Data storage device and method for dynamic controller memory buffer allocation

Abstract

A data storage device and method for dynamic controller memory buffer allocation is disclosed. In one embodiment, a data storage device is provided comprising a memory and a controller having a controller memory buffer. The controller is configured to communicate with the non-volatile memory and is further configured to configure a size of the controller memory buffer, receive a request from a host to modify the size of the controller memory buffer during operation of the data storage device, and determine whether to grant the request to modify the size of the controller memory buffer. Other embodiments are possible, and each of the embodiments can be used alone or together in combination.

Description

Technical Field

[0001] (Cross - Reference to Related Applications) This application claims the benefit of U.S. Non - Provisional Patent Application No. 18 / 223,144, filed Jul. 18, 2023, entitled "Data Storage Device and Method for Dynamic Controller Memory Buffer Allocation", which claims the priority of U.S. Provisional Patent Application No. 63 / 437,171, filed Jan. 5, 2023, and the entire content thereof is incorporated herein by reference for all purposes.

Background Art

[0002] A host can store data in the memory within a data storage device and read data from the memory. The data storage device can include a controller that facilitates read and write operations to the memory. The controller can include a volatile memory referred to as a controller memory buffer. The size of the controller memory buffer is set by the data storage device during boot - up and remains constant during the operation of the data storage device.

Brief Description of the Drawings

[0004] overview As an introduction, the following embodiments relate to a data storage device and method for dynamic controller memory buffer allocation. In one embodiment, a data storage device is provided comprising non-volatile memory and a controller having a controller memory buffer. The controller is configured to communicate with the non-volatile memory and to configure the size of the controller memory buffer, and to receive requests from a host to modify the size of the controller memory buffer during the operation of the data storage device, and to determine whether to permit the request to modify the size of the controller memory buffer.

[0005] In some embodiments, the controller is further configured to use surplus space in the controller memory buffer that is not being used by the host.

[0006] In some embodiments, the controller is further configured to take the workload into consideration when determining whether to allow the request.

[0007] In some embodiments, the request includes a specific command.

[0008] In some embodiments, the controller and the host each include their respective controller memory buffer allocation modules.

[0009] In some embodiments, the controller is further configured to reject requests in response to requests that attempt to expand the size of the controller memory buffer beyond its maximum size.

[0010] In some embodiments, the controller is further configured to evict data from the controller memory buffer in order to permit the request.

[0011] In some embodiments, the controller is further configured to prioritize data in the controller memory buffer for eviction.

[0012] In some embodiments, the controller is further configured to send a confirmation to the host after granting the request.

[0013] In some embodiments, the non-volatile memory includes a three-dimensional memory.

[0014] Another embodiment provides a method performed on a host that communicates with a data storage device having a controller memory buffer. This method includes instructing the data storage device to configure the size of the controller memory buffer, receiving a request from the data storage device to modify the size of the controller memory buffer, and determining whether to allow the request from the data storage device to modify the size of the controller memory buffer.

[0015] In some embodiments, the data storage device is configured to use surplus space in the controller memory buffer that is not being used by the host.

[0016] In some embodiments, the workload is taken into consideration when determining whether to allow the request.

[0017] In some embodiments, the request includes a dedicated command.

[0018] In some embodiments, the controller and the host each include their respective controller memory buffer allocation modules.

[0019] In some embodiments, the method further includes determining to reject a request in response to a request to expand the size of the controller memory buffer beyond its maximum size.

[0020] In some embodiments, the method further includes evicting data from the controller memory buffer in order to permit the request.

[0021] In some embodiments, the method further includes causing prioritization of the data for eviction.

[0022] In some embodiments, the method further includes sending a confirmation to the data storage device after permitting the request.

[0023] In another embodiment, a data storage device is provided, comprising a non-volatile memory, a controller configured to communicate with the non-volatile memory, and a controller memory buffer, and means for changing the size of the controller memory buffer from an initial size to a modified size during operation of the data storage device.

[0024] Other embodiments are possible, and each embodiment can be used alone or in combination together. Accordingly, various embodiments are described herein with reference to the accompanying drawings.

[0025] Embodiment The following embodiments relate to data storage devices (DSDs). As used herein, "data storage device" refers to a device that stores data. Examples of DSDs include, but are not limited to, hard disk drives (HDDs), solid state drives (SSDs), tape drives, and hybrid drives. Illustrative details of DSDs are provided below.

[0026] Figures 1A to 1C show data storage devices suitable for use in implementing aspects of these embodiments. Figure 1A is a block diagram illustrating a data storage device 100 according to one embodiment of the subject matter described herein. Referring to Figure 1A, the data storage device 100 includes a controller 102 and a non-volatile memory which may consist of one or more non-volatile memory dies 104. As used herein, the term die refers to a collection of non-volatile memory cells and associated circuits for managing the physical operation of those non-volatile memory cells, formed on a single semiconductor substrate. The controller 102 interfaces with a host system and transmits command sequences for read, program, and erase operations to the non-volatile memory dies 104.

[0027] The controller 102 (which may be a non-volatile memory controller (e.g., flash, resistive random-access memory (ReRAM), phase-change memory (PCM), or magnetoresistive random-access memory (MRAM) controller)) can take the form of a computer-readable medium that stores computer-readable program code (e.g., firmware) executable by, for example, processing circuits, microprocessors or processors, as well as (micro)processors, logic gates, switches, application-specific integrated circuits (ASICs), programmable logic controllers, and embedded microcontrollers. The controller 102 can be composed of hardware and / or firmware to perform the various functions described below and shown in the flowchart. Some of the components shown as being inside the controller can also be stored outside the controller, and other components can be used. In addition, the phrase "operably communicate with ~" can mean communicating directly with one or more components, or communicating indirectly (wired or wirelessly) through one or more components, which may or may not be illustrated or described herein.

[0028] As used herein, a non-volatile memory controller is a device that manages data stored in non-volatile memory and communicates with a host, such as a computer or electronic device. In addition to the specific functions described herein, a non-volatile memory controller may have a variety of other functions. For example, a non-volatile memory controller may format the non-volatile memory to ensure it is functioning correctly, map out faulty non-volatile memory cells, and allocate spare cells to replace future failed cells. Some portions of the spare cells may be used to operate the non-volatile memory controller and hold firmware for implementing other features. While operating, the host can communicate with the non-volatile memory controller when it needs to read data from or write data to the non-volatile memory. If the host provides a logical address from which data is read / written, the non-volatile memory controller can translate the logical address received from the host into a physical address in the non-volatile memory. (Alternatively, the host can provide the physical address.) Non-volatile memory controllers can also perform a variety of memory management functions, though not limited to wear leveling (distributing writes to avoid wearing out certain blocks of memory that would otherwise be repeatedly written to) and garbage collection (moving only valid pages of data to new blocks after a block is full, so that full blocks can be erased and reused).

[0029] The non-volatile memory die 104 may include any suitable non-volatile storage medium, including resistive random-access memory (ReRAM), magnetoresistive random-access memory (MRAM), phase-change memory (PCM), NAND flash memory cells, and / or NOR flash memory cells. The memory cells may take the form of solid-state (e.g., flash) memory cells and may be once programmable, multiple times programmable, or many times programmable. The memory cells may also be single-level cells (SLC), multiple-level cells (MLC) (e.g., dual-level cells, triple-level cells (TLC), quad-level cells (QLC), etc.), or other memory cell level technologies currently known or to be developed may be used. Furthermore, the memory cells may be manufactured in two-dimensional or three-dimensional manner.

[0030] The interface between the controller 102 and the non-volatile memory die 104 may be any preferred flash interface, such as toggle mode 200, 400, or 800. In one embodiment, the data storage device 100 may be a solid-state drive. In another embodiment, the data storage device 100 may be part of an embedded data storage device.

[0031] In the example illustrated in Figure 1A, the data storage device 100 (sometimes referred to herein as a storage module) includes a single channel between the controller 102 and the non-volatile memory die 104; however, the subject matter described herein is not limited to having a single memory channel. For example, in some architectures (such as those shown in Figures 1B and 1C), depending on the capabilities of the controller, two, four, eight or more memory channels may exist between the controller and the memory device. In any of the embodiments described herein, even if a single channel is shown in the drawings, two or more channels may exist between the controller and the memory die.

[0032] Figure 1B illustrates a storage module 200 including a plurality of non-volatile data storage devices 100. Thus, the storage module 200 may include a host and a storage controller 202 that interfaces with a data storage device 204 containing the plurality of data storage devices 100. The interface between the storage controller 202 and the data storage devices 100 may be a bus interface such as a serial advanced technology attachment (SATA), a peripheral component interconnect express (PCIe) interface, or a double-data-rate (DDR) interface. In one embodiment, the storage module 200 may be a solid-state drive (SSD) or a non-volatile dual in-line memory module (NVDIMM), as found in server PCs or portable computing devices such as laptop computers and tablet computers.

[0033] Figure 1C is a block diagram illustrating a hierarchical storage system. The hierarchical storage system 250 includes a plurality of storage controllers 202, each controlling its own data storage device 204. A host system 252 can access the memory in the storage system 250 via a bus interface. In one embodiment, the bus interface may be a Non-Volatile Memory Express (NVMe) or Fibre Channel over Ethernet (FCoE) interface. In one embodiment, the system illustrated in Figure 1C may be a rack-mountable mass storage system accessible by multiple host computers, such as those found in data centers or other locations where mass storage is required.

[0034] Figure 2A is a block diagram illustrating the components of the controller 102 in more detail. The controller 102 includes a front-end module 108 that interfaces with a host, a back-end module 110 that interfaces with one or more non-volatile memory dies 104, and various other modules that perform the functions described herein in detail. Modules can take the form of, for example, packaged functional hardware units designed for use with other components, portions of program code (e.g., software or firmware) executable by a (micro) processor or processing circuit that typically performs a particular function among the related functions, or self-contained hardware or software components that interface with a larger system. The “means” for performing the functions can be implemented using at least one of the structures described herein for the controller, and may be pure hardware or a combination of hardware and computer-readable program code.

[0035] Referring again to the module of controller 102, the buffer manager / bus controller Ra isIt manages buffers in the random access memory (RAM) 116 and controls the internal bus arbitration of the controller 102. The read-only memory (ROM) 118 stores the system boot code. In Figure 2A, it is illustrated as being located separately from the controller 102, but in other embodiments, one or both of the RAM 116 and ROM 118 may be located within the controller. In yet another embodiment, parts of the RAM and ROM may be located both within and outside the controller 102.

[0036] The front-end module 108 includes a host interface 120 and a physical layer interface (PHY) 122 that provide an electrical interface with the host or a next-level storage controller. The choice of host interface 120 may depend on the type of memory being used. Examples of host interface 120 include, but are not limited to, Fibre Channel, Universal Serial Bus (USB), PCIe, and NVMe. The host interface 120 typically facilitates the transfer of data, control signals, and timing signals.

[0037] The backend module 110 includes an error correction code (ECC) engine 124 that encodes data bytes received from the host and decodes and error-corrects data bytes read from the non-volatile memory. The command sequencer 126 generates command sequences, such as program and erase command sequences, which are sent to the non-volatile memory die 104. The RAID (Redundant Array of Independent Drive) module 128 manages the generation of RAID parity and the recovery of failed data. RAID parity can be used as an additional level of integrity protection for data written to the memory device 104. In some cases, the RAID module 128 may be part of the ECC engine 124. The memory interface 130 provides command sequences to the non-volatile memory die 104 and receives status information from the non-volatile memory die 104. In one embodiment, the memory interface 130 may be a double data rate (DDR) interface, such as a toggle mode 200, 400, or 800 interface. The flash control layer 132 controls the overall operation of the backend module 110.

[0038] The data storage device 100 also includes other discrete components 140 such as an external electrical interface, external RAM, resistors, capacitors, or other components that can interface with the controller 102. In an alternative embodiment, a physical layer interface 122, a RAID module 128, a media management layer 138, and a buffer management / bus controller are also included. La One or more of these are optional components that are not required for the controller 102.

[0039] Figure 2B is a block diagram illustrating the components of the non-volatile memory die 104 in more detail. The non-volatile memory die 104 includes peripheral circuits 141 and a non-volatile memory array 142. The non-volatile memory array 142 includes non-volatile memory cells used to store data. The non-volatile memory cells may be any suitable non-volatile memory cells, including two-dimensional and / or three-dimensional ReRAM, MRAM, PCM, NAND flash memory cells and / or NOR flash memory cells. The non-volatile memory die 104 includes a data cache 156 for caching data. And address decoders 148, 150 and The peripheral circuitry 141 includes a state machine 152 that provides status information to the controller 102.

[0040] Returning to Figure 2A, the flash control layer 132 (referred to herein as the flash translation layer (FTL), or more generally, the “media management layer” since memory may not be flash) handles flash errors and interfaces with the host. In particular, the FTL, which may be an algorithm within the firmware, is responsible for the internal memory management and translates writes from the host into writes to memory 104. The FTL may be necessary because memory 104 may have limited durability, can only be written to a limited number of pages, and / or cannot be written to unless erased as a block. The FTL understands these potential limitations of memory 104, which may not be visible to the host. Therefore, the FTL attempts to translate writes from the host into writes to memory 104.

[0041] The FTL may include a logical-to-physical address (L2P) map (sometimes referred to herein as a table or data structure) and allocated cache memory. In this way, the FTL translates logical block addresses ("logical block addresses, LBAs") from the host to physical addresses in memory 104. The FTL may include, but is not limited to, power-off recovery (so that the data structures of the FTL can be recovered in the event of a sudden power loss) and wear leveling (so that wear across memory blocks is uniform to prevent excessive wear on some blocks, which would lead to a greater likelihood of failure).

[0042] Referring again to the drawings, Figure 3 is a block diagram of a host 300 and a data storage device 100 in one embodiment. The host 300 can take any preferred form, including but not limited to a computer, mobile phone, tablet, wearable device, digital video recorder, surveillance system, etc. In this embodiment, the host 300 (here, a computing device) comprises a processor 330 and a memory 340. In one embodiment, computer-readable program code stored in the host memory 340 configures the host processor 330 to perform the operations described herein. Thus, actions performed by the host 300 may be referred to herein as being performed by an application (computer-readable program code) running on the host 300. For example, the host 300 may be configured to send data (e.g., initially stored in the host's memory 340) to the data storage device 100 for storage in the data storage device's memory 104.

[0043] Referring back to Figure 2A, the controller 102 in this embodiment also includes volatile memory (e.g., DRAM) referred to herein as controller memory buffer (CMB) 103. In one embodiment, the CMB 103 is a general-purpose read / write memory that can be used by the data storage device 100 and / or the host 300 for any preferred purpose, such as caching a portion of the logical-physical address map stored in the non-volatile memory 104, storing submission and / or completion queues, or storing control or other data.

[0044] The following paragraphs provide details of the implementation of the CMB103 under the NVMe specification. These details are provided for illustrative purposes only, and it should be understood that details discussed herein (related to the NVMe specification or otherwise) should not be incorporated into the claims unless expressly stated otherwise.

[0045] In one embodiment, controller 102 indicates support for CMB103 by setting CAP.CMBS to "1". When this bit is set to "1", controller 102 indicates the properties of CMB103 via the CMBLOC and CMBSZ properties. Host 300 indicates its intention to use CMB102 by setting CMBMSC.CRE to "1". As mentioned above, CMB103 can be used for various purposes, and controller 102 can indicate for what purpose CMB103 can be used by setting a support flag in the CMBSZ property. The PCI Express address range of the CMB can be used for external memory read and write requests to CMB103. The PCI Express base address of CMB103 can be defined by the PCI Base Address Register (BAR) indicated by CMBLOC.BIR, and the offset can be indicated by CMBLOC.OFST. The size of CMB103 can be indicated by CMBSZ.SZ. Controller 102 can use the controller address range of the CMB to reference CMB 103 at an address supplied by host 300. The PCI Express address range and the controller address range of CMB 103 may differ, but both ranges can have the same size, and equivalent offsets within each range can have a one-to-one correspondence.

[0046] Host 300 can configure the controller address range via the CMBMSC property. Host 300 can enable the controller memory space of the CMB via the CMBMSC.CMSE bit. When the controller memory space is enabled, if Host 300 supplies an address that references the controller address range of the CMB, Controller 102 can direct memory read or write requests to CMB 103 for this address. CMB 103 may be used by Host 300 to store a submission queue so that Controller 102 can read addresses directly from CMB 103 when a read command is issued. The completion queue in CMB 103 may be used for peer-to-peer or other applications. For writing small amounts of data, it may be advantageous to have Host 300 write the data and / or metadata to CMB 103 rather than having Controller 102 fetch the data and / or metadata from Host Memory 340.

[0047] Controller 102 may support Physical Region Pages (PRPs) and Scatter Gather Lists (SGLs) within the CMB 103. If the CMBLOC.CDPMLS bit is cleared to "0", for a particular PRP list or SGL associated with a single command, all memory associated with the PRP list or SGL can be located either entirely within the CMB 103 or entirely outside the CMB 103. Controller 102 may support data and metadata within the CMB 103. If the CMBLOC.CDMMMS bit is cleared to "0", all data and metadata associated with a particular command, if any, can be located either entirely within the CMB 103 or entirely outside the CMB 103. The address space allocated for the CMB 103 may be 4KiB aligned. Controller 102 may allocate the CMB 103 on an 8KiB boundary. The controller 102 can support burst transactions up to the maximum payload size, support byte enablement, and support arbitrary byte alignment.

[0048] The size of CMB103 can be indicated by the CMBSZ.SZ field from the NVMe specification. This configuration is set during boot by the data storage device 100. The size of CMB103 remains constant during the operation of the data storage device 100, and the space dedicated to CMB103 may remain empty if the host 300 does not utilize it.

[0049] The following embodiments can be used to modify the size of the CMB 103 during the operation of the data storage device 100. These embodiments can improve the flexibility of the CMB implementation and the utilization of DRAM, resulting in faster high-end storage controller operation. In one embodiment, the host 300 can modify the CMB size according to its current needs and conditions, and the data storage device 100 can use the surplus space in the CMB 103 when the host 300 does not need it (and coordinate its operation with the host 300 to better utilize the controller RAM). In one embodiment, a modified interface can be used between the host 300 and the data storage device 100, and the host 300 can use a dedicated command to indicate the CMB size required for its operation (e.g., larger or smaller than the CMB size currently in use). Referring to the embodiment shown in Figure 4, ,host 50 It may have a host CMB allocation module 55, and the controller 102 in the data storage device 100, CMB400 and The memory controller CMB allocation module 455 can be included. ru. The storage controller CMB allocation module 455, which may be computer-readable program code executed by a processor within controller 102, can control the CMB size according to host commands or other trigger events (for example, to dynamically change the host control address). 50 internal process Sa Therefore, the host CMB allocation module 55, which can be made into computer-readable program code that is executed, can issue and receive commands related to CMB size modification.

[0050] The allocation modules 55 and 455 can take the current workload into consideration in order to change the CMB size according to the expected load. For example, in a low-intensity workload with short-length data, the data storage device 100 may decide to use the CMB 103 to store user data because the CMB is relatively small and the associated overhead is not large. In a high-intensity, long-sequential workload, CMB transfers and fetches may have additional unnecessary overhead that the host 300 can avoid, while the host 300 can use the CMB 103 for its own purposes.

[0051] Figure 5 is a flowchart 500 of a method for one embodiment of dynamic controller memory buffer allocation by host 300. As shown in Figure 5, first, host 300 sets some initial CMB size (and / or purpose) (operation 510). Then, after some workload change or other trigger (e.g., environmental change, change in workload locality, power instability, increase in bit error rate (BER) etc.), host CMB allocation module 55 issues a command to change the CMB size (and / or purpose) (operation 520). Then, controller CMB allocation module 455 analyzes the current CMB usage and, depending on host 300, confirms or rejects the request (operation 530). For example, if host 300 requests to expand CMB 103 beyond its maximum size, controller CMB allocation module 455 may reject the request (operation 540). However, if controller CMB allocation module 455 can permit the request, controller CMB allocation module 455 modifies the CMB size as requested (operation 550). This may involve evicting some of the controller data currently present in the DRAM to free up space. The controller CMB allocation module 455 can prioritize which data can be evicted with minimal impact on controller performance. After freeing the corresponding space requested by the host 300, the controller CMB allocation module 455 may return an acknowledgment note to the host 300 (operation 560).

[0052] Figure 6 is a flowchart 600 of a method for dynamic controller memory buffer allocation by data storage device 100 in one embodiment. In this embodiment, controller 102 may issue a request to modify the CMB size. The request may arrive in the form of an asynchronous event and may be triggered by a controller that needs to use DRAM (e.g., some critical management operation, identification of an unusually low hit rate of controller metadata cached in DRAM, or identification of host 300 not fully using the allocated space for an extended period). As shown in Figure 6, first, host 300 sets some initial CMB size (and / or purpose) (operation 610). Next, after a critical management operation or other trigger, controller CMB allocation module 455 issues an asynchronous event to host 300 to change the CMB size (operation 620). Then, host CMB allocation module 55 responds to the controller command (operation 630). For example, if controller 102 requests that CMB 103 be expanded beyond its maximum size, host CMB allocation module 55 may reject the request (operation 640). However, if host CMB allocation module 55 can permit the request, it will modify the CMB size accordingly (operation 650). Then, controller CMB allocation module 455 issues an asynchronous event to host 300 to use the modified CMB size (operation 660).

[0053] There are several advantages associated with these embodiments. For example, when used with NVMe data storage devices that have a CMB to support high-throughput use cases, these embodiments can be used to enable better integration between the CMB and those data storage devices. This can improve the utilization of their CMB / DRAM, resulting in reduced power consumption and improved performance in certain workloads.

[0054] Finally, as mentioned above, any suitable type of memory can be used. Semiconductor memory devices include volatile memory devices such as dynamic random access memory ("DRAM") or static random access memory ("SRAM") devices, non-volatile memory devices such as resistive random access memory ("ReRAM"), electrically erasable programmable read-only memory ("EEPROM"), flash memory (which can also be considered a subset of EEPROM), ferroelectric random access memory ("FRAM"), and magnetoresistive random access memory ("MRAM"), as well as other semiconductor elements capable of storing information. Each type of memory device may have a different configuration. For example, flash memory devices may be configured in a NAND or NOR configuration.

[0055] Memory devices can be formed from passive and / or active elements in any combination. As a non-limiting example, passive semiconductor memory elements include ReRAM device elements, which in some embodiments include resistivity switching memory elements such as antifuses and phase-change materials, and optionally steering elements such as diodes. Furthermore, as a non-limiting example, active semiconductor memory elements include EEPROM and flash memory device elements, which in some embodiments include elements comprising charge storage regions such as floating gates, conductive nanoparticles, or charge storage dielectric materials.

[0056] Multiple memory elements can be configured so that they are connected in series, or so that each element is individually accessible. As a non-limiting example, a flash memory device with a NAND configuration (NAND memory) typically includes memory elements connected in series. A NAND memory array can be configured so that the array consists of multiple strings of memory, each string consisting of multiple memory elements that share a single bit line and are accessed as a group. Alternatively, memory elements can be configured so that each element is individually accessible (e.g., a NOR memory array). NAND and NOR memory configurations are examples, and memory elements can be configured in other ways.

[0057] Semiconductor memory elements located within and / or on the substrate may be arranged in two or three dimensions, such as in a two-dimensional memory structure or a three-dimensional memory structure.

[0058] In a two-dimensional memory structure, semiconductor memory elements are arranged on a single plane or at the level of a single memory device. Typically, in a two-dimensional memory structure, memory elements are arranged on a plane (e.g., the xz plane) that extends substantially parallel to the main plane of the substrate supporting the memory elements. The substrate may be a wafer on which layers of memory elements are formed or within it, or a carrier substrate to which memory elements are attached after they have been formed. In non-limiting examples, the substrate may include semiconductors such as silicon.

[0059] Memory elements may be arranged in an ordered array, such as multiple rows and / or columns, at the level of a single memory device. However, memory elements may be arranged in an irregular or non-orthogonal configuration. Each memory element may have two or more electrodes or contact lines, such as bit lines and word lines.

[0060] A three-dimensional memory array is arranged such that memory elements occupy multiple planes or multiple memory device levels, thereby forming a three-dimensional structure (i.e., in the x, y, and z directions, where the y direction is substantially perpendicular to the main surface of the substrate, and the x and z directions are substantially parallel to the main surface of the substrate).

[0061] As a non-limiting example, a three-dimensional memory structure may be arranged vertically as a stack of multiple two-dimensional memory device levels. As another non-limiting example, a three-dimensional memory array may be arranged as multiple vertical columns (e.g., columns substantially perpendicular to the main plane of the substrate, i.e., extending in the y-direction) where each column has multiple memory elements. The columns may be arranged in a two-dimensional configuration, e.g., in the xz plane, resulting in a three-dimensional arrangement of memory elements having elements on multiple vertically stacked memory planes. Other configurations of three-dimensional memory elements can also constitute a three-dimensional memory array.

[0062] As a non-restrictive example, in a three-dimensional NAND memory array, memory elements may be joined together to form a NAND string within a single horizontal (e.g., xz) memory device level. Alternatively, memory elements may be joined together to form a vertical NAND string that spans multiple horizontal memory device levels. Other three-dimensional configurations can be envisioned where some NAND strings contain memory elements within a single memory level, and others contain memory elements that span multiple memory levels. Three-dimensional memory arrays can also be designed in NOR and ReRAM configurations.

[0063] Typically, in a monolithic three-dimensional memory array, one or more memory device levels are formed on a single substrate. Optionally, a monolithic three-dimensional memory array may also have one or more memory layers at least partially within a single substrate. In a non-limiting example, the substrate may include a semiconductor such as silicon. In a monolithic three-dimensional array, the layers constituting each memory device level of the array are typically formed on layers of memory device levels beneath the array. However, adjacent memory device level layers in a monolithic three-dimensional memory array may be shared, or there may be intervening layers between the memory device levels.

[0064] In this case as well, the two-dimensional arrays may be formed separately and then packaged together to form a non-monolithic memory device having multiple memory layers. For example, a non-monolithic stacked memory can be constructed by forming memory levels on separate substrates and then stacking the memory levels on top of each other. The substrates may be thinned or removed from the memory device levels before stacking, but since the memory device levels are initially formed on separate substrates, the resulting memory array is not a monolithic three-dimensional memory array. Furthermore, multiple two-dimensional or three-dimensional memory arrays (monolithic or non-monolithic) may be formed on separate chips and then packaged together to form a stacked chip memory device.

[0065] Associated circuitry is typically required for the operation of memory elements and for communication with them. In a non-limiting example, a memory device may have circuitry used to control and drive memory elements to achieve functions such as programming and reading. This associated circuitry may be on the same board as the memory elements and / or on a separate board. For example, a controller for memory read-write operations may be located on a separate controller chip and / or on the same board as the memory elements.

[0066] Those skilled in the art will recognize that the present invention is not limited to the two-dimensional and three-dimensional structures described herein, but encompasses all relevant memory structures within the spirit and scope of the invention as described herein and as understood by those skilled in the art.

[0067] The above detailed description is intended to be understood not as a definition of the present invention, but as an illustrative example of selected forms that the invention may take. Only the following claims, including all equivalents, are intended to define the scope of the claimed invention. Finally, it should be noted that any aspect of the embodiments described herein may be used individually or in combination with others.

Claims

1. A data storage device, Non-volatile memory and Volatile memory and A controller comprising a processor, wherein the processor is configured to communicate with the non-volatile memory and the volatile memory, The size of the controller memory buffer created from a portion of the volatile memory is configured, and the controller memory buffer is configured for use by the host. Controller data is stored in another part of the aforementioned volatile memory, During the operation of the data storage device, the host receives a request to increase the size of the controller memory buffer. Determine whether to grant the aforementioned request, In response to a determination to grant the request, the controller memory buffer is further configured to expand its size by moving at least a portion of the controller data from another portion of the volatile memory into the free space of the volatile memory. The processor is further configured to take the workload into consideration when determining whether to allow the request, and is a data storage device.

2. A data storage device, Non-volatile memory and Volatile memory and A controller comprising a processor, wherein the processor is configured to communicate with the non-volatile memory and the volatile memory, The size of the controller memory buffer created from a portion of the volatile memory is configured, and the controller memory buffer is configured for use by the host. Controller data is stored in another part of the aforementioned volatile memory, During the operation of the data storage device, the host receives a request to increase the size of the controller memory buffer. Determine whether to grant the aforementioned request, In response to a determination to grant the request, the controller memory buffer is further configured to expand its size by moving at least a portion of the controller data from another portion of the volatile memory into the free space of the volatile memory. The processor is further configured to reject any request that attempts to increase the size of the controller memory buffer beyond its maximum size, in response to such a request.

3. A data storage device, Non-volatile memory and Volatile memory and A controller comprising a processor, wherein the processor is configured to communicate with the non-volatile memory and the volatile memory, The size of the controller memory buffer created from a portion of the volatile memory is configured, and the controller memory buffer is configured for use by the host. Controller data is stored in another part of the aforementioned volatile memory, During the operation of the data storage device, the host receives a request to increase the size of the controller memory buffer. Determine whether to grant the aforementioned request, In response to a determination to grant the request, the controller memory buffer is further configured to expand its size by moving at least a portion of the controller data from another portion of the volatile memory into the free space of the volatile memory. The processor is further configured to prioritize data in the controller memory buffer for eviction, and is a data storage device.

4. The data storage device according to any one of claims 1 to 3, wherein the processor is further configured to use surplus space in the controller memory buffer that is not being used by the host.

5. The data storage device according to any one of claims 1 to 3, wherein the request includes a dedicated command.

6. The data storage device according to any one of claims 1 to 3, wherein the controller and the host each include their respective controller memory buffer allocation modules.

7. The data storage device according to any one of claims 1 to 3, wherein the processor is further configured to send an acknowledgment to the host after granting the request.

8. The data storage device according to any one of claims 1 to 3, wherein the non-volatile memory includes a three-dimensional memory.

9. It is a method, In a host that communicates with a data storage device comprising volatile memory and a controller memory buffer created from a portion of the volatile memory, Storing host data in another part of the volatile memory, Receiving a request from the data storage device to increase the size of the controller memory buffer, To determine whether to grant the aforementioned request, In response to a determination to grant the request, the process includes expanding the size of the controller memory buffer by moving at least a portion of the host data from another portion of the volatile memory into the free space of the volatile memory, A method by which the workload is taken into consideration when determining whether to allow the aforementioned request.

10. A method, In a host that communicates with a data storage device comprising volatile memory and a controller memory buffer created from a portion of the volatile memory, Storing host data in another part of the volatile memory, Receiving a request from the data storage device to increase the size of the controller memory buffer, To determine whether to grant the aforementioned request, In response to a determination to grant the request, the process includes expanding the size of the controller memory buffer by moving at least a portion of the host data from another portion of the volatile memory into the free space of the volatile memory, A method further comprising deciding to reject a request in response to a request that attempts to increase the size of the controller memory buffer beyond its maximum size.

11. A method, In a host that communicates with a data storage device comprising volatile memory and a controller memory buffer created from a portion of the volatile memory, Storing host data in another part of the volatile memory, Receiving a request from the data storage device to increase the size of the controller memory buffer, To determine whether to grant the aforementioned request, In response to a determination to grant the request, the process includes expanding the size of the controller memory buffer by moving at least a portion of the host data from another portion of the volatile memory into the free space of the volatile memory, A method that further includes causing data prioritization for eviction.

12. The method according to any one of claims 9 to 11, wherein the data storage device is configured to use surplus space in the controller memory buffer that is not being used by the host.

13. The method according to any one of claims 9 to 11, wherein the request includes a dedicated command.

14. The method according to any one of claims 9 to 11, wherein the data storage device and the host each include their respective controller memory buffer allocation modules.

15. The method according to any one of claims 9 to 11, further comprising sending a confirmation to the data storage device after granting the request.

16. A data storage device, Non-volatile memory and Volatile memory and means, The size of the controller memory buffer created from a portion of the volatile memory is configured, and the controller memory buffer is configured for use by the host. Controller data is stored in another part of the aforementioned volatile memory, During the operation of the data storage device, the host receives a request to increase the size of the controller memory buffer. Determine whether to grant the aforementioned request, In response to a determination to grant the request, the size of the controller memory buffer is increased by moving at least a portion of the controller data from another portion of the volatile memory into the free space of the volatile memory. Equipped with means for, The means is further configured to take the workload into consideration when determining whether to allow the request, a data storage device.

17. A data storage device, Non-volatile memory and Volatile memory and means, The size of the controller memory buffer created from a portion of the volatile memory is configured, and the controller memory buffer is configured for use by the host. Controller data is stored in another part of the aforementioned volatile memory, During the operation of the data storage device, the host receives a request to increase the size of the controller memory buffer. Determine whether to grant the aforementioned request, In response to a determination to grant the request, the size of the controller memory buffer is increased by moving at least a portion of the controller data from another portion of the volatile memory into the free space of the volatile memory. Equipped with means for, The means is further configured to reject the request in response to the request to expand the size of the controller memory buffer beyond its maximum size, in the event of such a request.

18. A data storage device, Non-volatile memory and Volatile memory and means, The size of the controller memory buffer created from a portion of the volatile memory is configured, and the controller memory buffer is configured for use by the host. Controller data is stored in another part of the aforementioned volatile memory, During the operation of the data storage device, the host receives a request to increase the size of the controller memory buffer. Determine whether to grant the aforementioned request, In response to a determination to grant the request, the size of the controller memory buffer is increased by moving at least a portion of the controller data from another portion of the volatile memory into the free space of the volatile memory. Equipped with means for, The means is a data storage device further configured to prioritize data in the controller memory buffer for eviction.

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