Circuit module and method for manufacturing a circuit module

Abstract

According to the present invention, a mounting electrode is located on a positive principal surface of a resin layer located in the most positive Z-axis direction among a plurality of resin layers.　An inner conductor layer overlaps the mounting electrode as seen in the Z-axis direction.　The positive Z-axis end of a first interlayer connecting conductor is in contact with the mounting electrode.　The negative Z-axis end of the first interlayer connecting conductor is in contact with the inner conductor layer.　An article comprises a connecting member bonded to the mounting electrode.　The first interlayer connecting conductor includes first and second areas.　The first and second areas are arranged in that order in the negative Z-axis direction.　The material of the first area is the same as the material of the mounting electrode.　The Young's modulus of the second area is lower than the Young's modulus of the first area.

Description

Technical Field

[0001] The present invention relates to a circuit module including an article and a circuit board.

Background Art

[0002] As an invention related to a conventional circuit module, for example, a semiconductor device described in Patent Document 1 is known. The semiconductor device includes an IC chip and a multilayer wiring board. A plurality of IC connection terminals are provided on the upper main surface of the multilayer wiring board. A plurality of via connection terminals and a plurality of support vias are provided inside the multilayer wiring board. Each of the plurality of support vias connects the plurality of IC connection terminals and the plurality of via connection terminals.

[0003] Further, the IC chip has a plurality of solder bumps. Each of the plurality of solder bumps is joined to the plurality of IC connection terminals.

Prior Art Documents

Patent Documents

[0004]

Patent Document1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in the field of the semiconductor device described in Patent Document 1, a plurality of solder bumps and a plurality of IC connection terminals may be joined using an ultrasonic bonding technique. In this case, ultrasonic vibration is transmitted to the plurality of IC connection terminals and the plurality of support vias. As a result, vibration is applied to the boundary between the plurality of support vias and the plurality of via connection terminals, and there is a possibility that these connection portions are damaged.

[0006] Therefore, an object of the present invention is to provide a circuit module and a method for manufacturing a circuit module that can suppress breakage in a connection portion between an interlayer connection conductor and an internal conductor layer. [Means for solving the problem]

[0007] A circuit module according to one embodiment of the present invention is Circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive direction of the Z-axis among the plurality of resin layers, An internal conductor layer provided in the laminate and overlapping with the mounted electrode when viewed in the Z-axis direction, A first interlayer connecting conductor that penetrates the resin layer in the Z-axis direction, wherein the positive Z-axis end of the first interlayer connecting conductor is in contact with the mounted electrode, and the negative Z-axis end of the first interlayer connecting conductor is in contact with the internal conductor layer, It is equipped with, The aforementioned article is The connecting member that is solid-bonded to the aforementioned mounted electrode is They are equipped, The first interlayer connecting conductor includes a first region and a second region, The first region and the second region are arranged in this order in the negative direction of the Z-axis, The Young's modulus of the second region is lower than that of the first region.

[0008] A circuit module according to one embodiment of the present invention is Circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive direction of the Z-axis among the plurality of resin layers, It is provided on the laminate, and, when viewed in the Z-axis direction, an internal conductor layer overlapping with the mounting electrode, A third interlayer connection conductor penetrating the resin layer in the Z-axis direction, wherein the positive end of the Z-axis of the third interlayer connection conductor is in contact with the mounting electrode, and the negative end of the Z-axis of the third interlayer connection conductor is in contact with the internal conductor layer, a third interlayer connection conductor; A fourth interlayer connection conductor penetrating the resin layer in the Z-axis direction and overlapping with the mounting electrode when viewed in the Z-axis direction, wherein the positive end of the Z-axis of the fourth interlayer connection conductor is in contact with the internal conductor layer, a fourth interlayer connection conductor; and includes The article includes a connection member solid-phase bonded to the mounting electrode, and includes The fourth interlayer connection conductor includes a third region and a fourth region arranged side by side in the Z-axis direction, The material of the third interlayer connection conductor and the material of the third region are the same as the material of the mounting electrode, The Young's modulus of the fourth region is lower than the Young's modulus of the third region.

Advantages of the Invention

[0009] According to the circuit module of the present invention, breakage at the connection portion between the interlayer connection conductor and the internal conductor layer can be suppressed

Brief Description of the Drawings

[0010] [Figure 1] FIG. 1 is a cross-sectional view of the circuit module 10. [Figure 2] FIG. 2 is a cross-sectional view of the circuit module 10a. <000008,5>FIG. 3 is a cross-sectional view of the circuit module 10b. [Figure 4] FIG. 4 is a cross-sectional view of the circuit module 10c.

Embodiments for Carrying Out the Invention

[0011] (Embodiment) [Structure of Circuit Module] The structure of circuit module 10 according to an embodiment of the present invention will be described below while referring to the drawings. FIG. 1 is a cross-sectional view of circuit module 10.

[0012] In this specification, directions are defined as follows. The stacking direction of laminate 12 is defined as the vertical direction. Also, the vertical direction coincides with the Z-axis direction. The upward direction is the positive direction of the Z-axis. The downward direction is the negative direction of the Z-axis. Also, the directions orthogonal to the vertical direction are defined as the left-right direction and the front-back direction. The left-right direction is orthogonal to the front-back direction. Note that the upward and downward directions in the vertical direction may be interchanged, the left and right directions in the left-right direction may be interchanged, or the front and back directions in the front-back direction may be interchanged.

[0013] Circuit module 10 is used, for example, in a wireless communication terminal such as a smartphone. Circuit module 10 includes a circuit board 11 and an article 100.

[0014] Circuit board 11 transmits high-frequency signals. Circuit board 11 includes laminate 12, protective layer 16, conductor layers 18a to 18c, 20a to 20c, internal conductor layers 19a to 19f, first interlayer connection conductors V1a, V1b, interlayer connection conductors v1, v3a to v3c, and second interlayer connection conductors v2a to v2f.

[0015] Laminate 12 has a plate shape having an upper main surface and a lower main surface. Laminate 12 has a structure in which resin layers 14a to 14d having an upper main surface (a positive main surface located in the positive direction of the Z-axis) and a lower main surface are stacked in the vertical direction (Z-axis direction). Resin layers 14a to 14d are arranged in this order from top to bottom. Resin layers 14a to 14d have a rectangular shape when viewed in the vertical direction. The material of resin layers 14a to 14d is resin. The material of resin layers 14a to 14d is, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. Thereby, laminate 12 has flexibility.

[0016] The conductor layers 18a to 18c are provided on the laminate 12. The conductor layers 18a to 18c are located on the upper principal surface (positive principal surface) of the uppermost resin layer 14a (positive direction of the Z axis) among the resin layers 14a to 14d. The conductor layers 18a to 18c also have mounting electrodes E1 to E3. Therefore, the mounting electrodes E1 to E3 are located on the upper principal surface (positive principal surface) of the uppermost resin layer 14a (most positive direction of the Z axis) among the resin layers 14a to 14d. The mounting electrodes E1 to E3 are the parts where the conductor layers 18a to 18c are exposed from the protective layer 16, which will be described later. The mounting electrodes E1 to E3 have a rectangular shape when viewed in the vertical direction.

[0017] Conductor layers 18a to 18c are arranged in this order from left to right. Conductor layer 18a extends in the left-right direction. Mounted electrode E1 is located at the right end of conductor layer 18a. Conductor layer 18b has a square shape. Mounted electrode E2 is located in the center of conductor layer 18b. Conductor layer 18c extends in the left-right direction. Mounted electrode E3 is located at the left end of conductor layer 18c.

[0018] The internal conductor layers 19a to 19c are provided on the laminate 12. The internal conductor layers 19a to 19c are located on the upper main surface of the resin layer 14b. The internal conductor layers 19a to 19c are arranged in this order from left to right. The internal conductor layers 19a to 19c extend in the left-right direction. In addition, when viewed in the vertical direction (Z-axis direction), the internal conductor layers 19a and 19b overlap with the mounted electrodes E1 and E2, respectively. In this embodiment, the right end of the internal conductor layer 19a overlaps with the mounted electrode E1 when viewed in the vertical direction. The left end of the internal conductor layer 19b overlaps with the mounted electrode E2 when viewed in the vertical direction.

[0019] The internal conductor layers 19d to 19f are provided in the laminate 12. The internal conductor layers 19d to 19f are located on the lower main surface of the resin layer 14c. The internal conductor layers 19d to 19f are arranged in this order from left to right.

[0020] The conductive layers 20a to 20c are provided on the laminate 12. The conductive layers 20a to 20c are located on the lower main surface of the resin layer 14d. The conductive layers 20a to 20c are arranged in this order from left to right. When viewed in the vertical direction, the conductive layers 20a to 20c have a rectangular shape. The conductive layers 20a to 20c are, for example, external electrodes.

[0021] The conductive layers 18a-18c, 20a-20c and the internal conductive layers 19a-19f described above are formed by patterning metal foil attached to the upper main surface of resin layers 14a, 14b and the lower main surface of resin layers 14c, 14d. The metal foil is, for example, copper foil.

[0022] Furthermore, the mounted electrodes E1 to E3 have a structure in which nickel plating and gold plating are applied to the surface of copper foil. Thus, the surface material of mounted electrodes E1 to E3 is gold.

[0023] The protective layer 16 covers almost the entire positive principal surface (upper principal surface) of the uppermost resin layer 14a (positive direction of the Z axis) among the resin layers 14a to 14d. Thus, the protective layer 16 protects the conductor layers 18a to 18c. However, the mounted electrodes E1 to E3 are not covered by the protective layer 16. Furthermore, the protective layer 16 is not part of the laminate 12. No conductor layer is provided on the upper principal surface of the protective layer 16.

[0024] The first interlayer connecting conductors V1a and V1b are provided in the laminate 12. In this embodiment, the first interlayer connecting conductors V1a and V1b penetrate the resin layer 14a in the vertical direction (Z-axis direction). When viewed in the vertical direction, the first interlayer connecting conductor V1a overlaps with the mounted electrode E1 and the right end of the internal conductor layer 19a. Therefore, the upper end (positive Z-axis end) of the first interlayer connecting conductor V1a is in contact with the mounted electrode E1. The lower end (negative Z-axis end) of the first interlayer connecting conductor V1a is in contact with the internal conductor layer 19a. Furthermore, when viewed in the vertical direction, the first interlayer connecting conductor V1b overlaps with the mounted electrode E2 and the left end of the internal conductor layer 19b. Therefore, the upper end (positive Z-axis end) of the first interlayer connecting conductor V1b is in contact with the mounted electrode E2. The lower end (the negative end in the Z-axis direction) of the first interlayer connecting conductor V1b is in contact with the inner conductor layer 19b.

[0025] The first interlayer connecting conductors V1a and V1b have a shape in which the area of ​​the cross-section perpendicular to the vertical direction decreases as you go from bottom to top. Specifically, the first interlayer connecting conductors V1a and V1b have a frustoconical shape. Furthermore, the area of ​​the upper end of the first interlayer connecting conductors V1a and V1b is smaller than the area of ​​the lower end of the first interlayer connecting conductors V1a and V1b.

[0026] Each of the first interlayer connecting conductors V1a and V1b contains a first region A1 and a second region A2. The first region A1 and the second region A2 are arranged in this order downwards (negative Z-axis direction). Therefore, the second region A2 is located below the first region A1 (negative Z-axis direction). The volume of the first region A1 is 30% or more of the volume of the first interlayer connecting conductors V1a and V1b. The Young's modulus of the second region A2 is lower than that of the first region A1. As a result, the Young's modulus of the lower half of the first interlayer connecting conductors V1a and V1b is different from that of the upper half. Furthermore, the second region A2 has a lower heat transfer coefficient than the first region A1. The material of the first region A1 is the same as the material of the mounting electrodes E1 and E2. Therefore, the material of the first region A1 and the materials of the mounting electrodes E1 and E2 are, for example, copper, aluminum, or silver. The material of the second region A2 is an alloy mainly composed of tin. An alloy mainly composed of tin is, for example, a tin-copper alloy or a tin-silver alloy. The second region A2 is formed by sintering a conductive paste, which is a mixture of metal powder and resin.

[0027] The interlayer connecting conductor v1 is provided in the laminate 12. In this embodiment, the interlayer connecting conductor v1 penetrates the resin layer 14a in the vertical direction (Z-axis direction). The upper end of the interlayer connecting conductor v1 is in contact with the right end of the conductor layer 18c. The lower end of the interlayer connecting conductor v1 is in contact with the left end of the inner conductor layer 19c. The structure of the interlayer connecting conductor v1 is the same as that of the first interlayer connecting conductors V1a and V1b, so a description is omitted.

[0028] The second interlayer connecting conductors v2a to v2c are located below the first interlayer connecting conductors V1a and V1b (in the negative Z-axis direction). The second interlayer connecting conductors v2a to v2c penetrate the resin layer 14b in the vertical direction (Z-axis direction). The upper end of the second interlayer connecting conductor v2a is in contact with the left end of the inner conductor layer 19a. The upper end of the second interlayer connecting conductor v2b is in contact with the right end of the inner conductor layer 19b. The upper end of the second interlayer connecting conductor v2c is in contact with the right end of the inner conductor layer 19c.

[0029] The second interlayer connecting conductors v2a to v2c have a shape in which the area of ​​the cross-section perpendicular to the vertical direction decreases as you go from bottom to top. Specifically, the second interlayer connecting conductors v2a to v2c have a frustoconical shape. Furthermore, the area of ​​the upper end of the second interlayer connecting conductors v2a to v2c is smaller than the area of ​​the lower end of the second interlayer connecting conductors v2a to v2c.

[0030] The second interlayer connecting conductors v2d to v2f are located below the first interlayer connecting conductors V1a and V1b (in the negative Z-axis direction). The second interlayer connecting conductors v2d to v2f penetrate the resin layer 14c in the vertical direction (Z-axis direction). The upper end of the second interlayer connecting conductor v2d is in contact with the second interlayer connecting conductor v2a. The lower end of the second interlayer connecting conductor v2d is in contact with the internal conductor layer 19d. The upper end of the second interlayer connecting conductor v2e is in contact with the second interlayer connecting conductor v2b. The lower end of the second interlayer connecting conductor v2e is in contact with the right end of the internal conductor layer 19e. The upper end of the second interlayer connecting conductor v2f is in contact with the second interlayer connecting conductor v2c. The lower end of the second interlayer connecting conductor v2f is in contact with the internal conductor layer 19f.

[0031] The second interlayer connecting conductors v2d to v2f have a shape in which the area of ​​the cross-section perpendicular to the vertical direction decreases as you go from top to bottom. Specifically, the second interlayer connecting conductors v2d to v2f have a frustoconical shape. Furthermore, the area of ​​the lower end of the second interlayer connecting conductors v2d to v2f is smaller than the area of ​​the upper end of the second interlayer connecting conductors v2d to v2f.

[0032] The Young's modulus of the second interlayer connecting conductors v2a to v2f is lower than that of the first region A1. The Young's modulus of the second interlayer connecting conductors v2a to v2f is equal to that of the second region A2. The material of such second interlayer connecting conductors v2a to v2f is an alloy mainly composed of tin. Examples of tin-based alloys include tin-copper alloys and tin-silver alloys. The second interlayer connecting conductors v2a to v2f are formed by sintering a conductive paste, which is a mixture of metal powder and resin.

[0033] The interlayer connecting conductors v3a to v3c are provided in the laminate 12. In this embodiment, the interlayer connecting conductors v3a to v3c penetrate the resin layer 14d in the vertical direction. The upper end of interlayer connecting conductor v3a is in contact with the internal conductor layer 19d. The lower end of interlayer connecting conductor v3a is in contact with the conductor layer 20a. The upper end of interlayer connecting conductor v3b is in contact with the left end of the internal conductor layer 19e. The lower end of interlayer connecting conductor v3b is in contact with the conductor layer 20b. The upper end of interlayer connecting conductor v3c is in contact with the internal conductor layer 19f. The lower end of interlayer connecting conductor v3c is in contact with the conductor layer 20c.

[0034] The interlayer connecting conductors v3a to v3c have a shape in which the area of ​​the cross-section perpendicular to the vertical direction decreases as you go from top to bottom. Specifically, the interlayer connecting conductors v3a to v3c have a frustoconical shape. Furthermore, the area of ​​the lower end of the interlayer connecting conductors v3a to v3c is smaller than the area of ​​the upper end of the interlayer connecting conductors v3a to v3c.

[0035] Each of the interlayer connecting conductors v3a to v3c contains a first region A1 and a second region A2. The second region A2 is located above the first region A1. The structure of the first region A1 and the second region A2 of the interlayer connecting conductors v3a to v3c is the same as the structure of the first region A1 and the second region A2 of the first interlayer connecting conductors V1a and V1b, so a detailed explanation is omitted.

[0036] In the process of forming the first interlayer connecting conductors V1a, V1b and interlayer connecting conductors v1, v3a~v3c, through holes are formed that penetrate the resin layers 14a and 14d in the vertical direction (Z-axis direction). Furthermore, the first region A1 is formed by plating the through holes. After forming the first region A1, the second region A2 is formed by filling the through holes with conductive paste and solidifying the conductive paste by heating.

[0037] Article 100 is mounted on the mounting electrodes E1 to E3 of the circuit board 11. Article 100 is an element that generates heat during operation. Article 100 is, for example, an IC (Integrated Circuit). Article 100 is, for example, an RFIC (Radio Frequency Integrated Circuit), a CPU (Central Processing Unit), a power supply IC, etc. Article 100 comprises an article body 102 and connecting members B1 to B3. The article body 102 has a rectangular parallelepiped shape. The connecting members B1 to B3 are located on the lower surface of the article body 102. The connecting members B1 to B3 are arranged in this order from left to right. Each of the connecting members B1 to B3 is solid-phase bonded to the mounting electrodes E1 to E3. Solid-phase bonding is a type of bonding in which a bonding boundary is formed by the contact between the solid phase of the connecting members B1 to B3 and the solid phase of the mounting electrodes E1 to E3. In solid-state bonding, two metals are joined without the need for a low-melting-point metal intermediary.

[0038] The connecting members B1 to B3 described above are gold bumps. Therefore, the surface material of connecting members B1 to B3 is gold. In this embodiment, the entire material of connecting members B1 to B3 is gold. Each of connecting members B1 to B3 is joined to the mounting electrodes E1 to E3 by ultrasonic bonding technology. During ultrasonic bonding, a portion of the gold in connecting members B1 to B3 and a portion of the gold in mounting electrodes E1 to E3 melt and then solidify. As a result, each of connecting members B1 to B3 is joined to the mounting electrodes E1 to E3.

[0039] [effect] (a) The circuit module 10 can suppress damage to the connection between the first interlayer connecting conductor V1a and the internal conductor layer 19a. More specifically, the surface material of the connecting member B1 is gold. The connecting member B1 is then joined to the mounted electrode E1 by ultrasonic bonding technology. For the connecting member B1 to be firmly joined to the mounted electrode E1, the mounted electrode E1 only needs to be supported by the hard first interlayer connecting conductor V1a. For example, the material of the first interlayer connecting conductor V1a can be the same as the material of the mounted electrode E1. This allows ultrasonic vibrations to be efficiently transmitted to the connecting member B1 and the mounted electrode E1. As a result, the connecting member B1 is firmly joined to the mounted electrode E1.

[0040] However, if the first interlayer connecting conductor V1a is too stiff, damage may occur at the connection point between the first interlayer connecting conductor V1a and the inner conductor layer 19a. More specifically, the upper end of the first interlayer connecting conductor V1a is in contact with the mounting electrode E1. The lower end of the first interlayer connecting conductor V1a is in contact with the inner conductor layer 19a. Therefore, ultrasonic vibrations are transmitted to the first interlayer connecting conductor V1a and the inner conductor layer 19a via the mounting electrode E1. If the first interlayer connecting conductor V1a is too stiff, ultrasonic vibrations are more likely to be applied to the junction between the first interlayer connecting conductor V1a and the inner conductor layer 19a.

[0041] Therefore, the first interlayer connecting conductor V1a includes a first region A1 and a second region A2. The first region A1 and the second region A2 are arranged in this order downwards. The Young's modulus of the second region A2 is lower than that of the first region A1. As a result, the mounted electrode E1 is supported by the hard first region A1. Thus, the connecting member B1 is firmly bonded to the mounted electrode E1. On the other hand, a soft second region A2 exists between the mounted electrode E1 and the internal conductor layer 19a. Therefore, ultrasonic vibrations are less likely to be transmitted from the first interlayer connecting conductor V1a to the internal conductor layer 19a. Thus, the circuit module 10 can suppress damage to the connection between the first interlayer connecting conductor V1a and the internal conductor layer 19a. Furthermore, for the same reason, the circuit module 10 can suppress damage to the connection between the first interlayer connecting conductor V1b and the internal conductor layer 19b.

[0042] (b) In the circuit module 10, the volume of the first region A1 is 30% or more of the volume of the first interlayer connecting conductor V1a. As a result, the first interlayer connecting conductor V1a becomes rigid, and the mounted electrode E1 is supported by the rigid first interlayer connecting conductor V1a. Consequently, ultrasonic vibrations are efficiently transmitted to the connecting member B1 and the mounted electrode E1. Thus, the connecting member B1 is firmly bonded to the mounted electrode E1.

[0043] (c) In the circuit module 10, the transmission of ultrasonic vibrations into the laminate 12 is suppressed. More specifically, the second interlayer connecting conductors v2a to v2f are located below (in the negative direction of the Z axis) the first interlayer connecting conductors V1a and V1b. Furthermore, the Young's modulus of the second interlayer connecting conductors v2a to v2f is lower than that of the first region A1. As a result, ultrasonic vibrations are less likely to propagate through the laminate 12 via the second interlayer connecting conductors v2a to v2f. Consequently, the transmission of ultrasonic vibrations into the laminate 12 is suppressed in the circuit module 10. Therefore, the occurrence of disconnections within the laminate 12 of the circuit module 10 is suppressed.

[0044] (d) In the circuit module 10, warping of the circuit board 11 is suppressed. More specifically, the first interlayer connecting conductors V1a, V1b and interlayer connecting conductor v1 penetrate the resin layer 14a in the vertical direction. Interlayer connecting conductors v3a to v3c penetrate the resin layer 14d in the vertical direction. The first interlayer connecting conductors V1a, V1b and interlayer connecting conductors v1, v3a to v3c include the first region A1 and the second region A2. As a result, the circuit board 11 approaches a vertically symmetrical structure. Therefore, the coefficient of thermal expansion near the upper main surface of the circuit board 11 approaches the coefficient of thermal expansion near the lower main surface of the circuit board 11. Based on the above, warping of the circuit board 11 is suppressed in the circuit module 10.

[0045] (e) In the circuit module 10, the material of the resin layers 14a to 14d is a thermoplastic resin. Therefore, the laminate 12 can be formed by heat-pressing the resin layers 14a to 14d. Furthermore, during heat-pressing, the second region A2 of the first interlayer connecting conductors V1a and V1b, the second region A2 of the interlayer connecting conductors v1, v3a to v3c, and the second interlayer connecting conductors v2a to v2f can be cured.

[0046] (First variation) The structure of the circuit module 10a according to the first modified example will be described below with reference to the drawings. Figure 2 is a cross-sectional view of the circuit module 10a.

[0047] Circuit module 10a differs from circuit module 10 in the structure of the second interlayer connecting conductors v2a to v2f. More specifically, the second interlayer connecting conductors v2a to v2f include the first region A1 and the second region A2. In the second interlayer connecting conductors v2a to v2c, the first region A1 is , located above the second region A2. In the second interlayer connecting conductor v2d~v2f, the second region A2 is located above the first region A1. The other structures of circuit module 10a are the same as those of circuit module 10, so their description is omitted. Circuit module 10a can achieve the effects of (a), (b), (d), and (e).

[0048] (f) With the circuit module 10a, the second interlayer connecting conductors v2a to v2f become rigid, so the circuit board 11a becomes rigid. As a result, ultrasonic vibrations are more easily transmitted through the circuit board 11a, so that each of the connecting members B1 to B3 is firmly bonded to the mounted electrodes E1 to E3.

[0049] (g) According to the circuit module 10a, all first interlayer connecting conductors V1a, V1b, interlayer connecting conductors v1, v3a~v3c and second interlayer connecting conductors v2a~v2f include the first region A1 and the second region A2. Therefore, all first interlayer connecting conductors V1a, V1b, interlayer connecting conductors v1, v3a~v3c and second interlayer connecting conductors v2a~v2f can be formed by the same construction method.

[0050] (Second variation) The structure of the circuit module 10b according to the second modified example will be described below with reference to the drawings. Figure 3 is a cross-sectional view of the circuit module 10b.

[0051] Circuit module 10b differs from circuit module 10 in the structure of article 100. More specifically, connecting members B1 and B3 are gold wires. The other structural features of circuit module 10b are the same as those of circuit module 10, so their description is omitted. Circuit module 10b can achieve the effects (a) to (e). Furthermore, when connecting connecting members B1 and B3 to mounting electrodes E1 and E3, connecting member B1 is first connected to mounting electrode E1 using ultrasonic bonding technology, and then connecting member B3 is connected to mounting electrode E3 using ultrasonic bonding technology. In this way, connecting members B1 and B3 are connected to mounting electrodes E1 and E3 in multiple steps, ensuring that each of the connecting members B1 and B3 is reliably connected to the mounting electrodes E1 and E3.

[0052] (Third variation) The structure of the circuit module 10c according to the third modified example will be described below with reference to the drawings. Figure 4 is a cross-sectional view of the circuit module 10c.

[0053] Circuit module 10c differs from circuit module 10 in that it includes third interlayer connecting conductors v13a to v13c and a fourth interlayer connecting conductor V4. The third interlayer connecting conductors v13a to v13c penetrate the resin layer 14a in the vertical direction (Z-axis direction). The upper end (positive Z-axis end) of the third interlayer connecting conductor v13a is in contact with the mounted electrode E1. The lower end (negative Z-axis end) of the third interlayer connecting conductor v13a is in contact with the internal conductor layer 19a. The upper end (positive Z-axis end) of the third interlayer connecting conductor v13b is in contact with the mounted electrode E2. The lower end (negative Z-axis end) of the third interlayer connecting conductor v13b is in contact with the internal conductor layer 19b. The upper end (positive Z-axis end) of the third interlayer connecting conductor v13c is in contact with the conductor layer 18c. The lower end (the negative Z-axis end) of the third interlayer connecting conductor v13c is in contact with the inner conductor layer 19c.

[0054] The third interlayer connecting conductors v13a to v13c have a shape in which the area of ​​the cross-section perpendicular to the vertical direction decreases from top to bottom. Specifically, the third interlayer connecting conductors v13a to v13c have a frustoconical shape. Furthermore, the area of ​​the upper end of the third interlayer connecting conductors v13a to v13c is greater than the area of ​​the lower end of the third interlayer connecting conductors v13a to v13c. Large stomach.

[0055] The Young's modulus of the third interlayer connecting conductors v13a to v13c is higher than that of the fourth region A4, which will be described later. The Young's modulus of the third interlayer connecting conductors v13a to v13c is equal to that of the third region A3, which will be described later. The material of these third interlayer connecting conductors v13a to v13c is the same as the material of the mounting electrodes E1 to E3. Therefore, the material of the third interlayer connecting conductors v13a to v13c is, for example, copper, aluminum, or silver.

[0056] The fourth interlayer connecting conductor V4 penetrates the resin layer 14b in the vertical direction (Z-axis direction). When viewed in the vertical direction (Z-axis direction), the fourth interlayer connecting conductor V4 overlaps with the mounted electrode E2. The upper end (positive Z-axis end) of the fourth interlayer connecting conductor V4 is in contact with the internal conductor layer 19b.

[0057] The fourth interlayer connecting conductor V4 includes the third region A3 and the fourth region A4, which are aligned vertically (in the Z-axis direction). The fourth region A4 is located below the third region A3. The volume of the third region A3 is 30% or more of the volume of the fourth interlayer connecting conductor V4. The Young's modulus of the fourth region A4 is lower than that of the third region A3. The material of the third region A3 is the same as the material of the mounting electrodes E1 to E3. Therefore, the material of the third region A3 and the materials of the mounting electrodes E1 to E3 are, for example, copper, aluminum, or silver. The material of the fourth region A4 is an alloy mainly composed of tin. An alloy mainly composed of tin is, for example, a tin-copper alloy or a tin-silver alloy. The fourth region A4 is formed by sintering a conductive paste, which is a mixture of metal powder and resin. The other structures of the circuit module 10c are the same as those of the circuit module 10, so their description is omitted. The circuit module 10c can achieve the effect of (b).

[0058] According to circuit module 10c, the third interlayer connecting conductor v13 b and internal conductor layer 19 b This prevents damage from occurring at the connection point. More specifically, the surface material of the connecting member B2 is gold. The connecting member B2 is then joined to the mounted electrode E2 by ultrasonic bonding technology. For the connecting member B2 to be firmly joined to the mounted electrode E2, the mounted electrode E2 only needs to be supported by a rigid third interlayer connecting conductor v13b. For example, the material of the third interlayer connecting conductor v13b can be the same as the material of the mounted electrode E2. This allows ultrasonic vibrations to be efficiently transmitted to the connecting member B2 and the mounted electrode E2. As a result, the connecting member B2 is firmly joined to the mounted electrode E2.

[0059] However, if the third interlayer connecting conductor v13b is too rigid, damage may occur at the connection point between the third interlayer connecting conductor v13b and the inner conductor layer 19b. More specifically, the upper end of the third interlayer connecting conductor v13b is in contact with the mounting electrode E2. The lower end of the third interlayer connecting conductor v13b is in contact with the inner conductor layer 19b. Therefore, ultrasonic vibrations are transmitted to the third interlayer connecting conductor v13b and the inner conductor layer 19b via the mounting electrode E2. If the third interlayer connecting conductor v13b is too rigid, ultrasonic vibrations are more likely to be applied to the junction between the third interlayer connecting conductor v13b and the inner conductor layer 19b.

[0060] Therefore, the upper end of the fourth interlayer connecting conductor V4 is in contact with the inner conductor layer 19b. The fourth interlayer connecting conductor V4 includes the third region A3 and the fourth region A4, which are aligned in the vertical direction (Z-axis direction). The Young's modulus of the fourth region A4 is lower than that of the third region A3. As a result, the inner conductor layer 19b is supported by the fourth interlayer connecting conductor V4, which includes the soft fourth region A4. Therefore, when ultrasonic vibrations are applied to the third interlayer connecting conductor v13b and the inner conductor layer 19b, the fourth region A4 absorbs the ultrasonic vibrations. Force is less likely to be applied to the connection between the third interlayer connecting conductor v13b and the inner conductor layer 19b. Thus, according to the circuit module 10c, damage to the connection between the third interlayer connecting conductor v13b and the inner conductor layer 19b can be suppressed.

[0061] In the process of forming the fourth interlayer connecting conductor V4, through holes are formed that penetrate the resin layer 14b in the vertical direction (Z-axis direction). By plating the through holes, the third region A3 is formed. After forming the third region A3, conductive paste is filled into the through holes, and the conductive paste is solidified by heating to form the fourth region A4.

[0062] (Other embodiments) According to the present invention Circuit module This can be modified within the scope of its essence, not limited to circuit modules 10, 10a to 10c. Furthermore, the structures of circuit modules 10, 10a to 10c may be combined in any way.

[0063] Note that article 100 is not limited to electronic components. Article 100 may also be a circuit board. In this case, connecting members B1 to B3 are mounted electrodes on the circuit board. Gold is present on the surfaces of connecting members B1 to B3.

[0064] The surface material of connecting members B1 to B3 may be other than gold. For example, the surface material of connecting members B1 to B3 may be aluminum or silver.

[0065] Note that the material of the first region A1 may be different from the material of the mounting electrodes E1 to E3.

[0066] In addition, Circuit module The laminate 12 may further include a protective layer that covers the lower main surface.

[0067] Furthermore, the materials of the conductive layers 18a-18c and 20a-20c, the materials of the internal conductive layers 19a-19f, the materials of the first region A1, and the materials of the third region A3 may be aluminum or silver.

[0068] Furthermore, the fourth region A4 may be located above the third region A3.

[0069] Note that the arrangement of the first region A1 and the second region A2 in this order downwards includes not only the case where the first region A1 is located above the second region A2, but also the case where at least a portion of the second region A2 is located below the first region A1. In this case, the first region A1 and the second region A2 may be in contact with the conductor layers 18a and 18b. However, the area of ​​contact between the first region A1 and the conductor layers 18a and 18b is greater than or equal to the area of ​​contact between the second region A2 and the conductor layers 18a and 18b.

[0070] Furthermore, the lower main surface of the conductor layer 18a has a uniform structure. A uniform structure means a planar shape or a shape with periodic irregularities. The boundary between the first region A1 and the conductor layer 18a is the lower main surface of the conductor layer 18a where the state of the lower main surface is uniform. In other words, the protrusions that extend downward from the conductor layer 18a due to the presence of irregularities on the lower main surface of the conductor layer 18a are part of the conductor layer 18a and not part of the first region A1.

[0071] The present invention has the following structure.

[0072] (1) Circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive direction of the Z-axis among the plurality of resin layers, An internal conductor layer provided in the laminate and overlapping with the mounted electrode when viewed in the Z-axis direction, A first interlayer connecting conductor that penetrates the resin layer in the Z-axis direction, wherein the positive Z-axis end of the first interlayer connecting conductor is in contact with the mounted electrode, and the negative Z-axis end of the first interlayer connecting conductor is in contact with the internal conductor layer, It is equipped with, The aforementioned article is The connecting member that is solid-bonded to the aforementioned mounted electrode is They are equipped, The first interlayer connecting conductor includes a first region and a second region, The first region and the second region are arranged in this order in the negative direction of the Z-axis, The Young's modulus of the second region is lower than that of the first region. Circuit module.

[0073] (2) The volume of the first region is 30% or more of the volume of the first interlayer connecting conductor. (1) The circuit module described above.

[0074] (3) The material of the first region is the same as the material of the mounting electrode. The circuit module described in (1) or (2).

[0075] (4) The material of the first region and the material of the mounting electrode are copper, aluminum, or silver. (3) The circuit module described above.

[0076] (5) The material in the second region is an alloy mainly composed of tin. A circuit module as described in any of (1) through (4).

[0077] (6) The aforementioned circuit board is A second interlayer connecting conductor is located in the negative direction of the Z-axis from the first interlayer connecting conductor and penetrates the resin layer in the Z-axis direction. Furthermore, it is equipped with The Young's modulus of the second interlayer connecting conductor is lower than that of the first region. A circuit module as described in any of (1) through (5).

[0078] (7) The material of the second interlayer connecting conductor is an alloy mainly composed of tin. (6) The circuit module described above.

[0079] (8) The aforementioned circuit board is A protective layer covering the positive principal surface of the resin layer located most in the positive direction of the Z-axis among the plurality of resin layers, Furthermore, it is equipped with A circuit module as described in any of (1) through (7).

[0080] (9) The material of the aforementioned resin layer is a thermoplastic resin. A circuit module as described in any of (1) through (8).

[0081] (10) The material of the surface of the connecting member is gold. A circuit module as described in any of (1) through (9).

[0082] (11) The Young's modulus of the lower half of the first interlayer connecting conductor is different from the Young's modulus of the upper half of the first interlayer connecting conductor. A circuit module as described in any of (1) through (10).

[0083] (12) The first interlayer connecting conductor has a frustoconical shape. A circuit module as described in any of (1) through (11).

[0084] (13) A method for manufacturing a circuit module as described in any of (1) to (12), In the process of forming the first interlayer connecting conductor, a through-hole is formed in the resin layer in the Z-axis direction, and the first region is formed by plating the through-hole, and after the first region is formed, the second region is formed by filling the through-hole with conductive paste. The connecting member is joined to the mounted electrode using ultrasonic bonding technology. A method for manufacturing circuit modules.

[0085] (14) Circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive direction of the Z-axis among the plurality of resin layers, An internal conductor layer provided in the laminate and overlapping with the mounted electrode when viewed in the Z-axis direction, A third interlayer connecting conductor that penetrates the resin layer in the Z-axis direction, wherein the positive Z-axis end of the third interlayer connecting conductor is in contact with the mounted electrode, and the negative Z-axis end of the third interlayer connecting conductor is in contact with the internal conductor layer, A fourth interlayer connecting conductor that penetrates the resin layer in the Z-axis direction and overlaps with the mounted electrode when viewed in the Z-axis direction, wherein the positive Z-axis end of the fourth interlayer connecting conductor is in contact with the internal conductor layer, It is equipped with, The aforementioned article is The connecting member that is solid-bonded to the aforementioned mounted electrode is They are equipped, The fourth interlayer connecting conductor includes the third and fourth regions aligned in the Z-axis direction, The material of the third interlayer connecting conductor and the material of the third region are the same as the material of the mounting electrode. The Young's modulus of the fourth region is lower than that of the third region. Circuit module.

[0086] (15) A method for manufacturing a circuit module as described in (14), In the process of forming the fourth interlayer connecting conductor, a through hole is formed in the resin layer in the Z-axis direction, and the third region is formed by plating the through hole, and after the third region is formed, the fourth region is formed by filling the through hole with conductive paste. In the step of joining the connecting member to the mounted electrode, the connecting member is joined to the mounted electrode by ultrasonic bonding technology. A method for manufacturing circuit modules. [Explanation of symbols]

[0087] 10, 10a~10c: Circuit module 11,11a: Circuit board 12: Laminate 14a~14d: Resin layer 16:Protective layer 18a~18c, 20a~20c: Conductor layer 19a~19f: Inner conductor layer 100: Goods 102: Item body A1:First area A2:Second area A3: Third area A4: 4th area B1~B3: Connecting members E1~E3: Mounted electrodes V1a, V1b: First interlayer connecting conductors V4: Fourth interlayer connecting conductor v1, v3a~v3c: Interlayer connecting conductors v13a~v13c: Third layer interconnecting conductor v2a~v2f: Interlayer connecting conductors for the second layer

Claims

1. Circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive Z-axis direction among the plurality of resin layers, An internal conductor layer provided in the laminate and overlapping with the mounted electrode when viewed in the Z-axis direction, A first interlayer connecting conductor that penetrates the resin layer in the Z-axis direction, wherein the positive Z-axis end of the first interlayer connecting conductor is in contact with the mounted electrode, and the negative Z-axis end of the first interlayer connecting conductor is in contact with the internal conductor layer, A second interlayer connecting conductor is located in the negative direction of the Z-axis from the first interlayer connecting conductor and penetrates the resin layer in the Z-axis direction, It is equipped with, The aforementioned article is The connecting member that is solid-bonded to the aforementioned mounted electrode is They are equipped, The first interlayer connecting conductor includes a first region and a second region, The first region and the second region are arranged in this order in the negative direction of the Z-axis, The first region is in contact with the mounted electrode, The Young's modulus of the second region is lower than that of the first region. The Young's modulus of the second interlayer connecting conductor is equal to the Young's modulus of the second region. Circuit module.

2. The volume of the first region is 30% or more of the volume of the first interlayer connecting conductor. The circuit module according to claim 1.

3. The material of the first region is the same as the material of the mounting electrode. The circuit module according to claim 1 or claim 2.

4. The material of the first region and the material of the mounting electrode are copper, aluminum, or silver. The circuit module according to claim 3.

5. The material in the second region is an alloy mainly composed of tin. The circuit module according to claim 1 or claim 2.

6. The material of the second interlayer connecting conductor is an alloy mainly composed of tin. The circuit module according to claim 1 or claim 2.

7. The aforementioned circuit board is A protective layer covering the positive principal surface of the resin layer located most in the positive direction of the Z-axis among the plurality of resin layers, Furthermore, it is equipped with The circuit module according to claim 1 or claim 2.

8. The material of the aforementioned resin layer is a thermoplastic resin. The circuit module according to claim 1 or claim 2.

9. The material of the surface of the connecting member is gold. The circuit module according to claim 1 or claim 2.

10. The Young's modulus of the lower half of the first interlayer connecting conductor is different from the Young's modulus of the upper half of the first interlayer connecting conductor. The circuit module according to claim 1 or claim 2.

11. The first interlayer connecting conductor has a frustoconical shape. The circuit module according to claim 1 or claim 2.

12. A circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive Z-axis direction among the plurality of resin layers, An internal conductor layer provided in the laminate and overlapping with the mounted electrode when viewed in the Z-axis direction, A first interlayer connecting conductor that penetrates the resin layer in the Z-axis direction, wherein the positive Z-axis end of the first interlayer connecting conductor is in contact with the mounted electrode, and the negative Z-axis end of the first interlayer connecting conductor is in contact with the internal conductor layer, It is equipped with, The aforementioned article is The connecting member that is solid-bonded to the aforementioned mounted electrode is They are equipped, The first interlayer connecting conductor includes a first region and a second region, The first region and the second region are arranged in this order in the negative direction of the Z-axis, The first region is in contact with the mounted electrode, A method for manufacturing a circuit module, wherein the Young's modulus of the second region is lower than the Young's modulus of the first region. In the process of forming the first interlayer connecting conductor, a through hole is formed in the resin layer in the Z-axis direction, and the first region is formed by plating the through hole, and after the first region is formed, the second region is formed by filling the through hole with conductive paste. The connecting member is joined to the mounted electrode using ultrasonic bonding technology. A method for manufacturing circuit modules.

13. A circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive Z-axis direction among the plurality of resin layers, An internal conductor layer provided in the laminate and overlapping with the mounted electrode when viewed in the Z-axis direction, A first interlayer connecting conductor that penetrates the resin layer in the Z-axis direction, wherein the positive Z-axis end of the first interlayer connecting conductor is in contact with the mounted electrode, and the negative Z-axis end of the first interlayer connecting conductor is in contact with the internal conductor layer, It is equipped with, The aforementioned article is The connecting member that is solid-bonded to the aforementioned mounted electrode is They are equipped, The first interlayer connecting conductor includes a first region and a second region, The first region and the second region are arranged in this order in the negative direction of the Z-axis, The first region is in contact with the mounted electrode, The Young's modulus of the second region is lower than that of the first region. A method for manufacturing a circuit module, wherein the volume of the first region is 30% or more of the volume of the first interlayer connecting conductor, In the process of forming the first interlayer connecting conductor, a through hole is formed in the resin layer in the Z-axis direction, and the first region is formed by plating the through hole, and after the first region is formed, the second region is formed by filling the through hole with conductive paste. The connecting member is joined to the mounted electrode using ultrasonic bonding technology. A method for manufacturing circuit modules.

14. A circuit board and Goods and, It is equipped with, The aforementioned circuit board is A laminate having a structure in which multiple resin layers having a positive principal surface located in the positive direction of the Z axis are stacked in the Z-axis direction, A mounting electrode located on the positive principal surface of the resin layer that is located furthest in the positive Z-axis direction among the plurality of resin layers, An internal conductor layer provided in the laminate and overlapping with the mounted electrode when viewed in the Z-axis direction, A third interlayer connecting conductor that penetrates the resin layer in the Z-axis direction, wherein the positive Z-axis end of the third interlayer connecting conductor is in contact with the mounted electrode, and the negative Z-axis end of the third interlayer connecting conductor is in contact with the internal conductor layer, A fourth interlayer connecting conductor that penetrates the resin layer in the Z-axis direction and overlaps with the mounted electrode when viewed in the Z-axis direction, wherein the positive Z-axis end of the fourth interlayer connecting conductor is in contact with the inner conductor layer, It is equipped with, The aforementioned article is The connecting member that is solid-bonded to the aforementioned mounted electrode is They are equipped, The fourth interlayer connecting conductor includes the third and fourth regions aligned in the Z-axis direction, The third region is in contact with the internal conductor layer, The material of the third interlayer connecting conductor and the material of the third region are the same as the material of the mounting electrode. A method for manufacturing a circuit module, wherein the Young's modulus of the fourth region is lower than the Young's modulus of the third region. In the process of forming the fourth interlayer connecting conductor, a through hole is formed in the resin layer in the Z-axis direction, and the third region is formed by plating the through hole, and after the third region is formed, the fourth region is formed by filling the through hole with conductive paste. In the step of joining the connecting member to the mounted electrode, the connecting member is joined to the mounted electrode by ultrasonic bonding technology. A method for manufacturing circuit modules.

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