PCB production system

Abstract

This substrate production system comprises a first production facility and a second production facility. The first production facility is equipped with a first number of production lines of a first type. The production lines of the first type perform component mounting processing to mount components on substrates. The second production facility is equipped with a second number of production lines of a second type, the second number of production lines being less than the first number of production lines. The production lines of the second type perform post-processing on a substrate 1 that has undergone the component mounting processing in the production lines of the first type.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a substrate production system that produces substrates by a plurality of production lines installed together.

Background Art

[0002] A substrate production system that mounts components on a substrate to produce a component-mounted substrate is known. This type of substrate production system includes production lines including a printing machine, a component mounter, a substrate inspection machine, a reflow machine, etc. By the way, in recent years, mass production of a variety of products in small quantities is often carried out, and it is necessary to realize flexible production. In this case, substrates may be produced by a substrate production system composed of a plurality of production lines. As this type of substrate production system, for example, there is the prior art disclosed in JP-A-2004-265887. In addition, depending on the factory, there may be cost limitations or area limitations, so it may not be possible to construct the necessary production lines. In this case, it is also considered to share some equipment for a plurality of production lines and make the entire equipment smaller.

Summary of the Invention

Problems to be Solved by the Invention

[0003] However, in this type of PCB production system, it can be difficult to operate each piece of equipment that makes up the system efficiently. For example, when changing the type of component-mounted PCB produced by the PCB production system, equipment changeover is necessary. In this case, the printing press and component mounting machine require physical changeover, such as mask replacement and feeder replacement. In contrast, the PCB inspection machine and reflow machine do not require physical changeover; the changeover is completed by simply changing the data. Therefore, the downtime for the PCB inspection machine and reflow machine during changeover is relatively short. Consequently, there may be a waiting period during which the PCB inspection machine and reflow machine are stopped while the printing press and component mounting machine changeover is completed, making it difficult to efficiently produce component-mounted PCBs. Therefore, it was desirable to operate the equipment efficiently and continue production even during changeover.

[0004] Therefore, this specification provides a technology that enables efficient operation of equipment even when there is a waiting period due to the shutdown of some equipment. [Means for solving the problem]

[0005] This specification discloses a substrate production system comprising a first production facility and a second production facility. The first production facility comprises a first type of production line in a first number of line units. The first type of production line performs component mounting processing, which involves mounting components onto substrates. The second production facility comprises a second number of second type of production lines, which is fewer than the number of first line units. The second type of production line performs post-processing on substrates that have undergone component mounting processing in the first type of production line. Therefore, with the above configuration, since the number of first type of production lines and the number of second type of production lines are different, the equipment can be operated efficiently even when there is waiting time due to, for example, a partial shutdown of the equipment. [Brief explanation of the drawing]

[0006] [Figure 1] This is a schematic diagram showing the substrate production system of Example 1. [Figure 2]This is a schematic diagram showing the substrate production system of Example 2. [Modes for carrying out the invention]

[0007] In the substrate production system disclosed herein, a first type of production line may include a printing machine for printing solder patterns onto substrates and a component mounting machine for mounting components onto substrates on which solder patterns have been printed by the printing machine. A second type of production line may include a substrate inspection machine for inspecting substrates on which component mounting has been performed and a reflow machine for reflowing substrates inspected by the substrate inspection machine. With such a configuration, the first type of production line, which includes the printing machine and the component mounting machine, constitutes the first number of lines, and the second type of production line, which includes the substrate inspection machine and the reflow machine, constitutes the second number of lines, allowing each piece of equipment to be operated efficiently.

[0008] In the substrate production system disclosed herein, each of the second type of production lines with a second number of lines may be located adjacent to the corresponding first type of production line among the first type of production lines with a first number of lines. A second type of production line is not necessarily located adjacent to a first type of production line that does not correspond to a first type of production line among the first type of production lines with a first number of lines. Substrates that have undergone component mounting processing on a non-corresponding first type of production line may undergo post-processing on a specific second type of production line among the second type of production lines with a second number of lines. With this configuration, a second type of production line can be located adjacent to some first type of production lines downstream, allowing component mounting processing and post-processing to be carried out continuously.

[0009] In the substrate production system disclosed herein, a specific second type of production line may be configured to perform post-processing on substrates that have undergone component mounting processing in a first type of production line located adjacent to and upstream of the specific second type of production line, and on substrates that have undergone component mounting processing in a non-corresponding first type of production line. Such a configuration allows for efficient operation of the equipment in both the first and second type of production lines.

[0010] In the substrate production system disclosed herein, a specific second type of production line may perform post-processing on substrates for which component mounting has been performed on a non-corresponding first type production line when the component mounting process is stopped on a first type production line located adjacent to the upstream of the specific second type of production line. With this configuration, when the first type of production line is stopped, the equipment of the specific second type of production line located adjacent to it downstream can be operated efficiently.

[0011] In the substrate production system disclosed herein, the stopped state may be a state in which a changeover operation is being performed on the first type of production line. With this configuration, when the first type of production line is performing a changeover operation, the equipment of a specific second type of production line located downstream and adjacent to it can be operated efficiently.

[0012] (Example 1) Hereinafter, an embodiment of the substrate production system 11 of the present invention will be described with reference to the drawings. Figure 1 is a schematic diagram showing the substrate production system 11 of this embodiment.

[0013] The PCB production system 11 is a system that produces a PCB 1 with components mounted on it by mounting components on a PCB 1 that is fed into the system, and comprises a first production equipment 21 and a second production equipment 22. In this embodiment, the first production equipment 21 and the second production equipment 22 are arranged side by side with a predetermined space between them, and the first production equipment 21 and the second production equipment 22 are independent of each other. That is, the PCB transport direction of the first production equipment 21 is parallel to the PCB transport direction of the second production equipment, and the first production equipment 21 and the second production equipment are arranged with space between them in a direction perpendicular to the PCB transport direction. The PCB 1 comprises at least one pad and a chip component to be mounted on the pad. The PCB 1 may also comprise at least one land and a leaded component to be mounted on the land.

[0014] The first production equipment 21 is equipment for performing component mounting processing, which involves mounting components onto a circuit board 1, and includes a first type of production line 26 (hereinafter sometimes simply referred to as production line 26). Production line 26 includes a printing press 31 and a component mounting machine 32. Production line 26 further includes a circuit board transport device 33 for transporting the circuit board 1 from the upstream end to the downstream end of production line 26, a storage unit 35, a circuit board feeder storage unit 36, a replacement robot 37, etc. Production line 26 may further include a circuit board loader (not shown).

[0015] The printing press 31 prints solder patterns on the circuit boards 1, which are fed in one by one from a circuit board loader (not shown). The circuit boards 1 with the solder patterns printed on them are transported from the printing press 31 by a circuit board transport device 33. Specifically, the circuit board transport device 33 moves the circuit boards 1 with the solder patterns printed on them to the component mounting machine 32. Between the printing press 31 and the component mounting machine 32, there is a storage unit 35 for temporarily holding materials used in the component mounting process and the circuit boards 1.

[0016] Multiple component mounting machines 32 are provided along the substrate transport path and mount components onto substrates 1 on which solder patterns have been printed by the printer 31. The substrate transport device 33 transports the substrates 1 on which solder patterns have been printed by the printer 31 to the component mounting positions of each component mounting machine 32 and positions them. The substrate transport device 33 includes, for example, a belt conveyor and a positioning device. The component mounting machine 32 is equipped with a mounting unit that mounts a predetermined number of components onto the substrate 1 that has been transported to the component mounting position. The mounting unit is equipped with multiple detachably attached component feeders 38 and mounts the components supplied from these component feeders 38 onto the substrate 1. The substrates 1 on which components have been mounted by the component mounting machine 32 are transported downstream of the substrate transport device 33 by the substrate transport device 33. A substrate mounting feeder storage unit 36 ​​is located at the downstream end of the substrate transport device 33. In production line 26A, the circuit boards 1 with mounted components that reach the downstream end of the circuit board transport device 33 are transported to the second production equipment 22 (described later), or transferred to the circuit board feeder storage unit 36 ​​by means of a robot or other means (not shown). In production line 26B, the circuit boards 1 with mounted components that reach the downstream end of the circuit board transport device 33 are transferred to the circuit board feeder storage unit 36.

[0017] The replacement robot 37 moves between the board-mounted feeder storage unit 36 ​​and the storage unit 35. The replacement robot 37 is a device that automatically transports and retrieves component feeders 38 for multiple component mounting machines 32. The component feeders 38 contain components used for component mounting. The replacement robot 37 also transports board-mounted feeders that contain boards 1 with components mounted on them.

[0018] The first production facility 21 described above is equipped with a first type of production line 26, and in this embodiment, it is equipped with two first type of production lines 26.

[0019] The second production facility 22 is a facility for performing post-processing on the substrate 1 on which component mounting processing has been carried out on the production line 26, and includes a second type of production line 27 (hereinafter, may be simply referred to as the production line 27). The production line 27 includes a substrate inspection machine 41 and a reflow machine 42. The production line 27 may further include a substrate unloader (not shown) or the like.

[0020] The substrate inspection machine 41 inspects the substrate 1 on which component mounting processing has been carried out. The substrate inspection machine 41 is, for example, a substrate appearance inspection machine, and inspects whether components are normally mounted on the substrate 1. If components are not normally mounted on the substrate 1 (for example, if the components are mounted in different locations), the substrate 1 is discarded. On the other hand, if components are normally mounted on the substrate 1, the substrate 1 is carried out from the substrate inspection machine 41 to the reflow machine 42.

[0021] The reflow machine 42 performs reflow processing on the substrate 1 inspected by the substrate inspection machine 41. That is, the reflow machine 42 heats the carried-in substrate 1 to melt the solder and solder the components to the substrate 1. The substrate 1 carried out from the reflow machine 42 is carried out to a substrate unloader (not shown). Then, the substrate unloader carries out the substrate 1 on which components are mounted by soldering from the second type of production line 27.

[0022] The above-mentioned second production facility 22 includes the second type of production line 27 in a second line number that is less than the first line number, and in this embodiment, only one second type of production line 27 is provided.

[0023] Next, the layout of the first production facility 21 and the second production facility 22 will be described.

[0024] Each of the second type of production lines 27 with the second line number is provided adjacent to the downstream of the corresponding first type of production line 26A among the first type of production lines 26 (26A, 26B) with the first line number. Specifically, the second type of production line 27 has a line number of "1", and the first type of production lines 26 (26A, 26B) have a line number of "2". The second type of production line 27 is provided adjacent to the downstream of the corresponding first type of production line 26A (the left production line 26A in FIG. 1) among the first type of production lines 26 (26A, 26B). That is, adjacent to the downstream of the first type of production line 26A, equipment for performing post-processing on the substrate 1 on which component mounting processing has been performed is provided.

[0025] On the other hand, the second type of production line 27 is not provided adjacent to the downstream of the production line 26B among the first type of production lines 26 (26A, 26B). That is, in this embodiment, adjacent to the downstream of the production line 26B (the right production line in FIG. 1), equipment for performing post-processing on the substrate 1 on which component mounting processing has been performed is not provided.

[0026] Then, the substrate 1 on which component mounting processing has been performed on the production line 26B is subjected to post-processing on a specific second type of production line 27A among the second type of production lines 27 with the second line number. The specific second type of production line 27A is configured to be able to perform post-processing on each of the substrate 1 on which component mounting processing has been performed on the production line 26A provided adjacent to its upstream and the substrate 1 on which component mounting processing has been performed on the production line 26B. That is, in this embodiment, the substrate 1 on which component mounting processing has been performed on the first type of production lines 26 (26A, 26B) is all subjected to post-processing on one common second type of production line 27 (specific second type of production line 27A).

[0027] The PCB production system 11 is connected to a control device (not shown) via a communication line. The control device is, for example, a computer composed of a CPU, ROM, RAM, etc., and manages the operation of each device in the first type of production line 26 (printing press 31, component mounting machine 32, etc.) and each device in the second type of production line 27 (board inspection machine 41, reflow machine 42, etc.). The PCB production system 11 also includes at least one automated transport device 51 (for example, an automated guided vehicle (AGV), an autonomous mobile robot (AMR), etc.). In this embodiment, the automated transport device 51 is located in the space between the upstream side of production line 26A and the upstream side of production line 26B. The automated transport device 51 moves between the storage facilities 35 of the production lines 26 (26A, 26B) and automatically transports feeder magazines that stock board mounting feeders containing boards 1 after component mounting processing. The control device may also manage the operation of the automated transport device 51.

[0028] Next, we will explain the operation when the circuit board 1 is produced by the circuit board production system 11.

[0029] Normally, the PCB production system 11 produces PCBs 1 by operating the first production equipment 21 and the second production equipment 22, respectively. In the first production equipment 21, component mounting is performed on production lines 26A and 26B, respectively. For PCBs 1 that have undergone component mounting on production line 26A, post-processing (inspection and reflow processing) is performed on production line 27A located downstream, completing the PCB 1 with soldered components. Meanwhile, PCBs 1 that have undergone component mounting on production line 26B are transferred to the PCB mounting feeder storage unit 36. In the PCB mounting feeder storage unit 36, the PCBs 1 are placed in the PCB mounting feeders. Then, the exchange robot 37 transports the PCB mounting feeders containing the PCBs 1 from the PCB mounting feeder storage unit 36 ​​to the storage unit 35 (see the route indicated by arrow A1). The transported PCB mounting feeders are then temporarily stored in the storage unit 35. Furthermore, the circuit board-mounted feeders stored in the storage unit 35 of production line 26B are transported to the circuit board-mounted feeder storage unit 36 ​​of production line 26A by the automated transport device 51 and the exchange robot 37. The circuit board-mounted feeder storage unit 36 ​​of production line 26A feeds the circuit boards 1 (i.e., circuit boards with components mounted) contained in the transported circuit board-mounted feeders into production line 27A. As a result, post-processing is performed on the fed circuit boards 1 in production line 27A, and the circuit boards 1 with components soldered on are completed.

[0030] In the PCB production system 11, one of the production lines 26A or 26B of the first production equipment 21 may be stopped. Specifically, for example, when a changeover is performed on production line 26A, which is located adjacent to the upstream of production line 27A, the component mounting process on production line 26A is stopped, and the system becomes stopped. In this stopped state, production line 27A can perform post-processing (inspection and reflow processing) on ​​the PCB 1 for which component mounting processing has been performed on production line 26B. In this embodiment, the PCB 1 after component mounting processing is transported from production line 26B to production line 26A. Specifically, the automatic transport device 51 transports a feeder magazine containing multiple PCB mounting feeders from the storage unit 35 on the production line 26B side to the storage unit 35 on the production line 26A side (see the route indicated by arrow A2). Then, a loader 38 belonging to production line 26A transports the board-mounted feeder containing the board 1 from the storage unit 35 to the board-mounted feeder storage unit 36 ​​(see the route indicated by arrow A3). Note that the transport of the board 1 after component mounting processing from production line 26B to production line 26A may be done manually (see the route indicated by arrow A4). That is, an operator may manually transport the board 1 after component mounting processing from the operating board-mounted feeder storage unit 36 ​​to the board-mounted feeder storage unit 36 ​​that is stopped for setup change. After this, the board 1 transported to the board-mounted feeder storage unit 36 ​​of production line 27A is fed into production line 27A. Post-processing is performed in production line 27A, and as a result, the board 1 with soldered components is completed. Note that once the setup change in production line 26A is complete, production returns to normal.

[0031] In the PCB production system 11 of this embodiment, the downtime for production line 27 during setup changes is shorter than the downtime for production lines 26A and 26B during setup changes. This is because production lines 26A and 26B include a printing press 31 and a component mounting machine 32, which require physical setup changes, whereas the PCB inspection machine 41 and reflow machine 42 can be set up by simply changing the data. For this reason, in conventional technology, there was a waiting period during which the second type of production line 27 was stopped while the first type of production lines 26A and 26B were being set up.

[0032] In this respect, the PCB production system 11 of this embodiment has production lines 26A and 26B (i.e., 2 lines) in the first production equipment 21 and production line 26A and 26B (i.e., 2 lines) in the second production equipment 22 and production line 27 (i.e., 1 line). Therefore, PCBs 1 after component mounting can be transported from production line 26B, which is not undergoing setup changes, to production line 27, and post-processing can be performed on the transported PCBs 1. Thus, even when there is a waiting time due to the shutdown of some equipment, it is possible to operate the equipment (i.e., the production line) efficiently, and PCBs 1 can be produced efficiently. In other words, according to the configuration of this embodiment, by making the number of second lines of the second type of production line 27 less than the number of first lines of the first type of production line 26, it is possible to prevent a decrease in the operating rate of the second type of production line 27. Therefore, a PCB production system 11 that is advantageous for multi-product, small-batch production can be realized. Furthermore, according to this embodiment, since some equipment is shared, the overall equipment can be made smaller.

[0033] Furthermore, the aforementioned PCB production system 11 can efficiently manufacture different types of PCBs 1 while increasing the operating rate of each piece of equipment. For example, component mounting processing can be performed on the first type of PCB in production line 26A, and on the second type of PCB in production line 26B. Then, post-processing can be performed on both the first type of PCB (which underwent component mounting processing in production line 26A) and the second type of PCB (which underwent component mounting processing in production line 26B) in production line 27A. In other words, the post-processing (inspection and reflow processing) in production line 27A can be performed in a shorter time than the component mounting processing performed in production lines 26A and 26B. Therefore, by performing post-processing on PCBs that have undergone component mounting processing in production lines 26A and 26B in a single production line 27, two types of PCBs can be efficiently produced without reducing the operating rate of production line 27. The PCB production system 11 may also be used as a system to produce multiple types of PCBs, or as a system to produce only one type of PCB. Even in this case, by balancing the production capacity of production lines 26A and 26B with the production capacity of production line 27, it is possible to efficiently manufacture circuit boards while increasing the operating rate of each of the production lines 26a, 26b, and 27.

[0034] (Example 2) Next, with reference to Figure 2, the substrate production system 11A of Example 2 will be described. Figure 2 is a schematic diagram showing the substrate production system 11A of this example. The following description will mainly focus on the configurations that differ from those of Example 1. For configurations common to Example 1, detailed explanations will be omitted, for example, by assigning common part numbers.

[0035] In the substrate production system 11A of this embodiment, another production line 26C of the first type is located right next to the first production line 26B. In other words, in this embodiment, the first production equipment 21 is equipped with three production lines 26 of the first type.

[0036] Furthermore, in the substrate production system 11A of this embodiment, in addition to the second type of production line 27A, there is another second type of production line 27B. In other words, in this embodiment, the second production equipment 21 is equipped with two second type of production lines 26. The second type of production line 27B is located downstream of the first type of production lines 26B and 26C, but is not connected to them and is located independently at a slightly separated position. The second type of production line 27B extends in a direction perpendicular to the substrate transport direction of the first type of production lines 26B and 26C. The second type of production line 27B is equipped with a substrate inspection machine 41 and a reflow machine 42, and further upstream of the substrate inspection machine 41, it is equipped with a storage unit 35, a substrate-mounted feeder storage unit 36, and a replacement robot 37.

[0037] Normally, circuit boards 1 with component mounting processed are transported to the second type of production line 27B from each of the two first type of production lines 26B and 26C. Specifically, the automated transport device 51 transports a feeder magazine containing multiple circuit board-mounted feeders from the storage 35 of the first type of production line 26B (see the route indicated by arrow A6). The automated transport device 51 also transports a feeder magazine containing multiple circuit board-mounted feeders from the storage 35 of production line 26C (see the route indicated by arrow A7). The transported multiple circuit board-mounted feeders are then handed over to the storage 35 of the second type of production line 27B. The circuit board-mounted feeders handed over to the storage 35 are then transported to the circuit board-mounted feeder storage 36 by the exchange robot 37. Then, the circuit board 1, which has undergone component mounting, is fed into the circuit board inspection machine 41 and the reflow machine 42, after which post-processing (inspection and reflow processing) is performed, and the circuit board 1 with soldered components is completed.

[0038] For example, when a setup change is performed on the first type of production line 26A, which is located upstream of the second type of production line 27A, the component mounting process on production line 26A is stopped and the line enters a stopped state. In this stopped state, production line 27A performs post-processing (inspection and reflow processing) on ​​the circuit boards 1 that have undergone component mounting processing on production lines 26B and 26C, which are not stopped. In this embodiment, the automatic transport device 51 transports the circuit boards 1 after component mounting processing from the production line 26B side to the storage unit 35 on the production line 26A side. In addition, the automatic transport device 51 transports the circuit boards 1 after component mounting processing from the production line 26C side to the storage unit 35 on the production line 26A side (see the route indicated by arrow A5). After this, the circuit boards 1 that have been transported to the circuit board feeder storage unit 36 ​​on production line 26A are fed into production line 27A. There, post-processing is performed, and as a result, the circuit boards 1 with soldered components are completed. Once the setup changeover for production line 26A is complete, normal production will resume.

[0039] Even with the configuration of the substrate production system 11A of this embodiment described above, substrates 1 after component mounting can be transported to production line 27 from production lines 26B and 26C, which are not undergoing setup changes, and post-processing can be carried out there. Therefore, even when there is a waiting time due to the shutdown of some equipment, the equipment can be operated efficiently, and substrates 1 can be produced efficiently.

[0040] Although Examples 1 and 2 have been described above, the specific embodiments are not limited to Examples 1 and 2. In Examples 1 and 2, the substrate 1 on which the component mounting process was performed was temporarily stored in a storage unit 35 on the substrate transport route and transported from there, but the configuration is not limited to this. For example, in other embodiments, the substrate 1 on which the component mounting process was performed may be stored in a separate location away from the substrate transport route and transported from there.

[0041] For example, a control device, which is a higher-level system of the circuit board production system 11A, may constantly monitor the production status in production lines 26A, 26B, and 26C, and make a decision on which production line 27A or 27B the circuit boards 1 that have undergone component mounting processing in each of the aforementioned lines should be fed for post-processing. By automatically feeding the circuit boards 1 based on this decision, the equipment can be operated more efficiently.

[0042] In the above embodiments 1 and 2, examples were shown in which the parts feeder 38 is transported by the exchange robot 37, but the technology disclosed herein is not limited to this configuration. For example, the exchange robot 37 may transport parts units that contain parts but do not have a feeder (supply) function.

[0043] In the above embodiments 1 and 2, examples were shown in which a substrate mounting feeder is transported by an automatic transport device 51, but the technology disclosed herein is not limited to this configuration. For example, the automatic transport device 51 may transport a substrate mounting unit that accommodates a substrate 1 with components mounted on it but does not have a feeder (supply) function.

[0044] Although specific examples of the present invention have been described in detail above, these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples illustrated above. The technical elements described in this specification or drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technologies illustrated in this specification or drawings can achieve multiple objectives simultaneously, and achieving even one of these objectives itself constitutes technical usefulness. [Explanation of Symbols]

[0045] 1: Circuit board 11, 11A: PCB production system 21: Production Facility No. 1 22: Second Production Facility 26: Type 1 production line 26A: Corresponding to the first type of production line 26B, 26C: Not compatible with Type 1 production line 27: Second type of production line 27A: A specific second type of production line 31:Printing machine 32: Component mounting machine 41: Circuit board inspection machine 42: Reflow machine

Claims

1. A first production facility equipped with a first type of production line, the number of which is the number of lines, for performing component mounting processing to mount components onto a circuit board, A second production facility comprising a second production line, having a second number of lines less than the number of the first production line, for performing post-processing on the substrate that has undergone component mounting processing on the first production line, Equipped with, The first type of production line includes a component mounting machine for mounting the components onto the substrate, A circuit board production system in which the component mounting machines provided in each of the first type of production lines of the first number of lines are provided independently of the component mounting machines provided in other first type of production lines.

2. The first type of production line further comprises a printing machine for printing a solder pattern onto the substrate, The component mounting machine provided in the first type of production line mounts the components onto the substrate on which the solder pattern has been printed by the printing machine provided in the first type of production line. The substrate production system according to claim 1, wherein the second type of production line comprises a substrate inspection machine for inspecting the substrate on which the component mounting process has been performed, and a reflow machine for reflow processing the substrate inspected by the substrate inspection machine.

3. Each of the second type of production lines with the second number of lines is provided adjacent to the corresponding first type of production line with the first number of lines downstream. In the first type of production line of the first number of lines, the second type of production line is not located adjacent to any of the first type of production lines that do not correspond to the first type of production line. A substrate production system according to claim 1 or 2, wherein the substrate on which the component mounting process has been performed in the non-corresponding first type production line is transported by an automated transport device to a storage facility provided in the corresponding first type production line, and the post-processing is performed in a specific second type production line among the second number of second type production lines.

4. No second type of production line is provided adjacent to the first type of production line downstream. The substrate production system according to claim 1 or 2, wherein the substrate on which the component mounting process has been carried out in the first type of production line is transported by an automatic transport device to a storage facility provided in a specific second type of production line among the second number of second line production lines, and the post-processing is carried out in the specific second type of production line.

5. The substrate production system according to claim 3, wherein the specific second type of production line is configured to enable the post-processing to be performed on substrates for which the component mounting process has been carried out in the first type of production line located adjacent to the upstream of the specific second type of production line, and on substrates for which the component mounting process has been carried out in the first type of production line that does not correspond to the second type of production line.

6. The substrate production system according to claim 5, wherein the specified second type of production line performs the post-processing on substrates on which the component mounting process has been performed in the non-corresponding first type of production line when the component mounting process is stopped in the first type of production line which is located adjacent to the upstream of the specified second type of production line.

7. The substrate production system according to claim 6, wherein the stopped state is a state in which a changeover operation is being performed on the first type of production line.

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