Multifunctional pressure pad for induction welding

Abstract

To provide a compression load distributor for maintaining a weld line temperature during induction welding.SOLUTION: A compression load distributor (400) includes a support layer (404) and a heat spreading layer (401). The support layer (404) includes a flexible carrier (405) configured to distribute a load from a compression load applying device. The heat spreading layer (401) is coupled to and carried on the support layer, and comprises a heat sink (402) configured to transfer heat throughout the compression load distributor (400). The heat sink (402) is thermally conductive and electrically non-conductive.SELECTED DRAWING: Figure 4B

Description

Technical Field

[0001] The present disclosure relates to a compression load disperser for induction welding, also referred to as a multi-functional pressure pad. The present disclosure also relates to a method for maintaining the weld line temperature in induction welding using the compression load disperser.

Background Art

[0002] Induction welding is an operation that uses electromagnetic induction to heat a component without contacting the component. For example, two components can be welded at a joint by induction welding, but neither component contacts the induction welding coil itself. The configuration of induction welding is typically limited to a configuration that maximizes the heat profile at the weld interface while maintaining a temperature lower than the deconsolidation temperature in the remaining part of the component. Conventionally, heat is applied to the weld interface and removed from the coil side of the welded part. Heat is typically transferred from the surface of the weld object closest to the coil to the heat sink on the coil side of the weld object in order to appropriately disperse the heat. During welding, by applying a compressive force on the opposite side of the coil, the elements of the weld object are pressed together at the weld interface. Therefore, the conventional welding system does not have a mechanism for removing heat on the weld side opposite to the coil side. As a result, the thickness of components that can be induction welded is limited, and induction welding of thin components is not possible.

Summary of the Invention

[0003] Embodiments of the present disclosure will be described in detail below with reference to the following accompanying drawings. Also, to explain the embodiments or embodiments disclosed in this specification, an outline is presented below. However, this outline is not intended to limit all embodiments to a specific configuration or order of steps.

[0004] In one embodiment, a compressible load distributor is provided. The compressible load distributor includes a support layer and a thermal diffusion layer. The support layer includes a flexible carrier configured to distribute a load from a compressible load application device. The thermal diffusion layer is bonded to and supported on the support layer. The thermal diffusion layer also includes a heat sink configured to transfer heat throughout the compressible load distributor, the heat sink being both thermally conductive and non-conductive.

[0005] In another embodiment, a compressible load distributor is provided. The compressible load distributor comprises a flexible carrier and a plurality of plate-like bodies. The flexible carrier is configured to distribute a load from a compressible load application device. The plurality of plate-like bodies are embedded in the flexible carrier and are configured to transfer heat throughout the flexible carrier. The plurality of plate-like bodies are thermally conductive and non-conductive.

[0006] In another embodiment, a compressible load distributor is provided. The compressible load distributor comprises a support layer, a thermal diffusion layer, and a silicone rubber layer. The support layer includes a flexible carrier configured to distribute a load from a compressible load application device. The thermal diffusion layer includes a heat sink bonded to the support layer and configured to transfer heat throughout the compressible load distributor. The heat sink is thermally conductive and non-conductive. The support layer is provided between the thermal diffusion layer and the silicone rubber layer.

[0007] In another embodiment, a method is provided for maintaining a weld line temperature during induction welding. The method includes applying a welding temperature to a weld line; distributing a compressive load across the entire weld line by a compressive load distributor during induction welding; applying the welding temperature while pressing the weld lines together; and removing welding heat to maintain the surface temperature of the surfaces being induction welded lower than the welding temperature in the weld line.

[0008] In another embodiment, an apparatus for induction welding is provided. The apparatus includes a weldable material including an induction welding area, an induction welding device on the welding side of the induction welding area, and a heat sink material having a welding surface adjacent to the contact side of the induction welding area opposite to the welding side. The weldable material is positioned between the induction welding device and the heat sink material.

[0009] In another embodiment, a method for manufacturing a compressive load distributor is provided. The method comprises: fabricating a mold; placing a thermal diffusion layer, which includes a heat sink configured to disperse heat and is both thermally conductive and non-conductive, in the mold; applying an adhesion promoter to the thermal diffusion layer; placing a support layer, which includes a flexible carrier configured to distribute a load, on the adhesion promoter; and curing the thermal diffusion layer, the adhesion promoter, and the support layer.

[0010] In another embodiment, a method is provided for distributing a compressive load during induction welding. The method includes receiving pressure from a compressive force application device, applying a load to a component being induction welded in a welding line, and using a compressive load distributor to distribute the load applied to the component being induction welded.

[0011] Other technical features will be readily apparent to those skilled in the art from the following drawings, description, and claims. [Brief explanation of the drawing]

[0012] To fully understand this disclosure and its effects, please refer to the following description in conjunction with the attached drawings. In these drawings, similar components are denoted by the same reference numerals.

[0013] [Figure 1] This figure shows an induction welding structure according to various embodiments of the present disclosure. [Figure 2A-2C] This figure shows a pressure pad according to various embodiments of the present disclosure. [Figure 3A-3D] This figure shows a pressure pad according to various other embodiments of the present disclosure. [Figure 4A-4D] This figure shows a pressure pad according to various other embodiments of the present disclosure. [Figure 5] This figure shows pressure pads and compression load application devices according to various embodiments of the present disclosure. [Figure 6] This figure shows a method for manufacturing a pressure pad according to various embodiments of the present disclosure. [Figure 7] This figure shows a method for maintaining a welding temperature during induction welding according to various embodiments of the present disclosure. [Figure 8] This figure shows a method for distributing a compressive load during induction welding according to various embodiments of the present disclosure. [Figure 9] This figure shows an induction welding system according to various embodiments of the present disclosure. [Figure 10] This is a schematic perspective view showing an aircraft capable of performing induction welding according to various embodiments of the present disclosure. [Figure 11] This is a block diagram showing methods for manufacturing and maintaining aircraft according to various embodiments of the present disclosure.

[0014] Throughout the drawings, similar components are indicated by similar reference numerals. In Figures 1-11, the system is shown in a schematic diagram. These drawings may not be to scale. [Modes for carrying out the invention]

[0015] Various embodiments are described in detail below with reference to the attached drawings. Where possible, the same reference numerals are used throughout the drawings for identical or similar components. References to specific embodiments and designs in this disclosure are for illustrative purposes only and are not intended to limit all embodiments unless otherwise suggested.

[0016] The above overview and the detailed descriptions of some embodiments below will be better understood by referring to the accompanying drawings. In this specification, elements or processes described in the singular and preceded by the word “one” do not necessarily exclude multiple elements or processes. Furthermore, the reference to “one embodiment” does not exclude the existence of other embodiments that similarly include the described features. Moreover, unless otherwise specified, embodiments that “compile” or “have” one or more elements having a particular property may additionally include other elements that do not have that property.

[0017] As described herein, in induction welding, heat is applied to and removed from the coil side of a component. In various embodiments of this disclosure, a thermally conductive pressure pad or compressive load distributer is provided on the non-coil side of the induction welding area to properly distribute heat. In one example, the pressure pad, due to its thermal conductivity, removes heat on the non-coil side and uniformly distributes pressure from a compressive load application device such as an inflatable bladder or pressure bellow. In induction welding operations, the pressure pad can lower the temperature of the induction weld surface by removing heat from the component being induction welded and distributing the heat along the pressure pad, thereby preventing non-integration and / or surface defects in the weld line. In addition, the pressure pad enables welding of components thinner than those currently available.

[0018] Figure 1 shows induction welded structures according to various embodiments of the present disclosure. The example of induction welded structure 100 is for illustrative purposes only. Other embodiments of induction welded structure 100 can be used without departing from the scope of the present disclosure. That is, induction welded structures having various shapes, dimensions, configurations, etc., are envisioned in this disclosure.

[0019] The induction welding structure 100 includes an induction welding coil 101, a heat sink 103, a coil-side tool 105, a non-coil-side tool 107, a pressure pad 109, and a compression load applying device 111. The induction welding structure 100 is configured to perform induction welding on two components 113, 115. The two components 113, 115 may be a laminate, a thermoplastic material, a composite material, or other materials suitable for induction welding.

[0020] The induction welding coil 101 can be any type of coil operable to generate a magnetic flux 119. That is, the induction welding coil 101 has a configuration capable of induction welding two components 113, 115. In one example, in such induction welding, the induction welding coil 101 is used only for one side of the two components 113, 115. As shown in FIG. 1, the two components 113, 115 are shown for the purpose of clarity only, and within the scope not departing from the present disclosure, any two components 113, 115 suitable for induction welding can be used. The induction welding coil 101 is powered to operate at an induction welding frequency for induction welding the two components 113, 115 (for example, applying a voltage at a specific frequency such as a frequency between 10 kHz and 1 MHz for joining adjacent components). In one example, the two components 113, 115 are induction heated from one side of these components at a welding interface 117 between the two components 113, 115.

[0021] The induction welding coil 101 is disposed on or above the heat sink 103 for performing induction welding. That is, the heat sink 103 is disposed in contact with one of the two components 113, 115 to be induction welded and the induction welding coil 101. The heat sink 103 absorbs and disperses heat from the surface of the component 113 with which the heat sink contacts when the two components 113, 115 are induction welded. As a result, it is possible to prevent the surface contacting the heat sink from exceeding the transition temperature due to the heat generated at the welding interface 117 within the two components 113, 115.

[0022] The coil-side tool 105 and the non-coil-side tool 107 are configured to support the induction welding structure 100. Specifically, the coil-side tool 105 provides support to stabilize the induction welding coil 101, the heat sink 103, and the two components 113, 115 during the induction welding process. In some embodiments, the coil-side tool 105 applies a downward compressive force 121 to the heat sink 103 and the two components 113, 115 during the induction welding process to press the two components 113, 115 together during induction welding so that welding is performed well at the welding interface 117. The term "downward" is used only for reference based on the line-of-sight direction in FIG. 1, and the coil-side tool 105 can apply an appropriate stabilizing force in any direction based on the orientation of the induction welding structure 100. In other embodiments, during induction welding, the coil-side tool 105 applies a strong backing pressure, and the two components 113, 115 are pressed together by the compression load applying device 111 while this backing pressure is applied.

[0023] The non-coil-side tool 107 provides support to stabilize the two components 113, 115, the pressure pad 109, and the compressive load application device 111 during the induction welding process. In some embodiments, the non-coil-side tool 107 applies an upward compressive force 123 to the two components 113, 115, the pressure pad 109, and the compressive load application device 111 during the induction welding process, pressing the two components 113, 115 against the heat sink 103 and the coil-side tool 105. The term "upward" is used for reference only, based on the line of sight in Figure 1, and the non-coil-side tool 107 can apply appropriate stabilizing force in any direction based on the orientation of the induction welding structure 100.

[0024] In one example, the compressive load application device 111 is inflatable to apply pressure to two components 113 and 115 during the induction welding process. Specifically, the compressive load application device 111 reacts to the two components 113 and 115 and the coil-side tool 105, moving away from the holding cavity 112 and the non-coil-side tool 107. By applying pressure, a force is provided to stabilize and fix the two components 113 and 115, facilitating the joining of the welding interface 117. Movement of the two components 113 and 115 during the induction welding process is undesirable. Applying a clamping force from the compressive load application device 111 during the induction welding process can enhance the effectiveness of the induction welding process. In some embodiments, the compressive load application device 111 is an inflatable bag or pressure bellows that is inflated with air. However, other devices can also be used. The amount of air pressure used to inflate the compressive load application device 111 can be used to adjust the degree of force applied by the compressive load application device 111. In other words, when the amount of air used to inflate the compressive load application device 111 increases, the degree of clamping force that the compressive load application device 111 applies to the welding interface 117 also increases, while when the amount of air used to inflate the compressive load application device 111 decreases, the degree of clamping force that the compressive load application device 111 applies to the welding interface 117 also decreases.

[0025] The pressure pad 109, also referred to herein as a compressive load distributor, is positioned on the opposite side of the induction welding coil 101 from the two components 113 and 115. The pressure pad 109 is also positioned between the compressive load application device 111 and the two components 113 and 115. During the induction welding process, the pressure pad 109 removes heat from the two components 113 and 115, particularly component 115. That is, the pressure pad 109 functions as a heat sink, removing heat from the surface of component 115 in contact with it. Furthermore, the design of the pressure pad 109 and the materials used in its fabrication allow it to diffuse the compressive load over a wider area and distribute the force from the compressive load application device 111 more uniformly compared to using the compressive load application device 111 alone. By removing heat on the opposite side of the induction welding coil 101, the pressure pad 109 can passively cool the system during the induction welding process. The pressure pad 109 can be implemented as pressure pad 200, pressure pad 300, or pressure pad 400. The configuration of the pressure pad 109 is described in detail below with reference to Figures 2A to 4D.

[0026] Figures 2A to 2C show pressure pads 200, or compressive load distributors, according to various embodiments of the present disclosure. Figure 2A is a top perspective view of the pressure pad 200, Figure 2B is a side view of the pressure pad 200, and Figure 2C is a top view of the pressure pad 200. The examples of pressure pads 200 shown in Figures 2A to 2C are for illustrative purposes only. Other embodiments of the pressure pad 200 may be adopted without departing from the scope of the present disclosure. That is, pressure pads having various shapes, dimensions, configurations, etc., are envisioned in the present disclosure. In some embodiments, the pressure pad 200 is embodied as the pressure pad 109 shown in Figure 1.

[0027] In the illustrated example, the pressure pad 200 includes a carrier 201. The carrier 201 is a flexible carrier configured to distribute the load from the compression load application device 111. The carrier 201 is formed from a flexible plate-like carrier having high thermal conductivity and minimal electrical conductivity. In some embodiments, the flexible plate-like carrier is formed from silicone rubber. In some embodiments, the flexible plate-like carrier is formed from a glass fiber fabric. In some embodiments, the flexible plate-like carrier is formed from a quartz fiber fabric or a basalt fiber fabric. It is also possible to manufacture the carrier 201 using other materials. Furthermore, in this specification, "formed from" includes any process used to form parts or elements. That is, "formed" means "manufactured" from or using one or more materials to form parts or elements, or that parts or elements are "made" from or using one or more elements.

[0028] The pressure pad 200 further includes a plurality of plate-like bodies 203. The plurality of plate-like bodies 203 are embedded and dispersed in a carrier 201. In one example, the plurality of plate-like bodies 203 are embedded in the carrier 201 and uniformly dispersed within the carrier 201. In one embodiment, the plurality of plate-like bodies 203 are cooling filler plates dispersed within the carrier 201 and aligned in the same plane to enhance the heat dissipation capacity of the carrier 201. However, other dispersion and spacing configurations are also possible. In one example, the plurality of plate-like bodies 203 are thermally conductive and non-conductive. In some embodiments, the plurality of plate-like bodies 203 are ceramic and can be formed from, for example, aluminum nitride. In other embodiments, the plurality of plate-like bodies 203 are formed from boron nitride (BN). In some embodiments, the plurality of plate-like bodies are formed from crushed carbon fibers. Also, the individual plate-like bodies in the plurality of plate-like bodies 203 transfer heat from the two components 113, 115 by thermal conductivity. Thus, when the multiple plate-like bodies 203 are embedded and uniformly dispersed within the carrier 201, the heat from the two components 113 and 115 is uniformly dispersed or diffused throughout the carrier 201 during the induction welding process. More specifically, the multiple plate-like bodies 203 disperse the heat from the magnetic flux applied to the two components 113 and 115 by the induction welding coil 101.

[0029] Figure 2B shows a plurality of plate-like bodies 203 embedded in the carrier 201. As shown in Figure 2B, the plurality of plate-like bodies 203 are uniformly, or substantially uniformly, distributed throughout the entire body (height, length, and width) of the carrier 201. Each of the plurality of plate-like bodies 203 is embedded in the carrier 201 substantially parallel to the surface of the carrier 201. As described above, the carrier 201 contains a material with high thermal conductivity, such as aluminum nitride or boron nitride. By oriented substantially parallel to each other within the carrier 201 and uniformly distributed throughout the carrier 201, heat can be better distributed throughout the carrier 201, reducing the possibility of "hot spots" occurring in the carrier 201. In this specification, a "hot spot" is an area in the carrier 201 where heat is not uniformly distributed. By distributing heat throughout the carrier 201 and avoiding hot spots, the effectiveness of welding can be enhanced.

[0030] Figures 3A to 3D show pressure pads 300, or compressive load distributors, according to various embodiments of the present disclosure. Figure 3A is a top perspective view of the pressure pad 300, Figure 3B is a side view of the pressure pad 300 shown in Figure 3A, Figure 3C is a top view of the pressure pad 300 shown in Figure 3A, and Figure 3D is a side view of the pressure pad 300 shown in Figure 3A and an additional silicone rubber layer 307. The examples of pressure pads 300 shown in Figures 3A to 3D are for illustrative purposes only. Other embodiments of the pressure pad 300 may be adopted without departing from the scope of the present disclosure. That is, various shapes, dimensions, configurations, etc., of pressure pads are envisioned in this disclosure. For example, pressure pad 200 has a different configuration from pressure pads 300 and 400, which will be described later. In some embodiments, pressure pad 300 is embodied as pressure pad 109 shown in Figure 1.

[0031] The pressure pad 300 includes a heat diffusion layer 301 and a support layer 304. The heat diffusion layer 301 is bonded to and supported by the support layer 304 and includes a heat sink 302. This heat sink includes a plurality of ceramic tiles 303 that disperse heat throughout the pressure pad 300. More specifically, the heat sink 302 disperses heat from the magnetic flux applied to two components 113, 115 by the induction welding coil 101. The heat sink 302 is formed from a thermally conductive and non-conductive material. That is, the heat sink 302 is heated only by conductive heat transfer from, for example, the surface of the component 115 in contact with the heat sink. The heat sink 302 is unaffected by magnetic flux. Therefore, the heat sink 302 is not directly heated by induction or other means. The heat sink 302 comes into contact with the component that is the target of the induction welding in contact with the pressure pad 300, and absorbs heat from the component by heat conduction through this contact. In some embodiments, the heat sink 302 includes multiple ceramic tiles 303a-303n rather than a single ceramic tile to maintain a certain degree of flexibility. This flexibility allows for easy maintenance of contact with components to be induction welded, such as one of components 113, 115.

[0032] For example, as shown in Figure 3B, the heat sink 302 includes seven ceramic tiles 303a, 303b, ... 303n. Although Figure 3B shows seven ceramic tiles 303, the heat sink 302 can include any number of ceramic tiles 303 to properly distribute heat throughout the pressure pad 300. In some embodiments, the ceramic tiles 303 are formed from aluminum nitride. In other embodiments, the ceramic tiles 303 are formed from boron nitride (BN). The heat diffusion layer 301 is rigid in some examples. Due to its rigidity, small gaps are provided between the multiple ceramic tiles 303n to maintain a certain degree of flexibility. While the heat diffusion layer 301 is rigid as a whole in some examples, it is desirable to have some flexibility to allow it to bend together with the component 115. The dimensions, shape, configuration (e.g., single row or multiple rows), and spacing of the ceramic tiles 303n can be changed as desired or as needed. In some cases, the cross-sectional properties (e.g., thickness) of at least one of the support layer 304 and the heat diffusion layer 301 may change in the longitudinal direction, and consequently, the rigidity of the pressure pad 300 or the heat diffusion properties of the pressure pad 300 may also change.

[0033] The support layer 304 includes a carrier 305 that distributes the load from the compression load application device 111. The carrier 305 may be a flexible plate-shaped carrier. In some embodiments, the flexible plate-shaped carrier is made of silicone rubber. In some embodiments, the flexible plate-shaped carrier is made of glass fiber fabric. In some embodiments, the flexible plate-shaped carrier is made of quartz fiber fabric or basalt fiber fabric. In some embodiments, the plate-shaped carrier is more rigid and is made of polyetheretherketone (PEEK). In other embodiments, the plate-shaped carrier is more rigid and is made of polyetherketoneketone (PEKK). It is also possible to use combinations of materials. For example, in some embodiments, the flexible plate-shaped carrier is made of a combination of PEKK and PEEK. In some embodiments, to form a semi-rigid pad by maintaining the arrangement of the ceramic tiles 303 on the carrier 305, the carrier 305 is coupled to the compression load application device 111, and the bottom of the ceramic tiles 303 is bonded to the carrier 305, for example, by bottom bonding (using any suitable bonding material). By bonding the ceramic tiles 303 of the semi-rigid pad, the pressure pad 300 can be structurally supported, and the load applied from the compression load application device 111 during the induction welding process can be uniformly distributed.

[0034] In some embodiments, the ceramic tile 303 is a block with a flat or substantially flat surface. Due to the size of the surface area of ​​the ceramic tile 303 that contacts the component 115 during the induction welding process, the heat sink 302 conducts heat transfer from the component 115 to the heat sink 302, thereby efficiently dispersing or radiating the heat. In some embodiments, the heat sink 302 is in direct contact with the component 115 during the induction welding process. In this embodiment, the heat sink 302 does not have an insulating gap between the heat sink and the component 115, which can hinder conductive heat transfer and load distribution. In another embodiment, as shown in Figure 3A, the pressure pad 300 further includes a film 306 provided on the heat sink 302 (e.g., bonded or joined) and a carrier 305 that contacts the component 115 during the induction welding process. In one example, the film 306 is a polyimide film, which prevents the carrier 305 from deforming and causing imprinting on the component 115 when a load is applied from the compression load application device 111. The thickness of the film 306 may be less than 5 millimeters, less than 3 millimeters, or less than 2 millimeters. Other thicknesses are also envisioned in this disclosure.

[0035] In some embodiments, to form the pressure pad 300, a heat diffusion layer 301 formed by a plurality of ceramic tiles 303 defining the heat sink 302, a support layer 304 formed by a carrier 305, and (in applicable embodiments) a film 306 are sequentially applied as liquids and then cured until substantially rigid. In some embodiments, the support layer 304 is machined. In some embodiments, the film 306 is applied as a bonding film. The manufacturing process of the pressure pad 300 is described below in detail with reference to Figure 6. After the heat sink 302, carrier 305, and (in applicable embodiments) film 306 are applied and cured, the pressure pad 300 is formed as shown in Figures 3A to 3C. As shown in Figures 3A and 3B, the support layer 304 is provided on three sides of the heat sink 302, namely the front, back, and bottom as viewed in the line of sight in Figures 3A and 3B. In other words, the carrier 305 is substantially U-shaped, with a heat sink 302 of the heat diffusion layer 301 embedded in the central region of the carrier 305, and the carrier 305 supports all surfaces of the heat sink 302 except for the top surface.

[0036] In some embodiments, the pressure pad 300 includes an additional silicone rubber layer 307 provided (e.g., bonded or joined) to the support layer 304. In these embodiments, as shown in Figure 3D, the silicone rubber layer 307 is provided adjacent to or in contact with the support layer 304 so that the silicone rubber layer 307 contacts the compressive load application device 111 during the induction welding process. The silicone rubber layer 307 acts as an additional support layer for the compressive load application device 111, increasing the rigidity of the pressure pad 300, transmitting the compressive load from the compressive load application device 111 over a wider area during the induction welding process, and reducing the risk of the compressive load application device 111 pinching the pressure pad 300. In this way, the silicone rubber layer 307 can reduce the risk of pinching by the compressive load application device 111, thereby providing the silicone rubber layer 307 with a preferred surface for contact with the component being induction welded, and consequently, distributing the compressive load over a wider and more consistent area. In some embodiments, the silicone rubber layer 307 is less rigid than the support layer 304, i.e., more flexible, allowing it to more closely conform to the shape and structure of the compression load application device 111. In one embodiment, the silicone rubber layer 307 is formed from a silicone rubber substrate that is rigid yet flexible when cured, and has high inhibition resistance, good cut growth resistance, and low shrinkage. Specifically, the silicone rubber layer 307 can withstand the temperature conductively transmitted to the pressure pad 300 during induction welding, and has sufficient rigidity to easily distribute the load from the compression load application device 111, while also having sufficient flexibility to form a favorable interface with the compression load application device 111. Furthermore, the rigidity of the pressure pad 300 allows for the formation of a complementary shape to the component being induction welded, and allows for the distribution of contact points of the component being induction welded over a wider area.In some embodiments, the silicone rubber layer 307 may be Dow's Silastic® RTV-4136-M base beige 20.4KG pail or RTV-2 silicone rubber. However, the disclosure assumes any suitable silicone rubber layer having sufficient stiffness, flexibility, and resistance properties as described herein.

[0037] Figures 4A to 4D show pressure pads 400, or compressive load distributors, according to various embodiments of the present disclosure. Figure 4A is a top perspective view of the pressure pad 400, Figure 4B is a side view of the pressure pad 400 shown in Figure 4A, Figure 4C is a top view of the pressure pad 400 shown in Figure 4A, and Figure 4D is a side view of the pressure pad 400 shown in Figure 4A, demonstrating the flexibility of the pressure pad 400. The examples of pressure pads 400 shown in Figures 4A to 4D are for illustrative purposes only. Other embodiments of the pressure pad 400 may be adopted without departing from the scope of the present disclosure. That is, pressure pads having various shapes, dimensions, configurations, etc., are envisioned in the present disclosure. In some embodiments, the pressure pad 400 is the pressure pad 109 shown in Figure 1.

[0038] The pressure pad 400, or compressive load distributor, includes a heat diffusion layer 401, a support layer 404, and a silicone rubber layer 407. The heat diffusion layer 401 includes a heat sink 402, which includes a plurality of ceramic tiles 403 that distribute heat throughout the pressure pad 400. More specifically, the heat sink 402 disperses heat from the magnetic flux applied to two components 113, 115 by the induction welding coil 101. The heat sink 402 is made of a thermally conductive and non-conductive material. That is, the heat sink 402 is heated only by conductive heat transfer from, for example, the surface of the component 115 with which the heat sink is in contact. The heat sink 402 is unaffected by magnetic flux. Therefore, the heat sink 402 is not directly heated by induction or other means. The heat sink 402 is in contact with the component that is the target of induction welding and is in contact with the pressure pad 400, and absorbs heat from the component by heat conduction through this contact. In some embodiments, the heat sink 402 includes multiple ceramic tiles 403a-403n rather than a single ceramic tile to maintain a certain degree of flexibility. This flexibility allows for easy maintenance of contact with components to be induction welded, such as one of components 113, 115.

[0039] For example, as shown in Figure 4B, the heat sink 402 includes four ceramic tiles 403a, 403b, ... 403n. Although Figure 4B shows that it includes four ceramic tiles 403, the heat sink 402 can include any number of ceramic tiles 403 to properly distribute heat throughout the pressure pad 400. In some embodiments, the ceramic tiles 403 are formed from aluminum nitride. In other embodiments, the ceramic tiles 403 are formed from boron nitride (BN). The heat diffusion layer 401 is rigid in some examples. Due to its rigidity, small gaps are provided between the ceramic tiles 403 to maintain a certain degree of flexibility. The heat diffusion layer 301 is rigid as a whole in some examples, but it is desirable to have some flexibility in order to bend together with the component 115. The dimensions, shape, configuration (e.g., single row or multiple rows), spacing, etc. of the ceramic tiles 403 can be changed as desired or as needed. In some cases, the cross-sectional properties (e.g., thickness) of at least one of the support layer 404 and the heat diffusion layer 401 may change in the longitudinal direction, and consequently, the rigidity of the pressure pad 400 or the heat diffusion properties of the pressure pad 400 may also change.

[0040] The support layer 404 includes a carrier 405 that distributes the load from the compression load application device 111. The carrier 405 may be a flexible plate-shaped carrier. In some embodiments, the flexible plate-shaped carrier is made of silicone rubber. In some embodiments, the flexible plate-shaped carrier is made of glass fiber fabric. In some embodiments, the flexible plate-shaped carrier is made of quartz fiber fabric or basalt fiber fabric. In some embodiments, the plate-shaped carrier is more rigid and is made of PEEK, PEKK, or a combination thereof. In some embodiments, the carrier 405 is coupled to the compression load application device 111 and the bottom of the ceramic tile 403 is joined to the carrier 405 in order to maintain the arrangement of the ceramic tile 403 on the carrier 405 and form a semi-rigid pad. By joining the ceramic tile 403 of the semi-rigid pad, the pressure pad 400 can be structurally supported and the load applied from the compression load application device 111 can be uniformly distributed during the induction welding process.

[0041] In some embodiments, the ceramic tile 403 is a block with a flat or substantially flat surface. Due to the large surface area of ​​the ceramic tile 403 that contacts the component 115 during the induction welding process, the heat sink 402 conductively transfers heat from the component 115 to the heat sink 402, thereby efficiently dispersing and releasing the heat.

[0042] As shown in Figure 4A, the pressure pad 400 further includes a film 406 provided (e.g., bonded or joined) on a heat sink 402 that contacts the component 115 during the induction welding process. In one example, the film 406 is a polyimide film, which prevents the component 115 from deforming and indenting when a load is applied from the compression load application device 111. The thickness of the film 406 may be less than 5 millimeters, less than 3 millimeters, or less than 2 millimeters. Other thicknesses are also envisioned in this disclosure.

[0043] The pressure pad 400 further includes a silicone rubber layer 407 provided (e.g., bonded or joined) to the support layer 404, the silicone rubber layer 407 in contact with the compressive load application device 111 during the induction welding process. The silicone rubber layer 407 acts as an additional support layer for the compressive load application device 111, increasing the rigidity of the pressure pad 400, transmitting the compressive load from the compressive load application device 111 over a wider area during the induction welding process, and reducing the risk of the compressive load application device 111 pinching the pressure pad 400. In this way, the silicone rubber layer 407 reduces the risk of pinching by the compressive load application device 111, thereby providing the silicone rubber layer 407 with a favorable surface for contact with the component being induction welded, and consequently distributing the compressive load over a wider and more consistent area. In some embodiments, the silicone rubber layer 407 is less rigid than the support layer 404, i.e., more flexible, and can conform more faithfully to the shape and structure of the compressive load application device 111. In one embodiment, the silicone rubber layer 407 is formed from a silicone rubber substrate that is rigid yet flexible when cured, and has high resistance to inhibition, good resistance to cut growth, and low shrinkage. Specifically, the silicone rubber layer 407 can withstand the temperature conductively transmitted to the pressure pad 400 during the induction welding process, and has sufficient rigidity to facilitate the distribution of the load from the compressive load application device 111, while also having sufficient flexibility to form a favorable interface with the compressive load application device 111. Furthermore, the rigidity of the pressure pad 400 allows for the formation of a complementary shape to the component being induction welded, and allows for the distribution of contact points of the component being induction welded over a wider area. In some embodiments, the silicone rubber layer 407 may be Dow's Silastic® RTV-4136-M base beige 20.4KG pail or RTV-2 silicone rubber. However, in this disclosure, any suitable silicone rubber layer having sufficient rigidity, flexibility, and resistance characteristics as described herein is assumed.

[0044] In some embodiments, to form the pressure pad 400, the heat diffusion layer 401, the support layer 404, the film 406, and optionally the silicone rubber layer 407 are sequentially applied as liquids and then cured until substantially rigid. In some embodiments, the support layer 404 is machined. In some embodiments, the film 406 is applied as a bonding film. The manufacturing process of the pressure pad 400 is described below in detail with reference to Figure 6. After the heat diffusion layer 401, the support layer 404, and (in applicable embodiments) the film 406 are applied and cured, the pressure pad 400 is formed as shown in Figures 4A to 4D. As shown in Figures 4A and 4B, and in contrast to the pressure pad 300, the support layer 404 is provided on one side of the heat diffusion layer 401. That is, the support layer 404 supports one side of the heat diffusion layer 401. As shown in Figures 4A to 4D, the pressure pad 400 can improve heat dissipation capacity compared to the current solution by increasing the contact area of ​​the heat sink 402 across the entire pressure pad 400.

[0045] In some embodiments, the silicone rubber in the support layer 404 and / or the silicone rubber layer 407 is a component of the curing solution. For example, the silicone rubber may be a two-component silicone rubber layer including a base. The base may be silicone rubber, and the curing agent acts as a catalyst for vulcanizing, i.e., curing, the pressure pad 400. Other configurations, such as using different solutions, are also conceivable.

[0046] Figure 4D shows the flexibility of the pressure pad 400. The use of multiple ceramic tiles 403 and the small gaps between these ceramic tiles 403 increases the flexibility of the pressure pad 400. Each of the heat diffusion layer 401, support layer 404, film 406, and silicone rubber layer 407 has a degree of flexibility as shown in Figure 4D, which allows the pressure pad 400 to be attached to and used on two substantially flat or non-flat components 113, 115. In some embodiments, the ceramic tiles 403 are embedded in the support layer 404 rather than bonded to it in order to further increase the flexibility of the pressure pad 400.

[0047] Figure 5 shows a pressure pad 501, i.e., a compressible load distributor, and a compressible load application device 503 according to various embodiments of the present disclosure. The examples of the pressure pad 501 and compressible load application device 503 shown in Figure 5 are for illustrative purposes only. Other embodiments of the pressure pad 501 and compressible load application device 503 may be adopted without departing from the scope of the present disclosure. That is, the present disclosure envisions pressure pads and compressible load application devices having various shapes, dimensions, configurations, etc.

[0048] In some embodiments, the pressure pad 501 can be embodied as one of the pressure pads 109, 200, 300, or 400. In some embodiments, the compressive load application device 503 may be the compressive load application device 111. As shown in Figure 5, the compressive load application device 503 may have an elongated elliptical cross-section. When the compressive load application device 503 is inflated with air, it expands and applies pressure to the pressure pad 501. The pressure applied to the pressure pad 501 causes it to move away from the compressive load application device 503. That is, when the compressive load application device 503 expands, it pushes against the retaining structure, and as a result, a compressive force is applied to the component 115 during the induction welding process.

[0049] For example, when implemented in the induction welding structure 100 shown in Figure 1, the pressure from the compressive load application device 503 causes the pressure pad 501 to move toward the two components 113 and 115. As the compressive load application device 503 is filled with air, the pressure that the pressure pad 501 applies to the two components 113 and 115 also gradually increases. As the pressure that the pressure pad 501 applies to the two components 113 and 115 gradually increases, the load from the compressive load application device 503 is not concentrated at a single contact point with the two components 113 and 115, but is distributed across the entire pressure pad 501. For example, the pressure pad 501 is configured to bend along or conform to the shape of the compressive load application device 503, as will be described in more detail herein.

[0050] Figure 6 shows a method for manufacturing a pressure pad according to various embodiments of the present disclosure. Method 600 can be carried out by electronic devices such as the induction welding system 900 shown in Figure 9 below, or by other suitable devices. Method 600 can be carried out in various forms without departing from the scope of the present disclosure.

[0051] In step 610, a mold is fabricated. By using the mold, elements of the pressure pad, such as the pressure pad 109, can be placed in the mold and cured together. The mold can be formed from any material suitable for maintaining the molded shape within a desired temperature range during the cooling and curing of the pressure pad elements. In some embodiments, the mold can be configured to produce pressure pads of various shapes and dimensions, depending on the dimensions of the compression load application device 111 used with the pressure pad, the dimensions of the two components 113 and 115 welded using the pressure pad, the shape of the two components 113 and 115 welded using the pressure pad, and the amount of heat removed from the two components 113 and 115 during induction welding. For example, in the case of component 115 with a steeper curve, a pressure pad with greater flexibility is required to accommodate the curve of component 115. A mold for a pressure pad with greater flexibility may include one of the following: a larger support layer, a thinner thermal diffusion layer, smaller ceramic tiles within the thermal diffusion layer, larger gaps between ceramic tiles within the thermal diffusion layer, or other configurations that improve flexibility.

[0052] In step 620, heat diffusion layers 301 and 401 are placed in the mold. The heat diffusion layer may be either heat diffusion layer 301 or heat diffusion layer 401, and may include heat sink 302 or heat sink 402, respectively. For example, ceramic tiles 303 or 403 may be placed in the mold. In various embodiments, the heat diffusion layers 301 and 401 may include ceramic tiles 303 or 403 composed of aluminum nitride or boron nitride.

[0053] In step 630, an adhesion promoter is applied to the heat diffusion layers 301 and 401. The adhesion promoter or bonding promoter may be an adhesion promoter suitable for sufficiently bonding the heat diffusion layers 301 and 401 to the support layers 304 and 404 without impairing the specific electrical properties, namely electrical invisibility and thermal properties, of each layer. For example, the adhesion promoter used may maintain the thermal conductivity and non-conductivity of the heat diffusion layers 301 and 401 while also having sufficient adhesion.

[0054] In step 640, support layers 304 and 404 are placed on the adhesion promoter in the mold. The support layers may be support layer 304 or support layer 404, and may each contain carrier 305 or carrier 405. In various embodiments, support layers 304 and 404 contain one or more of glass fibers, quartz fibers, basalt fibers, PEEK, or PEKK. Support layers 304 and 404 are placed or poured into the mold as a liquid to conform to the shape of the mold.

[0055] In step 650, the heat diffusion layers 301, 401, the adhesion promoter, and the support layers 304, 404 are cured within the mold. The heat diffusion layers 301, 401, the adhesion promoter, and the support layers 304, 404 are cured by cooling within the mold or by other suitable methods.

[0056] While this specification describes a series of steps, additional steps may be performed, some steps may be omitted, or the steps may be performed in a different order, without departing from the scope of this disclosure. In some embodiments, a polyimide film, such as film 306 or 406, may be placed in the mold before the heat diffusion layers 301, 401 are placed in the mold. In other embodiments, film 306 or 406 is placed on the heat diffusion layers 301, 401 after they have been bonded to the support layers 304, 404. In embodiments where an additional support layer, such as a silicone rubber layer 407 in the pressure pad 400, is used, an additional adhesion promoter is placed on the support layers 304, 404 in the mold before curing, and the silicone rubber layer 407 is applied on the adhesion promoter. That is, once each layer is placed in the mold, these layers are then cured.

[0057] Figure 7 shows a method for maintaining the welding temperature during induction welding according to various embodiments of the present disclosure. Method 700 can be carried out by the induction welding structure 100 or by other suitable systems. Method 700 can be carried out in various forms without departing from the scope of the present disclosure.

[0058] In step 710, a welding temperature is applied. The welding temperature is applied to the welding line between two components, such as two components 113 and 115. In one embodiment, the welding temperature at the welding interface 117 between the two components 113 and 115 is achieved by induction. In step 720, a compressive load is distributed throughout the welding line during the induction welding process. In some embodiments, the compressive load is distributed by a compressive load distributor, such as a pressure pad 109, a pressure pad 200, a pressure pad 300, or a pressure pad 400. In step 730, the welding temperature is applied to press the welding line. In step 740, welding heat is removed from the two components 113 and 115 to maintain the surface temperature at the welding interface 117 of the two components 113 and 115 being induction welded. That is, heat is conductively transferred from one surface of the two components 113 and 115 to prevent overheating of that surface, while maintaining the welding temperature at the welding interface 117. In particular, welding heat is removed by the heat diffusion function of the compressive load distributor. For example, in the pressure pad 200, multiple plate-like bodies 203 remove and disperse welding heat. In the pressure pad 300, the heat sink 302 removes and disperses welding heat. In the pressure pad 400, the heat sink 402 removes and disperses welding heat.

[0059] Figure 8 shows a method for distributing a compressive load during induction welding according to various embodiments of the present disclosure. Method 800 can be implemented using pressure pads 109, 200, 300, or 400, as shown in Figures 1, 2, 3, or 4, respectively. Method 800 can be implemented in various forms without departing from the scope of the present disclosure.

[0060] In step 810, a compressive load is applied from the compressive load application device 111. For example, the compressive load application device 111 is placed in the holding cavity 112, and when the compressive load application device 111 expands, a pressure of a corresponding intensity is applied to the pressure pad 109. The compressive load application device 111 can be expanded with any gas suitable for pressurizing the pressure pad 109. For example, the compressive load application device 111 can be expanded with air from the ambient environment, nitrogen, or other inert gas. In step 820, a compressive pressure is applied to the components to be induction welded, such as two components 113 and 115. The pressure pad 109 loads the two components 113 and 115 in the welding line. In step 830, the pressure pad 109 distributes the load applied to the two components 113 and 115. Specifically, the support layer of the pressure pad 109 distributes the applied load over a wider area than when using the compression load application device 111, based on the footprint of the pressure pad 109. The compression load application device 111, due to its elongated structure, has a smaller surface area to which the compression load is applied. By distributing the compression load using the pressure pad 109, which has a relatively large surface area and footprint due to the support layer, the pressure pad 109 can distribute the compression load over a wider area. For example, the support layer may be the carrier 201, support layer 304, or support layer 404 of the pressure pad 200, pressure pad 300, or pressure pad 400, respectively.

[0061] Figure 9 is a block diagram showing an induction welding system 900 according to various embodiments of the present disclosure. The induction welding system 900 can perform induction welding, for example, as described in method 700 shown in Figure 7. The induction welding system 900 can also be implemented, in whole or in part, in the induction welding structure 100 shown in Figure 1. The induction welding system 900 shown in Figure 9 is for illustrative purposes only. Other embodiments of the induction welding system 900 can also be adopted without departing from the scope of the present disclosure. That is, the present disclosure envisions induction welding systems 900 having various shapes, dimensions, configurations, etc.

[0062] In this example, the induction welding system 900 includes a robot 920, which has a controller 902 and memory 904 for managing the operation of a kinematic chain 906, which consists of one or more actuators 908 and one or more rigid bodies 910. By controlling the operation of the kinematic chain 906, the position, speed, and / or direction of the end effector 914 supporting the induction welding coil 912 can be adjusted. In some embodiments, the induction welding coil 912 is the induction welding coil 101 described earlier with reference to Figure 1. The controller 902 further controls the amount of current applied to the induction welding coil 912 to increase or decrease the magnetic field generated by the induction welding coil 912. This adjusts the temperature of the welding interface 117 between two components 113, 115 where induction welding is desired. The controller 902 can be implemented, for example, by a custom circuit, a hardware processor that executes programmed instructions, or a combination thereof. The controller 902 can also instruct the operation of various components of the robot 920 according to commands stored in the numerical control (NC) program stored in memory 904.

[0063] The induction welding coil 912, upon receiving an applied current, generates a magnetic field on one side of the two components 113 and 115. The strength of the generated magnetic field is based on the amount of current applied. Thus, the induction welding coil 912 is controllably adjusted to generate a magnetic field of a desired strength.

[0064] During operation, the magnetic field generated by the induction welding coil 912 causes the thermoplastic elements to reach a transition temperature. For example, at the transition temperature, the thermoplastic elements in component 113 fuse or weld together with the thermoplastic elements in component 115. As a result, the thermoplastic elements in each of the two components 113 and 115 combine to form a single mass, which is then cooled to form a single thermoplastic matrix. The thermoplastic elements may include suitable thermoplastic materials such as PEEK or PEKK.

[0065] Figure 10 is a schematic perspective view showing an aircraft capable of induction welding according to various embodiments of the present disclosure. In one or more examples, composite parts such as thermoplastic aircraft components for the aircraft 1000 shown in Figure 10 can be manufactured. The aircraft 1000 includes wings 1002 and 1004 attached to a fuselage 1006. The aircraft 1000 also includes an engine 1008 attached to wing 1002 and an engine 1010 attached to wing 1004. The fuselage 1006 includes a tail section 1012 to which horizontal stabilizers 1014, 1016, and 1018 are attached. In some examples, the fuselage 1006 has a composite outer skin 1020.

[0066] Aircraft 1000 is an example of an aircraft capable of implementing welded thermoplastic structures, as illustrated by various examples described herein. In certain examples, as will be described in more detail herein, composite brackets and blade stringers of aircraft 1000 are welded thermoplastic structures formed in accordance with this disclosure. In other examples, structural supports such as wing spars and ribs of wings 1002, wings 1004, or fuselage 1006, or other structural supports welded to other components, include thermoplastic structures. For example, structural supports of fuselage 1006 welded to composite skin 1020 may include welded thermoplastic structures.

[0067] In some examples of this disclosure, various shapes or configurations of multiple parts can be induction welded by applying the magnetic flux from the induction welding coil 101 to only one side of the component to be welded. For example, as described herein, the induction welding coil 101 makes it possible to perform induction welding from one side while effectively diffusing heat and pressure. For example, some or all aspects of this disclosure can be implemented in at least the wing 1004, fuselage 1006, and / or composite outer skin 1020 as described herein.

[0068] The description of aircraft 1000 does not impose any physical or structural limitations on the exemplary configurations. For example, while aircraft 1000 is a civilian aircraft, aircraft 1000 may be a military aircraft, a rotary-wing aircraft, a helicopter, an unmanned aerial vehicle, or any other suitable aircraft.

[0069] Furthermore, although the above embodiments describe aircraft, this disclosure can also be applied to other types of platforms. The platform may be, for example, a mobile platform, a fixed platform, a land-based structure, a water-based structure, and a space-based structure. More specifically, the platform may be a surface ship, a tank, a personnel carrier, a train, a spacecraft, a space station, a satellite, a submarine, a car, a power plant, a bridge, a dam, a house, a wind turbine, a manufacturing facility, a building, and other suitable platforms.

[0070] Figure 11 is a block diagram illustrating various possible methods for manufacturing and maintaining an aircraft. Examples of this disclosure can be described in relation to a method 1100 for manufacturing and maintaining an aircraft, as shown in Figure 11. Before the commencement of production, method 1100 may include specification and design 1102 of the aircraft (e.g., aircraft 1000 shown in Figure 10) and material procurement 1104. During production, the manufacturing of aircraft components and small assemblies 1106 and system integration 1108 are carried out. The aircraft 1000 then enters service 1112 after undergoing certification and delivery 1110. During customer service, the aircraft 1000 is incorporated into routine maintenance and upkeep 1114 (which may include improvements, reconfigurations, modifications, etc.).

[0071] Each step of Method 1100 may be performed or carried out by a system integrator, a third party, and / or an operator (e.g., a customer). The system integrator may include, but is not limited to, several aircraft manufacturers and major system subcontractors. The third party may include, but is not limited to, several sellers, subcontractors, and suppliers. The operator may be an airline, leasing company, military organization, service organization, etc.

[0072] Furthermore, any number of other systems can be included in the system described herein. While the aerospace industry is given as an example, the principles of this disclosure may also be applied to other industries, such as the automotive industry.

[0073] The apparatus and methods illustrated or described herein may be employed in any one or more stages of the manufacturing and maintenance method 1100. For example, parts or assemblies corresponding to the manufacturing of parts and assemblies 1106 may be manufactured or produced in the same manner as parts or assemblies manufactured during the aircraft's service. Furthermore, by utilizing one or more embodiments of the apparatus, methods, or combinations thereof in the manufacturing processes of assemblies 1106 and system integration 1108, the aircraft's assembly speed can be substantially increased or costs reduced. Similarly, one or more embodiments of the apparatus or methods, or combinations thereof, may be used during the aircraft's service, for example, in maintenance and servicing 1114.

[0074] Therefore, in various embodiments, induction welding of parts can be facilitated by improving the manner in which the welding interface between parts is heated from one side of the parts (for example, by heating more uniformly). The present disclosure, including the embodiments described herein, can be implemented using different manufacturing environments. For example, some or all embodiments of the present disclosure can be implemented at least in the material procurement 1104 and the manufacturing of parts and small assemblies 1106 described herein.

[0075] The descriptions of the manufacturing environment herein do not impose any physical or structural limitations on how the exemplary embodiments are carried out. Other components may be used in addition to, or in place of, the illustrated components. Some components may also be omitted. Blocks in the figures represent functional components. One or more of these blocks may be combined, separated, or combined and then separated into different blocks when carried out in the exemplary embodiments.

[0076] Without limitation, computer-readable media include computer storage media, and communication media can be implemented in one or more examples by controller 902, etc. Computer storage media include volatile and non-volatile memory, removable memory, and non-removable memory, implemented by any method or technique for storing information such as computer-readable instructions, data structures, and program modules. Computer storage media are tangible and mutually exclusive with respect to communication media. Computer storage media are implemented in hardware, excluding carrier waves and propagated signals. Computer storage media for the purposes of this disclosure are not signals themselves. In one example, computer storage media include hard disks, flash drives, solid-state memory, phase-change random access memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disk read-only memory (CD-ROM), digital multipurpose discs (DVDs) or other optical storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other non-transmission media used to store information accessed by the arithmetic unit. In contrast, communication media typically embody computer-readable instructions, data structures, program modules, etc., in modulated data signals such as carrier waves or other transport mechanisms, and include any information distribution media.

[0077] As described above, program code instructions are stored in memory and executed by correspondingly programmed processing circuits, thereby enabling the functions of the systems, subsystems, tools, and their elements described herein. Furthermore, by loading any appropriate program code instructions from a computer-readable storage medium into a computer or other appropriate programmable device, a specific machine can be formed, in which case the specific machine becomes a means for realizing the functions described herein. These program code instructions can also be stored in a computer-readable storage medium capable of instructing a computer, processing circuit, or other programmable device to function in a specific manner, thereby enabling the formation of a specific machine or a specific product. Instructions stored in a computer-readable storage medium can form a product, and the product becomes a means for realizing the functions described herein. By retrieving program code instructions from a computer-readable storage medium and loading them into a computer, processing circuit, or other programmable device, the computer, processing circuit, or other programmable device can be configured to perform operations that should be performed by the computer, processing circuit, or other programmable device.

[0078] The acquisition, loading, and execution of program code instructions are performed sequentially, for example, one instruction at a time. However, in some exemplary embodiments, acquisition, loading, and / or execution may occur in parallel, such that multiple instructions are acquired, loaded, and / or executed together. By executing program code instructions, a computer implementation process can be created, enabling the instructions executed by a computer, processing circuit, or other programmable device to perform operations to realize the functions described herein.

[0079] A combination of operations to realize a specific function can be achieved by executing instructions through a processing circuit or by storing instructions in a computer-readable storage medium. Furthermore, one or more functions and combinations of functions can be realized by a hardware-based computer system and / or processing circuit for a specific purpose that performs a particular function, or by a combination of hardware for a specific purpose and program code instructions.

[0080] The following notes describe further aspects of this disclosure. In some embodiments, the notes described below can be further combined in any partial way, without departing from the scope of this disclosure.

[0081] A1: A compressible load distribution body comprising a support layer and a thermal diffusion layer, The support layer includes a flexible carrier configured to distribute the load from the compression load application device. The heat diffusion layer is bonded to and supported on the support layer and includes a heat sink configured to transfer heat throughout the compressible load distribution body, wherein the heat sink is both thermally conductive and non-conductive.

[0082] A2: The compressive load distribution body according to Appendix A1, wherein the heat sink comprises a plurality of ceramic tiles, and the flexible carrier comprises a flexible plate.

[0083] A3: The flexible carrier includes a flexible plate coupled to the compression load application device, The heat diffusion layer includes a plurality of ceramic tiles, The flexible plate and the plurality of ceramic tiles form a semi-rigid pad, as described in Appendix A1.

[0084] A4: The compressive load distribution body described in Appendix A3, wherein the multiple ceramic tiles are bottom-bonded to the flexible plate in order to maintain the arrangement of the multiple ceramic tiles with the flexible plate.

[0085] A5: The heat sink is configured to dissipate heat from its surface during induction welding, and the heat is generated from the magnetic flux applied to the surface by the induction welding coil, as described in Appendix A1.

[0086] A6: The heat sink is a compressive load distribution body as described in Appendix A1, comprising a plurality of ceramic tiles made from aluminum nitride.

[0087] A7: The heat sink is a compressive load distribution body as described in Appendix A1, comprising a plurality of ceramic tiles made from boron nitride (BN).

[0088] A8: The compressive load distribution body according to Appendix A1, wherein the flexible carrier includes a flexible plate made from glass fibers.

[0089] A9: The compressive load distribution body according to Appendix A1, wherein the flexible carrier includes a flexible plate made from quartz fibers or basalt fibers.

[0090] A10: The compressive load dispersant according to Appendix A1, further comprising a polyimide film between the surface to be induction-welded and the heat diffusion layer.

[0091] A11: A method for manufacturing a part of an aircraft using the compressible load distributer described in Appendix A1.

[0092] B1: A flexible carrier configured to distribute the load from a compression load application device, A compressive load distributor comprising a plurality of plate-like bodies embedded in the flexible carrier and configured to transfer heat throughout the flexible carrier, wherein the plurality of plate-like bodies are thermally conductive and non-conductive.

[0093] B2: The compressive load distributor described in Appendix B1, wherein the plurality of plate-like bodies are cooling filler plate-like bodies dispersed within the flexible carrier and aligned in the same plane, and the cooling filler plate-like bodies enhance the heat dissipation capacity of the flexible carrier.

[0094] B3: The plurality of plate-like bodies are the compressive load distribution bodies described in Appendix B1, comprising aluminum nitride.

[0095] B4: The plurality of plate-like bodies are the compressive load distributing bodies described in Appendix B1, which contain boron nitride (BN).

[0096] B5: The plurality of plate-like bodies are the compressive load distribution bodies described in Appendix B1, wherein the plurality of plate-like bodies contain crushed carbon fibers.

[0097] B6: The compressive load distribution body according to Appendix B1, wherein the flexible carrier includes a flexible plate made from glass fibers.

[0098] B7: The compressive load distribution body according to Appendix B1, wherein the flexible carrier includes a flexible plate made from quartz fibers or basalt fibers.

[0099] B8: The compressive load distribution body according to Appendix B1, wherein the plurality of plate-like bodies are embedded in the flexible carrier substantially parallel to the surface of the flexible carrier.

[0100] B9: A method for manufacturing a part of an aircraft using the compressible load distributer described in Appendix B1.

[0101] C1: A compressive load distribution body comprising a support layer, a heat diffusion layer, and a silicone rubber layer, The support layer includes a flexible carrier configured to distribute the load from the compression load application device. The heat diffusion layer comprises a heat sink and is bonded to the support layer, and the heat sink is configured to transfer heat throughout the entire compressive load distribution body, and is both thermally conductive and non-conductive. The support layer is a compressive load distributer provided between the heat diffusion layer and the silicone rubber layer.

[0102] C2: The compressive load distribution body according to Appendix C1, wherein the cross-sectional properties of at least one of the support layer and the heat diffusion layer vary in the longitudinal direction.

[0103] C3: The compressive load distribution body according to Appendix C1, wherein the flexible carrier includes a flexible plate coupled to the compressive load application device.

[0104] C4: The heat sink is a compressible load distribution body as described in Appendix C1, comprising a plurality of ceramic tiles.

[0105] C5: The plurality of ceramic tiles are a compressive load distribution body as described in Appendix C4, comprising aluminum nitride.

[0106] C6: The plurality of ceramic tiles are a compressible load distribution body as described in Appendix C4, comprising boron nitride (BN).

[0107] C7: The compressive load distribution body according to appendix C1, further comprising a polyimide film between the support layer and the heat diffusion layer.

[0108] C8: The compressive load distribution body according to Appendix C1, wherein the flexible carrier includes a flexible plate made from glass fibers.

[0109] C9: A method for manufacturing a part of an aircraft using the compressible load distributer described in Appendix C1.

[0110] D1: A method for maintaining the welding line temperature during induction welding, Applying welding temperature to the welding line, During the induction welding, the compressive load is distributed across the entire welding line by the compressive load distribution body. Applying the welding temperature while pressing the welding line together, A method comprising removing welding heat in order to maintain the surface temperature of a surface to be induction welded at a lower temperature than the welding temperature in the welding line.

[0111] D2: The method according to Appendix D1, wherein the compressible load distributor includes a flexible carrier configured to distribute the compressive load from a compressive load application device.

[0112] D3: The method according to Appendix D2, wherein the compressible load distributor includes a thermal diffusion layer bonded to the flexible carrier, the thermal diffusion layer is configured to transfer welding heat from the surface in the welding line throughout the entire compressible load distributor, and the thermal diffusion layer is both thermally conductive and non-conductive.

[0113] D4: The method according to appendix D3, further comprising applying a heat-generating magnetic flux by an induction coil to apply the welding temperature to the welding line.

[0114] D5: Part of an aircraft assembled according to the method described in Appendix D1.

[0115] E1: Apparatus for induction welding, Weldable material including induction welding areas, The induction welding device on the welding side of the induction welding area, An apparatus comprising a heat sink material having a welding surface adjacent to the contact side of the induction welding portion opposite to the welding side, wherein the weldable material is disposed between the induction welding device and the heat sink material.

[0116] E2: Further includes a compression load application device, The heat sink material further includes a pressure contact surface on the side of the induction welding portion opposite to the welding side, The compression load application device is an apparatus for induction welding as described in Appendix E1, which contacts the pressure contact surface of the heat sink material.

[0117] E3: The heat sink material includes a flexible heat sink, A support layer including a flexible carrier configured to distribute the compressive load from the compressive load application device, An apparatus for induction welding according to Appendix E2, comprising a heat sink and a heat diffusion layer bonded to the support layer, wherein the heat sink is configured to disperse heat and is both thermally conductive and non-conductive.

[0118] E4: The apparatus for induction welding as described in Appendix E3, wherein the flexible carrier is a flexible plate.

[0119] E5: A method for manufacturing a part of an aircraft using the apparatus described in Appendix E1.

[0120] F1: A method for manufacturing a compressible load distributer, Creating a mold, A heat diffusion layer, including a heat sink configured to disperse heat and being both thermally conductive and non-conductive, is placed in the mold. Applying an adhesion promoter to the aforementioned heat diffusion layer, A support layer containing a flexible carrier configured to distribute the load is placed on the adhesion promoter, A method comprising curing the heat diffusion layer, the adhesion promoter, and the support layer.

[0121] F2: Part of an aircraft assembled according to the method described in Appendix F1.

[0122] G1: A method for distributing compressive load during induction welding, Being subjected to pressure from a compression force applying device, Applying a load to components being induction welded in a welding line, A method comprising using a compressible load distributer to distribute the load applied to the component being induction welded.

[0123] G2: Part of an aircraft assembled according to the method described in Appendix G1. While specific language relating to structural features and / or the operation of a method has been used in the description of the subject matter of this disclosure, it should be understood that the subject matter defined in the attached claims is not necessarily limited to the aforementioned specific features or operations. Rather, the aforementioned specific features or operations are merely described as examples of forms of carrying out the subject matter of the claims.

[0124] The benefits and effects described above may relate to one embodiment or to several embodiments. Embodiments are not limited to those that solve any or all of the problems described above, or that achieve any or all of the benefits or effects described above. Also, referring to "one" item means referring to one or more of that item.

[0125] As used herein, the terms “includes / equipment” mean to include the feature or action described following the term, but do not exclude the inclusion of one or more other features or actions.

[0126] In some examples, the illustrated operations may be implemented as software instructions encoded in a computer-readable medium, or by hardware programmed or designed to perform the operations, or both. For example, aspects of the present disclosure may be implemented as a system on a chip or other circuit comprising a plurality of interconnected conductive elements.

[0127] The execution order of processes illustrated and described in the embodiments of this disclosure is not mandatory unless otherwise specified. In other words, unless otherwise specified, the execution order of processes is arbitrary. Furthermore, the embodiments of this disclosure may include more or fewer processes than those described. For example, a particular process may be executed before, simultaneously with, or after other processes, and all such cases are included within the scope of this disclosure.

[0128] In aspects of this disclosure or its embodiments, an element described in the singular means that there is one or more of that element. Furthermore, terms such as “equipment,” “includes,” and “possess” are used in a comprehensive sense, meaning that additional elements not listed may be included. The term “exemplary” means “an example.” The expression “one or more of A, B, and C” means “at least one of A and / or at least one of B and / or at least one of C.”

[0129] While the embodiments of this disclosure have been described in detail above, it should be clear that various modifications and variations are possible without departing from the scope of the embodiments of this disclosure as defined in the attached claims. The above-described structures, products, and methods can be modified in various ways without departing from the scope of the embodiments of this disclosure, and the contents shown in the above description and attached drawings are merely examples and not intended to be limiting.

[0130] It should be understood that the above description is illustrative and not limiting. For example, the embodiments (and / or aspects thereof) described above can be used in combination with each other. In addition, various modifications are possible to adapt to specific situations or materials without departing from the scope of teaching of the various embodiments of this disclosure. The dimensions and material types described herein define parameters in the various embodiments of this disclosure, but such embodiments are not intended to be limiting in any way and are merely illustrative. Many more other embodiments will be apparent to those skilled in the art in view of the above description. Therefore, the scope of the various embodiments of this disclosure should be determined by reference to the claims, taking into account all equivalents recognized in the appended claims. The terms “equipped with / including” and “being” used in the appended claims are used in their usual sense and are equivalent to expressions such as “possessing” and “in.” In addition, terms such as “first,” “second,” and “third” are used merely as distinguishing marks and do not impose quantitative requirements on the subject matter referred to by them.

[0131] This specification discloses various embodiments, including the best mode, using examples, and enables various embodiments, including the fabrication and use of any device or system, and the execution of the incorporated methods, to those skilled in the art. The patentable scope of the various embodiments of this disclosure is defined by the claims and may include other embodiments that a person skilled in the art may imagine. Such other embodiments should be considered to be included in the claims if they have components identical to the language of the claims, or if they have equivalent components that differ only non-essentially from the language of the claims.

[0132] Note 1. A compressible load distribution body (109,300,400) including a support layer (304,404) and a heat diffusion layer (301,401), The support layer includes flexible carriers (305, 405) configured to distribute the load from the compression load application device (111), The heat diffusion layer (301, 401) is bonded to and supported on the support layer (304, 404) and includes a heat sink (302, 402) configured to transfer heat throughout the compressible load distribution body, wherein the heat sink (302, 402) is thermally conductive and non-conductive.

[0133] Note 2. The heat sink (302, 402) includes a plurality of ceramic tiles (303, 403), and the flexible carrier (305, 405) includes a flexible plate, as described in Note 1, for the compressive load distribution body (109, 300, 400).

[0134] Note 3. The flexible carrier (305, 405) includes a flexible plate coupled to the compressive load application device (111). The heat diffusion layer (301, 401) includes a plurality of ceramic tiles, The flexible plate and the plurality of ceramic tiles (303, 403) form a semi-rigid pad, which is the compressive load distribution body (109, 300, 400) described in Appendix 1.

[0135] Note 4. In order to maintain the arrangement of the plurality of ceramic tiles (303, 403) with the flexible plate, the plurality of ceramic tiles (303, 403) are bottom-bonded to the flexible plate, as described in Note 3, for the compressive load distribution body (109, 300, 400).

[0136] Note 5. The heat sink (302, 402) is configured to dissipate heat from its surface (113, 115) during induction welding, and the heat is generated from the magnetic flux (119) applied to the surface (113, 115) by the induction welding coil, as described in Note 1, for the compressive load distribution body (109, 300, 400).

[0137] Note 6. The heat sink (302, 402) is a compressible load distribution body (109, 300, 400) as described in Note 1, comprising a plurality of ceramic tiles (303, 403) made from aluminum nitride.

[0138] Note 7. The heat sink (302, 402) is a compressible load distribution body (109, 300, 400) as described in Note 1, comprising a plurality of ceramic tiles (303, 403) made from boron nitride (BN).

[0139] Note 8. The flexible carrier (305, 405) is the compressive load distribution body (109, 300, 400) described in Note 1, which includes a flexible plate made from glass fiber.

[0140] Note 9. The flexible carrier (305, 405) is the compressive load distribution body (109, 300, 400) described in Note 1, which includes a flexible plate made from quartz fibers or basalt fibers.

[0141] Note 10. The compressible load distribution body (109, 300, 400) described in Note 1, further comprising a polyimide film (306, 406) between the induction-welded surface (113, 115) and the heat diffusion layer (301, 401).

[0142] Appendix 11. A method for manufacturing a part of an aircraft (1000) using the compressible load distribution body (109, 300, 400) described in Appendix 1.

[0143] Note 12. A flexible carrier (201) configured to distribute the load from the compression load application device (111), A compressible load distributor (109,200) comprising a plurality of plate-like bodies (203) embedded in the flexible carrier (201) and configured to transfer heat throughout the entire flexible carrier (201), wherein the plurality of plate-like bodies are thermally conductive and non-conductive.

[0144] Note 13. The plurality of plate-like bodies (203) are cooling filler plate-like bodies dispersed within the flexible carrier (201) and aligned in the same plane, and the cooling filler plate-like bodies enhance the heat dissipation capacity of the flexible carrier (201), as described in Note 12, for the compressive load distribution body (109,200).

[0145] Note 14. The plurality of plate-like bodies (203) are the compressive load distribution bodies (109,200) described in Note 12, which contain aluminum nitride.

[0146] Note 15. The plurality of plate-like bodies (203) are the compressible load distribution bodies (109,200) described in Note 12, which contain boron nitride (BN).

[0147] Note 16. The plurality of plate-like bodies (203) are the compressive load distribution bodies (109,200) described in Note 12, which contain crushed carbon fibers.

[0148] Note 17. The flexible carrier (201) is the compressive load distribution body (109,200) described in Note 12, which includes a flexible plate made from glass fibers.

[0149] Note 18. The flexible carrier (201) is the compressive load distribution body (109,200) as described in Note 12, comprising a flexible plate made from quartz fibers or basalt fibers.

[0150] Note 19. The compressive load distribution body (109,200) according to Note 12, wherein the plurality of plate-like bodies (203) are embedded in the flexible carrier (201) substantially parallel to the surface of the flexible carrier (201).

[0151] Appendix 20. A method for manufacturing a part of an aircraft (1000) using the compressible load distribution body (109,200) described in Appendix 12.

[0152] Note 21. A compressible load distribution body (109,300,400) comprising a support layer (304,404), a heat diffusion layer (301,401), and a silicone rubber layer (307,407), The support layer includes flexible carriers (305, 405) configured to distribute the load from the compression load application device (111), The heat diffusion layer comprises a heat sink (302, 402) and is bonded to the support layer (304, 404), and the heat sink (302, 402) is configured to transfer heat throughout the entire compressible load distribution body (109, 300, 400), and is thermally conductive and non-conductive. The support layers (304, 404) are compression load distributers provided between the heat diffusion layers (301, 401) and the silicone rubber layers (307, 407).

[0153] Note 22. The compressive load distribution body (109, 300, 400) described in Note 21, wherein the cross-sectional properties of at least one of the support layer (304, 404) and the heat diffusion layer (301, 401) vary in the longitudinal direction.

[0154] Note 23. The flexible carrier (305, 405) is the compressive load distribution body (109, 300, 400) described in Note 21, which includes a flexible plate coupled to the compressive load application device (111).

[0155] Note 24. The heat sink (302, 402) is a compressible load distribution body (109, 300, 400) as described in Note 21, which includes a plurality of ceramic tiles (303, 403).

[0156] Note 25. The plurality of ceramic tiles (303, 403) are the compressible load distribution body (109, 300, 400) described in Note 24, which contains aluminum nitride.

[0157] Note 26. The plurality of ceramic tiles (303, 403) are the compressible load dispersion (109, 300, 400) described in Note 24, which contain boron nitride (BN).

[0158] Note 27. The compressible load dispersion body (109, 300, 400) according to Note 21, further comprising a polyimide film (306, 406) between the support layer (304, 404) and the heat diffusion layer (301, 401).

[0159] Note 28. The flexible carrier (305, 405) is the compressive load distribution body (109, 300, 400) described in Note 21, which includes a flexible plate made from glass fiber.

[0160] Appendix 29. A method for manufacturing a part of an aircraft (1000) using the compressible load distribution body (109, 300, 400) described in Appendix 21.

[0161] Appendix 30. A method for maintaining the welding line temperature during induction welding (700), Applying the welding temperature to the welding line (710), During the induction welding, the compressive load is distributed over the entire welding line by the compressive load distributor (720), The welding temperature is applied while the welding lines are pressed together (730), A method comprising (740) removing welding heat in order to maintain the surface temperature of the surface to be induction welded lower than the welding temperature in the welding line.

[0162] Note 31. The method according to Note 30, wherein the compressible load disperser includes a flexible carrier configured to disperse the compressive load from a compressive load application device.

[0163] Note 32. The method according to Note 31, wherein the compressible load distribution body includes a thermal diffusion layer bonded to the flexible carrier, the thermal diffusion layer is configured to transmit welding heat from the surface in the welding line throughout the entire compressible load distribution body, and the thermal diffusion layer is both thermally conductive and non-conductive.

[0164] Appendix 33. The method according to Appendix 32, further comprising applying a heat-generating magnetic flux by an induction coil to the welding line to apply the welding temperature.

[0165] Appendix 34. Part of an aircraft (1000) assembled according to the method described in Appendix 30.

[0166] Note 35. Apparatus for induction welding, Weldable materials (113, 115) including induction welding areas, The induction welding device (101) on the welding side of the induction welding area, An apparatus comprising a heat sink material (109) having a welding surface adjacent to the contact side of the induction welding portion opposite to the welding side, wherein the weldable material is disposed between the induction welding device and the heat sink material.

[0167] Note 36. Further includes a compression load application device (111), The heat sink material further includes a pressure contact surface on the side of the induction welding portion opposite to the welding side, The compression load application device is an apparatus for induction welding as described in Appendix 35, which contacts the pressure contact surface of the heat sink material.

[0168] Note 37. The heat sink material includes a flexible heat sink. A support layer including a flexible carrier configured to distribute the compressive load from the compressive load application device, An apparatus for induction welding according to Appendix 36, comprising a heat sink and a heat diffusion layer bonded to the support layer, wherein the heat sink is configured to disperse heat and includes a heat diffusion layer that is both thermally conductive and non-conductive.

[0169] Appendix 38. The apparatus for induction welding described in Appendix 37, wherein the flexible carrier is a flexible plate.

[0170] Appendix 39. A method for manufacturing a part of an aircraft using the apparatus described in Appendix 35.

[0171] Appendix 40. A method for manufacturing a compressible load distributer (600), Making a mold (610) and A heat diffusion layer including a heat sink configured to disperse heat and being both thermally conductive and non-conductive is placed in the mold (620), Applying an adhesion promoter to the heat diffusion layer (630), A support layer including a flexible carrier configured to distribute the load is placed on the adhesion promoter (640), A method comprising curing the heat diffusion layer, the adhesion promoter, and the support layer (650).

[0172] Appendix 41. Part of an aircraft assembled according to the method described in Appendix 40.

[0173] Appendix 42. A method for distributing compressive load during induction welding (800), Receiving pressure from a compression force application device (810), Applying a load to a component being guide-welded in a welding line (820), A method comprising (830) using a compressible load distributor to distribute the load applied to the component being induction welded.

[0174] Appendix 43. Part of an aircraft (1000) assembled according to the method described in Appendix 42.

[0175] While this disclosure has been described using various embodiments, various changes and modifications are possible without departing from the scope of this disclosure.

Claims

1. A compressible load distribution body comprising a support layer and a heat diffusion layer, wherein the compressible load distribution body is positioned on a second side opposite to the first side where the induction heating means is positioned together with the first heat sink with respect to the welding interface. The support layer includes a flexible carrier configured to distribute the load from the compression load application device. The heat diffusion layer includes a second heat sink bonded to and supported on the support layer and configured to transfer heat throughout the compressible load distribution, wherein the second heat sink is thermally conductive and non-conductive.

2. The compressive load distribution body according to claim 1, wherein the second heat sink comprises a plurality of ceramic tiles, and the flexible carrier comprises a flexible plate.

3. The flexible carrier includes a flexible plate coupled to the compressive load application device. The heat diffusion layer includes a plurality of ceramic tiles, The compressive load distribution body according to claim 1, wherein the flexible plate and the plurality of ceramic tiles form a semi-rigid pad.

4. The compressive load distribution body according to claim 3, wherein the plurality of ceramic tiles are bottom-bonded to the flexible plate in order to maintain the arrangement of the plurality of ceramic tiles with the flexible plate.

5. The compressive load distributor according to claim 1, wherein the second heat sink is configured to dissipate heat from its surface during induction welding, and the heat is generated from the magnetic flux applied to the surface by the induction welding coil.

6. The compression load distribution body according to claim 1, wherein the second heat sink includes a plurality of ceramic tiles made from aluminum nitride.

7. The compressive load distribution body according to claim 1, wherein the second heat sink comprises a plurality of ceramic tiles made from boron nitride (BN).

8. The compressive load distributor according to any one of claims 1, 6, and 7, wherein the flexible carrier includes a flexible plate made from glass fibers.

9. The compressive load distributor according to any one of claims 1, 6, and 7, wherein the flexible carrier includes a flexible plate made from quartz fibers or basalt fibers.

10. A compressive load distribution body comprising a support layer and a thermal diffusion layer, The support layer includes a flexible carrier configured to distribute the load from the compression load application device. The heat diffusion layer includes a heat sink bonded to and supported on the support layer and configured to transfer heat throughout the compressive load distribution body, wherein the heat sink is both thermally conductive and non-conductive. A compressible load dispersant further comprising a polyimide film between the surface to be induction-welded and the heat diffusion layer.

11. A method for manufacturing a part of an aircraft using a compressible load distributor according to any one of claims 1 to 10.

12. A method for maintaining the welding line temperature during induction welding, Applying welding temperature to the welding line, During the induction welding, the compressive load is distributed across the entire welding line by a compressive load distribution body including a second heat sink, and the compressive load distribution body is positioned on the second side of the welding line, opposite to the first side where the induction heating means is positioned together with the first heat sink. Applying the welding temperature while pressing the welding line together, A method comprising removing welding heat through the first heat sink and the second heat sink in order to maintain the surface temperature of the surface to be induction welded lower than the welding temperature in the welding line.

13. The method according to claim 12, wherein the compressible load distributor includes a flexible carrier configured to distribute the compressive load from a compressive load application device.

14. The method according to claim 13, wherein the compressible load distributor includes a thermal diffusion layer bonded to the flexible carrier, the thermal diffusion layer is configured to transmit welding heat from the surface in the welding line throughout the entire compressible load distributor, and the thermal diffusion layer is both thermally conductive and non-conductive.

15. The method according to claim 14, further comprising applying a heat-generating magnetic flux by an induction coil to the welding line to apply the welding temperature.

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