Method for manufacturing a conductive film, dispersion, radiation-sensitive resin composition, light-emitting element

Abstract

The present invention provides a manufacturing method for a conductive film that has high conductivity and makes it possible to evenly fix a conductive carbon material over the entirety of a conductive film formation region. The present invention also provides a manufacturing method wherein it is possible to efficiently remove a dispersant that has remained in the conductive film, as well as a polymer that is in a section where a radiation-sensitive resin composition has not been subjected to light exposure.　The present invention includes: a step (A) in which a liquid dispersion is applied on a main surface of a substrate and dried to form a first film, said liquid dispersion including a carbon material and a first polymer that has one type of functional group among a carboxyl group, a hydroxyl group, and a phenolic hydroxyl group; a step (B) in which a radiation-sensitive resin composition is applied on the first film to form a second film, said radiation-sensitive resin composition having an acid generating agent and a second polymer that has one type of functional group among a carboxyl group, a hydroxyl group, and a phenolic hydroxyl group; a step (C) in which the second film is exposed to light; and a step (D) in which, after the step (C), the first polymer and the second polymer are removed by developing.

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a conductive film. Furthermore, the present invention relates to a dispersion used in the method for manufacturing the conductive film, a radiation-sensitive resin composition, and a light-emitting element manufactured using the method for manufacturing the conductive film. [Background technology]

[0002] In recent years, semiconductor devices have been developed in which electrodes and wiring are formed from conductive films made of nanocarbon materials. Traditionally, electrodes and wiring in semiconductor devices were often made from metals such as copper and aluminum. However, nanocarbon materials, especially carbon nanotubes (hereinafter sometimes abbreviated as "CNT"), can be constructed to be much thinner than metals or metal oxide films and exhibit high conductivity, making them a material that is attracting considerable attention as a semiconductor device material. Furthermore, conductive films formed from nanocarbon materials can be made to show high transmittance to visible light, so there is a growing trend to actively adopt them in semiconductor optical elements.

[0003] Given the background described above, various proposals have been made regarding materials and manufacturing methods for conductive films made of CNTs. For example, Patent Document 1 below discloses a composition containing a solvent and CNTs as a composition with improved dispersibility of CNTs. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2010-214837 [Overview of the project] [Problems that the invention aims to solve]

[0005] However, conductive films produced by the above compositions have the problem of being prone to aggregation during drying processes, which can impair their homogeneity. In transparent CNT conductive films, the fibrous CNTs overlap like a nonwoven fabric, forming circuits through which current flows and exhibiting conductivity. Therefore, unlike metal films or metal oxide films, it is difficult to configure them to have stable properties, and it is difficult to achieve stable electrical characteristics.

[0006] In particular, with the increasing miniaturization of semiconductor devices such as LSIs, the wiring width is extremely narrow. When wiring is formed using conductive films of carbon nanotubes (CNTs), there are challenges such as the formation of wiring with high resistance in certain areas or a high likelihood of disconnection.

[0007] Furthermore, when used in light-emitting elements or touch panels, it is necessary to form the conductive film as thinly as possible to enhance transmittance to visible light, while also requiring high conductivity and the formation of a homogeneous conductive film. In such cases, as with semiconductor devices such as LSIs mentioned above, the problem of the conductive film being prone to breakage arises. More specifically, for example, when wiring constituting a touch panel is constructed with a width of 50 μm or less, or when creating lead wires from contact holes of 50 μm or less when creating pixel electrodes for a display panel, breakage is particularly likely to occur. Moreover, when a radiation-sensitive resin composition is applied on such a conductive film to form an insulating layer pattern, a portion of the CNT conductive film may peel off. As a result, problems such as the need to add new processes to prevent the peeling of the CNT conductive film have been latent.

[0008] In view of the above problems, the present invention aims to provide a method for manufacturing a conductive film that has high conductivity and can evenly fix a conductive carbon material throughout the entire conductive film formation region. Furthermore, it aims to provide a manufacturing method that can efficiently remove the dispersant remaining in the conductive film and the polymer in the parts of the radiation-sensitive resin composition that have not been exposed. [Means for solving the problem]

[0009] The method for manufacturing a conductive film of the present invention is: Step (A) involves applying a dispersion containing a first polymer having one of the functional groups of a carboxyl group, a hydroxyl group, or a phenolic hydroxyl group, and a carbon material onto the main surface of a substrate and drying it to form a first film. Step (B) involves applying a radiation-sensitive resin composition containing a second polymer having one of the functional groups of a carboxyl group, a hydroxyl group, or a phenolic hydroxyl group, and a photoacid generator onto the first film to form a second film, A step (C) of exposing a portion of the second film, The process includes, after performing step (C), step (D) removing the first polymer and the second polymer from the portion exposed in step (C).

[0010] Furthermore, the above manufacturing method is After performing step (D), the process may include step (E) of heat-treating the substrate.

[0011] In the above manufacturing method, The above step (A) may be a method of coating the first polymer having a polyamic acid structure, and the above step (B) may be a method of coating the second polymer having a polyamic acid structure.

[0012] In the above manufacturing method, Step (A) may also be a method of applying the first polymer having a polyamic acid structure and the dispersion containing an organic solvent.

[0013] In this context, a "polyamic acid structure" refers to a structure that has a substructure containing a carboxyl group, and upon heating, this substructure undergoes dehydration and cyclization to form an imide structure.

[0014] In the above manufacturing method, The step (B) may be a method of applying the radiation-sensitive resin composition containing the second polymer mainly composed of a polyamic acid having a structural unit represented by the following general formula (1).

Chemical formula

[0015] In the present specification, the "main component" refers to the substance having the highest content among the substances contained in the material.

[0016] In the above production method, The step (A) may be a method of applying the dispersion liquid containing at least one carbon material selected from carbon nanotubes, graphene, and fullerenes.

[0017] In the above production method, The step (B) may be a method of applying the radiation-sensitive resin composition containing a quinonediazide compound as the photoacid generator.

[0018] In the above production method, The step (B) may be a method of applying the radiation-sensitive resin composition containing a colorant.

[0019] In the above production method, The step (A) may be a method of applying the dispersion liquid containing the first polymer in a range of 1,000 mass% to 100,000 mass% with respect to the content of the carbon material.

[0020] In the above production method, The step (A) may be a method of applying the dispersion liquid by any coating method of spin coating method, slit coating method, bar coating method, spray coating method, and inkjet method.

[0021] In the above manufacturing method, Step (B) may also be a method of applying the radiation-sensitive resin composition by any of the following coating methods: spin coating, slit coating, bar coating, spray coating, or inkjet coating.

[0022] In the above manufacturing method, The aforementioned step (C) may be a method of exposure through a halftone mask.

[0023] In the above manufacturing method, Step (D) may also be a method of removing the first polymer and the second polymer using an alkaline aqueous solution, an organic solvent, or a mixture thereof as a developer.

[0024] In the above manufacturing method, After performing step (D), step (E) is performed to remove the exposed carbon material by etching, After performing step (E), a step (F) is performed to further expose a portion of the second film, The method may also include a step (G) of removing the first polymer and the second polymer from the portion exposed in step (F).

[0025] The dispersion of the present invention is This is a dispersion used in the above manufacturing method.

[0026] The radiation-sensitive resin composition of the present invention, This is a radiation-sensitive resin composition used in the above manufacturing method.

[0027] The present invention's light-emitting element is This is a light-emitting element comprising a conductive film manufactured by the above manufacturing method. [Effects of the Invention]

[0028] According to the present invention, a method for manufacturing a conductive film is realized that has high conductivity and can evenly fix a conductive carbon material throughout the entire conductive film formation region. Furthermore, according to the present invention, a manufacturing method is realized that can efficiently remove the dispersant remaining in the conductive film and the polymer in the parts of the radiation-sensitive resin composition that have not been exposed. [Brief explanation of the drawing]

[0029] [Figure 1] This is a schematic diagram showing the overall configuration of one embodiment of a display panel. [Figure 2] This diagram schematically illustrates the process of forming a conductive film. [Figure 3] This diagram schematically illustrates the process of forming a conductive film. [Figure 4] This diagram schematically illustrates the process of forming a conductive film. [Figure 5] This diagram schematically illustrates the process of forming a conductive film. [Figure 6] This diagram schematically illustrates the process of forming a conductive film. [Figure 7] This is a photograph of the surface of a circuit board taken with an AFM (Automated Microscope). [Figure 8] This is a photograph of the surface of a circuit board taken with an AFM (Automated Microscope). [Modes for carrying out the invention]

[0030] The following describes, first, the configuration of the display panel 1 as one embodiment, and then, the details of one embodiment of the method for manufacturing the conductive film on the display panel 1. Finally, a verification and evaluation experiment was conducted to confirm the dispersibility and coatability of the dispersion and radiation-sensitive resin composition using one embodiment of the method for manufacturing the conductive film, and the details of this verification and evaluation experiment are described.

[0031] [Display panel] The overall configuration of one embodiment of the display panel 1 will be described. Figure 1 is a schematic diagram showing the overall configuration of one embodiment of the display panel 1. The display panel 1 has a base material 2, and one surface of the base material 2 is provided with an element region 2a and a peripheral region 2b.

[0032] The substrate 2 is made of a light-transmitting material, specifically, a glass substrate, a quartz substrate, or an organic resin substrate. An example of an organic resin substrate material is polyimide. The organic resin substrate can have a thickness of several micrometers to tens of micrometers, making it possible to realize a flexible sheet display.

[0033] Element region 2a is a region in which elements for displaying an image are formed. Element region 2a is provided with a lower electrode, and an insulating layer is provided on the lower electrode. An organic resin layer is provided on the insulating layer, and a conductive film is provided on the organic resin layer.

[0034] The material of the organic resin layer is an organic material containing a polymer having hydrocarbon groups. The material of the conductive film is carbon nanotubes (CNTs). As for the type of CNT, single-walled carbon nanotubes or multi-walled carbon nanotubes with two or more layers can be used, and single-walled carbon nanotubes are preferred.

[0035] Conductive films made from carbon nanotubes exhibit varying transmittance depending on the film thickness, but they are transparent conductive films that transmit visible light.

[0036] The material constituting the organic resin layer is an organic resin material containing a polymer having hydrocarbon groups. While not particularly limited, examples of materials constituting the organic resin layer include polyimide resin, polyamide resin, polyether resin, and polyester resin. From the viewpoint of adhesion to carbon nanotubes, the material constituting the organic resin layer is preferably a material containing aromatic hydrocarbons, and more preferably a material containing polycyclic aromatic hydrocarbons.

[0037] The first film, which is a coating film for forming a conductive film in this embodiment, is formed by coating a dispersion containing carbon nanotubes and a first polymer, which is a dispersant. The first polymer is not particularly limited, but it is preferable to use a polymer mainly composed of polyamic acid having the structural unit shown in formula (1) in order to improve the dispersibility of carbon nanotubes. For reference, formula (1) is shown again.

[0038] [ka] (In formula (1), R 1 R is a tetravalent organic group that constitutes a tetracarboxylic acid, 2 (where n is a divalent organic group that constitutes a diamine, and n is a positive integer.)

[0039] R 1Specific examples of the tetravalent organic groups that constitute the tetracarboxylic acids shown include pyromellitic acid, 2,3,6,7-naphthalenetetracarboxylic acid, 1,2,5,6-naphthalenetetracarboxylic acid, 1,4,5,8-naphthalenetetracarboxylic acid, 2,3,6,7-anthracenetetracarboxylic acid, 1,2,5,6-anthracenetetracarboxylic acid, 3,3',4,4'-biphenyltetracarboxylic acid, 2,3,3',4-biphenyltetracarboxylic acid, bis(3,4-dicarboxyphenyl) ether, 3,3',4,4'-benzophenonetetracarboxylic acid, bis(3,4-dicarboxyphenyl) sulfone, bis(3,4-dicarboxyphenyl) methane, 2,2-bis(3,4-dicarboxyphenyl) propane, 1,1,1,3,3,3-hexafluoro-2,2- Examples include dianhydrides of aromatic tetracarboxylic acids such as bis(3,4-dicarboxyphenyl)propane, bis(3,4-dicarboxyphenyl)dimethylsilane, bis(3,4-dicarboxyphenyl)diphenylsilane, 2,3,4,5-pyridinetetracarboxylic acid, and 2,6-bis(3,4-dicarboxyphenyl)pyridine; dianhydrides of tetracarboxylic acids having an alicyclic structure such as 1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, 1,2,4,5-cyclohexanetetracarboxylic acid, 2,3,5-tricarboxycyclopentylacetic acid, and 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic acid; and dianhydrides of aliphatic tetracarboxylic acids such as 1,2,3,4-butanetetracarboxylic acid. These acid dianhydrides may be used as a single compound or in combination of multiple compounds.

[0040] R 2Specific examples of divalent organic groups that constitute diamines as shown include p-phenylenediamine, m-phenylenediamine, 2,5-diaminotoluene, 2,6-diaminotoluene, 4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethoxy-4,4'-diaminobiphenyl, diaminodiphenylmethane, diaminodiphenyl ether, 2,2'-diaminodiphenylpropane, bis(3,5-diethyl-4-aminophenyl)methane, diaminodiphenylsulfone, diaminobenzophenone, diaminonaphthalene, 1,4-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenyl)benzene, 9,10-bis(4-aminophenyl)anthracene, 1,3-bis(4-aminophenoxy) Examples include aromatic diamines such as xy)benzene, 4,4'-bis(4-aminophenoxy)diphenylsulfone, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis(4-aminophenyl)hexafluoropropane, and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane; alicyclic diamines such as bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, and 3,5-cholestanil diaminobenzoate; aliphatic diamines such as 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, and 1,6-diaminohexane; and silicon diamines such as 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane. These diamines may be used as a single compound or in combination of multiple compounds.

[0041] Furthermore, R in equation (1) above 1 It is preferable that the ring is a cyclobutane ring, as the cyclobutane ring is preferable because its ring structure decomposes upon light irradiation or heating, causing a structural change in the polyamic acid, which makes it easier to remove the polyamic acid, the first polymer. Furthermore, the dispersion may contain, for example, an organic solvent as a dispersion medium.

[0042] The radiation-sensitive resin composition for coating the first film to form an insulating layer pattern contains a polyamic acid (second polymer) having the structural site represented by formula (1) above, which is contained in the coating solution for forming the first film. Since the polyamic acid is soluble in alkaline aqueous solutions, it can be removed, for example, with an alkaline aqueous solution. In other words, an alkaline aqueous solution can be used as a developer.

[0043] The developer is preferably an alkaline aqueous solution, an organic solvent, or a mixture thereof, but any other solution that can remove the first polymer may be used. Another example of a polymer-developer combination is a polymer having a carboxyl group and an aqueous solution of TMAH (tetramethylammonium hydroxide).

[0044] The radiation-sensitive resin composition is a material that is applied to a first film to form a second film, and a pattern is formed on the conductive film by exposing and developing a portion of the second film. During this development process, the first polymer remaining in the first film and the first and second polymers in the exposed portion of the radiation-sensitive resin composition can be removed simultaneously in a single development step.

[0045] When the unexposed polymer is heated, a portion of its polyamic acid structure is dehydrated, resulting in a polyimide structure. Polyimide is used to form insulating layers due to its high insulating properties and excellent resistance to organic solvents. Such polyimide can be used in the bank layer formed to partition the light-emitting region in display panels such as organic EL displays.

[0046] The radiation-sensitive resin composition contains a polyamic acid represented by formula (1) and only needs to have a polyamic acid structure, and some substituents may differ. Furthermore, it may also contain an alkali-soluble resin other than polyamic acid. Examples of such alkali-soluble resins include polymers obtained by radical polymerization using an unsaturated compound containing a carboxyl group as a monomer as an alkali-soluble group. Other alkali-soluble resins include polysiloxanes, resins containing a cardo skeleton, phenol novolac resins, cresol novolac resins, biphenyl resins, bisphenol A type resins, bisphenol F type resins, resins having a dicyclopentanyl skeleton, resins having a trisphenolmethane skeleton, bisphenol F type epoxy resins, polyfunctional epoxy resins, flexible epoxy resins, brominated epoxy resins, and glycidyl Ester-type epoxy resins, phenoxy resins, biphenyl-type epoxy resins, siloxane resins, polyhydroxystyrene resins, styrene-hydroxystyrene copolymer resins, bisphenol A-type, bisphenol F-type, bisphenol AD-type, brome-containing bisphenol A-type, phenol novolac-type, cresol novolac-type, polyphenol-type, linear aliphatic-type, butadiene-type, urethane-type glycidyl ether-type epoxy resins, etc., can be used.

[0047] The radiation-sensitive resin composition contains a photoacid generator and functions as a positive-type radiation-sensitive material. Quinone diazide compounds are particularly preferred as the photoacid generator. Quinone diazide compounds generate carboxylic acids upon irradiation with radiation. By including a quinone diazide compound, the positive-type radiation-sensitive resin composition can be given positive-type radiation-sensitive properties, where the exposed portion is removed during the development process.

[0048] Preferably, the quinone diazide compound is a condensate of a compound having a phenolic hydroxyl group and naphthoquinone diazidosulfonic acid halide. Examples of compounds having a phenolic hydroxyl group include the following compounds.

[0049] [ka]

[0050] [ka]

[0051] Of these, 4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphenol and 1,1,1-tri(p-hydroxyphenyl)ethane are preferred as compounds having a phenolic hydroxyl group. Examples of the naphthoquinone diazide sulfonic acid halides mentioned above include 1,2-naphthoquinone diazide-4-sulfonic acid chloride and 1,2-naphthoquinone diazide-5-sulfonic acid chloride. Ester compounds (quinone diazide compounds) obtained from 1,2-naphthoquinone diazide-4-sulfonic acid chloride have absorption in the i-line (wavelength 365 nm) region and are therefore suitable for i-line exposure. On the other hand, ester compounds (quinone diazide compounds) obtained from 1,2-naphthoquinone diazide-5-sulfonic acid chloride have absorption over a wide range of wavelengths and are therefore suitable for exposure over a wide range of wavelengths.

[0052] Preferred quinone diazide compounds include a condensate of 4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphenol and 1,2-naphthoquinone diazide-5-sulfonic acid chloride, and a condensate of 1,1,1-tri(p-hydroxyphenyl)ethane and 1,2-naphthoquinone diazide-5-sulfonic acid chloride.

[0053] Quinone diazide compounds can be used alone or in combination of two or more. The content of the quinone diazide compound in the radiation-sensitive resin composition is preferably 1 to 100 parts by mass, and more preferably 5 to 50 parts by mass, per 100 parts by mass of polyamic acid. By setting the content of the quinone diazide compound within the above specific range, the difference in solubility between the irradiated and unirradiated portions in the alkaline aqueous solution used as a developer becomes large, resulting in good patterning performance. In addition, the solvent resistance of the resulting insulating film is also good.

[0054] When forming an organic EL bank, the photosensitive resin composition may include a colorant to impart reflective or light-shielding properties to it. Specifically, the colorant includes at least one colorant selected from the group consisting of white pigments, black organic colorants, black inorganic colorants, and colorants other than black. The colorant may be a mixture of two or more inorganic or organic colorants.

[0055] White pigments can be used to impart reflectivity to an organic EL bank. Examples of white pigments include alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, barium carbonate, calcium carbonate, lead sulfate, lead phosphate, zinc phosphate, silicon dioxide, zinc oxide, tin oxide, strontium sulfide, strontium titanate, barium tungstate, lead metasilicate, talc, kaolin, clay, bismuth chloride oxide, hollow silica particles, organic hollow particles, and core-shell particles.

[0056] The white pigment preferably contains at least one inorganic substance selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate, and is particularly preferably titanium oxide. Since the above inorganic substances have a high refractive index, they can improve the reflectivity of the formed cured film. Among these, titanium oxide has a particularly high refractive index and is also preferred from the viewpoint of its dispersion characteristics in solvents.

[0057] The lower limit of the average particle size of the white pigment is preferably 50 nm, more preferably 100 nm, and more preferably 200 nm. On the other hand, the upper limit is preferably 700 nm, more preferably 500 nm, and even more preferably 400 nm. When the average particle size of the white pigment is within the above range, good dispersibility and light scattering properties can be achieved, and as a result, light reflectivity and light shielding properties can be improved.

[0058] To impart light-shielding properties to an organic EL bank, at least one colorant selected from the group consisting of black organic colorants, black inorganic colorants, and colorants other than black can be used. Specifically, any black inorganic colorant, any black organic colorant, and any colorant other than black known in the art can be used. For example, any compound classified as a pigment in ColorIndex (published by the Japanese Society of Dyeing and Color Technology) and dyes known in the art can be used. Specific examples of black organic colorants include at least one selected from the group consisting of aniline black, lactam black, and perylene black.

[0059] Among these, using lactam black represented by the following formula (for example, Irgaphor Black S 0100 CF manufactured by BASF) is preferable in terms of optical density, dielectric constant, transmittance, etc. [ka]

[0060] Furthermore, as the perylene black, it is preferable to use perylene black represented by the following formula (LumogenBlack FK42809, manufactured by BASF) in terms of optical density, dielectric constant, transmittance, etc. [ka]

[0061] Specific examples of black inorganic colorants include carbon black, titanium black, metal oxides such as Cu-Fe-Mn oxides, and synthetic iron black. From the viewpoint of pattern characteristics and chemical resistance, carbon black is preferred.

[0062] Specific examples of colorants other than black include CI Pigment Violet 13, 14, 19, 23, 25, 27, 29, 32, 33, 36, 37, and 38, and CI Pigment Blue 15 (15:3, 15:4, 15:6, etc.), 16, 21, 28, 60, 64, and 76. Specifically, colorants other than black may include at least one colorant selected from the group consisting of blue colorants and violet colorants. From the viewpoint of reducing reflectivity, preferred among these are CI Pigment Blue 15:6 and 60 or CI Pigment Violet 23.

[0063] The coloring agent is contained in an amount of 1 to 50% by mass, preferably 5 to 20% by mass, relative to the total amount of the photosensitive resin composition. When the coloring agent is present in an amount of 1 to 50% by mass, the optical density is excellent, and when it is present in an amount of 5 to 20% by mass, the optical density can be further improved. The solid content in the photosensitive resin composition refers to the total amount of components after the solvent has been removed.

[0064] The radiation-sensitive resin composition may contain other optional components such as photoacid generators (other than quinone diazide compounds), antioxidants, polyfunctional acrylates, surfactants, adhesion aids, inorganic oxide particles, compounds having cyclic ether groups, and solvents. These other optional components may be used individually or in combination of two or more.

[0065] [Manufacturing method] The method for manufacturing a conductive film will be explained with reference to Figures 2 to 6. Figures 2 to 6 are schematic diagrams showing the process of forming a conductive film. In this embodiment, the conductive film is fabricated on an organic resin layer formed on a substrate.

[0066] As shown in Figure 2, an organic resin layer 20 is formed on the substrate 2, which has an insulating layer 10 formed on it, by applying an organic resin material containing a polymer having hydrocarbon groups.

[0067] First, as shown in Figure 2, a dispersion containing polyamic acid 30a, CNT 30c, and an organic solvent as a dispersion medium is applied to the substrate on which the organic resin layer 20 is formed, thereby forming a pattern of the coated film 30 (step S1).

[0068] Then, as the coating film 30 dries and the organic solvent evaporates, the polyamic acid 30a and CNT 30c are fixed onto the organic resin layer 20, as shown in Figure 3, forming the first film 40 (step S2). Steps S1 and S2 correspond to process (A).

[0069] In step S1, a pattern is formed on the organic resin layer 20 by coating a dispersion containing CNTs using printing techniques such as casting, screen printing, or inkjet printing.

[0070] After the first film 40 is formed on the organic resin layer 20, as shown in Figure 4, a radiation-sensitive resin composition is applied to the organic resin layer 20 with the first film 40 formed on it to form the second film 50 (step S3). This step S3 corresponds to process (B).

[0071] After the second film 50 is formed, the exposed portion A1 of the second film 50 is exposed through the photomask 60, as shown in Figure 5 (step S4). This step S4 corresponds to process (C).

[0072] Since the radiation-sensitive resin composition for forming the second film 50 contains a quinonediazide compound, it functions as a positive-type radiation-sensitive resin material. In the exposed portion A1, the quinonediazide compound changes to an indenecarboxylic acid structure, making it soluble in an aqueous alkali solution.

[0073] When exposing, it is usually exposed through a photomask having a predetermined pattern. As the radiation L1 used for exposure, radiation having a wavelength in the range of 190 nm to 450 nm is preferable, and radiation including ultraviolet light of 365 nm is more preferable. As the exposure dose, 500 J / m 2 ~6,000 J / m 2 is preferable, and 1,500 J / m 2 ~l,800 J / m 2 is more preferable. This exposure dose is a value measured by an illuminometer ("OAI model356" of OAI Optical Associates) for the intensity of the radiation at a wavelength of 365 nm. A halftone mask can be used for the photomask 60. By using the halftone mask, it becomes possible to control the shape of the obtained pattern. Specifically, it becomes possible to control the inclination of the pattern side wall (also referred to as a tapered shape).

[0074] After step S4, as shown in FIG. 6, by developing using an aqueous alkali solution as a developer after exposure, the polyamic acid 30a, which is the second polymer of the radiation-sensitive resin composition layer in the exposed portion A1, is removed (step S5). This step S5 corresponds to step (D).

[0075] Through the steps of steps S1 to S5 above, on the organic resin layer 20, a region where a conductive film 70 is partially formed and the second film 50 remains in another part is formed. The conductive film 70 has a structure in which CNT30c is dispersed, as shown in FIG. 6, and is transparent, that is, shows permeability to visible light.

[0076] The first polymer in the dispersion and the second polymer contained in the radiation-sensitive resin composition are polymers having a polyamic acid structure. Polymers having a polyamic acid structure have carboxyl groups in their molecules, and therefore exhibit high solubility in alkaline aqueous developer solutions.

[0077] By developing with an alkaline aqueous developer, it becomes possible to simultaneously remove the polyamic acid 30a from the first film 40 of the exposed area A1 and the polyamic acid 30a from the second film 50. Then, by heating and drying after development, it becomes possible to form a conductive film 70 from which the polyamic acid has been removed and a pattern that has been transformed from polyamic acid into a polyimide structure.

[0078] Suitable alkaline aqueous solutions include, for example, KOH (potassium hydroxide), NaOH (sodium hydroxide), sodium carbonate, and TMAH (tetramethylammonium hydroxide) aqueous solutions.

[0079] After step S5, further development can remove the polyamic acid 30a of the first film 40 and the polyamic acid 30a of the second film 50 in the exposed area A1 simultaneously, and etching can be performed on the exposed carbon material. This etching process patterns the film made of carbon material (step S6). This step S6 corresponds to step (E).

[0080] Alternatively, after step S5, the remaining radiation-sensitive resin composition forming the second film 50 may be further exposed to light through a photomask to expose the exposed portion A2 of the second film 50 (step S7), similar to step S4, and then developed with a developer solution, similar to step S5, to create an exposed portion of the new conductive film 70 (step S8). Steps S7 and S8 correspond to steps (F) and (G), respectively.

[0081] By performing this process, the conductive film 70 can be precisely patterned using a radiation-sensitive resin composition, and at the same time, it becomes possible to form a conductive film 70 from which polyamic acid has been removed and a pattern in which polyamic acid has been transformed into a polyimide structure. As a result of this effect, for example, finer wiring can be formed in substrates for touch panels and solar cells, thereby contributing to more complex wiring designs and higher integration than before.

[0082] As for the application method of the dispersion, appropriate methods such as spray coating, roll coating, rotary coating (spin coating), slit die coating (slit coating), bar coating (bar coating), solution immersion, and inkjet can be employed. The conductive film is formed to a certain thickness by a predetermined method.

[0083] Similarly, the method for applying the radiation-sensitive resin composition can also be any appropriate method, such as spray coating, roll coating, rotary coating (spin coating), slit die coating (slit coating), bar coating (bar coating), solution immersion, or inkjet. The conductive film is formed to a certain thickness by a predetermined method.

[0084] Furthermore, it is preferable that the dispersion applied on the organic resin layer 20 contains a first polymer in the range of 1,000% to 100,000% by mass relative to CNT30a. By having the first polymer content relative to CNT30c within this range, non-uniformity of the solvent during the drying process is prevented, and aggregation and localization of CNT30c on the organic resin layer 20 during drying is suppressed.

[0085] Furthermore, in order to improve the uniformity of the conductive film 70, it is preferable to perform a step to remove the solvent by a baking step and a solution immersion step to remove the first polymer. Among the coating methods described above, the slit die coating method or the inkjet method is preferred from the viewpoint of uniformity of the coating film thickness and liquid saving. Moreover, the inkjet method is more preferred from the viewpoint that electrode patterning can be performed by coating alone.

[0086] By employing the conductive film formation method described above, the conductive film formed on the organic resin layer exhibits unique electrical properties, excellent adhesion to the organic resin layer, and good chemical resistance and flatness.

[0087] Furthermore, when the conductive film 70 is formed on the organic resin layer 20, the CNTs 30c contained in the first film 40 exhibit high adhesion to the organic resin layer 20, resulting in the effect that they are less likely to localize due to solvent aggregation during the drying process. Moreover, even in the solution immersion process to remove the first polymer, peeling and aggregation of CNTs do not occur, suppressing the localization of CNTs, and even when forming wiring with a very narrow pattern width, the effect of preventing localized high-resistance areas and disconnections is also obtained.

[0088] To obtain the above effects, the method for manufacturing the conductive film may include forming an insulating layer 10 on a substrate 2, forming an organic resin layer 20 after forming the insulating layer 10, and forming a conductive film 70 made of CNT 30a on the organic resin layer 20.

[0089] Furthermore, it is preferable that the CNT30a contained in the dispersion includes at least one of single-walled nanotubes or multi-walled nanotubes. According to this method for manufacturing conductive films, it is possible to form semiconductor devices with even better adhesion between the organic resin layer 20 and the conductive film 70. In addition, the manufacturing yield is further improved. As a carbon material other than carbon nanotubes, for example, graphene or fullerene, which have excellent conductivity, can be used, but any material that exhibits conductivity may be used.

[0090] Furthermore, the above-described method for manufacturing the conductive film can be applied not only to the manufacture of the display panel 1 but also to the manufacture of all kinds of electronic devices. However, given that a transparent conductive film can be formed, it is particularly suitable for the manufacture of display panels, touch panels, optical devices, and the like.

[0091] The organic resin layer may also be formed by the following process. The organic resin layer formed by the following process exhibits unique electrical properties, excellent adhesion to CNTs, and good chemical resistance and flatness. Furthermore, this formation method suppresses thermal degradation of the substrate and the elements attached to the substrate because heating is performed at 140°C or below. Each process is described in detail below.

[0092] [Process (1)] In this process, a coating film is formed on the insulating layer using the radiation-sensitive resin composition. Specifically, a coating film of the radiation-sensitive resin composition is formed by applying the radiation-sensitive resin composition to the surface of the insulating layer. It is preferable to perform a pre-bake treatment in this step to remove the solvent contained in the coating film.

[0093] As a method for applying the radiation-sensitive composition, appropriate methods such as spraying, roll coating, rotary coating (spin coating), slit die coating, bar coating, and inkjet coating can be used. Among these, the inkjet coating method is preferred. The pre-baking conditions vary depending on the type and proportion of each component, but can be, for example, 60°C to 130°C for 30 seconds to 10 minutes. The film thickness of the formed coating after pre-baking is preferably 0.1 μm to 5 μm, more preferably 0.1 μm to 1 μm, and even more preferably 0.2 μm to 0.4 μm.

[0094] [Process (2)] In this process, a portion of the coating film is irradiated (exposed) with radiation. Specifically, the coating film formed in process (1) is irradiated with radiation through a photomask having a predetermined pattern. Depending on the pattern of the photomask used, it is possible to form patterns such as contact holes or line and space formation.

[0095] Examples of radiation used in this process include ultraviolet rays, far-ultraviolet rays, X-rays, and charged particle beams. The photomask used may also be a multi-tone photomask such as a halftone mask or a graytone mask.

[0096] Examples of ultraviolet light include g-rays (wavelength 436 nm), i-rays (wavelength 365 nm), and KrF excimer laser light (wavelength 248 nm). Examples of X-rays include synchrotron radiation. Examples of charged particle beams include electron beams. Of these radiations, ultraviolet light is preferred, and ultraviolet light with a wavelength of 200 nm to 380 nm is more preferred. The radiation exposure dose is 1,000 J / m². 2 ~20,000 J / m 2 It is preferable.

[0097] In some cases, post-exposure baking (PEB) may be performed after exposure.

[0098] [Process (3)] In this step, the irradiated coating is developed. Specifically, the irradiated coating from step (2) is developed using a developer to remove the irradiated areas. As the developer, for example, an alkaline aqueous solution in which potassium hydroxide, sodium carbonate, triethanolamine, tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide, etc. are dissolved in water, or an organic solvent such as ethanol, isopropyl alcohol, acetone, ethyl acetate, or butyl acetate can be used.

[0099] As for the development method, appropriate methods such as the liquid-filling method, dipping method, agitation immersion method, and shower method can be employed. The development time varies depending on the composition of the radiation-sensitive resin composition, but can be, for example, 30 to 120 seconds.

[0100] [Process (4)] In this process, the coating film after step (3) above can be heated. The coating film is hardened by heat treatment (post-bake) using a heating device such as a hot plate or oven.

[0101] The upper limit of the heating temperature in this process is 140°C, but the heating temperature may also be 130°C, 125°C, or 115°C. According to this forming method, the coating film can be formed into a good shape even with relatively low heating temperatures.

[0102] [Verification and evaluation experiment] Finally, we conducted a verification and evaluation experiment to confirm the extent to which the above manufacturing method is effective in dispersing CNTs contained in the dispersion liquid applied to the substrate, which is described below.

[0103] [Synthesis Example 1: Synthesis of Polyamic Acids] 80 g of propylene glycol monoethyl ether acetate (PGMEA) was added to the reaction vessel as a polymerization solvent. Then, a diamine compound and a tetracarboxylic acid dianhydride, a tetracarboxylic acid derivative, were added to the polymerization solvent so that the solid content concentration was 20% by weight relative to the total 80 g of polymerization solvent. In this example, 2,2'-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF) was used as the diamine compound. After dissolving it, 2,3,5-tricarboxycyclopentyl acetate dianhydride (TCA) and 1,3-dihydro-1,3-dioxo-5-isobenzofurancarboxylic acid-1,4-phenylene ester (TMHQ) were added as tetracarboxylic acid dianhydrides, with a molar ratio of TCA:TMHQ = 95:5. Then, 90 moles of tetracarboxylic acid dianhydrides were added to 100 moles of the total amount of diamine compound. After that, the mixture was reacted at 60°C for 3 hours. This yielded approximately 100 g of polyamic acid solution. This solution containing polyamic acid will be referred to as "PAA" below.

[0104] [Synthesis Example 2: Synthesis of Acrylic Polymers] In a flask equipped with a condenser and a stirrer, 8 parts by mass of azobisisobutyronitrile and 220 parts by mass of diethylene glycol methyl ethyl ether were charged. Subsequently, 15 parts by mass of methacrylic acid, 40 parts by mass of benzyl methacrylate, 10 parts by mass of α-methyl-p-hydroxystyrene, 10 parts by mass of styrene, and 25 parts by mass of n-butyl methacrylate were charged. After purging with nitrogen, the temperature of the solution was raised to 90°C while gently stirring, and polymerization was carried out by maintaining this temperature for 5 hours to obtain a solution containing an acrylic polymer. This solution containing the acrylic polymer will be hereinafter referred to as "PAc".

[0105] [Comparative Synthesis Example 1: Synthesis of Styrene Polymers Without Carboxyl Groups] Eight parts by mass of azobisisobutyronitrile and 220 parts by mass of diethylene glycol methyl ethyl ether were charged into a flask equipped with a condenser and a stirrer. Subsequently, 50 parts by mass of styrene and 50 parts by mass of benzyl methacrylate were charged, and after purging with nitrogen, the temperature of the solution was raised to 90°C while stirring slowly, and polymerization was carried out by maintaining this temperature for 5 hours to obtain a solution containing a styrene-based polymer without carboxyl groups. This solution containing a styrene-based polymer without carboxyl groups will be hereinafter referred to as "PSt".

[0106] [Preparation of CNT-containing dispersion] 10 parts by mass of single-walled carbon nanotubes (SWNT) and 1,000 parts by mass of polymer (PAA) obtained in Synthesis Example 1 as the first polymer were placed in a container, to which 100,000 parts by mass of NMP was added as a solvent. Then, ultrasonic dispersion was performed for 60 minutes to prepare dispersion (S-1).

[0107] Next, 100,000 parts by mass of NMP was added as a solvent to a container containing 10 parts by mass of single-wall carbon nanotubes (SWNT) and 1,000 parts by mass of the polymer (PAc) obtained in Synthesis Example 2 as the first polymer. Then, ultrasonic dispersion was performed for 60 minutes to prepare dispersion (S-2).

[0108] Next, 100,000 parts by mass of NMP was added as a solvent to a container containing 10 parts by mass of single-wall carbon nanotubes (SWNT) and 1,000 parts by mass of the polymer (PSt) obtained in Comparative Synthesis Example 1 as the first polymer. Then, ultrasonic dispersion was performed for 60 minutes to prepare the dispersion (ss-1).

[0109] [Preparation of radiation-sensitive resin composition (P-1)] To 100 parts by mass (solids) of the polymer (PAA) obtained in Synthesis Example 1, 30 parts by mass of a quinone diazide compound (4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphenol and a condensate of 1,2-naphthoquinone diazide-5-sulfonic acid chloride) as a photoacid generator and 3 parts by mass of an adhesion aid (1:3-glycidyloxypropyltrimethoxysilane) were mixed. The mixture was then dissolved in a solvent (propylene glycol monomethyl ether acetate (PGMEA)) to a solids content of 30% by mass, and the mixture was filtered through a membrane filter with a pore size of 0.2 μm to prepare a radiation-sensitive resin composition (P-1).

[0110] [Preparation of radiation-sensitive resin composition (P-2)] To 100 parts by mass (solids) of the polymer (PAc) obtained in Synthesis Example 2, 30 parts by mass of a quinone diazide compound (4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphenol and a condensate of 1,2-naphthoquinone diazide-5-sulfonic acid chloride) as a photoacid generator and 3 parts by mass of an adhesion promoter (1:3-glycidyloxypropyltrimethoxysilane) were mixed. The mixture was then dissolved in a solvent (propylene glycol monomethyl ether acetate (PGMEA)) to a solids content of 30% by mass, and the mixture was filtered through a membrane filter with a pore size of 0.2 μm to prepare a radiation-sensitive resin composition (P-2).

[0111] [Preparation of radiation-sensitive resin composition (P-3)] To an amount equivalent to 100 parts by mass (solids) of the polymer (PAA) obtained in Synthesis Example 1, 30 parts by mass of a quinone diazide compound (4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphenol and a condensate of 1,2-naphthoquinone diazide-5-sulfonic acid chloride) as a photoacid generator, 10 parts by mass of lactam black (Irgaphor Black S 0100 CF, manufactured by BASF) as a coloring agent, and 3 parts by mass of an adhesion aid (1:3-glycidyloxypropyltrimethoxysilane) were mixed. After adding a solvent (propylene glycol monomethyl ether acetate (PGMEA)) to achieve a solids content of 30% by mass, a radiation-sensitive resin composition (P-3) was prepared.

[0112] [Preparation of radiation-sensitive resin composition (pp-1)] To 100 parts by mass (solids) of polymer (PSt) obtained in Comparative Synthesis Example 1, 30 parts by mass of a quinone diazide compound (4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphenol and a condensate of 1,2-naphthoquinone diazide-5-sulfonic acid chloride) as a photoacid generator and 3 parts by mass of an adhesion aid (1:3-glycidyloxypropyltrimethoxysilane) were mixed. The mixture was then dissolved in a solvent (propylene glycol monomethyl ether acetate (PGMEA)) to a solids content of 30% by mass, and the mixture was filtered through a membrane filter with a pore size of 0.2 μm to prepare a radiation-sensitive resin composition (pp-1).

[0113] [Evaluation of CNT-containing dispersion] (1) Evaluation of CNT dispersion The above dispersions (S-1), (S-2), and (ss-1) were left to stand on a flat surface at 25°C. The evaluation was as follows: "Excellent (A)" if the CNTs remained in their initial dispersion state without settling after 1 week; "Good (B)" if the CNTs remained in their initial dispersion state without settling after 3 days; "Good (C)" if the CNTs remained in their initial dispersion state without settling after 1 day; "Acceptable (D)" if the CNTs remained in their initial dispersion state without settling after 3 hours; and "Poor (E)" if settling or aggregation of CNTs was observed within 3 hours. The results are shown in Table 1.

[0114] (2) Evaluation of CNT dispersion stability (durability) A dispersion was prepared in the same manner as in (1) above. The obtained dispersion was left to stand on a flat surface at 40°C, and the dispersion state over time was observed. The evaluation was as follows: if the CNTs did not settle and the initial dispersion state was maintained after one week, it was "Excellent (A)"; if the CNTs did not settle and the initial dispersion state was maintained until three days, it was "Good (B)"; if the CNTs did not settle and the initial dispersion state was maintained until one day, it was "Acceptable (D)" if the CNTs did not settle and the initial dispersion state was maintained until three hours; and if settling or aggregation was observed after three hours, it was "Poor (E)". The results are shown in Table 1.

[0115] (3) Evaluation of the applicability of the dispersion The dispersions (S-1), (S-2), and (ss-1) obtained above were applied by spin coating onto a glass substrate on which an organic resin layer had been formed, and dried on an 80°C hot plate for 10 minutes to form a coating film with a thickness of 0.1 μm in the center of the substrate. This coating film was observed under a 50x magnification microscope to check for unevenness in film thickness and the presence or absence of pinholes. The evaluation was as follows: if neither unevenness in film thickness nor pinholes were observed, the coating performance was "excellent (A)"; if at least one of unevenness in film thickness or pinholes was slightly observed, the coating performance was "good (B)"; and if at least one of unevenness in film thickness or pinholes was clearly observed, the coating performance was "poor (C)". The results are shown in Table 1.

[0116] [Evaluation of radiation-sensitive resin compositions] The substrates on which the coated film is formed are designated as substrate (S-1), substrate (S-2), and substrate (ss-1).

[0117] (4) Evaluation of the applicability of the radiation-sensitive resin composition Radiation-sensitive resin compositions (P-1), (P-2), (P-3), and (pp-1) were applied to substrates (S-1), (S-2), and (ss-1) by spin coating, and dried on a hot plate at 90°C for 2 minutes to form a coating film with a thickness of 4 μm. This coating film was observed under a microscope at 50x magnification to check for unevenness in film thickness and the presence or absence of pinholes. The evaluation was as follows: if neither unevenness in film thickness nor pinholes were observed, the coating performance was "excellent (A)"; if at least one of unevenness in film thickness or pinholes was slightly observed, the coating performance was "good (B)"; and if at least one of unevenness in film thickness or pinholes was clearly observed, the coating performance was "poor (C)". The results are shown in Table 2.

[0118] (5) Evaluation of pattern shape Substrates coated with each of the above radiation-sensitive resin compositions were exposed to 500 mJ / cm² of radiation through a photomask having a 10 μm line-and-space pattern using an exposure machine (Canon's "MPA-600FA" (GHI mixed)). 2 The images were exposed to light at the specified exposure level and then developed using the liquid-to-liquid method with a 2.38% by mass aqueous solution of tetramethylammonium hydroxide at 23°C for 80 seconds. Subsequently, they were washed with ultrapure water for 1 minute and then dried to form a 10 μm line-and-space pattern.

[0119] Subsequently, the obtained pattern shape was evaluated using a scanning electron microscope (SEM). A pattern with a forward taper cross-section was rated as "Good (A)", a pattern with a taper angle smaller than a forward taper and nearly perpendicular to the substrate was rated as "Acceptable (B)", and a pattern with undissolved residue in the gaps and insufficient development was rated as "Poor (C)". When applied to organic EL bank material, a pattern with a forward taper cross-section is preferable because it allows for smooth film formation of the light-emitting material, preventing thinning or interruption of parts of the thin film layer and preventing defects such as uneven brightness within the light-emitting region. The results are shown in Table 2.

[0120] (6) Evaluation of CNT removal capability Regarding the patterned substrate obtained as described above, the underlying CNT conductive layer can be confirmed in the space areas of the line-and-space pattern, provided that the radiation-sensitive resin composition coating film is completely removed during development.

[0121] Figures 7 and 8 are photographs of the surface of the empty portion of the substrate taken with an AFM (atomic force scanning microscope). Figure 7 is an example of a photograph of a substrate surface in which the irregularities of CNTs are observed, and Figure 8 is an example of a photograph of a substrate surface in which the irregularities of CNTs are not observed with AFM, i.e., the CNTs are covered with resin and the first polymer. The first polymer on the surface is removed and exposed CNTs (carbon nanotubes) are visible as shown in Figure 7 is classified as "Good (A)", partially exposed CNTs are classified as "Acceptable (B)" as shown in Figure 8, and the surface is covered with resin and CNT exposure is not visible, or the film formation is poor and cannot be determined is classified as "Poor (C)".

[0122] (7) Judgment criteria In the evaluation of the dispersion and the evaluation of the radiation-sensitive resin composition on the substrate, any sample that showed a "poor" result in even one of these evaluations was judged as NG (Not Good).

[0123] The results above are summarized in Tables 1 and 2 below.

[0124] [Table 1]

[0125] [Table 2] [Explanation of symbols]

[0126] 1: Display panel 2: Base material 10: Insulating layer 20: Organic resin layer 30: Coating film 40: 1st membrane 50:Second membrane 60: Photomask 70: Conductive layer 80: Pattern

Claims

1. Step (A) involves applying a dispersion containing a carbon material and a first polymer having one of the functional groups of a carboxyl group, a hydroxyl group, or a phenolic hydroxyl group onto the main surface of a substrate and drying it to form a first film. Step (B) involves applying a radiation-sensitive resin composition containing a second polymer having one of the functional groups of a carboxyl group, a hydroxyl group, or a phenolic hydroxyl group, and a photoacid generator onto the first film to form a second film. A step (C) of exposing a portion of the second film, A method for manufacturing a conductive film, comprising the step (D) of removing the first polymer and the second polymer from the portion exposed in step (C) after performing step (C).

2. The method for producing a conductive film according to claim 1, wherein step (A) is to coat the first polymer having a polyamic acid structure, and step (B) is to coat the second polymer having a polyamic acid structure.

3. The method for producing a conductive film according to claim 2, wherein step (A) involves applying the first polymer having a polyamic acid structure and the dispersion containing an organic solvent.

4. The method for producing a conductive film according to claim 1, wherein step (B) involves applying the radiation-sensitive resin composition containing the second polymer, which is mainly composed of a polyamic acid having a structural unit represented by the following general formula (1). 【Chemistry 1】 (In formula (1), R 1 R is a tetravalent organic group that constitutes a tetracarboxylic acid. 2 (where n is a divalent organic group that constitutes a diamine, and n is a positive integer.)

5. The method for producing a conductive film according to claim 1, wherein step (A) involves applying the dispersion containing at least one carbon material selected from carbon nanotubes, graphene, and fullerene.

6. The method for producing a conductive film according to claim 1, wherein step (B) is to apply the radiation-sensitive resin composition containing a quinone diazide compound as the photoacid generator.

7. The method for producing a conductive film according to claim 1, wherein step (B) is to apply the radiation-sensitive resin composition containing a coloring agent.

8. The method for producing a conductive film according to claim 1, wherein step (A) is to apply the dispersion containing the first polymer in an amount ranging from 1,000% by mass to 100,000% by mass relative to the carbon material content.

9. The method for manufacturing a conductive film according to claim 1, wherein step (A) involves applying the dispersion by one of the following coating methods: spin coating, slit coating, bar coating, spray coating, or inkjet.

10. The method for producing a conductive film according to claim 1, wherein step (B) involves applying the radiation-sensitive resin composition by one of the following coating methods: spin coating, slit coating, bar coating, spray coating, or inkjet.

11. The method for manufacturing a conductive film according to claim 1, wherein step (C) is exposure through a halftone mask.

12. The method for producing a conductive film according to claim 2, wherein step (D) removes the first polymer and the second polymer using an alkaline aqueous solution, an organic solvent, or a mixture thereof as a developer.

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