Terminal, semiconductor device manufacturing system, and display method

Abstract

The purpose of the present invention is to provide a digital dashboard that can be used in a semiconductor device manufacturing apparatus and a semiconductor device manufacturing system.　One terminal according to the present invention is connected to a network provided with at least a first database in which recipe information that is used in a semiconductor manufacturing apparatus for processing a sample is stored, a second database in which an electron microscope image of the sample is stored, and a server that is capable of directly or indirectly communicating with the first database and the second database, wherein the terminal is characterized by comprising a processor for processing a communication protocol with the network, and a user interface (hereafter referred to as "UI") for displaying information that is stored in the first database or the second database, the terminal also being characterized in that, in accordance with a request inputted from the UI, a digital dashboard for displaying the recipe information or the electron microscope image is displayed on the UI.

Description

Technical Field

[0001] The present invention relates to a terminal, a semiconductor device manufacturing system, and a display method.

Background Art

[0002] Conventionally, as one of information analysis tools, a digital dashboard has been used to unify and display data collected from a plurality of information sources in real time to promote data utilization. Digital dashboards are also used in fields related to manufacturing, in addition to marketing and business analysis.

[0003] For example, Patent Document 1 aims to "provide a control program for a multi-function device group and a control method for the multi-function device group for maintaining and optimizing a multi-function device group using a handheld device such as a smartphone or a tablet", and discloses the following as the control program for the multi-function device group and the control method for the multi-function device group. "The control program for the multi-function device group according to the embodiment is a control program for the multi-function device group executed by a handheld device that receives the proposal or recommendation from a data analysis server that accumulates data of a plurality of multi-function device groups and generates a proposal or recommendation by a machine learning function based on the accumulated data, and includes a procedure for displaying a dashboard of a plurality of selection items on the user interface of the handheld device, a procedure for selecting one selection item in the dashboard, a procedure for displaying the proposal or recommendation related to the selected selection item on the user interface, and a procedure for applying the displayed proposal or recommendation to the multi-function device selected from the user interface, and causes the handheld device to execute the procedures."

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

[0005] Patent Document 1 shows the use of a digital dashboard in a document processing device, but it does not consider its use in semiconductor device manufacturing equipment and semiconductor device manufacturing systems. Therefore, the present invention aims to provide a technology that enables the use of a digital dashboard in semiconductor device manufacturing equipment and semiconductor device manufacturing systems. [Means for solving the problem]

[0006] To solve the above problems, one representative terminal of the present invention is a terminal connected to a network comprising at least a first database storing recipe information used in a semiconductor manufacturing apparatus for processing a sample, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database, wherein the terminal comprises a processor that processes a communication protocol with the network, and a user interface (hereinafter referred to as "UI") that displays information stored in the first database or the second database, and the UI displays a digital dashboard that displays the recipe information or electron microscope images in response to a request input from the UI. [Effects of the Invention]

[0007] According to the present invention, a digital dashboard can be utilized in semiconductor device manufacturing equipment and semiconductor device manufacturing systems. Other issues, configurations, and effects not mentioned above will be clarified by the description of the embodiments for carrying out the invention below. [Brief explanation of the drawing]

[0008] [Figure 1]Figure 1 shows the configuration of a semiconductor device manufacturing system using a group of equipment including semiconductor manufacturing equipment and a platform. [Figure 2] Figure 2 is a block diagram showing the configuration of a user's personal computer. [Figure 3] Figure 3 is a flowchart showing the procedure for creating reports in a semiconductor device manufacturing system. [Figure 4] Figure 4 shows an example of recipe information input to an etching apparatus. [Figure 5] Figure 5 shows a cross-sectional view of the device. [Figure 6] Figure 6 shows a microscopic image display, including a microscopic image. [Figure 7] Figure 7 shows a foreign object information display that includes information about foreign objects. [Figure 8] Figure 8 shows an example of a selection list displayed on the output section of a user's personal computer. [Figure 9] Figure 9 shows an example of a selection list displayed on the output section of a user's personal computer. [Figure 10] Figure 10 shows the configuration of a semiconductor device manufacturing system that includes a group of equipment, including semiconductor device manufacturing equipment, and a network. [Modes for carrying out the invention]

[0009] Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to these embodiments. Furthermore, in the drawings, identical parts are denoted by the same reference numerals. When there are multiple components with the same or similar function, they may be described using the same symbol but with different subscripts. Furthermore, when it is not necessary to distinguish between these multiple components, the subscripts may be omitted in the description.

[0010] In this disclosure, "recipe" refers to a processing program that specifies the procedures and control parameters for processing performed in the apparatus.

[0011] [First Embodiment] (System Configuration) Referring to Figure 1, the configuration of the semiconductor device manufacturing system according to the first embodiment will be described. Figure 1 is a diagram showing the configuration of a semiconductor device manufacturing system 1 using a group of devices including semiconductor manufacturing equipment and a network 117 (hereinafter referred to as "platform 117"). The platform 117 is a network comprising at least a first database storing recipe information used in semiconductor manufacturing equipment that processes samples, a second database storing electron microscope images of the samples, and a server that can communicate directly or indirectly with the first database and the second database. The semiconductor device manufacturing system 1 collects data on important manufacturing equipment in semiconductor device manufacturing, enabling data analysis for evaluating manufacturing processes and maintaining manufacturing equipment. In Figure 1, the environment to which platform 117 is applied is classified into three areas: equipment area network, internal network, and external network.

[0012] The equipment area network is a network that connects control devices for semiconductor manufacturing equipment (hereinafter referred to as "PCs for semiconductor manufacturing equipment") 101, control devices for semiconductor inspection equipment (hereinafter referred to as "PCs for semiconductor inspection equipment") 102, control devices for semiconductor analysis equipment (hereinafter referred to as "PCs for semiconductor analysis equipment") 103, control devices for semiconductor analysis equipment (hereinafter referred to as "PCs for semiconductor analysis equipment") 104, and relay devices (hereinafter referred to as "relay PCs") 105. The PC 101 for semiconductor manufacturing equipment, the PC 102 for semiconductor inspection equipment, the PC 103 for semiconductor analysis equipment, and the PC 104 for semiconductor analyzer are also simply referred to as "PC 101 - 104 for equipment". Also, semiconductor manufacturing equipment and the like controlled by the PC for equipment are also simply referred to as "equipment group 100". Put another way, the equipment group 100 is a collection of processing equipment for processing samples. The processing equipment is equipment that performs manufacturing (such as etching), inspection, analysis, and analytical processing. The processing equipment can also be referred to as semiconductor device manufacturing equipment.

[0013] The internal network is a network that connects a conversion connection device (hereinafter referred to as "gateway PC") 108, a personal computer 114 for users, a personal computer 115 for user mobile terminals, and a route setting device (hereinafter referred to as "route setting PC").

[0014] The external network is a network that connects a database server 106, an application server 109, a WEB server 110, a GPU server 111, and a remote monitor personal computer 116. The internal network and the external network are connected by the Internet 113. Note that the database server 106, the application server 109, the WEB server 110, and the GPU server 111 are also simply referred to as "server groups 106 and 109 - 111".

[0015] The platform 117 includes an application server 109, a GPU server 111, and a WEB server 110. The application server 109 or the GPU server 111 is connected to the WEB server 110 via communication means. The platform 117 enables remote access from the user's personal computer 114 and user's mobile terminal personal computer 115 on the internal network or the remote monitoring personal computer 116 on the external network to the device PCs 101 - 104 in the device area network. And the platform 117 has a network with a device group 100 including semiconductor manufacturing devices, a relay PC 105 for security check, a gateway PC 108 having a data acquisition program, a route setting PC 118, and various databases. Note that the configuration of the platform 117 is an example and is not limited to this configuration. For example, as a platform, it can be configured to include an application server 109 and a GPU server 111, and the data output from each of the device group 100 can be downloaded by the application server 109 or the GPU server 111 as described later.

[0016] (Classification by security measures) Different security measures are implemented for each area in the device area network, internal network, and external network. The device area network is a network to which at least semiconductor manufacturing devices are connected. The device area network is, for example, a network constituted by manufacturing devices such as production lines in a semiconductor manufacturing factory. The device area network may include, for example, networks of devices for automatically transporting members and finished products and devices for automatically handling the incoming and outgoing of members. The internal network is a network to which servers, such as those used for production management, are connected. In addition to managing production plans, the internal network may also include servers for monitoring production status and acquiring equipment information. Servers for ordering and receiving materials and collecting information for formulating production plans may also be connected. The internal network may also include, for example, the management departments at the head office. The external network is a network that connects to the equipment area network and the internal network via the internet. The external network is not managed by the semiconductor manufacturing plant or headquarters, and may, for example, be used by equipment vendors for remote maintenance.

[0017] Next, I will explain the security measures. Security measures such as preventing intrusion into the communication network, preventing unauthorized access to the area, account management, monitoring of communication logs and operation logs, and monitoring alerts for PCs and terminals are set up for each of the three areas. For example, the equipment area network, which includes the network composed of equipment within the semiconductor manufacturing plant, has security measures such as preventing unauthorized access to the premises and restricting the use of terminal devices such as PCs. Here, let's focus on software updates (especially OS updates) as a security measure. In this case, OS updates are expected to eliminate vulnerabilities and prevent unauthorized access from external sources. While OS updates are performed on internal and external networks, there are cases where devices and equipment in the device area network have not received OS updates.

[0018] (Structure by area) In the first embodiment, an etching apparatus will be used as an example of a processing apparatus. An etching apparatus can also be called a semiconductor manufacturing apparatus that processes a semiconductor wafer (hereinafter also simply referred to as "wafer") as a sample. This disclosure is not limited to the case of an etching apparatus, but can also be applied to other processing apparatuses. Furthermore, although the following description will focus on the case of a semiconductor wafer, this disclosure can also be applied to samples other than semiconductor wafers.

[0019] (Device Area Network) PC101 for semiconductor manufacturing equipment is a device that manages the control of, for example, wet etching equipment and plasma etching equipment (hereinafter also simply referred to as "etching equipment"). PC102 for semiconductor inspection equipment is a device that controls, for example, visual inspection equipment such as cameras and microscopes and electrical inspection equipment using probes. PC103 for semiconductor analysis equipment is a device that controls analysis equipment such as transmission electron microscopes and atomic interatomic microscopes. For example, PC104 for semiconductor analysis equipment is a device that controls analysis equipment that performs, for example, TCT gas chromatography / mass spectrometry and time-of-flight secondary ion mass spectrometry. In addition, PC104 for semiconductor analysis equipment can also control foreign matter measuring instruments such as laser measuring instruments that measure foreign matter on etched wafers. Although the control devices have been classified according to their functions of inspection, analysis, and processing, the classification is not limited to this. Multiple functions may be performed by a single control device, and the settings may be appropriately configured based on the manufacturing process performed in the semiconductor device manufacturing system 1 to which platform 117 is applied.

[0020] When a processing recipe for etching is input into the semiconductor manufacturing equipment PC101, the PC101 executes the processing recipe. The PC101 transmits instruction values ​​according to the processing recipe to each component in the etching equipment, and the etching process is performed in the etching equipment. The executed processing recipe is stored in the semiconductor manufacturing equipment PC101.

[0021] The etched wafer is transported to one of the following: a semiconductor inspection device, a semiconductor analysis device, or a semiconductor analytical device. The PC102 for the semiconductor inspection device receives a measurement recipe for inspection and controls the semiconductor inspection device according to the recipe. The measured results are stored in the PC102 for the semiconductor inspection device. Similarly, the PC103 for the semiconductor analysis device receives a measurement recipe for analysis and controls the semiconductor analysis device according to the recipe. The measured results are stored in the PC103 for the semiconductor analysis device. The PC104 for the semiconductor analytical device receives a measurement recipe for analysis and controls the semiconductor analytical device according to the recipe. The measured results are stored in the PC104 for the semiconductor analytical device.

[0022] The apparatus group 100 and the apparatus PCs 101-104 make it possible to acquire data on the state inside the etching apparatus during etching (e.g., pressure, temperature, number of foreign particles, gas type, plasma density, etc.). Microscopic images of the etched wafer and data linking the microscope images to length measurements are also acquired. Furthermore, data on the number of foreign particles on the wafer measured by a foreign particle measuring instrument after etching is acquired.

[0023] (Data communication between regions) To explain the first embodiment, we will again refer to Figure 1. A relay PC 105 is placed in the equipment area network where the equipment group 100, including the semiconductor manufacturing equipment such as the etching apparatus, is located. Each of the equipment group 100 is connected to the network by a relay PC 105. The relay PC 105 has means for bidirectional data communication between the control device of each piece of equipment in the equipment group 100 and the relay PC 105, and has a program for security checking the data and a storage unit for storing the data that has passed the security check. Specifically, the relay PC 105 is equipped with communication means so that it can collect data obtained from the equipment group 100 or the equipment PCs 101 to 104. The relay PC 105 has a storage unit that stores data indicating the results received from the equipment group 100, and master data described later, and has access rights limited to the relay PC 105 only. For example, a folder in which the results of each piece of equipment in the equipment group are stored is created as a shared folder 105a using the SMB (Server Message Block) communication protocol, and access rights are granted to the relay PC 105. This allows the relay PC 105 to collect output data from each device in the device group 100. The relay PC 105 can also transfer (transmit) data to the device group 100. For example, the relay PC 105 receives a recipe from the gateway PC 108 and inputs it to each device in the device group 100. In the above explanation, a shared folder 105a is used as an example, but the form of the storage unit is not limited to this. A storage device located within the relay PC 105 may be used as the storage unit, or an external storage device such as a hard disk that is separate from the relay PC 105 and connectable to the relay PC 105 may be used.

[0024] The relay PC 105 is configured to allow OS updates via an external network. Furthermore, the relay PC 105 has a built-in program that performs security checks on data such as antivirus software, ensuring that the latest virus definitions are always reflected. The shared folder 105a is designated as the target for continuous security monitoring within the antivirus software, and data stored in this shared folder is constantly subjected to security checks. This shared folder is accessible from both the internal and external networks and is also used as a storage location for data such as recipes to be transferred to the device group 100.

[0025] The shared folder 105a manages the device master MA, which contains at least the device IDs assigned to each device in the device group 100. The device master MA is also stored in the database server 106 located on the external network.

[0026] Although the example shown has only one shared folder, there can be multiple shared folders. For example, to store data that you want to access and use on the external network on the device PCs 101-104, you can create shared folders between the relay PC 105 and each of the device PCs 101-104, using the SMB protocol, for example. Furthermore, although the device master MA is stored in the database server 106, it may also be stored in another server included in the external network.

[0027] (Internal network) An internal network is formed outside the relay PC 105 mentioned above. A gateway PC 108 is located within this internal network. The gateway PC 108 has a built-in program that accesses the device master MA based on authentication information from the external network or platform 117, and retrieves output data authorized by the device master MA from the storage unit. Specifically, the gateway PC 108 can access the shared folder 105a via the relay PC 105, and can collect output data from the device group 100 by referring to the device master MA.

[0028] The routing PC 118 incorporates a program that allows the gateway PC 108 to access the storage unit and transfer the acquired output data to the internal network, or to transfer the output data stored in the storage unit to the device group 100, while blocking spontaneous data leakage from each device in the device group 100. This allows the gateway PC 108 to access the memory unit of the relay PC 105, while prohibiting the transfer of data from the device area network to the internal network.

[0029] Furthermore, the user's personal computer 114 and the user's mobile terminal computer 115 are operated by users utilizing the platform 117. The semiconductor device manufacturing system 1 is connected to the platform 117, the user's personal computer 114, and the user's mobile terminal computer 115 via communication means.

[0030] (External network) The database server 106 stores authentication information for the equipment master MA and users. The database server 106 also stores output data from each device in the equipment group (for example, data showing results obtained by the equipment group 100, manufacturing data output from each device in the equipment group 100, and microscope images obtained by microscopes included in the equipment group 100). The database server 106 may be composed of multiple database servers, for example, including at least a first database that stores recipe information used in semiconductor manufacturing equipment that processes samples, and a second database that stores electron microscope images of semiconductor wafers.

[0031] The application server 109 receives user requests transferred from the web server 110, executes application programs, and responds to the web server 110. Furthermore, if data retrieval and updating are necessary, the application server 109 requests the database server 106, processes the data, and then responds to the web server 110 with dynamic content. The application server 109 is also a server capable of communicating directly or indirectly with the first and second databases. Direct or indirect communication refers to communication where the appropriate wired or wireless communication method and communication protocol can be selected. The application server 109 also includes editing functions for creating reports based on the display of a digital dashboard.

[0032] The web server 110 responds to user requests with static web content (HTML pages, files, images, videos, etc.), and if dynamic processing is required, it requests processing from the application server 109. ra Receive a response with relevant content. The database server 106 processes requests from the application server 109 and transfers the results back to the application server 109. The GPU server 111 generates content on behalf of the application server 109 when there are user requests that place a heavy load on the system.

[0033] (Configuration for acquiring data to be used in digital dashboards) In this disclosure, the web server 110 shares the digital dashboard with the user's personal computer 114. The application server 109 stores the application programs required to create the digital dashboard and executes calculation logic in these application programs. The database server 106 acquires data such as manufacturing environment data and device characteristics obtained for each recipe. This will be explained in detail below.

[0034] The database server 106 functions as a Data Warehouse (DWH) and comprehensively stores data used for the digital dashboard. The application server 109 processes data acquired from the processing unit, the first database, and the second database based on templates used for the digital dashboard. Specifically, the application server 109 has an ETL (Extract, Transform, Load) tool to extract, transform, and write data used for the digital dashboard to the database server 106. The data stored in the database server 106 includes, for example, recipe information for etching, the state of the etching equipment during etching, the number of foreign objects on the wafer during etching, and microscope images and measurement data of the wafer after etching. The application server 109 also has a VER application for calculating the etch rate, which can calculate the etch rate based on measurement data acquired over time. This data is organized chronologically in the database server 106, and new data is added as it is collected. Furthermore, because the data has a multidimensional array arranged along axes such as "time," "environmental conditions," and "recipe," it is possible to analyze changes in recipes or trends over a certain period within the processing steps, as well as to analyze the factors that cause changes. The combination of data and visualization methods can be set in advance, and users can select combinations of data and display methods from templates.

[0035] Furthermore, it is generally assumed that the provider of the digital dashboard service is different from the administrator of the device area network and internal network. Due to security measures and other considerations, the provider of the digital dashboard service may be subject to excessive restrictions on handling data on the device area network and internal network. In this disclosure, since the database server 106, application server 109, and web server 110 are located on an external network, data processing can be performed without security restrictions even when providing the digital dashboard service, and this is also advantageous in terms of service operation such as equipment improvement and maintenance.

[0036] While the present invention describes an embodiment consisting of a database server 106, an application server 109, and a web server 110, this disclosure is not limited to this case. For example, it is possible to configure a combination of application servers and database servers for each application program. Furthermore, while the present invention describes a server configuration consisting of a web server 110, an application server 109, and a database server 106, this disclosure is not limited to this case, and may, for example, consist of a front-end server and a back-end server. In addition, the servers are not limited to hardware configurations and may be provided by cloud services.

[0037] (Terminal configuration) Referring to Figure 2, an example of the configuration of the user PC 114 will be described. Figure 2 is a block diagram showing the configuration of the user PC 114. The user PC 114 (hereinafter also referred to as the "terminal") is connected to the platform 117 and includes a processor that processes the communication protocol with the platform 117, and a user interface (hereinafter referred to as the "UI") that displays information stored in the first database or the second database. The UI displays a digital dashboard that shows recipe information or electron microscope images in response to requests entered from the UI. A detailed explanation follows below.

[0038] The user's personal computer 114 is equipped with a processor 201, memory 202, storage unit 203, input unit 204, output unit 205, and communication unit 207, each of which is connected to the processor 201 via a bus 200.

[0039] The processor 201 controls the various components of the user's personal computer 114. The processor 201 may include, for example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), a GPU (Graphics Processing Unit), or an FPGA (Field-Programmable Gate Array). The processor 201 performs processing necessary for the user's personal computer 114 to function, and for communication, it handles the communication protocol with the platform 117.

[0040] Memory 202 stores programs that, when executed by the processor 201, realize various functions. Memory 202 can be ROM (Read Only Memory), RAM (Random Access Memory), etc. The storage unit 203 stores data processed by the processor 201 and data input from the input unit 204. The storage unit 203 is an HDD (Hard Disk Drive), SSD (Solid State Drive), etc.

[0041] The input unit 204 receives user requests and data to be processed on the user's personal computer 114. The input unit 204 includes a mouse, keyboard, etc. The output unit 205 outputs the results processed by the processor 201 to the user. The output unit 205 is, for example, a liquid crystal display or an organic EL (Electro-Luminescence) display. Furthermore, since the input unit 204 and the output unit 205 share the common function of mediating between the user's personal computer 114 and the user, the input unit 204 and the output unit 205 are collectively referred to as the interface (UI). As will be described later, the UI (especially the output unit 205) displays a digital dashboard that shows recipe information or electron microscope images in response to requests entered from the UI (especially the input unit 204).

[0042] The communication unit 207 transmits and receives data with other devices via the network. The communication unit 207 may be, for example, a NIC (Network Interface Card), a wireless communication module, a USB (Universal Serial Interface) module, or a serial communication module. The above description illustrates an example of the configuration of a user personal computer 114, and the present invention is not limited to this example.

[0043] The user's mobile PC 115 has a touch panel display in which the input unit 204 and output unit 205 are integrated, as described above for the user's PC 114. The user's mobile PC 115 and the user's PC 114 have similar configurations in other respects. The remote monitor PC 116 also has a similar configuration to the user's PC 114. The following description will focus on the use of the user's PC 114, but this disclosure is also applicable to the use of the user's mobile PC 115 and the remote monitor PC 116. However, the operation method and the display mode of the digital dashboard do not necessarily have to be the same for the user's PC 114, the user's mobile PC 115, and the remote monitor PC 116. The operation method and display mode may be changed depending on the PC configuration and user authentication differences.

[0044] Furthermore, the following description will explain a case in which a digital dashboard generated primarily on the application server 109 of the platform 117 is displayed on the output unit 205 of the user's personal computer 114, but this disclosure is not limited to this case. For example, in the user's personal computer 114, the memory 202 may store an application program that is executed by the processor 201 to create the digital dashboard.

[0045] (How to operate) When a user uses the semiconductor device manufacturing system 1, they register authentication information from their personal computer 114 to log in to the platform 117. The user's authentication information is stored in the database server 106. When the user enters, for example, a user ID and password from the user's personal computer 114, it is compared with the authentication information stored in the database server 106, and the user is authenticated. When logging in to the platform 117, the user's authentication information is also applied to the database server 106, application server 109, web server 110, and GPU server 111.

[0046] (Control flowchart) Referring to Figure 3, the process by which the report is generated is explained. The report aggregates information such as indices and device status monitored during the manufacturing stage, and is mainly generated when the specifications of the devices manufactured using the equipment group 100 are met. In this disclosure, the status of the equipment group 100 and the semiconductor wafer status during the manufacturing stage can be checked using a digital dashboard, and it is possible to manufacture devices so that they reach the specifications while performing various controls such as Run to Run control.

[0047] Figure 3 is a flowchart showing the procedure for creating reports in semiconductor device manufacturing system 1. Figure 3(a) mainly shows the user's personal computer 11 4The above shows the processing performed based on the user's input, and Figures 3(b) and 3(c) mainly show the processing performed in the application server 109 included in platform 117.

[0048] First, referring to Figure 3(a), we will explain the processing that is mainly performed based on user requests entered from the user's personal computer 114. First, in step S1, the specifications are set. The specifications indicate the structure and characteristics of the device to be realized by the processing performed in the equipment group 100. For example, if the processing is performed by an etching apparatus in the equipment group 100, the specifications are the physical width, etching rate, width depth, and other shape of the device formed on the wafer. The specifications can also be the pattern shape after etching, or the etching target, or the dimensions after etching. The specifications are not limited to numerical values ​​that physically define the structure, but also include processing conditions in the manufacturing equipment and the electrical characteristics of the device. In the case of an etching apparatus, the specifications are input to the semiconductor device manufacturing system 1 via the input unit 204 of the user PC 114. The equipment group 100 processes the semiconductor wafer based on the specifications and the recipe set based on the specifications.

[0049] Next, in step S2, the first evaluation is performed. The first evaluation is the initial evaluation of the wafers after processing in the equipment group 100. The first evaluation is performed before the creation of the digital dashboard and report, which will be described later.

[0050] Next, in step S3, the report format (display method) is selected. The report format selection involves choosing how the information to be included in the report will be displayed. For example, if abnormalities are observed in particles (foreign matter) at the time of the first evaluation in step S2, a display method suitable for particle analysis (e.g., a line graph of the number of foreign matter particles in the manufacturing process) will be selected. The report format will be described later.

[0051] Next, as Step S4, the second evaluation will be conducted. Tare A digital dashboard is created according to the port type, and at the second evaluation stage, data analysis is performed using the digital dashboard and specifications. Users can perform data analysis while viewing the digital dashboard displayed on the output unit 205 of the user's PC 114.

[0052] Next, in step S5, the type of data is selected. For example, in addition to the particles that were the focus of the first evaluation, the etching rate may also need to be analyzed in the second evaluation. In such cases, the etching rate is selected as data to be displayed on the digital dashboard, in addition to the particles. In the second evaluation stage, in addition to the data obtained in the first evaluation stage, information on the environmental conditions under which the processing takes place, such as the pressure and temperature inside the chamber in the case of an etching apparatus, as well as analysis information such as microscope images of the device after processing, are also collected. It is possible to select the type of data from among this information.

[0053] Next, in step S6, it is determined whether or not the report is completed. A report is generated when the semiconductor device manufacturing system 1 obtains results that satisfy the specifications. Therefore, if it is confirmed that the specifications are satisfied in the digital dashboard or the acquired data, the report is generated (Y (Yes) in step S6).

[0054] On the other hand, if it is not confirmed that the specifications are satisfied (N (No) in step S6), step S7 is used to determine whether or not to add pages to the report. The additional pages will contain information about the additional processing. If pages are added (Y in step S7), the process returns to step S3, and a report is created regarding the additional processing performed by the group of devices 100. The group of devices 100 then performs the processing again to satisfy the specifications.

[0055] Furthermore, if no pages are added (N in step S7), comparison data is added (step S8). If the addition of comparison data is selected, the data obtained in the current process is referenced back to step S5, referencing data obtained during other processes. After that, it is possible to create a provisional report (Y in step S6), or to repeat the procedure until the specifications are satisfied.

[0056] The application server 109 has functions for saving created reports, reading saved reports, and searching for them. The application server 109 also has a function for saving reports with a document number (TS-No) and searching for saved reports using the TS-No as an ID. Reports created by the application server 109 are saved, for example, in the database server 106 with the TS-No assigned to them. When a report is searched from the user's PC 114, the report is searched based on the TS-No and displayed on the output unit 205 of the user's PC 114.

[0057] (Selection of report format) Referring to Figure 3(b), the selection of the report format in step S3 will be explained. First, in step S31, the user's authentication information is verified. Regarding the verification of the user's authentication information, in step S31, the user is asked to input their authentication information via the input unit 204 of the user's PC 114. The application server 109 then verifies this against the authentication information stored in the database server 106. Alternatively, the application server 109 may use the user ID and password entered by the user when they logged into the platform 117.

[0058] Next, in step S32, the selection list is displayed. The web server 110 displays the selection list on the output unit 205 of the user's personal computer 114. The selection list contains the display modes (templates) of reports to be displayed on the digital dashboard. The report display modes include, for example, a microscope report showing information related to microscope images, and a particle (PA) report containing foreign matter information such as the number of foreign matter in the etching apparatus and foreign matter on the wafer.

[0059] Next, in step S33, the report format is determined. When the user's selection is received by the input unit 204 of the user's PC 114, the web server 110 receives the user's selection.

[0060] Next, in step S34, a query is made to the database. The web server 110 queries the database server 106 for a report corresponding to the determined report type.

[0061] Next, in step S35, the report is displayed. The web server 110 displays the selected type of report on the output unit 205 of the user's personal computer 114.

[0062] The process in step S31 is performed to associate and store the user and the result of the report format selection made by the user. If the same report as the completed report is to be created, the report format selection can be performed efficiently by referring to the user and report format selection information.

[0063] (Selection of data type) Referring to Figure 3(c), the selection of the data type in step S5 will be explained. First, in step S51, the user's authentication information is verified. The process for verifying the user's authentication information is the same as in step S31. If the authentication information has an expiration date, and the expiration date from step S31 is still valid at the time of step S51, the process in step S51 can be omitted.

[0064] Next, in step S52, the selection list is displayed. The web server 110 displays the selection list on the output unit 205 of the user's personal computer 114. The selection list contains the types of data used in the report. The data types include, for example, data acquired during processing of each wafer or batch, the state of the processing room (for example, vacuum level, temperature, and in the case of a plasma device, the plasma generation state), and in the case of microscope image data, the coordinates in which the image was taken.

[0065] Next, in step S53, the data type is determined. When the user's selection is received by the input unit 204 of the user's PC 114, the web server 110 receives the user's selection.

[0066] Next, in step S54, a query is made to the database. The web server 110 queries the database server 106 for the selected data type.

[0067] Next, in step S35, data display takes place. The web server 110 displays a digital dashboard containing the selected data type on the output unit 205 of the user's PC 114.

[0068] Even when selecting data types, this process is carried out to associate and remember the user with the results of their data type selection. This makes it possible to efficiently select data types when creating reports later.

[0069] (Recipe information) Refer to Figure 4 to explain the recipe information entered into the PCs 101-104 for the apparatus. Figure 4 shows an example of recipe information entered into the etching apparatus. The recipe includes the following items: "Step No.", "Processing Time", "Pressure", "Gas Type / Flow Rate", "Microwave Output", "Bias Output", "Temperature", and "Step Name".

[0070] The item "Step No." indicates the process included in the plasma processing. When plasma processing is performed in an etching apparatus, the plasma environment generated within the etching apparatus is realized by the setting conditions set for each step number. "Processing time" indicates the period during which the set conditions are maintained. "Pressure" indicates the pressure inside the etching apparatus where the wafer is placed. "Gas type / flow rate" indicates the type and flow rate of gas supplied into the etching apparatus. The example in Figure 4 shows the case where three types of gas are used. "Microwave output" indicates the output value of the microwave applied inside the etching apparatus. "Bias output" indicates the voltage applied to the wafer. "Temperature" indicates the set temperature of the location where the wafer is placed. "Step name name " is the search key for step number. As shown in Figure 4, a predetermined setting value is entered for each item.

[0071] Recipe information is displayed on the digital dashboard in response to user requests entered via the UI of the user's PC 114. For example, as described later, when the digital dashboard content is generated by specifying a Run number, the recipe information executed by that Run number is displayed on the digital dashboard. Also, when the digital dashboard content is generated by specifying the state inside the etching apparatus, the operating conditions of the apparatus related to the state inside the apparatus are extracted from the recipe information and displayed on the digital dashboard.

[0072] (Specifications) Next, the specifications will be explained with reference to Figure 5. Figure 5 is a diagram showing a cross-sectional view of the device. Figure 5(a) schematically shows the case when the device 120 is etched from the z-axis direction. A resist layer 122 having a predetermined pattern shape is formed on the wafer 121, and the portion of the wafer 121 where the resist layer 122 is not formed is etched to form a trench shape. When specifying the trench shape, the width A of the groove portion 121a of the wafer 121, the width B of the protrusion 121b of the wafer 121, the height C of the protrusion 121b, and the thickness D of the resist layer can be used as characteristics of the trench shape. As for the specifications, predetermined set values ​​are associated with each of the widths A to D, as shown in Figure 5(b).

[0073] (Example of report format) Next, an example of a report format (the way the information included in the report is displayed) will be described with reference to Figures 6 and 7. Figures 6 and 7 show the display format of the information included in the final report, and are a portion of the information displayed on the digital dashboard in the output unit 205 of the user's personal computer 114 while wafer processing is being performed. Figures 6 and 7 show the display format selected from the selection list displayed on the output unit 205 of the user's personal computer 114 (corresponding to the selection list in step S32 of Figure 2(b)). The digital dashboard includes a microscope report containing microscope images or a particle report containing foreign matter information. This will be explained in detail below.

[0074] Figure 6 shows a microscope image display including a microscope image. The microscope image display (microscope report) 300 includes microscope images (SEM / ER data) 302 and 308. Microscope image 302 corresponds to data selected from the data selection unit 304. The measurement table 306 is a measurement of a portion of the device from which the microscope image 302 was acquired, as defined in the specifications (corresponding to step S1 in Figure 2(a)). The measurement table 306 is shown to include items 1 and 2, but the number of items may be other than 2.

[0075] Microscope image 308 is the image selected as a comparison target when, for example, comparison data is added (corresponding to step S8 in Figure 2(a)). Microscope image 308 corresponds to the data selected from the data selection unit 310, and, as with microscope image 302, the measurement table 312 is associated with it.

[0076] The comparison graph (trend graph) 314 shows the values ​​for measurement item 1 and item 2 at the time of microscope image 302 and at the time of microscope image 308.

[0077] The microscope image display 300 is pre-configured as a template, and according to the data selected from the data selection unit 304 and the data selection unit 310, the microscope image, measurement table, and comparison graph are displayed.

[0078] Although the above description shows a case where two microscope images are included, this disclosure is not limited to this case. For example, it is also possible to set up a template that includes three microscope images.

[0079] Figure 7 shows a foreign matter information display that includes information about foreign matter. The foreign matter information display (particle (PA) report) 400 includes a foreign matter count scatter plot (PA data) 402 showing the change in the number of foreign matter over time and a foreign matter distribution map (PA map) 406 showing the measurement results of foreign matter on the wafer. The foreign matter count scatter plot 402 corresponds to the data selected from the data selection unit 404. In the foreign matter count scatter plot 402, the elapsed time of the etching process is on the horizontal axis and the number of foreign matter is on the vertical axis. The foreign matter information display 400 is updated each time the number of foreign matter is measured, and the measurement results are shown in real time.

[0080] The foreign matter distribution diagram 406 shows the distribution of foreign matter on the wafer over time, for example, during the etching process selected by the data selection unit 408. By setting the coordinates of the foreign matter distribution diagram 406 via the data selection units 410, 414, and 418, the shape and composition of the foreign matter at the set coordinates are displayed in the display fields 412, 416, and 420, respectively.

[0081] (Examples of data types) Next, an example of data types will be explained with reference to Figures 8 and 9. Figures 8 and 9 show an example of a selection list displayed on the output unit 205 of the user's personal computer 114. The selection list corresponds to the selection list in step S52 of Figure 2(c).

[0082] Figure 8(a) shows the selection list 500 displayed in the microscope image display 300 when the data selection unit 304 of the microscope image 302 is selected. The selection list 500 includes Run numbers 001 to 005. The Run number is an index corresponding to the processed wafer and is incremented each time a wafer is processed (or one batch if the etching process is performed in batch processing). The selection list 500 is displayed on the output unit 205 of the user PC 114, and the Run number is selected via the input unit 204 of the user PC 114. The application server 109 has the function to access data using the Run number specified from the UI of the user PC 114. The application server 109 extracts the microscope image based on the Run number from the database server 106. The microscope image 302 displays the microscope image of the wafer etched with the Run number selected by the user.

[0083] Figure 8(b) shows the selection list 502 displayed in the foreign matter information display 400 when the data selection unit 404 of the foreign matter count scatter plot 402 is selected. The selection list 502 shows the condition inside the etching apparatus (Condit io Regarding n), it includes Condition001 to Condition005. The selection list 502 is displayed on the output unit 205 of the user's personal computer 114, and the state is selected via the input unit 204 of the user's personal computer 114. The foreign matter count scatter plot 402 displays the elapsed time of the etching process during the period in which a predetermined state is achieved as time on the horizontal axis, and the number of foreign matter in the etching process during that period as the vertical axis.

[0084] Figure 9(a) shows the selection list 504 displayed in the foreign matter information display 400 when the data selection unit 408 of the foreign matter distribution diagram 406 is selected. The selection list 504 is ,a The discharge time, which indicates the elapsed time during the etching process, includes discharge times t1 to t5. The selection list 504 is displayed on the output unit 205 of the user's personal computer 114, and the discharge time is selected via the input unit 204 of the user's personal computer 114. The foreign matter distribution diagram 406 displays the distribution of foreign matter on the wafer measured at the discharge time selected by the user.

[0085] Figure 9(b) shows the selection list 506 displayed when the data selection unit 410 is selected in the foreign object information display 400. The selection list 506 includes coordinates 001 to 005 in the foreign object distribution diagram 406. The selection list 506 is displayed on the output unit 205 of the user's personal computer 114, and the coordinates are selected via the input unit 204 of the user's personal computer 114. The display field 412 displays the shape and composition of the foreign object at the coordinates selected by the user.

[0086] (Effects / Actions) According to the present invention, a digital dashboard can be utilized in semiconductor device manufacturing equipment and semiconductor device manufacturing systems. In particular, recipe information and microscope images are unique information in semiconductor device manufacturing systems, and this information can be viewed in real time as a list along with other information that changes. Furthermore, since reports can be created through the operation of the digital dashboard using templates, the burden on the user in creating reports is reduced, and the efficiency of evaluating semiconductor device manufacturing systems can be improved.

[0087] [Second Embodiment] The second embodiment differs from the first embodiment in that the data used in the digital dashboard is stored in a cache. Figure 10 shows the configuration of a semiconductor device manufacturing system 1a using a group of equipment including semiconductor manufacturing equipment and a network 117a (hereinafter referred to as "platform 117a"). In the following description, components that are the same as or equivalent to those in the first embodiment described above are denoted by the same reference numerals, and their descriptions are simplified or omitted.

[0088] Platform 117a includes a cache server 130. The cache server 130 stores data used in the digital dashboard. The cache server 130 may also be composed of multiple cache servers, for example, a configuration that includes a first database storing recipe information used in a processing device for processing samples, and a second database storing electron microscope images of samples. The application server 109 communicates directly or indirectly with the first and second databases and processes the data obtained from the processing device and the first and second databases based on templates used in the digital dashboard.

[0089] Similar to the database server 106, data is also accumulated in the cache server 130, but the cache server 130 deletes older data from the accumulated data. For example, one method of data deletion is to define a retention period for each type of data and delete data whose accumulation time exceeds the retention period. In addition to this, data deletion methods can be set as appropriate according to user requests.

[0090] Although this explanation describes the case using cache server 130, this disclosure is not limited to this case. Other configurations can be adopted as long as the data used in the digital dashboard is stored in a cache.

[0091] (Effects / Actions) Generally, since the data related to wafer processing increases over time, sufficient storage capacity is required. In contrast, in the second embodiment, the cache server 130 deletes past data, making it possible to secure the data necessary for creating the digital dashboard while keeping storage capacity down. Furthermore, when requesting data, reading data from the cache server 130 is faster and reduces the load compared to reading from the database. As a result, when creating digital dashboards and reports, it is possible to improve the overall performance of the semiconductor device manufacturing system 1a.

[0092] Although embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications are possible without departing from the spirit of the invention.

[0093] The following describes, but is not limited to, embodiments that may constitute the present invention. (Aspect 1) Semiconductors that process samples manufacturing In a terminal connected to a network comprising at least a first database storing recipe information used in the device, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first and second databases, The device in question is, A processor that processes the communication protocol with the aforementioned network, The system includes a user interface (hereinafter referred to as "UI") that displays information stored in the first database or the second database, A terminal characterized in that a digital dashboard displaying the recipe information or electron microscope image is shown in the UI in response to a request entered from the UI. (Aspect 2) The terminal according to embodiment 1, characterized in that the digital dashboard includes a microscope report including a microscope image or a particle report including foreign matter information. (Aspect 3) The terminal according to embodiment 1 or embodiment 2, characterized in that the server has an editing function for creating reports based on the display of the digital dashboard. (Aspect 4) The terminal according to any one of embodiments 1 to 3, characterized in that the server is equipped with a VER application for calculating the etch rate. (Appendix 5) The terminal according to any one of embodiments 1 to 4, characterized in that the server has a function to access data by a Run number specified from the UI of the terminal. (Aspect 6) The terminal according to any one of embodiments 1 to 5, characterized in that the server has functions for saving the report, reading the saved report, and searching for it. (Aspect 7) The terminal according to any one of embodiments 1 to 6, characterized in that the server has a function to save the report with a document number assigned to it and to search the saved report using the document number as an ID. (Pattern 8) The terminal according to any one of embodiments 1 to 7, characterized in that the server processes data obtained from the semiconductor manufacturing equipment, the first database, and the second database based on a template used for the digital dashboard. (Aspect 9) The aforementioned terminal has memory, The memory is characterized in that it stores an application program that, when executed by the processor, creates the digital dashboard. Any one of Embodiments 1 to 8 The terminals listed. (Aspect 10) A network comprising at least a semiconductor manufacturing apparatus for processing a sample, a first database storing recipe information used in the semiconductor manufacturing apparatus, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database. The network includes terminals that are directly or indirectly connected to the server, A semiconductor device manufacturing system characterized in that, in response to a request from the terminal, a digital dashboard displaying the recipe information or electron microscope images is displayed on the user interface of the terminal. (Aspect 11) A semiconductor manufacturing apparatus for processing samples, a first database storing recipe information used in the semiconductor manufacturing apparatus, and the sample A network comprising at least a second database storing electron microscope images and a server capable of communicating directly or indirectly with the first database and the second database, A display method for displaying a digital dashboard on a user interface (hereinafter also referred to as "UI") in a semiconductor device manufacturing system, which includes a terminal having a user interface (hereinafter also referred to as "UI") and being directly or indirectly connected to the server in the network, The aforementioned semiconductor manufacturing Device The data obtained from the first database and the second database is processed based on the template used for the digital dashboard. A display method characterized by displaying the digital dashboard, which displays the recipe information or electron microscope image, on the UI of the terminal in response to a request from the UI of the terminal. [Explanation of Symbols]

[0094] 1, 1a... Semiconductor device manufacturing system, 101... PC for semiconductor manufacturing equipment, 102... PC for semiconductor inspection equipment, 103... PC for semiconductor analysis equipment, 104... PC for semiconductor analysis equipment, 105... Relay PC, 106... Database server, 108... Gateway PC, 109... Application server, 110... Web server, 111... GPU server, 113... Internet, 114... User PC, 115... User mobile terminal PC, 116... Remote monitoring PC, 117, 117a... Platform (network), 118... Route setting PC, 120... Device, 121... Wafer, 122... Resist layer, 130... Cache server, 300... Microscope image display, 400... Foreign object information display

Claims

1. A terminal connected to a network comprising at least a first database storing recipe information used in a semiconductor manufacturing apparatus for processing a sample, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database, The device in question is, A processor that processes the communication protocol with the aforementioned network, The system includes a user interface (hereinafter referred to as "UI") that displays information stored in the first database or the second database, A digital dashboard is displayed on the UI that displays the recipe information or electron microscope image in response to a request entered from the UI. The server is a terminal characterized by having an editing function for creating reports based on the display of the digital dashboard.

2. A terminal connected to a network comprising at least a first database storing recipe information used in a semiconductor manufacturing apparatus for processing a sample, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database, The device in question is, A processor that processes the communication protocol with the aforementioned network, The system includes a user interface (hereinafter referred to as "UI") that displays information stored in the first database or the second database, A digital dashboard is displayed on the UI that displays the recipe information or electron microscope image in response to a request entered from the UI. The aforementioned server is a terminal characterized by having a VER application for calculating the etch rate.

3. A terminal connected to a network comprising at least a first database storing recipe information used in a semiconductor manufacturing apparatus for processing a sample, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database, The device in question is, A processor that processes the communication protocol with the aforementioned network, The system includes a user interface (hereinafter referred to as "UI") that displays information stored in the first database or the second database, A digital dashboard is displayed on the UI that displays the recipe information or electron microscope image in response to a request entered from the UI. The server is a terminal characterized by etching data obtained from the semiconductor manufacturing equipment, the first database, and the second database based on a template used in the digital dashboard.

4. The terminal according to any one of claims 1 to 3, wherein the digital dashboard includes a microscope report including a microscope image or a particle report including foreign matter information.

5. The terminal according to any one of claims 1 to 3, characterized in that the server has a function to access data by a Run number specified from the UI of the terminal.

6. The terminal according to claim 1, wherein the server has functions for saving the report, reading the saved report and searching for it.

7. The terminal according to claim 6, wherein the server has a function to store the report with a document number assigned to it and to search the stored report using the document number as an ID.

8. The aforementioned terminal has memory, The terminal according to any one of claims 1 to 3, characterized in that the memory stores an application program that creates the digital dashboard when executed by the processor.

9. A network comprising at least a semiconductor manufacturing apparatus for processing a sample, a first database storing recipe information used in the semiconductor manufacturing apparatus, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database. The network includes terminals that are directly or indirectly connected to the server, In response to a request from the terminal, a digital dashboard displaying the recipe information or electron microscope image is displayed on the user interface of the terminal. The semiconductor device manufacturing system is characterized in that the server has an editing function for creating reports based on the display of the digital dashboard.

10. A network comprising at least a semiconductor manufacturing apparatus for processing a sample, a first database storing recipe information used in the semiconductor manufacturing apparatus, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database. The network includes terminals that are directly or indirectly connected to the server, In response to a request from the terminal, a digital dashboard displaying the recipe information or electron microscope image is displayed on the user interface of the terminal. The semiconductor device manufacturing system is characterized in that the server is equipped with a VER application for calculating the etch rate.

11. A network comprising at least a semiconductor manufacturing apparatus for processing a sample, a first database storing recipe information used in the semiconductor manufacturing apparatus, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database. The network includes terminals that are directly or indirectly connected to the server, In response to a request from the terminal, a digital dashboard displaying the recipe information or electron microscope image is displayed on the user interface of the terminal. A semiconductor device manufacturing system characterized in that the server etches data obtained from the semiconductor manufacturing apparatus, the first database, and the second database based on a template used in the digital dashboard.

12. A network comprising at least a semiconductor manufacturing apparatus for processing a sample, a first database storing recipe information used in the semiconductor manufacturing apparatus, a second database storing electron microscope images of the sample, and a server capable of communicating directly or indirectly with the first database and the second database. User interface (hereinafter also referred to as "UI"). A display method for displaying a digital dashboard on the UI in a semiconductor device manufacturing system, which includes a terminal having a network and being directly or indirectly connected to the server, The semiconductor manufacturing equipment and the data obtained from the first and second databases are processed based on a template used in the digital dashboard. A display method characterized by displaying the digital dashboard, which displays the recipe information or electron microscope image, on the UI of the terminal in response to a request from the UI of the terminal.

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