Capacitor

Abstract

A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a drawing-out terminal 20A (21A) electrically connected to the external electrode 12a (12b); an outer case 30 having accommodated therein the capacitor element 10 such that the drawing-out terminal 20A (21A) is projecting outward; and a filling resin 40 that fills inside the outer case 30 so as to embed the capacitor element 10. The drawing-out terminal 20A (21A) has a first drawing-out terminal 20Aa (21Aa) and a second drawing-out terminal 20Ab (21Ab) that is electrically connected to the external electrode 12a (12b) via the first drawing-out terminal 20Aa (21Aa). The first drawing-out terminal 20Aa (21Aa) and the second drawing-out terminal 20Ab (21Ab) are locked so as to be in surface contact with each other.

Description

Technical Field

[0001] The present invention relates to a capacitor.

Background Art

[0002] In Patent Document 1, a capacitor element (10) having an electrode portion (10a) on an end face is connected by a bus bar (20), housed in a case (50), filled with resin (60), and external connection terminals (32) (42) are drawn out in a direction substantially orthogonal to the case opening (53). The capacitor further includes a terminal block (70). The terminal block (70) does not contact the case (50), one side is embedded in the resin (60), and a screw portion (73a) provided on the other side faces the mounting holes (32b) (42b) of the external connection terminals (32) (42). A capacitor is disclosed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the capacitor described in Patent Document 1, it is said that a CP wire connected to the electrode portion of the capacitor element and the bus bar are connected by solder. However, in the capacitor described in Patent Document 1, even when trying to connect the CP wire and the bus bar by solder, the heat during soldering easily escapes to the outside through the bus bar, so the temperature of the solder easily drops. Therefore, in the capacitor described in Patent Document 1, it is difficult to connect the CP wire and the bus bar by solder.

[0005] In contrast, in the capacitor described in Patent Document 1, it is conceivable to weld the CP wire and the busbar together rather than solder them. However, even if one attempts to weld the CP wire and the busbar together in the capacitor described in Patent Document 1, sufficient surface contact cannot be achieved due to the structure described in Figure 1 of Patent Document 1, variations in the size of the capacitor elements, etc. Therefore, welding the CP wire and the busbar together is difficult in the capacitor described in Patent Document 1.

[0006] As described above, in conventional capacitors, when a structure is used in which multiple lead terminals (CP line and busbar in the capacitor described in Patent Document 1) are connected to bring the electrode portion of the capacitor element to the outside, there is room for improvement in improving the connectivity between the lead terminals (between the CP line and busbar in the capacitor described in Patent Document 1) without using joining materials such as solder.

[0007] The present invention was made to solve the above problems and aims to provide a capacitor that can improve connectivity between lead terminals without using joining materials such as solder. [Means for solving the problem]

[0008] The capacitor of the present invention comprises a capacitor element having a base body and an external electrode provided on the end face of the base body; a lead terminal electrically connected to the external electrode; an outer case in which the capacitor element is housed such that the lead terminal protrudes outward; and a filling resin filled inside the outer case so as to embed the capacitor element, wherein the lead terminal has a first lead terminal and a second lead terminal electrically connected to the external electrode via the first lead terminal, and the first lead terminal and the second lead terminal are locked together so as to be in surface contact. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a capacitor that can improve connectivity between lead terminals without using joining materials such as solder. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a schematic perspective view showing an example of a capacitor according to Embodiment 1 of the present invention. [Figure 2] Figure 2 is a schematic perspective view showing an example of a disassembled capacitor (excluding the filling resin) as shown in Figure 1. [Figure 3] Figure 3 is a schematic perspective view showing an example of the capacitor element shown in Figures 1 and 2. [Figure 4] Figure 4 is a schematic cross-sectional view showing an example of a cross-section along the line segment a1-a2 of the capacitor element shown in Figure 3. [Figure 5] Figure 5 is a schematic perspective view showing the state before the first and second lead terminals shown in Figure 2 are locked. [Figure 6] Figure 6 is a schematic perspective view showing the state after the first and second lead terminals shown in Figure 5 have been locked. [Figure 7] Figure 7 is a schematic perspective view showing an example of a capacitor according to Embodiment 2 of the present invention. [Figure 8] Figure 8 is a schematic perspective view showing an example of a disassembled capacitor (excluding the filling resin) as shown in Figure 7. [Figure 9] Figure 9 is a schematic perspective view showing the state before the first and second lead terminals shown in Figure 8 are locked. [Figure 10] Figure 10 is a schematic perspective view showing the state in which the first and second lead terminals shown in Figure 9 are being locked. [Figure 11] Figure 11 is a schematic perspective view showing the state after the first and second lead terminals shown in Figure 10 have been locked. [Modes for carrying out the invention]

[0011] The capacitor of the present invention will be described below. Note that the present invention is not limited to the following configurations and may be appropriately modified without departing from the gist of the present invention. Also, combinations of a plurality of the individual preferred configurations described below are also within the scope of the present invention.

[0012] Each of the embodiments shown below is illustrative, and it is needless to say that partial substitution or combination of the configurations shown in different embodiments is possible. In the following embodiments starting from Embodiment 2, descriptions of matters common to Embodiment 1 will be omitted, and different points will be mainly described. In particular, the same operational effects due to the same configurations will not be sequentially mentioned for each embodiment.

[0013] In the following description, when not particularly distinguishing each embodiment, it is simply referred to as "the capacitor of the present invention".

[0014] Below, as an example of the capacitor of the present invention, a film capacitor is shown. The capacitor of the present invention is also applicable to capacitors other than film capacitors.

[0015] The drawings shown below are schematic diagrams, and their dimensions, scales of aspect ratios, etc. may differ from those of actual products.

[0016] In this specification, terms indicating the relationship between elements (e.g., "parallel", "orthogonal", etc.) and terms indicating the shape of elements do not only mean a strictly literal aspect but also mean a substantially equivalent range, for example, a range including a difference of about a few percent.

[0017] The capacitor of the present invention includes a capacitor element having a dielectric body and an external electrode provided on an end surface of the dielectric body, a lead-out terminal electrically connected to the external electrode, an exterior case in which the capacitor element is housed such that the lead-out terminal protrudes outward, and a filling resin filled inside the exterior case so as to embed the capacitor element. The lead-out terminal has a first lead-out terminal and a second lead-out terminal electrically connected to the external electrode via the first lead-out terminal, and the first lead-out terminal and the second lead-out terminal are locked so as to be in surface contact with each other.

[0018] [Embodiment 1] In the capacitor according to Embodiment 1 of the present invention, one of the first lead-out terminal and the second lead-out terminal has a first claw-shaped portion and a second claw-shaped portion located at a height different from that of the first claw-shaped portion in a first direction, and the other of the first lead-out terminal and the second lead-out terminal is sandwiched between the first claw-shaped portion and the second claw-shaped portion in the first direction.

[0019] FIG. 1 is a perspective schematic view showing an example of the capacitor according to Embodiment 1 of the present invention. FIG. 2 is a perspective schematic view showing an example of a state in which the capacitor shown in FIG. 1 (excluding the filling resin) is disassembled.

[0020] The capacitor 1A shown in FIGS. 1 and 2 has a capacitor element 10 (see FIG. 3 described later), a lead-out terminal 20A, a lead-out terminal 21A, an exterior case 30, and a filling resin 40.

[0021] In FIGS. 1 and the like, a first direction D1, a second direction D2, and a third direction D3 are orthogonal to each other.

[0022] FIG. 3 is a perspective schematic view showing an example of the capacitor element shown in FIGS. 1 and 2. FIG. 4 is a cross-sectional schematic view showing an example of a cross section along a line segment a1-a2 of the capacitor element shown in FIG. 3.

[0023] The capacitor element 10 shown in FIGS. 3 and 4 has a dielectric body 11, a first external electrode 12a, and a second external electrode 12b.

[0024] The base body 11 is a wound body formed by winding a first metallized film 13a and a second metallized film 13b in a state where they are stacked in a first direction D1. In other words, the capacitor 1A, or more specifically, the capacitor element 10, is a wound-type film capacitor in which metallized films are wound in a state where they are stacked.

[0025] Furthermore, the capacitor 1A, or more specifically, the capacitor element 10, may be a multilayer film capacitor in which metallized films are stacked.

[0026] In the capacitor element 10, from the viewpoint of reducing the height, it is preferable that the cross-sectional shape of the element 11 is flattened when viewed in a cross-section perpendicular to the winding axis direction (third direction D3 in Figure 3). More specifically, it is preferable that the cross-sectional shape of the element 11 is pressed into a flattened shape such as an ellipse or oblong, and that the thickness is smaller than when the cross-sectional shape of the element 11 is a perfect circle.

[0027] Whether the base material was pressed to have a flattened cross-sectional shape can be confirmed, for example, by checking for the presence of press marks on the base material.

[0028] The capacitor element 10 may have a cylindrical winding shaft. The winding shaft is positioned on the central axis of the first metallized film 13a and the second metallized film 13b in the wound state, and serves as the winding shaft when winding the first metallized film 13a and the second metallized film 13b.

[0029] The first metallized film 13a comprises a first dielectric film 14a and a first metal layer 15a.

[0030] The first dielectric film 14a has a first main surface 14aa and a second main surface 14ab that are opposite to the first direction D1.

[0031] The first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a. More specifically, the first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a such that, in the third direction D3, it reaches one side edge of the first dielectric film 14a but does not reach the other side edge of the first dielectric film 14a.

[0032] The second metallized film 13b comprises a second dielectric film 14b and a second metal layer 15b.

[0033] The second dielectric film 14b has a first main surface 14ba and a second main surface 14bb that are opposite to the first direction D1.

[0034] The second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b. More specifically, the second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b such that, in the third direction D3, it does not reach one side edge of the second dielectric film 14b but reaches the other side edge of the second dielectric film 14b.

[0035] In the base body 11, the adjacent first metallized film 13a and second metallized film 13b are shifted in the third direction D3 such that the end of the first metal layer 15a that reaches the side edge of the first dielectric film 14a is exposed on one end face of the base body 11, and the end of the second metal layer 15b that reaches the side edge of the second dielectric film 14b is exposed on the other end face of the base body 11. In other words, in the adjacent first metallized film 13a and second metallized film 13b, the first metallized film 13a protrudes toward the first external electrode 12a side relative to the second metallized film 13b. Also, in the adjacent first metallized film 13a and second metallized film 13b, the second metallized film 13b protrudes toward the second external electrode 12b side relative to the first metallized film 13a. In this state, the first metal layer 15a is connected to the first external electrode 12a and not connected to the second external electrode 12b. Furthermore, the second metal layer 15b is connected to the second external electrode 12b, but not to the first external electrode 12a.

[0036] In the base body 11, as described above, the adjacent first metallized film 13a and second metallized film 13b are shifted in the third direction D3. Therefore, in the adjacent first dielectric film 14a and second dielectric film 14b, the first dielectric film 14a, on which the first metal layer 15a is provided on the first main surface 14aa, protrudes toward the first external electrode 12a side relative to the second dielectric film 14b, on which the first metal layer 15a is not provided on the main surface. Also, in the adjacent first dielectric film 14a and second dielectric film 14b, the second dielectric film 14b, on which the second metal layer 15b is provided on the first main surface 14ba, protrudes toward the second external electrode 12b side relative to the first dielectric film 14a, on which the second metal layer 15b is not provided on the main surface.

[0037] Since the base body 11 is formed by winding the first metallized film 13a and the second metallized film 13b in a state where they are stacked in a first direction D1, it can be said that it contains the first dielectric film 14a, the first metal layer 15a, the second dielectric film 14b, and the second metal layer 15b in the first direction D1 in that order. Alternatively, the base body 11 can be said to be a wound body formed by winding the first dielectric film 14a, the first metal layer 15a, the second dielectric film 14b, and the second metal layer 15b in a state where they are stacked in the first direction D1 in that order.

[0038] In the base material 11, the first main surface 14aa of the first dielectric film 14a and the second main surface 14bb of the second dielectric film 14b face each other in the first direction D1, and the second main surface 14ab of the first dielectric film 14a and the first main surface 14ba of the second dielectric film 14b face each other in the first direction D1. Thus, in the base material 11, the first metallized film 13a and the second metallized film 13b are wound in a state where they are stacked in the first direction D1. In other words, in the base material 11, the second metallized film 13b is on the inside of the first metallized film 13a, and more specifically, the first metal layer 15a is on the inside of the first dielectric film 14a, and the second metal layer 15b is on the inside of the second dielectric film 14b, so the first metallized film 13a and the second metallized film 13b are wound in a state where they are stacked in the first direction D1. In other words, in the base body 11, the first metal layer 15a and the second metal layer 15b face each other with either the first dielectric film 14a or the second dielectric film 14b in between.

[0039] A fuse portion may be provided in the first metal layer 15a. The fuse portion provided in the first metal layer 15a is, for example, a portion that connects a divided electrode portion, which is a portion of the first metal layer 15a that is divided into multiple parts, with an electrode portion that is not facing the second metal layer 15b. Examples of electrode patterns for the first metal layer 15a provided with a fuse portion include the electrode patterns disclosed in Japanese Patent Application Publication No. 2004-363431 and Japanese Patent Application Publication No. Hei 5-251266.

[0040] The second metal layer 15b may also be provided with a fuse portion, similar to the first metal layer 15a.

[0041] The first dielectric film 14a may contain a curable resin as its main component.

[0042] In this specification, the main component means the component with the highest weight percentage, and preferably means the component with a weight percentage higher than 50% by weight.

[0043] The curable resin may be a thermosetting resin or a photocurable resin.

[0044] In this specification, thermosetting resins mean resins that can be cured by heat, but this does not limit the curing method. Therefore, thermosetting resins include resins that can be cured by methods other than heat (e.g., light, electron beam, etc.), as long as they can be cured by heat. In addition, depending on the material, the reaction may be initiated by the reactivity of the material itself, and resins that proceed to cure without necessarily being subjected to external heat are also considered thermosetting resins. The same applies to photocurable resins; as long as they can be cured by light, they also include resins that can be cured by methods other than light (e.g., heat, etc.).

[0045] The curable resin is preferably composed of a cured product of a first organic material having hydroxyl groups (OH groups) and a second organic material having isocyanate groups (NCO groups). In this case, the curable resin is composed of a cured product having urethane bonds obtained by the reaction of the hydroxyl groups of the first organic material and the isocyanate groups of the second organic material.

[0046] The presence of urethane bonding in dielectric films can be confirmed by analysis using a Fourier transform infrared spectrophotometer (FT-IR).

[0047] When a curable resin is obtained by the reaction described above, uncured portions of the starting material may remain in the first dielectric film 14a. For example, the first dielectric film 14a may contain at least one of hydroxyl groups and isocyanate groups. In this case, the first dielectric film 14a may contain either one of hydroxyl groups and isocyanate groups, or both hydroxyl groups and isocyanate groups.

[0048] The presence of hydroxyl groups and / or isocyanate groups in dielectric films can be confirmed by analysis using FT-IR.

[0049] Examples of the first organic material include phenoxy resin, polyvinyl acetal resin, and polyvinyl butyral resin.

[0050] Multiple types of organic materials may be used in combination as the first organic material.

[0051] Examples of the second organic material include aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI), and aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI). As the second organic material, at least one modified form of these polyisocyanates may be used, or a mixture of at least one of these polyisocyanates and its modified form may be used.

[0052] Multiple types of organic materials may be used in combination as the second organic material.

[0053] The first dielectric film 14a may contain a thermoplastic resin as its main component.

[0054] Examples of thermoplastic resins include polypropylene, polyethersulfone, polyetherimide, and polyarylate.

[0055] The first dielectric film 14a may contain additives for adding various functions.

[0056] Examples of additives include leveling agents used to impart smoothness.

[0057] The additive preferably has a functional group that reacts with hydroxyl groups and / or isocyanate groups, and forms part of the crosslinked structure of the cured product. Examples of such additives include resins having at least one functional group selected from the group consisting of hydroxyl groups, epoxy groups, silanol groups, and carboxyl groups.

[0058] The second dielectric film 14b, like the first dielectric film 14a, may contain a thermosetting resin as its main component, a photocurable resin as its main component, or a thermoplastic resin as its main component. Furthermore, the second dielectric film 14b, like the first dielectric film 14a, may also contain additives.

[0059] The compositions of the first dielectric film 14a and the second dielectric film 14b may be different from each other, but it is preferable that they be the same.

[0060] The thickness of the first dielectric film 14a and the second dielectric film 14b is preferably 1 μm or more and 10 μm or less, and more preferably 3 μm or more and 5 μm or less.

[0061] The thicknesses of the first dielectric film 14a and the second dielectric film 14b may be different, but it is preferable that they be the same.

[0062] The thickness of the dielectric film is measured using an optical film thickness gauge.

[0063] The first dielectric film 14a and the second dielectric film 14b are preferably each produced by forming a resin solution containing the resin material described above into a film, and then curing it by heat treatment.

[0064] Examples of constituent materials for the first metal layer 15a and the second metal layer 15b include metals such as aluminum, zinc, titanium, magnesium, tin, and nickel.

[0065] The compositions of the first metal layer 15a and the second metal layer 15b may be different from each other, but it is preferable that they be the same.

[0066] The thickness of the first metal layer 15a and the second metal layer 15b is preferably 5 nm or more and 40 nm or less.

[0067] The thicknesses of the first metal layer 15a and the second metal layer 15b may be different, but it is preferable that they be the same.

[0068] The thickness of the metal layer is measured by observing a cross-section of the metallized film along the first direction using a transmission electron microscope (TEM).

[0069] The first metal layer 15a and the second metal layer 15b are preferably formed by depositing the above-described metal onto the main surfaces of the first dielectric film 14a and the second dielectric film 14b, respectively.

[0070] The first external electrode 12a is provided on one end face of the base body 11. More specifically, the first external electrode 12a is connected to the first metal layer 15a by contacting the end of the first metal layer 15a exposed on one end face of the base body 11. On the other hand, the first external electrode 12a is not connected to the second metal layer 15b.

[0071] The second external electrode 12b is provided on the other end face of the base body 11. More specifically, the second external electrode 12b is connected to the second metal layer 15b by contacting the end of the second metal layer 15b exposed on the other end face of the base body 11. On the other hand, the second external electrode 12b is not connected to the first metal layer 15a.

[0072] Examples of materials that make up the first external electrode 12a and the second external electrode 12b include metals such as zinc, aluminum, tin, and zinc-aluminum alloys.

[0073] The compositions of the first external electrode 12a and the second external electrode 12b may be different from each other, but it is preferable that they be the same.

[0074] The first external electrode 12a and the second external electrode 12b are preferably formed by thermal spraying the above-mentioned metal onto one end face and the other end face of the base body 11, respectively.

[0075] As shown in Figure 2, the lead terminal 20A is electrically connected to the first external electrode 12a. For example, the lead terminal 20A is electrically connected to the first external electrode 12a via a bonding member such as solder.

[0076] As shown in Figure 2, the lead terminal 20A has a first lead terminal 20Aa and a second lead terminal 20Ab.

[0077] As shown in Figure 2, the first lead terminal 20Aa may be electrically located closest to the first external electrode 12a at lead terminal 20A. In other words, the first lead terminal 20Aa may be located closest to the first external electrode 12a in the electrical path spanning the first external electrode 12a and lead terminal 20A.

[0078] Furthermore, the first lead terminal 20Aa does not necessarily have to be located electrically closest to the first external electrode 12a at lead terminal 20A. In other words, the first lead terminal 20Aa does not necessarily have to be located furthest towards the first external electrode 12a in the electrical path spanning the first external electrode 12a and lead terminal 20A. That is, lead terminal 20A may have another lead terminal located electrically closer to the first external electrode 12a than the first lead terminal 20Aa.

[0079] As shown in Figure 2, the second lead terminal 20Ab is electrically connected to the first external electrode 12a via the first lead terminal 20Aa. In other words, the second lead terminal 20Ab is located at a position electrically further away from the first external electrode 12a than the first lead terminal 20Aa.

[0080] As shown in Figure 2, the second lead terminal 20Ab may be electrically located furthest from the first external electrode 12a at lead terminal 20A. In other words, the second lead terminal 20Ab may be located furthest from the first external electrode 12a in the electrical path spanning the first external electrode 12a and lead terminal 20A.

[0081] Furthermore, the second lead terminal 20Ab does not necessarily have to be located electrically on the opposite side of the first external electrode 12a from the lead terminal 20A. In other words, the second lead terminal 20Ab does not necessarily have to be located on the opposite side of the first external electrode 12a from the first external electrode 12a in the electrical path spanning the first external electrode 12a and the lead terminal 20A. That is, the lead terminal 20A may have another lead terminal located electrically further away from the first external electrode 12a than the second lead terminal 20Ab.

[0082] The first lead terminal 20Aa and the second lead terminal 20Ab are locked in place so as to be in surface contact.

[0083] The following describes the locking mechanisms of the first lead terminal 20Aa and the second lead terminal 20Ab.

[0084] Figure 5 is a schematic perspective view showing the state before the first and second lead terminals shown in Figure 2 are locked. Figure 6 is a schematic perspective view showing the state after the first and second lead terminals shown in Figure 5 are locked. Note that in Figures 5 and 6, other components such as capacitor elements have been omitted to make it easier to focus on the locking mechanism of the first and second lead terminals.

[0085] As shown in Figure 5, the first lead terminal 20Aa has a first claw-shaped portion 25a and a second claw-shaped portion 25b.

[0086] The second claw-shaped portion 25b is located at a different height from the first claw-shaped portion 25a in the first direction D1.

[0087] As shown in Figure 5, the second claw-shaped portion 25b may be positioned lower than the first claw-shaped portion 25a in the first direction D1, that is, closer to the capacitor element 10 (see Figure 2) than the first claw-shaped portion 25a in the first direction D1.

[0088] The second claw-shaped portion 25b may be positioned higher than the first claw-shaped portion 25a in the first direction D1, that is, further from the capacitor element 10 (see Figure 2) than the first claw-shaped portion 25a in the first direction D1.

[0089] In this specification, when two claw-shaped parts are located at different heights in the same direction (first direction D1 in Figure 5), it means that at least the tips of the two claw-shaped parts are located at different heights in the same direction (first direction D1 in Figure 5).

[0090] As shown in Figure 5, the first claw-shaped portion 25a and the second claw-shaped portion 25b do not have to overlap when viewed from the first direction D1.

[0091] The first claw-shaped portion 25a and the second claw-shaped portion 25b may overlap when viewed from the first direction D1.

[0092] As shown in Figure 5, the first lead terminal 20Aa may further have a third claw-shaped portion 25c.

[0093] As shown in Figure 5, the third claw-shaped portion 25c may be located at the same height as the second claw-shaped portion 25b in the first direction D1. In other words, as shown in Figure 5, the third claw-shaped portion 25c may be located at a different height from the first claw-shaped portion 25a in the first direction D1, similar to the second claw-shaped portion 25b.

[0094] As shown in Figure 5, the third claw-shaped portion 25c may be positioned lower than the first claw-shaped portion 25a in the first direction D1, similar to the second claw-shaped portion 25b, that is, closer to the capacitor element 10 (see Figure 2) than the first claw-shaped portion 25a in the first direction D1.

[0095] Furthermore, if the first claw-shaped portion 25a and the second claw-shaped portion 25b are located at different heights in the first direction D1, the third claw-shaped portion 25c may be located at the same height as the first claw-shaped portion 25a or at the same height as the second claw-shaped portion 25b in the first direction D1.

[0096] In this specification, when two claw-shaped parts are said to be at the same height in the same direction (first direction D1 in Figure 5), it means that at least the tips of the two claw-shaped parts are at the same height in the same direction (first direction D1 in Figure 5).

[0097] As shown in Figure 5, the first claw-shaped portion 25a and the third claw-shaped portion 25c do not have to overlap when viewed from the first direction D1.

[0098] The first claw-shaped portion 25a and the third claw-shaped portion 25c may overlap when viewed from the first direction D1.

[0099] As shown in Figure 5, the first claw-shaped portion 25a may be located between the second claw-shaped portion 25b and the third claw-shaped portion 25c in the second direction D2, which is perpendicular to the first direction D1, when viewed from the first direction D1.

[0100] Furthermore, the first claw-shaped portion 25a does not necessarily have to be located between the second claw-shaped portion 25b and the third claw-shaped portion 25c in the second direction D2 when viewed from the first direction D1.

[0101] As shown in Figure 6, the second lead terminal 20Ab is held between the first claw-shaped portion 25a and the second claw-shaped portion 25b in the first direction D1. More specifically, the second lead terminal 20Ab is held by the elastic force of the first claw-shaped portion 25a and the second claw-shaped portion 25b in the first direction D1. Furthermore, as shown in Figure 6, if the first lead terminal 20Aa further has a third claw-shaped portion 25c, the second lead terminal 20Ab is held between the first claw-shaped portion 25a and the third claw-shaped portion 25c in the first direction D1. More specifically, the second lead terminal 20Ab is held by the elastic force of the first claw-shaped portion 25a and the third claw-shaped portion 25c in the first direction D1.

[0102] In the examples shown in Figures 5 and 6, the first lead terminal 20Aa has a first claw-shaped portion 25a, a second claw-shaped portion 25b, and a third claw-shaped portion 25c. However, instead of the first lead terminal 20Aa, the second lead terminal 20Ab may have a first claw-shaped portion 25a, a second claw-shaped portion 25b, and a third claw-shaped portion 25c. In this case, instead of the second lead terminal 20Ab, the first lead terminal 20Aa may be sandwiched between the first claw-shaped portion 25a and the second claw-shaped portion 25b, and also sandwiched between the first claw-shaped portion 25a and the third claw-shaped portion 25c in the first direction D1.

[0103] In the examples shown in Figures 5 and 6, the first lead terminal 20Aa has three claw-shaped parts: a first claw-shaped part 25a, a second claw-shaped part 25b, and a third claw-shaped part 25c. However, the number of claw-shaped parts is not particularly limited, as long as it has at least two claw-shaped parts, the first claw-shaped part 25a and the second claw-shaped part 25b. The same applies when the second lead terminal 20Ab has claw-shaped parts.

[0104] As described above, in capacitor 1A, the other of the first lead terminal 20Aa and the second lead terminal 20Ab is sandwiched between multiple claw-like portions on one of the first lead terminal 20Aa and the second lead terminal 20Ab. As a result, in capacitor 1A, the first lead terminal 20Aa and the second lead terminal 20Ab are locked together in surface contact.

[0105] In capacitor 1A, the first lead terminal 20Aa and the second lead terminal 20Ab are locked together, allowing for mechanical (physical) connection between them without the use of solder or other joining materials. Therefore, capacitor 1A improves connectivity between the first lead terminal 20Aa and the second lead terminal 20Ab without the use of solder or other joining materials.

[0106] Furthermore, if the first lead terminal 20Aa and the second lead terminal 20Ab are mechanically connected, the connection point between the first lead terminal 20Aa and the second lead terminal 20Ab can be firmly held without using a joining material such as solder. This improves the handling (assembly workability) when assembling the capacitor 1A, for example, when housing the capacitor element 10 to which the lead terminals 20A are connected into the outer case 30.

[0107] Furthermore, in order to further strengthen the connection between the first lead terminal 20Aa and the second lead terminal 20Ab, if the first lead terminal 20Aa and the second lead terminal 20Ab are to be welded, as described above, the first lead terminal 20Aa and the second lead terminal 20Ab are in surface contact while connected, making welding easier. For this reason, it is preferable that the first lead terminal 20Aa and the second lead terminal 20Ab are welded at a location where they are locked in surface contact.

[0108] As shown in Figure 5, the second lead terminal 20Ab may be provided with a notch 26.

[0109] If the second lead terminal 20Ab is provided with a notch 26, it is preferable that the first claw-shaped portion 25a is fitted into the notch 26. In this case, the first claw-shaped portion 25a is less likely to shift in the second direction D2 due to the notch 26, so that the first lead terminal 20Aa and the second lead terminal 20Ab are sufficiently firmly locked together.

[0110] In the examples shown in Figures 5 and 6, the second lead terminal 20Ab is provided with a notch 26. However, if the second lead terminal 20Ab has a first claw-shaped portion 25a instead of the first lead terminal 20Aa, the notch 26 may be provided on the first lead terminal 20Aa instead of the second lead terminal 20Ab, and the first claw-shaped portion 25a of the second lead terminal 20Ab may be fitted into the notch 26 provided on the first lead terminal 20Aa.

[0111] Although not shown in Figures 5 and 6, as shown in Figure 2, the timing of the connection of the first lead terminal 20Aa and the first external electrode 12a may be before the first lead terminal 20Aa and the second lead terminal 20Ab are locked, or it may be after the first lead terminal 20Aa and the second lead terminal 20Ab are locked.

[0112] As shown in Figure 2, the lead terminal 21A is electrically connected to the second external electrode 12b. For example, the lead terminal 21A is electrically connected to the second external electrode 12b via a bonding member such as solder.

[0113] As shown in Figure 2, the lead terminal 21A has a first lead terminal 21Aa and a second lead terminal 21Ab.

[0114] As shown in Figure 2, the first lead terminal 21Aa may be electrically located furthest towards the second external electrode 12b at lead terminal 21A. In other words, the first lead terminal 21Aa may be located furthest towards the second external electrode 12b in the electrical path spanning the second external electrode 12b and lead terminal 21A.

[0115] Furthermore, the first lead terminal 21Aa does not necessarily have to be located electrically closest to the second external electrode 12b at lead terminal 21A. In other words, the first lead terminal 21Aa does not necessarily have to be located furthest towards the second external electrode 12b in the electrical path spanning the second external electrode 12b and lead terminal 21A. That is, lead terminal 21A may have another lead terminal located electrically closer to the second external electrode 12b than the first lead terminal 21Aa.

[0116] As shown in Figure 2, the second lead terminal 21Ab is electrically connected to the second external electrode 12b via the first lead terminal 21Aa. In other words, the second lead terminal 21Ab is located at a position electrically further away from the second external electrode 12b than the first lead terminal 21Aa.

[0117] As shown in Figure 2, the second lead terminal 21Ab may be electrically located furthest from the second external electrode 12b at lead terminal 21A. In other words, the second lead terminal 21Ab may be located furthest from the second external electrode 12b in the electrical path spanning the second external electrode 12b and lead terminal 21A.

[0118] Furthermore, the second lead terminal 21Ab does not necessarily have to be located electrically on the opposite side of the second external electrode 12b from the lead terminal 21A. In other words, the second lead terminal 21Ab does not necessarily have to be located on the opposite side of the second external electrode 12b from the second external electrode 12b in the electrical path spanning the second external electrode 12b and the lead terminal 21A. That is, the lead terminal 21A may have another lead terminal located electrically further away from the second external electrode 12b than the second lead terminal 21Ab.

[0119] It is preferable that the first lead terminal 21Aa and the second lead terminal 21Ab are locked in a manner that they are in surface contact.

[0120] In capacitor 1A, when the first lead terminal 21Aa and the second lead terminal 21Ab are locked, the first lead terminal 21Aa and the second lead terminal 21Ab can be mechanically (physically) connected without using a joining material such as solder. In this case, capacitor 1A can improve the connectivity between the first lead terminal 21Aa and the second lead terminal 21Ab without using a joining material such as solder.

[0121] Furthermore, if the first lead terminal 21Aa and the second lead terminal 21Ab are mechanically connected, the connection point between the first lead terminal 21Aa and the second lead terminal 21Ab can be firmly held without using a joining material such as solder. This improves the handling (assembly workability) when assembling the capacitor 1A, for example, when housing the capacitor element 10 to which the lead terminals 21A are connected into the outer case 30.

[0122] Furthermore, in order to further strengthen the connection between the first lead terminal 21Aa and the second lead terminal 21Ab, if the first lead terminal 21Aa and the second lead terminal 21Ab are to be welded together, as described above, it is easier to weld them together if they are in surface contact while connected. For this reason, it is preferable that the first lead terminal 21Aa and the second lead terminal 21Ab are welded together at a location where they are locked in surface contact.

[0123] In addition, as described above, for capacitor 1A, it is sufficient that at least the first lead terminal 20Aa and the second lead terminal 20Ab are locked in surface contact, and it is preferable that the first lead terminal 21Aa and the second lead terminal 21Ab are locked in surface contact, but they do not have to be locked in surface contact.

[0124] Furthermore, when the first lead terminal 21Aa and the second lead terminal 21Ab are locked in surface contact, the locking configuration of the first lead terminal 21Aa and the second lead terminal 21Ab is preferably the same as the locking configuration of the first lead terminal 20Aa and the second lead terminal 20Ab described above, but it may be different from the locking configuration of the first lead terminal 20Aa and the second lead terminal 20Ab.

[0125] The shape of the lead terminal 20A may be, for example, plate-shaped or wire-shaped (rod-shaped). In other words, the shapes of the first lead terminal 20Aa and the second lead terminal 20Ab may each be, for example, plate-shaped or wire-shaped (rod-shaped). In this case, the first lead terminal 20Aa and the second lead terminal 20Ab may each have a shape in which a part is bent.

[0126] The shape of the lead terminal 21A may be, for example, plate-shaped or wire-shaped (rod-shaped). In other words, the shapes of the first lead terminal 21Aa and the second lead terminal 21Ab may each be, for example, plate-shaped or wire-shaped (rod-shaped). In this case, the first lead terminal 21Aa and the second lead terminal 21Ab may each have a shape in which a part is bent.

[0127] The first lead terminal 20Aa, the second lead terminal 20Ab, the first lead terminal 21Aa, and the second lead terminal 21Ab are also called busbars.

[0128] Lead terminals 20A and 21A are used, for example, as terminals for electrically connecting the capacitor element 10 to the mounting target when mounting capacitor 1A to the mounting target.

[0129] As shown in Figure 1, the capacitor element 10 is housed inside the outer casing 30 such that lead terminals 20A and 21A protrude outwards.

[0130] Although not shown in Figure 1, it is preferable that the capacitor element 10 is housed in the center of the outer casing 30, while being separated from the inner surface of the outer casing 30.

[0131] In the examples shown in Figures 1 and 2, one capacitor element 10 is housed inside one outer casing 30, but multiple capacitor elements 10 may be housed inside one outer casing 30.

[0132] The outer casing 30 has a bottomed cylindrical shape, for example, as shown in Figures 1 and 2, with an opening 31 at one end in the first direction D1.

[0133] In the example shown in Figures 1 and 2, the outer surface of the outer case 30 includes a first outer surface 32 facing the opening 31 in a first direction D1, and a second outer surface 33 (including four outer surfaces in the example shown in Figures 1 and 2) extending from the first outer surface 32 toward the opening 31 in the first direction D1.

[0134] Examples of the outer casing 30 include resin cases, metal cases, and the like.

[0135] If the outer casing 30 is a resin case, examples of resins that make up the resin case include liquid crystal polymer (LCP), polyphenylene sulfide, and polybutylene terephthalate. Among these, it is preferable that the resin case contains liquid crystal polymer.

[0136] As for the liquid crystal polymer contained in the resin case, for example, a liquid crystal polymer having p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid groups in its backbone can be used. In addition to p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid groups, liquid crystal polymers formed by polycondensation using various components such as phenol, phthalic acid, and ethylene terephthalate can also be used. Furthermore, when classifying liquid crystal polymers, there are classification methods such as Type I, Type II, and Type III, but in terms of materials, these refer to the same materials as the liquid crystal polymers formed from the above-mentioned components.

[0137] The resin case preferably further contains an inorganic filler in addition to the liquid crystal polymer.

[0138] As the inorganic filler included in the resin case, a material with higher strength than the liquid crystal polymer can be used. Preferably, the inorganic filler is a material with a higher melting point than the liquid crystal polymer, and more preferably a material with a melting point of 680°C or higher.

[0139] The form of the inorganic filler is not particularly limited, and examples include forms having a longitudinal direction, such as fibrous or plate-like forms. Multiple types of inorganic materials may be used in combination as such inorganic fillers. Preferably, the resin case contains at least one of a fibrous inorganic material and a plate-like inorganic material as the inorganic filler.

[0140] In this specification, a filler is described as fibrous if the relationship between the longitudinal dimension in the longitudinal direction and the cross-sectional diameter in a cross-section perpendicular to the longitudinal direction is such that longitudinal dimension / cross-sectional diameter ≥ 5 (i.e., an aspect ratio of 5:1 or greater). Here, the cross-sectional diameter is defined as the distance between the two longest points on the outer circumference of the cross-section. If the cross-sectional diameter differs in the longitudinal direction, the measurement is taken at the point where the cross-sectional diameter is maximum.

[0141] In this specification, a filler is described as being in the form of a plate, meaning that in the filler, the relationship between the cross-sectional diameter of the surface with the largest projected area and the maximum height in a direction perpendicular to this cross-section is such that the cross-sectional diameter / maximum height ≥ 3.

[0142] Preferably, the inorganic filler has at least a portion thereof that is oriented toward the opening 31 from the first outer surface 32 and toward the adjacent second outer surface 33 on the second outer surface 33 of the outer case 30, and is dispersed inside the outer case 30.

[0143] The inorganic filler material is preferably 5 μm or larger in diameter and 50 μm or larger in length.

[0144] It is preferable that the inorganic filler is dispersed throughout the outer casing 30 without agglomerating.

[0145] Examples of inorganic fillers include fibrous glass fillers, plate-shaped talc, or mica. Among these, it is preferable that the inorganic filler mainly contains fibrous glass fillers.

[0146] Even when the resin case contains another resin (for example, polyphenylene sulfide) instead of the liquid crystal polymer, it is preferable that the resin case further contains the inorganic filler described above.

[0147] The resin case is manufactured, for example, by methods such as injection molding.

[0148] If the outer casing 30 is a metal case, examples of metals that make up the metal case include individual metals such as aluminum, magnesium, iron, stainless steel, and copper, as well as alloys containing at least one of these individual metals. In particular, it is preferable that the metal case contains aluminum or an aluminum alloy.

[0149] The metal case is manufactured, for example, by a method such as impact molding.

[0150] As shown in Figure 1, the filling resin 40 is filled inside the outer case 30 so as to embed the capacitor element 10. The capacitor element 10 is held in place inside the outer case 30 by the filling resin 40 in this manner.

[0151] When the capacitor element 10 is housed inside the outer case 30 such that it is separated from the inner surface of the outer case 30, the filler resin 40 is filled between the capacitor element 10 and the outer case 30, more specifically, between the outer surface of the capacitor element 10 and the inner surface of the outer case 30. Furthermore, the filler resin 40 is filled inside the outer case 30 not only between the capacitor element 10 and the outer case 30, but also in the area extending from the opening 31 of the outer case 30 to the capacitor element 10.

[0152] As the filler resin 40, it is preferable to appropriately select a resin with low moisture permeability from the viewpoint of suppressing the penetration of moisture into the capacitor element 10, such as epoxy resin, silicone resin, or urethane resin. As a curing agent for epoxy resin, examples include amine curing agents and imidazole curing agents.

[0153] As the filler resin 40, only the resin described above may be used, but a resin to which a reinforcing agent has been added may also be used for the purpose of improving strength. Examples of reinforcing agents include silica and alumina.

[0154] From the viewpoint of suppressing the intrusion of moisture into the capacitor element 10, it is preferable that the thickness of the filling resin 40 at the opening 31 of the outer case 30 is large. The thickness of the filling resin 40 at the opening 31 of the outer case 30 is preferably sufficiently large within the range that the overall volume (size) of the capacitor 1A is permissible, and specifically, preferably 2 mm or more, more preferably 4 mm or more. In particular, it is preferable to arrange the capacitor element 10 inside the outer case 30 on the first outer surface 32 side rather than on the opening 31 side of the outer case 30, so that the thickness of the filling resin 40 for the capacitor element 10 is larger on the opening 31 side of the outer case 30 than on the first outer surface 32 side.

[0155] The thickness of the filling resin 40 is measured, for example, using a soft X-ray device in a non-destructive state, and using a length measuring device such as a caliper in a destructive state.

[0156] In the first direction D1, the relationship between the height of the outer case 30 and the height of the filling resin 40 is such that the thickness of the filling resin 40 at the opening 31 of the outer case 30 is made as large as possible, and it may extend to the inside of the outer case 30, or it may fill it to the brim, or it may slightly overflow due to surface tension.

[0157] As shown in Figure 1, at least a portion of the first lead-out terminal 20Aa (see Figure 2) may be embedded in the filler resin 40. In the example shown in Figure 1, the entire first lead-out terminal 20Aa is embedded in the filler resin 40.

[0158] As shown in Figure 1, at least a portion of the first lead terminal 21Aa (see Figure 2) may be embedded in the filler resin 40. In the example shown in Figure 1, the entire first lead terminal 21Aa is embedded in the filler resin 40.

[0159] As shown in Figure 1, at least a portion of the second lead terminal 20Ab (see Figure 2) may protrude from the filler resin 40. In the example shown in Figure 1, a portion (end) of the second lead terminal 20Ab protrudes from the filler resin 40.

[0160] As shown in Figure 1, at least a portion of the second lead terminal 21Ab (see Figure 2) may protrude from the filler resin 40. In the example shown in Figure 1, a portion (end) of the second lead terminal 21Ab protrudes from the filler resin 40.

[0161] [Embodiment 2] In the capacitor of Embodiment 2 of the present invention, one of the first lead terminal and the second lead terminal has a claw-shaped portion, and the other of the first lead terminal and the second lead terminal is provided with a slit portion that penetrates in the first direction, and the claw-shaped portion is inserted through the slit portion in the first direction and hooked onto the edge of the slit portion. Except for this point, the capacitor of Embodiment 2 of the present invention is the same as the capacitor of Embodiment 1 of the present invention.

[0162] Figure 7 is a schematic perspective view showing an example of a capacitor according to Embodiment 2 of the present invention. Figure 8 is a schematic perspective view showing an example of the capacitor shown in Figure 7 (excluding the filling resin) in a disassembled state.

[0163] The capacitor 1B shown in Figures 7 and 8 comprises two capacitor elements 10 (see Figure 3 above), lead terminals 20B and 21B, an outer case 30, and a filling resin 40.

[0164] In the examples shown in Figures 7 and 8, two capacitor elements 10 are housed inside one outer casing 30, but one capacitor element 10 may be housed inside one outer casing 30, or three or more capacitor elements 10 may be housed inside one outer casing 30.

[0165] As shown in Figure 8, the lead terminal 20B is electrically connected to each of the first external electrodes 12a of the two capacitor elements 10. For example, the lead terminal 20B is electrically connected to each of the first external electrodes 12a of the two capacitor elements 10 via a bonding member such as solder.

[0166] As shown in Figure 8, the lead terminal 20B has a first lead terminal 20Ba and a second lead terminal 20Bb.

[0167] The first lead terminal 20Ba and the second lead terminal 20Bb are locked in place so as to be in surface contact.

[0168] The following describes the locking mechanisms of the first lead terminal 20Ba and the second lead terminal 20Bb.

[0169] Figure 9 is a schematic perspective view showing the state before the first and second lead terminals shown in Figure 8 are locked. Figure 10 is a schematic perspective view showing the state during the locking of the first and second lead terminals shown in Figure 9. Figure 11 is a schematic perspective view showing the state after the first and second lead terminals shown in Figure 10 are locked. Note that in Figures 9, 10, and 11, other components such as capacitor elements have been omitted to make it easier to focus on the locking mechanism of the first and second lead terminals.

[0170] As shown in Figure 9, the first lead terminal 20Ba has a claw-shaped portion 25.

[0171] As shown in Figure 9, the second lead terminal 20Bb is provided with a slit portion 27.

[0172] The slit portion 27 penetrates the second lead terminal 20Bb in the first direction D1.

[0173] As shown in Figure 9, the slit portion 27 may have a first slit portion 27a and a second slit portion 27b.

[0174] As shown in Figure 9, the second slit portion 27b is connected to the first slit portion 27a in the second direction D2 which is perpendicular to the first direction D1.

[0175] When viewed from the first direction D1, it is preferable that the first slit portion 27a can encapsulate the claw-shaped portion 25.

[0176] In this specification, when the slit portion is said to be able to enclose the claw-shaped portion when viewed from the same direction (first direction D1 in Figure 9), it means that when the claw-shaped portion and the slit portion are superimposed when viewed from the same direction (first direction D1 in Figure 9), the claw-shaped portion does not protrude from the slit portion, or more specifically, the outer edge of the claw-shaped portion does not lie outside the outer edge of the slit portion.

[0177] When viewed from the first direction D1, it is preferable that the second slit portion 27b cannot contain the claw-shaped portion 25.

[0178] In this specification, when viewed from the same direction (first direction D1 in Figure 9), it is said that the slit portion cannot contain the claw-shaped portion, and when the claw-shaped portion and the slit portion are superimposed when viewed from the same direction (first direction D1 in Figure 9), the claw-shaped portion protrudes from the slit portion, or more specifically, the outer edge of the claw-shaped portion is located outside the outer edge of the slit portion.

[0179] When viewed from the first direction D1, if the first slit portion 27a can enclose the claw-shaped portion 25, the claw-shaped portion 25 can be directly inserted through the first slit portion 27a in the first direction D1, as shown in Figure 10.

[0180] Furthermore, if the second slit portion 27b cannot encapsulate the claw-shaped portion 25 when viewed from the first direction D1, the claw-shaped portion 25 cannot be directly inserted into the second slit portion 27b in the first direction D1.

[0181] It is preferable that the claw-shaped portion 25 is slidable in the second direction D2 between the first slit portion 27a and the second slit portion 27b while inserted into the slit portion 27 in the first direction D1. For example, as shown in Figure 10, if the dimension in the third direction D3 of the root portion of the claw-shaped portion 25 located opposite the tip (the portion extending in the first direction D1) is less than or equal to the dimension of the second slit portion 27b in the third direction D3, the claw-shaped portion 25 can be slid in the second direction D2 between the first slit portion 27a and the second slit portion 27b while inserted into the first slit portion 27a in the first direction D1.

[0182] As shown in Figure 10, the claw-shaped portion 25 is inserted into the first slit portion 27a in the first direction D1. When the claw-shaped portion 25 is slid in the second direction D2 toward the second slit portion 27b, as shown in Figure 11, the claw-shaped portion 25 is inserted into the slit portion 27 in the first direction D1 and hooked onto the edge of the slit portion 27. More specifically, as shown in Figure 11, it is preferable that the claw-shaped portion 25 is hooked onto the edge of the second slit portion 27b. In this case, the claw-shaped portion 25 is positioned in the third direction D3 by the second slit portion 27b.

[0183] In the examples shown in Figures 9, 10, and 11, the first lead terminal 20Ba has a claw-shaped portion 25, but the second lead terminal 20Bb may have the claw-shaped portion 25 instead of the first lead terminal 20Ba. In this case, the first lead terminal 20Ba may be provided with a slit portion 27 instead of the second lead terminal 20Bb, and the claw-shaped portion 25 of the second lead terminal 20Bb may be inserted through the slit portion 27 provided on the first lead terminal 20Ba in the first direction D1 and hooked onto the edge of the slit portion 27.

[0184] As described above, in capacitor 1B, the claw-shaped portion 25 on one of the first lead terminal 20Ba and the second lead terminal 20Bb is inserted through the slit portion 27 provided on the other end of the first lead terminal 20Ba and the second lead terminal 20Bb in the first direction D1, and is hooked onto the edge of the slit portion 27. As a result, in capacitor 1B, the first lead terminal 20Ba and the second lead terminal 20Bb are locked together in surface contact.

[0185] In capacitor 1B, the first lead terminal 20Ba and the second lead terminal 20Bb are locked together, allowing for mechanical (physical) connection between them without the use of solder or other joining materials. Therefore, capacitor 1B improves connectivity between the first lead terminal 20Ba and the second lead terminal 20Bb without the use of solder or other joining materials.

[0186] Furthermore, if the first lead terminal 20Ba and the second lead terminal 20Bb are mechanically connected, the connection point between the first lead terminal 20Ba and the second lead terminal 20Bb can be firmly held without using a joining material such as solder. This improves the handling (assembly workability) when assembling the capacitor 1B, for example, when housing the capacitor element 10 to which the lead terminals 20B are connected into the outer case 30.

[0187] Furthermore, in order to further strengthen the connection between the first lead terminal 20Ba and the second lead terminal 20Bb, if welding is to be attempted between the first lead terminal 20Ba and the second lead terminal 20Bb, as described above, the first lead terminal 20Ba and the second lead terminal 20Bb are in surface contact while connected, making welding easier. For this reason, it is preferable that the first lead terminal 20Ba and the second lead terminal 20Bb are welded at a location where they are locked in surface contact.

[0188] In the example shown in Figure 8, the first lead terminal 20Ba and the second lead terminal 20Bb are locked at two locations, but the number of locations to which the first lead terminal 20Ba and the second lead terminal 20Bb are locked is not particularly limited.

[0189] As shown in Figure 9, the first lead terminal 20Ba may further have a claw-shaped portion 25'.

[0190] As shown in Figure 9, the claw-shaped portion 25' may be located at a different height from the claw-shaped portion 25 in the first direction D1.

[0191] As shown in Figure 9, the claw-shaped portion 25' may be positioned lower than the claw-shaped portion 25 in the first direction D1, that is, closer to the capacitor element 10 (see Figure 8) than the claw-shaped portion 25 in the first direction D1.

[0192] As shown in Figure 9, the claw-shaped portion 25 and the claw-shaped portion 25' do not necessarily have to overlap when viewed from the first direction D1.

[0193] As shown in Figure 9, when the first lead terminal 20Ba has claw-shaped portions 25 and 25', it is preferable that the second lead terminal 20Bb is sandwiched between the claw-shaped portions 25 and 25' in the first direction D1, as shown in Figure 11. In this case, the second lead terminal 20Bb is less likely to shift in the first direction D1 while sandwiched between the claw-shaped portions 25 and 25', so that the first lead terminal 20Ba and the second lead terminal 20Bb are sufficiently firmly locked together.

[0194] In the examples shown in Figures 9, 10, and 11, the first lead terminal 20Ba has a claw-shaped portion 25 and a claw-shaped portion 25'. However, if the second lead terminal 20Bb has a claw-shaped portion 25 instead of the first lead terminal 20Ba, the second lead terminal 20Bb may further have a claw-shaped portion 25', and the first lead terminal 20Ba may be sandwiched between the claw-shaped portion 25 and the claw-shaped portion 25' of the second lead terminal 20Bb in the first direction D1.

[0195] In the examples shown in Figures 9, 10, and 11, the first slit portion 27a and the second slit portion 27b are connected in the second direction D2, but they may be connected in the third direction D3 instead. In this case, the claw-shaped portion 25 may be slidable in the third direction D3 between the first slit portion 27a and the second slit portion 27b while inserted into the slit portion 27 in the first direction D1.

[0196] Although not shown in Figures 9, 10, and 11, as shown in Figure 8, the timing of the connection of the first lead terminal 20Ba and the first external electrode 12a may be before the first lead terminal 20Ba and the second lead terminal 20Bb are locked, or it may be after the first lead terminal 20Ba and the second lead terminal 20Bb are locked.

[0197] As shown in Figure 8, the lead terminal 21B is electrically connected to each of the second external electrodes 12b of the two capacitor elements 10. For example, the lead terminal 21B is electrically connected to each of the second external electrodes 12b of the two capacitor elements 10 via a bonding member such as solder.

[0198] As shown in Figure 8, when the lead terminal 20B is electrically connected to each of the first external electrodes 12a of the two capacitor elements 10, and the lead terminal 21B is electrically connected to each of the second external electrodes 12b of the two capacitor elements 10, the two capacitor elements 10 are connected in parallel.

[0199] As shown in Figure 8, the lead terminal 21B has a first lead terminal 21Ba and a second lead terminal 21Bb.

[0200] It is preferable that the first lead terminal 21Ba and the second lead terminal 21Bb are locked in a manner that ensures surface contact.

[0201] In capacitor 1B, when the first lead terminal 21Ba and the second lead terminal 21Bb are locked, the first lead terminal 21Ba and the second lead terminal 21Bb can be mechanically (physically) connected without using a joining material such as solder. In this case, capacitor 1B can improve the connectivity between the first lead terminal 21Ba and the second lead terminal 21Bb without using a joining material such as solder.

[0202] Furthermore, if the first lead terminal 21Ba and the second lead terminal 21Bb are mechanically connected, the connection point between the first lead terminal 21Ba and the second lead terminal 21Bb can be firmly held without using a joining material such as solder. This improves the handling (assembly workability) when assembling the capacitor 1B, for example, when housing the capacitor element 10 to which the lead terminals 21B are connected into the outer case 30.

[0203] Furthermore, in order to further strengthen the connection between the first lead terminal 21Ba and the second lead terminal 21Bb, if the first lead terminal 21Ba and the second lead terminal 21Bb are to be welded together, as described above, it is easier to weld them together if they are in surface contact while connected. For this reason, it is preferable that the first lead terminal 21Ba and the second lead terminal 21Bb are welded together at a location where they are locked in surface contact.

[0204] In addition, as described above, for capacitor 1B, it is sufficient that at least the first lead terminal 20Ba and the second lead terminal 20Bb are locked in surface contact, and it is preferable that the first lead terminal 21Ba and the second lead terminal 21Bb are locked in surface contact, but they do not have to be locked in surface contact.

[0205] Furthermore, when the first lead terminal 21Ba and the second lead terminal 21Bb are locked in surface contact, the locking configuration of the first lead terminal 21Ba and the second lead terminal 21Bb is preferably the same as the locking configuration of the first lead terminal 20Ba and the second lead terminal 20Bb described above, but it may be different from the locking configuration of the first lead terminal 20Ba and the second lead terminal 20Bb. For example, the locking configuration of the first lead terminal 21Ba and the second lead terminal 21Bb may be the same as the locking configuration of the first lead terminal 20Aa and the second lead terminal 20Ab described above.

[0206] The capacitor of the present invention is useful, for example, as a smoothing capacitor in a power conversion device (e.g., an inverter) for automotive applications.

[0207] This specification discloses the following:

[0208] <1> A capacitor element having a base body and an external electrode provided on the end face of the base body, The lead terminals electrically connected to the above external electrodes, An outer casing in which the capacitor element is housed, such that the lead terminals protrude outward, The device comprises a filling resin filled inside the outer casing so as to embed the capacitor element, The above-mentioned lead terminal has a first lead terminal and a second lead terminal electrically connected to the external electrode via the first lead terminal. A capacitor characterized in that the first lead terminal and the second lead terminal are locked together so as to be in surface contact.

[0209] <2> The first and second lead terminals are welded together at a point where they are locked in surface contact. <1> The capacitors listed.

[0210] <3> One of the above-mentioned first lead terminal and the above-mentioned second lead terminal has a first claw-shaped portion and a second claw-shaped portion located at a different height from the first claw-shaped portion in the first direction, The other end of the first lead terminal and the second lead terminal is sandwiched between the first claw-shaped portion and the second claw-shaped portion in the first direction. <1> or <2> The capacitors listed.

[0211] <4> The first claw-shaped portion and the second claw-shaped portion do not overlap when viewed from the first direction. <3> The capacitors listed.

[0212] <5> One of the above-mentioned first lead terminal and the above-mentioned second lead terminal further has a third claw-shaped portion located at the same height as the second claw-shaped portion in the first direction, The other end of the first lead terminal and the second lead terminal is sandwiched between the first claw-shaped portion and the third claw-shaped portion in the first direction. <3> or <4> The capacitors listed.

[0213] <6> The first claw-shaped portion and the third claw-shaped portion do not overlap when viewed from the first direction. <5> The capacitors listed.

[0214] <7> The first claw-shaped portion is located between the second claw-shaped portion and the third claw-shaped portion in a second direction perpendicular to the first direction, when viewed from the first direction. <5> or <6> The capacitors listed.

[0215] <8> The other end of the first lead terminal and the second lead terminal is provided with a notch. The first claw-shaped portion described above is fitted into the notched portion. <3> ~ <7> A capacitor listed in any of the following.

[0216] <9> One of the above-mentioned first lead terminal and the above-mentioned second lead terminal has a claw-shaped portion, The other of the first and second lead terminals is provided with a slit portion that penetrates in the first direction. The claw-shaped portion is inserted through the slit in the first direction and hooked onto the edge of the slit. <1> ~ <8> A capacitor listed in any of the following.

[0217] <10> The slit portion includes a first slit portion and a second slit portion connected to the first slit portion in a second direction perpendicular to the first direction. When viewed from the first direction described above, the first slit portion is capable of enclosing the claw-shaped portion, and the second slit portion is not capable of enclosing the claw-shaped portion. <9> The capacitors listed.

[0218] <11> The claw-shaped portion is inserted into the slit portion in the first direction and is slidable between the first slit portion and the second slit portion in the second direction. <10> The capacitors listed.

[0219] <12> The claw-shaped portion is hooked onto the edge of the second slit portion. <11> The capacitors listed. [Explanation of Symbols]

[0220] 1A, 1B Capacitors 10 Capacitor element 11 Base Body 12a 1st external electrode 12b 2nd external electrode 13a First Metallized Film 13b Second Metallized Film 14a First dielectric film 14aa First main surface of the first dielectric film 14ab Second main surface of the first dielectric film 14b Second Dielectric Film 14ba First main surface of the second dielectric film 14bb Second main surface of the second dielectric film 15a 1st metal layer 15b 2nd metal layer 20A, 20B, 21A, 21B extraction terminal 20Aa, 20Ba, 21Aa, 21Ba 1st extraction terminal 20Ab, 20Bb, 21Ab, 21Bb 2nd extraction terminal 25, 25' Claw-shaped part 25a 1st claw part 25b Second claw-like part 25c 3rd claw part 26 Notch 27 Slit section 27a First slit section 27b Second slit section 30 outer cases 31 Aperture 32 1st outer surface 33 Second outer surface 40 Filling resin D1 1st direction D2 2nd direction D3 Third direction

Claims

1. A capacitor element having a base body and an external electrode provided on the end face of the base body, A lead terminal electrically connected to the external electrode, An outer casing in which the capacitor element is housed such that the lead terminals protrude outward, The casing comprises a filling resin filled inside the outer casing so as to embed the capacitor element, The lead terminal comprises a first lead terminal and a second lead terminal electrically connected to the external electrode via the first lead terminal. The first lead terminal and the second lead terminal are locked in a surface contact manner. One of the first lead-out terminal and the second lead-out terminal has a first claw-shaped portion and a second claw-shaped portion located at a different height from the first claw-shaped portion in the first direction. A capacitor characterized in that the other end of the first lead terminal and the second lead terminal is sandwiched between the first claw-shaped portion and the second claw-shaped portion in the first direction.

2. A capacitor element having a base body and an external electrode provided on the end face of the base body, A lead terminal electrically connected to the external electrode, An outer casing in which the capacitor element is housed such that the lead terminals protrude outward, The casing comprises a filling resin filled inside the outer casing so as to embed the capacitor element, The lead terminal comprises a first lead terminal and a second lead terminal electrically connected to the external electrode via the first lead terminal. The first lead terminal and the second lead terminal are locked in a surface contact manner. One of the first lead terminal and the second lead terminal has a claw-shaped portion, The other of the first and second lead terminals is provided with a slit portion that penetrates in the first direction. The capacitor is characterized in that the claw-shaped portion is inserted through the slit portion in the first direction and hooked onto the edge of the slit portion.

3. The capacitor according to claim 1 or 2, wherein the first lead terminal and the second lead terminal are welded at a location where they are locked in surface contact.

4. The capacitor according to claim 1, wherein the first claw-shaped portion and the second claw-shaped portion do not overlap when viewed from the first direction.

5. One of the first lead terminal and the second lead terminal further has a third claw-shaped portion located at the same height as the second claw-shaped portion in the first direction, The capacitor according to claim 1, wherein the other end of the first lead terminal and the second lead terminal is sandwiched between the first claw-shaped portion and the third claw-shaped portion in the first direction.

6. The capacitor according to claim 5, wherein the first claw-shaped portion and the third claw-shaped portion do not overlap when viewed from the first direction.

7. The capacitor according to claim 5 or 6, wherein the first claw-shaped portion is located between the second claw-shaped portion and the third claw-shaped portion in a second direction perpendicular to the first direction when viewed from the first direction.

8. The other end of the first lead terminal and the second lead terminal is provided with a notch. The capacitor according to any one of claims 1, 4 to 6, wherein the first claw-shaped portion is fitted into the notch portion.

9. The slit portion includes a first slit portion and a second slit portion connected to the first slit portion in a second direction perpendicular to the first direction. The capacitor according to claim 2, wherein, when viewed from the first direction, the first slit portion is capable of enclosing the claw-shaped portion, and the second slit portion is not capable of enclosing the claw-shaped portion.

10. The capacitor according to claim 9, wherein the claw-shaped portion is inserted through the slit portion in the first direction and is slidable between the first slit portion and the second slit portion in the second direction.

11. The capacitor according to claim 10, wherein the claw-shaped portion is hooked onto the edge of the second slit portion.

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