Photonic devices, photonic patches, and electronic systems

Abstract

To provide a photonics device, a photonics patch and an electronic system for increasing the bandwidth and / or reducing the fiber count in photonics multi-chip packages.SOLUTION: Embodiments disclosed herein include photonics systems with a dual polarization module. In an embodiment, a photonics patch 505 comprises a patch substrate, and a photonics die 525 on a first surface of the patch substrate. In an embodiment, a multiplexer 599 is on a second surface of the patch substrate. In an embodiment, a first optical path from the photonics die to the multiplexer is provided for propagating a first optical signal 594, and a second optical path from the photonics die to the multiplexer is provided for propagating a second optical signal 593. In an embodiment, a Faraday rotator 595 is provided along the second optical path to convert the second optical signal from a first mode TE to a second mode TM before reaching the multiplexer.SELECTED DRAWING: Figure 5

Description

Technical Field

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[0001] Embodiments of the present disclosure relate to an electronic package, and more particularly to a photonics package having a Faraday rotator to increase bandwidth by transmitting multiple transmission modes on a single optical fiber.

Background Art

[0002] The microelectronics industry has begun to use optical connections as a way to increase bandwidth and performance. Currently, fibers are optically coupled to photonics dies within an electronic package. Currently available photonics dies are configured to support a single polarization of an optical signal. For example, a photonics die can operate using a TE mode optical signal. Thus, the optical fibers coupled to the photonics die only transmit a single polarization. Since multiple polarizations (e.g., TE mode and TM mode) are not supplied on a single optical fiber, the bandwidth of the system is limited.

Summary of the Invention

[0003] The present invention provides a photonics device, the photonics device comprising: a substrate; a photonics die on a first surface of the substrate; a multiplexer on a second surface of the substrate; a first optical path for transmitting a first optical signal from the photonics die to the multiplexer; and a second optical path for transmitting a second optical signal from the photonics die to the multiplexer, wherein a magnetic shell and an optically transparent plug filling the magnetic shell are provided along the second optical path to convert the second optical signal from a first mode to a second mode before reaching the multiplexer..

Brief Description of the Drawings

[0004] [Figure 1A] It is a plan view of an electronic package according to an embodiment. [Figure 1B] It is a plan view of an electronic package having a dual polarization module optically coupled to a photonics die according to an embodiment. [Figure 2] This is a schematic diagram illustrating how a Faraday rotor functions according to an embodiment. [Figure 3A] This is a cross-sectional view of a patch having an embedded Faraday rotor below a photonic die, relating to an embodiment. [Figure 3B] This is a cross-sectional view of a patch having an integrated Faraday rotor below a photonic die, relating to an embodiment. [Figure 3C] This is a cross-sectional view of an electronic package relating to an embodiment, having a Faraday rotor optically coupled to the upper surface of a photonics die. [Figure 3D] This is a cross-sectional view of an electronic package relating to an embodiment, which has a Faraday rotor having an electromagnetic / magnetic region optically coupled to the upper surface of a photonics die. [Figure 4] This is a schematic diagram illustrating an embodiment of how a dual-polarization module enables multiplexing and demultiplexing of optical signals in order to enable dual polarization on a single optical fiber. [Figure 5] This is a cross-sectional view of a photonics patch having an integrated dual-polarization module according to an embodiment. [Figure 6] This is a cross-sectional view of an electronic system having an integrated dual-polarization module according to an embodiment. [Figure 7] This is a schematic diagram of a computer device configured according to an embodiment. [Modes for carrying out the invention]

[0005] This specification describes a photonic package with a Faraday rotator for increasing bandwidth by transmitting multiple transmission modes over a single optical fiber, according to various embodiments. The following description will explain various aspects of exemplary implementations using terminology commonly used by those skilled in the art, and will convey the nature of their work to them. However, it will be apparent to those skilled in the art that the invention may be implemented in only some of the embodiments described. For illustrative purposes, specific quantities, materials, and configurations are described to fully understand the specific implementations. However, it will be apparent to those skilled in the art that the invention can be implemented without specific details. In other examples, well-known features are omitted or simplified so as not to obscure the exemplary implementations.

[0006] Various operations are described as several separate operations in the manner most useful for understanding the present invention, but the order of description should not be interpreted as meaning that these operations necessarily depend on the order. In particular, these operations do not need to be performed in the order presented.

[0007] As described above, existing photonics systems are limited in bandwidth due to their ability to handle a single transmission mode. Accordingly, embodiments disclosed herein include a dual-polarization module integrated into a photonics system and optically coupled to a photonics die. The dual-polarization module may include a splitter, a Faraday rotator, and a multiplexer. The splitter separates the incident laser input into a first optical signal and a second optical signal. The second optical signal may pass through a Faraday rotator to switch the transmission mode (e.g., from TE to TM). The multiplexer then recombines the first and second optical signals so that the multiplexed signal can be transmitted along a single optical fiber. This makes it possible to double the bandwidth and reduce the number of optical fibers required for the system (by half). Similarly, the receiver portion of the dual-polarization module may demultiplex the incident multiplexed signal into a third optical signal and a fourth optical signal. The Faraday rotator may then convert the transmission mode of the fourth optical signal so that both the third and fourth optical signals have the same transmission mode.

[0008] Embodiments disclosed herein include various Faraday rotor architectures that can be used in dual-polarization modules. In the first embodiment, individual Faraday rotors are mounted in through holes in a patch substrate. In additional embodiments, the Faraday rotors are integrated with the patch substrate during its manufacture. In these two embodiments, the Faraday rotors are optically coupled to the bottom surface of a photonic die. In yet another embodiment, the Faraday rotors may be coupled to the top surface of the photonic die.

[0009] Next, refer to Figure 1A. A plan view of the photonics system 100 is shown to provide context for the embodiments described herein. As shown, the photonics system 100 includes a package substrate 105. A compute die 120 and a photonics die 125 are provided on the package substrate 105. The compute die 120 is communicate-coupled to the photonics die 125 by a bridge 127 embedded in the package substrate 105. The photonics die 125 is typically configured to support a single transmission mode of an optical signal. For example, the photonics die 125 may support a TE mode signal or a TM mode signal.

[0010] To increase bandwidth (or decrease the count (quantity) of optical fibers), embodiments disclosed herein include a dual-polarization module. A photonics system 100 having a dual-polarization module 128 is shown in Figure 1B. As shown, the dual-polarization module 128 is directly coupled to a photonics die 125. The dual-polarization module 128 enables the conversion of an optical signal from a first transmission mode to a second transmission mode, or vice versa. That is, the conversion between transmission modes is performed only in the dual-polarization module 128. This allows the photonics die 125 to be independent of the change in transmission mode, since the photonics die 125 still only needs to process one transmission mode.

[0011] In embodiments, the dual-polarization module 128 includes one or more Faraday rotors. A Faraday rotor includes a magnetic region and polarizers that enable the conversion of transmission modes. Figure 2 is a comprehensive diagram illustrating how a Faraday rotor works. As shown, the Faraday rotor 260 includes a first polarizer 265, a magnetic region 266, and a second polarizer 267 on the magnetic region 266 opposite to the first polarizer 265. Incident light 261 may have random polarization. After passing through the first polarizer 265, light 262 may be perpendicularly polarized. In embodiments, light 262 is transmitted through the magnetic region 266, where the magnetic field results in a polarization shift, as shown by light 263. For example, in some embodiments, a 45-degree polarization shift may be provided. Light 263 then passes through the second polarizer 267, which restricts the light to only the selected polarization shift caused by the magnetic region 266, as shown by light 264. In light passing in the opposite direction (i.e., light 268, 269, and 270), angled polarizations 268 and 269 pass through the magnetic region 266 in the opposite direction. The magnetic region 266 shifts the polarization again. For example, if 45-degree polarization is used, the polarization of light 269 is further shifted so that light 270 is polarized by 90 degrees. It should be understood that such a Faraday rotator architecture may result in filtering out reflections from the optical path. Thus, the signal-to-noise ratio increases, and in addition to providing a change of transmission mode, the performance of the optical interconnect is improved.

[0012] Next, refer to Figures 3A–3D. Exemplary Faraday rotors and their integration into photonic systems are shown in various embodiments. While four different Faraday rotor architectures are illustrated, it should be understood that the dual-polarization module is not limited to the illustrated Faraday rotor architectures. Any structure that provides the functionality of a Faraday rotor may be used as part of the dual-polarization module.

[0013] Next, refer to Figure 3A, which shows a cross-sectional view of a photonic patch 305 according to an embodiment. In this embodiment, the patch 305 includes a core 312 and conductive wiring layers 313 above and below the core 312. Through-core vias 311 may electrically couple the upper wiring layer 313 to the lower wiring layer 313. However, it will be understood that in some embodiments, a coreless patch 305 may be used.

[0014] In embodiments, patch 305 may include a compute die 320 and a photonics die 325. In embodiments, the compute die 320 and the photonics die 325 are attached to patch 305 by an interconnect 321. The interconnect 321 may be any suitable first-tier interconnect (FLI). The compute die 320 may be any type of die, including but not limited to a processor, graphics processor, field-programmable gate array (FPGA), system on a chip (SoC), or memory. In embodiments, the photonics die 325 includes features for converting signals between the optical and electrical domains. For example, the photonics die 325 may include a laser and / or photodiode. In embodiments, the compute die 320 is communicate-coupled to the photonics die 325 by a bridge 327 embedded in the upper wiring layer 313 of patch 305. The bridge 327 provides a dimensionally stable substrate on which high-density conductive routing can be provided.

[0015] In this embodiment, the optical cable 334 is connected to the connector 333. The connector 333 interfaces with a Faraday rotor 330 that penetrates the thickness of the patch 305. In this embodiment, the Faraday rotor 330 is located within the footprint of the photonic die 325. Thus, an optical path is provided through the Faraday rotor 330 from the connector 333 to the photonic die 325.

[0016] In an embodiment, the Faraday rotator 330 includes a housing 332. The housing 332 may be a tube. In an embodiment, the housing 332 is mechanically coupled to the patch 305 by a dielectric layer 331. In an embodiment, the dielectric layer 331 is a material that expands during heat treatment. Thus, the Faraday rotator 330 may be inserted into the patch 305, and the Faraday rotator 330 is fixed to the patch 305 by heat treatment.

[0017] In an embodiment, the Faraday rotator 330 may include a first polarizer 336 and a second polarizer 337. The first polarizer 336 may be a vertical polarizer, and the second polarizer 337 may be an angled polarizer (e.g., 45 degrees). That is, the first polarizer 336 may be different from the second polarizer 337. In an embodiment, a magnetic region is provided between the first polarizer 336 and the second polarizer 337. The magnetic region may include a permanent magnet 335. The permanent magnet 335 may be a shell that wraps around an optically clear layer 338. The permanent magnet 335 has a magnetic field that modifies the orientation of the incident vertical polarization. For example, the permanent magnet 335 may produce 45-degree polarization in some embodiments.

[0018] In an embodiment, the efficiency of the Faraday rotator 330 may be further improved by including lenses. For example, a first lens 339A may be provided between the first polarizer 336 and the connector 333, and a second lens 339B may be provided between the second polarizer 337 and the photonics die 325.

[0019] In an embodiment, the Faraday rotator 330 is configured to convert an incident optical signal from a first transmission mode to a second transmission mode. For example, an incident optical signal that is in the TE mode may be converted to an optical signal that is in the TM mode. As will be described in more detail below, the conversion between transmission modes enables multiplexing or demultiplexing of optical signals in order to improve the bandwidth or reduce the fiber count.

[0020] Next, refer to FIG. 3B. A cross-sectional view of the photonics patch 305 having an architecture of an alternative Faraday rotator 330 is shown according to an embodiment. In an embodiment, the patch 305 may include a core 312 and conductive wiring layers 313 above and below the core 312. Through-core vias 311 may electrically couple the upper wiring layer 313 to the bottom wiring layer 313. In other embodiments, the patch 305 may be coreless. In an embodiment, the compute die 320 and the photonics die 325 are attached to the patch 305 by an interconnect 321. The interconnect 321 may be any suitable FLI. The compute die 320 may be communicatively coupled to the photonics die 325 by a bridge 327 embedded in the upper wiring layer 313.

[0021] In an embodiment, the patch 305 includes a Faraday rotator 330. The Faraday rotator 330 may be integrated with the patch 305. That is, rather than being a separate component (as in the case of FIG. 3A), the Faraday rotator 330 is assembled as part of the patch 305 during the manufacture of the patch 305.

[0022] In an embodiment, the Faraday rotator 330 includes a magnetic shell 351 and an optically transparent core 352. The magnetic shell 351 may be in direct contact with the wiring layer 313 and the core 312. That is, there may be no housing between the magnetic shell 351 and the substrate of the patch 305. However, in other embodiments, a liner (not shown) may separate the magnetic shell 351 from the substrate of the patch 305. In an embodiment, a lens 353 may be provided at the bottom of the Faraday rotator 330. The lens 353 may be coupled to an optical cable 334. Although no polarizer is shown in FIG. 3B, it is to be understood that an embodiment may include a pair of polarizers provided at both ends of the magnetic shell 351. In other embodiments, the Faraday rotator 330 may be used without a polarizer.

[0023] In this embodiment, the Faraday rotor 330 is configured to convert the incident optical signal from a first transmission mode to a second transmission mode. For example, an incident optical signal in TE mode may be converted to an optical signal in TM mode. As will be described in more detail below, the conversion between transmission modes allows for multiplexing or demultiplexing of the optical signals to improve bandwidth or reduce fiber count.

[0024] Next, refer to Figure 3C. A cross-sectional view of the electronic package 300 is shown according to an additional embodiment. In the embodiment, the electronic package 300 includes a package substrate 302. In the embodiment, one or more embedded bridges 327 may be provided within the package substrate 302. The bridges 327 provide high-density routing for communication coupling of the photonic die 325 to the compute die 320. The photonic die 325 and the compute die 320 may be coupled to the package substrate 302 by an interconnect 321. The interconnect 321 may include an arbitrary FLI architecture. In the embodiment, an integrated heat spreader (IHS) 360 may be provided on the package substrate 302. The IHS 360 may be thermally coupled to the compute die 320. For example, a thermal interface material (TIM) (not shown) may be provided between the IHS 360 and the compute die 320.

[0025] In some embodiments, the Faraday rotor 330 may penetrate the IHS 360 and be optically coupled to the photonic die 325. That is, the Faraday rotor 330 may be optically coupled to the upper surface of the photonic die 325. In some embodiments, the Faraday rotor 330 may include a tubular housing 371. A first polarizer 372 and a second polarizer 375 are provided in the housing 371. A magnetic shell 373 may be provided between the first polarizer 372 and the second polarizer 375. In some embodiments, the magnetic shell 373 may be a permanent magnet. In the illustrated embodiments, the first polarizer 372 and the second polarizer 375 have diameters substantially equal to the inner diameter of the magnetic shell 373. In such embodiments, the first polarizer 372 and the second polarizer 375 may be located within the magnetic shell 373. However, in other embodiments, the first polarizer 372 and the second polarizer 375 may be located at both ends of the magnetic shell 373, or on the outside of the magnetic shell 373. In embodiments, an optically transparent plug 374 may be provided within the inner diameter of the magnetic shell 373.

[0026] The second polarizer 375 may be a perpendicular polarizer, and the first polarizer 372 may be an angled polarizer (e.g., 45 degrees). That is, the first polarizer 372 may be different from the second polarizer 375. In some embodiments, the magnetic shell 373 has a magnetic field that corrects the orientation of the incident perpendicular polarization. For example, in some embodiments, the magnetic shell 373 may produce 45-degree polarization.

[0027] In the embodiment, the first lens 377 may be located within the housing 371. The lens 377 improves the optical coupling between the Faraday rotor 330 and the photonic die 325. In the embodiment, the connector 376 is located above and around the end of the housing 371. The connector 376 may be tubular and surround the end of the housing 371. The connector 376 may include a second lens 378 that focuses the optical signal incident on the Faraday rotor 330. The connector 376 may provide a mechanical coupling of the optical fiber 379 to the Faraday rotor 330.

[0028] In this embodiment, the Faraday rotor 330 is configured to convert the incident optical signal from a first transmission mode to a second transmission mode. For example, an incident optical signal in TE mode may be converted to an optical signal in TM mode. As will be described in more detail below, the conversion between transmission modes allows for multiplexing or demultiplexing of the optical signals to improve bandwidth or reduce fiber count.

[0029] Next, refer to Figure 3D. A cross-sectional view of the electronic package 300 is shown according to an additional embodiment. In this embodiment, the electronic package 300 in Figure 3D is substantially similar to the electronic package 300 in Figure 3C, with the exception that the Faraday rotor 330 has a different magnet configuration. Instead of providing a permanent magnet shell, a conductive coil 383 is provided between the first polarizer 372 and the second polarizer 375. The conductive coil 383 may be an electromagnet connected to a power source (not shown). By controlling the current passing through the conductive coil 383, it is possible to provide a controllable magnetic field around the plug 374. Thus, the incident light signal can have adjustable optical polarization.

[0030] In this embodiment, the Faraday rotor 330 is configured to convert the incident optical signal from a first transmission mode to a second transmission mode. For example, an incident optical signal in TE mode may be converted to an optical signal in TM mode. As will be described in more detail below, the conversion between transmission modes allows for multiplexing or demultiplexing of the optical signals to improve bandwidth or reduce fiber count.

[0031] Next, refer to Figure 4. A schematic diagram of system 400 is shown illustrating how the dual-polarization module 428 interfaces with the photonics die 425 in an embodiment. In this embodiment, the system has a transmit (Tx) chain 470 and a receive (Rx) chain 471. The Tx chain 470 outputs a multiplexed signal 496 that includes both TM mode signals and TE mode signals. The Rx chain 471 receives the multiplexed signal 497 and converts it into a pair of TE mode signals 451 and 452.

[0032] With respect to the Tx chain 470, the input laser beam 492 is supplied to a splitter 491 on a dual-polarization module 428. The splitter 491 separates the input laser beam 492 into a first optical signal 494 and a second optical signal 493. In this embodiment, the first optical signal 494 and the second optical signal 493 are transmitted in a first transmission mode (e.g., TE mode). The first optical signal 494 and the second optical signal 493 are transmitted to a photonics die 425. The photonics die 425 modulates the first optical signal 494 and the second optical signal 493 and modulates data onto these optical signals.

[0033] In the embodiment, the first optical signal 494 and the second optical signal 493 are returned to the dual polarization module 428. In the embodiment, the second optical signal 493 passes through the Faraday rotor (FR) 495. The second optical signal 493 is converted to a second transmission mode (e.g., TM mode) by the Faraday rotor 495 and supplied with a modified second optical signal 493'. In the embodiment, the first optical signal 494 and the modified second optical signal 493' are supplied to a multiplexer (MUX) 499, which combines them into a multiplexed signal 496 having both TE and TM transmission modes.

[0034] In this way, a single fiber cable can transmit two signals, doubling the bandwidth on the optical fiber. Furthermore, it is understood that the photonic die 425 is only necessary to accommodate a single transmission mode. For example, only the TE mode signal is supplied to the photonic die 425 on the Tx chain 470. Thus, the photonic die 425 can be substantially independent of the polarization changes provided by the dual polarization module 428.

[0035] With respect to the Rx chain 471, the multiplexed signal 497 may be received by a demultiplexer (DEMUX) 498. The multiplexed signal 497 may include a third signal 451 having a first transmission mode and a fourth signal 452' having a second transmission mode. For example, the first transmission mode may be TE and the second transmission mode may be TM. The demultiplexer 498 separates the third signal 451 from the fourth signal 452'. The third signal 451 is transmitted directly to the photonic die 425, and the fourth signal 452' passes through the Faraday rotor 453. The Faraday rotor changes the transmission mode from the second transmission mode to the first transmission mode. For example, the Faraday rotor 453 may change the transmission mode of the fourth signal 452' from TM mode to TE mode. The modified fourth signal 452 is then transmitted to the photonic die 425.

[0036] In this way, a photonic die configured to handle only a single transmission mode may receive and process a multiplexed signal having two transmission modes, doubling the bandwidth on the optical fiber. Furthermore, it is understood that the photonic die 425 is only necessary to accommodate a single transmission mode. For example, only the TE mode signal is supplied to the photonic die 425 on the Rx chain 471. Thus, the photonic die 425 can be substantially independent of the polarization changes provided by the dual polarization module 428.

[0037] Next, refer to Figure 5. A cross-sectional view of a photonic patch 505 having an integrated dual-polarization module 528 according to an embodiment is shown. In the embodiment, the patch 505 may include a core 512 and wiring layers 513 provided above and below the core 512. The photonic die 525 and the compute die 520 may be coupled to the wiring layers 513 by an FLI 521. A bridge 527 may communicate-couple the photonic die 525 to the compute die 520.

[0038] In this embodiment, the dual-polarization module 528 is integrated with the core 512 and wiring layer 513 below the photonics die 525. Starting from the Tx chain, the input laser source 592 is provided along the optical fiber 534 toward the splitter 591. The splitter 591 may be embedded in or on the bottom wiring layer 513. The splitter 591 may be mounted using a standard mounting process. The splitter 591 separates the incident laser source 592 into a first optical signal 594 and a second optical signal 593. In this embodiment, the first optical signal 594 and the second optical signal 593 may be TE-mode signals. The first optical signal 594 and the second optical signal 593 are transmitted to the photonics die 525 via the optical path 584.

[0039] After passing through the photonics die 525, the first optical signal 594 is transmitted down the optical path 584 to the multiplexer 599. The second optical signal 593 passes through the Faraday rotor 595 and is converted from the first mode to the second mode (e.g., TM mode). The modified second optical signal 593' is then supplied to the multiplexer 599. The multiplexer 599 may be embedded in the bottom wiring layer 513 or provided over the bottom wiring layer 513. The multiplexer may be mounted using a standard mounting process. The multiplexer 599 combines the first optical signal 594 with the modified second optical signal 593' to supply a multiplexed signal 596 to be transmitted along the fiber 534. In embodiments, the fiber 534 may be a single-mode fiber or a multimode fiber. With respect to the fiber 534, it is understood that the mode is different from TE mode or TM mode. In other words, the single-mode fiber 534 may still be able to transmit a multiplexed signal 596 having both TE and TM mode optical signals.

[0040] Next, referring to the Rx chain, the incoming multiplexed signal 597 is supplied to the demultiplexer 598 via fiber 534. The demultiplexer 598 separates the multiplexed signal 597 into a third optical signal 551 and a fourth optical signal 552'. The demultiplexer 598 may be located within or across the bottom wiring layer 513. The demultiplexer 598 may be installed by a standard process.

[0041] The third optical signal 551 may be in the first mode (e.g., TE), and the fourth optical signal 552' may be in the second mode (e.g., TM). The third optical signal 551 is supplied to the photonic die 525 through the optical path 584. The fourth optical signal 552' is transmitted through the Faraday rotor 553. The Faraday rotor 553 converts the second mode to the first mode, providing a modified fourth signal 552. For example, the modified fourth signal 552 may be in the TE mode.

[0042] In the illustrated embodiment, the Faraday rotors 595 and 553 are formed to have a structure similar to that of Figure 3B, i.e., the magnetic shell 582 surrounds the optical path 584. Although separate polarizers are not shown, it is understood that in some embodiments, the Faraday rotors 595 and 553 may include polarizers above and below the magnetic shell 582. Furthermore, it is understood that other Faraday rotor architectures, such as those shown in Figures 3A, 3C, and 3D, may be used in the dual-polarization module 528 according to other embodiments.

[0043] Next, refer to Figure 6, which shows a cross-sectional view of an electronic system 600 according to an embodiment. In this embodiment, the electronic system 600 includes a board 601, such as a printed circuit board (PCB). The interposer 602 is attached to the board 601 by an interconnect 603. Although shown as a solder ball, it is understood that the interconnect 603 may be any architecture, such as a socket. The interposer 602 may include conductive routing (not shown) to provide an electrical coupling between the top surface of the interposer 602 and the bottom surface of the interposer 602.

[0044] In the embodiment, patch 605 is attached to the interposer 602 by an interconnect 604 such as a solder bump. Patch 605 may be substantially similar to any of the patches described herein. For example, patch 605 comprises a core 612 and conductive wiring layers 613 provided above and below the core 612. The compute die 620 may be communication-coupled to the photonic die 625 by a bridge 627. FLI 621 may couple the compute die 620 and the photonic die 625 to the wiring layer 613.

[0045] In this embodiment, patch 605 may include an integrated dual-polarization module 628. For example, the dual-polarization module 628 may be provided with a core 612 and a wiring layer 613. The dual-polarization module 628 may include a Tx chain 670 and an Rx chain 671. The Tx chain 670 may include a splitter 691 and first optical paths 6841 and second optical paths 6842 located between the splitter 691 and the photonics die 625. Return optical paths 6843 and 6844 may be provided between the photonics die 625 and the multiplexer 699. In this embodiment, a fourth optical path 6844 passes through a Faraday rotor 695. The Faraday rotor 695 may convert the TE mode signal to a TM mode signal. The multiplexer 699 combines the TE mode signal from the third optical path 6843 with the TM mode signal from the fourth optical path 6844.

[0046] On the Rx chain 671, the demultiplexer 698 feeds to the fifth optical path 6845 and the sixth optical path 6846. The demultiplexer 698 may separate the TE mode signal from the TM mode signal. The TE mode signal goes through the fifth optical path 6845 to the photonic die 625. The TM mode signal is converted to a TE mode signal by the Faraday rotator 653 along the sixth optical path 6846.

[0047] As shown in Figure 6, patch 605 may be stretched across the edge of interposer 602. The stretched portion of patch 605 allows a fiber (not shown in Figure 6) to access the bottom surface of the patch to connect to the dual-polarization module 628.

[0048] Figure 7 shows a computer device 700 according to one embodiment of the present invention. The computer device 700 houses a board 702, which may contain a number of components, including, but not limited to, a processor 704 and at least one communication chip 706. The processor 704 is physically and electrically coupled to the board 702. In some embodiments, at least one communication chip 706 is also physically and electrically coupled to the board 702. In other embodiments, the communication chip 706 is part of the processor 704.

[0049] These other components include, but are not limited to, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, graphics processor, digital signal processor, cryptographic processor, chipset, antenna, display unit, touchscreen display unit, touchscreen control unit, battery, audio codec, video codec, power amplifier, Global Positioning System (GPS) device, compass, accelerometer, gyroscope, speaker, camera, and mass storage devices (such as hard disk drives, compact discs (CDs), and digital general-purpose discs (DVDs)).

[0050] The communication chip 706 enables wireless communication for transferring data to and from the computer device 700. The term “wireless” and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communication channels, etc., that may communicate data via the use of modulated electromagnetic radiation over a non-solid medium. Although in some embodiments the devices in question may not contain wires, the term does not mean that the devices in question do not contain wires. The communication chip 706 may implement any of several wireless standards or protocols, including, but not limited to, Wi-Fi® (IEEE 802.11 family), WiMAX® (IEEE 802.16 family), IEEE 802.20, Long-Term Evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM®, GPRS, CDMA, TDMA, DECT®, Bluetooth®, their derivatives, and any other wireless protocols designated as 3G, 4G, 5G and later. The computer device 700 may include multiple communication chips 706. For example, the first communication chip 706 may be dedicated to relatively short-range wireless communication such as Wi-Fi and Bluetooth, and the second communication chip 706 may be dedicated to relatively long-range wireless communication such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, and Ev-DO.

[0051] The processor 704 of the computer device 700 includes an integrated circuit die packaged within the processor 704. In some embodiments of the present invention, the integrated circuit die of the processor may be part of an electronic system having a photonics die optically coupled to a dual-polarization module, according to embodiments described herein. The term “processor” may refer to a device or part of a device that processes this electronic data from registers and / or memory in order to convert the electronic data into other electronic data that may be stored in registers and / or memory.

[0052] Furthermore, the communication chip 706 includes an integrated circuit die packaged within the communication chip 706. According to another embodiment of the present invention, the integrated circuit die of the communication chip may be part of an electronic system having a photonics die optically coupled to a dual-polarization module, according to embodiments described herein.

[0053] The above description of exemplary embodiments of the Invention, including those described in the abstract, is not intended to be exhaustive or to limit the Invention to the exact form disclosed. Specific embodiments and examples of the Invention are described herein for illustrative purposes, but various equivalent modifications are possible within the scope of the Invention, as will be understood by those skilled in the art.

[0054] These modifications may be made in light of the detailed description above. The terms used in the following claims shall not be construed as limiting the invention to any particular implementation disclosed in the specification and claims. Rather, the scope of the invention shall be entirely defined by the following claims. The claims shall be construed in accordance with established principles of claim interpretation.

[0055] Example 1: A photonic device comprising a substrate; a photonic die on a first surface of the substrate; a multiplexer on a second surface of the substrate; a first optical path from the photonic die to the multiplexer for transmitting a first optical signal; and a second optical path from the photonic die to the multiplexer for transmitting a second optical signal, wherein a magnetic shell and an optically transparent plug filling the magnetic shell are provided along the second optical path, converting the second optical signal from a first mode to a second mode before reaching the multiplexer.

[0056] Example 2: A photonic device of the same type as in Example 1, wherein the first mode is the TE mode and the second mode is the TM mode.

[0057] Example 3: A photonic device of the same type as in Example 2, wherein the first optical signal is a TE-mode signal.

[0058] Example 4: A photonic device according to Examples 1 to 3, wherein the multiplexer combines a first optical signal with a second optical signal to form a multiplexed signal.

[0059] Example 5: A photonic device of Example 4, wherein multiplexed signals are transmitted along a single optical fiber.

[0060] Example 6: A photonic device according to Examples 1 to 5, further comprising a splitter, wherein the splitter is configured to separate an incident optical signal into a first optical signal and a second optical signal.

[0061] Example 7: A photonic device of Example 6, wherein the splitter is on the same surface as the multiplexer on the substrate.

[0062] Example 8: A photonic device according to Example 6, wherein an input laser supplies an incident light signal to a splitter, and the incident light signal is a TE-mode signal.

[0063] Example 9: A photonic device according to Examples 1 to 8, wherein a magnetic shell and an optically transparent plug function as a Faraday rotor.

[0064] Example 10: A photonic device according to Examples 1 to 9, wherein the Faraday rotor further comprises a tube in which a magnetic shell is contained within a tube, a first polarizer, and a second polarizer, the first and second polarizers being located at opposite ends of the magnetic shell.

[0065] Example 11: A photonic device according to Examples 1 to 10, further comprising a compute die on a substrate, wherein the compute die is communicate-coupled to the photonic die by an embedded bridge.

[0066] Example 12: A photonic patch comprising: a patch substrate; a photonic die on the patch substrate; a compute die on the patch substrate and communicate-coupled to the photonic die by a bridge embedded in the patch substrate; a splitter below the photonic die configured to separate an incident optical signal into a first optical signal and a second optical signal; a first optical path from the splitter to the photonic die for transmitting the first optical signal; a second optical path from the splitter to the photonic die for transmitting the second optical signal; a third optical path from the photonic die to a multiplexer for transmitting the first optical signal; and a fourth optical path from the photonic die to a multiplexer for transmitting the second optical signal, wherein a Faraday rotor is provided along the fourth optical path to convert the second optical signal from a first mode to a second mode.

[0067] Example 13: A photonic patch of the same type as in Example 12, wherein the first mode is TE mode and the second mode is TM mode.

[0068] Example 14: A photonic patch of Example 13, wherein the first optical signal is a TE-mode signal.

[0069] Example 15: A photonic patch according to Examples 12 to 14, wherein the multiplexer combines the first optical signal with the second optical signal to form a multiplexed signal.

[0070] Example 16: A photonic patch of Example 15, wherein multiplexed signals are transmitted along a single optical fiber.

[0071] Example 17: A photonics patch according to Examples 12 to 16, further comprising a receiving channel, the receiving channel being a demultiplexer configured to separate incoming multiplexed signals including a third optical signal and a fourth optical signal, wherein the third optical signal is in first mode and the fourth optical signal is in second mode; a fifth optical path between the demultiplexer and a photonics die, along which the third optical signal is transmitted; a sixth optical path between the demultiplexer and a photonics die, along which the fourth optical signal is transmitted; and a second Faraday rotor provided along the sixth optical path to convert the fourth optical signal from second mode to first mode.

[0072] Example 18: A photonic patch according to Examples 12 to 17, wherein the Faraday rotor comprises a magnetic shell and an optically transparent plug filling the magnetic shell.

[0073] Example 19: A photonic patch according to Examples 12 to 17, wherein the Faraday rotator comprises a tube, a first polarizer, a second polarizer, and a magnetic shell between the first and second polarizers.

[0074] Example 20: A photonic patch comprising: a patch substrate; a photonic die on the patch substrate; a transmit chain configured to separate an incident optical signal into a first optical signal and a second optical signal, wherein the second optical signal is converted from a first mode to a second mode by a first Faraday rotor; and a receive chain configured to separate a multiplexed signal into a third optical signal transmitted in a first mode and a fourth optical signal transmitted in a second mode, wherein the second Faraday rotor converts the fourth optical signal to a first mode before it reaches the photonic die.

[0075] Example 21: A photonic patch of Example 20, wherein the photonic die simply receives and / or transmits an optical signal transmitted in the first mode.

[0076] Example 22: A photonics patch according to Example 20 or Example 21, wherein the first mode is TE mode and the second mode is TM mode.

[0077] Example 23: An electronic system comprising a board; an interposer on the board; and a patch on the interposer, wherein the patch comprises a patch substrate, a photonic die, and a transmit chain, the transmit chain comprising a splitter that separates an incident optical signal into a first optical signal and a second optical signal; a Faraday rotor that converts the second optical signal from a first mode to a second mode; and a multiplexer that combines the first optical signal with the second optical signal and transmits them along a single optical fiber.

[0078] Example 24: An electronic system of Example 23, wherein a patch board is stretched across the edge of an interposer.

[0079] Example 25: An electronic system of Example 23 or Example 24, wherein the patch further includes a receiving chain, the receiving chain configured to separate a multiplexed signal into a third optical signal transmitted in a first mode and a fourth optical signal transmitted in a second mode, and a second Faraday rotor converts the fourth optical signal to the first mode before it reaches the photonics die.

Claims

1. circuit board and A photonic die on the first surface of the substrate, A multiplexer located on the second surface of the substrate, A first optical path formed on the substrate transmits a first optical signal from the photonics die to the multiplexer, The substrate is formed and includes a second optical path that transmits a second optical signal from the photonics die to the multiplexer, A photonic device comprising a magnetic shell and an optically transparent plug filling the magnetic shell, arranged within the substrate and along the second optical path, which converts the second optical signal from a first mode to a second mode before reaching the multiplexer.

2. The photonic device according to claim 1, wherein the first mode is the TE mode and the second mode is the TM mode.

3. The photonic device according to claim 2, wherein the first optical signal is a TE mode signal.

4. The photonic device according to claim 1, 2, or 3, wherein the multiplexer combines the first optical signal with the second optical signal to form a multiplexed signal.

5. The photonic device according to claim 4, wherein the multiplexer transmits the multiplexed signals along a single optical fiber.

6. The photonic device according to any one of claims 1 to 5, further comprising a splitter, wherein the splitter is configured to separate an incident light signal into a first light signal and a second light signal.

7. The photonic device according to claim 6, wherein the splitter is located on the same surface as the multiplexer on the substrate.

8. The photonic device according to claim 6, wherein an input laser supplies the incident light signal to the splitter, and the incident light signal is a TE mode signal.

9. The photonic device according to any one of claims 1 to 8, wherein the magnetic shell and the optically transparent plug function as a Faraday rotor.

10. The Faraday rotor further includes a tube in which the magnetic shell is located, a first polarizer located within the tube, and a second polarizer located within the tube. The photonic device according to any one of claims 1 to 8, wherein the first polarizer and the second polarizer are located at opposite ends of the magnetic shell.

11. The photonic device according to any one of claims 1 to 10, further comprising a compute die on the substrate, wherein the compute die is communicate-coupled to the photonic die by an embedded bridge.

12. Patch circuit board and A photonic die on the aforementioned patch substrate, A compute die located on the patch substrate and communicate-coupled to the photonics die by a bridge embedded in the patch substrate, A splitter located below the aforementioned photonics die, configured to separate the incident optical signal into a first optical signal and a second optical signal, A first optical path formed on the patch substrate transmits the first optical signal from the splitter to the photonics die, A second optical path formed on the patch substrate transmits the second optical signal from the splitter to the photonics die, A third optical path formed on the patch substrate transmits the first optical signal from the photonics die to the multiplexer, The patch substrate is formed on the patch substrate and includes a fourth optical path that transmits the second optical signal from the photonics die to the multiplexer, A photonic patch in which a Faraday rotor is arranged on the patch substrate and provided along the fourth optical path, converting the second optical signal from the first mode to the second mode.

13. The photonic patch according to claim 12, wherein the first mode is the TE mode and the second mode is the TM mode.

14. The photonic patch according to claim 13, wherein the first optical signal is a TE mode signal.

15. The photonic patch according to claim 12, 13, or 14, wherein the multiplexer combines the first optical signal with the second optical signal to form a multiplexed signal.

16. The photonic patch according to claim 15, wherein the multiplexer transmits the multiplexed signals along a single optical fiber.

17. The receiving channel is further provided, and the receiving channel is A demultiplexer configured to separate an incident multiplexed signal including a third optical signal and a fourth optical signal, wherein the third optical signal is the first mode and the fourth optical signal is the second mode, A fifth optical path located between the demultiplexer and the photonics die, wherein the third optical signal is transmitted along the fifth optical path, A sixth optical path located between the demultiplexer and the photonics die, the sixth optical path through which the fourth optical signal is transmitted, The photonic patch according to any one of claims 12 to 16, wherein a second Faraday rotor is provided along the sixth optical path to convert the fourth optical signal from the second mode to the first mode.

18. The Faraday rotor is, Magnetic shell and, A photonic patch according to any one of claims 12 to 17, comprising an optically transparent plug that fills the magnetic shell.

19. The photonic patch according to any one of claims 12 to 17, wherein the Faraday rotor comprises a tube, a first polarizer, a second polarizer, and a magnetic shell between the first polarizer and the second polarizer.

20. Patch circuit board and A photonic die on the aforementioned patch substrate, A transmitting chain arranged on the patch substrate and configured to separate an incident light signal into a first optical signal and a second optical signal, wherein the second optical signal is converted from a first mode to a second mode by a first Faraday rotor, A photonic patch comprising a receiving chain arranged on the patch substrate and configured to separate a multiplexed signal into a third optical signal transmitted in a first mode and a fourth optical signal transmitted in a second mode, wherein a second Faraday rotor converts the fourth optical signal to the first mode before it reaches the photonic die.

21. The photonics patch according to claim 20, wherein the photonics die simply receives and / or transmits the optical signal transmitted in the first mode.

22. The photonic patch according to claim 20 or 21, wherein the first mode is the TE mode and the second mode is the TM mode.

23. Board and, The interposer on the aforementioned board, The interposer includes a patch located on the interposer, The aforementioned patch comprises a patch substrate, a photonics die, and a transmission chain. The aforementioned transmission chain is A splitter is placed on the patch substrate and separates the incident light signal into a first optical signal and a second optical signal, A Faraday rotator, which is arranged on the patch substrate and converts the second optical signal from the first mode to the second mode, An electronic system comprising a multiplexer arranged on the patch substrate, which combines the first optical signal with the second optical signal and transmits it along a single optical fiber.

24. The electronic system according to claim 23, wherein the patch substrate is stretched across the edge of the interposer.

25. The electronic system according to claim 23 or 24, wherein the patch further includes a receiving chain, which is arranged on the patch substrate and configured to separate the multiplexed signal into a third optical signal transmitted in a first mode and a fourth optical signal transmitted in a second mode, and a second Faraday rotor is arranged on the patch substrate and converts the fourth optical signal to the first mode before it reaches the photonics die.

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