Manufacturing method for mounting head, mounting apparatus, and electronic device

Abstract

To provide a mounting head capable of applying a low load to an electronic component with good control when mounting the electronic component on a substrate.SOLUTION: A mounting head according to the present invention includes a drive unit 10 that moves vertically and applies a load to an electronic component, a float unit 20 supported on the drive unit so as to be freely movable vertically, and a linear motor 30 that applies a vertically upward pressing force to the float unit, with a stator 30A of the linear motor fixed to the drive unit and a mover 30B of the linear motor fixed to the float unit, and the electronic component is mounted on a substrate by moving the drive unit vertically downward, and the magnitude of the load applied to the electronic component is controlled by the pressing force.SELECTED DRAWING: Figure 2

Description

Technical Field

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[0001] The present invention relates to a mounting head for mounting an electronic component such as a semiconductor chip on a substrate, a mounting apparatus using the same, and a method for manufacturing an electronic device in which an electronic component is mounted on a substrate using the mounting head.

Background Art

[0002] When mounting an electronic component on a substrate, a mounting head using a voice coil motor (linear motor) that can apply a low load to the electronic component is known (see, for example, Patent Document 1).

[0003] The voice coil motor described in Patent Document 1 includes a stator fixed to a motor holder and a mover connected to a mounting tool that holds an electronic component. By driving the voice coil motor, the mounting tool connected to the mover descends toward the substrate, and thereby, the electronic component held by the mounting tool is pressed against the substrate. By controlling the drive current of the voice coil motor at this time, a relatively small load can be applied to the electronic component.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When mounting a small and thin electronic component on a substrate, if an excessive load is applied to the electronic component, the electronic component may crack. Therefore, it is necessary to control the load applied to the electronic component to a low load.

[0006] While voice coil motors can apply low loads to electronic components, they cannot control loads below the resolution that a voice coil motor can output. Therefore, it is difficult to apply loads low enough to prevent breakage to increasingly smaller and thinner electronic components, creating a need for mounting heads that can apply even lower loads.

[0007] The present invention has been made in view of the above, and its main objective is to provide a mounting head that can apply a low load to electronic components with good control when mounting them to a substrate. [Means for solving the problem]

[0008] The mounting head according to the present invention is a mounting head for mounting electronic components onto a substrate, and comprises a drive unit that moves vertically and applies a load to the electronic components, a float unit supported on the drive unit so as to be movable vertically, a linear motor that applies an upward vertical pressing force to the float unit, and a mounting tool fixed to the float unit for holding the electronic components, wherein the stator of the linear motor is fixed to the drive unit and the movable element of the linear motor is fixed to the float unit, and the mounting of electronic components onto the substrate is performed by moving the drive unit vertically downward, and the magnitude of the load applied to the electronic components is controlled by the pressing force. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a mounting head that can apply a low load to electronic components with good control when mounting them onto a substrate. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows the configuration of a mounting device equipped with a mounting head in one embodiment of the present invention. [Figure 2] This diagram schematically shows the configuration of the mounting head in this embodiment. [Figure 3]Figures (A) to (D) illustrate the process of mounting electronic components onto a substrate using the mounting head in this embodiment. [Figure 4] This figure shows the configuration of the mounting head in a modified example 1 of the present invention. [Figure 5] This diagram illustrates the process of mounting electronic components onto a substrate using the mounting head shown in Modification Example 1. [Figure 6] This figure shows the configuration of the mounting head in a modified example 2 of the present invention. [Figure 7] Figures (A) to (D) illustrate the process of mounting electronic components onto a substrate using the mounting head in the modified example 2. [Figure 8] This figure shows another configuration of the mounting device equipped with a mounting head in this embodiment. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to the following embodiments. Furthermore, modifications can be made as appropriate without departing from the scope of achieving the effects of the present invention.

[0012] Figure 1 shows the configuration of a mounting device equipped with a mounting head in one embodiment of the present invention.

[0013] As shown in Figure 1, the mounting apparatus 100 includes a mounting head 110 that picks up electronic components and mounts them onto a substrate. The mounting head 110 is equipped with a mounting tool 40 that picks up and holds electronic components, and is controlled to move horizontally by a drive shaft 120. The mounting head 110 moves up to the component supply stage 140 to pick up the electronic component 150, then moves up to the mounting stage 130, lowers the mounting head 110, and mounts the electronic component 150 held by the mounting tool 40 onto the substrate 160.

[0014] Figure 2 is a schematic diagram showing the configuration of the mounting head 110 in this embodiment.

[0015] As shown in FIG. 2, the mounting head 110 includes a drive unit 10 that moves in the vertical direction and applies a load to an electronic component, a float unit 20 that is vertically movably supported by the drive unit 10, a linear motor 30 that applies an upward vertical pressing force to the float unit 20, and a mounting tool 40 that is fixed to the float unit 20 and holds the electronic component.

[0016] A servo motor 60 that controls the vertical movement of the drive unit 10 is fixed to the frame 63 of the mounting device 100 via a base member 61. A ball screw 62 is connected to the output shaft of the servo motor 60, and the ball screw 62 is fixed to the head base 10A of the drive unit 10. The drive unit 10 is connected to a guide rail 64 that guides the vertical movement of the drive unit 10. Thereby, the drive unit 10 can move in the vertical direction by the drive of the servo motor 60.

[0017] The float unit 20 is vertically movably supported by the drive unit 10 via a leaf spring 50. Also, the float unit 20 is restricted from moving in the horizontal direction by the leaf spring 50. The leaf spring 50 is preferably a member that has low sliding with respect to vertical movement.

[0018] The linear motor 30 includes a stator 30A in which permanent magnets are arranged and a mover 30B that is arranged inside the stator 30A and is composed of a coil. The stator 30A is fixed to the drive unit 10, and the mover 30B is fixed to the float unit 20. By energizing the coil, the stator 30A can apply an upward vertical pressing force to the mover 30B. Thereby, an upward vertical pressing force can also be applied to the float unit 20 to which the mover 30B is fixed by energizing the coil. The linear motor 30 can use, for example, a voice coil motor or the like.

[0019] The mounting tool 40 is connected to the float unit 20 so as to be located at the lower tip of the mounting head 110, and can adsorb and hold an electronic component by a vacuum adsorption method or the like.

[0020] In this embodiment, the mounting of the electronic component on the substrate is performed by moving the driving unit 10 downward in the vertical direction and applying the load due to the self-weight of the floating unit 20 to the electronic component. At the same time, by driving the linear motor 30, a vertically upward pressing force is applied to the floating unit 20. As a result, a load obtained by subtracting the vertically upward pressing force applied to the floating unit 20 from the load due to the self-weight of the floating unit 20 is actually applied to the electronic component. That is, the magnitude of the load applied to the electronic component is controlled by the vertically upward pressing force applied to the floating unit 20 by driving the linear motor 30.

[0021] According to this embodiment, by setting the vertically upward pressing force applied to the floating unit 20 to a value close to the load due to the self-weight of the floating unit 20, when mounting the electronic component on the substrate, even a very small load of 0.1 N or less can be applied to the electronic component with good control. Thereby, even when mounting a very small and thin electronic component on the substrate, it is possible to prevent the electronic component from cracking.

[0022] In this embodiment, since the mover 30B of the linear motor 30 is fixed to the floating unit 20, the "load due to the self-weight of the floating unit 20" means the load including the load of the mover 30B.

[0023] Next, referring to FIGS. 3(A) to (D), the process of mounting an electronic component on a substrate using the mounting head 110 in this embodiment will be described.

[0024] FIG. 3(A) shows the standby state of the mounting head 110, where the mounting head 110 moves horizontally and the electronic component 150 held by the mounting tool 40 is positioned on the substrate 160 placed on the mounting stage 130. At this time, the driving unit 10 is in the raised state, the linear motor 30 is not driven for reasons to be described later, and the floating unit 20 is in the lower limit state with a load F due to its self-weight.

[0025] Next, as shown in FIG. 3(B), drive the linear motor 30 to apply an upward vertical pressing force T to the float portion 20. At this time, the float portion 20 rises slightly from the lower limit state.

[0026] Next, as shown in FIG. 3(C), drive the servo motor 60 to lower the drive portion 10, bring the electronic component 150 into contact with the substrate 160, and push in the mounting tool 40. At this time, the float portion 20 rises by the amount of the push-in, and a load obtained by subtracting the pressing force T (T < F) applied to the float portion 20 from the load F due to the self-weight of the float portion 20 is applied to the electronic component 150.

[0027] Next, as shown in FIG. 3(D), release the holding of the electronic component 150 by the mounting tool 40, mount the electronic component 150 on the substrate 160, and then drive the servo motor 60 to raise the drive portion 10. Note that the drive of the linear motor may be released while the drive portion 10 is being raised.

[0028] According to the present embodiment, by applying the upward vertical pressing force T to the float portion 20 by the linear motor 30 at least before moving the drive portion 10 downward in the vertical direction and applying the load F due to the self-weight of the float portion 20 to the electronic component 150, when the electronic component 150 is brought into contact with the substrate 160, it is possible to prevent the load F due to the self-weight of the float portion 20 from being suddenly applied to the electronic component 150.

[0029] In the present embodiment, the "standby state of the mounting head" includes at least a state in which the mounting head 110 moves onto the component supply stage 140 in order to pick up the electronic component 150 and a state in which the mounting head 110 moves onto the mounting stage 130 in order to mount the picked-up electronic component 150 on the substrate.

[0030] Incidentally, if the linear motor 30 is driven continuously, the coil of the movable element 30B will heat up, which will cause a change in the magnetic flux density of the permanent magnets arranged in the stator 30A. This will cause the output of the linear motor 30 to become unstable, reducing the accuracy of the pressing force T applied to the float section 20, and consequently reducing the accuracy of the load applied to the electronic component 150 during mounting. For this reason, it is preferable to deactivate the linear motor 30 when the mounting head 110 is in standby mode and not apply a vertically upward pressing force T to the float section 20.

[0031] (Modification 1 of the present invention) In the above embodiment, since the float portion 20 is supported by the drive unit 10 so as to be movable in the vertical direction via the leaf spring 50, the float portion 20 may vibrate when the mounting head 110 moves at high speed in the horizontal or vertical direction. If vibration occurs in the float portion 20, problems may arise such as the vertical height position of the mounting tool 40 becoming unstable or the electronic component 150 held by the mounting tool 40 falling off.

[0032] Figure 4 shows the configuration of the mounting head 110 that can suppress vibrations of the float section 20.

[0033] As shown in Figure 4, in this modified example 1, the drive unit 10 is equipped with a biasing means 70 that biases the float unit 20 vertically downward. Specifically, a compression spring 70 is positioned between the head base 10A of the drive unit 10 and the float unit 20.

[0034] In this way, by constantly biasing the float section 20 with a vertically downward force using the compression spring 70, vibrations of the float section 20 can be suppressed.

[0035] Note that the components other than those described above are the same as those of the mounting head 110 shown in Figure 2, and therefore the same reference numerals are used, and their explanations are omitted.

[0036] FIG. 5 is a diagram corresponding to the mounting process shown in FIG. 3(C), showing a state where the servo motor 60 is driven to lower the driving unit 10, the electronic component 150 is brought into contact with the substrate 160, and the mounting tool 40 is pushed in. At this time, a load obtained by subtracting the pressing force T (T < F + R) applied to the floating unit 20 from the combined load (F + R) of the load F due to the self-weight of the floating unit 20 and the biasing force R by the compression spring 70 is applied to the electronic component 150.

[0037] In addition, since the mounting processes other than those described above are the same as the mounting processes shown in FIGS. 3(A) to (D), the description thereof is omitted.

[0038] (Modification Example 2 of the Present Invention) FIG. 6 is a diagram showing another configuration of the mounting head 110 that can suppress the vibration of the floating unit 20.

[0039] As shown in FIG. 6, the driving unit 10 has a first extending portion (head base) 10A extending in the horizontal direction, and the floating unit 20 is located vertically above the first extending portion 10A and has a second extending portion 20A having a portion overlapping with the first extending portion 10A in the vertical direction. Further, a mechanical stopper 80 having a spherical surface is provided on the second extending portion 20A.

[0040] In this modification example 2, when the mounting head is in the standby state, due to the self-weight of the floating unit 20, the mechanical stopper 80 provided on the second extending portion 20A contacts the first extending portion 10A, thereby restricting the movement of the floating unit 20 in the vertical direction. As a result, the vibration of the floating unit 20 can be suppressed.

[0041] In addition, since the mechanical stopper 80 repeats contact with the first extending portion (head base) 10A, it is preferable that both use a material with high rigidity such as steel so that the position of the floating unit 20 does not fluctuate due to deformation of the member.

[0042] In addition, if the parallelism of the mutually facing surfaces of the first extending portion 10A and the second extending portion 20A is high and both are made of a material with high rigidity, the mechanical stopper 80 may not be provided on the second extending portion 20A, and the first extending portion 10A and the second extending portion 20A may be brought into direct contact with each other.

[0043] In addition, since the configurations other than those described above are the same as those of the mounting head 110 shown in FIG. 2, the same reference numerals are given and the description thereof is omitted.

[0044] FIGS. 7(A) to (D) are diagrams for explaining the steps of mounting an electronic component on a substrate using the mounting head 110 in the second modification example.

[0045] FIG. 7(A) shows the standby state of the mounting head 110, and the electronic component 150 held by the mounting tool 40 is located on the substrate 160 placed on the mounting stage 130. At this time, the linear motor 30 is not driven, and the float portion 20 is moved vertically by the load F of its own weight, and the mechanical stopper 80 contacts the first extending portion 10A of the driving portion 10, and the movement in the vertical direction is restricted.

[0046] Next, as shown in FIG. 7(B), the linear motor 30 is driven to apply an upward vertical pushing force T to the float portion 20. At this time, by setting the load F due to the weight of the float portion 20 to be larger than the pushing force T applied to the float portion 20, the movement of the float portion 20 in the vertical direction is restricted.

[0047] Next, as shown in FIG. 7(C), the servo motor 60 is driven to lower the driving portion 10, bring the electronic component 150 into contact with the substrate 160, and push in the mounting tool 40. At this time, the float portion 20 rises by the amount of pushing in, the mechanical stopper 80 moves away from the driving portion 10, and a load obtained by subtracting the pushing force T (T < F) applied to the float portion 20 from the load F due to the weight of the float portion 20 is applied to the electronic component 150.

[0048] Next, as shown in Figure 7(D), the mounting tool 40 releases its grip on the electronic component 150, and the electronic component 150 is mounted on the substrate 160. Then, the servo motor 60 is driven to raise the drive unit 10. At this time, the load F due to the weight of the float unit 20 is set to be greater than the pressing force T applied to the float unit 20, thereby restricting the vertical movement of the float unit 20. Note that the linear motor may be deactivated while the drive unit 10 is being raised.

[0049] Figure 8 shows another configuration of the mounting apparatus 100 equipped with the mounting head 110 shown in the above embodiment.

[0050] As shown in Figure 8, the mounting apparatus 100 consists of a mounting head 110, a mounting stage 130, a component supply stage 140, and a stage drive shaft 170. The mounting stage 130 and the component supply stage 140 are each mounted on the stage drive shaft 170 and can move horizontally to directly below the mounting head 110.

[0051] Picking up the electronic component 150 is performed by moving the component supply stage 140, on which the electronic component 150 is mounted, to directly below the mounting head 110 using the stage drive shaft 170. Mounting the electronic component 150 onto the circuit board is performed by moving the mounting stage 130, on which the circuit board 160 is mounted, to directly below the mounting head 110 using the stage drive shaft 170.

[0052] In a mounting device 100 with this configuration, there is no need to move the mounting head 110 horizontally at high speed, so vibrations of the float section 20 associated with the movement of the mounting head 110 can be suppressed.

[0053] Using the mounting head 110 in this embodiment, an electronic device can be manufactured by mounting electronic components 150 onto a substrate 160. In this case, the manufacturing method of the electronic device consists of the steps of moving the drive unit 10 vertically downward and applying a vertical upward pressing force to the float unit 20 by driving the linear motor 30, and mounting the electronic components 150 onto the substrate 160 by controlling the load applied to the electronic components 150 by the weight of the float unit 20 with the pressing force.

[0054] Although the present invention has been described above with reference to preferred embodiments, this description is not limiting, and various modifications are, of course, possible. [Explanation of Symbols]

[0055] 10 Drive unit 10A Head base (first extension) 20 Float section 20A 2nd extension 30 Linear Motors 30A stator 30B Mover 40 Implementation Tools 50 leaf springs 60 Servo motors 61 Base member 63 frames 64 Guide Rails 70 Compression spring (biasing means) 80 Mechanical Stopper 100 mounting device 110 Mounting Head 120 drive shaft 130 Implementation Stages 140 parts supply stages 150 Electronic Components 160 circuit boards 170 Stage drive shaft

Claims

1. A mounting head for mounting electronic components onto a circuit board, A drive unit that moves in the vertical direction, The drive unit includes a float portion supported so as to be movable in the vertical direction, A mounting tool fixed to the float portion and holding the electronic component Equipped with, The drive unit has a first extension that extends horizontally, The float portion is located vertically above the first extension portion and has a second extension portion that overlaps with the first extension portion in the vertical direction. A mounting head in which, in a standby state, the second extension comes into contact with the first extension due to the weight of the float portion, thereby restricting the vertical movement of the float portion.

2. The float portion is equipped with a linear motor that applies an upward vertical pushing force, The stator of the linear motor is fixed to the drive unit, and the movable element of the linear motor is fixed to the float unit. The mounting of the electronic component onto the substrate is performed by moving the drive unit vertically downward. The mounting head according to claim 1, wherein the magnitude of the load applied to the electronic component is controlled by the pressing force.

3. The mounting head according to claim 1, wherein the float portion is supported by the drive unit via a leaf spring so as to be movable in the vertical direction.

4. The mounting head according to claim 2, wherein, when the mounting head is in a standby state, the float portion is not subjected to a vertically upward pressing force by the linear motor.

5. The mounting head according to claim 1, wherein the drive unit further comprises a biasing means for biasing the float unit in a vertically downward direction.

6. A mechanical stopper with a spherical surface is provided on the second extension portion. The mounting head according to claim 1, wherein, when the mounting head is in a standby state, the mechanical stopper provided on the second extension contacts the first extension, thereby restricting the vertical movement of the float portion.

7. A mounting head according to any one of claims 1 to 6, A mounting apparatus comprising a horizontal movement mechanism for horizontally moving the mounting head.

8. A method for manufacturing an electronic device in which electronic components are mounted on a substrate using a mounting head, The aforementioned mounting head is A drive unit that moves in the vertical direction, The drive unit includes a float portion supported so as to be movable in the vertical direction, A mounting tool fixed to the float portion and holding the electronic component Equipped with, The drive unit has a first extension that extends horizontally, The float portion is located vertically above the first extension portion and has a second extension portion that overlaps with the first extension portion in the vertical direction. The process of moving the mounting head horizontally to a mounting stage for mounting the electronic components, The process of moving the mounting head vertically downward to mount the electronic component onto the substrate, Includes, A method for manufacturing an electronic device, wherein, in the step of moving the mounting head in the horizontal direction, the second extension portion comes into contact with the first extension portion due to the weight of the float portion, thereby restricting the vertical movement of the float portion.

9. The float portion is equipped with a linear motor that applies an upward vertical pushing force, The stator of the linear motor is fixed to the drive unit, and the movable element of the linear motor is fixed to the float unit. A method for manufacturing an electronic device according to claim 8, wherein in the step of mounting the electronic component onto the substrate, a pressing force is applied to the float portion in a vertical upward direction by driving the linear motor, and the load applied to the electronic component is controlled by the pressing force, thereby mounting the electronic component onto the substrate.

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