Processing equipment, cleaning method, and cleaning plate

Abstract

To provide a processing device which can clean a holding surface for holding a work-piece without relying on a dedicated cleaning mechanism.SOLUTION: A processing device comprises: a holding unit including a chuck table which has a first holding surface for holding a work-piece; a processing unit; a cassette mounting table on which a cassette capable of accommodating a tabular plate for cleaning, on a first surface side of which an uneven structure is provided, is placed; a transportation unit including a holding pad; and a control unit which can control the holding unit and the transportation unit according to a program stored in a storage device. The control unit executes, according to the program, procedure for holding a second face of the plate for cleaning by the holding pad, a procedure for pressing the first surface of the plate for cleaning against the first holding surface of the chuck table in the state that the plate for cleaning is held by the holding pad, and a procedure for rotating the chuck table when pressing the first surface of the plate for cleaning against the first holding surface of the chuck table.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a processing apparatus configured to be able to clean a holding surface for holding a plate-shaped workpiece, a cleaning method used when cleaning the holding surface, and a cleaning plate.

Background Art

[0002] In a processing apparatus for processing a plate-shaped workpiece typified by a semiconductor wafer, for example, the workpiece is held by an instrument called a chuck table or the like. Thereby, the positional relationship between a tool or the like used in processing and the workpiece can be controlled with high precision, and precise processing of the workpiece is realized.

[0003] By the way, when chips or the like generated during processing accumulate on the holding surface of the chuck table that holds the workpiece, the workpiece cannot be properly held by the chuck table, and the accuracy of processing the workpiece decreases. Therefore, a processing apparatus provided with a dedicated cleaning mechanism specialized for cleaning the holding surface of the chuck table has been proposed (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when a dedicated cleaning mechanism as described above is provided in a processing apparatus, due to this cleaning mechanism, the processing apparatus becomes large-sized. Further, along with the cost of the cleaning mechanism, the price of the processing apparatus also rises significantly.

[0006] Therefore, the object of the present invention is to provide a processing apparatus and cleaning method that can clean the holding surface for holding a workpiece without relying on a dedicated cleaning mechanism, as well as a cleaning plate used therein. [Means for solving the problem]

[0007] According to one aspect of the present invention, the present invention includes a holding unit having a first holding surface for holding a plate-shaped workpiece and a chuck table that can rotate around a rotation axis intersecting the first holding surface; a processing unit capable of processing the workpiece held by the holding unit; a cassette mounting base on which a plate-shaped cleaning plate having an uneven structure on the first surface side and a cassette capable of housing the workpiece are placed; a transport unit having a holding pad having a second holding surface for holding the workpiece and capable of transporting the workpiece housed in the cassette to the chuck table; and a processing device and a storage device, wherein the holding is carried out according to a program stored in the storage device. The system comprises a unit and a control unit capable of controlling the transport unit, wherein the control unit, according to the program, carries out the cleaning plate contained in the cassette using the transport unit and holds the second surface of the cleaning plate opposite to the first surface with the second holding surface of the holding pad; while the second surface of the cleaning plate is held by the second holding surface of the holding pad, the transport unit presses the first surface of the cleaning plate against the first holding surface of the chuck table; and when the transport unit presses the first surface of the cleaning plate against the first holding surface of the chuck table, the chuck table Around the axis of rotation A processing apparatus is provided that performs a rotation procedure and cleans the first holding surface of the chuck table.

[0008] According to another aspect of the present invention, the present invention includes a holding unit having a first holding surface for holding a plate-shaped workpiece and a chuck table that can rotate around a rotation axis intersecting the first holding surface; a processing unit capable of processing the workpiece held in the holding unit; a cassette mounting base on which a plate-shaped cleaning plate having an uneven structure on the first surface side and a cassette capable of housing the workpiece are placed; a transport unit having a holding pad having a second holding surface for holding the workpiece and capable of transporting the workpiece housed in the cassette to the chuck table; and a processing device and a storage device, which control the holding unit and the transport unit according to a program stored in the storage device. A processing apparatus is provided which includes a control unit capable of performing the following steps to clean the second holding surface of a retaining pad: the control unit, in accordance with the program, transports the cleaning plate housed in the cassette using the transport unit and holds the second surface of the cleaning plate opposite to the first surface with the first holding surface of the chuck table; while the second surface of the cleaning plate is held by the first holding surface of the chuck table, the transport unit presses the second holding surface of the retaining pad against the first surface of the cleaning plate; and when the second holding surface of the retaining pad is pressed against the first surface of the cleaning plate, the chuck table is rotated.

[0009] For example, the chuck table holds the workpiece when the workpiece is being processed by the processing unit. Alternatively, for example, the processing apparatus further includes a cleaning unit capable of cleaning the workpiece, and the chuck table holds the workpiece when the workpiece is being cleaned by the cleaning unit.

[0010] According to yet another aspect of the present invention, the processing apparatus comprises a holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and being rotatable around a rotation axis intersecting the first holding surface; a processing unit capable of processing the workpiece held in the holding unit; a cassette mounting base on which a plate-shaped cleaning plate having an uneven structure on the first surface side and a cassette capable of housing the workpiece are placed; and a transport unit including a holding pad having a second holding surface for holding the workpiece and capable of transporting the workpiece housed in the cassette to the chuck table. A cleaning method used when cleaning the first holding surface of a chuck table, wherein the cleaning plate contained in the cassette is transported out by the transport unit, the second surface of the cleaning plate opposite to the first surface is held by the second holding surface of the holding pad, and with the second surface of the cleaning plate held by the second holding surface of the holding pad, the first surface of the cleaning plate is pressed against the first holding surface of the chuck table by the transport unit, and when the first surface of the cleaning plate is pressed against the first holding surface of the chuck table by the transport unit, the chuck table is Around the axis of rotation A cleaning method is provided for cleaning the first holding surface of the chuck table by rotating it.

[0011] According to yet another aspect of the present invention, the present invention relates to a processing apparatus comprising: a holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and being rotatable around a rotation axis intersecting the first holding surface; a processing unit capable of processing the workpiece held by the holding unit; a cassette mounting base on which a plate-shaped cleaning plate having an uneven structure on the first surface side and a cassette capable of containing the workpiece are placed; and a transport unit including a holding pad having a second holding surface for holding the workpiece and being capable of transporting the workpiece contained in the cassette to the chuck table, wherein the second holding surface of the holding pad of the processing apparatus is cleaned. A cleaning method is provided for use in the process of cleaning a cleaning plate, wherein the cleaning plate housed in the cassette is transported out by the transport unit, the second surface of the cleaning plate opposite to the first surface is held by the first holding surface of the chuck table, and while the second surface of the cleaning plate is held by the first holding surface of the chuck table, the second holding surface of the holding pad is pressed against the first surface of the cleaning plate by the transport unit, and the second holding surface of the holding pad is cleaned by rotating the chuck table when the second holding surface of the holding pad is pressed against the first surface of the cleaning plate.

[0012] For example, when processing the workpiece with the processing unit, the workpiece is held by the chuck table. Alternatively, for example, the processing apparatus further includes a cleaning unit capable of cleaning the workpiece, and when cleaning the workpiece with the cleaning unit, the workpiece is held by the chuck table. [Effects of the Invention]

[0015] The processing apparatus and cleaning method according to each aspect of the present invention use a holding unit including a chuck table, a transport unit including a holding pad, and a cleaning plate having an uneven structure on the first side to clean the first holding surface of the chuck table or the second holding surface of the holding pad. Thus, the holding surface for holding the workpiece can be cleaned without relying on a dedicated cleaning mechanism. [Brief explanation of the drawing]

[0016] [Figure 1] FIG. 1 is a perspective view schematically showing a grinding apparatus. [Figure 2] FIG. 2 is a perspective view schematically showing a cleaning plate. [Figure 3] FIG. 3 is a functional block diagram schematically showing a functional structure of a control unit. [Figure 4] FIG. 4 is a flowchart showing a flow of a process related to cleaning. [Figure 5] FIG. 5 is a cross-sectional view schematically showing a state in which a first holding pad holding a cleaning plate is disposed above a rotating chuck table in a first cleaning mode. [Figure 6] FIG. 6 is a cross-sectional view schematically showing a state in which a first surface of a cleaning plate is pressed against an upper surface of a rotating chuck table in a first cleaning mode. [Figure 7] FIG. 7 is a cross-sectional view schematically showing a state in which a second holding pad holding a cleaning plate is disposed above a rotating chuck table in a second cleaning mode. [Figure 8] FIG. 8 is a cross-sectional view schematically showing a state in which a first surface of a cleaning plate is pressed against an upper surface of a rotating chuck table in a second cleaning mode. [Figure 9] FIG. 9 is a cross-sectional view schematically showing a state in which a first holding pad is disposed above a cleaning plate rotating together with a chuck table in a third cleaning mode. [Figure 10] FIG. 10 is a cross-sectional view schematically showing a state in which a lower surface of a first holding pad is pressed against a first surface of a cleaning plate rotating together with a chuck table in a third cleaning mode. [Figure 11] FIG. 11 is a perspective view schematically showing a cleaning plate according to a modification.

BEST MODE FOR CARRYING OUT THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a grinding device (processing device) 2 of the present embodiment. In FIG. 1, some elements constituting the grinding device 2 are represented by functional blocks. Also, the X-axis direction (front-rear direction), Y-axis direction (left-right direction), and Z-axis direction (vertical direction) used in the following description are perpendicular to each other.

[0018] As shown in FIG. 1, the grinding device 2 includes a base 4 that supports various elements constituting the grinding device 2. On the front end side of the upper surface of the base 4, a concave housing portion 4a having an upper end opening to the upper surface of the base 4 is provided, and a robot arm 6 used for transporting the plate-like workpiece 11 or the like is housed in the housing portion 4a. Note that the robot arm 6 can not only transport the workpiece 11 and the like, but also invert the workpiece 11 up and down.

[0019] The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. That is, the workpiece 11 has a circular surface 11a and a circular back surface 11b opposite to the surface 11a. The surface 11a side of the workpiece 11 is divided into a plurality of small regions by a plurality of streets (division planned lines) intersecting each other, and devices such as integrated circuits (ICs) are formed in each small region.

[0020] The grinding device 2 of the present embodiment is used, for example, when grinding the back surface 11b side of the workpiece 11. When grinding the back surface 11b side of the workpiece 11, a protective member represented by a protective tape made of a material such as resin can be attached to the surface 11a side of the workpiece 11. By attaching the protective member to the surface 11a side of the workpiece 11, the impact applied to the surface 11a side during the grinding process of the back surface 11b side is alleviated, and the devices and the like of the workpiece 11 are protected.

[0021] Furthermore, in this embodiment, a disc-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited to this embodiment. For example, substrates made of other semiconductors, ceramics, resins, metals, etc. can be used as the workpiece 11. Similarly, the type, quantity, shape, structure, size, arrangement, etc. of devices are not limited to the above embodiment. Devices do not need to be formed on the workpiece 11.

[0022] As shown in Figure 1, cassette tables 10a and 10b are provided in front of the storage section 4a, on which cassettes 8a and 8b capable of accommodating multiple workpieces 11 are placed. A position adjustment mechanism 12 for adjusting the position of the workpieces 11 is provided diagonally behind the storage section 4a. The position adjustment mechanism 12 includes a disc-shaped position adjustment table and a plurality of pins arranged around the position adjustment table.

[0023] By moving multiple pins along the radial direction of the position adjustment table, the center of the workpiece 11, which is unloaded from the cassette 8a by the robot arm 6 and placed on the position adjustment table, can be aligned to a predetermined position in the X-axis and Y-axis directions. The workpiece 11 is placed on the position adjustment table with its grinding surface (for example, the back surface 11b) facing upwards.

[0024] In this embodiment, a plate-shaped cleaning plate used for cleaning any holding surface for holding the workpieces 11 is housed in cassettes 8a and 8b along with a plurality of workpieces 11. In other words, cassettes 8a and 8b used in this embodiment are configured to accommodate the cleaning plate. Figure 2 is a schematic perspective view showing the cleaning plate 1.

[0025] The cleaning plate 1 is typically a disc-shaped wafer made of a semiconductor material such as silicon, and is about the same size as or larger than the workpiece 11. Specifically, the cleaning plate 1 has a circular first surface 1a, a circular second surface 1b opposite to the first surface 1a, and an outer peripheral surface 1c connecting the first surface 1a and the second surface 1b.

[0026] On the first surface 1a of the cleaning plate 1, multiple linear grooves 1d are formed so as to intersect with each other. Furthermore, both ends of each groove 1d are open to the outer surface 1c. These multiple grooves 1d create an uneven surface suitable for cleaning the retaining surface. In other words, the first surface 1a of the cleaning plate 1 is provided with an uneven surface suitable for cleaning the retaining surface. On the other hand, the second surface 1b of the cleaning plate 1 is generally flat and does not have an uneven surface.

[0027] In this embodiment, a disc-shaped wafer made of a semiconductor material such as silicon is used as the cleaning plate 1, but the material, shape, structure, size, etc. of the cleaning plate 1 are not limited to this embodiment. For example, a substrate made of other semiconductors, ceramics, resins, metals, etc. may be used as the cleaning plate 1. The cleaning plate 1 only needs to have a first surface 1a that is larger than the holding surface to be cleaned. In addition, at least the first surface 1a side should have an uneven structure.

[0028] As shown in Figure 1, a first transport arm 14 is provided on the side of the position adjustment mechanism 12, which is used to hold the workpiece 11 and the like and transport it to the rear. A motor (not shown) and an air cylinder are connected to the base end of the first transport arm 14. Therefore, the tip of the first transport arm 14 moves (rotates) around a rotation axis that passes through the base end of the first transport arm 14 and is roughly parallel to the Z-axis direction, powered by the motor, and moves up and down (rises and falls) powered by the air cylinder.

[0029] The tip of the first transport arm 14 is provided with a first holding pad 16 that can suction and hold the upper surface (grinding surface) of the workpiece 11. The first holding pad 16 includes, for example, a disc-shaped frame 18 (see Figure 5, etc.). The lower part of the frame 18 is provided with a recess 18a (see Figure 5, etc.) whose lower end opens in a circular shape to the lower surface of the frame 18.

[0030] A retaining plate 20 (see Figure 5, etc.), which is made of a porous, disc-shaped material such as ceramics, is fixed to the recess 18a. The circular lower surface (second retaining surface) 20a (see Figure 5, etc.) of the retaining plate 20 functions as a retaining surface for holding the workpiece 11, etc. The upper surface of the retaining plate 20 is connected to a suction source (not shown), such as an ejector, via a flow path (not shown) provided inside the frame 18 or a valve (not shown) located outside the frame 18.

[0031] Therefore, when the workpiece 11 or the like is in contact with the lower surface 20a of the holding plate 20, the valve is opened and negative pressure from the suction source is applied, causing the workpiece 11 or the like to be sucked in by the first holding pad 16. In other words, the workpiece 11 or the like is held by the lower surface 20a of the first holding pad 16. For example, the workpiece 11 whose position has been adjusted by the position adjustment mechanism 12 is held by the first holding pad 16, and by rotating the first holding pad 16 with the first transport arm 14, the workpiece 11 is transported backward.

[0032] A turntable 22 is provided behind the first transport arm 14 and the first holding pad 16. The turntable 22 is connected to a motor (not shown) or the like, and rotates around a rotation axis that is generally parallel to the Z-axis direction by the power of this motor or the like. Three sets of disc-shaped chuck tables (machining chuck tables) 24 are provided on the upper surface of the turntable 22 at intervals of generally equal angles along the circumferential direction of the turntable 22. However, the number of chuck tables 24 is not limited to this configuration.

[0033] Each chuck table 24 includes a disc-shaped frame 26 made of a material such as ceramics. The upper part of the frame 26 is provided with a recess 26a (see Figure 5, etc.) whose upper end opens in a circular shape to the upper surface of the frame 26. A retaining plate 28, which is made of a porous disc-shaped material such as ceramics, is fixed to this recess 26a.

[0034] The upper surface (first holding surface) 28a of the holding plate 28 is configured to have a shape corresponding to, for example, the side surface of a cone, and functions as a holding surface for holding the workpiece 11 or the like. The difference in height (height difference) between the center of the upper surface 28a of the holding plate 28, which corresponds to the apex of the cone, and the outer edge of the upper surface 28a of the holding plate 28 is approximately 10 μm to 30 μm.

[0035] The lower surface of the holding plate 28 is connected to a suction source (not shown), such as an ejector, via a flow path 26b (see Figure 5, etc.) provided inside the frame 26, or via a valve (not shown) located outside the frame 26. Therefore, when the workpiece 11 (protective member, etc.) is in contact with the upper surface 28a of the holding plate 28, the valve is opened and negative pressure from the suction source acts, causing the workpiece 11 to be sucked in by the chuck table 24. In other words, the workpiece 11 is held by the upper surface 28a of the chuck table 24.

[0036] A motor (not shown) or the like is connected to the lower part of the frame 26 of each chuck table 24, and each chuck table 24 rotates around a rotation axis that is roughly parallel to the Z-axis direction, or slightly inclined with respect to the Z-axis direction, using the power of this motor or the like. In other words, each chuck table 24 is configured to rotate around a rotation axis that intersects its upper surface 28a.

[0037] For example, as the turntable 22 rotates in the direction of the arrow in Figure 1 and in the opposite direction of the arrow, each chuck table 24 moves along the circumferential direction of the turntable 22. Specifically, the turntable 22 moves the chuck tables 24 in the following order: the loading / unloading area adjacent to the first transport arm 14 and the first holding pad 16, the rough grinding area behind the loading / unloading area, the finish grinding area to the side of the rough grinding area, and the loading / unloading area. The workpiece 11 is transported by the first transport arm 14 and the first holding pad 16 from the position adjustment table of the position adjustment mechanism 12 to the chuck table 24 located in the loading / unloading area.

[0038] As shown in Figure 1, columnar support structures 30 are provided behind the rough grinding area and the finish grinding area (i.e., behind the turntable 22). A Z-axis moving mechanism 32 is provided on the front side of each support structure 30. Each Z-axis moving mechanism 32 is equipped with a pair of guide rails 34 that are generally parallel to the Z-axis direction, and a moving plate 36 is attached to this pair of guide rails 34 in a manner that allows it to slide.

[0039] Each movable plate 36 is provided with a nut portion (not shown) that constitutes a ball screw on its rear (back) side. A screw shaft 38, which is generally parallel to the guide rail 34, is connected to this nut portion in a manner that allows it to rotate. A motor 40 or the like is connected to one end of the screw shaft 38. By rotating the screw shaft 38 with the motor 40 or the like, the movable plate 36 moves along the guide rail 34 (in the Z-axis direction).

[0040] A fixing device 42 is provided on the front (surface) of each movable plate 36. Each fixing device 42 supports a grinding unit (processing unit) 44 capable of grinding a workpiece 11 held by a chuck table 24 in a rough grinding area or a finish grinding area. Each grinding unit 44 includes a spindle housing 46 fixed to the fixing device 42. Each spindle housing 46 houses a spindle 48 having a rotation axis parallel to the Z-axis direction, or a rotation axis slightly inclined with respect to the Z-axis direction, in such a manner that it can rotate around its axis.

[0041] The lower end of each spindle 48 is exposed from the lower end surface of the spindle housing 46, and a disc-shaped mount 50 is fixed to the lower end of each spindle 48. For example, the outer edge of each mount 50 is provided with a plurality of holes (not shown) that penetrate the mount 50 in the direction of its thickness, and bolts 52 or the like are inserted into each hole.

[0042] A grinding wheel 54 for rough grinding is attached to the underside of the mount 50 of the grinding unit 44 on the rough grinding area side with bolts 52. In other words, the grinding wheel 54 for rough grinding is mounted on the spindle 48 on the rough grinding area side. A motor (not shown) or the like, connected to the upper end of the spindle 48, is housed in the spindle housing 46 of the grinding unit 44 on the rough grinding area side. The power from this motor or the like rotates the grinding wheel 54 for rough grinding together with the spindle 48.

[0043] On the other hand, a grinding wheel 54 for finishing grinding is attached to the lower surface of the mount 50 of the grinding unit 44 on the finishing grinding area side with bolts 52. In other words, the grinding wheel 54 for finishing grinding is mounted on the spindle 48 on the finishing grinding area side. In addition, a motor (not shown) or the like, which is connected to the upper end of the spindle 48, is housed in the spindle housing 46 of the grinding unit 44 on the finishing grinding area side. Power from this motor or the like rotates the grinding wheel 54 for finishing grinding together with the spindle 48.

[0044] Each grinding wheel 54 includes an annular wheel base formed from a metal such as stainless steel or aluminum. Multiple grinding wheels, each in which abrasive grains such as diamond are dispersed in a binder such as vitrified or resinoid, are fixed to the lower surface of the wheel base along the circumferential direction of the wheel base.

[0045] For example, the average particle size of the abrasive grains contained in the grinding wheel 54 for finish grinding is smaller than the average particle size of the abrasive grains contained in the grinding wheel 54 for rough grinding. This allows for the creation of a grinding wheel 54 suitable for rough grinding and a grinding wheel 54 suitable for finish grinding. The specific size of the abrasive grains is appropriately set according to the required quality of the workpiece 11 after grinding.

[0046] Next to each grinding unit 44, a nozzle 56 is provided to supply a liquid (grinding fluid) such as pure water to the part where the workpiece 11 and the grinding wheel come into contact. Alternatively, a liquid supply port used for supplying liquid may be provided on the grinding wheel 54 or the like, either in place of or in conjunction with the nozzle 56.

[0047] The workpiece 11 held on the chuck table 24 in the rough grinding area has its upper surface ground by the grinding unit 44 on the rough grinding area side as described above. Similarly, the workpiece 11 held on the chuck table 24 in the finish grinding area has its upper surface ground by the grinding unit 44 on the finish grinding area side as described above.

[0048] In other words, the chuck table 24 holding the workpiece 11 moves in the order of loading / unloading area, rough grinding area, and finish grinding area, so that rough grinding and finish grinding of the workpiece 11 are performed continuously. When the finish grinding of the workpiece 11 is completed, the chuck table 24 in the finish grinding area is positioned again in the loading / unloading area.

[0049] A second transport arm 58 is provided in front of the loading / unloading area and to the side of the first transport arm 14 and the first holding pad 16, for holding the workpiece 11 after grinding and transporting it forward. A motor (not shown) and an air cylinder are connected to the base end of the second transport arm 58. As a result, the tip of the second transport arm 58 moves (rotates) around a rotation axis that passes through the base end of the second transport arm 58 and is generally parallel to the Z-axis direction, powered by the motor, and moves up and down (rises and falls) powered by the air cylinder.

[0050] The tip of the second transport arm 58 is provided with a second holding pad 60 that can suction and hold the upper surface (grinding surface) of the workpiece 11. The second holding pad 60 includes, for example, a disc-shaped frame 62 (see Figure 7, etc.). The lower part of the frame 62 is provided with a recess 62a (see Figure 7, etc.) whose lower end opens in a circular shape to the lower surface of the frame 62.

[0051] A retaining plate 64 (see Figure 7, etc.), which is made of a porous, disc-shaped material such as ceramics, is fixed to the recess 62a. The circular lower surface (second retaining surface) 64a (see Figure 7, etc.) of the retaining plate 64 functions as a retaining surface for holding the workpiece 11, etc. The upper surface of the retaining plate 64 is connected to a suction source (not shown), such as an ejector, via a flow path (not shown) provided inside the frame 62 or a valve (not shown) located outside the frame 62.

[0052] Therefore, when the workpiece 11 or the like is in contact with the lower surface 64a of the holding plate 64, the valve is opened and negative pressure from the suction source acts, causing the workpiece 11 or the like to be sucked in by the second holding pad 60. In other words, the workpiece 11 or the like is held by the lower surface 64a of the second holding pad 60. For example, the workpiece 11 after grinding is held by the second holding pad 60, and by rotating the second holding pad 60 with the second transport arm 58, the workpiece 11 after grinding is transported forward from the chuck table 24 in the loading / unloading area.

[0053] A cleaning unit 66 is provided to the side of the second transport arm 58 and the second holding pad 60, which is used to clean the workpiece 11 after grinding has been removed from the chuck table 24 in the loading / unloading area. The cleaning unit 66 includes, for example, a cleaning nozzle (not shown) that can spray a cleaning fluid. Below this cleaning nozzle, a chuck table (cleaning chuck table) 68 is positioned to hold the workpiece 11 when it is cleaned by the cleaning unit 66 (cleaning nozzle).

[0054] The structure of the chuck table 68 is similar to that of the chuck table 24 that holds the workpiece 11 when grinding the workpiece 11 with the grinding unit 44 described above. However, the diameter of the chuck table 68 in this embodiment is smaller than, for example, the diameter of the chuck table 24 described above. Also, the upper surface (first holding surface) 68a of the chuck table 68 is generally flat, unlike the upper surface 28a of the chuck table 24.

[0055] A motor (not shown) is connected to the lower part of the chuck table 68, and the chuck table 68 rotates around a rotation axis that is roughly parallel to the Z-axis direction by the power of this motor. In other words, the chuck table 68 is configured to rotate around a rotation axis that intersects its upper surface 68a. The workpiece 11 is transported from the chuck table 24 located in the loading / unloading area to the chuck table 68 by the second transport arm 58 and the second holding pad 60.

[0056] The workpiece 11 is cleaned by rotating the chuck table 68 and spraying a cleaning fluid from a cleaning nozzle onto the workpiece 11 held on the chuck table 68. The cleaning fluid sprayed from the cleaning nozzle is typically a mixed fluid (two fluids) of water and air. Of course, water or other fluids not mixed with air may also be used as the cleaning fluid. After cleaning, the workpiece 11 is transported by the robot arm 6 and stored, for example, in a cassette 8b.

[0057] A control unit 70 is connected to each element of the grinding apparatus 2. This control unit 70 is composed of a computer, for example, a processing unit 72 and a storage device 74, and controls the operation of each element of the grinding apparatus 2 described above so that the workpiece 11 is properly ground.

[0058] The processing unit 72 is typically a CPU (Central Processing Unit) and performs various processes necessary to control the elements described above. The storage device 74 includes, for example, a main memory such as DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive or flash memory. The functions of this control unit 70 are realized, for example, by the processing unit 72 operating according to a program stored in the storage device 74.

[0059] An input device 76 is connected to the control unit 70. The input device 76 is, for example, a touch panel, which inputs commands from the operator to the control unit 70. This touch panel also serves as a display device that shows information output from the control unit 70. Note that a keyboard or mouse may also be used as the input device 76.

[0060] The control unit 70 of this embodiment is configured to clean the upper surface 28a of the chuck table 24, the upper surface 68a of the chuck table 68, the lower surface 20a of the first retaining pad 16, or the lower surface 64a of the second retaining pad 60 using the plate-shaped cleaning plate 1 housed in the cassettes 8a and 8b described above.

[0061] More specifically, for example, a portion of the storage device 74, which is a non-temporary recording medium that can be read by a computer or the like, stores a program that causes the processing device 72 to execute the procedures necessary for cleaning. The processing device 72 then carries out various procedures necessary for cleaning according to this program.

[0062] Figure 3 is a functional block diagram schematically showing the functional structure of the control unit 70 realized by the program described above, and Figure 4 is a flowchart showing the flow of the cleaning process. For the sake of explanation, Figure 3 also shows elements such as the input device 76, holding unit 78, and transport unit 80 connected to the control unit 70.

[0063] As shown in Figure 3, the control unit 70 includes an input determination unit 70a that determines input from the input device 76. When the input determination unit 70a receives a command from the input device 76 to start one of the following modes, for example, a first cleaning mode in which a series of steps are performed to clean the upper surface 28a of any chuck table 24, a second cleaning mode in which a series of steps are performed to clean the upper surface 68a of the chuck table 68, a third cleaning mode in which a series of steps are performed to clean the lower surface 20a of the first holding pad 16, or a fourth cleaning mode in which a series of steps are performed to clean the lower surface 64a of the second holding pad 60, it notifies the holding unit control unit 70b and the transport unit control unit 70c of this fact.

[0064] When the holding unit control unit 70b and the transport unit control unit 70c receive a notification from the input determination unit 70a, they respectively use the holding unit 78 or the transport unit 80 to perform a series of procedures necessary for one of the first cleaning mode, second cleaning mode, third cleaning mode, or fourth cleaning mode specified in the notification.

[0065] The holding unit 78 includes the turntable 22, chuck table 24, chuck table 68, and associated motors, valves, and other elements. The transport unit 80 includes the robot arm 6, first transport arm 14, first holding pad 16, second transport arm 58, second holding pad 60, and associated motors, air cylinders, valves, and other elements.

[0066] First, a first cleaning mode, or first embodiment of the cleaning method, in which a series of steps are performed to clean the upper surface 28a of any chuck table 24, will be described. When the input determination unit 70a receives a command from the input device 76 to start the first cleaning mode (YES in step ST11), for example, it notifies the holding unit control unit 70b and the transport unit control unit 70c that the first cleaning mode has started.

[0067] Upon receiving notification from the input determination unit 70a that the first cleaning mode has started, the transport unit control unit 70c uses the transport unit 80 to unload the cleaning plate 1 housed in the cassette 8a (or cassette 8b). Specifically, the transport unit control unit 70c, for example, uses the robot arm 6 to unload the cleaning plate 1 from the cassette 8a (or cassette 8b) and place it on the position adjustment table of the position adjustment mechanism 12.

[0068] In the first cleaning mode, the transport unit control unit 70c uses the robot arm 6 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12 so that the second surface 1b faces upward. Subsequently, the transport unit control unit 70c holds the second surface 1b of the cleaning plate 1, which is placed on the position adjustment table of the position adjustment mechanism 12, with the lower surface 20a of the first holding pad 16 (step ST12).

[0069] The holding unit control unit 70b rotates the turntable 22 as needed to position the chuck table 24 to be cleaned in the loading / unloading area. The transport unit control unit 70c also rotates the first holding pad 16 to position it above the chuck table 24 located in the loading / unloading area. The holding unit control unit 70b then rotates the chuck table 24 located in the loading / unloading area (step ST13). Figure 5 is a schematic cross-sectional view showing the state in which the first holding pad 16 holding the cleaning plate 1 is positioned above the rotating chuck table 24.

[0070] Subsequently, the transport unit control unit 70c lowers the first holding pad 16 to press the first surface 1a of the cleaning plate 1 against the upper surface 28a of the chuck table 24 (step ST14). Figure 6 is a schematic cross-sectional view showing the state in which the first surface 1a of the cleaning plate 1 is pressed against the upper surface 28a of the rotating chuck table 24.

[0071] In this way, when the first surface 1a of the cleaning plate 1 is pressed against the upper surface 28a of the rotating chuck table 24, any debris adhering to the upper surface 28a of the chuck table 24 is scraped off by the uneven structure provided on the first surface 1a of the cleaning plate 1, thereby removing it from the upper surface 28a. In other words, the upper surface 28a of the chuck table 24 is cleaned.

[0072] Once cleaning of the upper surface 28a of the chuck table 24 is complete, for example, the holding unit control unit 70b stops the rotation of the chuck table 24. Then, the transport unit control unit 70c places the cleaning plate 1, which is held by the first holding pad 16, onto the chuck table 24. The transport unit control unit 70c also holds the cleaning plate 1, which is now on the chuck table 24, with the second holding pad 60.

[0073] Subsequently, the transport unit control unit 70c rotates the second holding pad 60 to position it above the chuck table 68, and places the cleaning plate 1, which is being held by the second holding pad 60, onto the chuck table 68. Then, the transport unit control unit 70c uses the robot arm 6 to transport the cleaning plate 1, which is on the chuck table 68, into the cassette 8a (or cassette 8b).

[0074] In the first cleaning mode, the holding unit control unit 70b rotates the chuck table 24, and then the transport unit control unit 70c presses the first surface 1a of the cleaning plate 1 against the upper surface 28a of the chuck table 24. However, this order can be reversed as long as the load on the rotation of the chuck table 24 is not excessive. In other words, the transport unit control unit 70c may press the first surface 1a of the cleaning plate 1 against the upper surface 28a of the chuck table 24, and then the holding unit control unit 70b may rotate the chuck table 24.

[0075] Furthermore, in this first cleaning mode, once cleaning of the upper surface 28a of the chuck table 24 is complete, the cleaning plate 1 is loaded into the cassette 8a (or cassette 8b) via the chuck table 68. However, the cleaning plate 1 may also be loaded into the cassette 8a (or cassette 8b) via the position adjustment mechanism 12 without going through the chuck table 68.

[0076] In this case, for example, the transport unit control unit 70c rotates the first holding pad 16 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12. This allows the transport unit control unit 70c to use the robot arm 6 to transport the cleaning plate 1, which is on the position adjustment table of the position adjustment mechanism 12, into the cassette 8a (or cassette 8b).

[0077] Next, a second cleaning mode, or second embodiment of the cleaning method, will be described, in which a series of steps for cleaning the upper surface 68a of the chuck table 68 are performed. When the input determination unit 70a receives a command from the input device 76 to start the second cleaning mode (YES in step ST11), for example, it notifies the holding unit control unit 70b and the transport unit control unit 70c that the second cleaning mode has started.

[0078] When the transport unit control unit 70c is notified by the input determination unit 70a that the second cleaning mode has started, it uses the transport unit 80 to unload the cleaning plate 1 housed in the cassette 8a (or cassette 8b). Specifically, the transport unit control unit 70c, for example, uses the robot arm 6 to unload the cleaning plate 1 from the cassette 8a (or cassette 8b) and places it on the position adjustment table of the position adjustment mechanism 12.

[0079] In the second cleaning mode, the transport unit control unit 70c uses the robot arm 6 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12 so that the second surface 1b faces upward. Subsequently, the transport unit control unit 70c holds the second surface 1b of the cleaning plate 1, which is placed on the position adjustment table of the position adjustment mechanism 12, with the lower surface 20a of the first holding pad 16.

[0080] Next, the transport unit control unit 70c rotates the first holding pad 16 to place the cleaning plate 1 on the chuck table 24 located in the loading / unloading area. The transport unit control unit 70c also holds the second surface 1b of the cleaning plate 1, which is placed on the chuck table 24, with the lower surface 64a of the second holding pad 60 (step ST12).

[0081] Furthermore, the transport unit control unit 70c rotates the second holding pad 60 to position it above the chuck table 68. Then, the holding unit control unit 70b rotates the chuck table 68 (step ST13). Figure 7 is a schematic cross-sectional view showing the state in which the second holding pad 60 holding the cleaning plate 1 is positioned above the rotating chuck table 68.

[0082] Subsequently, the transport unit control unit 70c lowers the second holding pad 60 to press the first surface 1a of the cleaning plate 1 against the upper surface 68a of the chuck table 68 (step ST14). Figure 8 is a schematic cross-sectional view showing the state in which the first surface 1a of the cleaning plate 1 is pressed against the upper surface 68a of the rotating chuck table 68.

[0083] In this way, when the first surface 1a of the cleaning plate 1 is pressed against the upper surface 68a of the rotating chuck table 68, any debris adhering to the upper surface 68a of the chuck table 68 is removed from the upper surface 68a by being scraped off by the uneven structure provided on the first surface 1a of the cleaning plate 1. In other words, the upper surface 68a of the chuck table 68 is cleaned.

[0084] Once cleaning of the upper surface 68a of the chuck table 68 is complete, for example, the holding unit control unit 70b stops the rotation of the chuck table 68, and the transport unit control unit 70c places the cleaning plate 1, which is held by the second holding pad 60, onto the chuck table 68. Then, the transport unit control unit 70c uses the robot arm 6 to transport the cleaning plate 1, which is on the chuck table 68, into the cassette 8a (or cassette 8b).

[0085] In the second cleaning mode, the holding unit control unit 70b rotates the chuck table 68, and then the transport unit control unit 70c presses the first surface 1a of the cleaning plate 1 against the upper surface 68a of the chuck table 68. However, this order can be reversed as long as the load on the rotation of the chuck table 68 is not excessive. In other words, the transport unit control unit 70c may press the first surface 1a of the cleaning plate 1 against the upper surface 68a of the chuck table 68, and then the holding unit control unit 70b may rotate the chuck table 68.

[0086] Furthermore, in this second cleaning mode, once cleaning of the upper surface 68a of the chuck table 68 is complete, the cleaning plate 1 is loaded into the cassette 8a (or cassette 8b) via the chuck table 68. However, the cleaning plate 1 may also be loaded into the cassette 8a (or cassette 8b) via the position adjustment mechanism 12 without going through the chuck table 68.

[0087] Next, a third cleaning mode, or third aspect of the cleaning method, will be described, in which a series of steps for cleaning the lower surface 20a of the first retaining pad 16 are performed. When the input determination unit 70a receives a command from the input device 76 to start the third cleaning mode (YES in step ST11), for example, it notifies the retaining unit control unit 70b and the transport unit control unit 70c that the third cleaning mode has started.

[0088] When the transport unit control unit 70c is notified by the input determination unit 70a that the third cleaning mode has started, it uses the transport unit 80 to unload the cleaning plate 1 housed in the cassette 8a (or cassette 8b). Specifically, the transport unit control unit 70c, for example, uses the robot arm 6 to unload the cleaning plate 1 from the cassette 8a (or cassette 8b) and places it on the position adjustment table of the position adjustment mechanism 12.

[0089] In the third cleaning mode, the transport unit control unit 70c uses the robot arm 6 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12 so that the first surface 1a faces upward. Subsequently, the transport unit control unit 70c holds the first surface 1a of the cleaning plate 1, which is placed on the position adjustment table of the position adjustment mechanism 12, with the lower surface 20a of the first holding pad 16.

[0090] Next, the transport unit control unit 70c rotates the first holding pad 16 to place the cleaning plate 1 on the chuck table 24 located in the loading / unloading area. The holding unit control unit 70b then holds the second surface 1b of the cleaning plate 1 with the upper surface 28a of the chuck table 24 (step ST12).

[0091] Then, the holding unit control unit 70b rotates the chuck table 24 while it is holding the cleaning plate 1 (step ST13). Figure 9 is a schematic cross-sectional view showing the state in which the first holding pad 16 is positioned above the cleaning plate 1 which is rotating together with the chuck table 24.

[0092] Subsequently, the transport unit control unit 70c lowers the first holding pad 16 and presses the lower surface 20a of the first holding pad 16 against the first surface 1a of the cleaning plate 1 (step ST14). In other words, the first surface 1a of the cleaning plate 1 is pressed against the lower surface 20a of the first holding pad 16. Figure 10 is a schematic cross-sectional view showing the state in which the lower surface 20a of the first holding pad 16 is pressed against the first surface 1a of the cleaning plate 1, which is rotating together with the chuck table 24.

[0093] In this way, when the lower surface 20a of the first retaining pad 16 is pressed against the first surface 1a of the rotating cleaning plate 1, any debris adhering to the lower surface 20a of the first retaining pad 16 is scraped off by the uneven structure provided on the first surface 1a side of the cleaning plate 1, thereby removing it from the lower surface 20a. In other words, the lower surface 20a of the first retaining pad 16 is cleaned.

[0094] Once cleaning of the lower surface 20a of the first holding pad 16 is complete, for example, the holding unit control unit 70b stops the rotation of the chuck table 24 and releases the chuck table 24 from holding the cleaning plate 1. Next, the transport unit control unit 70c holds the cleaning plate 1, which is still on the chuck table 24, with the second holding pad 60.

[0095] Subsequently, the transport unit control unit 70c rotates the second holding pad 60 to position it above the chuck table 68, and places the cleaning plate 1, which is being held by the second holding pad 60, onto the chuck table 68. Then, the transport unit control unit 70c uses the robot arm 6 to transport the cleaning plate 1, which is on the chuck table 68, into the cassette 8a (or cassette 8b).

[0096] In the third cleaning mode, the holding unit control unit 70b rotates the chuck table 24 together with the cleaning plate 1, and then the transport unit control unit 70c presses the lower surface 20a of the first holding pad 16 against the first surface 1a of the cleaning plate 1. However, this order can be reversed as long as the load on the rotation of the chuck table 24 is not excessive. In other words, the transport unit control unit 70c may press the lower surface 20a of the first holding pad 16 against the first surface 1a of the cleaning plate 1, and then the holding unit control unit 70b may rotate the chuck table 24.

[0097] Furthermore, in this third cleaning mode, the first surface 1a side of the cleaning plate 1, which has an uneven surface structure, is held by the first retaining pad 16, etc. Therefore, it is desirable that the grooves 1d that realize the uneven surface structure of the cleaning plate 1 be provided in such a manner that there is no shortage of suction force acting on the cleaning plate 1 from the first retaining pad 16, etc.

[0098] For example, if both ends of the groove 1d are open to the outer surface 1c, negative pressure from the suction source will leak from the openings at both ends of the groove 1d, making it easy for the suction force acting on the cleaning plate 1 from the first retaining pad 16, etc., to be insufficient. Therefore, the total area of ​​the openings formed on the outer surface 1c should be, for example, 5 mm 2 Preferably, 2.5 mm 2 A groove 1d is formed as follows:

[0099] As a result, the first surface 1a of the cleaning plate 1 is properly held by the first retaining pad 16, etc. Note that both ends of the groove 1d formed in the cleaning plate 1 do not necessarily have to open to the outer surface 1c. In this case, the suction force acting on the cleaning plate 1 from the first retaining pad 16, etc. will not be insufficient due to negative pressure leakage.

[0100] Furthermore, in this third cleaning mode, once cleaning of the upper surface 68a of the chuck table 68 is complete, the cleaning plate 1 is loaded into the cassette 8a (or cassette 8b) via the chuck table 68. However, the cleaning plate 1 may also be loaded into the cassette 8a (or cassette 8b) via the position adjustment mechanism 12 without going through the chuck table 68.

[0101] Most of the third cleaning mode described above is common to the fourth cleaning mode, i.e., the fourth aspect of the cleaning method, in which a series of steps for cleaning the lower surface 64a of the second retaining pad 60 are performed. In the fourth cleaning mode, the transport unit control unit 70c lowers the second retaining pad 60 so that the lower surface 64a of the second retaining pad 60 is pressed against the first surface 1a of the cleaning plate 1 held by the chuck table 24 (step ST14).

[0102] In other words, the first surface 1a of the cleaning plate 1 is pressed against the lower surface 64a of the second retaining pad 60. In this fourth cleaning mode, the lower surface 64a of the second retaining pad 60 may be pressed against the first surface 1a of the cleaning plate 1, which is held by the chuck table 68.

[0103] As described above, the grinding apparatus (processing apparatus) 2 and cleaning method according to this embodiment use a holding unit 78 including a chuck table 24 and a chuck table 68, a transport unit 80 including a first holding pad 16 and a second holding pad 60, and a cleaning plate 1 having an uneven structure on the first surface 1a side to clean the upper surface (first holding surface) 28a of the chuck table 24, the upper surface (first holding surface) 68a of the chuck table 68, the lower surface (second holding surface) 20a of the first holding pad 16, or the lower surface (second holding surface) 64a of the second holding pad 60. Thus, the holding surfaces for holding the workpiece 11 can be cleaned without relying on a dedicated cleaning mechanism.

[0104] It should be noted that the present invention is not limited to the embodiments described above and can be implemented with various modifications. Figure 11 is a schematic perspective view showing a modified cleaning plate 21. This modified cleaning plate 21 is the same as the cleaning plate 1 in the embodiment, except that grooves 21d that realize an uneven structure are provided radially.

[0105] In other words, the cleaning plate 21 has a circular first surface 21a, a circular second surface 21b opposite to the first surface 21a, and an outer peripheral surface 21c connecting the first surface 21a and the second surface 21b. On the first surface 21a side of the cleaning plate 1, a plurality of linear grooves 21d are formed passing through the center of the first surface 21a. Both ends of each groove 21d open to the outer peripheral surface 21c. These plurality of grooves 21d create an uneven structure suitable for cleaning the retaining surface.

[0106] Furthermore, in the embodiments described above, a grinding device 2 used for grinding a workpiece 11 was given as an example of a processing device. However, the present invention can be applied to any processing device equipped with a processing unit capable of processing a workpiece 11 held in a holding unit. For example, the processing device of the present invention may be a cutting device equipped with a cutting unit (processing unit) having a spindle on which an annular cutting blade is mounted and used for cutting a workpiece 11, a polishing device equipped with a polishing unit (processing unit) having a spindle on which a polishing pad is mounted and used for polishing a workpiece 11, or a laser processing device equipped with a laser oscillator and optical system (processing unit) that generates a laser beam and used for laser processing of a workpiece 11.

[0107] Furthermore, in the above-described embodiment, a program for cleaning the retaining surface is stored in the storage device 74 within the control unit 70. However, this program may be recorded on any non-temporary recording medium that can be read by a computer or the like. For example, this program may be recorded on an optical disc such as a CD (Compact Disc) that can be distributed at low cost.

[0108] Furthermore, the structures, methods, etc., of the embodiments and modified versions described above may be modified as appropriate, as long as they do not deviate from the scope of the present invention. [Explanation of Symbols]

[0109] 2: Grinding equipment (processing equipment) 4: Base 4a: Containment section 6: Robot arm 8a: Cassette 8b: Cassette 10a: Cassette Table 10b: Cassette Table 12:Position adjustment mechanism 14: First transport arm 16: First retaining pad 18:Frame body 18a: Recess 20: Holding plate 20a: Bottom surface (second holding surface) 22: Turntable 24: Chuck table (machining chuck table) 26: Frame 26a: Recess 26b: Flow channel 28: Holding plate 28a: Top surface (first holding surface) 30:Support structure 32:Z-axis movement mechanism 34: Guide rail 36: Mobile Plate 38: Screw shaft 40: Motor 42: Fixture 44: Grinding unit (processing unit) 46: Spindle Housing 48: Spindle 50: Mount 52: Bolt 54: Grinding Wheel 56: Nozzle 58: Second transport arm 60: Second retaining pad 62: Frame 62a: recess 64: Holding plate 64a: Bottom surface (second holding surface) 66: Washing Unit 68: Chuck table (Chuck table for cleaning) 68a:Top surface (first holding surface) 70: Control Unit 70a: Input determination unit 70b: Holding unit control unit 70c: Conveyor Unit Control Unit 72: Processing Unit 74: Storage device 76: Input device 78: Holding Unit 80: Conveyor Unit 1: Cleaning plate 1a: 1st page 1b: 2nd side 1c: Outer surface 1d: Groove 11: Workpiece 11a: Surface 11b: Back side 21: Cleaning plate 21a: 1st page 21b: 2nd side 21c: Outer surface 21d: Groove

Claims

1. A holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and a rotation axis that intersects the first holding surface, A processing unit capable of processing the workpiece held in the holding unit, A plate-shaped cleaning plate having an uneven structure on its first side, and a cassette mounting base on which a cassette capable of accommodating the workpiece is placed, A conveying unit that includes a holding pad having a second holding surface for holding the workpiece, and can transport the workpiece contained in the cassette to the chuck table, The system comprises a processing unit and a storage device, and a control unit capable of controlling the holding unit and the transport unit according to a program stored in the storage device, The control unit, in accordance with the program, The procedure involves using the transport unit to unload the cleaning plate contained in the cassette, and holding the second surface of the cleaning plate opposite to the first surface with the second holding surface of the holding pad, The procedure involves holding the second surface of the cleaning plate with the second holding surface of the holding pad, and then pressing the first surface of the cleaning plate against the first holding surface of the chuck table with the transport unit, A processing apparatus for cleaning the first holding surface of a chuck table by performing the following steps: pressing the first surface of the cleaning plate against the first holding surface of the chuck table with the transport unit, and rotating the chuck table around the rotation axis.

2. A holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and a rotation axis that intersects the first holding surface, A processing unit capable of processing the workpiece held in the holding unit, A plate-shaped cleaning plate having an uneven structure on its first side, and a cassette mounting base on which a cassette capable of accommodating the workpiece is placed, A conveying unit that includes a holding pad having a second holding surface for holding the workpiece, and can transport the workpiece contained in the cassette to the chuck table, The system comprises a processing unit and a storage device, and a control unit capable of controlling the holding unit and the transport unit according to a program stored in the storage device, The control unit, in accordance with the program, The procedure involves unloading the cleaning plate contained in the cassette using the transport unit, and holding the second surface of the cleaning plate opposite to the first surface with the first holding surface of the chuck table, The procedure involves holding the second surface of the cleaning plate with the first holding surface of the chuck table, and then pressing the second holding surface of the holding pad against the first surface of the cleaning plate with the transport unit, A processing apparatus for cleaning the second holding surface of a holding pad by performing the procedure of rotating the chuck table when pressing the second holding surface of the holding pad against the first surface of the cleaning plate.

3. The processing apparatus according to claim 1 or 2, wherein the chuck table holds the workpiece when processing the workpiece with the processing unit.

4. The system further includes a cleaning unit capable of cleaning the workpiece, The processing apparatus according to claim 1 or 2, wherein the chuck table holds the workpiece when the workpiece is being washed in the washing unit.

5. A holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and a rotation axis that intersects the first holding surface, A processing unit capable of processing the workpiece held in the holding unit, A plate-shaped cleaning plate having an uneven structure on its first side, and a cassette mounting base on which a cassette capable of accommodating the workpiece is placed, A cleaning method used when cleaning the first holding surface of a chuck table of a processing apparatus comprising a holding pad having a second holding surface for holding the workpiece, and a transport unit capable of transporting the workpiece contained in the cassette to the chuck table, wherein the apparatus includes The cleaning plate contained in the cassette is unloaded by the transport unit, and the second surface of the cleaning plate, opposite to the first surface, is held by the second holding surface of the holding pad. With the second surface of the cleaning plate held by the second holding surface of the holding pad, the first surface of the cleaning plate is pressed against the first holding surface of the chuck table by the transport unit. A cleaning method for cleaning the first holding surface of a chuck table by rotating the chuck table around its axis while pressing the first surface of the cleaning plate against the first holding surface of the chuck table with the transport unit.

6. A holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and a rotation axis that intersects the first holding surface, A processing unit capable of processing the workpiece held in the holding unit, A plate-shaped cleaning plate having an uneven structure on its first side, and a cassette mounting base on which a cassette capable of accommodating the workpiece is placed, A cleaning method used when cleaning the second holding surface of a holding pad of a processing apparatus, which includes a holding pad having a second holding surface for holding the workpiece, and a transport unit capable of transporting the workpiece contained in the cassette to the chuck table, The cleaning plate contained in the cassette is unloaded by the transport unit, and the second surface of the cleaning plate, opposite to the first surface, is held by the first holding surface of the chuck table. With the second surface of the cleaning plate held by the first holding surface of the chuck table, the second holding surface of the holding pad is pressed against the first surface of the cleaning plate by the transport unit. A cleaning method for cleaning the second retaining surface of a retaining pad by rotating a chuck table while pressing the second retaining surface of the retaining pad against the first surface of the cleaning plate.

7. The cleaning method according to claim 5 or 6, wherein the workpiece is held in the chuck table when the workpiece is processed in the processing unit.

8. The processing apparatus further includes a cleaning unit capable of cleaning the workpiece, The cleaning method according to claim 5 or 6, wherein the workpiece is held in the chuck table when the workpiece is being cleaned in the cleaning unit.

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