Crimping device and crimping method

Abstract

To provide a crimping device and the like, capable of suppressing decrease in mounting accuracy.SOLUTION: A crimping device 100 includes: a heating part 140 heating a backup part 130; a crimping head 160 crimping a component to a substrate supported by the backup part 130; a stage movement part 120 moving the stage 110 by a first movement amount so that a support surface 131 supports an end of the substrate placed on the stage 110; and a head movement part 170 moving the crimping head 160 by a second movement amount so that the crimping head crimps a component to the substrate supported by the backup part 130; and a control part 181. The control part 181 determines at least one of the first movement amount and the second movement amount on the basis of a temperature of the backup part 130, and allows the crimping head 160 to perform crimping by controlling the stage movement part 120 and the head movement part 170 with the use of at least one of the first movement amount and the second movement amount having been determined.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a crimping device and a crimping method for crimping components onto a substrate.

Background Art

[0002] Conventionally, there has been a crimping device for crimping components such as a drive circuit onto a substrate (see, for example, Patent Document 1). Patent Document 1 discloses a crimping device having a plurality of crimping heads.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When crimping a component onto a substrate, the backup part that supports the substrate may be heated. In such a case, due to the change in the height of the upper surface of the backup part accompanying the temperature change, the positional relationship between the stage on which the substrate is placed and the backup part, and / or the positional relationship between the crimping head and the backup part may change. When crimping a component onto the substrate in such a state, there is a risk that the mounting accuracy may decrease, such as the component not being properly crimped onto the substrate.

[0005] The present invention provides a crimping device and the like that can suppress a decrease in mounting accuracy.

Means for Solving the Problems

[0006] A crimping apparatus according to one aspect of the present invention comprises: a stage on which a substrate is placed; a backup unit having a support surface that supports the end of the substrate placed on the stage from below the substrate; a heating unit that heats the backup unit; a crimping head provided above the backup unit so as to be movable up and down and for crimping a component onto the substrate whose end is supported by the support surface; a stage moving unit that moves the stage by a first amount of movement so as to support the end of the substrate placed on the stage with the support surface; a head moving unit that moves the crimping head by a second amount of movement so as to perform the crimping of the component onto the substrate whose end is supported by the support surface; and a control unit, wherein the control unit determines at least one of the first and second amounts of movement based on the temperature of the backup unit, and controls the stage moving unit and the head moving unit using at least one of the determined first and second amounts of movement to move the stage and cause the crimping head to perform the crimping.

[0007] Furthermore, a crimping method according to one aspect of the present invention is a crimping method performed by a crimping apparatus comprising: a stage on which a substrate is placed; a backup unit having a support surface that supports the end of the substrate placed on the stage from below the substrate; a heating unit for heating the backup unit; a crimping head provided above the backup unit so as to be vertically movable and for crimping a component onto the substrate whose end is supported by the support surface; a stage moving unit that moves the stage by a first amount of movement so as to support the end of the substrate placed on the stage with the support surface; and a head moving unit that moves the crimping head by a second amount of movement so as to perform the crimping of the component onto the substrate whose end is supported by the support surface, wherein at least one of the first and second amounts of movement is determined based on the temperature of the backup unit, and the stage moving unit and the head moving unit are controlled using at least one of the determined first and second amounts of movement to move the stage and cause the crimping head to perform the crimping.

[0008] These comprehensive or specific embodiments may be implemented as a system, method, integrated circuit, computer program, or non-temporary recording medium such as a computer-readable CD-ROM, or as any combination of a system, method, integrated circuit, computer program, and recording medium. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a crimping device and the like that can suppress a decrease in mounting accuracy. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a side view showing a crimping device according to an embodiment. [Figure 2] Figure 2 is a block diagram showing the configuration of a crimping device according to an embodiment. [Figure 3] Figure 3 is a diagram illustrating the height distribution of the support surface of the backup unit according to the embodiment. [Figure 4] Figure 4 is a diagram illustrating the height measuring unit according to the embodiment. [Figure 5] Figure 5 is a flowchart illustrating the processing procedure for creating temperature-dependent data performed by the crimping device according to the embodiment. [Figure 6] Figure 6 is a flowchart showing the crimping process performed by the crimping device according to the embodiment. [Figure 7] Figure 7 is a side view illustrating the crimping process performed by the crimping device according to the embodiment. [Figure 8] Figure 8 is a side view illustrating the crimping process performed by the crimping device according to the embodiment. [Figure 9] Figure 9 is a side view illustrating the crimping process performed by the crimping device according to the embodiment. [Figure 10] Figure 10 is a side view illustrating a crimping device according to a modified embodiment.

Best Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that all of the embodiments described below are specific examples of the present invention. Therefore, numerical values, shapes, materials, components, arrangements and connection forms of components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components not described in the independent claims of the present invention are described as optional components.

[0012] Also, each drawing is a schematic diagram and is not necessarily drawn precisely. Therefore, for example, scales etc. in each drawing do not necessarily match. Also, in each drawing, substantially the same configurations are denoted by the same reference numerals, and overlapping descriptions are omitted or simplified.

[0013] Also, in this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The X-axis and Y-axis are perpendicular to each other and both are perpendicular to the Z-axis. Also, in the following embodiments, there are cases where the positive direction of the Z-axis is described as upward and the negative direction of the Z-axis is described as downward.

[0014] (Embodiment) [Configuration] First, the configuration of the crimping device according to the embodiment will be described.

[0015] FIG. 1 is a side view showing a crimping device 100 according to the embodiment. FIG. 2 is a block diagram showing the functional configuration of the crimping device 100 according to the embodiment. In FIG. 1, illustration of some components such as a computer 180 included in the crimping device 100 is omitted.

[0016] The crimping device 100 is a device that crimps (more specifically, thermally crimps) the component 200 to the substrate 300. The crimping device 100 is, for example, a part of a component mounting system for producing a display panel or the like. In the component mounting system, for example, an anisotropic conductive member such as an ACF (Anisotropic Conductive Film) is adhered to an electrode portion provided on the substrate 300, and the substrate 300 and the component 200 are thermally crimped via the anisotropic conductive member. The mounting system includes, for example, an adhering device that adheres the ACF to the substrate 300, a temporary crimping device that places (temporarily crimps) the component 200 on the substrate 300 via the ACF, and a main crimping device that thermally crimps (main crimps) the component 200 to the substrate 300. For example, the crimping device 100 is the main crimping device included in the mounting system.

[0017] The crimping device 100 mainly crimps the substrate 300 and the component 200 that have been carried out from an upstream device (for example, an adhering device) to the stage 110 by a substrate transfer device (not shown). The substrate 300 to which the component 200 has been mainly crimped is, for example, transferred to a downstream device (for example, a main crimping device) by the substrate transfer device.

[0018] Examples of the substrate 300 include a flexible substrate made of resin or the like. Note that the substrate 300 may also be a display panel using a glass substrate or the like.

[0019] Examples of the component 200 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits), or IC (Integrated Circuit) chips.

[0020] The crimping device 100 includes a stage 110, a stage moving unit 120, a backup unit 130, a heating unit 140, a temperature measuring unit 150, a crimping head 160, a head moving unit 170, and a computer 180.

[0021] The crimping device 100 includes various components such as a stage moving unit 120, a backup unit 130 (more specifically, a suction mechanism provided in the backup unit 130), a heating unit 140, a temperature measuring unit 150, a crimping head 160, and a head moving unit 170, all of which are connected to a computer 180 via control lines (not shown) or wirelessly. Each of these components is controlled by the computer 180 to perform predetermined processing.

[0022] Stage 110 is a movable stage on which the substrate 300 is placed. Specifically, the substrate 300, with components 200 placed on its end 310, is placed on Stage 110. For example, the substrate 300 transported by the substrate transport device described above is placed on Stage 110. More specifically, Stage 110 has a holding surface 111 that holds the substrate 300 with the end 310 on which the components 200 are placed overhanging. In other words, the substrate 300 is placed on Stage 110 with the end 310, which is the outer edge of the substrate 300, overhanging from Stage 110 (more specifically, with the end 310 not overlapping with Stage 110 in a top view). The end 310 is supported by the backup section 130 when the components 200 are pressed onto the substrate 300.

[0023] The stage 110 may also be provided with a suction mechanism for adsorbing the substrate 300 on the holding surface 111. For example, an opening (e.g., a through hole) is formed in the holding surface 111, and the stage 110 adsorbs and holds the substrate 300 on the holding surface 111. For example, a suction device is connected to the opening, which sucks air through the opening to cause the substrate 300 to be attracted to the holding surface 111, and the substrate 300 is attracted and held on the holding surface 111 by the suction device sucking air. The suction mechanism may include, for example, a vacuum pump for sucking air, vacuum piping connecting the vacuum pump and the opening, and a valve for controlling the suction.

[0024] The control unit 181 controls the valve to switch whether or not to generate an adhesive force on the holding surface 111 by the suction mechanism, that is, whether or not to allow the end portion 310 of the substrate 300 to be adsorbed by the suction mechanism.

[0025] The valves in the adsorption mechanism may be, for example, solenoid valves for switching air intake on and off, or pressure regulating valves (so-called pressure regulators) for switching the suction force (adsorption force).

[0026] Alternatively, the stage 110 may not have the aforementioned openings on the holding surface 111, and the substrate 300 may be held by the holding surface 111 simply by being placed on the holding surface 111.

[0027] The stage 110 is, for example, a three-axis stage that can move in the X, Y, and Z axes, and is provided to be movable by a stage moving unit 120.

[0028] The stage moving unit 120 is a mechanism for moving the stage 110. The stage moving unit 120 is implemented, for example, by a conveyor configured to move the stage 110 arbitrarily in the XY plane and to move up and down in the Z axis direction.

[0029] The stage moving unit 120 moves the stage 110 by a first amount of movement, thereby supporting the end 310 of the substrate 300 placed on the stage 110 with the support surface 131. Specifically, the stage moving unit 120 moves the stage 110 downward by a distance Z1 from a state where the holding surface 111 and the support surface 131 are flush, thereby supporting the end 310 of the substrate 300 placed on the stage 110 with the support surface 131. In other words, the stage moving unit 120 moves the stage 110 so that the height of the holding surface 111 is lower than the height of the support surface 131 by a distance Z1, and then supports the end 310 of the substrate 300 placed on the stage 110 with the support surface 131. Distance Z1 is the difference between the height of the holding surface 111 and the height of the support surface 131 when the crimping head 160 crimps the component 200 to the substrate 300, and is an example of the first amount of movement.

[0030] The stage moving unit 120 moves the stage 110 on which the substrate 300 is placed, thereby moving the end portion 310 above (more specifically, directly above) the backup unit 130.

[0031] The backup unit 130 is a so-called backup stage having a support surface 131 that supports the end portion 310 of the substrate 300 placed on the stage 110 from below the substrate 300. Specifically, when the crimping head 160 crimps the component 200 to the substrate 300, the backup unit 130 supports the portion of the substrate 300 to which the component 200 is crimped, that is, the end portion 310 of the substrate 300 that extends beyond the stage 110, from the back (bottom) side of the substrate 300.

[0032] The backup section 130 includes a support surface 131.

[0033] The support surface 131 is provided on the backup section 130 and is a support surface that supports the end portion 310 from below the substrate 300.

[0034] The backup unit 130 may also be provided with a suction mechanism for adsorbing the substrate 300 on the support surface 131. For example, an opening (e.g., a through hole) is formed in the support surface 131, and the backup unit 130 adsorbs and holds the substrate 300 on the support surface 131. For example, a suction device is connected to the opening to adsorb the substrate 300 on the support surface 131 by sucking air through the opening, and the substrate 300 is adsorbed and held on the support surface 131 by the suction device sucking air. The suction mechanism may include, for example, a vacuum pump for sucking air, vacuum piping connecting the vacuum pump and the opening, and a valve for controlling the suction.

[0035] The control unit 181 controls the valve to switch whether or not to generate an adhesive force on the support surface 131 by the suction mechanism, that is, whether or not to allow the end portion 310 of the substrate 300 to be adsorbed by the suction mechanism.

[0036] The valves in the adsorption mechanism may be, for example, solenoid valves for switching air intake on and off, or pressure regulating valves (so-called pressure regulators) for switching the suction force (adsorption force).

[0037] The support surface 131 is a support surface provided on the backup unit 130 that supports the substrate 300, and for example, it supports the end portion 310 of the substrate 300 from below while adsorbing it.

[0038] Furthermore, the support surface 131 may be provided with a notch.

[0039] The notch is a cutout that overlaps with a portion of the end 310 of the substrate 300 when the end 310 is supported by the support surface 131, in a top view. The notch is provided so that a camera positioned below the notch can recognize the component 200 held by the crimping head 160.

[0040] The notch does not necessarily have to be provided on the support surface 131. In this case, the camera may be positioned at any location.

[0041] The heating unit 140 is a heater that heats the backup unit 130. Specifically, the heating unit 140 heats the support surface 131 of the backup unit 130, thereby heating the component 200, the substrate 300, and the ACF for attaching the component 200 to the substrate, which are supported on the support surface 131. In this embodiment, the heating unit 140 is located inside the backup unit 130. The heating unit 140 only needs to be able to heat the backup unit 130 (more specifically, the support surface 131), and may be located in any location, such as outside the backup unit 130. Furthermore, the heating unit 140 only needs to be able to heat the backup unit 130 (more specifically, the support surface 131), and may be implemented by any heater such as an electric heating wire or a Peltier element.

[0042] The temperature measuring unit 150 is a measuring instrument that measures the temperature of the backup unit 130. The temperature measuring unit 150 is implemented, for example, by a thermocouple. In this embodiment, the temperature measuring unit 150 is located inside the backup unit 130. The temperature measuring unit 150 only needs to be able to measure the temperature of the backup unit 130 and may be located in any location, such as outside the backup unit 130. Alternatively, the temperature measuring unit 150 may be implemented by a device capable of measuring temperature, such as a thermal camera, instead of a thermocouple.

[0043] The crimping head 160 is a head for crimping (main crimping) the component 200 onto the substrate 300 supported by the backup unit 130. The crimping head 160 is mounted above the backup unit 130 so as to be able to move up and down, and performs crimping of the component 200 onto the substrate 300 supported by the support surface 131.

[0044] The crimping head 160 may also be equipped with a heater, such as a heating element or a Peltier element, for heating the crimping head 160.

[0045] The head movement unit 170 is a mechanism that moves the crimping head 160 up and down (in this embodiment, reciprocating in the H-axis direction parallel to the Z-axis direction). Specifically, the head movement unit 170 moves the crimping head 160 by a second movement amount to crimp the component 200 onto the substrate 300, whose end portion 310 is supported by the backup unit 130. For example, the head movement unit 170 crimps the component 200 onto the substrate 300 by lowering the crimping head 160 by a distance H1 from a predetermined initial position of the crimping head 160. Distance H1 is an example of the second movement amount.

[0046] The head movement unit 170 is implemented by a linear guide and a linear motor for moving the crimping head 160. The control unit 181 controls, for example, a heater provided on the crimping head 160 and the head movement unit 170 to heat the crimping head 160 and then press the component 200 to the substrate 300 using the crimping head 160.

[0047] Computer 180 is a control device that controls each of the devices of the crimping device 100. Computer 180 is, for example, a personal computer and is implemented with a communication interface for communicating with each of the devices of the crimping device 100, non-volatile memory where programs are stored, volatile memory which is a temporary storage area for executing programs, input / output ports for sending and receiving signals, and a processor for executing programs.

[0048] The computer 180 comprises a control unit 181 and a storage unit 182.

[0049] The control unit 181 is a processing unit that controls the operation of each component of the crimping device 100, such as the stage moving unit 120, the heating unit 140, the temperature measuring unit 150, and the head moving unit 170, as well as the timing of said operation.

[0050] For example, the control unit 181 determines at least one of a first movement amount and a second movement amount based on the temperature of the backup unit 130, and controls the stage movement unit 120 and the head movement unit 170 using at least one of the determined first and second movement amounts to move the stage 110 and perform crimping on the crimping head 160. Specifically, the control unit 181 determines at least one of the first movement amount and a second movement amount based on the temperature of the backup unit 130 measured by the temperature measuring unit 150. More specifically, the control unit 181 derives the height of the support surface 131 corresponding to the temperature of the backup unit 130 measured by the temperature measuring unit 150 based on temperature-dependent data, and determines at least one of the first and second movement amounts based on the derived height.

[0051] Figure 3 is a diagram illustrating the height distribution of the support surface of the backup unit 130 according to the embodiment. Specifically, Figure 3(a) shows an example of temperature-dependent data, and Figure 3(b) shows the positional relationship between the horizontal axis of the temperature-dependent data shown in Figure 3(a) and the backup unit 130 (more specifically, the support surface 131). The horizontal axis of the temperature-dependent data shown in Figure 3(a) indicates the position of the backup unit 130 (in this embodiment, the position in the X-axis direction), and the vertical axis indicates the height of the support surface 131. The graph shown by ○ in Figure 3(a) shows the distribution of the height of the support surface 131 in the X-axis direction when the temperature of the backup unit 130 is 30°C. The graph shown by △ in Figure 3(a) shows the distribution of the height of the support surface 131 in the X-axis direction when the temperature of the backup unit 130 is 50°C. The graph shown by □ in Figure 3(a) shows the distribution of the height of the support surface 131 in the X-axis direction when the temperature of the backup unit 130 is 80°C.

[0052] As shown in Figure 3, for example, the temperature-dependent data includes height distribution data showing the relationship between the height distribution of the support surface 131 (i.e., the height of the support surface 131 at each location) and the temperature of the backup section 130.

[0053] The control unit 181 derives the height of the support surface 131 from, for example, the temperature of the backup unit 130 measured by the temperature measuring unit 150 and temperature-dependent data.

[0054] The control unit 181 may, for example, derive the height of the support surface 131 from the set temperature of the heating unit 140 and temperature-dependent data, rather than from the temperature measured by the temperature measuring unit 150. In this case, for example, the crimping device 100 does not need to be equipped with the temperature measuring unit 150.

[0055] Furthermore, information such as a formula or table used to calculate the amount of movement from the height of the support surface 131 may be pre-stored in the storage unit 182.

[0056] The crimping device 100 may also be equipped with a height measuring unit 190 for measuring the height of the support surface 131.

[0057] Figure 4 is a diagram illustrating the height measuring unit 190 according to the embodiment.

[0058] The control unit 181 receives instructions from the user to create temperature-dependent data, for example, via a user interface (not shown) such as a mouse and keyboard. When the control unit 181 receives such instructions, it controls the heating unit 140 to a predetermined temperature and obtains the height distribution of the support surface 131 at that time from the height measuring unit 190. The control unit 181 repeatedly obtains the height distribution of the support surface 131 from the height measuring unit 190 while changing the temperature of the heating unit 140. As a result, the control unit 181 creates temperature-dependent data as shown in Figure 3(a).

[0059] The temperature of the heating unit 140 when creating temperature-dependent data can be set arbitrarily and is not particularly limited.

[0060] Furthermore, the height measurement position on the support surface 131 can be set arbitrarily and is not particularly limited.

[0061] Furthermore, the height measuring unit 190 may be attached to a movable part that moves in the X-axis direction, such as an X-axis stage. The control unit 181 may control the position of the support surface 131 measured by the height measuring unit 190 by controlling the X-axis stage.

[0062] The height measuring unit 190 may be implemented by any device, such as a laser rangefinder or a camera. In this case, the height measuring unit 190 may be attached to the crimping head 160. In this case, the control unit 181 may determine the position measured by the height measuring unit 190 by controlling the head moving unit 170. The head moving unit 170 may also be configured to be movable in the X-axis direction and / or the Y-axis direction.

[0063] Furthermore, the height measuring unit 190 may be, for example, a pressure gauge mounted on the crimping head 160. For example, the control unit 181 may calculate the distance between the crimping head 160 and the support surface 131 from the difference between the set load and the measured value, based on the measured value measured by the pressure gauge mounted on the crimping head 160. Data showing the relationship between the set load and height is stored in advance in, for example, the storage unit 182.

[0064] The control unit 181 is implemented, for example, by a communication interface for communicating with each device of the crimping device 100, a processor, and a memory in which a control program executed by the processor is stored.

[0065] The control unit 181 determines, for example, a first movement amount and a second movement amount for each position of the component 200 located on the edge 310 of the substrate 300 based on temperature-dependent data, and controls the stage movement unit 120 and the head movement unit 170 to move by the determined movement amounts, thereby pressing the component 200 onto the substrate 300.

[0066] Information indicating the position of the part 200 may be stored in advance in the storage unit 182. Also, for example, the crimping device 100 may be equipped with a detection unit such as a camera for detecting the position of the part 200. For example, the control unit 181 determines the position of the part 200 based on the detection result of the detection unit, determines the height of the support surface 131 according to the position of the part 200 based on the determined position, temperature-dependent data and the temperature of the support surface 131 obtained from the temperature measurement unit 150, and determines the first and second movement amounts based on the determined height.

[0067] Furthermore, the crimping head 160 may be movable in the X-axis direction.

[0068] The memory unit 182 is a storage device that stores various data necessary for component crimping, such as the size of the substrate 300, the types of components 200 to be mounted (crimped) onto the substrate 300, mounting positions, mounting directions, the operation of each device, and the timing of said operation. In this embodiment, the memory unit 182 stores temperature-dependent data showing the relationship between the height of the support surface 131 and the temperature of the backup unit 130. This can be implemented, for example, by an HDD (Hard Disk Drive) or flash memory.

[0069] [Processing Procedure] Next, the processing procedure of the crimping device 100 according to the embodiment will be described.

[0070] Figure 5 is a flowchart illustrating the processing procedure for creating temperature-dependent data performed by the crimping device 100 according to the embodiment.

[0071] First, the control unit 181 repeats steps S110 and S120 N times from 1 to n.

[0072] Note that N and n are any natural numbers.

[0073] For example, the control unit 181 controls the heating unit 140 to control the temperature of the backup unit 130 to a first temperature (S110). Next, the control unit 181 controls the height measuring unit 190 to measure the height of the support surface 131 (S120). Next, the control unit 181 controls the heating unit 140 to control the temperature of the backup unit 130 to a second temperature (S110). Next, the control unit 181 controls the height measuring unit 190 to measure the height of the support surface 131 (S120). The control unit 181 repeatedly performs this process from the first temperature to the Nth temperature.

[0074] Note that N can be arbitrarily determined in advance and is not particularly limited. Also, the first temperature, second temperature, ..., and Nth temperature can each be arbitrarily determined in advance and are not particularly limited. 30°C, 50°C, and 80°C shown in Figure 3(a) are examples of the Nth temperature (for example, N=3, which corresponds to the first, second, and third temperatures).

[0075] Next, the control unit 181 associates the height of the support surface 131 with the temperature of the backup unit 130 (in this example, the set temperature) and stores (stores) this information in the storage unit 182 (S130).

[0076] Steps S110, S120, and S130 may be executed repeatedly.

[0077] Furthermore, the temperature of the backup unit 130 may be measured by the temperature measuring unit 150 before, during, or simultaneously with step S120. In step S130, the height of the support surface 131 and the temperature of the backup unit 130 measured by the temperature measuring unit 150 may be linked and stored in the storage unit 182.

[0078] Figure 6 is a flowchart illustrating the crimping process of the crimping device 100 according to the embodiment. Figures 7 to 9 are schematic side views illustrating the crimping process performed by the crimping device 100 according to the embodiment.

[0079] Note that in Figures 7 to 9, some of the components of the crimping device 100, such as the computer 180, are not shown.

[0080] First, the control unit 181 places the substrate 300 on the stage 110 (S210). For example, the control unit 181 controls a substrate transport device (not shown) to transport the substrate 300, which is located in a device upstream of the crimping device 100, to the stage 110, thereby causing the stage 110 to hold the substrate 300.

[0081] Next, the control unit 181 controls the heating unit 140 to heat the backup unit 130 to a predetermined temperature (S220). The predetermined temperature can be arbitrarily set in advance and is not particularly limited.

[0082] Next, the control unit 181 controls the temperature measuring unit 150 to measure the temperature of the backup unit 130 (S230).

[0083] Next, the control unit 181 obtains height information of the support surface 131 from the storage unit 182 (S240). Specifically, the control unit 181 obtains the height of the support surface 131 at the measured temperature of the backup unit 130 based on the temperature of the backup unit 130 measured in step S230 and the temperature-dependent data stored in the storage unit 182.

[0084] Next, the control unit 181 determines at least one of the first and second movement amounts based on the height information acquired in step S240 (S250). In this embodiment, the control unit 181 determines both the first and second movement amounts.

[0085] When the control unit 181 determines either the first or second movement amount, the other may be a fixed value. In this case, for example, information indicating the fixed value may be stored in advance in the storage unit 182.

[0086] Next, the control unit 181 controls the stage movement unit 120 based on the determined first movement amount, moving the substrate 300 from the state shown in Figure 7 to the state shown in Figure 8, thereby supporting the end 310 of the substrate 300 on the support surface 131 of the backup unit 130 (S260).

[0087] Next, the control unit 181 controls the head movement unit 170 based on the determined second movement amount, thereby pressing the component 200 onto the substrate 300 as shown in Figure 9 (S270).

[0088] Step 210 does not need to be performed before step S260, and may be performed at any time.

[0089] Furthermore, for example, in step S250, the amount of movement of the stage 110 and the crimping head 160 (i.e., the first amount of movement and the second amount of movement) may be determined by the amount of change from a predetermined reference value, if such reference value is set in advance. In other words, the control unit 181 may correct the amount of movement of the stage 110 and the crimping head 160 based on the height information acquired in step S240.

[0090] For example, suppose the support surface 131 increases by Δh from a predetermined reference height. In this case, for example, if the reference value of the first movement is Z1, the control unit 181 corrects the first movement to Z1-Δh. Also, in this case, for example, if the reference value of the second movement is H1, the control unit 181 corrects the second movement to H1-Δh. Furthermore, for example, if Δh changes in the longitudinal direction of the support surface 131 (in this embodiment, the Z-axis direction), the control unit 181 may use the average, maximum, or minimum value of h(x) as the correction amount, depending on the material of the substrate 300 and / or the correction target (for example, the first movement or the second movement). For example, if the reference value of the first movement is Z1, Z1 may be corrected as Z1-min(Δh(x)) or Z1-ave(Δh(x)). Furthermore, if the reference value of the second movement is h1, then H1 may be corrected as H1-max(Δh(x)) or H1-ave(Δh(x)). Also, if the reference value of the first movement is Z1, then Z1 may be corrected according to the position of the crimping head 160 as Z1-Δh(xh) (where xh is the X coordinate of the crimping head 160).

[0091] [Differentiation] The number of crimping heads provided by the crimping device 100 may be multiple.

[0092] Figure 10 is a side view illustrating a modified crimping device 101 according to the embodiment. The modified crimping device 101 differs from the crimping device 100 in the number of crimping heads 160, but the other configurations are the same as the crimping device 100. In other words, the crimping heads 160A of the crimping device 101 include a first crimping head 161 facing a first region 400 of the support surface 131 (for example, the position where part 201 is placed) and a second crimping head 162 facing a second region 401 of the support surface 131 (for example, a region different from the first region 400, where part 202 is placed). In Figure 10, some components of the crimping device 101, such as the stage moving unit 120 and the computer, are not shown.

[0093] For example, the crimping device 101 includes a first crimping head 161 and a second crimping head 162 corresponding to the positions of parts 201 and 202. The head movement unit 170 can, for example, control the first crimping head 161 and the second crimping head 162 individually. In other words, the head movement unit 170 can, for example, individually determine and control the amount of movement of the first crimping head 161 and the amount of movement of the second crimping head 162.

[0094] The control unit 181 determines, for example, the amount of movement of the first crimping head 161 and the amount of movement of the second crimping head 162 as second movement amounts, based on height distribution data (temperature-dependent data). Specifically, the control unit 181 derives a first height, which is the height of the first region 400, and a second height, which is the height of the second region 401, based on the temperature and height distribution data of the backup unit 130. Furthermore, for example, the control unit 181 determines the amount of movement of the first crimping head 161 based on the derived first height. In addition, for example, the control unit 181 determines the amount of movement of the second crimping head 162 based on the derived second height.

[0095] The first crimping head 161 and the second crimping head 162 may be configured, for example, to move simultaneously.

[0096] For example, the amount of movement of the first crimping head 161 and the second crimping head 162 may be the same. For example, the control unit 181 may derive the average, maximum, or minimum value of the height distribution of the support surface 131 based on the temperature and height distribution data of the backup unit 130. Alternatively, for example, the control unit 181 may determine a common amount of movement for the first crimping head 161 and the second crimping head 162 based on the derived average, maximum, or minimum value of the height distribution of the support surface 131.

[0097] Furthermore, the control unit 181 determines, for example, the amount of movement of the stage 110 when the first crimping head 161 performs crimping, and the amount of movement of the stage 110 when the second crimping head 162 performs crimping, as a first movement amount based on height distribution data (temperature-dependent data). Specifically, the control unit 181 derives a first height, which is the height of the first region 400, and a second height, which is the height of the second region 401, based on the temperature and height distribution data of the backup unit 130. Furthermore, for example, the control unit 181 determines the amount of movement of the stage 110 when the first crimping head 161 performs crimping, based on the derived first height. Furthermore, for example, the control unit 181 determines the amount of movement of the stage 110 when the second crimping head 162 performs crimping, based on the derived second height.

[0098] Furthermore, the amount of movement of the stage 110 when the first crimping head 161 performs crimping and the amount of movement of the stage 110 when the second crimping head 162 performs crimping may be the same. For example, the control unit 181 derives the average, maximum, or minimum value of the height distribution of the support surface 131 at the given temperature based on the temperature and height distribution data of the backup unit 130, and determines a common amount of movement of the stage 110 when the first crimping head 161 performs crimping and when the second crimping head 162 performs crimping based on the derived average, maximum, or minimum value of the height distribution. In other words, the control unit 181 may determine a common amount of movement of the stage 110 when the first crimping head 161 performs crimping and when the second crimping head 162 performs crimping based on the average, maximum, or minimum value of the height distribution of the support surface 131.

[0099] The number of crimping heads provided by the crimping device may be three or more.

[0100] [Effects, etc.] As described above, the crimping device 100 according to the embodiment includes a stage 110 on which a substrate 300 is placed, a backup unit 130 having a support surface 131 that supports the end 310 of the substrate 300 placed on the stage 110 from below the substrate 300, a heating unit 140 that heats the backup unit 130, a crimping head 160 that is provided above the backup unit 130 so as to be able to move up and down and crimps the component 200 onto the substrate 300 whose end 310 is supported by the support surface 131, a stage moving unit 120 that moves the stage 110 by a first amount of movement so as to support the end 310 of the substrate 300 placed on the stage 110 on the support surface 131, a head moving unit 170 that moves the crimping head 160 by a second amount of movement so as to crimp the component 200 onto the substrate 300 whose end 310 is supported by the support surface 131, and a control unit 181. The control unit 181 determines at least one of the first and second movement amounts based on the temperature of the backup unit 130, and controls the stage moving unit 120 and the head moving unit 170 using at least one of the determined first and second movement amounts to move the stage 110 and cause the crimping head 160 to perform crimping.

[0101] Conventionally, in the mounting (production) of display panels such as liquid crystal or organic EL (Electro Luminescence) panels, the crimping process is carried out without changing the amount of movement from the initial setting, regardless of the temperature conditions of the heating unit 140. Using the height of the backup unit 130, which is set in advance, the stage 110 is lowered to place the substrate 300 on the support surface 131 of the backup unit 130, and the crimping head 160 is lowered to match the said reference height. However, the height of the support surface 131 of the backup unit 130 changes due to thermal expansion caused by temperature changes. Therefore, depending on the temperature conditions during mounting, there is a possibility that the amount of lowering of the stage 110 (the amount of placement) or the amount of lowering of the crimping head 160 (the operating distance) may be excessive or insufficient, which may result in poor crimping of the component 200 or damage to the component 200.

[0102] The crimping device 100 acquires data such as the height of the support surface 131 of the backup unit 130 according to the temperature heated by the heating unit 140 (e.g., height distribution data), and based on the information of the change in height, it determines the amount of descent of the stage 110 to an appropriate value by making appropriate corrections to the amount of descent of the stage 110 for each size of the substrate 300 or mounting conditions in order to keep the amount of substrate 300 deposited constant. Similarly, the crimping device 100 determines the amount of descent of the crimping head 160 to an appropriate value by making appropriate corrections to the amount of descent of the crimping head 160 according to the change in height of the support surface 131 of the backup unit 130 in order to keep the pressure applied by the crimping head 160 uniform.

[0103] With the crimping device 100, even when the backup unit 130 is heated, the amount of movement of the stage 110 and / or the crimping head 160 can be appropriately controlled in accordance with changes in the positional relationship between the stage 110 on which the substrate 300 is placed and the backup unit 130, and / or the positional relationship between the crimping head 160 and the backup unit 130. Therefore, with the crimping device 100, a decrease in the mounting accuracy of the component 200 onto the substrate 300 can be suppressed.

[0104] Furthermore, for example, the crimping device 100 further includes a temperature measuring unit 150 for measuring the temperature of the backup unit 130. In this case, for example, the control unit 181 determines at least one of the first and second displacement amounts based on the temperature of the backup unit 130 measured by the temperature measuring unit 150.

[0105] According to this, since the measured temperature of the backup unit 130 is used to determine the first and second displacement amounts, appropriate first and second displacement amounts can be determined.

[0106] Furthermore, for example, the crimping device 100 further includes a storage unit 182 that stores temperature-dependent data showing the relationship between the height of the support surface 131 and the temperature of the backup unit 130. In this case, for example, the control unit 181 derives the height of the support surface 131 corresponding to the temperature of the backup unit 130 measured by the temperature measuring unit 150 based on the temperature-dependent data, and determines at least one of the first and second displacement amounts based on the derived height.

[0107] According to this, the appropriate first and second displacements can be determined from the temperature-dependent data.

[0108] Furthermore, for example, the temperature-dependent data includes height distribution data showing the relationship between the height distribution of the support surface 131 and the temperature of the backup section 130.

[0109] According to this, an appropriate height can be derived depending on the position of the support surface 131, that is, the position of the part 200 to be crimped.

[0110] Furthermore, for example, the crimping device 101 comprises the configuration of the crimping device 100, and a crimping head 160A instead of the crimping head 160 provided in the crimping device 100. The crimping head 160A includes a first crimping head 161 facing a first region 400 of the support surface 131, and a second crimping head 162 facing a second region 401 of the support surface 131. In this case, for example, the control unit 181 determines, as a second movement amount, the movement amount of the first crimping head 161 and the movement amount of the second crimping head 162 based on the height distribution data.

[0111] Furthermore, for example, the control unit 181 derives a first height, which is the height of the support surface 131 of the first region 400, and a second height, which is the height of the support surface 131 of the second region 401, based on the temperature and height distribution data of the backup unit 130. Based on the derived first height, it determines the amount of movement of the first crimping head 161, and based on the derived second height, it determines the amount of movement of the second crimping head 162.

[0112] According to these methods, even when there are multiple crimping heads, an appropriate amount of movement can be determined for each one.

[0113] Furthermore, for example, the control unit 181 derives the average, maximum, or minimum value of the height distribution of the support surface 131 based on the temperature and height distribution data of the backup unit 130, and determines the common amount of movement of the first crimping head 161 and the second crimping head 162 based on the derived average, maximum, or minimum value of the height distribution.

[0114] According to these methods, for example, even in cases where multiple crimping heads can only be moved uniformly, an appropriate amount of movement can be determined.

[0115] Furthermore, for example, the crimping head 160A includes a first crimping head 161 facing a first region 400 of the support surface 131, and a second crimping head 162 facing a second region 401 of the support surface 131. In this case, for example, the control unit 181 determines, as a first movement amount, the amount of movement of the stage 110 when the first crimping head 161 performs crimping, and the amount of movement of the stage 110 when the second crimping head 162 performs crimping, based on the height distribution data.

[0116] Furthermore, for example, the control unit 181 derives a first height, which is the height of the first region 400, and a second height, which is the height of the second region 401, based on the temperature and height distribution data of the backup unit 130. Based on the derived first height, it determines the amount of movement of the stage 110 when the first crimping head 161 performs crimping, and based on the derived second height, it determines the amount of movement of the stage 110 when the second crimping head 162 performs crimping.

[0117] According to these methods, even when there are multiple crimping heads, the appropriate amount of movement of the stage 110 when each crimps the part 200 can be determined.

[0118] Furthermore, for example, the control unit 181 derives the average, maximum, or minimum value of the height distribution of the support surface 131 at the given temperature based on the temperature and height distribution data of the backup unit 130, and determines the common amount of movement of the stage 110 when the first crimping head 161 performs crimping and the stage 110 when the second crimping head 162 performs crimping based on the derived average, maximum, or minimum value of the height distribution of the support surface 131 at the given temperature.

[0119] According to this, for example, even in cases where multiple crimping heads can only be moved uniformly, an appropriate amount of movement can be determined.

[0120] Furthermore, for example, the crimping device 100 further includes a height measuring unit 190 for measuring the height of the support surface 131.

[0121] According to this, the control unit 181 can create temperature-dependent data.

[0122] The crimping device 101 may also be equipped with a height measuring section 190.

[0123] Furthermore, the crimping method according to the embodiment includes a stage 110 on which a substrate 300 is placed, a backup unit 130 having a support surface 131 that supports the end 310 of the substrate 300 placed on the stage 110 from below the substrate 300, a heating unit 140 that heats the backup unit 130, a crimping head 160 that is provided above the backup unit 130 so as to be able to move up and down and crimps the component 200 onto the substrate 300 whose end 310 is supported by the support surface 131, and a stay that moves the stage 110 by a first amount of movement so that the end 310 of the substrate 300 placed on the stage 110 is supported by the support surface 131. A crimping method performed by a crimping device 100 comprising a stage moving unit 120 and a head moving unit 170 that moves the crimping head 160 by a second amount of movement to cause the component 200 to be crimped onto a substrate 300 whose end portion 310 is supported by a support surface 131, wherein at least one of a first amount of movement and a second amount of movement is determined based on the temperature of the backup unit 130 (S250), and the stage moving unit 120 and the head moving unit 170 are controlled using at least one of the determined first amount of movement and second amount of movement to move the stage 110 and cause the crimping head 160 to perform crimping (S270).

[0124] According to this, it will have the same effect as the crimping device 100.

[0125] (Other embodiments) Although the crimping device and the like according to this embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0126] For example, in the above embodiment, the method for adsorbing the substrate 300 on the support surface 131 was described as vacuum adsorption using a vacuum pump with an adsorption mechanism, but any configuration in which the adsorption mechanism adsorbs the substrate 300 on the support surface 131 is acceptable.

[0127] Furthermore, the computer 180 may be a dedicated computer for controlling each device of the crimping device 100, or it may be a computer that also controls each device of the mounting system that includes the crimping device 100.

[0128] Furthermore, for example, in the above embodiment, all or part of the components of the computer 180 may be made up of dedicated hardware, or they may be realized by executing software programs suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded on a recording medium such as an HDD or semiconductor memory.

[0129] Furthermore, the components of computer 180 may consist of one or more electronic circuits. Each of these one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0130] One or more electronic circuits may include, for example, semiconductor devices, ICs, or LSIs (Large Scale Integrations). ICs or LSIs may be integrated on a single chip or on multiple chips. While referred to here as ICs or LSIs, the terminology may vary depending on the degree of integration; they might also be called system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). Field Programmable Gate Arrays (FPGAs), which are programmed after the LSI is manufactured, can also be used for the same purpose.

[0131] Furthermore, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art could conceive, as well as forms realized by arbitrarily combining the components and functions of each embodiment without departing from the spirit of the present invention. [Industrial applicability]

[0132] The crimping device according to the present invention can be used as a crimping device for crimping components onto a substrate. [Explanation of symbols]

[0133] 100, 101 Crimping device 110 stages 111 Holding surface 120 Stage Movement Section 130 Backup section 131 Support surface 140 Heating section 150 Temperature measurement section 160, 160A crimping head 161 First crimping head 162 Second crimping head 170 Head movement unit 180 Computers 181 Control Unit 182 Memory section 190 Height measuring section Parts 200, 201, 202 300 circuit boards 310 End 400 1st area 401 Second area

Claims

1. A stage on which the circuit board is placed, A backup unit having a support surface that supports the end of the substrate placed on the stage from below the substrate, A heating unit for heating the backup unit, A crimping head is provided above the backup section so as to be movable up and down, and its end is supported by the support surface for crimping components onto the substrate, A stage moving unit moves the stage by a first amount of movement to support the end of the substrate placed on the stage on the support surface, A head movement unit that moves the crimping head by a second movement amount to cause the component to be crimped onto the substrate whose end is supported by the support surface, Control unit and Equipped with, The control unit, Based on the temperature of the backup unit, at least one of the first displacement and the second displacement is determined. By using at least one of the determined first and second movement amounts, and controlling at least one of the stage moving unit and the head moving unit corresponding to at least one of the determined first and second movement amounts, the stage is moved to cause the crimping head to perform the crimping. Crimping device.

2. The system further includes a temperature measuring unit for measuring the temperature of the backup unit, The control unit determines at least one of the first displacement and the second displacement based on the temperature of the backup unit measured by the temperature measuring unit. The crimping device according to claim 1.

3. The system further includes a storage unit that stores temperature-dependent data showing the relationship between the height of the support surface and the temperature of the backup unit. The control unit, The height of the support surface corresponding to the temperature of the backup unit measured by the temperature measuring unit is derived based on the temperature-dependent data. Based on the derived height, at least one of the first and second displacement amounts is determined. The crimping device according to claim 2.

4. The temperature-dependent data includes height distribution data showing the relationship between the height distribution of the support surface and the temperature of the backup section. The crimping device according to claim 3.

5. The crimping head includes a first crimping head facing a first region of the support surface and a second crimping head facing a second region of the support surface. The control unit determines, based on the height distribution data, the amount of movement of the first crimping head and the amount of movement of the second crimping head as the second amount of movement. The crimping device according to claim 4.

6. The control unit, Based on the temperature of the backup unit and the height distribution data, the first height, which is the height of the first region, and the second height, which is the height of the second region, are derived. Based on the derived first height, the amount of movement of the first crimping head is determined. Based on the derived second height, the amount of movement of the second crimping head is determined. The crimping device according to claim 5.

7. The control unit, Based on the temperature of the backup unit and the height distribution data, the average, maximum, or minimum value of the height distribution is derived. Based on the average, maximum, or minimum value of the derived height distribution, the common amount of movement of the first crimping head and the second crimping head is determined. The crimping device according to claim 5.

8. The crimping head includes a first crimping head facing a first region of the support surface and a second crimping head facing a second region of the support surface. The control unit determines, based on the height distribution data, the first movement amount, which is the amount of movement of the stage when the first crimping head performs the crimping, and the amount of movement of the stage when the second crimping head performs the crimping. The crimping device according to claim 4.

9. The control unit, Based on the temperature of the backup unit and the height distribution data, the first height, which is the height of the first region, and the second height, which is the height of the second region, are derived. Based on the derived first height, the amount of movement of the stage when the first crimping head performs the crimping is determined. Based on the derived second height, the amount of movement of the stage when the second crimping head performs the crimping is determined. The crimping device according to claim 8.

10. The control unit, Based on the temperature of the backup unit and the height distribution data, the average, maximum, or minimum value of the height distribution at that temperature is derived. Based on the average, maximum, or minimum value of the height distribution at the derived temperature, the common amount of movement of the stage when the first crimping head performs the crimping and the common amount of movement of the stage when the second crimping head performs the crimping are determined. The crimping device according to claim 8.

11. The system further includes a height measuring unit for measuring the height of the support surface. A crimping device according to any one of claims 1 to 10.

12. A stage on which the circuit board is placed, A backup unit having a support surface that supports the end of the substrate placed on the stage from below the substrate, A heating unit for heating the backup unit, A crimping head is provided above the backup section so as to be movable up and down, and its end is supported by the support surface for crimping components onto the substrate, A stage moving unit moves the stage by a first amount of movement to support the end of the substrate placed on the stage on the support surface, A crimping method performed by a crimping device comprising: a head moving unit that moves the crimping head by a second amount of movement to cause the component to be crimped onto the substrate whose end is supported by the support surface; Based on the temperature of the backup unit, at least one of the first displacement and the second displacement is determined. By using at least one of the determined first and second movement amounts, and controlling at least one of the stage moving unit and the head moving unit corresponding to at least one of the determined first and second movement amounts, the stage is moved to cause the crimping head to perform the crimping. Crimping method.

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