Substrate processing apparatus and method for manufacturing a substrate processing apparatus

Abstract

To provide a substrate processing apparatus and a manufacturing method for the substrate processing apparatus that allow the layout of lift pins to be changed without changing a chamber.SOLUTION: A substrate processing apparatus includes a processing container, a mounting table including a mounting plate having a mounting surface on which a substrate is mounted and a main body portion that supports the mounting plate, and arranged in the processing container, a lift pin disposed in an insertion hole passing through the mounting plate and protruding from and retractable from the mounting surface, a drive unit having a drive shaft that penetrates the bottom wall of the processing container and drives in the vertical direction, and a drive member fixed to the drive shaft and disposed facing and spaced from the lift pin.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a method for manufacturing a substrate processing apparatus.

Background Art

[0002] Patent Document 1 discloses a substrate processing apparatus including a susceptor having lift pins provided so as to be able to project and retract from a mounting surface on which a substrate is mounted, a drive unit that drives the lift pins, and a control unit that controls the drive unit. In the configuration shown in Patent Document 1, the lift pins are disposed in insertion holes that penetrate the bottom wall of the chamber and the susceptor.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] On one side, the present disclosure provides a substrate processing apparatus and a method for manufacturing a substrate processing apparatus capable of changing the layout of lift pins without changing the chamber.

Means for Solving the Problems

[0005] To solve the above problems, according to one aspect, there is provided a substrate processing apparatus including a processing container, a mounting plate having a mounting surface on which a substrate is mounted, and a main body portion that supports the mounting plate, a mounting table disposed in the processing container, lift pins disposed in insertion holes that penetrate the mounting plate and provided so as to be able to project and retract from the mounting surface, a drive unit having a drive shaft that penetrates the bottom wall of the processing container and drives in the vertical direction, and a drive member fixed to the drive shaft and disposed to face the lift pins with a gap therebetween. A plurality of the lift pins are arranged on the mounting surface described above to form a lift pin arrangement, the lift pin arrangement is configured to be changeable according to the substrate, and the drive member is configured so that at least one of the shape and mounting orientation of the drive member can be changed according to the lift pin arrangement. A substrate processing apparatus is provided.

Advantages of the Invention

[0006] In one respect, it is possible to provide a substrate processing apparatus and a method for manufacturing a substrate processing apparatus that can change the layout of the lift pins without changing the chamber. [Brief explanation of the drawing]

[0007] [Figure 1] An example of a schematic cross-sectional view of a substrate processing device. [Figure 2] An example of a schematic cross-sectional view in the planar direction of a substrate processing device. [Figure 3] An example of a block diagram showing the configuration of the drive mechanism that drives the lift pin. [Figure 4] An example of a partially enlarged cross-sectional view of a susceptor with the lift pin lowered. [Figure 5] An example of a partially enlarged cross-sectional view of a susceptor with the lift pin raised. [Modes for carrying out the invention]

[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0009] <Substrate Processing Equipment> The substrate processing apparatus 1 according to this embodiment will be described with reference to Figures 1 to 3. Figure 1 is an example of a schematic cross-sectional view of the substrate processing apparatus 1. The substrate processing apparatus 1 is a device that places a substrate G on a mounting table and performs a desired process (for example, film deposition) on the substrate G. The mounting table is configured to allow adjustment of the temperature of the placed substrate G (for example, heating with a heater or cooling with a chiller). In this explanation, the horizontal direction will be referred to as the X direction, the horizontal direction perpendicular to the X direction will be referred to as the Y direction, and the height direction will be referred to as the Z direction.

[0010] Furthermore, the substrate G processed in the substrate processing apparatus 1, in other words, the substrate G placed on the mounting table, is rectangular in shape when viewed from above and is a flexible substrate. The substrate G may be, for example, a flexible rectangular glass substrate. The substrate G may also be, for example, a thin-film glass substrate with a thickness of 0.2 mm to several mm. The substrate G may also have planar dimensions ranging from approximately 1500 mm × 1800 mm for the 6th generation to approximately 3000 mm × 3400 mm for the 10.5th generation. The substrate G may also be, for example, a glass substrate used in the manufacture of flat panel displays.

[0011] The substrate processing apparatus 1 includes a chamber 2 as a processing container for housing the substrate G. The chamber 2 is made of, for example, aluminum whose surface has been anodized (anodic oxidation treated), and is formed in a rectangular cylindrical shape corresponding to the shape of the substrate G.

[0012] A susceptor 4 is provided on the bottom wall of the chamber 2 as a mounting platform for the substrate G. The susceptor 4 is formed in the shape of a rectangular plate or columnar shape, corresponding to the shape of the substrate G. The susceptor 4 has a mounting plate 4a made of a conductive material such as metal, and a main body 4b made of an insulating material that is provided between the bottom of the mounting plate 4a and the bottom surface of the chamber 2 and supports the mounting plate 4a. A power supply line 23 for supplying high-frequency power is connected to the mounting plate 4a. A high-frequency power supply 25 is connected to the power supply line 23 via a matching unit 24. The high-frequency power supply 25 applies, for example, 13.56 MHz of high-frequency power to the susceptor 4. The matching unit 24 matches the output impedance of the high-frequency power supply 25 with the input impedance of the load side. As a result, the susceptor 4 is configured to function as a lower electrode.

[0013] The upper surface of the susceptor 4 (the upper surface of the mounting plate 4a) becomes the substrate mounting surface 4c (mounting surface) on which the substrate G is mounted. An electrostatic chuck (not shown) for adsorbing and holding the substrate G may also be provided on the upper surface of the susceptor 4.

[0014] A showerhead 11, which supplies processing gas into the chamber 2 and functions as an upper electrode, is provided on the upper part or upper wall of the chamber 2, facing the susceptor 4. The showerhead 11 has a gas diffusion space 12 formed inside for diffusing the processing gas, and a plurality of discharge holes 13 for discharging the processing gas are formed on its lower surface or the surface facing the susceptor 4. This showerhead 11 is grounded and together with the susceptor 4 constitutes a pair of parallel plate electrodes. In this embodiment, the present disclosure is described as being applied to a substrate processing apparatus that generates plasma using parallel plate electrodes, but of course, the present disclosure may also be applied to a substrate processing apparatus that generates plasma by inductive coupling, or to a substrate processing apparatus that generates plasma by other methods.

[0015] A gas inlet 14 is provided on the upper surface of the shower head 11, and a processing gas supply pipe 15 is connected to this gas inlet 14. A processing gas supply source 18 is connected to this processing gas supply pipe 15 via a valve 16 and a mass flow controller 17. From the processing gas supply source 18, for example, a processing gas for film formation is supplied. As the processing gas, gases commonly used in this field such as SiF4 gas, SiCl4 gas, N2 gas, O2 gas, and Ar gas can be used.

[0016] An exhaust pipe 19 is connected to the bottom wall of chamber 2, and an exhaust device 20 is connected to this exhaust pipe 19. The exhaust device 20 is equipped with a vacuum pump such as a turbomolecular pump, and is configured to evacuate the inside of chamber 2 to a predetermined reduced pressure atmosphere. An inlet / outlet 21 for loading and unloading substrates G is formed on the side wall of chamber 2, and a gate valve 22 is provided to open and close this inlet / outlet 21. When the inlet / outlet 21 is open, the substrate G is supported from below by a transport arm 50 (see Figure 2, described later) as a transport member, and is transported between the inlet / outlet 21 and an adjacent transport chamber (not shown) via the gate valve 22.

[0017] The susceptor 4 has insertion holes 7 penetrating the mounting plate 4a, which are formed at the outer peripheral position and the central position (a position closer to the inside or the center than the outer peripheral position) of the susceptor 4, respectively. In each of the insertion holes 7, lift pins 8 for supporting and lifting the substrate G from below are inserted so as to be able to project and retract with respect to the substrate mounting surface 4c of the susceptor 4. The lift pins 8 are provided so as to contact the outer peripheral portion and the central portion of the substrate G when projecting, and are positioned in the radial direction or the width direction by positioning bushes (not shown) and inserted into the insertion holes 7.

[0018] Below the lift pins 8 projects below the mounting plate 4a. That is, below the lift pins 8 is disposed in the space between the lower side of the mounting plate 4a and the bottom wall of the chamber 2. On the back side of the mounting plate 4a, a lift pin guide 200 for guiding the vertical movement of the lift pins 8 is provided. Also, a drive shaft 101 penetrating the bottom wall of the chamber 2 and a drive member 102 disposed in the space between the mounting plate 4a and the bottom wall of the chamber 2 are provided. Further, the bottom wall of the chamber 2 has a drive unit 9 for driving the drive member 102. The drive unit 9 moves the lift pins 8 up and down by moving the drive shaft 101 and the drive member 102 up and down.

[0019] Here, the arrangement of the insertion holes 7 and the lift pins 8 on the substrate mounting surface 4c will be further described using FIG. 2. FIG. 2 is an example of a schematic cross-sectional view in the planar direction of the substrate processing apparatus 1. In FIG. 2, the positions of the transfer arm 50 and the substrate G when the substrate G held by the transfer arm 50 is disposed above the mounting region 4d are indicated by a two-dot chain line.

[0020] As shown in FIG. 2, the substrate mounting surface 4c of the susceptor 4 on which the substrate G is placed has a rectangular shape with a short side (Y direction) and a long side (X direction) in plan view. Further, the substrate mounting surface 4c has a mounting region 4d (shown by a broken line in FIG. 2) corresponding to the substrate G. When the substrate G is placed on the susceptor 4, the substrate G is placed in the mounting region 4d. In FIG. 2, the center lines 4e (a line connecting the midpoints of one long side and the other long side) and 4f (a line connecting the midpoints of one short side and the other short side) of the mounting region 4d are shown by a one-dot chain line. Also, in FIG. 2, for the sake of convenience, the broken line indicating the mounting region 4d is drawn inside the two-dot chain line indicating the substrate G, but this does not mean that the mounting region 4d is defined inside the outer periphery of the substrate G. It is desirable that the mounting region 4d has the same shape and the same area as the substrate G. Also, the mounting region 4d may be a region having a shape and an area that encloses the substrate G.

[0021] The susceptor 4 has a plurality of insertion holes 7 on the substrate mounting surface 4c (mounting surface), and a plurality of lift pins 8 are arranged in each of the plurality of insertion holes 7. The arrangement by the plurality of insertion holes 7 constitutes an insertion hole arrangement, and the arrangement by the plurality of lift pins 8 constitutes a lift pin arrangement. The susceptor 4 has insertion holes 7a and 7b as the insertion holes 7. The insertion hole 7a is provided at the outer peripheral portion of the mounting region 4d. The insertion hole 7b is provided at the central portion of the surface of the mounting region 4d surrounded by the outer peripheral portion of the mounting region 4d. Lift pins 8a and 8b are arranged in the insertion holes 7a and 7b as the lift pins 8.

[0022] Insertion holes 7a are provided at the outer peripheral portion of the rectangular mounting region 4d. In the example shown in FIG. 2, 12 insertion holes 7a are provided in the mounting region 4d with the center lines 4e and 4f as the target axes. Lift pins 8a are respectively arranged in each of the insertion holes 7a.

[0023] Insertion holes 7b are provided at the central portion of the surface of the rectangular mounting region 4d. In the example shown in FIG. 2, the insertion holes 7b are provided on the center line 4e and two insertion holes 7b are provided with the center line 4f as the target axis. Lift pins 8b are respectively arranged in each of the insertion holes 7b.

[0024] Figure 3 is an example of a block diagram showing the configuration of the drive mechanism that drives the lift pin 8.

[0025] Each of the lift pins 8 is connected to a drive unit 9. The lift pins 8 are configured to protrude from and retract from the substrate mounting surface 4c of the susceptor 4 by moving up and down when driven by the drive unit 9. Each of the drive units 9 is configured, for example, using a stepping motor. Although the lift pins 8 have been described as being configured to be driven individually, as shown in Figure 3, they are not limited to this configuration and may be configured to be driven in groups. This configuration allows for a reduction in the number of drive units (stepping motors).

[0026] The drive of the drive unit 9 is controlled separately by a controller 31 equipped with a microprocessor (computer), thereby enabling each of the lift pins 8 to be raised and lowered independently of each other. The controller 31 is connected to a user interface 32, which includes a keyboard for the process manager to input commands to manage the drive of the drive unit 9, and a display that visualizes and displays the drive status of the drive unit 9. A storage unit 33 stores a recipe containing a control program and drive condition data for realizing the drive of the drive unit 9 under the control of the controller 31. When necessary, the controller 31 can execute a recipe by calling it from the storage unit 33 via instructions from the user interface 32, thereby driving and stopping the drive unit 9 under the control of the controller 31. The recipe can be used, for example, stored on a computer-readable storage medium such as a CD-ROM, hard disk, or flash memory, or it can be transmitted from another device as needed, for example, via a dedicated line.

[0027] The controller 31, user interface 32, and memory unit 33 constitute a control unit that controls the raising and lowering of the lift pin 8 by the drive unit 9, and the susceptor 4, lift pin 8, drive unit 9, and control unit constitute a substrate mounting mechanism.

[0028] Next, the drive mechanism for driving the lift pin 8 will be further explained using Figures 4 and 5. Figure 4 is an example of a partially enlarged cross-sectional view of the susceptor 4 in the lowered position of the lift pin 8. Figure 5 is an example of a partially enlarged cross-sectional view of the susceptor 4 in the raised position of the lift pin 8.

[0029] The lift pin 8 is made of, for example, alumina and has a shaft portion 81 and a head portion 82. The head portion 82 is formed to be larger in diameter than the shaft portion 81.

[0030] The insertion hole 7 of the susceptor 4 has a through portion 71 and a storage portion 72. The through portion 71 is formed by penetrating the upper and lower surfaces of the mounting plate 4a, and the shaft portion 81 of the lift pin 8 is inserted into the through portion 71. The storage portion 72 is formed with a larger diameter than the through portion 71 so that the head portion 82 of the lift pin 8 can be stored, and houses the head portion 82 of the lift pin 8 when the lift pin 8 is in the lowered position (see Figure 4). Furthermore, the head portion 82 of the lift pin 8 is formed with a larger diameter than the through portion 71 of the insertion hole 7. As a result, when the lift pin 8 is in the lowered position (see Figure 4), the lower surface of the head portion 82 of the lift pin 8 contacts the bottom surface of the storage portion 72 of the insertion hole 7, and the lift pin 8 is locked to the mounting plate 4a.

[0031] Furthermore, a lift pin guide 200 is provided on the back side of the mounting plate 4a. The lift pin guide 200 guides the lift pin 8 so that it can move in the vertical direction and supports the lift pin 8 to prevent it from tilting when it protrudes from the substrate mounting surface 4c (see Figure 5). The lift pin guide 200 has a shaft insertion portion 211 into which the shaft portion 81 of the lift pin 8 is inserted. The lift pin guide 200 is fixed to the back side of the mounting plate 4a by a fixing member 260 such that the through portion 71 of the insertion hole 7 and the shaft insertion portion 211 are coaxial. The mounting plate 4a becomes hot (for example, 350°C) during processing of the substrate G. By forming the lift pin guide 200 from alumina, the lift pin 8 can be guided suitably even in a high-temperature environment. Also, there is a risk that processing gas may flow into the lift pin guide 200 through the insertion hole 7. By forming the lift pin guide 200 from alumina, corrosion resistance can be improved. Furthermore, by forming the lift pin guide 200 from alumina, like the lift pin 8, wear resistance can be improved.

[0032] A drive unit 9 is provided on the bottom wall of the chamber 2, having a drive shaft 101 that penetrates the bottom wall of the chamber 2 and drives vertically. The drive shaft 101 is supported by a drive shaft guide 2a, which is provided on the bottom wall of the chamber 2 and guides the vertical movement of the drive shaft 101. Here, when the susceptor 4 is viewed from above, the position of the drive shaft 101 and the position of the lift pin 8 are located at different positions in the horizontal direction (a direction perpendicular to the driving direction of the drive shaft 101). However, the position of the drive shaft 101 and the position of the lift pin 8 in the horizontal direction may coincide.

[0033] The drive member 102 is positioned in the space between the mounting plate 4a and the bottom wall of the chamber 2. The drive member 102 is, for example, a member that has one end fixed to the drive shaft 101 and extends horizontally from the drive shaft 101. As the drive unit 9 moves the drive shaft 101 in the vertical direction, the drive member 102 also moves in the vertical direction.

[0034] Furthermore, the drive member 102 is positioned opposite the lift pin 8. Here, when viewing the susceptor 4 from above, the drive member 102 is formed to include the position of the drive shaft 101 and the position of the lift pin 8. Also, the drive member 102 and the lift pin 8 are not fixed to each other, and when the drive member 102 (drive shaft 101) is lowered (see Figure 4), the drive member 102 and the lift pin 8 are spaced apart. In other words, the drive member 102 can be attached to the drive shaft 101 at one end facing any direction, and the other end of the drive member 102, or the space between the other end and one end, is formed to face the lift pin 8 at a distance.

[0035] Furthermore, when the drive member 102 (drive shaft 101) is raised (see Figure 5), the drive member 102 and the lift pin 8 come into contact, and the drive member 102 pushes up the lift pin 8.

[0036] Furthermore, the drive member 102 is provided with a contact member 103 at a position that contacts the lift pin 8. The drive member 102 is made of, for example, aluminum. The contact member 103 is made of, for example, alumina. By making the contact member 103 that contacts the lift pin 8 from the same material as the lift pin 8 (alumina), wear between the lift pin 8 and the contact member 103 during contact can be suppressed.

[0037] Furthermore, the drive member 102 is fixed to the drive shaft 101 by a detachable fixing member 104. This allows the drive member 102 to be easily replaced. Similarly, the contact member 103 is fixed to the drive member 102 by a detachable fixing member 105. This allows the contact member 103 to be easily replaced.

[0038] When processing the substrate G, the mounting plate 4a becomes hotter than the bottom wall of the chamber 2, creating a temperature difference between the mounting plate 4a and the bottom wall of the chamber 2. This changes the horizontal distance between the center position of the lift pin 8 and the center position of the drive shaft 101. Since the drive member 102 and the lift pin 8 are not fixed together, even if the distance between the center position of the lift pin 8 and the center position of the drive shaft 101 changes due to the temperature difference, the lift pin 8 will not bend. The drive member 102 is formed to be large enough to come into contact with the lift pin 8 even if the distance between the center position of the lift pin 8 and the center position of the drive shaft 101 changes due to the temperature difference.

[0039] Furthermore, the lift pins 8, which are arranged in multiple locations on the mounting area 4d, are positioned so as not to affect the semiconductor device or light-emitting element that will ultimately be formed on the substrate G. For this reason, the substrate processing apparatus 1 is required to be configured to allow the arrangement (layout) of the multiple lift pins 8 arranged on the mounting area 4d to be changed according to the substrate G.

[0040] If it is desired to change the layout of the lift pins 8, which are positioned on the mounting area 4d of the substrate mounting surface 4c (mounting surface), according to the substrate G, the substrate processing apparatus 1 can change the layout of the lift pins 8 by replacing the mounting plate 4a with another mounting plate 4a having through holes 7 formed to correspond to the changed layout, and by changing at least one of the shape and mounting orientation (extension direction) of the drive member 102. In other words, the layout of the lift pins 8 can be changed without changing the position of the drive shaft 101 provided on the bottom wall of the chamber 2. In this way, the layout of the lift pins 8 (arrangement of multiple lift pins) can be changed by replacing the parts inside the chamber 2 (mounting plate 4a, drive member 102).

[0041] Alternatively, the mounting plate 4a may be pre-formed with a group of insertion holes 7, which are more numerous than the number of lift pins 8. The lift pins 8 can then be placed in the selected insertion holes 7 according to the layout of the lift pins 8, thereby changing at least one of the shape and mounting orientation (extension direction) of the drive member 102. This allows the layout of the lift pins 8 to be changed.

[0042] Alternatively, the mounting plate 4a may be pre-formed with a group of insertion holes 7, which are greater than the number of lift pins 8 that contact the drive member 102. A group of lift pins 8 may be pre-positioned in each of the insertion holes 7 to form a lift pin group, thereby changing at least one of the shape and mounting orientation (extension direction) of the drive member 102. This allows the lift pins 8 that contact and are pushed up by the drive member 102 to be selected from the lift pin group when the drive member 102 (drive shaft 101) is raised (see Figure 5), thereby changing the layout of the lift pins 8 that push up the substrate G.

[0043] Furthermore, although the examples shown in Figures 1, 4, and 5 describe one drive member 102 corresponding to one lift pin 8, this is not the only configuration. A single drive member 102 may contact and push up multiple lift pins 8. This allows for a reduction in the number of drive units 9 (stepping motors).

[0044] Furthermore, the manufacturing method of the substrate processing apparatus 1 includes the steps of determining the arrangement of a plurality of through holes 7 formed in the mounting plate 4a according to the substrate G, selecting an through hole 7 from the plurality of through holes 7 to which a lift pin 8 will be placed according to the substrate G, and determining the lift pin 8 to be pushed up by the drive member 102 according to the substrate G. Furthermore, the manufacturing method of the substrate processing apparatus 1 includes the steps of forming the through holes 7 in the mounting plate 4a based on the determined arrangement of the plurality of through holes 7, placing the lift pin 8 in the selected through hole 7, installing a drive unit 9 having a drive shaft 101 that penetrates the bottom wall of the chamber 2, and attaching the drive member 102 to the drive shaft 101 based on the determined lift pin 8.

[0045] Although the substrate processing apparatus 1 has been described above, this disclosure is not limited to the embodiments described above, and various modifications and improvements are possible within the scope of the gist of this disclosure as described in the claims. [Explanation of Symbols]

[0046] 1. Substrate processing device 2 Chambers 2a Drive shaft guide 4 Susceptors 4a Mounting plate 4b Main body 4c substrate mounting surface 7 Through hole 8 Lift Pins 9 Drive unit 71 Penetration 72 Storage compartment 81 Shaft 82 Head 101 Drive shaft 102 Drive Member 103 Contact Member 104 Fixing member 105 Fixing member 200 Lift Pin Guide 211 Shaft insertion section G board

Claims

1. Processing container and A mounting stand having a mounting plate having a mounting surface on which a substrate is placed, and a main body that supports the mounting plate, which is placed inside the processing container, A lift pin is provided, which is positioned in a through-hole that penetrates the aforementioned mounting plate and is capable of protruding from the mounting surface described above, A drive unit having a drive shaft that penetrates the bottom wall of the processing container and drives in the vertical direction, The drive member is fixed to the drive shaft and is positioned opposite to the lift pin at a distance from it, A plurality of the lift pins are arranged on the mounting surface to form a lift pin arrangement, and the lift pin arrangement is configured to be changeable according to the substrate. The drive member is configured such that at least one of its shape and mounting orientation can be changed depending on the arrangement of the lift pins. Circuit board processing equipment.

2. The lift pin is pushed up by contacting the drive member which is raised by the drive unit, and the lift pin protrudes from the mounting surface described above. The substrate processing apparatus according to claim 1.

3. A plurality of insertion holes corresponding to the lift pin arrangement are arranged to form an insertion hole arrangement, and the aforementioned mounting plate is configured to be interchangeable with other mounting plates having different insertion hole arrangements. A substrate processing apparatus according to claim 1 or claim 2.

4. The mounting plate has a plurality of insertion holes that constitute a group of insertion holes, and the lift pin is placed in an insertion hole selected from the group of insertion holes. A substrate processing apparatus according to claim 1 or claim 2.

5. The mounting plate has a plurality of insertion holes that constitute a group of insertion holes, and a lift pin is placed in each of the insertion holes that constitute the group of insertion holes to form a group of lift pins. The drive member is positioned opposite to the lift pin selected from the group of lift pins, A substrate processing apparatus according to claim 1 or claim 2.

6. One of the drive members is provided to be able to drive two or more of the lift pins. A substrate processing apparatus according to claim 1 or claim 2.

7. A processing container, a mounting plate having a mounting surface on which a substrate is placed, and a main body that supports the mounting plate, a mounting stand disposed inside the processing container, and a through hole that penetrates the mounting plate, A method for manufacturing a substrate processing apparatus, comprising: a lift pin provided so as to be able to protrude from the mounting surface; a drive unit having a drive shaft that penetrates the bottom wall of the processing container and drives in the vertical direction; and a drive member fixed to the drive shaft and positioned opposite to the lift pin at a distance from it, wherein a plurality of the lift pins are arranged on the mounting surface to form a lift pin arrangement, the lift pin arrangement is configured to be changeable according to the substrate, and the drive member is configured so that at least one of the shape and mounting orientation of the drive member can be changed according to the lift pin arrangement, A step of determining the arrangement of the plurality of insertion holes formed in the aforementioned mounting plate according to the substrate, A step of selecting an insertion hole from a plurality of insertion holes to arrange the lift pin according to the substrate, A step of determining the lift pin that is pushed up by the drive member according to the substrate, A step of forming the insertion holes in the aforementioned mounting plate based on the arrangement of the determined plurality of insertion holes, The steps include: positioning the lift pin in the selected insertion hole; A step of installing the drive unit having the drive shaft that penetrates the bottom wall of the processing container, A step of attaching the drive member to the drive shaft based on the determined lift pin, including, A method for manufacturing a substrate processing apparatus.

Images