Method and apparatus for inspecting workpieces, processing method, and processing apparatus.

Abstract

To easily and accurately evaluate a change in quality of processing executed to a workpiece.SOLUTION: An inspection method of inspecting a workpiece which includes a front surface formed with a device region in which a device is formed in each region in which a plurality of division schedule lines intersecting each other are set and which is sectioned by the division schedule line, in which the device region includes a plurality of small sections including a structure having the same arrangement, and in which a processing mark is formed with processing along the division schedule line, includes: a holding step of holding the workpiece with a holding table; an imaging step of creating a plurality of evaluation images by imaging the workpiece at the same imaging position in the plurality of small sections in the device region of the workpiece held by the holding table; and a display step of making a display unit display two or more evaluation images in the plurality of evaluation images. In the display step, the two or more evaluation images are displayed on the display unit according to the processing order of the small sections in each evaluation image.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to an inspection method and an inspection apparatus for inspecting a workpiece when the workpiece is processed along a planned division line to form a processing mark. The present invention also relates to a processing method and a processing apparatus for a workpiece that processes a plate-shaped workpiece along a planned division line to form a processing mark and then inspects the workpiece.

Background Art

[0002] In the manufacturing process of device chips used in electronic devices such as mobile phones and computers, a grid-like planned division line called a street is set on the surface of a wafer made of a semiconductor such as silicon. Devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in each region partitioned by the planned division line on the surface of the wafer. Then, when the wafer is divided along the street, individual device chips can be formed.

[0003] The devices formed in each region partitioned by the planned division line are formed on the surface of the wafer by a process including an exposure process using a stepper. In the stepper, light is irradiated through a reticle for each small area to transfer a circuit pattern to a resist, and an etching process is performed to form a predetermined pattern shape on the surface of the wafer. Therefore, structures with the same arrangement are formed on the surface of the wafer for each small area with the reticle as a unit.

[0004] The division of a workpiece such as a wafer is performed, for example, by a cutting device having a cutting blade. The cutting device rotates the cutting blade and cuts into the workpiece along the street to cut the workpiece. Further, the division of the workpiece may be performed using a laser processing device having a laser processing unit. The laser processing device irradiates the workpiece with a laser beam along the street to perform laser processing on the workpiece.

[0005] These processing devices are equipped with an imaging unit that photographs the workpiece. The processing device uses the imaging unit to photograph the processing marks formed on the workpiece processed by the processing unit. It then determines the quality of the processing marks, such as whether the processing marks are formed in the intended location and whether there are any large chips on the edges of the processing marks (see, for example, Patent Documents 1 to 5). This function is called kerf checking.

[0006] The control unit of the processing equipment has registered evaluation items, evaluation methods, and tolerance values ​​for each evaluation item as judgment conditions used in kerf checking. When determining the quality of the processing marks formed on the workpiece, the registered judgment conditions are read out and used. Furthermore, the control unit also registers the position of the workpiece to be imaged by the imaging unit for kerf checking. The operator registers any position on the surface of the workpiece as an imaging point in the control unit. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2005-197492 [Patent Document 2] Japanese Patent Publication No. 2013-74198 [Patent Document 3] Japanese Patent Publication No. 2010-10445 [Patent Document 4] Japanese Patent Publication No. 2016-197702 [Patent Document 5] Japanese Patent Publication No. 2009-246015 [Overview of the project] [Problems that the invention aims to solve]

[0008] Structures such as TEGs and electrodes are formed along the planned division lines of workpieces such as wafers. The condition and quality of the processing marks formed on the workpiece along the planned division lines are affected by the structures formed at the processing locations. Therefore, even if each part of the planned division line is processed similarly, variations will occur in the processing marks formed at each location due to the structures formed at that location.

[0009] When the imaging locations for kerf checking are determined at the operator's discretion, it is possible to perform kerf checking at each imaging location and individually evaluate the quality of the processing marks formed at that location. However, it is not easy to precisely evaluate the changes in processing quality during the processing of the workpiece by the processing equipment, while excluding the influence of variations caused by structures formed at each imaging location.

[0010] The present invention has been made in view of the above problems, and its object is to provide an inspection method, an inspection apparatus, a processing method, and a processing apparatus that can easily and accurately evaluate changes in the quality of processing performed on a workpiece by inspecting the workpiece. [Means for solving the problem]

[0011] According to one aspect of the present invention, an inspection method for inspecting a workpiece having a device region on its surface in which a plurality of intersecting division lines are set and devices are formed in each region partitioned by the division lines, wherein the device region has a plurality of sub-compartments containing structures arranged in the same manner, and the workpiece has been processed along the division lines to form processing marks, comprising: a holding step of placing the workpiece facing the holding surface of a holding table and holding the workpiece with the holding table; and imaging the workpiece at the same imaging position in each of the plurality of sub-compartments of the device region of the workpiece held on the holding table. The same structure in each of the sub-sections is shown.A method for inspecting a workpiece is provided, comprising an imaging step of creating multiple evaluation images, and a display step of displaying two or more of the multiple evaluation images on a display unit, wherein in the display step, the two or more evaluation images are displayed on the display unit in the order in which the small sections depicted in each evaluation image are processed.

[0012] Preferably, in the display step, two or more evaluation images are displayed on the display unit in the order specified. Alternatively, preferably, in the display step, two or more evaluation images are displayed sequentially on the display unit in the order specified.

[0013] Preferably, after the holding step and before the imaging step, the device further includes a sub-sub

[0014] According to another aspect of the present invention, an inspection apparatus for inspecting a workpiece having a device region on its surface, wherein a plurality of intersecting division lines are set and devices are formed in each region partitioned by the division lines, and the device region has a plurality of sub-compartments containing structures arranged in the same manner, and the workpiece has been processed along the division lines and has processing marks formed thereon, comprising: a holding table having a holding surface and holding the workpiece in contact with the holding surface; an imaging unit imaging the workpiece held by the holding table and creating an image; and the holding table and the imaging unit being positioned parallel to the holding surface. The system comprises a feed unit that moves relative to the direction, a display unit that displays the captured image created by the imaging unit, and a control unit, the control unit controlling the holding table, the imaging unit, and the feed unit by referring to the arrangement stored in the sub-sub The same structure in each of the sub-sections is shown. An inspection device for a workpiece is provided, comprising: an evaluation image creation instruction unit that causes the creation of multiple evaluation images; and a display control unit that causes two or more of the multiple evaluation images to be displayed on the display unit, wherein the display control unit displays the two or more evaluation images on the display unit in the order in which the small sections depicted in each evaluation image have been processed.

[0015] Preferably, the display control unit displays two or more evaluation images in the order specified on the display unit. Alternatively, preferably, the display control unit sequentially displays two or more evaluation images in the order specified on the display unit.

[0016] Preferably, the control unit further includes a small section detection unit that controls the holding table, the imaging unit, and the feed unit to cause the imaging unit to image multiple locations on the surface of the workpiece held by the holding table to create multiple detection images, and detects multiple small sections of the device region based on the imaging position on the surface of each of the multiple detection images and the structure captured in each of the multiple detection images, and an imaging position determination unit that determines the imaging position in the multiple small sections of the workpiece detected by the small section detection unit and stores the imaging position in the imaging position storage unit.

[0017] A machining method for machining a workpiece along the division lines, wherein the workpiece has a device region on its surface, where a plurality of intersecting division lines are set and devices are formed in each region partitioned by the division lines, and the device region has a plurality of sub-compartments containing structures arranged in the same manner, the method comprising: a holding step of facing the holding surface of a holding table and holding the workpiece with the holding table; a machining step of machining the workpiece held on the holding table along the plurality of division lines; and simultaneously with or after the machining step, imaging the workpiece at the same imaging position in each of the plurality of sub-compartments of the device region of the workpiece held on the holding table. The same structure in each of the sub-sections is shown. A method for processing a workpiece is provided, comprising an imaging step of creating multiple evaluation images, and a display step of displaying two or more of the multiple evaluation images on a display unit, wherein in the display step, the two or more evaluation images are displayed on the display unit in the order in which the small sections depicted in each evaluation image were processed in the processing step.

[0018] Preferably, in the display step, two or more evaluation images are displayed on the display unit in the order specified. Alternatively, preferably, in the display step, two or more evaluation images are displayed sequentially on the display unit in the order specified.

[0019] Preferably, in the processing step, the workpiece is processed by a cutting blade to form processing marks on the workpiece, and the evaluation image created in the imaging step shows these processing marks. Alternatively, preferably, in the processing step, the workpiece is irradiated with a laser beam to form processing marks, and the evaluation image created in the imaging step shows either the processing marks or the light emitted from the workpiece when the laser beam was irradiated.

[0020] According to yet another aspect of the present invention, a processing apparatus for processing a workpiece along the division lines, having a device region on its surface in which a plurality of intersecting division lines are set and devices are formed in each region partitioned by the division lines, wherein the device region has a plurality of sub-compartments containing structures arranged in the same manner, comprising: a holding table having a holding surface and holding the workpiece in contact with the holding surface; a processing unit for processing the workpiece held by the holding table; an imaging unit for imaging the workpiece held by the holding table and creating an image; a feed unit for moving the holding table and the imaging unit relative to each other in a direction parallel to the holding surface; and a display for the image created by the imaging unit. The system comprises a display unit and a control unit, the control unit having a processing control unit that controls the holding table and the processing unit to cause the processing unit to process the workpiece along the planned division line, a sub-sub The same structure in each of the sub-sections is shown.An evaluation image creation instruction unit that creates a plurality of evaluation images, and a display control unit that causes the display unit to display two or more of the plurality of evaluation images. The display control unit causes the display unit to display two or more of the evaluation images in the order in which the small sections shown in the respective evaluation images are processed by the processing unit. A processing apparatus for a workpiece is provided, characterized in that.

[0021] Preferably, the display control unit arranges two or more of the evaluation images in the order and displays them on the display unit. Alternatively, preferably, the display control unit sequentially displays two or more of the evaluation images on the display unit in the order.

[0022] Also, preferably, the processing unit is a cutting unit that cuts the workpiece with a cutting blade, and the evaluation image created by the imaging unit shows the processing marks formed on the workpiece by cutting with the cutting blade. Alternatively, preferably, the processing unit is a laser processing unit that irradiates the workpiece with a laser beam to perform laser processing on the workpiece, and the evaluation image created by the imaging unit shows the processing marks formed on the workpiece by irradiating the laser beam, or the light emitted from the workpiece when the laser beam is irradiated.

Effect of the Invention

[0023] In the inspection method, inspection apparatus, processing method, and processing apparatus for a workpiece according to one aspect of the present invention, a workpiece having a plurality of small sections including structures in which the device regions on the surface are arranged in the same manner is inspected. The workpiece is held by a holding table, and the surface side is imaged. Two or more of the created evaluation images are displayed on the display unit. At this time, each evaluation image is displayed on the display unit according to the order in which the small sections shown in the evaluation image are processed.

[0024] The evaluation images are created by capturing images of the workpiece at the same imaging position in multiple subsections of the workpiece. Therefore, the multiple evaluation images displayed on the display unit show the same processing marks and other features formed on the workpiece. Consequently, the influence of variations caused by structures and other factors at each imaging location is eliminated, allowing for verification of changes in processing quality as the workpiece is processed by the processing device.

[0025] Furthermore, since the arrangement of background structures and other elements is the same in the multiple evaluation images displayed on the display unit, it becomes easy to compare the processing marks and other elements visible in each evaluation image. Therefore, operators who inspect the quality of the processing results of a workpiece by visually checking the display unit can perform inspections with extreme ease and high accuracy.

[0026] Therefore, the present invention provides an inspection method and inspection apparatus, a processing method and a processing apparatus that can easily and accurately evaluate changes in the quality of processing performed on a workpiece by inspecting the workpiece. [Brief explanation of the drawing]

[0027] [Figure 1] This is a schematic perspective view showing a processing device that can function as an inspection device. [Figure 2] This is a schematic perspective view showing a workpiece being processed by a processing unit. [Figure 3] This is a schematic plan view showing the surface side of the workpiece. [Figure 4] This is a plan view showing a magnified and partial view of the device area on the surface of the workpiece. [Figure 5] This is a schematic plan view illustrating an example of an evaluation image. [Figure 6] This is a schematic plan view illustrating an example of the display unit's display. [Figure 7] This is a schematic plan view illustrating another example of the display unit's display. [Figure 8] This is a schematic plan view showing a workpiece being processed in another processing unit. [Figure 9]This flowchart shows the flow of each step in the processing and inspection methods for a workpiece. [Modes for carrying out the invention]

[0028] An embodiment of one aspect of the present invention will be described with reference to the attached drawings. In the inspection method, inspection apparatus, processing method, and processing apparatus according to this embodiment, a workpiece such as a semiconductor wafer is inspected. Figure 2 is a schematic perspective view showing a workpiece 1 being processed by the processing apparatus, and Figure 3 is a schematic plan view showing the surface 1a side of the workpiece 1. Figure 4 is a schematic plan view showing an enlarged portion of the surface 1a of the workpiece 1. First, the workpiece 1 will be described.

[0029] The workpiece 1 is a wafer formed from materials such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor materials. Alternatively, it is a wafer formed from a complex oxide such as LT (lithium tantalate) or LN (lithium niobate).

[0030] Alternatively, the workpiece 1 is a roughly disc-shaped substrate made of a material such as sapphire, glass, or quartz. The glass may be, for example, alkali glass, alkali-free glass, soda-lime glass, lead glass, borosilicate glass, or quartz glass. Alternatively, the workpiece 1 may be a package substrate formed by arranging multiple device chips vertically and horizontally and sealing them with resin. The following explanation will use the case where the workpiece 1 is a semiconductor wafer as an example, but the workpiece 1 is not limited to this.

[0031] The surface 1a of the workpiece 1 is divided by multiple intersecting division lines 3. Devices 5, such as ICs and LSIs, are formed in each region of the workpiece 1a divided by the division lines 3. There are no restrictions on the type, quantity, or arrangement of the devices 5. By dividing the workpiece 1 along the division lines 3, individual device chips, each containing a device 5, can be formed. The region of the workpiece 1a where the devices 5 are arranged is called the device region 5a, and the surrounding area is called the outer peripheral surplus region 5b.

[0032] Device 5 is formed, for example, by a general photolithography process. That is, an insulating film, a metal film, etc., is deposited on the surface 1a of the workpiece 1, or, without depositing a film, a photoresist is applied to the workpiece 1. Next, using an exposure device called a stepper, light is irradiated onto the photoresist through a photomask called a reticle, on which a circuit or other pattern is drawn. After that, a development process is carried out to expose the surface 1a of the workpiece 1 at predetermined locations, and the unwanted parts are removed by etching.

[0033] Device 5 is formed by repeating this photolithography process. During the repeated photolithography process, structures 13 such as TEGs and electrodes, which will be used before the workpiece 1 is divided, are formed along the division lines 3 on the surface 1a of the workpiece 1.

[0034] Here, after applying photoresist to the surface 1a of the workpiece 1, when the photoresist is exposed using a reticle, various parts of the surface 1a are sequentially exposed while moving the exposure area from one to the other. As a result, as shown in Figure 4, multiple small sections 15 with various structures arranged in the same way are formed adjacent to each other on the surface 1a of the workpiece 1. In other words, the device area 5a of the surface 1a of the workpiece 1 has multiple small sections 15 containing structures with the same arrangement, with the reticle as the unit.

[0035] In the example shown in Figure 4, each sub-section 15 is demarcated by four planned division lines 3 along one direction and five planned division lines 3 along the other direction, and includes 12 devices 5 and 3 structures 13. However, the configuration of the sub-section 15 is not limited to this. That is, the number and arrangement of planned division lines 3, devices 5, and structures 13 such as TEGs included in a single sub-section 15 are not limited to this.

[0036] Furthermore, a single reticle may simultaneously expose the surface 1a of the workpiece 1 in multiple sub-sections 15. In other words, each sub-section 15 does not necessarily have to be a reticle unit. To put it another way, each sub-section 15 and the area exposed simultaneously by the reticle do not necessarily coincide. In any case, the device area 5a of the surface 1a of the workpiece 1 has sub-sections 15 that contain structures of the same arrangement and shape.

[0037] Figure 2 schematically shows a perspective view of a frame unit 11 containing a workpiece 1 to be processed by the processing device. When the workpiece 1 is brought into the processing device, the workpiece 1, adhesive tape 7, and ring frame 9 are integrated to form the frame unit 11. The workpiece 1 is then brought into the processing device in the form of the frame unit 11 and processed.

[0038] The frame unit 11 includes a ring frame 9 and an adhesive tape 7 that is applied to cover the opening of the ring frame 9. The adhesive tape 7 exposed at the opening of the ring frame 9 is attached to the back surface 1b of the workpiece 1. In other words, the workpiece 1 is supported by the ring frame 9 via the adhesive tape 7. Alternatively, instead of the adhesive tape 7, a non-adhesive resin sheet, such as a polyolefin or polyester material, may be heat-pressed and integrated with the workpiece 1 and the ring frame 9 to form the frame unit 11.

[0039] Next, an inspection apparatus and a processing apparatus for implementing the inspection method according to this embodiment will be described. The inspection apparatus and processing apparatus for inspecting the workpiece 1 inspect the workpiece 1 after it has been processed along the division line 3 and processing marks have been formed on it. Alternatively, the inspection apparatus and processing apparatus according to this embodiment process the workpiece 1 along the division line 3 and then inspect the processed workpiece 1.

[0040] Hereinafter, as an example of an inspection apparatus and processing apparatus for implementing the inspection method according to this embodiment, a processing apparatus used to process and inspect a workpiece 1 will be described. Figure 1 is a schematic perspective view showing a cutting apparatus 2, which is an example of a processing apparatus.Hereafter, the explanation will be given using the case where the processing apparatus is a cutting apparatus 2 as an example, but the processing apparatus is not limited to a cutting apparatus 2.

[0041] The cutting device (inspection device, processing device) 2 is equipped with a base 4 that supports each component. An opening 4a is formed in the front corner of the base 4, and a cassette support base 8 that moves up and down by a lifting mechanism (not shown) is provided inside this opening 4a. A cassette 10 that accommodates multiple workpieces 1 is mounted on the upper surface of the cassette support base 8. Note that in Figure 1, only the outline of the cassette 10 is shown for the sake of explanation.

[0042] A rectangular opening 4b is formed on the side of the cassette support base 8, with its longitudinal direction aligned with the X-axis direction (front-to-back direction, machining feed direction). Inside the opening 4b are a ball screw type X-axis movement mechanism (not shown), a table cover 14 covering the top of the X-axis movement mechanism, and a dustproof and waterproof cover 16. The X-axis movement mechanism includes an X-axis movement table (not shown) covered by the table cover 14, and moves this X-axis movement table in the X-axis direction.

[0043] A holding table 18 is positioned on the upper surface of the X-axis moving table so as to be exposed from the table cover 14. The holding table 18 functions as a chuck table that, for example, holds a workpiece 1 placed on its upper-exposed holding surface 18a by suction. The holding table 18 is connected to a rotational drive source (not shown), such as a motor, and rotates around a rotation axis that is roughly parallel to the Z-axis direction (vertical direction).

[0044] The holding table 18 comprises a porous member 18c having the same diameter as the workpiece 1, and a frame covering the porous member 18c. Inside the holding table 18, a suction passage (not shown) is formed, one end of which is connected to a suction source (not shown), such as an ejector, provided outside the holding table 18. The other end of the suction passage reaches the porous member 18c.

[0045] The upper surface of the porous member 18c is exposed on the holding surface 18a of the holding table 18. The upper surface of the porous member 18c has a diameter equivalent to that of the workpiece 1 and is formed to be roughly parallel to the X-axis and Y-axis directions. Furthermore, a plurality of clamps 18b are provided around the holding table 18 for fixing the ring frame 9 that supports the workpiece 1 from the surroundings.

[0046] When holding the workpiece 1 with the holding table 18, first, the workpiece 1 is placed facing the holding surface 18a, and the frame unit 11 is placed on the holding surface 18a of the holding table 18. Then, the suction source and the porous member 18c are connected via the suction passage, and negative pressure is applied to the workpiece 1 via the adhesive tape 7. As a result, the workpiece 1 is held by the holding table 18.

[0047] The cutting apparatus 2 includes a transport unit (not shown) in the area adjacent to the opening 4b for transporting the workpiece 1 to a holding table 18 or the like. A temporary placement mechanism for temporarily placing the workpiece 1 is provided in a position close to the side of the cassette support base 8. The temporary placement mechanism includes, for example, a pair of guide rails 12 that move closer to and further away from each other while maintaining a state parallel to the Y-axis direction (indexing feed direction). The pair of guide rails 12 grip the workpiece 1 pulled out from the cassette 10 by the transport unit along the X-axis direction and align it to a predetermined position.

[0048] The workpiece 1, positioned in the predetermined location, is lifted by the transport unit and transported to the holding table 18. At this time, the pair of guide rails 12 are separated from each other, and the workpiece 1 is passed between the pair of guide rails 12.

[0049] Above the holding table 18, a first processing unit 24a and a second processing unit 24b are provided, which cut (process) the workpiece 1 with an annular cutting blade. On the upper surface of the base 4, a gate-shaped support structure 20 for supporting the first processing unit 24a and the second processing unit 24b is positioned so as to straddle the opening 4b.

[0050] The upper front of the support structure 20 is provided with a first moving unit 22a for moving the first processing unit 24a in the Y-axis and Z-axis directions, and a second moving unit 22b for moving the second processing unit 24b in the Y-axis and Z-axis directions. The first moving unit 22a is equipped with a Y-axis moving plate 28a, and the second moving unit 22b is equipped with a Y-axis moving plate 28b. The two Y-axis moving plates 28a and 28b are slidably mounted on a pair of Y-axis guide rails 26 arranged along the Y-axis direction on the front of the support structure 20.

[0051] A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 28a, and a Y-axis ball screw 30a, which is generally parallel to the Y-axis guide rail 26, is screwed into this nut portion. Similarly, a nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 28b, and a Y-axis ball screw 30b, which is generally parallel to the Y-axis guide rail 26, is screwed into this nut portion.

[0052] A Y-axis pulse motor 32a is connected to one end of the Y-axis ball screw 30a. By rotating the Y-axis ball screw 30a with the Y-axis pulse motor 32a, the Y-axis moving plate 28a moves in the Y-axis direction along the Y-axis guide rail 26. Additionally, a Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 30b. By rotating the Y-axis ball screw 30b with this Y-axis pulse motor, the Y-axis moving plate 28b moves in the Y-axis direction along the Y-axis guide rail 26.

[0053] A pair of Z-axis guide rails 34a are provided on the front surface of the Y-axis moving plate 28a, along the Z-axis direction, and a pair of Z-axis guide rails 34b are provided on the front surface of the Y-axis moving plate 28b, along the Z-axis direction. A pair of Z-axis moving plates 36a are slidably attached to the pair of Z-axis guide rails 34a, and a pair of Z-axis moving plates 36b are slidably attached to the pair of Z-axis guide rails 34b.

[0054] A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36a, and a Z-axis ball screw 38a is screwed into this nut portion, positioned to be approximately parallel to the Z-axis guide rail 34a. A Z-axis pulse motor 40a is connected to one end of the Z-axis ball screw 38a, and by rotating the Z-axis ball screw 38a with the Z-axis pulse motor 40a, the Z-axis moving plate 36a moves in the Z-axis direction along the Z-axis guide rail 34a.

[0055] A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36b, and a Z-axis ball screw 38b, which is positioned to be roughly parallel to the Z-axis guide rail 34b, is screwed into this nut portion. A Z-axis pulse motor 40b is connected to one end of the Z-axis ball screw 38b, and by rotating the Z-axis ball screw 38b with the Z-axis pulse motor 40b, the Z-axis moving plate 36b moves in the Z-axis direction along the Z-axis guide rail 34b.

[0056] A first processing unit 24a is provided at the bottom of the Z-axis moving plate 36a. An imaging unit 46a for photographing the workpiece 1 held by the holding table 18 is provided adjacent to the first processing unit 24a. A second processing unit 24b is provided at the bottom of the Z-axis moving plate 36b. An imaging unit 46b for photographing the workpiece 1 held by the holding table 18 is provided adjacent to the second processing unit 24b.

[0057] The imaging units 46a and 46b each include, for example, a photoelectric conversion element that receives light and converts it into an electrical signal, and a lens that focuses on the upper surface of the workpiece 1 held by the holding table. The photoelectric conversion element is, for example, a CMOS sensor or a CCD sensor. The imaging units 46a and 46b have the function of capturing an image of the upper surface (for example, surface 1a) of the workpiece 1, creating an image, and transmitting the image to the control unit 56, which will be described later.

[0058] The first moving unit 22a controls the Y-axis and Z-axis positions of the first processing unit 24a and imaging unit 46a, and the second moving unit 22b controls the Y-axis and Z-axis positions of the second processing unit 24b and imaging unit 46b. The positions of the first processing unit 24a and the second processing unit 24b are controlled independently of each other.

[0059] To explain from another perspective, the cutting apparatus 2 includes a holding table 18 and a feed unit that moves the machining units 24a, 24b and imaging units 46a, 46b relative to the holding table 18 in directions parallel to the holding surface 18a of the holding table 18 (X-axis direction, Y-axis direction). This feed unit is composed of the aforementioned X-axis movement mechanism and movement units 22a, 22b.

[0060] Figure 2 is a schematic perspective view showing a workpiece 1 being cut by a machining unit 24 (first machining unit 24a or second machining unit 24b) equipped with a cutting blade 44 as a machining tool. Note that the clamp 18b of the holding table 18 and the imaging units 46a, 46b, etc., are omitted in Figure 2. The machining unit (cutting unit) 24 comprises an annular cutting blade 44 and a spindle (not shown) that passes through a through hole in the center of the cutting blade 44. The cutting blade 44 can be rotated by rotating the spindle.

[0061] The cutting blade 44 has a grinding wheel portion on its outer circumference that includes countless abrasive grains such as diamond and a bond that disperses and fixes the abrasive grains. When the cutting blade 44 is rotated and the grinding wheel portion is brought into contact with the workpiece 1 along the planned division line 3, the workpiece 1 is cut and a machining mark 3a is formed.

[0062] When processing the workpiece 1, first, the surface 1a of the workpiece 1 held by the holding table 18 is photographed by the imaging units 46a and 46b to detect the division line 3. Then, the holding table 18 is rotated around an axis perpendicular to the holding surface 18a so that the extension direction of the division line 3 matches the processing feed direction (X-axis direction). After that, the cutting blade 44 is positioned above the end of the division line 3 and the cutting blade 44 is rotated.

[0063] Subsequently, the machining unit 24 is lowered so that the lower end of the cutting blade 44 reaches the adhesive tape 7 below the back surface 1b of the workpiece 1. Then, the workpiece 1 is fed along the X-axis, and the workpiece 1 is cut, forming machining marks (cutting grooves) 3a along the division line 3. After machining the workpiece 1 along one division line 3, the machining unit 24 is indexed and fed in the Y-axis direction perpendicular to the X-axis, and the workpiece 1 is machined similarly along the other division line 3.

[0064] In this way, the workpiece 1 is processed one after another, and after processing the workpiece 1 along all the planned division lines 3 in one direction, the holding table 18 is rotated around an axis perpendicular to the holding surface 18a to align the planned division lines 3 in the other direction with the processing feed direction. Then, the workpiece 1 is processed one after another along the planned division lines 3 in the other direction. When the workpiece 1 has been processed along all the planned division lines 3 and processing marks 3a have been formed, the processing of the workpiece 1 by the cutting device 2 is completed.

[0065] The machining unit 24 is further equipped with a cutting fluid supply nozzle 24c that supplies cutting fluid, such as pure water, to the workpiece 1 being machined. When the workpiece 1 is cut by the cutting blade 44, cutting chips are generated from the workpiece 1 and the cutting blade 44. Heat is also generated due to friction between the workpiece 1 and the cutting blade 44. While the workpiece 1 is being machined, if cutting fluid is supplied through the cutting fluid supply nozzle 24c, the cutting chips and heat are removed by the cutting fluid.

[0066] The cutting device (processing device) 2 will be further explained using Figure 1. An opening 4c is formed opposite to opening 4a relative to opening 4b. A cleaning unit 48 for cleaning the workpiece 1 is placed inside opening 4c, and the workpiece 1 processed on the holding table 18 is cleaned by the cleaning unit 48. The workpiece 1 cleaned by the cleaning unit 48 is then stored back into the cassette 10.

[0067] Furthermore, the cutting device 2 is equipped with a display unit 50 capable of displaying various information. The display unit 50 displays information indicating the status of the cutting device 2 and the workpiece 1, information indicating the progress of machining, or information indicating the presence or absence of abnormalities, and notifies the user or manager of the cutting device 2 of this information. The display unit 50 also has the function of displaying images captured by the imaging units 46a and 46b. The display unit 50 is, for example, a monitor such as a liquid crystal display.

[0068] Furthermore, the display unit 50 may incorporate an input device (input interface) such as a touch panel. If the display unit 50 is a touch panel display, users of the cutting device 2 can use the display unit 50 to input various commands to the cutting device 2 and operate the cutting device 2. In this case, the display unit 50 will display an operation screen.

[0069] Furthermore, the cutting device (inspection device, processing device) 2 is equipped with a control unit 56 that controls each component of the cutting device 2. The control unit 56 controls the feed unit, which consists of an X-axis movement mechanism and movement units 22a, 22b, processing units 24a, 24b, imaging units 46a, 46b, holding table 18, cleaning unit 48, display unit 50, various transport devices, etc.

[0070] The control unit 56 then controls each component to advance the machining of the workpiece 1 in the cutting device 2. Furthermore, when the cutting device 2 functions as an inspection device, the control unit 56 controls each component to advance the inspection of the workpiece 1.

[0071] The control unit 56 is comprised of a computer that includes, for example, a processing unit such as a CPU or microprocessor and a storage device such as flash memory or a hard disk drive. By operating the processing unit according to software such as a program stored in the storage device, it functions as a concrete means of cooperation between software and the processing unit (hardware resource).

[0072] The control unit 56 includes a storage unit 58 that stores processing conditions for various workpieces 1 processed by processing units 24a and 24b, as well as various other information. Specifically, the storage unit 58 includes a processing condition storage unit 58a that stores processing conditions.

[0073] The machining conditions stored in the machining condition storage unit 58a include information such as the type and size of the workpiece 1 to be machined, the rotational speed and depth of cut of the cutting blade 44, the machining feed rate, the cutting fluid injection conditions, and the type of cutting blade 44 used for machining. Multiple machining conditions are pre-registered in the machining condition storage unit 58a, and the conditions suitable for machining the workpiece 1 to be machined are appropriately selected and referenced.

[0074] The control unit 56 includes a machining control unit 60 that reads machining conditions stored in the machining condition storage unit 58a and controls the X-axis movement mechanism, movement units 22a, 22b, machining units 24a, 24b, holding table 18, etc., according to the machining conditions. The machining control unit 60 controls each component according to predetermined machining conditions to perform machining on the workpiece 1.

[0075] In the cutting device 2, when the workpiece 1 processed by the processing units 24a and 24b is photographed by the imaging units 46a and 46b, the formed processing marks 3a can be analyzed. The analysis of processing marks 3a is called a kerf check. Performing a kerf check allows monitoring of the quality of the processing marks 3a formed on the workpiece 1. Then, if, for example, processing marks 3a of an unacceptable shape are formed on the workpiece 1, the cutting device 2 can interrupt processing or issue a warning to the manager of the cutting device 2 to prompt inspection.

[0076] The memory unit 58 of the control unit 56 stores evaluation items, evaluation methods, and permissible values ​​for each evaluation item as judgment conditions used in kerf checking. When determining the quality of the machining marks formed on the workpiece 1, the registered judgment conditions are read out and used. The control unit 56 may also include a judgment unit 66 that reads out the judgment conditions etc. registered in the memory unit 58 and controls the imaging units 46a, 46b and the feed unit etc. to perform kerf checking.

[0077] Here, structures 13 (see Figure 4), such as TEGs and electrodes, are formed along the planned division line 3 of the workpiece 1, such as a wafer. The state and quality of the processing marks 3a formed on the workpiece 1 along the planned division line 3 are affected by the structures 13 formed at the processing locations. Therefore, even if each part of the planned division line 3 is processed similarly, variations will occur in the processing marks 3a formed at each location due to the structures 13 formed at that location.

[0078] When the imaging locations for kerf checking are determined at the operator's discretion, it is possible to perform kerf checking at each imaging location and individually evaluate the quality of the machining marks 3a formed at that location. However, it is not easy to evaluate the changes in machining quality during the machining of the workpiece 1 by the cutting device (machining device) 2 while excluding the influence of variations caused by structures 13 etc. formed at each imaging location.

[0079] Therefore, in the inspection apparatus and processing apparatus (cutting apparatus 2) according to this embodiment, multiple evaluation images are created by imaging the workpiece 1 at the same imaging position in multiple small sections 15 included in the workpiece 1, so that changes in the quality of processing performed on the workpiece 1 can be easily and accurately evaluated. In this case, since the same structure 13 etc. are captured in each evaluation image, the workpiece 1 is processed similarly in each location and processing marks 3a are formed similarly. That is, since there is no difference in the processing state due to the structure 13 at each processing location, changes in processing quality can be easily and precisely evaluated by comparing each evaluation image.

[0080] The following description of the cutting device (inspection device, processing device) 2 will focus on its configuration for inspecting changes in processing quality. The control unit 56 includes a compartment storage unit 58b that stores the arrangement of multiple compartments 15 on the surface 1a of the workpiece 1, and an imaging position storage unit 58c that stores the same imaging position in the multiple compartments 15.

[0081] The manager of the cutting device 2 may pre-register the arrangement of small compartments 15 on the surface 1a of the workpiece 1 in the small compartment storage unit 58b of the control unit 56. For example, when light is irradiated through a reticle to perform a photolithography process and form a device 5, etc., structures with a similar arrangement will be formed on the surface 1a of the workpiece 1 on a reticle-by-reticle basis. In this case, it is preferable that each irradiated area that is irradiated with light at one time be registered as a small compartment 15 in the small compartment storage unit 58b.

[0082] However, the position of the sub-compartment 15 may be stored in the sub-compartment storage unit 58b by other means. For example, the control unit 56 of the cutting device 2 may have a sub-compartment detection unit 70 that causes the imaging units 46a and 46b to image the workpiece 1 held on the holding table 18, and detects the repeating units as sub-compartments 15 from the obtained imaged images.

[0083] More specifically, the small section detection unit 70 controls the holding table 18, the imaging units 46a and 46b, and the aforementioned feed unit to cause the imaging units 46a and 46b to image multiple locations on the surface 1a of the workpiece 1 held by the holding table 18. The imaging units 46a and 46b then create multiple detection images. The small section detection unit 70 compares each of the created detection images to detect the same structures, etc., that appear in each detection image.

[0084] The sub-compartment detection unit 70 then detects the multiple sub-compartments 15 that the device region 5a has, based on the imaging position on each surface 1a of the multiple detection images and the structure captured in each of the multiple detection images. In this case, the sub-compartment detection unit 70 stores the arrangement of the detected sub-compartments 15 in the sub-compartment storage unit 58b of the storage unit 58.

[0085] Furthermore, when the workpiece 1 is processed by the cutting device 2, the sub-section detection unit 70 should detect the sub-sections 15 on the surface 1a of the workpiece 1 after it has been held by the holding table 18 and before it is processed by the processing units 24a and 24b.

[0086] Thus, the cutting device (inspection device, processing device) 2 may independently detect the small sections 15 of the workpiece 1 using imaging units 46a, 46b, etc. In this case, the arrangement of the small sections 15 does not need to be stored in the small section storage unit 58b in advance.

[0087] The imaging position storage unit 58c of the control unit 56 stores the imaging positions that the imaging units 46a and 46b should capture when creating evaluation images, as described later. Figure 4 schematically shows an example of an imaging position 15a. As shown in Figure 4, each imaging position 15a is determined to be the same position in each of the sub-sections 15.

[0088] The manager of the cutting device 2 may pre-register a suitable imaging position 15a in the imaging position storage unit 58c of the control unit 56. For example, the manager may input an instruction to the control unit 56 to display an image of the small section 15 on the display unit 50, and select a position in the image that is suitable for obtaining information about changes in processing quality as the imaging position 15a. Then, the manager may specify the selected position as the imaging position 15a and register it in the imaging position storage unit 58c.

[0089] However, the imaging position storage unit 58c does not necessarily have to have the imaging position 15a stored in advance. For example, the control unit 56 may further include an imaging position determination unit 72 that determines the imaging positions 15a in a plurality of small sections 15 of the workpiece 1 detected by the small section detection unit 70 and stores the imaging positions 15a in the imaging position storage unit 58c. In other words, the control unit 56 may determine the imaging positions 15a itself.

[0090] The imaging position determination unit 72 determines, for example, as the imaging position 15a a position in the planned division line 3 of the workpiece 1 where both the area where a structure 13 such as a TEG is formed and the area where the structure 13 is not formed can be imaged. This allows for simultaneous evaluation of the processing quality under various processing conditions from each evaluation image. However, the imaging position 15a is not limited to this. The imaging position 15a in the small section 15 determined by the imaging position determination unit 72 is stored in the imaging position storage unit 58c.

[0091] The control unit 56 includes an evaluation image creation instruction unit 62 that controls the holding table 18, the imaging units 46a and 46b, and the aforementioned feeding unit to cause the imaging units 46a and 46b to image the surface 1a of the workpiece 1 at a predetermined position to form an evaluation image.

[0092] The evaluation image creation instruction unit 62 reads out the arrangement of the small compartments 15 stored in the small compartment storage unit 58b and the imaging positions 15a stored in the imaging position storage unit 58c. Then, referring to these, it instructs the imaging units 46a and 46b to image the workpiece 1 at each of the imaging positions 15a of the multiple small compartments 15, thereby creating multiple evaluation images.

[0093] Figure 5 is a schematic plan view showing an example of an evaluation image 17. The evaluation image 17 shown in Figure 5 shows two devices 5 arranged vertically, a planned division line 3 between these two devices 5, and the area 21 where machining marks 3a are formed on the workpiece 1 along the planned division line 3. The evaluation image 17 shown in Figure 5 also shows structures 19a and 19b such as electrode patterns and elements that make up the device 5. Machining marks 3a are also formed on structures 13 such as TEGs formed on the planned division line 3.

[0094] In the cutting device (processing device, inspection device) 2, a kerf check may be performed using this evaluation image 17. That is, the width and position of the processing marks 3a, the occurrence of chipping, etc., may be evaluated. For example, the cutting device 2 may display the evaluation image 17 on the display unit 50, and the user of the cutting device 2 may determine the quality of the processing result based on the evaluation image 17 displayed on the display unit 50.

[0095] Alternatively, the control unit 56 may include a determination unit 66 that determines the quality of the processing results, etc., based on the evaluation image 17. The storage unit 58 stores in advance the determination conditions that the determination unit 66 uses to determine the quality of the processing results, etc.

[0096] Here, we will explain the calf check of the processing marks 3a of the processed workpiece 1. During the calf check process, for example, the off-center amount, which indicates the deviation between the center line of the planned division line 3 and the center line of the processing marks 3a, as well as the minimum calf width and maximum calf width are evaluated. In addition, the size of the chipping, which is a chip formed on the outer edge of the processing marks 3a, is evaluated. Tolerance values ​​are set for each judgment item. The judgment unit 66 determines the quality of the processing marks 3a by determining whether these judgment items fall within the tolerance values ​​based on the evaluation image 17.

[0097] The memory unit 58 of the control unit 56 further includes an image memory unit 58d that can store and accumulate the created evaluation images 17. The image memory unit 58d may store, for example, information regarding the imaging position on the surface 1a of the workpiece 1 along with each evaluation image 17. The imaging position of each evaluation image 17 is useful for deriving the processing order of the small sections 15 depicted in each evaluation image 17, as will be described later. Alternatively, instead of information regarding the imaging position, the processing order of the small sections 15 depicted may be associated with and registered for each evaluation image 17 stored in the image memory unit 58d.

[0098] The control unit 56 further includes a display control unit 64 that displays two or more of the evaluation images 17 from among the multiple evaluation images 17 on the display unit 50. The display control unit 64 is not required to display all of the evaluation images 17 stored in the image storage unit 58d on the display unit 50, but it may display all of the evaluation images 17 on the display unit 50.

[0099] The display control unit 64 then causes the display unit 50 to display two or more evaluation images 17 according to the processed order of the small sections 15 depicted in each evaluation image 17. The process of displaying each evaluation image 17 in this order on the display unit 50 will now be described in detail.

[0100] Figure 6 is a schematic plan view of a display unit 50 that displays a results display screen 50a containing four evaluation images 17a, 17b, 17c, and 17d. On the results display screen 50a, the evaluation images 17a, 17b, 17c, and 17d are arranged according to the order in which the sub-sections 15 displayed on the screen were processed.

[0101] For example, the evaluation image 17a showing the earliest processed sub-section 15 among the sub-sections 15 captured in each image is displayed on the upper left of the results display screen 50a, and the evaluation image 17b showing the next processed sub-section 15 is displayed on the upper right of evaluation image 17a. Furthermore, the evaluation image 17c showing the next processed sub-section 15 is displayed on the lower left of the results display screen 50a as the image following evaluation image 17b, and the evaluation image 17d showing the last processed sub-section 15 is displayed on the lower right. In this way, on the results display screen 50a, the evaluation images 17a, 17b, 17c, and 17d are arranged from left to right and from top to bottom according to the order in which the sub-sections 15 captured in each image were processed.

[0102] Here, each evaluation image 17a, 17b, 17c, and 17d is an image obtained by capturing images at the same imaging position 15a in each sub-section 15. Therefore, in each evaluation image 17a, 17b, 17c, and 17d, the structures other than the processing marks 21a, 21b, 21c, and 21d are the same, and only the processing marks 21a, 21b, 21c, and 21d with these structures as the background differ. In this case, each processing mark 21a, 21b, 21c, and 21d can be compared very easily and with high accuracy.

[0103] Then, the evaluation images 17a, 17b, 17c, and 17d are displayed on the display unit 50 in the order in which the small sections 15 are processed. As a result, the influence of variations caused by structures 13 such as TEGs can be eliminated, and the changes in processing quality during the processing of the workpiece 1 can be verified.

[0104] The manner in which the evaluation images 17 are displayed on the display unit 50 in the order in which the small sections 15 are processed is not limited to this. For example, the display control unit 64 may sequentially display two or more evaluation images 17 on the display unit 50 in the order in which the small sections 15 are processed. Figure 7 is a schematic plan view of the display unit 50 on which the result display screen 50b in which the evaluation images 17 are sequentially displayed is shown.

[0105] On the results display screen 50b shown on the display unit 50, for example, multiple evaluation images 17 are displayed one by one in the specified order, switching at regular intervals. The results display screen 50b may also display an operation button 54b for inputting a command to the control unit 56 to temporarily stop the switching of images displayed on the display unit 50 and continue to display one evaluation image 17.

[0106] Furthermore, the results display screen 50b may also display an operation button 54c used to input a command to display the next evaluation image 17 after the displayed evaluation image 17. When the operation button 54c displayed on the display unit 50 is touched by an operator or the like, the display control unit 64 causes the next evaluation image 17 in that order to be displayed on the display unit 50.

[0107] Furthermore, the results display screen 50b may also display an operation button 54a used to input a command to display the evaluation image 17 preceding the displayed evaluation image 17. When the operation button 54a displayed on the display unit 50 is touched by an operator or the like, the display control unit 64 displays the evaluation image 17 preceding that image in that sequence on the display unit 50.

[0108] In this configuration, where evaluation images 17 are sequentially displayed on the display unit 50 according to the order in which the small sections 15 projected onto the display unit 50 are processed, it is easy for operators viewing the display unit 50 to intuitively and accurately grasp the changes in the processing trace formation area 21, i.e., the changes in processing quality.

[0109] Next, the procedure for processing and inspecting the workpiece 1 using the cutting device (processing device, inspection device) 2 will be described. That is, the processing method (inspection method) for the workpiece according to this embodiment will be described. Figure 9 is a flowchart showing the flow of each step in the processing method for the workpiece according to this embodiment. Steps not shown in this flowchart may also be performed in this processing method. The following description will use the case in which the processing method for the workpiece according to this embodiment is performed using the cutting device 2 as an example, but this processing method (inspection method) may also be performed using other processing devices (inspection devices), etc.

[0110] This processing method is for processing a workpiece 1 having a device region 5a on its surface 1a, where a device 5 is formed in each region partitioned by a plurality of intersecting division lines 3, and the device region 5a has a plurality of sub-compartments 15 containing structures arranged in the same manner. In this processing method, the workpiece 1 is unloaded from a cassette 10 placed on a cassette support base 8, the workpiece 1 is brought facing the holding surface 18a of a holding table 18, and a holding step S10 is performed in which the workpiece 1 is held by the holding table 18.

[0111] In the holding step S10, the workpiece 1 in the frame unit 11 (see Figure 2) may be transported to the holding table 18. At this time, the adhesive tape 7 may be attached to the back surface 1b of the workpiece 1, exposing the front surface 1a, or the adhesive tape 7 may be attached to the front surface 1a of the workpiece 1, exposing the back surface 1b.

[0112] By placing the workpiece 1 on the holding surface 18a of the holding table 18 via the adhesive tape 7, gripping the ring frame 9 with the clamp 18b, and applying negative pressure to the workpiece 1 through the holding surface 18a, the workpiece 1 can be held in place by suction at the holding table 18.

[0113] Next, a machining step S20 is performed in which the workpiece 1 held in the holding table 18 is machined along multiple planned division lines 3. The machining step S20 may be performed, for example, by the functions of the machining control unit 60 of the control unit 56. The machining control unit 60 reads predetermined machining conditions stored in the machining condition storage unit 58a of the storage unit 58, and controls each component of the cutting device 2 according to these machining conditions to proceed with machining the workpiece 1.

[0114] In machining step S20, first, the holding table 18 is rotated to align the orientation of one of the planned division lines 3 of the workpiece 1 with the X-axis direction (machining feed direction). Then, the X-axis movement mechanism, etc., is operated to position the cutting blade 44 on the extension of one of the planned division lines 3. At this time, it is advisable to use imaging units 46a and 46b to image the workpiece 1 and confirm the position and orientation of the planned division line 3.

[0115] Then, the cutting blade 44 starts rotating, and the moving units 22a and 22b are activated to lower the rotating cutting blade 44, positioning the lower end of the cutting blade 44 between the upper and lower ends of the adhesive tape 7. Next, the X-axis moving mechanism is activated to move the holding table 18 that holds the workpiece 1 and the machining unit 24 relative to each other along the X-axis direction. As a result, the cutting blade 44 cuts the workpiece 1 along the planned division line 3, and machining marks 3a are formed on the workpiece 1.

[0116] After the workpiece 1 is cut along one planned division line 3, the cutting blade 44 is raised, and the holding table 18 and the machining unit 24 are moved in opposite directions relative to each other in the X-axis direction. Then, the workpiece 1 is similarly cut along another planned division line 3 parallel to the first planned division line 3 with the cutting blade 44, successively forming machining marks 3a on the workpiece 1. That is, at each planned division line 3, the cutting blade 44 cuts into the workpiece 1 from the same direction.

[0117] Then, after cutting the workpiece 1 along all the planned division lines 3 in one direction, the holding table 18 is rotated around an axis perpendicular to the holding surface 18a, and the workpiece 1 is similarly cut along the planned division lines 3 in the other direction. When the workpiece 1 has been cut along all the planned division lines 3 and machining marks 3a have been formed along all the planned division lines 3, the cutting of the workpiece 1 is complete.

[0118] When processing step S20 is performed to form processing marks 3a on the workpiece 1, the workpiece 1 is divided into individual chips. The formed individual chips are then supported by adhesive tape 7. If the quality of the processing marks 3a formed on the workpiece 1 is poor, the chips become defective. Therefore, a kerf check of the formed processing marks 3a is performed, and an inspection is carried out in which an image of the processing marks 3a is displayed on the display unit 50 so that an operator or other person can evaluate the processing quality.

[0119] Next, the imaging step S30 will be described. The imaging step S30 is performed, for example, after the processing step S20 has been carried out and processing marks 3a have been formed on the workpiece 1. In the imaging step S30, the workpiece 1 is imaged at the same imaging position in each of the multiple small sections 15 that have a device area 5a of the workpiece 1 held on the holding table 18, and multiple evaluation images 17 (see Figure 5) are created. For example, imaging units 46a and 46b are used in the imaging step S30.

[0120] The control unit 56's evaluation image creation instruction unit 62 reads information about the imaging position from the imaging position storage unit 58c, and while adjusting the positions of the holding table 18 and the imaging units 46a and 46b, it successively images the workpiece 1 at each imaging position on the workpiece 1. As a result, multiple evaluation images 17 are obtained.

[0121] The obtained evaluation images 17 are stored, for example, in the image storage unit 58d of the control unit 56. As will be explained later, in order to display each evaluation image 17 on the display unit 50 according to the processing order of the small sections 15 depicted in each evaluation image 17, it is preferable that the image storage unit 58d stores the imaging position at which each evaluation image 17 was created along with each evaluation image 17. In this case, the processing order of the small sections 15 depicted in each evaluation image 17 can be derived based on the imaging position of each evaluation image 17.

[0122] Alternatively, when each evaluation image 17 is created by the imaging units 46a and 46b and stored in the image storage unit 58d, the processed order of the small sections 15 depicted in each evaluation image 17 may also be stored in the image storage unit 58d along with each evaluation image 17.

[0123] Here, we will describe in detail the order in which each sub-section 15 of the workpiece 1 is processed in the processing step S20, and the order in which each sub-section 15 is imaged in the imaging step S30. In the processing step S20, in all parallel division lines 3, the rotating cutting blade 44 cuts (processes) the workpiece 1 by cutting from one side in the processing feed direction to the other. One reason for this is that if the cutting blade 44, which continues to rotate in a constant direction, were to cut from one side in the processing feed direction to the other, the processing quality would change.

[0124] Therefore, after cutting the workpiece 1 with the cutting blade 44 along one planned division line 3 from one side in the machining feed direction to the other, the cutting blade 44 is raised and returned to one side in the machining feed direction. Then, the workpiece 1 is cut with the cutting blade 44 along the next planned division line 3 from one side in the machining feed direction to the other.

[0125] On the other hand, in imaging step S30, the relative movement direction of the workpiece 1 and the imaging units 46a and 46b does not affect the content of the evaluation image 17 created. Therefore, first, images are taken sequentially from one side of the processing feed direction to the other at a group of imaging positions aligned along the processing feed direction, and then, when imaging is taken at the next group of imaging positions aligned along the processing feed direction, images may be taken sequentially from the other side of the processing feed direction to the other. In this case, the relative movement distance between the workpiece 1 and the imaging units 46a and 46b can be reduced.

[0126] Therefore, the order in which the small sections 15 in each evaluation image 17 were processed in processing step S20 does not necessarily match the order in which they were captured in imaging step S30. For this reason, information for identifying the processed order of the small sections 15 in each evaluation image 17 is stored in the image storage unit 58d along with each evaluation image 17. The information regarding the imaging position of each evaluation image 17 can be said to be information for identifying the processed order of the small sections 15 in each evaluation image 17.

[0127] The imaging step S30 may be performed simultaneously with the machining step S20. For example, the workpiece 1 is cut with a cutting blade 44 along one planned division line 3 from one side in the machining feed direction to the other. Then, when the cutting blade 44 is returned to one side in the machining feed direction, the imaging units 46a and 46b sequentially image the workpiece 1 at each imaging position along this planned division line 3.

[0128] Alternatively, while the workpiece 1 is being cut along one planned division line 3 with the cutting blade 44, imaging units 46a and 46b that follow the processing unit 24 may capture images at each imaging position along this planned division line 3. Alternatively, while the workpiece 1 is being cut along one planned division line 3 with the cutting blade 44, imaging units 46a and 46b may be moved along other planned division lines 3 that have already been cut (processed) while capturing images at each imaging position.

[0129] In these methods, the workpiece 1 is imaged at each imaging position as it is successively cut along each planned division line 3. Thus, when the machining step S20 and the imaging step S30 are performed simultaneously, dedicated movement operations are not required solely to position the imaging units 46a and 46b at each imaging position. In other words, the relative total travel distance between the workpiece 1, the machining unit 24, and the imaging units 46a and 46b through the machining step S20 and imaging step S30 is shortened, making the process more efficient.

[0130] Next, a display step S40 is performed in which two or more of the multiple evaluation images 17 are displayed on the display unit 50. The display step S40 is performed, for example, by the function of the display control unit 64 of the control unit 56. The display control unit 64 may display all of the multiple evaluation images 17 stored in the image storage unit 58d on the display unit 50. Alternatively, the display control unit 64 may choose not to display some of the multiple evaluation images 17 on the display unit 50.

[0131] In the display step S40, two or more evaluation images 17 are displayed on the display unit 50 in the order in which the small sections 15 depicted in each evaluation image 17 were processed in the processing step S20. For example, as explained using Figure 6, in the display step S40, the two or more evaluation images 17 may be displayed on the display unit 50 in the order in which the small sections 15 depicting them were processed. Alternatively, as explained using Figure 7, in the display step S40, the two or more evaluation images 17 may be sequentially displayed on the display unit 50 in that order.

[0132] As described above, in the display step S40, two or more evaluation images 17 are displayed on the display unit 50 in the order in which the small sections 15 are processed. This allows the operator to easily grasp the changes in processing quality based on each evaluation image 17 displayed on the display unit 50. In particular, since various structures in the background are captured similarly in each evaluation image 17, changes in processing marks 3a can be easily grasped. Furthermore, since there is no difference in structures at each imaging position, changes in processing conditions caused by the structure of the workpiece 1 can be eliminated, and changes in processing quality can be easily and accurately evaluated.

[0133] The above explanation primarily describes the case where, in the machining step S20, the workpiece 1 is machined by the cutting blade 44, forming machining marks 3a on the workpiece 1, and the machining marks 3a are visible in the evaluation image 17 created in the imaging step S30. However, the machining step S20 and imaging step S30 are not limited to this.

[0134] For example, the processing method for the workpiece 1 according to this embodiment may be carried out using a laser processing apparatus equipped with a laser processing unit instead of the cutting device 2. The laser processing unit includes, for example, a laser oscillator and an optical system including a lens that focuses the laser beam emitted from the laser oscillator onto the workpiece.

[0135] For example, in processing step S20, a laser beam with a wavelength absorbed by the workpiece 1 may be irradiated onto the workpiece 1, and the workpiece 1 may be laser-processed (ablated) along the planned division line 3 to form processing marks 3a such as division grooves. Alternatively, in processing step S20, a laser beam with a wavelength that can penetrate the workpiece 1 may be focused onto the workpiece, and the workpiece 1 may be laser-processed along the planned division line 3 to form processing marks 3a such as modified layers. In these cases, the processing marks 3a will be visible in the evaluation image 17 created in imaging step S30.

[0136] Furthermore, when the workpiece 1 is irradiated with a laser beam in processing step S20, light of a specific wavelength (plasma light) is emitted from the processing point. This light changes depending on the material of the workpiece 1 structure at the processing point and the output of the irradiated laser beam. Therefore, it is possible to determine whether the processing is proceeding as planned based on this light. In other words, this light is useful for determining the quality of the processing.

[0137] Therefore, the processing step S20 and the imaging step S30 may be performed simultaneously to capture the laser-processed processing point with imaging units 46a and 46b, and an evaluation image 17 showing this light may be created.

[0138] Figure 8 is a schematic plan view showing an evaluation image 68 created by imaging a workpiece 1 being processed with a laser beam along the planned division line 3. As shown in Figure 8, the evaluation image 68 captures the processing marks 23 formed by the processing and the light (plasma light) 25 emitted from the processing point of the workpiece 1 when the laser beam was irradiated. By analyzing the light 25, it is possible to determine whether or not the processing is progressing as planned.

[0139] In the example shown in Figure 8, the laser beam is not properly irradiated onto the planned division line 3, but rather onto the outer edge of the device 5. In this case, the light 25 contains components originating not only from structures present on the planned division line 3, but also from structures present on the device 5. Therefore, an error in the processing position is detected from the light 25 captured in the evaluation image 68.

[0140] Furthermore, even when the processing position is appropriate, if the laser beam output or other parameters do not meet the allowable range, the light 25 captured in the evaluation image 68 will exhibit a different pattern than usual. Therefore, various processing abnormalities, such as insufficient laser beam output or optical system malfunctions, can be detected from the light 25 captured in the evaluation image 68, and the laser processing unit can be adjusted. In addition, in the processing method according to this embodiment, it is easy to distinguish the changes in the light 25 captured in each of the multiple evaluation images 68, so changes in processing quality can be easily and accurately evaluated.

[0141] It should be noted that the present invention is not limited to the embodiments described above and can be implemented with various modifications. For example, in the above embodiments, the case in which the workpiece 1 is processed by a processing device such as a cutting device 2 and the workpiece 1 is imaged to form an evaluation image 17 was described as an example. However, one aspect of the present invention is not limited to this. That is, an inspection device that creates an evaluation image by imagering the workpiece 1 without processing it, and an inspection method that creates an evaluation image by imagering the workpiece 1 without processing it are also aspects of the present invention.

[0142] An inspection apparatus according to one aspect of the present invention comprises a holding table for holding a workpiece 1, an imaging unit for imaging the surface 1a side of the workpiece 1 and creating an image, a feeding unit for moving the holding table and the imaging unit relative to each other, and a display unit. On the other hand, an inspection apparatus according to one aspect of the present invention does not necessarily have to include a processing unit.

[0143] This inspection device is used, for example, to inspect a workpiece 1 that has been processed by another processing device. The control unit of the inspection device includes a small-partition storage unit 58b, an imaging position storage unit 58c, an evaluation image creation instruction unit 62, and a display control unit 64 of the control unit 56 of the cutting device 2 according to the above embodiment. In other words, the above description of the control unit 56 of the cutting device 2 can be appropriately interpreted as a description of the control unit of this inspection device.

[0144] The display control unit of the control unit of the inspection device according to one aspect of the present invention displays two or more evaluation images 17 on the display unit 50 in the order in which the small sections 15 depicted in each evaluation image 17 were processed. Therefore, it is possible to easily and accurately evaluate the changes in the quality of the processing performed on the workpiece 1 by inspecting a workpiece 1 processed by another processing device.

[0145] Furthermore, an inspection method according to one aspect of the present invention comprises a holding step S10 in which the workpiece is held on a holding table, an imaging step S30 in which the workpiece 1 is imaged to create a plurality of evaluation images, and a display step S40 in which two or more of the evaluation images are displayed on a display unit. On the other hand, an inspection method according to one aspect of the present invention does not necessarily have to include a processing step S20.

[0146] This inspection method can use a processing device such as the cutting device 2 according to the above embodiment, or the inspection device described above. In the display step S40 of the inspection method according to one aspect of the present invention, two or more evaluation images 17 are displayed on the display unit 50 in the order in which the small sections 15 depicted in each evaluation image 17 are processed. Therefore, the workpiece 1 processed by the processing device can be inspected and the changes in the quality of the processing performed on the workpiece 1 can be easily and accurately evaluated.

[0147] In addition, in the inspection method and processing method according to one aspect of the present invention, a sub-part detection step may be performed after the holding step S10 and before the imaging step S30 to detect a plurality of sub-parts 15 having a device area 5a on the surface 1a of the workpiece 1. This sub-part detection step is performed, for example, by the function of the sub-part detection unit 70 of the control unit 56 described in the above embodiment. Therefore, the above description of the sub-part detection unit 70 can be appropriately referred to when explaining the sub-part detection step.

[0148] In the sub-compartment detection step, multiple detection images are created by imaging multiple locations on the surface 1a of the workpiece 1. Then, based on the imaging position on the surface 1a of each of the multiple detection images and the structures captured in each of the multiple detection images, the multiple sub-compartments of the device region are detected. The detection images are created, for example, by imaging the workpiece 1 with imaging units 46a and 46b. The arrangement of the sub-compartments 15 detected in the sub-compartment detection step may be stored, for example, in the sub-compartment storage unit 58b of the storage unit 58.

[0149] Furthermore, in the inspection method and processing method according to one aspect of the present invention, after the sub-section detection step, an imaging position determination step may be performed to determine the imaging positions in a plurality of sub-sections 15 of the workpiece 1 to be imaged in the imaging step S30. This imaging position determination step is performed, for example, by the function of the imaging position determination unit 72 of the control unit 56 described in the above embodiment. Therefore, the above-mentioned description of the imaging position determination unit 72 can be appropriately referred to when explaining the imaging position determination step.

[0150] In the imaging position determination step, for example, an imaging position 15a is determined that can capture both the area where a structure 13 such as a TEG is formed and the area where the structure 13 is not formed in the planned division line 3 of the workpiece 1. This allows for simultaneous evaluation of the processing quality under various processing conditions from each evaluation image. However, the imaging position 15a is not limited to this. The imaging position 15a in the small section 15 determined in the imaging position determination step may be stored, for example, in the imaging position storage unit 58c of the storage unit 58.

[0151] Furthermore, although the above embodiment described a case in which the planned division line 3 of the workpiece 1 is visible in the evaluation image 17, the present invention is not limited to this. That is, the imaging position of the evaluation image 17 does not have to be set on the planned division line 3, and the planned division line 3 does not have to be visible in the evaluation image 17.

[0152] For example, when a workpiece 1 is processed along a planned division line 3, processing debris may be generated from the workpiece 1, etc., and scatter into the surroundings, adhering to the device 5. In a processing apparatus (inspection apparatus) and processing method (inspection method) according to one aspect of the present invention, the scattering of processing debris can be inspected as an indicator of processing quality by imaging units 46a and 46b to capture images of the device 5 and create evaluation images 17.

[0153] Furthermore, the structures, methods, etc., according to the above embodiments can be modified as appropriate without departing from the scope of the objectives of the present invention. [Explanation of symbols]

[0154] 1 Workpiece 1a surface 1b back side Planned division lines (3 divisions) 3a,21a,21b,21c,21d Machining marks 5 devices 5a Device area 5b Peripheral surplus region 7 Adhesive tape 9 Ring Frame 11 Frame Unit 13 Structures 15 small plots 17,17a,17b,17c,17d Evaluation images 19a, 19b Structures 21 Formation area 23 Machining marks 25 light 2 Cutting equipment 4 base 4a,4b,4c opening 8 Cassette Support Stands 10 cassettes 12 Guide rails 14 Table Covers 16 Dustproof and splashproof cover 18 Retention Table 18a Holding surface 18b Clamp 18c Porous material 20 Support structure 22a, 22b Mobile Unit 24, 24a, 24b Processing Units 26, 34a, 34b Guide rails 28a, 28b, 36a, 36b Mobile Plate 30a, 30b, 38a, 38b Ball Screw 32a, 40a, 40b pulse motor 44 Cutting Blades 46a, 46b Imaging Units 48 Washing Unit 50 display units 50a,50b Result display screen 54a, 54b, 54c Operation buttons 56 Control Unit 58 Memory section 58a Machining condition memory section 58b Small Compartment Memory Unit 58c Imaging position memory unit 58d Image storage unit 60 Machining Control Unit 62 Evaluation image creation instruction unit 64 Display Control Unit 66 Judgment section 68 Evaluation Images 70 Small Compartment Detection Unit 72 Imaging position determination unit

Claims

1. An inspection method for inspecting a workpiece having a device region on its surface in which multiple intersecting division lines are set and devices are formed in each region partitioned by the division lines, and the device region has multiple sub-compartments containing structures arranged in the same manner, and which has been processed along the division lines to form processing marks, A holding step involves positioning the workpiece facing the holding surface of the holding table and holding the workpiece with the holding table, The imaging step involves imaging the workpiece held on the holding table at the same imaging position in each of the multiple sub-sections of the device area of ​​the workpiece, thereby creating multiple evaluation images in which the same structure is visible in each of the sub-sections; The system includes a display step of displaying two or more of the evaluation images from a plurality of evaluation images on a display unit, A method for inspecting a workpiece, characterized in that, in the display step, two or more evaluation images are displayed on the display unit in the order in which the sub-sections depicted in each evaluation image are processed.

2. The method for inspecting a workpiece according to claim 1, characterized in that, in the display step, two or more evaluation images are arranged in the order and displayed on the display unit.

3. The method for inspecting a workpiece according to claim 1, characterized in that, in the display step, two or more evaluation images are sequentially displayed on the display unit in the order described above.

4. After the holding step and before the imaging step, a sub-sub A method for inspecting a workpiece according to any one of claims 1 to 3, further comprising: an imaging position determination step, after the sub-sub

5. An inspection device for inspecting a workpiece that has been processed along the division lines and has processing marks formed on it, wherein a plurality of intersecting division lines are set and a device region is formed on the surface in each region partitioned by the division lines, and the device region has a plurality of sub-sections containing structures arranged in the same manner, A holding table having a holding surface and holding the workpiece that contacts the holding surface, An imaging unit that captures an image of the workpiece held on the holding table and creates an image of it, A feed unit that moves the holding table and the imaging unit relative to each other in a direction parallel to the holding surface, A display unit that displays the captured image created by the imaging unit, It includes a control unit, The control unit is, A compartment storage unit that stores the arrangement of multiple compartments on the surface of the workpiece, An imaging position storage unit that stores the same imaging position in multiple sub-sections, An evaluation image creation instruction unit controls the holding table, the imaging unit, and the feed unit, and refers to the arrangement stored in the sub-compartment storage unit and the imaging position stored in the imaging position storage unit, causing the imaging unit to image the workpiece at each of the imaging positions in the multiple sub-compartments and create multiple evaluation images in which the same structure is captured in each sub-compartment, The system includes a display control unit that causes two or more of the evaluation images to be displayed on the display unit, The inspection apparatus for a workpiece is characterized in that the display control unit displays two or more evaluation images on the display unit in the order in which the small sections depicted in each evaluation image are processed.

6. The workpiece inspection apparatus according to claim 5, characterized in that the display control unit arranges two or more evaluation images in the order described above and displays them on the display unit.

7. The workpiece inspection apparatus according to claim 5, characterized in that the display control unit sequentially displays two or more evaluation images in the order described above on the display unit.

8. The control unit is, A small section detection unit controls the holding table, the imaging unit, and the feed unit to cause the imaging unit to image multiple locations on the surface of the workpiece held by the holding table, thereby creating multiple detection images, and detects multiple small sections of the device region based on the imaging position on the surface of each of the multiple detection images and the structure captured in each of the multiple detection images. An inspection apparatus for a workpiece according to any one of claims 5 to 7, further comprising: an imaging position determination unit that determines the imaging position in a plurality of sub-sections of the workpiece detected by the sub-section detection unit and stores the imaging position in the imaging position storage unit.

9. A processing method for processing a workpiece along the division lines, wherein a plurality of division lines intersect with each other, and the workpiece has a device region on its surface in which a device is formed in each region partitioned by the division lines, and the device region has a plurality of sub-compartments containing structures arranged in the same manner, A holding step involves positioning the workpiece facing the holding surface of the holding table and holding the workpiece with the holding table, A machining step of machining the workpiece held in the holding table along a plurality of planned division lines, Simultaneously with the processing step, or after the processing step, an imaging step is performed to create multiple evaluation images in which the same structure is captured in each of the multiple sub-sections of the device area of ​​the workpiece held on the holding table, by imaging the workpiece at the same imaging position in each of the sub-sections. The system includes a display step of displaying two or more of the evaluation images from a plurality of evaluation images on a display unit, A method for processing a workpiece, characterized in that, in the display step, two or more evaluation images are displayed on the display unit in the order in which the small sections depicted in each evaluation image were processed in the processing step.

10. The method for processing a workpiece according to claim 9, characterized in that, in the display step, two or more evaluation images are arranged in the order and displayed on the display unit.

11. The method for processing a workpiece according to claim 9, characterized in that, in the display step, two or more evaluation images are sequentially displayed on the display unit in the order described.

12. In this machining step, the workpiece is machined with a cutting blade to form machining marks on the workpiece. The method for processing a workpiece according to any one of claims 9 to 11, characterized in that the evaluation image created in the imaging step shows the processing marks.

13. In this processing step, a laser beam is irradiated onto the workpiece to form processing marks. The method for processing a workpiece according to any one of claims 9 to 11, characterized in that the evaluation image created in the imaging step captures the processing marks or the light emitted from the workpiece when the laser beam is irradiated onto it.

14. A processing apparatus for processing a workpiece along the division lines, wherein multiple division lines are set that intersect with each other, and the device region has a surface in which a device is formed in each region partitioned by the division lines, and the device region has multiple sub-compartments containing structures arranged in the same manner, A holding table having a holding surface and holding the workpiece that contacts the holding surface, A processing unit for processing the workpiece held on the holding table, An imaging unit that captures an image of the workpiece held on the holding table and creates an image of it, A feed unit that moves the holding table and the imaging unit relative to each other in a direction parallel to the holding surface, A display unit that displays the captured image created by the imaging unit, It includes a control unit, The control unit is, A holding table, a processing unit, and a processing control unit that controls the processing unit to process the workpiece along the planned division line, A compartment storage unit that stores the arrangement of multiple compartments on the surface of the workpiece, An imaging position storage unit that stores the same imaging position in multiple sub-sections, After the processing control unit has the processing unit process the workpiece, or simultaneously with the processing, the processing control unit controls the holding table, the imaging unit, and the feeding unit, referring to the arrangement stored in the sub-compartment storage unit and the imaging position stored in the imaging position storage unit, and causing the imaging unit to image the workpiece at each of the imaging positions in the sub-compartments to create multiple evaluation images in which the same structure is captured in each sub-compartment, and the evaluation image creation instruction unit The system includes a display control unit that causes two or more of the evaluation images to be displayed on the display unit, The workpiece processing apparatus is characterized in that the display control unit displays two or more evaluation images on the display unit in the order in which the small sections depicted in each evaluation image were processed by the processing unit.

15. The workpiece processing apparatus according to claim 14, characterized in that the display control unit arranges two or more evaluation images in the order described above and displays them on the display unit.

16. The workpiece processing apparatus according to claim 14, characterized in that the display control unit sequentially displays two or more evaluation images in the order described above on the display unit.

17. The processing unit is a cutting unit that cuts the workpiece with a cutting blade, The workpiece processing apparatus according to any one of claims 14 to 16, characterized in that the evaluation image produced by the imaging unit shows the processing marks formed on the workpiece by cutting with the cutting blade.

18. The processing unit is a laser processing unit that irradiates the workpiece with a laser beam to laser process the workpiece. The workpiece processing apparatus according to any one of claims 14 to 16, characterized in that the evaluation image produced by the imaging unit captures the processing marks formed on the workpiece when the laser beam is irradiated, or the light emitted from the workpiece when the laser beam is irradiated.

Images