Induction heating conditioner

Abstract

To provide an induction heating cooker with high cooling performance for an electronic component.SOLUTION: An induction heating cooker includes a main body 1A, a top plate 2A that covers the top of the main body 1A, a plurality of heating coils provided in the main body 1A, a second operation unit 41 that is provided near the heating coil and performs operation and display, a board stand 13A that supports left and right boards 15 that control the heating coil, and a fan device 9 that cools high heat generating elements provided on the left and right boards 15. The board stand 13A includes a wall unit 12s that is exposed to the cooling air that has passed through the high heat generating element, and openings 12b and 12c that are provided above the wall unit 12s and discharge the cooling air toward the second operation unit 41. The second operation unit 41 is provided with a side surface 43a that allows the cooling air to flow toward the top plate 2A.SELECTED DRAWING: Figure 16

Description

Technical Field

[0001] The present invention relates to an induction heating cooker.

Background Art

[0002] Patent Document 1 describes an induction heating cooker in which a top plate is provided with three heating parts corresponding to the installation positions of three heating coils and an operation part for adjusting the heat intensity of the cooking pot.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the induction heating cooker described in Patent Document 1, if an operation display unit that further aggregates the operation parts and liquid crystal display parts for each heating part is provided in a region surrounded by the heating parts on the top plate, the distance between the part touched for operation and the heating part becomes closer than before. Therefore, it is easily affected by the heat transfer from the pot during heating to the top plate, and when the touched part becomes high temperature, touch operation becomes impossible.

[0005] Therefore, an object of the present invention is to provide an induction heating cooker with high cooling performance of electronic components.

Means for Solving the Problems

[0006] The present invention comprises a housing, a top plate covering the upper part of the housing, a plurality of heating coils provided inside the housing, an operation display unit provided near the heating coils for operation and display, a substrate case unit supporting a control board for controlling the heating coils, and a fan device for cooling a high-heat generating element provided on the control board, wherein the substrate case unit has a wall to which cooling air that has passed through the high-heat generating element is directed, and an opening provided above this wall for discharging the cooling air toward the operation display unit, A protruding portion that extends toward the top plate, The operation display unit is provided with a wall surface that guides the cooling air toward the top plate. The protruding portion has an opening, and an air passage is formed between the protruding portion and the top plate to guide the cooling air toward the heating coil. It is characterized by the following: [Effects of the Invention]

[0007] According to the present invention, it is possible to provide an induction heating cooker with high cooling performance for electronic components. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of an induction cooker according to the first embodiment. [Figure 2] This is a plan view of the induction cooker according to the first embodiment with the top plate removed. [Figure 3] This is an exploded perspective view of an induction cooker according to the first embodiment. [Figure 4] This is an exploded perspective view of the fan device included in the induction cooker according to the first embodiment. [Figure 5] This is a longitudinal cross-sectional view of the induction heating cooker according to the first embodiment, when cut along the VV line in Figure 1. [Figure 6] This is a longitudinal cross-sectional view of the induction heating cooker according to the first embodiment, taken by cutting along the line VI-VI in Figure 1. [Figure 7] This is a plan view including the fan device, left and right circuit boards, and middle circuit board of an induction heating cooker according to the first embodiment. [Figure 8] This is a circuit diagram of an induction cooker according to the first embodiment. [Figure 9]The longitudinal sectional view when the left and right substrates of the induction heating cooker according to the first embodiment are cut along the line IX-IX in FIG. 7. [Figure 10] The bottom view of the substrate cover included in the induction heating cooker according to the first embodiment. [Figure 11] The plan view of the induction heating cooker according to the second embodiment with the top plate removed. [Figure 12] The plan view including the left and right substrates and the fan device included in the induction heating cooker according to the second embodiment. [Figure 13] The exploded perspective view of the induction heating cooker according to the third embodiment. [Figure 14] The plan view of the induction heating cooker according to the third embodiment with the top plate removed. [[ID=十七]] [Figure 15] The sectional view when cut along the line XV-XV in FIG. 14. [Figure 16] The sectional view when cut along the line XVI-XVI in FIG. 14. [Figure 17] The sectional view when cut along the line XVII-XVII in FIG. 14.

Mode for Carrying Out the Invention

[0009] Hereinafter, as an example, an induction heating cooker 100 (see FIG. 1), which is configured as a built-in IH (Induction Heating) cooking heater equipped with a grill compartment 4 (see FIG. 1), will be described. Note that the first embodiment and the second embodiment are reference examples, and the third embodiment corresponds to the present invention.

[0010] ≪First Embodiment≫ FIG. 1 is a perspective view of an induction heating cooker 100 according to the first embodiment. As shown in FIG. 1, with the surface on which the front panel 5 of the induction heating cooker 100 is provided as the front (front surface), the front-back, left-right, and up-down directions are defined. The induction cooker 100 shown in Fig. 1 is a device that generates eddy currents at the bottom of a metal cooking pot (not shown) and causes the cooking pot itself to generate heat by Joule heat due to these eddy currents. The above-mentioned eddy currents are generated by flowing a predetermined high-frequency current through the right heating coil 6 (see Fig. 2), the left heating coil 7 (see Fig. 2), and the middle heating coil 8 (see Fig. 2), and changing the magnetic flux over time.

[0011] As shown in Fig. 1, the induction cooker 100 includes a main body 1, a top plate 2, an exhaust cover 3, a grill compartment 4, and a front panel 5. The main body 1 is a housing that constitutes the outer shell of the induction cooker 100 and has a box shape (concave shape) with an open upper side (also see Fig. 3).

[0012] The top plate 2 includes a plate-shaped glass 2a on which a cooking pot (not shown) is placed and a frame portion 2b that holds the four sides of the plate-shaped glass 2a, and is installed so as to close the upper opening of the main body 1. Further, the top plate 2 includes a three-hole pot placement portion 2c corresponding to the installation positions of the right heating coil 6 (see Fig. 2), the left heating coil 7 (see Fig. 2), and the middle heating coil 8 (see Fig. 2), and an operation panel 2d used for adjusting the heating condition of the cooking pot. In Fig. 1, an example where the operation panel 2d is provided on the top plate 2 is shown, but a part or all of the operation panel 2d may be provided on the front panel 5.

[0013] The exhaust cover 3 is a thin plate-shaped metal plate provided at the rear end portion of the top plate 2. A plurality of holes 3h are provided in the exhaust cover 3 as exhaust ports for exhausting the air blown out from the fan device 9 (see Fig. 2). Note that the exhaust cover 3 is detachable so that it can be cleaned when it gets dirty.

[0014] The grill compartment 4 (also referred to as a roaster or an oven) heats the cooking object with an upper heater 4b (see Fig. 6) and a lower heater 4c (see Fig. 6) described later. In the example of Fig. 1, the grill compartment 4 is provided on the left side of the front of the main body 1 and is slidable in the front-rear direction.

[0015] The front panel 5 is located on the main unit 1, adjacent to the front of the grill compartment 4 in the left-right direction. A plug P is connected to the main unit 1 via a wiring cord C.

[0016] Figure 2 is a plan view of the induction cooker 100 with the top plate removed. As shown in Figure 2, the induction cooker 100 includes a right heating coil 6 (first heating coil), a left heating coil 7 (second heating coil), a middle heating coil 8 (third heating coil), and a fan device 9.

[0017] The right heating coil 6, the left heating coil 7, and the middle heating coil 8 are coils through which a predetermined high-frequency current flows, and are located on the underside of the top plate 2 (see Figure 1). In the example shown in Figure 2, the right heating coil 6 is located in the right-side region of the main body 1 in a plan view, and the left heating coil 7 is located in the left-side region of the main body 1. The middle heating coil 8 is located in the central rear side of the main body 1 in a plan view.

[0018] The fan device 9 is a device that blows cooling air to dissipate heat from the electronic components mounted on the left and right circuit boards 15 (see Figure 3) and the middle circuit board 16 (see Figure 3), as well as from the right heating coil 6, the left heating coil 7, and the middle heating coil 8. The circuit board cover 12, left and right circuit boards 15, and middle circuit board 16 shown in Figure 2 will be described later.

[0019] Figure 3 is an exploded perspective view of the induction cooker 100. In addition to the above-described configuration, the induction cooker 100 includes a coil base 10, a temperature sensor 11, a circuit board cover 12, circuit board bases 13 and 14, left and right circuit boards 15, and a central circuit board 16, as shown in Figure 3.

[0020] The coil base 10 is a component on which the right heating coil 6, the left heating coil 7, and the middle heating coil 8 are mounted, and is supported at three points by support parts 20 (see Figure 5), such as springs. An upward biasing force is applied to the coil base 10 from these support parts 20, pressing the right heating coil 6, etc., against the lower surface (back surface) of the top plate 2, thereby maintaining a predetermined distance between the cooking pot (not shown) and the right heating coil 6, etc.

[0021] The temperature sensor 11 is a sensor that detects the temperature of the bottom of the pot being cooked (not shown), and one is provided near the center of each of the right heating coil 6, left heating coil 7, and middle heating coil 8. The circuit board cover 12 partitions the left and right circuit boards 15 and the middle circuit board 16 from each heating coil (right heating coil 6, left heating coil 7, and middle heating coil 8) in the vertical direction. The circuit board cover 12 also has the function of forming an air passage that guides the cooling air blown out from the fan device 9 to a predetermined location.

[0022] The circuit board cover 12 is installed to cover the left and right circuit boards 15 (first circuit board) and at least a portion of the middle circuit board 16 (second circuit board). The right heating coil 6, the left heating coil 7, and the middle heating coil 8 are installed on the upper side of the circuit board cover 12. The upper casing 9d of the fan device 9 is provided almost integrally with the circuit board cover 12.

[0023] The substrate base 13 is a resin insulating member on which the left and right substrates 15 are placed, and in a plan view it has a rectangular shape corresponding to the left and right substrates 15. The other substrate base 14 is an insulating member on which the middle substrate 16 is placed, and in a plan view it has a rectangular shape corresponding to the middle substrate 16. These substrate bases 13 and 14 are fixed to each other so that their respective surface surfaces are substantially flush and that they are adjacent to each other in a predetermined position in the front-to-back direction. A substrate cover 12 is then installed to cover these substrate bases 13 and 14 from above.

[0024] As described above, the main body 1 has a box-like (concave) shape with an open top. Specifically, the main body 1 is composed of a partition plate 1a (bottom plate of the main body 1) which has a rectangular shape in plan view, and a side plate 1b that extends upward from the edge of the partition plate 1a. The base plates 13 and 14 are fixed to the partition plate 1a of the main body 1. The partition plate 1a is provided with an intake opening 1h for guiding outside air to the intake port 91h (see Figure 5) of the fan device 9. In addition, the main body 1 is provided with a display unit 17 for displaying the status of the induction heating cooker 100 in a predetermined manner.

[0025] The left and right circuit boards 15 (first circuit board) are printed circuit boards on which predetermined electronic components are mounted, and are installed on the main body 1. Such electronic components include right inverter elements S1 and S2 (see Figure 7) connected to the right heating coil 6, left inverter elements S3 and S4 (see Figure 7) connected to the left heating coil 7, as well as diode bridges 21 (see Figure 7), integrated circuits, capacitors, resistors, etc.

[0026] The central circuit board 16 (second circuit board) is a printed circuit board on which predetermined electronic components are mounted, and is installed on the main body 1. Such electronic components include the central inverter elements S5 and S6 (see Figure 7) connected to the central heating coil 8, as well as capacitors, resistors, and the like. The left and right circuit boards 15 and the central circuit board 16 are electrically connected via power lines and communication lines.

[0027] The water receiving section 18 shown in Figure 3 is designed to receive liquid droplets that drip through the holes 3h (see Figure 1) in the exhaust cover 3, and is located on the underside of the exhaust cover 3, behind the fan device 9. The water receiving section 18 is also provided with a grid-like partition 18a to separate it from the fan device 9. This partition 18a prevents liquid droplets from entering the fan device 9.

[0028] Figure 4 is an exploded perspective view of the fan device 9 of the induction cooker. The fan device 9 shown in Figure 4 is a centrifugal fan comprising a motor 9a, an impeller 9b, and casings 9c and 9d. The motor 9a is the driving source of the fan device 9 and includes a stator (not shown), a rotor (not shown), and a rotating shaft 91a that rotates integrally with the rotor. The impeller 9b is a vane that blows out air through rotation accompanying the drive of the motor 9a. The casings 9c and 9d house the motor 9a and the impeller 9b.

[0029] As shown in Figure 4, the lower casing 9c is constructed by integrally molding a bottom portion 91c, a side portion 92c, a pair of tongue portions 93c and 94c, and a branch portion 95c. An air intake port 91h is provided near the center of the impeller 9b at the bottom portion 91c of the casing 9c. The side portion 92c of the casing 9c extends upward from the edge of the bottom portion 91c and has a C-shape in plan view (in Figure 4, the left and right sides are reversed C-shapes).

[0030] The pair of tongues 93c and 94c are formed to curve outward from one end and the other end of the side portion 92c in a plan view. The branching portion 95c has the function of dividing the air discharged as the impeller 9b rotates into two directions. As shown in Figure 4, the branching portion 95c has an inverted V shape in a plan view and is provided at a predetermined location between the pair of tongues 93c and 94c.

[0031] Then, the impeller 9b, which is connected to the rotating shaft 91a of the motor 9a, is installed in the casing 9c, and another casing 9d is fixed to the casing 9c from above, acting as a lid. In this state, the impeller 9b is rotatably supported by the rotating shaft 91a of the motor 9a so as not to come into contact with the casings 9c and 9d.

[0032] The front outlet 92h (one outlet) and the left outlet 93h (the other outlet) shown in Figure 4 are openings from which air is blown out of the fan device 9, and are located vertically between the left and right substrates 15 (first substrate: see Figure 3) and the substrate cover 12 (see Figure 3).

[0033] The left air outlet 93h is composed of the bottom 91c (part) of the casing 9c, one tongue portion 93c, and the branch portion 95c (the portion facing the tongue portion 93c), as well as a part of the circuit board cover 12 (see Figure 3). Furthermore, the front outlet 92h is composed of the bottom 91c (part) of the casing 9c, the other tongue portion 94c, and the branch portion 95c (the portion facing the tongue portion 94c), as well as a part of the circuit board cover 12 (see Figure 3). When the impeller 9b rotates in conjunction with the drive of the motor 9a, the air introduced into the casings 9c and 9d via the intake port 91h is divided and blown out in two directions: the front outlet 92h and the left outlet 93h.

[0034] Furthermore, it is desirable that the fan device 9 has a pressure-airflow characteristic with sufficient margin (capacity) relative to the internal airflow resistance (e.g., 100 [Pa] to 200 [Pa]) of the main body 1 (see Figure 3). This allows for the acquisition of the necessary airflow for cooling (e.g., 1.0 to 1.5 [m3 / min]) even at low rotation speeds, thereby efficiently cooling the electronic components on the left and right substrates 15 (see Figure 3) and the middle substrate 16 (see Figure 3), as well as the heating coils, and reducing noise during induction heating.

[0035] Figure 5 is a longitudinal cross-sectional view of the induction cooker 100 when it is cut along the VV line in Figure 1. In Figure 5, the white arrows indicate airflow. As shown in Figure 5, an intake opening 1h is provided on the back of the main body 1 to draw air into the main body 1 from the outside. A duct 19 is also provided in the space at the rear of the main body 1. The duct 19 guides the air flowing in through the intake opening 1h of the main body 1 to the intake port 91h of the fan device 9.

[0036] As the fan device 9 is driven, the air that has passed through the intake opening 1h and the duct 19 in sequence is guided to the fan device 9 via the intake port 91h. The air pressurized by the fan device 9 then splits into two directions via the front outlet 92h (see Figure 4) and the left outlet 93h (see Figure 4). In Figure 5, the flow of air discharged via the front outlet 92h is indicated by a white arrow.

[0037] The air blown out through the front outlet 92h of the fan device 9 flows generally forward through the space F1 between the left and right circuit boards 15 and the circuit board cover 12. This promotes heat dissipation from each electronic component E mounted on the left and right circuit boards 15. The air that has flowed through the space F1 between the left and right circuit boards 15 and the circuit board cover 12 is then guided through the upper outlet 12h of the circuit board cover 12 to the space F2 between the circuit board cover 12 and the top plate 2. As the air flows through this space F2, the right heating coil 6 and other components are cooled appropriately. The air that has flowed through space F2 is then exhausted to the outside through the holes 3h provided in the exhaust cover 3.

[0038] Figure 6 is a longitudinal cross-sectional view of the induction cooker 100 when it is cut along the line VI-VI in Figure 1. As shown in Figure 6, a heating chamber 4k is provided inside the grill compartment 4 as a space partitioned by a partition plate 4a. The heating chamber 4k is equipped with an upper heater 4b and a lower heater 4c, which are heat sources, as well as a grilling net 4d on which fish and other food items are placed, and a drip tray 4e positioned below the grilling net 4d. The drip tray 4e is slidable in the front-to-back direction together with the grilling net 4d.

[0039] Furthermore, the heat source for heating the food to be cooked in the heating chamber 4k is not limited to an electric heater; it may also be a microwave, steam, or a combination thereof. Additionally, a temperature controller (not shown) may be used to adjust the internal temperature of the grill chamber 4 while performing oven heating to a predetermined level. The ferrite 3f shown in Figure 6 is a highly permeable material used to suppress electromagnetic influence on the left and right substrates 15, and is installed below the intermediate heating coil 8, etc.

[0040] The air blown out through the left outlet 93h of the fan device 9 flows generally to the left through the space F1 between the left and right circuit boards 15 and the circuit board cover 12, cooling the electronic components E mounted on the left and right circuit boards 15. The air that has passed through space F1 is then guided through the upper outlet 12h (see Figure 5) to the space F2 between the top plate 2 and the circuit board cover 12.

[0041] Figure 7 is a plan view of the induction heating cooker 100, including the fan device 9, left and right circuit boards 15, and the central circuit board 16. In Figure 7, the ribs Ra, Rb, Rc, Rd and the substrate cover dividers Rs, Rt, which are integrally provided on the back side of the substrate cover 12 (see also Figure 10), are shown by dashed lines. Also in Figure 7, the airflow is shown by white arrows.

[0042] As shown in Figure 7, left and right circuit boards 15 are positioned in front of the fan device 9, and the air blown out through the front outlet 92h of the fan device 9 is guided to the left and right circuit boards 15. In addition, a middle circuit board 16 is provided on the left side of the fan device 9, and the air blown out through the left outlet 93h of the fan device 9 is guided to the middle circuit board 16.

[0043] The central circuit board 16 is positioned behind the left and right circuit boards 15 in the front-to-back direction and is electrically connected to the left and right circuit boards 15 via a connection part 29. The connection part 29 consists of a fixing part 29a that directly fixes the left and right circuit boards 15 and the central circuit board 16 with a circuit board base, and a hook 29b through which power lines pass. The circuit board surface (top surface) of the central circuit board 16 is substantially flush with the circuit board surface (top surface) of the left and right circuit boards 15. As shown in Figure 7, in addition to the diode bridge 21, a pair of right inverter elements S1, S2 and a pair of left inverter elements S3, S4 are mounted on the left and right circuit boards 15. Each of these electronic components will be explained with reference to Figure 8.

[0044] Figure 8 is a circuit diagram of the induction cooker 100. The induction cooker 100 includes, as electronic components mounted on the left and right circuit boards 15 (see Figure 7), a diode bridge 21, a smoothing capacitor 22, a right inverter circuit 23 (first inverter circuit), a left inverter circuit 24 (second inverter circuit), and resonant capacitors 26 and 27. The induction cooker 100 also includes, as electronic components mounted on the middle circuit board 16 (see Figure 7), a middle inverter circuit 25 (third inverter circuit), a middle heating coil 8 (third heating coil), and a resonant capacitor 28.

[0045] The diode bridge 21 is a circuit that full-wave rectifies the AC voltage applied from the AC power supply Q and converts it into a DC voltage (pulsating current). In the example in Figure 8, the diode bridge 21 is configured with four diodes D1 to D4 connected in a bridge configuration. The smoothing capacitor 22 is a capacitor that smooths the voltage (pulsating DC voltage) applied from the diode bridge 21.

[0046] The right inverter circuit 23 is a power conversion circuit that converts the DC voltage applied from the smoothing capacitor 22 via wirings 30a and 30b into a predetermined high-frequency voltage, and is connected to the right heating coil 6. As shown in Figure 8, the right inverter circuit 23 is equipped with a pair of right inverter elements S1 and S2 (first inverter elements). For example, IGBTs are used as such right inverter elements S1 and S2 (the same applies to the left inverter elements S3 and S4 and the middle inverter elements S5 and S6).

[0047] In the example shown in Figure 8, the emitter of one right inverter element S1 is connected to the collector of the other right inverter element S2, and this intermediate connection point is connected to one end of the right heating coil 6. Furthermore, the collector of one right inverter element S1 is connected to the positive terminal of the smoothing capacitor 22, and the emitter of the other right inverter element S2 is connected to the negative terminal of the smoothing capacitor 22. A freewheeling diode D is connected in antiparallel to each of the pair of right inverter elements S1 and S2.

[0048] Furthermore, a pair of resonant capacitors 26, 26 are connected in series with their intermediate connection point connected to the other end of the right heating coil 6. Then, by controlling the on / off state of a pair of right inverter elements S1, S2 to a predetermined extent, a high-frequency current flows through the right heating coil 6.

[0049] The left inverter circuit 24 is a power conversion circuit that converts the DC voltage applied from the smoothing capacitor 22 via wirings 30c and 30d into a predetermined high-frequency voltage, and is connected to the left heating coil 7. The left inverter circuit 24 is connected to the positive terminal of the smoothing capacitor 22 via wirings 30c and 30a (partially), and to the negative terminal of the smoothing capacitor 22 via wirings 30d and 30b (partially). As shown in Figure 8, the left inverter circuit 24 comprises a pair of left inverter elements S3 and S4 (second inverter elements), and their intermediate connection point is connected to the left heating coil 7. In addition, a pair of resonant capacitors 27 and 27 are connected in series with each other, and their intermediate connection point is connected to the other end of the left heating coil 7.

[0050] The intermediate inverter circuit 25 is a power conversion circuit that converts the DC voltage applied from the smoothing capacitor 22 via wirings 30e and 30f into a predetermined high-frequency voltage, and is connected to the intermediate heating coil 8. The intermediate inverter circuit 25 is connected to the positive terminal of the smoothing capacitor 22 via wirings 30e and 30a (partially), and to the negative terminal of the smoothing capacitor 22 via wirings 30f and 30b (partially). As shown in Figure 8, the intermediate inverter circuit 25 comprises a pair of intermediate inverter elements S5 and S6 (third inverter elements), and their intermediate connection point is connected to the intermediate heating coil 8. In addition, a pair of resonant capacitors 28 and 28 are connected in series with each other, and their intermediate connection point is connected to the other end of the intermediate heating coil 8.

[0051] In the first embodiment, as shown in Figure 8, the right inverter circuit 23, the left inverter circuit 24, and the middle inverter circuit 25 share (commonize) a single diode bridge 21, and this diode bridge 21 is mounted on a single left and right circuit board 15 (see Figure 7). In other words, the diode bridge 21 is commonly connected to the DC side of each of the right inverter circuit 23, the left inverter circuit 24, and the middle inverter circuit 25. This reduces the mounting area of ​​the diode bridge 21, and consequently makes the left and right circuit boards 15 (see Figure 7) more compact. Note that the circuit diagram in Figure 8 is just an example, and the circuit configuration of the induction heating cooker 100 is not limited to this.

[0052] Figure 9 is a longitudinal cross-sectional view of the left and right substrates 15 of the induction heating cooker 100 when cut along the line IX-IX in Figure 7. As shown in Figure 9, the left and right substrates 15 are provided with a heat sink H1 (first heat sink) as a metal component on which the right inverter element S1 is installed. The heat sink H1 comprises a plate-shaped base Ha1 on which the right inverter element S1 is installed, and a plurality of fins Hb1 extending perpendicularly from the base Ha1. In the example in Figure 9, the heat sink H1 is installed so that the base Ha1 is perpendicular to the substrate surface of the left and right substrates 15, and the plurality of fins Hb1 extend to the left from the base Ha1. The same applies to the heat sink H2 (see Figure 7) on which the other right inverter element S2 (see Figure 7) is installed.

[0053] Furthermore, the left and right substrates 15 are provided with a heat sink H3 (second heat sink) as a metal component on which the left inverter element S3 is installed. The heat sink H3 comprises a plate-shaped base Ha3 on which the left inverter element S3 is installed, and a plurality of fins Hb3 extending perpendicularly from this base Ha3. In the example shown in Figure 9, the heat sink H3 is installed so that the base Ha3 is perpendicular to the substrate surface of the left and right substrates 15, and the plurality of fins Hb3 extend to the right from the base Ha3. The same applies to the heat sink H4 (see Figure 7) on which the other left inverter element S4 (see Figure 7) is installed.

[0054] In the example shown in Figure 9, the tip of fin Hb1 of heatsink H1 and the tip of fin Hb3 of heatsink H3 face each other in the left-right direction with a predetermined gap between them. A substrate cover partition Rs (see also Figure 7) extending in the front-back direction is provided in this gap. The substrate cover partition Rs is a component that partitions the respective regions of heatsinks H1 and H3, forming an airflow path for cooling air, and extends downward from the back surface of the substrate cover 12.

[0055] As shown in Figure 7, a pair of right inverter elements S1 and S2 (first inverter elements) are each individually fitted with heat sinks H1 and H2 (first heat sinks). The pair of heat sinks H1 and H2 are arranged in a line along the direction of the cooling airflow (front-back direction in Figure 7). In the example in Figure 7, of the pair of heat sinks H1 and H2, the heat sink H2 on the downstream side of the cooling airflow extends a longer length in the direction of the cooling airflow than the heat sink H1 on the upstream side. As a result, the cooling performance of the downwind heat sink H2 is relatively higher than that of the upwind heat sink H1.

[0056] For example, the length L1 in the front-to-back direction of the upwind heatsink H1 may be 25 mm, and the length L2 in the front-to-back direction of the downwind heatsink H2 may be 35 mm. By defining the relative lengths of the heatsinks H1 and H2 in the front-to-back direction in this way, even if the temperature of the cooling air rises due to heat dissipation from one right inverter element S1, the other right inverter element S2 is also adequately cooled by heat dissipation through the downwind heatsink H2.

[0057] Similarly, a pair of left inverter elements S3 and S4 (second inverter elements) are each individually fitted with heat sinks H3 and H4 (second heat sinks). Furthermore, the pair of heat sinks H3 and H4 are arranged in a line along the direction of the cooling airflow. Of the pair of heat sinks H3 and H4, the heat sink H4 on the downstream side of the cooling airflow extends a longer length in the direction of the cooling airflow than the heat sink H3 on the upstream side. As a result, the cooling performance of the downwind heat sink H4 is relatively higher than that of the upwind heat sink H3.

[0058] Furthermore, the left and right substrates 15 are provided with a heat sink HD (heat sink for diodes) as a metal component on which the diode bridge 21 is installed. As shown in Figure 9, the heat sink HD comprises a plate-shaped base HDa on which the diode bridge 21 is installed, and a plurality of fins HDb extending perpendicularly from this base HDa. In the example in Figure 9, the heat sink HD is installed so that the base HDa is perpendicular to the substrate surface of the left and right substrates 15, and the plurality of fins HDb extend laterally from the base HDa.

[0059] Furthermore, as shown in Figure 7, it is preferable that the distance in the left-right direction between heatsinks H1 and HD (the first heatsink and the diode heatsink) is longer than the distance in the left-right direction between heatsinks H1 and H3 (the first heatsink and the second heatsink). Moreover, it is preferable that the distance in the left-right direction between heatsinks H3 and HD (the second heatsink and the diode heatsink) is longer than the distance in the left-right direction between heatsinks H1 and H3 (the first heatsink and the second heatsink). With this configuration, heat transfer from one of the right inverter elements S1 and S2 and the diode bridge 21 to the other is suppressed. Heat transfer from one of the left inverter elements S3 and S4 and the diode bridge 21 to the other is also suppressed. Therefore, the right inverter elements S1 and S2, the left inverter elements S3 and S4, and the diode bridge 21 are each efficiently cooled by heat exchange with the cooling air.

[0060] In the example shown in Figure 9, the number of fins Hb1 and Hb3 on heatsinks H1 and H3 (12 fins) is greater than the number of fins HDb on heatsink HD (10 fins). This reduces the mounting area of ​​heatsinks H1 and H3, and also reduces pressure loss as cooling air flows through them, thereby improving cooling efficiency (the same applies to heatsinks H2 and H4). The relative lengths of heatsinks H1-H4 and HD in the vertical direction can be changed as needed.

[0061] Let's return to Figure 7 and continue the explanation. As shown in Figure 7, focusing on the installation positions of the heat sinks H1-H4 and HD provided on the left and right substrates 15, they are arranged as follows. That is, the heat sinks H1 and H2 (first heat sinks), H3 and H4 (second heat sinks), and HD (heat sink for diodes) are installed at different positions in the direction perpendicular to the flow direction (front-to-back direction) of the cooling air flowing through them (front-to-back direction) (left-to-right direction). Cooling air flows through each of the heat sinks H1-H4 and HD via predetermined air passages, promoting heat dissipation from the high-heat-generating elements such as the right inverter elements S1 and S2 and the left inverter elements S3 and S4, as well as the diode bridge 21.

[0062] As shown in Figure 7, the central substrate 16 is provided with heat sinks H5 and H6 (third heat sinks) as metal members on which a pair of central inverter elements S5 and S6 are installed. In the example in Figure 7, two heat sinks H5 and H6 are provided along the direction of cooling airflow (left-right direction). One heat sink H5 is equipped with the central inverter element S5, and the other heat sink H6 is equipped with another central inverter element S6.

[0063] As described above, the fan device 9 is provided with two air outlets: a front air outlet 92h and a left air outlet 93h. Of these two air outlets, the cooling air blown out through the front air outlet 92h (one of the air outlets) is divided and directed towards the right inverter elements S1 and S2 (first inverter elements), the left inverter elements S3 and S4 (second inverter elements), and the diode bridge 21. The cooling air blown out through the left air outlet 93h (the other air outlet) is directed to the middle inverter elements S5 and S6 (third inverter elements).

[0064] As described above, air passages are provided to direct the cooling air blown out from the fan device 9 toward the right inverter elements S1 and S2 (first inverter elements), the left inverter elements S3 and S4 (second inverter elements), the middle inverter elements S5 and S6 (third inverter elements), and the diode bridge 21, respectively. These air passages will be explained using Figure 10.

[0065] Figure 10 is a bottom view of the circuit board cover 12 of the induction heating cooker 100. Note that Figure 10 is a bottom view of the back surface of the circuit board cover 12, viewed from below, and therefore the left and right sides are reversed compared to Figure 7. As shown in Figure 10, the substrate cover 12 is provided with multiple ribs Ra, Rb, Rc, Rd and substrate cover partitions Rs, Rt extending downward from its lower surface (back side). The air passage W1 that guides the cooling air from the fan device 9 to the heat sinks H1, H2 of the right inverter elements S1, S2 (see Figure 7) is composed of a substrate cover partition Rt (near the heat sinks H1, H2), another substrate cover partition Rs, a part of the left and right substrates 15 (see Figure 7), and a part of the substrate cover 12.

[0066] Furthermore, the air passage W2 that guides the cooling air from the fan device 9 to the heat sinks H3 and H4 of the left inverter elements S3 and S4 (see Figure 7) is composed of a substrate cover partition Rs, a rib Ra, a part of the left and right substrates 15 (see Figure 7), and a part of the substrate cover 12. Furthermore, the air passage W3 that guides the cooling air from the fan device 9 to the heat sink HD of the diode bridge 21 (see Figure 7) is composed of a substrate cover partition Rt (near the heat sink HD), a rib Rb, parts of the left and right substrates 15 (see Figure 7), and parts of the substrate cover 12.

[0067] As described above, the diode bridge 21 (see Figure 7) is located relatively far from the right inverter elements S1 and S2 (see Figure 7) and the left inverter elements S3 and S4 (see Figure 7). Therefore, a relatively low-temperature cooling air is directed to the heat sink HD of the diode bridge 21, thereby promoting heat dissipation from the diode bridge 21.

[0068] Furthermore, the air passage W4 that guides the cooling air from the fan device 9 to the heat sinks H5 and H6 of the central inverter elements S5 and S6 (see Figure 7) is composed of ribs Rc and Rd, a part of the central substrate 16 (see Figure 7), and a part of the substrate cover 12. As a result, cooling air with a relatively low temperature is guided to the heat sinks H5 and H6 of the central inverter elements S5 and S6.

[0069] <Effects> According to the first embodiment, cooling air is directed to each of the right inverter elements S1, S2, left inverter elements S3, S4, middle inverter elements S5, S6, and diode bridge 21. Therefore, thermal effects between the aforementioned electronic components are suppressed, and each electronic component can be properly cooled. Consequently, the fan device 9 can be miniaturized and its power consumption reduced.

[0070] In conventional induction cookers, three or more high-heat-generating elements, such as inverter elements and diode bridges, were mounted on the circuit board in a row (for example, Patent Document 1). In such a configuration, the temperature of the cooling air rises due to heat absorption from the high-heat-generating elements, making it difficult for the high-heat-generating elements on the downwind side to dissipate heat. Also, when the power consumption of the induction cooker is high, the amount of heat generated per unit time by the diode bridge increases, so the rotation speed of the fan device may be increased to prevent insufficient cooling, which can lead to an increase in power consumption.

[0071] In contrast, in the first embodiment, only two high-heat-generating elements (e.g., right inverter elements S1, S2: see Figure 7) are needed to be mounted in a line along the direction of airflow. Therefore, even when the rotation speed of the fan device 9 is relatively low, the high-heat-generating element on the downwind side (e.g., right inverter element S2) is properly cooled. Furthermore, the pressure loss of the cooling air during the process of passing through the high-heat-generating elements is reduced, making it easier for the cooling air to flow.

[0072] Furthermore, the diode bridge 21 connected to the DC side of the right inverter circuit 23 (see Figure 8), the left inverter circuit 24, and the central inverter circuit 25 is integrated into a single (common) bridge. In addition, the grounded busbar (wiring 30b in Figure 8, etc.) is common, which reduces the area of ​​the left and right circuit boards 15, and consequently makes the induction heating cooker 100 more compact.

[0073] Furthermore, since the central inverter elements S5 and S6 are mounted on the central substrate 16, they are relatively far from the diode bridge 21 mounted on the left and right substrates 15. Therefore, there is almost no thermal influence between the central inverter elements S5 and S6 and the diode bridge 21, and the central inverter elements S5 and S6 can be efficiently cooled by the cooling air. Also, for example, when a radiant heater is used instead of the central heating coil 8, the substrate base 14 (see Figure 3) and the central substrate 16 (see Figure 3) can be omitted, and the left and right substrates 15 can be used almost as is. Therefore, even if the induction heating cooker models are different, many parts can be standardized, which reduces development and manufacturing costs.

[0074] ≪Second Embodiment≫ The second embodiment is configured such that a radiant heater 40 (see Figure 11) is provided in place of the intermediate heating coil 8 (see Figure 2) described in the first embodiment. Furthermore, the second embodiment differs from the first embodiment in that the induction heating cooker 100A (see Figure 12) includes left and right substrates 15 (see Figure 12), while it does not include a central substrate 16 (see Figure 7 of the first embodiment). Other aspects are the same as the first embodiment. Therefore, the differences from the first embodiment will be explained, and the overlapping parts will be omitted.

[0075] Figure 11 is a plan view of the induction cooker 100A according to the second embodiment with the top plate removed. As shown in Figure 11, the induction cooker 100A includes a right heating coil 6 (first heating coil), a left heating coil 7 (second heating coil), a radiant heater 40, and a fan device 9.

[0076] The radiant heater 40 is a spiral-shaped heating element (for example, a nichrome wire) that generates heat when an electric current flows through it. In the example shown in Figure 11, the radiant heater 40 is installed on the upper side of the substrate cover 12, at the rear center of the plan view. The radiant heater 40 is connected to predetermined electronic components mounted on the left and right substrates 15 (first substrate).

[0077] Figure 12 is a plan view of the induction heating cooker 100A, including the left and right circuit boards 15 and the fan device 9. Figure 12 differs from the configuration of the first embodiment (see Figure 7) in that the substrate base 14 and the middle substrate 16 are not provided, but otherwise (the configuration of the left and right substrates 15, etc.) is the same as the first embodiment. In the example of Figure 12, no other substrates are particularly connected to the connection parts 29 (fixing parts 29a and hooks 29b) provided on the edges of the left and right substrates 15 (first substrate). Power is supplied from the left and right substrates 15 to the radiant heater 40 via predetermined wiring, causing the radiant heater 40 to generate heat.

[0078] Furthermore, as shown in Figure 12, of the two outlets of the fan device 9, the front outlet 92h (one of the outlets) and the left outlet 93h, the cooling air blown out through the front outlet 92h (one of the outlets) is divided and directed toward the right inverter elements S1 and S2 (first inverter elements), the left inverter elements S3 and S4 (second inverter elements), and the diode bridge 21, respectively. The cooling air blown out through the left outlet 93h (the other outlet) of the fan device 9 is guided into the space G near the connection part 29, which consists of a fixed part 29a and a hook 29b.

[0079] <Effects> According to the second embodiment, even in a configuration where a radiant heater 40 is provided, high-heat generating elements such as the right inverter elements S1, S2, the left inverter elements S3, S4, and the diode bridge 21 can be appropriately cooled. Furthermore, since the induction cooker 100A only requires one left and right circuit board 15 on which the right inverter elements S1, S2, the left inverter elements S3, S4, the diode bridge 21, etc. are mounted, the induction cooker 100A can be made more compact.

[0080] Furthermore, even if, for example, a medium heating coil 8 (see Figure 2) as described in the first embodiment is provided instead of the radiant heater 40, the left and right circuit boards 15 can be used as is, thus enabling the commonality of parts between different models and reducing development and manufacturing costs.

[0081] ≪Variations≫ Although the induction heating cookers 100 and 100A according to the present invention have been described in detail in each embodiment, the present invention is not limited to these descriptions, and various modifications can be made. For example, in each embodiment, a configuration was described in which the cooling air is divided into predetermined directions using the ribs Ra~Rd (see Figure 10) of the substrate cover 12 and the partitions Rs,Rt (see Figure 10) of the substrate cover, but the configuration is not limited to this. For example, three or more outlets may be provided in the casing 9c of the fan device 9, and the cooling air may be divided into predetermined directions through these outlets.

[0082] Furthermore, the circuit configuration of the induction cooker 100 is not limited to the example shown in Figure 8, and various modifications are possible. For example, a chopper circuit (not shown) that boosts or lowers the DC voltage may be provided as appropriate. Furthermore, in the first embodiment, the induction cooker 100 (see Figure 2) was described as having a configuration comprising a right heating coil 6, a left heating coil 7, and a middle heating coil 8. However, for example, the middle heating coil 8 may be omitted.

[0083] Furthermore, in the first embodiment, a configuration was described in which the DC side of the central inverter circuit 25 (see Figure 8) is connected to a diode bridge 21 mounted on the left and right substrates 15, but the invention is not limited to this configuration. For example, another diode bridge (not shown) may be provided that is connected to the DC side of the central inverter circuit 25, and this diode bridge may be installed on the central substrate 16.

[0084] Furthermore, although each embodiment has described a configuration in which a substrate cover partition Rs is provided to separate the heat sinks H1, H2 of the right inverter elements S1, S2 (see Figure 7) from the heat sinks H3, H4 of the left inverter elements S3, S4, this substrate cover partition Rs may be omitted. In addition, the cooling air may be divided into predetermined portions on the front side (upwind side) of the high-heat generating elements such as the right inverter elements S1, S2 and the left inverter elements S3, S4.

[0085] Furthermore, although each embodiment described a configuration in which heat sinks H1 and H2 are individually installed on the right inverter elements S1 and S2, the heat sinks of the right inverter elements S1 and S2 may be shared. The same applies to the heat sinks of the left inverter elements S3 and S4 and the middle inverter elements S5 and S6. Furthermore, although each embodiment has described a configuration in which a heat sink is installed on each high-heat generating element such as the right inverter elements S1 and S2, the heat sink may be omitted as appropriate, or a predetermined heat dissipation component other than a heat sink may be installed.

[0086] Furthermore, while each embodiment has described the case in which IGBTs are used as the right inverter elements S1, S2, left inverter elements S3, S4, and middle inverter elements S5, S6, it is not limited to this. In other words, predetermined switching elements other than IGBTs may be used as each of the inverter elements. Also, multiple types of switching elements may be mixed together.

[0087] Furthermore, while each embodiment describes a case where the induction cooker 100, 100A is a built-in type IH cooking heater equipped with a grill compartment 4 (see Figure 1), it is not limited to this. In other words, each embodiment can be applied to various types of induction cookers other than built-in type IH cooking heaters.

[0088] ≪Third Embodiment≫ However, existing induction cooktops only have a single control panel, which makes them inconvenient for users. Therefore, there is a need to improve user experience by adding a touch panel control panel to induction cooktops in addition to the existing control panel. Furthermore, the dimensions of the installation space for induction cooktops in typical home kitchens are generally fixed to some extent. Therefore, induction cooktops are designed to fit within those dimensions. And induction cooktops typically have multiple heating areas. Consequently, the top plate must be allocated for these multiple heating areas.

[0089] However, in this case, if the touch panel control unit described above is provided so that it can be operated from the top plate, then when a large pot or the like is placed on the heating area and heated, the touch panel control unit must be positioned relatively close to the pot or the like. As a result, the distance from the pot or the like to the touch panel control unit tends to be short, heat is easily transferred from the pot or the like to the touch panel control unit (the corresponding part of the top plate), and there is a problem that the user who touches the top plate that has become hot to operate the control unit may become concerned about the temperature rise of the control unit (the part of the top plate above it). Furthermore, it becomes necessary to consider the heat resistance of the touch panel. Therefore, in this embodiment, even if a touch panel control unit is added, it is designed so that the user does not feel any discomfort when operating that control unit. The following explanation will be given with reference to Figures 13 to 17.

[0090] Figure 13 is an exploded perspective view of the induction cooker according to the third embodiment. Components similar to those in the first embodiment are denoted by the same reference numerals and their descriptions are omitted. As shown in Figure 13, the induction cooker 100B of the third embodiment comprises a main body 1A (housing), a top plate 2A covering the upper part of the main body 1A, heating coils (right heating coil 6, left heating coil 7, middle heating coil 8) provided inside the main body 1A, a second operation unit 41 (operation display unit) provided near the heating coils (right heating coil 6, left heating coil 7, middle heating coil 8) for operation and display, a circuit board case unit (circuit board cover 12A, circuit board base 13A, 14A) supporting a control board (left and right circuit boards 15, middle circuit board 16) that controls the heating coils (right heating coil 6, left heating coil 7, middle heating coil 8), and a fan device 9 for cooling high-heat generating elements (right inverter elements S1, S2 and left inverter elements S3, S4) provided on the control board (left and right circuit boards 15).

[0091] The main body 1A is the casing that constitutes the outer shell of the induction heating cooker 100B, and has a box-like (concave) shape with an open top. The main body 1A is composed of a partition plate 1a (bottom plate of the main body 1) which has a rectangular shape in plan view, and a side plate 1d that extends upward from the edge of the partition plate 1a. The main body 1A also has a recess 1c formed on the side where the fan device 9 is located, which is deeper than the partition plate 1a. Furthermore, the rear side plate 1d on which the recess 1c is formed has a perforated intake hole 1e for taking in cooling air.

[0092] The top plate 2A is rectangular in shape and made of glass, and is installed to cover the upper opening of the main body 1A. Three heating regions (heaters) 2c are set on the top surface of the top plate 2A. If we call the front left heating region 2L, the front right heating region 2R, and the rear center heating region 2M, then heating regions 2L and 2R are arranged side by side on the top surface of the top plate 2A, with a certain amount of space between them. Heating region 2M is located behind the midpoint between heating regions 2R and 2L, with a certain amount of space between them. Heating regions 2R, 2L, and 2M are, for example, circular, but heating regions 2R and 2L are, for example, relatively large circles of the same size, while heating region 2M is a smaller circle. The exact locations of heating areas 2R, 2L, and 2M on the top surface of top plate 2A are indicated on the top surface of top plate 2A (visible from above) using different colors, lines, etc.

[0093] Furthermore, a first operating section 31, which can be operated from the top surface of the top plate 2A, is located near the front edge when viewed from above. The first operating section 31 is a group of operation buttons that accept various operations of the main body 1A. The first operating section 31 is, for example, a group of electrostatic induction type glass touch buttons. Of course, the first operating section 31 may also be configured as a mechanical contact type switch. The first operating section 31 is, for example, a group of buttons arranged in a row in the left-right direction. Of the first operating section 31, the right heater operating section 31R, which is arranged in a row on the right side in the left-right direction, accepts various operations of the heating area 2R (corresponding to the right heating coil 6) from the user. Of the first operating section 31, the left heater operating section 31L, which is arranged in a row on the left side in the left-right direction, accepts various operations of the heating area 2L (corresponding to the left heating coil 7) from the user. Of the first control unit 31, the central heater and grill control unit 31M, which are arranged in a line in the center in the left-right direction, receive various operations of the heating area 2M (corresponding to the central heating coil 8) and various operations of the grill compartment 4 from the user. The base plates 13A and 14A are fixed to the partition plate 1a of the main body 1A.

[0094] Furthermore, a second operation unit 41 (operation display unit) is provided in the center of the top plate 2A, in the left-right direction, in front of the heating areas 2R and 2L and behind the first operation unit 31, and is operable from the top surface of the top plate 2A. The second operation unit 41 is a touch panel that accepts various operations from the user and displays various messages. For displaying messages, the second operation unit 41 may use a liquid crystal panel or an organic EL panel. Note that liquid crystal panels are more durable than organic EL panels in terms of heat resistance.

[0095] The second operation unit 41 is configured to include an operation display panel 42 that receives various operations from the user and displays various messages, and a support frame 43 that holds the operation display panel 42 and is fixed to the circuit board cover 12A. A display control board 44 (see Figures 16 and 17) that controls the operation display panel 42 is provided on the support frame 43 below the operation display panel 42.

[0096] The circuit board base 13A, which is part of the circuit board case unit, is equipped with a duct section 9e for guiding air from the intake hole 1e to the fan device 9. This duct section 9e is positioned so as to fit into the recess 1c of the main body 1A.

[0097] Furthermore, the circuit board cover 12A, which is another part of the circuit board case unit, partitions the left and right circuit boards 15 and the middle circuit board 16 from the heating coils (right heating coil 6, left heating coil 7, and middle heating coil 8) in the vertical direction. The circuit board cover 12A also has the function of forming an air passage that guides the cooling air blown out from the fan device 9 in a predetermined direction. In addition, openings 12b and 12c are formed side by side in the left-right direction in the center of the front side of the upper part of the circuit board cover 12A. These openings 12b and 12c are elongated rectangles in the left-right direction, are formed spaced apart on the left and right, and open towards the front. Below the openings 12b and 12c, the circuit board cover 12A has a wall portion 12s that separates the inside and outside of the circuit board cover 12A.

[0098] Figure 14 is a plan view of the induction cooker according to the third embodiment with the top plate removed. As shown in Figure 14, the right heating coil 6 corresponds to heating region 2R, the left heating coil 7 corresponds to heating region 2L, and the middle heating coil 8 corresponds to heating region 2M. The fan device 9 is located behind the right heating coil 6 and to the right of the middle heating coil 8.

[0099] The second operation unit 41 is located in the area between each heating region 2c (see Figure 13) and the first operation unit 31 (see Figure 13). The second operation unit 41, which is a liquid crystal touch panel type, has a receiving region 41a that accepts various operations and a non-receiving region 41b that does not accept various operations. In other words, the second operation unit 41 has a region that has the function of a touch panel and a region that does not have that function. The non-receiving region 41b, which does not have the function of a touch panel, only displays various messages. The non-receiving region 41b is located on the heating region 2R (see Figure 13), heating region 2L (see Figure 13), and heating region 2M (see Figure 13) side of the receiving region 41a. That is, as shown in Figure 14, the shortest distance from the non-receiving region 41b to the heating region 2L (see Figure 13) is shorter than the shortest distance from the receiving region 41a to the heating region 2L (see Figure 13) (the same applies to heating region 2R and heating region 2M). The shortest distance between the outermost edge of the heating area 2c (see Figure 13) closest to the second operating area 41 (heating area 2R and heating area 2L in this example) and the second operating area 41 is, for example, 40 mm to 80 mm. In other words, considering the effects of heat (such as the durability of the touch panel and the temperature sensation when the user touches the touch panel), the reception area 41a, which has the functionality of a touch panel, is positioned further away from the heating area 2c (see Figure 13) than the non-reception area 41b, which does not have that functionality.

[0100] The substrate cover 12A has protrusions 12d and 12e formed on it, which have the aforementioned openings 12b and 12c (see Figure 13). These protrusions 12d and 12e project from the back to the front in the vertical direction of the paper. The protrusions 12d and 12e are formed in a flattened rectangular tube shape in the left-right direction. The protrusions 12d and 12e are positioned with a slight gap at the rear edge of the operation display panel 42. The protrusions 12d and 12e are also positioned so as not to protrude from the left and right ends of the operation display panel 42 in the left-right direction.

[0101] Figure 15 is a cross-sectional view obtained when the material is cut along the line XV-XV in Figure 14. Note that Figure 15 is a view taken from the rear to the front, after cutting at the positions of the protrusions 12d and 12e. As shown in Figure 15, the protrusions 12d and 12e of the substrate cover 12A protrude upward toward the top plate 2A. Below the protrusions 12d and 12e, a wall portion 12s is formed, which constitutes part of the substrate cover 12A. This wall portion 12s is composed of surfaces extending in the vertical (up and down) and left and right directions. The openings 12b formed in the protrusion 12d and 12c formed in the protrusion 12e are rectangular in shape, elongated in the left and right directions.

[0102] Furthermore, the side surface 43a of the support frame 43 that supports the operation display panel 42 is located in front of the openings 12b and 12c. A through-hole 43b (opening) is formed on the side surface 43a facing the opening 12b, extending toward the operation display panel 42. The opening area A2 of this through-hole 43b is smaller than the opening area A1 of the opening 12b. In other words, the opening area A1 of the opening 12b is larger than the opening area A2 of the through-hole 43b. Note that the aforementioned through-hole 43b is not formed on the side of the side surface 43a facing the protruding portion 12e, and the entire opening 12c faces the side surface 43a.

[0103] Furthermore, an air passage R (gap) is formed between the protrusions 12d, 12e and the top plate 2A, allowing air to flow along the lower surface 2s of the top plate 2A. In this way, the air discharged from the openings 12b, 12c strikes the side surface 43a of the support frame 43, changes direction upward, and is blown onto the lower surface 2s of the top plate 2A. Then, it flows through the air passage R toward the front side in the direction perpendicular to the plane of the paper.

[0104] Figure 16 is a cross-sectional view taken along the line XVI-XVI in Figure 14. Figure 17 is a cross-sectional view taken along the line XVII-XVII in Figure 14. Note that Figure 16 is a cross-sectional view taken along the line XVI-XVI in Figure 15, and Figure 17 is a cross-sectional view taken along the line XVII-XVII in Figure 15, and both are cross-sectional views taken on the side of the protruding portion 12d. As shown in Figure 16, a base plate 13A is fixed to the main body 1A, and the left and right circuit boards 15 are supported on the base plate 13A. A wall portion 12s is formed on the circuit board cover 12A provided on the left and right circuit boards 15, to which the airflow (cooling air) from the fan device 9 hits. Above this wall portion 12s, an opening 12b is formed that opens forward. In front of the opening 12b, the side surface 43a of the support frame 43 that supports the operation display panel 42 is positioned opposite.

[0105] As a result, the cooling air from the fan device 9, which has cooled the high-heat-generating right inverter elements S1 and S2 (see Figure 12), strikes the wall portion 12s of the substrate cover 12A, as indicated by the white arrow, changes direction vertically upward, and is discharged forward from the opening 12b formed in the protrusion 12d. Since the side surface 43a of the support frame 43 is positioned opposite the opening 12b, the cooling air changes direction further upward and is blown toward the lower surface 2s of the top plate 2A. Note that the area below the front of the opening 12b is a closed space due to the opposing wall portion 12s and side surface 43a, so the cooling air discharged from the opening 12b does not flow downward. The cooling air then passes backward through the air passage R in the gap between the upper surface of the protrusion 12d and the top plate 2A, cooling the top plate 2A around the rear side of the second operating section 41. In other words, it is possible to suppress the transfer of heat from the pot on the heating regions 2R and 2L (see Figure 13) to the second operating section 41. Although not shown in the figures, the top plate 2A surrounding the rear side of the second operating section 41 is cooled by cooling air on the side of the protrusion 12e in the same manner as on the side of the protrusion 12d shown in Figure 16.

[0106] Furthermore, the support frame 43 is supported by a spring (elastic member) provided on the base plate 13A. As a result, the support frame 43 is pressed from below, causing the operation display panel 42 to be pressed against the lower surface 2s of the top plate 2A, and the second operation unit 41 is stably held within the main body 1A.

[0107] As shown in Figure 17, the substrate cover 12A has a wall portion 12s that is exposed to cooling air from the fan device 9. Above this wall portion 12s, there is an opening 12b that opens forward. In front of the opening 12b, there is a through portion 43b that penetrates the side surface 43a of the support frame 43 that supports the operation display panel 42 in the front-rear direction.

[0108] As a result, the cooling air from the fan device 9 that has cooled the high-heat-generating right inverter elements S1 and S2 (see Figure 12) hits the wall portion 12s of the substrate cover 12A, as indicated by the white arrow, changes direction upward, and is discharged forward from the opening 12b formed in the protrusion 12d. A through portion 43b formed in the support frame 43 faces a part of the front of the opening 12b, so a portion of the cooling air flows through the through portion 43b towards the operation display panel 42. In other words, a portion of the cooling air from the fan device 9 cools the operation display panel 42, thereby suppressing thermal deterioration of the operation display panel 42. Although not shown, on the side facing the protrusion 12e, the through portion 43b is not formed in the side surface 43a of the support frame 43, so that the cooling air does not flow towards the operation display panel 42. Alternatively, a configuration in which a through portion 43b is formed in the same way as on the protrusion 12d side may also be used.

[0109] As described above, the induction cooker 100B comprises a main body 1A (housing), a top plate 2A covering the top of the main body 1A, a plurality of heating coils (right heating coil 6, left heating coil 7, middle heating coil 8) provided inside the main body 1A, a second operation unit 41 (operation display unit) provided near each heating coil (right heating coil 6, left heating coil 7, middle heating coil 8) for operation (reception area 41a) and display (non-reception area 41b), a board base 13A (board case unit) supporting left and right boards 15 (control boards) that control the heating coils (right heating coil 6, left heating coil 7, middle heating coil 8), and a fan device 9 for cooling the right inverter elements S1, S2 and left inverter elements S3, S4 (high heat generation elements) provided on the left and right boards 15. The substrate cover 12A includes a wall portion 12s (wall) to which cooling air that has passed through the high-heat-generating element is directed, and openings 12b and 12c provided above the wall portion 12s that discharge cooling air toward the second operation section 41. The second operation section 41 is provided with a side surface 43a (wall surface) that guides the cooling air toward the top plate 2A. This efficiently reduces the temperature rise of the top plate 2A (heating section side) near the second operation section 41 due to heat transfer from the pot to the top plate 2A during heating, and provides an induction heating cooker 100B with high cooling performance.

[0110] Furthermore, in the induction cooker 100B, the second operating section 41 includes an operation display panel 42 provided along the lower surface 2s of the top plate 2A, and a support frame 43 that supports the operation display panel 42. The support frame 43 is provided with a through section 43b (opening) that directs (guides) the cooling air discharged from the openings 12b and 12c toward the operation display panel 42. This suppresses deterioration of the operation display panel 42.

[0111] Furthermore, in the induction cooker 100B, the opening area A1 of the openings 12b and 12c is formed to be larger than the opening area A2 of the through-hole 43b. This allows for a larger volume of cooling air to be directed toward the top plate 2A, ensuring that the top plate 2A (heating section side) near the second operating section 41 is reliably cooled.

[0112] Furthermore, in the induction heating cooker 100B, a non-receiving area 41b (display area) of the operation display panel 42 is provided between the operation display panel 42 and the openings 12b and 12c. This allows the receiving area 41a (operation area surface) of the operation display panel 42 to be separated from the heating coils (right heating coil 6, left heating coil 7, and center heating coil 8), thereby suppressing the temperature rise of the receiving area 41a of the operation display panel 42.

[0113] Furthermore, in the induction cooker 100B, the substrate cover 12A has protrusions 12d and 12e above the wall portion 12s toward the top plate 2A. Openings 12b and 12c are formed in the protrusions 12d and 12e, and an air passage R is formed between the protrusions 12d and 12e and the top plate 2A to guide cooling air toward the heating coils (right heating coil 6, left heating coil 7, and middle heating coil 8). As a result, the cooling air flows toward the reception area 41a (operation section, operation area surface) on the front side of the operation display panel 42, and the temperature rise on the heating section side of the top plate 2A near the second operation section 41 can be suppressed over a wide area.

[0114] Furthermore, the embodiments are described in detail to clearly explain the present invention and are not necessarily limited to those comprising all the configurations described. In addition, it is possible to add, delete, or replace some of the configurations in the embodiments with other configurations. Furthermore, the mechanisms and configurations described above are those deemed necessary for explanatory purposes and do not necessarily represent all of the mechanisms and configurations shown in the actual product. [Explanation of Symbols]

[0115] 1A Main unit (casing) 2A Top Plate 2s bottom side 6. Right heating coil (heating coil) 7. Left heating coil (heating coil) 8. Medium heating coil (heating coil) 9. Fan device 12A Circuit Board Cover (Circuit Board Case Unit) 12b,12c opening 12d,12e Projection 12s Wall section (wall) 13A PCB mount (PCB case unit) 15 Left and right circuit boards (control boards) 16 Middle board (control board) 31 1st operation section 41. Second control unit (operation display unit) 42 Operation display panel 43 Support frame 43a Side (Wall) 43b Penetration (opening) 44 Display control board 100B induction heating cooker A1 Opening area (opening area of ​​the opening) A2 Opening area (opening area of ​​the opening) R wind path

Claims

1. The casing and A top plate covering the upper part of the aforementioned housing, Multiple heating coils provided within the housing, An operation and display unit is provided near the heating coil for operation and display, A circuit board case unit that supports a control board for controlling the heating coil, The control board is equipped with a fan device for cooling a high-heat generating element, The substrate case unit comprises a wall to which cooling air that has passed through the high-heat-generating element is directed, an opening provided above this wall for discharging the cooling air toward the operation display unit, and a protruding portion that extends toward the top plate. The operation display unit is provided with a wall surface that guides the cooling air toward the top plate. An induction cooker characterized in that the protruding portion has the opening formed therein, and an air passage is formed between the protruding portion and the top plate to guide the cooling air toward the heating coil.

2. The casing and A top plate covering the upper part of the aforementioned housing, Multiple heating coils provided within the housing, An operation and display unit is provided near the heating coil for operation and display, A circuit board case unit that supports a control board for controlling the heating coil, The control board is equipped with a fan device for cooling a high-heat generating element, The substrate case unit comprises a wall to which cooling air that has passed through the high-heat-generating element is directed, and an opening provided above this wall for discharging the cooling air toward the operation display unit. The operation display unit comprises a wall surface that guides the cooling air toward the top plate, an operation display panel provided along the lower surface of the top plate, and a support frame that supports the operation display panel. The induction heating cooker is characterized in that the support frame has an opening that guides the cooling air discharged from the opening toward the operation display panel.

3. The induction heating cooker according to claim 2, characterized in that the opening area of ​​the opening is larger than the opening area of ​​the opening.

4. The induction heating cooker according to claim 2, characterized in that a display portion of the operation display panel is provided between the operation display panel and the opening.

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