Cooling structures, power modules equipped with such cooling structures, and power converters such as inverters equipped with such power modules.

The cooling structure with meandering structures in multiple layers addresses inefficiencies in heat transfer by increasing coolant contact, resulting in improved cooling efficiency and uniform heat dissipation for power modules.

JP7851962B2Active Publication Date: 2026-04-27VALEO EAUTOMOTIVE GERMANY GMBH
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
VALEO EAUTOMOTIVE GERMANY GMBH
Filing Date
2022-05-24
Publication Date
2026-04-27

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Abstract

The cooling structure (211) is made up of multiple layers (L 1-4 ) and a plurality of layers (L 1-4 ) distributed among the local chambers (230; 230 A-C ;230' A-C ;230” A-E ) and each local chamber (230; 230 A-C ;230' A-C ;230” A-E ) has at least two openings (I 1-2 , O 1-2 ;I' 1-6 , O' 1-4 ;I” 1-3 ;O” 1-3 ), and at least one of the at least two openings is formed by the layer (L 1-4 ) in another layer of local chambers (230; 230 A-C ;230' A-C ;230” A-E ) and each local chamber (230; 230 A-C ;230' A-C ;230” A-E ) is the two openings (I 1-2 , O 1-2 ;I' 1-6 , O' 1-4 ;I” 1-3 ;O” 1-3 ) between the local chambers (230; 230 A-C ;230' A-C ;230” A-E ) has one or more serpentine structures (M) that interrupt any direct path.
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Description

Technical Field

[0001] The present invention relates to a cooling structure, a power module including such a cooling structure, and a power converter such as an inverter including such a power module. The invention is particularly applicable to motor vehicles.

Summary of the Invention

[0002] Published European Application No. EP 2416 483 A2 describes a directly cooled two-sided single-phase power module. In particular, the power module includes a plate with pins protruding therefrom. The pins are intended to be inserted into openings of a flow path forming portion, whereby the coolant flowing into the flow path forming portion comes into contact with the pins.

[0003] An object of the invention is to improve the heat transfer between the cooling structure and the coolant.

[0004] The object of the invention is solved by a cooling structure comprising a plurality of layers and a network of a plurality of local chambers distributed between the plurality of layers laminated one on top of the other in the lamination direction, each local chamber including at least two openings, at least one of the at least two openings communicating with another local chamber of the layer, and each local chamber comprising one or a meandering structure blocking any direct path in the local chamber between the two openings.

[0005] Thanks to the invention, in each local chamber, the coolant flowing between the two openings is brought into contact with at least one meandering structure, whereby heat can be relatively easily transferred from the meandering structure to the coolant. This is in contrast, for example, to a triangular chamber where the two openings are arranged at respective vertices, in which a part of the coolant can travel along a direct path between the two openings without contacting the walls of the chamber. In particular, each layer includes one or more meandering structures, in particular formed by one or more meandering structures.

[0006] Next, optional features of the invention are listed. These features may be implemented individually or in any combination.

[0007] In some embodiments, each meandering structure has at least one curvature, i.e., a single curve or multiple curves, around the stacking direction. Preferably, the curvature is an ellipse, a circle, or a double parabola.

[0008] In some embodiments, each local chamber comprises a plurality of meandering structures, particularly including at least a first curve and at least one second curve opposite to or different from the first curve. Advantageously, the two curves having opposite curves relatively easily block any direct path between the two openings. In particular, each layer comprises a plurality of meandering structures, particularly including at least a first curve and at least one second curve opposite to or different from the first curve.

[0009] Preferably, the first and second curves are ellipses, circles, or double parabolas.

[0010] In some embodiments, multiple local chambers in each layer are separated from one another within their respective layers and connected to each other only through at least one local chamber in another layer. Advantageously, this allows for coolant flow toward different levels.

[0011] In some embodiments, two local chambers in two adjacent layers overlap each other, and the overlap forms an opening for both local chambers, and these two local chambers have walls that define the direction of the flow of each coolant, forming an angle with respect to each other in the overlap that is between 30° and 90°, preferably between 45° and 90°. Advantageously, the local chambers are thus shaped to obtain impinging flows against the transverse walls of the joint (overlapping portion) of the local chambers. Impinging flows can greatly improve heat transfer, thereby allowing heat to be easily transferred from the chamber walls to the coolant. In particular, the overlapping of two serpentine structures in two consecutive layers forms an opening for the local chambers.

[0012] In some embodiments, each layer's local chamber includes the same local chamber. Advantageously, having the same local chamber simplifies the design of the cooling structure.

[0013] In some embodiments, at least some local chambers in one layer are mirror images of at least some local chambers in an adjacent layer. Advantageously, the mirror image chambers allow the coolant to dissipate heat more uniformly from the cooling structure.

[0014] In some embodiments, the cooling structure includes stacked plates, each forming a layer, with each plate having holes that define local chambers for the corresponding layer. Advantageously, the stacked plates provide a simple way to construct a network of local chambers.

[0015] The invention also relates to a power module comprising a main body and a cooling structure according to the invention fixed to the main body. In particular, the main body includes a base plate, and the cooling structure is fixed to the base plate.

[0016] Advantageously, the power module can be easily mounted to a cooling channel that has a cavity for a pin fin base plate. The layer then extends into the cavity instead of the pin fin.

[0017] In particular, the power module includes a controllable switch, such as a controllable semiconductor switch like an IGBT. The power module is configured to convert a DC voltage applied to the input of the power module into an AC voltage present at the output of the power module, in particular by controlling the controllable switch in a manner known to those skilled in the art.

[0018] The AC voltage may be a multiphase AC voltage, particularly a three-phase voltage.

[0019] The power module may comprise two cooling structures according to the invention, particularly two cooling structures one fixed to one side of the main body of the power module and the other fixed to the opposite side of the main body. Such a power module may be known as a double-sided cooled power module.

[0020] The invention also relates to a power converter comprising one or more power modules and a cooling channel configured to cool the power modules at least indirectly by its cooling structure. The power inverter may be an inverter configured to convert a DC voltage to an AC voltage by one or more power modules. The inverter may include a DC link capacitor for smoothing the DC voltage applied to the inverter.

[0021] The power converter may be configured such that a cooling channel comprises a cavity having an open side, and the cooling channel is fixed to the power module such that the side of the main body, particularly the base plate, containing the cooling structure closes the open side and the cooling structure is received in the cavity. The coolant or cooling fluid flowing through the cooling channel then comes into direct contact with the cooling structure, resulting in improved cooling of the power module, particularly its controllable switches.

[0022] Furthermore, the invention relates to an electric drive comprising an inverter according to the invention and an electric motor driven by the inverter.

[0023] The invention also relates to an automobile vehicle equipped with an electric drive according to the invention, configured to drive, for example, at least one wheel of the automobile vehicle. [Brief explanation of the drawing]

[0024] The present invention will be described more specifically with reference to the accompanying drawings, in which: [Figure 1] Figure 1 is a cross-sectional view of a power converter equipped with a cooling structure according to the invention. [Figure 2] Figure 2 is a three-dimensional view of the coolant flowing in a first example of a chamber network that could be used in the cooling structure of Figure 1. [Figure 3] Figure 3 is a top view of the coolant in some of the chambers shown in Figure 2. [Figure 4] Figure 4 is a three-dimensional view of the coolant flowing in a second example of a chamber network that could be used in the cooling structure of Figure 1. [Figure 5] Figure 5 is a top view of the coolant in some of the chambers shown in Figure 4. [Figure 6] Figure 6 is a top view of coolant in some of the chambers of a third example of a network of chambers that could be used in the cooling structure of Figure 1. [Figure 7]Figure 7 is a three-dimensional view of three power modules having a common cooling structure according to the invention, with a transparent housing for viewing the coolant. [Figure 8] Figure 8 is a simplified diagram of an automobile vehicle including an inverter in which the cooling structure according to the invention may be used. [Modes for carrying out the invention]

[0025] Next, an example of a power converter 200 in which the invention is carried out will be described with reference to Figure 1. The power converter may be an inverter configured to convert a DC voltage to an AC voltage. The inverter may include a DC link capacitor configured to smooth the DC voltage.

[0026] The following explanation will be made with reference to an arbitrary direction V, for example, the vertical direction.

[0027] The power converter 200 includes a power module 202 that specifically converts DC voltage to AC voltage.

[0028] The power module 202 comprises a main body including a base plate 204 and a substrate 206 fixed to the upper surface of the base plate 204. The substrate 206 is, for example, a DBC (Direct Bonded Copper) substrate having a ceramic plate with copper layers on both sides. The substrate 206 may also be, for example, a lead frame on an insulating layer connected in some way to the base plate 204. The power module 202 further comprises a controllable switch, for example, a semiconductor power component 208 supported by the substrate 206.

[0029] Specifically, the power module 202 comprises an electrically insulating housing 210 surrounding the substrate 206 and semiconductor power components 208, while allowing at least a portion of the downward-facing surface of the base plate 204 to be visible. The electrically insulating housing 210 may include, for example, epoxy resin, or alternatively, a plastic casing filled with an electrically insulating gel.

[0030] The power module 202 further includes a cooling structure 211 fixed to the main body, particularly to the bottom surface of the base plate 204.

[0031] The power converter 200 further comprises a cooling channel 212 for cooling the power module 202, in particular its controllable switch. The cooling channel 212 is configured to guide a coolant, for example, a cooling liquid or cooling fluid. The coolant may be a liquid such as water, or a liquid-gas mixture such as a two-phase refrigerant (for example, in an air conditioning circuit or heat pump). The cooling channel 212 comprises a cavity 214 having an open top side 215, a general coolant inlet 216 for allowing coolant to flow into the cavity 214, and a general coolant outlet 218 for allowing coolant to flow out of the cavity 214.

[0032] The cooling channel 212 is configured to be fixed to the power module 202, for example to the base plate 204, so that the base plate 204 of the power module 202 closes the open top side 215 and the cooling structure 211 is received in the cavity 214, thereby fixing the cooling structure 211 and the cooling channel 212 to each other. This fixing may include sealing.

[0033] Next, the cooling structure 211 will be described in more detail.

[0034] The cooling structure 211 comprises a network of chambers 230, each having a serpentine structure, as will be explained in more detail below.

[0035] In the example described, the cooling structure 211 defines a general inlet chamber 226 connected to a general coolant inlet 216 and a general outlet chamber 228 connected to a general coolant outlet 218. Thus, the coolant is intended to flow from the general inlet chamber 226 to the general outlet chamber 228, traversing the chamber 230 in accordance with the general or main direction of the flow F, which is perpendicular to the vertical direction V in the example described.

[0036] As shown, the chambers 230 are distributed among multiple layers stacked on top of each other according to the vertical direction V. In particular, each layer contains, and is formed by, one or more serpentine structures M.

[0037] For example, each of those phases is hole It is formed by plates 232 on which are provided. The plates 232 are stacked on top of each other according to the vertical direction V. hole It is partially closed from below by the previous plate in the stack, or by the cooling channel 212 in the case of the bottom plate 232, and is closed from above by the next plate in the stack, or by the base plate 204 of the power module 202 in the case of the top plate 232, thereby hole Each of these forms a chamber 230. For example, hole These are obtained by etching, waterjet cutting, or laser jet cutting and stamping, etc. Plate 232 can be joined together, for example, by cold rolling and / or soldering, brazing, or bonding.

[0038] Advantageously, the power module 202 can be easily mounted to a cooling channel having a cavity for a pin fin cooling structure, i.e., a cavity for pin fins protruding downward from the base plate 204. The cooling structure 211 will extend into the cavity instead of the pin fins.

[0039] The cooling channel 212 can be a separate component as shown in FIG. 1, but it is also possible to incorporate it into the structure of the plate 232 that forms the outer wall defining the cooling channel without requiring a separate wall (which ultimately leads to the configuration of FIG. 7).

[0040] Next, referring to FIG. 2, an example of the network of chambers 230 of the cooling structure 211 will be described in more detail. FIG. 2 is a three-dimensional view of the coolant flowing in a first example of a network of chambers that can be used in the cooling structure of FIG. 1.

[0041] In the example shown, the chamber 230 is disposed between four layers L1, L2, L3, L4 stacked in the vertical direction V.

[0042] The chambers 230 of each layer L 1-4 are aligned on lines parallel to the general direction of the general or main flow F (in the example shown, five lines LN1, LN2, LN3, LN4, LN5 for each layer L 1-4 ). In the example described, each line LN 1-5 comprises the same chamber (two in the example described) and, for example, to adjust the distance between the general inlet chamber 226 and the general outlet chamber 228 of the cooling structure 211, two chambers with their tips cut off at the two tips of the line LN 1-5 around the complete chamber. The chambers with their tips cut off are, for example, the same as the complete chamber except that their tips are cut off.

[0043] The chambers 230 of each layer L 1-5 are separated within those layers so that the coolant must pass through at least one chamber 230 of another layer L 1-4 to flow between two consecutive chambers 230 of the line LN 1-4 . To allow the flow of coolant between the chambers 230 of different layers L 1-4 , each chamber 230 is connected to at least one chamber 230 of an adjacent layer L 1-4It overlaps with the chamber 230 (upper layer and / or lower layer). Preferably, line LN 1-5 Both of the two consecutive chambers 230 in this structure are adjacent to each other in layer L 1-4 The same chamber 230 overlaps. The overlap between the two chambers 230 in adjacent layers forms a coolant opening that allows coolant communication between these two chambers. Thus, the opening forms a local coolant inlet with respect to one of the chambers 230 and a local coolant outlet with respect to the other chamber.

[0044] Furthermore, each line LN 1-5 The chamber 230, with its tip cut off at the front, comprises a local inlet having a general inlet chamber 226 or a local outlet having an outlet chamber 228. In this way, each chamber 230 includes at least one pair of coolant openings (one local inlet and one local outlet).

[0045] Each complete chamber 230 has the shape of a tube (having a rectangular cross-section in the example described) and comprises at least one meandering structure M along the direction of the coarse flow or main flow F. In the example described, each complete chamber 230 comprises three consecutive meandering structures: two meandering structures have first curves M1, M3; M'1, M'3, M'5, M'7 are around the vertical direction V, and between them, further meandering structures M'2, M'4, M'6, M'8 are around the vertical direction V, opposite to the first curves.

[0046] In the example described, one layer L 1-4 The complete chamber 230 is next to the layer L (i.e., with respect to the plane parallel to the vertical direction V and the flow direction F). 1-4 This is a vertical mirror image of the complete chamber 230.

[0047] Figure 3 shows two consecutive layers L 1-4 The complete chamber 230 is shown from above by a simple line and a dashed line, respectively. Complete chamber 230A The other adjacent chambers 230 B and 230 C This overlaps with Chamber 230. A Regarding Chamber 230 B The overlaps forming the local inlet from are mentioned in I1 and I2, and chamber 230 C The overlaps that form the local exit points are mentioned in O1 and O2.

[0048] As you can see, curved section M 1-2 This blocks all direct flow paths (i.e., straight lines) from the local inlet I1 to the local outlet O1. Curved section M 1-3 This blocks all direct flow paths from the local inlet I1 to the local outlet O2. Curved section M 1-3 This blocks all direct flow paths from the local inlet I2 to the local outlet O2. In this way, the coolant flowing from the local inlet I1 to the local outlet O1, from the local inlet I1 to the local outlet O2, and from the local inlet I2 to the local outlet O2 is blocked by at least some of the meandering structures, and in particular by their curved portions M 1-3 This contact increases heat transfer between the cooling structure 211 and the coolant.

[0049] Two chambers in two adjacent layers, for example, chamber 230 A and 230 B The two chambers overlap each other, and this overlap forms an opening in both chambers (e.g., opening I1). The two chambers preferably have two coolant flow directions (arrow F) in their overlap (i.e., opening I1). A and F B ) has a wall that defines the direction of coolant flow (arrow F) for each of the two coolant flow directions. A and F B ) form an angle α which is between 30° and 90°, preferably 45° and 90°. In this way, a collision flow can be obtained. For example, chamber 230 BThe coolant coming from chamber 230 passes through opening I1. A When entering, at least partially chamber 230 A It collides with wall W at an angle α. Therefore, wall W forms a collision wall.

[0050] Another example of the arrangement of chamber 230 is shown in Figure 4. In this example, each complete chamber 230 contains a total of seven meandering structures, and adjacent layers L of the lower and / or upper layers. 1-4 It overlaps with two consecutive, aligned chambers 230.

[0051] Referring to Figure 5, 230' A One of the complete chambers in Figure 4, as mentioned by [reference], is described in detail.

[0052] Complete Chamber 230' A For example, it comprises a serpentine structure having four curved sections M'1, M'3, M'5, and M'7 having a first curved section around a vertical direction V, and a serpentine structure M between them having four curved sections M'2, M'4, M'6, and M'8 having opposite curved sections around a vertical direction V. Complete chamber 230' A This consists of two consecutive, aligned chambers 230' in adjacent lower or upper layers. B , 230' C This overlaps with the 230' chamber. A In the chamber 230' B Six local inlet sections I'1, I'2, I'3, I'4, I'5, I'6 and chamber 230' c Four local exit points O'1, O'2, O'3, and O'4 are defined.

[0053] As shown in the diagram, local entrance section I' 1-6 From either of the local exit sections O' 1-4 Any direct road leading to any of these locations, except for the local entrance section I'6 and local exit section O'1 where the direct road exists, will be subject to the meandering section M' 1-8 It is blocked by at least some of them.

[0054] Refer to Figure 6 to illustrate another example of the chamber 230 network. Figure 6 shows only the complete chamber.

[0055] The complete chamber 230 is the same as that in Figure 3, and in particular it has three meandering sections M 1-3 This includes, however, that each complete chamber 230 is arranged differently so that it not only overlaps with two consecutive chambers (on the same line) in an adjacent layer, but also with at least one chamber in that adjacent layer located on the adjacent line.

[0056] For example, a complete chamber 230” A The adjacent chamber 230” B , 230” C , 230” D , 230” E Overlapping with the first line LN"1" aligned continuous chamber 230" B and 230” C , and also, two aligned continuous chambers 230" of line LN"2 adjacent to line LN"1" D and 230” E Includes.

[0057] Thus, in the example described, chamber 230” A The chamber is 230" B Two local inlet sections I"1", I"3", and chamber 230" D One local inlet section I"2 from, as well as chamber 230" C Two local outlets O"1", O"3", and chamber 230" E It includes one local exit section O"2 to the terminal.

[0058] As you can see, curved section M 1-3 At least some of them are local entrances I"3 and local exits O"1, with the exception of local entrances I" 1-3Either of the local exit section O” 1-3 Blocks all direct paths between any of the following:

[0059] Referring to Figure 7, in some embodiments, a common cooling structure 211 according to the invention is used to cool multiple power modules 2021, 2022, and 2023. A The following can be used. In Figure 7, the cooling structure 211 A is flow F A Following the direction, power module 202 1-3 It is cooled from above. Cooling structure 211 A The chamber may be arranged in any of the above-described configurations, or in any other configuration. Cooling structure 211 A The chamber is the general inlet chamber 226 A From the general outlet chamber 228 A They extend to the general coolant inlet 216 and general coolant outlet 218 of the cooling channel 212, respectively.

[0060] Furthermore, two cooling channels, each provided with two cooling structures, may be located on both sides of one or more power modules for the side coolers. The two cooling structures may be connected to the same coolant inlet and coolant outlet. For example, in Figure 7, cooling structure 211 A Another cooling structure (not visible) similar to that of power module 202 1-3 It is provided to cool from below. Preferably, the flow directions of the two cooling structures are opposite to each other. In the example described, the chamber of the lower cooling structure is the general inlet chamber 226 B From the general outlet chamber 228 B It extends to the general coolant inlet 216 and the general coolant outlet 218, respectively.

[0061] Next, with reference to Figure 8, an example of a vehicle 100 in which the invention can be carried out will be described. In the example described, vehicle 100 is an automobile vehicle.

[0062] The vehicle 100 comprises wheels 102 for moving the vehicle 100 by friction on the ground (e.g., a road), and an electric drive unit 104 configured to drive at least one of the wheels 102 at least indirectly. The vehicle 100 further comprises a DC voltage source 106, such as a battery, for supplying power to the electric drive unit 104. The DC voltage source 106 is configured to supply a DC voltage E.

[0063] The electric drive unit 104 includes an electric motor 108 and an inverter 110 configured to drive the electric motor 108, for example, by supplying power. For example, the electric motor 108 is a rotary motor having stator phases. In the example described, the electric motor 108 is a three-phase motor having three stator phases.

[0064] Inverter 110 receives DC voltage E from input terminal IT + IT - As present, input terminal IT is connected to DC voltage source 106. + IT - It is equipped with the following. For more details, see the input terminal IT. + IT - This is the positive input terminal IT connected to the positive terminal of the DC voltage source 106. + The negative input terminal IT is connected to the negative terminal of the DC voltage source 106 and the electrical ground GND. - This includes.

[0065] The inverter 110 further comprises an output terminal OT connected to the motor 108. An AC voltage is intended to be present at the output terminal OT in order to supply power to the motor 108. The AC voltage may be a single-phase AC voltage or a multi-phase AC voltage. In the example described, where the motor 108 is a three-phase motor, the AC voltage is a three-phase AC voltage.

[0066] Inverter 110 has an input terminal IT + , IT - and further includes controllable switches Q, Q' called main switches connected to the output terminal OT. The main switches Q, Q' are semiconductor switches having, for example, transistors. Each of the main switches Q, Q' includes, for example, one of a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), and a silicon carbide MOSFET (SiC MOSFET). These switches Q, Q' correspond to, for example, the semiconductor power component 208 in FIG. 1.

[0067] In the example described, the inverter 110 includes switch legs 114 1-3 respectively associated with the stator phases of the electric motor 108. 1-3 Each switch leg 114 + includes a high-side (HS) main switch Q' connected to the positive input terminal IT - and a low-side (LS) main switch Q connected to the negative input terminal IT. The HS main switch Q' and the LS main switch Q are connected to each other at an intermediate point connected to the output terminal OT connected to the associated stator phase of the electric motor 108.

[0068] Each switch leg 114 1-3 is intended to be controlled to switch between two configurations. In a first one called the high-side (HS) configuration, the HS main switch Q' is closed (on) and the LS main switch Q is opened (off) so that a DC voltage E is substantially applied to the associated stator phase. In a second one called the low-side (LS) configuration, the HS main switch Q' is opened (off) and the LS main switch Q is closed (on) so that a zero voltage is basically applied to the associated stator phase.

[0069] The inverter 110 further comprises a control device 116, which is configured to control the main switches Q and Q' so that they convert a DC voltage E to an AC voltage. In the example described, the control device 116 is configured to switch each switch leg 114 between the two configurations described above.

[0070] The power module 202 includes, for example, the switch leg 114 1-3 one or all of the switch legs 114 1-3 It is possible to implement this.

[0071] It should be noted that the invention is not limited to the embodiments described above. It will certainly be apparent to those skilled in the art that various modifications can be made to the embodiments described above in light of the teachings disclosed.

[0072] In particular, the layers may be different (for example, the shape of the chamber in one layer may be different from the shape of the chamber in another layer). Furthermore, the curved sections may be asymmetrical, for example, having different curvatures. The meandering sections may also be "V" shaped, that is, by two planar walls joined to each other at a certain angle.

[0073] In the detailed descriptions of the inventions used herein, the terms used should not be interpreted as limiting the invention to the embodiments presented herein, but rather as encompassing all equivalents that are within the realm of understanding for a person skilled in the art, by applying the general knowledge of a person skilled in the art to the practice of the disclosed teachings.

Claims

1. A plurality of layers (L A-C , 1-3 , 1-6 , 1-2 , A-E , A-C , A-C , 1-3 , 1-4 , 1-2 , A-E ), and a network of local chambers (230; 230 1-4 ; 230' A-C ; 230'' A-C ; 230'' A-E ) distributed between the plurality of layers (L A-C ; 230' A-C ; 230'' A-E ) stacked on top of each other along the stacking direction (V), wherein each local chamber (230; 230 1-2 ; 230' 1-2 ; 230'' 1-6 ; 230'' 1-4 ; 230'' 1-3 ; 230'' 1-3 ) includes at least two openings (I 1-4 ), O A-C ; I' A-C ; O' A-E ; I'' A-C ; O'' A-C ; O'' A-E ), and at least one of the at least two openings communicates with a local chamber (230; 230 1-2 ; 230' 1-2 ; 230'' 1-6 ; 230'' 1-4 ; 230'' 1-3 ; 230'' 1-3 ) of another layer of the layer (L A-C ; 230' A-C [[ID=�8]]; 230'' [[ID=�9]] A-E ), and each local chamber (230; 230 A-C ; 230' A-C ; 230'' A-E ) has one or more meandering structures (M) that block the direct path in the local chamber (230; 230 A-C ; 230' A-C ; 230'' A-E ) between the two openings (I 1-2 ), O 1-2 ; I' 1-6 [[ID=7�]]; O' 1-4 ; I'' 1-3 ; O'' 1-3 ; O'' A-C ; 230' A-C ; 230'' A-E A cooling structure (211) in which the local chambers (230; 230 A-C; 230' A-C; 230” A-E) of each layer (L 1-4) are separated from each other within their respective layers (L 1-4) and are thereby connected to each other only through at least one local chamber (230; 230 A-C; 230' A-C; 230” A-E) of the other layers.

2. Each meandering structure (M) has a curved portion (M) that curves with respect to the stacking direction (V). 1-3 ;M' 1-8 The cooling structure (211) according to claim 1, having and / or each of the following:

3. Each meandering structure (M) has a first curved section (M 1 M 3 ;M' 1 , M' 3 , M' 5 , M' 7 ) and the first curved portion (M 1 M 3 ;M' 1 , M' 3 , M' 5 , M' 7 ) the opposite or different second curved section (M 2 ;M' 2 , M' 4 , M' 6 , M' 8 The cooling structure (211) according to claim 1, which includes )

4. Each layer (L 1-4 ) local chamber (230; 230 A-C ;230' A-C ;230” A-E The cooling structure (211) according to claim 1, which includes the same local chamber.

5. One layer (L 1-4 ) at least some local chambers (230; 230 A-C ;230' A-C ;230” A-E ) is adjacent to the L layer 1-4 ) at least some local chambers (230; 230 A-C ;230' A-C ;230” A-E The cooling structure (211) according to claim 1 is a mirror image of the above.

6. The layer (L 1-4 The plate (232) comprises stacked plates (232) each forming the corresponding layer (L 1-4 ) the local chamber (230; 230 A-C ;230' A-C ;230” A-E The cooling structure (211) according to claim 1, including holes that define each of the following.

7. - Main body and, A power module (202) comprising a cooling structure (211) according to any one of claims 1 to 6, which is fixed to the main body.

8. A power converter, - The power module (202) described in claim 7, - A cooling channel (212) configured to cool the power module at least indirectly by the cooling structure, A power converter equipped with the following features.

9. The power converter according to claim 8, wherein the cooling channel (21) includes a cavity (214) having an open side (215), and the cooling channel (212) is fixed to the power module (202) such that the side of the main body including the cooling structure (211) closes the open side (215), and the cooling structure (211) is received in the cavity (214).

Citation Information

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