Apparatus for initializing an elastic film, polishing apparatus, and method for initializing an elastic film

Abstract

To provide an initialization device for an elastic membrane that can accurately improve flexibility of an elastic membrane.SOLUTION: An initialization device 50 for an elastic membrane 10 includes: a compression device 55; an expansion amount detection device 58; and a control device 40 for comparing an expansion amount detected by the expansion amount detection device 58 with a predetermined target expansion amount and, when the expansion amount reaches the target expansion amount, determining the completion of initialization of the elastic membrane 10.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to an initialization device for an elastic film, a polishing device, and and a method for initializing an elastic film. In the law It relates thereto.

Background Art

[0002] In a polishing device for performing CMP (Chemical Mechanical Polishing), a substrate such as a wafer is held by a substrate holding mechanism (or substrate holding device) called a top ring or a polishing head, etc., and this substrate is pressed against the polishing surface of a polishing pad held on a polishing table with a predetermined pressure. At this time, the substrate is slidably contacted with the polishing surface of the polishing pad by relatively moving the polishing table and the substrate holding mechanism, and the surface of the substrate is polished.

[0003] When the relative pressing force between the substrate being polished and the polishing surface of the polishing pad is not uniform over the entire surface of the substrate, under-polishing or over-polishing occurs according to the pressing force applied to each part of the substrate. Therefore, in order to equalize the pressing force on the substrate, a pressure chamber formed from a flexible elastic film (membrane) is provided below the substrate holding mechanism, and a fluid such as air is supplied to this pressure chamber to press the substrate by fluid pressure through the elastic film.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Repeated polishing of substrates using a polishing machine alters the state of the elastic film. This altered elastic film needs to be replaced with a new one. Traditionally, the replacement timing (i.e., the lifespan of the elastic film) has been uniformly determined based on past process performance (e.g., the number of substrates processed). However, from the perspective of reducing the cost of consumables in substrate manufacturing and maintaining substrate quality, it is desirable that the state of the elastic film (more specifically, the replacement timing) be appropriately determined according to individual differences.

[0006] The newly replaced elastic film does not have sufficient elasticity (flexibility), so a process (i.e., break-in process) is performed to make the new elastic film ready for substrate manufacturing. Conventionally, the break-in process involves polishing a dummy wafer (non-product wafer) using the newly replaced elastic film to make the elastic film ready for substrate manufacturing. The break-in process of the elastic film interrupts the substrate manufacturing process (downtime).

[0007] Furthermore, even if the required number of dummy wafers for break-in processing are polished, if the break-in process is insufficient, the dummy wafers must be polished again until the elastic film is ready to process the substrate, increasing downtime. As a result, the operating rate of the polishing equipment decreases. On the other hand, excessive break-in processing leads to prolonged equipment downtime and wasteful consumption of consumables such as slurry. From this perspective, it is desirable that the state of the elastic film (more specifically, the completion time of the break-in process) be appropriately determined.

[0008] Therefore, the present invention aims to provide an elastic membrane initialization apparatus and an elastic membrane initialization method that can accurately improve the elasticity of the elastic membrane. This invention provides a polishing device that can accurately determine the replacement timing of an elastic membrane. Place The purpose is to provide. [Means for solving the problem]

[0009] In one embodiment, an elastic membrane initialization device is provided, comprising: a pressurizing device that pressurizes an elastic membrane that can be attached to a substrate holding mechanism of a polishing device to expand the elastic membrane; an expansion amount detection device that detects the amount of expansion of the elastic membrane; and a control device that compares the amount of expansion detected by the expansion amount detection device with a predetermined target expansion amount, and determines that the initialization of the elastic membrane is complete when the expansion amount reaches the target expansion amount.

[0010] In one embodiment, the initializing device for the elastic membrane includes a mounting section for attaching an elastic membrane assembly that holds the elastic membrane. In one embodiment, the control device repeats the pressurizing operation by the pressurizing device until the amount of expansion of the elastic membrane reaches the target amount of expansion. In one embodiment, the pressurizing device comprises a ring-shaped pressing jig positioned in the pressure chamber of the elastic membrane, and a biasing device that presses the pressing jig against the elastic membrane.

[0011] In one embodiment, the pressurizing device includes a pressure regulating device that supplies pressurized fluid to the pressure chamber of the elastic membrane and opens the pressure chamber of the elastic membrane to the atmosphere. In one embodiment, the initialization device for the elastic membrane includes a heating structure for heating the elastic membrane. In one embodiment, the initializing device for the elastic membrane comprises a rotating mechanism for rotating the elastic membrane and a pad member against which the elastic membrane is pressed. The control device operates the pressing device to press the elastic membrane against the pad member, and while the elastic membrane is pressed against the pad member, operates the rotating mechanism to rotate the elastic membrane.

[0012] In one embodiment, a polishing apparatus is provided, comprising: a substrate holding mechanism on which an elastic film is attached; a pressurizing device that pressurizes the elastic film to expand it; an expansion amount detection device that detects the amount of expansion of the elastic film; and a control device that compares the amount of expansion detected by the expansion amount detection device with a predetermined set expansion amount.

[0013] In one embodiment, the set expansion amount corresponds to a target expansion amount that indicates the elasticity of the target elastic membrane, and the control device completes the initialization of the elastic membrane when the expansion amount reaches the target expansion amount. In one embodiment, the set expansion amount corresponds to a replacement expansion amount indicating the time to replace the elastic membrane, and the control device issues a signal regarding the replacement time of the elastic membrane when the expansion amount reaches the replacement expansion amount. In one embodiment, the control device measures the time it takes to detach the substrate held by the substrate holding mechanism from the elastic film, and determines the timing for replacing the elastic film based on the measured detachment time and the calculated expansion amount.

[0014] In one embodiment, a method for initializing an elastic film that can be attached to a substrate holding mechanism of a polishing apparatus is provided. The method for initializing an elastic film involves pressurizing the elastic film with a pressurizing device to expand it, detecting the amount of expansion of the elastic film with an expansion amount detection device, comparing the amount of expansion detected by the expansion amount detection device with a predetermined target expansion amount, and determining that the initialization of the elastic film is complete when the expansion amount reaches the target expansion amount.

[0015] In one embodiment, the elastic film assembly holding the elastic film is attached to an initialization device provided separately from the polishing device, and the elastic film is expanded by the pressurizing device without holding the substrate, thereby initializing the elastic film. In one embodiment, the pressurizing operation by the pressurizing device is repeated until the amount of expansion of the elastic membrane reaches the target amount of expansion. In one embodiment, the elastic membrane is heated.

[0016] In one embodiment, the elastic membrane is pressed against the pad member, and while the elastic membrane is pressed against the pad member, the elastic membrane is rotated. In one embodiment, the elastic film is initialized by polishing a dummy wafer with the substrate holding mechanism on which the elastic film is attached.

[0017] In one aspect, a pressure device pressurizes an elastic membrane to expand the elastic membrane, an expansion amount detection device detects the expansion amount of the elastic membrane, and the expansion amount detected by the expansion amount detected device is compared with a predetermined exchange expansion amount. When the expansion amount reaches the exchange expansion amount, a method for determining the replacement timing of the elastic membrane is provided.

[0018] In one aspect, the detachment time until the substrate held by the substrate holding mechanism on which the elastic membrane is mounted is detached from the elastic membrane is measured, and based on the measured detachment time and the calculated expansion amount, the replacement timing of the elastic membrane is determined. [[ID=…]]

Advantages of the Invention

[0019] The control device can improve the elasticity of the elastic membrane accurately and without excess or deficiency by comparing the expansion amount of the elastic membrane with the target expansion amount.

Brief Description of the Drawings

[0020] [Figure 1] It is a diagram showing an embodiment of a polishing device. [Figure 2] It is a cross-sectional view schematically showing a polishing head. [Figure 3] [[ID=2…]]It is a schematic diagram showing a pressure adjustment device. [Figure 4] It is a schematic diagram showing a state where the elastic membrane assembly is removed from the polishing head shown in FIG. 2. [Figure 5] It is a diagram showing an embodiment of an initialization device. [Figure 6] It is a diagram showing a pressure device and an expansion amount detection device. [Figure 7] It is a diagram showing a pressure device. [Figure 8] FIG. 8(a) is a diagram showing an expansion amount detection device as a transmissive optical sensor. FIG. 8(b) is a diagram showing an expansion amount detection device as a reflective optical sensor. [Figure 9] It is a diagram showing another embodiment of the expansion amount detection device. [Figure 10]This figure shows another embodiment of the expansion amount detection device. [Figure 11] This figure shows a changing moiré pattern. [Figure 12] This diagram shows the control flow of the initialization process of the elastic membrane by the control device. [Figure 13] Figures 13(a) to 13(d) show multiple embodiments of a heating structure for heating an elastic membrane. [Figure 14] This diagram shows a rotation mechanism that rotates an elastic membrane. [Figure 15] This figure shows another embodiment of the pressurizing device. [Figure 16] This figure shows a polishing apparatus comprising a polishing unit and a transfer station. [Figure 17] This is a perspective view showing the handover station. [Figure 18] This diagram shows an expansion amount detection device located at the transfer station. [Figure 19] This diagram shows the control flow for the process of determining the replacement timing of the elastic membrane by the control device. [Figure 20] This diagram shows the control flow for the process of determining the replacement timing of the elastic membrane by the control device. [Modes for carrying out the invention]

[0021] Embodiments of the present invention will be described below with reference to the drawings. Figure 1 shows one embodiment of a polishing unit. The polishing unit PA is part of the components of a polishing apparatus. As shown in Figure 1, the polishing unit PA includes a polishing table 18 that supports a polishing pad 19, and a polishing head (substrate holding mechanism or substrate holding device) 1 that holds a wafer W as an example of a substrate and presses it against the polishing pad 19 on the polishing table 18.

[0022] The polishing table 18 is connected to a table motor 29 located below it via a table axis 18a, and is rotatable around the table axis 18a. The polishing pad 19 is attached to the upper surface of the polishing table 18, and the surface 19a of the polishing pad 19 constitutes the polishing surface for polishing the wafer W. The polishing pad 19 is supported by the polishing table 18.

[0023] A processing liquid supply nozzle 25 is installed above the polishing table 18, and this processing liquid supply nozzle 25 supplies a processing liquid consisting of polishing liquid or cleaning liquid (e.g., pure water) or other liquid onto the polishing pad 19 on the polishing table 18.

[0024] The polishing head 1 comprises a head body 2 that presses the wafer W against the polishing surface 19a, and a retainer ring 3 that holds the wafer W and prevents it from flying out of the polishing head 1. The polishing head 1 is connected to a head shaft 27, which moves up and down relative to the head arm 64 by a vertical movement device 81. This vertical movement of the head shaft 27 raises and lowers the entire polishing head 1 relative to the head arm 64 for positioning. A rotary joint 82 is attached to the upper end of the head shaft 27.

[0025] The vertical movement device 81, which moves the head shaft 27 and the polishing head 1 up and down, comprises a bridge 84 that rotatably supports the head shaft 27 via a bearing 83, a ball screw 88 attached to the bridge 84, and a servo motor 90.

[0026] The ball screw 88 comprises a screw shaft 88a connected to the servo motor 90 and a nut 88b into which the screw shaft 88a is screwed. The head shaft 27 moves up and down together with the bridge 84. Therefore, when the servo motor 90 is driven, the bridge 84 moves up and down via the ball screw 88, which in turn causes the head shaft 27 and the polishing head 1 to move up and down.

[0027] The head shaft 27 is connected to a rotating cylinder 66 via a key (not shown). This rotating cylinder 66 is equipped with a timing pulley 67 on its outer circumference. A head motor 68 is fixed to the head arm 64, and the timing pulley 67 is connected to a timing pulley 70 provided on the head motor 68 via a timing belt 69.

[0028] Therefore, by rotationally driving the head motor 68, the rotating cylinder 66 and head shaft 27 rotate together via the timing pulley 70, timing belt 69, and timing pulley 67, causing the polishing head 1 to rotate. The head arm 64 is supported by an arm shaft 80 which is rotatably supported on a frame (not shown). The polishing unit PA includes a control device 40 that controls each component in the device, including the head motor 68, servo motor 90, and vertical movement device 81.

[0029] The control device 40 includes a storage device 40a in which programs and data are stored, and a processing device 40b such as a CPU (Central Processing Unit) that performs calculations according to the programs stored in the storage device 40a. The program causes the processing device 40b to perform an initialization operation of the elastic membrane 10 (described later) and / or a life determination operation of the elastic membrane 10 (described later).

[0030] The program for causing the processing unit 40b to perform the above operations is stored on a computer-readable recording medium, which is a non-temporary tangible object, and provided to the control unit 40 via the recording medium. Alternatively, the program may be input to the control unit 40 from a communication device (not shown) via a communication network such as the Internet or a local area network.

[0031] The polishing head 1 is configured to hold a wafer W on its lower surface. The head arm 64 is connected to an arm motor 89 located below it via an arm shaft 80, and is rotatable around the arm shaft 80. The control device 40 is electrically connected to the arm motor 89 and is configured to control the arm motor 89 as a swivel device that rotates the polishing head 1.

[0032] The head arm 64 is configured to rotate around the arm shaft 80, and the polishing head 1, which holds the wafer W on its lower surface, is moved from the wafer W receiving position (standby position) to above the polishing pad 19 by the rotation of the head arm 64.

[0033] The wafer W is polished as follows: The polishing head 1 and the polishing table 18 are rotated, and polishing fluid is supplied onto the polishing pad 19 from a processing fluid supply nozzle 25 located above the polishing table 18. In this state, the polishing head 1 is lowered to a predetermined position (a predetermined height), and at this predetermined position, the wafer W is pressed against the polishing surface 19a of the polishing pad 19. The wafer W is brought into sliding contact with the polishing surface 19a of the polishing pad 19, thereby polishing the surface of the wafer W. The polishing head (substrate holding mechanism or substrate holding device) 1 provided in the polishing unit PA shown in Figure 1 will be described in detail with reference to Figure 2.

[0034] Figure 2 is a schematic cross-sectional view of the polishing head. As shown in Figure 2, the polishing head 1 comprises a head base 5 fixed to the lower end of the head shaft 27, and an elastic membrane assembly 7 attached to the lower end of the head base 5. The elastic membrane assembly 7 is attached to the head base 5 via a connecting mechanism (not shown).

[0035] The elastic membrane assembly 7 comprises a retainer ring 3 that directly presses against the polishing surface 19a, an elastic membrane 10 that presses the wafer W against the polishing surface 19a, and a carrier 8 to which the elastic membrane 10 is attached. The retainer ring 3 is positioned to surround the wafer W and the elastic membrane 10 and is connected to the carrier 8. The elastic membrane 10 is attached to the carrier 8 so as to cover the lower surface of the carrier 8.

[0036] The elastic membrane 10 has a plurality (eight in the figure) of concentrically arranged annular peripheral walls 10a, 10b, 10c, 10d, 10e, 10f, 10g, and 10h. Peripheral wall 10h corresponds to the side wall located at the outermost periphery of the elastic membrane 10. These plurality of peripheral walls 10a to 10h form a central circular pressure chamber 12 located in the center, annular edge pressure chambers 14a and 14b located at the outermost periphery, and five annular intermediate pressure chambers (first to fifth intermediate pressure chambers) 16a, 16b, 16c, 16d, and 16e located between the central pressure chamber 12 and the edge pressure chambers 14a and 14b, between the upper surface of the elastic membrane 10 and the lower surface of the carrier 8. In this embodiment, the number of pressure chambers formed in the elastic membrane 10 is eight, but the number of pressure chambers is not limited to this embodiment. The number of pressure chambers may be increased or decreased depending on the structure of the elastic membrane 10.

[0037] Within the carrier 8, there are flow paths 20 that communicate with the central pressure chamber 12, flow paths 22 that communicate with the edge pressure chamber 14a, flow paths 24f that communicate with the edge pressure chamber 14b, and flow paths 24a, 24b, 24c, 24d, and 24e that communicate with the intermediate pressure chambers 16a, 16b, 16c, 16d, and 16e, respectively.

[0038] Flow paths 20, 22, 24a, 24b, 24c, 24d, 24e, and 24f are connected to fluid lines 26, 28, 30a, 30b, 30c, 30d, 30e, and 30f, respectively, and these fluid lines are connected to a pressure regulator 65 via a rotary joint 82. The pressure regulator 65 is electrically connected to a control device 40, which can control the operation of the pressure regulator 65. The pressure regulator 65 constitutes part of the polishing unit PA.

[0039] A retainer chamber 34 is formed directly above the retainer ring 3, and the retainer chamber 34 is connected to the pressure regulator 65 via a flow path 36 and a fluid line 38 formed within the carrier 8.

[0040] The control device 40, while holding the wafer W with the polishing head 1, controls the pressure of the pressurized fluid supplied to each pressure chamber 12, 14a, 14b, 16a to 16e, thereby pressing the wafer W with different pressures in each of the multiple areas on the elastic film 10 along the radial direction of the wafer W.

[0041] In this way, the control device 40 can adjust the pressing force applied to the wafer W for each region of the wafer W by adjusting the pressure of the fluid supplied to each pressure chamber 12, 14a, 14b, 16a-16e formed between the carrier 8 and the elastic membrane 10. Similarly, the control device 40 can adjust the pressing force applied by the retainer ring 3 to the polishing pad 19 by controlling the pressure of the pressurized fluid supplied to the retainer chamber 34.

[0042] The carrier 8 is formed from a resin such as engineering plastic (e.g., PEEK), and the elastic membrane 10 is formed from a rubber material with excellent strength and durability, such as ethylene propylene rubber (EPDM), polyurethane rubber, or silicone rubber. Details of the pressure regulating device 65 will be described with reference to Figure 3.

[0043] Figure 3 is a schematic diagram showing a pressure regulating device. As shown in Figure 3, the fluid lines 26, 28, 30a~30f, and 38 are each provided with on / off valves V1, V2, V3, V4, V5, V6, V7, V8, and V9, and pressure regulators R1, R2, R3, R4, R5, R6, R7, R8, and R9, respectively. As shown in Figure 3, the fluid lines 26, 28, 30a, 30b, 30c, 30d, 30e, 30f, and 38 are connected to the fluid supply source 32.

[0044] Fluid lines 26, 30a-30f, 28, and 38 are connected to atmospheric release lines 91-99. Atmospheric release valves L1-L9 are attached to these atmospheric release lines 91-99, respectively.

[0045] Pressure regulators R1 to R9 each have a pressure adjustment function that adjusts the pressure of the pressurized fluid supplied from the fluid supply source 32 to the pressure chambers 12, 14a, 14b, 16a to 16e and the retainer chamber 34. The pressure regulators R1 to R9, on / off valves V1 to V9, and atmospheric release valves L1 to L9 are connected to a control device 40, which is configured to control their operation. When atmospheric release valves L1 to L9 are activated, each chamber 12, 14a, 14b, 16a to 16e, and 34 are opened to the atmosphere and become atmospheric pressure.

[0046] Although not shown in the diagram, vacuum lines are connected to fluid lines 26, 28, 30a, 30b, 30c, 30d, 30e, 30f, and 38, respectively, and negative pressure is created in each chamber 12, 14a, 14b, 16a-16e, and 34 through these vacuum lines. In this way, each chamber 12, 14a, 14b, 16a-16e, and 34 is adjusted to one of three pressure states—pressurized, negative pressure, or atmospheric pressure—by the pressure adjustment device 65.

[0047] When a vacuum is formed in the intermediate pressure chamber 16c with the wafer W in contact with the lower surface of the elastic film 10, the wafer W is held by the polishing head 1 by vacuum suction. Furthermore, when pressurized fluid is supplied to the intermediate pressure chamber 16c with the wafer W separated from the polishing pad 19, the wafer W is released from the polishing head 1.

[0048] If the elastic membrane 10 is replaced as needed for maintenance or other purposes, the replaced new elastic membrane 10 does not have sufficient elasticity (flexibility). Therefore, even if a fluid with a predetermined pressure is supplied to each pressure chamber 12, 14a, 14b, 16a-16e, the wafer W cannot be pressed against the polishing surface 19a of the polishing pad 19 with the desired pressing force.

[0049] In this embodiment, the elasticity (flexibility) of the elastic film 10 can be improved by performing a break-in process (in other words, an initialization process for the elastic film 10) to improve the elasticity of the elastic film 10. Therefore, the wafer W can be pressed against the polishing surface 19a of the polishing pad 19 with a desired pressing force. As a result, the surface of the wafer W can be polished stably.

[0050] Figure 4 is a schematic diagram showing the state after the elastic membrane assembly has been removed from the polishing head shown in Figure 2. As shown in Figure 4, the elastic membrane assembly 7 is removed from the polishing head 1. Then, the elastic membrane 10 is removed from the carrier 8 of the removed elastic membrane assembly 7, and the new elastic membrane 10 is attached to the carrier 8 of the elastic membrane assembly 7. The elastic membrane assembly 7 with the new elastic membrane 10 attached is attached to the elastic membrane 10 initialization device, which will be described later, and the break-in process for the new elastic membrane 10 is performed. The details of the elastic membrane 10 initialization device (hereinafter sometimes simply referred to as the initialization device) will be explained below with reference to Figure 5.

[0051] Figure 5 shows one embodiment of the initialization device. The initialization device 50 shown in Figure 5 includes a pressurizing device 55 that pressurizes the elastic membrane 10 to expand it, and an expansion amount detection device 58 that detects the amount of expansion of the elastic membrane 10.

[0052] The initialization device 50 comprises a housing box 51 for housing a pressurizing device 55 (and an elastic membrane assembly 7 connected to the pressurizing device 55), a main body 53 on which the housing box 51 is mounted, and a mounting section 54 for attaching the elastic membrane assembly 7. The mounting section 54 is configured to attach the elastic membrane assembly 7 to a predetermined position inside the housing box 51.

[0053] Figure 6 shows a pressurizing device and an expansion amount detection device. Figure 7 shows a pressurizing device. As shown in Figures 6 and 7, the pressurizing device 55 includes ring-shaped pressing fixtures 100 positioned in each of the pressure chambers 12, 14a, 14b, and 16a-16e of the elastic membrane 10, and a biasing device 101 that presses the pressing fixtures 100 against the elastic membrane 10 (more specifically, the lower surface of the elastic membrane 10).

[0054] The number of pressing fixtures 100 corresponds to the number of pressure chambers in the elastic membrane 10. In this embodiment, eight pressing fixtures 100 are arranged concentrically along the radial direction of the elastic membrane 10. The pressurizing device 55 includes a plurality of connecting rods 102 connected to each pressing fixture 100. These connecting rods 102 are arranged at equal intervals along the circumferential direction of the elastic membrane 10. The biasing device 101 is connected to each connecting rod 102 and transmits the biasing force of the biasing device 101 to the pressing fixtures 100 through the connecting rods 102.

[0055] In this embodiment, the number of biasing devices 101 corresponds to the number of connecting rods 102, but the number of biasing devices 101 is not limited to this embodiment as long as a biasing force can be transmitted to the pressing jig 100.

[0056] In the embodiments shown in Figures 6 and 7, the biasing device 101 is an air cylinder that drives the pressing jig 100 in a direction toward and toward the lower surface of the elastic membrane 10. However, the biasing device 101 is not necessarily limited to an air cylinder, as long as it has a structure that drives the pressing jig 100 in a direction toward and toward the lower surface of the elastic membrane 10. For example, the biasing device 101 may be a linear motor.

[0057] The control device 40 is electrically connected to the biasing device 101 and can control the operation of the biasing device 101. In Figure 6, the control device 40 operates the biasing device 101 corresponding to the pressing jig 100 located in the pressure chamber 14b, pressing the pressing jig 100 against the elastic membrane 10. Subsequently, the control device 40 operates the biasing device 101 to raise the pressing jig 100.

[0058] The control device 40 may operate all the biasing devices 101 to press the pressing fixtures 100 located in all the pressure chambers against the elastic membrane 10, or it may operate at least one of the biasing devices 101. In this way, the control device 40 can improve the elasticity (flexibility) of the elastic membrane 10 by operating the biasing devices 101 to lower and raise the pressing fixtures 100. Therefore, the initialization device 50 can equalize the pressing force against the wafer W, and as a result, the polishing unit PA can stably polish the surface of the wafer W.

[0059] In the embodiment shown in Figure 6, the expansion amount detection device 58 is positioned to the side of the lower surface of the elastic membrane 10 and is a photosensor that irradiates light in the radial direction of the elastic membrane 10. The expansion amount detection device 58 is configured to detect a signal corresponding to the expansion amount of the elastic membrane 10 based on the intensity of light which changes according to the expansion amount of the elastic membrane 10. The expansion amount detection device 58 is electrically connected to the control device 40 and sends the detection signal to the control device 40. The control device 40 determines the expansion amount of the elastic membrane 10 based on the detection signal sent from the expansion amount detection device 58.

[0060] Figure 8(a) shows an expansion amount detection device as a transmissive optical sensor. Figure 8(b) shows an expansion amount detection device as a reflective optical sensor. As shown in Figures 8(a) and 8(b), the structure of the expansion amount detection device 58 as an optical sensor is not particularly limited.

[0061] As shown in Figure 8(a), the expansion amount detection device 58 may include a light-emitting unit 58a and a light-receiving unit 58b positioned on both sides of the elastic membrane 10. In this case, the light emitted from the light-emitting unit 58a is received by the light-receiving unit 58b. The control device 40 determines the expansion amount of the elastic membrane 10 based on the amount (intensity) of the light received by the light-receiving unit 58b.

[0062] More specifically, when the pressurizing device 55 pressurizes the elastic membrane 10, the elastic membrane 10 expands. The expanded elastic membrane 10 blocks at least a portion of the light emitted from the light-emitting unit 58a. Therefore, the amount of light received by the light-receiving unit 58b changes according to the amount of expansion of the elastic membrane 10. The amount of light and the amount of expansion of the elastic membrane 10 are correlated with each other, and the storage device 40a of the control device 40 stores the correlation (i.e., correlation data) between the amount of light and the amount of expansion of the elastic membrane 10. The control device 40 determines the amount of expansion of the elastic membrane 10 based on the signal detected by the light-receiving unit 58b and the above correlation.

[0063] As shown in Figure 8(b), the expansion amount detection device 58 may be a reflective type optical sensor positioned to the side of the elastic membrane 10. In this case, the expansion amount detection device 58 is an optical sensor incorporating a light-emitting unit 58a and a light-receiving unit 58b. At least a portion of the light emitted from the expansion amount detection device 58 is reflected by the expanded elastic membrane 10, and the expansion amount detection device 58 receives the reflected light.

[0064] The amount of reflected light changes according to the amount of expansion of the elastic film 10, and the amount of reflected light (intensity) and the amount of expansion of the elastic film 10 are correlated with each other. The storage device 40a stores the correlation (i.e., correlation data) between the amount of reflected light and the amount of expansion of the elastic film 10. Therefore, the control device 40 determines the amount of expansion of the elastic film 10 based on the signal detected by the expansion amount detection device 58 and the above correlation.

[0065] If the expansion amount detection device 58 is a transmissive or reflective optical sensor, the initialization device 50 may include at least one expansion amount detection device 58. When the pressurizing device 55 pressurizes the elastic membrane 10, the edge pressure chambers 14a, 14b and intermediate pressure chambers 16a to 16e, excluding the central pressure chamber 12, expand in an annular shape as a whole. By providing multiple expansion amount detection devices 58, the control device 40 can accurately and three-dimensionally evaluate the expansion amount of the elastic membrane 10 based on the signals detected by the multiple expansion amount detection devices 58.

[0066] Figure 9 shows another embodiment of the expansion amount detection device. As shown in Figure 9, the expansion amount detection device 58 may be a distance sensor that irradiates light from below the elastic membrane 10 and receives reflected light. In the embodiment shown in Figure 9, the expansion amount detection device 58 is configured to be movable in the radial direction (horizontal direction in this embodiment) of the elastic membrane 10. The expansion amount detection device 58, as a distance sensor, is configured to detect a signal corresponding to the expansion amount of the elastic membrane 10 based on the change in distance between the expansion amount detection device 58 and the elastic membrane 10 due to its movement.

[0067] As shown in Figure 9, when the pressurizing device 55 pressurizes the elastic membrane 10, the elastic membrane 10 expands. When the elastic membrane 10 expands, the distance between the lower surface of the elastic membrane 10 and the expansion amount detection device 58 changes. The storage device 40a stores the correlation (i.e., correlation data) between this distance and the amount of expansion of the elastic membrane 10. Therefore, the control device 40 determines the amount of expansion of the elastic membrane 10 based on the signal detected by the expansion amount detection device 58 and the above correlation.

[0068] Figure 10 shows another embodiment of the expansion amount detection device. As shown in Figure 10, the expansion amount detection device 58 may be an imaging device positioned below the elastic membrane 10. In this case, the expansion amount detection device 58, acting as an imaging device, images the elastic membrane 10 before and after expansion and sends the images (detection signals) of the elastic membrane 10 to the control device 40. The control device 40 compares the images of the elastic membrane 10 before and after expansion and determines the amount of expansion of the elastic membrane 10 based on the images of the changing elastic membrane 10.

[0069] As shown in Figure 10, the expansion amount detection device 58, which acts as an imaging device, may generate a moiré fringe image based on a first pattern sheet 60 placed between the expansion amount detection device 58 and the elastic membrane 10, and a second pattern sheet 61 attached to the surface of the elastic membrane 10.

[0070] Figure 11 shows a changing moiré fringe image. When the pressurizing device 55 pressurizes the elastic membrane 10, the elastic membrane 10 expands, and the fringe pattern of the second pattern sheet 61 attached to the elastic membrane 10 changes. The moiré fringe image changes along with the change in the second pattern sheet 61, and the changed moiré fringe image is captured by the expansion amount detection device 58.

[0071] The pattern of change in the moiré fringe image is determined according to the amount of expansion of the elastic membrane 10, and a correlation exists between the pattern of change in the moiré fringe image and the amount of expansion of the elastic membrane 10. The storage device 40a stores the above correlation (i.e., correlation data). Therefore, the control device 40 determines the amount of expansion of the elastic membrane 10 based on the signal (more specifically, the image) detected by the expansion amount detection device 58 and the above correlation.

[0072] Figure 12 is a diagram showing the control flow of the initialization process of the elastic membrane by the control device. As shown in step S101 of Figure 12, the control device 40 operates the pressurizing device 55 to expand the elastic membrane 10. The expansion amount detection device 58 detects the amount of expansion of the elastic membrane 10 by the expansion of the elastic membrane 10 (see step S102) and sends a detection signal to the control device 40.

[0073] The control device 40 compares the amount of expansion of the elastic membrane 10 detected by the expansion amount detection device 58 with a predetermined set expansion amount (more specifically, a target expansion amount) (see step S103). The target expansion amount is a numerical value that serves as an indicator of the target elasticity of the elastic membrane 10 (the amount of elongation of the elastic membrane 10). For example, the target expansion amount may be determined based on the expansion amount of the elastic membrane 10 that has been used in the past and is judged to be sufficiently initialized to the extent that it can exhibit the desired polishing performance. The target expansion amount is pre-stored in the storage device 40a.

[0074] After step S103, the control device 40 determines whether the expansion amount of the elastic membrane 10 has reached the target expansion amount (see step S104). If the expansion amount has not reached the target expansion amount (see "NO" in step S104), the control device 40 repeats steps S101 to S103. In this way, the control device 40 repeats the pressurizing operation of the elastic membrane 10 by the pressurizing device 55 until the expansion amount of the elastic membrane 10 reaches the target expansion amount.

[0075] If the expansion amount reaches the target expansion amount (see "YES" in step S104), the control device 40 determines that the initialization of the elastic membrane 10 is complete (see step S105). In other words, the control device 40 completes the break-in process. The control device 40 may also issue a signal indicating the completion of the initialization of the elastic membrane 10.

[0076] According to this embodiment, the control device 40 can improve the elasticity of the elastic membrane 10 accurately and without excess by comparing the amount of expansion of the elastic membrane 10 detected by the expansion amount detection device 58 with the target expansion amount. In this embodiment, the break-in process of the elastic membrane 10 is performed by an initialization device 50 different from the polishing unit PA. Therefore, the initialization device 50 can prevent a decrease in the operating rate of the polishing device due to increased downtime.

[0077] After the break-in process of the elastic film 10 is completed, the elastic film assembly 7 is removed from the initialization device 50 and attached to the head base 5 of the polishing head 1. Then, the polishing unit PA performs a trial polish with the new elastic film 10 only once, and if there are no problems, polishes the wafer W as usual.

[0078] As described above, conventionally, the elasticity of the elastic film 10 is improved by polishing the dummy wafer using a new elastic film 10. Therefore, it is preferable that the initialization apparatus 50 performs the break-in process under conditions as similar as possible to those in which the dummy wafer was polished using a new elastic film 10.

[0079] When polishing a dummy wafer using a new elastic film 10, the frictional heat generated by polishing the dummy wafer is transferred to the elastic film 10, causing it to heat up. Furthermore, since the polishing head 1 rotates while holding the dummy wafer to polish it, the rotational force of the polishing head 1 is transmitted to the elastic film 10. Therefore, the initialization device 50 may be equipped with a heating structure for heating the elastic film 10 and / or a rotation mechanism for rotating the elastic film 10.

[0080] Figures 13(a) to 13(d) show multiple embodiments of a heating structure for heating an elastic membrane. In Figures 13(a) to 13(d), the biasing device 101 is omitted from the illustration for clarity. The initialization device 50 includes a heating structure 110 for heating the elastic membrane 10.

[0081] In the embodiment shown in Figure 13(a), the heating structure 110 comprises a heater 111 and a pressurizing device 55 (more specifically, a pressing jig 100 and a connecting rod 102) connected to the heater 111. The heater 111 transmits the heat generated by its heating to the pressing jig 100 through the connecting rod 102, thereby heating the pressing jig 100. When the biasing device 101 presses the heated pressing jig 100 against the elastic membrane 10, the elastic membrane 10 is heated. In this case, the pressing jig 100 and the connecting rod 102 may be composed of heat transfer members.

[0082] For example, if the pressing jig 100 and the connecting rod 102 have a structure through which fluid flows, the heater 111 may have a structure that supplies heating fluid to the pressing jig 100 and the connecting rod 102. For example, the heater 111 may be a nichrome wire heater that heats the pressing jig 100 and the connecting rod 102.

[0083] In the embodiment shown in Figure 13(b), the heating structure 110 includes a planar heating element positioned below the elastic membrane 10. The planar heating element has a sheet shape (or plate shape) and is larger in size than the elastic membrane 10. When the biasing device 101 presses the pressing jig 100 against the elastic membrane 10, the elastic membrane 10 expands and comes into contact with the heating structure 110, which acts as a planar heating element. The elastic membrane 10 is heated by this contact.

[0084] In the embodiment shown in Figure 13(c), the heating structure 110 includes a heating lamp (for example, a halogen lamp) positioned below the elastic membrane 10. In this embodiment, the elastic membrane 10 is heated by the heat emitted from the heating structure 110, which acts as a heating lamp.

[0085] In the embodiment shown in Figure 13(d), the heating structure 110 includes a heat dissipation device (e.g., a hot air device, a far-infrared device) positioned below the elastic membrane 10. In this embodiment, the elastic membrane 10 is heated by the heat emitted from the heating structure 110, which acts as a heat dissipation device.

[0086] In Figures 13(a) to 13(d), the control device 40 may operate the heating structure 110 to heat the elastic film 10 to a temperature equivalent to the temperature of the frictional heat applied to the elastic film 10 when polishing a wafer W held by the polishing head 1 to which the elastic film 10 is attached. With this configuration, the initialization device 50 can perform break-in processing under the same conditions as when polishing a dummy wafer using a new elastic film 10.

[0087] Figure 14 shows a rotating mechanism for rotating the elastic membrane. As shown in Figure 14, the initialization device 50 includes a rotating mechanism 120 for rotating the elastic membrane 10 (more specifically, the elastic membrane assembly 7) and a pad member 130 against which the elastic membrane 10 is pressed.

[0088] The rotating mechanism 120 includes a rotating shaft 121 connected to the elastic membrane assembly 7 and a rotating motor 123 connected to the rotating shaft 121 via a timing belt 122. The rotating motor 123 is electrically connected to the control device 40. When the control device 40 operates the rotating motor 123, the elastic membrane assembly 7 (more specifically, the elastic membrane 10) rotates at a predetermined rotational speed via the rotating shaft 121 and the timing belt 122.

[0089] The pad member 130 is positioned between the lower surface of the elastic membrane 10 and the main body 53, and the lower surface of the elastic membrane 10 can contact the upper surface of the pad member 130. Therefore, the control device 40 expands the elastic membrane 10 with the pressurizing device 55 and presses the elastic membrane 10 against the pad member 130. In this state, when the control device 40 rotates the elastic membrane 10 by operating the rotation mechanism 120 (more specifically, the rotation motor 123), the rotational force of the rotation shaft 121 is transmitted to the elastic membrane 10. With this configuration, the initialization device 50 can perform break-in processing under the same conditions as when a dummy wafer is polished using a new elastic membrane 10. The control device 40 may rotate the rotation shaft 121 at the same rotational speed as the rotational speed of the polishing head 1 when polishing a dummy wafer.

[0090] Figure 15 shows another embodiment of the pressurizing device. In the embodiment shown in Figure 15, the initialization device 50 also includes a pressurizing device 55. In the embodiments described above, the configuration of the pressurizing device 55, which includes a pressing jig 100 and a biasing device 101, was described, but the configuration of the pressurizing device 55 is not limited to the embodiments described above. In one embodiment, the pressurizing device 55 includes a pressure regulating device 165 that supplies pressurized fluid to the pressure chambers 12, 14a, 14b, 16a-16e of the elastic membrane 10 and opens the pressure chambers 12, 14a, 14b, 16a-16e to the atmosphere. The configuration of the pressure regulating device 165 is the same as the configuration of the pressure regulating device 65 described above (see Figure 3), so a detailed description of the pressure regulating device 165 is omitted.

[0091] In the embodiment shown in Figure 15, the configuration of the pressure regulating device 165 is the same as that of the pressure regulating device 65. Therefore, the control device 40 can expand the elastic membrane 10 by supplying pressurized fluid, and improve the elasticity of the elastic membrane 10 by repeatedly supplying pressurized fluid and releasing it to the atmosphere as needed.

[0092] In this embodiment as well, the initialization device 50 equipped with the pressure adjustment device 165 may also be equipped with the expansion amount detection device 58 described above. In one embodiment, the initialization device 50 equipped with the pressure adjustment device 165 may be equipped with a heating structure corresponding to the heating structure 110 described above (see Figures 13(a) to 13(d)). Alternatively, the initialization device 50 can use a heated fluid as the pressurized fluid, thereby making the pressurized fluid function as the heating structure 110.

[0093] Figure 16 shows a polishing apparatus comprising a polishing unit and a transfer station. Figure 17 is a perspective view showing the transfer station. The wafer W polished in the polishing unit PA is transported via the transfer station 200 to the cleaning unit 250 for cleaning the wafer W. The wafer W transported to the cleaning unit 250 is cleaned in a cleaning module (not shown) and then dried in a drying module (not shown). In this way, a series of processes including polishing, cleaning, and drying are performed on the wafer W.

[0094] The transfer station 200 is located adjacent to the polishing table 18. The transfer station 200 is provided for attaching the wafer W to the polishing head 1 and / or removing the wafer W from the polishing head 1. In this embodiment, the transfer station 200 is configured to remove the wafer W from the polishing head 1.

[0095] As shown in Figure 16, when the head arm 64 rotates around the arm shaft 80 while the polishing head 1 is holding the wafer W, the wafer W is positioned at the transfer station 200 together with the polishing head 1. Below the wafer W that has been transported to the transfer station 200, a transport stage 210 is positioned. The wafer W that has been released from the polishing head 1 is received by the transport stage 210 and transported to the cleaning unit 250.

[0096] Figure 18 shows an expansion amount detection device located at the transfer station. As shown in Figure 18, the polishing apparatus may include an expansion amount detection device 158 located at the transfer station 200. The configuration of the expansion amount detection device 158 is the same as that of the expansion amount detection device 58 described above. In the embodiment shown in Figure 18, the expansion amount detection device 158 is a transmissive optical sensor comprising a light-emitting unit 158a and a light-receiving unit 158b, but it may also be a reflective optical sensor.

[0097] If the expansion amount detection device 158 is a transmissive or reflective optical sensor, the initialization device 50 may include at least one expansion amount detection device 158. By providing multiple expansion amount detection devices 158, the control device 40 can accurately and three-dimensionally evaluate the expansion amount of the elastic membrane 10.

[0098] The expansion amount detection device 158 is electrically connected to the control device 40. Therefore, the control device 40 may compare the expansion amount detected by the expansion amount detection device 158 with the set expansion amount (more specifically, the target expansion amount), and determine that the initialization of the elastic membrane 10 is complete when the expansion amount of the elastic membrane 10 reaches the target expansion amount.

[0099] In this embodiment, the polishing unit PA is equipped with a pressure regulating device 65 having a configuration similar to that of the pressurizing device 55 (more specifically, the pressure regulating device 165), and the transfer station 200 is equipped with an expansion amount detection device 158 having a configuration similar to that of the expansion amount detection device 58.

[0100] More specifically, the control device 40 moves the polishing head 1, which is fitted with a new elastic membrane 10, to the transfer station 200. In this state, the control device 40 operates the pressure adjustment device 65 to supply pressurized fluid, such as compressed air, from the fluid supply source 32 to at least one of the pressure chambers 12, 14a, 14b, 16a to 16e. An expansion amount detection device 158 located at the transfer station 200 detects the expansion amount of the elastic membrane 10. The control device 40 compares the expansion amount of the elastic membrane 10 detected by the expansion amount detection device 158 with a predetermined target expansion amount to determine whether the initialization of the elastic membrane 10 is complete (see Figure 12).

[0101] The control device 40 may operate the pressure regulating device 65 to repeatedly supply pressurized fluid to at least one of the pressure chambers 12, 14a, 14b, 16a-16e, and to release the pressure chamber to which the pressurized fluid has been supplied to the atmosphere. Repeated supply of pressurized fluid and release to the atmosphere corresponds to repeated pressurization operation of the pressurizing device 55.

[0102] In this embodiment, the transfer station 200 may have a configuration corresponding to the heating structure 110 (see Figures 13(a) to 13(d)).

[0103] In this embodiment, the pad member 130 (see Figure 14) may be provided in a position where the head arm 64 can rotate (or the transfer station 200 may have a configuration equivalent to the pad member 130). That is, the polishing head 1 rotates while pressing the elastic membrane 10 against the pad member 130, and the frictional heat generated between the pad member 130 and the polishing head 1 is transferred to the elastic membrane 10. In this case, the polishing head 1 corresponds to the rotation mechanism 120.

[0104] In one embodiment, the polishing unit PA may polish a dummy wafer with a polishing head 1 to which a new elastic film 10 is attached.

[0105] In this embodiment, the processing of wafer W must be interrupted during the polishing of the dummy wafer, resulting in downtime. However, since the control device 40 has a configuration that compares the expansion amount of the elastic film 10 with a predetermined target expansion amount and determines whether the initialization of the elastic film 10 is complete, problems such as insufficient break-in processing do not occur. The expansion amount of the elastic film 10 can be measured by the expansion amount detection device 158 during the polishing of multiple dummy wafers.

[0106] As mentioned above, even if the required number of dummy wafers for the break-in process are polished, if the break-in process is insufficient, the dummy wafers must be polished again, increasing downtime.

[0107] According to this embodiment, it is possible to prevent increased downtime caused by insufficient break-in processing. Furthermore, since the completion of the break-in processing can be determined according to the individual differences of the elastic film, it is possible to avoid polishing an excessive number of dummy wafers. In addition, it is possible to reduce process losses that occur in the conventional method, where insufficient break-in processing is discovered by polishing a monitor wafer to check the uniformity of polishing after polishing a predetermined number of dummy wafers, and then additional dummy wafer polishing is required.

[0108] When the elastic film 10 is used repeatedly, its condition will eventually change. The changed condition of the elastic film 10 can negatively affect the uniformity of the pressing force on the wafer W, potentially resulting in the wafer W becoming a defective product. Therefore, the following embodiment describes a configuration that can accurately determine the timing for replacing the elastic film 10.

[0109] Figure 19 shows the control flow of the process for determining the replacement timing of the elastic membrane by the control device. The replacement timing of the elastic membrane 10 is determined at the transfer station 200 while the elastic membrane 10 is attached to the polishing head 1. First, the control device 40 moves the polishing head 1 with the elastic membrane 10 attached to it to the transfer station 200.

[0110] In this state, the control device 40 operates the pressure regulating device 65 to supply pressurized fluid to at least one of the pressure chambers 12, 14a, 14b, 16a-16e, and expand the elastic membrane 10 (see step S201). The expansion amount detection device 158 located at the transfer station 200 detects the amount of expansion of the elastic membrane 10 (see step S202). The control device 40 compares the amount of expansion of the elastic membrane 10 detected by the expansion amount detection device 158 with a predetermined set expansion amount (more specifically, the replacement expansion amount) (see step S203). The replacement expansion amount is a numerical value (amount of elongation of the elastic membrane 10) that serves as an indicator of the elasticity of the elastic membrane 10, indicating when it is time to replace the elastic membrane. Generally, when the state of the elastic membrane 10 changes, the amount of expansion of the elastic membrane 10 becomes smaller (or larger) than that of a normal elastic membrane 10.

[0111] After step S203, the control device 40 determines whether the expansion amount of the elastic membrane 10 has reached the replacement expansion amount (see step S204). If the expansion amount has reached the replacement expansion amount (see "YES" in step S204), the control device 40 determines that the elastic membrane 10 has reached the replacement time (see step S205). If the expansion amount has not reached the replacement expansion amount (see "NO" in step S204), the control device 40 determines that the elastic membrane 10 has not yet reached the replacement time (see step S206).

[0112] At the transfer station 200, when the wafer W is released, a fluid (e.g., pure water, inert gas, etc.) is injected into the gap between the wafer W and the lower surface of the elastic film 10. If the elastic film 10 has reached its replacement time, it has a different elastic force than a normal elastic film 10. For example, the elastic film 10 may have hardened due to a change in its state. In this case, the elastic film 10 that holds the wafer W hardly stretches, so it is not possible to properly supply fluid between the wafer W and the lower surface of the elastic film 10, and as a result, the time required to release the wafer W may be extended.

[0113] Conversely, the elastic film 10 may soften due to a change in its state. In this case, the elastic film 10 that holds the wafer W may stretch more than necessary, potentially extending the time required to release the wafer W.

[0114] Therefore, the control device 40 may measure the time it takes for the wafer W, which is held by the polishing head 1 to which the elastic film 10 is attached, to detach from the elastic film 10, and determine when to replace the elastic film 10 based on the measured detachment time.

[0115] Figure 20 shows the control flow of the elastic film replacement timing determination process by the control device. As shown in step S301 of Figure 20, the control device 40 operates a release nozzle (not shown) to start injecting fluid into the gap between the wafer W and the elastic film 10. Subsequently, the control device 40 measures the wafer W detachment time. The wafer W detachment time is, for example, the time from when the fluid injection is started until the wafer W is received by the transport stage 210.

[0116] The control device 40 compares the detachment time with a predetermined reference time (see step S302) and determines whether the detachment time is longer than the reference time (see step S303). The reference time is an indicator of when the elastic membrane 10 should be replaced. If the detachment time is longer than the reference time (see "YES" in step S303), the control device 40 determines that the elastic membrane 10 has reached its replacement time (see step S304). If the detachment time is not longer than the reference time (see "NO" in step S303), the control device 40 determines that the elastic membrane 10 has not yet reached its replacement time (see step S305).

[0117] The embodiment shown in Figure 19 and the embodiment shown in Figure 20 may be combined. In this case, the control device 40 determines the timing for replacing the elastic membrane 10 based on two factors: the amount of expansion of the elastic membrane 10 and the time of release of the elastic membrane 10.

[0118] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of Symbols]

[0119] 1 Polishing head 2 Head body 3 Retainer Rings 5 Head base 7 Elastic membrane assembly 8 carriers 10 Elastic membrane 10a~10h Peripheral wall 12 Central pressure chamber 14a, 14b Edge pressure chamber 16a~16e Intermediate pressure chamber 18 Polishing Tables 18a Table axis 19 Polishing pads 19a Polished surface 20,22,24a~24f channel 25 Processing liquid supply nozzle 26, 28, 30a~30f Fluid lines 27 Head Shaft 29 Table motor 32 Fluid supply source 34 Retainer Chamber 36 channels 38 Fluid lines 40 Control device 40a storage device 40b Processing Unit 50 Initialization device 51 Storage Box 53 Main body 54 Mounting part 55 Pressurizing device 58 Expansion Amount Detection Device 58a Light-emitting section 58b Light receiving section 60 Pattern Sheet 1 61. Second Pattern Sheet 64 Head Arm 65 Pressure Regulator 66 Rotating Cylinder 67 Timing pulley 68 Head motor 70 Timing Pulley 80 Arm Shaft 81 Up and down movement device 82 Rotary Joint 83 Bearings 84 Bridge 88 Ball screw 88a Screw shaft 88b Nut 90 Servo motors 91-99 Open to the atmosphere line 100 Pressing jigs 101 Biasing device 102 Connecting rod 110 Heating structure 111 Heater 120 rotation mechanism 121 Rotating shaft 122 Timing belt 123 Rotary motor 130 Pad component 158 Expansion Amount Detection Device 158a Light-emitting section 158b Light receiving section 165 Pressure Regulator 200 handover stations 210 Transport Stage 250 Cleaning section

Claims

1. A pressurizing device that pressurizes an elastic membrane, which can be attached to the substrate holding mechanism of a polishing device, to expand the elastic membrane, An expansion amount detection device for detecting the amount of expansion of the elastic membrane, An elastic membrane initialization device comprising: a control device that compares the amount of expansion detected by the expansion amount detection device with a predetermined target expansion amount, and determines the completion of the initialization of the elastic membrane when the expansion amount reaches the target expansion amount.

2. The initializing device for the elastic membrane according to claim 1, wherein the initializing device for the elastic membrane includes a mounting portion for attaching an elastic membrane assembly that holds the elastic membrane.

3. The initialization device for an elastic membrane according to claim 1 or 2, wherein the control device repeats the pressurizing operation by the pressurizing device until the expansion amount of the elastic membrane reaches the target expansion amount.

4. The pressurizing device is A ring-shaped pressing jig placed in the pressure chamber of the elastic membrane, An initialization device for an elastic membrane according to claim 1 or claim 2, comprising a biasing device for pressing the pressing jig against the elastic membrane.

5. The initialization device for an elastic membrane according to claim 1 or 2, wherein the pressurizing device is equipped with a pressure adjustment device that supplies pressurized fluid to the pressure chamber of the elastic membrane and opens the pressure chamber of the elastic membrane to the atmosphere.

6. The initializing device for the elastic membrane according to claim 1 or claim 2, wherein the initializing device for the elastic membrane comprises a heating structure for heating the elastic membrane.

7. The initializing device for the elastic membrane is, A rotating mechanism for rotating the elastic membrane, The system comprises a pad member against which the elastic membrane is pressed, The control device is The pressurizing device is operated to press the elastic membrane against the pad member. An initializing device for an elastic membrane according to claim 1 or claim 2, wherein the elastic membrane is pressed against the pad member, and the rotation mechanism is operated to rotate the elastic membrane.

8. A polishing apparatus, A substrate holding mechanism with an elastic membrane attached, A pressurizing device that pressurizes the elastic membrane to expand it, An expansion amount detection device for detecting the amount of expansion of the elastic membrane, The system includes a control device that compares the amount of expansion detected by the expansion amount detection device with a predetermined set expansion amount. The aforementioned set expansion amount corresponds to the replacement expansion amount that indicates the replacement timing for the elastic membrane. The control device, when the expansion amount reaches the replacement expansion amount, emits a signal regarding the timing of replacement of the elastic membrane. The control device is The separation time until the substrate held by the substrate holding mechanism is separated from the elastic film is measured. A polishing device that determines the timing for replacing the elastic membrane based on the measured detachment time and the detected expansion amount.

9. A polishing device, A substrate holding mechanism with an elastic membrane attached, A pressurizing device that pressurizes the elastic membrane to expand it, An expansion amount detection device for detecting the amount of expansion of the elastic membrane, The system includes a control device that compares the amount of expansion detected by the expansion amount detection device with a predetermined set expansion amount. The aforementioned set expansion amount corresponds to the target expansion amount that indicates the target elasticity of the elastic membrane. The control device completes the initialization of the elastic membrane when the expansion amount reaches the target expansion amount.

10. A method for initializing an elastic film that can be attached to a substrate holding mechanism of a polishing device, The elastic membrane is pressurized by the pressurizing device to expand the elastic membrane, The expansion amount detection device detects the expansion amount of the elastic membrane, A method for initializing an elastic membrane, comprising comparing the amount of expansion detected by the expansion amount detection device with a predetermined target expansion amount, and determining the completion of the initialization of the elastic membrane when the expansion amount reaches the target expansion amount.

11. The elastic membrane assembly holding the elastic membrane is attached to an initialization device provided separately from the polishing device. The method for initializing an elastic membrane according to claim 10, wherein the elastic membrane is expanded by the pressurizing device without holding the substrate, thereby initializing the elastic membrane.

12. A method for initializing an elastic membrane according to claim 10 or claim 11, wherein the pressurizing operation by the pressurizing device is repeated until the amount of expansion of the elastic membrane reaches the target amount of expansion.

13. A method for initializing an elastic membrane according to claim 10 or claim 11, comprising heating the elastic membrane.

14. The elastic membrane is pressed against the pad member, A method for initializing an elastic membrane according to claim 10 or claim 11, wherein the elastic membrane is rotated while the elastic membrane is pressed against the pad member.

15. The method for initializing an elastic film according to claim 10, wherein the dummy wafer is polished in the substrate holding mechanism on which the elastic film is attached, thereby initializing the elastic film.

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