Cutting device and method for manufacturing cut products

Abstract

To provide a cutting device capable of relatively efficiently performing automatic setting of an inspection region in a picked-up image of a cut product, and a manufacturing method of the cut product.SOLUTION: A cutting device comprises an imaging section, a first processing section, and a second processing section. The imaging section images a part of or all of a plurality of cut products, thereby generating a picked-up image. The first processing section sets a plurality of inspection regions in the picked-up image. The second processing section inspects appearances of the cut products included in the picked-up image on the basis of the images included in the plurality of inspection regions in the picked-up image. The first processing section executes determination processing for determining whether or not a part of any one side in the plurality of cut products is included in a predetermined number of pixels based on pixel values of the predetermined number of pixels which are positioned continuously in a first direction in the picked-up image. The first processing section sets at least a part of the plurality of inspection regions by repeatedly executing the determination processing while deviating the positions of the predetermined number of pixels.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a cutting device and a method for manufacturing a cut product.

Background Art

[0002] Japanese Unexamined Patent Application Publication No. 2010-125488 (Patent Document 1) discloses a cutting device for cutting a workpiece. In this cutting device, a plurality of fragmented workpieces are manufactured by cutting the workpiece, and an appearance inspection of each fragmented workpiece is performed (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An appearance inspection of a cut product (for example, a fragmented workpiece) manufactured by cutting a substrate is performed, for example, based on a photographed image of the cut product. In this case, an inspection area is set in the photographed image of the cut product, and the appearance of the cut product is inspected based on the image within the inspection area. That is, in order to perform an appearance inspection of a cut product based on a photographed image of the cut product, it is necessary to set an inspection area in the photographed image of the cut product. However, in Patent Document 1 mentioned above, a specific method for setting the inspection area is not disclosed.

[0005] The present invention has been made to solve such problems, and an object thereof is to provide a cutting device and a method for manufacturing a cut product capable of relatively efficiently automatically setting an inspection area in a photographed image of a cut product.

Means for Solving the Problems

[0006] A cutting apparatus according to a certain aspect of the present invention manufactures multiple cut pieces by cutting a substrate. This cutting apparatus comprises an imaging unit, a first processing unit, and a second processing unit. The imaging unit generates an image by imaging part or all of the multiple cut pieces. The first processing unit sets up multiple inspection areas in the image. The second processing unit inspects the appearance of each cut piece included in the image based on the image included in each of the multiple inspection areas in the image. The shape of each of the multiple inspection areas is rectangular. The shape of each cut piece is rectangular. The first processing unit performs a determination process to determine whether a predetermined number of pixels, based on the pixel values ​​of each of the pixels located continuously in a first direction in the image, contain a part of one side of any of the multiple cut pieces. The predetermined number is smaller than the total number of pixels in the first direction of the entire image. The first processing unit sets up at least part of the multiple inspection areas by repeatedly shifting the position of the predetermined number of pixels and performing the determination process.

[0007] A method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the above-described cutting apparatus. The cutting apparatus comprises a cutting table and a cutting unit. A substrate is placed on the cutting table. The cutting unit cuts the substrate placed on the cutting table. The manufacturing method includes the steps of placing the substrate on the cutting table and cutting the substrate placed on the cutting table. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a cutting device that can relatively efficiently automatically set the inspection area in the captured image of a cut product, and a method for manufacturing a cut product. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic plan view of the cutting device. [Figure 2] This diagram schematically illustrates how electronic components are photographed by a second optical inspection camera. [Figure 3] This is a schematic diagram showing the hardware configuration of a computer. [Figure 4] This figure schematically shows an example of an image captured by the second optical inspection camera. [Figure 5] This is a flowchart showing the procedure for visual inspection of electronic components. [Figure 6] This is a flowchart showing the procedure for setting the inspection area. [Figure 7] This is a flowchart showing the procedure for setting the first inspection area. [Figure 8] This diagram illustrates the procedure for identifying a portion of the left-hand side of the first electronic component in a captured image. [Figure 9] This diagram illustrates how the positions of a predetermined number of pixels subject to left-hand side determination are changed. [Figure 10] This diagram illustrates the generation of an approximation curve in the left-hand side determination process. [Figure 11] This figure schematically shows the curve resulting from the differentiation of an approximate curve. [Figure 12] This is a diagram illustrating the procedure for identifying other parts of the left-hand side. [Figure 13] This diagram illustrates the procedure for identifying the left-hand side based on the pixel positions corresponding to each maximum value (maximum value > first predetermined value) of the derivative obtained through the left-hand side determination process. [Figure 14] This is a flowchart showing the procedure for specifying the left-hand side of the first electronic component. [Figure 15] This flowchart shows the procedures for specific processing at the upper and lower ends of the left-hand side. [Figure 16] This diagram illustrates the procedure for identifying the right-hand side of the first electronic component. [Figure 17] This is a flowchart showing the procedure for specifying the right-hand side of the first electronic component. [Figure 18] This diagram illustrates the procedure for identifying the top and bottom edges of the first electronic component. [Figure 19] This is a flowchart showing the procedure for identifying the top surface of the first electronic component. [Figure 20] It is a flowchart showing the procedure of the specific process for the lower side in the first electronic component. [Figure 21] It is a diagram for explaining the procedure of setting another inspection area at a position shifted in the row direction or the column direction with respect to the first inspection area. [Figure 22] It is a flowchart showing the procedure of the setting process for another inspection area at a position shifted in the row direction with respect to the first inspection area. [Figure 23] It is a flowchart showing the procedure of the setting process for another inspection area at a position shifted in the column direction with respect to the first inspection area.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments according to one aspect of the present invention (hereinafter also referred to as "the present embodiments") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their descriptions are not repeated. Also, each drawing is schematically drawn with appropriate omissions or exaggerations of the subject for easy understanding.

[0011] [1. Configuration] <1-1. Configuration of the Cutting Device> FIG. 1 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to cut a package substrate (an example of a cutting object) to individualize the package substrate into a plurality of electronic components (an example of cut products). In the package substrate, a substrate or a lead frame to which a semiconductor chip is fixed is resin-sealed. Note that the cutting object does not necessarily have to be a package substrate, and for example, a substrate not resin-sealed (including a wafer) may be used.

[0012] Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

[0013] Furthermore, the cutting device 1 is configured to inspect each of the multiple electronic components that have been separated into individual pieces. In the cutting device 1, each electronic component is photographed, and each electronic component is inspected based on the captured image. Inspection data is generated through this inspection, and each electronic component is classified as either a "good product" or a "defective product".

[0014] In this example, a package substrate P1 is used as the object to be cut, and the cutting device 1 separates the package substrate P1 into multiple electronic components S1 (see Figure 2). Hereinafter, of the two sides of the package substrate P1, the side that is resin-sealed will be referred to as the molded side, and the side opposite the molded side will be referred to as the ball / lead side. If the object to be cut is a substrate that is not resin-sealed, the side facing upwards during cutting (the cut surface) corresponds to the ball / lead side in this embodiment, and the side opposite the cut surface corresponds to the molded side in this embodiment.

[0015] As shown in Figure 1, the cutting device 1 includes a cutting module A1 and an inspection / storage module B1 as its components. The cutting module A1 is configured to produce multiple electronic components S1 by cutting a package substrate P1. The inspection / storage module B1 is configured to inspect each of the produced electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and interchangeable with respect to the other components.

[0016] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a transport unit 7.

[0017] The substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing them out one by one from the magazine M1 which contains multiple package substrates P1. At this time, the package substrates P1 are positioned with the ball / lead surface facing upwards.

[0018] The positioning unit 4 positions the package substrate P1, which has been extruded from the substrate supply unit 3, by placing it on the rail unit 4a. After that, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5.

[0019] The cutting table 5 holds the package substrate P to be cut. Here, a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1, which has been transported by the positioning unit 4, by suction from below. The rotating mechanism 5b allows the holding member 5a to rotate in the horizontal plane in the direction θ1 in the figure. The moving mechanism 5c allows the holding member 5a to move along the Y axis in the figure.

[0020] The spindle section 6 cuts the package substrate P1, thereby separating it into multiple electronic components S1. Here, a cutting device 1 with a twin-spindle configuration having two spindle sections 6 is illustrated. The spindle sections 6 are movable along the X and Z axes in the figure. Note that the cutting device 1 may also have a single-spindle configuration with one spindle section 6.

[0021] The spindle section 6 includes a rotating shaft 6c. A blade 6a is fixed to the rotating shaft 6c of the spindle section 6. The blade 6a cuts the package substrate P1 by rotating at high speed, breaking the package substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being held between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown), such as nuts.

[0022] The cutting module A1 is equipped with nozzles for cutting fluid, cooling water, and scrap removal water (not shown). The cutting fluid nozzles spray cutting fluid towards the high-speed rotating blade 6a. The cooling water nozzles spray cooling water towards the vicinity of the cutting area of ​​the package substrate P1. The scrap removal water nozzles spray scrap removal water to blow away cutting debris and other waste.

[0023] After the cutting table 5 picks up the package substrate P1, the package substrate P1 is imaged by the first position confirmation camera 5d to confirm its position. The confirmation using the first position confirmation camera 5d is, for example, to confirm the position of alignment marks provided on the package substrate P1. The position information of the alignment marks is used, for example, to determine the cutting line of the package substrate P1.

[0024] Subsequently, the cutting table 5 moves along the Y-axis in the figure toward the spindle unit 6. After the cutting table 5 moves below the blade 6a, the package substrate P1 is cut by moving the cutting table 5 and the spindle unit 6 relative to each other. After that, if necessary, the package substrate P1 is imaged by the second position confirmation camera 6b provided in the cutting module A1, and the position of the package substrate P1 is confirmed. Confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

[0025] After the cutting of the package substrate P1 is complete, the cutting table 5 moves away from the spindle section 6 along the Y-axis in the figure, while holding the multiple individual electronic components S1. During this movement process, the upper surface (ball / lead surface) of the electronic components S1 is cleaned and dried by the first cleaner 5e. This cleaning may be performed, for example, by directly spraying cleaning water onto the upper surface of the electronic components S1, or by supplying cleaning water to the upper surface of the electronic components S1 via a brush or the like. In the cutting device 1, two first cleaners 5e are provided, aligned in the X-axis direction in the figure, but the number of first cleaners 5e is not limited to this.

[0026] The transport unit 7 picks up the electronic component S1 held on the cutting table 5 from above and transports the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the underside (molded surface) of the electronic component S1. This cleaning may be performed, for example, by directly spraying cleaning water onto the underside of the electronic component S1, or by supplying cleaning water to the underside of the electronic component S1 via a brush or the like.

[0027] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement section 14, and an extraction section 15. The first optical inspection camera 12 may be provided in the cutting module A1.

[0028] The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis in the figure. The inspection table 11 can also be inverted vertically. The inspection table 11 is provided with a holding member 11b (see Figure 2) that holds the electronic component S1 by suction.

[0029] The first optical inspection camera 12 and the second optical inspection camera 13 photograph the molded surface and the ball / lead surface of the electronic component S1, respectively. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections (visual inspections) of the appearance of the electronic component S1 are performed. Examples of visual inspections include inspection of the size of the electronic component S1, inspection of the size of the ball portion BA1, and inspection of the length between adjacent ball portions BA1. The first optical inspection camera 12 and the second optical inspection camera 13 are positioned near the inspection table 11 to photograph the area above.

[0030] The first optical inspection camera 12 photographs the molded surface of the electronic component S1 as it is transported to the inspection table 11 by the transport unit 7. The transport unit 7 then places the electronic component S1 on the holding member 11b of the inspection table 11. After the holding member 11b has attracted the electronic component S1, the inspection table 11 is inverted. The inspection table 11 moves above the second optical inspection camera 13, and the ball / lead surface of the electronic component S1 is photographed by the second optical inspection camera 13.

[0031] Figure 2 is a schematic diagram showing how electronic components S1 are photographed by the second optical inspection camera 13. The inspection table 11 includes an inspection table body 11a and a holding member 11b. The holding member 11b is located below the inspection table body 11a. The surface of the holding member 11b that holds the electronic components S1 is made of, for example, black rubber. Note that the color of the rubber does not have to be black; for example, it may be white. Multiple electronic components S1 held by the holding member 11b are photographed by the second optical inspection camera 13. Based on the image data or captured images (hereinafter simply referred to as "captured images") generated by the second optical inspection camera 13, an inspection of the appearance of the ball / lead surfaces of each electronic component S1 is performed. The procedure for inspecting the appearance of the ball / lead surfaces of each electronic component S1 will be described in detail later.

[0032] Referring again to Figure 1, the inspected electronic components S1 are placed in the placement section 14. The placement section 14 is movable along the Y-axis in the figure. The inspection table 11 places the inspected electronic components S1 in the placement section 14.

[0033] The extraction unit 15 transfers the electronic components S1 placed in the placement unit 14 to trays. The electronic components S1 are sorted into "good" or "defective" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. Based on the sorting results, the extraction unit 15 transfers each electronic component S1 to either the good component tray 15a or the defective component tray 15b. That is, good components are stored in the good component tray 15a, and defective components are stored in the defective component tray 15b. When each of the good component tray 15a and the defective component tray 15b is filled with electronic components S1, it is replaced with a new tray.

[0034] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro-Luminescence) monitor. The monitor 20 is, for example, located in front of the cutting device 1.

[0035] The computer 50 controls, for example, the operation of each part of the cutting module A1 and the inspection / storage module B1. The computer 50 controls, for example, the operation of the substrate supply unit 3, positioning unit 4, cutting table 5, spindle unit 6, transport unit 7, inspection table 11, first optical inspection camera 12, second optical inspection camera 13, placement unit 14, extraction unit 15, and monitor 20.

[0036] Furthermore, the computer 50 performs various inspections of the electronic component S1 based on image data generated by, for example, the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 will be described in detail.

[0037] <1-2. Computer Configuration> Figure 3 is a schematic diagram showing the hardware configuration of computer 50. As shown in Figure 3, computer 50 includes a control unit 70, an input / output interface (I / F) 90, a reception unit 95, and a storage unit 80, and each component is electrically connected via a bus.

[0038] The control unit 70 includes a CPU (Central Processing Unit) 72, RAM (Random Access Memory) 74, and ROM (Read Only Memory) 76, etc. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 according to information processing.

[0039] The input / output interface 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The input / output interface 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from the user. The reception unit 95 is composed of, for example, some or all of a touch panel, keyboard, mouse, and microphone.

[0040] The memory unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The memory unit 80 is configured to store, for example, a control program 81. Various operations in the cutting device 1 are realized when the control program 81 is executed by the control unit 70. When the control unit 70 executes the control program 81, the control program 81 is loaded into the RAM 74. The control unit 70 then controls each component by having the CPU 72 interpret and execute the control program 81 loaded into the RAM 74.

[0041] [2. The necessity of automatic setting of the examination area] As described above, in the cutting device 1, the appearance of the electronic component S1 is inspected based on the images captured by the first optical inspection camera 12 and the second optical inspection camera 13.

[0042] Figure 4 is a schematic diagram showing an example of an image IM1 captured by the second optical inspection camera 13. Referring to Figure 4, the image IM1 shows multiple electronic components S1, for example, electronic components S1A, S1B, S1C, and S1D. In the image IM1, the multiple electronic components S1 are arranged in a grid. Since the image IM1 is an image of the ball / lead surface of each electronic component S1, the image IM1 shows multiple ball portions BA1 of each electronic component S1. In addition, the holding member 11b of the inspection table 11 is visible between two adjacent electronic components S1.

[0043] The captured image IM1 is a grayscale (256-level) image. In this example, the color of each electronic component S1 is lighter than the color of the holding member 11b. For example, each electronic component S1 is shown in gray, and the holding member 11b is shown in black. Note that the fact that the subject is "visible" in the captured image is also referred to as the subject being "included" in the captured image.

[0044] The shape of the captured image IM1 is rectangular, and the shape of each electronic component S1 is rectangular. In this specification, "rectangle" means a rectangle (a quadrilateral with all four corners equal), but it may also mean a square. The left side IL1, right side IR1, top side IT1, and bottom side IB1 of the captured image IM1 are parallel to the left side EL1, right side ER1, top side ET1, and bottom side EB1 of each electronic component S1, respectively. Here, parallelism includes not only a strict meaning but also a practical meaning. That is, even if the angle between two sides is not zero, the two sides are parallel if the angle between them is within the range of error.

[0045] When visual inspection of an electronic component S1 is performed based on a captured image IM1, first, multiple inspection areas T1 are set in the captured image IM1. Each inspection area T1 corresponds to one of the electronic components S1 included in the captured image IM1. For example, inspection areas T1A, T1B, T1C, and T1D correspond to electronic components S1A, S1B, S1C, and S1D, respectively. In the cutting device 1, the appearance of each electronic component S1 included in the captured image IM1 is inspected based on the images included in each of the multiple inspection areas T1 in the captured image IM1.

[0046] One possible method for setting each inspection area T1 is for the operator to set it manually. However, when operators manually set each inspection area T1, problems may arise, such as the fact that setting the inspection area T1 takes a relatively long time, the accuracy of setting the inspection area T1 varies from operator to operator, and the frequency of errors in setting the inspection area T1 is relatively high.

[0047] In the cutting device 1 according to this embodiment, each inspection area T1 is set automatically. Therefore, the cutting device 1 can suppress the occurrence of problems that may arise when an operator manually sets each inspection area T1. Furthermore, as will be described in detail later, the cutting device 1 incorporates improvements to the algorithm for the automatic setting of each inspection area T1. Therefore, the cutting device 1 can perform the automatic setting of each inspection area T1 relatively efficiently.

[0048] [3. Procedure for visual inspection of electronic components (cut pieces)] Figure 5 is a flowchart showing the procedure for visual inspection of electronic components S1. In the cutting apparatus 1 according to this embodiment, only some of the electronic components S1 arranged on the inspection table 11 are photographed at once by the second optical inspection camera 13, and the appearance of each electronic component S1 is inspected on an image-by-image basis. By repeatedly adjusting the positional relationship between the second optical inspection camera 13 and the inspection table 11 and taking photographs with the second optical inspection camera 13, the appearance of all electronic components S1 arranged on the inspection table 11 is inspected.

[0049] The process shown in the flowchart of Figure 5 is executed, for example, by the control unit 70 of the computer 50 when the first of multiple images taken for the visual inspection of all electronic components S1 placed on the inspection table 11 is taken.

[0050] Referring to Figure 5, the control unit 70 controls the second optical inspection camera 13 to photograph multiple electronic components S1 placed on the inspection table 11 (step S100). The control unit 70 performs setting processing for each inspection area T1 in the captured image IM1 generated by the second optical inspection camera 13 (step S110). The processing in step S110 will be explained in detail later.

[0051] The control unit 70 performs various visual inspection processes on each electronic component S1 contained in the captured image IM1 based on the images contained in each inspection area T1 (step S120). When visual inspection is performed through the second or subsequent images of multiple images taken for the visual inspection of all electronic components S1 placed on the inspection table 11, for example, each inspection area T1 set for the visual inspection through the first image is used, and the process in step S110 is omitted.

[0052] Figure 6 is a flowchart showing the procedure for setting the inspection area (step S110 in Figure 5). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0053] Referring to Figure 6, the control unit 70 performs a setting process for the inspection area T1 (for example, inspection area T1A in Figure 4) corresponding to the first of the multiple electronic components S1 included in the captured image IM1 (step S200). The process in step S200 will be explained in detail later.

[0054] The control unit 70 performs a setting process for an inspection area T1 (for example, inspection area T1B in Figure 4) corresponding to an electronic component S1 located at a position shifted in the row direction relative to the inspection area T1 set in step S200 (step S210). The process in step S210 will be explained in detail later.

[0055] The control unit 70 performs a setting process for an inspection area T1 (for example, inspection area T1C in Figure 4) corresponding to an electronic component S1 located at a position shifted in the column direction relative to the inspection area T1 set in step S200 (step S220). The process in step S220 will be explained in detail later.

[0056] The control unit 70 determines the number of inspection areas T1 in the row direction and the number of inspection areas T1 in the column direction based on the inspection areas T1 set through the processing in steps S200, S210, and S220, and sets other inspection areas T1 (for example, inspection area T1D in Figure 4) based on the results (step S230). In the example shown in Figure 4, the number of inspection areas T1 in the row direction is determined to be "2" through the processing in steps S200, S210, and S220, and the number of inspection areas T1 in the column direction is determined to be "2". Then, other inspection areas T1 are set so that each inspection area T1 is arranged in a 2x2 grid.

[0057] Figure 7 is a flowchart showing the procedure for setting the first inspection area T1 (step S200 in Figure 6). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0058] Referring to Figure 7, the control unit 70 performs a process to identify the left-hand side EL1 of the first electronic component S1 (hereinafter also simply referred to as "the first electronic component") among the multiple electronic components S1 included in the captured image IM1 (step S300). The process in step S300 will be explained in detail later. Based on the identified left-hand side EL1, the control unit 70 performs a process to identify the right-hand side ER1 of the first electronic component S1 (step S310). The process in step S310 will be explained in detail later.

[0059] The control unit 70 performs a process to identify the top edge ET1 of the first electronic component S1 based on the identified left-hand side EL1 and right-hand side ER1 (step S320). The process in step S320 will be explained in detail later. The control unit 70 performs a process to identify the bottom edge EB1 of the first electronic component S1 based on the identified left-hand side EL1 and right-hand side ER1 (step S330). The process in step S330 will be explained in detail later. The control unit 70 sets the inspection area T1 corresponding to the first electronic component S1 based on the identified left-hand side EL1, right-hand side ER1, top edge ET1, and bottom edge EB1 (step S340).

[0060] Figure 8 is a diagram illustrating the procedure for identifying a portion of the left-hand side EL1 of the first electronic component S1 in the captured image IM1. Referring to Figure 8, the left-hand side determination process is performed in the cutting device 1. The left-hand side determination process is a process that determines whether a portion of the left-hand side EL1 is included in a predetermined number of pixels (hereinafter also simply referred to as "a predetermined number of pixels") that are located consecutively in the row direction, based on the pixel value of each of the predetermined number of pixels. In the left-hand side determination process, the boundary between the holding member 11b and the electronic component S1 is identified based on the pixel value of each of the predetermined number of pixels. For example, moving from left to right in the figure, a portion is identified in which pixels with small pixel values ​​(pixels corresponding to the holding member 11b (dark pixels)) and pixels with large pixel values ​​(pixels corresponding to the electronic component S1 (bright pixels)) are adjacent in that order.

[0061] If the left-side determination process determines that a predetermined number of pixels do not contain a portion of the left-side EL1, the positions of the predetermined number of pixels being determined are changed, for example, to the lower right, and the left-side determination process is performed on the changed predetermined number of pixels. By repeatedly changing the positions of the predetermined number of pixels being determined and performing the left-side determination process, the positions of a portion of the left-side EL1 are identified.

[0062] Figure 9 is a diagram illustrating how the positions of a predetermined number of pixels subject to left-hand side determination processing are changed. In the captured image IM1 shown in this figure, images of each electronic component S1, etc., have been omitted for ease of explanation.

[0063] Referring to Figure 9, the captured image IM1 is composed of multiple pixels PX1. In the cutting device 1, first, five pixels (an example of a predetermined number of pixels) are selected from the upper left pixel PX1 toward the right in the row direction, and a left-edge determination process is performed on the selected five pixels. If it is determined that the selected five pixels do not contain part of the left-edge EL1, the positions of the five pixels are changed by one pixel each to the right in the row direction and downward in the column direction. Then, a left-edge determination process is performed on the changed five pixels. The position changes of the five pixels and the left-edge determination process are repeated until part of the left-edge EL1 is identified.

[0064] Figure 10 is a diagram illustrating the generation of the approximation curve L1 in the left-hand side determination process. Referring to Figure 10, the horizontal axis represents the position of each of a predetermined number of pixels, and the vertical axis represents the pixel value. In the left-hand side determination process, an approximation curve L1 is generated that shows how the pixel values ​​of a predetermined number of pixels change from left to right in the captured image IM1. Various known techniques can be applied to generate the approximation curve L1.

[0065] Figure 11 schematically shows curve L2, which is the result of differentiating the approximation curve L1. Referring to Figure 11, the horizontal axis shows the position of each of a predetermined number of pixels, and the vertical axis shows the derivative value. In the left-hand side determination process, differentiation is performed on the generated approximation curve L1. In the left-hand side determination process, if the maximum value of the derivative exceeds a threshold (first predetermined value), it is determined that a part of the left-hand side EL1 exists in a predetermined number of pixels. If it is determined that a part of the left-hand side EL1 exists in a predetermined number of pixels, the other parts of the left-hand side EL1 are identified based on the identified part of the left-hand side EL1.

[0066] Figure 12 is a diagram illustrating the procedure for identifying other parts of the left-hand side EL1. Referring to Figure 12, pixel PX1A is an example of pixel PX1 corresponding to the maximum value of the derivative obtained through the left-hand side determination process (maximum value > first predetermined value). In the process of identifying other parts of the left-hand side EL1, the process of identifying the upper end of the left-hand side EL1 is performed first, and then the process of identifying the lower end of the left-hand side EL1 is performed.

[0067] Specifically, five pixels, including pixel PX1A, the two pixels to its left, and the two pixels to its right, are selected as the pixels to be judged. The process of shifting the position of the five pixels to be judged one pixel upward in the column direction and the left-side judgment process are repeatedly executed until it is determined that the selected five pixels do not contain any part of the left-side EL1. When each of the five selected pixels points to the holding member 11b (see Figure 4), the process of shifting the position of the five pixels to be judged one pixel upward in the column direction stops, and the upper end of the left-side EL1 is identified. Note that the pixels to be judged do not necessarily have to be the five pixels including pixel PX1A, the two pixels to its left, and the two pixels to its right. For example, the pixels to be judged may be three pixels including pixel PX1A, one pixel to the left of pixel PX1A, and one pixel to the right of pixel PX1A; or four pixels including pixel PX1A, two pixels to the left of pixel PX1A, and one pixel to the right of pixel PX1A; or four pixels including pixel PX1A, one pixel to the left of pixel PX1A, and two pixels to the right of pixel PX1A.

[0068] Once the upper end of the left-hand side EL1 is identified, the process of shifting the positions of the five pixels to be judged downwards by one pixel in the column direction and the left-hand side determination process are repeatedly executed until it is determined that no part of the left-hand side EL1 is included in the five pixels, which include pixel PX1A, the two pixels to the left of pixel PX1A, and the two pixels to the right of pixel PX1A. As each of the five selected pixels corresponds to a holding member 11b (see Figure 4), the process of shifting the positions of the five pixels to be judged downwards by one pixel in the column direction stops, and the lower end of the left-hand side EL1 is identified.

[0069] Figure 13 illustrates the procedure for identifying the left-hand side EL1 based on each pixel position corresponding to each maximum value (maximum value > first predetermined value) of the derivative obtained through the left-hand side determination process. In this example, multiple pixels PX1 are arranged in a column direction, each containing a pixel position (maximum derivative position PO1) corresponding to the maximum value (maximum value > first predetermined value). In this case, for example, the left-hand side EL1 is identified by applying a predetermined algorithm to each maximum derivative position PO1. An example of a predetermined algorithm is RANSAC (Random Sample Consensus). This identifies the left-hand side of the first electronic component S1.

[0070] Figure 14 is a flowchart showing the procedure for identifying the left-hand side EL1 in the first electronic component S1 (step S300 in Figure 7). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0071] Referring to Figure 14, the control unit 70 determines the positions of a predetermined number of pixels that are subject to left-hand side determination processing (step S400). For example, the control unit 70 determines that five pixels to the right of pixel PX1 at the upper left corner of the captured image IM1 are subject to left-hand side determination processing.

[0072] The control unit 70 generates an approximate curve based on the determined pixel values ​​of the five pixels (step S410). The control unit 70 performs differentiation of the generated approximate curve (step S420). The control unit 70 determines whether the maximum value of the derivative is greater than a first predetermined value (step S430). If it is determined that the maximum value of the derivative is less than or equal to the first predetermined value (NO in step S430), the control unit 70 shifts the position of the five pixels subject to the left-hand side determination process diagonally downward to the right (step S440), and executes steps S410, S420, and S430 (left-hand side determination process) again.

[0073] On the other hand, if it is determined that the maximum value of the derivative is greater than the first predetermined value (YES in step S430), the control unit 70 performs a process to identify the upper and lower ends of the left-hand side EL1 (step S450). The process of identifying the upper and lower ends of the left-hand side EL1 will be explained in detail later.

[0074] Once the upper and lower ends of the left-hand side EL1 are identified, the control unit 70 determines whether the difference between the length between the upper and lower ends and the first predetermined length is less than the second predetermined value (step S460). The first predetermined length is, for example, the length corresponding to the specification value of the length between the upper and lower ends of the electronic component S1. The second predetermined value may be, for example, the length corresponding to 0.5%-5% of the specification value of the length between the upper and lower ends of the electronic component S1.

[0075] If it is determined that the difference between the length between the upper and lower ends and the first predetermined length is greater than or equal to the second predetermined value (NO in step S460), the control unit 70 executes the process in step S440 based on the five pixels for which the maximum value of the derivative was determined to be greater than the first predetermined value in step S430. For example, this can occur if the ball portion BA1 (see Figure 4) is included in a predetermined number of pixels that are subject to the left-hand side determination process.

[0076] On the other hand, if it is determined that the difference between the length between the upper and lower ends and the first predetermined length is less than the second predetermined value (YES in step S460), the control unit 70 identifies the left-hand side EL1 based on each pixel position corresponding to each maximum value (maximum value > first predetermined value) of the differential value obtained through the left-hand side determination process (step S470).

[0077] Figure 15 is a flowchart showing the procedure for the specific processing at the upper and lower ends of the left-hand side EL1 (step S450 in Figure 14). The processing shown in this flowchart is executed by the control unit 70 of the computer 50.

[0078] Referring to Figure 15, the control unit 70 shifts the positions of a predetermined number of pixels (5 pixels) that are the subject of the left-hand side determination process by 1 pixel upward in the column direction, based on the position of a predetermined number of pixels (5 pixels) that include pixel PX1 corresponding to the maximum value of the differential value calculated in step S420 of Figure 14 (maximum value > first predetermined value) (step S500).

[0079] The control unit 70 generates an approximate curve based on the pixel values ​​of the five pixels whose positions have been changed (step S510). The control unit 70 performs differentiation of the generated approximate curve (step S520). The control unit 70 determines whether the maximum value of the derivative is greater than a first predetermined value (step S530). If it is determined that the maximum value of the derivative is greater than the first predetermined value (YES in step S530), the control unit 70 executes the process in step S500 again. On the other hand, if it is determined that the maximum value of the derivative is less than or equal to the first predetermined value (NO in step S530), the control unit 70 identifies the upper end of the left-hand side EL1 (step S540).

[0080] The control unit 70 shifts the positions of a predetermined number of pixels (5 pixels), including pixel PX1, which corresponds to the maximum value of the derivative calculated in step S420 of Figure 14 (maximum value > first predetermined value), by one pixel downward in the column direction (step S550).

[0081] The control unit 70 generates an approximate curve based on the pixel values ​​of the five pixels whose positions have been changed (step S560). The control unit 70 performs differentiation of the generated approximate curve (step S570). The control unit 70 determines whether the maximum value of the derivative is greater than a first predetermined value (step S580). If it is determined that the maximum value of the derivative is greater than the first predetermined value (YES in step S580), the control unit 70 executes the process in step S550 again. On the other hand, if it is determined that the maximum value of the derivative is less than or equal to the first predetermined value (NO in step S580), the control unit 70 identifies the lower end of the left-hand side EL1 (step S590). This identifies the upper and lower ends of the left-hand side EL1.

[0082] Thus, in the cutting device 1 according to this embodiment, at least a portion of the multiple inspection areas T1 are set by repeatedly shifting the position of a predetermined number of pixels and performing a left-side determination process. Therefore, the cutting device 1 allows for more efficient automatic setting of the inspection areas T1 compared to, for example, a case where the inspection areas T1 are set based on the pixel values ​​of each pixel PX1 included in the entire captured image IM1.

[0083] Furthermore, with the cutting device 1, the positions of a predetermined number of pixels are gradually shifted diagonally, and a portion of one side of any of the multiple electronic components S1 (for example, the left side EL1) intersects with the predetermined number of pixels at a relatively early stage, so that a portion of one side of any of the multiple electronic components S1 can be identified relatively efficiently.

[0084] Furthermore, according to the cutting device 1, other parts of the left-hand side EL1 are identified based on a part of the left-hand side EL1 that has been identified, so the entire left-hand side EL1 can be identified relatively efficiently.

[0085] Figure 16 is a diagram illustrating the procedure for identifying the right-hand side ER1 of the first electronic component S1. Referring to Figure 16, the right-hand side ER1 of the first electronic component S1 is identified based on the left-hand side EL1 after the left-hand side EL1 has been identified.

[0086] A predetermined number of pixels (5 pixels) are selected to the right in the row direction, based on each pixel located several pixels to the right in the row direction from the position of each pixel included in the left-hand side EL1, and a set of 5 pixels is generated. For each of the 5 pixels in the set of 5 pixels, a right-hand side determination process is performed. The position of the leftmost pixel among the 5 pixels initially selected to identify the right-hand side ER1 is located several pixels to the right in the row direction from the position of the left-hand side EL1. The number of pixels shifted from the position of the left-hand side EL1 is predetermined, for example, based on the specification value of the left-right length of the electronic component S1.

[0087] The right-hand side determination process is a process that determines whether a portion of the right-hand side ER1 is included in a predetermined number of pixels, based on the pixel value of each of those pixels. In the right-hand side determination process, the boundary between the holding member 11b and the electronic component S1 is identified based on the pixel value of each of the predetermined number of pixels. For example, moving from the right to the left in the figure, a portion is identified in which pixels with small pixel values ​​(pixels corresponding to the holding member 11b (dark pixels)) and pixels with large pixel values ​​(pixels corresponding to the electronic component S1 (bright pixels)) are adjacent in that order.

[0088] In the left-hand side determination process described above, for the five pixels targeted for left-hand side determination, it is determined whether a predetermined number of pixels contain a portion of the left-hand side EL1 based on how the pixel values ​​change from left to right in the figure. On the other hand, in the right-hand side determination process, for the five pixels targeted for right-hand side determination, it is determined whether a predetermined number of pixels contain a portion of the right-hand side ER1 based on how the pixel values ​​change from right to left in the figure. This is because, for the five pixels containing the left-hand side EL1, the pixel values ​​increase (become brighter) from left to right, while for the five pixels containing the right-hand side ER1, the pixel values ​​increase from right to left. In other respects, the content of the left-hand side determination process and the right-hand side determination process are the same.

[0089] If the right-hand side determination process determines that a predetermined number of pixels (5 selected pixels) contain a predetermined number of pixels that do not include part of the right-hand side ER1, the position of the set of pixels is shifted one pixel to the right in the row direction. Then, the right-hand side determination process is performed on the modified set of pixels. The position of the right-hand side ER1 is determined by repeatedly performing the position change of the set of pixels and the right-hand side determination process.

[0090] Figure 17 is a flowchart showing the procedure for identifying the right-hand side ER1 in the first electronic component S1 (step S310 in Figure 7). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0091] Referring to Figure 17, the control unit 70 determines the position of a predetermined set of pixels that are subject to the right-hand side determination process (step S600). For example, the control unit 70 determines the position of a predetermined number of pixels (5 pixels) to the right in the row direction, based on each pixel PX1 located at a position shifted by several pixels to the right in the row direction from the position of each pixel PX1 included in the left-hand side EL1, as the position of the set subject to the right-hand side determination process.

[0092] The control unit 70 generates multiple approximation curves based on the determined pixel values ​​of each of the five pixels (step S610). The control unit 70 performs differentiation on each of the generated multiple approximation curves (step S620). The control unit 70 determines whether the maximum value of each derivative is greater than a first predetermined value (step S630). If it is determined that some of the maximum values ​​of the derivatives are less than or equal to the first predetermined value (NO in step S630), the control unit 70 shifts the position of the set of five pixels subject to the right-hand side determination process one pixel to the right (step S640).

[0093] The control unit 70 determines whether an error has occurred based on the positions of the set of 5 pixels that are subject to the modified right-hand side determination process (step S650). For example, if the length between the position of each pixel at the leftmost end of the set of 5 pixels that are subject to the modified right-hand side determination process and the position of the left-hand side EL1 is longer than the specified length of the electronic component S1 in the left-right direction, and the difference is greater than or equal to a predetermined length, it is determined that an error has occurred.

[0094] If it is determined that an error has occurred (YES in step S650), the control unit 70 repeats the process in step S440, using the five pixels that were determined to have a maximum derivative value greater than the first predetermined value in step S430 of Figure 14 as the basis. On the other hand, if it is determined that no error has occurred (NO in step S650), the control unit 70 repeats steps S610, S620, and S630 (right-hand side determination process).

[0095] On the other hand, if it is determined that each maximum value of the derivative is greater than the first predetermined value (YES in step S630), the control unit 70 identifies the right-hand side ER1 based on each pixel position corresponding to each maximum value of the derivative obtained through the right-hand side determination process (maximum value > first predetermined value) (step S650).

[0096] Figure 18 is a diagram illustrating the procedure for identifying the upper edge ET1 and the lower edge EB1 of the first electronic component S1. Referring to Figure 18, the upper edge ET1 and the lower edge EB1 of the first electronic component S1 are identified based on the left edge EL1 and the right edge ER1 after the left edge EL1 and the right edge ER1 have been identified.

[0097] Specifically, a predetermined number of pixels (5 pixels) are selected from a set of pixels arranged in the column direction, perpendicular to the straight line connecting the upper end pixels of the left side EL1 and the right side ER1, and an upper edge determination process is performed on the selected 5 pixels. The upper edge determination process determines whether a part of the upper edge ET1 is included in the predetermined number of pixels based on the pixel value of each of the predetermined number of pixels. In the upper edge determination process, the boundary between the holding member 11b and the electronic component S1 is identified based on the pixel value of each of the predetermined number of pixels. For example, from the top to the bottom of the figure, a portion is identified in which pixels with small pixel values ​​(pixels corresponding to the holding member 11b (dark pixels)) and pixels with large pixel values ​​(pixels corresponding to the electronic component S1 (bright pixels)) are adjacent in that order.

[0098] In the left-hand side determination process described above, for the five pixels targeted for left-hand side determination, it is determined whether a predetermined number of pixels contain a portion of the left-hand side EL1 based on how the pixel values ​​change from left to right in the figure. On the other hand, in the top-hand side determination process, for the five pixels targeted for top-hand side determination, it is determined whether a predetermined number of pixels contain a portion of the top-hand side ET1 based on how the pixel values ​​change from top to bottom in the figure. This is because, for the five pixels containing the left-hand side EL1, the pixel values ​​increase (become brighter) from left to right, while for the five pixels containing the top-hand side ET1, the pixel values ​​increase from top to bottom. In other respects, the content of the left-hand side determination process and the top-hand side determination process are the same.

[0099] The process of changing the position of a predetermined number of pixels to be determined to be included in the upper edge ET1 and the upper edge determination process are repeatedly performed until it is determined through the upper edge determination process that a predetermined number of pixels do not contain a portion of the upper edge ET1. Once it is determined through the upper edge determination process that a predetermined number of pixels do not contain a portion of the upper edge ET1, the left and right ends of the upper edge ET1 are identified, and the upper edge ET1 is identified.

[0100] Furthermore, a predetermined number of pixels (5 pixels) are selected from a set of pixels arranged in the column direction perpendicular to the straight line connecting the lower end pixels of the left side EL1 and the right side ER1, and a lower edge determination process is performed on the selected 5 pixels. The lower edge determination process determines whether a part of the lower edge EB1 is included in the predetermined number of pixels based on the pixel value of each of the predetermined number of pixels. In the lower edge determination process, the boundary between the holding member 11b and the electronic component S1 is identified based on the pixel value of each of the predetermined number of pixels. For example, from the bottom to the top of the figure, a portion is identified in which pixels with small pixel values ​​(pixels corresponding to the holding member 11b (dark pixels)) and pixels with large pixel values ​​(pixels corresponding to the electronic component S1 (bright pixels)) are adjacent in that order.

[0101] In the left-side determination process described above, for the five pixels targeted for left-side determination, it is determined whether a predetermined number of pixels contain a portion of the left-side EL1 based on how the pixel values ​​change from left to right in the figure. On the other hand, in the bottom-side determination process, for the five pixels targeted for bottom-side determination, it is determined whether a predetermined number of pixels contain a portion of the bottom-side EB1 based on how the pixel values ​​change from bottom to top in the figure. This is because, for the five pixels containing the left-side EL1, the pixel values ​​increase (become brighter) from left to right, while for the five pixels containing the bottom-side EB1, the pixel values ​​increase from bottom to top. In other respects, the content of the left-side determination process and the bottom-side determination process are the same.

[0102] The process of changing the position of a predetermined number of pixels to be determined to be included in the row direction to the right and the process of determining the bottom edge are repeatedly performed until the bottom edge determination process determines that a predetermined number of pixels do not contain a portion of the bottom edge EB1. Once the bottom edge determination process determines that a predetermined number of pixels do not contain a portion of the bottom edge EB1, the left and right ends of the bottom edge EB1 are identified, and the bottom edge EB1 is identified.

[0103] Figure 19 is a flowchart showing the procedure for identifying the upper edge ET1 of the first electronic component S1 (step S320 in Figure 7). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0104] Referring to Figure 19, the control unit 70 determines the positions of a predetermined number of pixels that are subject to the top edge determination process (step S700). For example, the control unit 70 determines that a predetermined number of pixels located at the leftmost end of a set of predetermined number of pixels (5 pixels) arranged in the column direction, perpendicular to the straight line connecting the upper end pixels of the left side EL1 and the right side ER1, will be subject to the top edge determination process.

[0105] The control unit 70 generates an approximation curve based on the determined pixel values ​​of the five pixels (step S710). The control unit 70 performs differentiation of the generated approximation curve (step S720). The control unit 70 determines whether the maximum value of the derivative is greater than a first predetermined value (step S730). If it is determined that the maximum value of the derivative is greater than the first predetermined value (YES in step S730), the control unit 70 shifts the position of the five pixels subject to the top edge determination process by one pixel to the right in the row direction (step S740), and then executes steps S710, S720, and S730 (top edge determination process) again.

[0106] On the other hand, if it is determined that the maximum value of the derivative is less than or equal to a first predetermined value (NO in step S730), the control unit 70 determines whether the difference between the length (left-right length) between the position of the upper end of the left-hand side EL1 and the positions of a predetermined number of pixels for which the maximum value of the derivative is determined to be less than or equal to the first predetermined value, and the second predetermined length, is less than a third predetermined value (step S750). The second predetermined length is, for example, a length corresponding to the specification value of the left-right length of the electronic component S1. The third predetermined value may be, for example, a length corresponding to 0.5%-5% of the specification value of the left-right length of the electronic component S1.

[0107] If it is determined that the difference between the left-right length and the second predetermined length is greater than or equal to the third predetermined value (NO in step S750), the control unit 70 then repeats the process of step S440, using as a reference the five pixels for which the maximum value of the derivative was determined to be greater than the first predetermined value in step S430 of Figure 14.

[0108] On the other hand, if it is determined that the difference between the left-right length and the second predetermined length is less than the third predetermined value (YES in step S750), the control unit 70 identifies the top edge ET1 based on each pixel position corresponding to each maximum value (maximum value > first predetermined value) of the differential value obtained through the top edge determination process (step S760).

[0109] Figure 20 is a flowchart showing the procedure for identifying the lower edge EB1 of the first electronic component S1 (step S330 in Figure 7). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0110] Referring to Figure 20, the control unit 70 determines the positions of a predetermined number of pixels that are subject to bottom edge determination processing (step S800). For example, the control unit 70 determines that a predetermined number of pixels located at the left end of a set of predetermined number of pixels (5 pixels) arranged in the column direction, perpendicular to the line connecting the pixels at the bottom ends of the left edge EL1 and the right edge ER1, will be subject to bottom edge determination processing.

[0111] The control unit 70 generates an approximate curve based on the determined pixel values ​​of the five pixels (step S810). The control unit 70 performs differentiation of the generated approximate curve (step S820). The control unit 70 determines whether the maximum value of the derivative is greater than a first predetermined value (step S830). If it is determined that the maximum value of the derivative is greater than the first predetermined value (YES in step S830), the control unit 70 shifts the position of the five pixels subject to the bottom edge determination process by one pixel to the right in the row direction (step S840), and then executes steps S810, S820, and S830 (bottom edge determination process) again.

[0112] On the other hand, if it is determined that the maximum value of the derivative is less than or equal to a first predetermined value (NO in step S830), the control unit 70 determines whether the difference between the length (left-right length) between the position of the lower end of the left-hand side EL1 and the positions of a predetermined number of pixels for which the maximum value of the derivative is determined to be less than or equal to the first predetermined value, and the second predetermined length, is less than a third predetermined value (step S850).

[0113] If it is determined that the difference between the left-right length and the second predetermined length is greater than or equal to the third predetermined value (NO in step S850), the control unit 70 then repeats the process of step S440, using as a reference the five pixels for which the maximum value of the derivative was determined to be greater than the first predetermined value in step S430 of Figure 14.

[0114] On the other hand, if it is determined that the difference between the left-right length and the second predetermined length is less than the third predetermined value (YES in step S850), the control unit 70 identifies the bottom edge EB1 based on the pixel positions corresponding to each maximum value (maximum value > first predetermined value) of the differential values ​​obtained through the bottom edge determination process (step S860). Then, the inspection area T1 is set based on the identified left edge EL1, right edge ER1, top edge ET1, and bottom edge EB1.

[0115] Thus, according to the cutting device 1 of this embodiment, the other three sides of the electronic component S1 including the left-hand side EL1 are identified based on the identified left-hand side EL1, so the inspection area T1 can be set relatively efficiently.

[0116] Furthermore, with the cutting device 1, when searching for the right side ER1 opposite the left side EL1, the left side EL1 is identified and the approximate positions of both ends (upper and lower ends) of the right side ER1 are known, so the right side ER1 can be identified relatively efficiently. Also, with the cutting device 1, when searching for the two sides other than the left side EL1 and the right side ER1 (upper side ET1 and lower side EB1), the left side EL1 and the right side ER1 are identified and the approximate positions of both ends of the two sides other than the left side EL1 and the right side ER1 are known, so the two sides other than the left side EL1 and the right side ER1 can be identified relatively efficiently.

[0117] Figure 21 illustrates the procedure for setting up other inspection areas T1 at positions offset in the row or column direction relative to the first inspection area T1. Referring to Figure 21, for example, inspection area T1B, which is offset in the row direction relative to inspection area T1A, and inspection area T1C, which is offset in the column direction relative to inspection area T1A, are each set up based on inspection area T1A.

[0118] To set an inspection area T1 that is offset in the row direction from the inspection area T1A, for example, a temporary inspection area T1B1 with the same shape as inspection area T1A is selected. The shape of the temporary inspection area T1B1 is the same as the shape of inspection area T1A. That is, the lengths of the left side, right side, top side, and bottom side of the temporary inspection area T1B1 are the same as the lengths of the left side, right side, top side, and bottom side of inspection area T1A.

[0119] The position of the provisional inspection area T1B1 is shifted by several pixels in the row direction relative to the position of inspection area T1A. The number of pixels shifted from the position of inspection area T1A is predetermined, for example, based on the specification value of the left-right length of the electronic component S1.

[0120] When a temporary inspection area T1 (for example, temporary inspection area T1B1) is selected, a determination process (hereinafter also referred to as "each-edge determination process") is executed to determine whether the left edge, right edge, top edge, and bottom edge of the temporary inspection area T1 (for example, temporary inspection area T1B1) correspond to the left edge, right edge, top edge, and bottom edge of the electronic component S1 (for example, electronic component S1B), respectively. In each-edge determination process, the left-edge determination process is repeatedly executed along the left edge of the temporary inspection area T1, and the right-edge determination process is repeatedly executed along the right edge of the temporary inspection area T1. In addition, the top edge determination process is repeatedly executed along the top edge of the temporary inspection area T1, and the bottom edge determination process is repeatedly executed along the bottom edge of the temporary inspection area T1. This determines whether each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1.

[0121] If it is determined that any edge of the temporary inspection area T1 does not correspond to an edge of the electronic component S1, a new temporary inspection area T1 (for example, temporary inspection area T1B2) is selected at a position shifted by one pixel in the row direction. Then, the edge determination process is performed for the newly selected temporary inspection area T1. The process of shifting the position of the temporary inspection area T1 in the row direction and the edge determination process are repeated until it is determined that each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1. As a result, other inspection areas T1 at positions shifted in the row direction are set relative to the first inspection area T1. By repeating the same procedure, inspection areas T1 corresponding to each electronic component S1 located at positions shifted in the row direction relative to the first set inspection area T1 are set.

[0122] To set an inspection area T1 that is offset in the column direction from the inspection area T1A, for example, a temporary inspection area T1C1 with the same shape as inspection area T1A is selected. The shape of the temporary inspection area T1C1 is the same as the shape of inspection area T1A. That is, the lengths of the left side, right side, top side, and bottom side of the temporary inspection area T1C1 are the same as the lengths of the left side, right side, top side, and bottom side of inspection area T1A.

[0123] The position of the provisional inspection area T1C1 is shifted by several pixels in the column direction relative to the position of inspection area T1A. The number of pixels shifted from the position of inspection area T1A is predetermined, for example, based on the specification value of the vertical length of the electronic component S1.

[0124] When a temporary inspection area T1 (for example, temporary inspection area T1C1) is selected, the edge determination process is executed for each edge. If it is determined that any edge of the temporary inspection area T1 does not correspond to an edge of the electronic component S1, a new temporary inspection area T1 (for example, temporary inspection area T1C2) is selected at a position shifted by one pixel in the column direction. Then, the edge determination process is executed for the newly selected temporary inspection area T1. The process of shifting the position of the temporary inspection area T1 in the column direction and the edge determination process are repeated until it is determined that each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1. As a result, other inspection areas T1 at positions shifted in the column direction are set relative to the first inspection area T1. By repeating the same procedure, inspection areas T1 corresponding to each electronic component S1 located at positions shifted in the column direction relative to the first set inspection area T1 are set.

[0125] Figure 22 is a flowchart showing the procedure for setting up another inspection area T1 at a position offset in the row direction from the first inspection area T1 (step S210 in Figure 6). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0126] Referring to Figure 22, the control unit 70 selects a temporary inspection area T1 at a position shifted by several pixels in the row direction from the set inspection area T1, based on the set inspection area T1 (step S900). The control unit 70 performs edge determination processing for the selected temporary inspection area T1 (step S910). The control unit 70 determines whether each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1 (step S920).

[0127] If it is determined that any edge of the temporary inspection area T1 does not correspond to an edge of the electronic component S1 (NO in step S920), the control unit 70 changes the position of the temporary inspection area T1 by shifting its position by 1 pixel in the row direction (step S930). After that, the control unit 70 executes the processes of steps S910 and S920 again.

[0128] On the other hand, if it is determined that each side of the temporary inspection area T1 corresponds to an side of the electronic component S1 (YES in step S920), the control unit 70 sets the currently selected temporary inspection area T1 as the inspection area T1 (step S940). Subsequently, the control unit 70 determines whether or not inspection areas T1 corresponding to all electronic components S1 present in the row direction have been set (step S950). If it is determined that the setting of inspection areas T1 corresponding to all electronic components S1 present in the row direction has not been completed (NO in step S950), the control unit 70 executes the process in step S900 again. On the other hand, if it is determined that inspection areas T1 corresponding to all electronic components S1 present in the row direction have been set (YES in step S950), the process shown in this flowchart ends.

[0129] Figure 23 is a flowchart showing the procedure for setting up another inspection area T1 at a position offset in the column direction from the first inspection area T1 (step S220 in Figure 6). The process shown in this flowchart is executed by the control unit 70 of the computer 50.

[0130] Referring to Figure 23, the control unit 70 selects a temporary inspection area T1 at a position shifted by several pixels in the column direction from the set inspection area T1, based on the set inspection area T1 (step S1000). The control unit 70 performs edge determination processing for the selected temporary inspection area T1 (step S1010). The control unit 70 determines whether each edge of the temporary inspection area T1 corresponds to an edge of the electronic component S1 (step S1020).

[0131] If it is determined that any side of the temporary inspection area T1 does not correspond to a side of the electronic component S1 (NO in step S1020), the control unit 70 changes the position of the temporary inspection area T1 by shifting its position by one pixel in the column direction (step S1030). After that, the control unit 70 executes the processes of steps S1010 and S1020 again.

[0132] On the other hand, if it is determined that each side of the temporary inspection area T1 corresponds to an side of the electronic component S1 (YES in step S1020), the control unit 70 sets the currently selected temporary inspection area T1 as the inspection area T1 (step S1040). Subsequently, the control unit 70 determines whether or not an inspection area T1 corresponding to all electronic components S1 present in the column direction has been set (step S1050). If it is determined that the setting of an inspection area T1 corresponding to all electronic components S1 present in the column direction has not been completed (NO in step S1050), the control unit 70 executes the process in step S1000 again. On the other hand, if it is determined that an inspection area T1 corresponding to all electronic components S1 present in the column direction has been set (YES in step S1050), the process shown in this flowchart ends.

[0133] Thus, according to the cutting device 1 of this embodiment, since other inspection areas T1 are identified based on the first identified inspection area T1, multiple inspection areas T1 can be identified relatively efficiently.

[0134] [4. Features] As described above, in the cutting device 1 according to this embodiment, at least a portion of multiple inspection areas T1 is set by repeatedly shifting the position of a predetermined number of pixels PX1 and performing a determination process (for example, a left-hand side determination process). Therefore, the cutting device 1 can automatically set the inspection areas T1 more efficiently than, for example, when the inspection areas T1 are set based on the pixel values ​​of each pixel PX1 included in the entire captured image IM1.

[0135] Note that the cutting device 1 is an example of a "cutting device" in the present invention. Electronic component S1 is an example of a "cut product" in the present invention. The first optical inspection camera 12 and the second optical inspection camera 13 are examples of "imaging units" in the present invention. The control unit 70 is an example of a "first processing unit" and an example of a "second processing unit" in the present invention. Captured image IM1 is an example of a "captured image" in the present invention.

[0136] [5. Other Embodiments] The concept of the above embodiments is not limited to those described above. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. Below, an example of another embodiment to which the concept of the above embodiments can be applied will be described.

[0137] <5-1> In the above embodiment, the cutting device 1 was controlled by a computer 50. However, the cutting device 1 does not need to be controlled by a single computer 50, and may be controlled by multiple computers.

[0138] <5-2> Furthermore, in the above embodiment, the color of the holding member 11b of the inspection table 11 was black. However, as mentioned above, the color of the holding member 11b may be white. When the color of the holding member 11b is white, the pixel value decreases from left to right on the left side of the electronic component S1, and decreases from right to left on the right side. Also, the pixel value decreases from top to bottom on the top side of the electronic component S1, and decreases from bottom to top on the bottom side. Therefore, in the left-side determination process, it may be determined that a predetermined number of pixels include a part of the left side when the minimum value of the derivative of the approximation curve showing the change in pixel value from left to right is less than a threshold. Also, in the left-side determination process, it may be determined that a predetermined number of pixels include a part of the left side when the maximum value of the derivative of the approximation curve showing the change in pixel value from right to left is greater than a threshold. The same applies to the right-side determination process, the top-side determination process, and the bottom-side determination process.

[0139] <5-3> Furthermore, in the above embodiment, the left-hand side EL1 was identified first in order to set the initial inspection area T1. However, the side identified first is not limited to the left-hand side EL1. The right-hand side ER1 may be identified first, the top side ET1 may be identified first, or the bottom side EB1 may be identified first.

[0140] <5-4> Furthermore, in the process of identifying the left side EL1, the right side ER1, the top side ET1, and the bottom side EB1, the unit of pixels when shifting a predetermined number of pixels does not have to be 1 pixel. The position of a predetermined number of pixels may be shifted in units of multiple pixels. Also, the predetermined number of pixels does not have to be 5 pixels. The predetermined number of pixels can be 2 or more pixels. Furthermore, in the process of setting the second and subsequent inspection areas T1, the unit of pixels when shifting the temporary inspection area T1 does not have to be 1 pixel. The position of the temporary inspection area T1 may be shifted in units of multiple pixels.

[0141] <5-5> Furthermore, in the above embodiment, each side of the electronic component S1 in the captured image IM1 was identified based on the derivative value of an approximation curve generated based on the pixel values ​​of a predetermined number of pixels. However, such derivative values ​​do not necessarily have to be used to identify each side of the electronic component S1 in the captured image IM1.

[0142] <5-6> Furthermore, in the above embodiment, only a portion of the multiple electronic components S1 arranged on the inspection table 11 were captured simultaneously by the second optical inspection camera 13. However, the area captured by the second optical inspection camera 13 is not limited to this, and all of the multiple electronic components S1 arranged on the inspection table 11 may be captured simultaneously by the second optical inspection camera 13.

[0143] <5-7> Furthermore, in the above embodiment, some of the inspection areas T1 set from the second onward (for example, inspection area T1D in Figure 4) were set without going through the edge determination process. However, the method for setting the inspection areas T1 set from the second onward is not limited to this, and for example, all inspection areas T1 set from the second onward in the captured image IM1 may be set after going through the edge determination process.

[0144] <5-8> Furthermore, in the above embodiment, after the first inspection area T1 was set, an inspection area T1 at a position shifted in the row direction was set, and then an inspection area T1 at a position shifted in the column direction was set. However, the order in which each inspection area T1 is set is not limited to this. For example, after the first inspection area T1 is set, an inspection area T1 at a position shifted in the column direction may be set, and then an inspection area T1 at a position shifted in the row direction may be set.

[0145] <5-9> Furthermore, in the above embodiment, the left side EL1, the right side ER1, the top side ET1, and the bottom side EB1 were identified in this order in order to set the first inspection area T1. However, the order in which each side is identified is not limited to this.

[0146] <5-10> Furthermore, although the above embodiment mainly described the setting of the inspection area T1 in the captured image IM1 taken by the second optical inspection camera 13, similar processing may be performed when setting the inspection area in the captured image taken by the first optical inspection camera 12.

[0147] <5-11> Furthermore, in the above embodiment, when a part of the left-hand side EL1 is identified and the other part of the left-hand side EL1 is identified, the upper end of the left-hand side EL1 is identified first, and then the lower end of the left-hand side EL1 is identified. However, the order in which the upper and lower ends are identified is not limited to this. For example, when a part of the left-hand side EL1 is identified and the other part of the left-hand side EL1 is identified, the lower end of the left-hand side EL1 may be identified first, and then the upper end of the left-hand side EL1 may be identified.

[0148] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0149] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. That is, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0150] [6. Addendum] <Technology 1> (composition) A cutting apparatus for manufacturing multiple cut products by cutting a circuit board, A shooting unit that generates an image by photographing part or all of the aforementioned multiple cut pieces, A first processing unit that sets multiple inspection areas in the captured image, The system includes a second processing unit that inspects the appearance of each cut piece included in the captured image based on the image included in each of the plurality of inspection areas in the captured image, Each of the aforementioned inspection areas has a rectangular shape. The shape of each of the aforementioned cut pieces is rectangular. The first processing unit performs a determination process to determine whether a portion of one side of any of the multiple cut pieces is included in a predetermined number of pixels based on the pixel values ​​of each of the predetermined number of pixels that are continuously located in a first direction in the captured image. The predetermined number is smaller than the total number of pixels in the captured image. The cutting device sets at least a portion of the plurality of inspection areas by repeatedly performing the determination process while shifting the positions of a predetermined number of pixels, in the first processing unit. (Effects, etc.) In this cutting device, the above determination process is repeatedly performed by shifting the position of a predetermined number of pixels, thereby setting at least a portion of multiple inspection areas. Therefore, this cutting device allows for more efficient automatic setting of inspection areas compared to, for example, a case where inspection areas are set based on the pixel value of each pixel included in the entire captured image.

[0151] <Technology 2> (composition) The cutting apparatus according to Technical 1, wherein the left, right, top, and bottom edges of the captured image are parallel to the left, right, top, and bottom edges of each of the cut pieces, respectively.

[0152] <Technology 3> (composition) The first processing unit sets at least a portion of the plurality of inspection areas by repeatedly shifting the positions of the predetermined number of pixels in the second direction and executing the determination process, The cutting apparatus according to Technology 1 or Technology 2, wherein the second direction is oblique to the first direction. (Effects, etc.) With this cutting device, the positions of a predetermined number of pixels are gradually shifted diagonally, and a portion of one side of any of the multiple cut pieces intersects with the predetermined number of pixels at a relatively early stage, making it possible to identify a portion of one side of any of the multiple cut pieces relatively efficiently.

[0153] <Technology 4> (composition) The cutting apparatus according to any one of the technologies 1 to 3, wherein the first direction is the row direction or the column direction.

[0154] <Technology 5> (composition) The cutting apparatus according to Technology 3 or Technology 4, wherein the first processing unit shifts the position of each of the predetermined number of pixels by one or more pixels in the row direction and by one or more pixels in the column direction, thereby shifting the positions of the predetermined number of pixels in the second direction. (Effects, etc.) With this cutting device, the positions of a predetermined number of pixels are gradually shifted by one or more pixels in the row direction and by one or more pixels in the column direction. As a result, a predetermined number of pixels intersect with a portion of one side of any of the multiple cut pieces at a relatively early stage, making it possible to identify a portion of one side of any of the multiple cut pieces relatively efficiently.

[0155] <Technology 6> (composition) The cutting apparatus according to any one of the technologies 1 to 5, wherein the first processing unit determines through the determination process that a predetermined number of pixels contain a portion of the first side, which is one of the sides of the plurality of cut pieces, and then identifies the other portion of the first side based on at least a portion of the predetermined number of pixels that are determined to contain a portion of the first side. (Effects, etc.) This cutting device allows for the identification of the entire first side relatively efficiently, as the rest of the first side is identified based on the identified portion of the first side.

[0156] <Technology 7> (composition) The cutting apparatus according to Art 6, wherein the first processing unit identifies three other sides of the cut piece including the first side based on the identified first side, and sets one of the plurality of inspection areas based on the identified four sides. (Effects, etc.) With this cutting device, the other three sides of the cut piece, including the first side, are identified based on the identified first side, allowing for relatively efficient setting of the inspection area.

[0157] <Technology 8> (composition) The cutting apparatus according to Technical Reference No. 7, wherein the first processing unit identifies a second side from the other three sides that is opposite to the first side based on the identified first side, and then identifies two sides other than the first side and the second side. (Effects, etc.) With this cutting device, when searching for the second side opposite the first side, the first side is identified and the approximate positions of both ends of the second side are known, allowing for relatively efficient identification of the second side. Furthermore, with this cutting device, when searching for two sides other than the first and second sides, the first and second sides are identified and the approximate positions of both ends of the other two sides are known, allowing for relatively efficient identification of the other two sides.

[0158] <Technology 9> (composition) The cutting apparatus according to any one of the technologies 1 to 8, wherein the first processing unit sets the other inspection areas among the plurality of inspection areas based on the inspection area that was set first among the plurality of inspection areas. (Effects, etc.) This cutting device allows for the identification of multiple inspection areas relatively efficiently, as other inspection areas are identified based on the first inspection area identified.

[0159] <Technology 10> (composition) A method for manufacturing a cut product using a cutting device described in any one of Technology 1 to Technology 9, The cutting device is A cutting table on which the substrate is placed, The cutting unit comprises a cutting section for cutting the substrate placed on the cutting table, The aforementioned manufacturing method is The steps include placing the substrate on the cutting table, The steps include: manufacturing the plurality of cut products by cutting the substrate placed on the cutting table; The steps include generating the captured image by photographing part or all of the multiple cut pieces, The steps include setting the plurality of inspection areas in the captured image, A method for manufacturing a cut product, comprising the step of inspecting the appearance of each cut product included in the captured image based on the image included in each of the plurality of inspection areas in the captured image. (Effects, etc.) In this method for manufacturing cut products, the above determination process is repeatedly performed by shifting the position of a predetermined number of pixels, thereby setting at least a portion of multiple inspection areas. Therefore, this method for manufacturing cut products allows for more efficient automatic setting of inspection areas compared to, for example, a method where inspection areas are set based on the pixel value of each pixel included in the entire captured image. [Explanation of Symbols]

[0160] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Spindle unit, 6a Blade, 6b Second position confirmation camera, 6c Rotation axis, 7 Transport unit, 7a Second cleaner, 11 Inspection table, 11a Inspection table body, 11b Holding member, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement unit, 15 Extraction unit, 15a Tray for good products, 15b Tray for defective products, 20 Monitor, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Storage unit, 81 Control program, 90 Input / Output I / F, 95 Receiving unit, A1 Cutting module, B1 Inspection / Storage module, BA1 Ball unit, EB1, IB1 Bottom edge: EL1, IL1 Left edge: ER1, IR1 Right edge: ET1, IT1 Top edge: IM1 Captured image, L1 Approximation curve, L2 Curve, M1 Magazine, P1 Package substrate, PO1 Position of maximum derivative, PX1 Pixel, S1 Electronic component, T1 Inspection area, T1B1, T1B2, T1B3, T1C1, T1C2, T1C3 Provisional inspection area.

Claims

1. A cutting apparatus for manufacturing multiple cut products by cutting a circuit board, A shooting unit that generates an image by photographing part or all of the aforementioned multiple cut pieces, A first processing unit that sets multiple inspection areas in the captured image, The system includes a second processing unit that inspects the appearance of each cut piece included in the captured image based on the image included in each of the plurality of inspection areas in the captured image, Each of the aforementioned inspection areas has a rectangular shape. The shape of each of the aforementioned cut pieces is rectangular. The first processing unit performs a determination process to determine whether a predetermined number of pixels located continuously in a first direction in the captured image contain a portion of one side of any of the multiple cut pieces, based on the pixel values ​​of each of those pixels. The predetermined number is smaller than the total number of pixels in the captured image. The cutting device sets at least a portion of the plurality of inspection areas by repeatedly performing the determination process while shifting the positions of a predetermined number of pixels, in the first processing unit.

2. The cutting apparatus according to claim 1, wherein the left edge, right edge, top edge, and bottom edge of the captured image are parallel to the left edge, right edge, top edge, and bottom edge of each of the cut pieces, respectively.

3. The first processing unit sets at least a portion of the plurality of inspection areas by repeatedly shifting the positions of the predetermined number of pixels in the second direction and executing the determination process, The cutting apparatus according to claim 1, wherein the second direction is oblique to the first direction.

4. The cutting apparatus according to claim 1, wherein the first direction is the row direction or the column direction.

5. The cutting apparatus according to claim 3, wherein the first processing unit shifts the position of each of the predetermined number of pixels by one or more pixels in the row direction and by one or more pixels in the column direction, thereby shifting the positions of the predetermined number of pixels in the second direction.

6. The cutting apparatus according to claim 1, wherein the first processing unit determines through the determination process that a predetermined number of pixels contain a portion of the first side, which is one of the sides of the plurality of cut pieces, and then identifies the other portion of the first side based on at least a portion of the predetermined number of pixels that are determined to contain a portion of the first side.

7. The cutting apparatus according to claim 6, wherein the first processing unit identifies three other sides of the cut product including the first side based on the identified first side, and sets one of the plurality of inspection areas based on the identified four sides.

8. The cutting apparatus according to claim 7, wherein the first processing unit identifies a second side from the other three sides that is opposite to the first side based on the identified first side, and then identifies two sides other than the first side and the second side.

9. The cutting apparatus according to claim 1, wherein the first processing unit sets the other inspection areas among the plurality of inspection areas based on the inspection area that was set first among the plurality of inspection areas.

10. A method for manufacturing a cut product using a cutting device according to any one of claims 1 to 9, The cutting device is A cutting table on which the substrate is placed, The cutting unit comprises a cutting section for cutting the substrate placed on the cutting table, The aforementioned manufacturing method is The steps include placing the substrate on the cutting table, The steps include: manufacturing the plurality of cut products by cutting the substrate placed on the cutting table; The steps include generating the captured image by photographing part or all of the multiple cut pieces, The steps include setting the plurality of inspection areas in the captured image, A method for manufacturing a cut product, comprising the step of inspecting the appearance of each cut product included in the captured image based on the image included in each of the plurality of inspection areas in the captured image.

Images