Protective member forming apparatus

Abstract

To suppress bend of a glass table when expanding a liquid resin.SOLUTION: A table 31 is supported by a placement part 361 of a support base 36 via an annular cylinder-like support column 35 and a block-like first support part 37 supporting a lower end of an outer edge part 312. Even when the support base 36 is deformed, deformation of the support base 36 is hardly transmitted to the table 31 in comparison to a case of directly supporting the table 31 by the support table 36. Consequently, since bend of the table 31 can be suppressed, a protection member with the uniform thickness can be formed on a wafer 100.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a protective member forming apparatus.

Background Art

[0007] The protective member forming apparatus of the present invention (this protective member forming apparatus) comprises: a table mechanism having a mounting surface for placing a sheet; a liquid resin supply mechanism for supplying a predetermined amount of liquid resin onto the sheet placed on the mounting surface; a holding section having a holding surface facing the mounting surface and holding a wafer; a vertical movement mechanism for moving the table mechanism and the holding section relative to each other in a direction perpendicular to the mounting surface and spreading the liquid resin onto the lower surface of the wafer held on the holding surface; a curing mechanism for curing the spread liquid resin by applying external stimuli; and a control section, wherein the table mechanism comprises: a table having the mounting surface; a support column whose center coincides with the center of the table and supports the lower surface of the table; and a support base that supports the lower end of the support column. The vertical movement mechanism is positioned on the support base opposite the table, and includes at least four first support parts positioned between the support column and the support base at equal angles with respect to the center of the support column. . Another protective member forming apparatus of the present invention comprises: a table mechanism having a mounting surface for placing a sheet; a liquid resin supply mechanism for supplying a predetermined amount of liquid resin onto the sheet placed on the mounting surface; a holding section having a holding surface facing the mounting surface and holding a wafer; a vertical movement mechanism for moving the table mechanism and the holding section relative to each other in a direction perpendicular to the mounting surface and spreading the liquid resin onto the lower surface of the wafer held on the holding surface; a curing mechanism for curing the spread liquid resin by applying external stimuli; and a control section, wherein the table mechanism comprises: a table having the mounting surface; a support column whose center coincides with the center of the table and supports the lower surface of the table; and a support base supporting the lower end of the support column. The vertical movement mechanism is arranged at least three times at equal angles around the center of the table, on the outer portion of the support base of the table. And so, The support column and the support base are provided with at least three second support parts arranged at equal angles with respect to the center of the support column. picture, The second support is positioned between the two vertical movement mechanisms. doing . [Effects of the Invention]

[0008] In this protective member forming apparatus, the table is supported by a support base via support columns. Therefore, even if the support base deforms, the deformation is less likely to be transmitted to the table compared to when the table is directly supported by the support base. As a result, table deflection can be suppressed, and a protective member of uniform thickness can be formed on the wafer. [Brief explanation of the drawing]

[0009] [Figure 1]This is a perspective view showing the configuration of the first protective member forming apparatus. [Figure 2] This is a cross-sectional view showing the configuration near the table mechanism of the first protective member forming apparatus. [Figure 3] This is a perspective view showing the configuration of the support base of the first protective member forming apparatus. [Figure 4] This is a cross-sectional view showing the configuration near the table mechanism of the first protective member forming apparatus. [Figure 5] This is a perspective view showing the configuration of the second protective member forming apparatus. [Figure 6] This is a perspective view showing the configuration of the support base of the second protective member forming device. [Modes for carrying out the invention]

[0010] The first protective member forming apparatus 1 shown in Figure 1 is an apparatus for forming a protective member made of ultraviolet-curing resin over the entire surface of the lower surface 102 of a wafer 100.

[0011] The wafer 100 shown in Figure 1 is, for example, a circular az-sliced ​​wafer formed by thinly slicing a cylindrical silicon ingot with a wire saw or the like. However, wafer 100 is not limited to an az-sliced ​​wafer, and may be, for example, a semiconductor wafer on which a device is formed.

[0012] The first protective member forming apparatus 1 has a table mechanism 30. As shown in Figures 1 and 2, the table mechanism 30 includes a table 31 having a mounting surface 311, and a table support portion 32 and a table pressing portion 33 that support the table 31.

[0013] Table 31 is a glass table made of, for example, quartz glass and is formed in a substantially disc shape. A sheet 110 for storing a liquid ultraviolet curable resin is placed on a placement surface 311 which is a flat upper surface of the table 31. Thus, the table mechanism 30 has a placement surface 311 for placing the sheet 110 for storing the liquid ultraviolet curable resin. This placement surface 311 is formed larger than the lower surface 102 of the wafer 100.

[0014] Table 31 has an outer edge portion 312 that is thinner than a central portion where the placement surface 311 is formed on its outer peripheral side. The outer edge portion 312 has an upper surface lower than the placement surface 311. The table support portion 32 is formed in a substantially annular shape having an L-shaped cross section and supports the lower surface and side surface of the outer edge portion 312 of the table 31. The table pressing portion 33 is formed in an annular shape and is arranged to press the upper surface of the outer edge portion 312 of the table 31 and the upper surface of the table support portion 32 from above. And the table support portion 32 and the table pressing portion 33 are fastened to each other by screws not shown. Thus, in the table mechanism 30, the table support portion 32 and the table pressing portion 33 support the table 31 by sandwiching the outer edge portion 312 of the table 31 from the vertical direction.

[0015] Note that the upper surface of the table pressing portion 33 may be configured to be slightly higher than the placement surface 311 of the table 31. In this case, it is possible to suppress the liquid resin stored in the sheet 110 placed on the placement surface 311 from overflowing from the placement surface 311.

[0016] Further, the table mechanism 30 further includes a support column 35 having an annular columnar (cylindrical) shape and a support base 36 that supports the lower end of the support column 35.

[0017] As shown in FIGS. 1 and 2, the annular columnar support column 35 supports the lower surface of the table support portion 32 that supports the lower surface of the table 31 with the center of the support column 35 aligned with the center of the table 31. That is, the support column 35 has its center aligned with the center of the table 31 and supports the lower surface of the table 31 via the table support portion 32.

[0018] The support base 36 is formed in a substantially square-ring shape in a plan view, and as shown in FIG. 2, it has a housing portion 360 which is a space for housing the table 31, the support column 35, etc. inside. Also, as shown in FIG. 3, the support base 36 has a substantially square-ring-shaped placement portion 361 protruding centrally at its bottom. And as shown in FIG. 2, the lower end of the support column 35 that supports the table 31 is supported by this placement portion 361.

[0019] Also, as shown in FIGS. 2 and 3, a block-shaped first support portion 37 is provided between the support column 35 and the support base 36. That is, the support column 35 is supported by the placement portion 361 of the support base 36 via the first support portion 37. The first support portion 37 has, for example, a rectangular parallelepiped shape having sides of a length that can be installed on the placement portion 361 of the support base 36. And in the present embodiment, as shown in FIG. 3, four first support portions 37 are arranged on the placement portion 361 of the support base 36. These four first support portions 37 are arranged on the placement portion 361 at equal angles around the center of the support column 35 shown in FIG. 2.

[0020] Also, as shown in FIG. 1, the first protective member forming device 1 has a liquid resin supply mechanism 25 in the vicinity of the support base 36 in the table mechanism 30. The liquid resin supply mechanism 25 is for supplying a predetermined amount of liquid resin onto the sheet 110 placed on the placement surface. The liquid resin supply mechanism 25 includes a resin supply nozzle 26 and a resin supply source 27 communicable with the resin supply nozzle 26.

[0021] The resin supply nozzle 26 is rotatable about a pivot axis in the Z-axis direction and has a supply port 261 facing the mounting surface 311 of the table mechanism 30. The resin supply nozzle 26 is connected to the resin supply source 27, enabling it to supply a predetermined amount of liquid resin 200 to the sheet 110 on the mounting surface 311. In this embodiment, the liquid resin 200 supplied by the liquid resin supply mechanism 25 is an ultraviolet-curing resin that hardens when irradiated with ultraviolet light.

[0022] Furthermore, as shown in Figures 1 and 2, the first protective member forming apparatus 1 includes a UV lamp unit 20 below the table 31 within the housing 360 of the support base 36. The UV lamp unit 20 includes a UV lamp 21, a lamp stand 22 positioned below the UV lamp 21, and a plurality of lamp support columns 23.

[0023] The UV lamp (ultraviolet irradiation lamp) 21 has a roughly disc shape and is configured to irradiate ultraviolet light toward the table 31 above. The lamp stand 22 is placed on the mounting portion 361 of the support base 36 and supports the UV lamp 21 via the lamp support column 23.

[0024] This UV lamp unit 20 is an example of a curing mechanism that cures a spread-out liquid resin by applying an external stimulus. Specifically, the UV lamp unit 20 is configured to cure the liquid resin 200, which is spread out on the sheet 110 of the table 31, by irradiating it with ultraviolet light as an external stimulus through the table 31 and the sheet 110.

[0025] The liquid resin 200 supplied by the liquid resin supply mechanism 25 may be a thermosetting resin that hardens when heat is applied. In this case, a heat supply unit having a heating mechanism such as a heater is provided instead of the UV lamp unit 20 as the curing mechanism.

[0026] Furthermore, as shown in Figures 1 and 2, the first protective member forming apparatus 1 has a holding section 60 for holding the wafer 100. As shown in Figure 2, the holding section 60 has a circular plate 61 in plan view and a porous member 62 fitted to the lower surface side of the plate 61.

[0027] The surface of the porous member 62 is a holding surface 63 for holding the wafer 100, and is formed to face the mounting surface 311 of the table mechanism 30. In the holding section 60, the porous member 62 is connected to a suction source (not shown), which generates a suction force on the holding surface 63. As a result, the holding section 60 can hold the wafer 100 by suction using the holding surface 63. Thus, the holding section 60 has a holding surface 63 that holds the wafer 100 facing the mounting surface 311 of the table mechanism 30.

[0028] As shown in Figure 1, multiple load sensors 65 are arranged on the upper surface of the plate 61 of the holding section 60. The load sensors 65 are used to measure the load (reaction force) applied to the wafer 100 from the table mechanism 30 side when the wafer 100 held on the holding surface 63 is pressed against the liquid resin 200 on the table mechanism 30 from the +Z direction side.

[0029] The holding portion 60 is supported by the slider 50 shown in Figure 1. The slider 50 is formed in a substantially rectangular shape in plan view. The slider 50 is configured to move in the Z-axis direction while supporting the holding portion 60.

[0030] The slider 50 supports the holding portion 60 in the central region of its lower surface via an annular unit connector 66 and at least four fixing bolts (tilt adjustment portions) 67 arranged at equal angles. The fixing bolts 67 adjust the height of the holding portion 60 relative to the slider 50 and the parallelism of the holding portion 60. In this embodiment, since the slider 50 and the holding portion 60 are fastened at four points by the four fixing bolts 67, when a load is applied to the slider 50, the deformation of the slider 50 is suppressed from being transmitted to the plate 61 of the holding portion 60.

[0031] As shown in Figure 1, above the slider 50, a roughly rectangular upper base 53 is positioned together with the support base 36 to sandwich the slider 50 from above and below. The centers of the upper base 53, the slider 50, the holding surface 63 of the holding part 60, the support base 36, and the mounting surface 311 of the table mechanism 30 coincide with each other.

[0032] Furthermore, the first protective member forming apparatus 1 includes a pair of vertical movement mechanisms 4 arranged opposite each other, with the table 31 of the table mechanism 30 in between. The vertical movement mechanisms 4 move the table mechanism 30 and the holding part 60 relative to each other in the Z-axis direction perpendicular to the mounting surface 311, and spread the liquid resin on the mounting surface 311 onto the lower surface 102 of the wafer 100 held on the holding surface 63.

[0033] In this embodiment, the vertical movement mechanism 4 connects the support base 36 and the upper base 53, and moves the slider 50 in the Z-axis direction between the upper base 53 and the support base 36. As a result, the vertical movement mechanism 4 moves the holding portion 60 supported by the slider 50 in the Z-axis direction relative to the mounting surface 311 of the table 31 supported by the support base 36.

[0034] As shown in Figure 1, the vertical movement mechanism 4 includes a nut 40 positioned on the slider 50, a ball screw 41 screwed into the nut 40, a motor 42 that rotates the ball screw 41, and a pair of guide rails 44.

[0035] The nut 40 is connected to both ends of the slider 50 by bolts or the like (not shown). The nut 40 is screwed onto a ball screw 41 that extends in the Z-axis direction. The upper end of the ball screw 41 is supported by a fixed bearing 420 fixed to the upper base 53 and is also connected to a motor 42. The motor 42 is connected to the upper end of the ball screw 41 and rotates the ball screw 41.

[0036] Furthermore, the lower end of the ball screw 41 is supported by a support-side bearing 416 fixed to the support base 36. That is, a pair of mounting parts 362 for installing the vertical movement mechanism 4 are provided at both ends of the support base 36 that sandwich the table 31, and the support-side bearing 416 that supports the lower end of the ball screw 41 is fixed to these mounting parts 362. In this way, the vertical movement mechanism 4 is arranged on the support base 36 facing each other with the table 31 in between.

[0037] A pair of guide rails 44 are positioned parallel to the ball screw 41, closer to the center of the slider 50 than the ball screw 41. The guide rails 44 guide the vertical movement of the slider 50 along the Z-axis direction. The upper ends of the guide rails 44 are fixed to the upper base 53 by guide rail fixing nuts 442. The guide rails 44 also movably pass through through holes provided at both ends of the slider 50. Furthermore, the lower ends of the guide rails 44 pass through a support base insertion hole 363 (see Figure 3) provided in the mounting portion 362 of the support base 36 and are fixed to the mounting portion 362 by guide rail fixing nuts 445.

[0038] In the vertical movement mechanism 4 having this configuration, the motor 42 rotates the ball screw 41, converting the rotational motion of the ball screw 41 into linear motion in the Z-axis direction of the nut 40 that is screwed onto the ball screw 41. Consequently, the slider 50 equipped with the nut 40, and the holding part 60 supported by the slider 50, move along the guide rail 44 in the Z-axis direction.

[0039] Furthermore, as shown in Figure 1, for example, a pair of counterbalances 55 are connected to the slider 50 and the upper base 53. These counterbalances 55 are intended to reduce or offset the load on the vertical movement mechanism 4 caused by the weight of the holding part 60 and the slider 50.

[0040] Furthermore, the first protective member forming apparatus 1 has a control unit 7 inside for controlling the operation of the first protective member forming apparatus 1. The control unit 7 includes a CPU that performs calculations according to a control program, and a storage medium such as memory. The control unit 7 executes various processes and provides overall control over each component of the first protective member forming apparatus 1. For example, the control unit 7 controls each of the above-mentioned components of the first protective member forming apparatus 1 to perform the process of forming a protective member on the wafer 100.

[0041] The following describes the process of forming a protective member in the first protective member forming apparatus 1. First, as shown in Figure 2, the holding portion 60 holds the upper surface 101 of the wafer 100 by suction using the holding surface 63, such that the center of the holding surface 63 and the center of the wafer 100 are approximately aligned.

[0042] In parallel with the suction holding of the wafer 100 by the holding unit 60, the sheet 110 is placed on the mounting surface 311 of the table mechanism 30. Then, the control unit 7 uses the liquid resin supply mechanism 25 shown in Figure 1 to accumulate a predetermined amount of liquid resin 200 in the center of the sheet 110.

[0043] Furthermore, the control unit 7 controls the vertical movement mechanism 4 to lower the slider 50 and the holding unit 60, which is supported by the slider 50 and holds the wafer 100, in the -Z direction. During this lowering, the counterbalance 55 applies a force that biases the slider 50 in the +Z direction. This reduces the load on the vertical movement mechanism 4.

[0044] The control unit 7 lowers the slider 50 and the holding unit 60 using the vertical movement mechanism 4, bringing the lower surface 102 of the wafer 100, which is held by suction in the holding unit 60, into contact with the liquid resin 200 accumulated in the center of the sheet 110 placed on the mounting surface 311 of the table 31. Then, the control unit 7 further lowers the holding unit 60, and as shown in Figure 4, presses the liquid resin 200 against the lower surface 102 of the wafer 100, spreading it radially across the lower surface 102 of the wafer 100.

[0045] Subsequently, the control unit 7 controls the vertical movement mechanism 4 to stop the slider 50 and the holding unit 60 from descending, and in this state continues to spread the liquid resin 200 film onto the lower surface 102 of the wafer 100. As a result, a film of liquid resin 200 of uniform thickness is formed on the lower surface 102 of the wafer 100.

[0046] Next, the control unit 7 controls the UV lamp 21 of the UV lamp unit 20 to irradiate the film of liquid resin 200 with ultraviolet light, which acts as an external stimulus. As a result, the film of liquid resin 200 hardens, and a protective member of uniform thickness is formed on the lower surface 102 of the wafer 100.

[0047] Subsequently, the control unit 7 controls the vertical movement mechanism 4 to raise the slider 50 and the holding unit 60. In this way, the wafer 100 having the protective member is formed.

[0048] As described above, in this embodiment, the slider 50 and the holding part 60 are lowered in the -Z direction by the vertical movement mechanism 4, thereby pressing the wafer 100 held by the holding part 60 against the liquid resin 200 on the mounting surface 311 of the table 31. At this time, the support base 36 that supports the ball screw 41 and the lower end of the guide rail 44 of the vertical movement mechanism 4 may deform. Since the support base 36 supports the table 31, if the support base 36 deforms, this deformation is transmitted to the table 31, causing the table 31 to bend. This results in an uneven load being transmitted from the wafer 100 of the holding part 60 to the liquid resin 200 on the table 31, which raises concerns that it will be difficult to form a protective member of uniform thickness on the wafer 100.

[0049] In other words, the support base 36 deforms such that the mounting portion 362, where the ball screw 41 is positioned, bends upward symmetrically with respect to the first line 364 shown in Figures 1-4. As a result, the table 31 also deforms with respect to the first line 364, raising concerns that it will be difficult to form a protective member of uniform thickness. This first line 364 is a line that extends along the Y-axis direction, which is perpendicular to the direction in which the vertical movement mechanisms 4 are aligned and parallel to the mounting surface 311, at the midpoint of the pair of vertical movement mechanisms 4, and passes through the center of the mounting surface 311.

[0050] Furthermore, the slider 50 deforms symmetrically with respect to the second line 51 (see Figures 1, 2, and 4), causing the portion where the nut 40 that screws onto the ball screw 41 is located to droop. As a result, the plate 61 also deforms with respect to the second line 51, raising concerns that it will be difficult to form a protective member of uniform thickness. This second line 51 is a line that extends along the Y-axis direction, which is perpendicular to the direction in which the vertical movement mechanisms 4 are aligned and parallel to the holding surface 63, at the midpoint of the pair of vertical movement mechanisms 4, and passes through the center of the holding surface 63.

[0051] In this regard, in the table mechanism 30 according to this embodiment, the table 31 is supported on the mounting portion 361 of the support base 36 via an annular columnar support column 35 that supports the lower end of its outer edge portion 312 and a plurality of block-shaped first support portions 37 that are arranged at equal angles with respect to the center of the table 31. Therefore, even if the support base 36 deforms, the deformation of the support base 36 is less likely to be transmitted to the table 31 compared to when the table 31 is directly supported by the support base 36. As a result, the deflection of the table 31 can be suppressed, and a protective member of uniform thickness can be formed on the wafer 100.

[0052] Furthermore, in this embodiment, the table 31 is supported by the support base 36 via a first support portion 37 that has a small contact area with the support base 36. Therefore, the transmission of deformation of the support base 36 to the table 31 can be suppressed more effectively.

[0053] Furthermore, in this embodiment, the first protective member forming apparatus 1 has a pair of vertical movement mechanisms 4, each having a motor 42, arranged facing each other across the table 31 of the table mechanism 30. Therefore, when the slider 50 and the holding part 60 are moved in the Z-axis direction by the two vertical movement mechanisms 4, the control unit 7 can correct the tilt of the holding part 60 that holds the wafer 100 by individually adjusting the output of the motor 42 of each vertical movement mechanism 4. As a result, the wafer 100 can be lowered so that it is parallel to the mounting surface 311 of the table mechanism 30, making it easy to form a protective member of uniform thickness on the wafer 100.

[0054] Furthermore, since the plate 61 is supported by the slider 50 via at least four fixing bolts 67, even if the slider 50 deforms, the deformation of the slider 50 is less likely to be transmitted to the plate 61 compared to when the plate 61 is directly supported by the slider 50. Therefore, deflection of the plate 61 can be suppressed.

[0055] In this embodiment, the table mechanism 30 supports the table 31 via a support base 36 through an annular columnar support column 35 and a block-shaped first support portion 37. However, the table mechanism 30 may also support the table 31 via the support base 36 only through the annular columnar support column 35, without using the first support portion 37. Even in this case, the transmission of deformation of the support base 36 to the table 31 can be suppressed compared to the case where the table 31 is directly supported by the support base 36.

[0056] Furthermore, in the first protective member forming apparatus 1, it is sufficient that at least four first support parts 37 are arranged between the support column 35 and the support base 36, at equal angles with respect to the center of the support column 35. Therefore, five or more first support parts 37 may be arranged on the mounting portion 361 of the support base 36.

[0057] The protective member forming apparatus according to this embodiment may also be the second protective member forming apparatus 2 shown in Figure 5.

[0058] As shown in Figure 5, the second protective member forming apparatus 2, like the first protective member forming apparatus 1 shown in Figure 1, includes a control unit 7, a table mechanism 30 including a support base 36, a holding unit 60, a UV lamp unit 20, a liquid resin supply mechanism 25, a slider 50, an upper base 53, a counterbalance 55, and a vertical movement mechanism 4.

[0059] However, in the second protective member forming apparatus 2, the upper base 53, slider 50, and support base 36 are formed in a roughly equilateral triangular shape in plan view. Counterbalances 55 and vertical movement mechanisms 4 are provided near each of the three vertices of the upper base 53, slider 50, and support base 36. In other words, in the second protective member forming apparatus 2, the three vertical movement mechanisms 4 are arranged at equal angles with respect to the center of the table 31 in the table mechanism 30, on the outer portion of the table mechanism 30 in the support base 36.

[0060] The vertical movement mechanism 4 of the second protective member forming apparatus 2 is equipped with a nut 40 located on a slider 50, a ball screw 41 screwed into the nut 40, a motor 42 for rotating the ball screw 41, and a guide rail 44, similar to the first protective member forming apparatus 1. However, the second protective member forming apparatus 2 has only one guide rail 44.

[0061] Furthermore, in the second protective member forming apparatus 2, similar to the first protective member forming apparatus 1, as shown in Figures 5 and 2, the table mechanism 30 includes an annular columnar support column 35 and a support base 36 that supports the lower end of the support column 35. The annular columnar support column 35 is centered on the center of the table 31 and supports the lower surface of the table 31 via the table support portion 32.

[0062] The support base 36 has a housing section 360 inside which houses the table 31 and support columns 35, and also has an annular mounting section 361 (see also Figure 6) protruding from the center at its bottom. The lower end of the support column 35 that supports the table 31 is supported by this mounting section 361.

[0063] Furthermore, as shown in Figures 5 and 2, a block-shaped second support portion 38 is provided between the support column 35 and the support base 36. The second support portion 38 has a rectangular parallelepiped shape with sides of a length that allows it to be installed on the mounting portion 361 of the support base 36, similar to the first support portion 37 of the first protective member forming apparatus 1.

[0064] In this embodiment, as shown in Figure 6, three second support parts 38 are arranged on the mounting portion 361 of the support base 36. These three second support parts 38 are arranged on the mounting portion 361 at equal angles with respect to the center of the support column 35.

[0065] Furthermore, in the second protective member forming apparatus 2, there is a concern that the support base 36 and slider 50 may deform, making it difficult to form a protective member of uniform thickness. In other words, the support base 36 deforms such that the three mounting sections 362, where the ball screws 41 are positioned, bend upward, relative to the first line 364 shown in Figures 5 and 6. As a result, the table 31 also deforms relative to the first line 364, raising concerns that it will be difficult to form a protective member of uniform thickness. This first line 364 is a line that extends from the center of the table 31 in a direction parallel to the mounting surface 311 to the midpoint between adjacent vertical movement mechanisms 4.

[0066] Furthermore, the slider 50 deforms so that the portion where the nut 40 that screws onto the ball screw 41 is located hangs down, with the second line 51 (see Figure 5) as the reference. As a result, the plate 61 also deforms with respect to the second line 51, raising concerns that it will be difficult to form a protective member of uniform thickness. This second line 51 is a line that extends parallel to the holding surface 63 from the center of the holding part 60 to the midpoint between adjacent vertical movement mechanisms 4.

[0067] Furthermore, in the second protective member forming apparatus 2, the support base 36, which is roughly equilateral triangular in shape, has three mounting parts 362 near its vertex for installing the vertical movement mechanism 4. The second support part 38 is positioned between the two mounting parts 362 on the mounting part 361. In other words, in a plan view, the second support part 38 is positioned between the two vertical movement mechanisms 4 on the mounting part 361.

[0068] In the protective member formation process of the second protective member forming apparatus 2 having such a configuration, similar to the first protective member forming apparatus 1, the control unit 7 controls the vertical movement mechanism 4 to lower the slider 50 and the holding part 60 supported by the slider 50 and holding the wafer 100 in the -Z direction, so that the liquid resin 200 accumulated on the mounting surface 311 of the table 31 is spread onto the lower surface 102 of the wafer 100 to have a uniform thickness, as shown in Figure 4. Then, the control unit 7 cures the liquid resin 200 with the UV lamp unit 20 to form a protective member of uniform thickness on the lower surface 102 of the wafer 100.

[0069] In the table mechanism 30 of the second protective member forming apparatus 2, the table 31 is supported on the mounting portion 361 of the support base 36 via an annular columnar support column 35 that supports the lower end of its outer edge portion 312 and a plurality of block-shaped second support portions 38 that are arranged at equal angles with respect to the center of the table 31. Therefore, in the second protective member forming apparatus 2 as well, deformation of the support base 36 is less likely to be transmitted to the table 31 compared to when the table 31 is directly supported by the support base 36. As a result, deflection of the table 31 can be suppressed, and a protective member of uniform thickness can be formed on the wafer 100.

[0070] Furthermore, in the second protective member forming apparatus 2, the table 31 is supported by the support base 36 via a second support portion 38, which has a small contact area with the support base 36. Therefore, the transmission of deformation of the support base 36 to the table 31 can be suppressed more effectively.

[0071] Furthermore, in the second protective member forming apparatus 2, three vertical movement mechanisms 4, each having a motor 42, are arranged to surround the table 31 of the table mechanism 30 at equal intervals. Therefore, when the slider 50 and the holding part 60 are moved in the Z-axis direction by the three vertical movement mechanisms 4, the control unit 7 can correct the tilt of the holding part 60 that holds the wafer 100 in more detail by individually adjusting the output of the motors 42 of each vertical movement mechanism 4. As a result, a protective member of uniform thickness can be formed on the wafer 100 with greater precision.

[0072] Furthermore, in the second protective member forming apparatus 2, since the plate 61 of the holding part 60 is supported by the slider 50 via at least three fixing bolts 67, even if the slider 50 deforms, the deformation of the slider 50 is less likely to be transmitted to the plate 61 compared to when the plate 61 is directly supported by the slider 50. Therefore, deflection of the plate 61 can be suppressed.

[0073] As mentioned above, in the second protective member forming apparatus 2, the three vertical movement mechanisms 4 are arranged near the three vertices of the support base 36. In this regard, in the second protective member forming apparatus 2, it is sufficient that at least three vertical movement mechanisms 4 are arranged at equal angles with respect to the center of the table 31 in the table mechanism 30, on the outer portion of the table mechanism 30 in the support base 36. Therefore, the second protective member forming apparatus 2 may have four or more vertical movement mechanisms 4.

[0074] Furthermore, in the second protective member forming apparatus 2, it is sufficient that at least three second support parts 38 are arranged between the support column 35 and the support base 36 at equal angles centered on the center of the support column 35. Therefore, four or more second support parts 38 may be arranged on the mounting portion 361 of the support base 36. [Explanation of Symbols]

[0075] 1: First protective member forming apparatus, 2: Second protective member forming apparatus, 4: Vertical movement mechanism, 7: Control unit, 20: UV lamp unit, 21: UV lamp, 22: Lamp base, 23: Lamp support column, 25: Liquid resin supply mechanism, 26: Resin supply nozzle, 27: Resin supply source, 30: Table mechanism, 31: Table, 32: Table support part, 33: Table holding part, 35: Support column, 36: Support base, 37: First support part, 38: Second support part, 40: Nut, 41: Ball screw, 42: Motor, 44: Guide rail, 50: Slider, 51: Second line, 53: Upper base, 55: Counterbalance, 60: Holding part, 61: Plate, 62: Porous member, 63: Holding surface, 65: Load sensor, 66: Unit connector, 67: Fixing bolt, 100: Wafer, 101: Top surface, 102: Bottom surface, 110: Sheet 200: liquid resin, 261: supply port, 311: mounting surface, 312: outer edge, 360: Storage section, 361: Mounting section, 362: Installation section, 363: Support base insertion hole, 364: First line, 416: Support side bearing, 420: Fixed side bearing, 442: Guide rail fixing nut, 445: Guide rail fixing nut

Claims

1. A protective member forming apparatus comprising: a table mechanism having a mounting surface for placing a sheet; a liquid resin supply mechanism for supplying a predetermined amount of liquid resin onto the sheet placed on the mounting surface; a holding part having a holding surface facing the mounting surface and holding a wafer; a vertical movement mechanism for moving the table mechanism and the holding part relative to each other in a direction perpendicular to the mounting surface and spreading the liquid resin onto the lower surface of the wafer held on the holding surface; a curing mechanism for curing the spread liquid resin by applying external stimuli; and a control unit, The table mechanism comprises a table having a mounting surface, a support column whose center coincides with the center of the table and supports the lower surface of the table, and a support base that supports the lower end of the support column. The vertical movement mechanism is positioned on the support base opposite the table, Between the support column and the support base, there are at least four first support parts arranged at equal angles with respect to the center of the support column. Protective member forming apparatus.

2. A protective member forming apparatus comprising: a table mechanism having a mounting surface for placing a sheet; a liquid resin supply mechanism for supplying a predetermined amount of liquid resin onto the sheet placed on the mounting surface; a holding part having a holding surface facing the mounting surface and for holding a wafer; a vertical movement mechanism for moving the table mechanism and the holding part relative to each other in a direction perpendicular to the mounting surface and spreading the liquid resin onto the lower surface of the wafer held on the holding part; a curing mechanism for curing the spread liquid resin by applying an external stimulus; and a control unit, The table mechanism comprises a table having a mounting surface, a support column whose center coincides with the center of the table and supports the lower surface of the table, and a support base that supports the lower end of the support column. The vertical movement mechanism is arranged at least three times at equal angles with respect to the center of the table, on the outer portion of the support base of the table. Between the support column and the support base, there are at least three second support parts arranged at equal angles with respect to the center of the support column, The second support is positioned between the two vertical movement mechanisms. Protective member forming apparatus.

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