Semiconductor module
The semiconductor module addresses heat dissipation and size constraints by using integrated metal wiring boards with joint and rising portions, achieving efficient heat transfer and compact design.
JP7881968B2Active Publication Date: 2026-06-30FUJI ELECTRIC CO LTD
Patent Information
- Authority / Receiving Office
- JP Β· JP
- Patent Type
- Patents
- Current Assignee / Owner
- FUJI ELECTRIC CO LTD
- Filing Date
- 2022-04-13
- Publication Date
- 2026-06-30
AI Technical Summary
Technical Problem
Existing semiconductor modules face challenges in efficiently dissipating heat generated by semiconductor elements while minimizing the overall size of the module due to the increased number and area of metal wiring boards required for heat transfer.
Method used
A semiconductor module design featuring a laminated substrate with integrated metal wiring boards that include joint and rising portions to connect semiconductor elements to external terminals, reducing the need for additional wiring and minimizing the mounting area.
Benefits of technology
This design effectively dissipates heat from semiconductor elements to external terminals while maintaining a compact module size, ensuring stability and efficient heat transfer without additional wiring.
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Smart Images
Figure 0007881968000001 
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Abstract
To prevent a semiconductor module from being enlarged while preventing heat generated at a semiconductor element from being transmitted to a main terminal.SOLUTION: A semiconductor module (1) includes a stacked substrate (2) in which at least a circuit board (22a) and a circuit board (22b) are arranged on the top surface of a dielectric plate (20), a semiconductor element (3a) arranged on the top surface of the circuit board (22a), a main terminal (M), and a metal wiring board (4b) that electrically connects the semiconductor element (3a) and the main terminal (M). The metal wiring board (4b) has a joint portion (43) joined to the top surface electrode of the semiconductor element (3a), a joint portion (45) joined to the top surface of the circuit board (22b), a connecting portion (46) that joins the joint portion (43) and the joint portion (45) together, and a rising portion (48) that rises upward from an end portion of the joint portion (45). The upper end of the rising portion (48) is electrically connected to the main terminal (M).SELECTED DRAWING: Figure 1
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