Method for manufacturing an element mounting means

Abstract

To provide element placement means becoming capable of easily attaching a light-emitting element and a light-receiving element thereto, and to provide a manufacturing method of the element installation means, and a manufacturing method of a smoke detector thereof.SOLUTION: According to an element placement part 15 where a light-emitting part 17 and a light-receiving part 18 of a sensor for sensing smoke by receiving scattering light generated by scattering light from the light-emitting part 17 due to the smoke, with the light-receiving part 18 are placed; there are provided a conductive light-emitting side electrode part for placing the light-emitting part 17 via electrical connection thereof, and a conductive light-receiving side electrode part for placing the light-receiving part 18 via electrical connection thereof. The light-emitting side electrode part and the light-receiving side electrode part are integrally formed on a common lead frame. The light-emitting side electrode part and the light-receiving side electrode part are arranged by corresponding to a first element angle constituting a scattering angle indicated by an intersection angle between a light-emitting axis of the light-emitting part 17 and a light-receiving axis of the light-receiving part 18.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an element mounting means, a method for manufacturing electrode means, and a method for manufacturing a smoke sensor.

Background Art

[0002] Conventionally, there has been known a smoke sensor that detects smoke by receiving scattered light scattered by smoke in a smoke detection space from a light emitting element with a light receiving element (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in a conventional smoke sensor, since the light emitting element and the light receiving element are directly attached to a smoke detection unit main body for partitioning a part of the smoke detection space in the smoke sensor, it is necessary to accurately attach each element to a relatively narrow portion (for example, a recess for attaching each element, etc.) in the smoke detection unit main body, which may be troublesome. Therefore, there has been a demand for a technology that enables easy attachment of the light emitting element and the light receiving element.

[0005] The present invention has been made in view of the above problems, and an object thereof is to provide an element mounting means, a method for manufacturing electrode means, and a method for manufacturing a smoke sensor that enable easy attachment of a light emitting element and a light receiving element.

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, according to claim 1 Element mounting meansThe manufacturing method involves a light-emitting element and an element mounting tool for a smoke detector that detects smoke by receiving scattered light, which is emitted from a light-emitting element and scattered by smoke, with a light-receiving element. Step A manufacturing method comprising an electrode means comprising a conductive light-emitting element side electrode means for electrically connecting and mounting the light-emitting element, and a conductive light-receiving element side electrode means for electrically connecting and mounting a light-receiving element that is paired with the light-emitting element side electrode means. Both common conductive The steps of integrally forming on the frame body, and in the common frame body, a pair The light-emitting element side electrode means and the light-receiving element side electrode means to share The steps include holding it with a conventional insulating material, and Shared notes Common insulating material Keep held The pair of light-emitting electrode means and the light-receiving electrode means are insulated from each other. Separated from the common frame body Then, the pair of light-emitting electrode means and the light-receiving electrode means are removed from the element mounting means, which is held by the common insulating member. Includes steps and

[0007] Furthermore, the claim described in claim 2 Element mounting means The method for manufacturing is described in claim 1. Element mounting means In the manufacturing method, the light-emitting element side electrode means and the light-receiving element side electrode means are arranged in accordance with the first element angle that constitutes the scattering angle, which is indicated by the intersection angle between the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element.

[0008] Furthermore, the claim described in claim 3 Element mounting means The method for manufacturing is described in claim 1. Element mounting means In the manufacturing method, The aforementioned photodetector-side electrode means is Shielding that functions as an electromagnetic shield for the light-receiving element Step include.

[0009] Also, the claim described in claim 4 Element mounting means The method for manufacturing is described in claim 1. Element mounting means The manufacturing method further includes the step of bending the light-emitting electrode means or the light-receiving electrode means according to the scattering angle indicated by the intersection angle of the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element. [Effects of the Invention]

[0010] According to the manufacturing method of the electrode means described in claim 1, the problems of the present application can be solved.

Brief Description of Drawings

[0011] [Figure 1] It is a diagram for explaining the installation state of the sensor. [Figure 2] It is an exploded perspective view of components of a part of the sensor. [Figure 3] It is a perspective view of the smoke detection unit main body. [Figure 4] It is a perspective view of the smoke detection unit main body. [Figure 5] It is a perspective view of the element mounting part. [Figure 6] It is a perspective view of the element mounting part. [Figure 7] It is a front view of the element mounting part. [Figure 8] It is a plan view of the element mounting part. [Figure 9] It is a rear view of the element mounting part. [Figure 10] It is a bottom view of the element mounting part. [Figure 11] It is a right side view of the element mounting part. [Figure 12] It is a left side view of the element mounting part. [Figure 13] It is a plan view of a plurality of lead frames. [Figure 14] It is a plan view of one lead frame. [Figure 15] It is a partial enlarged view of FIG. 14. [Figure 16] It is a partial enlarged view of FIG. 14. [Figure 17] It is a plan view showing a lead frame in a state where a holding member or the like is formed. [Figure 18] It is a bottom view showing a lead frame in a state where a holding member or the like is formed. [Figure 19] It is a plan view showing a separated holding member or the like. [Figure 20] It is a front view showing a circuit board in a state where an element mounting part is mounted. [Modes for carrying out the invention]

[0012] Embodiments of the method for manufacturing the element mounting means, electrode means, and smoke detector according to the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to these embodiments.

[0013] [Basic Concepts of the Embodiments] First, let's explain the basic concepts of the embodiment.

[0014] "Element mounting means" refers to means for mounting the light-emitting element and light-receiving element of a smoke detector, which detects smoke by receiving scattered light, which is emitted from the light-emitting element and scattered by the smoke, with a light-receiving element. For example, it includes an electrode means on the light-emitting element side and an electrode means on the light-receiving element side.

[0015] The "light-emitting element side electrode means" is a conductive element for electrically connecting and mounting the light-emitting element, and the "photodetector side electrode means" is a conductive element for electrically connecting and mounting the photodetector. These light-emitting element side electrode means and photodetector side electrode means are integrally formed on a common frame.

[0016] In the embodiments described below, each component of the present invention will be explained using a smoke detector installed on the ceiling, which is the installation surface, as an example.

[0017] [Specific details of the embodiment] Next, the specific details of the embodiment will be described.

[0018] (composition) First, let's explain the configuration of the detector. Figure 1 is a diagram illustrating the installation of the detector, and Figure 2 is an exploded perspective view of some of the components of the detector.

[0019] The detector 100 in Figure 1 is a smoke detector installed on the ceiling, which is the installation surface of the area to be monitored, for detecting fires occurring in the area to be monitored. The "area to be monitored" is the area that is monitored by the detector 100, and is a concept that includes, for example, rooms in a building, stairwells, or any other arbitrary area.

[0020] In the example shown in Figure 1, the sensor 100 is shown to be directly mounted on the mounting surface, but it may also be configured to be mounted via a mounting base, for example.

[0021] The detector 100 includes, for example, an outer cover 11 in Figure 1, a smoke detection unit cover 12 in Figure 2, an insect screen 13, a smoke detection unit body 14, an element mounting unit 15, a circuit board 16, a light-emitting unit 17, and a light-receiving unit 18. The circuit board 16 has a light-emitting control circuit that drives the light-emitting unit 17 (described later) and a light-receiving processing circuit that processes the light-receiving signal (photoelectrically converted signal) from the light-receiving unit 18, and is electrically connected to the light-emitting side connection unit 212 and the light-receiving side connection unit 312 (described later), respectively.

[0022] (Components: outer cover, smoke detection unit cover, insect screen) The outer cover 11 in Figure 1 is a housing means for housing the components of the sensor 100.

[0023] The smoke detection unit cover 12 in Figure 2 forms a smoke detection space 122 (Figure 1), and includes, for example, a labyrinth 121 that allows smoke to flow in or out of the smoke detection space 122 while shielding it from external light.

[0024] The insect screen 13 is a screen designed to prevent insects from entering the smoke detection space 122, and is, for example, an annular shape that covers the outer perimeter of the labyrinth 121.

[0025] (Components - Smoke detection unit main body) Figures 3 and 4 are perspective views of the smoke detection unit body. The smoke detection unit body 14 in Figure 2, together with the smoke detection unit cover 12, forms a smoke detection space 122, and the circuit board 16 is mounted on it. As shown in Figures 3 and 4, the smoke detection unit body 14 includes, for example, an opening 141 for a light-emitting element and an opening 142 for a light-receiving element.

[0026] The light-emitting element opening 141 is an opening for irradiating light from the light-emitting element 17, which is installed on the back side of the smoke detection unit body 14 (the side shown in Figure 4), into the smoke detection space 122 provided on the front side of the smoke detection unit body 14 (the side shown in Figure 3). For example, it is an opening that penetrates from the back side to the front side of the smoke detection unit body 14.

[0027] The aperture 142 for the light-receiving element is an opening for irradiating a light-receiving element 18, which is installed on the back side of the smoke detection unit body 14, with light (specifically scattered light) from the smoke detection space 122 provided on the front side of the smoke detection unit body 14. For example, it is an aperture that penetrates from the back side to the front side of the smoke detection unit body 14.

[0028] (Configuration - Element mounting section) The element mounting section 15 in Figure 2 is an element mounting means for mounting the light-emitting section 17 and the light-receiving section 18, and is mounted, for example, on a circuit board 16. Details of the element mounting section 15 will be described later.

[0029] (Configuration - Circuit board) The circuit board 16 in Figure 2 is a board on which various electrical circuits are mounted, and is, for example, a rigid board of a predetermined shape located on the back side of the smoke detection unit body 14.

[0030] (Configuration - Light-emitting part) The light-emitting unit 17 in Figure 2 is a light-emitting element that irradiates light into the smoke detection space 122, and is, for example, a light-emitting diode (LED).

[0031] (Configuration - light receiving section) The light-receiving unit 18 in Figure 2 is a light-receiving element that detects light (specifically scattered light) irradiated from the smoke detection space 122, and is, for example, a photodiode (PD).

[0032] (Configuration - Details - Element Mounting Section) Next, the details of the element mounting section 15 will be described. Figures 5 and 6 are perspective views of the element mounting section, Figure 7 is a front view of the element mounting section, Figure 8 is a top view of the element mounting section, Figure 9 is a rear view of the element mounting section, Figure 10 is a bottom view of the element mounting section, Figure 11 is a right side view of the element mounting section, and Figure 12 is a left side view of the element mounting section.

[0033] In Figures 5 and 6, the optical axes of the light-emitting unit 17 and the light-receiving unit 18 are shown by dashed lines. It may also be interpreted that the optical axis extending from the light-emitting unit 17 corresponds to the "light-emitting axis," and the optical axis extending from the light-receiving unit 18 corresponds to the "light-receiving axis." Furthermore, Figures 7(a), (b), and (c) illustrate the view from directions A1, A2, and A3 in Figure 8. In Figures 7 through 12, the X, Y, and Z axes are assumed to be mutually orthogonal.

[0034] The element mounting section 15 in Figure 2 is an element mounting means for mounting the light-emitting section 17 and the light-receiving section 18, and is, for example, attached and fixed to the circuit board 16. As shown in Figures 5 and 6, the element mounting section 15 holds the light-emitting section 17 and the light-receiving section 18 such that, for example, a scattering angle 900 within a predetermined angular range is formed.

[0035] The "scattering angle" 900 is the angle formed at the intersection P where the optical axis of the light-emitting unit 17 and the optical axis of the light-receiving unit 18 intersect with each other, and is indicated by the intersection angle at said intersection P. More specifically, it is the angle on the plane passing through each optical axis that forms intersection P. In the case of the sensor 100, the intersection P is actually formed within the smoke detection space 122 (Figure 1).

[0036] Furthermore, while the specific angle of the scattering angle 900 is arbitrary, a range of approximately 60 to 90 degrees is preferred to minimize sensitivity differences for various smoke particle sizes, and in this embodiment, the system is configured to fall within this angle range. In this embodiment, the angle of the scattering angle 900 is determined by the first element angle 901 (Figure 14, described later) and the second element angle 902 (Figures 7(b) and (c)).

[0037] The "first element angle" 901 is determined by the direction in which the light-emitting electrode portion 21 and the light-receiving electrode portion 31 are facing in the lead frame 400, as shown in Figure 14, which will be described later.

[0038] Furthermore, the "second element angle" 902 is determined by the inclination of the light-emitting side holding part 22 and the light-receiving side holding part 32 relative to the holding member 4, as shown in Figures 7(b) and (c). The angles of these two second element angles 902 may be the same or they may be different.

[0039] The element mounting section 15 in Figures 5 and 6 includes, for example, a light-emitting mounting section 2, a light-receiving mounting section 3, and a holding member 4.

[0040] (Configuration - Details - Element mounting section - Light-emitting side mounting section) The light-emitting mounting section 2 in Figures 5 and 6 is the part for mounting the light-emitting section 17 onto the circuit board 16, and includes, for example, a light-emitting electrode section 21 (see also Figure 14, which will be described later) and a light-emitting holding section 22 (Figures 5 and 6).

[0041] (Configuration - Details - Element mounting section - Light-emitting side mounting section - Light-emitting side electrode section) The light-emitting electrode portion 21 (see also Figure 14, described later) is a conductive light-emitting element-side electrode means for electrically connecting the light-emitting portion 17 to the electrical circuit of the circuit board 16 and mounting it on the circuit board 16, and is, for example, a metal portion. The light-emitting electrode portion 21 includes, for example, a light-emitting lead portion 211 (Figure 6) and a light-emitting connection portion 212 (see also Figure 15, described later).

[0042] The light-emitting lead portion 211 is a conductive wire electrically connected to the anode and cathode terminals of the light-emitting unit 17 mounted on the light-emitting mounting portion 2, and is partially held by the holding member 4. A portion of the tip end of the light-emitting lead portion 211 is bent inside the light-emitting lead opening 41, for example, as shown in Figure 6, and protrudes toward the back side (in the -Z direction, as shown in Figure 7(a)). A portion of the light-emitting lead portion 211 opposite to the tip end is bent by a second element angle of 902 minutes, as shown in Figure 7(b).

[0043] The light-emitting side connection portion 212 (see also Figure 15, described later) is a portion that is continuous with the light-emitting side lead portion 211, and is the portion where the anode terminal and cathode terminal of the light-emitting unit 17 mounted on the light-emitting side mounting portion 2 come into contact and are electrically connected.

[0044] (Configuration - Details - Element mounting section - Light-emitting side mounting section - Light-emitting side holding section) The light-emitting side holding portion 22 in Figures 5 and 6 is an insulating portion (for example, a resin portion) that holds a part of the light-emitting side electrode portion 21, and is a substantially rectangular portion overall, comprising a light-emitting side support portion 221 (Figure 6), a light-emitting side projection portion 222 (Figure 6), and a light-emitting side opening portion 223 (Figure 5).

[0045] The light-emitting side support portion 221 is a support means for supporting the light-emitting side holding portion 22. For example, it is configured to support the light-emitting side holding portion 22 with respect to a holding member 4 (Figure 7(b)) provided on the circuit board 16 and parallel to the circuit board 16, at an angle of 902 minutes of the second element.

[0046] The light-emitting side projection 222 is a projection for positioning the light-emitting side mounting portion 2 relative to the circuit board 16, and is, for example, a portion that is inserted into a hole or groove provided at a predetermined position on the circuit board 16.

[0047] The light-emitting side opening 223 is a substantially rectangular opening provided in the light-emitting side holding part 22 at the position where the light-emitting part 17 is attached, and is, for example, an opening that exposes the light-emitting side connection part 212 (see also Figure 15, which will be described later).

[0048] (Configuration - Details - Element mounting section - Light receiving side mounting section) The light-receiving mounting section 3 in Figures 5 and 6 is the part for mounting the light-receiving unit 18 onto the circuit board 16, and includes, for example, a light-receiving electrode section 31 (see also Figure 14, which will be described later) and a light-receiving holding section 32 (Figures 5 and 6).

[0049] (Configuration - Details - Element mounting section - Light receiving side mounting section - Light receiving side electrode section) The light-receiving electrode portion 31 (see also Figure 14, described later) is a conductive light-receiving element-side electrode means for electrically connecting the light-receiving portion 18 to the electrical circuit of the circuit board 16 and mounting it on the circuit board 16, and is, for example, a metal portion. The light-receiving electrode portion 31 includes, for example, a light-receiving lead portion 311 (Figure 6), a light-receiving connection portion 312 (see also Figure 16, described later), a shield portion 313 (Figure 6), a shield-side lead portion 314 (Figure 6), and a shield-side connection portion 315 (see also Figure 16, described later).

[0050] The light-receiving lead portion 311 is a conductive wire electrically connected to the anode and cathode terminals of the light-receiving unit 18 mounted on the light-receiving mounting portion 3, and is partially held by the holding member 4. A portion of the tip end of the light-receiving lead portion 311 is bent inside the light-receiving lead opening 42, for example, as shown in Figure 6, and protrudes toward the back side (the -Z direction, as in Figure 7(a)). A portion of the light-receiving lead portion 311 opposite to the tip end is bent by a second element angle of 902 minutes, as shown in Figure 7(c).

[0051] The light-receiving connection section 312 (see also Figure 16, described later) is a continuous portion from the light-receiving lead section 311, and is the portion where the anode terminal and cathode terminal of the light-receiving unit 18 mounted on the light-receiving mounting section 3 make contact and are electrically connected.

[0052] The shield portion 313 is a shielding means that functions as a shield to prevent or reduce noise in the light receiving unit 18 mounted on the light receiving side mounting portion 3. It is a substantially rectangular portion and is located on the back side of the light receiving unit 18. Furthermore, the shield portion 313 is formed by extending from a part of the light receiving side electrode portion 31.

[0053] The shield-side lead portion 314 is a conductive wire electrically connected to the shield portion 313, and is, for example, the portion whose tip protrudes toward the back side (in the -Z direction, as in (a) in Figure 7).

[0054] The shield-side connection portion 315 (see also Figure 16, described later) is a portion that is continuous with the shield portion 313 and is the portion that comes into contact with the case of the light-receiving portion 18 mounted on the light-receiving portion 3.

[0055] (Configuration - Details - Element mounting section - Light receiving side mounting section - Light receiving side holding section) The light-receiving side holding portion 32 in Figures 5 and 6 is an insulating portion (for example, a resin portion) that holds a part of the light-receiving side electrode portion 31, and is a substantially rectangular portion overall, comprising a light-receiving side support portion 321 (Figure 6), a light-receiving side projection portion 322 (Figure 6), and a light-receiving side opening portion 323 (Figure 5).

[0056] The light-receiving support portion 321 is a support means for supporting the light-receiving holding portion 32. For example, it is configured to support the light-receiving holding portion 32 with respect to a holding member 4 (Figure 7(c)) provided on the circuit board 16 and parallel to the circuit board 16, at an angle of 902 minutes of the second element.

[0057] The light-receiving protrusion 322 is a protrusion for positioning the light-receiving mounting portion 3 relative to the circuit board 16, and is, for example, a portion that is inserted into a hole or groove provided at a predetermined position on the circuit board 16.

[0058] The light-receiving side opening 323 is a substantially rectangular opening provided in the light-receiving side holding part 32 at the position where the light-receiving part 18 is attached, and is an opening that exposes, for example, the light-receiving side connection part 312 and the shield side connection part 315 (see also Figure 16, which will be described later).

[0059] (Configuration - Details - Element mounting section - Holding member) The holding member 4 in Figure 6 is an insulating member (for example, a resin member) that holds the light-emitting electrode portion 21 and the light-receiving electrode portion 31, and as shown in Figure 8, it is an insulating member that is bent such that a predetermined angle (specifically, the first element angle 901 (Figure 14 described later)) is formed in a plan view.

[0060] As shown in Figure 6, the holding member 4 includes, for example, an opening 41 for the light-emitting lead, an opening 42 for the light-receiving lead, and a holding member side protrusion 43.

[0061] The light-emitting lead opening 41 is a through-opening located closer to the light-emitting holding portion 22, and a portion of the tip of the light-emitting lead portion 211 is disposed inside the opening.

[0062] The light-receiving lead opening 42 is a through-opening located closer to the light-receiving holding portion 32, and a portion of the tip of the light-receiving lead portion 311 is disposed inside the opening.

[0063] The retaining member side projection 43 is a projection for positioning the retaining member 4 relative to the circuit board 16, and is, for example, a portion that is inserted into a hole or groove provided at a predetermined position on the circuit board 16.

[0064] (Manufacturing method for the element mounting section) Next, a method for manufacturing the element mounting section 15 configured in this way will be described. Figure 13 is a plan view of multiple lead frames, Figure 14 is a plan view of one lead frame, Figures 15 and 16 are enlarged views of parts of Figure 14, Figure 17 is a plan view showing a lead frame with retaining members etc. formed, Figure 18 is a bottom view showing a lead frame with retaining members etc. formed, and Figure 19 is a plan view showing retaining members etc. in a separated state.

[0065] The "lead frame" 400 is a lead frame body, generally made of metal, and includes, for example, elements that constitute at least a part of the element mounting section 15.

[0066] ===Formation of the light-emitting electrode and light-receiving electrode=== First, as shown in Figure 14, the light-emitting electrode portion 21 and the light-receiving electrode portion 31 are formed. In actual manufacturing, multiple lead frames 400, each comprising a light-emitting electrode portion 21 and a light-receiving electrode portion 31, will be formed together. However, in this embodiment, the explanation will focus on a single lead frame 400. Here, for example, as shown in Figures 14 to 16, a metal light-emitting electrode portion 21 and a light-receiving electrode portion 31 of a predetermined thickness (for example, about 1 mm to 3 mm) are integrally formed on a single lead frame 400 using any method (for example, a method of press-forming metal using a mold or other known method).

[0067] In particular, for the light-emitting electrode portion 21 and the light-receiving electrode portion 31, as shown in Figure 14, the first element angle 901, which is an angle determined by the direction in which each electrode portion extends (the direction shown by the dashed line in Figure 14), is formed to be an angle that allows for the formation of an appropriate scattering angle 900 (Figures 5 and 6) (i.e., as mentioned above, a scattering angle 900 of approximately 60 to 90 degrees). As an example, the first element angle 901 may be formed to be 120 degrees.

[0068] In this case, for example, multiple fixing parts 401 are integrally formed to fix the light-emitting electrode part 21 and the light-receiving electrode part 31 to the lead frame 400.

[0069] Furthermore, in this case, for example, the light-emitting electrode portion 21 and the light-receiving electrode portion 31 may be formed simultaneously, or the light-receiving electrode portion 31 may be formed after the light-emitting electrode portion 21 has been formed, or conversely, the light-emitting electrode portion 21 may be formed after the light-receiving electrode portion 31 has been formed.

[0070] ===Holding of the light-emitting electrode and light-receiving electrode=== Next, as shown in Figures 17 and 18, the light-emitting electrode portion 21 and the light-receiving electrode portion 31 (Figure 14) are held by a common holding member 4. Here, for example, as shown in Figures 17 and 18, the holding member 4, the light-emitting holding portion 22, and the light-receiving holding portion 32 are integrally formed on a single lead frame 400 using any method (for example, a method using insert molding or other known methods).

[0071] In this case, for example, the holding member 4, the light-emitting side holding part 22, and the light-receiving side holding part 32 may be formed simultaneously, or they may be formed sequentially in any order.

[0072] ===Separation of retaining members, etc.=== Next, as shown in Figure 19, the light-emitting electrode portion 21, the light-receiving electrode portion 31, the holding member 4, the light-emitting holding portion 22, and the light-receiving holding portion 32 (hereinafter also referred to as "each element of the element mounting portion 15") are separated from the other parts of the lead frame 400. Here, for example, each element of the element mounting portion 15 is separated by cutting the connection portion with the multiple fixing portions 401 shown in Figure 14.

[0073] In addition, this procedure also involves removing the two removal sections 310 shown in Figure 17, which are part of the light-receiving electrode section 31. As a result of this procedure, each of the two light-receiving lead sections 311 in Figure 16 will be separated from the shield section 313, and the two light-receiving lead sections 311 will be electrically isolated from each other.

[0074] ===Bending of the lead section (i.e., bending of the lead section)=== Next, as shown in Figures 5 to 12, the element mounting portion 15 is formed by bending the light-emitting electrode portion 21 and the light-receiving electrode portion 31 at predetermined positions. This completes the manufacturing of the element mounting portion 15.

[0075] (Manufacturing method for sensors) Next, we will explain how to manufacture the sensor 1.

[0076] Figure 20 is a front view showing the circuit board with the element mounting section mounted. The surface of the circuit board 16 (the upper surface in Figure 20) is provided with holes or grooves into which each protrusion of the element mounting section 15 is inserted for positioning. The circuit board 16 is also provided with through holes through which the light-emitting lead section 211, light-receiving lead section 311, and shield-side lead section 314 provided on the positioned element mounting section 15 are inserted.

[0077] ===Implementation of each element=== First, the light-emitting unit 17 and the light-receiving unit 18 are mounted on the element mounting unit 15 manufactured as described above. Here, for example, as shown in Figure 5, the light-emitting unit 17 is provided in the light-emitting side opening 223 (see also Figure 19), and the light-receiving unit 18 is provided in the light-receiving side opening 323 (see also Figure 19). The specific fixing method is arbitrary, but for example, they may be fixed by engagement, or they may be fixed using adhesive (unless otherwise specified, the fixing method for other elements is the same).

[0078] In this case, for example, the anode terminal and cathode terminal of the light-emitting unit 17 are electrically connected to the light-emitting side connection part 212 in Figure 19, that is, they are electrically connected to the light-emitting side lead part 211 (Figure 6).

[0079] In this case, for example, the anode terminal and cathode terminal of the light-receiving unit 18 are electrically connected to the light-receiving side connection part 312 in Figure 19, that is, they are electrically connected to the light-receiving side lead part 311 (Figure 6).

[0080] ===Implementation of the element mounting section=== Next, as shown in Figure 20, the element mounting section 15 is mounted by fixing it to the circuit board 16. Here, for example, each protruding part of the element mounting section 15 is positioned by inserting it into a positioning hole or groove in the circuit board 16, and the tip ends of the light-emitting lead section 211, the light-receiving lead section 311, and the shielding lead section 314 are fixed in place by inserting them into the insertion holes in the circuit board 16.

[0081] In this case, the holding member 4 is parallel to the circuit board 16, and the light-emitting side holding part 22 and the light-receiving side holding part 32 are supported by the light-emitting side support part 221 and the light-receiving side support part 321. As shown in Figures 7(b) and (c), the second element angle 902 is maintained at a predetermined angle (a predetermined angle such that the scattering angle 900 (Figures 5 and 6) is, for example, about 60 to 90 degrees).

[0082] After this, the mounting of the element mounting section 15 is completed by connecting the light-emitting lead portion 211, the light-receiving lead portion 311, and the shielding lead portion 314, which protrude from the back surface (the lower side of the drawing in Figure 20) of the circuit board 16, to the electrical circuit (including the wiring pattern) or ground pattern of the circuit board 16 using solder or the like.

[0083] ===Attaching each element=== Next, as shown in Figure 2, the circuit board 16 with the element mounting section 15 mounted is fixed to the back side of the smoke detection unit body 14 using any method (for example, by fixing it with fixing screws). In this case, the optical axes of the light-emitting section 17 and the light-receiving section 18 shown in Figures 5 and 6 pass through the light-emitting element opening 141 and the light-receiving element opening 142 shown in Figures 3 and 4 to the front side of the smoke detection unit body 14.

[0084] Next, the smoke detection unit cover 12, with the insect screen 13 attached, is fixed to the front side of the smoke detection unit body 14 by any method (for example, by engaging and fixing mounting protrusions, or by using adhesive).

[0085] Next, the outer cover 11 (Figure 1) is fixed to the smoke detection unit body 14, etc., using any method (for example, by fixing it with fixing screws). In this case, the smoke detection space 122 shown in Figure 1 is formed, and the intersection P in Figures 5 and 6 is located inside the smoke detection space 122. Thus, the detector 1 is manufactured.

[0086] (Sensor operation) Next, we will explain the operation of sensor 1. Since the operation of sensor 1 is well known, we will only give a brief overview. Here, we will explain the case where sensor 100 is installed on the ceiling, as shown in Figure 1.

[0087] If a fire occurs in the monitored area, smoke particles flow into the smoke detection space 122 through the opening in the outer cover 11 of the detector 100. In this case, the light emitted from the light-emitting unit 17 in Figures 5 and 6 is scattered by the incoming smoke particles, and the light-receiving unit 18 detects the scattered light, which is the light resulting from this scattering, causing the detector 100 to detect a fire.

[0088] (Effects of the embodiment) As described above, according to this embodiment, by providing a light-emitting electrode portion 21 and a light-receiving electrode portion 31, it becomes possible to easily attach the light-emitting portion 17 and the light-receiving portion 18 to, for example, a sensor 100. Furthermore, since the light-emitting electrode portion 21 and the light-receiving electrode portion 31 are integrally formed on a common lead frame 400, it becomes possible to easily form, for example, an element mounting portion 15.

[0089] Furthermore, since the light-emitting electrode portion 21 and the light-receiving electrode portion 31 are arranged in accordance with the first element angle 901 that constitutes the scattering angle 900, it becomes possible to reliably and easily form a scattering angle 900 of an appropriate angle (for example, about 60 to 90 degrees) in the sensor 100.

[0090] Furthermore, by integrally forming the shield portion 313 on the lead frame 400, it becomes possible to provide a shield for the light-receiving portion 18 in the element mounting portion 15, for example.

[0091] Furthermore, since the shield portion 313 is formed extending from a part of the light-receiving electrode portion 31, for example, the shield portion 313 can be integrally formed on the light-receiving electrode portion 31, making it possible to easily form the shield portion 313.

[0092] Furthermore, by providing a holding member 4 that holds the light-emitting electrode portion 21 and the light-receiving electrode portion 31, for example, the light-emitting electrode portion 21, the light-receiving electrode portion 31, and the holding member 4 can be made into a single unit, making handling easier.

[0093] Furthermore, by electrically connecting the light-emitting unit 17 and the light-receiving unit 18 to the electrical circuit of the circuit board 16 of the sensor 100 via the light-emitting lead portion 211 and the light-receiving lead portion 311, it becomes possible to reliably and easily electrically connect the light-emitting unit 17 and the light-receiving unit 18 to the electrical circuit.

[0094] Furthermore, by electrically connecting the shielding section 313 to the electrical circuit ground (a predetermined circuit ground) of the circuit board 16 of the sensor 100, it becomes possible to improve, for example, the electromagnetic shielding effect of the shielding section 313 (i.e., the effect of preventing electrical and magnetic disturbance noise from affecting the element, or the effect of mitigating such effects).

[0095] Furthermore, by forming the light-emitting electrode portion 21 and the light-receiving electrode portion 31, it becomes possible to easily attach the light-emitting portion 17 and the light-receiving portion 18 to the sensor 100, for example. Also, since the light-emitting electrode portion 21 and the light-receiving electrode portion 31 are integrally formed on a common lead frame 400, it becomes possible to easily form, for example, the element mounting portion 15.

[0096] Furthermore, by holding the light-emitting electrode portion 21 and the light-receiving electrode portion 31 with a common holding member 4, and separating the light-emitting electrode portion 21, the light-receiving electrode portion 31, and the holding member 4 from the common lead frame 400, for example, the light-emitting electrode portion 21, the light-receiving electrode portion 31, and the holding member 4 can be made into a single unit, making it possible to easily separate them from the common lead frame 400.

[0097] Furthermore, by bending the light-emitting electrode portion 21 and the light-receiving electrode portion 31 according to the scattering angle, it becomes possible to reliably and easily form a scattering angle 900 of an appropriate angle (for example, about 60 to 90 degrees) in the sensor 100.

[0098] Furthermore, by electrically connecting the element mounting section 15, on which the light-emitting section 17 and light-receiving section 18 are electrically connected to the light-emitting electrode section 21 and light-receiving electrode section 31, which are integrally held by the holding member 4, to the electrical circuit of the circuit board of the sensor 100, for example, the light-emitting section 17 and light-receiving section 18 can be easily attached to the sensor 100. In addition, by electrically connecting them via the light-emitting lead section 211 and the light-receiving lead section 311, for example, the light-emitting section 17 and light-receiving section 18 can be reliably and easily electrically connected to the electrical circuit.

[0099] [Modifications of the embodiment] While embodiments of the present invention have been described above, the specific configurations and means of the present invention can be arbitrarily modified and improved within the scope of the technical idea of ​​each invention described in the claims. Such modifications will be described below.

[0100] (Regarding the problems to be solved and the effects of the invention) First, the problems that the invention aims to solve and the effects of the invention are not limited to those described above, and may vary depending on the implementation environment and details of the invention's configuration. In some cases, only a portion of the problems described above may be solved, or only a portion of the effects described above may be achieved.

[0101] (Regarding decentralization and integration) Furthermore, the above-described configuration is a functional concept and does not necessarily require that the physical structure be as shown in the diagram. In other words, the specific forms of distribution and integration of each part are not limited to those shown in the diagram, and all or part of them can be functionally or physically distributed or integrated in any unit.

[0102] (Regarding the shield section) Furthermore, the shield portion 313 in Figure 16 of the above embodiment may be modified as desired. For example, the shield portion 313 may be configured separately from the other parts of the light-receiving electrode portion 31. In this case, for example, the shield portion may be formed at a position away from the elements of the light-receiving lead portion 311 and the light-receiving connection portion 312 after they have been formed.

[0103] Furthermore, for example, the shield-side lead portion 314 may be omitted, and the shield portion 313 may be configured not to be electrically connected to the circuit board 16. Also, for example, the shield-side connection portion 315 may be omitted. Furthermore, for example, a shield portion that functions as an electromagnetic shield for the light-emitting portion 17 may be provided.

[0104] Furthermore, in the above embodiment, as shown in Figure 20, the case in which the light-emitting lead portion 211, the light-receiving lead portion 311, and the shield-side lead portion 314 are inserted through the insertion holes of the circuit board 16 and electrically connected to an electrical circuit (including wiring patterns) or ground pattern, etc. on the back side of the circuit board 16 (the lower side in Figure 20) is described, but the invention is not limited to this. For example, an electrical circuit (including wiring patterns) or ground pattern, etc. may be formed on the front side of the circuit board 16 (the upper side in Figure 20), and the light-emitting lead portion 211, the light-receiving lead portion 311, and the shield-side lead portion 314 may be configured to be electrically connected to the electrical circuit, etc. Specifically, for example, the light-emitting lead portion 211, the light-receiving lead portion 311, and the shielding lead portion 314 shown in Figure 7(a) may be bent so that their tips are parallel to the holding member 4, thereby aligning the light-emitting lead portion 211 and the light-receiving lead portion 311 with the back surface (-Z direction surface) of the holding member 4, and then electrically connecting them to the electrical circuit etc. provided on the front side of the circuit board 16 using solder or the like. In this configuration, the element mounting portion 15 can be surface-mounted onto the circuit board 16, eliminating the need for the aforementioned through holes for inserting each lead portion.

[0105] The direction in which each lead portion is bent is arbitrary, but for example, the tip of the light-emitting lead portion 211 in Figure 6 may be bent toward the light-emitting holding portion 22 (i.e., the right side of Figure 6), and the tip of the light-receiving lead portion 311 in Figure 6 may be bent toward the light-receiving holding portion 32 (i.e., the left side of Figure 6). When bent in this way, the ends of the light-emitting lead opening 41 and the light-receiving lead opening 42 will come into contact with a part of the holding member 4, and the bend can be made starting from the part of the holding member 4 that comes into contact with the holding member 4, thereby improving workability.

[0106] (Regarding the number of light-emitting electrodes and light-receiving electrodes) Furthermore, although the above embodiment describes a case in which one light-emitting electrode portion 21 and one light-receiving electrode portion 31 are provided for one element mounting portion 15, the embodiment is not limited to this. For example, multiple instances of either one or both of the light-emitting electrode portion 21 or the light-receiving electrode portion 31 may be provided.

[0107] For example, if two light-emitting electrode units 21 are provided and one light-receiving electrode unit 31 is provided, then two light-emitting units 17 and one light-receiving unit 18 can be provided for one sensor 100. In this case, differences in wavelength and scattering angle distribution can be combined and utilized. For example, one light-emitting unit 17 that emits near-infrared or red light may be placed on the forward scattering side (i.e., so that the light-receiving unit 18 receives its forward scattered light), and the other light-emitting unit 17 that emits blue light may be placed on the backscattering side, and the light-receiving unit 18 may be configured to compare the scattered light from both units that it receives.

[0108] Furthermore, for example, if one light-emitting electrode section 21 is provided and two light-receiving electrode sections 31 are provided, then one light-emitting section 17 and two light-receiving sections 18 can be provided for one sensor 100. In this case, the scattering angle distribution can be utilized, and for example, the forward scattered light from the near-infrared light-emitting section 17 may be received by one light-receiving section 18, and the back scattered light from the same light-emitting section 17 may be received by the other light-receiving section 18, and these received forward scattered light and back scattered light may be compared.

[0109] Furthermore, with the configuration described above, for example, multiple light-emitting units 17 or light-receiving units 18 can be provided for each detector 100, thereby improving the performance of the detector 10. In other words, it becomes possible to distinguish between white smoke and black smoke within the smoke of a fire (i.e., to distinguish between the type of fire (source of combustion)) or to distinguish between fire smoke and other substances (e.g., dust, steam, cooking fumes, etc.).

[0110] Furthermore, by providing three or more of either the light-emitting electrode section 21 or the light-receiving electrode section 31, one sensor 100 may be provided with three or more of either the light-emitting section 17 or the light-receiving section 18.

[0111] (Regarding the features) Furthermore, the configurations and modified features of the above embodiments may be combined in any way.

[0112] (Note) The element mounting means described in Appendix 1 is an element mounting means for mounting a light-emitting element and a light-receiving element of a smoke detector that detects smoke by receiving scattered light, which is scattered by smoke, from a light-emitting element, and comprises a conductive light-emitting element-side electrode means for mounting the light-emitting element while electrically connecting it, and a conductive light-receiving element-side electrode means for mounting the light-receiving element while electrically connecting it, wherein the light-emitting element-side electrode means and the light-receiving element-side electrode means are integrally formed on a common frame body.

[0113] The element mounting means in Appendix 2 is the element mounting means described in Appendix 1, wherein the light-emitting element side electrode means and the light-receiving element side electrode means are arranged in accordance with the first element angle that constitutes the scattering angle, which is indicated by the intersection angle between the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element.

[0114] The element mounting means described in Appendix 3 is an element mounting means described in Appendix 1 or 2, wherein a shielding means that functions as an electromagnetic shield for the light-receiving element is integrally formed on a frame body common to the light-emitting element side electrode means and the light-receiving element side electrode means.

[0115] The element mounting means in Appendix 4 is the element mounting means described in Appendix 3, wherein the shielding means is formed extending from a part of the photodetector side electrode means.

[0116] The element mounting means of Appendix 5 further comprises an insulating member for holding the light-emitting element side electrode means and the light-receiving element side electrode means, in the element mounting means described in any one of Appendix 1 to 4.

[0117] The element mounting means in Appendix 6 is the element mounting means described in any one of Appendix 1 to 5, wherein the element mounting means comprises a plurality of sets of at least one of the light-emitting element side electrode means and the light-receiving element side electrode means.

[0118] The element mounting means described in Appendix 7 is the element mounting means described in any one of Appendix 1 to 6, wherein the light-emitting element side electrode means and the light-receiving element side electrode means are provided with lead portions, and the light-emitting element and the light-receiving element of the element mounting means are electrically connected to the electrical circuit of the circuit board of the smoke detector via the lead portions.

[0119] The element mounting means described in Appendix 8 is an element mounting means described in any one of Appendix 1 to 7, wherein a shielding means that functions as an electromagnetic shield for the light-receiving element is integrally formed on a frame body common to the light-emitting element side electrode means and the light-receiving element side electrode means, and the shielding means is electrically connected to the electrical circuit ground of the circuit board of the smoke detector.

[0120] The method for manufacturing the electrode means described in Appendix 9 is a method for manufacturing the electrode means in an element mounting means for mounting a light-emitting element and a light-receiving element of a smoke detector that detects smoke by receiving scattered light, which is scattered by smoke, from a light-emitting element, and comprising the steps of: integrally forming a conductive light-emitting element-side electrode means for mounting the light-emitting element while electrically connecting it on a common frame body; and integrally forming a conductive light-receiving element-side electrode means for mounting the light-receiving element while electrically connecting it on the common frame body.

[0121] The method for manufacturing the electrode means described in Appendix 10 is a method for manufacturing the electrode means in an element mounting means for mounting a light-emitting element and a light-receiving element of a smoke detector that detects smoke by receiving scattered light, which is scattered by smoke, from a light-emitting element, and comprising the steps of integrally forming a conductive light-emitting element-side electrode means on a common frame body for mounting the light-emitting element while electrically connecting it, and integrally forming a conductive light-receiving element-side electrode means on the common frame body for mounting the light-receiving element while electrically connecting it, wherein the light-emitting element-side electrode means and the light-receiving element-side electrode means are arranged in accordance with a first element angle that constitutes the scattering angle, which is indicated by the intersection angle between the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element.

[0122] The method for manufacturing the electrode means described in Appendix 11 is a method for manufacturing the electrode means in an element mounting means for mounting a light-emitting element and a light-receiving element of a smoke detector that detects smoke by receiving scattered light scattered by smoke from a light-emitting element, wherein the element mounting means comprises a conductive light-emitting element side electrode means for mounting the light-emitting element while electrically connecting it, and a conductive light-receiving element side electrode means for mounting the light-receiving element while electrically connecting it, wherein the light-emitting element side electrode means and the light-receiving element side electrode means are integrally formed on a common frame body, and the method for manufacturing the electrode means includes the step of integrally forming a shielding means that functions as an electromagnetic shield for the light-receiving element on the common frame body with the light-emitting element side electrode means and the light-receiving element side electrode means.

[0123] The method for manufacturing the electrode means described in Appendix 12 further includes, in the method for manufacturing the electrode means described in any one of Appendix 9 to 11, the steps of holding the light-emitting side electrode means and the photodetector side electrode means with a common insulating member in the common frame body, and separating the light-emitting side electrode means, the photodetector side electrode means, and the common insulating member from the common frame body.

[0124] The method for manufacturing the electrode means described in Appendix 13 further includes the step of bending the light-emitting side electrode means or the light-receiving element side electrode means according to the scattering angle indicated by the intersection angle of the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element, in the method for manufacturing the electrode means described in Appendix 12.

[0125] The method for manufacturing a smoke detector described in Appendix 14 is a method for manufacturing a smoke detector that detects smoke by receiving scattered light, which is light from a light-emitting element scattered by smoke, with a light-receiving element, and includes the step of electrically connecting an element mounting means, on which the light-emitting element and the light-receiving element are electrically connected and mounted, to the light-emitting element side electrode means and the light-receiving element side electrode means, which are arranged in correspondence with a first element angle that constitutes a scattering angle indicated by the intersection angle of the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element, and which are integrally held by an insulating member, to the lead portions of the light-emitting element side electrode means and the light-receiving element side electrode means, to the electrical circuit of the circuit board of the smoke detector.

[0126] (Effect of the note) According to the element mounting means described in Appendix 1, by providing an electrode means on the light-emitting side and an electrode means on the light-receiving element side, it becomes possible to easily attach the light-emitting element and the light-receiving element to, for example, a smoke detector. Furthermore, by integrally forming the electrode means on the light-emitting side and the electrode means on the light-receiving element side on a common frame, it becomes possible to easily form, for example, the element mounting means.

[0127] According to the element mounting means described in Appendix 2, the light-emitting electrode means and the light-receiving electrode means are arranged in accordance with the first element angle that constitutes the scattering angle, thereby making it possible to reliably and easily form a scattering angle of an appropriate angle (for example, about 60 to 90 degrees) in a smoke detector, for example.

[0128] According to the element mounting means described in Appendix 3, by integrally forming the shielding means on the frame body, it becomes possible to provide a shield for the light-receiving element in the element mounting means, for example.

[0129] According to the element mounting means described in Appendix 4, the shielding means is formed extending from a part of the photodetector-side electrode means, so for example, the shielding means can be integrally formed in the photodetector-side electrode means, and the shielding means can be easily formed.

[0130] According to the element mounting means described in Appendix 5, by providing an insulating member for holding the light-emitting element side electrode means and the light-receiving element side electrode means, for example, the light-emitting element side electrode means, the light-receiving element side electrode means, and the insulating member can be made into a single unit, making handling easier.

[0131] According to the element mounting means described in Appendix 6, by providing multiple sets of at least one of the light-emitting element side electrode means and the light-receiving element side electrode means, for example, multiple light-emitting elements or multiple light-receiving elements can be provided for a single smoke detector, thereby improving the performance of the smoke detector. In other words, for example, it becomes possible to distinguish between white smoke and black smoke in a fire (i.e., to distinguish the type of fire (combustion source)), or to distinguish between fire smoke and other substances (e.g., dust, steam, cooking fumes, etc.).

[0132] According to the element mounting means described in Appendix 7, the light-emitting element and the light-receiving element are electrically connected to the electrical circuit of the smoke detector's circuit board via the lead portions of the light-emitting element-side electrode means and the light-receiving element-side electrode means, respectively. This makes it possible to reliably and easily electrically connect the light-emitting element and the light-receiving element to the electrical circuit.

[0133] According to the element mounting means described in Appendix 8, the shielding means is electrically connected to the electrical circuit ground (a predetermined circuit ground) of the circuit board of the smoke detector, which makes it possible to improve, for example, the electromagnetic shielding effect of the shielding means (i.e., the effect of preventing electrical and magnetic disturbance noise from affecting the element, or the effect of mitigating such influence).

[0134] According to the manufacturing method of the electrode means described in Appendix 9, by forming the light-emitting element side electrode means and the light-receiving element side electrode means, it becomes possible to easily attach the light-emitting element and the light-receiving element to, for example, a smoke detector. Furthermore, since the light-emitting element side electrode means and the light-receiving element side electrode means are integrally formed on a common frame, it becomes possible to easily form, for example, an element mounting means.

[0135] According to the manufacturing method of the electrode means described in Appendix 10, by forming the light-emitting element side electrode means and the light-receiving element side electrode means, it becomes possible to easily attach the light-emitting element and the light-receiving element to, for example, a smoke detector. Furthermore, since the light-emitting element side electrode means and the light-receiving element side electrode means are integrally formed on a common frame, it becomes possible to easily form, for example, an element mounting means. In addition, since the light-emitting element side electrode means and the light-receiving element side electrode means are arranged in accordance with the first element angle that constitutes the scattering angle, it becomes possible to reliably and easily form an appropriate scattering angle (for example, about 60 to 90 degrees) in, for example, a smoke detector.

[0136] According to the manufacturing method of the electrode means described in Appendix 11, by forming a shielding means that functions as an electromagnetic shield for the light-receiving element, it becomes possible to provide, for example, a shield for the light-receiving element.

[0137] According to the method for manufacturing the electrode means described in Appendix 12, the light-emitting side electrode means and the light-receiving element side electrode means are held by a common insulating member, and the light-emitting side electrode means, the light-receiving element side electrode means, and the common insulating member are separated from the common frame body. For example, the light-emitting side electrode means, the light-receiving element side electrode means, and the insulating member can be made into a single unit and easily separated from the common frame body.

[0138] According to the method for manufacturing the electrode means described in Appendix 13, by bending the light-emitting electrode means or the light-receiving electrode means according to the scattering angle, it becomes possible to reliably and easily form a scattering angle of an appropriate angle (for example, about 60 to 90 degrees) in a smoke detector, for example.

[0139] According to the method for manufacturing a smoke detector described in Appendix 14, by electrically connecting an element mounting means, on which a light-emitting element and a light-receiving element are electrically connected to an electrode means on the light-emitting element side and an electrode means on the light-receiving element side, which are integrally held by an insulating member, to the electrical circuit of the smoke detector's circuit board, it becomes possible to easily attach the light-emitting element and the light-receiving element to the smoke detector. Furthermore, by electrically connecting them via the lead portions of the respective electrode means on the light-emitting element side and the electrode means on the light-receiving element side, it becomes possible to reliably and easily electrically connect the light-emitting element and the light-receiving element to the electrical circuit. [Explanation of Symbols]

[0140] 2. Light-emitting mounting section 3. Light-receiving mounting section 4. Retaining member 11 Outer cover 12. Smoke detection unit cover 13 Insect net 14. Smoke detection unit 15 Element mounting section 16 Circuit boards 17 Light-emitting part 18 Light receiving part 21 Light-emitting electrode section 22 Light-emitting side holding part 31 Light-receiving side electrode part 32 Light receiving side holding part 41 Opening for light-emitting lead 42 Aperture for light-receiving lead 43 Holding member side protrusion 100 sensors 121 Labyrinth 122 Smoke detection space 141 Aperture for light-emitting element 142 Aperture for photodetector 211 Light-emitting lead section 212 Light-emitting side connection part 221 Light-emitting side support part 222 Light-emitting side protrusion 223 Light-emitting side aperture 311 Light-receiving lead section 312 Light-receiving side connection section 313 Shield section 314 Shield-side lead section 315 Shield side connection part 321 Light receiving side support part 322 Light receiving side protrusion 323 Light-receiving aperture 400 Lead Frames 401 Fixed part 900 scattering angle 901 First element angle 902 Second element angle P intersection

Claims

1. A method for manufacturing a light-emitting element and an element mounting means for mounting a light-receiving element of a smoke detector, which detects smoke by receiving scattered light, which is scattered by smoke, from a light-emitting element, The step of integrally forming both electrode means, which consist of a conductive light-emitting element side electrode means for electrically connecting and mounting the light-emitting element, and a conductive light-receiving element side electrode means for electrically connecting and mounting the light-receiving element that is paired with the light-emitting element side electrode means, on a common conductive frame body, The steps include: holding a pair of light-emitting element-side electrode means and a light-receiving element-side electrode means in the common frame body with a common insulating member; The steps include separating the pair of light-emitting electrode means and the light-receiving electrode means, which are held by the common insulating member, from the common frame body so that they are insulated from each other, and removing the pair of light-emitting electrode means and the light-receiving electrode means from the element mounting means, which are held by the common insulating member, A method for manufacturing an element mounting means including the element mounting means.

2. The light-emitting element-side electrode means and the light-receiving element-side electrode means are arranged in accordance with the first element angle that constitutes the scattering angle, which is determined by the intersection angle between the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element. A method for manufacturing the element mounting means according to claim 1.

3. The photodetector-side electrode means includes a shielding means that functions as an electromagnetic shield for the photodetector, A method for manufacturing the element mounting means according to claim 1.

4. The further step includes bending the light-emitting electrode means or the light-receiving electrode means according to the scattering angle indicated by the intersection angle of the light-emitting axis of the light-emitting element and the light-receiving axis of the light-receiving element, A method for manufacturing the element mounting means according to claim 1.

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