Composition for protective film and method for manufacturing the same

Abstract

When a titanium electrode provided with a catalyst layer for increasing electrolysis efficiency is used in a strong acid solution containing a hydrogen peroxide solution, the catalyst layer is damaged in the environment in the solution and peeled off, and the electrolysis efficiency is reduced. If a protective layer for protecting the catalyst layer is composed of a metal film, the forming step becomes complicated and the cost is also increased.　This protective film composition contains a silicone oligomer, a silicone resin, and an epoxy group-containing silicone compound, wherein the silicone resin is contained in an amount of greater than 10 parts by weight and less than 300 parts by weight with respect to 100 parts by weight of the silicone oligomer, and the epoxy group-containing silicone compound is contained in an amount of greater than 10 parts by weight and less than 200 parts by weight with respect to 100 parts by weight of the total amount of the silicone oligomer and the silicone resin. The protective film composition can protect a catalyst layer of an electrode from a severe environment in a treatment solution and elongate the electrode service life.

Description

[Technical Field]

[0001] This disclosure relates to a composition for creating a protective film that protects electrodes used in electrolysis, which is widely used in industrial applications, as well as for applications such as plating and recovering metals present in the treatment solution. [Background technology]

[0002] Electrolysis is used in various industrial fields. The electrodes used in this process have a current of several A / dm 2 From several hundred A / dm 2 It is used in a wide range of current densities, including those exceeding a certain limit. In particular, the anode requires high oxidation resistance and electrode durability because oxidation reactions such as the generation of oxygen and chlorine gases occur on its surface. Furthermore, from an environmental and safety perspective, titanium and its alloys are used as electrode substrates as valve metals for electrodes. However, although titanium is conductive, its conductivity is not considered high, so when used as an electrode, a stable catalyst layer such as a platinum-based metal is provided on its surface.

[0003] In industrial electrolysis, high current densities are sometimes used as described above, and the treated liquid may be a strong acid, or it may be used in a strong oxidizing environment with added hydrogen peroxide. In particular, if a catalyst layer is formed on the surface of the electrode material to increase the efficiency of electrolysis, the catalyst layer will be damaged.

[0004] Patent Document 1 discloses an electrode comprising a valve metal substrate such as titanium, an external catalyst layer, and a protective layer made of a valve metal oxide interposed between the substrate and the catalyst layer. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Patent No. 5932028 Publication [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] While using metal as a protective layer for the catalyst layer on the electrode is considered to offer high protection, it requires complex processes such as heat treatment at temperatures close to 500°C during manufacturing, resulting in high costs. There was a need for a more inexpensive protective layer that could protect the electrode (especially the catalyst layer) even in harsh environments. [Means for solving the problem]

[0007] This disclosure was conceived in view of the above-mentioned problems and provides a protective film composition and a method for manufacturing the same that can protect materials to be protected, including electrodes used in harsh environments.

[0008] Specifically, the protective film composition relating to this disclosure is: A silicone oligomer having an organic group bonded to a main skeleton formed by siloxane bonds, with a weight-average molecular weight of 1000 or more and 10000 or less, wherein the organic group contains an alkoxy group and a methyl group, and does not contain an epoxy group. It has a siloxane skeleton, a weight-average molecular weight of 30,000, and methyl groups. and phenyl group At least one silicone resin that has a methyl group but does not have an epoxy group, or has a weight-average molecular weight of 3 million to 4 million and does not have an epoxy group, The silicone compound contains a siloxane skeleton or a Si-O bond and an epoxy group. The silicone resin is contained in an amount greater than 10 parts by weight and less than 300 parts by weight relative to 100 parts by weight of the silicone oligomer. The silicone compound containing the epoxy group is characterized by containing an amount of more than 10 parts by weight and less than 200 parts by weight per 100 parts by weight of the total of the silicone oligomer and the silicone resin.

[0009] Specifically, the method for manufacturing the protective film composition relating to this disclosure is: A silicone oligomer having an organic group bonded to a main skeleton formed by siloxane bonds, with a weight-average molecular weight of 1000 or more and 10000 or less, wherein the organic group contains an alkoxy group and a methyl group, and does not contain an epoxy group. It has a siloxane skeleton, a weight-average molecular weight of 30,000, and methyl groups. and phenyl group At least one silicone resin that has a methyl group but does not have an epoxy group, or has a weight-average molecular weight of 3 million to 4 million and does not have an epoxy group, A step of mixing a silicone compound containing a siloxane skeleton or an epoxy group having a Si-O bond and an epoxy group with a solvent to obtain a mixture, The process includes dispersing the aforementioned mixture to obtain a protective film composition, In the aforementioned mixture, The aforementioned silicone resin is More than 10 parts by weight relative to 100 parts by weight of the aforementioned silicone oligomer, It is in the range of less than 300 parts by weight. The silicone compound containing the epoxy group is A total of 100 parts by weight of the silicone oligomer and the silicone resin. In contrast, the range is more than 10 parts by weight and less than 200 parts by weight. The solvent is characterized by being in the range of 130 to 230 parts by weight per 100 parts by weight of total solids. [Effects of the Invention]

[0010] The protective film composition of this disclosure forms a resin film mainly composed of silicone, and therefore adheres firmly to the catalyst layer on the electrode surface, which is the material to be protected, even in harsh solution environments such as those involving strong acids or hydrogen peroxide, thereby protecting the entire electrode. Furthermore, because the protective film composition of this disclosure is inexpensive and the formation of the protective film is very easy, the service life of the electrode can be extended by reapplying it each time it is peeled off, rather than forming a metal solid protective film using a complex procedure. [Brief explanation of the drawing]

[0011] [Figure 1]It is a diagram showing the experimental configuration of an example for examining the performance of the protective film composition. [Figure 2] (a) is a surface photograph of an electrode on which a catalyst layer is formed. (b) is a surface photograph of an electrode on which a protective film is formed over the catalyst layer. (c) is a photograph showing a state where half of the protective film has peeled off after use.

Mode for Carrying Out the Invention

[0012] Hereinafter, the protective film composition according to the present disclosure will be illustrated and described with reference to the drawings and examples. It should be noted that the following description exemplifies one embodiment and one example of the present disclosure, and the present disclosure is not limited to the following description. The following description can be modified without departing from the spirit of the present disclosure. In addition, in the following description, "~" representing the range of component composition means "from ... to ...", that is, "A%~B%" represents "not less than A% and not more than B%".

[0013] The protective film composition according to the present disclosure contains silicone. More specifically, it contains a silicone oligomer, a silicone resin, and a silicone compound containing an epoxy group. Further, it may optionally contain conductive particles and a solvent.

[0014] The silicone oligomer is also referred to as an alkoxy group-containing organopolysiloxane in which organic groups are bonded to the main skeleton formed by siloxane bonds, and refers to one having a weight average molecular weight of not less than 1000 and not more than 10000. In the present disclosure, organic groups to which a methyl group, a phenyl group, an ethoxy group, a methoxy group, an epoxy group, a mercapto group, an amino group, a methacryloyl group, an acryloyl group, or the like are bonded are suitably used.

[0015] Specifically, these are X-41-1053, X-41-1059A (all containing epoxy, methoxy, and ethoxy groups), X-41-1056 (containing epoxy and methoxy groups), X-41-1805 (containing mercapto, methoxy, and ethoxy groups), X-41-1818 (containing mercapto and ethoxy groups), X-41-1810 (containing mercapto and methoxy groups), X-41-2651 (containing amino and methoxy groups), and X-40-2655, all manufactured by Shin-Etsu Chemical Co., Ltd. Alkoxy oligomers such as A (having a methacryloyl group and a methoxy group), KR-513 (having an acryloyl group and a methoxy group), KC-89S, KR-500, X-40-9225, X-40-9246, X-40-9250, KR-401N, X-40-9227, X-40-9247, KR-510, KR-9218, KR-213, X-40-2308 (all having a methoxy group), and X-40-9238 (having an ethoxy group) can be suitably used.

[0016] Silicone compounds containing epoxy groups (hereinafter also simply referred to as "epoxy") can be those having a siloxane skeleton or a Si-O bond and an epoxy group. Specifically, silane coupling agents (3-glycidoxypropyltrimethoxysilane: CAS number 2530-83-8) can be suitably used.

[0017] Furthermore, it is desirable that the silicone compound containing epoxy groups has multiple epoxy groups, as this allows for the formation of a stronger bond with the catalyst layer. Specific examples include Shin-Etsu Chemical's KR-516, KR-517, and X-24-9590.

[0018] Furthermore, silicone compounds containing epoxy groups do not need to have an alkoxy group, as long as they have a Si-O structure and an epoxy group within the molecule. Specific examples include Shin-Etsu Chemical's X-40-2678, X-40-2669, X-40-2728, and KR-470.

[0019] Silicone resins are those that have a siloxane skeleton and a weight-average molecular weight ranging from tens of thousands to several million.

[0020] Me Suitable methyl phenyl silicone resins include KR255, KR311, KR300, and KR510 from Shin-Etsu Chemical Co., Ltd. Suitable methyl silicone resins include KR251, KR400, KR220L, KR242A, KR240, KR500, and KC89 from Shin-Etsu Chemical Co., Ltd. Also suitable are SR2400 and Trefil R910 from Toray Dow Corning Co., Ltd. Furthermore, silicone resins with a trifunctional T-unit content of 60 mol% or more may be used. Among these, silicone resins in which 50 mol% or more of the functional groups on Si are methyl groups are particularly suitable. It is desirable that at least one of the silicone oligomer and silicone resin contains phenyl groups. The presence of phenyl groups slightly softens the hardness of the resin, leading to suppression of film cracking and peeling.

[0021] The protective film composition according to this disclosure does not necessarily have to contain conductive particles, but if conductive particles are included, the effect of lowering the terminal voltage when constant current control is performed can be obtained. Therefore, the protective film composition may contain conductive particles. Suitable conductive particles include conductive carbon-based particles such as conductive carbon black and carbon nanotubes.

[0022] <Composition ratio> Furthermore, silicone oligomers, silicone resins, epoxy, and conductive particles can be used within the following ranges. Assuming a total solid weight of 100 parts by weight of silicone oligomer, the amount of silicone resin is more than 10 parts by weight and less than 300 parts by weight. More preferably, it is 20 to 250 parts by weight, and most preferably 30 to 200 parts by weight. Too little silicone resin results in poor film-forming properties and insufficient film strength. On the other hand, too much resin results in a brittle film.

[0023] Furthermore, the epoxy is used in amounts greater than 10 parts by weight and less than 200 parts by weight, with the total solid content of the silicone oligomer and silicone resin being 100 parts by weight. More preferably, it is 20 to 180 parts by weight, and most preferably 30 to 150 parts by weight. Note that the weight of the epoxy curing catalyst is not included in the total solid content of the epoxy, as only a small amount of the curing catalyst is used. If there is too little epoxy, adhesion cannot be ensured, and if there is too much, the film will be weakened overall due to the excessive number of organic groups, and the three-dimensional Si-O-Si network will be weakened, making it impossible to ensure sufficient film strength and chemical resistance.

[0024] Furthermore, the conductive particles are present in amounts of 0 to 15 parts by weight, more preferably 2 to 15 parts by weight, and most preferably 4 to 15 parts by weight, based on 100 parts by weight of the total solid content of the silicone oligomer, silicone resin, and epoxy. The solvent can be an aromatic hydrocarbon solvent such as toluene or xylene, a carboxylic acid ester solvent such as ethyl acetate or butyl acetate, or a ketone solvent such as methyl ethyl ketone or methyl isobutyl ketone. The solvent may be used to achieve a viscosity that is easy to handle when applying the protective film composition. Adding conductive particles can reduce the resistance during electrolysis; that is, the voltage can be reduced in the case of constant current control. On the other hand, adding too many conductive particles will make the film brittle.

[0025] The protective film composition is prepared by mixing and dispersing the above materials, and then applying it to a conductive substrate so that the film thickness after drying is 1 μm to 100 μm. After drying, the conductive substrate with the protective film is cured at 100°C to 250°C for 30 minutes to 3 hours to form the protective film. [Examples]

[0026] The following describes an example of the protective film composition according to this disclosure, in which a protective film 34 is formed on a catalyst layer 32 on a conductive substrate 30. Figure 1 shows a schematic diagram of the experimental apparatus for the example. Referring to Figure 1, the liquid to be treated 12 was placed in a container 10, and the anode 14 and cathode 16 were fixed in place with a portion of them immersed in the liquid to be treated 12. A constant current power supply 18 was placed between the anode 14 and cathode 16, and an ammeter 20 and a voltmeter 22 were placed therein.

[0027] A conductive substrate 30 forming the anode 14 was made of pure titanium (equivalent to JIS H4600-2) sheet material (20 mm x 100 mm x 2 mm). An alcohol solution containing a dissolved platinum salt was sprayed onto both sides of the conductive substrate 30 and baked at 200°C to form a catalyst layer 32. The catalyst layer 32, composed of platinum, was formed to a thickness of 2 μm. The conductive substrate 30 on which the catalyst layer 32 is formed will hereafter be referred to as the "catalyst-coated substrate".

[0028] A protective film composition (paint) prepared according to the following mixing ratio was sprayed onto the catalyst-coated substrate to form a protective film 34 over the entire surface. The thickness of the protective film 34 after drying was 10 μm. After drying, it was cured at 200°C for 1 hour. The catalyst-coated substrate on which the protective film 34 has been formed is called a "catalyst substrate with protective film".

[0029] A test simulated treatment solution 12 was prepared as the treatment solution 12, consisting of 10% sulfuric acid and 4% hydrogen peroxide (each in weight ratio).

[0030] A catalyst substrate with a protective film was immersed as the anode 14 and a titanium plate as the cathode 16 in a test simulated treatment solution 12, and the electrodes were fixed with a distance L between the opposing surfaces of 30 mm. Each electrode was connected to a constant current power supply 18, and the current density was 30 A / dm². 2 The settings were adjusted to achieve this, and constant current control was performed.

[0031] Durability evaluation was conducted as follows. (1) Stop the electrolysis every 0.5 hours, remove the electrodes and air dry them, (2) The test was performed by visual inspection and by comparing the condition with that before the test using a microscope. (3) If there is no change from the condition after application, it is considered OK, and the test is continued. The time at which the protective film peels off (NG) is taken as the durability time of the protective film. Protective film peeling includes not only cases where the protective film is visibly peeled off, but also cases where the thickness of the protective film decreases to the point where the underlying catalyst layer is approximately half visible.

[0032] Figure 2 shows a surface photograph. This is a 400x magnification image of the substrate surface taken with a shape-measuring laser microscope (VK-X1100, manufactured by Keyence Corporation). Figure 2(a) is a surface photograph of the catalyst-coated substrate. Fine powder resembling charcoal is observed on the titanium substrate. Figure 2(b) shows the state of the catalyst substrate with a protective film. The protective film covers the entire surface of the catalyst. Figure 2(c) is a surface photograph of the catalyst substrate with a protective film after it failed the durability test. Approximately half of the black underlying catalyst layer is exposed. This was evaluated by visual inspection. In this disclosure, constant current control was performed, and the time it took for the inter-electrode voltage to become more than twice the initial state was defined as the durability time.

[0033] <Composition> Two types of silicone oligomers were prepared: KR500 and KR510 (manufactured by Shin-Etsu Chemical Co., Ltd.). KR500 has a weight-average molecular weight of approximately 3,000 to 10,000 and contains methoxy groups in its skeleton. KR510 has a weight-average molecular weight of approximately 3,000 and contains methoxy groups in its skeleton.

[0034] Two types of silicone resin were prepared: KR251 and KR311 (manufactured by Shin-Etsu Chemical Co., Ltd.). KR251 has a weight-average molecular weight of 3 to 4 million. KR311 has a weight-average molecular weight of approximately 30,000.

[0035] The epoxy used was KBM403 (manufactured by Shin-Etsu Chemical Co., Ltd.), KR516 (manufactured by Shin-Etsu Chemical Co., Ltd.), and X-40-2669 (manufactured by Shin-Etsu Chemical Co., Ltd.). The conductive carbon used was 9538BLACK (manufactured by Tokushiki Co., Ltd.). Although some of the raw materials already contain solvents, they may be diluted with solvents such as ethyl acetate to achieve a viscosity that is easy to apply to electrodes. In this disclosure, the amount of solvent was 130 to 230 parts by weight per 100 parts by weight of the total solid content of the protective film composition. Furthermore, D20 (manufactured by Shin-Etsu Chemical Co., Ltd.) was added as a curing catalyst for the silicone.

[0036] The raw materials, silicone oligomer, silicone resin, epoxy, and conductive carbon (which can be used as a curing catalyst or optional additive), were mixed with a solvent to create a mixture. This mixture was then thoroughly stirred and dispersed using a disperser. The resulting paste was used as the protective film composition coating. Furthermore, the protective film composition coating was applied and then dried to obtain the protective film composition.

[0037] In addition, acrylic resin (52-668BA: manufactured by DIC Corporation) and melamine resin (L-145-60: manufactured by DIC Corporation) were prepared as comparative examples.

[0038] The composition and evaluation results of each example sample (protective coating) are shown in Tables 1 and 2. The composition and evaluation results of the comparative example sample (protective coating) are shown in Table 3.

[0039] [Table 1]

[0040] [Table 2]

[0041] [Table 3]

[0042] Table 1 shows "◆Formulation (g)", "◆Formulation (Relative)", and "◆Evaluation". "◆Formulation (g)" represents the actual weighed weight. The solid content of each material is shown in "%". "◆Formulation (Relative)" is calculated by setting the total solid weight of the oligomer to 100 (oligomer * ), resin * This represents the weight percentage (%) of the oligomer relative to the total solids weight. * This represents the weight percentage (%) of the oligomer and resin relative to the total solids weight. * The calculation does not include the curing catalyst. Also, solvent *represents the weight percentage (%) of all solvents (ethyl acetate and other solvents) added relative to the total solid content of the materials used. In Comparative Example 5, there is no silicone oligomer and silicone resin, so the relative expression of epoxy (25 ** ), it is defined as the weight percentage (%) of epoxy relative to the total solid weight of the acrylic resin and melamine resin.

[0043] Referring to Tables 1 to 3, Examples 1 to 4 are coating compositions for protective films according to the present disclosure. The protective films formed from these coating compositions all exhibited an endurance time of 8 hours or more. Further, Examples 5 to 16 are also coating compositions for protective films according to the present disclosure. The protective films formed from these coating compositions exhibited the following properties.

[0044] Example 1 is obtained by increasing the proportion of the resin in Comparative Example 1. The endurance time of Example 1 was +6 hours longer (endurance time became longer) than that of Comparative Example 1. Therefore, with respect to 100 parts by weight of the oligomer, when the proportion of the resin is in the range of 10 parts by weight to 100 parts by weight, the protective effect increased as the proportion increased.

[0045] Example 2 is obtained by using a combination of methyl silicone resin and methylphenyl silicone resin in place of the resin used in Example 1. The endurance time of Example 2 was +2 hours longer than that of Example 1. Therefore, when the resin has a phenyl group, the protective effect is further improved.

[0046] Example 3 is obtained by adding conductive particles to Example 2. The endurance time of Example 3 was +2 hours longer than that of Example 2. Therefore, the addition of conductive particles further improves the protective effect.

[0047] Example 4 is obtained by using a combination of methyl silicone resin and methylphenyl silicone resin in place of the oligomer used in Example 1. The endurance time of Example 4 was +1 hour longer than that of Example 1. Therefore, when the oligomer has a phenyl group, the protective effect is improved.

[0048] Example 5 is obtained by adding conductive particles to Example 4. The durability time of Example 5 was +1 hour compared to Example 4. Therefore, the protective effect was improved by adding conductive particles.

[0049] Example 6 uses the oligomer from Example 2 in combination with methyl silicone resin and methylphenyl silicone resin. The durability time of the protective film composition according to Example 6 was 2 hours longer than that of Example 2. Therefore, the protective effect was further enhanced by the presence of a phenyl group in the oligomer.

[0050] Example 7 involves increasing the proportion of conductive particles in Example 3 and adding conductive particles to Example 2. The durability time of Example 7 was -1 hour compared to Example 3 and +1 hour compared to Example 2. From this, it can be said that there is an upper limit to the proportion of conductive particles, as the effect decreased when the proportion of conductive particles was increased. Also, the protective effect was improved by adding conductive particles.

[0051] Example 8 involved reducing the proportion of conductive particles compared to Example 3 and adding conductive particles to Example 2. The durability time of Example 8 was -1 hour compared to Example 3 and +1 hour compared to Example 2. From a comparison of Examples 7 and 8 with Example 3, it can be said that the optimal value for the proportion of conductive particles is lower than 15%. Furthermore, the protective effect was improved by adding conductive particles.

[0052] Example 9 was obtained by reducing the resin proportion of Example 1 and increasing the resin proportion of Comparative Example 1. The durability time of Example 9 was -3 hours compared to Example 1 and +3 hours compared to Comparative Example 1. Therefore, it can be said that it is desirable for the resin proportion to be greater than 10 parts by weight per 100 parts by weight of the total solid content of the oligomer.

[0053] Example 10 increased the resin proportion of Example 1 and decreased the resin proportion of Comparative Example 2. The durability time of Example 10 was -2 hours compared to Example 1 and +4 hours compared to Comparative Example 2. Therefore, it can be said that it is desirable for the resin proportion to be less than 300 parts by weight per 100 parts by weight of the total solid content of the oligomer.

[0054] Example 11 involved reducing the proportion of epoxy compared to Example 1 and increasing the proportion of epoxy compared to Comparative Example 3. The durability time of Example 11 was -2 hours compared to Example 1 and +5.5 hours compared to Comparative Example 3. Therefore, it can be said that it is desirable for the proportion of epoxy to be greater than 10 parts by weight per 100 parts by weight of the total solid content of the oligomer and resin.

[0055] Example 12 increased the proportion of epoxy compared to Example 1 and decreased the proportion of epoxy compared to Comparative Example 4. The durability time of Example 12 was -2 hours compared to Example 1 and +3 hours compared to Comparative Example 4. Therefore, it can be said that it is desirable for the proportion of epoxy to be less than 200 parts by weight per 100 parts by weight of the total solid content of the oligomer and resin.

[0056] Example 13 is a variation in which the epoxy used in Example 2 is replaced with an epoxy containing multiple epoxy groups. The durability time of Example 13 was +1 hour compared to Example 2. Therefore, the protective effect was improved by using an epoxy containing multiple epoxy groups.

[0057] Example 14 is obtained by adding conductive particles to Example 13. The durability time of Example 14 was 4 hours longer than that of Example 13. Therefore, the protective effect was further improved by adding conductive particles.

[0058] Example 15 is a variation of Example 13 in which the type of epoxy containing multiple epoxy groups was changed. The durability time of Example 15 was equivalent to that of Example 13.

[0059] Example 16 is obtained by adding conductive particles to Example 15. The durability time of Example 16 was increased by 3 hours compared to Example 15. Therefore, the protective effect was further enhanced by adding conductive particles. As described above, although there were differences in the durability time of Examples 1 to 16, all showed a durability time of 5 hours or more.

[0060] On the other hand, the durability time for all of the comparative examples was 3 hours or less. Comparative Example 1 is an example where the amount of silicone resin is too small. Comparative Example 2 is an example where the amount of silicone resin is too large. From this, it can be said that the amount of silicone resin should be more than 10 parts by weight and less than 300 parts by weight relative to the total weight of the oligomer.

[0061] Comparative Example 3 is an example where the amount of epoxy is small, and Comparative Example 4 is an example where the amount of epoxy is large. From this, it can be said that the amount of epoxy should be more than 10 parts by weight and less than 200 parts by weight, based on a total of 100 parts by weight of silicone oligomer and silicone resin. In particular, Comparative Example 3, where the amount of epoxy is small, only maintained the protective film for 30 minutes, which shows that epoxy is important.

[0062] Comparative Example 5 is an example without oligomers and resin. In Comparative Example 5, the protective film peeled off after 30 minutes. This shows that the presence of silicone is important for maintaining the protective film in environments that are highly damaging to protective films, such as those containing strong acids and hydrogen peroxide. [Industrial applicability]

[0063] The protective film composition according to this disclosure can be suitably used as a protective film composition for electrodes when electrolyzing a liquid to be treated that contains strong acids and hydrogen peroxide, and can also be suitably used in situations where a material to be protected needs to be protected from the environment in harsh environments such as strong acids and oxidizing atmospheres. [Explanation of Symbols]

[0064] 10 containers 12. Liquid to be treated 14 Anode 16 Cathode 18 Constant current power supply 20 ammeter 22 Voltmeter 30 Conductive substrate 32 Catalyst layer 34 Protective film

Claims

1. A silicone oligomer having an organic group bonded to a main skeleton formed by siloxane bonds, with a weight-average molecular weight of 1000 or more and 10000 or less, wherein the organic group contains an alkoxy group and a methyl group, and does not contain an epoxy group. A silicone resin having a siloxane skeleton, a weight-average molecular weight of 30,000, having methyl and phenyl groups but no epoxy groups, or a weight-average molecular weight of 3 million to 4 million, having methyl groups but no epoxy groups, and at least one of these, The silicone compound contains a siloxane skeleton or an Si-O bond and an epoxy group. The silicone resin is contained in an amount greater than 10 parts by weight and less than 300 parts by weight relative to 100 parts by weight of the silicone oligomer. A protective film composition comprising, in an amount of more than 10 parts by weight and less than 200 parts by weight of the epoxy group-containing silicone compound per 100 parts by weight of the total of the silicone oligomer and the silicone resin.

2. The protective film composition according to claim 1, wherein at least one of the silicone oligomer and the silicone resin has a phenyl group.

3. The protective film composition according to claim 1 or 2, wherein the silicone compound containing the epoxy group contains a plurality of epoxy groups.

4. The protective film composition according to claim 1 or 2, further comprising conductive particles.

5. The protective film composition according to claim 4, wherein the conductive particles are in an amount of 2 to 15 parts by weight relative to the total solid weight of the silicone oligomer, the silicone resin, and the silicone compound containing the epoxy group.

6. A silicone oligomer having an organic group bonded to a main skeleton formed by siloxane bonds, with a weight-average molecular weight of 1000 or more and 10000 or less, wherein the organic group contains an alkoxy group and a methyl group, and does not contain an epoxy group. A silicone resin having a siloxane skeleton, a weight-average molecular weight of 30,000, having methyl and phenyl groups but no epoxy groups, or a weight-average molecular weight of 3 million to 4 million, having methyl groups but no epoxy groups, and at least one of these, A step of mixing a silicone compound containing a siloxane skeleton or an epoxy group having an Si-O bond and an epoxy group with a solvent to obtain a mixture, The process includes dispersing the aforementioned mixture to obtain a protective film composition, In the aforementioned mixture, The aforementioned silicone resin is More than 10 parts by weight relative to 100 parts by weight of the aforementioned silicone oligomer, It is within the range of less than 300 parts by weight. The silicone compound containing the epoxy group is A total of 100 parts by weight of the silicone oligomer and the silicone resin In contrast, the range is more than 10 parts by weight and less than 200 parts by weight. The solvent is in the range of 130 to 230 parts by weight per 100 parts by weight of total solids. A method for producing a protective film composition.

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