Double-sided chip embedded circuit board and method of manufacturing the same

CN122179980APending Publication Date: 2026-06-09CHAFA FRIEDRICH SCHAFFEN CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHAFA FRIEDRICH SCHAFFEN CO LTD
Filing Date
2024-12-05
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Traditional chip embedding circuit board designs only utilize the front side of the circuit board for wiring, resulting in a crowded front layout and poor stability.

Method used

After the chip packaging unit is embedded into the prefabricated circuit board, conductive film layers are applied to the upper and lower surfaces of the circuit board respectively. The upper conductive film layer is used for the electrode lead-out of the chip packaging unit, and the lower conductive film layer is used to lay out other functional modules. Heat dissipation fins are set on the back of the chip packaging unit.

Benefits of technology

This design achieves a reasonable layout of electrical performance, improves the stability and heat dissipation of the circuit board, and avoids increasing costs by adding conductive layers, thus achieving a balance between cost and performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122179980A_ABST
    Figure CN122179980A_ABST
Patent Text Reader

Abstract

The application relates to the technical field of automobile parts, and provides a double-sided chip-embedded circuit board and a manufacturing method thereof. The double-sided chip-embedded circuit board comprises a prefabricated circuit board, the upper and lower surfaces of which are conductive layers; a chip packaging unit embedded in the prefabricated circuit board; an upper conductive film layer attached to the upper surface of the prefabricated circuit board through an upper dielectric layer and covering the chip packaging unit, and the electrodes of the chip packaging unit are led out to the surface of the upper conductive film layer; and a lower conductive film layer attached to the lower surface of the prefabricated circuit board through a lower dielectric layer and exposing the back surface of the chip packaging unit, and the back surface of the chip packaging unit is provided with heat dissipation fins. In the application, the upper and lower surfaces of the prefabricated circuit board are respectively attached with conductive film layers, the upper conductive film layer is used for leading out the electrodes of the chip packaging unit, and the lower conductive film layer can be used for arranging other functional modules of the circuit board, so that the double-sided chip-embedded circuit board has reasonable electrical performance layout and better stability.
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