Substrate processing equipment

Abstract

To provide a substrate processing apparatus that always keeps the whole substrate wet when the attitude change is performed, and thereby can suppress the collapse of a pattern on the substrate.SOLUTION: A plurality of substrates W that has been processed in a batch processing unit is transported to an attitude conversion unit 41 by a second transport mechanism WTR. At this time, the plurality of substrates W is immersed in pure water in an immersion tank 43, until the attitude change is performed. Accordingly, when the attitude of the plurality of substrates W is changed from a vertical attitude to a horizontal attitude, the whole substrates W can be always kept wet. As a result, even if the substrate W is transported for being subjected to sheet processing by a center robot, the collapse of the pattern on the substrate W can be suppressed.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus that performs predetermined processing on substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs.

Background Art

[0002] Conventionally, as this type of apparatus, there is one provided with a batch-type module, a single-wafer-type module, and a rotation mechanism (see, for example, Patent Document 1). The batch-type module performs processing on a plurality of substrates collectively. The single-wafer-type module performs processing on each substrate one by one. Generally, in the drying process by the single-wafer-type module, compared with the drying process by the batch-type module, the space of the processing atmosphere that affects the substrate is smaller, and the particle performance is higher. Therefore, it is easier to enhance the drying performance of the single-wafer-type module than that of the batch-type module. Therefore, for example, after performing etching processing and rinsing processing with the batch-type module, drying processing is performed with the single-wafer-type module.

[0003] In the batch-type module, processing is performed with a plurality of substrates in a vertical posture. On the other hand, in the single-wafer-type module, processing is performed with the substrate in a horizontal posture. Therefore, the vertically-oriented substrate after processing in the batch-type module is converted to a horizontal posture by the rotation mechanism before being transported to the single-wafer-type module.

[0004] By the way, in recent years, in the semiconductor field, the refinement of patterns in three-dimensional structures has been progressing. Therefore, in such substrates, due to the influence of the gas-liquid interface when the substrate dries, there is a risk that the pattern will collapse. Therefore, before performing processing in the single-wafer-type module after processing by the batch-type module, the substrate is made wet so that the substrate does not dry.

[0005] Specifically, multiple spray pipes are placed next to the rotating mechanism. These spray pipes spray pure water onto the substrate held by the rotating mechanism. This keeps the substrate wet until it is placed on the single-wafer module. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Special Publication No. 2016-502275 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] However, conventional examples with such a configuration have the following problems. In other words, with conventional equipment, due to the positional relationship between the substrate's orientation caused by the rotating mechanism and the spraying pipe, there are times when the entire substrate is not sufficiently wet. Furthermore, even if pure water is sprayed from near the rotating mechanism, the presence of the rotating mechanism's components prevents the entire substrate from being sufficiently wetted. As a result, the drying of the substrate cannot be sufficiently suppressed, and even when drying is performed using a single-wafer module with superior drying performance, there is a problem in that the collapse of the patterns cannot be sufficiently suppressed.

[0008] The present invention has been made in view of these circumstances, and aims to provide a substrate processing apparatus that can suppress the collapse of patterns on a substrate by keeping the entire substrate wet at all times when changing its orientation. [Means for solving the problem]

[0009] To achieve this objective, the present invention has the following configuration. In other words, the invention described in claim 1 is a substrate processing apparatus for processing a substrate, A batch processing unit that processes multiple circuit boards simultaneously in a vertical orientation, A single-wafer processing unit that processes a single substrate in a horizontal position, A configuration change unit holds multiple substrates that have been processed by the batch processing unit and converts them from a vertical orientation to a horizontal orientation, A first transport unit that transports multiple substrates that have been processed in the batch processing unit to the attitude conversion unit, A second transport unit transports the substrate, which has been positioned horizontally in the attitude conversion unit, to the single-wafer processing unit. An immersion tank for housing multiple substrates whose orientation is to be changed by the orientation changing unit, and for immersing the multiple substrates in pure water until the orientation change is performed, Equipped with 、 The immersion tank is further equipped with a lifting mechanism that moves the plurality of substrates, which are positioned horizontally, up and down relative to each other. When the second transport unit receives the substrate, it moves only the substrate to be transported from among the multiple substrates so that it is positioned above the liquid surface of the immersion tank. The aforementioned attitude changing unit is A carrier inside a tank that houses multiple substrates, with the surfaces of the multiple substrates positioned perpendicular to a predetermined alignment direction, A rotation mechanism that rotates the in-tank carrier below the liquid surface in the immersion tank about a horizontal axis perpendicular to the alignment direction, Equipped with, The aforementioned lifting mechanism is The lifter comprises a back plate portion extending along the inner surface of the immersion tank, and a support portion provided at the lower end of the back plate portion, extending horizontally to support the in-tank carrier, The lifter is moved to a submerged position where the entire in-tank carrier is supported below the liquid surface of the immersion tank; a rotational position below the submerged position where the support portion is separated from the lower surface of the in-tank carrier; a transfer position where the substrate is transferred between the first transport unit and the lifter; and a transport position where only the substrate to be transported is positioned above the liquid surface of the immersion tank. It is characterized by the following:

[0010] [Function and Effect] According to the invention described in claim 1, multiple substrates that have been processed in a batch processing unit are transported to an orientation change unit by a first transport unit. At this time, the multiple substrates are immersed in pure water in an immersion tank until the orientation change is performed. Therefore, when the orientation of multiple substrates in a vertical orientation is changed to a horizontal orientation, the entire substrate can always be kept wet. As a result, even when the substrates are transported to a single-wafer processing unit by a second transport unit for processing, the collapse of patterns on the substrates can be suppressed.

[0011] Substrates that are not transported by the second transport unit are located below the liquid level in the immersion tank. Therefore, it is possible to prevent the substrates from drying out before they are transported by the second transport unit. As a result, collapse of the substrate patterns can be suppressed.

[0012] Since the carrier in the tank is rotated by the rotation mechanism, if dirt or the like occurs on the carrier in the tank, it can be restored by replacing only the carrier in the tank. Therefore, the downtime can be shortened and an improvement in the operating rate can be expected.

[0013] The elevating mechanism moves the lifter over the sinking position, the rotating position, the delivery position, and the conveying position. Thereby, it is possible to immerse all of a plurality of substrates in pure water, convert the horizontal posture below the liquid surface, deliver the substrate to the first conveying unit, or convey the substrate to the second conveying unit.

[0014] In the present invention, the rotation mechanism preferably includes a pair of rotating shafts movable between a connection position connected to a side surface orthogonal to the alignment direction and an open position separated from the side surface among the carriers in the tank, and a rotation drive unit that rotationally drives the pair of rotating shafts at the connection position in order to convert the posture of a plurality of substrates in the carrier in the tank (claim 2 ).

[0015] By rotationally driving the pair of rotating shafts at the connection position by the rotation drive unit, the carrier in the tank can be rotated to collectively convert the posture of a plurality of substrates to a horizontal posture. Therefore, since the posture of a plurality of substrates can be converted with a simple structure, the apparatus cost can be suppressed.

[0016] In the present invention, it is preferable to include a forward and backward drive mechanism that moves the pair of rotating shafts between the connection position and the open position, and the forward and backward drive mechanism advances the pair of rotating shafts to the connection position, and in a state where the lifter is moved to the rotating position, the rotation drive unit converts the posture of a plurality of substrates in the carrier in the tank (claim 3 ).

[0017] The forward and backward drive mechanism advances the pair of rotating shafts to the connection position, and in a state where the lifter is moved to the rotating position, the rotation drive unit converts the posture of a plurality of substrates in the carrier in the tank. Therefore, the posture of a plurality of substrates can be converted without interference between the lifter and the carrier in the tank.

[0018] In the present invention, the carrier in the tank has an opening at the bottom surface, and the lifter is provided at a position where the support portion does not block the opening, supports the lower edges of a plurality of substrates, and has a shape that does not interfere with the opening and the support portion. A pusher is provided below the carrier in the tank and at a position corresponding to the bottom of the immersion tank, and moves up and down between a standby position and a transfer position above the liquid surface in the immersion tank, where a plurality of substrates are transferred between the two positions. When the first transfer unit transports a plurality of substrates to the posture conversion unit, it is preferable that the pusher is raised to the transfer position to receive the plurality of substrates, and then the pusher is lowered to the standby position to transfer the plurality of substrates to the carrier in the tank (Claim 4 ).

[0019] A plurality of substrates can be received from the first transfer unit with the pusher raised to the transfer position. By lowering the pusher to the standby position, a plurality of substrates can be transferred to the carrier in the tank. Therefore, a plurality of substrates can be transferred from the first transfer unit to the carrier in the tank by the lifting operation of the pusher.

Effect of the Invention

[0020] According to the substrate processing apparatus of the present invention, a plurality of substrates that have been processed in the batch processing unit are transported to the posture conversion unit by the first transport unit. At this time, until the posture conversion is performed, the plurality of substrates are immersed in pure water in the immersion tank. Therefore, when the posture of a plurality of substrates in a vertical posture is converted to a horizontal posture, the entire substrate can always be in a wet state. As a result, even when the substrate is transported to the single-piece processing unit by the second transport unit for processing, the collapse of the pattern on the substrate can be suppressed.

[0021] Substrates that are not transported by the second transport unit are located below the liquid level in the immersion tank. Therefore, it is possible to prevent the substrates from drying out before they are transported by the second transport unit. As a result, collapse of the substrate patterns can be suppressed.

[0022] Since the internal carrier is rotated by a rotating mechanism, if the internal carrier becomes contaminated or damaged, it can be restored by replacing only the internal carrier. Therefore, downtime can be shortened and an improvement in operating rate can be expected.

[0023] The lifting mechanism moves the lifter through a submerged position, a rotating position, a transfer position, and a transport position. This allows for immersing multiple substrates entirely in pure water, converting them to a horizontal position below the liquid surface, transferring substrates to a first transport section, and transporting substrates to a second transport section. [Brief explanation of the drawing]

[0024] [Figure 1] This is a plan view of the substrate processing apparatus according to the embodiment. [Figure 2] This is a plan view of the underwater attitude change unit. [Figure 3] This is a side view of the underwater attitude change unit. [Figure 4] This is a front view of the underwater attitude change unit. [Figure 5] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 6] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 7] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 8] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 9] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 10] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 11] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 12] This is a diagram illustrating the operation of the underwater attitude change unit. [Figure 13] This is a side view showing a modified example of the underwater attitude change unit. [Modes for carrying out the invention]

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1 is a plan view of a substrate processing apparatus according to an embodiment.

[0026] <1. Overall Structure>

[0027] The substrate processing apparatus 1 comprises an input / output block 3, a stocker block 5, a transfer block 7, and a processing block 9.

[0028] The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 performs processes such as chemical treatment, cleaning, and drying on the substrate W. The substrate processing apparatus 1 employs a processing method that combines batch processing and single-wafer processing (a so-called hybrid method). In batch processing, multiple substrates W are processed at once in a vertical position. In single-wafer processing, a single substrate W is processed in a horizontal position.

[0029] In this specification, for convenience, the direction in which the loading / unloading block 3, stocker block 5, transfer block 7, and processing block 9 are aligned is called the "front-to-back direction X". The front-to-back direction X is horizontal. Of the front-to-back direction X, the direction from stocker block 5 toward loading / unloading block 3 is called "forward". The direction opposite to forward is called "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called "right". The direction opposite to right is called "left". The direction perpendicular to the horizontal is called the "vertical direction Z". In each figure, front, rear, right, left, up, and down are shown as appropriate for reference.

[0030] <2. Loading / Unloading Block>

[0031] The loading / unloading block 3 includes an input section 11 and an output section 13. The input section 11 and the output section 13 are arranged in the width direction Y. Multiple substrates W (for example, 25) are stacked horizontally at regular intervals within a single carrier C. The carrier C containing the unprocessed substrates W is placed on the input section 11. The input section 11 includes, for example, two mounting tables 15 on which the carrier C is placed. The carrier C has multiple grooves (not shown) formed therein, which accommodate each substrate W with their surfaces spaced apart. An example of a carrier C is a FOUP (Front Opening Unify Pod). A FOUP is a sealed container. The carrier C may be an open container, and is of any type.

[0032] The dispensing unit 13 is located on the opposite side of the input unit 11, straddling the center of the width direction Y in the substrate processing apparatus 1. The dispensing unit 13 is positioned to the left Y of the input unit 11. The dispensing unit 13 stores the processed substrates W in a carrier C and dispenses the carrier C together. The dispensing unit 13, which functions in this way, is equipped with, for example, two mounting tables 17 for placing the carrier C, similar to the input unit 11. The input unit 11 and the dispensing unit 13 are also called load ports.

[0033] <3. Storage Block>

[0034] The storage block 5 is positioned adjacent to the rear X of the loading / unloading block 3. The storage block 5 is equipped with a transport storage section ACB. The transport storage section ACB is equipped with a transport mechanism 19 and shelves 21.

[0035] The transport mechanism 19 transports the carrier C. The transport storage unit ACB is equipped with multiple shelves 21. Some shelves 21 are for temporarily placing the carrier C, while others are for placing the carrier C for transfer between the transport mechanism HTR and the transport storage unit ACB. The transport storage unit ACB takes in the carrier C containing the unprocessed substrates W from the input unit 11 and places it on the shelf 21. The transport storage unit ACB transports and places the carrier C to the transfer shelf 21 according to a schedule that defines the processing order. The transport storage unit ACB transports and places the empty carrier C that has been placed on the transfer shelf 21 back onto the shelf 21. The transport storage unit ACB transports and places the carrier C containing the processed substrates W, which have been placed on the transfer shelf 21 and transported by the first transport mechanism HTR, back onto the shelf 21. The transport and storage unit ACB is placed on shelf 21 and transports the carrier C containing the processed substrates W to the discharge unit 13.

[0036] <4. Transfer Block>

[0037] The transfer block 7 is positioned adjacent to the rear X of the stocker block 5. The transfer block 7 is equipped with a first transport mechanism HTR, a transfer mechanism CTC, and a second transport mechanism WTR.

[0038] The first transport mechanism HTR is located to the right Y of the rear X of the transport storage unit ACB. The first transport mechanism HTR transports multiple substrates W at once. In other words, the first transport mechanism HTR is equipped with multiple hands (not shown). One hand supports one substrate W. The first transport mechanism HTR can also transport only one substrate W. The first transport mechanism HTR takes multiple substrates W (for example, 25) at once from the carrier C placed on the transfer shelf 21 in the transport storage unit ACB and transports them to the transfer mechanism CTC. At this time, the first transport mechanism HTR changes the orientation of the substrates W from horizontal to vertical. The first transport mechanism HTR receives multiple processed substrates W at once from the processing block 9, which will be described later. The first transport mechanism HTR transports multiple processed substrates W at once to the carrier C placed on the transfer shelf 21 in the transport storage unit ACB.

[0039] A transfer mechanism CTC is located to the left Y of the first transport mechanism HTR. The transfer mechanism CTC transfers multiple substrates W between the first transport mechanism HTR and the second transport mechanism WTR. mechanism The CTC transports multiple substrates W in the width direction Y between the first transport mechanism HTR and the second transport mechanism WTR. mechanismAfter receiving multiple substrates W from the first transport mechanism HTR, the CTC moves them in the width direction Y to the second transport mechanism WTR. During this process, the transfer mechanism CTC assembles or disassembles batch lots. For example, the transfer mechanism CTC combines multiple substrates W that constitute one lot taken from one carrier C with multiple substrates W that constitute another lot taken from another carrier C to form a single batch lot. This is batch lot assembly. The reverse operation is batch lot disassembly. That is, multiple substrates W that constitute one lot of one batch lot and multiple substrates W that constitute another lot of the same batch lot are separated and returned to their original lots. Normally, the spacing between multiple substrates W taken from a carrier C is the same as the spacing between carrier C. This is called full pitch. In a single batch lot, for example, the spacing between multiple substrates W is half the full pitch. This is called half pitch. Note that the present invention does not specify the pitch, so in order to facilitate understanding of the invention, a detailed explanation of the pitch will be omitted in the following description.

[0040] In the following explanation, the configuration of the lot being processed is irrelevant. In other words, it is the same whether it is a regular lot or a batch lot, so in the following explanation, the object being processed will simply be referred to as a lot or multiple substrates W.

[0041] The second transport mechanism WTR is located to the left Y of the transfer mechanism CTC. The second transport mechanism WTR is configured to be movable between the transfer block 7 and the processing block 9. The second transport mechanism WTR is configured to be movable in the front-rear direction X. The second transport mechanism WTR is equipped with a pair of hands 23 for transporting a lot. The pair of hands 23 are equipped with a pivot axis oriented, for example, in the width direction Y. The pair of hands 23 swing around this pivot axis. The pair of hands 23 grip both end faces of the multiple substrates W that make up the lot. The second transport mechanism WTR transfers the multiple substrates W to the transfer mechanism CTC. The second transport mechanism WTR transfers the multiple unprocessed substrates W to the processing block 9.

[0042] The second transport mechanism WTR described above corresponds to the "first transport section" in this invention.

[0043] <5. Processing Block>

[0044] Processing block 9 performs processing on the substrate W. Processing block 9, excluding the second transport mechanism WTR, is divided, for example, into a first column R1, a second column R2, and a third column R3 in the width direction Y. In detail, the first column R1 is located to the left in the Y direction. The second column R2 is located in the center of the width direction Y. In other words, the second column R2 is located to the right of the first column R1 in the Y direction. The third column R3 is located to the right of the second column R2 in the Y direction.

[0045] <5-1. 1st column>

[0046] The first row R1 mainly comprises a batch processing unit. Specifically, the first row R1 comprises a first batch processing unit BPU1, a second batch processing unit BPU2, a third batch processing unit BPU3, and an underwater attitude conversion unit 25. The first batch processing unit BPU1 is adjacent to the rear X of the transfer block 7. The second batch processing unit BPU2 is adjacent to the rear X of the first batch processing unit BPU1. The third batch processing unit BPU3 is adjacent to the rear X of the second batch processing unit BPU2. The underwater attitude conversion unit 25 is adjacent to the rear X of the third batch processing unit BPU3.

[0047] The first batch processing unit BPU1, the second batch processing unit BPU2, and the third batch processing unit BPU3 correspond to the "batch-type processing unit" in this invention.

[0048] The first batch processing unit BPU1 is, for example, the chemical treatment processing unit CHB1. The chemical treatment processing unit CHB1 performs, for example, phosphoric acid treatment. Phosphoric acid treatment uses phosphoric acid as the treatment solution. Phosphoric acid treatment performs etching on multiple substrates W. Etching treatment chemically removes the thickness of a coating applied to the substrate W, for example, a nitride film.

[0049] The chemical solution processing unit CHB1 comprises a processing tank 27 and a lifter LF1. The processing tank 27 stores the processing liquid. The processing tank 27 supplies the processing liquid, for example, from below upwards. The lifter LF1 moves up and down in the vertical direction Z. Specifically, the lifter LF1 moves up and down between a processing position located inside the processing tank 27 and a transfer position located above the processing tank 27. The lifter LF1 holds multiple substrates W in a vertical position. At the transfer position, the lifter LF1 transfers the multiple substrates W to and from the second transport mechanism WTR.

[0050] The second batch processing unit BPU2 is, for example, the chemical treatment processing unit CHB2. The chemical treatment processing unit CHB2 has the same configuration as the chemical treatment processing unit CHB1. That is, the chemical treatment processing unit CHB2 is equipped with a processing tank 27 and a lifter LF2. The chemical treatment processing unit CHB2 performs the same processing as the chemical treatment processing unit CHB1. In other words, there are multiple processing units that perform the same chemical treatment. This is because the phosphoric acid treatment takes a long time compared to other chemical treatments and pure water washing treatments. The phosphoric acid treatment takes, for example, about 60 minutes. Therefore, throughput can be improved by performing the processing in parallel with multiple processing units.

[0051] The third batch processing unit CHB3 is, for example, the pure water processing unit ONB. The pure water processing unit ONB has a similar configuration to the chemical solution processing units CHB1 and CHB2. Specifically, it comprises a processing tank 27 and a lifter LF3. However, the processing tank 27 is mainly supplied with pure water for the pure water washing process. The processing tank 27 of the pure water processing unit ONB washes the chemical solution adhering to multiple substrates W. In other words, the processing tank 27 of the pure water processing unit ONB washes away the chemical solution adhering to multiple substrates W. The pure water processing unit ONB terminates the washing process when, for example, the resistivity of the pure water in the processing tank 27 rises to a predetermined value.

[0052] <5-2. 2nd column>

[0053] The second row R2 is equipped with a center robot CR. The center robot CR is equipped with a hand 29. The hand 29 holds one substrate W. The center robot CR may also be configured to have another hand 29 in the vertical direction Z. The center robot CR is configured to be movable in the forward / backward direction X. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR is configured to be able to rotate in a horizontal plane including the forward / backward direction X and the width direction Y. The hand 29 is configured to move forward and backward in a horizontal plane including the forward / backward direction X and the width direction Y. The hand 29 receives substrates W one by one from the underwater attitude change unit 25. The center robot CR passes substrates W one by one to the third row R3. If the center robot CR is equipped with two hands 29, it receives two substrates W from the underwater attitude change unit 25 and passes substrates W one by one to two locations in the third row R3.

[0054] The aforementioned center robot CR corresponds to the "second transport unit" in this invention.

[0055] <5-3. 3rd column>

[0056] The third row R3 mainly comprises a single-wafer processing unit. Specifically, the third row R3 comprises a first single-wafer processing unit SWP1, a second single-wafer processing unit SWP2, a third single-wafer processing unit SWP3, and a buffer unit 31. The first single-wafer processing unit SWP1 is located at the innermost side in the front-rear direction X. In other words, the first single-wafer processing unit SWP1 is located on the opposite side of the underwater attitude conversion unit 25 in the width direction Y, with the second row R2 in between. The second single-wafer processing unit SWP2 is adjacent to the front X of the first single-wafer processing unit SWP1. The third single-wafer processing unit SWP3 is adjacent to the front X of the second single-wafer processing unit SWP2. The buffer unit 31 is located in front X of the third single-wafer processing unit SWP3 and adjacent to the rear X of the first transport mechanism HTR.

[0057] The first sheet-watt processing unit SWP1, the second sheet-watt processing unit SWP2, and the third sheet-watt processing unit SWP3 correspond to the "sheet-watt processing unit" in this invention.

[0058] The first sheet-to-sheet processing unit SWP1 and the second sheet-to-sheet processing unit SWP2 each include, for example, a rotation processing unit 33 and a nozzle 35. The rotation processing unit 33 rotates the substrate W in a horizontal plane. The nozzle 35 supplies a processing liquid to the substrate W. The nozzle 35 oscillates between a standby position away from the rotation processing unit 33 and a supply position above the rotation processing unit 33. The processing liquid is, for example, IPA (isopropyl alcohol) or pure water. The first sheet-to-sheet processing unit SWP1 and the second sheet-to-sheet processing unit SWP2 perform, for example, a washing treatment on the substrate W with pure water, followed by a preliminary drying treatment with IPA.

[0059] The third sheet processing unit SWP3 is equipped with, for example, a supercritical fluid chamber 37. The supercritical fluid chamber 37 performs, for example, a drying treatment using a supercritical fluid. The fluid used in this case is, for example, carbon dioxide. The supercritical chamber 37 treats the substrate W by bringing the processing liquid to a supercritical state. The supercritical state is obtained by bringing the fluid to its own critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes zero. Therefore, the gas-liquid interface does not affect the pattern on the substrate W. Consequently, pattern collapse on the substrate W is less likely to occur.

[0060] The buffer section 31 includes, for example, multiple levels of mounting shelves 39. Preferably, the multiple mounting shelves 39 are stacked in the vertical direction Z. The multiple mounting shelves 39 can hold at least one lot of substrates W. Since the first transport mechanism HTR can take out multiple substrates W at once, the burden on the first transport mechanism HTR can be reduced compared to when substrates W are taken out one by one. The buffer section 31 can be accessed from multiple different directions in the horizontal direction. The center robot CR accesses the buffer section 39 to place substrates W from the second column R2 side toward the right Y. The first transport mechanism HTR accesses the buffer section 39 to receive one lot of substrates W from the front X toward the rear X. The first transport mechanism HTR can also receive fewer than one lot of substrates W. The center robot CR described above moves up and down in the vertical direction Z to transfer substrates W between the multiple mounting shelves 39.

[0061] Preferably, the first sheet-of-wafer processing unit SPW1, the second sheet-of-wafer processing unit SWP2, and the third sheet-of-wafer processing unit SWP3 described above are each stacked in multiple stages in the vertical direction Z. This improves throughput.

[0062] <6. Underwater attitude change unit>

[0063] Here, the underwater attitude change unit will be explained with reference to Figures 2 to 4. Figure 2 is a plan view of the underwater attitude change unit. Figure 3 is a side view of the underwater attitude change unit. Figure 4 is a front view of the underwater attitude change unit.

[0064] The underwater attitude changing unit 25 comprises an attitude changing unit 41, an immersion tank 43, a lifter LF4, and a pusher 45. The attitude changing unit 41 comprises an in-tank carrier 47 and a rotating mechanism 49.

[0065] The internal carrier 47 stores multiple substrates W in a vertical position. The internal carrier 47 stores multiple substrates W spaced apart at predetermined intervals in a predetermined alignment direction. The surface of the substrates W is perpendicular to the alignment direction. In this example, the alignment direction is the width direction Y. The internal carrier 47 has an opening 51 formed at its bottom. The internal carrier 47 has an opening 53 formed on its top surface. The length of the opening 53 in the front-rear direction X is longer than the diameter of the substrates W. The opening 51 has a smaller opening area than the opening 53. The internal carrier 47 is equipped with engaging portions 55. The engaging portions 55 are formed on two outer surfaces of the internal carrier 47 in the front-rear direction X. The engaging portions 55 are formed on the outer surfaces of the multiple substrates W in a direction perpendicular to the alignment direction.

[0066] The immersion tank 43 houses the internal carrier 47. The immersion tank 43 is equipped with ejector tubes 43a at both ends in the front-to-back direction X on its bottom surface. Each ejector tube 43a is cylindrical in shape. Each ejector tube 43a has a long axis in the width direction Y. Each ejector tube 43a is long in the width direction Y. Each ejector tube 43a supplies pure water toward the center of the immersion tank 43 in the front-to-back direction X. Each ejector tube 43a forms an upward flow of pure water from the bottom of the immersion tank 43 upwards. The pure water supplied to the immersion tank 43 from each ejector tube 43a is discharged over the upper edge of the immersion tank 43.

[0067] The rotating mechanism 49 comprises an air cylinder 57 and a motor 59. The air cylinder 57 comprises an operating shaft 57a and an engaging piece 57b. The operating shaft 57a is driven to move forward and backward in the front-rear direction X in accordance with the on / off state of the air cylinder 57. The immersion tank 43 has a through hole 44 formed therein. The through hole 44 is formed in the side wall of the immersion tank 43 in the front-rear direction X. The operating shaft 57a is installed in a liquid-tight state in the through hole 44 of the immersion tank 43. The operating shaft 57a moves forward and backward in a liquid-tight state in the front-rear direction X It is possible to move forward and backward. The operating shaft 57a is rotatable around the axis in the front-rear direction X while maintaining a liquid-tight state. In other words, the operating shaft 57a is possible to move forward and backward and rotate relative to the center of the immersion tank 43 while maintaining liquid tightness.

[0068] The extended position in which the engaging piece 57b of the operating shaft 57a engages with the engaging portion 55 is the connected position. The retracted position in which the engaging piece 57b of the operating shaft 57a separates from the engaging portion 55 is the open position. In Figure 2, the operating shaft 57a has the engaging piece 57b in the open position.

[0069] The engaging piece 57b engages with the engaging portion 55 of the in-tank carrier 47. The shape (contour) of the outer surface of the engaging piece 57b is formed so as to engage with the engaging portion 55. The engaging portion 55 and the engaging piece 57b have polygonal shapes when viewed from the front-rear direction X, for example. The dimensions of the engaging piece 57b in the longitudinal cross-section are slightly smaller than those of the engaging portion 55. The shape of the inner surface of the engaging portion 55 and the shape of the outer surface of the engaging piece 57b are similar. When the engaging piece 57b is engaged with the engaging portion 55, the in-tank carrier 47 and the operating shaft 57a become one unit. In other words, when the engaging piece 57b is engaged with the engaging portion 55, the in-tank carrier 47 does not rotate around the axis in the front-rear direction X with respect to the operating shaft 57a. The in-tank carrier 47 is rotatable together with the operating shaft 57a around the axis in the front-rear direction X.

[0070] When the air cylinder 57 is turned on, for example, the operating shaft 57a extends. When the air cylinder 57 is turned off, for example, the operating shaft 57a retracts. When the air cylinder 57 is turned on, the engaging piece 57b moves to a coupled position where it engages with the engaging portion 55. When the air cylinder 57 is turned off, the engaging piece 57b moves to an open position where it is separated from the engaging portion 55. In the coupled position, the operating shaft 57a is integrated with the tank carrier 47. In the open position, the operating shaft 57a is separate from the tank carrier 47.

[0071] The two operating shafts 57a mentioned above correspond to the "pair of rotating shafts" in this invention. The two air cylinders 57 mentioned above correspond to the "reverse drive mechanism" in this invention.

[0072] Motor 59 rotates air cylinder 57 around an axis in the front-rear direction X. When air cylinder 57 is turned on and motor 59 is driven to rotate in a first direction, motor 59 rotates the in-tank carrier 47 around an axis in the front-rear direction X. When air cylinder 57 is turned on and motor 59 is driven to rotate in a second direction opposite to the first direction, motor 59 rotates the in-tank carrier 47 in the opposite direction around the axis in the front-rear direction X. These rotation angles are approximately 90° each. The rotation angle at this time is the angle at which the orientation of the multiple substrates W housed in the in-tank carrier 47 is converted between a horizontal orientation and a vertical orientation.

[0073] The motor 59 described above corresponds to the "rotational drive unit" in the present invention. The motor 59 described above corresponds to the "rotational mechanism" in the present invention.

[0074] The lifter LF4 comprises a back plate portion 63 and support portions 65. The back plate portion 63 extends along the inner surface of the immersion tank 43. The back plate portion 63 extends downward in the vertical direction Z along the inner surface in the front-rear direction X. Two support portions 65 are attached to the lower end of the back plate portion 63, for example. The two support portions 65 extend in the width direction Y. The distance between the two support portions 65 in the front-rear direction X is wider than the opening 51. The lifter LF4 supports the in-tank carrier 47 so that its longitudinal direction is horizontal.

[0075] A lifting mechanism 67 is located near the lifter LF4. The lifting mechanism 67 comprises a motor 69, a screw shaft 71, a linear guide 73, and a lifting piece 75. The motor 69 is positioned with its rotation axis oriented vertically. The screw shaft 71 is attached to the rotation axis of the motor 69. The screw shaft 71 is oriented in the vertical direction Z. The linear guide 73 is provided parallel to the screw shaft 71. The linear guide 73 is oriented in the vertical direction Z. The lifting piece 75 is screwed onto the screw shaft 71. One end of the lifting piece 75 is slidably attached to the linear guide 73. The other end of the lifting piece 75 is attached to a connecting member 77. The connecting member 77 has an inverted L-shape. The connecting member 77 is coupled to the upper end of the back plate portion 63.

[0076] When the motor 69 rotates, the screw shaft 71 rotates. As the screw shaft 71 rotates, the lifting piece 75 moves up and down vertically in the Z direction along the linear guide 73 according to the direction of rotation of the motor 71. As a result, for example, the lifter LF4 is moved up and down to multiple height positions.

[0077] For example, as shown in Figure 3, the lifter LF4 is moved up and down by the lifting mechanism 67 between a first height position P1, a second height position P2, a third height position P3, and a fourth height position P4. The first height position P1 is lower than the second to fourth height positions P2 to P4. The second height position P2 is lower than the first height position P1 and the fourth height position. position It is higher than P4 and lower than the third height position P3. The third height position P3 is higher than the first height position P1, the second height position P2, and the fourth height position P4. The fourth height position P is higher than the first height position P, and higher than the second height position P2 and the third height P3.

[0078] The first height position P1 is when the support portion 65 of the lifter LF4 is located near the bottom surface of the immersion tank 43. The first height position P1 is when the in-tank carrier 47 is held by the rotation mechanism 49 and the support portion 65 is separated from the lower surface of the in-tank carrier 47. At the first height position P1, the in-tank carrier 47 is rotated vertically in the longitudinal direction within the immersion tank 43 by the rotation mechanism 49.

[0079] The second height position P2 is the position in which the entire in-tank carrier 47 is supported below the liquid surface of the immersion tank 43. At the second height position P2, the opening 53 of the in-tank carrier 47 is located below the liquid surface. The second height position P2 is the position in which the clamping operation on the in-tank carrier 47 is performed by the rotating mechanism 49. The second height position P2 is the position in which the engaging portion 55 of the in-tank carrier 47 and the engaging piece 57b of the air cylinder 57 are aligned linearly in the horizontal direction. In other words, the second height position P2 is the position in which the engaging portion 55 and the engaging piece 57b face each other in the horizontal direction.

[0080] The third height position P3 is the position where multiple substrates W are transferred between the second transport mechanism WTR and the in-tank carrier 47. At the third height position P3, for example, the support portion 65 of the lifter LF4 is positioned above the liquid level of the immersion tank 43. However, it is sufficient that the bottom of the in-tank carrier 47 is positioned above the liquid level, so the support portion 65 does not necessarily need to be positioned above the liquid level.

[0081] The fourth height position P4 maintains the in-tank carrier 47, with multiple substrates W in a horizontal position, below the water surface in the immersion tank 43. The stepped positions from the fourth height position P4 to the third height position P3 are height positions that position only the substrates W to be transported by the central robot CR above the liquid surface in the immersion tank 43.

[0082] The first height position P1 described above corresponds to the "rotation position" in this invention. The second height position P2 described above corresponds to the "sinking position" in this invention. The third height position described above corresponds to the "transfer position" in this invention. The area from the fourth height position P4 to the third height position P3 described above corresponds to the "conveying position" in this invention.

[0083] The immersion tank 43 has a through hole 79 formed in its bottom. A lifting member 81 is inserted through the through hole 79. The through hole 79 allows the lifting member 81 to be inserted while maintaining a liquid-tight state of the immersion tank 43. The lifting member 81 is U-shaped. A pusher 45 is attached to one side of the lifting member 81. The pusher 45 can support multiple substrates W at once. The pusher 45 supports the lower edge of the substrates W by contacting it. As shown in Figures 2 and 3, the dimensions of the pusher 45 are smaller than the openings 51 and 53 of the tank carrier 47. The pusher 45 can move up and down by passing through the tank carrier 47 in the vertical direction Z. The width of the pusher 45 is smaller than the spacing in the front-rear direction X of the support parts 65 of the lifter LF4. The pusher 45 does not interfere with the tank carrier 47 and the support parts 65 of the lifter LF4.

[0084] The pusher 45 has a lifting mechanism 83 in an adjacent position. The lifting mechanism 83 comprises a motor 85, a screw shaft 87, a linear guide 89, and a lifting piece 91. The motor 85 has its rotating shaft positioned vertically. The screw shaft 87 is attached to the rotating shaft of the motor 85. The screw shaft 87 is positioned in the vertical direction Z. The linear guide 89 is positioned parallel to the screw shaft 87. The linear guide 89 is positioned in the vertical direction Z. The lifting piece 91 is screwed onto the screw shaft 87. One end of the lifting piece 87 is slidably attached to the linear guide 89. The other end of the lifting piece 87 is connected to the lifting member 81.

[0085] When the motor 85 is driven in the forward or reverse direction, the screw shaft 87 rotates in the forward or reverse direction. Depending on the rotation direction of the motor 85, the lifting piece 91 moves up and down vertically in the Z direction along the linear guide 89. As a result, the pusher 45 moves up and down vertically in the Z direction. The pusher 45 moves up and down between a standby position and a transfer position. The standby position is below the in-tank carrier 47 and near the bottom of the immersion tank 43. This standby position is shown by a solid line in Figures 3 and 4. The transfer position is above the liquid surface in the immersion tank 43. This transfer position is shown by a dashed line in Figures 3 and 4. The transfer position is the position where multiple substrates W are transferred between the second transport mechanism WTR and the transfer position.

[0086] Furthermore, since the in-tank carrier 47 is rotated by the rotation mechanism 49, if the in-tank carrier 47 becomes contaminated or damaged, it can be restored by replacing only the in-tank carrier 47. Therefore, the downtime of the substrate processing apparatus 1 can be shortened, and an improvement in operating rate can be expected.

[0087] The operation of each of the above-described components is comprehensively controlled by the control unit (CU). The control unit (CU) is equipped with a CPU and memory. The control unit (CU) operates each component according to a program pre-stored in memory to perform processing on the circuit board (W).

[0088] <7. Operation Description>

[0089] The operation of the underwater attitude changing unit 25 in the substrate processing apparatus 1 described above will be explained with reference to Figures 5 to 12. Figures 5 to 12 are explanatory diagrams of the operation of the underwater attitude changing unit.

[0090] <7-1. Batch Processing>

[0091] Multiple substrates W are subjected to etching with phosphoric acid in the chemical treatment unit CHB1, and then to pure water cleaning in the pure water cleaning unit ONB. The multiple substrates W that have undergone pure water cleaning are transported to the underwater attitude change unit 25 by the second transport mechanism WTR.

[0092] <7-2. Posture Change>

[0093] Refer to Figure 5. The second transport mechanism WTR grasps the multiple substrates W that have been processed in the pure water processing unit ONB with the hand 23 and transports them to above the underwater attitude change unit 25. At this time, the support part 65 of the lifter LT4 is positioned at the second height position P2 of the underwater attitude change unit 25. The in-tank carrier 47 is held by the support part 65. Pure water is supplied to the immersion tank 43 in an upflow from the ejection pipe 43a. Pure water overflows from the upper edge of the immersion tank 43. As a result, the immersion tank 43 is always filled with normal pure water. The rotating mechanism 49 has the engaging piece 57b of the operating shaft 57a in the open position. That is, the rotating mechanism 49 is separated from the in-tank carrier 47. The pusher 45 is raised from the standby position to the transfer position of the immersion tank 43. As a result, the lower edges of the multiple substrates W held by the second transport mechanism WTR are supported by contact with the pusher 45.

[0094] Refer to Figure 6. The second transport mechanism WTR releases the grip of the hand 23 and frees the multiple substrates W. As a result, the multiple substrates W are transferred from the second transport mechanism WTR to the pusher 45. Next, the second transport mechanism WTR moves out of the way of the underwater attitude change unit 25. Specifically, it moves towards the first batch processing unit BPU1.

[0095] The lifting mechanism 67 drives the motor 69 to raise the lifter LF4 to the transfer position. Specifically, it raises the lifter LF4 to a third height position P3. As a result, multiple substrates W, whose lower edges are supported by the pusher 45, are placed in the tank carrier 47.

[0096] Refer to Figure 7. The lifting mechanism 83 rotates the motor 85 to lower the pusher 45 to the standby position. As a result, the multiple substrates W are completely housed in the tank carrier 47.

[0097] Refer to Figure 8. The lifting mechanism 67 rotates the motor 69 to lower the lifter LF4 to the second height position P2.

[0098] Refer to Figure 9. The rotating mechanism 49 acts on the air cylinder 57 to advance the operating shaft 57a toward the in-tank carrier 47. The rotating mechanism 49 advances the operating shaft 57a toward the coupling position. As a result, the engaging piece 57b of the air cylinder 57 engages with the engaging portion 55 of the in-tank carrier 47. The in-tank carrier 47 is supported at the bottom by the lifter LF4 and is clamped between the pair of operating shafts 57a. Next, the motor 69 of the lifting mechanism 67 is rotated to lower the lifter LF4 to the first height position P1. As a result, the in-tank carrier 47 is clamped only between the pair of operating shafts 57a.

[0099] Refer to Figure 10. The rotation mechanism 49 of the attitude change unit 41 is activated. Specifically, the motor 59 of the rotation mechanism 49 is rotationally driven to rotate the in-tank carrier 47 together with the air cylinder 57 around the axis in the front-rear direction X. In other words, the motor 59 is rotationally driven so that, as viewed from the pure water processing unit ONB side, tank The internal carrier 47 is rotated counterclockwise. The rotation angle is 90°. This changes the internal carrier 47 from a horizontal (horizontally elongated) position to a vertical (vertically elongated) position. Consequently, the orientation of the multiple substrates W is changed from a vertical position to a horizontal position. At this time, the multiple substrates W remain immersed in the pure water of the immersion tank 43. When the orientation change occurs, no part of the multiple substrates W is exposed from the pure water.

[0100] In this way, by rotating the pair of operating shafts 57a located at the connection position using the rotation mechanism 49, the in-tank carrier 47 can be rotated, and the orientation of multiple substrates W can be changed to a horizontal orientation all at once. Therefore, since the orientation of multiple substrates W can be changed with a simple structure, the equipment cost can be reduced.

[0101] Refer to Figure 11. The lifting mechanism 67 raises the lifter LF4 to the fourth position P4. As a result, the holding part 65 of the lifter LF4 holds the vertically positioned in-tank carrier 47 in the liquid. Furthermore, the air cylinder 57 is retracted, moving the operating shaft 57a to the open position. As a result, the in-tank carrier 47 is held only by the lifter LF4.

[0102] Refer to Figure 12. The lifting mechanism 67 raises the lifter LF4 from the fourth position P4, so that only the uppermost substrate W in the tank carrier 47 is exposed above the liquid surface. This substrate W is the object to be transported by the central robot CR. As a result, the uppermost substrate W is exposed above the liquid surface of the immersion tank 43 with the pure water stored in the immersion tank 43 piled on top of it. In this state, the central robot CR extends the hand 29 into the tank carrier 47 and unloads the uppermost substrate W.

[0103] When the central robot CR moves to the underwater attitude change unit 25 to transport the next substrate W, the lifting mechanism 67 further raises the lifter LF4. Specifically, it raises it by the distance between the grooves of the in-tank carrier 47. As a result, only the next substrate W is exposed above the liquid surface of the immersion tank 43. In this state, the central robot CR unloads the substrate W. In this way, each time the central robot CR moves, the lifting mechanism 67 gradually raises the lifter LF4. As a result, all the substrates W are transported by the central robot CR while remaining wet with pure water.

[0104] In this way, the substrates W that are not transported by the central robot CR are located below the liquid surface in the immersion tank 43. Therefore, it is possible to prevent the substrates W from drying out before they become subject to transport by the central robot CR. As a result, collapse of the patterns on the substrates W can be suppressed.

[0105] <7-3. Single-leaf processing>

[0106] As described above, the substrate W transported by the central robot CR is processed, for example, as follows:

[0107] The central robot CR transports the substrate W to the first sheet-to-sheet processing unit SWP1. The first sheet-to-sheet processing unit SWP1 rotates the substrate W using the rotation processing unit 33, for example, while supplying pure water from the nozzle 35. Subsequently, IPA is supplied to the substrate W from the nozzle 35 to replace the pure water in the substrate W with IPA. After that, the substrate W is unloaded by the central robot CR and transported to the third sheet-to-sheet processing unit SWP3. In the third sheet-to-sheet processing unit SWP3, the substrate W is fed into the supercritical fluid chamber 37. The substrate W is dried using carbon dioxide inside the supercritical fluid chamber 37. The drying process in the supercritical fluid chamber 37 provides a finishing drying treatment to the substrate W. This completely dries the substrate W, but the collapse of the patterns formed on the substrate W is suppressed.

[0108] After processing in the supercritical fluid chamber 37, the substrates W are transported to the buffer section 31 by the central robot CR. The central robot CR places the substrates W on the loading shelves 39 in the buffer section 31. Once a batch of substrates W is loaded into the buffer section 31, the first transport mechanism HTR transports multiple substrates W at once to the transport storage section ACB. The transport storage section ACB then transports the entire carrier C to the discharge section 13. The single-wafer processing and subsequent transport described above are performed for all substrates W in the tank carrier 47. This allows batch processing and single-wafer processing to be performed on all of the multiple substrates W.

[0109] In this embodiment, multiple substrates W that have been processed in the batch processing unit are transported to the attitude change unit 41 by the second transport mechanism WTR. At this time, until the attitude change is performed, the multiple substrates W are immersed in pure water in the immersion tank 43. Therefore, when the attitude change of multiple vertical substrates W is performed to a horizontal position, the entire substrate W can always be kept wet. As a result, even when the substrates W are transported by the center robot CR for single-wafer processing, the collapse of patterns on the substrates W can be suppressed.

[0110] Furthermore, since pattern collapse can be suppressed, it becomes unnecessary to perform reprocessing such as pattern removal on substrates W whose patterns have collapsed. As a result, the amount of chemicals and pure water used can be reduced. In addition, the power consumption of the substrate processing apparatus 1 required to complete processing on the same number of substrates W can be reduced.

[0111] <Variation>

[0112] The underwater attitude conversion unit 25 described above converts the in-tank carrier 47 from a horizontal to a vertical position using the attitude conversion unit 41, thereby converting the multiple substrates W from a vertical to a horizontal position. However, the underwater attitude conversion unit 25A may be configured as follows. Refer to Figure 13. Figure 13 is a side view showing a modified example of the underwater attitude conversion unit.

[0113] The underwater attitude changing unit 25A includes an attitude changing unit 41A. The lifter LF4 has a back plate 63 A The unit comprises a support section 65A, a short-side support section 93, and a support section drive section 95. The attitude changing section 41A includes the support section drive section 95.

[0114] The short-side support portion 93 is attached to the support portion 65A on the opposite side from the back plate portion 63A. The short-side support portion 93 supports the short side of the tank carrier 37. The support portion drive unit 95 is provided at the lower end of the back plate portion 63A. The support portion drive unit 95 includes a motor. The rotation axis of this motor is oriented laterally. This rotation axis is directed in the front-rear direction X.

[0115] The support drive unit 95 drives the support unit 65A together with the short-side support unit 93. Specifically, the support drive unit 95 drives the support unit 65A to a horizontal position where it is oriented in the width direction Y (shown by a dashed line in Figure 13) and to a vertical position where it is oriented in the vertical direction Z (shown by a solid line in Figure 13). The intermediate states when the posture is converted between these horizontal and vertical positions are shown by dotted lines in Figure 13.

[0116] In this attitude changing unit 41A, first the support unit 65A is set to a horizontal position (dotted line in Figure 13), and then multiple substrates W are received from the second transport mechanism WTR into the tank carrier 47. Next, the support unit drive unit 95 is driven to set the support unit 65A to a vertical position (solid line in Figure 13). This sets the support unit 65A to a vertical position in the liquid. When transferring the substrates W to the center robot CR, the lifting mechanism 67 is used to gradually raise the lifter LF4 in the vertical direction Z.

[0117] With this attitude changing unit 41A, the attitude can be changed while the carrier 47 inside the tank is lowered. Therefore, the attitude of multiple substrates W can be changed quickly. As a result, throughput can be improved.

[0118] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.

[0119] (1) In the above-described embodiment, the in-tank carrier 47 is raised relative to the immersion tank 43 when the substrate W is passed to the central robot CR. However, the present invention is not limited to this embodiment. For example, the immersion tank 43 may be lowered relative to the in-tank carrier 47.

[0120] (2) In the above-described embodiment, the attitude changing unit 41 is equipped with an in-tank carrier 47. However, the present invention does not require an in-tank carrier 47. For example, a plurality of grooves may be formed in the support portion 65 of the lifter LF4, and a plurality of substrates W may be supported by the support portion 65. In this case, the attitude of the substrates W can be changed by a support portion drive unit 95 as shown in Figure 13.

[0121] (3) In the embodiments described above, the substrate processing apparatus 1 is equipped with a chemical solution processing apparatus CHB2 and a pure water processing apparatus ONB as batch processing apparatus. However, the present invention is not limited to such batch processing apparatus.

[0122] (4) In the above-described embodiment, the substrate processing apparatus 1 was configured to have a first single-wafer processing unit SWP1 and a second single-wafer processing unit SWP2 that performed processing with pure water or IPA, and a third single-wafer processing unit SWP3 that included a supercritical chamber 37. However, the present invention is not limited to such a single-wafer processing unit.

[0123] (5) In the above-described embodiment, the attitude changing unit 41 is located outside the immersion tank 43. However, the present invention is not limited to this form. That is, the attitude changing unit 41 may be made waterproof and located inside the immersion tank 43.

[0124] (6) In the above-described embodiment, the underwater attitude changing unit 25 raised the substrates W one by one from the liquid surface. However, the present invention is not limited to this form. That is, if the center robot CR is equipped with two hands 29, the underwater attitude changing unit 25 may raise the substrates W two by two from the liquid surface. In other words, the substrates W may be raised from the liquid surface in proportion to the number of hands 29 of the center robot CR.

[0125] (7) In the embodiments described above, the substrate processing apparatus 1 was described using the configuration shown in Figure 1 as an example. However, the present invention is not limited to this configuration. In other words, the stocker block 5, the first transport mechanism HTR, and the transfer mechanism CTC are not essential. [Explanation of symbols]

[0126] 1 ... Substrate processing equipment 3… Loading / unloading block 5… Storage block 7… Transfer Block 9 ... Processing block W… Circuit board C... Career 11 … Input section 13… Dispensing section ACB… Transport and storage section 19… Conveying mechanism 21 ... shelf HTR… First conveying mechanism CTC … Transfer mechanism WTR… Second transport mechanism 23… Hand R1… 1st row R2 … 2nd row R3 … 3rd row BPU1~BPU3… 1st to 3rd batch processing units 25... Underwater attitude change unit CHB1, CHB2 ... Chemical treatment section ONB… Pure water treatment section LF1~LF4 ... Lifter CR... Center Robot SWP1~SWP3… 1st to 3rd leaf processing unit 31 … Buffer section 41 ... Posture change unit 43 … Soaking tank 45… Pusher 47... In-tank carrier 49… Rotation mechanism 55 ... Engagement part 57… Air cylinder 57a ... Operating shaft 57b … Engagement piece 63 … Back plate part 65 … Support part

Claims

1. In a substrate processing apparatus for processing substrates, A batch processing unit that processes multiple circuit boards simultaneously in a vertical orientation, A single-wafer processing unit that processes a single substrate in a horizontal position, A configuration change unit holds multiple substrates that have been processed by the batch processing unit and converts them from a vertical orientation to a horizontal orientation, A first transport unit that transports multiple substrates that have been processed in the batch processing unit to the attitude conversion unit, A second transport unit transports the substrate, which has been positioned horizontally in the attitude conversion unit, to the single-wafer processing unit. An immersion tank for housing multiple substrates whose orientation is to be changed by the orientation changing unit, and for immersing the multiple substrates in pure water until the orientation change is performed, Equipped with, The immersion tank is further equipped with a lifting mechanism that moves the plurality of substrates, which are positioned horizontally, up and down relative to each other. When the second transport unit receives the substrate, it moves only the substrate to be transported from among the multiple substrates so that it is positioned above the liquid surface of the immersion tank. The aforementioned attitude changing unit is A carrier inside a tank that houses multiple substrates, with the surfaces of the multiple substrates positioned perpendicular to a predetermined alignment direction, A rotation mechanism that rotates the in-tank carrier below the liquid surface in the immersion tank about a horizontal axis perpendicular to the alignment direction, Equipped with, The aforementioned lifting mechanism is The lifter comprises a back plate portion extending along the inner surface of the immersion tank, and a support portion provided at the lower end of the back plate portion, extending horizontally to support the in-tank carrier, A substrate processing apparatus characterized by moving the lifter to a submerged position in which the entire in-tank carrier is supported below the liquid surface of the immersion tank, a rotational position below the submerged position in which the support portion is separated from the lower surface of the in-tank carrier, a transfer position in which a substrate is transferred between the first transport portion and the lifter, and a transport position in which only the substrate to be transported is positioned above the liquid surface of the immersion tank.

2. In the substrate processing apparatus according to claim 1, The aforementioned rotating mechanism is The carrier inside the tank comprises a pair of rotating shafts that can move between a connecting position connected to a side perpendicular to the alignment direction and an open position spaced apart from the side, To change the orientation of multiple substrates in the carrier inside the tank, a rotational drive unit rotates the pair of rotating shafts located at the connecting position, A substrate processing apparatus characterized by comprising the following features.

3. In the substrate processing apparatus according to claim 2, The pair of rotating shafts are provided with a forward and backward drive mechanism that moves them between the connected position and the open position. A substrate processing apparatus characterized in that the forward / backward drive mechanism advances the pair of rotating shafts to the coupling position, moves the lifter to the rotation position, and the rotation drive unit changes the orientation of multiple substrates in the tank carrier.

4. In the substrate processing apparatus according to any one of claims 1 to 3, The aforementioned in-tank carrier has an opening at its bottom, The lifter is provided in a position where the support portion does not close the opening. The system includes a pusher that supports the lower edges of multiple substrates, has a shape that does not interfere with the opening and the support portion, and moves up and down between a standby position located below the in-tank carrier and at the bottom of the immersion tank, and a transfer position located above the liquid level in the immersion tank, where multiple substrates are transferred between the first transport unit. A substrate processing apparatus characterized in that, when the first transport unit has transported a plurality of substrates to the attitude changing unit, the pusher is raised to the transfer position to receive the plurality of substrates, and then the pusher is lowered to the standby position to transfer the plurality of substrates to the tank carrier.

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