Mounting operation condition management device, component mounting machine, mounting operation condition management method, mounting operation condition management program, and recording medium

Abstract

In the present invention, a plurality of recipe conditions R1-R4 (mounting operation conditions) each specifying the operation of a component-mounting machine 1, which produces a component-mounted board by mounting a component Wp on a board B, are managed as management objects by an operation condition management unit 813. Actual results of the operations executed on the basis of recipe conditions R1-R4, which are management objects, by the component-mounting machine 1 to produce the component-mounted board are acquired as actual result data Dp1-Dp4. These actual result data Dp1-Dp4 are stored in association with the recipe conditions R1-R4 at the time of acquisition of those actual result data Dp1-Dp4. The actual result data Dp1-Dp4 stored by the actual result saving process in step S303 are displayed on a display of a UI 12 in association with the recipe conditions R1-R4 at the time of acquisition of the actual result data Dp1-Dp4.

Description

Technical Field

[0001] This invention relates to a technique for managing mounting operation conditions that define the operation of a component mounter that produces a substrate with components mounted thereon by mounting components on a substrate.

Background Art

[0002] There is known a component mounter that sucks components supplied by a component supply device such as a tape feeder with a nozzle attached to a mounting head and mounts them on a substrate. In such a component mounter, if the operation conditions of various operations executed to mount components on a substrate are inappropriate, operation failures such as the inability to execute the operation properly occur. Therefore, Patent Document 1 discloses a technique for identifying a nozzle that causes a failure. Further, Patent Document 2 discloses a technique for determining whether to save recognition parameters based on the success or failure of the result of recognizing a component adsorbed on a nozzle based on predetermined recognition parameters.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] According to the technology in Patent Document 1, it is possible to identify nozzles that cause mounting defects. However, it was difficult for users to determine the optimal nozzle to suppress the occurrence of mounting defects. Furthermore, according to the technology in Patent Document 2, it is possible to avoid the storage of inappropriate recognition parameters and their subsequent use in component recognition. However, it was difficult for users to determine the appropriate recognition parameters to suppress component recognition failures. Thus, although the use of mounting operating conditions (nozzles, recognition parameters) that result in malfunctions can be avoided, it was difficult for users to determine the appropriate mounting operating conditions to suppress malfunctions.

[0005] This invention has been made in view of the above-mentioned problems, and aims to provide a technology that allows users to easily understand the appropriate implementation and operating conditions for suppressing malfunctions. [Means for solving the problem]

[0006] The mounting operation condition management device according to the present invention comprises: an operation condition management unit that manages a plurality of mounting operation conditions that define the operation of a component mounting machine that produces component-mounted boards by mounting components onto a substrate; an actual performance acquisition unit that acquires actual performance data of operations performed by the component mounting machine based on the managed mounting operation conditions in order to produce component-mounted boards; and a UI control unit that controls a user interface. The operation condition management unit executes an actual performance saving process that saves the actual performance data acquired by the actual performance acquisition unit in association with the mounting operation conditions at the time the actual performance data was acquired. In the actual performance saving process, the actual performance data is saved in association with the type of component-mounted board produced by the component mounting machine at the time the actual performance data was acquired. The UI control unit displays the actual performance data for component-mounted boards of the same type, saved by the actual performance saving process, to the user via the user interface in association with the mounting operation conditions at the time the actual performance data was acquired.

[0007] The component mounting machine according to the present invention is a component mounting machine that produces component-mounted substrates by mounting components onto a substrate, and comprises an operation condition management unit that manages a plurality of mounting operation conditions that define the operation of the component mounting machine, a performance acquisition unit that acquires performance data of operations performed by the component mounting machine based on the managed mounting operation conditions in order to produce component-mounted substrates, and a UI control unit that controls a user interface, wherein the operation condition management unit executes a performance storage process that saves the performance data acquired by the performance acquisition unit in association with the mounting operation conditions at the time the performance data was acquired, and in the performance storage process, the performance data is saved in association with the type of component-mounted substrate produced by the component mounting machine at the time the performance data was acquired, and the UI control unit displays the performance data for component-mounted substrates of the same type saved by the performance storage process to the user via the user interface in association with the mounting operation conditions at the time the performance data was acquired.

[0008] The mounting operation condition management method according to the present invention comprises the steps of: managing a plurality of mounting operation conditions as targets, each defining the operation of a component mounting machine that produces component-mounted boards by mounting components onto a board; acquiring actual data of the operations performed by the component mounting machine based on the managed mounting operation conditions in order to produce component-mounted boards; performing an actual data saving process to save the actual data in association with the mounting operation conditions at the time the actual data was acquired and the type of component-mounted board produced by the component mounting machine; and showing the actual data for component-mounted boards of the same type, saved by the actual data saving process, to the user via a user interface in association with the mounting operation conditions at the time the actual data was acquired.

[0009] The present invention provides a computer to perform the following steps: manage a plurality of mounting operation conditions as targets, each defining the operation of a component mounting machine that produces component-mounted boards by mounting components onto a board; acquire actual data of the operations performed by the component mounting machine based on the managed mounting operation conditions in order to produce component-mounted boards; perform an actual data saving process to save the actual data in association with the mounting operation conditions at the time the actual data was acquired and the type of component-mounted board produced by the component mounting machine; and present to the user via a user interface the actual data for component-mounted boards of the same type that has been saved by the actual data saving process, in association with the mounting operation conditions at the time the actual data was acquired.

[0010] The recording medium according to the present invention records the above-mentioned implementation operating condition management program in a way that can be read by a computer.

[0011] In the present invention (mounting operation condition management device, component mounting machine, mounting operation condition management method, mounting operation condition management program, and recording medium) configured as described above, multiple mounting operation conditions that define the operation of a component mounting machine that produces component-mounted circuit boards by mounting components onto a circuit board are managed as targets. The actual operation performed by the component mounting machine based on the managed mounting operation conditions to produce component-mounted circuit boards is acquired as actual data. This actual data is saved in association with the mounting operation conditions at the time the actual data was acquired (actual data saving process). Furthermore, in this actual data saving process, the actual data is saved in association with the type of component-mounted circuit board produced by the component mounting machine at the time the actual data was acquired. The actual data for component-mounted circuit boards of the same type, saved by the actual data saving process, is then shown to the user via the user interface in association with the mounting operation conditions at the time the actual data was acquired. Therefore, the user can check the actual data showing the actual operation performed based on the mounting operation conditions via the user interface. As a result, the user can easily grasp the appropriate mounting operation conditions to suppress malfunctions.

[0012] Furthermore, when the UI control unit confirms that the user has selected a piece of performance data from among the performance data presented to the user via the user interface, the operation condition management unit may configure the mounting operation condition management device to cause the component mounting machine to execute the operation for producing a component-mounted board using the mounting operation conditions corresponding to the selected performance data. In such a configuration, the user can check the performance data and cause the component mounting machine to execute the operation for producing a component-mounted board using the mounting operation conditions that they deem appropriate.

[0013] Furthermore, the mounting operation condition management device may be configured such that the mounting operation conditions are a combination of multiple operation parameters that define the operations performed by the component mounting machine to produce a component-mounted circuit board. In such a configuration, the user can check performance data showing the actual operations performed based on the multiple operation parameters through a user interface. As a result, the user can easily understand the appropriate combination of multiple operation parameters to suppress malfunctions.

[0014] Furthermore, the mounting operation condition management device may be configured such that the performance data includes multiple performance evaluation items that evaluate the operations performed by the component mounting machine to produce component-mounted circuit boards. In such a configuration, the user can conduct a multifaceted analysis based on multiple performance evaluation items. As a result, the user can easily and accurately grasp the appropriate mounting operation conditions to suppress malfunctions.

[0015] Furthermore, various specific examples of performance evaluation items can be envisioned. In other words, the mounting operation condition management device may be configured so that the performance data includes at least one of the following as performance evaluation items: production efficiency, which is an indicator of the time required to produce a board with components mounted; adsorption rate, which is an indicator of the percentage of components that the nozzle used to pick up components to mount them onto the board successfully picks up; error rate, which is an indicator of the frequency of errors that occur in the component mounting machine; and mounting accuracy, which is an indicator of the accuracy of the position in which the component mounting machine mounts components onto the board.

[0016] Furthermore, the operating condition management unit may calculate performance evaluation results based on multiple performance evaluation items, and the UI control unit may configure the implementation operating condition management device to display the performance evaluation results to the user through a user interface. In such a configuration, the user can easily understand the appropriate implementation operating conditions for suppressing malfunctions based on the performance evaluation results.

[0017] Alternatively, the UI control unit may be configured to accept user input on a user interface for inputting the importance of multiple performance evaluation items, and the operating condition management unit may be configured to calculate performance evaluation results while weighting them according to their importance. In such a configuration, the user can determine the appropriateness of the implementation operating conditions based on the performance evaluation results calculated according to the degree to which the user places importance on each performance evaluation item. As a result, the user can easily grasp the implementation operating conditions that meet their needs.

[0018] Furthermore, the component mounting machine may perform operations to produce a board with components mounted based on the mounting operation conditions set for the component mounting machine, and the mounting operation condition management unit may be configured to add the changed mounting operation conditions to the management unit when the mounting operation conditions set for the component mounting machine are changed. In such a configuration, the user can change the mounting operation conditions and understand whether each mounting operation condition is appropriate.

[0019] Furthermore, the UI control unit may be configured as a mounting operation condition management device that displays to the user, in chronological order, the timing of changes in the mounting operation conditions set on the component mounting machine, and the actual data saved by the actual data saving process before and after the timing of the changes, through a user interface. In such a configuration, the suitability of the mounting operation conditions can be determined by referring to the actual data before and after the timing of the changes in the mounting operation conditions.

[0020] In addition, when the performance data acquired by the performance acquisition unit deviates from the allowable range, the operation condition management unit may configure the mounting operation condition management device to start the performance saving process. In such a configuration, when a defective tendency occurs in the operation of the component mounter, the saving of the performance data is started. Therefore, the user can consider appropriate mounting operation conditions and appropriately respond to the defective tendency.

Advantages of the Invention

[0021] According to the present invention, it becomes possible for the user to easily grasp the mounting operation conditions appropriate for suppressing malfunction.

Brief Description of the Drawings

[0022] [Figure 1] A block diagram showing an example of a component mounting system including the component mounter according to the present invention. [Figure 2] A plan view schematically showing an example of the component mounter according to the present invention. [Figure 3] A block diagram showing the electrical configuration of the component mounter shown in FIG. 1. [Figure 4] A flowchart showing the operation in substrate production executed by the component mounter shown in FIG. 2. [Figure 5] A flowchart showing an example of a method for managing recipe conditions. [Figure 6A] A flowchart showing an example of a method for collecting performance data. [Figure 6B] A diagram schematically showing an example of the operation executed by the flowchart of FIG. 6A. [Figure 7] A flowchart showing a first example of a method for supporting the setting of recipe conditions. [Figure 8] A diagram schematically showing an example of a performance list screen displayed according to the flowchart of FIG. 7. [Figure 9] A diagram schematically showing an example of a performance time change screen displayed according to the flowchart of FIG. 7. [Figure 10] A flowchart showing a second example of a method for supporting the setting of recipe conditions. [Figure 11]This diagram schematically shows an example of a performance evaluation screen displayed according to the flowchart in Figure 10. [Modes for carrying out the invention]

[0023] Figure 1 is a block diagram showing an example of a component mounting system equipped with a component mounting machine according to the present invention. The component mounting system 9 includes a component mounting machine 1, a substrate inspection machine 91, and a conveyor 92 for transporting a substrate B (Figure 2) from the component mounting machine 1 to the substrate inspection machine 91. The component mounting machine 1 performs component mounting by mounting components Wp to target points on the substrate B, and the substrate inspection machine 91 performs mounting position inspection by measuring the positional deviation between the components Wp mounted on the substrate B and the target points. The position measurement result I, which is the result of the mounting position inspection by the substrate inspection machine 91, is transmitted from the substrate inspection machine 91 to the component mounting machine 1.

[0024] Figure 2 is a schematic plan view showing an example of a component mounting machine according to the present invention, and Figure 3 is a block diagram showing the electrical configuration of the component mounting machine in Figure 1. In Figure 2, the horizontal direction X, the horizontal direction Y perpendicular to the X direction, and the vertical direction Z are shown.

[0025] As shown in Figure 3, the component mounting machine 1 is equipped with a controller 8 that controls various parts of the component mounting machine 1. This controller 8 includes an arithmetic processing unit 81 and a storage unit 82. The arithmetic processing unit 81 is a processor such as a CPU (Central Processing Unit) and performs various calculations. The storage unit 82 is a storage device such as an SSD (Solid State Drive) and stores the management program Pp and database DB, which will be described later. The arithmetic processing unit 81 also controls the communication unit 11 and UI (User Interface) 12 equipped in the component mounting machine 1. Here, the communication unit 11 performs communication with the board inspection machine 91. The UI 11 has input devices such as a mouse and keyboard, and output devices such as a display. Note that the input and output devices of the UI 11 do not need to be configured separately, and they may be configured as an integrated unit by a touch panel display. In contrast, the arithmetic processing unit 81 has a communication control unit 811 that controls the communication unit 11 and a UI control unit 812 that controls the UI 12. The communication control unit 811 stores the position measurement result I received by the communication unit 11 from the board inspection machine 91 in the storage unit 82. The UI control unit 812 processes the input to the input device of the UI 12 and causes the UI 12 to output information to the output device.

[0026] The communication control unit 811 and the UI control unit 812 are constructed in the arithmetic processing unit 81 when the arithmetic processing unit 81 executes the management program Pp. Furthermore, the operation condition management unit 813 and the performance acquisition unit 814, described later, are also constructed in the arithmetic processing unit 81 upon execution of the management program Pp. The management program Pp is stored in the storage unit 82. The management program Pp may be stored in the storage unit 82 (recording medium) at the time of factory shipment of the component mounting machine 1, or it may be downloaded from, for example, an internet server's storage device (recording medium) and stored in the storage unit 82. Alternatively, it may be read from a USB (Universal Serial Bus) memory (recording medium) and stored in the storage unit 82.

[0027] The component mounting machine 1 mounts components Wp onto a substrate B that is fed in from the upstream side in the X direction (substrate transport direction) and then discharges it to the downstream side in the X direction. Multiple mounting points are provided on the substrate B, and the controller 8 controls each part of the component mounting machine 1 to mount components Wp onto each mounting point. Here, components Wp are bare chips of diced wafer W, attached to an adhesive sheet Ws.

[0028] The component mounting machine 1 is equipped with a transport unit 2 that transports the substrate B in the X direction. The transport unit 2 has an input conveyor 21, a mounting conveyor 22, and an output conveyor 23 arranged in this order in the X direction, and these conveyors 21 to 23 cooperate to transport the substrate B in the X direction. The controller 8 has a transport control unit 85 that controls the transport of the substrate B by the transport unit 2. The transport control unit 85 performs the following operations by controlling the input conveyor 21, the mounting conveyor 22, and the output conveyor 23. Specifically, the transport control unit 85 places the substrate B that has been brought in from outside the component mounting machine 1 by the input conveyor 21 at the input waiting position Li on the input conveyor 21. The transport control unit 85 also stops the substrate B that has been transported from the input waiting position Li on the input conveyor 21 to the work position Lm on the mounting conveyor 22 at the work position Lm. Furthermore, the transport control unit 85 places the substrate B, which has been transported from the work position Lm on the mounting conveyor 22 to the discharge waiting position Lo on the discharge conveyor 23, into a waiting position Lo. Then, when the substrate B becomes ready for loading into the substrate inspection machine 91, the transport control unit 85 discharges the substrate B from the discharge waiting position Lo on the discharge conveyor 23 towards the substrate inspection machine 91.

[0029] Furthermore, the component mounting machine 1 is equipped with a component supply mechanism 3 that supplies components Wp. The controller 8 has a component supply control unit 86 that controls the component supply mechanism 3. The component supply mechanism 3 includes a wafer table 31 that supports the wafer W and a component extraction unit 35 that extracts components Wp from the wafer W supported by the wafer table 31. The component extraction unit 35 has an extraction head 36 that extracts components Wp from the wafer table 31, and the extraction head 36 can be driven in the X and Y directions.

[0030] In other words, the parts extraction unit 35 includes an X-axis rail 351 that supports the extraction head 36 so as to be movable in the X direction, and an X-axis motor 352 that extends in the X direction and drives a ball screw attached to the extraction head 36. The parts extraction unit 35 also includes a Y-axis rail 353 that supports the X-axis rail 351 so as to be movable in the Y direction, a ball screw 354 that extends in the Y direction and is attached to the X-axis rail 351, and a Y-axis motor 355 that drives the ball screw 354. Therefore, the parts supply control unit 86 can move the extraction head 36 in the X direction by driving the ball screw with the X-axis motor 352, and move the extraction head 36 in the Y direction together with the X-axis rail 351 by driving the ball screw 354 with the Y-axis motor 355.

[0031] The extraction head 36 has a bracket 361 extending in the X direction and two flipper nozzles 362 rotatably supported on the bracket 361. Each flipper nozzle 362 rotates around a rotation axis parallel to the X direction to be positioned in either a downward-facing suction position or an upward-facing transfer position (position shown in Figure 2). The extraction head 36 also has a Z-axis motor 363 that drives the bracket 361 in the Z direction, and the parts supply control unit 86 can move the flipper nozzles 362 in the Z direction together with the bracket 361 by having the Z-axis motor 363 drive the bracket 361.

[0032] Furthermore, the parts supply mechanism 3 includes an eject pin that pushes up the parts Wp to be attracted by the flipper nozzle 362 from below the sheet Ws, and an eject motor 37 that drives the eject pin in the Z direction. Therefore, the parts supply control unit 86 can move the eject pin in the Z direction by having the eject motor 37 drive the eject pin.

[0033] The component supply control unit 86, which controls the component supply mechanism 3, positions the flipper nozzle 362 in the suction position and brings it into contact with the component Wp on the wafer table 31 from above. The component supply control unit 86 then pushes the center of the component Wp upward with the eject pin, separating the component Wp from the sheet Ws, and applies negative pressure to the flipper nozzle 362 to cause the component Wp to be attracted to the flipper nozzle 362 from the sheet Ws. The component supply control unit 86 then raises the flipper nozzle 362 to remove the component Wp from the wafer table 31. Furthermore, the component supply control unit 86 supplies the component Wp by positioning the flipper nozzle 362 in the transfer position.

[0034] The component mounting machine 1 includes a component transfer unit 4 that transfers the components Wp supplied by the component supply mechanism 3 to the substrate B which is stopped at the working position Lm. The controller 8 has a component transfer control unit 87 that controls the component transfer unit 4. The component transfer unit 4 has a support member 41 that is movable along a fixed rail provided on the ceiling of the component mounting machine 1 in the Y direction, and a mounting head 42 that is supported by the support member 41 so as to be movable in the X direction. This mounting head 42 has two downward-facing transfer nozzles 421. The component transfer unit 4 also has an X-axis motor 43 that drives the mounting head 42 in the X direction, a Y-axis motor 44 that drives the support member 41 in the Y direction along with the mounting head 42, and a Z-axis motor 45 that drives the transfer nozzles 421 in the Z direction. Therefore, the component transfer control unit 87 can move the mounting head 42 in the X direction with the X-axis motor 43 and move the mounting head 42 in the Y direction with the Y-axis motor 44. Furthermore, the component transfer control unit 87 can move the transfer nozzle 421 in the Z direction using the Z-axis motor 45.

[0035] The component transfer control unit 87, which controls the component transfer unit 4, moves the mounting head 42 above the extraction head 36 when picking up and mounting component Wp. It then positions the transfer nozzle 421 above the component Wp held by the flipper nozzle 362 at the transfer position and lowers the transfer nozzle 421 to make contact with component Wp. Subsequently, the component supply control unit 86 releases the negative pressure on the flipper nozzle 362, while the component transfer control unit 87 applies negative pressure to the transfer nozzle 421 and raises it. Once component Wp is picked up by the transfer nozzle 421 of the mounting head 42, the component transfer control unit 87 moves the mounting head 42 so that the component Wp picked up by the transfer nozzle 421 is positioned above the mounting target point on the substrate B, which stops at the mounting position Pm. Furthermore, the component transfer control unit 87 lowers the transfer nozzle 421, bringing the component Wp attracted to the transfer nozzle 421 into contact with the mounting point on the substrate B. Once the component Wp makes contact with the mounting point on the substrate B, the component transfer control unit 87 releases the negative pressure on the transfer nozzle 421. In this way, the component Wp is transferred to the mounting point on the substrate B.

[0036] Furthermore, the component mounting machine 1 has a component recognition camera 51 positioned facing upwards. The controller 8 has an imaging control unit 88 that controls the component recognition camera 51. The component recognition camera 51 images the component Wp that is attracted to the transfer nozzle 421 from below before the component Wp is transferred to the substrate B. In other words, when the mounting head 42 attracts the component Wp with the transfer nozzle 421, the component transfer control unit 87 brings the component Wp facing the component recognition camera 51 from above before bringing the component Wp facing the mounting target point on the substrate B. The imaging control unit 88 then illuminates the component Wp with illumination light from the component recognition camera 51 and causes the component recognition camera 51 to image the component Wp, thereby acquiring an image of the component Wp. Furthermore, the imaging control unit 88 recognizes the position of the component Wp that is attracted to the transfer nozzle 421 (component recognition) based on the result of binarizing the image of the component Wp with a predetermined threshold. Then, the component transfer control unit 87 transfers the component Wp to the mounting point on the substrate B by controlling the position of the transfer nozzle 421 according to the position of the component Wp recognized by the imaging control unit 88.

[0037] Figure 4 is a flowchart showing the operation of a circuit board production process performed by the component mounting machine in Figure 2. In this circuit board production process, one pre-assembled circuit board is produced by mounting component Wp onto circuit board B. When producing multiple pre-assembled circuit boards, the circuit board production process in Figure 4 is repeated. Furthermore, by repeating the circuit board production process in Figure 4 while changing the type of pre-assembled circuit board, a predetermined number of pre-assembled circuit boards of different types can be produced. When the type of pre-assembled circuit board to be produced is changed, at least one of the following is changed: either the type of circuit board B fed into the component mounting machine 1 or the type of component Wp mounted onto circuit board B by the component mounting machine 1.

[0038] In step S101, the transport control unit 85 controls the transport unit 2 to transport the substrate B that has been brought into the loading standby position Li to the working position Lm and stops the substrate B at the working position Lm. In step S102, the component supply control unit 86 controls the component extraction unit 35 to supply the component Wp extracted from the wafer W by the flipper nozzle 362 to the mounting head 42. In response, the component transfer control unit 87 controls the component transfer unit 4 to pick up the component Wp supplied by the flipper nozzle 362 with the transfer nozzle 421 (step S103).

[0039] Once the suction of component Wp is complete, the component supply control unit 86 controls the component transfer unit 4 to position the component Wp, which has been picked up by the transfer nozzle 421, facing the component recognition camera 51 from above. Then, component recognition in step S104 is performed. That is, the imaging control unit 88 acquires an image of component Wp by imaging it with the component recognition camera 51. Based on this image, the imaging control unit 88 recognizes the position of component Wp. If the recognition of the position of component Wp fails, steps S102 to S104 are re-executed. Steps S102 to S104 are re-executed until recognition is successful or the number of executions reaches a predetermined number of retries.

[0040] In this way, the position of component Wp acquired by the imaging control unit 88 is transmitted to the component transfer control unit 87. The component transfer control unit 87 controls the component transfer unit 4 to adjust the position of the transfer nozzle 421 based on the position of component Wp acquired from the imaging control unit 88, and aligns component Wp with the component mounting points on substrate B, thereby transferring component Wp to the component mounting points on substrate B (step S105). Steps S101 to S105 are repeated until the transfer of component Wp to all component mounting points on substrate B is complete (until "YES" is displayed in step S106).

[0041] By the way, the board production shown in Figure 4 is carried out based on various operating parameters set for the component mounting machine 1. Next, we will explain the setting and management of these operating parameters. The operating parameters set for the component mounting machine 1 include recipe parameters that are changed according to the type of component-mounted board, and machine parameters that are set regardless of the type of component-mounted board. In other words, when changing the type of component-mounted board produced by the component mounting machine 1, the recipe parameters set for the component mounting machine 1 change before and after the board type change, while the machine parameters set for the component mounting machine 1 remain unchanged before and after the board type change. Therefore, the recipe parameters are managed in association with the type of component-mounted board.

[0042] To give an example of recipe parameters, • Ejector pin rise amount: The amount by which the ejector motor 37 rises the ejector pin to separate the part Wp from the sheet Ws during the part supply in step S102. • Ejector pin raising speed: The speed at which the ejector motor 37 raises the ejector pin to separate the part Wp from the sheet Ws during part supply in step S102. • Flipper nozzle descent amount: In step S102, the amount by which the flipper nozzle 362 is lowered toward part Wp in order to attract part Wp during part supply. • Flipper nozzle descent speed: In step S102, the speed at which the flipper nozzle 362 is lowered toward the part Wp in order to attract the part Wp. • Illumination level: In part recognition in step S104, the level of illumination light shining onto part Wp from the illumination of the part recognition camera 51. • Threshold... In part recognition in step S104, the threshold for binarizing the image of part Wp. • Tolerance…In part recognition in step S104, the tolerance of the edge position detected by binarizing the image of part Wp. • Part size… The size of the part to be recognized in step S104. • Transfer height: In step S105, the height at which the transfer nozzle 421 is lowered in order to transfer component Wp to substrate B. • Transfer speed: The speed at which the transfer nozzle 421 is lowered in order to transfer component Wp to substrate B during component transfer in step S105. • Transfer load: The load applied by the transfer nozzle 421 to component Wp that is in contact with substrate B during component transfer in step S105. • Substrate thickness: The thickness of substrate B, which is the substrate to be manufactured. This is the result.

[0043] For example, machine parameters are: • Substrate height: The height of the lower surface of the substrate B supported at the working position Lm by the mounting conveyor 22. • Loading standby position: The position of the wafer W waiting to be loaded onto the mounting conveyor 22 (loading standby position Li) • Loading standby position: The position of the wafer W waiting to be loaded outside the component mounting machine 1 (loading standby position Lo). • Number of retries: The number of retries for steps S102-S104 when component recognition fails in step S104. This is the result.

[0044] In contrast, the component mounting machine 1 has each recipe parameter and each machine parameter pre-set. Setting a recipe parameter means setting the value of the recipe parameter to the component mounting machine 1. For example, if the recipe parameter to be set is the thickness of the substrate, the specific value of the thickness of substrate B (e.g., 1 mm) is set in the controller 8 of the component mounting machine 1 and stored in the memory or storage unit 82 of the arithmetic processing unit 81. As a result, the controller 8 executes the control required for substrate production shown in Figure 4, under the condition that the thickness of substrate B is the set value (e.g., 1 mm). Machine parameters can be set in a similar manner. Incidentally, the user can set recipe parameters and machine parameters to the component mounting machine 1 by operating the UI 12.

[0045] Furthermore, in this embodiment, combinations of multiple recipe parameters are managed as recipe conditions. In particular, in order to manage the recipe conditions, performance data showing the actual operations performed by the component mounting machine 1 to which the recipe conditions are set is collected.

[0046] Figure 5 is a flowchart showing an example of a method for managing recipe conditions, Figure 6A is a flowchart showing an example of a method for collecting actual data, and Figure 6B is a schematic diagram showing an example of an operation performed by the flowchart in Figure 6A.

[0047] The recipe condition management shown in Figure 5 is performed by the operation condition management unit 813 to manage the recipe conditions to be stored in the database DB as managed items. In step S201, the operation condition management unit 813 determines whether the set recipe conditions, which are the recipe conditions set on the component mounting machine 1, have been changed. In other words, the user can change the recipe conditions (set recipe conditions) set on the component mounting machine 1 by operating the UI 12. Incidentally, if the value of at least one of the multiple recipe parameters that make up the set recipe conditions is changed, the operation condition management unit 813 determines that the set recipe conditions have been changed.

[0048] If the set recipe conditions are changed (if the answer is "YES" in step S201), the operation condition management unit 813 determines whether or not a recipe condition identical to the set recipe condition is stored as a managed item in the database DB (step S202). If a recipe condition identical to the set recipe condition is not stored, the set recipe condition is determined to be new (if the answer is "YES" in step S202), and the set recipe condition is added to the database DB as a managed item. Therefore, each time a user sets a new recipe condition that is not stored as a managed item in the database DB on the component mounting machine 1, a recipe condition is added to be stored as a managed item. In this way, multiple recipe conditions are stored and managed in the database DB.

[0049] The data collection shown in Figure 6A is performed by the performance acquisition unit 814 to collect performance data that shows the actual operation performed by the component mounting machine 1 based on the set recipe conditions. The performance data shows the values ​​(actual values) of multiple performance evaluation items.

[0050] Examples of performance evaluation items include: • Cycle time (production efficiency): The time required to produce a circuit board with components already mounted. • Adsorption rate: The percentage of times that the transfer nozzle 421 successfully adsorbs component Wp in order to mount component Wp onto substrate B (number of successful adsorptions / number of adsorption attempts) • Error rate: The frequency (number of times per unit time) at which a component mounting machine generates errors (e.g., abnormal motor shutdown). • Mounting accuracy: Positional deviation between component Wp and the mounting target point, as shown by position measurement result I. This is the result.

[0051] The performance acquisition unit 814 monitors the operations performed by the component mounting machine 1 during board production (Figure 4) and acquires performance data indicating the performance of those operations (step S301). Here, acquiring performance data means determining the values ​​of multiple performance evaluation items that constitute the performance data. Note that the timing for determining the values ​​of the performance evaluation items may differ depending on each performance evaluation item. When the performance acquisition unit 814 acquires performance data, it checks the recipe conditions (set recipe conditions) set on the component mounting machine 1 at the time the performance data was acquired (step S302). Then, it associates the performance data acquired in step S301 with the recipe conditions confirmed as set recipe conditions in step S302 and saves it to the database DB (step S303). Furthermore, in step S303, the performance data is associated with the type of component mounted board produced by the component mounting machine 1 at the time the performance data was acquired and saved to the database DB. As a result, as shown in Figure 6B, performance data Dp1 to Dp4 are saved to the database DB corresponding to multiple different recipe conditions R1 to R4. Here, the table in Figure 6B corresponds to one product type. Therefore, as multiple product types of pre-assembled circuit boards are produced, a separate table is created for each product type and stored in the database.

[0052] Then, based on the actual data Dp1 to Dp4 of the recipe conditions R1 to R4 stored in the database DB, the user is assisted in setting the recipe conditions. Figure 7 is a flowchart showing the first example of a method for assisting in setting recipe conditions, and Figure 8 is a schematic diagram showing an example of the actual results list screen displayed according to the flowchart in Figure 7.

[0053] In step S401, the UI control unit 812 determines whether or not an instruction to display the performance list screen S1 has been entered. In other words, the user can enter this instruction by operating the UI 12. If the UI control unit 812 determines that the instruction has been entered (YES in step S401), it displays the performance list screen S1 (Figure 8) on the UI 12's display (step S402).

[0054] In other words, the performance list screen S1 displays the performance data Dp1 to Dp4 of the operations performed by the component mounting machine 1 based on the recipe conditions R1 to R4, corresponding to those recipe conditions R1 to R4. Here, the performance list screen S1 displays the performance data Dp1 to Dp4 corresponding to component mounting boards of the same type. Which type of performance data Dp1 to Dp4 is displayed is set according to the user's operation on UI12. Incidentally, in the example in Figure 8, UPH (Unit Per Hour), mounting accuracy, adsorption rate, error rate, production quantity (number of boards with components mounted), and date and time (date and time of performance data update) are displayed as performance data. Note that the performance data displayed on the performance list screen S1 may be data that is essentially the same as the performance data stored in the database DB, but converted to data that is essentially the same as the actual performance data. For example, as described above, while the takt time is acquired as performance data in the database DB, the performance list screen S1 displays the UPH which is the takt time converted. Furthermore, it is not necessary to display all performance evaluation items managed in the database DB on the performance list screen S1. It is acceptable to display only some of the performance evaluation items managed in the database DB on the performance list screen S1. In addition, instead of displaying each recipe parameter that makes up recipe conditions R1 to R4 on the performance list screen S1, the names (R1 to R4) that identify recipe conditions R1 to R4 are displayed.

[0055] In step S403, the UI control unit 812 determines whether one recipe condition (in other words, the performance data corresponding to that recipe condition) has been selected from among the multiple recipe conditions R1 to R4 displayed on the performance list screen S1. In other words, the user can select one recipe condition from the performance list screen S1 by operating the UI 12. When one recipe condition is selected (YES in step S403), the operation condition management unit 813 sets the selected recipe condition to the component mounting machine 1 (step S404). As a result, from step S404 onward, the component mounting machine 1 performs PCB production (Figure 4) according to that recipe condition.

[0056] In the embodiment described above, multiple recipe conditions R1 to R4 (mounting operation conditions) that define the operation of the component mounting machine 1 to produce a component-mounted board by mounting components Wp onto substrate B are managed by the operation condition management unit 813 as targets. The actual operation performed by the component mounting machine 1 based on the recipe conditions R1 to R4 to produce a component-mounted board is acquired as actual data Dp1 to Dp4 (Figures 6A and 6B). This actual data Dp1 to Dp4 is saved in association with the recipe conditions R1 to R4 at the time the actual data Dp1 to Dp4 was acquired (step S303, actual data saving process). Furthermore, in this actual data saving process, the actual data Dp1 to Dp4 is saved in association with the type of component-mounted board produced by the component mounting machine 1 at the time the actual data Dp1 to Dp4 was acquired. Then, the performance data Dp1 to Dp4 for boards with the same type of components mounted, which were saved by the performance data saving process in step S303, are displayed on the UI12 display, corresponding to the recipe conditions R1 to R4 at the time the performance data Dp1 to Dp4 were acquired. Therefore, the user can check the performance data Dp1 to Dp4, which shows the results of the operations performed based on the recipe conditions R1 to R4, on the UI12 display. As a result, the user can easily understand the appropriate recipe conditions R1 to R4 to suppress malfunctions.

[0057] Furthermore, when the UI control unit 812 confirms that the user has selected one piece of performance data from among the performance data Dp1 to Dp4 displayed on the UI12 display (step S403), the operation condition management unit 813 causes the component mounting machine 1 to execute an operation for producing a component-mounted board using the recipe conditions corresponding to that performance data (step S404). In this configuration, the user can check the performance data Dp1 to Dr4 and, based on the recipe conditions they deem appropriate, cause the component mounting machine 1 to execute an operation for producing a component-mounted board.

[0058] Furthermore, recipe conditions R1 to R4 are combinations of multiple recipe parameters that define the operations performed by the component mounting machine 1 to produce a component-mounted board. In this configuration, the user can check the actual data Dp1 to Dp4, which shows the actual operations performed based on the multiple recipe parameters, on the UI12 display. As a result, the user can easily understand the appropriate combination of multiple recipe parameters (i.e., recipe conditions) to suppress malfunctions.

[0059] Furthermore, performance data Dp1 to Dp4 include multiple performance evaluation items that evaluate the operations performed by the component mounting machine 1 to produce pre-mounted circuit boards. In this configuration, the user can conduct a multifaceted analysis based on multiple performance evaluation items. As a result, the user can easily and accurately grasp the appropriate recipe conditions to suppress malfunctions.

[0060] Furthermore, the component mounting machine 1 performs operations to produce a board with components mounted based on the recipe conditions set in the component mounting machine 1 (Figure 4). Also, when the recipe conditions set in the component mounting machine 1 (set recipe conditions) are changed (step S201), the operation condition management unit 813 adds the changed recipe conditions to the management targets (steps S202, S203). In this configuration, the user can change the recipe conditions and understand the suitability of each recipe condition.

[0061] By the way, in the above embodiment, in step S401 of Figure 7, the performance list screen S1 is displayed on the UI12 display. In step S401, the performance time change screen S2 of Figure 9 may be displayed together with or instead of the performance list screen S1. Here, Figure 9 is a schematic diagram showing an example of the performance time change screen displayed according to the flowchart of Figure 7. Figure 9 shows a graph representing the time change of performance data. In Figure 9, a graph showing the time change of a single performance evaluation item (specifically, implementation accuracy) included in the performance data is shown. However, the time changes of the values ​​of multiple performance evaluation items included in the performance data may be displayed in parallel.

[0062] In particular, in this example, at the change timing Tc while component mounting machine 1 is producing a component-mounted board of one type, the recipe condition is changed from recipe condition R3 to recipe condition R4. Correspondingly, the actual time change screen S2 displays the recipe condition change timing Tc, the name (R3) that identifies recipe condition R3 before the change timing Tc, and the name (R4) that identifies recipe condition R4 after the change timing Tc. Furthermore, the time change of actual data (mounting accuracy) before and after the recipe condition change timing Tc is shown.

[0063] In other words, the UI control unit 812 displays on the UI 12 display, in chronological order, the change timing Tc when the recipe conditions set on the component mounting machine 1 are changed while the component mounting machine 1 is producing a component-mounted board of one type, and the actual data saved by the actual data saving process in step S303 before and after the change timing Tc. In this configuration, the user can understand whether the recipe conditions are appropriate by referring to the actual data before and after the recipe condition change timing Tc.

[0064] Figure 10 is a flowchart showing a second example of a method for assisting in setting recipe conditions, and Figure 11 is a schematic diagram showing an example of a performance evaluation screen displayed according to the flowchart in Figure 10. In step S501, the UI control unit 812 determines whether or not an instruction to display the performance evaluation screen S3 has been entered. In other words, the user can enter this instruction by operating the UI 12.

[0065] When the UI control unit 812 determines that the instruction has been input (YES in step S501), the operating condition management unit 813 calculates evaluation values ​​V1 to V4 (actual evaluation results) for each of the recipe conditions R1 to R4, based on multiple actual evaluation items of the actual data (step S502). In particular, the operating condition management unit 813 calculates the evaluation values ​​V1 to V4 using the following evaluation formula, which weights the actual evaluation items to be weighted (UPH, implementation accuracy, error rate, and adsorption rate).

[0066] Evaluation value = (100 × UPH acquisition value / UPH tolerance value) × W1 +(100 × Tolerance for implementation precision / Acquired value of implementation precision) × W2 +(100-(Obtained error rate - Allowable error rate)))×W3 + (Acquired adsorption rate - Allowable adsorption rate) × W4 It is given by.

[0067] Here, the values ​​of each term on the right-hand side of the evaluation formula are in units of percentage. Furthermore, weight coefficient CW1 is the weight coefficient for UPH, weight coefficient CW2 is the tolerance value for implementation accuracy, weight coefficient CW3 is the weight coefficient for error occurrence rate, and weight coefficient CW4 is the weight coefficient for adsorption rate. In particular, the performance evaluation screen S3 is provided with weight coefficient setting units Ow1, Ow2, Ow3, and Ow4 for setting the weight coefficients CW1, W2, W3, and W4 respectively, and the user can change the weight coefficients CW1, W2, W3, and W4 by operating the weight coefficient setting units Ow1, Ow2, Ow3, and Ow4.

[0068] In step S503, the UI control unit 812 displays the performance evaluation screen S3, which includes the evaluation values ​​V1 to V4 calculated by the operating condition management unit 813, on the UI 12 display. In step S504, the UI control unit 812 determines whether any of the weight coefficients CW1 to CW4 have been changed by the user through the operation of the weight coefficient setting unit Ow1 to Ow4. If any of the weight coefficients CW1 to CW4 have been changed (if the answer is "YES" in step S504), the evaluation values ​​are recalculated in step S502, and the performance evaluation screen S3 is displayed in step S503.

[0069] On the other hand, if no change in the weight coefficients CW1 to CW4 is confirmed in step S504 (if "NO"), the UI control unit 812 determines whether one recipe condition (in other words, the actual data corresponding to that one recipe condition) has been selected from among the multiple recipe conditions R1 to R4 displayed on the actual list screen S1 (step S505). If no selection of one recipe condition is confirmed (if "NO" is confirmed in step S505), the process returns to step S504. If one recipe condition is selected (if "YES" is confirmed in step S505), the operation condition management unit 813 sets the selected recipe condition to the component mounting machine 1 (step S506). As a result, from step S506 onward, the component mounting machine 1 performs PCB production (Figure 4) according to that recipe condition.

[0070] As explained above, in the example of setting support shown in Figure 10, the operating condition management unit 813 calculates evaluation values ​​V1 to V4 (performance evaluation results) based on multiple performance evaluation items, and the UI control unit 812 displays the evaluation values ​​V1 to V4 on the UI 12 display (performance list screen S1). In this configuration, the user can easily understand the appropriate recipe conditions for suppressing malfunctions based on the evaluation values ​​V1 to V4.

[0071] Furthermore, the UI control unit 812 receives user input to the UI 12, which inputs weight coefficients CW1 to CW4 (importance) for each of the multiple performance evaluation items. The operating condition management unit 813 calculates evaluation values ​​V1 to V4 while applying weights according to the weight coefficients CW1 to CW4 (step S502). In this configuration, the user can determine the appropriateness of the recipe conditions based on the evaluation values ​​V1 to V4 calculated according to the degree to which the user considers each performance evaluation item important. As a result, the user can easily grasp the recipe conditions that meet their needs.

[0072] In the above embodiment, the component mounting machine 1 corresponds to an example of the "component mounting machine" of the present invention, the UI 12 corresponds to an example of the "user interface" of the present invention, the UI control unit 812 corresponds to an example of the "UI control unit" of the present invention, the operation condition management unit 813 corresponds to an example of the "operation condition management unit" of the present invention, the performance acquisition unit 814 corresponds to an example of the "performance acquisition unit" of the present invention, the storage unit 82 corresponds to an example of the "recording medium" of the present invention, the arithmetic processing unit 81 and the storage unit 82 correspond to an example of the "mounting operation condition management device" of the present invention, the substrate B corresponds to an example of the "substrate" of the present invention, the performance data Dp1 to Dp4 corresponds to an example of the "performance data" of the present invention, the management program Pp corresponds to an example of the "mounting operation condition management program" of the present invention, the recipe conditions R1 to R4 correspond to an example of the "mounting operation conditions" of the present invention, the evaluation values ​​V1 to V4 correspond to an example of the "performance evaluation result" of the present invention, the component Wp corresponds to an example of the "component" of the present invention, and step S303 corresponds to an example of the "performance saving process" of the present invention.

[0073] It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made to those described above without departing from the spirit of the invention. For example, the performance data collection in Figure 6A can be modified so that step S303 (performance data saving process) for saving the acquired performance data Dp1 to Dp4 is started when a predetermined starting condition is met. In this modified example, the operating condition management unit 813 monitors whether the performance data Dp1 to Dp4 acquired by the operating condition management unit 813 is within an acceptable range. When it determines that the performance data Dp1 to Dp4 is outside the acceptable range, it starts the performance data saving process to save the acquired performance data Dp1 to Dp4. In other words, if the performance data Dp1 to Dp4 is within the acceptable range, the acquired performance data Dp1 to Dp4 is not saved to the database DB. Here, if at least one of the multiple performance evaluation items included in the performance data is outside its acceptable range, it is determined that the performance data is outside the acceptable range.

[0074] In other words, in this modified configuration, when the performance data Dp1 to Dp4 acquired by the performance acquisition unit 814 falls outside the acceptable range, the operation condition management unit 813 starts the performance data saving process. In this configuration, when a defect trend occurs in the operation of the component mounting machine 1, the saving of performance data Dp1 to Dp4 is started. Therefore, the user can consider appropriate recipe conditions and respond appropriately to the defect trend.

[0075] Furthermore, the specific examples of recipe parameters are not limited to those shown above, and various modifications are possible. For example, the descent amount and descent speed of the traverser of a component mounting machine, as described in WO2018 / 154760, may be used as recipe parameters.

[0076] Furthermore, the specific configuration of the component mounting machine is not limited to the example above, and the above control may also be applied to a component mounting machine that mounts components with packages such as QFP (Quad Flat Package).

[0077] In addition, machine parameters may be managed in the same way as the recipe parameters described above. In this case, the condition management shown in Figure 5 and the actual data collection shown in Figure 6A will be performed on the machine parameters.

[0078] Furthermore, UI12 does not need to be installed in the component mounting machine 1; it can be a terminal carried by the user.

[0079] Alternatively, the control shown in Figures 4 and 5A above may be performed by a server computer or the like, which is provided separately from the component mounting machine 1. [Explanation of Symbols]

[0080] 1... Component mounting machine 12…UI 81...Calculation processing unit (implementation operating condition management device) 812...UI Control Unit 813...Operating condition management section 814... Achievement Acquisition Department 82...Storage unit (recording medium, implementation operating condition management device) B... Circuit board Dp1~Dp4...Performance data Pp... Management program (implementation operating condition management program) R1~R4... Recipe conditions (implementation operating conditions) V1~V4…Evaluation value (performance evaluation result) Wp...parts S303...Step (Performance saving process)

Claims

1. An operating condition management unit manages multiple mounting operating conditions that define the operation of a component mounting machine that produces component-mounted circuit boards by mounting components onto the board, A performance acquisition unit monitors the operations performed by the component mounting machine based on the mounting operation conditions that are subject to management in order to produce the component mounted board, and acquires the results of said operations as performance data. UI control unit that controls the user interface and Equipped with, The operating condition management unit executes a performance data saving process that saves the performance data acquired by the performance data acquisition unit in association with the implementation operating conditions at the time the performance data was acquired. In the aforementioned performance data storage process, the performance data is stored in association with the type of component-mounted circuit board produced by the component mounting machine at the time the performance data is acquired. The UI control unit displays to the user via the user interface the performance data for the same type of component-mounted boards, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. The aforementioned performance data includes a plurality of performance evaluation items that evaluate the operations performed by the component mounting machine to produce the component-mounted circuit board, The performance data includes, as performance evaluation items, the adsorption rate, which is an index relating to the percentage of times that a nozzle that adsorbs a component to mount the component onto the substrate successfully adsorbs the component, and the mounting accuracy, which is an index relating to the accuracy of the position in which the component mounting machine mounts the component onto the substrate. The aforementioned operating condition management unit calculates an evaluation value based on the multiple performance evaluation items to evaluate the implemented operating conditions, The UI control unit is an implementation operating condition management device that shows the evaluation value to the user via the user interface.

2. The UI control unit receives user operations on the user interface for inputting the importance of each of the multiple performance evaluation items. The implementation operating condition management device according to claim 1, wherein the operating condition management unit calculates the evaluation value while weighting it according to the importance.

3. An operating condition management unit manages multiple mounting operating conditions that define the operation of a component mounting machine that produces component-mounted circuit boards by mounting components onto the board, A performance acquisition unit monitors the operations performed by the component mounting machine based on the mounting operation conditions that are subject to management in order to produce the component mounted board, and acquires the results of said operations as performance data. UI control unit that controls the user interface and Equipped with, The operating condition management unit executes a performance data saving process that saves the performance data acquired by the performance data acquisition unit in association with the implementation operating conditions at the time the performance data was acquired. In the aforementioned performance data storage process, the performance data is stored in association with the type of component-mounted circuit board produced by the component mounting machine at the time the performance data is acquired. The UI control unit displays to the user via the user interface the performance data for the same type of component-mounted boards, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. The component mounting machine performs operations to produce the component-mounted circuit board based on the mounting operation conditions set in the component mounting machine. When the mounting operation conditions set in the component mounting machine are changed, the operation condition management unit adds the changed mounting operation conditions to the management targets. The UI control unit displays to the user, via the user interface, the timing at which the mounting operation conditions set on the component mounting machine were changed, and the performance data saved by the performance saving process before and after the timing of the change, in chronological order. The UI control unit is an implementation operation condition management device that, through the user interface, indicates to the user a name that identifies the implementation operation condition before the change timing and a name that identifies the implementation operation condition after the change timing.

4. The implementation operating condition management device according to any one of claims 1 to 3, wherein when the performance data acquired by the performance acquisition unit falls outside the acceptable range, the operating condition management unit starts the performance saving process.

5. A component mounting machine that produces pre-mounted circuit boards by mounting components onto the board, An operating condition management unit manages multiple mounting operating conditions that define the operation of the aforementioned component mounting machine, with these as the target of management. A performance acquisition unit monitors the operations performed by the component mounting machine based on the mounting operation conditions that are subject to management in order to produce the component mounted board, and acquires the results of said operations as performance data. UI control unit that controls the user interface and Equipped with, The operating condition management unit executes a performance data saving process that saves the performance data acquired by the performance data acquisition unit in association with the implementation operating conditions at the time the performance data was acquired. In the aforementioned performance data storage process, the performance data is stored in association with the type of component-mounted circuit board produced by the component mounting machine at the time the performance data is acquired. The UI control unit displays to the user via the user interface the performance data for the same type of component-mounted boards, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. The aforementioned performance data includes a plurality of performance evaluation items that evaluate the operations performed by the component mounting machine to produce the component-mounted circuit board, The performance data includes, as performance evaluation items, the adsorption rate, which is an index relating to the percentage of times that a nozzle that adsorbs a component to mount the component onto the substrate successfully adsorbs the component, and the mounting accuracy, which is an index relating to the accuracy of the position in which the component mounting machine mounts the component onto the substrate. The aforementioned operating condition management unit calculates an evaluation value based on the multiple performance evaluation items to evaluate the implemented operating conditions, The UI control unit is a component mounting machine that displays the evaluation value to the user via the user interface.

6. A component mounting machine that produces pre-mounted circuit boards by mounting components onto the board, An operating condition management unit manages multiple mounting operating conditions that define the operation of the aforementioned component mounting machine, with these as the target of management. A performance acquisition unit monitors the operations performed by the component mounting machine based on the mounting operation conditions that are subject to management in order to produce the component mounted board, and acquires the results of said operations as performance data. UI control unit that controls the user interface and Equipped with, The operating condition management unit executes a performance data saving process that saves the performance data acquired by the performance data acquisition unit in association with the implementation operating conditions at the time the performance data was acquired. In the aforementioned performance data storage process, the performance data is stored in association with the type of component-mounted circuit board produced by the component mounting machine at the time the performance data is acquired. The UI control unit displays to the user via the user interface the performance data for the same type of component-mounted boards, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. The component mounting machine performs operations to produce the component-mounted circuit board based on the mounting operation conditions set in the component mounting machine. When the mounting operation conditions set in the component mounting machine are changed, the operation condition management unit adds the changed mounting operation conditions to the management targets. The UI control unit displays to the user, via the user interface, the timing at which the mounting operation conditions set on the component mounting machine were changed, and the performance data saved by the performance saving process before and after the timing of the change, in chronological order. The UI control unit is a component mounting machine that, through the user interface, indicates to the user a name that identifies the implementation operating conditions before the change timing and a name that identifies the implementation operating conditions after the change timing.

7. A process in which a component mounting machine, which produces component-mounted circuit boards by mounting components onto a circuit board, manages multiple mounting operation conditions that define the operation of the machine, with the operation condition management unit as the target of management, A process in which the component mounting machine performs operations based on the mounting operation conditions that are subject to the management in order to produce the component mounted circuit board, and the performance acquisition unit monitors the operations performed by the component mounting machine and acquires the results of said operations as performance data, The process includes: executing a performance data storage process that stores the performance data in association with the mounting operating conditions at the time the performance data was acquired and the type of component-mounted circuit board produced by the component mounting machine; The UI control unit then displays to the user via the user interface the performance data for the same type of component-mounted circuit board, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. Equipped with, The aforementioned performance data includes a plurality of performance evaluation items that evaluate the operations performed by the component mounting machine to produce the component-mounted circuit board, The performance data includes, as performance evaluation items, the adsorption rate, which is an index relating to the percentage of times that a nozzle that adsorbs a component to mount the component onto the substrate successfully adsorbs the component, and the mounting accuracy, which is an index relating to the accuracy of the position in which the component mounting machine mounts the component onto the substrate. The aforementioned operating condition management unit calculates an evaluation value based on the multiple performance evaluation items to evaluate the implemented operating conditions, The UI control unit is an implementation operating condition management method that shows the evaluation value to the user through the user interface.

8. A process in which a component mounting machine, which produces component-mounted circuit boards by mounting components onto a circuit board, manages multiple mounting operation conditions that define the operation of the machine, with the operation condition management unit as the target of management, A process in which the component mounting machine performs operations based on the mounting operation conditions that are subject to the management in order to produce the component mounted circuit board, and the performance acquisition unit monitors the operations performed by the component mounting machine and acquires the results of said operations as performance data, The process includes: executing a performance data storage process that stores the performance data in association with the mounting operating conditions at the time the performance data was acquired and the type of component-mounted circuit board produced by the component mounting machine; The UI control unit then displays to the user via the user interface the performance data for the same type of component-mounted circuit board, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. Equipped with, The component mounting machine performs operations to produce the component-mounted circuit board based on the mounting operation conditions set in the component mounting machine. When the mounting operation conditions set in the component mounting machine are changed, the operation condition management unit adds the changed mounting operation conditions to the management targets. The UI control unit displays to the user, via the user interface, the timing at which the mounting operation conditions set on the component mounting machine were changed, and the performance data saved by the performance saving process before and after the timing of the change, in chronological order. The UI control unit provides an implementation operation condition management method that, through the user interface, indicates to the user a name that identifies the implementation operation condition before the change timing and a name that identifies the implementation operation condition after the change timing.

9. A process in which a component mounting machine, which produces component-mounted circuit boards by mounting components onto a circuit board, manages multiple mounting operation conditions that define the operation of the machine, with the operation condition management unit as the target of management, A process in which the component mounting machine performs operations based on the mounting operation conditions that are subject to the management in order to produce the component mounted circuit board, and the performance acquisition unit monitors the operations performed by the component mounting machine and acquires the results of said operations as performance data, The process includes: executing a performance data storage process that stores the performance data in association with the mounting operating conditions at the time the performance data was acquired and the type of component-mounted circuit board produced by the component mounting machine; The UI control unit then displays to the user via the user interface the performance data for the same type of component-mounted circuit board, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. Have the computer run it, The aforementioned performance data includes a plurality of performance evaluation items that evaluate the operations performed by the component mounting machine to produce the component-mounted circuit board, The performance data includes, as performance evaluation items, the adsorption rate, which is an index relating to the percentage of times that a nozzle that adsorbs a component to mount the component onto the substrate successfully adsorbs the component, and the mounting accuracy, which is an index relating to the accuracy of the position in which the component mounting machine mounts the component onto the substrate. The aforementioned operating condition management unit calculates an evaluation value based on the multiple performance evaluation items to evaluate the implemented operating conditions, The UI control unit is an implementation operating condition management program that shows the evaluation value to the user through the user interface.

10. A process in which a component mounting machine, which produces component-mounted circuit boards by mounting components onto a circuit board, manages multiple mounting operation conditions that define the operation of the machine, with the operation condition management unit as the target of management, A process in which the component mounting machine performs operations based on the mounting operation conditions that are subject to the management in order to produce the component mounted circuit board, and the performance acquisition unit monitors the operations performed by the component mounting machine and acquires the results of said operations as performance data, The process includes: executing a performance data storage process that stores the performance data in association with the mounting operating conditions at the time the performance data was acquired and the type of component-mounted circuit board produced by the component mounting machine; The UI control unit then displays to the user via the user interface the performance data for the same type of component-mounted circuit board, which has been saved by the performance data saving process, in association with the mounting operation conditions at the time the performance data was acquired. Have the computer run it, The component mounting machine performs operations to produce the component-mounted circuit board based on the mounting operation conditions set in the component mounting machine. When the mounting operation conditions set in the component mounting machine are changed, the operation condition management unit adds the changed mounting operation conditions to the management targets. The UI control unit displays to the user, via the user interface, the timing at which the mounting operation conditions set on the component mounting machine were changed, and the performance data saved by the performance saving process before and after the timing of the change, in chronological order. The UI control unit is an implementation operation condition management program that, through the user interface, indicates to the user a name that identifies the implementation operation condition before the change timing and a name that identifies the implementation operation condition after the change timing.

11. A recording medium for recording the implementation operating condition management program described in claim 9 or 10 in a manner readable by a computer.

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