Processing equipment

Abstract

To provide a processing device that detects a work-piece remaining in a pair of guide rails to prevent the work-piece from falling from the guide rails.SOLUTION: A processing device comprises a carry-out unit that carries out a work-piece from a storage cassette to a temporary placement region and a control unit. The temporary placement region is provided with a pair of guide rails on which the work-piece carried out from the storage cassette is placed, and a guide rail movement mechanism which is provided with a motor that moves the pair of guide rails in a direction in which the rails approach each other or in a direction in which the rails separate from each other, which positions the pair of guide rails at a position where the mechanism positions the work-piece at a centering position while holding the work-piece and at a position where the work-piece is released. The control unit comprises a load detecting part that detects a load acting on the motor, and a determining part that determines whether the work-piece exists on the pair of guide rails or not, on the basis of the load acting on the motor detected by the load detecting part when moving the guide rails.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a processing apparatus for processing a plate-shaped workpiece such as a semiconductor wafer.

Background Art

[0002] Device chips used in electronic devices such as mobile phones and computers are formed by grinding a wafer having a plurality of devices arranged side by side on the surface from the back side to thin it and then dividing the wafer for each device. Grinding of the workpiece is performed by a grinding apparatus equipped with a grinding wheel arranged in an annular shape. Further, for dividing a plate-shaped workpiece such as a wafer, for example, a cutting apparatus equipped with an annular cutting blade or a laser processing apparatus that irradiates a laser beam to the workpiece for laser processing is used.

[0003] Processing apparatuses such as a grinding apparatus, a cutting apparatus, and a laser processing apparatus include a chuck table (holding table) for holding a workpiece and a processing unit for processing the workpiece held by the chuck table. A storage cassette containing a plurality of workpieces is carried into the processing apparatus. The processing apparatus pulls out each workpiece from the storage cassette to a temporary placement area, conveys it to the chuck table, processes it with the processing unit, washes it with a washing unit, returns it to the temporary placement area, and stores it in the storage cassette. (See Patent Document 1 and Patent Document 2)

[0004] In the temporary placement area where the workpiece pulled out from the storage cassette is temporarily placed, a pair of guide rails parallel to the direction in which the workpiece is pulled out are provided. Each guide rail includes a support surface for supporting the workpiece and a abutting portion standing upright from the outside of the support surface. Each guide rail is movable in a direction approaching each other and a direction moving away from each other.

[0005] By placing the workpiece on the support surfaces of a pair of guide rails, bringing the two guide rails close together, and clamping the workpiece between the abutment points of the two guide rails, the workpiece can be positioned at a predetermined location (centering position). When the workpiece is then transported to the chuck table, it can be precisely positioned at a predetermined location on the holding surface of the chuck table. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 11-204461 [Patent Document 2] Japanese Patent Publication No. 2001-110756 [Overview of the project] [Problems that the invention aims to solve]

[0007] In machining equipment, operation may stop during the processing of a workpiece due to reasons such as machining errors or equipment malfunctions. In this case, the machining equipment is restarted after the cause of the stoppage is addressed by the user or manager of the machining equipment. At this time, an initial operation is performed to return the various mechanisms that were in operation to their initial state. In the initial operation of a pair of guide rails placed in a temporary positioning area, the guide rails move closer to each other and then further apart.

[0008] However, when the processing machine stops, the workpiece may be resting on the guide rails. In this case, during the initial operation when the processing machine restarts, the pair of guide rails may move away from each other, the distance between the two guide rails may exceed the width of the workpiece, and the workpiece may fall between the guide rails and be damaged. Furthermore, it may be necessary to remove the damaged workpiece. As a result, a significant loss that cannot be ignored may occur.

[0009] This invention has been made in view of the above problems, and its objective is to provide a processing device that can detect workpieces remaining on a pair of guide rails and prevent the workpieces from falling off the guide rails. [Means for solving the problem]

[0010] According to one aspect of the present invention, a processing apparatus comprising: a cassette table on which a storage cassette for storing a workpiece is placed; an unloading unit for unloading the workpiece from the storage cassette placed on the cassette table into a temporary storage area for temporarily placing the workpiece; a holding table having a holding surface for holding the workpiece; a processing unit for processing the workpiece held on the holding table; and a control unit, wherein the temporary storage area includes a pair of guide rails on which the workpiece unloaded from the storage cassette by the unloading unit is placed; and a direction that moves the pair of guide rails toward or toward each other. A processing apparatus is provided, comprising a motor for moving a workpiece, a guide rail moving mechanism for positioning a pair of guide rails at a position where the workpiece is clamped and positioned at a centering position, and a position where the workpiece is released, and a control unit connected to the guide rail moving mechanism, comprising a load detection unit for detecting the load applied to the motor, and a determination unit for determining whether or not the workpiece is present on the pair of guide rails based on the load applied to the motor detected by the load detection unit when the motor is operated and the guide rails are moved.

[0011] Preferably, the load detection unit detects the output torque of the motor as the load, and the determination unit performs the determination based on the output torque of the motor detected by the load detection unit. [Effects of the Invention]

[0012] A processing apparatus according to one aspect of the present invention comprises a guide rail moving mechanism equipped with a motor for moving a pair of guide rails, and a control unit. The load on the motor of the guide rail moving mechanism differs significantly depending on whether a workpiece is present on the guide rails or not. Therefore, the determination unit of the control unit can immediately determine whether or not a workpiece is present based on the load on the motor when the guide rail moving mechanism moves the guide rails.

[0013] For example, if a workpiece is present on the guide rail, the detection unit can determine that the workpiece is still there before the guide rail moves far enough for the workpiece to fall. In this case, the control unit can immediately stop the guide rail movement mechanism, thereby preventing the workpiece from falling off the guide rail.

[0014] Therefore, according to one aspect of the present invention, a processing apparatus is provided that can detect workpieces remaining on a pair of guide rails and prevent the workpieces from falling off the guide rails. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic perspective view of the processing equipment. [Figure 2] This is a schematic perspective view showing the storage cassette and the temporary storage area. [Figure 3] This is a schematic perspective view showing a pair of guide rails and a guide rail movement mechanism. [Figure 4] Figure 4(A) is a schematic cross-sectional view showing the workpiece and the guide rail positioned at the clamping position; Figure 4(B) is a schematic cross-sectional view showing the workpiece and the guide rail positioned at the transport position; and Figure 4(C) is a schematic cross-sectional view showing the workpiece and the guide rail positioned at the release position. [Figure 5] This is a schematic side view illustrating the guide rail movement mechanism. [Modes for carrying out the invention]

[0016] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, the workpiece to be processed in the processing apparatus according to this embodiment will be described. FIG. 1 includes a perspective view schematically showing the workpiece 1.

[0017] The workpiece 1 is, for example, a substantially disc-shaped substrate made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors, or a material such as sapphire, glass, quartz, etc.

[0018] The surface of the workpiece 1 is partitioned by a plurality of division planned lines (not shown) arranged in a grid pattern. Also, devices (not shown) such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in each region partitioned by the division planned lines on the surface of the workpiece 1. When the workpiece 1 is thinned using a processing apparatus and divided along the division planned lines, individual device chips are formed. However, the workpiece processed in the processing apparatus according to this embodiment is not limited to this.

[0019] Before the workpiece 1 is loaded into the processing apparatus, the workpiece 1, the tape 9, and the frame 7 are integrated to form the frame unit 11. The workpiece 1 is loaded into the processing apparatus in the state of the frame unit 11 and processed. The formed individual device chips are supported by the tape 9. Thereafter, the tape 9 is extended outward to widen the interval between the device chips, and the device chips are picked up.

[0020] The annular frame 7 is formed of a material such as metal, and has an opening 7a with a diameter larger than the diameter of the workpiece 1. When forming the frame unit 11, the workpiece 1 is positioned within the opening 7a of the frame 7 and accommodated in the opening 7a.

[0021] The tape 9 has a diameter larger than the opening 7a of the frame 7. The tape 9 is a tape called a dicing tape, for example, comprising a base material layer and an adhesive layer formed on the base material layer. The tape 9 is adhered to the back surface 1b of the frame 7 and the workpiece 1 by the adhesive force developed in the adhesive layer. Alternatively, instead of the tape 9, a resin sheet such as a polyolefin-based sheet or a polyester-based sheet without an adhesive layer may be used. The resin sheet is heat-pressed to the workpiece 1 and the frame 7.

[0022] The polyolefin-based sheet is a sheet of a polymer synthesized with an alkene as a monomer, for example, a polyethylene sheet, a polypropylene sheet, or a polystyrene sheet. The polyester-based sheet is a sheet of a polymer synthesized with a dicarboxylic acid (a compound having two carboxyl groups) and a diol (a compound having two hydroxyl groups) as monomers. For example, a polyethylene terephthalate sheet or a polyethylene naphthalate sheet.

[0023] However, the workpiece 1 processed by the processing apparatus according to the present embodiment does not need to be integrated with the tape 9 and the frame 7. That is, it is not necessary to form the frame unit 11. A protective tape for protecting one surface of the workpiece 1 may be adhered to the workpiece 1, or the protective tape may not be adhered. Hereinafter, the case where the workpiece 1 is carried into the processing apparatus in the state of the frame unit 11 and the processing apparatus processes the workpiece 1 included in the frame unit 11 will be described, but the processing apparatus according to the present embodiment is not limited thereto.

[0024] Next, a processing apparatus for processing the workpiece 1 will be described. When dividing the workpiece 1 along the planned division line, for example, a cutting apparatus equipped with an annular cutting blade is used. Alternatively, a laser processing apparatus is used that laser-processes the workpiece 1 by irradiating it with a laser beam along the planned division line. In addition, the workpiece 1 is thinned by grinding from the back side with a grinding apparatus. The processing apparatus described below will be based on the example of a cutting apparatus in this embodiment, but the processing apparatus in this embodiment is not limited to a cutting apparatus.

[0025] Figure 1 is a schematic perspective view of a cutting device (processing device) 2, which is an example of a processing device according to this embodiment. As shown in Figure 1, a cassette table 6 on which a storage cassette 13 is placed is provided at the corner of the base 4 of the cutting device 2. The cassette table 6 can be raised and lowered in the vertical direction (Z-axis direction) by a lifting mechanism (not shown). In Figure 1, the outline of the storage cassette 13 placed on the cassette table 6 is shown by a dashed line.

[0026] Here, a storage cassette 13 capable of accommodating multiple workpieces 1 (frame units 11) will be explained using Figure 2. Figure 2 schematically shows a perspective view of the storage cassette 13. The storage cassette 13 has a box-shaped housing 15. Inside the housing 15, the storage cassette 13 has a storage space 17 that is wider than the width of the workpieces 1 (frame units 11). The storage cassette 13 can accommodate multiple workpieces 1 arranged vertically (in the Z-axis direction) in the storage space 17.

[0027] The front of the housing 15 of the storage cassette 13 is provided with an opening 19 that opens the storage space 17 to the outside. The workpiece 1 is loaded into and out of the storage cassette 13 through the opening 19. Therefore, the width of the opening 19 is greater than the width of the workpiece 1 (frame unit 11). Multiple support grooves 21 are formed on the inner surfaces of a pair of side walls 15a adjacent to the opening 19 of the storage cassette 13 to support the ends of the workpiece 1 (frame 7).

[0028] Multiple support grooves 21 are formed at the same height on each of the pair of side walls 15a. On the inner surfaces of each pair of side walls 15a, the support grooves 21 that are adjacent to each other vertically are arranged at a constant interval 23. When the workpiece 1 is placed in the storage cassette 13, it is inserted into one of the support grooves 21 formed on one of the side walls 15a, and also into the support groove 21 on the other side wall 15a, which is formed at the same height as the support groove 21 on the first side wall 15a.

[0029] In other words, the workpiece 1 (frame unit 11) is housed in the storage space 17 of the storage cassette 13 with the frame 7 supported by a pair of corresponding support grooves 21 formed in each side wall 15a. The storage cassette 13 can accommodate as many workpieces 1 as there are pairs of support grooves 21 arranged vertically in each side wall 15a.

[0030] For example, each side wall 15a is provided with 25 support grooves 21 spaced 10 mm apart vertically 23. In this case, the storage cassette 13 can accommodate 25 workpieces 1. However, the storage cassette 13 does not necessarily have to be filled to its maximum capacity with workpieces 1, and some of the support grooves 21 do not need to have workpieces 1 on them.

[0031] The removal of the workpiece 1 (frame unit 11) from the storage cassette 13 is performed by the removal unit 12, which will be described later. When removing the workpiece 1 stored in the storage cassette 13, the cassette table 6 is raised or lowered so that the height of the workpiece 1 matches the height at which the removal unit 12 can perform the removal operation.

[0032] The area adjacent to the cassette table 6 on the upper surface of the base 4 of the cutting device (processing device) 2 is a temporary storage area 10 for temporarily placing the workpiece 1 (frame unit 11) that has been pulled out from the storage cassette 13 placed on the cassette table 6. Adjacent to the temporary storage area 10 is a transport unit 12 that transports the workpiece 1 (frame unit 11) from the storage cassette 13 to the temporary storage area 10.

[0033] Furthermore, the temporary placement area 10 is provided with a pair of guide rails 8 that move closer to and further apart from each other while maintaining a state parallel to the Y-axis direction (left-right direction, indexing feed direction). Figures 2 and 3 include schematic perspective views showing the guide rails 8.

[0034] Each pair of guide rails 8 has a support surface 8a that supports the workpiece 1 (frame 7) from below, and a stopper portion 8b that is generally perpendicular to the support surface 8a. The stopper portions 8b of each guide rail 8 are in contact with each other on the outside of the support surface 8a and face each other. The workpiece 1 that has been unloaded from the storage cassette 13 by the unloading unit 12 is temporarily placed on the pair of guide rails 8.

[0035] Next, the temporary storage area 10 will be described in more detail. Figure 3 is a schematic perspective view showing the internal structure of the temporary storage area 10 of the base 4 of the cutting device 2. The temporary storage area 10 is provided with a guide rail moving mechanism 54 equipped with a motor 56 that moves a pair of guide rails 8 toward or toward each other. The guide rail moving mechanism 54 positions the pair of guide rails 8 in a position that grips the workpiece 1 (frame unit 11) and positions the workpiece 1 in a centering position, a position suitable for transporting the workpiece 1, and a position where the workpiece 1 is released.

[0036] Figure 4(A) includes a schematic cross-sectional view showing the guide rail 8 positioned to center the workpiece 1. Figure 4(B) includes a schematic cross-sectional view showing the guide rail 8 positioned to a position suitable for transporting the workpiece 1. Figure 4(C) includes a schematic cross-sectional view showing the guide rail 8 positioned to release the workpiece 1.

[0037] However, in the cutting device 2, as shown in Figure 4(C), it is not assumed that the guide rail 8 will open wide when the workpiece 1 is in the temporary placement area 10. If the guide rail 8 opens to a position where the workpiece 1 is released when the workpiece 1 is in the temporary placement area 10, the workpiece 1 will fall from the guide rail 8, causing damage to the workpiece 1, and requiring the workpiece 1 to be removed.

[0038] The guide rail moving mechanism 54 will be described in more detail. Figure 3 includes a schematic perspective view of the guide rail moving mechanism 54. Figure 5 is a schematic side view of the guide rail moving mechanism. Figure 5 includes a schematic cross-sectional view of the guide rail 8. The guide rail moving mechanism 54 comprises a motor 56 having a rotating shaft 56b along the Z-axis direction, a pulley 56a provided at the tip of the rotating shaft 56b, and an annular belt 58 mounted around the pulley 56a.

[0039] The belt 58 is wrapped around a pulley 56a located on the rotation axis 56b of the motor 56 and a pulley 60a (see Figure 3) located on a free-rotating shaft 60 away from the motor 56. The free-rotating shaft 60 and the rotation axis 56b of the motor 56 are aligned along the X-axis. When the motor 56 is operated, the rotation axis 56b rotates, causing the belt 58 to rotate between the pulley 56a on the rotation axis 56b and the pulley 60a on the free-rotating shaft 60.

[0040] The belt 58 is connected to a fixing portion 64 provided at the bottom of one guide rail 8 and another fixing portion 64 provided at the bottom of the other guide rail 8. The two parts of the belt 58 that lie between the pulley 56a of the rotating shaft 56b and the pulley 60a of the free-rotating shaft 60 are designated as the first and second parts. In this case, the fixing portion 64 of one guide rail 8 is fixed to the first part of the belt 58, and the fixing portion 64 of the other guide rail 8 is fixed to the second part of the belt 58.

[0041] In this state, when the belt 58 is rotated by the motor 56, the two guide rails 8 move simultaneously by the same distance in opposite directions. That is, the two guide rails 8 move either toward each other or toward each other.

[0042] The guide rail moving mechanism 54 may have a motor driver 62 that has the function of controlling the motor 56 to rotate it by a predetermined amount at a predetermined speed. The motor driver 62 is composed of, for example, an IC. The motor driver 62 controls the motor 56 by adjusting the power supplied to the motor 56 from the power source. Alternatively, the control unit 50 (see Figure 1) of the cutting device 2, described later, may function as a motor driver that controls the motor 56.

[0043] An opening 14 is formed on the upper surface of the base 4, which traverses the temporary storage area 10 along the Y-axis. Inside the opening 14, a moving mechanism (not shown) is provided for moving the unloading unit 12 along the Y-axis. The unloading unit 12 includes a movable body 16 connected to the moving mechanism. Figure 3 includes a schematic perspective view of the unloading unit 12. An opening 18 is provided on the side of the movable body 16 facing the cassette table 6, and a gripping part 20 for gripping the workpiece 1 (frame 7 of the frame unit 11) is disposed in the opening 18.

[0044] The gripping portion 20 comprises an upper plate 22 and a lower plate 24, both of which have their base ends housed in the movable body 16 through an opening 18. The upper plate 22 and the lower plate 24 are moved closer to or further apart from each other by a moving mechanism (not shown) provided inside the movable body 16.

[0045] When the workpiece 1 (frame unit 11) stored in the storage cassette 13 is unloaded by the unloading unit 12, the moving body 16 is moved toward the storage cassette 13, and the workpiece 1 (frame 7) is positioned between the upper plate 22 and the lower plate 24. Then, the upper plate 22 and the lower plate 24 are moved toward each other, and the workpiece 1 (frame 7) is sandwiched between the upper plate 22 and the lower plate 24. At this point, the workpiece 1 (frame 7) is gripped by the gripping part 20 of the unloading unit 12.

[0046] Subsequently, when the movable body 16 is moved away from the storage cassette 13, the workpiece 1 (frame unit 11) is pulled out of the storage cassette 13 to the temporary storage area 10. Then, the gripping part 20 releases its grip on the workpiece 1 (frame 7). At this time, the workpiece 1 (frame 7) is supported on the respective support surfaces 8a of the pair of guide rails 8.

[0047] Then, by moving the pair of guide rails 8 in a direction that brings them closer together in the X-axis direction, the workpiece 1 (frame 7) is clamped between the abutment portions 8b of the pair of guide rails 8, thereby positioning the workpiece 1 (frame unit 11) in the centering position. Figure 4(A) is a schematic cross-sectional view showing the workpiece 1 positioned in the centering position and the pair of guide rails 8.

[0048] When the workpiece 1, positioned at the centering position, is transported by the first transport unit 34 (described later) in a predetermined transport operation, the workpiece 1 is precisely positioned at a predetermined location at the transport destination. When the workpiece 1 is transported from the temporary storage area 10, the pair of guide rails 8 are moved away from each other. Figure 4(B) is a schematic cross-sectional view showing the workpiece 1 and the pair of guide rails 8 when being transported from the temporary storage area 10.

[0049] Let's continue the explanation of the cutting apparatus 2, referring again to Figure 1. An elongated opening 4a is formed on the upper surface of the base 4 adjacent to the cassette table 6, in the X-axis direction (front-to-back direction, machining feed direction). Inside the opening 4a are a ball screw type X-axis movement mechanism (machining feed unit), which is not shown, and a bellows-shaped dustproof and dripproof cover 28 that covers the top of the X-axis movement mechanism.

[0050] The X-axis movement mechanism is connected to the lower part of the X-axis movement table 30 and has the function of moving the X-axis movement table 30 in the X-axis direction. For example, the X-axis movement table 30 moves between the loading / unloading area adjacent to the cassette table 6 and the machining position below the cutting unit 40, which will be described later.

[0051] A chuck table (holding table) 32 for attracting and holding the workpiece 1 (frame unit 11) is provided on the X-axis moving table 30. The chuck table 32 is connected to a rotational drive source (not shown), such as a motor, and rotates around a rotation axis that is roughly parallel to the Z-axis direction (vertical direction, cutting feed direction). The chuck table 32 also moves in the X-axis direction by the X-axis moving mechanism described above.

[0052] The upper surface of the chuck table 32 is a holding surface 32a for holding the workpiece 1 (frame unit 11). The holding surface 32a is connected to a suction source (not shown) via a suction passage (not shown) formed inside the chuck table 32. In addition, clamps 32b are provided around the chuck table 32 for fixing the frame 7 included in the frame unit 11 from the outside.

[0053] The transport of the workpiece 1 (frame unit 11) from the temporary storage area 10 to the chuck table 32 is performed by a first transport unit 34 located adjacent to the temporary storage area 10 and the opening 4a on the upper surface of the base 4. The first transport unit 34 has a shaft portion that is vertically movable and rotatable and protrudes upward from the upper surface of the base 4, an arm portion that extends horizontally from the upper end of the shaft portion, and a holding portion provided below the tip of the arm portion.

[0054] When the first transport unit 34 transports the workpiece 1 (frame unit 11) from the temporary storage area 10 to the chuck table 32, the X-axis moving table 30 is moved to position the chuck table 32 in the loading / unloading area. Then, the workpiece 1 (frame 7) that is temporarily placed in the temporary storage area 10 is held by the holding part, the workpiece 1 is lifted, and the shaft part is rotated to move the workpiece 1 above the chuck table 32.

[0055] Next, the workpiece 1 (frame unit 11) is lowered and placed on the holding surface 32a of the chuck table 32. Then, the frame 7 is fixed with the clamp 32b, and the suction source of the chuck table 32 is activated to suck up the tape 9. As a result, the workpiece 1 is held in place by suction via the tape 9.

[0056] The cutting apparatus 2 includes a support structure 36 positioned above the movement path of the X-axis moving table 30 from the loading / unloading area to the machining area, so as to cross the opening 4a. The support structure 36 is equipped with an imaging unit 38 facing downward. The imaging unit 38 images the surface 1a of the workpiece 1, which is held by suction on the chuck table 32 that moves to the machining area below the cutting unit 40, and detects the position and orientation of the division lines provided on the surface 1a.

[0057] The machining area is provided with a cutting unit (machining unit) 40 for cutting (machining) the workpiece 1 of the frame unit 11 held by the chuck table (holding table) 32. The cutting unit 40 comprises a cutting blade (machining tool) 42 having an annular grinding wheel portion on its outer circumference, and a spindle 44 with the cutting blade 42 mounted at its tip and aligned with the Y-axis direction which serves as the rotation axis of the cutting blade 42.

[0058] A rotational drive source (not shown), such as a motor, is connected to the base end of the spindle 44. The workpiece 1 held in the chuck table 32 can be cut (processed) by having the rotating cutting blade 42 cut into it. When the workpiece 1 is cut along all the planned division lines, individual device chips are formed. After that, the chuck table 32 is moved to the loading / unloading area by the X-axis movement mechanism.

[0059] An opening 4b is formed adjacent to the temporary placement area 10 and opening 4a on the upper surface of the base 4, and a cleaning unit 46 for cleaning the workpiece 1 after processing is housed in the opening 4b. The cleaning unit 46 is equipped with a spinner table for holding the workpiece 1 (frame unit 11). A rotational drive source (not shown) for rotating the spinner table at a predetermined speed is connected to the lower part of the spinner table.

[0060] The cutting apparatus 2 includes a second transport unit 48 that transports the frame unit 11 from the chuck table 32 located in the loading / unloading area to the cleaning unit 46. The second transport unit 48 has an arm that is movable along the Y-axis and a holding part provided below the tip of the arm.

[0061] When the second transport unit 48 transports the workpiece 1 (frame unit 11) from the chuck table 32 to the washing unit 46, the workpiece 1 (frame unit 11) is first held by the holding part. Then, the arm is moved along the Y-axis to place the workpiece 1 (frame unit 11) on the spinner table of the washing unit 46. After that, the workpiece 1 (frame unit 11) is held by the spinner table and washed.

[0062] When cleaning the workpiece 1 with the cleaning unit 46, a cleaning fluid (typically a mixed fluid of water and air) is sprayed onto the surface 1a of the workpiece 1 while rotating the spinner table. The workpiece 1, after being cleaned by the cleaning unit 46, is then placed in a storage cassette 13 on the cassette table 6.

[0063] When storing the workpiece 1 in the storage cassette 13, the workpiece 1 (frame unit 11) is transported from the washing unit 46 to the temporary storage area 10 using the first transport unit 34. Then, the movable body 16 of the unloading unit 12 is moved toward the storage cassette 13 to push the workpiece 1 (frame unit 11) into the storage cassette 13. At this time, in order to ensure that the storage operation is carried out reliably, the pair of guide rails 8 may be brought close to each other when the workpiece 1 (frame unit 11) is placed in the temporary storage area 10 to position the workpiece 1 (frame unit 11) in a centering position.

[0064] The cutting apparatus 2 further includes a control unit 50 that controls each component of the cutting apparatus 2. The control unit 50 controls, for example, the cassette table 6, the unloading unit 12, the temporary storage area 10, the X-axis movement mechanism, the chuck table 32, the imaging unit 38, the cutting unit 40, the cleaning unit 46, and the transport units 34, 48.

[0065] The control unit 50 is composed of a computer that includes, for example, a processing unit such as a CPU (Central Processing Unit), a main memory such as DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as flash memory. The functions of the control unit 50 are realized by operating the processing unit and other devices according to the software stored in the auxiliary storage device.

[0066] The control unit 50 of the cutting apparatus (processing apparatus) 2 according to this embodiment includes a storage unit 50a that stores various types of information. The storage unit 50a stores programs and control conditions for controlling each component, and the control unit 50 controls each component according to the programs and control conditions.

[0067] For example, the memory unit 50a has pre-entered and registered processing conditions for processing the workpiece 1, and the control unit 50 controls the cutting unit (processing unit) 40, etc., according to the processing conditions. The processing conditions are set appropriately according to the type of workpiece 1 and the desired processing result. The control unit 50 then controls each component while referring to the information sent from each component to proceed with cutting (processing) the workpiece 1 in a predetermined procedure. However, the memory unit 50a may also store other information. The configuration and functions of the control unit 50 will be described in detail later.

[0068] The cutting device 2 is equipped with a touch panel display 52. ​​The touch panel display 52 displays various information and operation screens. The operator can input various commands to the cutting device (processing device) 2 by touching a predetermined position on the touch panel display 52 that displays the screen. In other words, the touch panel display 52 functions as an input unit (input interface) used for inputting various commands, and also functions as a notification unit that notifies various information.

[0069] In the cutting apparatus 2 described above, the workpiece 1 stored in the storage cassette 13 is successively unloaded and processed. More specifically, the workpiece 1 (frame unit 11) is unloaded from the storage cassette 13 to the temporary storage area 10 and positioned at the center by the guide rail 8. Next, the workpiece 1 is held by suction on the chuck table (holding table) 32 and processed by the cutting unit (processing unit) 40. After that, the workpiece 1 is cleaned by the cleaning unit 46, returned to the temporary storage area 10, and then stored again in the storage cassette 13.

[0070] Furthermore, the cutting device (processing device) 2 may stop operating during the processing of the workpiece 1 due to processing errors, device malfunctions, or other reasons. In this case, the cutting device 2 will restart after the cause of the stoppage is addressed by the user or manager of the cutting device 2. At this time, an initial operation is performed to return the various mechanisms that were in operation to their initial state. In the initial operation of the pair of guide rails 8 provided in the temporary placement area 10, the guide rails 8 move closer to each other and then further apart.

[0071] However, when the cutting device (processing device) 2 stops, the workpiece 1 may be resting on the guide rail 8. In this case, during the initial operation when the cutting device 2 restarts, the guide rail 8 moves to a position that releases the workpiece 1, as shown in Figure 4(C), causing the workpiece 1 to fall between the guide rails 8 and be damaged. In this case, it may be necessary to remove the damaged workpiece 1. This can result in significant losses that cannot be ignored.

[0072] Therefore, in the processing apparatus according to this embodiment, the workpiece 1 remaining on the pair of guide rails 8 is detected, and the workpiece 1 is prevented from falling from the guide rails 8. The following description of the processing apparatus according to this embodiment will focus on the configuration for detecting the workpiece 1 remaining on the guide rails 8.

[0073] The detection of workpieces 1 remaining on the guide rail 8 is primarily achieved by the functions of the control unit 50. Specifically, the presence or absence of workpieces 1 on the guide rail 8 is detected based on the load applied to the motor 56 when the motor 56 of the guide rail moving mechanism 54 is operated. The control unit 50 is connected to the guide rail moving mechanism 54 along with other components of the cutting device (processing device) 2.

[0074] The control unit 50 is equipped with a load detection unit 50c that detects the load applied to the motor 56 of the guide rail moving mechanism 54. The motor driver 62 of the guide rail moving mechanism 54 transmits the load current value when operating the motor 56 to move the guide rail 8 at a predetermined speed to the load detection unit 50c of the control unit 50.

[0075] Alternatively, the motor driver 62 calculates the output torque of the motor 56 from the load current value and transmits this output torque, along with the load on the motor 56, to the load detection unit 50c of the control unit 50. Alternatively, the motor driver 62 calculates the ratio of the output torque of the motor 56 to the rated torque and transmits this calculated ratio, along with the load, to the load detection unit 50c of the control unit 50. Note that the load of the motor 56 transmitted by the guide rail moving mechanism 54 to the control unit 50 is not limited to these and is not particularly restricted.

[0076] Furthermore, the load detection unit 50c of the control unit 50 detects the load on the motor 56. For example, the load detection unit 50c detects the load current value of the motor 56 transmitted from the motor driver 62 as the load on the motor 56. Alternatively, the load detection unit 50c calculates the output torque of the motor 56 from the load current value of the motor 56 transmitted from the motor driver 62. Alternatively, the load detection unit 50c calculates the ratio of the output torque of the motor 56 to the rated torque.

[0077] Furthermore, the load detection unit 50c may detect the load of the motor 56 from the output torque of the motor 56 calculated by the motor driver 62. Alternatively, the load detection unit 50c may detect the load of the motor 56 from the ratio of the output torque of the motor 56 to the rated torque calculated and transmitted by the motor driver 62. The load of the motor 56 detected by the load detection unit 50c is not limited to these, and there are no particular restrictions.

[0078] The control unit 50 further includes a determination unit 50b that determines whether or not a workpiece 1 is present on the pair of guide rails 8 based on the load on the motor 56 detected by the load detection unit 50c when the motor 56 is operated to move the guide rails 8. Here, it will be explained that the determination unit 50b can utilize the load on the motor 56 when performing its determination.

[0079] When a workpiece 1 (frame unit 11) is present on the guide rail 8, the weight of the workpiece 1 is applied to the guide rail 8. Therefore, when the motor 56 is operated to move the guide rail 8 at a certain speed, a significantly larger load is placed on the motor 56 compared to when there is no workpiece 1 on the guide rail 8. On the other hand, when there is no workpiece 1 on the guide rail 8, no such large load is placed on the motor 56 that moves the guide rail 8.

[0080] Therefore, based on the load of the motor 56 detected when the motor 56 is operated to move the guide rail 8, it becomes possible to determine whether or not a workpiece 1 is present on the guide rail 8.

[0081] Next, the determination procedure performed by the determination unit 50b will be described. The determination unit 50b compares, for example, the load applied to the motor 56 detected by the load detection unit 50c with a predetermined threshold. If the load applied to the motor 56 exceeds the predetermined threshold, it determines that the workpiece 1 is present on the guide rail 8. On the other hand, if the load applied to the motor 56 does not exceed the predetermined threshold, it determines that the workpiece 1 is not present on the guide rail 8.

[0082] The memory unit 50a stores the conditions for the determination performed by the determination unit 50b. More specifically, the memory unit 50a stores the load of the motor 56, which serves as the criterion for determining whether or not a workpiece 1 is present on the guide rail 8, as a predetermined threshold value. The determination unit 50b performs the determination by referring to the predetermined threshold value previously registered in the memory unit 50a.

[0083] For example, when the load detection unit 50c detects the output torque of the motor 56 as the load applied to the motor 56, the determination unit 50b performs a determination based on the output torque of the motor 56 detected by the load detection unit 50c. In this case, the output torque that will serve as the threshold for the determination is pre-registered as a predetermined threshold in the storage unit 50a.

[0084] The determination by the determination unit 50b regarding whether or not a workpiece 1 is present on the guide rail 8 is performed and completed immediately after the motor 56 starts operating. Therefore, for example, if a workpiece 1 is present on the guide rail 8, even if the motor 56 starts operating and the guide rails 8 begin to move away from each other, the determination is completed before the guide rails 8 reach the position where the workpiece 1 is released, as shown in Figure 4(C).

[0085] Then, if the determination unit 50b determines that the workpiece 1 is on the guide rail 8, the control unit 50 controls the guide rail movement mechanism 54 to immediately stop the motor 56. In this case, as shown in Figure 4(C), the guide rail 8 stops before the workpiece 1 moves to the release position, thus preventing the workpiece 1 from falling off the guide rail 8.

[0086] Furthermore, the control unit 50 may have a notification control unit 50d that controls the notification unit to notify the user of the cutting device (processing device) 2, etc., when the determination unit 50b determines that a workpiece 1 is present on the guide rail 8. If the cutting device 2 has a touch panel display 52 that can function as a notification unit, the notification control unit 50d will display a warning screen on the touch panel display 52 that warns that a workpiece 1 remains on the guide rail 8.

[0087] However, the notification unit controlled by the notification control unit 50d is not limited to this. For example, if the cutting device (processing device) 2 is equipped with an alarm lamp capable of emitting multiple colors of light as a notification unit, the notification control unit 50d controls the alarm lamp. When the determination unit 50b determines that a workpiece 1 is present on the guide rail 8, the notification control unit 50d controls this alarm lamp to illuminate a lamp that emits red light to indicate a warning.

[0088] Furthermore, if the cutting device 2 is equipped with a buzzer capable of generating an alarm sound as a notification unit, the notification control unit 50d controls the buzzer. When the determination unit 50b determines that the workpiece 1 is on the guide rail 8, the notification control unit 50d controls this buzzer to generate an alarm sound.

[0089] On the other hand, the control unit 50 does not stop the motor 56 if the determination unit 50b determines that there is no workpiece 1 on the guide rail 8. For example, if the cutting device (processing device) 2 stops operating while processing the workpiece 1 and initial operations are being performed to restart it, the motor 56 does not stop and the movement of the guide rail 8 continues and the initial operations continue. In this case, the notification control unit 50d does not need to notify the notification unit of any particular information, and may notify the notification unit that the cutting device 2 is operating normally.

[0090] As described above, in the processing apparatus according to this embodiment, the determination unit 50b of the control unit 50 can determine whether or not a workpiece 1 is present on the guide rail 8 based on the load applied to the motor 56 when the guide rail moving mechanism 54 moves the guide rail 8. If a workpiece 1 is present on the guide rail 8, the determination unit 50b determines that a workpiece 1 is present. In this case, the control unit 50 can immediately stop the guide rail moving mechanism 54, thereby preventing the workpiece 1 from falling off the guide rail 8.

[0091] It should be noted that the present invention is not limited to the embodiments described above and can be implemented with various modifications. For example, although the above embodiments described a cutting device 2 as an example, the processing device according to one aspect of the present invention is not limited to this. The processing device according to one aspect of the present invention may be a laser processing device that laser processes a workpiece 1, a grinding device that grinds a workpiece 1 with a grinding wheel, or a polishing device that polishes a workpiece 1.

[0092] Furthermore, in the above embodiment, it was determined whether or not the workpiece 1 remained on the guide rail 8 during the initial operation when the processing device was restarted after it had stopped working. However, the determination may be made at other times. For example, in the normal operation of processing the workpieces 1 stored in the storage cassette 13 one after another, the determination may be made at a time when the workpiece 1 is not present on the guide rail 8.

[0093] In addition to the initial operation during restart, there are other times when it is problematic if the workpiece 1 remains on the guide rail 8. In one aspect of the present invention, a determination based on the load of the motor 56 may be made at a time during normal operation when it is problematic if the workpiece 1 remains on the guide rail 8. In other words, there are no limitations on the timing of the determination in the processing apparatus according to one aspect of the present invention.

[0094] Furthermore, in a processing apparatus according to one aspect of the present invention, a determination unit 50b may be used to confirm that the workpiece 1 remains on the guide rail 8. For example, when transporting the workpiece 1 from the temporary storage area 10 to the chuck table (holding table) 32, or when storing the workpiece 1 that has been returned to the temporary storage area 10 in the storage cassette 13, it may be confirmed that the workpiece 1 is present in the temporary storage area 10.

[0095] The motor 56 is activated at the timing when the workpiece 1 should be on the guide rail 8. Based on the load, it is confirmed that the workpiece 1 is on the guide rail 8, and it is confirmed that there is no problem with the processing device continuing its normal operation.

[0096] On the other hand, if it is confirmed that the workpiece 1 is not present on the guide rail 8 at such a time, it is possible that the workpiece 1 was not transported as planned and is stuck at some point in the processing equipment. In this case, immediately stopping the operation of the processing equipment may prevent damage to the workpiece 1 or the processing equipment.

[0097] Furthermore, the structures, methods, etc., of the embodiments and modifications described above can be modified as appropriate, as long as they do not deviate from the scope of the present invention. [Explanation of symbols]

[0098] 1 Workpiece 1a surface 1b back side 7 frames 7a aperture 9 tapes 11 Frame Unit 13 Cassettes 15 cabinets 15a side wall 17 Containment space 19 Aperture 21 Support groove 23 intervals 2 Cutting equipment (processing equipment) 4 bases 4a,4b opening 6 Cassette Table 8 Guide rails 8a Support surface 8b Butt section 10 Temporary placement area 12 unloading units 14 Aperture 16 Mobile Unit 18 Aperture 20 Gripping part 22 Top plate 24 Lower plate 28 Dustproof and splashproof cover 30 X-axis moving table 32 Chuck table (holding table) 32a Holding surface 32b Clamp 34,48 Transport Units 36 Support structure 38 imaging units 40 Cutting Units (Processing Units) 42 Cutting Blades 44 spindles 46 Washing Unit 50 control units 50a storage section 50b Judgment part 50c load detection unit 50d Notification Control Unit 52 Touchscreen Display 54 Guide rail moving mechanism 56 Motor 56b Rotation axis 56a, 60a pulley 58 belts 60 Free rotation axis 62 Motor Drivers 64 Fixed part

Claims

1. A processing apparatus comprising: a cassette table on which a storage cassette for containing a workpiece is placed; an unloading unit for unloading the workpiece from the storage cassette placed on the cassette table into a temporary storage area for temporarily placing the workpiece; a holding table having a holding surface for holding the workpiece; a processing unit for processing the workpiece held on the holding table; and a control unit, In the temporary placement area, A pair of guide rails on which the workpiece discharged from the storage cassette by the discharge unit is placed, A motor is provided to move a pair of guide rails toward or toward each other, and a guide rail moving mechanism is provided to position the pair of guide rails in a position where the workpiece is clamped and positioned in a centering position, and in a position where the workpiece is released. The control unit is, It is connected to the guide rail moving mechanism, A load detection unit for detecting the load applied to the motor, The system includes a determination unit that determines whether or not a workpiece is present on a pair of guide rails based on the load applied to the motor detected by the load detection unit when the motor is operated to move the guide rails. A processing apparatus characterized by the following features.

2. The load detection unit detects the output torque of the motor as the load, The processing apparatus according to claim 1, characterized in that the determination unit performs the determination based on the output torque of the motor detected by the load detection unit.

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