Electronic component manufacturing equipment

Abstract

To reduce chips that are not peeled off from an adhesive sheet.SOLUTION: A support mechanism 2 supports an adhesive sheet 10 having a front face that adhesively holds a plurality of chips 20 to be material of a plurality of electric parts. A facing member 3 is arranged facing a rear face of the adhesive sheet 10. A nozzle 4 blows air between the adhesive sheet 10 supported by the support mechanism 2 and the facing member 3. The nozzle 4 blows air between the adhesive sheet 10 and the facing member 3, resulting in vibration of the adhesive sheet 10, and the plurality of chips 20 are detached from the adhesive sheet 10.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a manufacturing apparatus for electronic components.

Background Art

[0002] As a prior art document that discloses the configuration of an external electrode forming apparatus for chip-shaped electronic components, there is Japanese Patent Application Laid-Open No. 2007-266208 (Patent Document 1). In the external electrode forming apparatus described in Patent Document 1, without applying an external force to a chip-shaped element attached to an adhesive material containing a plastically deformable thermally foaming adhesive, the adhesive material is heated to non-contact peel the chip-shaped element from the adhesive material.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the adhesive material plastically deforms to hold the chip, even if the adhesive material is heated and foamed, there will be chips that do not peel off from the adhesive material.

[0005] The present invention has been made in view of the above problems, and an object thereof is to provide a manufacturing apparatus for electronic components that can reduce chips that do not peel off from an adhesive sheet.

Means for Solving the Problems

[0006] An electronic component manufacturing apparatus according to the present invention comprises a support mechanism, an opposing member, and a nozzle. The support mechanism supports an adhesive sheet on which multiple chips, which are materials for multiple electronic components, are adheringly held on its surface. The opposing member is positioned opposite the back surface of the adhesive sheet. The nozzle blows air between the adhesive sheet supported by the support mechanism and the opposing member. By blowing air between the adhesive sheet and the opposing member, the nozzle vibrates the adhesive sheet, causing the multiple chips to detach from the adhesive sheet. [Effects of the Invention]

[0007] According to the present invention, the number of chips that do not peel off the adhesive sheet can be reduced. [Brief explanation of the drawing]

[0008] [Figure 1] This is a flowchart illustrating the manufacturing method of electronic components. [Figure 2] This is a perspective view showing the configuration of a manufacturing apparatus for electronic components related to one embodiment of the present invention. [Figure 3] Figure 2 is a plan view of the electronic component manufacturing apparatus as seen from the direction of arrow III. [Figure 4] Figure 3 is a side view of the electronic component manufacturing apparatus as seen from the direction of arrow IV. [Figure 5] This is a perspective view showing the state when a functional sheet is attached to the chip. [Figure 6] This is a perspective view showing the chip with a functional sheet attached. [Modes for carrying out the invention]

[0009] Hereinafter, an electronic component manufacturing apparatus according to one embodiment of the present invention will be described with reference to the figures. In the following description of the embodiment, the same or corresponding parts in the figures will be denoted by the same reference numerals, and their descriptions will not be repeated.

[0010] The following description of an electronic component manufacturing apparatus according to one embodiment of the present invention will be explained with reference to the figures. Figure 1 is a flowchart showing the manufacturing method of an electronic component. In the following description of the manufacturing method of an electronic component, the manufacturing method of a multilayer ceramic capacitor will be described, but the electronic component is not limited to a multilayer ceramic capacitor, and may also be a multilayer ceramic coil, or any electronic component manufactured from a chip.

[0011] As shown in Figure 1, when manufacturing a multilayer ceramic capacitor, a ceramic dielectric slurry is first prepared (step S1). Specifically, ceramic dielectric powder, additive powder, binder resin, and dissolving solution are dispersed and mixed to prepare the ceramic dielectric slurry. The ceramic dielectric powder is, for example, perovskite structure dielectric particles such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder consists of, for example, at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. As the binder resin, polyurethane resin, urea resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin, or aqueous polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These may be used individually or in mixtures of two or more. The ceramic dielectric slurry may be solvent-based or aqueous-based. When using a ceramic dielectric slurry as a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and dispersant with dielectric raw materials dissolved in water.

[0012] Next, a ceramic dielectric sheet is formed (step S2). Specifically, a ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, or microgravure coater, and then dried to form a ceramic dielectric sheet. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.2 μm to 10 μm.

[0013] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet in a predetermined pattern, thereby forming a mother sheet on which a predetermined internal electrode pattern is provided. The conductive paste contains Ni powder, a solvent, a dispersant, and a binder, and is prepared to have a constant viscosity. Polyvinyl butyral (PVB) or polyvinyl alcohol (PVA) can be used as the binder. Screen printing, inkjet printing, or gravure printing can be used as the application method for the conductive paste. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.2 μm to 10 μm. In addition to the mother sheet having the internal electrode pattern, a ceramic dielectric sheet that has not undergone step S3 is also prepared.

[0014] Next, multiple mother sheets are stacked (step S4). Specifically, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked so that, for example, the thickness is between 0.5 μm and 5 μm. On top of that, a predetermined number of mother sheets with an internal electrode pattern are stacked. The number of stacked mother sheets with an internal electrode pattern is, for example, between 5 and 1500. Furthermore, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked on top of that so that, for example, the thickness is between 0.5 μm and 10 μm. This constitutes a group of mother sheets.

[0015] Next, a dielectric block is formed by pressing the mother sheet group (step S5). Specifically, the mother sheet group is pressed and adhered in the stacking direction by a hydrostatic press or a rigid press, thereby forming a dielectric block. At this time, when the ceramic dielectric sheet is pressed at a predetermined temperature, the ceramic dielectric sheets adhere to each other. Also, by disposing and pressing a ceramic dielectric sheet of a certain thickness on the outermost layer in the stacking direction, the dielectric sheet having the internal electrode pattern formed thereon can be protected.

[0016] Next, the dielectric block is attached to the adhesive sheet (step S6). The adhesive sheet has an adhesive layer on the front surface and a base material layer on the back surface. The adhesive sheet may be one in which the surface area of the adhesive layer increases and the adhesive layer loses its adhesive holding force. The adhesive sheet may be a long sheet. The maximum dimension of the thickness of the adhesive sheet in a state where the adhesive holding force has been lost is preferably 0.2 mm or more and 0.5 mm or less.

[0017] Next, the dielectric block adhesively held on the adhesive sheet is divided to form chips (step S7). Specifically, the dielectric block is divided into a matrix shape by die cutting, dicing or laser cutting, and is separated into a plurality of chips. By step S7, an adhesive sheet adhesively held on the surface with a plurality of chips arranged in proximity is prepared. The internal electrodes are exposed on the side surfaces of each of the plurality of chips.

[0018] Next, the chips are detached from the adhesive sheet (step S8). Here, the configuration of the manufacturing apparatus for an electronic component according to an embodiment of the present invention used when detaching the chips from the adhesive sheet will be described. FIG. 2 is a perspective view showing the configuration of the manufacturing apparatus for an electronic component according to an embodiment of the present invention. FIG. 3 is a plan view of the manufacturing apparatus for an electronic component of FIG. 2 as viewed from the direction of arrow III. FIG. 4 is a side view of the manufacturing apparatus for an electronic component of FIG. 3 as viewed from the direction of arrow IV.

[0019] As shown in FIGS. 2 to 4, a manufacturing apparatus 1 for electronic components according to an embodiment of the present invention includes a support mechanism 2, an opposing member 3, and a nozzle 4. The support mechanism 2 supports an adhesive sheet 10 on which a plurality of chips, which are materials for a plurality of electronic components, are adhesively held on the surface. The adhesive sheet 10 is caused to lose its adhesive holding force while being supported by the support mechanism 2. The support mechanism 2 supports the adhesive sheet 10 by any one of a vacuum suction method, an electrostatic adsorption method, an adhesion method, or a mechanical method. In the present embodiment, the support mechanism 2 supports the adhesive sheet 10 so that a certain tension is applied to the adhesive sheet 10. Below the adhesive sheet 10, a box 5 for collecting the plurality of chips 20 detached from the adhesive sheet 10 is arranged. The box 5 is preferably made of resin so that the chips 20 are not damaged.

[0020] The opposing member 3 is arranged so as to face the back surface of the adhesive sheet 10. In the present embodiment, the surface of the opposing member 3 that faces the back surface of the adhesive sheet 10 is a rectangular flat plate. The area of the surface of the opposing member 3 that faces the back surface of the adhesive sheet 10 is, for example, 0.01 m 2 or more and 0.5 m 2 or less. However, the shape of the opposing member 3 is not limited to a rectangular flat plate, and the surface facing the back surface of the adhesive sheet 10 may be a circular flat plate. In this case, the diameter of the surface facing the back surface of the adhesive sheet 10 is, for example, 3 cm or more and 100 cm or less.

[0021] When viewed from a direction orthogonal to the back surface of the adhesive sheet 10, it is preferable that at least a part of the opposing member 3 is arranged so as to overlap with the region of the adhesive sheet 10 where the plurality of chips 20 are adhesively held, and it is more preferable that the entire opposing member 3 is arranged so as to overlap with the region of the adhesive sheet 10 where the plurality of chips 20 are adhesively held.

[0022] The area of the region where the opposing member 3 is projected onto the adhesive sheet 10 in a direction orthogonal to the back surface of the adhesive sheet 10 may be smaller than, the same as, or larger than the area of the region of the adhesive sheet 10 where the plurality of chips 20 are adhesively held.

[0023] The shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3 shown in Figure 4 is preferably 0 mm or more and 3 mm or less. The corners and edges of the side of the opposing member 3 that faces the back surface of the adhesive sheet 10 are preferably rounded. The opposing member 3 is fixed to a support part (not shown).

[0024] The nozzle 4 blows air between the adhesive sheet 10, which is supported by the support mechanism 2, and the opposing member 3. In this embodiment, three pairs of nozzles 4 are arranged symmetrically with respect to the longitudinal center of the opposing member 3 when viewed from a direction perpendicular to the back surface of the adhesive sheet 10. Note that the number of nozzles 4 arranged is not limited to six, but can be one or more. As shown in Figure 4, the inclination angle θ of the nozzle 4 with respect to the back surface of the adhesive sheet 10 is preferably 1° to 45°, and more preferably 16° to 45° from the viewpoint of suppressing interference between the nozzle 4 and the adhesive sheet 10. The shortest distance from the tip of the nozzle 4 to the back surface of the adhesive sheet 10 is preferably 3 mm to 20 mm. The nozzle 4 is connected to a supply source that supplies air. The pressure of the air supplied from the supply source to the nozzle 4 is preferably 0.3 MPa to 1 MPa.

[0025] Here, the operation of the electronic component manufacturing apparatus 1 will be described. First, the adhesive sheet 10 supported by the support mechanism 2 is heated or cooled until it exceeds a threshold temperature, causing it to lose its adhesive holding power. Even when the adhesive sheet 10 has lost its adhesive holding power, some of the multiple chips 20 still remain held by the adhesive sheet 10.

[0026] Next, as shown in Figure 4, with the adhesive sheet 10, which has lost its adhesive holding power, supported by the support mechanism 2, the nozzle 4 blows air between the adhesive sheet 10 and the opposing member 3, causing the adhesive sheet 10 to vibrate and detach the multiple chips 20 from it. Specifically, the convection of the air blown between the adhesive sheet 10 and the opposing member 3 causes the adhesive sheet 10 to vibrate vertically. This vibration detaches the chips 20 that were held by the adhesive sheet 10. The multiple chips 20 detached from the adhesive sheet 10 are collected in the box 10.

[0027] Next, a functional sheet is attached to the recovered chip 20. Figure 5 is a perspective view showing the state when the functional sheet is attached to the chip. Figure 6 is a perspective view showing the state after the functional sheet has been attached to the chip. As shown in Figures 5 and 6, the chip 20 has one surface 21 and the other surface 22. Paste 31 is applied to the surface 21. The paste 31 is conductive or adhesive.

[0028] With one side 21 of the chip 20 and the main surface 30S of the functional sheet 30 facing each other, the chip 20 is pressed against the functional sheet 30 from the other side 22, thereby adhering the functional sheet 30 to one side 21 of the chip 20. The functional sheet 30 is, for example, a conductive sheet. After this, the paste 31 and the functional sheet 30 are allowed to dry. Similarly, paste 31 is applied to the other side 22, the functional sheet 30 is attached, and then it is allowed to dry.

[0029] As shown in Figure 1, the chip is then fired (step S11). Specifically, the chip is heated, which causes the dielectric material and conductive material contained in the chip to be fired, forming a laminate. The firing temperature is set appropriately according to the dielectric material and conductive material.

[0030] Next, external electrodes are formed (step S12). For example, by applying Ni plating and Sn plating to the laminate in that order to form a plating layer, external electrodes are formed on the outer surface of the laminate.

[0031] By following the series of steps described above, multilayer ceramic capacitors can be manufactured.

[0032] (Example of experiment) The following describes the experimental results of chip detachment tests from adhesive sheets, conducted by changing each parameter.

[0033] [Table 1]

[0034] [Table 2]

[0035] Table 1 summarizes the basic parameters. Table 2 summarizes the parameters that were changed from the basic parameters in Experimental Examples 1 to 4. In each of Experimental Examples 1 to 4, the parameters shown in Table 1 were used, except for the parameters that were changed as shown in Table 2.

[0036] As shown in Table 2, in Experimental Example 1, a detachment test was conducted by varying the maximum thickness of the adhesive sheet 10 in a state where the adhesive holding power had been lost, and it was visually confirmed whether all the chips 20 had detached from the adhesive sheet 10. As a result, when the maximum thickness of the adhesive sheet 10 in a state where the adhesive holding power had been lost was between 0.2 mm and 0.5 mm, it was confirmed that all the chips 20 had detached from the adhesive sheet 10. When the maximum thickness of the adhesive sheet 10 in a state where the adhesive holding power had been lost was 0.1 mm, the adhesive sheet 10 tore or vibrated excessively, and damage to the chips 20 was observed. When the maximum thickness of the adhesive sheet 10 in a state where the adhesive holding power had been lost was 0.6 mm, the vibration of the adhesive sheet 10 weakened, and some chips 20 that did not detach from the adhesive sheet 10 were observed.

[0037] In Experimental Example 2, a detachment test was conducted by changing the inclination angle θ of the nozzle 4 relative to the back surface of the adhesive sheet 10, and it was visually confirmed whether all the tips 20 had detached from the adhesive sheet 10. As a result, it was confirmed that all the tips 20 had detached from the adhesive sheet 10 when the inclination angle θ of the nozzle 4 relative to the back surface of the adhesive sheet 10 was between 1° and 45°. When the inclination angle θ of the nozzle 4 relative to the back surface of the adhesive sheet 10 was 0°, the experiment could not be conducted due to interference between the nozzle 4 and the adhesive sheet 10. When the inclination angle θ of the nozzle 4 relative to the back surface of the adhesive sheet 10 was 50°, the vibration of the adhesive sheet 10 weakened, and some tips 20 were observed not to detach from the adhesive sheet 10.

[0038] In Experimental Example 3, a detachment test was conducted by varying the pressure of the air supplied to the nozzle 4, and it was visually confirmed whether all the tips 20 had detached from the adhesive sheet 10. As a result, it was confirmed that all the tips 20 had detached from the adhesive sheet 10 when the air pressure supplied to the nozzle 4 was between 0.3 MPa and 1 MPa. When the air pressure supplied to the nozzle 4 was 0.2 MPa, the vibration of the adhesive sheet 10 weakened, and some tips 20 were observed not to detach from the adhesive sheet 10. When the air pressure supplied to the nozzle 4 was 1.1 MPa, the adhesive sheet 10 tore or vibrated excessively, and damage to the tips 20 was observed.

[0039] In Experimental Example 4, a detachment test was conducted by varying the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3, and it was visually confirmed whether all the chips 20 had detached from the adhesive sheet 10. As a result, it was confirmed that all the chips 20 had detached from the adhesive sheet 10 when the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3 was between 0 mm and 3 mm. Even when the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3 was 0 mm, it was possible to introduce air from the nozzle 4 between the back surface of the adhesive sheet 10 and the opposing member 3, and it was confirmed that all the chips 20 had detached from the adhesive sheet 10. When the shortest distance L between the back surface of the adhesive sheet 10 and the opposing member 3 was 4 mm, the vibration of the adhesive sheet 10 weakened, and some chips 20 that did not detach from the adhesive sheet 10 were observed.

[0040] From the experimental results described above, it was confirmed that by blowing air between the adhesive sheet 10, which has lost its adhesive holding power, and the opposing member 3 using the nozzle 4, the adhesive sheet 10 is vibrated, causing multiple chips 20 to detach from the adhesive sheet 10, thereby reducing the number of chips 20 that do not detach from the adhesive sheet 10.

[0041] (Note) Those skilled in the art will understand that the exemplary embodiments described above are specific examples of the following embodiments.

[0042] <1> A support mechanism that supports an adhesive sheet on which multiple chips, which are materials for multiple electronic components, are held in place by adhesive adhesion on the surface, An opposing member is positioned so as to face the back surface of the adhesive sheet, The support mechanism includes a nozzle for blowing air between the adhesive sheet and the opposing member, An electronic component manufacturing apparatus that causes the adhesive sheet to vibrate and detach the plurality of chips from the adhesive sheet by blowing air between the adhesive sheet and the opposing member using the nozzle.

[0043] <2> The shortest distance between the adhesive sheet supported by the support mechanism and the opposing member is 0 mm or more and 3 mm or less. <1> Manufacturing equipment for the electronic components described above.

[0044] <3> The pressure of the air supplied to the nozzle is between 0.3 MPa and 1 MPa. <1> or <2> Manufacturing equipment for the electronic components described above.

[0045] <4> The inclination angle of the nozzle with respect to the back surface of the adhesive sheet is 1° or more and 45° or less. <1> from <3> A manufacturing apparatus for electronic components as described in any one of the following.

[0046] <5> The maximum thickness of the adhesive sheet in a state where its adhesive holding power has been lost is 0.2 mm or more and 0.5 mm or less. <1> from <4> A manufacturing apparatus for electronic components as described in any one of the following.

[0047] In the description of the embodiments described above, the combinable configurations may be combined with each other.

[0048] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the invention is indicated by the claims rather than by the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended. [Explanation of Symbols]

[0049] 1 Manufacturing equipment, 2 Support mechanism, 3 Opposing member, 4 Nozzle, 5 Box, 10 Adhesive sheet, 20 Chip, 21 One side, 22 Other side, 30 Functional sheet, 30S Main surface, 31 Paste.

Claims

1. A support mechanism that supports an adhesive sheet on which multiple chips, which are materials for multiple electronic components, are held in place by adhesive adhesion on the surface, An opposing member is positioned so as to face the back surface of the adhesive sheet, The support mechanism includes a nozzle for blowing air between the adhesive sheet and the opposing member, An electronic component manufacturing apparatus that causes the adhesive sheet to vibrate and detach the plurality of chips from the adhesive sheet by blowing air between the adhesive sheet and the opposing member using the nozzle.

2. The apparatus for manufacturing electronic components according to claim 1, wherein the shortest distance between the adhesive sheet supported by the support mechanism and the opposing member is 0 mm or more and 3 mm or less.

3. The electronic component manufacturing apparatus according to claim 1, wherein the pressure of the air supplied to the nozzle is 0.3 MPa or more and 1 MPa or less.

4. The electronic component manufacturing apparatus according to claim 1, wherein the inclination angle of the nozzle with respect to the back surface of the adhesive sheet is 1° or more and 45° or less.

5. The electronic component manufacturing apparatus according to claim 1, wherein the maximum thickness of the adhesive sheet in a state where its adhesive holding power has been lost is 0.2 mm or more and 0.5 mm or less.

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