Drying equipment

The drying apparatus efficiently heats and evaporates processing liquid using transparent quartz glass and near-infrared radiation, addressing inefficiencies in conventional drying processes by reducing steam generation waiting times and enhancing the cleaning and drying efficiency of semiconductor wafers.

JP7846495B2Active Publication Date: 2026-04-15HIMEJI RIKA INNOTEK CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-04-23
Publication Date
2026-04-15

AI Technical Summary

Technical Problem

Conventional drying apparatuses require a waiting period for isopropyl alcohol to be heated and vaporized, leading to inefficiencies in the cleaning and drying of semiconductor wafers.

Method used

A drying apparatus with a storage tank and halogen lamp heater configuration that efficiently heats and evaporates processing liquid using transparent quartz glass and near-infrared radiation, allowing direct heating of the liquid as it flows through a partitioned flow path, reducing waiting time for steam generation.

Benefits of technology

The apparatus achieves efficient and smooth washing and drying of objects by eliminating waiting times for steam generation, utilizing halogen lamp heaters with excellent controllability and energy savings.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a dryer capable of performing washing and drying treatment of an object to be dried smoothly and efficiently.SOLUTION: A dryer 1 includes a storage tank 14 that includes a flow path 15 sharing a bottom surface 14a of the storage tank 14 and a bottom part 15a, wherein the flow path 15 includes a flow inlet 15d provided so as to penetrate the bottom part 15a and a flow outlet 15e provided so as to be opened in the storage tank 14; a halogen lamp heater 16 is arranged along the flow path 15 below the bottom part 15a; and the bottom part 15a is made of transparent quartz glass and transmits near-infrared rays emitted from the halogen lamp heater 16.SELECTED DRAWING: Figure 4
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Description

Technical Field

[0001] The present invention relates to a drying apparatus including a storage tank for storing a processing liquid, a halogen lamp heater for heating and evaporating the processing liquid, and a drying chamber disposed above the storage tank and filled with vapor of the processing liquid, and configured to condense the vapor of the processing liquid on an object to be dried in the drying chamber to clean and dry the object to be dried.

Background Art

[0002] In a semiconductor manufacturing factory, after an object to be dried such as a semiconductor wafer is cleaned with a cleaning liquid such as hydrogen fluoride or pure water rinse liquid by a cleaning apparatus, it is dried by a drying apparatus.

[0003] As such a drying apparatus, Patent Document 1 discloses a drying apparatus including a drying chamber into and out of which a semiconductor wafer can be inserted, and a storage tank provided below the drying chamber for storing isopropyl alcohol as a processing liquid. [[ID=!]]

[0004] The drying apparatus arranges a plurality of semiconductor wafers in a substantially vertical posture and carries them into the drying chamber, heats and evaporates the isopropyl alcohol stored in the lower part of the processing chamber, and brings the vapor of isopropyl alcohol into contact with the surface of the semiconductor wafer. Then, the vapor condenses on the surface of the semiconductor wafer.

[0005] [[ID=?]] When droplets generated by the condensation of the vapor on the surface of the semiconductor wafer fall from the semiconductor wafer while taking in the cleaning liquid adhering to the semiconductor wafer, the cleaning liquid is removed from the surface of the semiconductor wafer.

[0006] Thus, the semiconductor wafer is cleaned. When the temperature of the semiconductor wafer becomes equal to the temperature of the vapor of isopropyl alcohol, the condensation ends, and the surface of the semiconductor wafer becomes dry. The semiconductor wafer dried in this way is carried out of the drying apparatus.

Prior Art Documents

Patent Documents

[0004] and in the original seem to be misformatted in the way they are presented here.

[0007] [Patent Document 1] Japanese Patent Publication No. 2008-264690 [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] However, the conventional drying apparatus described above requires a waiting period from the time isopropyl alcohol is supplied to the storage tank until the entire amount of isopropyl alcohol stored in the tank is heated and vapor is generated, which leaves room for improvement in the efficiency of cleaning and drying semiconductor wafers.

[0009] This invention has been made in view of the above-mentioned problems, and aims to provide a drying apparatus that can perform the washing and drying of objects to be dried smoothly and efficiently. [Means for solving the problem]

[0010] To achieve the above-mentioned objective, the present invention provides a drying apparatus comprising: a storage tank in which a processing liquid is stored; a halogen lamp heater for heating and evaporating the processing liquid; and a drying chamber located above the storage tank and filled with the vapor of the processing liquid, wherein the drying apparatus is configured to wash and dry an object to be dried by condensing the vapor of the processing liquid on the object to be dried within the drying chamber, wherein the storage tank has a flow path common to the bottom surface and bottom portion of the storage tank, the flow path has an inlet provided to penetrate the storage tank and an outlet provided to be open within the storage tank, the halogen lamp heater is located below the bottom portion along the flow path, and the bottom portion is made of transparent quartz glass that transmits near-infrared rays emitted from the halogen lamp heater.

[0011] According to the above configuration, the halogen lamp heater is positioned along the flow path below the bottom surface of the flow path and facing the bottom surface. Since the bottom surface is made of transparent quartz glass, it transmits near-infrared rays from the halogen lamp heater into the flow path. As a result, the processing liquid passing through the flow path is efficiently radiated and heated by the halogen lamp heater from the inlet to the outlet, reaching its boiling point and evaporating.

[0012] The processing liquid, having reached its boiling point through radiant heating, remains in the storage tank, turns into vapor, and is supplied to the drying chamber, where it washes and dries the objects to be dried.

[0013] Furthermore, halogen lamp heaters offer excellent on / off response and controllability, allowing them to reach a predetermined temperature in just a few seconds. Therefore, they enable improved process speed and energy savings.

[0014] Because the processing liquid supplied to the storage tank is directly heated and evaporated as it passes through the flow path, the waiting time required for steam generation, which is necessary for conventional systems that heat the entire processing liquid in the storage tank, is eliminated. As a result, it is now possible to provide a drying apparatus that can perform the washing and drying of the object to be dried smoothly and efficiently.

[0015] In the drying apparatus according to the present invention, the top surface of the flow path may be characterized in that, below the liquid level of the processing liquid stored in the storage tank, the distance from the bottom surface increases from the inlet to the outlet.

[0016] According to the above configuration, the cross-sectional area of ​​the inlet side of the flow path is narrower than the cross-sectional area of ​​the outlet side. Therefore, the heat capacity of the processing liquid is relatively smaller on the inlet side than on the outlet side, and thus it is efficiently heated by radiation from the halogen lamp heater.

[0017] Furthermore, since the top surface is positioned below the liquid level of the processing liquid stored in the storage tank, the amount of processing liquid stored above the top surface on the inlet side of the storage tank is greater than the amount of processing liquid stored above the top surface on the outlet side, meaning that the heat capacity is relatively larger. Therefore, even if processing liquid at a temperature lower than its boiling point is supplied to the inlet of the flow path, there is little risk of this processing liquid lowering the temperature of the processing liquid stored in the storage tank.

[0018] Furthermore, since the top surface is sloped such that the distance from the bottom surface increases from the inlet to the outlet, even if bubbles are generated in the flow path, these bubbles will flow along the top surface towards the outlet, and will not accumulate in the flow path.

[0019] The drying apparatus according to the present invention may be characterized in that the top surface is made of transparent quartz glass.

[0020] According to the above configuration, the processing liquid that exits the flow path and remains in the storage tank is also radiated through the top surface by radiation from the halogen lamp heater, maintaining the liquid temperature and thus preventing stagnation of steam generation.

[0021] In the drying apparatus according to the present invention, the thickness of the top surface may be greater than the thickness of the bottom surface.

[0022] When a processing liquid at a temperature lower than its boiling point is supplied to the inlet of the flow path, the temperature of the processing liquid stored in the storage tank is lost through the top surface. With the above configuration, even if a processing liquid at a temperature lower than its boiling point is supplied to the inlet of the flow path, the thickness of the top surface is greater than that of the bottom surface, so the loss of temperature of the processing liquid stored in the storage tank through the top surface can be suppressed. In addition, because the thickness of the top surface is greater than that of the bottom surface, the transmittance of near-infrared rays is lower at the top surface than at the bottom surface, and the top surface is heated more than the bottom surface by near-infrared rays. The processing liquid can also be heated by this heat transfer from the top surface.

[0023] In the drying device according to the present invention, the entire storage tank is made of transparent quartz glass, and the thickness of the bottom surface portion is preferably at least thinner than the thickness of the other portions of the bottom surface of the storage tank.

[0024] According to the above configuration, since the thickness of the bottom surface portion is at least thinner than the thickness of the other portions of the bottom surface of the storage tank, the near-infrared rays of the halogen lamp heater are efficiently used for the radiant heating of the processing liquid flowing through the flow path.

[0025] In the drying device according to the present invention, the flow path is partitioned by a partition wall from the vicinity of the inlet to the outlet, and a plurality of halogen lamp heaters are arranged along each of the partitioned flow paths below the bottom surface portion.

[0026] According to the above configuration, since the flow path is partitioned by a partition wall, the flow path cross-sectional area of the processing liquid per flow path becomes small. Since halogen lamp heaters are arranged in each flow path, the flow rate of the processing liquid per unit time per flow path decreases. Therefore, even if the halogen lamp heater has low power consumption, it can sufficiently radiantly heat the processing liquid flowing through each flow path.

[0027] In the drying device according to the present invention, a reflecting member is provided around the lower part of the halogen lamp heater to reflect the near-infrared rays irradiated downward and sideward from the halogen lamp heater toward the flow path.

[0028] According to the above configuration, since the near-infrared rays irradiated downward can be reflected toward the bottom surface portion, the processing liquid passing through the flow path can be more efficiently radiantly heated. The reflecting member is preferably composed of, for example, a stainless steel mirror-finished plate.

[0029] A drying apparatus according to the present invention may be characterized in that a recovery unit is provided between the drying chamber and the storage tank for recovering the processing liquid dripping from the object to be dried, and the recovery unit is provided with a vent that prevents the processing liquid dripping from the object to be dried from passing through the storage tank, while allowing the vapor of the processing liquid generated from the storage tank to pass through to the drying chamber.

[0030] The processing liquid that drips from the material being dried and is collected may contain substances other than the processing liquid itself. If the processing liquid in the storage tank becomes contaminated, there is a concern that the quality of the material being dried will deteriorate, and it may become necessary to replace the processing liquid. In contrast, with the above configuration, the processing liquid dripped from the material being dried can be collected, so there is no risk of the processing liquid in the storage tank becoming contaminated, thus eliminating the above concerns and the need for the above work. [Brief explanation of the drawing]

[0031] [Figure 1] Figure 1 is a front view of the drying apparatus according to the present invention. [Figure 2] Figure 2 is a side view of the drying apparatus according to the present invention. [Figure 3] Figure 3 is a front view of the main part of the drying apparatus according to the present invention. [Figure 4] Figure 4 is a side view of the main part of the drying apparatus according to the present invention. [Figure 5] Figure 5 is a plan view of the main part of the drying apparatus according to the present invention, and is a view taken along line AA in Figure 4. [Modes for carrying out the invention]

[0032] An embodiment of the drying apparatus according to the present invention will be described with reference to the drawings.

[0033] As shown in Figures 1 and 2, the housing 11 of the drying apparatus 10 is provided with a cooling chamber 12 and a drying chamber 13 through which semiconductor wafers 1 can be inserted and removed, and a storage tank 14 for storing isopropyl alcohol located below the drying chamber 13. Above the drying chamber 13 is a shutter (not shown) for opening and closing the housing 11. The housing 11 is also covered with an exterior member (not shown) made of stainless steel.

[0034] Note that semiconductor wafer 1 is an example of the "object to be dried" in the claim. Isopropyl alcohol is an example of the "processing liquid" in the claim. Isopropyl alcohol is a colorless, transparent liquid at room temperature with a melting point of -89.5°C and a boiling point of 82.4°C.

[0035] Multiple semiconductor wafers 1 are arranged in a nearly vertical position by a handling machine 2 and transported from the top of the drying apparatus 10 through the cooling chamber 12 into the drying chamber 13, where they are washed and dried. After being washed, they are then transported from the drying chamber 13 through the cooling chamber 12 back to the top of the drying apparatus 10.

[0036] The housing 11 is made of transparent quartz glass. That is, the cooling chamber 12, drying chamber 13, and storage tank 14 are made of transparent quartz glass. Since the drying apparatus 10 uses isopropyl alcohol, transparent quartz glass is preferable because it has corrosion resistance to it. Transparent quartz glass transmits near-infrared wavelengths easily, but absorbs longer wavelengths.

[0037] A halogen lamp heater 16, which primarily emits near-infrared light, is used to heat the isopropyl alcohol. The halogen lamp heater 16 emits near-infrared light radially and almost uniformly to the surroundings. Details of the halogen lamp heater 16 will be explained later.

[0038] The cooling chamber 12 is a space for condensing the steam rising from the drying chamber 13, and cooling coils 12a are arranged along the inner wall of the cooling chamber 12. Cooling water is passed through the cooling coils 12a. When cooling water is passed through the cooling coils 12a, the surface temperature of the cooling coils 12a decreases, and the steam on the surface condenses.

[0039] The drying chamber 13 is the space into which the semiconductor wafer 1 is brought, and a steam temperature sensor (not shown) is installed in the drying chamber 13. The steam temperature sensor detects the steam occupancy level inside the drying chamber 13 and sends the information to a control unit (not shown).

[0040] The storage tank 14 is a tank in which liquid isopropyl alcohol is stored, and a flow path 15 is arranged in the storage tank 14. The dimensions of the storage tank 14 are approximately 400 mm x 300 mm in the left-right x up-down directions of the paper in Figure 5, and the flow path 15 has a distance from the upstream side to the downstream side, i.e., a dimension in the left-right direction of the paper in the figure, of approximately 300 mm, and a width, i.e., a dimension in the up-down direction of the paper, of approximately 150 mm.

[0041] As shown in Figures 3 to 5, the flow path 15 is partitioned on the bottom surface 14a of the storage tank 14 by a bottom surface 15a, a top surface 15b, and a side surface 15c. The bottom surface 15a of the flow path 15 is made up of the bottom surface 14a of the storage tank 14. The white arrows shown in Figures 3 to 5 indicate the flow of isopropyl alcohol.

[0042] The bottom surface 15a, top surface 15b, and side surface 15c of the flow path 15 are made of a flat plate made of transparent quartz glass. In this embodiment, the thickness of the bottom surface 15a is 3 mm, and the thickness of the top surface 15b and side surface 15c is 5 mm.

[0043] The top surface 15b is inclined such that the distance from the bottom surface 15a increases from the inlet 15d to the outlet 15e. In this embodiment, the distance between the inner surface of the top surface 15b on the inlet 15d side and the bottom surface 15a is 6 mm, and the distance between the inner surface of the top surface 15b on the outlet 15e side and the bottom surface 15a is 15 mm.

[0044] The liquid level of isopropyl alcohol stored in the storage tank 14 is adjusted to be above the highest point on the top surface 15b, on the outlet 15e side (i.e., 15 mm). In this embodiment, the liquid level of isopropyl alcohol is set to approximately 50 mm from the bottom surface 14a of the storage tank 14.

[0045] As a result, the top surface 15b is positioned below the liquid level of isopropyl alcohol stored in the storage tank 14. Inside the storage tank 14, the amount of isopropyl alcohol stored above the top surface 15b on the inlet side 15d is greater than the amount of isopropyl alcohol stored above the top surface 15b on the outlet side 15e, resulting in a relatively larger heat capacity.

[0046] Therefore, even if isopropyl alcohol at a temperature lower than its boiling point is supplied to the inlet 15d of the flow path 15, there is little risk that this isopropyl alcohol will lower the temperature of the isopropyl alcohol stored in the storage tank 14.

[0047] Since the top surface 15b of the flow path 15 is made of a flat plate made of transparent quartz glass, the isopropyl alcohol that exits the flow path 15 and remains in the storage tank 14 is also radiantly heated through the top surface 15b by radiation from the halogen lamp heater 16, maintaining the liquid temperature, so that vapor generation does not stall.

[0048] Because the top surface 15b of the flow path 15 is inclined at an angle, the isopropyl alcohol in the storage tank 14 is agitated to every corner by the generation of a complex flow, resulting in a uniform liquid temperature.

[0049] Since the top surface 15b is sloped such that the distance from the bottom surface 15a increases from the inlet 15d to the outlet 15e, even if bubbles are generated in the flow path 15, these bubbles will flow along the top surface 15b towards the outlet 15e, and will not accumulate in the flow path 15.

[0050] The flow path 15 is provided with an inlet 15d that penetrates the bottom surface 15a and an outlet 15e that is open inside the storage tank 14.

[0051] In this embodiment, a partition wall 15f is provided in the flow path 15, extending from the vicinity of the inlet 15d to the outlet 15e. The partition wall 15f is also made of a flat plate of transparent quartz glass. In this embodiment, the thickness of the partition wall 15f is 5 mm.

[0052] The partition wall 15f extends from the bottom surface 15a to the top surface 15b, thereby dividing the inside of the flow path 15 into two sections, left and right.

[0053] The halogen lamp heater 16 is located below the bottom surface 14a of the storage tank 14. In this embodiment, two halogen lamp heaters 16 (16L, 16R) are arranged below the bottom surface 15a, along two divided flow paths 15 (15L, 15R). Where it is not necessary to distinguish between the flow paths 15L, 15R and the halogen lamp heaters 16L, 16R, they will simply be described as flow path 15 and halogen lamp heater 16.

[0054] Since the flow path 15 is divided by a partition wall 15f, and halogen lamp heaters 16L and 16R are arranged in each flow path 15L and 15R, the isopropyl alcohol flow path cross-sectional area per flow path 15L and 15R is half the flow path cross-sectional area when there is no partition wall 15f.

[0055] Isopropyl alcohol is supplied to the inlet 15d at a rate of several liters per minute. Since the flow rate of isopropyl alcohol per unit time per channel 15L, 15R is half the flow rate when there is no partition wall 15f, even halogen lamp heaters 16L, 16R with low power consumption (approximately half the capacity of halogen lamp heaters required to sufficiently radiate heat the isopropyl alcohol to the temperature at which it evaporates when there is no partition wall 15f) can sufficiently radiate heat the isopropyl alcohol flowing through each channel 15L, 15R.

[0056] In this embodiment, the halogen lamp heater 16 has a configuration in which the filament, which is a near-infrared radiation source, is sealed inside a transparent quartz glass tube. Also, in this embodiment, the tube of the halogen lamp heater 16 is a straight tube.

[0057] A power supply (not shown) is connected to the halogen lamp heater 16, and a desired power is required. In this embodiment, the halogen lamp heater 16 has a power consumption of 6 kW.

[0058] The power supply is controlled by a control unit (not shown). The control unit is configured to control the amount of near-infrared radiation by adjusting the amount of power supplied from the power supply.

[0059] Because the filament of the halogen lamp heater 16 is sealed inside the tube, it is less susceptible to disturbances such as airflow, and it also exhibits good temperature rise and response in response to the amount of power supplied from the power source.

[0060] In this embodiment, a reflective member 17 is provided around the lower part of the halogen lamp heater 16. The reflective member 17 comprises a bottom surface portion 17a and side surfaces 17b extending diagonally upward and outward from both ends of the bottom surface portion. The reflective member 17 is made of, for example, a stainless steel mirror-finished plate.

[0061] With this configuration, near-infrared rays emitted downwards or to the sides from the halogen lamp heater 16 are reflected towards the flow path 15. This allows for more efficient radiant heating of the isopropyl alcohol passing through the flow path 15.

[0062] Furthermore, in this embodiment, a cover member 19 made of transparent quartz glass is provided above the halogen lamp heater 16 to cover the upper surface of the halogen lamp heater 16.

[0063] The bottom portion 15a is made of transparent quartz glass so as to face the halogen lamp heater 16 and allow near-infrared rays emitted from the halogen lamp heater 16 to pass through easily.

[0064] The halogen lamp heater 16 is positioned along the flow path 15 below the bottom surface 15a of the flow path 15 and facing the bottom surface 15a. Since the area of ​​the bottom surface 15a that transmits near-infrared rays from the halogen lamp heater 16 into the flow path 15 is made of transparent quartz glass, the isopropyl alcohol passing through the flow path 15 is efficiently radiated and heated by the halogen lamp heater 16 from the inlet 15d to the outlet 15e, reaching its boiling point.

[0065] In this embodiment, the thickness of the bottom portion 15a is configured to be thinner than the thickness of at least the portion of the bottom surface 14a of the storage tank 14 other than the bottom portion 15a.

[0066] As described above, in this embodiment, the thickness of the bottom portion 15a is 3 mm. However, the thickness of the portion of the bottom surface 14a of the storage tank 14 other than the bottom portion 15a is 5 mm. The near-infrared light from the halogen lamp heater 16 is used to efficiently radiate and heat the isopropyl alcohol flowing through the flow path 15.

[0067] As described above, in this embodiment, the thickness of the top surface 15b is 5 mm, and the thickness of the bottom surface 15a is 3 mm. In other words, the thickness of the top surface 15b is greater than that of the bottom surface 15a. When isopropyl alcohol at a temperature lower than its boiling point is supplied to the inlet 15d of the flow path 15, the temperature of the isopropyl alcohol stored in the storage tank 14 is taken away through the top surface 15b. Even when isopropyl alcohol at a temperature lower than its boiling point is supplied to the inlet 15d of the flow path 15, the thickness of the top surface 15b is greater than that of the bottom surface 15a, so the temperature of the isopropyl alcohol stored in the storage tank 14 is suppressed from being taken away through the top surface 15b. Furthermore, since the thickness of the top surface 15b is greater than that of the bottom surface 15a, the transmittance of near-infrared rays is lower for the top surface 15b than for the bottom surface 15a, and the top surface 15b is heated more by near-infrared rays than the bottom surface 15a. Isopropyl alcohol can also be heated by heat transfer from this top surface 15b.

[0068] Furthermore, since the thickness of the top surface 15b is greater than that of the bottom surface 15a, near-infrared rays from the halogen lamp heater 16 are less likely to penetrate the top surface 15b than the bottom surface 15a. In other words, the top surface 15b is heated more easily. Heat transfer from the top surface 15b also contributes to the heating of the isopropyl alcohol in the storage tank 14.

[0069] The near-infrared radiation from the halogen lamp heater 16 passes through the transparent quartz glass and directly acts on the isopropyl alcohol. The isopropyl alcohol undergoes vibrational motion between molecules due to the irradiated near-infrared radiation, which is converted into heat, resulting in efficient radiant heating.

[0070] In this case, since the cross-sectional area of ​​the inlet 15d side of the flow path 15 is narrower than the cross-sectional area of ​​the outlet 15e side, the heat capacity of isopropyl alcohol is relatively smaller on the inlet 15d side than on the outlet 15e side, and therefore it is more efficiently heated by radiation from the halogen lamp heater 16.

[0071] As described above, the isopropyl alcohol flowing through channel 15 reaches its boiling point due to radiant heating from halogen lamp heater 16, and as it remains in storage tank 14, it turns into vapor and fills drying chamber 13.

[0072] The temperature of the semiconductor wafer 1 before it is brought into a predetermined position in the drying chamber 13 is close to room temperature. Immediately after being brought into the drying chamber 13, the surface temperature of the semiconductor wafer 1 is lower than the temperature of the isopropyl alcohol vapor, so the vapor condenses on the surface of the semiconductor wafer 1.

[0073] As this condensed isopropyl alcohol flows down the surface of the semiconductor wafer 1, any foreign matter adhering to the surface (residue of the cleaning solution used to clean the semiconductor wafer 1 in the cleaning device before it was brought into the drying device 10) also flows down, and the surface of the semiconductor wafer 1 is cleaned.

[0074] As the isopropyl alcohol vapor in the drying chamber 13 repeatedly condenses on the surface of the semiconductor wafer 1, the temperature of the surface gradually rises. When the surface temperature reaches the temperature of the vapor, the vapor stops condensing, and the cleaning of the surface is completed. At this point, the surface of the semiconductor wafer 1 becomes dry.

[0075] Subsequently, the semiconductor wafer 1 is transported from the drying chamber 13 through the cooling chamber 12 to the outside of the drying apparatus 10 by the handling machine 2.

[0076] The isopropyl alcohol vapor in the drying chamber 13 is cooled in the cooling chamber 12 and condenses and liquefies on the inner wall of the housing 11 and the surface of the cooling coil 12a, thus preventing leakage to the outside of the drying apparatus 10. This liquefied isopropyl alcohol is collected in the recovery trough 12b, then guided to the flow path 15 via a liquid transfer pipe (not shown), and supplied to the storage tank 14.

[0077] The storage tank 14 is equipped with a level gauge for measuring the liquid level of the stored isopropyl alcohol and a thermometer for measuring the temperature. The readings from the level gauge and thermometer are sent to the control unit, which then controls the amount of isopropyl alcohol supplied to the storage tank 14 and the on / off status of the halogen lamp heater 16 based on these readings.

[0078] For example, when the liquid level of isopropyl alcohol stored in the storage tank 14 reaches a predetermined lower limit level, isopropyl alcohol is supplied to the storage tank 14 via the flow path 15, and when it reaches a predetermined upper limit level, the supply is stopped.

[0079] Furthermore, when the temperature of the isopropyl alcohol stored in the storage tank 14 reaches a predetermined lower limit level, the halogen lamp heater 16 is turned on to heat the isopropyl alcohol in the flow path 15, and when it reaches a predetermined upper limit level, the halogen lamp heater 16 is turned off.

[0080] Between the drying chamber 13 and the storage tank 14, there is a recovery unit 18 for recovering isopropyl alcohol dripping from the semiconductor wafer 1. A drain pipe 18b is connected to the recovery unit 18. The drain pipe 18b penetrates the housing 11 and communicates with the outside of the drying apparatus 10. The isopropyl alcohol recovered in the recovery unit 18 is drained to the outside of the drying apparatus 10 via the drain pipe 18b. A gate valve (not shown) is provided in the drain pipe 18b.

[0081] In this embodiment, the recovery unit 18 is equipped with multiple vents 18a all over. The vents 18a are so-called louvers, and are configured to prevent isopropyl alcohol dripping from the semiconductor wafer 1 from passing through the storage tank 14, while allowing isopropyl alcohol vapor generated from the storage tank 14 to pass through the drying chamber 13. The isopropyl alcohol vapor can be quickly and stably filled into the drying chamber 13 via the vents 18a.

[0082] The isopropyl alcohol dripped and recovered from the semiconductor wafer 1 may contain substances other than isopropyl alcohol. If the isopropyl alcohol in the storage tank 14 becomes contaminated, there is a concern that the quality of the semiconductor wafer 1 may deteriorate, and it may become necessary to replace the isopropyl alcohol.

[0083] In contrast, with the above configuration, the isopropyl alcohol recovered in the recovery unit 18 can be drained outside the drying apparatus 10 without being returned to the storage tank 14. Since the isopropyl alcohol dropped from the semiconductor wafer 1 does not mix with the new isopropyl alcohol supplied from the flow path 15 into the storage tank 14, there is no concern about a deterioration in the quality of the semiconductor wafer 1, and the above-mentioned replacement work is unnecessary.

[0084] A drain pipe 14b is connected to the bottom surface 14a of the storage tank 14. Isopropyl alcohol in the storage tank 14 is drained through this drain pipe 14b. A gate valve (not shown) is provided in the drain pipe 14b.

[0085] As described above, we can provide a drying apparatus 10 that can perform the cleaning and drying process of a semiconductor wafer 1 smoothly and efficiently.

[0086] In the embodiments described above, the case where the object to be dried is a semiconductor wafer 1 was explained, but this is not limited to this case. The object to be dried can be anything that can be cleaned and dried with isopropyl alcohol vapor, and may be, for example, a semiconductor substrate or a precision optical component.

[0087] In the embodiments described above, the case where the processing liquid is isopropyl alcohol was explained, but this is not limited to that. The processing liquid can be any liquid that turns into vapor when heated by the radiant heat of the halogen lamp heater 16.

[0088] In the embodiment described above, the dimensions of the storage tank 14 are approximately 400 mm x 300 mm, and the liquid level of isopropyl alcohol is set to approximately 50 mm from the bottom surface 14a of the storage tank 14. However, this is not limited to this. An appropriate liquid level can be set according to the dimensions of the storage tank 14.

[0089] In the embodiments described above, the case in which the thickness of the top surface 15b, side surface 15c, and partition wall 15f is 5 mm was described, but this is not limited to this. For example, the thickness of the top surface 15b, side surface 15c, and partition wall 15f may be around 3 mm to 8 mm. In addition, the thickness of the top surface 15b, side surface 15c, and partition wall 15f may differ from that of the other parts, or each of them may have a different thickness.

[0090] In the above-described embodiment, the thickness of the bottom portion 15a is 3 mm, and the thickness of the portion of the bottom surface 14a of the storage tank 14 other than the bottom portion 15a is 5 mm. However, this is not limited to this. For example, the thickness of the portion of the bottom surface 14a other than the bottom portion 15a may be around 3 to 8 mm, and the thickness of the bottom surface 14a and the bottom portion 15a may be uniform.

[0091] In the embodiments described above, the halogen lamp heater 16 was described as having a straight tube, but this is not limited to that. The tube of the halogen lamp heater 16 may be, for example, a curved tube.

[0092] In the above embodiment, the halogen lamp heater 16 had a power consumption of 6 kW, but this is not limited to this. Depending on the dimensions and flow rate of the flow path 15, any heater capable of radiantly heating the isopropyl alcohol to its boiling point before it passes through the flow path 15 is acceptable.

[0093] In the embodiments described above, a reflective member 17 is provided around the lower part of the halogen lamp heater 16 in order to efficiently utilize the radiation from the halogen lamp heater 16, but this is not limited to this configuration. Even without the reflective member 17, the halogen lamp heater 16 may be configured to radiate in a specific direction by, for example, partially depositing or sputtering aluminum, gold, copper, etc., onto the transparent quartz glass tube, or by coating it with a reflective film to create a mirror finish.

[0094] In the embodiments described above, a cover member 19 made of transparent quartz glass is provided above the halogen lamp heater 16 to cover the upper surface of the halogen lamp heater 16. However, this is not limited to this configuration. The cover member 19 may not be provided. Alternatively, the bottom surface portion 15a may be provided with ribs.

[0095] In the embodiment described above, the case in which two halogen lamp heaters 16 (16L, 16R) are arranged along each of the two divided flow paths 15 (15L, 15R) was explained, but this is not limited to this configuration. A single large halogen lamp heater 16 may be arranged below the two divided flow paths 15 (15L, 15R).

[0096] In the embodiment described above, a single partition wall 15f is provided in the flow path 15 from the vicinity of the inlet 15d to the outlet 15e; however, this is not limited to this case. Two or more partition walls 15f may be provided to divide the flow path 15, or there may be no partition walls 15f at all. In this case, the capacity of the halogen lamp heater 16 is selected according to the flow path cross-sectional area of ​​the flow path 15 and the flow rate of isopropyl alcohol per unit time.

[0097] In the embodiments described above, the case in which the thickness of the bottom portion 15a is thinner than the thickness of at least the portion of the bottom surface 14a of the storage tank 14 other than the bottom portion 15a was described, but this is not limited to this case. The thickness of the bottom portion 15a and the thickness of the portion of the bottom surface 14a of the storage tank 14 other than the bottom portion 15a may be the same. In this case, manufacturing is easy because quartz glass of the same thickness can be used.

[0098] In the embodiments described above, the case in which the thickness of the top surface 15b is greater than the thickness of the bottom surface 15a was explained, but this is not limited to this case. For example, the thickness of the top surface 15b and the thickness of the bottom surface 15a may be the same. In this case, manufacturing is easier because quartz glass of the same thickness can be used. Also, the thickness of the top surface 15b may be less than the thickness of the bottom surface 15a. In this case, the near-infrared rays from the halogen lamp heater 16 can be transmitted more effectively into the storage tank 14.

[0099] In the embodiments described above, the case in which the recovery section 18 is provided with multiple ventilation holes 18a all over was explained, but this is not limited to this configuration. The ventilation holes 18a may be provided only on the outer periphery of the recovery section 18.

[0100] The configuration disclosed in any of the above-described embodiments can be applied in combination with configurations disclosed in other embodiments, provided that no inconsistencies arise. Furthermore, the embodiments disclosed herein are illustrative, and the embodiments of the present invention are not limited thereto and can be modified as appropriate without departing from the purpose of the present invention. [Explanation of Symbols]

[0101] 1: Semiconductor wafer 2: Handling Machine 10:Drying equipment 11: Cabinet 12: Cooling room 12a: Cooling coil 13: Drying room 14: Storage tank 14a: Base 14b: Drainage pipe 15: Flow channel 15L: Flow channel 15R: Flow path 15a: Bottom part 15b:Top part 15c: Side part 15d: Inlet 15e: Outlet 15f: Bulkhead 16: Halogen lamp heater 16L: Halogen lamp heater 16R: Halogen lamp heater 17: Reflective material 17a: Bottom part 17b: Side part 18: Recovery Department 18a: Ventilation opening 18b: Drainage pipe 19: Cover component

Claims

1. The system comprises a storage tank in which the processing liquid is stored, a halogen lamp heater for heating and evaporating the processing liquid, and a drying chamber located above the storage tank and filled with the vapor of the processing liquid. A drying apparatus configured to wash and dry an object to be dried by condensing the vapor of the processing liquid on the object to be dried in the drying chamber, The storage tank is provided with a common flow path between the bottom surface and the bottom portion of the storage tank. The flow path comprises an inlet provided to penetrate the storage tank and an outlet provided to be open within the storage tank. The halogen lamp heater is positioned below the bottom portion along the flow path, The drying apparatus is characterized in that the bottom surface is made of transparent quartz glass and transmits near-infrared rays emitted from the halogen lamp heater.

2. The drying apparatus according to claim 1, characterized in that the top surface of the flow path is inclined such that the distance from the bottom surface increases from the inlet to the outlet, below the liquid level of the processing liquid stored in the storage tank.

3. The drying apparatus according to claim 2, characterized in that the top surface is made of transparent quartz glass.

4. The drying apparatus according to claim 3, characterized in that the thickness of the top surface is greater than the thickness of the bottom surface.

5. The storage tank is entirely made of transparent quartz glass. The drying apparatus according to claim 1, characterized in that the thickness of the bottom portion is at least thinner than the thickness of the portion of the bottom of the storage tank other than the bottom portion.

6. The aforementioned flow path is divided by a partition wall from the vicinity of the inlet to the outlet. The drying apparatus according to claim 1, characterized in that a plurality of halogen lamp heaters are arranged below the bottom surface along each of the divided flow paths.

7. The drying apparatus according to claim 1 or 6, characterized in that a reflective member is provided around the lower part of the halogen lamp heater to reflect near-infrared rays irradiated downward or to the side from the halogen lamp heater toward the flow path.

8. Between the drying chamber and the storage tank, there is a recovery unit for collecting the processing liquid dripping from the object to be dried. The drying apparatus according to claim 1, characterized in that the recovery section is provided with a vent that prevents the processing liquid dripping from the object to be dried from passing through the storage tank, and allows the vapor of the processing liquid generated from the storage tank to pass through to the drying chamber.

Citation Information

Patent Citations

  • Vacuum drying device

    JP2007132550A

  • Vapor dryer

    JP2008264690A

  • Vapor dryer

    JP2009038210A