Component mounting apparatus and component mounting method

Abstract

To provide component mounting equipment capable of efficiently mounting a component even on a small board and a component mounting method.SOLUTION: The component mounting equipment includes: a first board detection sensor S1 that detects a board at a small board stop position E2 upstream than a stop position E1; and a second board detection sensor S2 that detects the board at the stop position E1. The component mounting method includes: a step of transporting a board with a transport belt 12 and stopping at the stop position E1; and a step of mounting the component to the stopped board. When transporting a small board 3S whose size in the transport direction is smaller than the board, the small board 3S is stopped at a small board stop position E2 upstream of the stop position E1.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a component mounting apparatus and a component mounting method for transporting a substrate and mounting components thereon.

Background Art

[0002] A component mounting apparatus transports a substrate to a stop position by a conveyor belt of a substrate transport unit, picks up a component from a component supply unit by a mounting head, images the component held by the mounting head with a camera disposed between the component supply unit and the substrate transport unit, corrects the position of the mounting head, and mounts the component on the substrate at the stop position (see, for example, Patent Document 1). The component mounting apparatus described in Patent Document 1 includes a first substrate detection sensor that detects the leading end of the substrate at the stop position and a second substrate detection sensor that detects the leading end of the substrate that has overridden from the stop position, and controls the substrate transport unit based on the detection results of these two substrate detection sensors, thereby accurately positioning the substrate at the stop position.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the prior art including Patent Document 1 always positions the leading end of the substrate at the stop position set in the substrate transport unit, and the positional relationship between the camera and the stop position is fixed. Therefore, when positioning a small substrate with a small size at the stop position, the movement path of the mounting head that moves to the small substrate at the stop position via the camera becomes unnecessarily long, and the efficiency of the component mounting operation may decrease, and there is room for further improvement.

[0005] Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of efficiently mounting components even on a small substrate. [Means for solving the problem]

[0006] The component mounting apparatus of the present invention comprises: a belt drive unit for driving a conveyor belt; a substrate transport unit for transporting a substrate on which components are mounted by the conveyor belt and stopping it at a predetermined stop position; a first substrate detection sensor provided upstream of the stop position for detecting the substrate at the upstream position; a second substrate detection sensor for detecting the substrate at the stop position; and a control unit that controls the belt drive unit based on the detection results of the first and second substrate detection sensors to stop the substrate at the stop position. The control unit controls the belt drive unit based on the detection result of the first substrate detection sensor to stop the small substrate at the upstream position when transporting a small substrate smaller in size in the transport direction than the substrate. Furthermore, the system includes a mounting head that takes components from a component supply unit and mounts the components onto the substrate or sub-substrate stopped in the substrate transport unit, and a recognition unit positioned between the component supply unit and the substrate transport unit that recognizes the components held by the mounting head, wherein the first substrate detection sensor is provided closer to the recognition unit than the second substrate detection sensor. . Furthermore, another component mounting apparatus of the present invention includes a belt drive unit that drives a transport belt, a substrate transport unit that transports a substrate on which components are mounted by the transport belt and stops it at a predetermined stop position, a first substrate detection sensor provided upstream of the stop position and detecting the substrate at the upstream position, a second substrate detection sensor that detects the substrate at the stop position, and a control unit that controls the belt drive unit based on the detection results of the first and second substrate detection sensors and stops the substrate at the stop position, wherein when transporting a small substrate smaller in size in the transport direction than the substrate, the control unit controls the belt drive unit based on the detection result of the first substrate detection sensor and stops the small substrate at the upstream position, and the first substrate detection sensor is movable in the transport direction according to the size of the small substrate in the transport direction. Furthermore, another component mounting apparatus of the present invention includes a belt drive unit that drives a transport belt, a substrate transport unit that transports a substrate on which components are mounted by the transport belt and stops it at a predetermined stop position, a first substrate detection sensor provided upstream of the stop position and detecting the substrate at the upstream position, a second substrate detection sensor that detects the substrate at the stop position, and a control unit that controls the belt drive unit based on the detection results of the first and second substrate detection sensors and stops the substrate at the stop position, wherein when transporting a small substrate smaller in size in the transport direction than the substrate, the control unit controls the belt drive unit based on the detection result of the first substrate detection sensor and stops the small substrate at the upstream position, and further includes a third substrate detection sensor provided upstream of the upstream position and detecting the small substrate, wherein when the third substrate detection sensor detects the small substrate, the control unit controls the belt drive unit to reduce the transport speed of the transport belt.

[0007] The component mounting method of the present invention is A component mounting apparatus comprising: a substrate transport unit having a belt drive unit for driving a transport belt, transporting a substrate on which components are mounted by the transport belt and stopping it at a predetermined stop position; a first substrate detection sensor provided upstream of the stop position for detecting the substrate at the upstream position; a second substrate detection sensor for detecting the substrate at the stop position; and a control unit that controls the belt drive unit based on the detection results of the first and second substrate detection sensors to stop the substrate at the stop position, wherein when transporting a small substrate smaller in size in the transport direction than the substrate, the control unit controls the belt drive unit based on the detection result of the first substrate detection sensor to stop the small substrate at the upstream position; the component mounting apparatus further comprises a third substrate detection sensor provided upstream of the upstream position for detecting the small substrate; and when the third substrate detection sensor detects the small substrate, the control unit controls the belt drive unit to decelerate the transport speed of the transport belt. . [Effects of the Invention]

[0008] According to the present invention, components can be efficiently mounted even on small circuit boards. [Brief explanation of the drawing]

[0009] [Figure 1] Plan view showing the configuration of the main part of a component mounting device according to one embodiment of the present invention. [Figure 2] (a) Plan view (b) Side view of the substrate transport section of a component mounting apparatus according to one embodiment of the present invention [Figure 3] Block diagram showing the configuration of the control system for a component mounting device according to one embodiment of the present invention. [Figure 4] Diagram illustrating the component mounting operation on a large circuit board stopped at a stop position using a component mounting apparatus according to one embodiment of the present invention. [Figure 5]In a component mounting operation on a small circuit board using a component mounting apparatus according to one embodiment of the present invention, (a) an explanatory diagram when the apparatus is stopped at the stop position and (b) an explanatory diagram when the apparatus is stopped at the small circuit board stop position. [Figure 6] Flowchart of a component mounting method using a component mounting apparatus according to one embodiment of the present invention [Figure 7] Flowchart of a large substrate transport method using a component mounting apparatus according to one embodiment of the present invention [Figure 8] Flowchart of a small circuit board transport method using a component mounting apparatus according to one embodiment of the present invention [Modes for carrying out the invention]

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the component mounting device and the substrate transport unit. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 1 and some parts described later, two mutually orthogonal axes in the horizontal plane are shown: the X-axis (left-right direction in Figure 1) in the substrate transport direction and the Y-axis (up-down direction in Figure 1) perpendicular to the substrate transport direction. In Figure 2(b) and some parts described later, the Z-axis (up-down direction in Figure 2(b)) is shown as the height direction perpendicular to the horizontal plane.

[0011] First, the configuration of the component mounting apparatus 1 will be explained with reference to Figure 1. The component mounting apparatus 1 has the function of performing component mounting work to manufacture a mounted board by mounting components supplied from the component supply unit onto a substrate. A substrate transport unit 2 is installed on the upper part of the base 1a along the X axis. The substrate transport unit 2 transports the substrate 3 brought in from upstream along the X axis and positions and holds it at the mounting work position by the mounting head, which will be described below. The substrate transport unit 2 also transports the substrate 3 downstream after the component mounting work is completed.

[0012] A component supply unit 4 is installed on the front side of the substrate transfer unit 2. A plurality of tape feeders 5 are mounted in parallel along the X-axis on the component supply unit 4. The tape feeder 5 supplies components to the component pickup position where the mounting head picks up the components by pitch-feeding a carrier tape formed with pockets for storing components from the outside of the component supply unit 4 in the direction (tape feed direction) toward the substrate transfer unit 2.

[0013] In FIG. 1, Y-axis tables 6 equipped with linear drive mechanisms are arranged at both ends in the X-axis direction on the upper surface of the base 1a. A beam 7 similarly equipped with a linear mechanism is movably coupled along the Y-axis to the Y-axis table 6. A mounting head 8 is movably mounted along the X-axis on the beam 7. A suction nozzle (not shown) for vacuum-sucking and holding components is mounted at the lower end of the mounting head 8.

[0014] The Y-axis table 6 and the beam 7 constitute a mounting head moving mechanism 9 for moving the mounting head 8 in the horizontal direction (X-axis direction, Y-axis direction). The mounting head moving mechanism 9 and the mounting head 8 repeatedly execute a series of turns of a component mounting operation in which components are taken out from the component pickup position of the tape feeder 5 mounted on the component supply unit 4 by the suction nozzle and transferred to the mounting position of the substrate 3 held stopped on the substrate transfer unit 2 for mounting.

[0015] In FIG. 1, a head camera 10 located on the lower surface side of the beam 7 and moving integrally with the mounting head 8 is mounted on the mounting head 8. When the mounting head 8 moves, the head camera 10 moves above the substrate 3 positioned at the mounting operation position of the substrate transfer unit 2 and images the substrate mark 3a provided on the substrate 3 to recognize the position of the substrate 3.

[0016] A component recognition camera 11 is installed between the component supply unit 4 and the substrate transfer unit 2. When the mounting head 8 that has taken out a component from the component supply unit 4 passes above the component recognition camera 11, the component recognition camera 11 images the component held by the suction nozzle from below. That is, the component recognition camera 11 is arranged between the component supply unit 4 and the substrate transfer unit 2 and is a recognition unit that recognizes the component held by the mounting head 8. In the component mounting operation of the component onto the substrate 3 by the mounting head 8, the mounting position is corrected in consideration of the recognition result of the substrate 3 by the head camera 10 and the recognition result of the component by the component recognition camera 11.

[0017] Next, referring to FIG. 2, the configuration and function of the substrate transfer unit 2 will be described. In FIG. 2(a), the substrate transfer unit 2 includes a transfer belt 12 installed in the X-axis direction along a fixed rail 2a and a movable rail 2b. As shown in FIG. 2(b), the transfer belt 12 is wound around drive pulleys 13a of a belt drive unit 13 having two pulleys 12a arranged at both ends of the fixed rail 2a and the movable rail 2b and a motor as a drive source. By driving the belt drive unit 13, the transfer belt 12 travels along the fixed rail 2a and the movable rail 2b, and the substrate 3 placed on the upper surface of the transfer belt 12 is transferred along the X-axis.

[0018] In FIG. 2(a), the position of the fixed rail 2a is fixed with respect to the base 1a. On the other hand, the movable rail 2b moves along the Y-axis integrally with the transfer belt 12 and the belt drive unit 13 by a rail movement mechanism (not shown) (arrow a). The position of the movable rail 2b is changed according to the width (length in the Y-axis direction) of the substrate 3 transferred by the substrate transfer unit 2.

[0019] In Figure 2, a mounting stage [A] is set up in the transport path of the substrate transport unit 2, corresponding to the range of movement of the mounting head 8, i.e., the mounting work area where components can be mounted. The mounting stage [A] is provided with a substrate lower support section 14, which is configured to raise and lower a lower support member 14a by a lifting mechanism 14b (arrow b). Multiple lower support pins 14c are erected on the upper surface of the lower support member 14a to contact and support the lower surface of the substrate 3. When the substrate 3 is brought into the mounting stage [A] and positioned at a predetermined mounting work position, the lower support member 14a is raised, and the substrate 3 is supported from below by the lower support pins 14c which can be raised and lowered. The arrangement of the lower support pins 14c is changed according to the size of the substrate 3 to be supported, the position of components already mounted on the lower surface of the substrate 3, etc.

[0020] In Figure 2, the substrate transport unit 2 can transport the substrate 3 in either the left or right direction in Figure 2 by reversing the driving direction of the motor of the belt drive unit 13. Hereafter, the left side of Figure 2 will be defined as upstream and the right side as downstream. Furthermore, the direction from upstream to downstream will be defined as the substrate transport direction.

[0021] In the fixed rail 2a and the movable rail 2b, when the largest substrate that the component mounting device 1 can mount (hereinafter referred to as "large substrate 3L") stops at the mounting work position, a second substrate detection sensor S2 is installed at the stopping position E1 (see Figure 4) where the downstream end of the large substrate 3L is located. In addition, in the fixed rail 2a and the movable rail 2b, a third substrate detection sensor S3 is installed at the position of the upstream end of the large substrate 3L that has been transported in the opposite direction to the transport direction and stopped at the mounting work position. That is, the second substrate detection sensor S2 and the third substrate detection sensor S3 are positioned symmetrically on the Y-axis with respect to the component recognition camera 11 in between in the substrate transport section 2.

[0022] In Figure 2, a first substrate detection sensor S1 is installed between the second substrate detection sensor S2 and the third substrate detection sensor S3 on the fixed rail 2a and the movable rail 2b. That is, the first substrate detection sensor S1 is located upstream of the stopping position E1 and closer to the component recognition camera 11 (recognition unit) than the second substrate detection sensor S2. Furthermore, the first substrate detection sensor S1 is provided so that its installation position can move along the X-axis (arrow c).

[0023] The first substrate detection sensor S1, the second substrate detection sensor S2, and the third substrate detection sensor S3 are light-shielding optical sensors. They detect the substrate 3 when the central part of the front end of the substrate 3 being transported by the transport belt 12 (a position midway between the fixed rail 2a and the movable rail 2b) passes through the detection optical axis of the optical sensor and is shielded from light. In this way, the second substrate detection sensor S2 detects the substrate 3 at the stopping position E1. The first substrate detection sensor S1 also detects the substrate 3 at a position upstream of the stopping position E1. The detection results from the first substrate detection sensor S1, the second substrate detection sensor S2, and the third substrate detection sensor S3 are transmitted to the control device 20 (see Figure 3) located in the main body of the component mounting device 1.

[0024] Next, with reference to Figure 3, the configuration of the control system of the component mounting device 1 will be described in detail. The control device 20 of the component mounting device 1 is connected to a substrate transport unit 2, a component supply unit 4, a mounting head 8, a mounting head movement mechanism 9, a head camera 10, a component recognition camera 11, a first substrate detection sensor S1, a second substrate detection sensor S2, and a third substrate detection sensor S3. The control device 20 also includes a mounting data storage unit 21, a transport control unit 22, and a mounting control unit 23.

[0025] The mounting data storage unit 21 is a memory device that stores component data 21a, mounting data 21b, etc. Component data 21a includes the component name (type), component size, etc., for each type of component. Mounting data 21b includes the size of the board 3, the component names (types), mounting positions (XY coordinates) of the components mounted on the board 3, and information that identifies the board transport mode, which will be described later, for each type of mounting board being manufactured.

[0026] In Figure 3, the transport control unit 22 controls the substrate transport unit 2 according to the substrate transport mode specified in the mounting data 21b, transporting the substrate 3 and positioning it at the mounting work position. The specific control by the transport control unit 22 will now be explained with reference to Figure 4. Figure 4 shows the state after the large substrate 3L has been positioned at the mounting work position using the large substrate transport mode. In the large substrate transport mode, the transport control unit 22 (control unit) controls the belt drive unit 13 based on the detection results of the large substrate 3L by the first substrate detection sensor S1 and the second substrate detection sensor S2, and stops the large substrate 3L at the stop position E1.

[0027] Specifically, when the transport control unit 22 receives the large substrate 3L from the upstream device, it activates the belt drive unit 13 to transport the large substrate 3L downstream at a predetermined transport speed. Next, when the first substrate detection sensor S1 detects the large substrate 3L, the transport control unit 22 controls the belt drive unit 13 to reduce the transport speed of the transport belt 12. Then, when the second substrate detection sensor S2 detects the large substrate 3L, the transport control unit 22 controls the belt drive unit 13 to stop the transport belt 12. As a result, the large substrate 3L stops at the stopping position E1.

[0028] In Figure 3, the mounting control unit 23 controls the component supply unit 4, mounting head 8, mounting head movement mechanism 9, and component recognition camera 11 based on the mounting data 21b, so that the mounting head 8 can pick up the components supplied by the tape feeder 5 of the component supply unit 4 and mount them to the mounting position on the substrate 3 held at the mounting work position. Now, with reference to Figure 4, the specific control of the component mounting work by the mounting control unit 23 will be explained. When the mounting head 8 picks up a component from the component supply unit 4, the mounting control unit 23 moves the mounting head 8 along the X-axis in the direction of the arrangement of the multiple tape feeders 5 arranged in the component supply unit 4 (arrow d1), causing the mounting head 8 to pick up a component from a predetermined tape feeder 5.

[0029] When the mounting head 8 holds a component, the mounting control unit 23 stops the mounting head 8 in front of the component recognition camera 11 (state shown in Figure 4). Next, the mounting control unit 23 moves the mounting head 8 along the Y-axis so that it passes above the component recognition camera 11 and moves it above the large substrate 3L that is held in the mounting work position (arrow d2). The component recognition camera 11 (recognition unit) recognizes the component held by the mounting head 8 as it passes above it. When the mounting head 8 moves above the large substrate 3L, the mounting control unit 23 moves the mounting head 8 above the mounting position on the large substrate 3L and mounts the held component to the mounting position.

[0030] Next, referring to Figure 5(a), we will explain the problems that occur when a small substrate 3S, which is smaller in size than the large substrate 3L, is transported and positioned at the mounting work location using the large substrate transport mode. Here, the small substrate 3S is a substrate 3 that is smaller in size (length) in the transport direction (X-axis direction) than the large substrate 3L. Also, in this example, the small substrate 3S is smaller in size in the direction perpendicular to the transport direction (Y-axis direction) than the large substrate 3L. When transporting the small substrate 3S, first, the position of the movable rail 2b is moved to match the size (width) of the small substrate 3S in the Y-axis direction. Next, the transport control unit 22 stops the small substrate 3S at the stop position E1 using the same control as described above for the large substrate 3L.

[0031] In this state, if the mounting control unit 23 is made to perform component mounting work, the following problem occurs. That is, the mounting head 8, which has taken a component from the component supply unit 4 and moved to the front of the component recognition camera 11 (arrow e1), then moves along the Y axis to the board transport unit 2 (arrow e2). However, the small board 3S is small in size in the transport direction, and the small board 3S is not at the position of the mounting head 8, which has moved along the Y axis from above the component recognition camera 11. Therefore, the mounting head 8 has to move further downstream to above the small board 3S (arrow e3), and this part becomes a wasted movement path that does not contribute to the component mounting work, thus increasing the work time.

[0032] Next, with reference to Figure 5(b), the control for transporting the small substrate 3S to the mounting work position using the small substrate transport mode will be described. In the small substrate transport mode, the transport control unit 22 (control unit) controls the belt drive unit 13 based on the detection results of the small substrate 3S by the first substrate detection sensor S1 and the third substrate detection sensor S3, and stops the small substrate 3S at a position upstream of the stop position E1 (hereinafter referred to as "small substrate stop position E2").

[0033] Specifically, when the transport control unit 22 receives the small substrate 3S from the upstream device, it activates the belt drive unit 13 to transport the small substrate 3S downstream at a predetermined transport speed. Next, when the third substrate detection sensor S3 detects the small substrate 3S, the transport control unit 22 controls the belt drive unit 13 to reduce the transport speed of the transport belt 12. Then, when the first substrate detection sensor S1 detects the small substrate 3S, the transport control unit 22 controls the belt drive unit 13 to stop the transport belt 12. As a result, the small substrate 3S stops at the small substrate stopping position E2. Thus, the third substrate detection sensor S3 is located upstream of the stopping position E1 (even further upstream than the small substrate stopping position E2) to detect the small substrate 3S.

[0034] In Figure 5(b), stopping the small substrate 3S at the small substrate stopping position E2, which is upstream of the stopping position E1, provides the following benefits in the component mounting operation. Specifically, the mounting head 8, which has taken a component from the component supply unit 4 and moved to the front of the component recognition camera 11 (arrow f1), then moves along the Y axis to the substrate transport unit 2 (arrow f2). Since the small substrate 3S is stopped (held) at the position where the mounting head 8 has moved to the substrate transport unit 2, there is no wasted portion in the movement path of the mounting head 8 that does not contribute to the component mounting operation, and mounting efficiency is improved.

[0035] Thus, the small substrate stopping position E2 (upstream position) is a position where at least a portion of the stopped small substrate 3S overlaps with the movement path (arrow f2) of the mounting head 8, which moves above the component recognition camera 11 (recognition unit) in a direction intersecting the transport direction (X-axis direction). The first substrate detection sensor S1 is movable along the X-axis, and its installation position is set to a position that increases the mounting efficiency for the small substrate 3S stopped at the small substrate stopping position E2. In other words, the first substrate detection sensor S1 is movable in the transport direction according to the size of the small substrate 3S in the transport direction, and is set according to the size (length) of the small substrate 3S in the transport direction so that the movement distance of the mounting head 8 is shortened.

[0036] Next, following the flow chart in Figure 6, and referring to Figures 4 and 5(b), a component mounting method will be described in which a substrate 3 is transported by a transport belt 12 of the component mounting device 1 to a predetermined stopping position, and components are mounted on the stopped substrate 3. Here, an example will be described in which one substrate 3 is transported and components are mounted on the transported substrate 3. First, the transport control unit 22 determines whether the substrate 3 is a large substrate 3L or a small substrate 3S based on the substrate transport mode of the substrate 3 contained in the mounting data 21b (ST1: Substrate size determination step).

[0037] If the substrate transport mode is the large substrate transport mode (Yes in ST1), the transport control unit 22 transports substrate 3 as large substrate 3L to the mounting work position using the large substrate transport mode (ST2: large substrate transport process). If the substrate transport mode is the small substrate transport mode (No in ST1), the transport control unit 22 transports substrate 3 as small substrate 3S to the mounting work position using the small substrate transport mode (ST3: small substrate transport process).

[0038] In Figure 6, once the substrate 3 is transported to the mounting work position and positioned, the mounting control unit 23 executes the component mounting operation. Specifically, the mounting head 8 takes a component from the component supply unit 4 (ST3: component removal process) and moves in front of the component recognition camera 11 (arrow d1 in Figure 4, arrow f1 in Figure 5(b)). Next, while the mounting head 8 moves above the component recognition camera 11 (recognition unit) positioned between the component supply unit 4 and the substrate transport unit 2 in a direction intersecting the transport direction (X-axis direction) (arrow d2 in Figure 4, arrow f2 in Figure 5(b)), the component recognition camera 11 recognizes the component held by the mounting head 8 (ST4: component recognition process).

[0039] Next, the mounting head 8 mounts components onto the substrate 3 which is stopped at a predetermined stopping position (ST5: component mounting process). That is, in the case of a large substrate 3L, the mounting head 8 mounts components onto the large substrate 3L which is stopped at stopping position E1, and in the case of a small substrate 3S, the mounting head 8 mounts components onto the small substrate 3S which is stopped at small substrate stopping position E2. Then, the component removal process (ST3), component recognition process (ST4), and component mounting process (ST5) are repeatedly executed until all components are mounted onto the substrate 3 (No in ST6). Once all components are mounted (Yes in ST6), the transport control unit 22 drives the belt drive unit 13 to transport the substrate 3 from the mounting work position (ST7: substrate transport process).

[0040] Next, with reference to Figure 7, the details of the large substrate transport process (ST2) (large substrate transport method) will be explained. First, the transport control unit 22 operates the belt drive unit 13 to transport the large substrate 3L received from the upstream device downstream by the transport belt 12 (ST11). Then, when the substrate detection sensor S1 detects the large substrate 3L (Yes in ST12), the transport control unit 22 controls the belt drive unit 13 to slow down the transport speed of the large substrate 3L (ST13).

[0041] In other words, when transporting a large substrate 3L, the transport speed of the transport belt 12 is reduced when the large substrate 3L reaches the small substrate stopping position E2 (upstream position). Next, when the substrate detection sensor S2 detects the large substrate 3L (Yes in ST14), the transport control unit 22 stops the belt drive unit 13 (ST15). As a result, the large substrate 3L stops at the stopping position E1.

[0042] Next, with reference to Figure 8, the details of the small substrate transport process (ST3) (small substrate transport method) will be explained. First, the transport control unit 22 operates the belt drive unit 13 to transport the small substrate 3S received from the upstream device downstream by the transport belt 12 (ST21). Then, when the substrate detection sensor S3 of 3 detects the small substrate 3S (Yes in ST22), the transport control unit 22 controls the belt drive unit 13 to slow down the transport speed of the small substrate 3S (ST23).

[0043] Next, when the substrate detection sensor S1 detects the small substrate 3S (Yes in ST24), the transport control unit 22 stops the belt drive unit 13 (ST25). As a result, the small substrate 3S stops at the small substrate stopping position E2. When transporting a small substrate 3S, which is smaller in size in the transport direction than the large substrate 3L, the small substrate 3S is stopped at a position upstream of the stopping position E1 (small substrate stopping position E2). This makes it possible to efficiently mount components even on the small substrate 3S.

[0044] As described above, the component mounting apparatus 1 of this embodiment includes a belt drive unit 13 that drives a conveyor belt 12, a substrate transport unit 2 that transports a large substrate 3L on which components are mounted by the conveyor belt 12 and stops it at a predetermined stop position E1, a first substrate detection sensor S1 provided at a position upstream of the stop position E1 (small substrate stop position E2) that detects the large substrate 3L at the small substrate stop position E2, a second substrate detection sensor S2 that detects the large substrate 3L at the stop position E1, and a control unit (transport control unit 22) that controls the belt drive unit 13 based on the detection results of the first substrate detection sensor S1 and the second substrate detection sensor S2 and stops the large substrate 3L at the stop position E1.

[0045] When transporting a small substrate 3S, which is smaller in size in the transport direction than the large substrate 3L, the control unit controls the belt drive unit 13 based on the detection result of the first substrate detection sensor S1, and stops the small substrate 3S at the small substrate stopping position E2 (upstream position). This makes it possible to efficiently mount components even on the small substrate 3S. [Industrial applicability]

[0046] The component mounting apparatus and component mounting method of the present invention are useful in the field of mounting components onto substrates, as they enable efficient component mounting even on small substrates. [Explanation of symbols]

[0047] 1. Component mounting equipment 2. Substrate transport section 3 circuit boards 3L large board 3S small board 8 Mounting Head 11. Component recognition camera (recognition unit) 12 Conveyor belt 13 Belt drive unit E1 Stop position E2 Small board stopping position (upstream position) S1 First substrate detection sensor S2 Second substrate detection sensor S3 Third substrate detection sensor

Claims

1. A substrate transport unit having a belt drive unit that drives a transport belt, transports a substrate on which components are mounted by the transport belt and stops it at a predetermined stopping position, A first substrate detection sensor is provided at a position upstream of the aforementioned stop position and detects the substrate at the aforementioned upstream position, A second substrate detection sensor for detecting the substrate at the aforementioned stopping position, The system includes a control unit that controls the belt drive unit based on the detection results of the first substrate detection sensor and the second substrate detection sensor, and stops the substrate at the stop position, When transporting a small substrate that is smaller in size in the transport direction than the main substrate, the control unit controls the belt drive unit based on the detection result of the first substrate detection sensor, and stops the small substrate at the upstream position. moreover, A mounting head that takes components from a component supply unit and mounts the components onto the board or small board that is stopped in the board transport unit, The system includes a recognition unit positioned between the component supply unit and the substrate transport unit, which recognizes the component held by the mounting head, A component mounting apparatus wherein the first substrate detection sensor is provided closer to the recognition unit than the second substrate detection sensor.

2. A substrate transport unit having a belt drive unit for driving a transport belt, which transports a substrate on which components are mounted by the transport belt and stops it at a predetermined stopping position, A first substrate detection sensor is provided at a position upstream of the aforementioned stop position and detects the substrate at the aforementioned upstream position, A second substrate detection sensor for detecting the substrate at the aforementioned stopping position, The system includes a control unit that controls the belt drive unit based on the detection results of the first substrate detection sensor and the second substrate detection sensor, and stops the substrate at the stop position, When transporting a small substrate that is smaller in size in the transport direction than the main substrate, the control unit controls the belt drive unit based on the detection result of the first substrate detection sensor, and stops the small substrate at the upstream position. The component mounting apparatus is configured such that the first substrate detection sensor is movable in the transport direction according to the size of the small substrate in the transport direction.

3. A substrate transport unit having a belt drive unit for driving a transport belt, which transports a substrate on which components are mounted by the transport belt and stops it at a predetermined stopping position, A first substrate detection sensor is provided at a position upstream of the aforementioned stop position and detects the substrate at the aforementioned upstream position, A second substrate detection sensor for detecting the substrate at the aforementioned stopping position, The system includes a control unit that controls the belt drive unit based on the detection results of the first substrate detection sensor and the second substrate detection sensor, and stops the substrate at the stop position, When transporting a small substrate that is smaller in size in the transport direction than the main substrate, the control unit controls the belt drive unit based on the detection result of the first substrate detection sensor, and stops the small substrate at the upstream position. moreover, It is provided with a third substrate detection sensor located upstream of the aforementioned upstream position, for detecting the small substrate, The control unit controls the belt drive unit to reduce the transport speed of the transport belt when the third substrate detection sensor detects the small substrate, in a component mounting apparatus.

4. A component mounting apparatus according to any one of claims 1 to 3, In a component mounting apparatus, when transporting the substrate, the control unit controls the belt drive unit to reduce the transport speed of the transport belt when the first substrate detection sensor detects the substrate.

5. A component mounting apparatus according to claim 1, The upstream position is a position where at least a portion of the stationary small substrate overlaps with the movement path of the mounting head, which moves above the recognition unit in a direction intersecting the transport direction.

6. A substrate transport unit having a belt drive unit for driving a transport belt, which transports a substrate on which components are mounted by the transport belt and stops it at a predetermined stopping position, A first substrate detection sensor is provided at a position upstream of the aforementioned stop position and detects the substrate at the aforementioned upstream position, A second substrate detection sensor for detecting the substrate at the aforementioned stopping position, A component mounting method in a component mounting apparatus comprising: a control unit that controls the belt drive unit based on the detection results of the first substrate detection sensor and the second substrate detection sensor, and stops the substrate at the stop position, When transporting a small substrate that is smaller in size in the transport direction than the main substrate, the control unit controls the belt drive unit based on the detection result of the first substrate detection sensor, and stops the small substrate at the upstream position. The component mounting apparatus further includes a third substrate detection sensor provided at a position upstream of the upstream position for detecting the small substrate, A component mounting method wherein, when the third substrate detection sensor detects the small substrate, the control unit controls the belt drive unit to reduce the transport speed of the transport belt.

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