Circuit board work machine and circuit board fixing method

Abstract

This board work machine performs work with respect to a board. The board work machine comprises: a support member that abuts on a back surface of a board to support the board; a suction device for suctioning the back surface of the board via a flow path provided in the support member; a detection unit for detecting a leak from an abutment surface of the support member with respect to the board when suctioning is performed by the suction device; a pressing device for pressing a predetermined position on the upper surface side of the board when the leak is detected by the detection unit; a storage unit for storing, when the state in which the leak is detected by the detection unit has turned to a state in which no leak is detected due to the pressing by the pressing device, the type of the board in association with the position on the upper surface side of the board where the pressing device has pressed; and a control unit for controlling the pressing device so that, in accordance with the type of the board supported by the support member, a position stored in the storage unit in association with the type of the board is pressed.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a substrate working machine and a substrate fixing method.

Background Art

[0002] In a substrate working machine (for example, a screen printing machine) that performs predetermined work on a substrate, when working on the substrate, the substrate may be sucked from the back surface and fixed to a support member (for example, a backup block, a backup pin). If there is a warped portion on the substrate, a leak may occur at the warped portion when sucked, and the substrate cannot be properly fixed to the support member. For example, International Publication No. 2018 / 163284 discloses a technique for eliminating a leak caused by a warped portion on a substrate. In the substrate working machine disclosed in International Publication No. 2018 / 163284, when a leak is detected, one of the corners of the substrate is pressed from above. The position where the substrate is pressed is preset and is set to press a plurality of positions predicted to be warped in order. Since the four corners of the substrate are often warped, in this substrate working machine, it is set to press the corners of the substrate in order. Until the leak is eliminated, the set positions are pressed in order.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In the substrate working machine of International Publication No. 2018 / 163284, when a leak is detected, a preset position on the substrate is pressed. However, since a plurality of preset positions are pressed in order until the leak is eliminated, depending on the position of the warped portion of the substrate, it may be necessary to press many positions until the leak is eliminated, and the process of eliminating the leak may take a long time.

[0004] This specification discloses a technique for efficiently eliminating a leak that may occur when sucking and fixing a substrate.

Means for Solving the Problems

[0005] A substrate work machine disclosed herein performs work on a substrate. The substrate work machine comprises a support member that contacts the back surface of the substrate and supports the substrate; a suction device that sucks the back surface of the substrate through a channel provided in the support member; a detection unit that detects a leak from the contact surface of the support member with the substrate when the suction device sucks the substrate; a pressing device that presses a predetermined position on the front surface of the substrate when the detection unit detects a leak; a storage unit that stores the type of substrate and the position on the front surface of the substrate pressed by the pressing device in association with each other when the detection unit changes from a state in which a leak is detected to a state in which a leak is not detected by pressing with the pressing device; and a control unit that controls the pressing device, which controls the pressing device to press the position stored in the storage unit associated with the type of substrate, according to the type of substrate supported by the support member.

[0006] In the above-described circuit board processing machine, the memory unit stores the type of circuit board and the position of the circuit board pressed by the pressing device, associating them when the pressing device eliminates the leak. In other words, the memory unit stores the position where pressing eliminates the leak. Circuit boards of the same type often warp at similar positions. By pressing the position associated with the type of circuit board, depending on the type of circuit board, it is possible to immediately press the position where pressing is likely to eliminate the leak. This prevents pressing unrelated positions to eliminate the leak, and shortens the time required for the leak elimination process.

[0007] Furthermore, the substrate fixing method disclosed herein for fixing a substrate comprises: a support step of supporting the substrate from the back side with a support member; a suction step of sucking the back side of the substrate through a channel provided in the support member; a first detection step of detecting a leak from the contact surface of the support member with the substrate when suction is performed in the suction step; a first pressing step of pressing a predetermined position on the front side of the substrate when a leak is detected in the first detection step; a second detection step of detecting the leak when the predetermined position is pressed in the first pressing step; a step of repeatedly performing the first pressing step and the second detection step while sequentially changing the predetermined position on the front side of the substrate until no leak is detected in the second detection step; a storage step of associating and storing the type of substrate and the position on the front side of the substrate pressed in the first pressing step when no leak is detected in the second detection step; and a second pressing step of pressing the position stored in the storage step associated with the type of substrate, according to the type of substrate supported by the support member.

[0008] In the above-described substrate fixing method, the memory step stores the type of substrate and the position on the surface side of the substrate that was pressed when no leak was detected. That is, the memory step stores the position where pressing eliminates the leak. Therefore, depending on the type of substrate, pressing the position stored in the memory step associated with that type of substrate can produce the same effects as the above-described substrate work machine. [Brief explanation of the drawing]

[0009] [Figure 1] A diagram showing the schematic configuration of a screen printing machine, which is an example of a substrate processing machine according to the embodiment. [Figure 2] A cross-sectional view showing the schematic configuration of the negative pressure generation mechanism. [Figure 3] A block diagram showing the control system of a screen printing machine. [Figure 4] These diagrams illustrate the position on the circuit board that is held down by the retaining mechanism. (a) shows the circuit board in a downward-curving state, and (b) shows the circuit board in an upward-curving state. [Figure 5]A flowchart illustrating an example of the process of securing a circuit board inside a screen printing machine. [Modes for carrying out the invention]

[0010] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0011] In the substrate work machine disclosed herein, if a leak is detected by the detection unit and a location associated with the type of substrate supported by the support member is stored in the storage unit, the control unit may press the location stored in the storage unit with the pressing device. If a leak is detected by the detection unit and a location associated with the type of substrate supported by the support member is not stored in the storage unit, the control unit may sequentially press a plurality of predetermined locations on the surface side of the substrate with the pressing device until the detection unit no longer detects a leak. With this configuration, if a location associated with the type of substrate is stored in the storage unit, the time required for the leak elimination process can be shortened by pressing a location that is highly likely to eliminate the leak. Furthermore, if a location associated with the type of substrate is not stored in the storage unit, the leak can be eliminated by sequentially pressing a plurality of predetermined locations.

[0012] In the substrate processing machine disclosed herein, the upper end of the support member may be provided with a contact surface that contacts the back surface of the substrate. One end of the flow path may be provided with a suction port that opens to the contact surface. The control unit may control the pressing device to press the substrate at a position above the suction port. With this configuration, the pressing device can press the substrate against the contact surface provided with a suction port that sucks the back surface of the substrate. Therefore, leaks can be effectively eliminated, for example, when the substrate is curved downwards.

[0013] In the substrate processing machine disclosed herein, the upper end of the support member may be provided with a plurality of contact surfaces that contact the back surface of the substrate. One end of the flow path may be provided with a suction port that opens into each of the plurality of contact surfaces. The control unit may control the pressing device to press the substrate at a position above the position between two adjacent suction ports when viewed from above. With this configuration, the pressing device presses the position between two adjacent contact surfaces. If the substrate is curved upward, pressing the position between two adjacent contact surfaces allows it to be bent so that both of those contact surfaces contact the substrate. In such cases, pressing the position between two adjacent contact surfaces allows two leaks to be eliminated simultaneously, further reducing the time required for the leak elimination process.

[0014] In the substrate processing machines disclosed herein, the substrate processing machine may be a printing machine equipped with a screen mask. Support members and suction devices may be used to position the substrate in a predetermined position relative to the screen mask. [Examples]

[0015] Referring to the drawings, a substrate processing machine according to an embodiment will be described. Here, a screen printing machine 10 will be described as an example of a substrate processing machine.

[0016] As shown in Figure 1, the screen printing machine 10 includes a circuit board positioning device 24, a negative pressure generation mechanism 54, a pressing mechanism 64, a screen mask 28, a squeegee device 30, a control device 20, and an interface device 22. The screen printing machine 10 receives the circuit board 2 from the upstream side of the mounting line, screen prints the desired solder onto the circuit board 2, and then sends the circuit board 2 to the downstream side of the mounting line. In the following description, in the screen printing machine 10, the transport direction of the circuit board 2 is referred to as the X direction, the direction perpendicular to the X direction in the horizontal plane is referred to as the Y direction, and the direction perpendicular to both the X and Y directions is referred to as the Z direction. Also, in the circuit board 2, the side that becomes the top surface when the circuit board 2 is transported and is screen printed on (the +Z side side) is sometimes referred to as the front surface, and the opposite side (the -Z side side) is sometimes referred to as the back surface.

[0017] The circuit board positioning device 24 includes a Y-direction movement mechanism 40, an X-direction movement mechanism 42, a rotation mechanism 44, a lifting mechanism 46, an X-direction transport mechanism 48, and a clamping mechanism 50.

[0018] The Y-direction movement mechanism 40 is supported on the base of the screen printing machine 10. The Y-direction movement mechanism 40 can be moved relative to the base of the screen printing machine 10 in the Y direction by the drive of an actuator (not shown).

[0019] The X-direction movement mechanism 42 is supported by the Y-direction movement mechanism 40. The X-direction movement mechanism 42 can move relative to the Y-direction movement mechanism 40 in the X direction by driving an actuator (not shown).

[0020] The rotating mechanism 44 is supported by the X-direction moving mechanism 42. The rotating mechanism 44 can rotate relative to the X-direction moving mechanism 42 around the Z-axis by being driven by a motor (not shown).

[0021] The lifting mechanism 46 is supported by the rotating mechanism 44. The lifting mechanism 46 can move relative to the rotating mechanism 44 in the Z direction by the drive of an actuator (not shown).

[0022] The X-direction transfer mechanism 48 and the clamp mechanism 50 are supported by the lifting mechanism 46. The X-direction transfer mechanism 48 includes a pair of conveyor belts 52 arranged along the X direction and a servo motor (not shown) for driving each conveyor belt 52. Both ends of the circuit board 2 in the Y direction are placed on the pair of conveyor belts 52, and by driving the servo motor, the circuit board 2 is transferred in the X direction. The distance between the pair of conveyor belts 52 can be adjusted according to the size of the circuit board 2. The clamp mechanism 50 can hold the circuit board 2 by clamping it from both ends in the Y direction and maintaining the circuit board 2 at a desired width.

[0023] Referring to FIG. 2, the negative pressure generating mechanism 54 will be described. FIG. 2 shows a state where the negative pressure generating mechanism 54 fixes the back surface of the circuit board 2. In FIG. 2, the illustration of the lifting mechanism 46 and the conveyor belt 52 is omitted. The negative pressure generating mechanism 54 sucks and fixes the circuit board 2 from the back surface. As shown in FIG. 2, the negative pressure generating mechanism 54 includes a support portion 55, a plurality of backup pins 56, an air flow path 58, a negative pressure generating device 60, and a sensor 62.

[0024] The support portion 55 is supported by the lifting mechanism 46 (see FIG. 1). The support portion 55 is capable of relative movement in the Z direction with respect to the lifting mechanism 46 by driving an actuator (not shown).

[0025] The backup pins 56 are supported by the support portion 55. The plurality of backup pins 56 are arranged on the support portion 55 at intervals. The backup pins 56 abut against the back surface of the circuit board 2 held by the clamp mechanism 50 and support the circuit board 2 from the back surface side. Further, the backup pins 56 are provided with a communication passage 57 extending axially inside the backup pins 56. The communication passage 57 extends from the upper end surface to the lower end surface of the backup pins 56. One end of the communication passage 57 (that is, the end on the lower end surface side of the backup pins 56) is connected to the air flow path 58.

[0026] The negative pressure generator 60 is connected to the communication passages 57 of each backup pin 56 via the air passage 58. Specifically, the downstream end of the air passage 58 (the right end in Figure 2) is connected to the negative pressure generator 60. The air passage 58 branches into multiple passages along its course, and each branched passage is connected to the lower end of the backup pin 56. The negative pressure generator 60 is, for example, a vacuum pump, and by sucking air from within the communication passages 57 while connected to each communication passage 57, it creates negative pressure in the space formed by the air passage 58 and each communication passage 57. The on / off operation of the negative pressure generator 60 is controlled by the control device 20. When the negative pressure generator 60 is turned on, it operates at a constant speed.

[0027] Sensor 62 is located in the air passage 58. Sensor 62 is a pressure sensor and detects the pressure in the air passage 58. When the negative pressure generator 60 is turned on with the upper end faces of all backup pins 56 in close contact with the circuit board 2, the openings of the multiple communication passages 57 are closed by the circuit board 2, and the space formed by the multiple communication passages 57 and the air passage 58 becomes negative pressure. Therefore, sensor 62 detects that the space in the air passage 58 is under negative pressure. On the other hand, if there is a gap between the upper end face of one of the backup pins 56 and the circuit board 2, outside air is drawn into the communication passage 57 through the opening from that part, and the space formed by the multiple communication passages 57 and the air passage 58 does not become negative pressure. Therefore, sensor 62 detects that the space in the air passage 58 is not under negative pressure. In other words, by detecting that the space in the air passage 58 is not under negative pressure, sensor 62 detects that there is an air leak (so-called leak) between one of the backup pins 56 and the circuit board 2.

[0028] Next, the retaining mechanism 64 will be described with reference to Figure 1. The retaining mechanism 64 is a mechanism that presses the surface of the circuit board 2 from above downwards. The retaining mechanism 64 includes a moving mechanism 66 and a retaining pin 68.

[0029] The moving mechanism 66 is supported on the base of the screen printing machine 10. The moving mechanism 66 can move relative to the base in the X and Y directions by driving an actuator (not shown). The moving mechanism 66 moves the retaining pin 68 between the standby position (position shown in Figure 1) and the circuit board 2. The standby position is a position that does not overlap with the screen mask 28 when viewed from above. The moving mechanism 66 can also move the retaining pin 68 relative to the base in the Z direction by driving an actuator (not shown).

[0030] The retaining pin 68 is cylindrical, and its tip is made of rubber. The moving mechanism 66 moves the retaining pin 68 onto the circuit board 2, and when the retaining pin 68 is lowered in that position, the retaining pin 68 presses down on a point on the surface of the circuit board 2 (specifically, the area in contact with the lower end surface of the retaining pin 68) from above.

[0031] If a leak occurs between the backup pin 56 and the circuit board 2, pressing down on the leak location or its vicinity from above will cause the upper end surface of the backup pin 56 to make close contact with the circuit board 2. This eliminates the leakage of air into the communication passage 57 and the air passage 58. In other words, the pressing mechanism 64 eliminates the leak by pressing down on an appropriate location on the surface of the circuit board 2. The appropriate location on the surface of the circuit board 2 will be described in detail later.

[0032] The screen mask 28 is a rectangular metal plate-like member, supported on all four sides by a mask support frame 32 fixed to the base of the screen printing machine 10. An opening is formed in the center of the screen mask 28, corresponding to the solder pattern to be printed on the circuit board 2.

[0033] The squeegee device 30 includes a Y-direction movement mechanism 70, squeegee heads 74a and 74b, and squeegees 76a and 76b.

[0034] The Y-direction movement mechanism 70 is supported on the base of the screen printing machine 10. The Y-direction movement mechanism 70 can move relative to the base in the Y direction by the drive of an actuator (not shown).

[0035] The squeegee heads 74a and 74b are supported by the Y-direction movement mechanism 70. The squeegee heads 74a and 74b can be moved relative to the Y-direction movement mechanism 70 in the Z-direction by the drive of actuators (not shown).

[0036] The squeegee 76a is supported by the squeegee head 74a. The squeegee 76a is tiltable relative to the squeegee head 74a by the drive of a servo motor (not shown). The squeegee 76b is supported by the squeegee head 74b. The squeegee 76b is tiltable relative to the squeegee head 74b by the drive of a servo motor (not shown). The squeegees 76a and 76b squeegee the solder supplied from the solder supply device (not shown) to the upper surface of the screen mask 28 onto the printed pattern.

[0037] The control device 20 includes a storage unit 80 for storing programs, a processor for executing the programs stored in the storage unit 80, and a communication device for communicating with a production management computer (not shown) that manages the overall operation of the mounting line. The control device 20 controls the operation of each component of the screen printing machine 10 according to instructions from the production management computer. Specifically, as shown in Figure 3, the control device 20 is connected to the interface device 22, the circuit board positioning device 24, the squeegee device 30, the negative pressure generator 60, and the pressing mechanism 64, and controls the interface device 22, the circuit board positioning device 24, the squeegee device 30, the negative pressure generator 60, and the pressing mechanism 64. The control device 20 is also connected to a sensor 62 and acquires detection results (pressure values) detected by the sensor 62. The control device 20 also transmits data indicating the status of the solder printing operation in the screen printing machine 10 to the production management computer.

[0038] Furthermore, the memory unit 80 stores the type of circuit board 2 and the position where the pressing mechanism 64 presses the surface of the circuit board 2 (hereinafter also referred to as the "pressing position") in association with each other. As described above, if the circuit board 2 is warped, the backup pins 56 may not make close contact with the circuit board 2, causing leakage. In this case, pressing the area where leakage is occurring or its vicinity will cause the backup pins 56 to make close contact with the circuit board 2, and the leakage will be eliminated. The memory unit 80 stores information regarding the pressing position used when the pressing position that eliminates the leakage is unknown (hereinafter also referred to as the first pressing position information), and information regarding the pressing position used when the pressing position that eliminates the leakage is known (hereinafter also referred to as the second pressing position information).

[0039] First, let's explain the first press position information. The first press position information includes information about multiple press positions set by the user and the order in which to press those multiple press positions. Hereinafter, in the first press information, the first press position to be pressed will be referred to as the "first position," and the nth (where n is an integer) press position to be pressed will be referred to as the "nth position." The multiple press positions set by the user can be, for example, a position above the backup pin 56 or a position between two adjacent backup pins 56.

[0040] Here, the pressing positions will be explained with reference to Figures 4(a) and 4(b). Figure 4(a) shows a downward curvature state in which the circuit board 2 is curved so as to protrude downward. In this case, the circuit board 2 will no longer be in close contact with the backup pins 56 at positions A and B, which correspond to the backup pins 56 near the downward curvature portion. Therefore, pressing positions A and B, which correspond to the area above the backup pins 56, will cause the circuit board 2 to be in close contact with the backup pins 56. Thus, by setting positions A and B above the backup pins 56 as pressing positions, pressing positions A and B in sequence will eliminate any leakage from the backup pins 56. If the pressing mechanism 64 is equipped with two pressing pins 68, the two pressing pins 68 may be used to press positions A and B simultaneously.

[0041] On the other hand, Figure 4(b) shows an upward-curving state in which the circuit board 2 is curved upwards, protruding upwards. In this case, the circuit board 2 will no longer be in close contact with the backup pins 56 at positions corresponding to each of the two adjacent backup pins 56 near the upward-curving portion. Even in this case, pressing down at the position corresponding to the above the backup pins 56 will cause the circuit board 2 to be in close contact with the backup pins 56 and the leak will be eliminated. However, when the circuit board is curved upwards, pressing down at the upward-curving position C between the two adjacent backup pins 56 will eliminate the upward curvature of the circuit board 2, and the two nearby backup pins 56 and the circuit board 2 will be in close contact simultaneously. Therefore, by setting the position between the two adjacent backup pins 56 as the pressing position, it may be possible to eliminate leaks from both backup pins 56 simultaneously. By setting the position between the two backup pins 56 as the pressing position in this way, the number of positions that need to be pressed to eliminate leaks can be reduced, and the time required for processing to eliminate leaks can be shortened.

[0042] In this way, multiple positions such as the position above the backup pin 56 and the position between two adjacent backup pins 56 are set as pressing positions, and the pressing order is set for these multiple pressing positions. Note that the pressing positions and pressing order can be set by the user as appropriate, and there are no particular limitations on the specific positions or order. For example, the user may select any position other than the position above the backup pin 56 or the position between two adjacent backup pins 56 as a pressing position.

[0043] Next, the second pressing position information will be explained. The second pressing position information is information about the pressing position where the leak was actually eliminated when the leak elimination process was executed according to the first pressing position information. Since the same type of circuit board 2 often warps in the same position in the same way, leaks often occur in the same part. For this reason, for the same type of circuit board 2, it is easier to eliminate the leak by pressing the same position. Therefore, when the leak elimination process is executed according to the first pressing position information, the pressing position where the leak was actually eliminated is stored, and when a leak occurs in the same type of circuit board 2, the pressing mechanism 64 presses the position stored in the storage unit 80. As a result, for the same type of circuit board 2, the leak elimination process can be efficiently executed by pressing the position where the leak was previously eliminated. Therefore, the time required for the leak elimination process can be shortened for the same type of circuit board 2.

[0044] Next, the process of fixing the circuit board 2 inside the screen printing machine 10 will be described. When printing on the surface of the circuit board 2, the circuit board 2 is securely fixed in a predetermined position inside the screen printing machine 10 by suction from the back side. If there is a warped part in the circuit board 2, leakage may occur from that warped part when the circuit board 2 is suctioned from the back side. If leakage occurs, the circuit board 2 cannot be fixed by suction. The process of eliminating leakage that occurs when the back side of the circuit board 2 is suctioned by the negative pressure generating mechanism 54 will be described below.

[0045] As shown in Figure 5, first, the control device 20 transports the circuit board 2 into the screen printing machine 10 and clamps it with the clamping mechanism 50 (S12). The process of clamping the circuit board 2 with the clamping mechanism 50 is carried out in the following procedure. When the circuit board 2 is sent from the upstream board transport device, the control device 20 drives the receiving transport device to receive the circuit board 2. Then, the control device 20 drives the Y-direction movement mechanism 40, the X-direction movement mechanism 42, the rotation mechanism 44, and the lifting mechanism 46 so that the X-direction transport mechanism 48 is in a position where it can receive the circuit board 2 from the receiving transport device. Then, the control device 20 drives the receiving transport device and the X-direction transport mechanism 48 to transfer the circuit board 2 from the receiving transport device to the X-direction transport mechanism 48. Once the circuit board 2 has been transferred to the X-direction transport mechanism 48, the control device 20 drives the X-direction transport mechanism 48 to transport the circuit board 2 to the X-direction position corresponding to the printing pattern of the screen mask 28. Next, the control device 20 drives the clamping mechanism 50 to hold the circuit board 2.

[0046] Next, the control device 20 raises the backup pin 56 (S14). Specifically, the control device 20 drives the support portion 55 to raise the backup pin 56 until its upper end surface contacts the back surface of the circuit board 2.

[0047] Next, the control device 20 uses the negative pressure generating mechanism 54 to draw air from the back surface of the circuit board 2 (S16). Specifically, the control device 20 turns on the negative pressure generating device 60. As a result, air is drawn in through the air passage 58 into the communication passage 57 of each backup pin 56. If the upper end surface of the backup pin 56 is in close contact with the back surface of the circuit board 2, the back surface of the circuit board 2 is drawn in.

[0048] Next, the control device 20 determines whether or not negative pressure has been detected by the sensor 62 (S18). Specifically, the control device 20 acquires the pressure value detected by the sensor 62 and determines whether or not the acquired pressure value is lower than a predetermined value. The circuit board 2 is supported by a plurality of backup pins 56, and each backup pin 56 attracts air to the back surface of the circuit board 2. When all of the backup pins 56 are in close contact with the circuit board 2, the space formed by the air passage 58 and the communication passage 57 of all the backup pins 56 becomes negative pressure, and the sensor 62 detects a pressure value indicating negative pressure. On the other hand, if there is a backup pin 56 that is not in close contact with the circuit board 2, outside air is drawn in from that backup pin 56 that is not in contact with the circuit board 2. In that case, the space formed by the air passage 58 and the communication passage 57 of all the backup pins 56 does not become negative pressure (the pressure does not drop sufficiently), and the sensor 62 does not detect a pressure value indicating negative pressure. If the sensor 62 detects negative pressure (YES in step S18), the control device 20 determines that all of the backup pins 56 are in close contact with the circuit board 2. In other words, the control device 20 determines that there is no leak. As a result, the circuit board 2 is securely fixed by suction. Therefore, the process of fixing the circuit board 2 is terminated.

[0049] On the other hand, if the sensor 62 does not detect negative pressure (NO in step S18), the control device 20 determines that there is one of the backup pins 56 that is not in close contact with the circuit board 2. In other words, the control device 20 determines that a leak has occurred and performs a process to eliminate the leak. First, the control device 20 determines whether or not second pressing position information is stored in the memory unit 80 for the circuit board 2 that is currently being clamped (S20). As described above, the second pressing position information is information about the pressing position where the leak was eliminated when a process to eliminate the leak was previously implemented for that circuit board 2. If the second pressing position information is not stored in the memory unit 80 (NO in step S20), the control device 20 determines that a process to eliminate the leak has never been performed for that circuit board 2 and decides to perform a process to eliminate the leak according to the first pressing position information. Then, the control device 20 drives the moving mechanism 66 to move the pressing pin 68 above the first position (S22), and then lowers the pressing pin 68 at that position (S24). As a result, the retaining pin 68 is in a state of pressing down on the first position of the circuit board 2.

[0050] Next, the control device 20 determines whether or not negative pressure has been detected by the sensor 62 (S26). If a leak occurs at the first position or a position near it, the leak may be eliminated by pressing down at the first position. On the other hand, if a leak occurs at a position other than the first position or a position near it, the leak will not be eliminated even if the first position is pressed down. If the sensor 62 does not detect negative pressure (NO in step S26), the control device 20 determines that the leak has not been eliminated. Then, according to the first pressing position information, the control device 20 drives the moving mechanism 66 to move the retaining pin 68 above the next position (i.e., the second position) (S28). After that, the process returns to step S24 and steps S24 to S28 are repeated.

[0051] If the sensor 62 detects negative pressure (YES in step S26), the control device 20 determines that the leak has been eliminated. The control device 20 then stores the pressing position that was pressed immediately before (i.e., the pressing position when the sensor 62 detected negative pressure) in the storage unit 80, associating it with the type of circuit board 2 (S30). As a result, the second pressing position information is stored in the storage unit 80. The process of fixing the circuit board 2 is then completed.

[0052] If the second pressing position information is stored in the memory unit 80 (YES in step S20), the control device 20 decides to perform a process to eliminate the leak according to the second pressing position information stored in the memory unit 80. The control device 20 then drives the movement mechanism 66 to move the pressing pin 68 above the position stored in the memory unit 80 (i.e., the pressing position stored in step S30) (S32), and then lowers the pressing pin 68 at that position (S34). As a result, the pressing pin 68 presses on the position on the circuit board 2 where the leak was previously eliminated, and the leak occurring at that position is eliminated.

[0053] Next, the control device 20 determines whether all positions included in the second pressing position information stored in the storage unit 80 have been pressed (S36). As will be described later, the second pressing position information may include multiple pressing positions. If not all positions stored in the second pressing position information have been pressed (NO in step S36), the process returns to step S32 and steps S32 to S36 are repeated.

[0054] When all positions stored in the second pressing position information are pressed (YES in step S36), the control device 20 determines whether or not negative pressure has been detected by the sensor 62 (S38). As described above, the same part of a circuit board 2 of the same type is prone to warping, so pressing the same position on the circuit board 2 where a leak was previously eliminated is likely to eliminate the leak. If the sensor 62 detects negative pressure (YES in step S38), the control device 20 determines that the leak has been eliminated and terminates the process of fixing the circuit board 2. In this way, by storing the second pressing position information in the storage unit 80, it is possible to press the same position on the circuit board 2 where a leak was previously eliminated, and the leak can be eliminated without pressing many positions. Therefore, the time required for the leak elimination process can be shortened.

[0055] On the other hand, if the sensor 62 does not detect negative pressure (NO in step S38), the control device 20 determines that the leak has not been eliminated. Leaks may occur from multiple backup pins 56, and the leak may not be eliminated unless multiple locations on the circuit board 2 are pressed down. For example, if the circuit board 2 is curved downward as shown in Figure 4(a), the leak will not be eliminated unless two points, A and B, are pressed down. Also, in multiple parts of the circuit board 2, there may be parts that are curved downward as shown in Figure 4(a), or parts that are curved upward as shown in Figure 4(b). In such cases, the leak will not be eliminated by pressing down only one point on the circuit board 2. Therefore, the process returns to step S22, and the processes from step S22 to step S30 are repeated. In this case, it can be considered that the pressing positions stored in the memory unit 80 have already been pressed down by the processes in steps S32 and S34, and the leak at those positions has already been eliminated. Therefore, by repeating the processes in steps S22 to S30, it is possible to identify leak locations other than the pressing positions already pressed in steps S32 and S34. Then, these newly identified pressing positions are stored in the storage unit 80 in association with the type of circuit board 2, in addition to the already stored pressing positions (S30). As a result, the second pressing position information is updated to include the previously stored pressing positions and the newly identified pressing positions, associated with the type of circuit board 2, and this updated second pressing position information is stored in the storage unit 80. Therefore, when the process of fixing the same type of circuit board 2 is performed next, the time required for the leak elimination process can be further reduced.

[0056] In this embodiment, all backup pins 56 were provided with communication passages 57, but the configuration is not limited to this. For example, the backup pins 56 may consist of both those with communication passages 57 (supporting and attracting the back surface of the circuit board 2) and those without communication passages 57 (supporting the circuit board 2 without attracting the back surface of the circuit board 2).

[0057] Furthermore, in this embodiment, the back surface of the circuit board 2 is supported and suctioned by backup pins 56, but the configuration is not limited to this. For example, the circuit board 2 may be supported by a box-shaped backup block. In this case, a plurality of through holes are provided on the surface of the backup block that contacts the back surface of the circuit board 2, and the circuit board 2 is fixed by suctioning the internal space of the backup block. In this case as well, the same process as in this embodiment can be performed to eliminate leakage.

[0058] Furthermore, in this embodiment, the above process was performed when fixing the circuit board 2 in the screen printing machine 10, but the configuration is not limited to this. Any circuit board work machine equipped with a configuration for fixing the circuit board 2 by suction can employ the same process as in this embodiment. For example, the same process as in this embodiment may be performed in a component mounting machine that mounts electronic components onto the circuit board 2.

[0059] The following points should be noted regarding the substrate work machine described in the embodiment. The screen printing machine 10 in the embodiment is an example of a "substrate work machine," the backup pin 56 is an example of a "support member," the negative pressure generating mechanism 54 is an example of a "suction device," the sensor 62 is an example of a "detection unit," the pressing mechanism 64 is an example of a "pressing device," and the control device 20 is an example of a "control unit."

[0060] The specific examples of the technologies disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples described above. Furthermore, the technical elements described herein or in the drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technologies illustrated herein or in the drawings achieve multiple objectives simultaneously, and achieving even one of these objectives constitutes technical usefulness in itself.

Claims

1. A circuit board work machine that performs operations on a circuit board, A support member that contacts the back surface of the substrate and supports the substrate, A suction device that sucks the back surface of the substrate through a flow path provided in the support member, A detection unit that detects leakage from the contact surface of the support member with the substrate when suction is performed by the suction device, A pressing device that presses a predetermined position on the surface side of the substrate when the detection unit detects a leak, A storage unit stores, in association with the type of substrate and the position on the surface side of the substrate pressed by the pressing device, when the detection unit changes from a state in which it detects the leak to a state in which it does not detect the leak, A control unit for controlling the pressing device, comprising: a control unit that controls the pressing device to press the position stored in the storage unit associated with the type of substrate, according to the type of substrate supported by the support member; Equipped with, The control unit, If a leak is detected by the detection unit, and the position associated with the type of substrate supported by the support member is stored in the storage unit, the position stored in the storage unit is pressed by the pressing device. If a leak is detected by the detection unit, and the position associated with the type of substrate supported by the support member is not stored in the storage unit, the pressing device presses a plurality of predetermined positions on the surface side of the substrate in sequence until the detection unit no longer detects a leak. A substrate work machine that, if a leak is detected by the detection unit despite the position stored in the memory unit being pressed by the pressing device, presses a plurality of predetermined positions on the surface side of the substrate sequentially with the pressing device until the detection unit no longer detects a leak, thereby identifying a leaking position other than the already pressed position, and stores the identified position in the memory unit in association with the type of substrate, in addition to the already stored position.

2. The upper end of the support member is provided with a contact surface that contacts the back surface of the substrate, A suction port opening to the contact surface is provided at one end of the aforementioned flow path. The substrate work machine according to claim 1, wherein the control unit controls the pressing device to press the substrate at a position above the suction port.

3. The upper end of the support member is provided with a plurality of contact surfaces that contact the back surface of the substrate. One end of the aforementioned flow path is provided with a suction port that opens to each of the multiple contact surfaces, The substrate work machine according to claim 1 or 2, wherein the control unit controls the pressing device to press the substrate at a position above the position between two adjacent suction ports when viewed from above.

4. The aforementioned substrate processing machine is a printing machine equipped with a screen mask, The substrate work machine according to claim 1, wherein the support member and the suction device are used to position the substrate at a predetermined position relative to the screen mask.

5. A method for fixing a circuit board, A support step in which the substrate is supported from the back side with a support member, A suction step of sucking the back surface of the substrate through a flow path provided in the support member, A first detection step in which leakage from the contact surface of the support member with the substrate is detected when suction is performed in the suction step, A first pressing step is performed in which a predetermined position on the surface side of the substrate is pressed when a leak is detected in the first detection step, A second detection step in which the leak is detected when the predetermined position is pressed in the first pressing step, When the leak is detected in the second detection step, a second pressing step is performed to press a predetermined position on the surface side of the substrate, The process involves repeatedly performing the second pressing step and the second detection step while sequentially changing predetermined positions on the surface side of the substrate until the leak is no longer detected in the second detection step, The system includes a storage step in which, when no leak is detected in the second detection step, the type of substrate and the position on the surface side of the substrate pressed in the second pressing step are associated and stored. In the second pressing step, If the position associated with the type of substrate supported by the support member is stored in the storage step, the position stored in the storage step is pressed. If the position associated with the type of substrate supported by the support member is not stored in the storage step, then a plurality of predetermined positions on the surface side of the substrate are pressed in sequence. In the memory step, the position associated with the type of substrate supported by the support member is stored, and if a leak is detected in the second detection step despite pressing the position stored in the memory step, the substrate fixing method further involves sequentially pressing the plurality of predetermined positions on the surface side of the substrate other than the position stored in the memory step until no more leaks are detected in the second detection step.

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