Electronic components

Abstract

A switch (1) comprises: a case (10); a movable contact member (20) disposed on the case (10); a fixed contact member (30) having a portion thereof embedded in the case (10); and a solder member (40) provided to the fixed contact member (30). The fixed contact member (30) has: a contact part (31) that is provided so as to be able to contact the movable contact member (20); and a terminal part (33) that is electrically connected to the contact part (31) and is exposed from the case (10). The solder member (40) has a joined portions (j) joined to the terminal part (33), and non-joined portions (nj) not joined to the terminal part (33).

Description

Technical Field

[0001] This disclosure relates to Electronic components used in electronic devices.

Background Art

[0002] For example, electronic components such as switches are mounted on a circuit board or the like by soldering. As an example of this type of electronic component, Patent Document 1 discloses an electronic component having preliminary solder formed on an external terminal. According to this electronic component, it is possible to suppress a shortage of the amount of solder when joining the external terminal and the circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the electronic component described in Patent Document 1, when forming the preliminary solder on the external terminal, the entire solder material is melted to form the preliminary solder. When the entire solder material is melted, the quality of the entire solder material changes, and the connection reliability during mounting may decrease.

[0005] In view of the above, this disclosure aims to Electronic components suppress a decrease in connection reliability during mounting.

Means for Solving the Problems

[0006] According to one aspect of this disclosure Electronic components is provided with Terminal portion, and the terminal portion a solder member provided on before The solder member has a joined portion joined to the terminal portion and a non-joined portion not joined to the terminal portion. [Effects of the Invention]

[0007] This disclosure Electronic components According to this, it is possible to suppress the decrease in connection reliability during implementation. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is an exploded perspective view of the switch according to Embodiment 1. [Figure 2] Figure 2 is a top view of the switch according to Embodiment 1. [Figure 3] Figure 3 is a bottom view of the switch according to Embodiment 1. [Figure 4] Figure 4 is a cross-sectional perspective view of a part of the switch according to Embodiment 1, viewed from an oblique direction on the bottom side. [Figure 5] Figure 5 is an enlarged view of a part of the switch according to Embodiment 1, seen from the side. [Figure 6] Figure 6 is an enlarged view of the soldering member of the switch according to Embodiment 1. [Figure 7] Figure 7 shows another example of a soldering component. [Figure 8] Figure 8 is a flowchart showing the method for manufacturing a switch according to Embodiment 1. [Figure 9] Figure 9 shows the steps for joining solder components. [Figure 10] Figure 10 is a cross-sectional image showing an example of joining the terminal portion of a switch to a soldering component. [Figure 11] Figure 11 is a cross-sectional image showing another example of joining the terminal portion of the switch to a soldering component. [Figure 12] Figure 12 is an enlarged view of the soldering member of the switch according to a modified example of Embodiment 1. [Figure 13] Figure 13 is a bottom view of the switch according to Embodiment 2. [Figure 14] Figure 14 is a bottom view of the fixed contact member of the switch according to Embodiment 2. [Figure 15]FIG. 15 is a perspective view showing a terminal portion and a solder member of the switch according to Embodiment 2. [Figure 16] FIG. 16 is a view showing a state in which the solder member is separated from the terminal portion of Embodiment 2. [Figure 17] FIG. 1 is a schematic view showing a cross section of a state in which the solder member is temporarily fixed to the terminal portion of Embodiment 2. [Figure 18] FIG. 18 is a view showing a state in which the solder member is joined to the terminal portion after being temporarily fixed to the terminal portion. [Figure 19] FIG. 19 is a bottom view of the switch according to Modification 1 of Embodiment 2. [Figure 20] FIG. 20 is a bottom view of the fixed contact member of the switch according to Modification 1 of Embodiment 2. [Figure 21] FIG. 21 is a view showing a state in which the solder member is separated from the terminal portion of the switch of Modification 1 of Embodiment 2. [Figure 22] FIG. 22 is a view showing a state in which the solder member is separated from the terminal portion of Modification 2 of Embodiment 2. [Figure 23] FIG. 23 is a schematic view showing a cross section of a state in which the solder member is temporarily fixed to the terminal portion of Modification 2 of Embodiment 2. [Figure 24] FIG. 24 is a view showing a state in which the solder member is separated from the terminal portion of the switch according to Modification 3 of Embodiment 2. [Figure 25] FIG. 25 is a schematic view showing a cross section of a state in which the solder member is temporarily fixed to the terminal portion of the switch according to Modification 3 of Embodiment 2. [Figure 26] FIG. 26 is a bottom view of the switch according to Embodiment 3. [Figure 27] FIG. 27 is a bottom view of the fixed contact member of the switch according to Embodiment 3. [Figure 28] FIG. 28 is a cross-sectional view showing the terminal portion and the solder member of the switch according to Embodiment 3. [Figure 29] FIG. 29 is a view showing a state in which the solder member is separated from the terminal portion of Embodiment 3. [Figure 30]Figure 30 shows an example of a recess in the terminal portion of Embodiment 3. [Figure 31] Figure 31 is an image showing another example of the recessed portion of the terminal portion in Embodiment 3. [Figure 32] Figure 32 is a bottom view of the switch according to Embodiment 4. [Figure 33] Figure 33 is a bottom view of the fixed contact member of the switch according to Embodiment 4. [Figure 34] Figure 34 is a cross-sectional view of the terminal portion and soldering member of Embodiment 4. [Figure 35] Figure 35 is an image of the plating layer of the terminal portion of Embodiment 4. [Modes for carrying out the invention]

[0009] (Background leading to this disclosure) Switches used in electronic devices are mounted on circuit boards and other components using solder. Recently, in line with Business Continuity Plans (BCPs), supply chains are being restructured, and this restructuring, including the solder material supply chain, is also being considered for switches.

[0010] One example of an electronic component mounted on a circuit board is an electronic component with pre-soldered external terminals. This component allows for the addition of solder to the external terminals when joining them to the circuit board. However, in this electronic component, a large amount of heat must be applied to the entire solder material to melt it when forming the pre-solder on the external terminals. When the entire solder material melts, the overall quality of the solder material after solidification changes, which can reduce the reliability of the connection during mounting.

[0011] In contrast, the switch of this disclosure has the following configuration in order to suppress a decrease in connection reliability during implementation.

[0012] The embodiments will be described in detail below with reference to the drawings.

[0013] The embodiments described below are all specific examples of this disclosure. The numerical values, shapes, materials, components, arrangement positions of components, connection configurations, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, any components in the following embodiments that are not described in an independent claim will be described as optional components.

[0014] Furthermore, each diagram shows the X, Y, and Z axes, representing three mutually orthogonal directions, and these axes are used for explanatory purposes as needed. Each axis is included for explanatory purposes and does not limit the direction or orientation of the switch.

[0015] (Embodiment 1) [Switch Configuration] The switch according to Embodiment 1 will be described with reference to Figures 1 to 7.

[0016] Figure 1 is an exploded perspective view of switch 1 according to Embodiment 1. Figure 2 is a top view of switch 1. Figure 3 is a bottom view of switch 1. Figure 4 is a cross-sectional perspective view of a part of switch 1 viewed from an oblique direction on the bottom surface 12 side.

[0017] Figure 1 shows the case 10, the first fixed contact member 30a, and the second fixed contact member 30b integrated together. Figure 2(a) shows the switch 1 as viewed from the top surface 11. Figure 2(b) shows the state in which the protective sheet 60, the pressing member 50, and the movable contact member 20 have been removed from Figure 2(a). Figure 2(c) shows the first fixed contact member 30a and the second fixed contact member 30b, and shows the state in which the case 10 has been removed from Figure 2(b). Also, the movable contact member 20 is not shown in Figure 4.

[0018] As shown in Figures 1 and 2, the switch 1 comprises a case 10, a movable contact member 20, a first fixed contact member 30a and a second fixed contact member 30b, a protective sheet 60, and a pressing member 50. Furthermore, as shown in Figures 1 and 3, the switch 1 also includes a soldering member 40.

[0019] The case 10 is a base component of the switch 1 and is formed of, for example, an insulating resin material. The case 10 has a rectangular parallelepiped case body 16 and an annular projection 17.

[0020] The case 10 also has a top surface 11, a bottom surface 12, and several side surfaces 13. The top surface 11 is located on the protruding end surface of the protruding portion 17. The bottom surface 12 is an end surface of the case body 16, located on the end surface opposite to the surface on which the protruding portion 17 is provided. The side surfaces 13 are located on the lateral end surfaces of the case body 16.

[0021] As shown in Figures 3 and 4, the case 10 has a plurality of recesses 14 that curve downward from the bottom surface 12 toward the top surface 11. Each recess 14 is formed by a recessed bottom surface 14a parallel to the bottom surface 12 and a recessed side surface 14b parallel to the side surface 13.

[0022] As shown in Figure 1, the protrusion 17 protrudes from the surface of the case body 16 that is facing away from the bottom surface 12. An opening is formed in the protruding end surface of the protrusion 17. That is, the case 10 has a recess 18 that is recessed toward the bottom surface 12 side from the protruding end surface of the protrusion 17.

[0023] The movable contact member 20 is positioned in the recess 18 of the case 10. The movable contact member 20 has a dome-shaped curved form and is formed from, for example, multiple elastic metal sheets. A layer of highly conductive metal material may be formed on the bottom surface of the movable contact member 20. Figure 1 shows an example in which the movable contact member 20 is composed of three layers of metal sheets, but the movable contact member 20 may be composed of one layer of metal sheet.

[0024] The movable contact member 20 is a member for electrically connecting or disconnecting the first fixed contact member 30a and the second fixed contact member 30b. For example, the outer end of the movable contact member 20 is in electrical contact with the first fixed contact member 30a, and the central part is in electrical contact with the second fixed contact member 30b when the movable contact member 20 is pressed toward the bottom surface 12. When the movable contact member 20 is not pressed, the central part and the second fixed contact member 30b do not come into contact, and a space is formed between the central part and the second fixed contact member 30b.

[0025] The protective sheet 60 is provided on the protruding portion 17 of the case 10 so as to cover the movable contact member 20. The protective sheet 60 is made of, for example, a flexible insulating film. The pressing member 50 is positioned in the center of the movable contact member 20 and is sandwiched between the movable contact member 20 and the protective sheet 60. The pressing member 50 is made of, for example, an insulating resin material.

[0026] The first fixed contact member 30a shown in Figures 2(b) and 2(c) is a member that makes electrical contact with the outer end of the movable contact member 20. The second fixed contact member 30b is a member that makes electrical contact with the central part of the movable contact member 20. The first fixed contact member 30a and the second fixed contact member 30b are formed from, for example, a metal material and are insert-molded together with the case 10. Hereafter, the term "fixed contact member 30" may refer to either or both of the first fixed contact member 30a and the second fixed contact member 30b.

[0027] As shown in Figure 4, the fixed contact member 30 has a contact portion 31, an embedded portion 32, and a plurality of terminal portions 33. The contact portion 31, the embedded portion 32, and the plurality of terminal portions 33 are made of a single metal material and are electrically connected to each other.

[0028] The contact portion 31 is exposed in the recess 18 of the case 10 and is capable of contacting the movable contact member 20. The embedded portion 32 is embedded in the case 10.

[0029] Each of the multiple terminal portions 33 is exposed in the region of the case 10 where the recess portion 14 is provided. Specifically, the terminal portion 33 protrudes laterally from the recess side surface 14b and is exposed from the case 10 in contact with the recess bottom surface 14a. The thickness of the terminal portion 33 is smaller than the depth of the recess bottom surface 14a, and the terminal bottom surface 33a, which is the bottom surface of the terminal portion 33, is located in the direction toward the top surface 11 (i.e., toward the recess bottom surface 14a) than the bottom surface 12. The terminal bottom surface 33a is the surface facing the solder member 40, and is formed with plating layers such as Ni plating and Au plating.

[0030] The switch 1 of this embodiment has a structure in which a soldering member 40 is fixed to the terminal portion 33 described above.

[0031] Figure 5 is an enlarged view of a part of switch 1 seen from the side. Figure 6 is an enlarged view of the soldering component 40 of switch 1.

[0032] In Figure 6, hatching is applied only to the soldering member 40. Figure 6(b) shows a view of the soldering member 40 from the bottom surface 12 side. Figure 6(a) shows a cross-sectional view taken along the line VIa-VIa in Figure 6(b). In addition, in Figure 6(a), regions 41a and 41b, which will be described later, are indicated by the arrows, and the first region 42a and second region 42b, which will be described later, are indicated by the curly braces.

[0033] As shown in Figures 5 and 6, the soldering member 40 is provided on the terminal portion 33 of the fixed contact member 30. The soldering member 40 is a plate-shaped or sheet-shaped member having a predetermined thickness. The thickness of the soldering member 40 is, for example, 0.05 mm or more and 0.1 mm or less. Also, when many are provided in a narrow area, it may be, for example, 0.5 mm or more and 1 mm or less. When viewed from the bottom surface 12 side, the soldering member 40 has a rectangular shape. The soldering member 40 is formed from materials such as Sn, Ag, and Cu. Note that other materials may be added to the soldering member 40.

[0034] As shown in Figure 6(a), a portion of the solder member 40 is soldered to the terminal portion 33. That is, the solder member 40 has a joined portion j that is joined to the terminal portion 33 and a non-joined portion nj that is not joined to the terminal portion 33. In Figure 6, four circular joined portions j are shown by hatched dots, and the non-joined portion nj is shown by diagonal hatching. Although Figure 6 shows an example in which the solder member 40 has multiple joined portions j, the number of joined portions j is not limited to multiple and may be one. This joined portion j can be formed, for example, by laser processing.

[0035] As shown in Figure 6(b), the soldering member 40 has a smaller area than the terminal portion 33. Furthermore, the soldering member 40 is positioned so that its side surface is located inward from the side surface of the terminal portion 33, so that it does not protrude beyond the terminal portion 33.

[0036] Furthermore, the area of ​​the non-jointed portion nj of the solder member 40 is larger than the area of ​​the multiple jointed portions j. In other words, the area of ​​the multiple jointed portions j is smaller than the area of ​​the non-jointed portion nj. The total area of ​​the multiple jointed portions j is, for example, 0.05 times or more and 0.5 times or less than the area of ​​the non-jointed portion nj.

[0037] As shown in Figure 6(a), the joint portion j has an alloy layer ja in contact with the terminal portion 33. In Figure 6(a), the alloy layer ja is shown with cross-hatching. The alloy layer ja is formed from the metal material of the solder member 40 and the metal material of the terminal portion 33. For example, if the solder member 40 contains Sn and the surface of the terminal portion 33 is made of Au plating, the alloy layer ja contains an AuSn alloy. Note that in the joint portion j, the area other than the alloy layer ja is an area that does not contain the AuSn alloy. The thickness of the alloy layer ja is sufficiently thinner than the thickness of the area that does not contain the AuSn alloy, for example, 10 μm to 100 μm.

[0038] The soldering member 40 has a first surface 41 facing the terminal portion 33 and a second surface 42 located opposite the first surface 41. The soldering member 40 is positioned such that the first surface 41 is located towards the top surface 11 rather than the bottom surface 12 of the case 10, and the second surface 42 is located in a direction that protrudes beyond the bottom surface 12 of the case 10. In other words, a part of the soldering member 40 protrudes outward from the bottom surface 12 of the case 10.

[0039] Of the first surface 41, the region 41a included in the joint portion j is joined to the terminal portion 33, while the region 41b included in the non-joined portion nj is not joined to the terminal portion 33. A gap g is formed between the region 41b included in the non-joined portion nj and the terminal portion 33. The dimensions of the gap g are, for example, 1 μm or more and 100 μm or more. Note that the gap g does not need to be provided in the entire region 41b, but may be provided in a part of region 41b. In other words, as long as the non-joined portion nj is not joined to the terminal portion 33, a part of the non-joined portion nj may be in contact with the terminal portion 33.

[0040] The second surface 42 has a first region 42a included in the jointed portion j and a second region 42b included in the non-joined portion nj. Multiple first regions 42a are provided depending on the number of jointed portions j. The first region 42a is the region irradiated with laser light, and a joint mark is formed thereon. The second region 42b is the region not irradiated with laser light, and no joint mark is formed thereon. The second region 42b is flatter than the first region 42a; for example, the surface roughness of the second region 42b is smaller than the surface roughness of the first region 42a.

[0041] Figure 7 shows another example of the soldering member 40. In Figure 7, only the soldering member 40 is hatched. Figure 7(b) shows the soldering member 40 as seen from the bottom surface 12 side. Figure 7(a) shows a cross-sectional view taken along the line VIIa-VIIa in Figure 7(b).

[0042] As shown in Figure 7(b), each of the multiple first regions 42a has an elliptical or elongated hole shape. For example, when the soldering member 40 is viewed from a direction perpendicular to the second surface 42, each of the multiple first regions 42a is provided along the short side of the rectangular soldering member 40. A portion of the second region 42b is provided between the multiple first regions 42a. In this case as well, it is desirable that the area of ​​the second region 42b is larger than the area of ​​the multiple first regions 42a.

[0043] Thus, in the switch 1 of this embodiment, the solder member 40 has a joint portion j that is joined to the terminal portion 33 and a non-joint portion nj that is not joined to the terminal portion 33. With this configuration, when providing the solder member 40 to the terminal portion 33, it is not necessary to melt the entire solder material, but only to melt a part of it, so that the overall quality of the solder material does not change. This makes it possible to suppress a decrease in connection reliability during mounting.

[0044] [How to manufacture a switch] A method for manufacturing the switch 1 having the above configuration will be described with reference to Figures 8 and 9.

[0045] Figure 8 is a flowchart showing the manufacturing method of switch 1. Figure 9 shows the steps for joining the soldering components 40.

[0046] As shown in Figure 8, the manufacturing method of the switch 1 includes the step S11 of forming the fixed contact member 30, the step S12 of resin molding the case 10, the step S13 of attaching the movable contact member 20, and the step S14 of joining the solder member 40.

[0047] In step S11, the fixed contact member 30 is formed by punching and bending the metal plate. Before punching and bending, the front and back surfaces of the metal plate may be plated with metal. In addition, the front surface of the portion that will become the terminal part 33 of the fixed contact member 30, that is, the surface that contacts the bottom surface 14a of the recess of the case 10, may be sandblasted.

[0048] In step S12, the case 10 is molded from resin. Specifically, insert molding is performed by inserting the fixed contact member 30 into the mold and then filling the mold with resin. This creates an intermediate product comprising the case 10 and the fixed contact member 30 having a contact portion 31, an embedded portion 32, and a terminal portion 33.

[0049] In step S13, the movable contact member 20 is attached to the intermediate product described above. Specifically, the movable contact member 20 and the pressing member 50 are placed in the recess 18 of the case 10, and a protective sheet 60 is provided on the protruding part 17 to cover them. The protective sheet 60 is bonded to the top surface 11 of the case 10 with adhesive.

[0050] In step S14, the solder member 40 is joined to the terminal portion 33. For example, as shown in Figure 9, with the bottom surface 12 of the case 10 facing upwards and the top surface 11 facing downwards, the solder member 40, which is made of rolled material, is placed on the terminal portion 33. Then, with the solder member 40 in contact with the terminal portion 33, a laser beam L is irradiated onto a part of the solder member 40, and the solder member 40 is soldered to the terminal portion 33. This soldering is performed instantaneously, for example, by an infrared laser. As a result, the solder member 40 has a joint portion j where the solder member 40 melts and joins with the terminal portion 33, and a non-joined portion nj where the solder member 40 does not melt and is not joined with the terminal portion 33. The joint portion j is formed, for example, by scanning with the laser beam L. In addition, multiple joint portions j are formed on the solder member 40.

[0051] Multiple bonding sites j may be formed by simultaneously irradiating multiple regions with laser light L, or by irradiating them individually with laser light L at different times. Figure 9 shows an example where the laser light L is scanned in the X direction, but the laser light L may also be scanned in the Y direction. Step S14 may be performed before step S13, as long as it is performed after step S12.

[0052] By these steps S11 to S14, a switch 1 having the configuration described above is manufactured. This makes it possible to provide a switch 1 with the solder member 40 temporarily fixed. For example, conventionally, when mounting the switch 1 to a circuit board, it is necessary to form solder paste on the circuit board in advance. However, with the switch 1 of this embodiment, it is possible to mount the switch 1 without any solder paste on the circuit board, or with a reduced amount of solder paste formed on the circuit board.

[0053] Next, an example of joining the terminal portion 33 of switch 1 to the soldering member 40 will be described.

[0054] Figure 10 is a cross-sectional image showing an example of joining the terminal portion 33 of switch 1 and the solder member 40. Figure 10 shows a cross-sectional image when the solder member 40 is placed on the terminal portion 33 of switch 1 and a laser beam L is irradiated while scanning horizontally, thereby joining the terminal portion 33 and the solder member 40. In this example, the cross-sectional image was taken for a switch of a type in which there is a gap between the terminal portion 33 and the recessed bottom surface 14a of the case 10. As shown in the figure, the solder member 40 has a joined portion j where the solder member 40 has melted and joined to the terminal portion 33, and a non-joined portion nj where the solder member 40 has not melted and is not joined to the terminal portion 33. In addition, an alloy layer ja is formed at the joined portion j.

[0055] Figure 11 is a cross-sectional image showing another example of joining the terminal portion 33 of switch 1 and the solder member 40. Figure 11 shows a cross-sectional image when the solder member 40 is placed on the terminal portion 33 of switch 1 and laser light L is shone at three spots to join the terminal portion 33 and the solder member 40. As shown in the figure, the solder member 40 has a joined portion j where the solder member 40 has melted and joined to the terminal portion 33, and a non-joined portion nj where the solder member 40 has not melted and is not joined to the terminal portion 33. In addition, an alloy layer ja is formed at the joined portion j.

[0056] [Modified example of Embodiment 1] A modified example of the switch 1 according to Embodiment 1 will be described. In this modified example, the non-jointed portion nj of the solder member 40A is in contact with the terminal portion 33.

[0057] Figure 12 is an enlarged view of the soldering member 40A of the switch 1 according to a modified example.

[0058] The soldering member 40A is provided on the terminal portion 33 of the fixed contact member 30. The soldering member 40A is a plate-shaped or sheet-shaped member having a predetermined thickness. When viewed from the bottom surface 12 side, the soldering member 40A has a rectangular shape.

[0059] A portion of the soldering member 40A is soldered to the terminal portion 33. That is, the soldering member 40A has a joined portion j that is joined to the terminal portion 33 and an unjoined portion nj that is not joined to the terminal portion 33. The area of ​​the unjoined portion nj of the soldering member 40A is larger than the area of ​​the multiple joined portions j.

[0060] The joint portion j has an alloy layer ja in contact with the terminal portion 33. The alloy layer ja is formed from the metal material of the solder member 40A and the metal material of the terminal portion 33. The thickness of the alloy layer ja is, for example, 10 μm or more and 100 μm or less.

[0061] The soldering member 40A has a first surface 41 facing the terminal portion 33 and a second surface 42 located opposite the first surface 41. Of the first surface 41, the region 41a included in the joining portion j is joined to the terminal portion 33, while the region 41b included in the non-joining portion nj is not joined to the terminal portion 33. In the modified example, the region 41b included in the non-joining portion nj is in contact with the terminal portion 33. A gap g may be formed in a portion of the area between region 41b and the terminal portion 33.

[0062] The second surface 42 has a first region 42a included in the jointed area j and a second region 42b included in the non-joined area nj. The first region 42a is the area irradiated with laser light L, and a joint mark is formed there. The second region 42b is the area not irradiated with laser light L, and no joint mark is formed there. On the second surface 42, the first region 42a bulges in the opposite direction to the first surface 41 than the second region 42b. In other words, the first region 42a bulges in the opposite direction to the top surface 11.

[0063] Furthermore, the first region 42a on the second surface 42 is not necessarily larger than the second region 42b. For example, the first region 42a may be at the same height as the second region 42b. Also, the first region 42a may be slightly recessed towards the first surface 41 than the second region 42b.

[0064] Thus, even in the modified switch 1, the solder member 40A has a joint portion j that is joined to the terminal portion 33 and a non-joint portion nj that is not joined to the terminal portion 33. With this configuration, when providing the solder member 40A to the terminal portion 33, it is not necessary to melt the entire solder material, but only to melt a part of it, so that the overall quality of the solder material does not change. This makes it possible to suppress a decrease in connection reliability during mounting.

[0065] (Summary of Embodiment 1) As described above, the switch 1 according to this embodiment comprises a case 10, a movable contact member 20 disposed in the case 10, a fixed contact member 30 with a portion embedded in the case 10, and a soldering member 40 provided on the fixed contact member 30. The fixed contact member 30 has a contact portion 31 that is in contact with the movable contact member 20, and a terminal portion 33 that is electrically connected to the contact portion 31 and exposed from the case 10. The soldering member 40 has a joint portion j that is joined to the terminal portion 33 and a non-joint portion nj that is not joined to the terminal portion 33.

[0066] By configuring the solder member 40 to have a joint portion j and a non-joined portion nj in this way, it becomes unnecessary to melt the entire solder material when applying the solder member 40 to the terminal portion 33. Therefore, it is possible to suppress changes in the overall quality of the solder material. This makes it possible to suppress a decrease in connection reliability during mounting.

[0067] Furthermore, the area of ​​the non-jointed portion nj may be larger than the area of ​​the jointed portion j.

[0068] According to this, when providing the solder member 40 to the terminal portion 33, it is possible to increase the portion of the solder material that does not melt compared to the portion where the solder material melts. Therefore, it is possible to increase the portion of the solder member 40 in which the quality of the solder material does not change. This makes it possible to suppress a decrease in connection reliability during mounting.

[0069] Furthermore, a gap g may be formed between the non-jointed portion nj and the terminal portion 33.

[0070] The formation of this gap g ensures the reliable creation of non-joint areas nj where the solder material does not melt. This prevents changes in the overall quality of the solder material, thereby preventing a decrease in connection reliability during assembly.

[0071] Furthermore, the joint portion j has an alloy layer ja in contact with the terminal portion 33, and the alloy layer ja may be formed from the metal material of the solder member 40 and the metal material of the terminal portion 33.

[0072] According to this, the joint portion j can be firmly joined to the terminal portion 33. This suppresses a decrease in connection reliability during mounting.

[0073] Furthermore, the soldering member 40 has a first surface 41 facing the terminal portion 33 and a second surface 42 located opposite the first surface 41. The second surface 42 has a first region 42a included in the joining portion j and a second region 42b included in the non-joining portion nj. On the second surface 42, the second region 42b may be flatter than the first region 42a.

[0074] Thus, because the second region 42b is flat, for example, when the soldering member 40 is brought into contact with the circuit board during mounting, the switch 1 can be maintained in a predetermined position. This helps to suppress a decrease in connection reliability during mounting.

[0075] Furthermore, the soldering member 40A has a first surface 41 facing the terminal portion 33 and a second surface 42 located opposite the first surface 41. The second surface 42 has a first region 42a included in the joint portion j and a second region 42b included in the non-joined portion nj. On the second surface 42, the first region 42a may bulge out in the opposite direction to the first surface 41 compared to the second region 42b.

[0076] In this way, the bulge in the first region 42a allows visual confirmation that the soldering member 40A is fixed to the terminal portion 33. This helps to suppress a decrease in connection reliability during mounting.

[0077] Furthermore, the soldering member 40 may have multiple joining portions j, and the second surface 42 of the soldering member 40 may have multiple first regions 42a.

[0078] In this way, having multiple joints j in the solder member 40 prevents the solder member 40 from detaching from the terminal portion 33 when, for example, an external force in the rotational direction is applied to the solder member 40. This prevents a decrease in connection reliability during mounting.

[0079] Furthermore, the soldering member 40 is rectangular when viewed from a direction perpendicular to the second surface 42, and each of the multiple first regions 42a may be provided along the short side of the rectangular soldering member 40.

[0080] In this way, by providing the first region 42a along the short side direction of the solder member 40, it is possible to prevent the solder member 40 from detaching from the terminal portion 33 when, for example, an external force in the rotational direction is applied to the solder member 40. This prevents a decrease in connection reliability during mounting.

[0081] Furthermore, the case 10 has a top surface 11, a bottom surface 12, and a recessed bottom surface 14a located on the top surface 11 side of the bottom surface 12. The terminal portion 33 is exposed from the case 10 in contact with the recessed bottom surface 14a, and the terminal bottom surface 33a, which is the bottom surface of the terminal portion 33, may be located in a direction toward the top surface 11 side of the bottom surface 12.

[0082] According to this, after implementation, the bottom surface 12 of the case 10 can be in contact with the circuit board. Therefore, even when a pressing force is applied to the switch 1, it is possible to suppress the load on the solder joint between the terminal portion 33 and the circuit board. This suppresses a decrease in connection reliability after implementation.

[0083] Furthermore, the soldering member 40 may be positioned such that the first surface 41 is located towards the top surface 11 of the case 10 rather than the bottom surface 12, and the second surface 42 is located in a direction that protrudes beyond the bottom surface 12 of the case 10.

[0084] In this way, because the second surface 42 of the soldering member 40 protrudes beyond the bottom surface 12, the soldering member 40 can be brought into contact with the circuit board during mounting, and the soldering material can be melted while in contact. Furthermore, the thickness of the soldering member 40 can be increased, ensuring that the necessary amount of solder is secured during mounting. This helps to suppress a decrease in connection reliability during mounting.

[0085] In other words, the switch of this disclosure has the following characteristics:

[0086] (Aspect 1) A switch comprising a case, a movable contact member disposed in the case, a fixed contact member partially embedded in the case, and a soldering member provided on the fixed contact member, wherein the fixed contact member has a contact portion provided to be in contact with the movable contact member and a terminal portion that is electrically connected to the contact portion and exposed from the case, and the soldering member has a joint portion joined to the terminal portion and a non-joint portion not joined to the terminal portion.

[0087] (Aspect 2) The switch according to embodiment 1, wherein the area of ​​the non-jointed portion is larger than the area of ​​the jointed portion.

[0088] (Aspect 3) A switch according to embodiment 1 or 2, wherein a gap is formed between the non-jointed portion and the terminal portion.

[0089] (Aspect 4) The switch according to any one of embodiments 1 to 3, wherein the joint portion has an alloy layer in contact with the terminal portion, and the alloy layer is formed of the metal material of the soldering member and the metal material of the terminal portion.

[0090] (Appendix 5) The soldering member has a first surface facing the terminal portion and a second surface located opposite the first surface, the second surface has a first region included in the joining portion and a second region included in the non-joining portion, and on the second surface, the second region is flatter than the first region, the switch according to any one of embodiments 1 to 4.

[0091] (Aspect 6) The soldering member has a first surface facing the terminal portion and a second surface located opposite the first surface, the second surface has a first region included in the joining portion and a second region included in the non-joining portion, and on the second surface, the first region bulges out in the direction opposite to the first surface compared to the second region, the switch according to any one of embodiments 1 to 4.

[0092] (Aspect 7) The switch according to embodiment 5 or 6, wherein the soldering member has a plurality of joint portions, and the second surface of the soldering member has a plurality of first regions.

[0093] (Pattern 8) The switch according to embodiment 7, wherein the soldering member is rectangular when viewed from a direction perpendicular to the second surface, and each of the plurality of first regions is provided along the short side of the rectangular soldering member.

[0094] (Aspect 9) The switch according to any one of embodiments 5 to 8, wherein the case has a top surface, a bottom surface, and a recessed bottom surface located on the top surface side of the bottom surface, the terminal portion is exposed from the case in contact with the recessed bottom surface, and the terminal bottom surface, which is the bottom surface of the terminal portion, is located in a direction toward the top surface side of the bottom surface.

[0095] (Aspect 10) The switch according to embodiment 9, wherein the soldering member is arranged such that the first surface is located toward the top surface of the case, and the second surface is located in a direction that protrudes from the bottom surface of the case.

[0096] (Embodiment 2) [Switch Configuration] The configuration of the switch 101 according to Embodiment 2 will be described below.

[0097] Embodiment 2 describes an example in which the terminal portion 33 has a temporary fixing area T1. The temporary fixing area T1 is provided, for example, to prevent the solder member 40 placed on the terminal portion 33 from shifting position or falling off before or during joining the solder member 40 to the terminal portion 33.

[0098] The switch 101 of Embodiment 2, like that of Embodiment 1, includes a case 10, a movable contact member 20, a first fixed contact member 30a and a second fixed contact member 30b, a protective sheet 60, and a pressing member 50 (not shown). The switch 101 of Embodiment 2 differs from the switch 1 of Embodiment 1 in some aspects of the configuration of the terminal portion 33 of the first fixed contact member 30a and the terminal portion 33 of the second fixed contact member 30b. The characteristic configuration of the switch 101 of Embodiment 2 will be described below.

[0099] Figure 13 is a bottom view of the switch 101 according to Embodiment 2. Figure 14 is a bottom view of the fixed contact member 30 of the switch 101. Figure 15 is a perspective view showing the terminal portion 33 and solder member 40 of the switch 101. Figure 16 is a diagram showing the state in which the solder member 40 has been separated from the terminal portion 33.

[0100] Figure 15 shows that one of the two terminal portions 33, located on the negative side in the Y direction, has the solder member 40 temporarily fixed and joined to it, while the other terminal portion 33, located on the positive side in the Y direction, has not yet had the solder member 40 temporarily fixed to it. Figure 16 also shows that the binder 170 has been separated from the terminal portions 33.

[0101] The terminal portion 33 of the switch 101 in Embodiment 2 has a temporary fixing area T1 that is provided so as to be in contact with the soldering member 40. The temporary fixing area T1 is an area that temporarily fixes the soldering member 40 to the terminal portion 33 in order to prevent the soldering member 40 from shifting position or falling off the terminal portion 33 before or during joining the soldering member 40 to the terminal portion 33.

[0102] The temporary fixing region T1 is located in a different region from the region corresponding to the joint portion j when viewed along the direction in which the terminal portion 33 and the soldering member 40 are adjacent to each other, that is, when viewed from the Z direction in Figure 13. For example, when viewed from the Z direction, the temporary fixing region T1 is located in the region corresponding to the non-joined portion nj. In the example shown in the figure, the temporary fixing region T1 is located in the region between multiple joint portions j.

[0103] As shown in Figure 16, the temporary fixing area T1 is provided on the terminal bottom surface 33a side of the terminal portion 33. The temporary fixing area T1 is provided with a groove-shaped recess 135, and a binder 170 is provided in the recess 135. The binder 170 is a material for temporarily fixing the solder member 40 to the terminal portion 33. The recess 135 is a pocket for accumulating this binder 170.

[0104] As shown in Figures 14 and 15, the recess 135 has a rectangular or oval shape when viewed from the Z direction. The oval shape includes a long hole shape or an elliptical shape. By making the recess 135 rectangular or oval, it is possible to suppress the rotation of the soldering member 40 relative to the terminal portion 33 when the soldering member 40 is temporarily fixed to the terminal portion 33.

[0105] Figure 17 is a schematic diagram showing a cross-section of the terminal portion 33 with the soldering member 40 temporarily attached. In Figure 17, a gap is visible between the terminal portion 33 and the soldering member 40, but in reality, there is almost no gap, and the terminal portion 33 and the soldering member 40 are in contact.

[0106] As shown in Figure 17, the recess 135 has a bottom portion 135a and multiple wall portions 135b. The corner portion 135c connecting the bottom portion 135a and the wall portions 135b has a rounded (R) curved surface. The radius of curvature of the curved surface is, for example, between 0.1 and 1.0 times the depth of the recess 135. The reason for making the corner portion 135c a rounded surface is to suppress the trapping or retention of air bubbles at the corner portion 135c when the binder 170 is placed inside the recess 135.

[0107] The recess 135 is formed, for example, by laser or press molding with a mold. The recess 135 may be formed in the terminal portion 33 before the fixed contact member 30 is insert molded with resin (see Figure 14), or it may be formed in the terminal portion 33 after insert molding.

[0108] Although Figure 17 shows only one recess 135, the number is not limited to this, and multiple recesses 135 may be provided in the temporary fixing area T1. For example, the width of the recess 135 is 0.1 mm or less, and the size is such that the binder 170 inside the recess 135 can be held in the recess 135 by surface tension or the like.

[0109] The binder 170 is a material provided between the terminal portion 33 and the solder member 40, and is, for example, a flux, or a material containing an acrylic resin or epoxy resin. The binder 170 is a liquid with a certain degree of viscosity. The viscosity of the binder 170 is preferably, for example, 1 Pa·s or more and 100 Pa·s or less. The binder 170 is also provided on the outside of the recess 135 so as to overflow from the recess 135. By providing the binder 170 on the outside of the recess 135, the inside of the recess 135 is filled with the binder 170, and the terminal portion 33 and the solder member 40 can be reliably temporarily fixed using the binder 170.

[0110] Figure 18 shows the process of temporarily fixing the solder member 40 to the terminal portion 33 and then joining the solder member 40 to the terminal portion 33. As an example, Figure 18 shows the solder member 40 being joined by a laser beam L. By temporarily fixing the solder member 40 to the terminal portion 33 in this way and then joining the solder member 40 to the terminal portion 33, it is possible to prevent the solder member 40 from shifting position or falling off before or during joining.

[0111] [Modification 1 of Embodiment 2] A modified example of the switch 101 according to Embodiment 2, Modification 1, will be described. In Modification 1, an example will be described in which the shape of the recess 135 is that of a counterbore hole.

[0112] Figure 19 is a bottom view of the switch 101 according to Modification 1 of Embodiment 2. Figure 20 is a bottom view of the fixed contact member 30 of the switch 101 according to Modification 1. Figure 21 shows the state in which the solder member 40 has been separated from the terminal portion 33 of the switch 101. Figure 21 also shows the state in which the binder 170 has been separated from the terminal portion 33.

[0113] The terminal portion 33 of the switch 101 in Modification 1 has a temporary fixing region T1 that is provided so as to be in contact with the solder member 40. When viewed from the Z direction in Figure 19, the temporary fixing region T1 is located in a region different from the region corresponding to the joint portion j. For example, when viewed from the Z direction, the temporary fixing region T1 is located in the region corresponding to the non-joined portion nj. In the example shown in Figure 19, the temporary fixing region T1 is located in the region between multiple joint portions j.

[0114] The temporary fixing area T1 is provided on the terminal bottom surface 33a side of the terminal portion 33. The temporary fixing area T1 is provided with a counterbore-shaped recess 135, and a binder 170 is provided inside the recess 135.

[0115] As shown in Figure 20, the recess 135 has a circular shape when viewed from the Z direction. As shown in Figure 21, the recess 135 has a bottom portion 135a and a wall portion 135b. The corner portion connecting the bottom portion 135a and the wall portion 135b may be a curved surface with an R shape. The wall portion 135b may be inclined with respect to the bottom portion 135a or the terminal bottom surface 33a. Although there is one recess 135 in the temporary fixing area T1 shown in Figure 19, the number is not limited to this, and multiple recesses 135 may be provided in the temporary fixing area T1 of the terminal portion 33. For example, the diameter of the recess 135 is 0.1 mm or less, and it is a size that allows the binder 170 inside the recess 135 to be held in the recess 135 by surface tension or the like.

[0116] As shown in this modified example 1, the solder member 40 is temporarily fixed to the terminal portion 33 before being joined to the terminal portion 33. This prevents the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining.

[0117] [Modification 2 of Embodiment 2] A modified example of the switch 101 according to Embodiment 2 will be described. In Modified Example 2, instead of the binder 170 being provided in the recess, an example will be described in which the binder 170 is provided on the terminal bottom surface 33a of the terminal portion 33.

[0118] Figure 22 shows the state in which the soldering member 40 has been separated from the terminal portion 33 of the switch 101. Figure 23 is a schematic diagram showing a cross-section of the state in which the soldering member 40 has been temporarily fixed to the terminal portion 33.

[0119] The terminal portion 33 of the switch 101 according to the modified example 2 of Embodiment 2 has a temporary fixing region T1 that is provided so as to be in contact with the soldering member 40.

[0120] The temporary fixing region T1 is located in a different region from the region corresponding to the joint portion j when viewed from the Z direction. For example, when viewed from the Z direction, the temporary fixing region T1 is located in the region corresponding to the non-joint portion nj. In the example shown in the figure, the temporary fixing region T1 is located in the region between multiple joint portions j.

[0121] As shown in Figures 22 and 23, the temporary fixing area T1 is provided on the terminal bottom surface 33a side of the terminal portion 33. In this example, multiple binders 170 are provided between the terminal portion 33 and the solder member 40 to form the temporary fixing area T1. For example, the binder 170 is water or ethanol, and the amount of each binder is 0.001 μL (microliter) or more and 0.1 μL or less. The binder 170 is applied to the terminal bottom surface 33a of the terminal portion 33 by, for example, an inkjet or a dispenser. Note that the binder 170 in the temporary fixing area T1 may be provided as a single connected unit rather than as multiple units.

[0122] As shown in this modified example 2, the solder member 40 is temporarily fixed to the terminal portion 33, and then joined to the terminal portion 33. This prevents the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining.

[0123] [Modification 3 of Embodiment 2] A modified example of the switch 101 according to the third modification of Embodiment 2 will be described. In the third modification, an example will be described in which the temporary fixing area T1 is provided on the soldering member 40.

[0124] Figure 24 shows the state in which the solder member 40 has been separated from the terminal portion 33 of the switch 101 according to the third modification of Embodiment 2. Figure 25 is a schematic diagram showing a cross-section of the state in which the solder member 40 has been temporarily fixed to the terminal portion 33 of the switch 101.

[0125] In the modified example 3 of Embodiment 2, the soldering member 40 of the switch 101 has a temporary fixing region T1 that is provided to be in contact with the terminal portion 33 when viewed from the Z direction. The temporary fixing region T1 is located in a region different from the region corresponding to the joint portion j. For example, when viewed from the Z direction, the temporary fixing region T1 is located in the region corresponding to the non-joined portion nj. The temporary fixing region T1 is located in the region between multiple joint portions j.

[0126] As shown in Figure 25, the temporary fixing region T1 of the modified example 3 is provided on the first surface 41 side of the solder member 40. The temporary fixing region T1 is provided with a recess 145, and a binder 170 is provided in the recess 145. The recess 145 is a pocket for accumulating this binder 170. When viewed from the Z direction, the recess 145 has a rectangular, oval, or circular shape. The second surface 42 of the solder member 40 before joining by a laser or the like is a flat surface.

[0127] The recess 145 is arc-shaped and rounded when viewed in cross-section. The recess 145 is formed, for example, by press molding of a mold. Although there is only one recess 145 shown in Figure 24, the number is not limited to this, and multiple recesses 145 may be provided in the temporary fixing area T1 of the solder member 40. For example, it is desirable that the width of the recess 145 is 0.1 mm or less, and that the size is such that the binder 170 inside the recess 145 can be held in the recess 145 by surface tension or the like.

[0128] As shown in this modified example 3, the solder member 40 is temporarily fixed to the terminal portion 33 before being joined to the terminal portion 33. This prevents the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining.

[0129] (Embodiment 3) A switch 101A according to Embodiment 3 will be described. In Embodiment 3, a recess 136 is formed in the temporary fixing area T1, and a part of the soldering member 40 is press-fitted into this recess 136.

[0130] The switch 101A of Embodiment 3, like the switch 1 of Embodiment 1, includes a case 10, a movable contact member 20, a first fixed contact member 30a and a second fixed contact member 30b, a protective sheet 60, and a pressing member 50 (not shown). The switch 101A of Embodiment 3 differs from the switch 1 of Embodiment 1 in some aspects of the configuration of the terminal portion 33 of the first fixed contact member 30a and the terminal portion 33 of the second fixed contact member 30b. The characteristic configuration of the switch 101A of Embodiment 3 will be described below.

[0131] Figure 26 is a bottom view of the switch 101A according to Embodiment 3. Figure 27 is a bottom view of the fixed contact member 30 of the switch 101A. Figure 28 is a cross-sectional view showing the terminal portion 33 and solder member 40 of the switch 101A. Figure 29 is a diagram showing the state in which the solder member 40 has been separated from the terminal portion 33 of the switch 101A.

[0132] As shown in Figure 26, the terminal portion 33 of the switch 101A of Embodiment 3 has a temporary fixing region T1 that is provided so as to be in contact with the solder member 40. The temporary fixing region T1 is located in a region different from the region corresponding to the joint portion j when viewed along the direction in which the terminal portion 33 and the solder member 40 are adjacent to each other, that is, when viewed from the Z direction in Figure 26. For example, when viewed from the Z direction, the temporary fixing region T1 is located in the region corresponding to the non-joined portion nj. In the example shown in Figure 26, the temporary fixing region T1 is located in the region between a plurality of joint portions j.

[0133] The temporary fixing area T1 is provided on the terminal bottom surface 33a side of the terminal portion 33. The temporary fixing area T1 is provided with a recess 136, into which the central portion 146 of the soldering member 40 is press-fitted. The recess 136 is an engagement portion into which the central portion 146 of the soldering member 40 fits.

[0134] As shown in Figure 27, the recessed portion 136 has a circular shape when viewed from the Z direction. As shown in Figures 28 and 29, the recessed portion 136 has a bottom portion 136a and a wall portion 136b. The wall portion 136b may be inclined with respect to the bottom portion 136a or the terminal bottom surface 33a. The recessed portion 136 may have a rectangular or oval shape when viewed from the Z direction.

[0135] Figure 30 shows an example of a recess 136 in the terminal portion 33. Figure 30(a) shows the state in which a soldering member 40 is placed on the terminal portion 33 having a recess 136, and Figure 30(b) shows the state in which the soldering member 40 is press-formed in a mold and the central portion 146 of the soldering member 40 is press-fitted into the recess 136.

[0136] Figure 31 is an image showing another example of the recessed portion 136 of the terminal portion 33.

[0137] Figure 31 shows an example in which a portion of the terminal portion 33 is removed by a laser beam L, forming a recess 136. As shown in Figure 31, the corner portion 136c connecting the bottom portion 136a and the wall portion 136b has an R-shaped curved surface and is rounded. Also, the outer circumference of the recess 136 is slightly higher than the height of the terminal bottom surface 33a of the terminal portion 33. For example, the outer peripheral region of the recess 136 is raised and has a convex shape. Because the outer peripheral region of the recess 136 has a convex shape, when the solder member 40 is pressed into the terminal portion 33, the solder member 40 bites into the convex outer peripheral region, and the solder member 40 is firmly temporarily fixed to the terminal portion 33.

[0138] The recessed portion 136 may be formed in the terminal portion 33 before the fixed contact member 30 is insert-molded with resin, or it may be formed in the terminal portion 33 after insert molding.

[0139] In this embodiment 3, the solder member 40 is temporarily fixed to the terminal portion 33, and then joined to the terminal portion 33. This prevents the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining.

[0140] (Embodiment 4) The configuration of the switch 101B according to Embodiment 4 will be described. In Embodiment 4, an example will be described in which the terminal portion 33 and the soldering member 40 are temporarily fixed in the temporary fixing area T1 by anchoring effect or pressure contact.

[0141] The switch 101B of Embodiment 4, like the switch 1 of Embodiment 1, includes a case 10, a movable contact member 20, a first fixed contact member 30a and a second fixed contact member 30b, a protective sheet 60, and a pressing member 50 (not shown). The switch 101B of Embodiment 4 differs from the switch 1 of Embodiment 1 in some aspects of the configuration of the terminal portion 33 of the first fixed contact member 30a and the terminal portion 33 of the second fixed contact member 30b. The characteristic configuration of the switch 101B of Embodiment 4 will be described below.

[0142] Figure 32 is a bottom view of the switch 101B according to Embodiment 4. Figure 33 is a bottom view of the fixed contact member 30 of the switch 101B.

[0143] The terminal portion 33 of the switch 101B in Embodiment 4 has a temporary fixing region T1 that is provided so as to be in contact with the solder member 40. The temporary fixing region T1 is located in a region different from the region corresponding to the joint portion j when viewed along the direction in which the terminal portion 33 and the solder member 40 are adjacent to each other, that is, when viewed from the Z direction in Figure 32. For example, when viewed from the Z direction, the temporary fixing region T1 is located in the region corresponding to the non-joined portion nj. In the example shown in Figure 32, the temporary fixing region T1 is located in the region between multiple joint portions j.

[0144] Figure 34 is a cross-sectional view of the terminal portion 33 and soldering member 40 of the switch 101B. Figure 35 is an image of the plating layer of the terminal portion 33. Figure 35 shows a surface image of the Ni plating.

[0145] As shown in Figures 33 and 34, the temporary fixing area T1 is provided on the terminal bottom surface 33a side of the terminal portion 33. The temporary fixing area T1 is in a state where the surface of the terminal portion 33 is rough and has an uneven shape.

[0146] A plating layer is formed on the terminal bottom surface 33a of the terminal portion 33. The plating layer is composed of multiple metal plating films, and in this example, it is composed of Ni plating formed on the terminal bottom surface 33a (see Figure 35) and Au plating formed on the Ni plating. The metal plating formed on the Ni plating is not limited to Au plating, but may also be Ag plating.

[0147] The surface roughness of the terminal portion 33 in the temporary fixing region T1 is at least one of the following: arithmetic mean roughness (Ra) of 0.05 μm or more and 2 μm or less, and maximum height (Rz) of 0.5 μm or more and 5 μm or less. These surface roughness values ​​are determined, for example, by a method conforming to the JIS standard "JIS B 0601-2001". The surface roughness of the terminal portion 33 can be adjusted by changing the current density when forming the Ni plating by electroplating. For example, the surface roughness value can be increased by decreasing the current density. The surface roughness of the terminal portion 33 may be formed to a predetermined range by irradiating the terminal portion 33 with a laser or by pressing a mold with irregularities formed on it against the terminal portion 33. Note that the surface roughness of the terminal portion 33 may be arithmetic mean roughness (Ra) of 0.05 μm or more, or maximum height (Rz) of 0.5 μm or more.

[0148] The terminal portion 33 and the solder member 40 are pressed together in the temporary fixing area T1. The metal material (stainless steel or phosphor bronze) and Ni plating constituting the terminal portion 33 are harder than the solder member 40. Therefore, when the solder member 40 is pressed against the terminal portion 33, the uneven surface area of ​​the terminal portion 33 bites into the solder member 40, and the terminal portion 33 and the solder member 40 are connected by an anchoring effect. The area with the uneven surface of the terminal portion 33 may be the entire area of ​​the terminal portion 33 or a part of it. In addition, there may be multiple areas with the uneven surface on the terminal portion 33.

[0149] In this embodiment 4, the solder member 40 is temporarily fixed to the terminal portion 33, and then joined to the terminal portion 33. This prevents the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining.

[0150] (Summary of Embodiments 2, 3, and 4) As described above, each of the switches 101, 101A, and 101B according to Embodiments 2, 3, and 4 comprises a case 10, a movable contact member 20 disposed in the case 10, a fixed contact member 30 partially embedded in the case 10, and a soldering member 40 provided on the fixed contact member 30, similar to the switch 1 of Embodiment 1. The fixed contact member 30 has a contact portion 31 that is in contact with the movable contact member 20, and a terminal portion 33 that is electrically connected to the contact portion 31 and exposed from the case 10. The soldering member 40 has a joint portion j that is joined to the terminal portion 33 and a non-joint portion nj that is not joined to the terminal portion 33.

[0151] Furthermore, in the switches 101, 101A, and 101B according to embodiments 2, 3, and 4, the terminal portion 33 has a temporary fixing region T1 that is provided so as to be in contact with the soldering member 40.

[0152] Because the terminal portion 33 has the temporary fixing area T1 described above, it is possible to prevent the solder member 40 from shifting position or falling off before or during joining the solder member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0153] Furthermore, the switch 101 according to Embodiment 2, like the switch 1 of Embodiment 1, comprises a case 10, a movable contact member 20 disposed in the case 10, a fixed contact member 30 partially embedded in the case 10, and a soldering member 40 provided on the fixed contact member 30. The fixed contact member 30 has a contact portion 31 that is in contact with the movable contact member 20, and a terminal portion 33 that is electrically connected to the contact portion 31 and exposed from the case 10. The soldering member 40 has a joint portion j that is joined to the terminal portion 33 and a non-joint portion nj that is not joined to the terminal portion 33.

[0154] Furthermore, in the switch 101 according to Embodiment 2, the soldering member 40 has a temporary fixing region T1 that is provided so as to be in contact with the terminal portion 33.

[0155] Because the soldering member 40 has the above-mentioned temporary fixing region T1, it is possible to prevent the soldering member 40 from shifting position or falling off the terminal portion 33 before or during joining the soldering member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0156] Furthermore, a binder 170 may be provided in the temporary fixing region T1.

[0157] The presence of the binder 170 in the temporary fixing area T1 allows for temporary fixing of the terminal portion 33 and the soldering member 40. This prevents the soldering member 40 from shifting position or falling off the terminal portion 33 before or during bonding. This helps to prevent a decrease in connection reliability during mounting.

[0158] Furthermore, a recess 135 may be provided in the temporary fixing area T1, and the binder 170 may be provided within the recess 135.

[0159] By providing the binder 170 within the recess 135 in this manner, the binder 170 can be retained within the temporary fixing region T1. Therefore, the terminal portion 33 and the solder member 40 can be securely temporarily fixed, and it is possible to prevent the solder member 40, which is placed on the terminal portion 33, from shifting position or falling off before or during joining the solder member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0160] Furthermore, the recess 135 has a bottom portion 135a and a wall portion 135b, and the corner portion 135c connecting the bottom portion 135a and the wall portion 135b may be an R-shaped curved surface.

[0161] According to this, for example, when the binder 170 is placed in the recess 135, it is possible to suppress the trapping or retention of air bubbles at the corner portion 135c. This suppresses deformation and splatter of solder during mounting, and prevents a decrease in connection reliability during mounting.

[0162] Furthermore, the recess 135 may be rectangular or oval in shape.

[0163] According to this, when the solder member 40 is temporarily fixed to the terminal portion 33, rotation of the solder member 40 relative to the terminal portion 33 can be suppressed. Therefore, the terminal portion 33 and the solder member 40 can be securely temporarily fixed, and the position of the solder member 40 placed on the terminal portion 33 or the solder member 40 can be suppressed from shifting or falling off before or during joining the solder member 40 to the terminal portion 33. This suppresses a decrease in connection reliability during mounting.

[0164] Furthermore, the binder 170 may also be provided on the outside of the recess 135.

[0165] In this way, by providing the binder 170 on the outside of the recess 135 as well, the binder 170 fills the recess 135, and the terminal portion 33 and the solder member 40 can be reliably temporarily fixed using the binder 170. Therefore, it is possible to prevent the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining the solder member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0166] Furthermore, the binder 170 may be a flux.

[0167] According to this method, the terminal portion 33 and the soldering member 40 can be securely temporarily fixed using flux. Therefore, it is possible to prevent the soldering member 40 from shifting position or falling off the terminal portion 33 before or during joining the soldering member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0168] Furthermore, the soldering member 40 may have multiple joint portions j, and the temporary fixing region T1 may be located in the region between the multiple joint portions j when viewed along the direction in which the terminal portion 33 and the soldering member 40 are adjacent to each other.

[0169] According to this, the temporary fixing effect of the temporary fixing area T1 can be effectively balanced, and it is possible to suppress the shifting of the position of the solder member 40 placed on the terminal portion 33 or the solder member 40 falling off before or during joining the solder member 40 to the terminal portion 33. This suppresses a decrease in connection reliability during mounting.

[0170] Furthermore, a recess 136 may be provided in the temporary fixing area T1, and a portion of the soldering member 40 may be press-fitted into the recess 136.

[0171] By pressing a portion of the soldering member 40 into the recess 136 in this manner, the soldering member 40 can be securely temporarily fixed to the terminal portion 33. Therefore, it is possible to prevent the soldering member 40 from shifting position or falling off the terminal portion 33 before or during joining the soldering member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0172] Furthermore, the soldering member 40 may have multiple joint portions j, and the recessed portion 136 may be located in the region between the multiple joint portions j when viewed along the direction in which the terminal portion 33 and the soldering member 40 are adjacent to each other.

[0173] According to this, the temporary fixing effect of the temporary fixing area T1 can be effectively balanced, and it is possible to suppress the shifting of the position of the solder member 40 placed on the terminal portion 33 or the solder member 40 falling off before or during joining the solder member 40 to the terminal portion 33. This suppresses a decrease in connection reliability during mounting.

[0174] Furthermore, the terminal portion 33 and the soldering member 40 may be connected in the temporary fixing area T1 by an anchoring effect.

[0175] This allows the soldering member 40 to be securely temporarily fixed to the terminal portion 33. Therefore, it is possible to prevent the soldering member 40 from shifting position or falling off the terminal portion 33 before or during joining the soldering member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0176] Furthermore, the terminal portion 33 and the soldering member 40 may be press-fitted in the temporary fixing region T1.

[0177] This allows the soldering member 40 to be securely temporarily fixed to the terminal portion 33. Therefore, it is possible to prevent the soldering member 40 from shifting position or falling off the terminal portion 33 before or during joining the soldering member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0178] Furthermore, the surface roughness of the temporary fixing region T1 of the terminal portion 33 may be at least one of the following: an arithmetic mean roughness of 0.05 μm or more and 2 μm or less, and a maximum height of 0.5 μm or more and 5 μm or less.

[0179] This method allows the solder member 40 to be securely temporarily fixed to the terminal portion 33 by utilizing an anchoring effect or pressure bonding effect. Therefore, it is possible to prevent the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining the solder member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0180] Furthermore, a plating layer may be formed in the temporary fixing area T1 of the terminal portion 33.

[0181] This method allows the solder member 40 to be securely temporarily fixed to the terminal portion 33 by utilizing an anchoring effect or pressure bonding effect. Therefore, it is possible to prevent the solder member 40 from shifting position or falling off the terminal portion 33 before or during joining the solder member 40 to the terminal portion 33. This prevents a decrease in connection reliability during mounting.

[0182] (Other embodiments, etc.) The switches relating to the embodiments of this disclosure have been described above, but this disclosure is not limited to these embodiments.

[0183] In the above embodiment, an example was shown in which the terminal portion 33 protrudes laterally from the recessed side surface 14b and is exposed from the case 10 in contact with the recessed bottom surface 14a, but the embodiment is not limited to this. For example, the terminal portion 33 may protrude from the recessed bottom surface 14a and be exposed from the case 10.

[0184] The switch 1 of the above embodiment may be manufactured by the following method. For example, the method for manufacturing the switch may include the steps of bringing a soldering member 40 into contact with the terminal portion 33, and fixing the soldering member 40 to the terminal portion 33 by thermally melting a portion of the soldering member 40 with a laser.

[0185] In the above embodiment, a switch 1 is shown in which a soldering member 40 is fixed to the terminal portion 33. However, this switch 1 may be mounted on a circuit board by the method described below. For example, if the circuit board is a flexible printed circuit board, the switch 1 may be placed on the surface of the circuit board, and the soldering member 40 may be melted by applying a heat tool such as a soldering iron from the back of the circuit board to mount the switch 1 to the circuit board.

[0186] For example, this disclosure is not limited to switch 1, but may also be applied to electronic components mounted on a circuit board or the like using solder material. For example, an electronic component comprises an electronic component body having a functional element such as an active element or a passive element, an external terminal electrically connected to the functional element and extended to the outside from the electronic component body, and a soldering member provided on the external terminal, wherein the soldering member may have a joint portion joined to the external terminal and a non-joint portion not joined to the external terminal.

[0187] Furthermore, this disclosure is not limited to this embodiment. Within the scope of one or more embodiments, various modifications to this embodiment that a person skilled in the art could conceive of, or forms constructed by combining components from different embodiments, may also be included, as long as they do not depart from the spirit of this disclosure. [Industrial applicability]

[0188] The switch described herein is useful as a switch for the operating section of various electronic devices. [Explanation of Symbols]

[0189] 1, 101, 101A, 101B switches 10 cases 11 Top surface 12. Base 13 Side view 14. Recessed area 14a Bottom surface of the depression 14b Recessed side 16 Case body 17 Protrusion 18 recesses 20 Movable contact member 30, 30a, 30b Fixed contact members 31 Contact point 32 Buried section 33 Terminal section 33a Bottom of terminal 40, 40A soldering components 41 Page 1 41a, 41b area 42 Side 2 42a 1st area 42b 2nd area 50 Pressing member 60 protective sheets 135 recess 135a bottom 135b Wall section 135c corner 136 Recessed area 136a bottom 136b Wall section 136c Corner 145 recess 146 Central part 170 Binder g gap j Joint site ja alloy layer nj non-junction site L Laser light T1 Temporary fixing area

Claims

1. Terminal portion and A soldering member provided at the terminal portion, Equipped with, The soldering member has a joint portion that is joined to the terminal portion and a non-joint portion that is not joined to the terminal portion. Electronic components.

2. The area of ​​the non-jointed portion is larger than the area of ​​the jointed portion. The electronic component according to claim 1.

3. A gap is formed between the non-jointed portion and the terminal portion. The electronic component according to claim 1 or 2.

4. The aforementioned joint portion has an alloy layer in contact with the terminal portion, The alloy layer is formed from the metal material of the soldering member and the metal material of the terminal portion. The electronic component according to any one of claims 1 to 3.

5. The soldering member has a first surface facing the terminal portion and a second surface located opposite the first surface. The second surface has a first region included in the joint portion and a second region included in the non-joined portion, On the second surface, the second region is flatter than the first region. The electronic component according to any one of claims 1 to 4.

6. The soldering member has a first surface facing the terminal portion and a second surface located opposite the first surface. The second surface has a first region included in the joint portion and a second region included in the non-joined portion, On the second surface, the first region bulges out in the opposite direction to the first surface compared to the second region. The electronic component according to any one of claims 1 to 4.

7. The soldering member has a plurality of the aforementioned joining portions, The second surface of the soldering member has a plurality of first regions. The electronic component according to claim 5 or 6.

8. The soldering member is rectangular in shape when viewed from a direction perpendicular to the second surface. Each of the multiple first regions is provided along the short side of the rectangular solder member. The electronic component according to claim 7.

9. The case further comprises a top surface, a bottom surface, and a recessed bottom surface located on the top surface side of the bottom surface. The terminal portion is exposed from the case in a state in contact with the bottom surface of the recess, The terminal bottom surface, which is the bottom surface of the terminal portion, is located in a direction toward the top surface than the bottom surface. The electronic component according to any one of claims 5 to 8.

10. The soldering member is positioned such that the first surface is located in a direction toward the top surface of the case rather than the bottom surface of the case, and the second surface is located in a direction that protrudes beyond the bottom surface of the case. The electronic component according to claim 9.

11. The terminal portion has a temporary fixing area provided so as to be in contact with the soldering member. The electronic component according to claim 1.

12. The soldering member has a temporary fixing region provided so as to be in contact with the terminal portion. The electronic component according to claim 1.

13. A binder is provided in the aforementioned temporary fixing region. The electronic component according to claim 11 or 12.

14. The aforementioned temporary fixing area is provided with a recess, The binder is provided in the recess. The electronic component according to claim 13.

15. The recess has a bottom and a wall, The corner section connecting the bottom and the wall section has an R-shaped curved surface. The electronic component according to claim 14.

16. The recess is rectangular or oval in shape. The electronic component according to claim 14.

17. The binder is also provided on the outside of the recess. The electronic component according to any one of claims 14 to 16.

18. The binder is a flux. The electronic component according to any one of claims 13 to 17.

19. The soldering member has a plurality of the aforementioned joining portions, The temporary fixing region is located in the region between the multiple joining portions when viewed along the direction in which the terminal portion and the soldering member are adjacent to each other. The electronic component according to any one of claims 11 to 18.

20. The temporary fixing area is provided with a recess, A portion of the soldering member is press-fitted into the recessed portion. The electronic component according to claim 11.

21. The soldering member has a plurality of the aforementioned joining portions, The recessed portion is located in the region between the multiple joining portions when viewed along the direction in which the terminal portion and the soldering member are adjacent to each other. The electronic component according to claim 20.

22. The terminal portion and the soldering member are connected in the temporary fixing area by an anchoring effect. The electronic component according to claim 11.

23. The terminal portion and the soldering member are pressed together in the temporary fixing area. The electronic component according to claim 11.

24. The surface roughness of the temporary fixing region of the terminal portion is at least one of the following: an arithmetic mean roughness of 0.05 μm or more and 2 μm or less, and a maximum height of 0.5 μm or more and 5 μm or less. The electronic component according to any one of claims 22 and 23.

25. A plating layer is formed in the temporary fixing region of the terminal portion. The electronic component according to any one of claims 22 to 24.

Images