Composition for forming release layer, and release layer

Abstract

As a composition for forming a release layer, which yields a release layer that exhibits high heat resistance and suitable release properties and exhibits excellent stability following film formation, the present invention provides a composition for forming a release layer, which contains: (A) a hydroxyalkyl group-containing cellulose (A1) or a derivative thereof, or the like; (B) an acid compound or a salt thereof; (C) a crosslinking agent selected from among compounds having a nitrogen atom substituted with a hydroxyalkyl group and / or an alkoxymethyl group; (D) a polymer additive containing repeating units represented by formula (a1), formula (b) and formula (c); and (E) a solvent, and in which component (D) is contained at a quantity of 5-100 parts by mass relative to 100 parts by mass of component (A). (RA is a hydrogen atom or a methyl group, RB1 is a branched alkyl group which has 3 or 4 carbon atoms and in which at least one hydrogen atom is substituted with a fluorine atom, RC is a hydroxyalkyl group having 1-10 carbon atoms, and RD is a polycyclic alkyl group having 6-20 carbon atoms or an aryl group having 6-12 carbon atoms.)

Description

Release layer-forming composition and release layer

[0001] The present invention relates to a composition for forming a release layer and a release layer.

[0002] In recent years, electronic devices have been required to be thin, lightweight, and flexible, which has led to the need to use lightweight, flexible plastic substrates instead of conventional glass substrates, which are heavy, fragile, and inflexible.

[0003] In particular, new generation displays require the development of active matrix full-color TFT display panels using lightweight flexible plastic substrates (hereinafter also referred to as resin substrates). For touch panel displays, materials that support flexibility, such as transparent electrodes and resin substrates for touch panels used in combination with display panels, have been developed. For transparent electrodes, alternative transparent electrode materials have been proposed, replacing the conventionally used ITO, such as bendable transparent conductive polymers such as PEDOT, metal nanowires, and mixtures thereof (Patent Documents 1 to 4).

[0004] Meanwhile, the substrate of touch panel films has also changed from glass to sheets made of plastics such as polyethylene terephthalate (PET), polyimide, cycloolefin, and acrylic, and transparent flexible touch screen panels with flexibility have been developed (Patent Documents 5 to 7).

[0005] Generally, flexible touch screen panels are produced by forming a release (adhesive) layer on a support substrate such as a glass substrate, and then peeling it off after fabricating the device, in order to ensure stable production and peeling (Patent Document 8). This release layer must not peel off from the support substrate during the process, but requires low peeling force when peeling. Furthermore, to improve productivity, the release layer must be stored in film form for a long period of time after deposition. Therefore, the release layer must be stable after deposition.

[0006] International Publication No. 2012 / 147235 JP 2009-283410 A JP 2010-507199 A JP 2009-205924 A JP 2017 / 002664 JP 2016 / 160338 JP 2015-166145 A JP 2016-531358 A

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a composition for forming a release layer that has high heat resistance and appropriate release properties and can provide a release layer that has excellent stability after film formation.

[0008] As a result of extensive research to achieve the above-mentioned object, the inventors have found that a composition for forming a release layer comprising (A) (A1) cellulose or a derivative thereof having a hydroxyalkyl group, (A2) polyester having a hydroxy group, or (A3) an acrylic polymer having a primary or secondary hydroxy group, (B) an acid compound or a salt thereof, (C) a crosslinking agent selected from compounds having a nitrogen atom substituted with a hydroxyalkyl group and / or an alkoxymethyl group, (D) a polymer additive containing a predetermined repeating unit, and (E) a solvent, can reproducibly provide a release layer having high heat resistance, excellent adhesion to the substrate, adequate adhesion to the resin substrate, and adequate releasability, and have completed the present invention.

[0009] That is, the present invention provides: 1. A composition for forming a release layer, comprising: (A) (A1) cellulose or a derivative thereof having a hydroxyalkyl group, (A2) polyester having a hydroxy group, or (A3) an acrylic polymer having a primary or secondary hydroxy group and no fluorine atom, (B) an acid compound or a salt thereof, (C) a crosslinking agent selected from compounds having a nitrogen atom substituted with a hydroxyalkyl group and / or an alkoxymethyl group, (D) a polymer additive including a repeating unit represented by the following formula (a1), a repeating unit represented by the following formula (b), and a repeating unit represented by the following formula (c), and (E) a solvent, wherein the polymer additive (D) is contained in an amount of 5 to 100 parts by mass per 100 parts by mass of the component (A), (In the formula, R A are each independently a hydrogen atom or a methyl group, and R B1is a branched alkyl group having 3 or 4 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, and R C is a hydroxyalkyl group having 1 to 10 carbon atoms, and R D is a polycyclic alkyl group having 6 to 20 carbon atoms or an aryl group having 6 to 12 carbon atoms.) 2. In the repeating unit represented by formula (b), R C is a hydroxyalkyl group having 2 to 10 carbon atoms, and the carbon atom to which the hydroxy group is bonded is a secondary or tertiary carbon atom; 3. The composition for forming a release layer according to 1, wherein in the repeating unit represented by formula (b), R C is a hydroxyalkyl group having 1 to 10 carbon atoms, the carbon atom to which the hydroxy group is bonded is a primary carbon atom, and the content of repeating units represented by formula (a1) is 25 mol % or more of all repeating units of the polymer additive (D); 4. A composition for forming a release layer according to 1, wherein the polymer additive (D) contains a repeating unit represented by the following formula (a2), a repeating unit represented by the following formula (b), a repeating unit represented by the following formula (c), and a repeating unit represented by the following formula (d); (In the formula, R A , R C and R D has the same meaning as above, and R B2 is a branched alkyl group having 3 or 4 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, but does not include a 2-methyl-1,1,1,3,3,3-hexafluoroisopropyl group, and R E is a single bond, a polycyclic alkylene group having 6 to 20 carbon atoms, or an arylene group having 6 to 12 carbon atoms, and R F is a single bond or an alkylene group having 1 to 10 carbon atoms, and R Gis a methyl group, an ethyl group, or a hydroxy group.) 5. A release layer-forming composition according to any one of 1 to 4, wherein the component (A1) is at least one selected from the group consisting of hydroxyethyl cellulose, hydroxypropyl cellulose, and derivatives thereof; 6. A release layer-forming composition according to any one of claims 1 to 4, wherein the component (A2) is a polyester having an aromatic group or an alicyclic group in its main chain; 7. A release layer-forming composition according to any one of 1 to 4 and 6, wherein the component (A2) is a polyester obtained by reacting a compound having two epoxy moieties with a compound having two carboxy groups; 8. A release layer-forming composition according to any one of 1 to 4, wherein the component (A3) is an acrylic polymer having a polyethylene glycol ester group or a primary or secondary hydroxyalkyl ester group having 2 to 6 carbon atoms; 9. A release layer-forming composition according to any one of 1 to 4 and 8, wherein the component (A3) is an acrylic polymer having a primary or secondary hydroxyalkyl group having 2 to 6 carbon atoms in its side chain; 10. 10. A release layer-forming composition according to any one of 1 to 9, wherein the component (B) is a sulfonic acid compound or a salt thereof; 11. A release layer-forming composition according to any one of 1 to 10, wherein the crosslinking agent (C) is a compound represented by any one of the following formulas (C-1) to (C-5); (In the formula, R 11 ~R 26 are each independently an alkyl group having 1 to 6 carbon atoms, and R 27 is a hydrogen atom or a methyl group.) 12. A release layer-forming composition as set forth in any one of 1 to 11, wherein the content of the (C) crosslinking agent is 10 to 100 parts by mass per 100 parts by mass of the (A) component; 13. A release layer obtained from the release layer-forming composition as set forth in any one of 1 to 12; 14. A laminate in which a resin layer having a light transmittance of 80% or more at a wavelength of 400 nm is laminated on the release layer as set forth in 13; 15. A method for producing a resin substrate, comprising the steps of applying the release layer-forming composition as set forth in any one of 1 to 12 to a base to form a release layer, forming a resin substrate having a light transmittance of 80% or more at a wavelength of 400 nm on the release layer, and peeling the resin substrate with a peel force of 0.25 N / 25 mm or less.

[0010] By using the release layer-forming composition of the present invention, a release layer having high heat resistance, excellent adhesion to the substrate, moderate adhesion to the resin substrate, and moderate releasability can be reproducibly obtained. Furthermore, in the manufacturing process of a flexible electronic device, it becomes possible to separate the resin substrate from the substrate together with the circuitry formed thereon without damaging the resin substrate formed on the substrate or the circuitry formed thereon. Therefore, the release layer-forming composition of the present invention can contribute to speeding up the manufacturing process of a flexible electronic device having a resin substrate and improving its yield.

[0011] [Composition for forming a release layer] The composition for forming a release layer of the present invention comprises (A) (A1) cellulose or a derivative thereof having a hydroxyalkyl group, (A2) polyester having a hydroxy group, or (A3) an acrylic polymer having a primary or secondary hydroxy group and no fluorine atom, (B) an acid compound or a salt thereof, (C) a crosslinking agent selected from compounds having a nitrogen atom substituted with a hydroxyalkyl group and / or an alkoxymethyl group, (D) a polymer additive containing a predetermined repeating unit, and (E) a solvent.

[0012] [(A) (A1) Cellulose or derivative thereof having a hydroxyalkyl group, (A2) polyester having a hydroxy group, or (A3) acrylic polymer having a primary or secondary hydroxy group and no fluorine atom] [(A1) Cellulose or derivative thereof] The component (A1) is cellulose or a derivative thereof having a hydroxyalkyl group.

[0013] Examples of the component (A1) include hydroxyalkyl celluloses such as hydroxyethyl cellulose and hydroxypropyl cellulose, hydroxyalkyl alkyl celluloses such as hydroxyethyl methyl cellulose, hydroxypropyl methyl cellulose and hydroxyethyl ethyl cellulose, and derivatives thereof. Among these, in the present invention, hydroxyalkyl celluloses and derivatives thereof are preferred, and hydroxyethyl cellulose and hydroxypropyl cellulose, and derivatives thereof are more preferred. The cellulose or derivative thereof having a hydroxyalkyl group (A1) may be used alone or in combination of two or more.

[0014] The weight-average molecular weight (Mw) of component (A1) is not particularly limited, but is preferably 1,000 to 500,000, more preferably 3,000 to 400,000, and even more preferably 5,000 to 300,000. The weight-average molecular weight is a value measured by gel permeation chromatography (GPC) relative to polystyrene standards (the same applies hereinafter).

[0015] [(A2) Polyester Having a Hydroxy Group] The polyester having a hydroxy group of the component (A2) is not particularly limited, but in the present invention, it is preferable that the polyester has an aromatic group or an alicyclic group in the main chain.

[0016] The polyester of component (A2) is preferably a polyester obtained by reacting a compound having two epoxy moieties with a compound having two carboxy groups.

[0017] There are no particular restrictions on the weight average molecular weight (Mw) of the polyester of component (A2), but it is preferably 1,000 to 200,000, more preferably 3,000 to 100,000, and even more preferably 5,000 to 50,000.

[0018] <Epoxy Compound> Examples of the compound having two epoxy moieties described above include bisphenol diglycidyl ethers such as bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, bisphenol B diglycidyl ether, bisphenol AD ​​diglycidyl ether, bisphenol S diglycidyl ether, tetrachlorobisphenol A diglycidyl ether, catechin diglycidyl ether, resorcinol diglycidyl ether, hydroquinone diglycidyl ether, 1,5-dihydroxynaphthalene diglycidyl ether, dihydroxybiphenyl diglycidyl ether, octachloro-4,4'-dihydroxybiphenyl diglycidyl ether, tetramethylbiphenyl diglycidyl ether, 9,9'-bis(4-hydroxyphenyl)furodienyl glycidyl ether, 9,9'-bis(4-hydroxyphenyl)furodienyl glycidyl ether, and 9,9'-bis(6-hydroxy-2-naphthyl)furodienyl glycidyl ether; Aliphatic diol diglycidyl ethers such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tetramethylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and neopentyl glycol diglycidyl ether; alicyclic diol diglycidyl ethers such as cyclohexanediol diglycidyl ether, cyclohexanedimethanol diglycidyl ether, dicyclopentadienediol diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol B diglycidyl ether, and hydrogenated bisphenol S diglycidyl ether; aromatic dicarboxylic acid diglycidyl esters such as phthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, and terephthalic acid diglycidyl ester; Alicyclic dicarboxylic acid diglycidyl esters such as bisglycidyl oxalate, bisglycidyl adipate, bisglycidyl pimelate, and bisglycidyl 2-ethyl-3-propyl-1,5-pentanedioate;Resins having epoxy groups at both ends, such as bisphenol A type epoxy resin jER828 (trade name, manufactured by Mitsubishi Chemical Corporation), terephthalate type epoxy resin Denacol EX711 (trade name, manufactured by Nagase ChemteX Corporation), biphenyl type epoxy resin YX4000H (trade name, manufactured by Mitsubishi Chemical Corporation), fluorene type epoxy resin OGSOL PG-100 (trade name, manufactured by Osaka Gas Chemicals Co., Ltd.), fluorene type epoxy resin OGSOL CG-500 (trade name, manufactured by Osaka Gas Chemicals Co., Ltd.), and cyclohexyl type epoxy resin CEL2021P (trade name, manufactured by Daicel Corporation); alicyclic dioxides such as vinylcyclohexene dioxide, limonene dioxide, dicyclopentadiene dioxide, tetrahydroindene dioxide, Epocalic (registered trademark of ENEOS Corporation) THI-DE, Epocalic (registered trademark of ENEOS Corporation) DE-102, and Epocalic (registered trademark of ENEOS Corporation) DE-103; Examples of the compound include compounds having two 3,4-epoxycyclohexyl groups, such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2,2-bis(3,4-epoxycyclohexyl)propane, bis(3,4-epoxycyclohexylmethyl) oxalate, bis(3,4-epoxycyclohexylmethyl) adipate, bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate, bis(3,4-epoxycyclohexylmethyl) pimelate, and bis(3,4-epoxycyclohexylmethyl) 2-ethyl-3-propyl-1,5-pentanedioate. These compounds may be used alone or in combination of two or more.

[0019] <Carboxy Group-Containing Compound> Examples of compounds having two carboxy groups include terephthalic acid, isophthalic acid, diphenic acid, 2-methyl terephthalic acid, 2-hydroxy terephthalic acid, 2,5-dimethyl terephthalic acid, 5-methyl isophthalic acid, 5-hydroxy isophthalic acid, 2,6-naphthalenedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, etc. These compounds may be used alone or in combination of two or more.

[0020] The method for obtaining the polyester, which is an example of component (A2), is not particularly limited, but it can be obtained, for example, by a polymerization reaction in a solvent containing the above-mentioned ester compound, carboxy group-containing compound, and catalyst at a temperature of 50 to 150° C. The solvent used in this case is not particularly limited as long as it dissolves the respective compounds, the polymerization initiator, etc.

[0021] The polyester of component (A2) obtained by the above method is usually in the form of a solution dissolved in a solvent.

[0022] The polyester of component (A2) is preferably one having a structural unit represented by the following formula [A2-1].

[0023] (In the formula, X and Y each independently represent a structure having an aromatic group or an alicyclic group.)

[0024] The X is preferably a group represented by the following formula (X-1).

[0025]

[0026] In the ceremony, L 1 represents an ether bond or an ester bond, and X 1 represents an alkylene group having 1 to 10 carbon atoms, a cyclic unsaturated hydrocarbon group, or a cyclic saturated hydrocarbon group; R 1 represents a single bond, an ether bond, carbonyl, sulfonyl, a saturated hydrocarbon group having 1 to 30 carbon atoms, an unsaturated hydrocarbon group having 2 to 30 carbon atoms, or a saturated hydrocarbon group having 1 to 30 carbon atoms substituted with a fluorine atom, and p represents 0, 1, or 2.

[0027] The X 1 is preferably a cyclic unsaturated hydrocarbon group having 4 to 16 carbon atoms or a cyclic saturated hydrocarbon group having 4 to 16 carbon atoms, more preferably a cyclic unsaturated hydrocarbon group having 4 to 8 carbon atoms or a cyclic saturated hydrocarbon group having 4 to 8 carbon atoms. 1 Any hydrogen atoms contained in may be independently substituted with an aliphatic group, and a plurality of substituents among these aliphatic groups may be bonded to each other to form a 4- to 6-membered ring.

[0028] Specific examples of X include groups represented by the following formulae (X-2) to (X-13), but are not limited thereto.

[0029] (In the formula, * represents a bond.)

[0030] The X is also preferably a structure derived from the resin having epoxy groups at both ends.

[0031] Examples of Y include, but are not limited to, groups represented by the following formulae (Y-1) to (Y-4).

[0032] (In the formula, * represents a bond.)

[0033] The polyester of component (A2) is also preferably one having a structural unit represented by the following formula [A2-2].

[0034]

[0035] In the formula, Cy represents a group derived from the alicyclic dioxide, i.e., a tetravalent organic group containing an aliphatic ring, in which all four bonding groups to OH and O come from the aliphatic ring, and Y has the same definition as Y in formula [A2-1].

[0036] Specific examples of Cy in formula [A2-2] include groups represented by the following formulae (Cy-1) to (Cy-4).

[0037] (In the formula, *1 and *2 each represent a bond, and one of the two *1 and *2 in each structural formula is bonded to a hydroxyl group.)

[0038] The polyester of component (A2) is also preferably one having a structural unit represented by the following formula [A2-3].

[0039]

[0040] In the formula, X and Y have the same definitions as X and Y in formula [A2-1].

[0041] Specific examples of X in formula [A2-3] include groups represented by the following formulae (X-Ch-1) to (X-Ch-3).

[0042] (In the formula, * represents a bond.)

[0043] [(A3) Acrylic Polymer] The acrylic polymer (A3) having a primary or secondary hydroxy group but no fluorine atom is not particularly limited. In the present invention, however, those having a polyethylene glycol ester group or a primary or secondary hydroxyalkyl ester group having 2 to 6 carbon atoms are preferred, and those having these groups in the side chain are more preferred. Examples of acrylic polymers that can be used include homopolymers of acrylic acid esters, homopolymers of methacrylic acid esters, copolymers thereof, and copolymers of these with monomers having unsaturated double bonds, such as styrene. The acrylic polymer having a polyethylene glycol ester group or a primary or secondary hydroxyalkyl ester group having 2 to 6 carbon atoms, which is a preferred example of the acrylic polymer of component (A3), may be an acrylic polymer having any of these groups, and is not particularly limited with respect to the main chain skeleton (other structural units) of the polymer constituting the acrylic polymer and the type of side chain.

[0044] As the structural unit having a polyethylene glycol ester group or a primary or secondary hydroxyalkyl ester group having 2 to 6 carbon atoms, those represented by the following formula [A3-1] are preferred.

[0045]

[0046] In the formula [A3-1], R A are each independently a hydrogen atom or a methyl group, and Y 1 is H-(OCH2CH2) n - group (where n is an integer of 2 to 30, preferably an integer of 2 to 10), or a primary or secondary hydroxyalkyl group having 2 to 6 carbon atoms.

[0047] There are no particular restrictions on the weight average molecular weight (Mw) of the acrylic polymer of component (A3), but it is preferably 1,000 to 200,000, more preferably 3,000 to 100,000, and even more preferably 5,000 to 50,000.

[0048] The acrylic polymer of component (A3) can be obtained, for example, by polymerizing a monomer having at least one of a polyethylene glycol group and a primary or secondary hydroxyalkyl group having 2 to 6 carbon atoms. Examples of monomers having a polyethylene glycol ester group include H—(OCH2CH2) n -OH (n has the same meaning as above). On the other hand, examples of monomers having a primary or secondary hydroxyalkyl group having 2 to 6 carbon atoms include 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl methacrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, glycerin monoacrylate, and glycerin monomethacrylate.

[0049] In this embodiment, when synthesizing the acrylic polymer of component (A3), monomers other than the above-mentioned monomers can be used in combination, as long as the effects of the present invention are not impaired. Specifically, monomers that do not contain a polyethylene glycol ester group or a primary or secondary hydroxy group and that do not contain a fluorine atom can be used in combination. Examples of such monomers include acrylic acid ester compounds such as methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, and t-butyl acrylate; methacrylic acid ester compounds such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, and t-butyl methacrylate; maleimide compounds such as maleimide, N-methylmaleimide, N-phenylmaleimide, and N-cyclohexylmaleimide; acrylamide compounds; acrylonitrile; maleic anhydride; styrene compounds; and vinyl compounds.

[0050] There are no particular restrictions on the method for producing the acrylic polymer of component (A3) (polymerization method), but one example is a method in which the above-mentioned monomers, other monomers, and a polymerization initiator are dissolved in a solvent and subjected to a polymerization reaction at a temperature of 50 to 110° C. The solvent used is not particularly limited as long as it can dissolve the monomers, polymerization initiator, etc.

[0051] Suitable examples of the acrylic polymer of component (A3) include polymers obtained by polymerizing primary or secondary hydroxyalkyl ester monomers such as 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, glycerin monoacrylate, and glycerin monomethacrylate, as well as acrylic polymers having a primary or secondary hydroxyalkyl group in the side chain, such as polymers obtained by copolymerizing such primary or secondary hydroxyalkyl ester monomers with monomers other than these monomers, for example, one or more monomers selected from the group consisting of monomers not having a primary or secondary hydroxy group.

[0052] The acrylic polymer of component (A3) obtained by the above method is usually in the form of a solution dissolved in a solvent.

[0053] [(B) Acid Compound or Salt Thereof] The release layer-forming composition of the present invention contains an acid compound or a salt thereof as component (B). Specific examples of the acid compound include sulfonic acid compounds such as p-toluenesulfonic acid, trifluoromethanesulfonic acid, pyridinium p-toluenesulfonate, salicylic acid, camphorsulfonic acid, sulfosalicylic acid, 4-chlorobenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, benzenedisulfonic acid, 1-naphthalenesulfonic acid, and pyridinium 1-naphthalenesulfonic acid; and carboxylic acid compounds such as salicylic acid, sulfosalicylic acid, citric acid, benzoic acid, and hydroxybenzoic acid. Furthermore, examples of salts of the acid compounds include pyridinium salts, isopropanolamine salts, and N-methylmorpholine salts of the above-mentioned acids. Specific examples include pyridinium p-toluenesulfonate, pyridinium 1-naphthalenesulfonate, isopropanolamine p-toluenesulfonate, and N-methylmorpholine p-toluenesulfonate.

[0054] The content of component (B) is preferably 0.01 to 15 parts by mass, more preferably 0.1 to 10 parts by mass, per 100 parts by mass of component (A). When the content of component (B) is within this range, a composition can be obtained that has high heat resistance and adequate release properties and can provide a release layer that is excellent in stability after film formation. The acid compound (B) or salt thereof may be used alone or in combination of two or more.

[0055] [Crosslinking Agent (C)] The release layer-forming composition of the present invention contains, as component (C), a crosslinking agent selected from compounds having a nitrogen atom substituted with a hydroxyalkyl group and / or an alkoxymethyl group. This crosslinking agent is preferably a compound represented by any one of the following formulas (C-1) to (C-5):

[0056]

[0057] In each of the above formulas, R 11 ~R 26 are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, preferably an alkyl group having 1 to 6 carbon atoms. 27 is a hydrogen atom or a methyl group.

[0058] Specific examples of the crosslinking agent include nitrogen-containing compounds such as hexamethylolmelamine, tetramethylolbenzoguanamine, 1,3,4,6-tetramethylolglycoluril, hexamethoxymethylmelamine, tetramethoxymethylbenzoguanamine, 1,3,4,6-tetrakis(methoxymethyl)glycoluril, 1,3,4,6-tetrakis(butoxymethyl)glycoluril, and 1,3,4,6-tetrakis(hydroxymethyl)glycoluril.

[0059] Furthermore, in the present invention, commercially available crosslinking agents can also be used, and specific examples thereof include nitrogen-containing compounds such as methoxymethyl-type melamine compounds (trade names: Cymel (registered trademark) 300, Cymel 301, Cymel 303, Cymel 350), butoxymethyl-type melamine compounds (trade names: Mycoat (registered trademark) 506, Mycoat 508), glycoluril compounds (trade names: Cymel 1170, Powderlink 1174), methylated urea resins (trade names: UFR65), butylated urea resins (trade names: UFR300, U-VAN10S60, U-VAN10R, U-VAN11HV), and urea / formaldehyde resins (trade names: Beckamine (registered trademark) J-300S, Beckamine P-955, Beckamine N) manufactured by Allnex Corporation.

[0060] Furthermore, polymers produced using, as the crosslinking agent, (meth)acrylamide compounds substituted with hydroxymethyl groups or alkoxymethyl groups, such as N-hydroxymethyl(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-ethoxymethyl(meth)acrylamide, and N-butoxymethyl(meth)acrylamide, can also be used. Specific examples of such polymers include poly(N-butoxymethyl(meth)acrylamide), a copolymer of N-butoxymethyl(meth)acrylamide and styrene, a copolymer of N-hydroxymethyl(meth)acrylamide and methyl(meth)acrylate, a copolymer of N-ethoxymethylmethacrylamide and benzyl methacrylate, and a copolymer of N-butoxymethyl(meth)acrylamide, benzyl(meth)acrylate, and 2-hydroxypropyl(meth)acrylate.

[0061] Among these crosslinking agents, it is preferable to use hexamethoxymethylmelamine, tetramethoxymethylbenzoguanamine, 1,3,4,6-tetrakis(methoxymethyl)glycoluril (POWDERLINK 1174), 1,3,4,6-tetrakis(butoxymethyl)glycoluril, and 1,3,4,6-tetrakis(hydroxymethyl)glycoluril.

[0062] The crosslinking agent can undergo a crosslinking reaction by self-condensation and can also undergo a crosslinking reaction with the hydroxyl groups in the acrylic polymer of component (A). These crosslinking reactions strengthen the release layer that is formed and reduce its solubility in organic solvents.

[0063] The content of component (C) is preferably 10 to 100 parts by mass, more preferably 20 to 50 parts by mass, per 100 parts by mass of component (A). When the content of component (C) is within this range, a composition can be obtained that has high heat resistance and adequate release properties and can provide a release layer that is excellent in stability after film formation. The crosslinking agent (C) may be used alone or in combination of two or more types.

[0064] [(D) Polymer Additive] The release layer-forming composition of the present invention contains, as component (D), a polymer additive including a repeating unit represented by the following formula (a1), a repeating unit represented by the following formula (b), and a repeating unit represented by the following formula (c).

[0065]

[0066] In each of the above formulas, R A are each independently a hydrogen atom or a methyl group, and R B1 is a branched alkyl group having 3 or 4 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, and R C is a hydroxyalkyl group having 1 to 10 carbon atoms, and R D is a polycyclic alkyl group having 6 to 20 carbon atoms or an aryl group having 6 to 12 carbon atoms.

[0067] R B1 Specific examples of the branched alkyl group having 3 or 4 carbon atoms include isopropyl, isobutyl, sec-butyl, and tert-butyl groups. B1 is a group in which at least one hydrogen atom of these branched alkyl groups has been substituted with a fluorine atom, and specific examples thereof include 1,1,1-trifluoroisopropyl, 1,1,1,3,3,3-hexafluoroisopropyl, and nonafluorotert-butyl groups.

[0068] R CSpecific examples of the hydroxyalkyl group having 1 to 10 carbon atoms include hydroxymethyl, 2-hydroxyethyl, 3-hydroxypropyl, 4-hydroxybutyl, 5-hydroxypentyl, 6-hydroxyhexyl, 7-hydroxyheptyl, 8-hydroxyoctyl, 9-hydroxynonyl, 10-hydroxydecyl, 2-hydroxy-1-methylethyl, 2-hydroxy-1,1-dimethylethyl, 3-hydroxy-1-methylpropyl, 3-hydroxy-2-methylpropyl, 3-hydroxy-1,1-dimethylpropyl, 3-hydroxy-1,2-dimethylpropyl, 3-hydroxy-2,2-dimethylpropyl, 4-hydroxy-1-methylbutyl, 4-hydroxy-2- Examples of hydroxyalkyl groups include hydroxyalkyl groups having 1 to 10 carbon atoms, such as methylbutyl and 4-hydroxy-3-methylbutyl, in which the carbon atom to which the hydroxy group is bonded is a primary carbon atom; and hydroxyalkyl groups having 2 to 10 carbon atoms, such as 1-hydroxyethyl, 1-hydroxypropyl, 2-hydroxypropyl, 1-hydroxybutyl, 2-hydroxybutyl, 1-hydroxyhexyl, 2-hydroxyhexyl, 1-hydroxyoctyl, 2-hydroxyoctyl, 1-hydroxydecyl, 2-hydroxydecyl, 1-hydroxy-1-methylethyl, and 2-hydroxy-2-methylpropyl, in which the carbon atom to which the hydroxy group is bonded is a secondary or tertiary carbon atom.

[0069] R D Specific examples of the polycyclic alkyl group having 6 to 20 carbon atoms include 1-adamantyl, 2-adamantyl, isobornyl, and norbornyl groups, and specific examples of the aryl group having 6 to 12 carbon atoms include phenyl, 1-naphthyl, 2-naphthyl, 1-biphenylyl, and 2-biphenylyl groups.

[0070] Furthermore, the polymer additive (D) may contain a repeating unit represented by the following formula (a2), a repeating unit represented by the following formula (b), a repeating unit represented by the following formula (c), and a repeating unit represented by the following formula (d).

[0071] (In the formula, R A , R C and R Drepresents the same meaning as above.)

[0072] R B2 R is a branched alkyl group having 3 or 4 carbon atoms in which at least one hydrogen atom has been substituted with a fluorine atom (excluding 2-methyl-1,1,1,3,3,3-hexafluoroisopropyl group), and examples of this fluorine-containing alkyl group include the same groups as those exemplified above. E is a single bond, a polycyclic alkylene group having 6 to 20 carbon atoms, or an arylene group having 6 to 12 carbon atoms, and R F is a single bond or an alkylene group having 1 to 10 carbon atoms, and R G is a methyl group, an ethyl group, or a hydroxy group.

[0073] R E Examples of the polycyclic alkylene group having 6 to 20 carbon atoms include groups in which one hydrogen atom has been removed from the specific examples of the polycyclic alkyl group having 6 to 20 carbon atoms described above, such as adamantylene, isobornylene, and norbornylene groups. E Examples of the arylene group having 6 to 12 carbon atoms include groups in which one hydrogen atom has been removed from the specific examples of the aryl group having 6 to 12 carbon atoms, such as phenylene, naphthylene, and biphenylylene groups.

[0074] R F Specific examples of the alkylene group having 1 to 10 carbon atoms include methylene, ethylene, trimethylene, propylene, tetramethylene, pentamethylene, hexamethylene, heptamethylene, octamethylene, nonamethylene, decamethylene, etc. Among these, alkylene groups having 1 to 5 carbon atoms are preferred, with methylene and ethylene groups being more preferred, and methylene groups being even more preferred.

[0075] Examples of the repeating unit represented by formula (a1) or (a2) include, but are not limited to, those represented by the following formulas (a-1) to (a-3). A represents the same meaning as above (the same applies below).

[0076]

[0077] Examples of the repeating unit represented by formula (b) include, but are not limited to, those represented by the following formulas (b-1) to (b-16).

[0078]

[0079] Examples of the repeating unit represented by formula (c) include, but are not limited to, those represented by the following formulas (c-1) to (c-13).

[0080]

[0081] Examples of the repeating unit represented by formula (d) include, but are not limited to, those represented by the following formulas (d-1) to (d-8).

[0082]

[0083] In the present invention, when the polymer additive (D) comprises a repeating unit represented by formula (a1), a repeating unit represented by formula (b), and a repeating unit represented by formula (c), and the carbon atom to which the hydroxy group in the hydroxyalkyl group in the repeating unit represented by formula (b) is bonded is a secondary or tertiary carbon atom (hereinafter, such a polymer additive will be referred to as polymer additive D1), the content of the repeating unit represented by formula (a1) is preferably 30 to 60 mol %, and more preferably 35 to 50 mol %, of all repeating units, the content of the repeating unit represented by formula (b) is preferably 10 to 35 mol %, and more preferably 15 to 30 mol %, of all repeating units, and the content of the repeating unit represented by formula (c) is preferably 5 to 60 mol %, and more preferably 20 to 50 mol %, of all repeating units.

[0084] On the other hand, when the polymer additive (D) comprises a repeating unit represented by formula (a1), a repeating unit represented by formula (b), and a repeating unit represented by formula (c), and the carbon atom to which the hydroxy group in the hydroxyalkyl group in the repeating unit represented by formula (b) is bonded is a primary carbon atom (hereinafter, such a polymer additive will be referred to as polymer additive D2), the content of the repeating unit represented by formula (a1) is preferably 15 to 60 mol%, more preferably 25 to 60 mol%, even more preferably 30 to 60 mol%, and still more preferably 35 to 50 mol%, of all repeating units; the content of the repeating unit represented by formula (b) is preferably 8 to 38 mol%, more preferably 10 to 38 mol%, even more preferably 10 to 35 mol%, and still more preferably 15 to 30 mol% of all repeating units; and the content of the repeating unit represented by formula (c) is preferably 2 to 77 mol%, more preferably 2 to 65 mol%, even more preferably 5 to 60 mol%, and still more preferably 20 to 50 mol% of all repeating units.

[0085] When the (D) polymer additive contains a repeating unit represented by formula (a2), a repeating unit represented by formula (b), a repeating unit represented by formula (c), and a repeating unit represented by formula (d) (hereinafter, such a polymer additive will be referred to as polymer additive D3), the content of the repeating unit represented by formula (a2) is preferably 2 to 45 mol%, and more preferably 5 to 35 mol%, of all repeating units; the content of the repeating unit represented by formula (b) is preferably 20 to 35 mol%, and more preferably 25 to 35 mol%, of all repeating units; the content of the repeating unit represented by formula (c) is preferably 30 to 45 mol%, and more preferably 35 to 45 mol% of all repeating units; and the content of the repeating unit represented by formula (d) is preferably 5 to 18 mol%, and more preferably 5 to 15 mol%, of all repeating units.

[0086] The weight average molecular weight (Mw) of the polymer additive (D) is preferably 2,000 to 10,000, more preferably 3,000 to 6,000, and the Mw / Mn ratio is preferably 1.0 to 2.1, more preferably 1.0 to 1.9 (Mn is the number average molecular weight).

[0087] The content of the polymer additive of component (D) is 5 to 100 parts by mass per 100 parts by mass of component (A). If the content of the polymer additive is less than 5 parts by mass, the peel strength may increase, and if it exceeds 100 parts by mass, repellency may occur during film formation.

[0088] In particular, when the (D) polymer additive is polymer additive D1, the content thereof is preferably 10 to 100 parts by mass, more preferably 20 to 100 parts by mass, and even more preferably 30 to 100 parts by mass, per 100 parts by mass of component (A). Furthermore, when the (D) polymer additive is a substance other than polymer additive D1, the content thereof is preferably 5 to 80 parts by mass, more preferably 5 to 50 parts by mass, per 100 parts by mass of component (A). The (D) polymer additives may be used alone, or two or more may be used in combination.

[0089] [(E) Solvent] The release layer-forming composition of the present invention contains a solvent as component (E). As the solvent, glycol ether-based solvents having 3 to 20 carbon atoms, ester-based solvents having 3 to 20 carbon atoms, ketone-based solvents having 3 to 20 carbon atoms, and amide-based solvents having 3 to 20 carbon atoms are preferred.

[0090] Specific examples of glycol ether solvents include propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl ether, and propylene glycol monopropyl ether. Specific examples of ester solvents include ethyl lactate, γ-butyrolactone, methyl 2-hydroxyisobutyrate, and ethyl 2-hydroxyisobutyrate. Specific examples of ketone solvents include methyl ethyl ketone, cyclopentanone, cyclohexanone, and benzophenone. Specific examples of amide solvents include N-methylpyrrolidone, N,N-dimethylacetamide, and 3-methoxy-N,N-dimethylpropanamide.

[0091] The content of the (E) solvent is not particularly limited, but is preferably an amount such that the solid content concentration in the release layer-forming composition of the present invention is 0.1 to 40% by mass, more preferably 0.5 to 20% by mass, and even more preferably 0.5 to 10% by mass. The solid content refers to all components of the release layer-forming composition other than the solvent, and the solid content amount is the total amount of these. The (E) solvent may be used alone or in combination of two or more.

[0092] [Other Additives] The release layer-forming composition of the present invention may contain a surfactant as needed. By adding a surfactant, the coatability of the release layer-forming composition to the substrate can be improved. As the surfactant, known surfactants such as nonionic surfactants, fluorine-based surfactants, and silicone-based surfactants can be used.

[0093] Specific examples of nonionic surfactants include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether; polyoxyethylene alkylaryl ethers such as polyoxyethylene octylphenyl ether and polyoxyethylene nonylphenyl ether; polyoxyethylene-polyoxypropylene block copolymers; sorbitan fatty acid esters such as sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, and sorbitan tristearate; and polyoxyethylene sorbitan fatty acid esters such as polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, and polyoxyethylene sorbitan tristearate.

[0094] Specific examples of fluorine-based surfactants include EFTOP (registered trademark) EF301, EF303, and EF352 (manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), MEGAFAC (registered trademark) F171, F173, F554, F559, F563, R-30, R-40, R-40-LM, and DS-21 (manufactured by DIC Corporation), FLUORAD (registered trademark) FC430 and FC431 (manufactured by 3M), ASAHIGUARD (registered trademark) AG710, SURFLOON (registered trademark) S-382, SC101, SC102, SC103, SC104, SC105, and SC106 (manufactured by AGC Inc.), and the like. Specific examples of silicone-based surfactants include organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.).

[0095] When the release layer-forming composition of the present invention contains a surfactant, the content thereof is preferably 0.0001 to 1 part by mass, and more preferably 0.001 to 0.5 parts by mass, per 100 parts by mass of component (A). The surfactant may be used alone or in combination of two or more types.

[0096] [Preparation of the composition for forming release layer] The preparation method of the composition for forming release layer of the present invention is not particularly limited, and for example, the method of mixing the solution of the component (A) dissolved in solvent with the component (B), component (C), component (D) and component (E) etc. in a predetermined ratio to make a uniform solution can be mentioned.It should be noted that the solvent that dissolves the component (A) can be the same solvent as the component (E) or different solvent.In addition, when using other additives, they can be added and mixed at any stage of the preparation of composition.

[0097] In preparing the composition for forming release layer of the present invention, the solution of polymer obtained by polymerization reaction in solvent can be used as it is.For example, after the polymerization reaction solution of producing component (A), component (B), further component (C), component (D), component (E) etc. can be added to make a homogeneous solution.At this time, for the purpose of adjusting concentration, further solvent can be added, and this solvent can be the same as or different from the solvent used in producing component (A).

[0098] The prepared solution of the composition for forming the release layer is preferably used after being filtered using a filter having a pore size of about 0.2 μm.

[0099] The viscosity of the release layer-forming composition of the present invention is appropriately set taking into consideration the thickness of the release layer to be produced, etc. However, particularly when the objective is to reproducibly obtain a film having a thickness of about 0.01 to 5 μm, a viscosity of about 1 to 5,000 mPa·s at 25°C is preferred, and about 1 to 2,000 mPa·s is more preferred. The viscosity in the present invention can be measured using a commercially available viscometer for measuring the viscosity of liquids, for example, by referring to the procedure described in JIS K7117-2, at a composition temperature of 25°C. As the viscometer, a cone-plate type rotational viscometer is preferably used, and it is also preferable to use the same type of viscometer with a standard cone rotor of 1°34' x R24, and to measure the composition temperature of 25°C. An example of such a rotational viscometer is the TVE-25L manufactured by Toki Sangyo Co., Ltd.

[0100] [Release Layer] A release layer having excellent adhesion to the substrate, adequate adhesion to the resin substrate, and adequate release properties can be obtained by a baking method including a step of applying the release layer-forming composition of the present invention to a substrate and then baking at 180 to 250°C. In this case, the heating time during baking cannot be generally specified because it varies depending on the heating temperature, but is usually 1 minute to 5 hours. Furthermore, as long as the maximum baking temperature is within the above range, a step of baking at a temperature lower than that may be included.

[0101] A preferred example of the heating mode in the present invention is to heat at 50 to 150°C for 1 minute to 1 hour, and then increase the heating temperature to 180 to 250°C for 5 minutes to 4 hours. A particularly preferred example of the heating mode is to heat at 50 to 150°C for 1 minute to 1 hour, and then heat at 200 to 250°C for 5 minutes to 2 hours. Another more preferred example of the heating mode is to heat at 50 to 150°C for 1 to 30 minutes, and then heat at 200 to 250°C for 5 minutes to 1 hour.

[0102] When the release layer of the present invention is formed on a substrate, the release layer may be formed on a portion of the surface of the substrate, or may be formed on the entire surface. Forms of forming a release layer on a portion of the surface of the substrate include a form in which the release layer is formed only in a predetermined area of ​​the substrate surface, and a form in which the release layer is formed in a pattern such as a dot pattern or a line and space pattern on the entire surface of the substrate. In the present invention, the substrate means a substrate on whose surface the release layer-forming composition of the present invention is applied and which is used in the manufacture of flexible electronic devices, etc.

[0103] Examples of the substrate (base material) include glass, metal (such as silicon wafer), slate, etc., but glass is particularly preferred because the release layer obtained from the release layer-forming composition of the present invention has sufficient adhesion to it.The substrate surface may be composed of a single material, or may be composed of two or more materials.The embodiment in which the substrate surface is composed of two or more materials includes an embodiment in which a certain area of ​​the substrate surface is composed of one material, and the remaining surface is composed of other materials, and an embodiment in which a material in a pattern such as a dot pattern or a line and space pattern is present in other materials on the entire substrate surface.

[0104] The method for applying the composition for forming the release layer is not particularly limited, but examples include cast coating, spin coating, blade coating, dip coating, roll coating, bar coating, die coating, inkjet printing, and printing methods (relief printing, intaglio printing, lithography, screen printing, etc.).

[0105] Examples of heating equipment include a hot plate, an oven, etc. The heating atmosphere may be air or an inert gas, and may be atmospheric pressure or reduced pressure.

[0106] The thickness of the release layer is usually about 0.01 to 50 μm, but from the viewpoint of productivity, it is preferably about 0.01 to 20 μm, more preferably about 0.01 to 5 μm, and the desired thickness is achieved by adjusting the thickness of the coating film before heating.

[0107] The release layer of the present invention has excellent adhesion to a substrate, particularly a glass substrate, and adequate adhesion and release properties to a resin substrate, and is therefore suitable for use in a manufacturing process for a flexible electronic device to release the resin substrate together with circuits and the like formed on the resin substrate from the substrate without damaging the resin substrate.

[0108] [Manufacturing Method of Resin Substrate] An example of a manufacturing method of a flexible electronic device using the release layer of the present invention will be described. First, a release layer is formed on a glass substrate by the above-mentioned method using the release layer-forming composition of the present invention. A resin substrate-forming solution for forming a resin substrate is applied onto this release layer, and the resulting coating is baked to form a resin substrate fixed to the glass substrate via the release layer of the present invention.

[0109] The baking temperature of the coating film is set appropriately depending on the type of resin, etc., but in the present invention, the maximum temperature during baking is preferably 200 to 250°C, more preferably 210 to 250°C, and even more preferably 220 to 240°C. By setting the maximum temperature during baking in this range when producing a resin substrate, it is possible to further improve the adhesion between the underlying release layer and the base, as well as the appropriate adhesion and releasability between the release layer and the resin substrate. In this case, too, as long as the maximum temperature is within the above range, a step of baking at a temperature lower than that may be included.

[0110] The resin substrate is preferably formed so as to completely cover the release layer and have an area larger than that of the release layer. Examples of the resin substrate include a resin substrate made of an acrylic polymer and a resin substrate made of a cycloolefin polymer, and preferably has a light transmittance of 80% or more at a wavelength of 400 nm. The resin substrate may be formed by a conventional method.

[0111] Next, a desired circuit is formed as needed on the resin substrate fixed to the substrate via the release layer of the present invention. The resin substrate is then cut, for example, along the release layer, and the resin substrate is peeled off from the release layer together with the circuit, separating the resin substrate from the substrate. At this time, a portion of the substrate may be cut along with the release layer. By using the release layer of the present invention, the resin substrate can be peeled off from the release layer with a peel force of 0.25 N / 25 mm or less. In particular, when the polymer additive (D) is polymer additive D2 or polymer additive D3, the resin substrate can be peeled off from the release layer with a peel force of 0.15 N / 25 mm or less. Furthermore, when the polymer additive (D) is polymer additive D1, the resin substrate can be peeled off from the release layer with a peel force of 0.1 N / 25 mm or less.

[0112] The present invention will be explained in more detail below by way of synthesis examples, preparation examples, working examples and comparative examples, but the present invention is not limited to the following examples.

[0113] (I) (A1) Composition for forming a release layer containing cellulose or its derivative having a hydroxyalkyl group The compounds used in the following examples are as follows. PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl ether acetate HPC-SSL: Hydroxypropyl cellulose, Mw 40,000 HPC-SL: Hydroxypropyl cellulose, Mw 100,000 HPC-L: Hydroxypropyl cellulose, Mw 140,000 CAB: Cellulose acetate butyrate, Mw 155,800 CAP: Cellulose acetate propionate, Mw 71,300 PL-LI: 1,3,4,6-tetrakis(methoxyethyl)glycoluril (manufactured by Allnex Corporation, trade name: POWDERLINK 1174) PPTS: Pyridinium p-toluenesulfonate HPMA: 2-hydroxypropyl methacrylate ADMA: 2-adamantyl methacrylate HFiPMA: 1,1,1,3,3,3-hexafluoroisopropyl methacrylate AIBN: azobisisobutyronitrile DDT: dodecanethiol

[0114] The weight average molecular weight (Mw) of the polymer was measured using a GPC apparatus manufactured by Shimadzu Corporation (column: Shodex (registered trademark) KF803L and KF804L (manufactured by Showa Denko K.K.) ; eluent: THF ; flow rate: 1.0 mL / min ; column temperature: 40°C ; Mw: standard polystyrene equivalent value).

[0115] [1] Polymer Synthesis [Synthesis Example 1-1] Synthesis of Acrylic Polymer (S1) 6.43 g of HFiPMA, 3.93 g of HPMA, 8.00 g of ADMA, 0.74 g of AIBN, and 0.92 g of DDT were dissolved in 80.1 g of PGME and reacted at 70 ° C. for 20 hours to obtain an acrylic polymer (S1) solution (solid concentration 20% by mass). The composition ratio of each unit was HFiPMA: HPMA: ADMA = 30: 30: 40. As a result of GPC analysis, the Mw of the obtained acrylic polymer (S1) was 5,310, and Mw / Mn was 1.8.

[0116] [Synthesis Example 1-2] Synthesis of acrylic polymer (S2) 8.57 g of HFiPMA, 2.62 g of HPMA, 8.00 g of ADMA, 0.74 g of AIBN, and 0.92 g of DDT were dissolved in 83.4 g of PGME and reacted at 70 ° C. for 20 hours to obtain an acrylic polymer (S2) solution (solids concentration 20% by mass). The composition ratio of each unit was HFiPMA: HPMA: ADMA = 40: 20: 40. As a result of GPC analysis, the Mw of the obtained acrylic polymer (S2) was 5,500, and Mw / Mn was 1.8.

[0117] [2] Preparation of Resin Substrate Forming Composition [Preparation Example 1] Preparation of Resin Substrate Forming Composition F1 To a recovery flask containing 100 g of carbon tetrachloride, 10 g of Zeonor (registered trademark) 1020R (a cycloolefin polymer manufactured by Zeon Corporation) and 3 g of Epolead (registered trademark) GT401 (manufactured by Daicel Corporation) were added. The solution was stirred for 24 hours under a nitrogen atmosphere to dissolve the components, thereby preparing Resin Substrate Forming Composition F1.

[0118] [3] Preparation of release layer-forming composition [Example 1-1] Preparation of release layer-forming composition 1 To 1.00 g of HPC-SSL, 0.32 g of PL-LI, 0.05 g of PPTS, 0.84 g of acrylic polymer (S1) solution, and PGMEA were added, and the mixture was diluted with PGME to a solids concentration of 5 mass% and a PGMEA concentration of 30 mass%, to prepare release layer-forming composition 1-1.

[0119] Example 1-2 Preparation of Release Layer-Forming Composition 2 A release layer-forming composition 1-2 was prepared in the same manner as in Example 1-1, except that the amount of PL-LI was changed to 0.50 g.

[0120] Example 1-3 Preparation of Release Layer-Forming Composition 3 A release layer-forming composition 1-3 was prepared in the same manner as in Example 1-1, except that the amount of PL-LI was changed to 0.25 g.

[0121] Example 1-4 Preparation of Release Layer-Forming Composition 4 A release layer-forming composition 1-4 was prepared in the same manner as in Example 1-1, except that HPC-SL was used instead of HPC-SSL.

[0122] Example 1-5 Preparation of Release Layer-Forming Composition 5 A release layer-forming composition 1-5 was prepared in the same manner as in Example 1-1, except that HPC-L was used instead of HPC-SSL.

[0123] Example 1-6 Preparation of Release Layer-Forming Composition 6 A release layer-forming composition 1-6 was prepared in the same manner as in Example 1-1, except that the amount of the acrylic polymer (S1) solution was changed to 0.50 g.

[0124] Example 1-7 Preparation of Release Layer-Forming Composition 7 A release layer-forming composition 1-7 was prepared in the same manner as in Example 1-1, except that the amount of the acrylic polymer (S1) solution was changed to 0.38 g.

[0125] Example 1-8 Preparation of Release Layer-Forming Composition 8 A release layer-forming composition 1-8 was prepared in the same manner as in Example 1-1, except that the acrylic polymer (S2) solution was used instead of the acrylic polymer (S1) solution.

[0126] Comparative Example 1-1 Preparation of Release Layer-Forming Composition 9 A release layer-forming composition 1-9 was prepared in the same manner as in Example 1-1, except that CAB was used instead of HPC-SSL.

[0127] Comparative Example 1-2 Preparation of Release Layer-Forming Composition 10 A release layer-forming composition 1-10 was prepared in the same manner as in Example 1-1, except that CAP was used instead of HPC-SSL.

[0128] [4] Preparation of Release Layer and Resin Substrate [Example 2-1] Using a spin coater (conditions: rotation speed 1,000 rpm for approximately 30 seconds), release layer forming composition 1-1 was applied onto a glass substrate (100 mm x 100 mm, the same applies below). The resulting coating film was heated at 100 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 10 minutes using a hot plate to form a release layer of approximately 0.1 μm thick on the glass substrate, thereby obtaining a glass substrate with a release layer. Thereafter, immediately using a spin coater (conditions: rotation speed 200 rpm for approximately 15 seconds), resin substrate forming composition F1 was applied onto the release layer (resin thin film) on the glass substrate. The resulting coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate of approximately 3 μm thick on the release layer, thereby obtaining a resin substrate and a glass substrate with a release layer. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation), and the resin substrate showed a transmittance of 90% or more at 400 nm.

[0129] [Example 2-2] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that release layer-forming composition 1-2 was used instead of release layer-forming composition 1-1, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0130] [Example 2-3] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that composition 1-3 for forming a release layer was used instead of composition 1-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0131] [Example 2-4] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that composition 1-4 for forming a release layer was used instead of composition 1-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0132] [Example 2-5] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that composition 1-5 for forming a release layer was used instead of composition 1-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0133] [Example 2-6] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that composition 1-6 for forming a release layer was used instead of composition 1-1 for forming a release layer, thereby obtaining a glass substrate with a release layer and a glass substrate with a resin substrate and a release layer.

[0134] [Example 2-7] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that release layer-forming composition 1-7 was used instead of release layer-forming composition 1-1, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0135] [Example 2-8] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that composition 1-8 for forming a release layer was used instead of composition 1-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0136] [Comparative Example 2-1] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that composition 1-9 for forming a release layer was used instead of composition 1-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0137] [Comparative Example 2-2] A release layer and a resin substrate were prepared in the same manner as in Example 2-1, except that composition 1-10 for forming a release layer was used instead of composition 1-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0138] [5] Evaluation of Peelability The peelability of the glass substrates with a release layer and the glass substrates with a resin substrate and a release layer obtained in Examples 2-1 to 2-8 and Comparative Examples 2-1 to 2-2 was confirmed by the following method. Note that the following tests were performed on the same glass substrate.

[0139] (1) Evaluation of Peelability Between Release Layer and Glass Substrate The release layer on the glass substrate with release layer obtained in Examples 2-1 to 2-8 and Comparative Examples 2-1 to 2-2 was cross-cut (at 2 mm intervals vertically and horizontally, the same applies below) to form 25 grids. That is, 25 2 mm squares were formed by this cross-cutting. Adhesive tape was attached to the 25 grids, and the tape was peeled off. The degree of peeling was evaluated based on the following criteria. The results are shown in Table 1. <Judgment Criteria> 5B: 0% peeling (no peeling) 4B: Less than 5% peeling 3B: 5% or more but less than 15% peeling 2B: 15% or more but less than 35% peeling 1B: 35% or more but less than 65% peeling 0B: 65% or more but less than 80% peeling B: 80% or more but less than 95% peeling A: 95% or more but less than 100% peeling AA: 100% peeling (complete peeling)

[0140] (2) Evaluation of peel strength between release layer and resin substrate 25 mm x 50 mm strips were prepared from the resin substrates and glass substrates with release layers obtained in Examples 2-1 to 2-8 and Comparative Examples 2-1 to 2-2. Furthermore, Cellotape (registered trademark) (CT-24, manufactured by Nichiban Co., Ltd.) was attached, and then the strips were peeled using an Autograph AGS-X500N (manufactured by Shimadzu Corporation) at a peel angle of 90° and a peel speed of 300 mm / min, and the peel strength was measured. Those that could not be peeled were deemed unpeelable. The results are shown in Table 1.

[0141]

[0142] From the results shown in Table 1, it was confirmed that the release layers of the Examples had excellent adhesion to the glass substrate and were easily peeled off from the resin film. On the other hand, it was confirmed that the release layers of Comparative Examples 2-1 and 2-2 had excellent adhesion to the glass substrate but were difficult to peel off from the resin substrate.

[0143] (II) (A2) Composition for forming a release layer containing a polyester having a hydroxy group The compounds used in the following examples are as follows. PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl ether acetate PL-LI: 1,3,4,6-tetrakis(methoxyethyl)glycoluril (manufactured by Allnex Corporation, trade name: POWDERLINK 1174) PPTS: Pyridinium p-toluenesulfonate HPMA: 2-hydroxypropyl methacrylate ADMA: 2-adamantyl methacrylate HFiPMA: 1,1,1,3,3,3-hexafluoroisopropyl methacrylate AIBN: Azobisisobutyronitrile DDT: Dodecanethiol EP1: Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: jER828) EP2: Terephthalate type epoxy resin (manufactured by Nagase ChemteX Corporation, trade name: Denacol EX711) EP3: Biphenyl type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: YX4000H) EP4: Fluorene type epoxy resin (manufactured by Osaka Gas Chemicals Co., Ltd., trade name: Oxol PG-100) EP5: Fluorene type epoxy resin (manufactured by Osaka Gas Chemicals Co., Ltd., trade name: Oxol CG-500) EP6: Cyclohexyl type epoxy resin (manufactured by Daicel Corporation, trade name: CEL2021P) TPhA: Terephthalic acid IPhA: Isophthalic acid 5HIPhA: 5-hydroxyisophthalic acid 14CHA: 1,4-cyclohexyldicarboxylic acid BTEAC: Benzyltriethylammonium chloride ETPPB: Ethyltriphenylphosphonium bromide

[0144] The weight average molecular weight (Mw) of the polymer was measured by the same method as described in (I) above.

[0145] [1] Polymer Synthesis [Synthesis Example 2-1] Synthesis of Polyester (A2-1) 10.0 g of EP1, 5.4 g of TPhA, and 0.25 g of BTEAC were dissolved in 36.4 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-1) solution (solids concentration 30% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-1) was 13,200, and the Mw / Mn was 3.9.

[0146] [Synthesis Example 2-2] Synthesis of polyester (A2-2) 10.0 g of EP3, 5.2 g of TPhA, and 0.24 g of BTEAC were dissolved in 36.0 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-2) solution (solids concentration 30% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-2) was 21,000 and the Mw / Mn was 3.2.

[0147] [Synthesis Example 2-3] Synthesis of polyester (A2-3) 10.0 g of EP1, 5.4 g of IPhA, and 0.25 g of BTEAC were dissolved in 36.4 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-3) solution (solids concentration 30% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-3) was 6,600 and the Mw / Mn was 2.1.

[0148] [Synthesis Example 2-4] Synthesis of polyester (A2-4) 10.0 g of EP2, 6.8 g of IPhA, and 0.31 g of BTEAC were dissolved in 39.9 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-4) solution (solids concentration 30% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-4) was 5,400 and the Mw / Mn was 4.1.

[0149] [Synthesis Example 2-5] Synthesis of polyester (A2-5) 10.0 g of EP3, 5.2 g of IPhA, and 0.24 g of BTEAC were dissolved in 36.0 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-5) solution (solids concentration 30% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-5) was 5,400 and the Mw / Mn was 3.3.

[0150] [Synthesis Example 2-6] Synthesis of polyester (A2-6) 10.0 g of EP4, 4.0 g of IPhA, and 0.18 g of BTEAC were dissolved in 56.5 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-6) solution (solids concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-6) was 8,100 and the Mw / Mn was 3.3.

[0151] [Synthesis Example 2-7] Synthesis of polyester (A2-7) 10.0 g of EP5, 3.4 g of IPhA, and 0.15 g of BTEAC were dissolved in 54.2 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-7) solution (solids concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-7) was 6,600 and the Mw / Mn was 2.0.

[0152] [Synthesis Example 2-8] Synthesis of polyester (A2-8) 10.0 g of EP4, 4.3 g of 5HIPhA, and 0.18 g of BTEAC were dissolved in 58.1 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-8) solution (solids concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-8) was 6,200 and the Mw / Mn was 2.4.

[0153] [Synthesis Example 2-9] Synthesis of polyester (A2-9) 10.0 g of EP5, 3.7 g of 5HIPhA, and 0.15 g of BTEAC were dissolved in 55.5 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-9) solution (solids concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-9) was 7,600 and the Mw / Mn was 2.2.

[0154] [Synthesis Example 2-10] Synthesis of polyester (A2-10) 10.0 g of EP6, 6.6 g of TPhA, and 0.59 g of ETPPB were dissolved in 40.1 g of PGME and reacted at 120°C for 20 hours to obtain a polyester (A2-10) solution (solids concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-10) was 9,200 and the Mw / Mn was 2.1.

[0155] Synthesis Example 2-11 Synthesis of Polyester (A2-11) 10.0 g of EP6, 6.8 g of 14CHA, and 0.59 g of ETPPB were dissolved in 40.7 g of PGME and reacted at 120°C for 20 hours to obtain a solution of polyester (A2-11) (solids concentration: 20% by mass). As a result of GPC analysis, the Mw of the obtained polyester (A2-11) was 5,800, and the Mw / Mn was 1.7.

[0156] [Synthesis Example 2-12] Synthesis of acrylic polymer (S1) 6.43 g of HFiPMA, 3.93 g of HPMA, 8.00 g of ADMA, 0.74 g of AIBN, and 0.92 g of DDT were dissolved in 80.1 g of PGME and reacted at 70 ° C. for 20 hours to obtain an acrylic polymer (S1) solution (solids concentration 20% by mass). The composition ratio of each unit was HFiPMA:HPMA:ADMA = 30:30:40. As a result of GPC analysis, the Mw of the obtained acrylic polymer (S1) was 5,310, and the Mw / Mn was 1.8.

[0157] [2] Preparation of Resin Substrate Forming Composition [Preparation Example 1] Preparation of Resin Substrate Forming Composition F1 To a recovery flask containing 100 g of carbon tetrachloride, 10 g of Zeonor (registered trademark) 1020R (a cycloolefin polymer manufactured by Zeon Corporation) and 3 g of Epolead (registered trademark) GT401 (manufactured by Daicel Corporation) were added. The solution was stirred for 24 hours under a nitrogen atmosphere to dissolve the components, thereby preparing Resin Substrate Forming Composition F1.

[0158] [3] Preparation of release layer-forming composition [Example 3-1] Preparation of release layer-forming composition 1 To 1 g of the polyester (A2-1) solution obtained in Synthesis Example 1, 0.06 g of PL-LI, 0.01 g of PPTS, 0.17 g of acrylic polymer (S1) solution, and PGMEA were added, and the mixture was diluted with PGME to a solids concentration of 5 mass% and a PGMEA concentration of 30 mass%, to prepare release layer-forming composition 2-1.

[0159] Example 3-2 Preparation of Release Layer-Forming Composition 2 A release layer-forming composition 2-2 was prepared in the same manner as in Example 3-1, except that the polyester (A2-2) solution was used instead of the polyester (A2-1) solution.

[0160] Example 3-3 Preparation of Release Layer-Forming Composition 3 A release layer-forming composition 2-3 was prepared in the same manner as in Example 3-1, except that the polyester (A2-3) solution was used instead of the polyester (A2-1) solution.

[0161] Example 3-4 Preparation of Release Layer-Forming Composition 4 A release layer-forming composition 2-4 was prepared in the same manner as in Example 3-1, except that the polyester (A2-4) solution was used instead of the polyester (A2-1) solution.

[0162] Example 3-5 Preparation of Release Layer-Forming Composition 5 A release layer-forming composition 2-5 was prepared in the same manner as in Example 3-1, except that the polyester (A2-5) solution was used instead of the polyester (A2-1) solution.

[0163] Example 3-6 Preparation of Release Layer-Forming Composition 6 A release layer-forming composition 2-6 was prepared in the same manner as in Example 3-1, except that the polyester (A2-6) solution was used instead of the polyester (A2-1) solution.

[0164] Example 3-7 Preparation of Release Layer-Forming Composition 7 A release layer-forming composition 2-7 was prepared in the same manner as in Example 3-1, except that the polyester (A2-7) solution was used instead of the polyester (A2-1) solution.

[0165] Example 3-8 Preparation of Release Layer-Forming Composition 8 A release layer-forming composition 2-8 was prepared in the same manner as in Example 3-1, except that the polyester (A2-8) solution was used instead of the polyester (A2-1) solution.

[0166] [Example 3-9] Preparation of release layer-forming composition 9 A release layer-forming composition 2-9 was prepared in the same manner as in Example 3-1, except that the polyester (A2-9) solution was used instead of the polyester (A2-1) solution.

[0167] Example 3-10 Preparation of Release Layer-Forming Composition 10 A release layer-forming composition 2-10 was prepared in the same manner as in Example 3-1, except that the polyester (A2-10) solution was used instead of the polyester (A2-1) solution.

[0168] [Example 3-11] Preparation of release layer-forming composition 11 A release layer-forming composition 2-11 was prepared in the same manner as in Example 3-1, except that the polyester (A2-11) solution was used instead of the polyester (A2-1) solution.

[0169] [4] Preparation of Release Layer and Resin Substrate [Example 4-1] Using a spin coater (conditions: rotation speed 1,000 rpm for approximately 30 seconds), release layer forming composition 2-1 was applied onto a glass substrate (100 mm x 100 mm, the same applies below). The resulting coating film was heated at 100 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 10 minutes using a hot plate to form a release layer of approximately 0.1 μm thick on the glass substrate, thereby obtaining a glass substrate with a release layer. Thereafter, immediately using a spin coater (conditions: rotation speed 200 rpm for approximately 15 seconds), resin substrate forming composition F1 was applied onto the release layer (resin thin film) on the glass substrate. The resulting coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate of approximately 3 μm thick on the release layer, thereby obtaining a resin substrate and a glass substrate with a release layer. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation), and the resin substrate showed a transmittance of 90% or more at 400 nm.

[0170] [Example 4-2] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-2 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0171] [Example 4-3] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-3 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0172] [Example 4-4] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-4 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0173] [Example 4-5] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-5 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0174] [Example 4-6] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-6 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0175] [Example 4-7] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-7 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0176] [Example 4-8] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-8 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0177] [Example 4-9] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-9 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0178] [Example 4-10] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-10 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0179] [Example 4-11] A release layer and a resin substrate were prepared in the same manner as in Example 4-1, except that composition 2-11 for forming a release layer was used instead of composition 2-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0180] [5] Evaluation of Peelability The peelability of the glass substrates with a release layer and the glass substrates with a resin substrate and a release layer obtained in Examples 4-1 to 4-11 was confirmed by the same method as described in [4] of (I) above. The results are shown in Table 2.

[0181]

[0182] From the results shown in Table 2, it was confirmed that the release layer of the example had excellent adhesion to the glass substrate and could be easily peeled off from the resin film.

[0183] (III) (A3) Composition for forming a release layer containing an acrylic polymer having a primary or secondary hydroxy group and no fluorine atom The compounds used in the following examples are as follows. PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl ether acetate CHN: Cyclohexanone PL-LI: 1,3,4,6-tetrakis(methoxyethyl)glycoluril (manufactured by Allnex Corporation, trade name: POWDERLINK 1174) PPTS: Pyridinium p-toluenesulfonate MMA: Methyl methacrylate HPMA: 2-hydroxypropyl methacrylate HEMA: 2-hydroxyethyl methacrylate 4HBA: 4-hydroxybutyl acrylate HADM: 3-hydroxy-1-adamantyl methacrylate ADMA: 2-adamantyl methacrylate HFiPMA: 1,1,1,3,3,3-hexafluoroisopropyl methacrylate AIBN: Azobisisobutyronitrile DDT: Dodecanethiol

[0184] The weight average molecular weight (Mw) of the polymer was measured by the same method as described in (I) above.

[0185] [1] Polymer Synthesis [Synthesis Example 3-1] Synthesis of Acrylic Polymer (A3-1) 20.0 g of HEMA, 1.26 g of AIBN, and 1.56 g of DDT were dissolved in 92 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-1) solution (solids concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-1) was 5,400, and the Mw / Mn was 1.7.

[0186] [Synthesis Example 3-2] Synthesis of acrylic polymer (A3-2) 20.0 g of HEMA and 1.26 g of AIBN were dissolved in 85 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-2) solution (solid content concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-2) was 13,300 and the Mw / Mn was 2.5.

[0187] [Synthesis Example 3-3] Synthesis of acrylic polymer (A3-3) 20.0 g of HPMA, 1.14 g of AIBN, and 1.40 g of DDT were dissolved in 90.2 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-3) solution (solids concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-3) was 6,300 and the Mw / Mn was 1.5.

[0188] [Synthesis Example 3-4] Synthesis of acrylic polymer (A3-4) 20.0 g of HPMA and 1.14 g of AIBN were dissolved in 84.5 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-4) solution (solid content concentration 20% by mass). As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-4) was 13,000 and the Mw / Mn was 2.5.

[0189] Synthesis Example 3-5 Synthesis of Acrylic Polymer (A3-5) 20.0 g of 4HBA, 1.14 g of AIBN, and 1.40 g of DDT were dissolved in 90.2 g of PGME and reacted at 70° C. for 20 hours to obtain a solution of acrylic polymer (A3-5) (solids concentration: 20% by mass). As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-5) was 4,200, and the Mw / Mn was 1.3.

[0190] Synthesis Example 3-6: Synthesis of Acrylic Polymer (A3-6) 10.0 g of MMA, 13.0 g of HEMA, 1.64 g of AIBN, and 1.21 g of DDT were dissolved in 103.4 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-6) solution (solids concentration 20% by mass). The composition ratio of each unit was MMA:HEMA = 50:50. As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-6) was 6,600, and the Mw / Mn was 1.9.

[0191] Synthesis Example 3-7: Synthesis of acrylic polymer (A3-7) 10.0 g of MMA, 14.3 g of HPMA, 1.64 g of AIBN, and 1.21 g of DDT were dissolved in 109.0 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-7) solution (solids concentration 20% by mass). The composition ratio of each unit was MMA:HPMA = 50:50. As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-7) was 6,400 and the Mw / Mn was 2.3.

[0192] Synthesis Example 3-8: Synthesis of Acrylic Polymer (A3-8) 15.0 g of MMA, 8.36 g of HEMA, 1.74 g of AIBN, and 1.30 g of DDT were dissolved in 105.7 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-8) solution (solids concentration 20% by mass). The composition ratio of each unit was MMA:HEMA = 70:30. As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-8) was 5,500 and the Mw / Mn was 2.0.

[0193] Synthesis Example 3-9: Synthesis of Acrylic Polymer (A3-9) 15.0 g of MMA, 9.26 g of HPMA, 1.74 g of AIBN, and 1.30 g of DDT were dissolved in 109.3 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A3-9) solution (solids concentration: 20% by mass). The composition ratio of each unit was MMA:HPMA = 70:30. As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-9) was 6,000 and the Mw / Mn was 2.0.

[0194] Synthesis Example 3-10 Synthesis of Acrylic Polymer (A3-10) 20.0 g of HADM, 0.69 g of AIBN, and 0.86 g of DDT were dissolved in 86.2 g of PGME and reacted at 70° C. for 20 hours to obtain a solution of acrylic polymer (A3-10) (solids concentration: 20% by mass). As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-10) was 5,100, and the Mw / Mn was 1.5.

[0195] Synthesis Example 3-11 Synthesis of Acrylic Polymer (A3-11) 10.0 g of MMA, 10.12 g of HADM, 1.17 g of AIBN, and 0.87 g of DDT were dissolved in 88.6 g of PGME and reacted at 70°C for 20 hours to obtain an acrylic polymer (A11) solution (solids concentration 20% by mass). The composition ratio of each unit was MMA:HADM = 70:30. As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-11) was 6,600 and the Mw / Mn was 1.6.

[0196] Synthesis Example 3-12 Synthesis of Acrylic Polymer (A3-12) 10.0 g of MMA, 0.82 g of AIBN, and 0.61 g of DDT were dissolved in 45.7 g of PGME and reacted at 70° C. for 20 hours to obtain a solution of acrylic polymer (A3-12) (solids concentration: 20% by mass). As a result of GPC analysis, the Mw of the obtained acrylic polymer (A3-12) was 5,200, and the Mw / Mn was 1.7.

[0197] [Synthesis Example 3-13] Synthesis of acrylic polymer (S1) 6.43 g of HFiPMA, 3.93 g of HPMA, 8.00 g of ADMA, 0.74 g of AIBN, and 0.92 g of DDT were dissolved in 80.1 g of PGME and reacted at 70 ° C. for 20 hours to obtain an acrylic polymer (S1) solution (solids concentration 20% by mass). The composition ratio of each unit was HFiPMA:HPMA:ADMA = 30:30:40. As a result of GPC analysis, the Mw of the obtained acrylic polymer (S1) was 5,310, and the Mw / Mn was 1.8.

[0198] [Synthesis Example 3-14] Synthesis of acrylic polymer (S2) 8.57 g of HFiPMA, 2.62 g of HPMA, 8.00 g of ADMA, 0.74 g of AIBN, and 0.92 g of DDT were dissolved in 83.4 g of PGME and reacted at 70 ° C. for 20 hours to obtain an acrylic polymer (S2) solution (solids concentration 20% by mass). The composition ratio of each unit was HFiPMA:HPMA:ADMA = 40:20:40. As a result of GPC analysis, the Mw of the obtained acrylic polymer (S2) was 5,500, and the Mw / Mn was 1.8.

[0199] [2] Preparation of Resin Substrate Forming Composition [Preparation Example 1] Preparation of Resin Substrate Forming Composition F1 To a recovery flask containing 100 g of carbon tetrachloride, 10 g of Zeonor (registered trademark) 1020R (a cycloolefin polymer manufactured by Zeon Corporation) and 3 g of Epolead (registered trademark) GT401 (manufactured by Daicel Corporation) were added. The solution was stirred for 24 hours under a nitrogen atmosphere to dissolve the components, thereby preparing Resin Substrate Forming Composition F1.

[0200] [3] Preparation of release layer-forming composition [Example 5-1] Preparation of release layer-forming composition 1 To 1 g of the acrylic polymer (A3-1) solution obtained in Synthesis Example 1, 0.06 g of PL-LI, 0.01 g of PPTS, 0.08 g of the acrylic polymer (S1) solution, and PGMEA were added, and the mixture was diluted with PGME to a solids concentration of 5 mass% and a PGMEA concentration of 30 mass%, to prepare release layer-forming composition 3-1.

[0201] Example 5-2 Preparation of Release Layer-Forming Composition 2 A release layer-forming composition 3-2 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-2) solution was used instead of the acrylic polymer (A3-1) solution.

[0202] Example 5-3 Preparation of Release Layer-Forming Composition 3 A release layer-forming composition 3-3 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-3) solution was used instead of the acrylic polymer (A3-1) solution.

[0203] Example 5-4 Preparation of Release Layer-Forming Composition 4 A release layer-forming composition 3-4 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-4) solution was used instead of the acrylic polymer (A3-1) solution.

[0204] Example 5-5 Preparation of Release Layer-Forming Composition 5 A release layer-forming composition 3-5 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-5) solution was used instead of the acrylic polymer (A3-1) solution.

[0205] Example 5-6 Preparation of Release Layer-Forming Composition 6 A release layer-forming composition 3-6 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-6) solution was used instead of the acrylic polymer (A3-1) solution.

[0206] [Example 5-7] Preparation of release layer-forming composition 7 A release layer-forming composition 3-7 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-1) solution was replaced with the acrylic polymer (A3-6) solution and the acrylic polymer (S1) was changed to 0.17 g.

[0207] Example 5-8 Preparation of Release Layer-Forming Composition 8 A release layer-forming composition 3-8 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-7) solution was used instead of the acrylic polymer (A3-1) solution.

[0208] [Example 5-9] Preparation of release layer-forming composition 9 A release layer-forming composition 3-9 was prepared in the same manner as in Example 1-1, except that the acrylic polymer (A3-1) solution was replaced with the acrylic polymer (A3-7) solution and the acrylic polymer (S1) was changed to 0.17 g.

[0209] [Example 5-10] Preparation of release layer-forming composition 10 A release layer-forming composition 3-10 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-7) solution was used instead of the acrylic polymer (A3-1) solution and the acrylic polymer (S2) solution was used instead of the acrylic polymer (S1) solution.

[0210] Example 5-11 Preparation of Release Layer-Forming Composition 11 A release layer-forming composition 3-11 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-8) solution was used instead of the acrylic polymer (A3-1) solution.

[0211] Example 5-12 Preparation of Release Layer-Forming Composition 12 A release layer-forming composition 3-12 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-9) solution was used instead of the acrylic polymer (A3-1) solution.

[0212] [Comparative Example 3-1] Preparation of release layer-forming composition 13 A release layer-forming composition 3-13 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-1) solution was replaced with the acrylic polymer (A3-10) solution and the solvent was changed to CHN.

[0213] Comparative Example 3-2 Preparation of Release Layer-Forming Composition 14 A release layer-forming composition 3-14 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-11) solution was used instead of the acrylic polymer (A3-1) solution.

[0214] Comparative Example 3-3 Preparation of Release Layer-Forming Composition 15 A release layer-forming composition 3-15 was prepared in the same manner as in Example 5-1, except that the acrylic polymer (A3-12) solution was used instead of the acrylic polymer (A3-1) solution.

[0215] [4] Preparation of Release Layer and Resin Substrate [Example 6-1] Using a spin coater (conditions: rotation speed 1,000 rpm for approximately 30 seconds), release layer forming composition 3-1 was applied onto a glass substrate (100 mm x 100 mm, the same applies below). The resulting coating was heated at 100 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 10 minutes using a hot plate to form a release layer of approximately 0.1 μm thick on the glass substrate, thereby obtaining a glass substrate with a release layer. Thereafter, immediately using a spin coater (conditions: rotation speed 200 rpm for approximately 15 seconds), resin substrate forming composition F1 was applied onto the release layer (resin thin film) formed on the glass substrate. The resulting coating was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate of approximately 3 μm thick on the release layer, thereby obtaining a resin substrate and a glass substrate with a release layer. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation), and the resin substrate showed a transmittance of 90% or more at 400 nm.

[0216] [Example 6-2] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-2 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0217] [Example 6-3] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-3 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0218] [Example 6-4] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-4 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0219] [Example 6-5] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-5 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0220] [Example 6-6] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-6 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0221] [Example 6-7] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-7 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0222] [Example 6-8] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-8 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0223] [Example 6-9] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-9 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0224] [Example 6-10] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-10 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0225] [Example 6-11] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-11 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0226] [Example 6-12] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-12 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0227] [Comparative Example 4-1] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-13 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate / glass substrate with a release layer were obtained.

[0228] [Comparative Example 4-2] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-14 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate / glass substrate with a release layer were obtained.

[0229] [Comparative Example 4-3] A release layer and a resin substrate were prepared in the same manner as in Example 6-1, except that composition 3-15 for forming a release layer was used instead of composition 3-1 for forming a release layer, and a glass substrate with a release layer and a resin substrate and a glass substrate with a release layer were obtained.

[0230] [5] Evaluation of peelability The peelability of the glass substrates with a release layer and the resin substrate / glass substrate with a release layer obtained in Examples 6-1 to 6-12 and Comparative Examples 4-1 to 4-3 was confirmed by the same method as described in [4] of (I) above. The results are shown in Table 3.

[0231] [6] Curability Evaluation The glass substrates with release layers obtained in Examples 6-1 to 6-12 and Comparative Examples 4-1 to 4-3 were immersed in EDM at room temperature for 5 minutes. They were then heated at 100°C for 2 minutes using a hot plate and dried. The film thickness was measured before and after immersion in PGME, and the residual film ratio was calculated using the following formula. The degree of curing was evaluated based on the following criteria. The results are shown in Table 3. <Formula for residual film ratio> {(film thickness after immersion) / (film thickness before immersion)} x 100 <Evaluation criteria> ◎: residual film ratio ≥ 95% ○: residual film ratio 70-94% △: residual film ratio 50-69% ×: residual film ratio < 50%

[0232]

[0233] As shown in Table 3, it was confirmed that the release layers of the Examples had excellent adhesion to the glass substrate and were easily peeled off from the resin film. On the other hand, it was confirmed that the release layers of Comparative Examples 4-1 to 4-3 had excellent adhesion to the glass substrate but were difficult to peel off from the resin substrate.

Claims

1. (A) (A1) cellulose or a derivative thereof having a hydroxyalkyl group, or (A3) an acrylic polymer having a primary or secondary hydroxy group and no fluorine atom, (B) an acid compound or a salt thereof, (C) a crosslinking agent selected from compounds having a nitrogen atom substituted with a hydroxyalkyl group and / or an alkoxymethyl group; (D) a polymer additive containing a repeating unit represented by the following formula (a1), a repeating unit represented by the following formula (b), and a repeating unit represented by the following formula (c), (E) Solvent The composition for forming a release layer comprises the above-mentioned (D) polymer additive in an amount of 5 to 100 parts by mass per 100 parts by mass of the component (A). 【Chemistry 1】 (In the formula, R A are each independently a hydrogen atom or a methyl group, R B1 is a branched alkyl group having 3 or 4 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, R C is a hydroxyalkyl group having 1 to 10 carbon atoms; R D is a polycyclic alkyl group having 6 to 20 carbon atoms or an aryl group having 6 to 12 carbon atoms.

2. (A2) A polyester having a structural unit represented by the following formula [A2-1], a structural unit represented by the following formula [A2-2], or a structural unit represented by the following formula [A2-3]: (B) an acid compound or a salt thereof, (C) a crosslinking agent selected from compounds having a nitrogen atom substituted with a hydroxyalkyl group and / or an alkoxymethyl group; (D) a polymer additive containing a repeating unit represented by the following formula (a1), a repeating unit represented by the following formula (b), and a repeating unit represented by the following formula (c), (E) Solvent The composition for forming a release layer comprises the above-mentioned (D) polymer additive in an amount of 5 to 100 parts by mass per 100 parts by mass of the component (A). 【Chemistry 2】 (In the formula, X represents a group X represented by the following formula (X-1), and Y represents a structure having an aromatic group or an alicyclic group.) 【Chemistry 3】 (In the formula, L 1 represents an ether bond or an ester bond, X 1 represents an alkylene group having 1 to 10 carbon atoms, a cyclic unsaturated hydrocarbon group or a cyclic saturated hydrocarbon group, R 1 represents a single bond, an ether bond, carbonyl, sulfonyl, a saturated hydrocarbon group having 1 to 30 carbon atoms, an unsaturated hydrocarbon group having 2 to 30 carbon atoms or a saturated hydrocarbon group having 1 to 30 carbon atoms substituted with a fluorine atom, and p represents 0, 1 or 2.) 【Chemistry 4】 (In the formula, Cy is a tetravalent organic group containing an aliphatic ring, and two OH groups and two O atoms are bonded to the aliphatic ring, and Y has the same definition as Y in formula [A2-1].) 【Chemistry 5】 (In the formula, X and Y have the same definitions as X and Y in formula [A2-1].) 【Chemistry 6】 (In the formula, each R A is independently a hydrogen atom or a methyl group, R B1 is a branched alkyl group having 3 or 4 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, R C is a hydroxyalkyl group having 1 to 10 carbon atoms, and R D is a polycyclic alkyl group having 6 to 20 carbon atoms or an aryl group having 6 to 12 carbon atoms.)

3. In the repeating unit represented by the formula (b), R C 3. The composition for forming a release layer according to claim 1, wherein is a hydroxyalkyl group having 2 to 10 carbon atoms, and the carbon atom to which the hydroxy group is bonded is a secondary or tertiary carbon atom.

4. In the repeating unit represented by the formula (b), R C is a hydroxyalkyl group having 1 to 10 carbon atoms, the carbon atom to which the hydroxy group is bonded is a primary carbon atom, and the content of the repeating unit represented by formula (a1) is 25 mol % or more of all repeating units of the polymer additive (D).

5. The composition for forming a release layer according to claim 1 or 2, wherein the (D) polymer additive comprises a repeating unit represented by the following formula (a2), a repeating unit represented by the following formula (b), a repeating unit represented by the following formula (c), and a repeating unit represented by the following formula (d). 【Chemistry 7】 (In the formula, R A , R C and R D has the same meaning as above, R B2 is a branched alkyl group having 3 or 4 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, but does not include a 2-methyl-1,1,1,3,3,3-hexafluoroisopropyl group; R E is a single bond, a polycyclic alkylene group having 6 to 20 carbon atoms, or an arylene group having 6 to 12 carbon atoms; R F is a single bond or an alkylene group having 1 to 10 carbon atoms, R G is a methyl group, an ethyl group, or a hydroxy group.

6. 2. The composition for forming a release layer according to claim 1, wherein the component (A1) is at least one member selected from the group consisting of hydroxyethyl cellulose, hydroxypropyl cellulose, and derivatives thereof.

7. 3. The composition for forming a release layer according to claim 2, wherein the component (A2) is a polyester obtained by reacting a compound having two epoxy moieties with a compound having two carboxy groups.

8. 2. The composition for forming a release layer according to claim 1, wherein the component (A3) is an acrylic polymer having a polyethylene glycol ester group or a primary or secondary hydroxyalkyl ester group having 2 to 6 carbon atoms.

9. 2. The composition for forming a release layer according to claim 1, wherein the component (A3) is an acrylic polymer having a primary or secondary hydroxyalkyl group having 2 to 6 carbon atoms on the side chain.

10. The composition for forming a release layer according to any one of claims 1 to 9, wherein the component (B) is a sulfonic acid compound or a salt thereof.

11. The composition for forming a release layer according to any one of claims 1 to 10, wherein the (C) crosslinking agent is a compound represented by any one of the following formulas (C-1) to (C-5): 【Chemistry 8】 (In the formula, R 11 ~R 26 are each independently an alkyl group having 1 to 6 carbon atoms; R 27 is a hydrogen atom or a methyl group.

12. The composition for forming a release layer according to any one of claims 1 to 11, wherein the content of the crosslinking agent (C) is 10 to 100 parts by mass per 100 parts by mass of the component (A).

13. A release layer obtained from the composition for forming a release layer according to any one of claims 1 to 12.

14. A laminate comprising the release layer according to claim 13 and a resin layer having a light transmittance of 80% or more at a wavelength of 400 nm laminated thereon.

15. A step of applying the composition for forming a release layer according to any one of claims 1 to 12 to a substrate to form a release layer; forming a resin substrate having a light transmittance of 80% or more at a wavelength of 400 nm on the release layer; and A step of peeling off the resin substrate with a peeling force of 0.25 N / 25 mm or less. A method for producing a resin substrate comprising the steps of:

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