Calibration device and calibration method

Abstract

To provide a calibration device and a calibration method for an operation head capable of executing calibration processing even when a calibration tool is deficient.SOLUTION: A calibration device comprises a setting part that makes settings for performing a measurement step in calibration processing more than once, when the number of calibration tools housed in a tool station is smaller than the number of holders for an operation head.SELECTED DRAWING: Figure 2

Description

【Technical Field】 【0001】 The present invention relates to a calibration device and a calibration method. 【Background Art】 【0002】 A calibration device is used for calibration processing for a work head that performs a predetermined substrate-facing operation using a tool such as a suction nozzle on a substrate. For the calibration processing of the work head, it is known to acquire the relative position of the work head with respect to the moving table and to inspect the state of the holder to which the tool can be attached (see Patent Documents 1 and 2). In the above calibration processing, for the purpose of improving processing accuracy, etc., a calibration tool may be attached to the holder. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2017-191888 【Patent Document 2】 Japanese Patent Application Laid-Open No. 2009-164276 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 When the work head can automatically exchange tools such as suction nozzles with a tool station, at least the calibration tools of the number of holders in the work head are pre-accommodated in the tool station when performing the calibration processing. However, if the calibration tools in the tool station are insufficient, the calibration processing cannot be executed and an error stop will occur. 【0005】 This specification aims to provide a calibration device and a calibration method for a work head that can execute calibration processing even when calibration tools are insufficient. 【Means for Solving the Problems】 【0006】 This specification discloses a calibration device applicable to a substrate-facing work machine, which is configured to automatically exchange tools with a tool station located inside the machine and has a work head that performs predetermined substrate-facing work on a substrate using the tools, and which performs a calibration process on the work head, wherein the calibration process includes a measurement step of attaching calibration tools applicable to the calibration process to a plurality of holders provided on the work head of the substrate-facing work machine and measuring the actual position of each of the plurality of holders inside the machine, and the calibration device includes a setting unit that sets the measurement step in the calibration process to be performed multiple times if the number of calibration tools that can be stored in the tool station is less than the number of holders in the work head. 【0007】 This specification discloses a calibration method applicable to a substrate-facing work machine, which is configured to automatically exchange tools with a tool station located inside the machine and has a work head that performs predetermined substrate-facing work on a substrate using the tools, and which performs a calibration process on the work head, wherein the calibration process includes a measurement step of attaching calibration tools applicable to the calibration process to a plurality of holders provided on the work head of the substrate-facing work machine and measuring the actual positions of the plurality of holders inside the machine, and a setting step of setting the measurement step in the calibration process to be performed multiple times if the number of calibration tools that can be stored in the tool station is less than the number of holders in the work head. 【0008】 This specification also discloses the technical idea of ​​changing "the calibration device described in claim 4" to "the calibration device described in claim 4 or 5" in the original claim 6, the technical idea of ​​changing "the calibration device described in claim 4" to "the calibration device described in any one of claims 4-6" in the original claim 7, the technical idea of ​​changing "the calibration device described in claim 1 or 2" to "the calibration device described in any one of claims 1-7" in the original claim 8, the technical idea of ​​changing "the calibration device described in claim 8" to "the calibration device described in claim 8 or 9" in the original claim 10, the technical idea of ​​changing "the calibration device described in claim 1 or 2" to "the calibration device described in any one of claims 1-10" in the original claim 11, and the technical idea of ​​changing "the calibration device described in claim 1 or 2" to "the calibration device described in any one of claims 1-11" in the original claim 12. [Effects of the Invention] 【0009】 With the calibration device and calibration method configuration described above, if the number of calibration tools to be stored is less than the number of holders in the work head, the number of measurement steps is set appropriately, so that the actual positions of multiple holders required for calibration can be measured. This makes it possible to perform calibration even when there is a shortage of calibration tools in the tool station. Furthermore, when the tools required for substrate work are stored in the tool station, even if the remaining storage capacity is less than the number of holders, calibration tools can be stored to enable calibration. [Brief explanation of the drawing] 【0010】 [Figure 1] This is a schematic diagram showing a production system to which a calibration device for the work head has been applied. [Figure 2] This is a schematic diagram showing the configuration of a parts mounting machine. [Figure 3] This is a schematic side view showing the mounting head. [Figure 4] This figure shows the holder and calibration tool as viewed from direction IV in Figure 3. [Figure 5] This block diagram shows the functions of a calibration device. [Figure 6] This is a flowchart showing the proofreading process. [Figure 7] This table shows the number of measurement steps to be performed, which is determined based on the number of calibration tools that can be accommodated and the number of holders in the work head. [Figure 8] This figure shows calibration information and skip information. [Figure 9] This is a diagram showing the calibration process schedule. [Modes for carrying out the invention] 【0011】 1. Overview of the work head calibration device The calibration device is used for calibration processing targeting a work head that performs predetermined board-to-board operations using a tool on a substrate. For example, as shown in Figure 3, the calibration device targets the mounting head 40 in a component mounting machine 2 that performs a mounting operation to attach components to a substrate 91 using a suction nozzle 46 as a tool. The calibration process determines the error between the control position of the holder of the work head to which the tool is attached and the actual position, and obtains a calibration value. The calibration process is performed as needed during the setup of board-to-board operations (for example, when the work head is replaced). In this embodiment, an example is given in which the calibration device is applied to a production system Sy configured by a component mounting machine 2 as a board-to-board work machine. 【0012】 2. Configuration of production line Ln The component mounting machine 2 described above is a board-to-board work machine that performs the mounting process as a predetermined board-to-board operation. As shown in Figure 1, the production line Ln is configured by installing multiple board-to-board work machines in the transport direction of the board 91. Each of the multiple board-to-board work machines is connected to a host computer 70 that controls the production line Ln in a communication manner. 【0013】 As shown in FIG. 5, the host computer 70 includes a storage unit 71. The storage unit 71 stores a calibration process schedule M1 and a storage schedule M2. The calibration process schedule M1 indicates the execution timing of the calibration process. The execution timing of the calibration process corresponds to the execution timing of the setup change of the production process assigned to each substrate processing machine in the production plan indicating the types and production order of the product substrates scheduled for production. However, the calibration process may be omitted in the setup change of the production process. 【0014】 The above storage schedule M2 indicates how to store the calibration tool 60 used for the calibration process in a plurality of tool stations (in this embodiment, the nozzle station 53) in correspondence with the execution timing of the calibration process. The storage schedule M2 is used for the movement process of the calibration tool 60. Details of the calibration process schedule M1 and the storage schedule M2 will be described later. 【0015】 The production line Ln includes a printer 1 as a plurality of substrate processing machines, a plurality of component mounting machines 2, a reflow furnace 3, and an inspection machine 4. The printer 1 prints paste-like solder at the component mounting positions on the loaded substrate 91. Each of the plurality of component mounting machines 2 mounts components on the substrate 91 conveyed from the upstream side of the production line Ln. The configuration of the component mounting machine 2 will be described later. The reflow furnace 3 heats the substrate 91 conveyed from the upstream side of the production line Ln to melt the solder on the substrate 91 for soldering. The inspection machine 4 inspects whether the appearance or function of the product substrate produced by the production line Ln is normal. 【0016】 In this embodiment, a plurality of production lines Ln (Ln1, Ln2,...) may be configured in the factory of the product substrate. Each of the plurality of production lines Ln can be appropriately added to or changed in its configuration according to, for example, the type of the product substrate to be produced. Specifically, buffer devices, substrate supply devices, substrate inversion devices, various inspection devices, shield mounting devices, adhesive coating devices, ultraviolet irradiation devices, and other substrate processing machines for temporarily holding the conveyed substrate 91 can be appropriately installed in the plurality of production lines Ln. 【0017】 3. Configuration of Component Mounting Machine 2 As shown in FIG. 2, the component mounting machine 2 includes two sets of working units each consisting of a substrate transfer device 10, a component supply device 20, a component transfer device 30, a component camera 51, a substrate camera 52, and a nozzle station 53, and a control device 55. In the following description, the horizontal direction and the front-rear direction of the component mounting machine 2 (the direction from the lower left to the upper right in FIG. 2) is defined as the Y direction, the horizontal direction intersecting the Y direction and the left-right direction of the component mounting machine 2 (the direction from the upper left to the lower right in FIG. 2) is defined as the X direction, and the vertical direction orthogonal to the X and Y directions (the vertical direction in FIG. 2) is defined as the Z direction. 【0018】 The above two sets of working units are arranged side by side in the Y direction and are configured to be line-symmetric at the central portion in the Y direction. Hereinafter, the side where the two sets of working units are installed (the lower side in FIG. 2) is defined as the first side S1, the other side (the upper side in FIG. 2) is defined as the second side S2, and the configuration of the working unit on the first side S1 will be described. In FIG. 2, in order to distinguish the two sets of units, the symbol of each configuration is appended with "A" on the first side S1 and "B" on the second side S2. 【0019】 [[ID=,12]]3-^{1}. Substrate Transfer Device 10 The substrate transfer device 10 is constituted by a transfer mechanism 11 installed side by side in the Y direction and the like. The transfer mechanism 11 has a pair of guide rails 12 and a pair of conveyor belts 13 respectively. The pair of guide rails 12 extends in the substrate transfer direction (X direction) and supports the periphery of the substrate 91 placed on the conveyor belt 13 and conveyed. At least one of the pair of guide rails 12 is provided on the base so as to be movable in the Y direction. 【0020】 The substrate transfer device 10 sequentially transfers the substrate 91 in the transfer direction and positions the substrate 91 at a predetermined position in the machine. The substrate transfer device 10 has a backup device 15 for clamping the positioned substrate 91 (see FIG. 3). After the execution of the component mounting process, the substrate transfer device 10 discharges the substrate 91 outside the component mounting machine 2. 【0021】 3-2. Parts supply device 20 The parts supply device 20 comprises a plurality of slots 21 and a plurality of reel holding units 22 arranged in the X direction. Each of the plurality of slots 21 is detachably set with a feeder 23. The feeder 23 feeds and moves a carrier tape containing a large number of parts to supply parts in a pickable state. The reel holding units 22 detachably hold reels on which the carrier tape is wound. Alternatively, the parts supply device 20 may supply, for example, relatively large parts arranged on trays placed on pallets. In the above configuration, the parts supply device 20 draws a predetermined pallet from a storage device that stores a plurality of pallets according to the mounting process and supplies the parts. 【0022】 3-3. Parts transfer device 30 The component transfer device 30 transfers components supplied by the component supply device 20 to a predetermined mounting position on the substrate 91 that has been brought into the machine by the substrate transport device 10. The head drive device 31 of the component transfer device 30 moves the mobile table 32 horizontally (X and Y directions) by a linear motion mechanism. A mounting head 40, which serves as a work head, is detachably fixed to the mobile table 32 by a clamping member (not shown). Various tools can be detachably attached to the mounting head 40. These tools include a suction nozzle 46 for holding components and a calibration tool 60, which will be described later (see Figure 3). 【0023】 As shown in Figure 3, the mounting head 40 has a rotary head 41 that is rotatable around an R axis parallel to the vertical axis (Z axis). The rotary head 41 supports a plurality of holders 42 so that they can be raised and lowered and rotated around the central axis (Q axis) of each of the plurality of holders 42. Each of the plurality of holders 42 is fitted with a holding member for holding a part 92. In this embodiment, the holding member is a type of tool, a suction nozzle 46 that holds the part 92 by suction using supplied negative pressure air. Alternatively, a chuck or the like that can be used as the holding member to hold the part by gripping it. 【0024】 The suction nozzle 46 has a shaft portion 461 that extends in the direction of the central axis and is formed in a cylindrical shape. A flange 462 is fixed to the shaft portion 461. The lower surface of the flange 462 is the background area when imaging the suction nozzle 46 from below. The upper surface of the flange 462 is marked with a code 463 indicating identification information of the suction nozzle 46. 【0025】 The mounting head 40 has an R-axis rotation device 43 that rotates the rotary head 41 around the R axis. The R-axis rotation device 43 sets the rotary head 41 to a predetermined angle around the R axis, thereby determining the position in which one holder 42 is raised or lowered by a lifting device 45, which will be described later. The mounting head 40 has a Q-axis rotation device 44 that rotates the holder 42 around the Q axis. In this embodiment, the Q-axis rotation device 44 has a mechanism that rotates a plurality of holders 42 in conjunction and is used for the rotation of a plurality of holders 42. With the above configuration, when one holder 42 is set to a predetermined angle around the Q axis, the other plurality of holders 42 are set to predetermined angles in conjunction. 【0026】 The mounting head 40 has a lifting device 45 that raises and lowers the holder 42 that has been assigned to a lifting position by the rotation of the rotary head 41 from among a plurality of holders 42. The lifting device 45 lowers and raises the suction nozzle 46 attached to the holder 42 by lowering and raising the holder 42. The mounting head 40 may be configured to have two or more lifting positions and to have a plurality of lifting devices that can be driven independently to raise and lower the holder 42 positioned at each position. 【0027】 The number of holders 42 supported by the mounting head 40 having the above configuration (hereinafter referred to as "number of holders Vs") may vary depending on the type of mounting head 40. Furthermore, the mounting head 40 can adopt various configurations other than the configuration in which a plurality of holders 42 are supported in an annular shape at equal intervals, as in this embodiment. For example, the mounting head 40 may adopt a configuration in which a plurality of holders 42 are arranged in a linear or matrix-like manner. 【0028】 As described above, the component mounting machine 2 of this embodiment includes an opposing robot with multiple work heads (mounting heads 40A, 40B) arranged facing each other in the Y direction. The movable ranges of the multiple mounting heads 40A, 40B overlap, and they are configured to be able to access the side opposite to the side the machine is close to (for example, the first side S1 of the first mounting head 40A) (for example, the second side S2), allowing them to work alternately on the same substrate 91. Non-interference control is performed on the multiple mounting heads 40A, 40B so that interference does not occur in the areas where their movable ranges overlap. 【0029】 3-4. Component camera 51, circuit board camera 52 The component camera 51 and the substrate camera 52 are digital imaging devices having an image sensor such as a CMOS. The component camera 51 and the substrate camera 52 perform imaging based on a control signal and transmit the image data acquired by the imaging. The component camera 51 is configured to be able to image a component held by the suction nozzle 46 from below. The substrate camera 52 is mounted on a movable stage 32 so as to be able to move horizontally integrally with the mounting head 40. The substrate camera 52 is configured to be able to image the substrate 91 from above. 【0030】 Furthermore, in addition to imaging the surface of the substrate 91, the substrate camera 52 can also image various devices and other objects as long as they are within the movable range of the mobile platform 32. For example, in this embodiment, as shown in Figure 3, the substrate camera 52 can capture images of a code attached to the nozzle station 53 (not shown) and tools housed in the nozzle station 53 (such as the suction nozzle 46 and calibration tool 60) within its camera field of view. In this way, the substrate camera 52 can be used to image different objects in order to acquire image data used for various image processing applications. 【0031】 3-5. Nozzle Station 53 The nozzle station 53 is located inside the component mounting machine 2. The nozzle station 53 is a tool station that houses various tools used by the component mounting machine 2, which acts as a board-mounting machine, for board-mounting work. In this embodiment, the nozzle station 53 detachably holds a plurality of suction nozzles 46 and calibration tools 60. In the process of replacing a suction nozzle 46, the nozzle station 53 holds the suction nozzle 46 that has been removed from the mounting head 40, and also holds another suction nozzle 46 in a removable manner. This allows the component mounting machine 2 to be configured to automatically replace the suction nozzles 46 according to the type of component to be mounted, for example, during the execution of the mounting process. 【0032】 The nozzle station 53 is detachably mounted on the base of the component mounting machine 2. A code attached to the top surface of the nozzle station 53 indicates the identification information of the nozzle station 53. This identification information is associated with the identification information and storage position of the tools that the nozzle station 53 houses. This storage position is indicated, for example, by the relative position of the storage section with respect to the reference position of the nozzle station 53. 【0033】 3-6. Control device 55 The control device 55 mainly consists of a CPU, various memories, and control circuits. The control device 55 performs a mounting process to attach components to the circuit board 91. During the mounting process, the control device 55 controls the operation of the component transfer device 30 based on information output from various sensors, the results of image processing, and control programs pre-stored in the memory unit 56. This controls the position and angle of the multiple suction nozzles 46 supported by the mounting head 40. 【0034】 Furthermore, the storage unit 56 stores calibration information D1 and skip information D2 generated or edited by the calibration device 80, which will be described later. As shown in Figure 8, the calibration information D1 indicates the calibration amount calculated for each of the multiple holders 42 by the calibration process. The skip information D2 indicates whether or not a defective holder 42 that can be detected in the calibration process is set to be skipped so as not to be used in the mounting process. 【0035】 The control device 55 executes the mounting process based on the calibration information D1 and the skip information D2. This allows the control device 55 to improve the mounting accuracy of the component 92 during the mounting process and to prevent mounting errors by restricting the use of defective holders. Details regarding the generation of calibration information D1 and skip information D2 by the calibration device 80 will be described later. 【0036】 4. Calibration device for the work head 80 4-1. Overview and Configuration of Calibration Device 80 The calibration device 80 performs a calibration process on the mounting head 40 before executing the mounting process. The purpose of the calibration process is to understand individual differences in the configuration of the mounting head 40 and to obtain appropriate correction values ​​according to the operating conditions and operating status before executing the mounting process. The above-mentioned "individual differences, etc." include, for example, mounting errors between the mobile base 32 and the mounting head 40, and positional errors of the multiple holders 42 relative to the reference position of the mounting head 40. The calibration device 80 may also calibrate rotational errors of the holders 42 around the R axis, rotational errors around the Q axis, and height errors due to lifting and lowering operations. 【0037】 In this embodiment, the calibration process determines the error between the controlled position of each holder 42 of the mounting head 40, to which tools such as retaining members are attached, and the actual position, and obtains a calibration value. Specifically, the calibration device 80 moves the mounting head 40 above the component camera 51 and acquires image data D5 (see Figure 4) by imaging from below. 【0038】 The calibration device 80 then processes the image data D5 and recognizes the reference mark 48 provided on the underside of the mounting head 40. This allows it to obtain the relative position of the mounting head 40 with respect to the optical axis of the component camera 51, which is located at a specified position inside the machine. The calibration device 80 then determines the error between the control position of the mounting head 40 during imaging and the actual position of the mounting head 40 obtained as described above. 【0039】 Furthermore, the calibration device 80 acquires the relative positions of the multiple holders with respect to the reference position of the mounting head 40 (for example, the position of the reference mark 48). This is because even if the multiple holders 42 are arranged at equal intervals around the R axis, there may be some degree of positional error. Therefore, the calibration device 80 individually acquires the positional relationship of the center (Q axis) of each holder 42 with respect to the reference mark 48 of the mounting head 40 in the image data D5. 【0040】 The calibration device 80 calculates a calibration amount for each holder 42 identification information (ID) to cancel out the error between the controlled position and the actual position of the multiple holders 42. The calculated calibration amount is recorded in calibration information D1, as shown in Figure 8. For the sake of simplicity, in this explanation, the calibration amount for each of the multiple holders 42 in the calibration process is calculated with the angle around the Q axis at 0 degrees. However, the calibration device 80 may similarly calculate the calibration amount with the holders rotated by a predetermined angle (e.g., 90 degrees, 180 degrees) around the Q axis. This allows the position of the holders 42 to be corrected with a calibration amount at the same or an approximate angle as the mounting angle in the mounting process, thereby absorbing errors caused by rotation around the Q axis and improving mounting accuracy. 【0041】 Incidentally, in the calibration process described above, when the mounting head 40 is imaged by the component camera 51, it is preferable from the viewpoint of improving the accuracy of image processing that calibration tools 60 are attached to multiple holders 42. In this case, the calibration tools 60 attached to the holders 42 may be suction nozzles 46 that are actually used in the mounting process to be performed. Alternatively, the calibration tools 60 may be dedicated to the calibration process. Dedicated calibration tools 60 are, for example, formed with higher shape accuracy compared to general-purpose suction nozzles 46, and employ a shape and color suitable for image processing in the calibration process, making them suitable for the calibration process from the viewpoint of improving accuracy. 【0042】 In this embodiment, if the mounting head 40 allows for automatic tool exchange with the nozzle station 53, the calibration tool 60 is housed in the nozzle station 53 before the calibration process is executed. In conventional calibration devices, in order to support the calibration tool 60 in all holders 42 from the nozzle station 53 when the calibration process is executed, it was necessary for at least the number of holders Vs of calibration tools 60 to be housed in the nozzle station 53 in advance. 【0043】 However, there is a demand to increase the number and types of suction nozzles 46 housed in the nozzle station 53 in order to accommodate the production of various types of product substrates. Therefore, if only the number of holders Vs of calibration tools 60 are housed in the nozzle station 53, there will be calibration tools 60 that are not used in subsequent production, which may not be desirable from the standpoint of improving productivity. In addition, if the number of calibration tools 60 housed in the nozzle station 53 is mistakenly set to less than the number of holders Vs during the external setup, and the calibration process cannot be performed due to a shortage of calibration tools 60, resulting in an error stop, there is a concern that productivity will decrease. 【0044】 Therefore, the calibration device 80 of this embodiment employs a configuration that allows calibration processing to be performed even if the number of calibration tools 60 is less than the number of holders Vs in the work head (mounting head 40). Here, the calibration processing includes a measurement step of measuring the actual positions of the multiple holders 42, and a calculation step of calculating the calibration amount of the multiple holders 42 based on the actual positions of each of the multiple holders 42. The calibration device 80 of this embodiment appropriately sets the number of times the measurement step is performed based on the number of holders Vs and the number of calibration tools 60 that can be accommodated in the nozzle station 53 Vc. 【0045】 This makes it possible to perform the calibration process even when there is a shortage of calibration tools 60 at the nozzle station 53. Furthermore, when the tools necessary for substrate-side operations such as mounting are stored in the nozzle station 53, the calibration process can be performed by storing the calibration tools 60 even if the remaining number of storage spaces is less than the number of holders Vs. Specifically, as shown in Figure 5, the calibration device 80 comprises a setting unit 81 and a processing control unit 82. Below, each step in the calibration process shown in Figure 6 will be described in detail, corresponding to each component of the calibration device 80. 【0046】 The calibration process is performed based on the calibration process schedule M1 as described above. During the calibration process, the calibration device 80 obtains the number of calibration tools 60 Vc in the nozzle station 53 (S11). Specifically, the calibration device 80 reads the codes 463 and 64 attached to multiple tools (suction nozzles 46, calibration tools 60) housed in multiple nozzle stations 53. The code 64 of the calibration tool 60 indicates the identification information of the calibration tool 60. The tool identification information is associated with the type of tool, maintenance records, etc. Based on the results of the reading process, the calibration device 80 obtains the types of multiple tools, including the calibration tool 60. 【0047】 For the above reading process, a dedicated code reader may be provided above the nozzle station 53, for example. In this embodiment, the calibration device 80 performs the code 64 reading process using a substrate camera 52 that is movably mounted integrally with the mounting head 40. The calibration device 80 obtains the tool storage position based on the position of the substrate camera 52 when the substrate camera 52 images the codes 342 and 64. 【0048】 Specifically, during the reading process, the substrate camera 52 is moved above the location where the tool codes 342 and 64 are attached to the nozzle station 53, and imaging is performed. By repeatedly moving the substrate camera 52 and imaging in this manner, the presence or absence of a tool and, if a tool is present, the type of tool are obtained for each of the multiple storage compartments of the nozzle station 53. Furthermore, the location in which the tool is stored is determined from the position of the substrate camera 52 at the time of imaging. This allows for the determination of whether or not the calibration tool 60 is stored, and, if so, its storage location. 【0049】 Furthermore, the calibration device 80 can employ various other configurations as long as it can acquire the storage location and number Vc of the calibration tools 60 within the machine. For example, the device may externally input set information, in which the tools including the calibration tools 60 are automatically or manually set in a tool station outside the machine, and installation information, in which the tool station is automatically or manually installed inside the machine, to determine the storage location and number Vc of the calibration tools 60 within the machine. 【0050】 4-2. Setting section 81 The setting unit 81 sets the number of times the measurement process (S20) in the calibration process is executed (S12). In this embodiment, the setting unit 81 sets the measurement process (S20) in the calibration process to be executed multiple times when the number of calibration tools 60 Vc in the nozzle station 53 is less than the number of holders Vs in the mounting head 40. Specifically, the setting unit 81 sets the number of times the measurement process is executed Nm to the quotient obtained by dividing the number of holders Vs by the number of tools Vc, adding 1 if there is a remainder, and 0 if there is no remainder. 【0051】 Specifically, as shown in the upper part of Figure 7, the component mounting machine 2 is equipped with a single robot consisting of one mounting head 40, and let's assume that the number of calibration tools 60 that can be accommodated in the nozzle station 53, Vc, is 8. In this case, if the number of holders Vs is 8, 12, and 24, the above quotients are 1, 1, and 3, and the remainders are 0, 1, and 0, so the setting unit 81 sets the number of executions Nm to 1, 2, and 3. 【0052】 Furthermore, as shown in the middle of Figure 7, the component mounting machine 2 is equipped with a opposing robot consisting of two mounting heads 40. Let's assume that the number of calibration tools 60 that can be accommodated at the nozzle station 53A on the first side S1 is 8 (Vc1), and the number of calibration tools 60 that can be accommodated at the nozzle station 53B on the second side S2 is 16 (Vc2). In this case, if the number of holders Vs1 for the mounting head 40A on the first side S1 is 12 and the number of holders Vs2 for the mounting head 40B on the second side S2 is 24, the setting unit 81 sets the number of executions Nm to 2,2. 【0053】 Here, the component mounting machine 2 may be equipped with multiple mounting heads 40A, 40B and multiple nozzle stations 53A, 53B, and the movement of the calibration tool 60 between the multiple nozzle stations 53A, 53B may be permitted. In this case, the number of calibration tools 60 that can be accommodated Vc can be treated as the sum of the number of calibration tools 60 accommodated Vc1, Vc2 in each of the multiple nozzle stations 53A, 53B (Vc = Vc1 + Vc2). 【0054】 Then, when the setting unit 81 targets a component mounting machine 2 equipped with a counter robot, it sets the number of times Nm the measurement process is executed in the calibration process based on the number of nozzle stations 53A and 53B that can accommodate Vc1 and Vc2 immediately before the calibration process is executed. Therefore, as described above, if the movement of the calibration tool 60 between multiple nozzle stations 53A and 53B is permitted, the calibration tool 60 can be moved before the setting process by the setting unit 81, and the number of nozzle stations 53A and 53B can be adjusted to manage the time required for the calibration process. Details of adjusting the number of nozzle stations 53A and 53B, including the movement of the calibration tool 60, will be described later. 【0055】 4-3. Processing Control Unit 82 The processing control unit 82 executes a calculation process (S14) after the calibration device 80 has performed the measurement process (S20). Specifically, the holders 42 to be measured are repeatedly subjected to different measurement processes (S20) for a number of executions Nm set by the setting unit 81. When the actual number of executions of the measurement process reaches the planned number of executions Nm (S13: Yes), the actual positions of all holders 42 have been measured. 【0056】 Then, the processing control unit 82 calculates the calibration amount for each of the holders 42 based on their actual positions (S14). Specifically, the processing control unit 82 calculates the calibration amount for each holder 42 identification information (ID) in order to cancel out the error between the control position and the actual position of each holder 42. The calculated calibration amount is associated with the identification information (ID) of the holder 42 and stored in the storage unit 56 of the control device 55 as calibration information D1, as shown in Figure 8. 【0057】 5. Calibration process using the calibration device 80 The details of the calibration process for the mounting head 40 will now be explained. First, as shown in Figure 9, the types and production order of product substrates to be produced on the first side S1 and the second side S2 of a predetermined production line Ln are planned. Then, in the setup work corresponding to the production of each product substrate (T11, T12, ..., T21, T22, ... in Figure 9), it is set whether or not calibration processing is required, for example, when the mounting head 40 is replaced. This generates a calibration processing schedule M1 that indicates when the calibration processing for the mounting head 40 (C11, C12, ..., C21, C22, ...) is to be performed. In Figure 9, setup work that requires calibration processing is indicated by a circle in the shaded area. 【0058】 Furthermore, each of the nozzle stations 53A and 53B accommodates a predetermined number of calibration tools 60 in addition to the suction nozzles 46 required for the planned mounting process. The number of calibration tools 60 to be accommodated Vc can be arbitrarily set by the operator performing the setup work, or the operator may be guided by the calibration device 80 to a recommended number Vc based on the calibration process to be performed. 【0059】 As shown in Figure 6, the calibration process first obtains the number of calibration tools 60 to be accommodated Vc at all nozzle stations 53 (S11). Here, as described above, the number of calibration tools 60 to be accommodated Vc is the sum of the number of calibration tools 60 to be accommodated Vc1 and Vc2 at each of the multiple nozzle stations 53A and 53B (Vc = Vc1 + Vc2). Next, the setting unit 81 sets the number of times the measurement process (S20) in the calibration process is executed (S12). Here, as shown in the middle of Figure 7, the number of executions Nm (2 times each on the first side S1 and the second side S2) is set based on the number of accommodated Vc1 and Vc2 and the number of holders Vs for each. 【0060】 At the start of individual production on the first side S1 and the second side S2, measurement processes (S20) targeting the respective mounting heads 40A and 40B are executed in parallel. Since the two measurement processes (S20) are substantially identical, only one measurement process (S20) will be described here. In the measurement process, first, a calibration tool 60 is attached to the holder 42 to be measured (S21). Next, the calibration device 80 moves the mounting head 40 above the part camera 51 and acquires image data D5 (see Figure 4) by imaging from below (S14). Figure 4 shows a state in which the calibration tool 60 is attached to only some of the multiple holders 42. 【0061】 The calibration device 80 processes the image data D5 (S22) to obtain the actual position of each holder 42 to be measured (S23). During the image processing described above, the processing control unit 82 also performs a process to detect defective holders 42x, which are defective holders 42. A "defective holder 42x" is a holder 42 that is unsuitable for substrate work (mounting process). The processing control unit 82 detects, for example, a holder 42 among a group of holders 42 that failed to mount the calibration tool 60, or a holder 42 whose measured actual position is outside the acceptable range, as a defective holder 42x. 【0062】 As shown in Figure 8, the calibration device 80 stores the actual position and whether each holder 42 is a normal holder 42 or a defective holder 42x, associating them with the holder's identification information (ID). Subsequently, if a defective holder 42x is detected in the current measurement step (S20) (S30: Yes), the processing control unit 82 sets a skip setting to skip the processing for the defective holder 42x in the subsequent calculation step (S14) (S31). 【0063】 In detail, as shown in Figure 8, the processing control unit 82 stores skip information D2, which associates the skip setting with the identification information (ID) of the defective holder 42x, together with calibration information D1 indicating the calibration amount of the other holders 42, so that it can be used in the mounting process by the component mounting machine 2. Furthermore, in this embodiment, if the processing control unit 82 detects a defective holder 42x (S30: Yes), it guides the operator to perform maintenance on the mounting head 40, or notifies the operator that normal holders 42 excluding the defective holder 42x will be used in the substrate work by the mounting head 40 (S32). 【0064】 This configuration prevents the use of defective holders 42x unsuitable for the mounting process, and encourages operators to perform maintenance at appropriate times when maintenance notices are provided. Furthermore, it allows production using only normal holders 42x, while enabling early improvement of the mounting head 40 through maintenance, thereby improving productivity. 【0065】 If no defective holder 42x is detected in the measurement process (S20) (S30: No), or if the corrective processing for detection (S31, S32) is completed, the calibration device 80 determines whether the actual number of executions of the measurement process (S20) has reached the planned number of executions Nm (S13). If the planned number of executions Nm has not been reached (S13: No), the measurement process (S20) is repeated. In the repeated measurement process (S20), the holder 42 to be measured is changed, and the calibration tool 60 is attached to the holder 42 to be measured by exchanging the calibration tool 60 via the nozzle station 53 (S21). 【0066】 If the measurement process (S20) is performed multiple times and the planned number of executions Nm is reached (S13: Yes), the processing control unit 82 performs the calculation process (S14). As shown in Figure 8, the processing control unit 82 stores the calibration amount calculated based on the actual position of each of the multiple holders 42 as calibration information D1, associated with the identification information (ID) of each of the multiple holders 42. When the component mounting machine 2 is equipped with an opposing robot, as in this embodiment, the calibration device 80 performs calibration processing for each mounting head 40A, 40B and generates or edits the respective calibration information D1. 【0067】 With the configuration described above, when the number of calibration tools Vc to be accommodated in the mounting head 40 is less than the number of holders Vs, the number of times the measurement process (S20) is executed Nm is set appropriately. This makes it possible to measure the actual positions of multiple holders 42 required in the calculation process (S14). This makes it possible to perform the calibration process even when there is a shortage of calibration tools 60 in the nozzle station 53. Furthermore, when the tools necessary for the mounting process (holding members such as suction nozzles 46) are accommodated in the nozzle station 53, the calibration process can be performed by accommodating the calibration tools 60 even if the remaining number of accommodable tools is less than the number of holders Vs. 【0068】 6. Adjusting the placement of the calibration tools The calibration device 80 performs the calibration process as described above, for example, as part of the setup process as needed. Furthermore, as in this embodiment, when the movement of the calibration tool 60 between multiple nozzle stations 53A and 53B is permitted, the efficiency of the calibration process can be improved by adjusting the capacity Vc1 and Vc2 of the multiple nozzle stations 53A and 53B at predetermined timings. 【0069】 In detail, the calibration device 80 adjusts the number of calibration tools Vc1, Vc2 in each of the multiple nozzle stations 53A, 53B based on a calibration process schedule M1 that indicates when the calibration process will be performed for each of the multiple mounting heads 40A, 40B. Here, as shown in Figure 9, when multiple types of production are started in a series, the timing of the calibration process may differ between the first side S1 and the second side S2 (for example, calibration process C12 on the first side S1 and calibration process C22 on the second side S2). 【0070】 Therefore, before the calibration process is performed, the calibration device 80 moves the calibration tools 60 to the nozzle station 53 on the side where the calibration process is performed, so that only the necessary number of tools are accommodated. By adjusting the number of tools Vc1 and Vc2, the setting unit 81 can appropriately set the number of measurement steps to be performed based on the previous number of tools Vc1 and Vc2 before the calibration process is performed, thereby reducing the number of measurement steps to be performed. 【0071】 Furthermore, if calibration processes for each of the multiple mounting heads 40 are scheduled to be performed at the same time (for example, calibration process C13 for the first side S1 and calibration process C23 for the second side S2), the calibration device 80 may adjust the number of calibration tools Vc1 and Vc2 in each of the multiple nozzle stations 53A and 53B based on the total time required for the multiple calibration processes to be performed at the same time. The phrase "calibration processes are scheduled to be performed at the same time" above means a situation in which it is estimated that at least a portion of the execution period of each calibration process will overlap. 【0072】 In such cases, if the calibration tools 60 are concentrated on one side, the overall required time may actually increase. Therefore, the calibration device 80 determines the ratio in which the multiple calibration tools 60 should be distributed between the first side S1 and the second side S2 to shorten the overall time required for calibration processes performed simultaneously, and adjusts the number of tools Vc1 and Vc2 based on the result. This allows the setting unit 81 to appropriately set the number of measurement steps in each calibration process based on the respective number of tools Vc1 and Vc2 before executing the calibration process, thereby shortening the overall required time (see the middle and lower sections of Figure 7). 【0073】 The calibration device 80 determines the optimal storage capacity Vc1 and Vc2 for each period (the period demarcated by the dashed lines in Figure 9) that is divided by setup work (T11, T12, ..., T21, T22, ...) in the calibration processing schedule M1. This optimal storage capacity Vc1 and Vc2 is the number that reduces the required time for the calibration process by reducing the number of measurement process executions Nm. Based on the storage capacity Vc1 and Vc2 for each period that has been determined, the calibration device 80 generates a storage schedule M2 that corresponds to the timing of the calibration process execution. 【0074】 The calibration device 80, for example, if the optimal storage capacity Vc1 and Vc2 are equal or approximate in two consecutive periods from among the above periods, considers them as one period. The storage schedule M2 thus generated shows the storage capacity Vc1 and Vc2 for multiple periods (F1, F2, F3, ...) (Vc1: K11, K12, K13..., Vc2: K21, K22, K23, ...), as shown in Figure 9. 【0075】 Therefore, the calibration device 80 moves the calibration tool 60 between multiple nozzle stations 53 during periods other than each period (F1, F2, F3, ...) (for example, from the end of period F1 to the start of period F2). This movement of the calibration tool 60 causes the capacity Vc1 and Vc2 to change, and the number of times the measurement process is executed in the calibration process is appropriately set by the setting unit 81. This makes it possible to accommodate calibration processes that are executed at various timings and to shorten the overall time required for the calibration process. 【0076】 7. Mounting process by component mounting machine 2 In the component mounting process of attaching components 92 to the substrate 91, the control device 55 of the component mounting machine 2 uses calibration information D1 generated by the calibration device 80 to position the suction nozzle 46 attached to the holder 42. As a result, the suction nozzle 46 is positioned in accordance with the calibration amount of the holder 42, thereby improving the accuracy of the mounting process. 【0077】 Here, the mounting process includes a process of repeating a PP cycle (pick and place cycle), which includes a sampling cycle and a mounting cycle, multiple times. The "sampling cycle" refers to a process of repeating the sampling operation, in which the parts 92 supplied by the parts supply device 20 are picked up by the suction nozzle 46, multiple times. The "mounting cycle" refers to a process of repeating the mounting operation, in which the picked parts 92 are mounted on the substrate 91 at a predetermined mounting position and at a predetermined mounting angle, multiple times. 【0078】 The control device 55 repeatedly executes a PP cycle consisting of multiple grouped sampling and mounting operations based on the mounting order of the parts 92 and the number of suction nozzles 46 attached to the mounting head 40 (i.e., corresponding to the number of holders Vs). Before executing the mounting process, the control device 55 refers to the skip information D2 stored together with the calibration information D1. The control device 55 then cancels the processing for holders 42 (defective holders 42x) that are set to "skip" in the skip information D2. 【0079】 Specifically, when the mounting process is executed, the control device 55 does not attempt to attach the suction nozzle 46 to the defective holder 42x, and blocks the air passage communicating with the defective holder 42x inside the mounting head 40. Then, when generating the PP cycle, the control device 55 prevents the sampling and mounting operations using the defective holder 42x from being performed. In other words, the control device 55 generates the PP cycle by assuming that the number of holders 42 obtained by subtracting the number of defective holders 42x from the number of holders Vs in the mounting head 40 has effective suction nozzles 46 attached to it. 【0080】 As a result, although productivity is reduced compared to using a fully functional mounting head 40, the mounting process can be performed using a holder 42 that has undergone proper calibration. Therefore, production of the product substrate can be continued, preventing error-induced shutdowns caused by defective holders 42x. 【0081】 Furthermore, while the mounting process described above is being executed, the control device 55 performs interference prevention control on the opposing mounting heads 40A and 40B, and executes the movement process of the calibration tools 60 at a timing that has little or no impact on the cycle time of the mounting process. Specifically, the control device 55 refers to the accommodation schedule M2 and obtains the recommended period for moving the calibration tools 60, as well as the direction (e.g., from the first side S1 to the second side S2) and number of calibration tools 60 to be moved. Then, for example, if there is a period in which both the first side S1 and the second side S2 are transporting the substrate 91, the control device 55 moves some or all of the calibration tools 60 that should be moved. 【0082】 As a result, for example, the calibration tool 60 is moved appropriately until the next calibration process is executed, and the capacity Vc1 and Vc2 at the multiple nozzle stations 53A and 53B are adjusted. Then, during the calibration process, the setting unit 81 appropriately sets the number of times the measurement process is executed, thereby improving the efficiency of the calibration process. 【0083】 8. Calibration method for the work head The same applies to the calibration method as described above for the calibration device 80. Specifically, the calibration method comprises a setting step and a processing control step. The setting step sets the calibration process so that the measurement step is executed multiple times when the number of calibration tools 60 in the tool station (nozzle station 53) Vc is less than the number of holders Vs in the work head (mounting head 40). The processing control step executes a calculation step after the holders 42 to be measured have performed multiple different measurement steps. 【0084】 9. Modified embodiments of the embodiment In this embodiment, the substrate work machine is a component mounting machine 2 that mounts components 92 onto a substrate 91. In contrast, the calibration device 80 and calibration method can be applied to various substrate work machines that are equipped with a work head. Furthermore, the work head may be a mounting head 40 that performs component mounting as a substrate work, or a work head that performs predetermined substrate work using a tool, such as applying bonding material to the substrate 91 or inspecting the appearance and function of the substrate 91. 【0085】 In this embodiment, the setting unit 81 and the processing control unit 82 are configured to be incorporated into the control device 55. In contrast, at least a portion of the setting unit 81 and the processing control unit 82 may be provided outside the control device 55. For example, part or all of the setting unit 81 and the processing control unit 82 may be incorporated into a host computer 70 that can communicate with the board work machine or a dedicated external device. Accordingly, various information D1, D2 and various schedules M1, M2 are stored in a storage device accessible by the setting unit 81 and the processing control unit 82. [Explanation of symbols] 【0086】 2: Component mounting machine, 10: Board transport device, 20: Component supply device, 30: Component transfer device, 31: Head drive device, 32: Mobile platform, 40: Mounting head (working head), 41: Rotary head, 42: Holder, 42x: Defective holder, 46: Suction nozzle (tool, holding member), 48: Reference mark, 51: Component camera, 52: Board camera, 53: Nozzle station (tool station), 55: Control device, 56: Memory unit, 60: Calibration tool, 64: Code, 70: Host computer, 71: Memory unit, 80: Calibration device, 81: Setting unit, 82: Processing control unit, 91: Board, 92: Component, D1: Calibration information, D2: Skip information, D5: Image data, M1: Calibration processing schedule, M2: Storage schedule, Vs: Number of holders, Vc, Vc1, Vc2: Capacity, Nm: Number of (measurement process) runs, Sy: Production system, Ln, Ln1, L2: Production line, S1: First side, S2: Second side

Claims

[Claim 1] A calibration device is applied to a circuit board work machine that is configured to automatically exchange tools with a tool station located inside the machine and has a work head that performs predetermined circuit board work on a circuit board using the said tool, and performs calibration processing of the said work head, The calibration process includes a measurement step of attaching calibration tools applicable to the calibration process to a plurality of holders provided on the work head of the substrate work machine and measuring the actual position of each of the plurality of holders within the machine. The tool station is equipped with a setting unit that, when the number of calibration tools it can hold is less than the number of holders in the work head, sets the measurement step in the calibration process to be executed multiple times. The aforementioned substrate work machine comprises a plurality of work heads and a plurality of tool stations, A calibration device in which the number of calibration tools to be accommodated is the sum of the number of calibration tools to be accommodated in each of the multiple tool stations. [Claim 2] The calibration apparatus according to claim 1, which adjusts the number of calibration tools to be stored in each of the multiple tool stations based on a calibration processing schedule that indicates when the calibration processing will be performed for each of the multiple work heads. [Claim 3] The calibration apparatus according to claim 1, wherein, when the calibration process for each of the multiple work heads is scheduled to be performed at the same time, the number of calibration tools to be accommodated in each of the multiple tool stations is adjusted based on the total time required for the multiple calibration processes to be performed at the same time. [Claim 4] A calibration device is applied to a circuit board work machine that is configured to automatically exchange tools with a tool station located inside the machine and has a work head that performs predetermined circuit board work on a circuit board using the said tool, and performs calibration processing of the said work head, The calibration process includes a measurement step of attaching calibration tools applicable to the calibration process to a plurality of holders provided on the work head of the substrate work machine and measuring the actual position of each of the plurality of holders within the machine, and a calculation step of calculating the calibration amount of the plurality of holders based on the actual position of each of the plurality of holders. A setting unit that, when the number of calibration tools in the tool station is less than the number of holders in the work head, sets the measurement step in the calibration process to be executed multiple times, The system includes a processing control unit that performs the calculation step after multiple measurement steps have been performed, Among the multiple holders, any holder in which the calibration tool was not attached, or any holder whose measured actual position is outside the acceptable range, shall be designated as a defective holder unsuitable for the substrate work. Calibration device, wherein the processing control unit, when it detects a defective holder in the measurement step, sets a skip to skip the processing for the defective holder in the calculation step. [Claim 5] The calibration apparatus according to claim 4, wherein the processing control unit stores skip information, which associates the skip setting with the identification information of the defective holder, together with calibration information indicating the calibration amount of the other holders, in a manner that can be used in the substrate work by the substrate work machine. [Claim 6] The calibration apparatus according to claim 4, wherein the processing control unit, upon detecting a defective holder, guides the operator to perform maintenance on the work head, or notifies the operator that a normal holder, excluding the defective holder, will be used in the substrate work performed by the work head. [Claim 7] The calibration apparatus according to claim 1 or 4, wherein the setting unit sets the number of times the measurement process is performed by adding 1 to the quotient obtained by dividing the number of holders by the number of storage units, if there is a remainder, and adding 0 if there is no remainder. [Claim 8] The calibration apparatus according to claim 1 or 4, wherein the calibration tool is dedicated to the calibration process. [Claim 9] The work head is a mounting head that has a holding member for holding the component as a tool attached to the holder, and mounts the component to the substrate. The calibration apparatus according to claim 1 or 4, wherein the measurement step involves imaging the plurality of calibration tools with a component camera that images the components held by the plurality of holding members, and using the image data acquired to measure the actual position of each of the plurality of calibration tools. [Claim 10] A calibration method for performing calibration processing on a work head, which is configured to automatically exchange tools with a tool station located inside the machine and is equipped with a work head that performs predetermined work on a circuit board using the tools, is applied to a circuit board work machine, and the method is applied to the work head. The calibration process includes a measurement step of attaching calibration tools applicable to the calibration process to a plurality of holders provided on the work head of the substrate work machine and measuring the actual position of each of the plurality of holders within the machine. The tool station includes a setting step to configure the measurement step in the calibration process to be executed multiple times if the number of calibration tools that can be stored in the tool station is less than the number of holders in the work head. The aforementioned substrate work machine comprises a plurality of work heads and a plurality of tool stations, A calibration method in which the number of calibration tools to be accommodated is the sum of the number of calibration tools to be accommodated in each of the multiple tool stations. [Claim 11] A calibration method for performing calibration processing on a work head, which is configured to automatically exchange tools with a tool station located inside the machine and is equipped with a work head that performs predetermined work on a circuit board using the tools, is applied to a circuit board work machine, and the method is applied to the work head. The calibration process includes a measurement step of attaching calibration tools applicable to the calibration process to a plurality of holders provided on the work head of the substrate work machine and measuring the actual position of each of the plurality of holders within the machine, and a calculation step of calculating the calibration amount of the plurality of holders based on the actual position of each of the plurality of holders. A setting step to configure the measurement step in the calibration process to be executed multiple times when the number of calibration tools in the tool station is less than the number of holders in the work head, The system includes a processing control step that executes the calculation step after multiple measurement steps have been performed, Among the multiple holders, any holder in which the calibration tool was not attached, or any holder whose measured actual position is outside the acceptable range, shall be designated as a defective holder unsuitable for the substrate work. The processing control step is a calibration method that, when a defective holder is detected in the measurement step, sets a skip setting to skip the processing for the defective holder in the calculation step.

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