Control device, mounting device, management device, and information processing method

Abstract

This control device is used in a mounting system which includes a printing device for printing a viscous fluid onto a processing target, and a mounting device for extracting a component from a component supply unit, which supplies components and has a holding member for holding components, and mounting the same onto the processing target which has been printed upon. The control device is equipped with a control unit for obtaining a component image obtained by imaging a component held by the holding member of the component supply unit and a substrate image which includes a location on a printed processing target where a component is to be positioned or a location on an unprinted processing target where a component is to be positioned, and generating a reference image by positioning the component image in the mounting location in the substrate image.

Description

Technical Field

[0001] This specification discloses a control device, a mounting device, a management device, and an information processing method.

Background Art

[0002] Conventionally, as a mounting device for mounting components on a processing object such as a substrate, for example, a data creation device creates mounting data based on an image on the lower surface side of a component and creates inspection data based on an image on the upper surface side of the component (see, for example, Patent Document 1). In this device, one data creation device can efficiently create both mounting data and inspection data.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in Patent Document 1 described above, inspection data can be created using a captured image of a component. However, since the data creation device creates an image using the component, there is still waste of the component, and the efficiency of data generation is not yet sufficient, and further improvement has been demanded.

[0005] This disclosure has been made in view of such problems, and the main object is to provide a control device, a mounting device, a management device, and an information processing method capable of executing a process with higher efficiency.

Means for Solving the Problems

[0006] The control device, mounting device, management device, and information processing method disclosed in this specification have taken the following means to achieve the above main object.

[0007] The control device disclosed herein is A control device used in a mounting system that includes a printing device for printing a viscous fluid onto an object to be processed, and a mounting device that has a holding member for holding parts and collects parts from a parts supply unit that supplies parts, and mounts them onto the printed object to be processed, A control unit acquires a part image obtained by imaging a part held by the holding member of the part supply unit, and a base image which includes the area on the printed object where the part is placed, or the area on the unprinted object where the part is placed, and generates a reference image in which the part image is placed at the mounting position of the base image. It is something that is provided.

[0008] This control device obtains a part image by capturing an image of the part held in the part supply unit, and then combines it with a substrate image to generate a reference image. Since it does not require a separate part for image generation, it can perform processing with greater efficiency. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram illustrating an example of the implemented system 10. [Figure 2] A schematic diagram showing an example of the mounting device 13. [Figure 3] An explanatory diagram illustrating an example of imaging the holding member 71 with the mark camera 34. [Figure 4] An explanatory diagram of an example of a circuit board S used during the mounting process. [Figure 5] A flowchart illustrating an example of a print inspection processing routine. [Figure 6] A flowchart showing an example of a reference image generation processing routine. [Figure 7] An explanatory diagram showing an example of the process for generating part image 91. [Figure 8] An explanatory diagram showing an example of the generation process for the base image 92 and the reference image 93. [Figure 9] A flowchart illustrating an example of an implementation-testing process routine. [Modes for carrying out the invention]

[0010] This embodiment will be described below with reference to the drawings. Figure 1 is a schematic diagram showing an example of the mounting system 10. Figure 2 is a schematic diagram showing an example of the mounting apparatus 13. Figure 3 is an explanatory diagram of an example in which the holding member 71 is imaged by the mark camera 34. Figure 4 is an explanatory diagram of an example of a substrate S during mounting processing, where Figure 4A is before printing processing, Figure 4B is after printing processing, and Figure 4C is after the component P has been placed. The mounting system 10 is a system that performs mounting processing, for example, the process of mounting component P onto the substrate S. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figure 1.

[0011] The mounting system 10 is configured as a production line in which mounting devices 13, which process components P onto a substrate S as the object to be processed, are arranged in the transport direction of the substrate S. Here, the object to be processed is described as a substrate S, but it is not particularly limited as long as it is used to mount components P, and may also be a three-dimensional shaped substrate. As shown in Figure 1, this mounting system 10 is configured to include a printing device 11, a printing inspection device 12, a mounting device 13, a mounting inspection device 14, and a management PC 18. The printing device 11 is a device that prints a viscous fluid such as solder paste onto the substrate S. The printing device 11 may also be a device that prints adhesives or conductive pastes as the viscous fluid. The printing inspection device 12 is a device that inspects the state of the printed solder. The mounting device 13 is a device that processes components P onto the substrate S. The mounting inspection device 14 is a device that inspects the state of the components P mounted by the mounting device 13. The mounting device 13 may also be a mounting-inspection device that has the functions of the mounting inspection device 14.

[0012] The mounting device 13 has a holding member 71 that holds components P, and is a device that takes components P from a component supply unit 22 that supplies components P and mounts them onto a substrate S before or after printing. As shown in Figure 2, the mounting device 13 comprises a substrate processing unit 21, a component supply unit 22, a parts camera 24, a control device 25, and a mounting unit 30. In addition to the function of performing the mounting process to place components P on the substrate S, the mounting device 13 also has a function of performing inspection processing to inspect components P and the substrate S. The substrate processing unit 21 is a unit that loads, transports, fixes at the mounting position, and unloads the substrate S. The substrate processing unit 21 has a pair of conveyor belts that are spaced apart at the front and back of Figure 1 and span the left and right directions. The substrate S is transported by these conveyor belts.

[0013] The component supply unit 22 has multiple feeders 23 equipped with reels and a tray unit, and is detachably attached to the front side of the mounting device 13. Tape, which serves as a holding member, is wound around each reel, and multiple components P are held on the surface of the tape along the longitudinal direction of the tape. This tape is unwound from the reel toward the rear, and with the components P exposed, it is fed by the feeder 23 to the picking position where it will be picked up by the picking member 33. The tray unit has a tray on which multiple components P are arranged and placed, and this tray is moved in and out of the predetermined picking position.

[0014] The parts camera 24 is a unit that captures images of one or more components P acquired and held by the mounting head 32. This parts camera 24 is located between the component supply unit 22 and the board processing unit 21. The imaging range of this parts camera 24 is above the parts camera 24. The parts camera 24 captures an image of the mounting head 32 holding the components P as it passes above the parts camera 24 and outputs the captured image data to the control device 25.

[0015] The mounting unit 30 is a unit that picks up the component P from the component supply unit 22 and places it on the substrate S fixed to the substrate processing unit 21. The mounting unit 30 includes a head moving unit 31, a mounting head 32, a picking member 33, and a mark camera 34. The head moving unit 31 includes a slider guided by a guide rail and moving in the XY directions, and a motor that drives the slider. The mounting head 32 is detachably attached to the slider and moves in the XY directions by the head moving unit 31. On the lower surface side of the mounting head 32, one or more picking members 33 (for example, 16, 8, 4, etc.) are detachably attached, and a plurality of components P can be picked up at once. The picking member 33 may be a suction nozzle that picks up components using negative pressure or a mechanical chuck that grips the component P.

[0016] The mark camera 34 is an imaging unit disposed on the lower surface side of the mounting head 32 and capable of imaging the substrate S, the component P, etc. from above. The mark camera 34 may be disposed, for example, on the lower surface of the mounting head 32 or on the lower surface of the slider of the head moving unit 31. The mark camera 34 moves in the XY directions as the mounting head 32 moves. The mark camera 34 has an imaging region below, and images a reference mark used for grasping the position of the substrate S attached to the substrate S, an electrode E formed on the substrate S, a component P disposed on the substrate S, a holding member 71 of the feeder 23 of the component supply unit 22, etc., and outputs the image to the control device 25.

[0017] Here, the substrate S on which the mounting head 32 places the component P will be described. The mounting head 32 places the component P on a plurality of electrodes E of the substrate S on which solder is printed. As shown in FIG. 4, the substrate S has at least electrodes Ea1 to Ea6 for placing components Pa1 to Pa6 and electrodes Eb1 to Eb3 for placing components Pb1 to Pb3. Here, the electrodes Ea1 to Ea6 are collectively referred to as the electrode Ea, the electrodes Eb1 to Eb3 are collectively referred to as the electrode Eb, the electrodes Ea to Eb are collectively referred to as the electrode E, the components Pa1 to Pa6 are collectively referred to as the component Pa, the components Pb1 to Pb3 are collectively referred to as the component Pb, and the components Pa to Pb are collectively referred to as the component P.

[0018] As shown in FIG. 2, the control device 25 is configured as a microprocessor centered around a CPU 26, and includes a storage unit 27 that stores various data. In addition to the function of controlling the entire mounting device 13, the control device 25 has functions such as performing abnormality inspections on the presence or absence of components P and electrodes E and whether their shapes are within the allowable range, and performing printing inspections on whether the printing of solder on the electrodes E is appropriate. The control device 25 outputs control signals to the substrate processing unit 21, the component supply unit 22, the parts camera 24, and the mounting unit 30, and inputs signals from the mounting unit 30, the component supply unit 22, the parts camera 24, and the mounting unit 30. The storage unit 27 stores mounting condition information including the mounting order of mounting the component P on the substrate S, the placement position of the component P, the type of the picking member 33 capable of picking the component P, etc., and a reference image used during the mounting inspection.

[0019] As shown in FIG. 1, the printing inspection device 12 includes a substrate processing unit 41, a control device 42, and an inspection unit 45. The substrate processing unit 41 is the same unit as the substrate processing unit 21 of the mounting device 13. The control device 42 has the same configuration as the control device 25, and includes a CPU 43 and a storage unit 44. The inspection unit 45 is a unit that inspects the substrate S itself and the state of the solder paste printed on the substrate S, and includes a head movement unit 46, an inspection head 47, and an imaging unit 48. The head movement unit 46 is a unit that moves the inspection head 47 in the XY direction in the same manner as the head movement unit 31. The inspection head 47 is provided with an imaging unit 48 that images the substrate S from above, and is moved in the XY direction by the head movement unit 46. The printing inspection device 12 uses reference information including information such as the reference position where the solder paste is printed and the shape of the printed solder paste to perform inspections on whether there are abnormalities in the shape of the printed solder paste and whether the solder paste is printed at an appropriate position.

[0020] The mounting inspection device 14 comprises a substrate processing unit 51, a control device 52, and an inspection unit 55. The substrate processing unit 51 is a unit similar to the substrate processing unit 21 of the mounting device 13. The control device 52 has the same configuration as the control device 25 and includes a CPU 53 and a storage unit 54. The inspection unit 55 is a unit that inspects the state of components P placed on a substrate S and comprises a head moving unit 56, an inspection head 57, and an imaging unit 58. The head moving unit 56 is a unit that moves the inspection head 57 in the XY direction, similar to the head moving unit 31. The inspection head 57 is equipped with an imaging unit 58 that images the substrate S from above and is moved in the XY direction by the head moving unit 56. The mounting inspection device 14 uses reference information, including information such as the reference position where components P are placed, to inspect for missing components P or abnormalities in their placement. The mounting inspection device 14 is located downstream of the mounting device 13, which does not have mounting inspection processing functions.

[0021] The management PC 18 is a computer that manages information about each device in the mounting system 10. The management PC 18 comprises a control unit 62, a communication unit 65, a display, and an input device. The control unit 62 is configured as a microprocessor centered on a CPU 63 and includes a storage unit 64. The storage unit 64 stores information for managing the production of the mounting system 10, as well as mounting condition information corresponding to each mounting device 13, including the mounting order for mounting components P onto the substrate S, the placement position of components P, and the type of material from which components P can be collected. The communication unit 65 is an interface for exchanging information with external devices.

[0022] Next, the operation of the mounting system 10 of this embodiment, as configured in this way, will be described, starting with the process of printing solder onto the substrate S by the printing device 11. The printing process routine that executes the printing process is stored in the memory of the printing control unit 21 and is executed by the control unit of the printing device 11 after the mounting system 10 is started. When the printing process routine is started, the control unit first transports and fixes the substrate S with the substrate processing unit 30 and raises it to the printing height to bring the substrate S into contact with the screen mask. Next, the control unit dispenses solder onto the screen mask M, moves the print head and lowers the squeegee to bring the squeegee into contact with the upper surface of the screen mask M. Subsequently, the control unit moves the squeegee in the front-back direction to print the solder onto the substrate S. Once the solder is printed onto the substrate S, the control unit discharges the printed substrate S from the device, and if there is another substrate S, it performs a transport and fixing process on the substrate S. The control unit of the printing device 11 repeats this process until the production of the current substrate S is completed.

[0023] Next, the inspection process in the print inspection device 12 will be described. Figure 5 is a flowchart showing an example of a print inspection processing routine executed by the control device 42 of the print inspection device 12. This routine is stored in the memory unit 44 of the print inspection device 12 and is executed by the CPU 43 of the control device 42 after the mounting system 10 is started. When this routine is started, the CPU 43 has the substrate processing unit 41 transport the printed substrate S to the inspection position and perform the fixing process (S100). Next, the CPU 43 has the imaging unit 48 of the inspection head 47 image the substrate S (S110). Next, the CPU 43 sets one of the printed electrodes E on the substrate S as the inspection target (S120). The CPU 43 may, for example, set the electrodes Ea1 in order as the inspection targets. Once the inspection targets are set, the CPU 43 acquires a reference image corresponding to this inspection target (S130) and determines whether the imaged inspection target is within the acceptable range relative to the reference image (S140). The reference image may, for example, be an image in which solder is ideally printed on electrode E. Furthermore, the predetermined tolerance range may be empirically determined, for example, by empirically determining the relationship between the solder printing state and the state of component P after reflow, and defining the range within which no defects occur in component P after reflow.

[0024] If the image of the object to be inspected in S140 is within the acceptable range relative to the reference image, the CPU 43 stores the object to be inspected as having good printing (S150). On the other hand, if the image of the object to be inspected is not within the acceptable range relative to the reference image, the CPU 43 stores the object to be inspected as having a printing defect (S160). After S160, or after S150, the CPU 43 determines whether all the objects to be inspected on the current board S have been inspected (S170). If not all have been inspected, the CPU 43 executes the processing from S120 onward. That is, in S120, the CPU 43 sets the next object to be inspected and determines whether the image of the object to be inspected is within the acceptable range relative to the reference image. On the other hand, if all the objects to be inspected have been inspected in S170, the CPU 43 executes transport processing according to the inspection results (S180). For example, the CPU 43 executes the process of transporting boards S for which all inspection results are good to the mounting device 13, and transports boards S with even one printing defect to remove them from the production line. The CPU 43 then determines whether the print inspection is complete (S190), and if it is not complete, it executes the processes from S100 onwards. On the other hand, if the print inspection is completed in S190, the CPU 43 terminates this routine. In this way, the print inspection device 12 supplies substrates S with all print results good to the mounting device 13.

[0025] Next, the process for generating a reference image used to inspect the substrate S on which the component P is mounted in the mounting device 13 will be described. Figure 6 is a flowchart showing an example of a reference image generation processing routine executed by the control device 25 of the mounting device 13. This routine is stored in the storage unit 27 and executed by the CPU 26 of the control device 25 after the mounting system 10 is started. When this routine is started, the CPU 26 determines whether or not it is the reference image generation timing (S200). Reference image generation timings include, for example, when a new component P is used, such as when the feeder 23 is mounted on the mounting part of the component supply unit 22, or when the reference image is updated because it is determined that the appropriateness of the reference image is low. Here, the timing when the feeder 23 is mounted on the mounting part of the component supply unit 22 will be mainly described.

[0026] When it is the reference image generation timing, the CPU 26 executes the component image generation process from S200 to S280 (S10). Specifically, the CPU 26 first moves the mark camera 34 onto the corresponding feeder 23 of the component supply unit 22 (S210), captures an image and obtains its feature quantities (S220), and stores it as an image without components (S230). Here, "feature quantities" include, for example, brightness values ​​and their variance. Figure 7 is an explanatory diagram showing an example of the component image 91 generation process, where Figure 7A is the supply unit captured image 80, Figure 7B is the supply unit captured image 85, and Figure 7C is an explanatory diagram of the component image 91 generation process. The supply unit captured images 80 and 85 include the holding member 81, the housing section 82, the feed hole 83, and the feeder 84 as images. As shown in Figure 3, at the front of the holding member 71, components P are not housed in several housing sections 72. Therefore, the CPU 26 obtains an image of only the holding member 71 at the leading edge of the holding member 71 (Figure 7A). Next, the CPU 26 executes the process of feeding out the holding member 71 (S240), captures an image and obtains its feature quantities (S250), and determines whether or not there is a change in the feature quantities (S260). If there is no change in the feature quantities, the CPU 26 executes the processes from S240 onward. If there is a change in the feature quantities in S260, the supply unit captured image 85 is stored in the storage unit 27 as an image with a component (S270). When the holding member 71 is fed out and the storage unit 72 containing the component P reaches the imaging position, the supply unit captured image 85 including the component P is captured (Figure 7B). At this time, as shown in Figures 7A and B, the brightness value, which is a feature quantity, changes, so the presence of component P can be confirmed. Next, the CPU 26 creates a difference image between an image 86 of the holding member 71 without holding part P and an image 87 of the holding member 71 with part P. The CPU 26 then performs blob processing on the difference image and crops it using the smallest bounding rectangle to generate a part image 91, which is an image of part P, and stores it in the storage unit 27 (S280). At this time, the CPU 26 rotates and corrects the position of part P as needed (Figure 7C). In this way, the CPU 26 obtains a part image 91 by imaging part P held by the holding member 71 of the part supply unit 22.

[0027] When a component image is generated in S280, the CPU 26 executes the substrate image generation process (S20) from S290 to S310 and the reference image generation process (S30) in S320. Specifically, the CPU 26 moves the mark camera 34 onto the printed substrate S before the component P is placed (S290), captures an image of the substrate S, and stores it as the substrate image 90 (S300). Next, the CPU 26 extracts the regions where each component P will be placed and stores each as a substrate image (S310). Next, the CPU 26 generates a reference image in which the component images are placed in the mounting positions of the substrate image (S320). Figure 8 is an explanatory diagram showing an example of the generation process of the substrate image 92 and the reference image 93, where Figure 8A is the substrate image 90 and Figure 8B is an explanatory diagram of the generation process of the substrate image 92 and the reference image 93. The substrate image 90 includes multiple regions A where components P are placed, including electrodes E with solder printed on them. Before placing components P on the substrate S, which has a good printing condition, the CPU 26 takes an image of the substrate S (Figure 8A). The CPU 26 then extracts each region A and stores it in the storage unit 27 as a base image 92. In this way, the CPU 26 obtains a base image of the printed substrate S that includes the areas where components P will be placed. The CPU 26 then generates a reference image 93 by placing the component image 91 at the mounting position on the base image 92.

[0028] After S320, or if it is not the reference image generation timing in S200, the CPU 26 determines whether or not the reference image has been generated for all feeders 23 (S330). If the reference image has not been generated for all feeders 23, the CPU 26 executes the processing from S200 onward. On the other hand, if the reference image 93 has been generated for all feeders 23 in S330, this routine is terminated. In this way, the reference image 93 can be obtained using the captured image of the component P on the component supply unit 22 and the captured image of the printed substrate S.

[0029] Next, the mounting and inspection processes in the mounting device 13 will be described. Figure 9 is a flowchart showing an example of a mounting-inspection process routine executed by the control device 25 of the mounting device 13. This routine is stored in the memory unit 27 of the mounting device 13 and is executed by the CPU 26 of the control device 25 after the mounting system 10 is started. When this routine is started, the CPU 26 first executes the mounting process from S400 to S450 (S40). Specifically, the CPU 26 reads and acquires the mounting condition information of the substrate S to be produced (S400), and has the substrate processing unit 21 transport the substrate S to the mounting position and perform the fixing process (S410). Next, the CPU 26 has the mounting head 32 pick up the component P to be picked up, which has been set based on the mounting condition information (S420). Next, the CPU 26 has the component camera 24 image the picked up component P to acquire the picking status of component P (S430), and based on the obtained picking status, corrects the position of component P and places it at the mounting position on the substrate S (S440). Next, the CPU 26 determines whether or not there is a component P to be collected and placed next (S450), and if there is a component P to be collected and placed next, it executes the processing from S420 onwards.

[0030] On the other hand, if there are no components P to be picked up and placed next in S450, the CPU 26 performs component inspection processing in S460 to S540 to inspect the state of components P on the substrate S (S50). Specifically, the CPU 26 images the components P placed on the substrate S with the mark camera 34 (S460) and sets the inspection targets (S470). For example, the CPU 26 may set the inspection targets in order from component Pa1 on the substrate S in Figure 4C. Once the components P to be inspected are set, the CPU 26 acquires the corresponding reference image 93 by reading it from the storage unit 27 (S480) and determines whether the placement state of the components P is within a predetermined tolerance range (S490). The predetermined tolerance range may be, for example, determined empirically by empirically finding the relationship between the mounting state of the components P and the state of the components P after reflow, and setting it within a range in which no defects occur in the components P after reflow. The mounting state may include the amount of displacement in the XY direction and the rotation angle. If the object to be inspected is within the acceptable range, the CPU 26 sets the component as a well-placed component (S500). If the object to be inspected is outside the acceptable range, the CPU 26 sets the component as a poorly placed component (S510). After S510 or after S500, the CPU 26 determines whether there are any uninspected components (S520). If there are uninspected components, the CPU 26 executes the processing from S470 onwards. On the other hand, if there are no uninspected components in S520, the CPU 26 saves the inspection results to the storage unit 27 and outputs them to the management PC 18 (S530), and determines whether the production of the board S is complete (S540). If the production of the board S is not complete, the CPU 26 executes the processing from S410 onwards. On the other hand, if the production of the board S is completed in S540, this routine is terminated. In this way, the CPU 26 uses the reference image 93 generated from the captured image to perform the inspection process of the mounting state of the component P.

[0031] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The control device 25 of this embodiment is an example of the control device of the present disclosure, the CPU 26 is an example of the control unit, the component image 91 is an example of a component image, the base image 92 is an example of a base image, and the reference image 93 is an example of a reference image. Furthermore, the component supply unit 22 is an example of a component supply unit, the holding member 71 is an example of a holding member, the mounting unit 30 is an example of a mounting unit, and the mark camera 34 is an example of a component imaging unit and a base imaging unit. In addition, in this embodiment, an example of the information processing method of the present disclosure is also clarified by explaining the operation of the control device 25.

[0032] The control device 25 of this embodiment, as described above, is used in a mounting system 10 that includes a printing device 11 for printing solder as a viscous fluid onto a substrate S as a workpiece, and a mounting device 13 for collecting components P from a component supply unit 22 that has a holding member 71 holding components P and mounts them onto the printed substrate S. This control device 25 includes a CPU 26 as a control unit that acquires a component image 91 obtained by imaging the component P held by the holding member 71 of the component supply unit 22, and a base image 92 which is the area on the printed substrate S where the component P is placed, and generates a reference image 93 in which the component image 91 is placed at the mounting position on the base image 92. Since this control device 25 does not consume components P specifically for image generation, it can perform more efficient processing without wasting components P.

[0033] Furthermore, the CPU 26 acquires a component image 91 based on the difference between captured images of a holding member 71 holding a component P and a holding member 71 not holding a component P. Therefore, the control device 25 can acquire the component image 91 more reliably depending on whether or not a component P is present in the holding member 71. In addition, the CPU 26 acquires a base image 92 of the substrate S after the printing device 11 has inspected the printing state of the viscous fluid. Therefore, the control device 25 can acquire a base image 92 that more accurately reflects the printing state. Moreover, the CPU 26 images the printed substrate S using a mark camera 34, which is an imaging device capable of reproducing the same imaging conditions as when performing a component inspection process to inspect the state of component P on the substrate S. Therefore, the control device 25 can further reduce the influence of differences in image quality when using a reference image 93. Furthermore, since the CPU 26 uses the reference image 93 in the component inspection process to inspect the state of component P on the substrate S, the reference image used in the component inspection process can be acquired more efficiently.

[0034] Furthermore, the mounting apparatus 13 includes a component supply unit 22 that has a holding member 71 that holds a component P and supplies the component P, a mounting unit 30 that takes the component P from the holding member 71 and processes it onto a substrate S, a mark camera 34 which acts as a component imaging unit that images the component P on the holding member 71 of the component supply unit 22 and a base imaging unit that images the substrate S, and the control device 25 described above. In this mounting apparatus 13, the CPU 26 of the control device 25 acquires a component image 91 from the image captured by the mark camera 34 and acquires a base image 92 from the image captured by the mark camera 34. In this mounting apparatus 13, the functions of the control device 25 described above can be realized in the mounting apparatus 13. In addition, in the mounting apparatus 13, the CPU 26 inspects the printing state of the viscous fluid on the substrate S that has been printed by the printing apparatus 11 and acquires a base image 92 of the substrate S after the inspection of this printing state, so that a reference image 93 that reflects a more appropriate printing state can be obtained.

[0035] Furthermore, since the control device 25 generates a reference image 93 from the component image 91 and the substrate image 92, it is possible to perform performance evaluations of component inspection processing using a reference image with misaligned mounting positions, for example, without having to prepare a substrate S with misaligned components P. In addition, since the control device 25 acquires the substrate image 92 from the printed substrate S, it is possible to perform inspection preparations that include the effects of viscous fluids.

[0036] It goes without saying that the control devices disclosed herein are not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

[0037] For example, in the embodiment described above, a substrate image 92 is obtained from a substrate S with a viscous fluid printed on it. However, the invention is not limited to this, and a substrate image including the area on the substrate S where the components P are placed, which is the object to be processed but has not been printed on, may also be obtained. In this control device 25, the influence of the viscous fluid is not taken into consideration, but since the components P are not specially consumed for image generation, it is possible to perform processing with higher efficiency without wasting components P.

[0038] In the embodiment described above, a base image 92 is obtained by imaging the printed substrate S using a mark camera 34, which is an imaging device capable of reproducing the same imaging conditions as those used to perform a component inspection process to inspect the state of components P on the substrate S. However, the system is not limited to this, and the base image 92 may be obtained using an imaging device different from that used for the component inspection process. In the mounting system 10, the imaging of the base image 92 for the reference image 93 and the imaging for the component inspection process are performed using a mark camera 34 with the same imaging conditions. However, for example, the base image 92 may be obtained using an image captured by the printing inspection device 12, and the imaging for the component inspection process may be performed with the mark camera 34. In this case, if there is a difference in imaging conditions between the reference image 93 and the image captured for the component inspection process, it may adversely affect the component inspection process. Therefore, it is desirable to be able to obtain a base image 92 with imaging conditions within a predetermined tolerance range for the image used to inspect the printing state of the viscous fluid.

[0039] In the above-described embodiment, the reference image 93 was explained to be generated by the control device 25 of the mounting device 13. However, the invention is not limited to this, and the control device 62 of the management PC 18 may acquire the component image 91 and the substrate image 92 and generate the reference image 93. This management PC 18 is used in a mounting system 10 that includes a printing device 11 that prints a viscous fluid onto a substrate S as the object to be processed, and a mounting device 13 that takes components P from a component supply unit 22 which has a holding member 71 that holds components P and supplies components P, and mounts them onto the printed object to be processed. This management PC 18 is a management device that manages information about this mounting system 10. Since this management PC 18 is equipped with the control device described above, the functions of the control device described above can be realized in the management device. Furthermore, the functions of the control device 25 of the mounting device 13 may be provided by one or more of the control devices such as the control device 52 of the mounting inspection device 14 and the control device 42 of the printing inspection device 12. Even with this control device, it is possible to perform processing with higher efficiency without causing waste of components P.

[0040] In the embodiments described above, the reference image 93 was described as being used for component inspection processing, but it is not limited to this and may be used for other processing. For example, the control device 25 may use the reference image 93 for one or more of the following processes: learning processing for component inspection on the object to be processed, or performance evaluation processing for component inspection on the object to be processed. The control device 25 may generate multiple reference images 93 with shifted mounting positions of component P and use these reference images 93 for learning processing. Alternatively, the control device 25 may generate multiple reference images 93 with shifted mounting positions of component P and use these reference images 93 for performance evaluation processing of component inspection. This control device can acquire reference images used for learning processing and performance evaluation processing more efficiently.

[0041] In the above-described embodiment, the mounting device 13 was described as having the functions of both a mounting device and a mounting inspection device. However, the invention is not limited to this, and the mounting device 13 may have only the function of mounting processing, and the mounting inspection device 14 may have only the function of component inspection processing. Specifically, the mounting device 13 executes the process of S40, and the mounting inspection device 14 executes the process of S50. In this mounting system 10 as well, since components P are not specially consumed for image generation, processing can be performed with higher efficiency without wasting components P. In this case, the component image 91 is captured by the mark camera 34 of the mounting device 13, the substrate image 92 is captured by the imaging unit 48 of the printing inspection device 12, and in the component inspection process, it is captured by the imaging unit 58 of the mounting inspection device 14. Therefore, it is preferable that these imaging conditions fall within a predetermined tolerance range. Note that image quality may differ due to differences in imaging resolution and illumination devices, so it is desirable to image the printed substrate S with the device that performs the component inspection process. If highly compatible images can be obtained from the printing inspection device 12, the mounting device 13, and the mounting inspection device 14, the substrate image 92 may be acquired by the printing inspection device 12.

[0042] In the embodiments described above, the present disclosure has been explained using the control device 25 and the mounting device 13, but it is not limited to these, and may also be used as an information processing method.

[0043] Here, the information processing method of this disclosure may be configured as follows. For example, the information processing method of this disclosure is An information processing method executed by a computer used in a mounting system that includes a printing device for printing a viscous fluid onto an object to be processed, and a mounting device that has a holding member for holding parts and collects parts from a parts supply unit that supplies parts and mounts them onto the printed object to be processed, (a) The steps of obtaining a part image obtained by imaging a part held by the holding member of the part supply unit, and a base image which includes the portion of the printed object on which the part is placed, or which includes the portion of the unprinted object on which the part is placed, (b) A step of generating a reference image by placing the acquired part image at the mounting position of the base image, It includes.

[0044] This information processing method, like the control device described above, can perform processing with greater efficiency. In this information processing method, various forms of the control device, implementation device, and management device described above may be adopted, or steps may be added to realize any of the functions of the control device, implementation device, and management device described above.

[0045] This specification also discloses technical concepts in which "the control device described in claim 1 or 2" in the original claim 5 was changed to "the control device described in any one of claims 1 to 4", technical concepts in which "the control device described in claim 1 or 2" in the original claim 6 was changed to "the control device described in any one of claims 1 to 5", and technical concepts in which "the control device described in claim 1 or 2" in the original claim 8 was changed to "the control device described in any one of claims 1 to 5". [Industrial applicability]

[0046] The inspection apparatus and inspection method described herein can be used in the technical field of apparatus that performs processing such as sampling and placement of parts. [Explanation of Symbols]

[0047] 10 Assembly system, 11 Printing device, 12 Printing inspection device, 13 Assembly device, 14 Assembly inspection device, 18 Management PC, 21 Board processing unit, 22 Parts supply unit, 23 Parts camera, 25 Control device, 26 CPU, 27 Memory unit, 28 Reference image information, 29, 29B Threshold information, 30 Assembly unit, 31 Head movement unit, 32 Assembly head, 33 Suction nozzle, 34 Mark camera, 41, 51 Board processing unit, 42, 52 Control device, 43, 53 CPU, 44, 54 Memory unit, 45, 55 Inspection unit, 46, 56 Head movement unit, 47, 5, 57 Inspection head, 48, 58 Imaging unit, 70 Holding member, 71 Housing unit, 72 Feeding hole, 80 Supply unit captured image, 81 Holding member, 82 Housing unit, 83 Feeding hole, 84 Feeder, 85 Supply unit image, 86 Image without components, 87 Image with components, 90 Substrate image, 91 Component image, 92 Base image, 93 Reference image, E, Ea1~Ea6, Eb1~Eb3 Electrodes, P, Pa1~Pa6, Pb1~Pb3 Components, S Substrate.

Claims

1. A control device used in a mounting system that includes a printing device for printing a viscous fluid onto an object to be processed, and a mounting device that has a holding member for holding parts and collects parts from a parts supply unit that supplies parts, and mounts them onto the printed object to be processed, A control unit acquires a part image obtained by imaging a part held by the holding member of the part supply unit, and a base image which includes the area on the printed object where the part is placed, or the area on the unprinted object where the part is placed, and generates a reference image in which the part image is placed at the mounting position of the base image. A control device equipped with the following features.

2. The control device according to claim 1, wherein the control unit acquires the part image based on captured images of the holding member holding the part and the holding member not holding the part.

3. The control device according to claim 1 or 2, wherein the control unit acquires a substrate image of the object to be processed after inspecting the printing state of the viscous fluid on the object to be processed by the printing device.

4. The control device according to claim 3, wherein the control unit acquires the substrate image in an imaging state that is within a predetermined tolerance range with respect to the imaging image used to inspect the printing state of the viscous fluid.

5. The control device according to claim 1 or 2, wherein the control unit uses the reference image in one or more of the following processes: a parts inspection process for inspecting the state of the parts on the object to be processed, a learning process for parts inspection on the object to be processed, and a performance evaluation process for parts inspection on the object to be processed.

6. A parts supply unit having a holding member that holds the parts and supplying the parts, A mounting unit that takes the parts from the holding member and mounts them onto the object to be processed, A component imaging unit that images a component located on the holding member of the component supply unit, A base imaging unit for imaging the object to be processed, A control device according to claim 1 or 2, A mounting device comprising the control unit of the control device, wherein the control unit of the control device acquires the part image from the image captured by the part imaging unit and acquires the substrate image from the image captured by the substrate imaging unit.

7. The mounting apparatus according to claim 6, wherein the control unit inspects the printing state of the viscous fluid on the object to be processed by the printing apparatus, and acquires the substrate image of the object to be processed after the inspection of the printing state.

8. A management device used in a mounting system that includes a printing device for printing a viscous fluid onto an object to be processed, and a mounting device that has a holding member for holding parts and collects parts from a parts supply unit that supplies parts and mounts them onto the printed object, and for managing information of the mounting system, The control device according to claim 1 or 2, A management device equipped with this device.

9. An information processing method executed by a computer used in a mounting system that includes a printing device for printing a viscous fluid onto an object to be processed, and a mounting device that has a holding member for holding parts and collects parts from a parts supply unit that supplies parts and mounts them onto the printed object to be processed, (a) The steps of obtaining a part image obtained by imaging a part held by the holding member of the part supply unit, and a base image which includes the portion of the printed object to be processed in which the part is placed, or which includes the portion of the unprinted object to be processed in which the part is placed, (b) A step of generating a reference image by placing the acquired component image at the mounting position of the base image, Information processing methods including

Images