Design and manufacturing of multi-component modules

Abstract

A multi-component module assembly by identifying failure sites on a laminate including a plurality of sites, adding machine recognizable marks associated with the failure sites, placing electrically good elements at the successful sites, and providing an MCM including the laminate and the electrically good elements.

Description

Technical Field

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[0003]

[0001] The present disclosure generally relates to the design and manufacture of multi-component modules. The present disclosure particularly relates to increasing the manufacturing process yield through design and assembly.

Background Art

[0005] Aspects of the present invention disclose a method, system, and computer-readable medium relating to multi-component module assembly by identifying fault sites on a laminate including multiple sites, adding machine-discernible marks associated with the fault sites, and placing electrically good elements at sites that are not marked, thereby providing an MCM including the laminate, fault sites, and electrically good elements. These steps provide a functional MCM without wasting electrically good components at fault component sites and without wasting the entire assembly due to fault component sites.

[0006] Aspects of the present invention disclose a method, system, and computer-readable medium relating to multi-component module assembly by identifying fault sites on a laminate containing multiple sites using automated inspection, adding machine-recognizable marks to distinguish the fault sites from successful sites, placing electrically good elements at the successful sites, and providing an MCM containing the laminate, mechanically good elements, and electrically good elements. These steps provide a functional MCM without wasting electrically good elements at fault component sites and without wasting the entire assembly due to a small number of fault component sites.

[0007] Aspects of the present invention disclose a method, system, and computer-readable medium relating to multi-component module assembly by identifying fault sites on a laminate including multiple sites using automated inspection, adding machine-recognizable marks to distinguish the fault sites, placing electrically good elements at the success sites, reading a first mark associated with the laminate, updating a database entry associated with the first mark according to the fault sites, and providing an MCM including the laminate, mechanically good elements, and electrically good elements. These steps provide a functional MCM without wasting electrically good elements at fault component sites and without wasting the entire assembly due to a small number of fault component sites. These steps further provide an updated and ongoing record of the manufacturing process of the final assembly.

[0008] Aspects of the present invention disclose a method, system, and computer-readable medium relating to multi-component module assembly by identifying fault sites on a laminate including multiple sites using automated inspection, reading a first mark associated with the laminate, updating a database entry associated with the first mark according to the fault sites, and, according to the database entry, placing electrically good elements at success sites, thereby providing an MCM including the laminate, mechanically good elements, and electrically good elements. These steps provide a functional MCM without wasting electrically good elements at fault component sites and without wasting the entire assembly due to a small number of fault component sites. These steps further provide an updated and ongoing record of the manufacturing process of the final assembly.

[0009] Aspects of the present invention disclose a multi-component module (MCM) assembly comprising a plurality of component sites, at least one of which is a fault site; electrically sound elements located on the component sites other than the fault site; and mechanical-only components or zero components located on the fault site.

[0010] A more detailed description of some embodiments of this disclosure shown in the accompanying drawings will further illuminate the above-mentioned objectives, features, and advantages of this disclosure, as well as other objectives, features, and advantages. In the embodiments of this disclosure, the same reference numerals generally refer to the same components. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic diagram of a computing environment according to one embodiment of the present invention. [Figure 2] This is a flowchart illustrating the operation sequence of one embodiment of the present invention. [Figure 3] This is a schematic diagram of a multi-component module stacked printed circuit board according to one embodiment of the present invention. [Figure 4] This figure shows an outline product flow according to one embodiment of the present invention. [Figure 5] This figure shows a cloud computing environment according to one embodiment of the present invention. [Figure 6] This figure shows an abstraction model layer according to one embodiment of the present invention. [Modes for carrying out the invention]

[0012] Some embodiments of this disclosure will be described in more detail with reference to the accompanying drawings illustrating embodiments of this disclosure. However, this disclosure can be implemented in various ways, and therefore should not be construed as being limited to the embodiments disclosed herein.

[0013] Complex multilayer printed circuit boards designed for large multi-component modules tend to increase component costs due to low product yields resulting from defects in one or more layers of the laminate. A single defect in a laminate layer can lead to the rejection of a completed multi-component module, and this rejection increases the overall cost per module by lowering product yield. Not all laminate defects are fatal to the final product; that is, not all defects lead to the rejection of an assembly. The disclosed embodiments increase component yield by reducing the rejection rate due to a single or small number of laminate defects. Rejections are reduced by identifying laminate defects as acceptable or unacceptable with respect to module failure and by modifying the downstream manufacturing of the final component to accept detected defects. To provide transparency regarding defects identified and accepted within each final product, the disclosed embodiments enable defect tracking throughout the assembly and packaging processes.

[0014] In one embodiment, one or more components of the system can use hardware, software, or both to solve problems that are inherently highly technical (e.g., identifying fault sites on a laminate containing multiple sites, adding mechanically recognizable marks associated with the fault sites, placing electrically good elements at marked sites, placing electrically good elements at unmarked sites, providing an MCM containing the laminate, mechanically good elements, and electrically good elements). These solutions are not abstract and cannot be performed as a single act of human thought due to the processing power required to facilitate multi-component module manufacturing, for example. Furthermore, some of the processes performed can be carried out by a dedicated computer that performs defined tasks related to MCM manufacturing and assembly. For example, a dedicated computer can be used to perform tasks related to manufacturing multi-component modules.

[0015] The disclosed embodiments can be carried out by utilizing industrial automation systems, including automated pick-and-place robot systems and machine vision systems, as well as automated electrical testing systems, to perform steps related to various embodiments. Subassemblies and laminates in production, such as multilayer laminates, after each additional layer of conductive traces has been added, can be inspected optically, electrically, or both to identify potential or actual laminate trace defects. Conductive trace defects may accumulate during the manufacturing of multilayer laminates, resulting in the identification of enough faulty component sites to identify the laminate as a faulty laminate with only insufficient successful component sites remaining to be considered successful. Such faulty laminates are removed from further manufacturing steps, thereby reducing costs, as no further resources are applied to the faulty laminates.

[0016] Circuit board laminates containing interlayers of non-conductive substrates and conductive traces can increase the likelihood of defects during the lamination manufacturing process. Defects can occur due to foreign matter interfering with the manufacturing imaging process related to the formation of conductive traces for signal lines, via interconnects between component sites, and other conductive trace connections. Process excursions can cause drying resin adhesion problems that deviate from the intended design of structural integrity in the finished laminate. Plating process defects can result in incomplete deposition of signal lines and via interconnects on the laminate surface. Surface contaminants can lead to improper trace formation. Dimples or other imperfections in the underlying dielectric surface can also lead to laminate defects.

[0017] Removing laminates or final assemblies due to defects in the laminate reduces overall process yield and increases the cost per unit. The disclosed embodiments enable the use of laminates and assemblies despite their defects. Saving such functional laminates and assemblies increases overall yield and reduces the cost per unit.

[0018] In one embodiment, a method for assembling a multi-component module identifies laminate defects during the laminate manufacturing process. In this embodiment, the method inspects the laminate at each forming step after the conductive traces of each layer of the overall laminate have been formed. The method can inspect the laminate traces using optical inspection methods, electrical inspection methods, or both. Optical methods include visible machine vision inspection of the layer traces and infrared inspection of the traces. These visible or infrared inspections look for improperly formed trace portions, incomplete traces, delaminated traces, etc. In this embodiment, the optical inspection compares the current trace appearance data for each portion of the trace in each layer with the expected trace appearance. The expected trace appearance can be collected from "good" laminate manufacturing, where "good" refers to qualified traces that meet design criteria. The method can further utilize a database containing images of previously detected "bad" trace portions, where "bad" refers to faulty traces (improperly formed traces, delaminated traces, contaminated traces, etc.) or traces whose appearance does not conform to design criteria. In one embodiment, this method utilizes a machine learning classification model to identify patterns of faulty board elements and successful board elements.

[0019] Electrical testing involves checking for electrical open circuits and short circuits on the traces of each layer. This testing uses a robotically operated probe to check the electrical resistance and continuity between specified contacts on the traces of each layer. Electrical open circuits, i.e., infinite resistance and no conduction, indicate that two contacts are not electrically connected or are parts of different electrical circuits. Electrical short circuits, i.e., zero or low resistance and high conduction, indicate that the contacts are parts of the same circuit. For a particular layer of the trace, the trace defines the pattern of electrical short circuits and open circuits on the trace. Electrical testing verifies the appropriate status of various contact pairs, such as having open circuits where the circuit was designed and short circuits where the design requires them.

[0020] In this embodiment, the inspection results identify the faulty trace portions on each layer of the laminate trace. The electrically faulty trace portions include an open circuit where there should be a short circuit and a short circuit where there should be an open circuit. The optical fault portions include trace portions indicating incomplete traces or delaminated traces, or other trace portions having an unexpected appearance.

[0021] In one embodiment, the method designates a laminate portion that does not meet the design criteria according to an optical inspection or an electrical inspection as a fault site. The failure of a critical site results in the rejection of the laminate, and the failure of a non-critical portion of the laminate may result in a sub-assembly that can meet smaller design criteria.

[0022] In one embodiment, the method defines one or more regions for each layer of the laminate. For each region, the method defines acceptable and unacceptable criteria for the presence of partial defects / faulty portions. The traces of each layer of the overall design are related to components installed on the completed laminate in the assembly of a multi-component module. The method associates the faulty portions identified on each layer with the relevant components of the final assembly including component installation sites including component mounting sites. For each region and component site, the method defines inspection criteria including acceptable trace partial defects and unacceptable trace partial defects (defects that make a component site a "faulty" component site and defects that make a component site a usable or successful component site). In this embodiment, the method performs inspections of each of the defined regions and determines faulty component sites according to the defined criteria for those regions. In one embodiment, the method receives user-defined regions and user-defined acceptable and unacceptable inspection criteria for each region.

[0023] As manufacturing / assembly progresses, this method tracks the location and identification of component sites and chiplet sites associated with non-defective trace portions, as well as the location and identification of component sites and chiplet sites associated with specific defective trace portions and failure trace portions. In one embodiment, this method applies a recognizable mark to distinguish sites identified as failures due to the underlying laminate defects, including failure traces, from successful and usable sites. This recognizable mark can be applied using an inkjet printer or similar printer, or applied to the laminate using a laser printer or similar marking device. The printed mark provides a site identifier for identifying the marked site following the application of the recognizable mark, which is recognizable using a machine vision system. In one embodiment, this method applies a mark to distinguish between failure sites and success sites. This mark can be applied to failure sites or success sites. This mark can be applied individually to each site, or a single mark can be applied to a designated location, where each portion of this single mark indicates success or failure for the corresponding component site. The placement of mechanically sound and electrically sound components proceeds according to this marking, with mechanically sound components placed at fault sites and electrically sound components at successful sites.

[0024] In one embodiment, the method maintains a database of site locations associated with each MCM final assembly. In this embodiment, the method tracks the identification of failure sites and updates the database records of the individual assemblies / layers showing the location of the failure sites identified using the inspection method shown above. As an example, the final assembly can include eight component sites during manufacture, and the method can identify a failure trace associated with one component site of a layer and update the database record for that layer to indicate the failure of the identified component site due to a layer defect.

[0025] In this embodiment, the method scans each layer to read serialized indicia such as serialized one-dimensional or two-dimensional barcodes, serial numbers or other serialized markings applied to each individual layer as part of the overall manufacturing process. Scanning the serialized indicia enables the method to maintain individual records for each layer of the manufacturing process and update those records using some or all of the inspection data and manufacturing data.

[0026] In one embodiment, manufacturing data regarding process parameter settings and measured parameter values are updated during the manufacturing process for the database records of each layer and assembly. Settings such as process temperature, air flow, dwell time, etc. are added to the database records of each layer according to the scanned serialized indicia. This database record enables tracking of issues during the assembly process such as the identification of common failure sites for a particular assembly (site 6 out of eight sites fails at a higher rate than any of the other seven sites), or the correlation of manufacturing failures with particular process parameter measurements and set values.

[0027] In one embodiment, the database record includes a series of binary bits or other digitized data, where each bit or data portion corresponds to a specific inspection point, processing parameter measurement, or other manufacturing process data. In this embodiment, the final version of the database record associated with an individual assembly / laminated product provides a record portion of the overall assembly process, though not the entire process.

[0028] In one embodiment, this method adds database records for an MCM assembly as part of a set of records or a single record associated with the system to which the MCM assembly is added. In this embodiment, the entire system carries a mark that provides links or notifications regarding the entire database entries for some or all system components, or the location of database records for system components.

[0029] In one embodiment, as assembly progresses, the method tracks the location of a fault site in the stack using either a recognizable mark or a database record. In another embodiment, the method tracks the fault site using either a printed mark or a location database, but not both.

[0030] In one embodiment, when the assembly process reaches the component mounting stage, the method examines the laminate and searches for sites marked as fault sites, or marks associated with all sites indicating fault sites. In one embodiment, the method scans the serialized markings of the laminate and re-examines the database records of the laminate to identify fault component sites. The method can use optical scanning of the laminate to search for recognizable marks, in cooperation with scanning of the serialized markings and database re-examination, to identify fault sites on each laminate before placing components on the laminate.

[0031] In one embodiment, this method places a mechanically good component at a faulty component site using a robotic pick-and-place system or other component placement means. In this embodiment, a mechanically good component is an element that has the same size, shape and mounting components as a component specified by design, but lacks the full electrical performance of the component specified by design. Such a mechanically good component can be mounted at the faulty site on the laminate by the placement means without adding the cost of a complete mechanically and electrically good component. An electrically good component, also called a mechanically and electrically good component, meets the full design criteria of that component with respect to mechanical size, shape and in-hole components and includes necessary electrical components, VLSI systems or other integrated circuits on a chip, etc. In one embodiment, a mechanically good component includes a faulty electrical component that has the exact physical size and shape required by the design criteria. In one embodiment, a mechanically-only element includes a deliberately constructed chiplet or other component that lacks circuit elements but has the appropriate shape and size of the design criteria. In one embodiment, this method places an electrically good component at a component site and does not place a component / chiplet at the faulty site. In one embodiment, this method places chiplets or other components on sites that consider redundant sites as part of the laminate design. In this embodiment, with respect to individual laminates that do not have fault sites, i.e., individual laminates where all manufactured chiplet and component sites are good sites, this method places the required number of electrically good chiplets and components on the good sites and mechanically good chiplets and components on the remaining good sites, thereby reducing the overall cost of the final assembly by placing mechanically good chiplets rather than electrically good chiplets on redundant chiplet sites.In one embodiment, this method places electrically good chiplets at all available sites, thereby providing electrically good redundant chiplets for use by MCM users.

[0032] Components form part of the overall structure of a multi-component module final assembly. Removing components from fault sites reduces costs but can compromise the structural integrity of the final assembly, potentially leading to warping or other problems in the laminate or assembly due to the absence of physical components. In one embodiment, inserting mechanically sound components into fault sites reduces the cost of the final assembly by inserting expensive components only into functional sites, while maintaining the overall structural integrity of the final assembly by placing mechanically sound components at fault sites, providing the structural integrity expected from those components in the design of the MCM assembly.

[0033] During assembly, a pick-and-place means places electrically good chiplets and components at sites indicated as good sites by the absence of a recognizable mark associated with a particular site, or by the absence of a description in the relevant database record, or both. After placing mechanically good components at fault sites and electrically good components at usable sites, the manufacturing process continues to produce a usable final MCM assembly. As outputs of the MCM manufacturing and assembly process of the disclosed embodiments, a complete assembly, i.e., an assembly with electrically good chiplets at all sites, and a partial assembly are provided. The complete assembly meets the design criteria for a complete MCM assembly. The partial assembly meets the design criteria for a smaller assembly.

[0034] In one embodiment, the method defines an overall success criterion for a completed MCM assembly, or accepts a user-defined overall success criterion for a completed MCM assembly, the criterion including the number of good and bad sites, the number and nature of identified defects, etc. In this embodiment, the method utilizes the defined acceptable and unacceptable criteria to identify each completed final assembly as acceptable or unacceptable according to the defined criteria. The method provides an acceptable final MCM assembly as output.

[0035] In one embodiment, this method completes the final assembly and packaging of the MCM and adds a recognizable, serialized second mark to the outer surface of the MCM packaging. This second mark corresponds to the serialized first mark and either provides a link to a database entry for a specific MCM, or directly incorporates data from the database entry into the mark itself, such as by using a two-dimensional barcode, or by printing the binary data or other data of the database entry directly onto the packaging using inkjet or laser printing as described above.

[0036] Figure 1 shows a schematic diagram of exemplary network resources related to carrying out the disclosed inventions. These inventions can be carried out within a processor of any of the disclosed elements that process an instruction stream. As shown in this figure, a networked client device 110 is wirelessly connected to a server subsystem 102. A client device 104 is wirelessly connected to the server subsystem 102 via a network 114. Client devices 104 and 110 contain manufacturing and assembly programs (not shown) along with sufficient computing resources (processor, memory, network communication hardware) to run these programs. Client devices 104 and 110 may include laminate inspection elements such as optical inspection elements and electrical inspection elements, as well as a robotic pick-and-place system programmed to place chiplets and other components at designated sites on a laminate. As shown in Figure 1, the server subsystem 102 includes a server computer 150. Figure 1 shows a block diagram of the components of a server computer 150 in a networked computer system 1000 according to one embodiment of the present invention. It should be understood that Figure 1 illustrates only one embodiment and does not imply any limitation regarding the environment in which different embodiments can be implemented. Many modifications to the illustrated environment can be made.

[0037] The server computer 150 may include a processor 154, memory 158, persistent storage 170, a communication unit 152, an input / output (I / O) interface 156, and a communication fabric 140. The communication fabric 140 provides communication between the cache 162, memory 158, persistent storage 170, communication unit 152, and the input / output (I / O) interface 156. The communication fabric 140 can be implemented to have an architecture designed to exchange data or control information, or both, between processors (e.g., microprocessors, communication and network processors), system memory, peripheral devices, and other hardware components in the system. For example, the communication fabric 140 can be implemented by one or more buses.

[0038] Memory 158 and persistent storage 170 are computer-readable storage media. In this embodiment, memory 158 includes random-access memory (RAM) 160. Generally, memory 158 may include suitable volatile or non-volatile computer-readable storage media. Cache 162 is a high-speed memory that enhances the performance of processor 154 by holding recently accessed and nearly recently accessed data from memory 158.

[0039] The persistent storage 170 stores program instructions and data, such as manufacturing and assembly programs 175, used to implement embodiments of the present invention, so that one or more of the corresponding processors 154 of the server computer 150 may execute or access, or execute and access, via the cache 162. In this embodiment, the persistent storage 170 includes a magnetic hard disk drive. Instead of, or in addition to, a magnetic hard disk drive, the persistent storage 170 may include a solid-state hard drive, a semiconductor storage device, read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, or other computer-readable storage media capable of storing program instructions or digital information.

[0040] The media used by persistent storage 170 can also be removable media. For example, a removable hard drive can be used for persistent storage 170. Other examples include optical and magnetic disks, thumb drives, and smart cards inserted into the drive for transfer to another computer-readable storage medium, which is also part of persistent storage 170.

[0041] In these examples, the communication unit 152 provides communication with other data processing systems or devices, including the resources of client computing devices 104 and 110. In these examples, the communication unit 152 includes one or more network interface cards. The communication unit 152 can provide communication by using either or both physical communication links and wireless communication links. Through the communication unit 152, software distribution programs, as well as other programs and data used for implementing the present invention, can be downloaded to the persistent storage 170 of the server computer 150.

[0042] The I / O interface 156 enables data input and output with other devices that may be connected to the server computer 150. For example, the I / O interface 156 can provide connection to an external device 190 such as a keyboard, keypad, touchscreen, microphone, digital camera, or several other suitable input devices or a combination thereof. The external device 190 may further include portable computer-readable storage media such as a thumb drive, portable optical or magnetic disk, and memory card. Software and data used to implement embodiments of the present invention, such as a manufacturing and assembly program 175 on the server computer 150, can be stored on such a portable computer-readable storage medium and loaded into persistent storage 170 via the I / O interface 156. The I / O interface 156 also connects to a display 180.

[0043] The display 180 provides a mechanism for displaying data to the user and can function as, for example, a computer monitor. The display 180 can also function as a touch screen, such as the display of a tablet computer.

[0044] Figure 2 shows a flowchart 200 illustrating exemplary operation related to the implementation of this disclosure. After program initiation, in block 210, the disclosed embodiment inspects the laminate during the manufacturing process using the system shown in Figure 1 and described above to identify laminate conductive traces and other assembly and manufacturing defects. This inspection may include optical, electrical, and other non-destructive testing methods to identify trace portions that do not meet design criteria for the laminate. With respect to multilayer laminates, this method inspects each layer of conductive traces, and in one embodiment, this method inspects each layer of conductive traces that is critical to the proper function of the chiplet after placement.

[0045] In one embodiment, this method evaluates the inspection results against defined criteria for each part of the laminate. In this embodiment, this method divides the laminate trace of each layer into multiple regions and defines success / failure criteria for each region. For example, some regions may be more tolerant of optically detected defects or specific electrically detected defects. In another example, some regions may contain defects that do not affect all chiplet sites. The failure trace portion of such regions may reduce the number of successful chiplet sites or electrically functional chiplet sites from the total number of such sites, but the number of remaining successful sites may be greater than the threshold for a laminate that is partially good but acceptable to use when completing an MCM assembly. In one embodiment, the success criteria include a threshold number of electrically good chiplets, a threshold number of definitive communication bus traces for which the test result must be successful, etc. In one embodiment, this method receives a board and inspects it according to user-defined design specifications and inspection criteria for specific regions in order to identify faulty and successful board sites.

[0046] In one embodiment, this method tracks available component sites according to, for example, the type of laminate being inspected, where each type of MCM may be built on a different laminate model. For each such laminate model, this method searches for and then tracks the component sites associated with that laminate model for each individual instance of the laminate model being inspected and assembled.

[0047] In one embodiment, this method compares the results of an electrical test obtained from the inspection with expected resistance and conductivity values ​​for each corresponding region / part of the laminate, and determines whether each part passes or fails the inspection based on the value comparison. In one embodiment, this method compares the optical inspection results using a machine vision system that compares current optical data with expected optical patterns. In this embodiment, this method compares the current data with a range of acceptable optical patterns for each inspection part of the laminate held in an image database. In one embodiment, this method utilizes an artificial intelligence machine learning classification model, such as a convolutional neural network, deep neural network, or recurrent neural network, which has been trained to identify image patterns corresponding to faulty laminate parts. In this embodiment, training the model includes providing a training and test data set containing images of previously identified faulty laminate parts, and training the model to recognize image patterns associated with faulty parts. This method then provides the trained model with new optical image data to identify faulty parts of new laminates.

[0048] In block 220, this method, operated by the computing system described above in Figure 1, applies identifiable marks associated with sites on the laminate identified as fault sites by inspection data. In one embodiment, this method adds a single composite mark to the laminate indicating the status of all inspected sites as either faulty or successful. In one embodiment, this method marks individual faulty sites as faulty, or successful sites as successful, or both. Identifiable marks using machine vision systems such as those described above can be applied using an inkjet printer, laser printer, or other suitable marking system.

[0049] In block 230, this method adds MCM assembly elements to identified sites. This method adds elements such as mechanically good alternative chiplets to locations identified as fault sites, having the necessary shape, size, physical properties, e.g., rigidity, and insertable components for placement at chiplet sites. These alternative chiplets do not contain the electrical components of electrically good chiplets and are significantly less expensive. The use of mechanically good chiplets / components provides the necessary mechanical properties, such as warp control, that would be expected from the presence of chiplets, while simultaneously avoiding the use of expensive electrically good chiplets / components at non-functional sites of the assembly. In one embodiment, this method scans the laminate, identifies marked chiplet sites identified as good or fault sites, and places mechanically good chiplets / components using a robot-controlled pick-and-place unit or similar component placement system.

[0050] In block 240, this method adds electrically good components to sites identified by inspection as acceptable, successful, or good. In one embodiment, this method marks good sites and leaves faulty sites as they are. In this embodiment, this method adds mechanically good components to unmarked sites and electrically good components to marked sites.

[0051] In one embodiment, the method scans a barcode or a serialized similar mark on a laminate and references one or more database entries for that laminate. The database provides information on the locations of faulty component sites and good component sites, as well as the locations of good traces and fault traces. This data enables the proper placement of mechanically good and electrically good components at their respective component sites.

[0052] In one embodiment, this method updates one or more database entries for individual laminates using data on the placement of mechanically good and electrically good components at their respective component sites. Such updates provide an up-to-date history of the ongoing manufacturing and assembly of the final MCM assembly.

[0053] In block 250, this method completes the assembly of MCM components, including the external packaging of the MCM, and provides the completed MCM for use. In this embodiment, this method can apply a mark to the outer MCM packaging that indicates the serial number of a particular MCM unit, provides data associated with a particular MCM unit, or achieves both. The provided serial number or other serialized mark allows the user to access stored database entries related to the manufacture of individual laminates and associated MCM assemblies.

[0054] Figure 3 shows a schematic diagram of a laminate under manufacturing as part of an MCM assembly. As shown in this figure, the laminate 300 includes four chiplet sites indicated in items 0-3, an electrically good chiplet 310 located at chiplet site 3, and several conductive traces 320, the conductive traces 320 which connect the chiplets and component sites to each other and also connect the chiplets and component sites to other assemblies by vias between the laminate and the laminate layer. During inspection, the disclosed method inspects each site and conductive trace to identify trace defects and to identify fault sites and fault traces according to design decision criteria and defect traces. Each chiplet site 0-3 may correspond to a defined area of ​​the laminate 300 for inspection. The fault trace of each fault area may be associated with the corresponding chiplet or component site of that area. In one embodiment, the conductive trace element 320 includes critical conductive traces. Critical conductive traces are those necessary for the function of any conceivable product. A detected failure in a critical trace element is attributed to the faulty stack, even if no other failure sites are detected.

[0055] Figure 4 shows a schematic diagram of the MCM assembly workflow according to one embodiment of the present invention. As shown in this figure, a set of nine laminates 410 in operation, indicated by items 401-409, similar to laminate 300 in Figure 3, are subjected to optical inspection. Laminates 402 and 409 have not passed optical inspection and give a partially good laminate. Laminate 403 has sufficient optical inspection failures to be designated as a faulty laminate and is either discarded or sent for failure analysis to avoid the costs associated with further processing of that laminate.

[0056] After this optical inspection, the method sends the remaining lot 420 of laminates, including good laminates 422 in which no optical faults were identified and partially good laminates 424 in which some faults were optically identified but sufficient redundant traces and component / chiplet sites remained to be considered successful, to an electrical inspection 430. The results of the electrical inspection give good laminates 432 in which there are no optically or electrically faulty traces or sites, partially good laminates 434 in which there is a combination of optical and electrical fault sites and traces but sufficient redundant sites and traces to be considered successful, and faulty laminates 436 in which the number of redundant sites or traces remaining after the optical and electrical inspection is too small to meet the overall success criteria for the laminate and MCM assembly. The method sends the good laminates 432 and partially good laminates 434 to use in a larger assembly. The method identifies the faulty laminates 436 as faulty / unfit and sends them to destruction or failure analysis.

[0057] The disclosed embodiments increase process yield by utilizing partially good laminate structures rather than discarding all laminates with a single site failure or trace failure. In one embodiment, this method analyzes manufacturing process database entries to determine design elements of laminates and assemblies that experience higher or lower levels of failure. Such analysis enables design reviews and modifications to the design and process to reduce such failures. In one embodiment, such analysis leads to design reviews and modifications to add additional redundant design components to reduce the impact of trace and site failures on the overall laminate and assembly yield.

[0058] Although this disclosure includes a detailed description of cloud computing, it should be understood that the embodiments of the teachings described herein are not limited to cloud computing environments. Rather, embodiments of the present invention can be implemented in relation to other types of computing environments that are currently known or may be developed in the future.

[0059] Embodiments of the present invention utilize edge cloud and cloud resources to process laminate inspection data, maintain inspection machine learning models, maintain MCM assembly database records, and enable manufacturers and downstream consumers of completed MCM assemblies to access the MCM assembly database records.

[0060] Cloud computing is a service delivery model that enables convenient on-demand network access to a shared pool of configurable computing resources (e.g., networks, network bandwidth, servers, processing, memory, storage, applications, virtual machines, and services) that can be rapidly supplied and released with minimal administrative effort or minimal interaction with service providers. This cloud model may include at least five features, at least three service models, and at least four deployment models.

[0061] The features are as follows:

[0062] On-demand self-service: Cloud consumers can automatically and unidirectionally access computing functions such as server time and network storage as needed, without requiring human interaction with the service provider.

[0063] Broad Network Access: The functionality is available over the network and accessed through standard mechanisms that facilitate use by heterogeneous thin or thick client platforms (e.g., mobile phones, laptops, and PDAs).

[0064] Resource pooling: To serve a large number of consumers using a multi-tenant model, a provider's computing resources are pooled, and different physical and virtual resources are dynamically allocated and reallocated as needed. Consumers generally have a sense of location independence, meaning they cannot control or know the exact location of the resources provided, but can specify the location at a higher level of abstraction (e.g., country, state, or data center).

[0065] Rapid elasticity: The functionality allows for rapid and elastic supply, sometimes automatically, to quickly scale out, and rapid release to quickly scale in. To consumers, the functionality available for supply often seems limitless, allowing them to purchase any amount they want, whenever they want.

[0066] Measured services: Cloud systems automatically control and optimize resource usage by intervening in instrumentation at an appropriate level of abstraction for the type of service (e.g., storage, processing, bandwidth, and user accounts in use). They can monitor, control, and report on resource usage, providing transparency to both service providers and consumers.

[0067] The service model is as follows:

[0068] Software as a Service (SaaS): This functionality, offered to consumers, allows them to use a provider's applications running on a cloud infrastructure. These applications can be accessed from various client devices through thin client interfaces such as web browsers (e.g., web-based email). Except for the configuration of limited user-specific applications, which may be possible in some cases, consumers do not manage or control the underlying cloud infrastructure, including the network, servers, operating system, storage, or individual application functions.

[0069] Platform as a Service (PaaS): This feature, offered to consumers, allows them to deploy consumer-created or acquired applications on cloud infrastructure using programming languages ​​and tools supported by the provider. Consumers do not manage or control the underlying cloud infrastructure, including networks, servers, operating systems, or storage, but they do control the deployed applications and, in some cases, the application hosting environment configuration.

[0070] Infrastructure as a Service (IaaS): This feature, offered to consumers, provides processing, storage, networking, and other fundamental computing resources, allowing consumers to deploy and run any software they choose, including operating systems and applications. Consumers do not manage or control the underlying cloud infrastructure, but they do control the operating system, storage, and deployed applications, and, in some cases, have limited control over selected network components (e.g., host firewalls).

[0071] The deployment model is as follows:

[0072] Private Cloud: This cloud infrastructure is operated solely for an organization. The infrastructure can be managed by that organization or a third party and can reside on-premises or off-premises.

[0073] Community Cloud: This cloud infrastructure is shared by several organizations to support specific communities that share common interests (e.g., mission, security requirements, policies, and compliance issues). The infrastructure can be managed by the organization or a third party and can reside on-premises or off-premises.

[0074] Public Cloud: This cloud infrastructure is available to the general public or large industry groups and is owned by an organization that sells cloud services.

[0075] Hybrid Cloud: This cloud infrastructure is a composite of two or more clouds (private, community, or public) that maintain their own distinct entities but are united by standardized or proprietary technologies (e.g., cloud bursting for load balancing between clouds) that enable data and application portability.

[0076] Cloud computing environments are service-oriented environments that emphasize statelessness, low coupling, modularity, and semantic interoperability. At the heart of cloud computing is an infrastructure that includes a network of interconnected nodes.

[0077] Referring now to Figure 5, an exemplary cloud computing environment 50 is shown. As shown, the cloud computing environment 50 includes one or more cloud computing nodes 10, and local computing devices used by cloud consumers, such as personal digital assistants (PDAs) or mobile phones 54A, desktop computers 54B, laptop computers 54C, or automotive computer systems 54N, or a combination thereof, can communicate with these nodes. The nodes 10 can communicate with each other. These nodes may be physically or virtually grouped into one or more networks, such as private, community, public, or hybrid clouds, or a combination thereof, as described above (not shown). This allows the cloud computing environment 50 to provide infrastructure, platforms, or software, or a combination thereof, as a service, so that cloud consumers do not need to maintain resources on their local computing devices. It is understood that the types of computing devices 54A-N shown in Figure 5 are intended to be merely examples, and that the computing node 10 and the cloud computing environment 50 can communicate with any type of computerized device over any type of network, an addressable network connection, or both (for example, using a web browser).

[0078] Referring now to Figure 6, a set of functional abstraction layers provided by the cloud computing environment 50 (Figure 5) is shown. It should be understood in advance that the components, layers, and functionalities shown in Figure 6 are intended to be merely examples, and embodiments of the present invention are not limited thereto. As shown in the illustration, the following layers and corresponding functionalities are provided:

[0079] The hardware and software layer 60 includes hardware components and software components. Examples of hardware components include a mainframe 61, RISC (Reduced Instruction Set Computer) architecture-based servers 62, 63, blade servers 64, storage devices 65, and network and networking components 66. In some embodiments, the software components include network application server software 67 and database software 68.

[0080] The virtualization layer 70 provides an abstraction layer that can provide the following examples of virtual entities: virtual servers 71, virtual storage 72, virtual networks 73 including virtual private networks, virtual applications and operating systems 74, and virtual clients 75.

[0081] For example, the management layer 80 may provide the following functions: Resource supply 81 provides dynamic procurement of computing resources and other resources used for the purpose of performing tasks within the cloud computing environment. Measurement and pricing 82 provides cost tracking when resources are used within the cloud computing environment and billing or invoices for the consumption of these resources. For example, these resources may include application software licenses. Security provides identification of cloud consumers and tasks and protection of data and other resources. User portal 83 provides consumers and system administrators with access to the cloud computing environment. Service level management 84 provides allocation and management of cloud computing resources so that the required service levels are achieved. Service Level Agreement (SLA) planning and execution 85 provides proactive coordination and procurement of cloud computing resources that are expected to be needed in the future in accordance with the SLA.

[0082] The workload layer 90 provides examples of functions that can utilize a cloud computing environment. Examples of workloads and functions that can be provided from this layer include mapping and navigation 91, software development and lifecycle management 92, virtual classroom education delivery 93, data analysis processing 94, transaction processing 95, and manufacturing and assembly programs 175.

[0083] The present invention may be a system, method, or computer program product, or a combination thereof, at a level of technical detail that allows for integration. The present invention can be beneficially implemented in any single or parallel system that processes instruction streams. The computer program product may include a computer-readable storage medium having computer-readable program instructions thereon for causing a processor to execute aspects of the present invention.

[0084] This computer-readable storage medium can be a tangible device capable of holding and storing instructions for use by an instruction execution device. This computer-readable storage medium can be, for example, but is not limited to, electronic storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or a suitable combination thereof. A non-exhaustive list of more specific examples of computer-readable storage media includes portable computer diskettes, hard disks, random-access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random-access memory (SRAM), portable compact disk read-only memory (CD-ROM), digital versatile disks (DVDs), memory sticks, floppy disks, mechanically coded devices such as punch cards or raised structures in grooves on which instructions are recorded, and suitable combinations thereof. The computer-readable storage media or computer-readable storage devices used herein should not be construed as themselves transient signals, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating within a waveguide or other transmission medium (e.g., light pulses passing through optical fiber cables), or electrical signals transmitted through wires.

[0085] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to the corresponding computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, or a wireless network, or a combination thereof. This network may include copper transmission cables, optical transmission fibers, wireless transmissions, routers, firewalls, switches, gateway computers or edge servers, or a combination thereof. A network adapter card or network interface within each computing / processing device receives the computer-readable program instructions from the network and transfers those computer-readable program instructions for storage in the corresponding computer-readable storage medium within the respective computing / processing device.

[0086] The computer-readable program instructions for performing the operation of the present invention may be assembler instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or configuration data for an integrated circuit, or they may be source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk and C++, and procedural programming languages ​​such as the C programming language or similar programming languages. These computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or remote server. In the last scenario above, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or this connection may be made to an external computer (for example, via the Internet using an Internet service provider). In some embodiments, to carry out aspects of the present invention, an electronic circuit including, for example, a programmable logic circuit, a field-programmable gate array (FPGA), or a programmable logic array (PLA) may execute the computer-readable program instruction by personalizing the electronic circuit using state information of the computer-readable program instruction.

[0087] In this specification, aspects of the present invention will be described with reference to flowcharts, block diagrams, or both, of methods, apparatus (systems), and computer program products according to embodiments of the present invention. It will be understood that each block in those flowcharts, block diagrams, or both, and combinations of blocks in those flowcharts, block diagrams, or both, can be implemented by computer-readable program instructions.

[0088] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a processor of a dedicated computer, or a processor of another programmable data processing device forming a machine, such that the instructions executed by the processor of that computer or the processor of the other programmable data processing device generate means to perform the functions / operations specified in the blocks of these flowcharts or block diagrams or both. These computer-readable program instructions can further be stored in a computer-readable storage medium that can instruct a computer, a programmable data processing device, or other device or a combination thereof to function in a particular manner, such that the computer-readable storage medium in which the instructions are stored contains a product containing instructions that perform the functions / operations specified in the blocks of these flowcharts or block diagrams or both.

[0089] These computer-readable program instructions can further be loaded onto a computer, other programmable device, or other device in such a manner that these instructions, executed on the computer, other programmable device, or other device, perform the functions / operations specified in the blocks of these flowcharts or block diagrams or both, in order to cause a series of operational steps on the computer, other programmable device, or other device to produce a process performed by the computer.

[0090] The flowcharts and block diagrams in the attached figures illustrate the architecture, function, and operation of possible embodiments of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in those flowcharts or block diagrams may represent a module, segment, or portion of instructions containing one or more executable instructions that perform a specified logical function. In some alternative embodiments, the functions shown in the blocks may be executed in an order different from the order shown in the figures. For example, two consecutively shown blocks may actually be executed substantially simultaneously, or depending on the functions they contain, those blocks may sometimes be executed in reverse order. It should also be noted that each block in those block diagrams or flowcharts or both, and combinations of blocks in those block diagrams or flowcharts or both, may be implemented by a hardware-based dedicated system that performs a specified function or operation or executes a combination of dedicated hardware and computer instructions.

[0091] Wherever "an embodiment," "an embodiment," or "an exemplary embodiment" is used in this specification, it means that the described embodiment may include certain features, structures, or characteristics, but not all embodiments necessarily include those features, structures, or characteristics. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when certain features, structures, or characteristics are described in relation to one embodiment, it is considered within the knowledge of those skilled in the art that such features, structures, or characteristics will be affected in relation to other embodiments, whether or not they are explicitly stated.

[0092] The terms used herein are intended solely to describe specific embodiments and are not intended to limit the invention. Where used herein, the singular forms “a,” “an,” and “the” are intended to include the plural form unless otherwise evident from the context. Where used herein, the terms “comprises” or “comprising” or both indicate the presence of a described feature, integer, step, operation, element, or component or combination thereof, but are not intended to exclude the presence or addition of any other one or more features, integers, steps, operations, elements, components or groups thereof, or combinations thereof.

[0093] The above description of various embodiments of the present invention is illustrative and is not intended to be exhaustive or limitful to the disclosed embodiments. Many modifications and variations that do not depart from the scope of the invention will become apparent to those skilled in the art. The terminology used herein has been selected to best describe the principles, practical applications, or technical improvements not found in commercially available art, or to enable those skilled in the art to understand the embodiments disclosed herein.

Claims

1. A method for assembling a multi-component module, wherein the method is Identifying fault sites on a stack containing multiple sites using one or more computer processors, Add a machine-recognizable mark associated with the aforementioned fault site. To place electrically favorable elements in multiple successful sites, Adding external packages to the aforementioned laminate, the failure site, and the multiple success sites, Adding a mark to the outer surface of the external package that provides access to a database entry associated with the laminate, including failure site data, and To provide a multi-component module (MCM) as a criterion-compliant assembly, comprising the external package with the mark added to the outer surface, the laminate, the failure site, and the electrically good elements of each of the multiple success sites. Methods that include...

2. To place mechanically sound elements at the aforementioned fault site. The method according to claim 1, further comprising:

3. The one or more computer processors provide a definition for at least one region of at least one layer of the laminate. The one or more computer processors receive the inspection judgment criteria for at least one region as the criterion, Inspecting at least one of the aforementioned areas in accordance with the inspection criteria, and Identify the fault site in accordance with the aforementioned inspection. The method according to claim 1, further comprising:

4. The method according to claim 1, further comprising updating a database entry associated with the laminate according to the failure site using one or more computer processors.

5. The method according to claim 1, further comprising: receiving an overall success criterion for the MCM as the criterion by one or more computer processors; and allowing the MCM in accordance with the overall success criterion by one or more computer processors.

6. A method for assembling a multi-component module (MCM), wherein the method is Identifying fault sites on a stack, including multiple sites, using automated inspection by one or more computer processors. To distinguish the aforementioned faulty site from the successful site, a machine-recognizable mark is added. To place electrically sound elements in each of the multiple aforementioned successful sites, Adding external packages to the aforementioned laminate, the failure site, and the multiple success sites, Adding a mark to the outer surface of the external package that provides access to a database entry associated with the laminate, including failure site data, and To provide an MCM (Multi-Chip Module) that includes the external package with the mark added to the outer surface, the laminate, the failure site, and the electrically good elements of each of the multiple success sites, as an assembly that meets the criteria. Methods that include...

7. To place mechanically sound elements at the aforementioned fault site. The method according to claim 6, further comprising:

8. The one or more computer processors provide a definition for at least one region of at least one layer of the laminate. The one or more computer processors receive the inspection judgment criteria for at least one region as the criterion, The one or more computer processors inspect the at least one region in accordance with the inspection criteria, and The one or more computer processors identify the fault site in accordance with the inspection. The method according to claim 6, further comprising:

9. The method according to claim 6, further comprising updating a database entry associated with the laminate according to the failure site using one or more computer processors.

10. The method according to claim 6, further comprising receiving an overall success criterion for the MCM as the criterion by one or more computer processors, and allowing the MCM in accordance with the overall success criterion by one or more computer processors.

11. A method for assembling a multi-component module (MCM), wherein the method is Identifying fault sites on a laminate containing multiple sites using automated inspection by one or more computer processors, To distinguish the aforementioned fault sites, a machine-recognizable mark is added. To place electrically favorable elements in each of multiple successful sites, Reading the first mark associated with the laminate, Updating the database entry associated with the first seal according to the failure site, Adding external packages to the aforementioned laminate, the failure site, and the multiple success sites, Adding a second mark to the outer surface of the external package that provides access to a database entry associated with the laminate, including failure site data, and To provide an MCM (Multi-Chip Module) that includes the external package, the laminate, the failure site, and the electrically good elements of each of the multiple success sites, with the second mark added to the outer surface, as an assembly that meets the criteria. Methods that include...

12. To place mechanically sound elements at the aforementioned fault site. The method according to claim 11, further comprising:

13. The one or more computer processors provide a definition for at least one region of at least one layer of the laminate. The one or more computer processors receive the inspection judgment criteria for at least one region as the criterion, The one or more computer processors inspect the at least one region in accordance with the inspection criteria, and The one or more computer processors identify the fault site in accordance with the inspection. The method according to claim 11, further comprising:

14. The method according to claim 11, further comprising: receiving an overall success criterion for the MCM as the criterion by one or more computer processors; and allowing the MCM in accordance with the overall success criterion by one or more computer processors.

15. A method for assembling a multi-component module (MCM), wherein the method is Identifying fault sites on a laminate containing multiple sites using automated inspection by one or more computer processors, The one or more computer processors read the first mark associated with the laminate. The one or more computer processors update the database entries associated with the first seal according to the failure site. In accordance with the aforementioned database entries, electrically sound elements are placed at each of the multiple successful sites. Adding external packages to the aforementioned laminate, the failure site, and the multiple success sites, Adding a second mark to the outer surface of the external package that provides access to a database entry associated with the laminate, including failure site data, and To provide an MCM (Multi-Chip Module) that includes the external package, the laminate, the failure site, and the electrically good elements of each of the multiple success sites, with the second mark added to the outer surface, as an assembly that meets the criteria. Methods that include...

16. In accordance with the database entries, mechanically sound elements are placed at the fault site. The method according to claim 15, further comprising:

17. The one or more computer processors provide a definition for at least one region of at least one layer of the laminate. The one or more computer processors receive the inspection judgment criteria for at least one region as the criterion, The one or more computer processors inspect the at least one region in accordance with the inspection criteria, and The one or more computer processors identify the fault site in accordance with the inspection. The method according to claim 15, further comprising:

18. The method according to claim 15, further comprising: receiving an overall success criterion for the MCM as the criterion by one or more computer processors; and allowing the MCM in accordance with the overall success criterion by one or more computer processors.

19. A multi-component module (MCM) assembly, Multiple component sites where at least one component site is a failure site, An electrically sound element placed on each of the component sites other than the aforementioned fault site, An external package is added to the laminate and the multiple component sites, and includes a mark on the outer surface that provides access to a database entry associated with the laminate, including failure site data. The fault site has mechanical-only components or zero components MCM assemblies, including those mentioned above.

20. A serialized first mark placed on the aforementioned MCM assembly The MCM assembly according to claim 19, further comprising:

21. The MCM assembly according to claim 19, further comprising a second mark associated with the fault site, which is placed on the MCM assembly.

22. The MCM assembly according to claim 19, further comprising a third mark associated with a database entry, which is placed on the MCM assembly.

23. The MCM assembly according to claim 19, further comprising a laminate defect associated with the aforementioned failure site.

24. A computer program that causes a processor to perform the method described in any one of claims 1 to 18.

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