Substrate processing apparatus, substrate processing system, and substrate processing method

Abstract

To detect abnormalities in parts with high accuracy by using design information.SOLUTION: A matching processing unit 61 determines which target part matches the actual image on the basis of the degree of matching of feature points between the actual image shape and the design shape. This makes it possible to perform matching while minimizing the effects of differences in shooting environments, light sources, water droplets, and fumes. An abnormality detection unit 63 detects an abnormality of the target component matched by the matching processing unit 61 by comparing the actual information and the normal information. Therefore, since the matching accuracy is improved, the abnormality detection unit 63 can accurately detect the abnormality of a component. In addition, even when a part of the target component is not visible at the time of photographing, matching is possible as long as the feature points appear in the actual image shape, such the influence of the positional relationship with other components can be minimized.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, a substrate processing system, and a substrate processing method for performing predetermined processing on substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. In particular, it relates to a technique for detecting abnormalities and operating states of components.

Background Art

[0002] Conventionally, as this type of apparatus, there is one including a processing chamber, a substrate holding unit, a nozzle, a camera, an image processing unit, and a monitoring unit (see, for example, Patent Document 1).

[0003] In this apparatus, the substrate holding unit, the nozzle, and the camera are arranged in the processing chamber. The substrate holding unit holds the substrate to be processed in a horizontal posture. The substrate holding unit rotates the substrate within a horizontal plane. The nozzle has its tip moved to an origin position deviated to the side of the substrate and a discharge position above the substrate. The nozzle moves the tip from the origin position to the discharge position for each substrate processing and supplies a processing liquid to the substrate. The camera is attached to a predetermined position in the processing chamber and photographs a predetermined area including the tip of the nozzle moved to the discharge position for each processing.

[0004] The monitoring unit stores in advance, as position information when the tip of the nozzle is located at a normal discharge position, first nozzle position information based on information from the rotation control system. The image processing unit obtains second nozzle position information indicating the position of the nozzle based on the image of the tip of the nozzle photographed by the camera and outputs the second nozzle position information to the monitoring unit. The monitoring unit determines whether there is an abnormality in the position of the tip of the nozzle based on the correspondence between the first nozzle position information and the second nozzle position information.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] WO2019 / 146456 publication [Overview of the project] [Problems that the invention aims to solve]

[0006] However, conventional examples with such a configuration have the following problems. In other words, conventional devices compare the first nozzle position information, based on information from the rotation control system, with the captured second nozzle position information. Therefore, if the environment during shooting, the light source, or water droplets / fumes (dust, mist, vapor, volatile particles generated by heating or sublimation of materials) changes, the captured image changes. As a result, accurate position information cannot be obtained with precision based on the captured image. Consequently, there is a problem in that anomalies regarding the nozzle position cannot be detected with precision when comparing the first nozzle position information with the second nozzle position information.

[0007] Furthermore, it has been proposed to use a reference image of a nozzle that has been moved to the correct discharge position in advance, instead of the first nozzle position information based on information from the rotation control system. However, if the shooting conditions for the reference image and the second nozzle position information differ significantly, it becomes impossible to accurately determine whether the difference between the reference image and the second nozzle position information is due to an abnormality. Therefore, there is still a problem in that abnormalities regarding the nozzle position cannot be detected with high accuracy.

[0008] This invention has been made in view of these circumstances, and aims to provide a substrate processing apparatus, a substrate processing system, and a substrate processing method that can accurately detect abnormalities in components by utilizing design information. [Means for solving the problem]

[0009] To achieve this objective, the present invention has the following configuration. In other words, the invention described in claim 1 is a substrate processing apparatus that performs a predetermined process on a substrate, comprising: a design information storage unit that stores three-dimensional design information relating to at least one target component to be detected as abnormal; an imaging unit that captures a real image including the target component; a matching processing unit that determines which of the target components matches the real image shape, based on the degree of agreement of feature points between the real image shape as a two-dimensional shape in the real image captured by the imaging unit and the two-dimensional design shape based on the three-dimensional design information of the target component; and an abnormality detection unit that detects an abnormality in the target component by comparing real information based on the real image of the matched target component with normal information based on the three-dimensional design information when the target component is normal.

[0010] [Function and Effects] According to the invention described in claim 1, the matching processing unit determines which target part matches the actual image shape based on the degree of agreement of feature points between the actual image shape and the design shape. Since the matching processing unit performs matching based on the degree of agreement of feature points, it can perform matching while minimizing the influence of differences in the shooting environment and the light source, water droplets, and fumes. The anomaly detection unit detects anomalies in the target part by comparing the actual information based on the actual image of the matched target part with normal information based on the three-dimensional design information when the target part is normal. Therefore, since the matching accuracy is improved, the anomaly detection unit can detect anomalies in the target part with high accuracy. In addition, even if part of the target part is not visible during shooting, matching is possible if feature points appear in the actual image shape, thus minimizing the influence of the positional relationship with other parts.

[0011] Furthermore, in the present invention, it is preferable that the abnormality detection unit sets the normal information based on the three-dimensional design information of the target part when the target part is within an acceptable range in which it can be considered normal (Claim 2).

[0012] By setting normal information within an acceptable range, variations in machining errors and assembly precision of the target parts can be absorbed. Therefore, false detection of abnormalities caused by machining errors or assembly errors can be prevented.

[0013] Furthermore, the present invention further comprises a spin chuck that supports a substrate in a horizontal position and rotates the substrate, a nozzle that discharges a processing liquid from its tip onto the substrate supported by the spin chuck, and a nozzle moving mechanism that moves the tip of the nozzle between an origin position located to the side of the substrate and a discharge position located above the substrate, wherein the target component is the nozzle, and the matching processing unit preferably performs matching at a timing set so that the nozzle is located at the discharge position (Claim 3).

[0014] When a nozzle that supplies processing liquid to a substrate supported by a spin chuck is moved by a nozzle movement mechanism, abnormalities such as the nozzle being out of the discharge position or the nozzle being deformed can be detected.

[0015] Furthermore, the present invention further comprises a nozzle pulse output unit that outputs a pulse when the nozzle is moved from the origin position to the discharge position, and a nozzle movement control unit that controls the nozzle movement mechanism based on the pulse from the nozzle pulse output unit, wherein the nozzle movement control unit causes the matching processing unit to perform matching only once at the timing when the nozzle movement mechanism moves the tip of the nozzle to the origin position, and associates the design information corresponding to the matched design shape with the pulse at the origin position, and the abnormality detection unit sets the normal information based on the association and the pulse at the discharge position (Claim 4).

[0016] The nozzle movement control unit, when the nozzle movement mechanism moves the nozzle tip to the origin position, performs matching only once, using the matching processing unit. At that time, it associates the design information corresponding to the matched design shape with the pulse at the origin position. The abnormality detection unit sets normal information at the discharge position based on this association and the pulse up to the discharge position. Therefore, the normal information regarding the discharge position, which is moved by the nozzle movement mechanism from the origin position in a predetermined number of pulses, can be made accurate enough to determine abnormalities. Furthermore, misjudgments due to assembly errors can be prevented.

[0017] Furthermore, in the present invention, the spin chuck is provided with a plurality of chucks on its periphery, each chuck comprising a lower support portion that supports the lower surface of the substrate and a periphery support portion erected at a position off-center from the rotation center of the lower support portion and supporting the periphery of the substrate, and the plurality of chucks are further provided with a chuck drive mechanism that rotates in response to a chuck operation command such that in the open position for loading and unloading the substrate, the periphery support portion is in a position where it does not contact the periphery of the substrate, and in the closed position for supporting the substrate, the periphery support portion is in a position where it contacts the periphery of the substrate, the target component is the chuck, and the matching processing unit performs matching at a timing set to operate in response to the chuck operation command (Claim 5).

[0018] When the chuck movement mechanism rotates the chuck between the open and closed positions in response to a chuck operation command, it is possible to detect abnormalities such as the peripheral support portion of the chuck not being in the open or closed position, or deformation of the peripheral support portion.

[0019] Furthermore, in the present invention, it is preferable that the matching processing unit performs matching only once after the chuck drive mechanism rotates the chuck to the closed position while the substrate is not placed on the chuck, and the abnormality detection unit sets the normal information according to the design information corresponding to the design shape matched at that time (Claim 6).

[0020] The matching processing unit performs matching only once with this as the origin position after rotating the chuck to the closed position in a state where no substrate is placed on the chuck. Then, normal information is set according to the design information corresponding to the design shape matched at that time. Therefore, the normal information can be made accurate and suitable for abnormality determination. Also, false determination due to assembly error can be prevented.

[0021] Further, in the present invention, a guard surrounding the side of the spin chuck, an origin position where the upper end of the guard is low, a guard moving mechanism for moving the guard up and down between the origin position and a processing position where the upper end of the guard is higher than the origin position, are further provided. The target part is the guard, and it is preferable that the matching processing unit performs matching at a timing set such that the guard is at the processing position (Claim 7).

[0022] When the guard is moved up and down between the origin position and the processing position by the guard moving mechanism, abnormalities such as the guard being displaced from the origin position or the processing position, and abnormalities in which the shape of the guard is deformed can be detected.

[0023] Further, in the present invention, it is preferable that the matching processing unit performs matching only once when the guard moving mechanism moves the guard to the origin position, and the abnormality detection unit sets the normal information according to the design information corresponding to the design shape matched at that time (Claim 8).

[0024] The matching processing unit performs matching only once when the guard moving mechanism moves the guard to the origin position. Then, normal information is set according to the design information corresponding to the design shape matched at that time. Therefore, the normal information can be made accurate and suitable for abnormality determination. Also, false determination due to assembly error can be prevented.

[0025] Further, in the present invention, it is preferable that the matching processing unit performs matching a plurality of times for each target part, and the abnormality detection unit detects an abnormality for each matching (Claim 9).

[0026] If matching is performed multiple times for each target component, it is possible to detect that there is an abnormality in the moving speed of the target component.

[0027] Moreover, in the present invention, it is preferable that the substrate processing system includes a plurality of the substrate processing apparatuses described in any of the above (Claim 10).

[0028] Even in a substrate processing system including a plurality of substrate processing apparatuses, it is possible to detect an abnormality based on design information.

Effect of the Invention

[0029] According to the substrate processing apparatus according to the present invention, the matching processing unit determines which target component matches the actual image shape based on the degree of coincidence of feature points for the actual image shape and the design shape. Since the matching processing unit performs matching based on the degree of coincidence of feature points, it is possible to perform matching while minimizing the differences in the environment at the time of shooting and the influence of light sources, water droplets, and fumes. The abnormality detection unit detects an abnormality of the target component by comparing the actual information based on the actual image of the matched target component with the normal information based on the three-dimensional design information when the target component is normal. Therefore, since the matching accuracy is improved, the abnormality detection unit can accurately detect an abnormality of the target component. Also, even if a part of the target component is not visible during shooting, if feature points appear in the actual image shape, matching is possible, so the influence of the positional relationship with other components can be minimized.

Brief Description of the Drawings

[0030] [Figure 1] It is a side view showing the substrate processing apparatus according to the embodiment. [Figure 2] It is a plan view of the substrate processing apparatus according to the embodiment. [Figure 3] It is a block diagram of the substrate processing apparatus according to the embodiment. [Figure 4] It is a schematic diagram for explaining the concept of matching regarding three-dimensional design information. [Figure 5]This is an explanatory diagram regarding the input and output of the matching processing unit and the anomaly detection unit. [Figure 6] This is a diagram illustrating nozzle matching. [Figure 7] This flowchart shows the processing flow in the substrate processing apparatus according to the embodiment. [Figure 8] This is an explanatory diagram showing the state after moving to the origin position. [Figure 9] This is an explanatory diagram for detecting abnormalities in the chuck. [Figure 10] This is an explanatory diagram for detecting abnormalities in the chuck. [Figure 11] This is an explanatory diagram for detecting abnormalities in the nozzle and guard. [Figure 12] This is a schematic diagram of the substrate processing system according to the embodiment. [Modes for carrying out the invention]

[0031] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0032] <1. Overall Structure>

[0033] Figure 1 is a side view showing a substrate processing apparatus according to an embodiment. Figure 2 is a top view of the substrate processing apparatus according to an embodiment.

[0034] The substrate processing apparatus 1 is a single-wafer type apparatus that processes substrates W one at a time. The substrate W, for example, has a circular shape when viewed from above. The substrate processing apparatus 1 rotates the substrate W while supplying a processing liquid to perform a predetermined process on the substrate W.

[0035] The substrate processing apparatus 1 is equipped with a housing CA. The housing CA isolates the interior from the ambient atmosphere. The substrate processing apparatus 1 is equipped with a spin chuck 3. The spin chuck 3 has a circular shape with a larger diameter than the substrate W when viewed from above. The upper end of the rotating shaft 5 is connected to the lower surface of the spin chuck 3. The lower end of the rotating shaft 5 is connected to a motor 7. When the motor 7 is driven, the spin chuck 3 rotates around the rotation center P1. The rotation center P1 extends in the vertical direction.

[0036] The spin chuck 3 is equipped with multiple chucks 9. The spin chuck 3 is equipped with multiple spin chucks 9 on the periphery of its upper surface. In this embodiment, the spin chuck 3 is equipped with four chucks 9. The number of chucks 9 is not limited to four, as long as the substrate W can be stably rotated around the rotation center P1 while being supported in a horizontal position.

[0037] The chuck 9 comprises a lower support portion 11 and a peripheral support portion 13. The lower support portion 11 supports the lower surface of the substrate W by contacting it. Preferably, the lower support portion 11 is configured to have a small contact area with the lower surface of the substrate W. This reduces the degree of cross-contamination. The lower support portion 11 is mounted on the upper surface of the spin chuck 3 so as to be rotatable around a rotation center P2. The rotation center P2 extends in the vertical direction. The peripheral support portion 13 is erected on the upper surface of the lower support portion 11. Preferably, the peripheral support portion 13 is formed so that its height from the upper surface of the lower support portion 11 is greater than the thickness of the substrate W. This configuration allows for stable holding of the peripheral edge of the substrate W. In a plan view, the peripheral support portion 13 is located away from the rotation center P2 toward the outer edge of the lower support portion 11. In other words, the peripheral support portion 13 is eccentric from the rotation center P2.

[0038] A rotating magnet 15 is mounted on the lower surface of the spin chuck 3 at a position corresponding to the rotation center P2. The rotating magnet 15 is connected to the lower support portion 11. The rotating magnet 15 is rotatably mounted around the rotation center P2. A chuck drive mechanism 17 is located below the rotating magnet 15.

[0039] The chuck drive mechanism 17 is located on the rotation axis 5 side of the chuck 9. The chuck drive mechanism 17 comprises, for example, an air cylinder 19 and a drive magnet 21. The drive magnet 21 has an annular shape in plan view. The air cylinder 19 is positioned with its operating axis oriented vertically. The drive magnet 21 is attached to the tip of the operating axis of the air cylinder 19. The chuck drive mechanism 17 operates in response to a chuck operation command. When the chuck drive mechanism 17 is activated, the drive magnet 21 rises and approaches the chuck 9, and when it is deactivated, the drive magnet 21 descends and moves away from the chuck 9.

[0040] The chuck 9 is equipped with a biasing mechanism (not shown). When the drive magnet 21 descends, the chuck 9 is in the closed position. When the drive magnet 21 rises, the chuck 9 is in the open position. In the closed position, the peripheral support portion 13 rotates around the rotation center P2, and the peripheral support portion 13 moves closer to the rotation center P1 and contacts the periphery of the substrate W. This allows the chuck 9 to grip the substrate W in the closed position. In the open position, the peripheral support portion 13 rotates around the rotation center P2, and the peripheral support portion 13 moves away from the rotation center P1. This allows the chuck 9 to load and unload the substrate W in the open position. When the drive magnet 21 descends without a substrate W placed on it, the peripheral support portion 13 moves slightly inward from the outer diameter of the substrate W to its origin position. In other words, in the origin position of the chuck 9, the peripheral support portion 13 is located closer to the rotation center P1 than in the closed position.

[0041] A home position sensor Z1 is positioned near the rotating magnet 15 of the chuck 9. The home position sensor Z1's output signal changes when the chuck 9 moves to the closed position or the home position. For example, when the chuck 9 moves to the closed position or the home position, the home position sensor Z1's output signal turns on.

[0042] A guard 23 is positioned around the spin chuck 3. The guard 23 surrounds the sides of the spin chuck 3. The guard 23 prevents the processing liquid from splashing into the surrounding area. The guard 23 is cylindrical in shape. An opening 23a is formed at the top of the guard 23. The inner diameter of the opening 23a is larger than the outer diameter of the spin chuck 3.

[0043] The guard 23 is equipped with a guard movement mechanism 25. The guard movement mechanism 25 comprises, for example, an air cylinder 27 and a locking piece 29. The guard movement mechanism 25 is positioned, for example, on the outer circumference of the guard 23. The guard movement mechanism 25 may also be positioned on the inner circumference of the guard 23, as long as it can raise and lower the guard 23. The air cylinder 27 is positioned with its operating shaft oriented vertically. A locking piece 29 is attached to the tip of the operating shaft of the air cylinder 27. The locking piece 29 is fixed to the outer surface of the guard 23. The guard movement mechanism 25 is not limited to this configuration, as long as it can raise and lower the guard 23.

[0044] The guard movement mechanism 23 moves the guard 23 between the origin position and the processing position in response to a guard operation command. The origin position is a position where the upper end of the guard 23 is low. The origin position is lower than the processing position. The processing position is higher than the origin position. When the guard 23 is located at the origin position, the upper edge of the guard 23 is lower than the substrate W supported by the spin chuck 3. When the guard 23 is located at the processing position, the upper edge of the guard 23 is higher than the substrate W supported by the spin chuck 3. For example, an origin sensor Z2 is located on the inner circumference side of the guard 23. The output signal of the origin sensor Z2 changes when the guard 23 moves to the origin position. For example, the output signal of the origin sensor Z2 turns ON when the guard 23 moves to the origin position.

[0045] The guard 23 is provided with a plurality of drainage ports (not shown) on its inner circumference. Preferably, the guard 23 has multiple guards 23 so that they can be raised and lowered by the guard movement mechanism 23 to switch between each drainage port. In this case, the drainage port is switched according to the liquid being processed, and the guard movement mechanism 23 moves the height of the guard 23 accordingly.

[0046] A processing liquid supply mechanism 31 is located on the outer circumference of the guard 23. The processing liquid supply mechanism 31 includes, for example, a nozzle 33 and a nozzle moving mechanism 35. In this embodiment, the processing liquid supply mechanism 31 includes, for example, two nozzles 33. In the following description, when it is necessary to distinguish between the two nozzles 33, the one on the left in Figure 2 will be referred to as nozzle 33A and the one on the right as nozzle 33B. The processing liquid supply mechanism 31 may have one nozzle 33 or three or more nozzles 33. In this embodiment, it is assumed that the two nozzles 33 have the same configuration.

[0047] The nozzle 33 comprises an extension 33a, a hanging portion 33b, and a tip portion 33c. One end of the extension 33a of the nozzle 33 is attached to the base portion 37. The extension 33a extends horizontally. The other end of the extension 33a connects to the hanging portion 33b. The hanging portion 33b extends vertically downward from the extension 33a. The tip portion 33c constitutes the lower end of the hanging portion 33b. The tip portion 33c discharges the processing liquid from its lower surface. Examples of processing liquids include photoresist solution, SOG (Spin-on-Glas) solution, developer solution, rinse solution, pure water, and washing solution.

[0048] The nozzle movement mechanism 35 includes, for example, a motor 39, a rotating shaft 41, and a position detection unit 43. The motor 39 is positioned vertically. The rotating shaft 41 is rotated by the motor 39 around the rotation center P3. The rotating shaft 41 is connected to a base 37. The base 37 is rotated by the drive of the motor 39. The nozzle 33 swings together with the base 37 around the rotation center P3. The position detection unit 43 detects the rotational position of the rotating shaft 41. The position detection unit 43 detects the angle of the rotating shaft 41 around the rotation center P3 in a plan view. The position detection unit 43 outputs pulses according to the rotational position.

[0049] In a plan view, a standby cup 44 is positioned laterally away from the guard 23. In a plan view, the standby cup 44 is located on the opposite side of the base 37 and on the tip 33c side of the nozzle 33. The standby cup 44 is located at the origin position of the nozzle 33. The standby cup 44 prevents the tip 33c of the nozzle 33 from drying out. The standby cup 44 is used for dry dispensing of the nozzle 33. The nozzle moving mechanism 35 drives the motor 39 to oscillate the nozzle 33. The nozzle moving mechanism 35 moves the tip 33c between the origin position and the dispensing position which is above the rotation center P1 of the spin chuck 3.

[0050] For example, a home position sensor Z3 is positioned on the outer circumference of the rotating shaft 41. The output signal of the home position sensor Z3 changes when the nozzle 33 is in the home position. For example, the output signal of the home position sensor Z3 turns on when the nozzle 33 moves to the home position. The configuration can be simplified by omitting the home position sensor Z3. In this case, a protrusion is provided on a part of the rotating shaft 41, as well as on the fixed side. The position detection unit 43 may detect when these protrusions come into contact with the rotating shaft 41 during rotation, making rotation impossible, and this is considered the home position. In this case, the position can be treated as the home position when the pulse of the position detection unit 43 becomes unchanged.

[0051] A camera CM is mounted on a part of the housing CA. For example, in a plan view, the camera CM is mounted on the corner on the side where the standby cup 44 of the nozzle 33 is located, on the side of the guard movement mechanism 25. The camera CM can be placed anywhere as long as the target parts described later are within its field of view. The lens of the camera CM has a field of view that includes all of the target parts described later within its field of view. The lens of the camera CM has a field of view that includes the origin position described later within its field of view.

[0052] The substrate processing apparatus 1 comprises a control unit 45, an instruction unit 47, and a notification unit 49. Details of the control unit 45 will be described later. The instruction unit 47 is operated by the operator of the substrate processing apparatus 1. The instruction unit 47 is, for example, a keyboard or a touch panel. The instruction unit 47 provides instructions for the target component, the timing to be checked, the tolerance range, the recipe, and the start of processing, which will be described later. The notification unit 49 notifies the operator of an abnormality when the control unit 45 determines that there is an abnormality. Examples of the notification unit 49 include a display, a lamp, and a speaker.

[0053] <2. Control System Configuration>

[0054] Now refer to Figure 3. Figure 3 is a block diagram of a substrate processing apparatus according to an embodiment.

[0055] The control unit 45 includes a CPU, memory, and other components. The control unit 45 is composed of multiple functional blocks. Specifically, the control unit 45 includes an operation control unit 51, a recipe memory 53, a parameter memory 55, a design information storage unit 57, an image processing unit 59, a matching processing unit 61, and an anomaly detection unit 63.

[0056] The motion control unit 51 operates the motors 7 and 39, the air cylinders 19 and 27, and the camera CM. The motion control unit 51 receives signals from the origin sensors Z1 to Z3 and the position detection unit 43. The operations performed by the motion control unit 51 are carried out according to the recipes defined in the recipe memory 53. For example, after the operator instructs the start of a recipe and processing, the motion control unit 51 outputs various operation commands based on the recipe to operate the motors 7 and other components at predetermined timings.

[0057] The recipe memory 53 stores various recipes in advance. The recipes define various procedures for processing the substrate W. The operator can specify a desired recipe by operating the instruction unit 47.

[0058] The parameter memory 55 stores the target component, the timing to be checked, and the tolerance range. The target component is one of the components that make up the substrate processing device 1 and is subject to abnormality detection. The timing to be checked is the timing for checking the operating status of the target component. The timing to be checked may overlap with the timing when the operation command output by the operation control unit 51 is completed in response to the operation command. The target component, the timing to be checked, the tolerance range, etc., can be arbitrarily set by the operator operating the instruction unit 47. The operator can specify from the instruction unit 37 which component to designate as the target component, which timing to designate as the timing to be checked, and what degree of timing error or position error to allow as the tolerance range.

[0059] The target parts include, for example, the chuck 9, the guard 23, and the nozzle 33. Timings that need to be checked include, for example, the timing when the chuck drive mechanism 17 operates the chuck 9 in response to the chuck operation command and moves it, the timing when the guard movement mechanism 25 raises or lowers the guard 23 in response to the guard operation command and moves it, the timing when the chuck 9 is set to the closed position by the chuck operation command, the timing when the nozzle 33 is set to the discharge position by the nozzle operation command, and the timing when the guard 23 is set to the processing position by the guard operation command.

[0060] The tolerance range indicates the degree to which the component deviates from its intended position under normal operation at the time of verification. For example, the tolerance range represents the degree to which deviation from the designed position or angle of the component is acceptable. Based on the processing of the circuit board W, the tolerance range indicates the range of deviation of the component at the time of verification that the processing of the circuit board W can tolerate, even if the component deviates from the designed position or angle at that time.

[0061] The aforementioned motion control unit 51, based on the information from the position detection unit 43 and the parameter memory 55, notifies the matching processing unit 61 of the position information of the target component at the timing requiring confirmation. Based on the information from the origin sensors Z1 to Z3, the motion control unit 51 notifies the matching processing unit 61 of the position information of the target component at the origin position. The motion control unit 51 notifies the matching processing unit 61 of the position information of the target component by operating the air cylinders 19 and 27 and the electric motor 39. The motion control unit 51 notifies the matching processing unit 61 that it has outputted operation commands to each part according to the recipe.

[0062] The design information storage unit 57 has pre-stored design information for the components that make up the substrate processing apparatus 1. Specifically, this includes design information for the components that make up the substrate processing apparatus 1 and the substrate W to be processed. The design information is, for example, 3D CAD (three-dimensional Computer Aided Design) data. The design information may also include physical property information related to the processing liquid and various materials used in the processing.

[0063] 3D CAD data is represented, for example, by three orthogonal coordinate axes, and when a part is placed in three-dimensional space, it is represented by positional information of position and angle. A host computer (not shown) stores three-dimensional design information as 3D CAD data for all parts and materials of the substrate processing apparatus 1. The design information storage unit 57 receives and stores in advance the design information of at least the target part from the host computer. Preferably, the design information storage unit 57 is limited to the design information of the target part, rather than the design information of all parts of the substrate processing apparatus 1. This saves the storage capacity of the design information storage unit 57. In addition, since the design information is limited to an acceptable range including the position that should be in normal operation at the timing that requires verification, storage capacity can be saved in particular when determining the matching of a target part that moves.

[0064] The image processing unit 59 processes the real image captured by the camera CM. The image processing unit 59 performs image processing on the real image and extracts the real image shape, including the two-dimensional shape of the target part. For all parts shown in the real image, the image processing unit 59 extracts the real image shape, for example, by performing contour extraction. Here, contours include not only the outline but also the edges located inside the outline. The real image shape extracted by the image processing unit 59 is provided to the matching processing unit 61.

[0065] The matching processing unit 61 performs matching. Matching, in this context, means determining which target part is reflected in the actual image shape from the image processing unit 59. Specifically, the matching processing unit 61 determines which target part matches the actual image shape from the image processing unit 59 and the two-dimensional design shape based on the three-dimensional design information of the target part from the parameter memory 55, based on the degree of matching of feature points. More specifically, the matching processing unit 61 performs matching between the actual image shape from the image processing unit 59 and the design shape for each target part at least when the target part needs to be checked. The matching by the matching processing unit 61 will be described in detail later. The design shape is two-dimensional shape information based on three-dimensional design information at the time of check. Two-dimensional shape information is a graphic.

[0066] The matching processing unit 61 may perform matching even when it is not a timing that requires confirmation, based on instructions from the operation control unit 51. For example, the operation control unit 51 may cause the matching processing unit 61 to perform matching based on the output signals from the origin sensors Z1 to Z3. Preferably, this matching (origin matching) is performed only once when the substrate processing device 1 is started up and processing on the substrate W begins. Alternatively, the matching processing unit 61 may perform matching at any timing, including the timing that requires confirmation. The matching processing unit 61 outputs the matched target component to the abnormality detection unit 63.

[0067] The anomaly detection unit 63 receives the output from the matching processing unit 61 and detects an anomaly in the target part. Specifically, the anomaly detection unit 63 is provided with information about the target part, real-world information based on a real image of the matched target part, and normal information based on three-dimensional design information for when the target part is normal, from the matching processing unit 61. The anomaly detection unit 63 compares the real-world information and the normal information. If these comparisons do not match, the anomaly detection unit 63 detects that there is an anomaly. The normal information is positional information including position and angle based on three-dimensional design information. Preferably, the normal information includes three-dimensional design information of the target part when it is within an acceptable range. The real-world information is based on a real image of the matched target part and represents the state in which the target part is actually located at the time of confirmation. Preferably, the normal information is an image based on three-dimensional design information, and the real-world image is an image of the target part. This makes it easy to compare the real-world information and the normal information.

[0068] The abnormality detection unit 63 causes the notification unit 49 to perform a notification operation according to the detection result. Specifically, the abnormality detection unit 63 causes the notification unit 49 to perform a notification operation only when an abnormality is detected. The notification unit 49 may also notify, for example, the target component and location information that was determined to be abnormal, along with the occurrence of the abnormality.

[0069] <3. The concept of matching>

[0070] Next, refer to Figure 4. Figure 4 is a schematic diagram illustrating the concept of matching three-dimensional design information.

[0071] For ease of understanding, Figure 4 shows the rivet as the target part TO. The three-dimensional design shape described above is the two-dimensional shape obtained when the target part TO is placed at the center and viewed from all sides around it.

[0072] For example, in Figure 4, the design shape DS1-1 is the view of the target part TO from a close distance to the lower right, and the design shape DS1-2 is the view from a more distant distance. Also, for example, the design shape DS2-1 is the view of the target part TO in Figure 4 from a close position to the lower left, and the design shape DS2-2 is the view from a more distant distance. Thus, when the target part TO is viewed from the lower right, design shape DS1-1 is the shape of a rivet with a semicircular head located on the left side. Design shape DS1-2 is a smaller shape than design shape DS1-1. Also, when the target part TO is viewed from the lower left, design shape DS2-1 is the shape of a rivet with only the head of the rivet located in a circular shape. Design shape DS2-2 is a smaller shape than design shape DS2-1.

[0073] The matching processing unit 61 described above determines, at least at the timing requiring confirmation, which target part TO matches the actual image shape based on the actual image captured by the camera CM and the design shape of all target parts TO, based on the degree of matching of feature points. The anomaly detection unit 63 detects an anomaly in the target part based on the result of the matching processing unit 61.

[0074] Refer to Figure 5. Figure 5 is an explanatory diagram of the input and output of the matching processing unit and the anomaly detection unit.

[0075] To summarize the above, the matching processing unit 61 has the input / output relationship shown in Figure 5. Specifically, the matching processing unit 61 obtains the actual image shape from the image processing unit 59. The matching processing unit 61 receives each target part and the timing to be checked from the parameter memory 55. The matching processing unit 61 obtains three-dimensional design information from the design information storage unit 57. The matching processing unit 61 outputs the target parts to be matched and the actual information to the anomaly detection unit 63. The anomaly detection unit 63 detects anomalies based on the result of comparing the actual information with normal information that takes into account the tolerance range for the matched target parts. If the anomaly detection unit 63 detects an anomaly, it outputs NG to the notification unit 49.

[0076] <4. Specific examples of matching>

[0077] Next, refer to Figure 6. Figure 6 is a diagram illustrating the matching of the nozzle.

[0078] Here, as an example, the timing at which the tip 33c of the nozzle 33 is moved to the rotation center P1 (discharge position) after receiving an operation command is defined as the timing to be checked. In Figure 6, the nozzle 33 depicted at the top corresponds to the actual image shape. In Figure 6, the nozzle 33 depicted at the bottom corresponds to one two-dimensional design shape DS when the nozzle 33 is viewed from any of its surroundings, as shown in Figure 4, regarding the three-dimensional design information of the nozzle 33.

[0079] In this case, for example, the degree of agreement between the feature points in the actual image shape and the design shape DS is examined at all locations of the multiple feature points indicated by small circles. This process is also performed for other two-dimensional design shapes DS when viewed around the entire circumference and at various distances. In this case, all the feature points in the actual image shape and the design shape DS shown in Figure 6 match. Therefore, the degree of agreement is greater than or equal to a predetermined value. For this reason, the matching processing unit 61 determines that a match has been made. In other words, it is determined that the nozzle 33 exists as the target part in the actual image shape. Although only the nozzle 33 has been explained in this example, it is also determined whether other target parts exist in the actual image shape. If the result of the degree of agreement is less than a predetermined value, it is determined that no match has been made.

[0080] <5. Specific Examples of Processing>

[0081] Next, specific examples of processing will be described with reference to Figures 7 to 11. Figure 7 is a flowchart showing the processing flow in the substrate processing apparatus according to the embodiment. Figure 8 is an explanatory diagram showing the state after moving to the origin position. Figures 9 and 10 are explanatory diagrams for detecting abnormalities in the chuck. Figure 11 is an explanatory diagram for detecting abnormalities in the nozzle and guard.

[0082] The operator pre-configures the instruction unit 47 to select a recipe from the recipe memory 53. The operation control unit 51 then operates its various components according to the selected recipe to proceed with processing on the substrate W.

[0083] Step S1 Move to the origin. Specifically, the motion control unit 51 operates the chuck drive mechanism 17, the guard movement mechanism 25, and the nozzle movement mechanism 35. The motion control unit 51 operates the chuck drive mechanism 17 in response to a chuck operation command to move the chuck 9 to the origin position. At this time, the output signal of the origin sensor Z1 is turned on. The motion control unit 51 determines that the chuck 9 has moved to the origin position based on the output signal of the origin sensor Z1. The motion control unit 51 operates the guard movement mechanism 25 in response to a guard operation command to move the guard 23 to the origin position.

[0084] As shown in Figure 8, the nozzle 33 is rotated around the rotation center P3, and the tip 33c is moved to an origin position that is laterally away from the guard 23. The guard 23 is moved to an origin position where the opening 23a is lower than the substrate W. This is shown by a solid line in Figure 8. The dashed line in Figure 8 indicates a processing position where the opening 23a is higher than the substrate W.

[0085] As shown in Figure 9, when the substrate W is not placed on the chuck 9, it is rotated around the rotation center P2 in response to the chuck operation command, and the peripheral support portion 13 moves toward the rotation center P1 side of the spin chuck 3. This is shown by a solid line in Figure 9. As a result, the peripheral support portion 13 of each chuck 9 is moved to a position where it contacts a circle with a diameter slightly smaller than the outer diameter of the substrate W.

[0086] Step S2 The camera captures images. Specifically, the motion control unit 51 triggers the camera CM to capture images when the nozzle 33, chuck 9, and guard 23 move to the origin position. Specifically, the camera captures images of the nozzle 33, chuck 9, and guard 23, ensuring that at least their characteristic points are captured. The image processing unit 59 performs image processing on the actual images captured by the camera CM to extract the actual image shapes, including the two-dimensional shapes of the nozzle 33, chuck 9, and guard 23.

[0087] Steps S3, S4 The matching processing unit 61 performs matching. The specific process is described below.

[0088] <Origin position: Nozzle 33> The matching processing unit 61 matches the actual image shape of each nozzle 33 extracted by the image processing unit 59 with the design shape of the nozzle 33. The matching processing unit 61 sets normal information for check timings other than the origin position of the nozzle 33, according to the three-dimensional design information corresponding to the matched design shape of the nozzle 33.

[0089] Specifically, design information corresponding to the matched design shape at the origin position of the nozzle movement mechanism 35 is linked to the origin position. Then, normal information is set according to the design information at the discharge position of each nozzle 33 in the design, according to the number of pulses from the origin position to the discharge position. This makes it possible to make the normal information for each nozzle 33 accurate and suitable for determining abnormalities. In addition, it is possible to prevent misjudgments due to assembly errors for each nozzle 33 and the nozzle movement mechanism 35.

[0090] <Origin position: Chuck 9> The matching processing unit 61 matches the actual image shape of each chuck 9 extracted by the image processing unit 59 with the design shape of each chuck 9. The matching processing unit 61 sets normal information for check timings other than the origin position of each chuck 9, according to the three-dimensional design information corresponding to the design shape matched to each chuck 9.

[0091] Specifically, normal information is set according to the design information corresponding to the matched design shape at the origin position of each chuck 9. The chuck 9 is an important component that holds the substrate W. The clamping state of the chuck 9 is adjusted for each substrate processing device 1, and the design origin position may differ slightly. Therefore, by setting the normal information based on the origin position, it is possible to prevent misjudgments caused by adjustments to the clamping state.

[0092] <Origin position: Guard 23> The matching processing unit 61 matches the actual image shape of the guard 23 extracted by the image processing unit 59 with the design shape of the guard 23. The matching processing unit 61 sets normal information for check timings other than the origin position of the guard 23, according to the three-dimensional design information corresponding to the design shape matched to the guard 23.

[0093] Furthermore, if a match cannot be achieved in step S3 above, or if the three-dimensional design information corresponding to the matched design shape is significantly deviated from the design origin, the process may be moved to step S14, described later, to notify of the anomaly.

[0094] Step S5 The substrate W to be processed is brought into the substrate processing apparatus 1.

[0095] Step S6 The processing of the substrate W is carried out according to the recipe. Specifically, first, the substrate W is placed on the chuck 9. The operation control unit 51 operates the chuck drive mechanism 17 by means of a chuck operation command, for example, to move the chuck 9 to the closed position. This state is as shown in Figure 10, for example. In other words, with the substrate W placed on it, the chuck 9 is rotated around the rotation center P2, and the peripheral support portion 13 is moved toward the rotation center P1 side of the spin chuck 3. As a result, the peripheral support portion 13 of each chuck 9 comes into contact with the outer diameter of the substrate W, and the substrate W is clamped. When viewed from above, the peripheral support portion 12 at this time is located slightly further outward than the peripheral support portion 13 in Figure 9.

[0096] Step S7 The system checks whether it is a timing that requires confirmation. Specifically, the operation control unit 51 refers to the target component and its timing that requires confirmation in the parameter memory 55. The system branches the processing depending on whether the target component is at a timing that requires confirmation. If it is not at a timing that requires confirmation, the system proceeds to step S11. Here, assuming it is at a timing that requires confirmation, the system proceeds to step S8.

[0097] Step S8 The operation control unit 51, recognizing that it is a confirmation timing set to position the chuck 9 in the closed position, instructs the camera CM to take an image. Specifically, it operates the camera CM according to the timing at which the chuck 9 is moved to the closed position by the chuck operation command. The camera CM captures a real image including each chuck 9. In response, the image processing unit 59 extracts the real image shape as a two-dimensional shape of the target part. As shown in Figure 10, of the four chucks 9, the chuck 9 furthest from the camera CM does not capture its entire shape in the real image. In other words, only the outer edge of the substrate W is captured in the real image. However, since the peripheral support portion 13 of the chuck 9 is captured, matching can be performed correctly by comparing its feature points.

[0098] Step S9 The matching processing unit 61 performs matching. Specifically, the matching processing unit 61 compares the degree of agreement of feature points between the actual image shape and the design shape of each chuck 9. The matching processing unit 61 determines whether or not a match is achieved, as shown in the example explained with reference to Figure 6. Furthermore, the anomaly detection unit 63 performs anomaly detection. Specifically, the anomaly detection unit 63 compares the actual information with the normal information for the matched chuck 9. If the comparison results do not match, the anomaly detection unit 63 detects an anomaly.

[0099] Step S10 The process branches according to the detection result in the abnormality detection unit 63. Specifically, if the chuck 9 is normal, the process proceeds to step S11. On the other hand, if there is an abnormality in the chuck 9, the process branches to step S14.

[0100] Here, we will assume that Chuck 9 was functioning correctly.

[0101] Step S11 The process branches depending on whether the process is complete or not. If the process is complete, the process branches to step S12. If the process is not complete, the process returns to step S6. At this point, the substrate W has only been placed and clamped by the chuck 9, so the process is not complete. Therefore, the process returns to step S6.

[0102] Step S6 The operation control unit 51, for example, operates the guard movement mechanism 25 according to a guard operation command to move the guard 23, which is in the origin position as shown in Figure 8, to the processing position as shown in Figure 11. Note that the nozzle 33, which is located above the substrate W in Figure 11, is in the origin position at this point.

[0103] Step S7 The system checks whether it is a timing that requires confirmation. Specifically, the operation control unit 51 refers to the target component and its timing that requires confirmation in the parameter memory 55. The operation control unit 51 branches the processing depending on whether the target component is at a timing that requires confirmation. In this case, the guard 23 is the target component and is at a timing that requires confirmation, so the system proceeds to step S8.

[0104] Step S8 The operation control unit 51 determines that the timing to be checked is set so that the guard 23 is in the processing position, and operates the camera CM to take a picture. As a result, the camera CM takes a real image including the guard 23. In response, the image processing unit 59 extracts the real image shape as a two-dimensional shape including the guard 23 from the real image.

[0105] Step S9 The matching processing unit 61 performs matching. Specifically, first, the matching processing unit 61 reads the design information of the guard 23 from the design information storage unit 57. The matching processing unit 61 compares the degree of agreement of feature points between the actual image shape and the two-dimensional design shape based on the design information. The matching processing unit 61 determines whether or not a match is made, as shown in the example described with reference to Figure 6. The anomaly detection unit 63 compares the actual information with the normal information for the matched guard 23.

[0106] Step S10 The process branches according to the result of the abnormality detection unit 63. Specifically, if the guard 23 is normal, the process proceeds to step S11. On the other hand, if there is an abnormality in the guard 23, the process branches to step S14.

[0107] Here, we will explain assuming that Guard 23 was functioning normally.

[0108] Step S11 At this point, the substrate W is held in the chuck 9, and the guard 23 has only been moved to the processing position. Since the processing is not yet complete, we return to step S6.

[0109] Step S6 The motion control unit 51 initiates the movement of the nozzle 33 according to the recipe. For example, the motion control unit 51 operates the nozzle movement mechanism 35 in response to a nozzle movement command to move nozzle 33B of the two nozzles 33A and 33B from the origin position to the discharge position, as shown in Figure 11. The discharge position is, for example, the same position as the rotation center P1.

[0110] Step S7 The operation control unit 51 refers to the timing for checking in the parameter memory 55. The operation control unit 51 branches the processing depending on whether the target component is at the timing for checking. In this case, the nozzle 33 (nozzle 33B) is at the timing for checking, so the process proceeds to step S8.

[0111] Step S8 The operation control unit 51 determines that it is a confirmation timing set so that the nozzle 33B is in the discharge position, and operates the camera CM to take an image. As a result, the camera CM captures a real image including the nozzle 33B. In response, the image processing unit 59 extracts the real image shape as a two-dimensional shape including the nozzle 33B from the real image.

[0112] Step S9 The matching processing unit 61 performs matching. Specifically, first, the matching processing unit 61 reads the design information of the nozzle 33B from the design information storage unit 57. The matching processing unit 61 compares the degree of agreement of feature points between the actual image shape and the two-dimensional design shape based on the design information. The matching processing unit 61 determines whether or not a match is made, as shown in the example described with reference to Figure 6. As shown in Figure 11, the nozzle 33B is on the back side of the nozzle 33A. Therefore, the entire nozzle 33B is not reflected in the actual image shape. However, since the characteristic shape of the nozzle 33B is visible, there is no problem in matching. The anomaly detection unit 63 compares the actual information with the normal information for the matched nozzle 33B. If the comparison does not result in a match, the process moves to step S14; if there is a match, the process moves to step S10.

[0113] Step S10 The process branches according to the result from the abnormality detection unit 63. Specifically, if the nozzle 33B is normal, the process proceeds to step S11. On the other hand, if there is an abnormality in the nozzle 33B, the process branches to step S14.

[0114] This explanation assumes that nozzle 33B is functioning correctly.

[0115] Step S11 Since the nozzle 33B has only been moved to the discharge position, the process is not yet complete. Therefore, we return to step S6.

[0116] Steps S6, S7, S11 The operation control unit 51 proceeds with the process by rotating the motor 7 according to the recipe. From here, steps S6, 7, and S11 are repeated. This allows, for example, the processing liquid to be supplied to the substrate W from the nozzle 33B, and the processing of the substrate W is considered complete. Once the processing according to this recipe is complete, the process moves to step S12.

[0117] Step S12 The motion control unit 51 returns the nozzle 33B, the guard 23, and the chuck 9 to their origin positions. The motion control unit 51 then removes the substrate W, which is placed on the spin chuck 3, to the outside.

[0118] Step S13 The operation control unit 51 branches the process depending on whether or not there is another board W. That is, if there is another board W, the process proceeds to step S5. Then, the next board W is brought in and processed as described above. Note that when processing the next board W, matching at the origin position is not performed. If there is no next board W, the process ends.

[0119] Next, we will explain what happens when the target part becomes abnormal in step S10.

[0120] Step S14 If the abnormality detection unit 63 detects an abnormality, it causes the notification unit 49 to perform a notification operation. The notification unit 49 may also notify, for example, the target component that was determined to be abnormal, its location information, and the details of the abnormality.

[0121] Specifically, the nozzle 33 is notified of abnormalities related to the operation of the nozzle movement mechanism 35, or abnormalities caused by deformation of its outer shape. The chuck 9 is notified of abnormalities related to the operation of the chuck drive mechanism 17, or abnormalities caused by damage to the lower support portion 11 or peripheral support portion 13 of the chuck 9. The guard 23 is notified of abnormalities related to the operation of the guard movement mechanism 25, or abnormalities caused by deformation of the outer shape of the opening 23a of the guard 23.

[0122] Step S15 Upon receiving notification from the notification unit 49, the operator, for example, stops the operation of the substrate processing device 1. This stops the processing of the substrate W, preventing continuous processing in an abnormal state. This prevents processing defects on the substrate W.

[0123] In this embodiment, the matching processing unit 61 determines which target part matches the actual image based on the degree of agreement of feature points between the actual image shape and the design shape. Since the matching processing unit 61 performs matching based on the degree of agreement of feature points, it can perform matching while minimizing the influence of differences in the shooting environment and the effects of light sources, water droplets, and fumes. The anomaly detection unit 63 detects anomalies in the target part by comparing the actual information based on the actual image of the matched target part with normal information based on the three-dimensional design information when the target part is normal. Therefore, since the matching accuracy is improved, the anomaly detection unit 63 can detect anomalies in the part with high accuracy. In addition, even if part of the target part is not visible during shooting, matching is possible if feature points appear in the actual image shape, thus minimizing the influence of the positional relationship with other parts.

[0124] The correspondence between the steps described above and the present invention is as follows: Steps S2 and S8 correspond to the "imaging step" in the present invention. Steps S3 and S9 correspond to the "matching processing step" in the present invention. Step S9 corresponds to the "anomaly detection step" in the present invention. Camera CM corresponds to the "imaging unit" in the present invention. Position detection unit 43 corresponds to the "nozzle pulse output unit" in the present invention. Operation control unit 51 corresponds to the "nozzle movement control unit" in the present invention.

[0125] <6. Substrate Processing System>

[0126] Although the above-described embodiment was a single substrate processing apparatus 1, the present invention can also be applied to the following configuration. Refer to Figure 12. Figure 12 is a schematic diagram of a substrate processing system according to the embodiment.

[0127] This substrate processing system 91 is equipped with the above-described substrate processing apparatus 1 stacked on top of each other. The substrate processing system 1 includes, for example, a tower TW with four substrate processing apparatus 1 units arranged in the height direction. The substrate processing system 1 is arranged with the tower TW units spaced apart and facing each other. The substrate processing system 1 has a transport robot TR positioned between the tower TW units. The transport robot TR is configured to be able to move up and down in the height direction. The transport robot TR has an arm (not shown) that is able to move back and forth between the substrate processing apparatus 1 units. The transport robot TR transports substrates W between each substrate processing apparatus 1 unit. Even with such a substrate processing system 91, each substrate processing apparatus 1 unit achieves the effects described above.

[0128] This substrate processing system 91 may, for example, be equipped with a camera that places the transport robot TR within its field of view. It is preferable to set the system to perform matching at confirmation timings set to be the origin position or handover position of the transport robot TR as described above, and to set the arm (not shown) on which the substrate W is placed as the target component. This makes it possible to detect abnormalities related to deformation of the transport robot TR's arm, abnormalities in movement speed, abnormalities in the drive system, etc.

[0129] The present invention is not limited to the above embodiments and can be modified and implemented as follows.

[0130] (1) In the embodiments described above, normal information is set based on three-dimensional design information within an acceptable range. However, the present invention is not limited thereto. That is, the abnormality detection unit 63 may set normal information based on one set of three-dimensional design information in which the target part is considered normal. This can reduce the load on the abnormality detection unit 63.

[0131] (2) In the above-described embodiment, the chuck 9, guard 23, and nozzle 33 were described as examples of target parts. However, the present invention is not limited to such configurations. For example, the spin chuck 3 may be used as the target part, and abnormalities caused by deformation of the outer shape may be detected. The substrate W to be processed may be set as the target part, and the timing at which the chuck 9 is set to the closed position may be set as the timing to be checked. This makes it possible to detect damage to the substrate W as an abnormality. In addition, there may be multiple target parts as in the embodiment, but there may also be one. Furthermore, matching at the origin position is not necessarily required.

[0132] (3) In the embodiments described above, matching is performed only once at a timing requiring confirmation other than the origin position for the target part. However, the present invention is not limited thereto. For example, for the nozzle 33, matching may be set at multiple timings requiring confirmation between the origin position and the timing set so that the nozzle 33 is located at the discharge position. In this way, if an abnormality is detected at one of the multiple timings requiring confirmation where the nozzle 33 is located between the origin position and the discharge position, an abnormality related to the movement speed of the nozzle 33 by the nozzle movement mechanism 35 can also be detected. Furthermore, for the guard 23, multiple timings requiring confirmation are set between the origin position and the processing position. In this case, an abnormality related to the movement speed of the guard 23 by the guard movement mechanism 25 can also be detected. Furthermore, in the embodiments described above, matching and abnormality detection were performed using the timings requiring confirmation as triggers. However, the present invention does not require timings requiring confirmation. For example, matching and abnormality detection may be performed each time the target part moves after a command to operate the target part, such as a chuck operation command, is issued.

[0133] (4) In the above-described embodiment, the matching processing unit 61 performed matching between the actual image shape and the design shape. However, the design shape is not simply a two-dimensional shape based on three-dimensional design information, but may also reflect, for example, reflections and shadows caused by the surface shape of each target part, and reflections and cloudiness caused by the positional relationship and environment within the housing CA. This increases the number of common feature points with the actual image shape, thereby preventing misjudgments caused by shape, environment, etc.

[0134] (5) In the embodiments described above, the substrate processing apparatus 1 is equipped with one camera CM. However, the present invention does not exclude the provision of multiple cameras CM. For example, multiple cameras CM may be provided, such as a camera CM dedicated to the nozzle 33 and a camera CM dedicated to the chuck 9. This can improve the accuracy of detecting abnormalities, for example, in the case of small target parts such as the chuck 9.

[0135] (6) In the above-described embodiment, the origin position was matched, but interference checks may be performed using this as a reference. In other words, if there is a difference in the timing of movement or deformation of the external shape when each target part moves, there is a risk of collision with each other. Therefore, it may be possible to check in advance whether interference will occur during movement or at the destination based on the design information, using the origin position as a reference. This makes it possible to prevent interference that cannot be detected by sensors that detect position, etc.

[0136] (7) In addition to the configuration of the embodiment described above, the target components may be the nozzle 33 and the processing liquid, and abnormalities in the supply of the processing liquid may be detected, including at the time of discharge of the processing liquid, as timings requiring confirmation. For example, a fluid simulator may be used to use the trajectory of the processing liquid during normal supply as design information, and the design shape based on the design information regarding the trajectory of the processing liquid may be matched with the actual image shape of the processing liquid at the time of discharge by the camera CM, and these real-world information may be compared with normal information. This makes it possible to detect abnormalities in the discharge system of the processing liquid. Alternatively, the trajectory of the processing liquid when the processing liquid is being discharged logically correctly may be simulated from the specified value of the flow rate control valve during the supply of the processing liquid, and this information may be used as design information for matching.

[0137] (8) In addition to the configuration of the embodiment described above, a machine vision configuration may be added. Specifically, if the target part is a nozzle 33, the position detection unit 43 calculates the position of the target part. Since the position corresponds to a position in the actual image shape, the position information of the target part in the actual images taken at predetermined intervals is compared with the position information of the position detection unit 43. If there is a difference between these, it is determined that there is an abnormality. At this time, the matching described above is used to find the target part within the actual image shape. This prevents false detections caused by reflections, shadows, or fumes from droplets in the actual image.

[0138] (9) In the embodiments described above, a substrate processing apparatus 1 that processes a substrate W with a processing solution was used as an example. However, the present invention is not limited to such a substrate processing apparatus. For example, the present invention can be applied to an apparatus that heat-treats a substrate W, an apparatus that transports a substrate W, an apparatus that exposes a substrate W, and so on. Furthermore, the present invention is not limited to single-wafer apparatuses that process substrates W one by one, as described in the embodiments. In other words, the present invention can be applied to batch-type apparatuses that process multiple substrates simultaneously. [Explanation of Symbols]

[0139] 1 ... Substrate processing equipment CA... Cabinet W… Circuit board 3… Spin Chuck P1~P3 ... Center of rotation 9... Chuck 11… Bottom support part 13 … Peripheral support section 17. Chuck drive mechanism Z1, Z2, Z3… Origin sensors 23… Guard 23a … opening 25... Guard movement history 31 ... Processing liquid supply mechanism 33, 33A, 33B… Nozzles 35 ... Nozzle movement mechanism CM... Camera 45 ... Control Unit 49… Hochi Department 51 ... Operation control unit 53… Recipe Memory 55 … Parameter memory 57 … Design information storage unit 59… Image Processing Unit 61… Matching Processing Unit 63 ... Anomaly detection unit

Claims

1. In a substrate processing apparatus that performs predetermined processing on a substrate, A design information storage unit that stores three-dimensional design information relating to at least the target component for which abnormalities are detected, A shooting unit that captures an actual image including the aforementioned target part, A matching processing unit determines which of the target parts matches the actual image shape, which is a two-dimensional shape in the actual image captured by the imaging unit, and the two-dimensional design shape based on the three-dimensional design information of the target part, based on the degree of agreement of feature points. An abnormality detection unit detects an abnormality in the target part by comparing the actual information based on the actual image of the matched target part with normal information based on the three-dimensional design information when the target part is normal, with respect to the target part matched by the matching processing unit. A substrate processing apparatus characterized by comprising the following features.

2. In the substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the abnormality detection unit sets the normal information based on the three-dimensional design information of the target component when the target component is within an acceptable range in which it can be considered normal.

3. In the substrate processing apparatus according to claim 1 or 2, A spin chuck that supports the circuit board in a horizontal position and rotates the circuit board, A nozzle that discharges a processing liquid from its tip onto a substrate supported by the spin chuck, A nozzle movement mechanism moves the tip of the nozzle between an origin position located to the side of the substrate and a discharge position located above the substrate. Furthermore, The aforementioned part is the nozzle, The substrate processing apparatus is characterized in that the matching processing unit performs matching at a timing set so that the nozzle is located at the discharge position.

4. In the substrate processing apparatus according to claim 3, A nozzle pulse output unit that outputs a pulse when the nozzle moves from the origin position to the discharge position, A nozzle movement control unit that controls the nozzle movement mechanism based on the pulses of the nozzle pulse output unit, Furthermore, The nozzle movement control unit, at the timing when the nozzle movement mechanism moves the tip of the nozzle to the origin position, causes the matching processing unit to perform matching, and at that time associates the design information corresponding to the matched design shape with the pulse of the origin position. The substrate processing apparatus is characterized in that the abnormality detection unit sets the normal information based on the correspondence and the pulse at the ejection position.

5. In the substrate processing apparatus according to claim 3 or 4, The spin chuck is provided with multiple chucks on its periphery, each chuck comprising a lower support portion that supports the lower surface of the substrate, and a periphery support portion that is erected at a position offset from the rotation center of the lower support portion and supports the periphery of the substrate. The plurality of chucks are further provided with a chuck drive mechanism that rotates in response to a chuck operation command so that in the open position for loading and unloading the substrate, the peripheral support portion does not come into contact with the peripheral edge of the substrate, and in the closed position for supporting the substrate, the peripheral support portion comes into contact with the peripheral edge of the substrate. The aforementioned part is the chuck, The substrate processing apparatus is characterized in that the matching processing unit performs matching at a timing set to operate in response to the chuck operation command.

6. In the substrate processing apparatus according to claim 5, The matching processing unit, with no substrate placed on the chuck, performs matching only once after the chuck drive mechanism has rotated the chuck to the closed position, using this position as the origin. The substrate processing apparatus is characterized in that the abnormality detection unit sets the normal information according to the design information corresponding to the design shape that was matched at that time.

7. In the substrate processing apparatus according to any one of claims 3 to 6, A guard surrounding the side of the spin chuck, A guard movement mechanism that moves the guard up and down between an origin position where the upper end of the guard is low and a processing position where the upper end of the guard is higher than the origin position, Furthermore, The aforementioned part is the guard, The substrate processing apparatus is characterized in that the matching processing unit performs matching at a timing set so that the guard is in the processing position.

8. In the substrate processing apparatus according to claim 7, The matching processing unit performs matching only once when the guard moving mechanism moves the guard to the origin position. The substrate processing apparatus is characterized in that the abnormality detection unit sets the normal information according to the design information corresponding to the design shape that was matched at that time.

9. In the substrate processing apparatus according to any one of claims 1 to 8, The matching processing unit performs matching multiple times for each target part. The substrate processing apparatus is characterized in that the abnormality detection unit detects an abnormality for each matching.

10. A substrate processing system characterized by comprising a plurality of substrate processing devices according to any one of claims 1 to 9.

11. In a substrate processing method that performs a predetermined process on a substrate, A shooting step in which an actual image is taken that includes at least the target component for which anomalies are to be detected, A matching process step that determines which of the target parts matches the actual image based on the degree of agreement of feature points between the actual image shape as a two-dimensional shape in the actual image and the two-dimensional design shape based on the three-dimensional design information of the target part, An abnormality detection step for detecting an abnormality in the target part by comparing the actual information based on the actual image of the matched target part with normal information based on the three-dimensional design information when the target part is normal, with respect to the target part that has been matched in the matching processing step, A substrate processing method characterized by comprising the following features.

Images