Resin composition, light-shielding film, and substrate with partitioning wall

Abstract

A purpose of the present invention is to provide a resin composition which enables the formation of a thick portioning wall having both of film tuckless properties after prebaking and heat resistance after curing according to a designed line width of a photomask in the processing with a high light exposure quantity. The purpose of the present invention can be achieved by a resin composition comprising a photoradical generator, a hindered phenol compound and / or a hindered amine compound, a polysiloxane containing a specific structure, and a (meth)acrylic polymer containing a specific structure and / or a cardo polymer containing a specific structure, in which the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo polymer is 30 / 70 to 70 / 30.

Description

Resin composition, light-shielding film, and partition-attached substrate

[0001] The present invention relates to a resin composition, a light-shielding film formed from the resin composition, and a substrate with partition walls having patterned partition walls.

[0002] In recent years, color display devices with improved light utilization efficiency have been proposed, each of which includes a light source, a wavelength conversion unit made of a wavelength-converting phosphor, a polarization separation unit, and a polarization conversion unit (see, for example, Patent Document 1).For example, a color display device has been proposed that includes a blue light source, a liquid crystal element, a phosphor that is excited by blue light to emit red fluorescence, a phosphor that is excited by blue light to emit green fluorescence, and a wavelength conversion unit that has a light-scattering layer that scatters the blue light (see, for example, Patent Document 2).

[0003] However, color filters containing color conversion phosphors as described in Patent Documents 1 and 2 emit fluorescence in all directions, resulting in low light extraction efficiency and insufficient brightness. In particular, in high-definition display devices such as 4K and 8K, the pixel size becomes smaller, making brightness issues more pronounced, and therefore higher brightness is required. In order to improve the brightness of display devices, it is effective to separate the color conversion phosphors with highly reflective partition walls. Furthermore, in order to prevent color mixing between adjacent pixels, the light blocking properties of the partition walls must be high. Therefore, a partition wall material that combines high reflectivity and high light blocking properties is required.

[0004] JP 2000-131683 A JP 2009-244383 A JP 2000-347394 A JP 2006-259421 A WO 2020 / 008969

[0005] In order to form barrier ribs that have both high reflectivity and high light-shielding properties, the inventors first investigated a method of using a material in which a light-shielding pigment was added to a white barrier rib material using a titanium oxide white pigment that exhibits high reflectivity. However, with this method, the white pigment and the light-shielding pigment absorbed all of the exposure light, preventing the light from reaching the bottom of the film during exposure, resulting in poor pattern processability.

[0006] As described in Patent Documents 3 and 4, techniques have been proposed in which a specific metal compound is added to blacken the film by baking it after pattern formation. However, these blackening techniques have the problem that baking at 400° C. or higher is required, and heating at 250° C. or lower does not improve the light-blocking properties.

[0007] The inventors therefore devised a design that allows the exposure light to pass through during the patterned exposure process after film formation, and then increases the light-blocking properties after heating the exposed film at a temperature of 120°C to 250°C. This was achieved by using a resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, a photopolymerization initiator or a quinone diazide compound, and a solvent (see Patent Document 5). In particular, the inventors discovered that using polysiloxane as the resin allows the formation of partition walls with high heat resistance.

[0008] However, this technology has the problem that when polysiloxane is used as the resin, the film becomes tacky after pre-baking, making it difficult to handle the substrate during processing. On the other hand, when (meth)acrylic polymers and / or cardo-based polymers are used as the resin, the tackiness after pre-baking is improved, but when forming thick barrier ribs with a height of 10 μm or more, there is a difference in the degree of hardening between the top and bottom of the film, and wrinkles occur due to the difference in stress after curing. Furthermore, it has also been found that barrier ribs formed using (meth)acrylic polymers and / or cardo-based polymers have lower heat resistance and weather resistance than those formed using siloxane polymers.

[0009] To form a thick barrier rib with a height of 10 μm or more, 300 to 500 mJ / cm ２ In some cases, pattern processing is performed with a high exposure dose, but in such cases, another problem has become apparent: the line width of the formed partition wall becomes significantly wider than the line width design of the photomask.

[0010] Therefore, an object of the present invention is to provide a resin composition that can form thick film partition walls that have both tackless film properties after pre-baking and heat resistance after curing, in accordance with the designed line width of a photomask even during high exposure processing.

[0011] As a result of extensive research, the present inventors have discovered that by forming partition walls from a resin composition containing a photoradical generator, a hindered phenol compound and / or a hindered amine compound, a polysiloxane having a specific structure, and a (meth)acrylic polymer having a specific structure and / or a cardo polymer having a specific structure, wherein the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo polymer is 30 / 70 to 70 / 30, it is possible to form thick film partition walls that have both tackless properties after pre-baking and heat resistance after curing in accordance with the designed line width of the photomask even during high exposure processing, and have completed the present invention.

[0012] That is, the present invention provides the following: [1] A resin composition containing: (i) a photoradical generator; (ii) a polysiloxane containing a structure having an aromatic ring represented by the following general formula (1) or (2) and a structure having a photoradical polymerizable group represented by the following general formula (3); and (iii) a (meth)acrylic polymer containing a structure having an aromatic ring represented by the following general formula (4) and a structure having a photoradical polymerizable group represented by the following general formula (5) and / or a cardo polymer having a structure represented by the following general formula (6) or (7) and a photoradical polymerizable group, wherein the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo polymer is 30 / 70 to 70 / 30.

[0013]

[0014] (In general formulas (1) to (7), R １ and R ２ R each independently represents hydrogen, a hydroxy group, an alkoxy group, a group having a siloxane bond, or a monovalent organic group having 1 to 30 carbon atoms. ３ and R ４ R each independently represents hydrogen, a hydroxyl group, or a monovalent organic group having 1 to 30 carbon atoms. ５ ~R ７ are each independently hydrogen, a monovalent organic group having 1 to 30 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an adjacent R ５ ~R７ R represents a group that forms an aromatic ring together. ８ represents hydrogen, a monovalent organic group having 1 to 30 carbon atoms, or an aryl group having 6 to 20 carbon atoms. １ , X ２ , X ３ and X ４ each independently represents an organic group having an aromatic ring. １ and Y ２ each independently represents an organic group having a photoradical polymerizable group. p, q, and r each independently represent an integer of 0 to 2, and s represents an integer of 1 or 2. a, b, c, d, e, f, and g each independently represent an integer of 1 or more. When a to e are 2 or more, multiple R １ , R ２ , R ３ , R ４ , R ５ , R ６ , R ７ , R ８ , X １ , X ２ , X ３ , X ４ , Y １ and Y ２may be the same or different.) [2] The resin composition according to [1], wherein the hindered phenol compound is a hindered phenol compound having two or more hindered phenol groups in one molecule. [3] The resin composition according to [1] or [2], wherein the hindered amine compound is a piperidine compound. [4] The resin composition according to any one of [1] to [3], wherein the hindered amine compound is a piperidine compound having a photopolymerizable group. [5] The resin composition according to any one of [1] to [4], wherein the polysiloxane has a weight-average molecular weight of 5,000 to 300,000, and contains 30 to 70 mol % of repeating units represented by general formula (1) or (2) and 15 to 70 mol % of repeating units represented by general formula (3) among all repeating units of the polysiloxane. [6] The resin composition according to any one of [1] to [5], wherein the glass transition temperature of the (meth)acrylic polymer and / or cardo polymer is 60°C or higher. [7] The resin composition according to any one of [1] to [6], further comprising at least one of a white pigment, a light-blocking pigment, and an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium. [8] The resin composition according to any one of [1] to [7], further comprising an oxime ester compound and a phosphine oxide compound as the photoradical generator. [9] The resin composition according to any one of [1] to [8], further comprising a liquid-repellent compound having a photopolymerizable group.

[10] A light-blocking film obtained by curing the resin composition according to any one of [1] to [9].

[11] A substrate with partition walls, having partition walls patterned (A-1) on a base substrate using the resin composition according to any one of [1] to [9], wherein the partition walls have a reflectance of 10% to 60% per 10 μm thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0 per 10 μm thickness at a wavelength of 450 nm.

[12] The partition-wall-equipped substrate according to

[11] , wherein the (A-1) patterned partition walls contain a resin, a white pigment, and a light-shielding pigment, and the light-shielding pigment is a pigment selected from titanium nitride, zirconium nitride, carbon black, a mixed pigment of a red pigment and a blue pigment in a weight ratio of 20 / 80 to 80 / 20, and particles of at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver.

[13] The partition-wall-equipped substrate according to

[11] or

[12] , wherein the (A-1) patterned partition walls further contain a hindered amine compound.

[14] The partition-wall-equipped substrate according to any one of

[11] to

[13] , further comprising (A-2) patterned light-shielding partition walls having an OD value per 1.0 μm thickness of 0.5 or more between the base substrate and the (A-1) patterned partition walls.

[15] The substrate with partition walls according to any one of

[11] to

[14] , which has pixel layers (B) arranged and separated by the patterned partition walls (A-1), and further containing a color-converting luminescent material.

[16] A display device comprising the substrate with partition walls according to any one of

[11] to

[15] , and a light source selected from the group consisting of a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.

[0015] The resin composition of the present invention can form a fine thick barrier rib pattern that has excellent tackless properties after pre-baking and heat resistance after curing, and that matches the designed line width of the photomask even during high exposure processing.

[0016] FIG. 1 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition and pixels containing a color-conversion luminescent material. FIG. 2 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition, a color-conversion luminescent material, and a light-shielding partition. FIG. 3 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition, a color-conversion luminescent material, and a color filter. FIG. 4 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition, a color-conversion luminescent material, a light-shielding partition, and a color filter. FIG. 5 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition, a color-conversion luminescent material, and a low refractive index layer. FIG. 6 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition, a color-conversion luminescent material, a low refractive index layer, and an inorganic protective layer I. FIG. 7 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition, a color-conversion luminescent material, a low refractive index layer, and an inorganic protective layer I. FIG. 8 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having a patterned partition, a color-conversion luminescent material, a light-shielding partition, a color filter, a low refractive index layer, and an inorganic protective layer I. FIG. 1 is a cross-sectional view showing one embodiment of a partition-attached substrate of the present invention, having a patterned partition, a color-converting luminescent material, a low refractive index layer, and an inorganic protective layer II. FIG. 2 is a cross-sectional view showing one embodiment of a partition-attached substrate of the present invention, having a patterned partition, a color-converting luminescent material, a color filter, and an inorganic protective layer III and / or a yellow organic protective layer. FIG. 3 is a cross-sectional view showing one embodiment of a partition-attached substrate of the present invention, having a patterned partition, a color-converting luminescent material, and an inorganic protective layer IV and / or a yellow organic protective layer. FIG. 4 is a cross-sectional view showing one embodiment of a partition-attached substrate of the present invention, having a patterned partition, and pixels containing a light-emitting source selected from an organic EL cell, a mini LED cell, and a micro LED cell. FIG. 5 is a cross-sectional view showing one embodiment of a partition-attached substrate of the present invention, having pixels containing a patterned partition, a color-converting luminescent material, and a light-emitting source selected from an organic EL cell, a mini LED cell, and a micro LED cell. FIG. 6 is a cross-sectional view showing the configuration of a display device used for color mixing evaluation in the examples.

[0017]

[0033] Preferred embodiments of the resin composition, the light-shielding film formed from the resin composition, the method for producing the light-shielding film, and the partition-attached substrate according to the present invention will be specifically described below, but the present invention is not limited to the following embodiments and can be modified in various ways depending on the purpose and application. The resin composition of the present invention can be suitably used as a material for forming partitions that separate light-emitting sources such as color-converting phosphors, organic EL cells, mini LED cells, and micro LED cells.

[0018] The resin composition of the present invention contains a photoradical generator, a hindered phenol compound and / or a hindered amine compound, a polysiloxane having a specific structure, and a (meth)acrylic polymer having a specific structure and / or a cardo polymer having a specific structure, and it is preferable that the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo polymer is 30 / 70 to 70 / 30.

[0019] When the resin composition of the present invention is used for forming a pattern of partition walls (A-1) described below, it preferably has negative photosensitivity. In order to impart negative photosensitivity, the resin composition of the present invention preferably contains a photoradical generator. By containing a photoradical generator, partition walls having a highly precise pattern shape can be formed.

[0020] The photoradical generator may be any one that decomposes and / or reacts upon irradiation with light (including ultraviolet light and electron beams) to generate radicals. Examples include α-aminoalkylphenone compounds such as 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; phosphine oxide compounds such as 2,4,6-trimethylbenzoylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)-phosphine oxide; 1-phenyl-1,2-propanedione-2-( and oxime ester compounds such as 1-phenyl-1,2-butanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butadione-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, and ethanone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime). Two or more of these may be contained.

[0021] Among these, in order to form thick partition walls, it is preferable to contain an oxime ester compound that is resistant to oxygen damage and effective for surface curing, and a phosphine oxide compound that absorbs longer wavelength light to generate radicals and is effective for bottom curing. From the viewpoint of effectively promoting radical curing, the content of the photoradical generator in the resin composition of the present invention is preferably 0.01 wt% or more, and more preferably 1 wt% or more, based on the solid content. On the other hand, from the viewpoint of suppressing elution of residual photoradical generator, the content of the photoradical generator is preferably 20 wt% or less, and more preferably 10 wt% or less, based on the solid content.

[0022] The resin composition of the present invention preferably contains a hindered phenol compound and / or a hindered amine compound. By containing a hindered phenol compound and / or a hindered amine compound, radicals can be appropriately trapped to suppress overreaction, and thickening of the line width can be suppressed when a partition wall pattern is formed with a high exposure dose, making it possible to form a fine partition wall pattern with the designed line width of the photomask.

[0023] The hindered phenol compound is preferably a hindered phenol compound having two or more hindered phenol groups per molecule. Here, the term "hindered phenol group" refers to a functional group containing a structure having at least one t-butyl group at a carbon site adjacent to the carbon site to which the hydroxyl group of a phenolic hydroxyl group is bonded. The hindered phenol group preferably has a structure having t-butyl groups at two carbon sites adjacent to the carbon site to which the hydroxyl group of the phenolic hydroxyl group is bonded. By containing two or more hindered phenol groups per molecule, the radical trapping effect is appropriately limited, suppressing line width thickening when forming a barrier rib pattern at a high exposure dose and enabling the formation of a fine barrier rib pattern according to the design line width of the photomask. It is more preferable for the compound to have three or more hindered phenol groups per molecule, and even more preferable for the compound to have four or more hindered phenol groups per molecule.

[0024] Examples of the hindered phenol compound include 3,5-di-t-butyl-4-hydroxytoluene, octadecyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, hexamethylenebis[3(3,5-di-t-butyl-4-hydroxyphenylpropionate], thiodiethylenebis[3(3,5-di-t-butyl-4-hydroxyphenylpropionate], ethylenebis(oxyethylene)bis[3-(5-t-butyl-4-hydroxy-m-tolyl] ) propionate, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, pentaerythritol tetrakis(3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-(2-hydroxy [3,5-di-t-pentylphenyl)ethyl]-4,6-di-t-pentylphenyl acrylate, 2,2'-methylenebis(6-t-butyl-4-methylphenol or 4,4'-butylidenebis(6-t-butyl-3-methylphenol), 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 4,4',4''-(1-methylpropanyl-3-ylidene)tris(6-t- butyl-m-cresol), 6,6'-di-t-butyl-4,4'-butylidenedi-m-cresol, 3,9-bis-(2-(3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro[5,5]undecene, 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, and the like. Two or more of these may be contained.

[0025] Among these, hexamethylene bis[3(3,5-di-t-butyl-4-hydroxyphenylpropionate], thiodiethylene bis[3(3,5-di-t-butyl-4-hydroxyphenylpropionate], ethylene bis(oxyethylene)bis[3-(5-t-butyl-4-hydroxy-m-tolyl)propionate], tris-(3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, 1,3,5-trimethyl-2,4,6-tris ... hydroxybenzyl)benzene, pentaerythritol tetrakis(3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-(2-hydroxy3,5-di-t-pentylphenyl)ethyl]-4,6-di-t-pentylphenyl acrylate, 2,2'-methylenebis(6-t-butyl-4-methylphenol or 4,4'-butylidenebis(6-t-butyl-3-methylphenol), 1,3 ,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 4,4',4''-(1-methylpropanyl-3-ylidene)tris(6-t-butyl-m-cresol), 6,6'-di-t-butyl-4,4'-butylidene-m-cresol, 3,9-bis-(2-(3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro[5,5]undecene, 1,3,5- Tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene is preferred, and examples thereof include 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, pentaerythritol tetrakis(3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-(2-hydroxy-3,5-di-t-pentylphenyl)ethyl]-4,6-di-t-pentylphenyl acrylate, 2,2'-methylenebis(6-t-butyl-4-methylphenol or 4,4'-butylidenebis(6-t-butyl-3-methylphenol), 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 4,4',4''-(1-methylpropanyl-3-ylidene)tris(6-t-butyl-m-cresol), and 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene are more preferred.

[0026] The hindered amine compound refers to a compound having at least one hindered amino group in the molecule. The hindered amino group is preferably a functional group having a secondary or tertiary amine structure bonded to two quaternary carbons. The hindered amine compound is preferably a piperidine compound. By containing a piperidine compound, the radical trapping effect is appropriately limited, and line width thickening is suppressed when forming a barrier rib pattern with a high exposure dose, making it possible to form a fine barrier rib pattern according to the designed line width of the photomask. A piperidine compound having a 2,2,6,6-tetramethylpiperidine structure is more preferable.

[0027] Examples of the hindered amine compound include bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butyl malonate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, methyl-1,2,2,6,6-pentamethyl-4-piperidylsebacate, 1,2,2,6,6-pentamethyl-4-piperidylmethacrylate, 2,2,6,6-tetramethyl- 4-piperidyl methacrylate, a reaction product of decanedioic acid bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester with 1,1-dimethylethyl hydroperoxide and octane, tetrakis(1,2,2,6,6-pentamethyl-4-pyridyl)butane-1,2,3,4-tetracarboxylate or tetrakis(2,2,6,6-tetramethyl-4-pyridyl)butane-1,2,3,4-tetracarboxylate.

[0028] Among these, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate and 2,2,6,6-tetramethyl-4-piperidyl methacrylate, which are piperidine compounds having a photopolymerizable group, are preferred. By using a piperidine compound having a photopolymerizable group, radicals can be trapped while the radical reaction proceeds, and curing of the bottom of the film can be further promoted. In this case, the photopolymerizable group may be photopolymerized in the partition wall (A-1) made of a photocured product of the negative photosensitive resin composition.

[0029] The content of the hindered phenol compound and / or hindered amine compound in the resin composition of the present invention is preferably 0.050 wt% or more, more preferably 0.070 wt% or more, based on the solid content, from the viewpoint of suppressing line thickening. On the other hand, from the viewpoint of efficiently proceeding with the radical reaction, the content of the hindered phenol compound and / or hindered amine compound is preferably 5.0 wt% or less, more preferably 3.0 wt% or less, based on the solid content. In particular, when a hindered phenol compound is used, the radical trapping effect is large, so the content is more preferably 0.10 wt% or more and 0.50 wt% or less, based on the solid content. Furthermore, when a piperidine compound having a photopolymerizable group is used as the hindered amine compound, the content is more preferably 0.10 wt% or more and 2.5 wt% or less, from the viewpoint of accelerating the curing of the film bottom.

[0030] The resin composition of the present invention contains a polysiloxane as a resin. The polysiloxane has the function of improving the crack resistance, weather resistance, and heat resistance of the partition walls. From the viewpoint of improving the crack resistance of the partition walls in heat treatment, the content of polysiloxane in the solid content of the resin composition is preferably 10% by weight or more, and more preferably 15% by weight or more. On the other hand, from the viewpoint of improving light fastness, the content of polysiloxane in the solid content of the resin composition is preferably 55% by weight or less, and more preferably 50% by weight or less. Here, the solid content refers to all components contained in the resin composition excluding volatile components such as solvents. The amount of solid content can be determined by heating the resin composition and measuring the residue after evaporating the volatile components.

[0031] Polysiloxane is a hydrolysis / dehydration condensation product of organosilane. Polysiloxane contains a structure having an aromatic ring represented by the following general formula (1) or (2) and a structure having a photoradical polymerizable group represented by the following general formula (3). It may further contain other repeating units.

[0032]

[0033] (In general formulas (1) to (3), R １ and R ２Each of X independently represents hydrogen, a hydroxy group, an alkoxy group, a group having a siloxane bond, or a monovalent organic group having 1 to 30 carbon atoms. １ , X ２ , and X ３ represents an organic group having an aromatic ring. １ represents an organic group having a photoradical polymerizable group. a, b, and c each independently represent an integer of 1 or more. When a to c are 2 or more, a plurality of R １ , R ２ , X １ , X ２ , X ３ , and Y １ may be the same or different. １ or R ２ The "group having a siloxane bond" represented by the formula (I) refers to a "-Si-O-Si-" bond formed by condensation between silanol groups. The functional group bonded to the Si atom to which the bond is made is not particularly limited. １ or R ２ The "monovalent organic group having 1 to 30 carbon atoms" represented by the formula (I) is preferably an alkyl group having 1 to 6 carbon atoms (including linear and branched alkyl groups). Specific examples of these groups include a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. １ , X ２ , or X ３ The "organic group having an aromatic ring" represented by the formula (I) is preferably an aromatic hydrocarbon group having 6 to 15 carbon atoms. Specific examples of these groups include a phenyl group, a benzyl group, a styryl group, a naphthyl group, and a biphenyl group. １ The "photoradically polymerizable group" represented by the formula (I) is preferably an ethylenically unsaturated group, and more preferably a functional group containing a methacryl group and / or an acrylic group. Specific preferred examples of these include a 3-methacryloxypropyl group and a 3-acryloxypropyl group. The aforementioned a, b, and c each independently represent an integer of 1 or more, with a preferably being 10 to 60, more preferably being 20 to 55, b preferably being 10 to 60, more preferably being 20 to 55, and c preferably being 5 to 60, more preferably being 10 to 50.

[0034] By including a repeating unit derived from an alkoxysilane compound containing an organic group having an aromatic ring represented by general formula (1) or (2), the Tg of the polysiloxane can be increased, and the tackless properties after pre-baking can be improved.

[0035] Of all repeating units in the polysiloxane, it is preferable that the repeating units represented by general formula (1) or (2) account for 20 to 80 mol%. By including 20 mol% or more of repeating units represented by general formula (1) or (2), the tackless property after prebaking can be further improved. The content of repeating units represented by general formula (1) or (2) is more preferably 25 mol% or more, and even more preferably 30 mol% or more. On the other hand, by including 80 mol% or less of repeating units represented by general formula (1) or (2), siloxane thermal condensation in the film can be efficiently promoted, thereby improving the degree of hardening of the film. The content of repeating units represented by general formula (1) or (2) is more preferably 75 mol% or less, and even more preferably 70 mol% or less.

[0036] Among the alkoxysilane compounds containing an organic group having an aromatic ring represented by general formula (1) or (2), it is preferable to contain a repeating unit derived from a bifunctional alkoxysilane compound containing two organic groups having an aromatic ring represented by general formula (2). By containing a repeating unit derived from a bifunctional alkoxysilane compound represented by general formula (2), excessive thermal polymerization (condensation) of polysiloxane due to heating can be suppressed, and the crack resistance of the partition walls can be improved.

[0037] By containing 10 mol% or more of the repeating unit represented by general formula (2), crack resistance can be further improved. The content of the repeating unit represented by general formula (2) is more preferably 15 mol% or more, and even more preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by general formula (2), the molecular weight of the polysiloxane can be sufficiently increased during polymerization, thereby improving coatability. The content of the repeating unit represented by general formula (2) is more preferably 70 mol% or less.

[0038] Furthermore, since the polysiloxane contains a repeating unit derived from an alkoxysilane compound containing an organic group having a photoradical polymerizable group represented by general formula (3), a crosslinking reaction proceeds in the exposed areas due to radicals generated from the photoradical generator, thereby increasing the degree of cure of the exposed areas.

[0039] Of all the repeating units in the polysiloxane, it is preferable that the repeating unit represented by general formula (3) accounts for 10 to 80 mol %. By including 10 mol % or more of the repeating unit represented by general formula (3), radical crosslinking between polysiloxanes in the film can be efficiently promoted, improving the degree of hardening of the film. The content of the repeating unit represented by general formula (3) is more preferably 12 mol % or more, and even more preferably 15 mol % or more. On the other hand, by including 80 mol % or less of the repeating unit represented by general formula (3), excessive radical crosslinking of the polysiloxane can be suppressed, improving the crack resistance of the partition wall. The content of the repeating unit represented by general formula (3) is more preferably 75 mol % or less, and even more preferably 70 mol % or less.

[0040] Examples of other repeating units that may be contained in the polysiloxane include repeating units derived from an alkoxysilane compound containing an organic group having a cyclic ether group such as an epoxy group and / or an oxetanyl group, repeating units derived from an alkoxysilane compound containing an organic group having an alkyl group having 1 to 30 carbon atoms, repeating units derived from an alkoxysilane compound containing an organic group having an acid anhydride, and repeating units derived from an alkoxysilane compound containing an organic group having a fluorine group. These do not necessarily need to be contained, and if they are contained, their content is preferably 80 mol % or less, more preferably 70 mol % or less, of all repeating units.

[0041] The repeating units represented by the above general formulas (1), (2), and (3) are derived from alkoxysilane compounds represented by the following general formulas (8), (9), and (10), respectively. That is, polysiloxanes containing repeating units represented by the above general formulas (1), (2), and (3) can be obtained by hydrolyzing and polycondensing alkoxysilane compounds containing alkoxysilane compounds represented by the following general formulas (8), (9), and (10). Other alkoxysilane compounds may also be used.

[0042]

[0043] In the above general formulas (8), (9) and (10), R １ , R ２ , X １ , X ２ , X ３ , and Y １ are R in the general formulas (1), (2) and (3), respectively. １ , R ２ , X １ , X ２ , X ３ , and Y １ represents the same group as ９ may be the same or different and represent a monovalent organic group having 1 to 20 carbon atoms, preferably an alkyl group having 1 to 6 carbon atoms. ９ ) ２ " is a symbol that indicates that the Si atom is "-(OR ９ ) means that two are bonded.

[0044] Examples of the alkoxysilane compound represented by general formula (8) include aromatic ring-containing alkoxysilane compounds such as phenyltrimethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilanethyltrimethoxysilane, biphenyltrimethoxysilane, 3-trimethoxysilylpropylphthalic anhydride, 3-triethoxysilylpropylphthalic anhydride, phenylmethyldimethoxysilane, phenylethyldimethoxysilane, phenylpropyldimethoxysilane, and styryltrimethoxysilane. Two or more of these may be used.

[0045] Examples of alkoxysilane compounds represented by general formula (9) include alkoxysilane compounds containing two aromatic rings, such as diphenyldimethoxysilane, 1-naphthylphenyldimethoxysilane, tolylphenyldimethoxysilane, biphenylphenyldimethoxysilane, 1-naphthyltolyldimethoxysilane, and 1-naphthylbiphenyldimethoxysilane. Two or more of these may be used. Among these, from the viewpoints of crack resistance and tackiness, diphenyldimethoxysilane, diphenyldiethoxysilane, styryltrimethoxysilane, and styryltriethoxysilane are preferred.

[0046] Examples of alkoxysilane compounds represented by general formula (10) include photoradical polymerizable group-containing alkoxysilane compounds such as vinyltrimethoxysilane, allyltrimethoxysilane, γ-acryloylpropyltrimethoxysilane, γ-acryloylpropyltriethoxysilane, γ-methacryloylpropyltrimethoxysilane, γ-methacryloylpropyltriethoxysilane, vinylmethyldimethoxysilane, styrylmethyldimethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, and γ-acryloylpropylmethyldimethoxysilane. Two or more of these may be used. Among these, γ-acryloylpropyltrimethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ-methacryloylpropyltrimethoxysilane, and γ-methacryloylpropylmethyldimethoxysilane are preferred from the viewpoint of photopolymerization reactivity.

[0047] Since the styryl group is both a photoradical polymerizable group and an aromatic group, when a styryl group-containing alkoxysilane compound such as styryltrimethoxysilane or styryltriethoxysilane is used as the alkoxysilane compound represented by general formula (10), it is not necessary to include any other alkoxysilane compound represented by general formula (8) or (9). That is, when a polysiloxane contains a structure having a styryl group as the structure represented by general formula (3), it is not necessary to include any other structure represented by general formula (1) or (2). Similarly, when a styryl group-containing alkoxysilane compound such as styryltrimethoxysilane or styryltriethoxysilane is used as the alkoxysilane compound represented by general formula (8), it is not necessary to include any other alkoxysilane compound represented by general formula (10). That is, when a polysiloxane contains a structure having a styryl group as the structure represented by general formula (1), it is not necessary to include any other structure represented by general formula (3). In this case, the content of the repeating unit having a structure having a styryl group is preferably 12 mol% or more, more preferably 15 mol% or more, from the viewpoint of improving the tackless property after prebaking, while the content of the repeating unit having a structure having a styryl group is more preferably 70 mol% or less, even more preferably 60 mol% or less, from the viewpoint of suppressing excessive radical crosslinking of the polysiloxane and improving the crack resistance of the partition walls.

[0048] Other alkoxysilane compounds include, for example, dimethyldimethoxysilane, ethylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethylethyldimethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, trifluoropropylmethyldimethoxysilane, Bifunctional alkoxysilane compounds such as silane and trifluoropropylethyldimethoxysilane; trifunctional alkoxysilane compounds such as methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-ureidopropyltrimethoxysilane, and 3-ureidopropyltriethoxysilane; 3-glycidoxypropyltrimethoxysilane, 2-(3,4-ethylhexyl)-2-methyl-2-propanol; alkoxysilane compounds containing an epoxy group or an oxetane group, such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, and 3-ethyl-3-{[3-(trimethoxysilyl)propoxy]methyl}oxetane; 3-trimethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, and 3-trimethoxysilylpropylsilane; Examples of suitable alkoxysilane compounds include carboxyl group-containing alkoxysilane compounds such as cyclohexyldicarboxylic anhydride and 3-trimethoxysilylpropylphthalic anhydride; fluorine group-containing alkoxysilane compounds such as trifluoropropyltrimethoxysilane and perfluoropentyltrimethoxysilane; tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane and silicate 51 (tetraethoxysilane oligomer); and monofunctional alkoxysilane compounds such as trimethylmethoxysilane and triphenylmethoxysilane. Two or more of these may be used.

[0049] The other alkoxysilane compounds preferably contain at least one carboxyl group-containing alkoxysilane compound, which improves the solubility of unexposed areas and improves resolution during pattern processing.

[0050] The weight average molecular weight (Mw) of the polysiloxane is preferably 1,000 or more, more preferably 2,000 or more, from the viewpoint of coatability. From the viewpoint of tackiness, it is even more preferably 5,000 or more. On the other hand, from the viewpoint of developability, the Mw of the polysiloxane is preferably 500,000 or less, more preferably 300,000 or less. Here, the Mw of the polysiloxane in the present invention refers to the polystyrene equivalent value measured by gel permeation chromatography (GPC). The measurement method is as described in the examples below.

[0051] Polysiloxanes can be obtained by hydrolyzing the aforementioned organosilane compound and then subjecting the hydrolyzate to a dehydration condensation reaction in the presence or absence of a solvent. Various conditions for the hydrolysis can be set to suit the physical properties appropriate for the intended application, taking into account factors such as the reaction scale and the size and shape of the reaction vessel. Examples of the various conditions include acid concentration, reaction temperature, and reaction time. Acid catalysts that can be used for the hydrolysis reaction include hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polycarboxylic acids or their anhydrides, and ion exchange resins. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid, and phosphoric acid is preferred.

[0052] When an acid catalyst is used in the hydrolysis reaction, the amount of acid catalyst added is preferably 0.05 parts by weight or more, more preferably 0.1 parts by weight or more, per 100 parts by weight of the total alkoxysilane compounds used in the hydrolysis reaction, from the viewpoint of proceeding hydrolysis more rapidly. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of acid catalyst added is preferably 20 parts by weight or less, more preferably 10 parts by weight or less, per 100 parts by weight of the total alkoxysilane compounds. Here, the amount of all alkoxysilane compounds refers to the amount including all of the alkoxysilane compounds, their hydrolysates, and their condensates. The same applies hereinafter.

[0053] The hydrolysis reaction can be carried out in a solvent. The solvent can be appropriately selected taking into consideration the stability, wettability, volatility, etc. of the resin composition. When a solvent is produced by the hydrolysis reaction, it is also possible to carry out the hydrolysis without a solvent. When used in a resin composition, it is also preferable to adjust the resin composition to an appropriate concentration by adding a solvent after the hydrolysis reaction is completed. Furthermore, after the hydrolysis, it is also possible to distill and remove all or part of the produced alcohol, etc. by heating and / or under reduced pressure, and then add a suitable solvent.

[0054] Examples of methods for the dehydration condensation reaction include heating the silanol compound solution obtained by the hydrolysis reaction of the organosilane compound as is. The heating temperature is preferably 50°C or higher and the boiling point of the solvent or lower, and the heating time is preferably 1 to 100 hours. Furthermore, reheating or the addition of a base catalyst may be performed to increase the degree of polymerization of the polysiloxane. Depending on the purpose, after the dehydration condensation reaction, an appropriate amount of the produced alcohol may be distilled and removed under heating and / or reduced pressure, and then a suitable solvent may be added.

[0055] The resin composition of the present invention further contains, as a resin, a (meth)acrylic polymer including a structure having an aromatic ring represented by the general formula (4) and a structure having a photoradical polymerizable group represented by the general formula (5), and / or a cardo polymer having a structure represented by the general formula (6) or the general formula (7) and a photoradical polymerizable group. The (meth)acrylic polymer and / or cardo polymer has the function of improving tacklessness after prebaking. From the viewpoint of improving tacklessness after prebaking, the content of the (meth)acrylic polymer and / or cardo polymer in the solid content of the resin composition is preferably 10% by weight or more, more preferably 15% by weight or more. On the other hand, from the viewpoint of improving the heat resistance of the partition walls, the content of the (meth)acrylic polymer and / or cardo polymer in the solid content of the resin composition is preferably 55% by weight or less, more preferably 50% by weight or less.

[0056] The (meth)acrylic polymer is preferably a polymer obtained by radical polymerization of a (meth)acrylic compound and / or a styrene compound. There are no particular limitations on the radical polymerization catalyst, and azo compounds such as azobisisobutyronitrile and organic peroxides such as benzoyl peroxide are commonly used. The radical polymerization conditions can be appropriately set, but it is preferable to add a (meth)acrylic compound and / or a styrene compound and a radical polymerization catalyst to a solvent, thoroughly replace the atmosphere in a reaction vessel with nitrogen by bubbling or vacuum degassing, and then react at 60 to 110°C for 30 to 300 minutes. Furthermore, a chain transfer agent such as a thiol compound may be used as needed.

[0057] When the (meth)acrylic polymer has an ethylenically unsaturated bond, the (meth)acrylic polymer is preferably one obtained, for example, by radical polymerization of a (meth)acrylic compound and / or a styrene compound, followed by an addition reaction with a glycidyl compound having an ethylenically unsaturated double bond group. There are no particular limitations on the catalyst used in the addition reaction of the glycidyl compound having an ethylenically unsaturated double bond group, and known catalysts can be used. Examples of catalysts that can be used include amino-based catalysts such as dimethylaniline, 2,4,6-tris(dimethylaminomethyl)phenol, and dimethylbenzylamine; tin-based catalysts such as tin(II) 2-ethylhexanoate and dibutyltin laurate; titanium-based catalysts such as titanium(IV) 2-ethylhexanoate; phosphorus-based catalysts such as triphenylphosphine; and chromium-based catalysts such as chromium acetylacetonate and chromium chloride. Among these, when used simultaneously with a polysiloxane, phosphorus-based catalysts are preferred from the viewpoint of improving the storage stability of the polysiloxane.

[0058] The (meth)acrylic polymer used in the resin composition of the present invention contains a structure represented by the following general formula (4) and a structure represented by the following general formula (5). It may also contain other structures.

[0059]

[0060] (In general formulas (4) and (5), R ３ and R ４ Each of X independently represents hydrogen, a hydroxyl group, or a monovalent organic group having 1 to 30 carbon atoms. ４ represents an organic group having an aromatic ring. ２ represents an organic group having a photoradical polymerizable group. d and e each independently represent an integer of 1 or more. When d and e are 2 or more, a plurality of R ３ , R ４ , X ４ , and Y ２ may be the same or different.) R ３ or R ４The "monovalent organic group having 1 to 30 carbon atoms" represented by the formula (I) is preferably an alkyl group having 1 to 6 carbon atoms (including linear and branched alkyl groups). Specific examples of these groups include a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. X ４ The "organic group having an aromatic ring" represented by the formula (I) is preferably an aromatic hydrocarbon group having 6 to 15 carbon atoms. Specific examples of these groups include a phenyl group, a benzyl group, a styryl group, a naphthyl group, and a biphenyl group. ２ The "organic group having a photoradical polymerizable group" represented by the formula (I) is preferably an ethylenically unsaturated group, and more preferably a functional group containing a methacrylic group and / or an acrylic group. Specific examples of these include functional groups in which glycidyl methacrylate and / or glycidyl acrylate are added to a carboxylic acid group. d and e each independently represent an integer of 1 or more; d is preferably 10 to 60, more preferably 20 to 50, and e is preferably 5 to 60, more preferably 10 to 50.

[0061] The repeating unit represented by general formula (4) is derived from a (meth)acrylic acid compound and / or a styrene compound containing an organic group having an aromatic ring. By containing an organic group having an aromatic ring, tackless properties can be improved.

[0062] Of all the repeating units in the (meth)acrylic polymer, it is preferable that the repeating unit represented by general formula (4) account for 10 to 80 mol %. By containing 10 mol % or more of the repeating unit represented by general formula (4), the tackless property of the film after prebaking can be improved. The content of the repeating unit represented by general formula (4) is more preferably 15 mol % or more, and even more preferably 20 mol % or more. On the other hand, by containing 80 mol % or less of the repeating unit represented by general formula (4), the degree of hardness of the partition walls can be improved. The content of the repeating unit represented by general formula (4) is more preferably 75 mol % or less, and even more preferably 70 mol % or less.

[0063] Examples of (meth)acrylic acid compounds containing an organic group having an aromatic ring include phenyl (meth)acrylate, benzyl (meth)acrylate, tolyl (meth)acrylate, and naphthyl (meth)acrylate. Examples of styrene compounds include p-methylstyrene, o-methylstyrene, m-methylstyrene, and α-methylstyrene. Among these, styrene is preferred. Copolymerization of styrene improves the heat resistance and moist heat resistance of the resulting cured film.

[0064] The repeating unit represented by general formula (5) preferably has an ethylenically unsaturated group as a photoradical polymerizable group. By containing an ethylenically unsaturated group as a photoradical polymerizable group, a crosslinking reaction proceeds with radicals generated from a photoradical generator in exposed areas, thereby increasing the degree of cure of the exposed areas. It is preferable that the (meth)acrylic polymer contains 10 to 80 mol% of repeating units represented by general formula (5) among all repeating units. By containing 10 mol% or more of repeating units represented by general formula (5), radical crosslinking between resins in the film can proceed efficiently, thereby improving the degree of cure of the film. The content of repeating units represented by general formula (5) is more preferably 15 mol% or more, and even more preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of repeating units represented by general formula (5), excessive radical crosslinking of the (meth)acrylic polymer can be suppressed, thereby improving the crack resistance of the partition walls. The content of repeating units represented by general formula (5) is more preferably 75 mol% or less, and even more preferably 70 mol% or less.

[0065] Examples of ethylenically unsaturated groups include vinyl groups, allyl groups, acrylic groups, and methacrylic groups. A common method for adding such side chains to an acrylic (co)polymer is to subject a carboxylic acid group of the acrylic (co)polymer to an addition reaction with an ethylenically unsaturated compound having a glycidyl group or (meth)acrylic acid chloride, as described above. Alternatively, a compound having an ethylenically unsaturated group can be added using isocyanate. Examples of the ethylenically unsaturated compound having a glycidyl group, acrylic acid, or methacrylic acid chloride herein include glycidyl (meth)acrylate, α-ethylglycidyl (meth)acrylate, α-n-propylglycidyl (meth)acrylate, α-n-butylglycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxyheptyl (meth)acrylate, α-ethyl-6,7-epoxyheptyl (meth)acrylate, allyl glycidyl ether, vinyl glycidyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinyl Examples thereof include vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-diglycidyloxymethylstyrene, 2,4-diglycidyloxymethylstyrene, 2,5-diglycidyloxymethylstyrene, 2,6-diglycidyloxymethylstyrene, 2,3,4-triglycidyloxymethylstyrene, 2,3,5-triglycidyloxymethylstyrene, 2,3,6-triglycidyloxymethylstyrene, 3,4,5-triglycidyloxymethylstyrene, 2,4,6-triglycidyloxymethylstyrene, acrylic acid chloride, and methacrylic acid chloride.

[0066] The other repeating units in the (meth)acrylic polymer preferably contain a carboxyl group and / or an acid anhydride group. The inclusion of a carboxyl group and / or an acid anhydride group increases the solubility contrast between exposed and unexposed areas, improving the resolution at which patterning is possible. Examples of (meth)acrylic compounds containing a carboxyl group and / or an acid anhydride group include (meth)acrylic acid, (meth)acrylic anhydride, itaconic acid, itaconic anhydride, mono(2-acryloyloxyethyl) succinate, mono(2-acryloyloxyethyl) phthalate, and mono(2-acryloyloxyethyl) tetrahydrophthalate. Two or more of these may be used.

[0067] The (meth)acrylic polymer may not necessarily contain other repeating units, and if it does, its content is preferably 90 mol% or less, more preferably 80 mol% or less, of the total repeating units. The weight-average molecular weight (Mw) of the (meth)acrylic polymer is not particularly limited, but is preferably 2,000 or more and 200,000 or less, in terms of polystyrene, as measured by gel permeation chromatography (GPC). By setting the Mw within the above range, good coating properties can be obtained, and the solubility of the unexposed areas in the developer during pattern formation is also good.

[0068] The (meth)acrylic polymer used in the resin composition of the present invention may be synthesized as in the synthesis examples described below, or a commercially available product may be used. Examples of commercially available (meth)acrylic polymers include AX3-BX-TR-101, AX3-BX-TR-102, AX3-BX-TR-106, AX3-BX-TR-107, AX3-BX-TR-108, AX3-BX-TR-109, AX3-BX-TR-110, AX3-RD-TR-501, AX3-RD-TR-502, AX3-R Examples include D-TR-503, AX3-RD-TR-504, AX3-RD-TR-103, AX3-RD-TR-104 (trade names, manufactured by Nippon Shokubai Co., Ltd.), SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, SPCR-215X (trade names, manufactured by Showa Denko K.K.), and X-4007 (trade name, manufactured by NOF Corporation). Among these, SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, and SPCR-215X, which have an aromatic group and a photoradical polymerizable group, are preferred. Two or more of these may be used.

[0069] The cardo polymer used in the resin composition of the present invention contains a structure represented by the following general formula (6) or (7) and a photoradical polymerizable group. It may also contain other structures.

[0070]

[0071] (In general formulas (6) and (7), R ５ ~R ７ is hydrogen, a monovalent organic group having 1 to 30 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an adjacent R ５ ~R ７ R represents a group that forms an aromatic ring together. ８ represents hydrogen, a monovalent organic group having 1 to 30 carbon atoms, or an aryl group having 6 to 20 carbon atoms. p, q, and r are integers of 0 to 2, and s is an integer of 1 or 2. f to g each independently represent an integer of 1 or more. When f to g are 2 or more, multiple R ５ , R ６ , R ７ , and R ８may be the same or different.) Here, as the "monovalent organic group having 1 to 30 carbon atoms", an alkyl group having 1 to 6 carbon atoms (including linear and branched alkyl groups) is preferred. Specific preferred examples of these include a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. Furthermore, as the "aryl group having 6 to 20 carbon atoms", an aromatic hydrocarbon group having 6 to 15 carbon atoms is preferred. Specific preferred examples of these include a phenyl group, a benzyl group, a styryl group, a naphthyl group, and a biphenyl group. Furthermore, from the viewpoint of ease of synthesis, R ５ , R ６ , and R ７ is preferably hydrogen, and R ８ is preferably a phenyl group. f and g each independently represent an integer of 1 or more, with f preferably being 2 to 60, more preferably being 3 to 50, and e preferably being 2 to 60, more preferably being 3 to 50.

[0072] The "photoradical polymerizable group" contained in the cardo polymer is preferably an ethylenically unsaturated group. By containing an ethylenically unsaturated group as the photoradical polymerizable group, a crosslinking reaction proceeds with radicals generated from a photoradical generator in the exposed area, thereby increasing the degree of hardening of the exposed area. Examples of ethylenically unsaturated groups include vinyl groups, allyl groups, styryl groups, acrylic groups, and methacrylic groups. Functional groups containing styryl groups, methacrylic groups, and acrylic groups are preferred. A preferred specific example is a functional group in which glycidyl methacrylate and / or glycidyl acrylate are added to a carboxylic acid group.

[0073] The cardo polymer used in the resin composition of the present invention preferably contains an alkali-soluble group as an "other structure." The alkali-soluble group preferably contains a carboxyl group and / or an acid anhydride group. The presence of a carboxyl group and / or an acid anhydride group increases the solubility contrast between exposed and unexposed areas, improving the resolution at which patterning is possible.

[0074] The weight average molecular weight (Mw) of the cardo polymer is not particularly limited, but is preferably 2,000 to 200,000 in polystyrene equivalent as measured by gel permeation chromatography (GPC) described below. By setting the Mw within this range, good coating properties can be obtained, and the solubility of unexposed areas in a developer during pattern formation is also good.

[0075] The cardo polymer used in the resin composition of the present invention may be synthesized or may be a commercially available product. Examples of commercially available cardo polymers include "Ogusol" (registered trademark) CR-TR, CR-TR2, CR-TR3, CR-TR4, CR-TR5, and CR-TR6 (all trade names, manufactured by Osaka Gas Chemicals Co., Ltd.), INR-16 (trade name, manufactured by Nagase Chemtec Corporation), V-259ME (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), and WR-301 (trade name, manufactured by ADEKA Corporation). Among these, V-259ME and WR-301, which contain a structure represented by the general formula (6) or (7), a photoradical polymerizable group, and an alkali-soluble group, are preferred. Two or more of these may also be used.

[0076] The resin composition of the present invention preferably contains the aforementioned polysiloxane as a resin in a weight ratio of 30 / 70 to 70 / 30, based on the total weight of the aforementioned (meth)acrylic polymer and cardo polymer. This ratio allows for both the high heat resistance inherent in the polysiloxane and the tacklessness of the film after prebaking inherent in the (meth)acrylic polymer and / or cardo polymer. The weight ratio of the polysiloxane to the total weight of the (meth)acrylic polymer and cardo polymer is more preferably 35 / 65 to 65 / 35, and even more preferably 40 / 60 to 60 / 40.

[0077] The (meth)acrylic polymer and / or cardo polymer preferably has a glass transition temperature of 60° C. or higher. A high glass transition temperature can improve the tackiness of the film after prebaking. A glass transition temperature of 65° C. or higher is more preferable. The glass transition temperature can be measured as described in the Examples below.

[0078] The resin composition of the present invention preferably further contains a white pigment. The white pigment has the function of further improving the reflectance of the partition walls. Examples of white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and composite compounds thereof. Two or more of these may be contained. Among these, titanium dioxide is preferred because it has high reflectance and is easily used industrially. The crystal structure of titanium dioxide is classified into anatase type, rutile type, and brookite type. Among these, rutile type titanium oxide is preferred because it has low photocatalytic activity.

[0079] The white pigment may be surface-treated. Surface treatment with a metal oxide containing a metal selected from Al, Si, and Zr is preferred, as this can improve the light resistance and heat resistance of the formed partition walls. The average primary particle diameter of the white pigment is preferably 100 to 500 nm, more preferably 150 to 350 nm, from the viewpoint of further improving the reflectance of the partition walls. Here, the average primary particle diameter of the white pigment can be measured by a laser diffraction method using a particle size distribution analyzer (N4-PLUS; manufactured by Beckman Coulter, Inc.) or the like.

[0080] Titanium dioxide pigments that are preferably used as white pigments include, for example, R960 manufactured by DuPont (rutile type, SiO ２ / Al ２ O ３ treated, average primary particle size 210 nm), CR-97; manufactured by Ishihara Sangyo Kaisha Ltd. (rutile type, Al ２ O ３ / ZrO ２ Treatment, average primary particle diameter of 250 nm). Two or more of these may be contained. From the viewpoint of further improving reflectance, the content of the white pigment in the resin composition is preferably 10% by weight or more, and more preferably 15% by weight or more, of the solid content. On the other hand, from the viewpoint of improving the surface smoothness of the partition walls, the content of the white pigment is preferably 60% by weight or less, and more preferably 55% by weight or less, of the solid content.

[0081] The resin composition of the present invention preferably further contains a light-shielding pigment and / or an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium (hereinafter, sometimes referred to as an "organometallic compound"). The light-shielding pigment and the organometallic compound have the function of further improving the light-shielding properties of the partition walls.

[0082] From the viewpoint of improving light-blocking properties, the light-blocking pigment preferably contains a black pigment. Examples of black pigments include black organic pigments, mixed-color organic pigments, and black inorganic pigments. Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone-based pigments. These may be coated with a resin.

[0083] Examples of mixed-color organic pigments include those obtained by mixing two or more pigments selected from red, blue, green, purple, yellow, magenta, and cyan to produce a pseudo-black color. Among these, a mixed pigment of a red pigment and a blue pigment is preferred from the viewpoint of achieving both a moderately high OD value and pattern processability. The weight ratio of the red pigment to the blue pigment in the mixed pigment is preferably 20 / 80 to 80 / 20, and more preferably 30 / 70 to 70 / 30. Specific examples of representative pigments, expressed by Color Index (CI) numbers, include the following: Red pigments include, for example, Pigment Red (hereinafter abbreviated as PR) 9, PR177, PR215, and PR254. Two or more of these pigments may be used. Blue pigments include, for example, Pigment Blue (hereinafter abbreviated as PB) 15, PB15:4, and PB15:6. Two or more of these pigments may be used.

[0084] Examples of black inorganic pigments include graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal composite oxides; metal sulfides; metal nitrides; metal oxynitrides; and metal carbides. Two or more of these may be contained. Among the above black pigments, pigments selected from titanium nitride, zirconium nitride, carbon black, and mixed pigments of red pigment and blue pigment in a weight ratio of 20 / 80 to 80 / 20 are preferred because of their high light-blocking properties.

[0085] From the viewpoint of improving light-shielding properties, the content of the light-shielding pigment in the resin composition is preferably 0.01 wt % or more, and more preferably 0.05 wt % or more, of the solid content. On the other hand, from the viewpoint of stably forming a fine thick film partition wall pattern, the content of the light-shielding pigment is preferably 5 wt % or less, and more preferably 3 wt % or less, of the solid content. Furthermore, the resin composition of the present invention may contain other light-shielding pigments besides the black pigment in order to improve the light-shielding properties of specific wavelengths. Examples of other light-shielding pigments include red pigments, blue pigments, purple pigments, green pigments, and yellow pigments. Two or more of these may be contained.

[0086] The organometallic compound decomposes and aggregates to form black or yellow particles in the exposure step and / or heating step during pattern formation of the partition walls (A-1) described below, and has the function of improving the light-shielding properties (OD value) of the partition walls (A-1) described below. Because the OD value is low before exposure and increases after pattern formation, the exposed light can be sufficiently transmitted to the bottom in the exposure step to photocure or photodecompose the partition walls (A-1). When a pattern is formed using a resin composition that contains a large amount of a light-shielding pigment in advance in order to form partition walls (A-1) with a high OD value, photocuring at the bottom tends to be insufficient. As a result, the shape of the resulting partition walls (A-1) tends to be inversely tapered. When a pattern is formed using the resin composition of the present invention containing the aforementioned organometallic compound, photocuring is sufficient down to the bottom, and the taper angle can easily be adjusted to the preferred range described below.

[0087] Examples of organometallic compounds include silver-containing organometallic compounds such as silver neodecanoate, silver octoate, and silver salicylate; gold-containing organometallic compounds such as chloro(triphenylphosphine)gold; platinum-containing organometallic compounds such as bis(acetylacetonato)platinum and dichlorobis(triphenylphosphine)platinum; and palladium-containing organometallic compounds such as bis(acetylacetonato)palladium and dichlorobis(triphenylphosphine)palladium. Two or more of these may be contained.

[0088] Among these, when an organometallic compound containing silver such as silver neodecanoate, silver octoate, or silver salicylate is contained, it decomposes and aggregates during the exposure process and / or heating process, generating nanosilver particles and turning the ink yellow.

[0089] On the other hand, when an organometallic compound containing platinum such as bis(acetylacetonato)platinum or an organometallic compound containing palladium such as bis(acetylacetonato)palladium is contained, the compound decomposes and aggregates in the exposure step and / or heating step to produce palladium oxide, resulting in blackening. Among these, silver neodecanoate and bis(acetylacetonato)palladium are preferred from the viewpoint of further improving the OD value.

[0090] In the resin composition of the present invention, the content of the organometallic compound in the solid content is preferably 0.2 to 5 wt %. By setting the content of the organometallic compound to 0.2 wt % or more, the OD value of the resulting partition walls can be further improved. The content of the organometallic compound is more preferably 0.5 wt % or more. On the other hand, by setting the content of the organometallic compound to 5 wt % or less, the reflectance can be further improved.

[0091] The resin composition of the present invention preferably further contains a coordinating compound having a phosphorus atom (hereinafter may be referred to as a "coordinating compound"). The coordinating compound coordinates to the organometallic compound in the resin composition, improves the solubility of the organometallic compound in a solvent, promotes decomposition of the organometallic compound, and can further improve the OD value of the resulting partition walls. Examples of the coordinating compound include triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, and tris(o-tolyl)phosphine. Two or more of these may be contained. The content of the coordinating compound in the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalents relative to the organometallic compound.

[0092] The resin composition of the present invention preferably further contains a photopolymerizable compound. The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in the molecule. By containing the photopolymerizable compound, a radical crosslinking reaction occurs with the (meth)acrylic group in the resin, thereby improving the degree of hardening of the film. In consideration of ease of radical polymerization, the photopolymerizable compound preferably has a (meth)acrylic group.

[0093] Examples of photopolymerizable compounds include 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, tripentaerythritol heptamethacrylate, tripentaerythritol octamethacrylate, tetrapentaerythritol nonamethacrylate, and tetrapentaerythritol decamethacrylate. Two or more of these may be contained.

[0094] The content of the photopolymerizable compound in the resin composition of the present invention is preferably 1 wt % or more of the solid content from the viewpoint of effectively promoting radical curing, while the content of the photopolymerizable compound is preferably 50 wt % or less of the solid content from the viewpoint of suppressing excessive radical reaction and improving resolution.

[0095] The resin composition of the present invention preferably contains a liquid-repellent compound having a photopolymerizable group. The liquid-repellent compound is a compound that imparts to the resin composition the property of repelling water and organic solvents (liquid-repellent performance). There are no particular limitations on the compound as long as it has such a property, but specifically, compounds having a fluoroalkyl group are preferably used. By containing the liquid-repellent compound, liquid-repellent performance can be imparted to the top of the partition wall (A-1) described below after formation. This makes it possible, for example, to easily apply color-converting luminescent materials having different compositions to each pixel when forming pixels containing the color-converting luminescent material (B) described below.

[0096] The liquid-repellent compound refers to a compound having a fluoroalkyl or fluoroalkylene group at the end, main chain, and / or side chain. The liquid-repellent compound contained in the resin composition of the present invention is preferably a liquid-repellent compound having a photopolymerizable group, since it can form a strong bond with the resin. Examples of liquid-repellent compounds having a photopolymerizable group include "Megafac" (registered trademark) RS-72-A, RS-75-A, RS-56, and RS-90 (all trade names, manufactured by DIC Corporation). In this case, the photopolymerizable group may be photopolymerized in the partition wall (A-1) made of a photocured product of the negative-type photosensitive resin composition.

[0097] From the viewpoint of improving the liquid repellency of the partition walls and improving inkjet coating properties, the content of the liquid repellent compound in the resin composition is preferably 0.01 wt % or more, and more preferably 0.1 wt % or more, based on the solid content. On the other hand, from the viewpoint of improving compatibility with the resin and the white pigment, the content of the liquid repellent compound is preferably 10 wt % or less, and more preferably 5 wt % or less, based on the solid content.

[0098] Furthermore, the resin composition of the present invention may contain a surfactant, an adhesion improver, etc., as necessary. By containing a surfactant in the resin composition of the present invention, flow properties during application can be improved. Examples of surfactants include fluorine-based surfactants such as "Megafac" (registered trademark) F445, F470, F475, and F477 (all trade names, manufactured by DIC Corporation), NBX-15, and FTX-218 (all trade names, manufactured by Neos Corporation); silicone-based surfactants such as "BYK" (registered trademark) -333, 352, and 301 (all trade names, manufactured by BYK Japan KK); polyalkylene oxide-based surfactants; and poly(meth)acrylate-based surfactants. Two or more of these may be contained.

[0099] By including an adhesion improver in the resin composition of the present invention, adhesion to the base substrate is improved, thereby enabling the production of highly reliable partition walls. Examples of adhesion improvers include alicyclic epoxy compounds and silane coupling agents. Among these, alicyclic epoxy compounds are preferred from the viewpoint of heat resistance. Examples of alicyclic epoxy compounds include 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, 1,4-cyclohexanedicarboxylate diglycidyl, and 1,4-cyclohexanedimethanol diglycidyl ether. Two or more of these may be contained.

[0100] The content of the adhesion promoter in the resin composition of the present invention is preferably 0.1 wt % or more, more preferably 1 wt % or more, of the solid content from the viewpoint of further improving adhesion to the base substrate, while the content of the adhesion promoter is preferably 20 wt % or less, more preferably 10 wt % or less, of the solid content from the viewpoint of pattern processability.

[0101] The resin composition of the present invention preferably further contains a solvent. The solvent adjusts the viscosity of the resin composition to a range suitable for application and improves the uniformity of the partition walls. A preferred solvent is a combination of a solvent having a boiling point of more than 150°C and not more than 250°C at atmospheric pressure and a solvent having a boiling point of 150°C or less. Examples of solvents include alcohols such as isopropanol and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether; ketones such as methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclopentanone; amides such as dimethylformamide and dimethylacetamide; and acetates such as propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate, and butyl lactate. Two or more of these may be contained. Among these, from the viewpoint of coatability, it is preferable to combine diacetone alcohol as a solvent having a boiling point of more than 150° C. and not more than 250° C. under atmospheric pressure with propylene glycol monomethyl ether as a solvent having a boiling point of 150° C. or less.

[0102] The content of the solvent can be set arbitrarily depending on the application method, etc. For example, when forming a film by spin coating, the content of the solvent in the resin composition is generally set to 50% by weight or more and 95% by weight or less.

[0103] The resin composition of the present invention can be produced, for example, by mixing the above-mentioned photoradical generator, polysiloxane, (meth)acrylic polymer and / or cardo polymer, and other components as necessary. Next, the light-shielding film of the present invention will be described. The light-shielding film of the present invention is obtained by curing the above-mentioned resin composition of the present invention. The light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS-type touch panel, such as a decorative pattern for a cover substrate, in addition to the partition wall (A-1) described below. The film thickness of the light-shielding film is preferably 10 μm or more. Next, an example will be given to explain a method for producing the light-shielding film of the present invention. The method for producing the light-shielding film of the present invention preferably includes a film-forming step of applying the resin composition of the present invention to a base substrate and drying it to obtain a dried film, an exposure step of pattern-exposing the obtained dried film, a development step of dissolving and removing portions of the exposed dried film that are soluble in a developer, and a heating step of heating the developed dried film to cure it.

[0104] Examples of methods for applying the resin composition in the film-forming process include slit coating and spin coating. Examples of drying devices include a hot air oven and a hot plate. The drying time is preferably 80 to 120°C, and the drying time is preferably 1 to 15 minutes. The exposure process is a process in which necessary portions of the dried film are photocured by exposure, or unnecessary portions of the dried film are photodecomposed, thereby rendering any portion of the dried film soluble in a developer. In the exposure process, exposure may be performed through a photomask having predetermined openings, or any desired pattern may be directly drawn using laser light or the like without using a photomask. Examples of exposure devices include a proximity exposure machine. The actinic ray irradiated in the exposure process is preferably ultraviolet light. Examples of light sources include a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, and a halogen lamp, with an ultra-high-pressure mercury lamp being preferred. The exposure conditions can be appropriately selected depending on the thickness of the dried film to be exposed. Generally, the exposure intensity is 1 to 100 mW / cm. ２ Using an ultra-high pressure mercury lamp with an output of 1 to 10,000 mJ / cm ２ It is preferable to expose the film with an exposure amount of 1000 ppm or more.

[0105] The development step is a step of dissolving and removing developer-soluble portions of the dried film after exposure with the developer, thereby obtaining a dried film patterned into an arbitrary pattern shape (hereinafter referred to as a pre-heating pattern) in which only developer-insoluble portions remain. Examples of the pattern shape include a lattice shape, a stripe shape, and a hole shape. Examples of the development method include an immersion method, a spray method, and a brush method.

[0106] The developer can be selected from a solvent capable of dissolving unnecessary portions of the dried film after exposure, and an aqueous solution containing water as the main component is preferred. For example, when the resin composition contains a polymer having a carboxyl group, an alkaline aqueous solution is preferred. Examples of alkaline aqueous solutions include inorganic alkaline aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, and calcium hydroxide; and organic alkaline aqueous solutions such as tetramethylammonium hydroxide. Among these, an aqueous potassium hydroxide solution or an aqueous tetramethylammonium hydroxide solution is preferred from the viewpoint of improving resolution. Furthermore, a surfactant may be added to the developer from the viewpoint of improving resolution. The development temperature is preferably 20 to 50°C to facilitate process control. The heating step is a step of heat-curing the pre-heated pattern formed in the development step. Examples of heating devices include a hot plate and an oven. The heating temperature is preferably 250°C or less from the viewpoint of suppressing cracking in the heated film. The heating time is preferably 15 minutes to 2 hours. When the resin composition of the present invention contains the aforementioned organometallic compound, the heating temperature is preferably 150°C or higher from the viewpoint of further improving the OD value.

[0107] Next, the partition-wall-equipped substrate of the present invention will be described. The partition-wall-equipped substrate of the present invention has partition walls (hereinafter, sometimes referred to as "partition walls (A-1)") patterned on a base substrate. The base substrate functions as a support for the partition-wall-equipped substrate. When the partition walls have pixels containing a color-converting luminescent material described below, they have the function of suppressing color mixing of light between adjacent pixels.

[0108] In the partition-formed substrate of the present invention, the partition (A-1) preferably has a reflectance per 10 μm thickness at a wavelength of 550 nm of 10% to 60% and an OD value per 10 μm thickness at a wavelength of 450 nm of 1.0 to 3.0. By setting the reflectance to 10% or more and the OD value to 3.0 or less, the brightness of the display device can be improved by utilizing reflection on the side surface of the partition (A-1). On the other hand, by setting the reflectance at a wavelength of 550 nm to 60% or less and the OD value at a wavelength of 450 nm to 1.0 or more, light transmitted through the partition (A-1) can be suppressed, thereby suppressing color mixing of light between adjacent pixels.

[0109] 1 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention, which has partition walls formed in a pattern. 1 has partition walls 2 formed in a pattern on a base substrate 1.

[0110] <Base substrate> Examples of the base substrate include a glass plate, a resin plate, and a resin film. The material of the glass plate is preferably alkali-free glass. The material of the resin plate and the resin film is preferably polyester, (meth)acrylic polymer, transparent polyimide, polyether sulfone, etc. The thickness of the glass plate and the resin plate is preferably 1 mm or less, and more preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

[0111] <Partition Walls (A-1)> The partition walls (A-1) preferably have a reflectance per 10 μm thickness at a wavelength of 550 nm of 10% to 60% and an OD value per 10 μm thickness at a wavelength of 450 nm of 1.0 to 3.0. Here, the thickness of the partition walls (A-1) refers to the height and / or width of the partition walls (A-1). The height of the partition walls (A-1) refers to the length of the partition walls (A-1) in a direction perpendicular to the base substrate (height direction). In the case of the substrate with partition walls shown in FIG. 1, the height of the partition walls 2 is represented by the symbol H. Furthermore, the width of the partition walls (A-1) refers to the length of the partition walls (A-1) in a direction parallel to the base substrate. In the case of the substrate with partition walls shown in FIG. 1, the width of the partition walls 2 is represented by the symbol L. In this specification, "height" may also be referred to as "thickness."

[0112] In the present invention, it is believed that the reflectance at the partition wall side surface contributes to improving the brightness of the display device, and the light-shielding property contributes to suppressing color mixing. On the other hand, since the reflectance and OD value per thickness are believed to be the same regardless of the height direction or width direction, the present invention focuses on the reflectance and OD value per thickness of the partition wall. As described below, the thickness (height) of the partition wall (A-1) is preferably 0.5 to 100 μm, and the width is preferably 1 to 100 μm. Therefore, in the present invention, 10 μm was selected as a representative value for the thickness of the partition wall (A-1), and attention was focused on the reflectance and OD value per 10 μm thickness. If the reflectance per 10 μm thickness of the partition wall (A-1) at a wavelength of 550 nm is less than 10%, visible light reflection at the partition wall side surface will be reduced, resulting in insufficient brightness of the display device. The reflectance per 10 μm thickness at a wavelength of 550 nm is preferably 10% or more, more preferably 20% or more, and even more preferably 30% or more.

[0113] The OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 450 nm is preferably 1.0 or more, more preferably 1.5 or more, and even more preferably 2.0 or more. The higher the OD value per 10 μm thickness at a wavelength of 450 nm, the greater the light-blocking property of the partition wall side surface, thereby preventing color mixing between adjacent pixels and improving the contrast of the display device. If the OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 450 nm is less than 1.0, blue excitation light leaks to adjacent pixels, and when a pixel containing the color-converting luminescent material (B) described below is present between the partition walls, light is emitted within the pixel, causing color mixing.

[0114] The reflectance per 10 μm thickness of the partition walls (A-1) at a wavelength of 550 nm can be measured in SCI mode from the top surface of the 10 μm-thick partition walls (A-1) using a spectrophotometer (for example, a CM-2600d manufactured by Konica Minolta, Inc.). However, if an area sufficient for measurement cannot be secured or a measurement sample with a thickness of 10 μm cannot be obtained and the composition of the partition walls (A-1) is known, a 10 μm-thick solid film having the same composition as the partition walls (A-1) may be prepared, and the reflectance of the solid film may be measured in the same manner as for the partition walls (A-1) to determine the reflectance per 10 μm thickness. For example, a solid film may be prepared using the material from which the partition walls (A-1) are formed, to a thickness of 10 μm, under the same processing conditions as for the formation of the partition walls (A-1), except that no pattern is formed, and the reflectance of the resulting solid film may be measured from the top surface in the same manner.

[0115] The OD value per 10 μm thickness of the partition walls (A-1) at a wavelength of 450 nm can be calculated by measuring the intensity of incident light and transmitted light from the top surface of the 10 μm-thick partition walls (A-1) using an optical densitometer (for example, U-4100 manufactured by Hitachi High-Tech Science) and using the following formula (1). However, if an area sufficient for measurement cannot be secured or a measurement sample with a thickness of 10 μm cannot be obtained and the composition of the partition walls (A-1) is known, the OD value per 10 μm thickness may be determined by preparing a 10 μm-thick solid film having the same composition as the partition walls (A-1) and measuring the OD value of the solid film in place of the partition walls (A-1) in the same manner as in the measurement of reflectance. OD value=log10(I ０ / I) ... (1) I ０ : Incident light intensity I: Transmitted light intensity.

[0116] As a means for adjusting the reflectance and OD value to fall within the above ranges, for example, the partition walls (A-1) may have a preferred composition as described below.

[0117] The taper angle of the partition wall (A-1) is preferably 45° to 110°. The taper angle of the partition wall (A-1) refers to the angle between the side edge and the bottom edge of the partition wall cross section. In the case of the partition wall-equipped substrate shown in FIG. 1 , the taper angle of the partition wall 2 is represented by the symbol θ. By setting the taper angle to 45° or more, the difference in width between the top and bottom of the partition wall (A-1) is reduced, and the width of the partition wall (A-1) can be easily formed within the preferred range described below. The taper angle is more preferably 70° or more. On the other hand, by setting the taper angle to 110° or less, ink breakage can be suppressed when forming pixels containing the color-converting luminescent material (B) described below by inkjet coating, thereby improving inkjet coating properties. Here, ink breakage refers to the phenomenon in which ink overcomes the partition wall and mixes into adjacent pixel portions. The taper angle is more preferably 95° or less. The taper angle of the partition wall (A-1) can be determined by observing an arbitrary cross section of the partition wall (A-1) using an optical microscope (FE-SEM (for example, S-4800 manufactured by Hitachi, Ltd.)) at an acceleration voltage of 3.0 kV and a magnification of 2,500 times, and measuring the angle between the side edge and the bottom edge of the cross section of the partition wall (A-1).

[0118] Note that, examples of means for setting the taper angle of the partition walls (A-1) within the above range include making the partition walls (A-1) have a preferred composition described later, or forming the partition walls (A-1) using the above-mentioned resin composition of the present invention.

[0119] When the partition-attached substrate has pixels containing the color-converting luminescent material (B) described below, the thickness of the partition wall (A-1) is preferably larger than the thickness of the pixels. Specifically, the thickness of the partition wall (A-1) is preferably 0.5 μm or more, more preferably 10 μm or more. On the other hand, from the viewpoint of more efficiently extracting light emitted from the bottom of the pixels, the thickness of the partition wall (A-1) is preferably 100 μm or less, more preferably 50 μm or less. Furthermore, the width of the partition wall (A-1) is preferably sufficient to further improve luminance by utilizing light reflection on the side surface of the partition wall and to further suppress color mixing of light in adjacent pixels due to light leakage. Specifically, the width of the partition wall is preferably 1 μm or more, more preferably 5 μm or more. On the other hand, from the viewpoint of securing a large luminescent region of the pixel and further improving luminance, the width of the partition wall (A-1) is preferably 100 μm or less, more preferably 50 μm or less.

[0120] The partition (A-1) has a repeating pattern of a predetermined number of pixels according to the screen size of the image display device. The number of pixels of the image display device can be, for example, 4000 horizontally and 2000 vertically. The number of pixels affects the resolution (fineness) of the displayed image. Therefore, it is necessary to form a number of pixels according to the required image resolution and the screen size of the image display device, and it is preferable to determine the pattern formation dimensions of the partition according to this.

[0121] The partition walls (A-1) preferably contain a resin, a white pigment, and a light-shielding pigment. The resin has a function of improving the crack resistance and light fastness of the partition walls. The white pigment has a function of further improving the reflectance of the partition walls. The light-shielding pigment has a function of adjusting the OD value and suppressing color mixing of light between adjacent pixels.

[0122] The resin and the white pigment and light-shielding pigment are as described above as materials constituting the resin composition. From the viewpoint of improving light-shielding properties, the light-shielding pigment preferably contains at least one pigment selected from black pigment, red pigment, blue pigment, purple pigment, and yellow pigment. Among these, from the viewpoint of suppressing color mixing of light in adjacent pixels, it is preferable to contain a black pigment and / or a yellow pigment. The black pigment is as described above as a material constituting the resin composition. Examples of yellow pigments include yellow organic pigments such as Pigment Yellow (hereinafter abbreviated as PY), PY137, PY138, PY139, PY150, PY166, PY168, and PY185, and yellow inorganic pigments such as metal fine particles such as nanosilver particles and nanogold particles; metal oxides; metal composite oxides; metal sulfides; metal nitrides; metal oxynitrides; and metal carbides. Among these, from the viewpoint of suppressing color mixing of light in adjacent pixels, it is preferable that the light-shielding pigment contains at least one pigment selected from titanium nitride, zirconium nitride, carbon black, a mixed pigment of a red pigment and a blue pigment in a weight ratio of 20 / 80 to 80 / 20, and particles of at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver.

[0123] The partition walls (A-1) preferably further contain a hindered amine compound. By containing a hindered amine compound, the weather resistance of the partition walls can be improved. The partition walls (A-1) are as described above as materials constituting a resin composition. The hindered amine compound may be immobilized to the resin by reaction of a photopolymerizable group in the molecule. From the viewpoint of further improving weather resistance, the content of the hindered amine compound in the partition walls (A-1) is preferably 0.005% by weight or more, more preferably 0.008% by weight or more. On the other hand, from the viewpoint of improving the surface curability of the partition walls, the content of the hindered amine compound in the partition walls (A-1) is preferably 5.0% by weight or less, more preferably 3.0% by weight or less. The partition walls (A-1) preferably further contain a liquid-repellent compound. By containing the liquid-repellent compound, liquid repellency can be imparted to the partition walls (A-1). For example, when forming pixels containing the color-converting luminescent material (B) described below, color-converting luminescent materials having different compositions can be easily applied to the respective pixels. The liquid repellent compound is as described above as a material constituting the resin composition.

[0124] The surface contact angle of the partition walls (A-1) with propylene glycol monomethyl ether acetate is preferably 10° or more, more preferably 20° or more, and even more preferably 40° or more, from the viewpoints of improving inkjet coating properties and facilitating separate application of the color-converting light-emitting material. On the other hand, from the viewpoint of improving adhesion between the partition walls and the underlying substrate, the surface contact angle of the partition walls (A-1) is preferably 70° or less, more preferably 60° or less. Here, the surface contact angle of the partition walls (A-1) can be measured with respect to the upper part of the partition walls in accordance with the wettability test method for substrate glass surfaces specified in JIS R3257 (established on April 20, 1999). Examples of methods for adjusting the surface contact angle of the partition walls (A-1) to the above range include a method using the liquid-repellent compound described above.

[0125] The photosensitive paste method is preferred as a method for forming a pattern of partition walls (A-1) on a base substrate because it allows for easy adjustment of the pattern shape. A preferred method for forming a pattern of partition walls using the photosensitive paste method includes, for example, a coating step of applying the above-described resin composition to a base substrate and drying it to obtain a dried film, an exposure step of pattern-exposing the resulting dried film according to the desired pattern shape, a development step of dissolving and removing portions of the exposed dried film that are soluble in a developer, and a heating step of curing the developed partition walls. The resin composition preferably has negative photosensitivity. The pattern exposure may be performed through a photomask having predetermined openings, or any desired pattern may be directly drawn using laser light or the like without using a photomask. When the partition-wall-attached substrate has a color filter and / or a light-shielding partition wall (A-2) described below, the partition walls (A-1) can be patterned on the color filter and / or the light-shielding partition wall (A-2) in a similar manner. Each step is as described above in the method for producing a light-shielding film.

[0126] The partition-equipped substrate of the present invention preferably further comprises pixels (hereinafter sometimes referred to as "pixels (B)") containing a color-converting luminescent material (B) arranged and separated by the partitions (A-1). The pixels (B) have the function of converting at least a part of the wavelength range of incident light and emitting output light in a wavelength range different from that of the incident light, thereby enabling color display.

[0127] 2 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention, which has patterned partition walls (A-1) and pixels (B). Patterned partition walls 2 are provided on a base substrate 1, and pixels 3 are arranged in areas separated by the partition walls 2. The color conversion material preferably contains a phosphor selected from inorganic phosphors and organic phosphors.

[0128] The partition-equipped substrate of the present invention can be used as a display device, for example, by combining a backlight that emits blue light with a liquid crystal formed on the TFT and a pixel (B). In this case, the region corresponding to the red pixel preferably contains a red phosphor that is excited by blue excitation light to emit red fluorescence. Similarly, the region corresponding to the green pixel preferably contains a green phosphor that is excited by blue excitation light to emit green fluorescence. The region corresponding to the blue pixel preferably does not contain a phosphor.

[0129] As the inorganic phosphor, those which emit colors such as green and red when excited by blue excitation light, that is, those which are excited by excitation light with a wavelength of 400 to 500 nm and have an emission spectrum with a peak in the region of 500 to 700 nm, are preferred. Examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialon-based phosphors, Mn ４＋ Examples of such phosphors include activated fluoride complex phosphors and inorganic semiconductors known as quantum dots. Among these, quantum dots are preferred. Quantum dots have a smaller average particle size than other phosphors, and therefore can smooth the surface of the pixel (B) and suppress light scattering on the surface, thereby further improving the light extraction efficiency and brightness.

[0130] Examples of quantum dot materials include semiconductors of Group II-IV, Group III-V, Group IV-VI, and Group IV. Examples of these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, and CdSe. Two or more of these may be used.

[0131] As the organic fluorescent material, one that emits various colors such as green and red when excited by blue light is preferred. Phosphors that emit red fluorescence include pyrromethene derivatives having a basic skeleton represented by the following structural formula (11), and phosphors that emit green fluorescence include pyrromethene derivatives having a basic skeleton represented by the following structural formula (12). Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that emit red or green fluorescence depending on the selection of substituents. Two or more of these may be contained. Among these, pyrromethene derivatives are preferred due to their high quantum yield. Pyrromethene derivatives can be obtained, for example, by the method described in JP 2011-241160 A.

[0132]

[0133] Because the organic phosphor is soluble in a solvent, pixels (B) of a desired thickness can be easily formed. From the viewpoint of improving color characteristics, the thickness of the pixels (B) is preferably 0.5 μm or more, more preferably 1 μm or more. On the other hand, from the viewpoint of thinning the display device and curved surface processability, the thickness of the pixels (B) is preferably 30 μm or less, more preferably 20 μm or less. The size of each pixel (B) is generally approximately 20 to 200 μm. The pixels (B) are preferably arranged separated by partition walls (A-1). By providing partition walls between pixels, diffusion of emitted light and color mixing can be further suppressed. Examples of methods for forming the pixels (B) include a method in which a coating liquid containing a color-converting luminescent material (hereinafter referred to as the color-converting luminescent material coating liquid) is filled into the space separated by the partition walls (A-1). The color-converting luminescent material coating liquid may further contain a resin or a solvent.

[0134] Examples of methods for filling the color-converting luminescent material coating liquid include photolithography and inkjet coating. From the viewpoint of easily applying different types of color-converting luminescent materials to each pixel, inkjet coating is preferred.

[0135] <Light-shielding partition walls (A-2)> The partition-wall-attached substrate of the present invention preferably further comprises, between the base substrate and the patterned partition walls (A-1), patterned partition walls (A-2) having an OD value of 0.5 or more per 1.0 μm thickness (hereinafter, sometimes referred to as "light-shielding partition walls (A-2)"). The presence of the light-shielding partition walls (A-2) improves light-shielding properties, suppresses backlight light leakage in a display device, and enables the production of high-contrast, clear images.

[0136] 3 is a cross-sectional view showing one embodiment of a substrate with partition walls of the present invention having light-shielding partition walls. Patterned partition walls 2 and light-shielding partition walls 4 are formed on a base substrate 1, and pixels 3 are arranged in regions separated by the partition walls 2 and the light-shielding partition walls 4.

[0137] The light-shielding partition wall (A-2) has an OD value of 0.5 or more per 1.0 μm of thickness. Here, the thickness of the light-shielding partition wall (A-2) is preferably 0.5 to 10 μm, as described below. In the present invention, 1.0 μm was selected as a representative value of the thickness of the light-shielding partition wall (A-2), and attention was focused on the OD value per 1.0 μm of thickness. By setting the OD value per 1.0 μm of thickness to 0.5 or more, the light-shielding property can be further improved, and a clearer image with higher contrast can be obtained. On the other hand, the OD value per 1.0 μm of thickness is preferably 4.0 or less, which can improve pattern processability. The OD value of the light-shielding partition wall (A-2) can be measured in the same manner as the OD value of the partition wall (A-1) described above.

[0138] The thickness of the light-shielding partition wall (A-2) is preferably 0.5 μm or more, more preferably 1.0 μm or more, from the viewpoint of improving light-shielding properties. On the other hand, the thickness of the light-shielding partition wall (A-2) is more preferably 5 μm or less, from the viewpoint of improving flatness. The width of the light-shielding partition wall (A-2) is preferably about the same as that of the above-mentioned partition wall (A-1).

[0139] The light-shielding partition walls (A-2) preferably contain a resin and a light-shielding pigment. The resin has the function of improving the crack resistance and light fastness of the partition walls. The light-shielding pigment has the function of absorbing incident light and reducing emitted light. The resin and the light-shielding pigment can be the same materials as those described above as materials constituting the resin composition.

[0140] As a method for forming a pattern of the light-shielding partition wall (A-2) on the base substrate, for example, a method for forming a pattern by a photosensitive paste method using a photosensitive material described in JP-A-2015-1654 is preferred, similar to the above-mentioned partition wall (A-1).

[0141] Furthermore, the partition-wall-equipped substrate of the present invention preferably further includes a color filter (hereinafter sometimes referred to as "color filter") having a thickness of 1 to 5 μm between the base substrate and the pixel (B). The color filter has the function of transmitting visible light in a specific wavelength range and changing the transmitted light to a desired hue, thereby improving the color purity of the display device. By making the color filter thickness 1 μm or more, the color purity can be further improved. On the other hand, by making the thickness 5 μm or less, the brightness can be further improved.

[0142] 4 shows a cross-sectional view of one embodiment of the substrate with partition walls having a color filter of the present invention. Patterned partition walls 2 and color filters 5 are formed on a base substrate 1, and pixels 3 are formed on the color filters 5.

[0143] Examples of the color filter include color filters that use a pigment-dispersed material in which a pigment is dispersed in a photoresist, which are used in flat panel displays such as liquid crystal displays, etc. The color filter may be laminated separately from or integrally with the pixel (B) containing the color-converting light-emitting material.

[0144] The partition-equipped substrate of the present invention preferably further comprises a 1-5 μm-thick color filter separated by a light-shielding partition between the base substrate and the pixel (B). Figure 5 shows a cross-sectional view of one embodiment of the partition-equipped substrate of the present invention having color filters separated by a light-shielding partition. The substrate has color filters 5 separated by patterned light-shielding partitions 4 on a base substrate 1, and partitions 2 and pixels 3 thereon.

[0145] The partition-wall-equipped substrate of the present invention preferably further comprises a low refractive index layer (C) having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm (hereinafter, sometimes referred to as "low refractive index layer (C)") above or below the pixel (B). By comprising the low refractive index layer (C), the light extraction efficiency can be further improved, and the brightness of the display device can be further improved.

[0146] 6 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a low refractive index layer. The substrate has patterned partition walls 2 and pixels 3 on a base substrate 1, and further has a low refractive index layer 6 on these.

[0147] In a display device, from the viewpoint of appropriately suppressing reflection of backlight light and efficiently allowing light to enter the pixels (B), the refractive index of the low refractive index layer (C) is preferably 1.20 or more, more preferably 1.23 or more. On the other hand, from the viewpoint of improving brightness, the refractive index of the low refractive index layer (C) is preferably 1.35 or less, more preferably 1.30 or less. Here, the refractive index of the low refractive index layer (C) can be measured by irradiating the cured film surface with light having a wavelength of 550 nm from a direction perpendicular to the film surface under atmospheric pressure and at 20°C using a prism coupler.

[0148] The low refractive index layer (C) can be formed, for example, using the low refractive index layer-forming material obtained in Preparation Example 6 described below, as in Examples 72 to 74. The thickness of the low refractive index layer (C) is preferably 0.1 μm or more, more preferably 0.5 μm or more, from the viewpoint of covering the steps of the pixels (B) and suppressing the occurrence of defects. On the other hand, the thickness of the low refractive index layer (C) is preferably 20 μm or less, more preferably 10 μm or less, from the viewpoint of reducing stress that may cause cracks in the low refractive index layer (C).

[0149] The partition-wall-equipped substrate of the present invention preferably further has an inorganic protective layer I having a thickness of 50 to 1,000 nm on the low refractive index layer (C). The presence of the inorganic protective layer I makes it difficult for moisture in the atmosphere to reach the low refractive index layer (C), thereby suppressing fluctuations in the refractive index of the low refractive index layer (C) and suppressing brightness deterioration.

[0150] 7 and 8 show cross-sectional views of one embodiment of the substrate with partition walls of the present invention, which has a low refractive index layer and an inorganic protective layer (I). Patterned partition walls 2 and pixels 3 are formed on a base substrate 1, and a low refractive index layer 6 and an inorganic protective layer (I) 7 are further formed above or below these.

[0151] The partition-attached substrate of the present invention preferably has the low refractive index layer (C) between the pixel (B) and the color filter, and further preferably has an inorganic protective layer (I) having a thickness of 50 to 1,000 nm on the low refractive index layer (C). By having the low refractive index layer (C) between the pixel (B) and the color filter, the light extraction effect of emitted light is improved, and the brightness of the display is improved.

[0152] 9 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention, which has the low refractive index layer and inorganic protective layer (I) between the pixel (B) and the color filter. The substrate has color filters 5 separated by light-shielding partition walls 4 on a base substrate 1, a low refractive index layer 6 and an inorganic protective layer (I) 7 thereon, and patterned partition walls 2 and pixels 3 thereon.

[0153] The partition-formed substrate of the present invention preferably further comprises an inorganic protective layer (II) having a thickness of 50 to 1,000 nm between the pixels (B) and the low refractive index layer (C). The presence of the inorganic protective layer (II) makes it difficult for raw materials forming the pixels (B) to move from the pixels (B) to the low refractive index layer, thereby suppressing fluctuations in the refractive index of the low refractive index layer (C) and reducing brightness degradation.

[0154] 10 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention, which has a low refractive index layer and an inorganic protective layer (II). The substrate has patterned partition walls 2 and pixels 3 on a base substrate 1, and further has an inorganic protective layer (II) 8 and a low refractive index layer 6 on these.

[0155] Furthermore, the partition-equipped substrate of the present invention preferably further comprises an inorganic protective layer (III) and / or a yellow organic protective layer having a thickness of 50 to 1,000 nm between the color filter and the pixel (B). The inorganic protective layer (III) makes it difficult for raw materials for forming the color filter to reach the pixel (B) containing the color-converting luminescent material from the color filter, thereby suppressing deterioration in the luminance of the pixel (B) containing the color-converting luminescent material. Furthermore, the yellow organic protective layer cuts out blue leakage light that was not fully converted by the pixel (B) containing the color-converting luminescent material, thereby improving color reproducibility.

[0156] 11 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention, which has color filters and an inorganic protective layer (III) and / or a yellow organic protective layer. The substrate has patterned partition walls 2 and color filters 5 on a base substrate 1, and then has an inorganic protective layer (III) and / or a yellow organic protective layer 9 on top of these. The substrate further has pixels 3 arranged and separated by the partition walls 2.

[0157] Furthermore, the partition-equipped substrate of the present invention preferably further comprises an inorganic protective layer (IV) and / or a yellow organic protective layer having a thickness of 50 to 1,000 nm on the base substrate. The inorganic protective layer (IV) and / or the yellow organic protective layer functions as a refractive index adjusting layer, allowing light emitted from the pixel (B) to be extracted more efficiently, thereby further improving the brightness of the display device. Furthermore, the yellow organic protective layer cuts out blue leakage light that was not fully converted by the pixel (B) containing the color-converting luminescent material, thereby improving color reproducibility.

[0158] 12 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention, which has an inorganic protective layer (IV) and / or a yellow organic protective layer. The substrate has an inorganic protective layer (IV) and / or a yellow organic protective layer 10 on a base substrate 1, and patterned partition walls 2 and pixels 3 on top of these.

[0159] Examples of materials constituting the inorganic protective layers (I) to (IV) include metal oxides such as silicon oxide, indium tin oxide, and gallium zinc oxide; and metal nitrides such as silicon nitride. Among these, silicon nitride or silicon oxide is more preferred because of its low water vapor permeability and high permeability. The thickness of the inorganic protective layers (I) to (IV) is preferably 50 nm or more, more preferably 100 nm or more, from the viewpoint of sufficiently suppressing the permeation of substances such as water vapor. On the other hand, the thickness of the inorganic protective layers (I) to (IV) is preferably 800 nm or less, more preferably 500 nm or less, from the viewpoint of suppressing a decrease in transmittance.

[0160] The yellow organic protective layer can be obtained, for example, by patterning a resin composition containing a yellow pigment and a resin. The yellow pigment and the resin can be the same materials as those described above for forming the partition wall (A-1). As a method for patterning the yellow organic protective layer, a method of forming a pattern by a photosensitive paste method, similar to the method for forming the partition wall (A-1), is preferred.

[0161] As shown in FIG. 7, when the yellow organic protective layer 8 is formed on the color filter 7, the yellow organic protective layer 8 may serve as an overcoat layer that flattens each pixel of the color filter.

[0162] The partition-equipped substrate of the present invention can also be used in display devices using mini- or micro-LEDs, in which a large number of LEDs corresponding to each pixel are arranged on the substrate and separated by partitions. Each pixel can be turned on or off by turning on or off the mini- or micro-LED, and no liquid crystal is required. In other words, the partition-equipped substrate of the present invention can be used not only as partitions separating each pixel, but also as partitions separating mini- or micro-LEDs in a backlight.

[0163] For example, the partition-equipped substrate of the present invention preferably further comprises, on the base substrate, a light source selected from organic EL cells, mini LED cells, and micro LED cells. By separating the light source selected from organic EL cells, mini LED cells, and micro LED cells with partitions, color mixing between pixels can be prevented, and the display color purity can be improved.

[0164] 13 shows a cross-sectional view of one embodiment of the substrate with partitions of the present invention, which has a light-emitting source selected from organic EL cells, mini LED cells, and micro LED cells. The light-emitting source 11 selected from organic EL cells, mini LED cells, and micro LED cells is located between partitions 2 patterned on a base substrate 1. The substrate with partitions of the present invention preferably further has a pixel (B) on the light-emitting source selected from organic EL cells, mini LED cells, and micro LED cells.

[0165] 14 shows a cross-sectional view of one embodiment of a substrate with partition walls of the present invention having light emitting sources and pixels selected from organic EL cells, mini LED cells, and micro LED cells. The light emitting sources 11 selected from organic EL cells, mini LED cells, and micro LED cells are provided between partition walls 2 patterned on a base substrate 1, and the pixels 3 are further provided thereon.

[0166] Next, the display device of the present invention will be described. The display device of the present invention has the above-described partition-equipped substrate and a light source. The light source is preferably a light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell. Due to their excellent light-emitting characteristics, organic EL cells are more preferable as the light source. A mini LED cell refers to a cell in which many LEDs with length and width of approximately 100 μm to 10 mm are arranged. A micro LED cell refers to a cell in which many LEDs with length and width of less than 100 μm are arranged.

[0167] The manufacturing method of the display device of the present invention will be described using an example of a display device having a partition-mounted substrate and an organic EL cell of the present invention. A photosensitive polyimide resin is applied to a glass substrate, and an insulating film having an opening is formed using photolithography. Aluminum is then sputtered onto the polyimide resin, and patterned using photolithography to form a back electrode layer made of aluminum in the openings where there was no insulating film. Subsequently, a film of tris(8-quinolinolato)aluminum (hereinafter abbreviated as Alq3) is formed on the polyimide resin by vacuum deposition as an electron transport layer, followed by a white light-emitting layer formed by doping Alq3 with dicyanomethylenepyran, quinacridone, and 4,4'-bis(2,2-diphenylvinyl)biphenyl. Next, a film of N,N'-diphenyl-N,N'-bis(α-naphthyl)-1,1'-biphenyl-4,4'-diamine is formed by vacuum deposition as a hole transport layer. Finally, ITO is sputtered to form a film as a transparent electrode, and an organic EL cell having a white light-emitting layer is fabricated. A display device can be fabricated by bonding the above-mentioned partition-equipped substrate and the obtained organic EL cell facing each other with a sealant.

[0168] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples. The names of the compounds used, for which abbreviations are used, are listed below: PGMEA: propylene glycol monomethyl ether acetate, DAA: diacetone alcohol, EDM: diethylene glycol ethyl methyl ether, BHT: dibutylhydroxytoluene.

[0169] The solids concentration of the polysiloxane solutions in Synthesis Examples 1 to 6 and the (meth)acrylic polymer solutions in Synthesis Examples 7 to 9 was determined by the following method. 1.5 g of the polysiloxane solution or (meth)acrylic polymer solution was weighed into an aluminum cup and heated at 250°C for 30 minutes using a hot plate to evaporate the liquid. The weight of the solids remaining in the aluminum cup after heating was weighed, and the solids concentration was determined from the ratio to the weight before heating.

[0170] The weight average molecular weights of the polysiloxane solutions in Synthesis Examples 1 to 6 and the (meth)acrylic polymer solutions in Synthesis Examples 7 to 9 were determined in polystyrene equivalent values ​​by the following method: Apparatus: GPC measurement apparatus (2695) equipped with an RI detector, manufactured by Waters Corporation Column: PLgel MIXED-C column (300 mm, manufactured by Polymer Laboratories) x 2 (connected in series) Measurement temperature: 40°C Flow rate: 1 mL / min Solvent: 0.5% by mass solution of tetrahydrofuran (THF) Standard substance: polystyrene Detection mode: RI

[0171] The content ratio of each repeating unit in the polysiloxane in Synthesis Examples 1 to 6 was determined by the following method: The polysiloxane solution was poured into a 10 mm diameter Teflon (registered trademark) NMR sample tube. ２９ Si-NMR measurement was carried out, and the content ratio of each repeating unit was calculated from the ratio of the integrated value of Si derived from a specific organosilane to the integrated value of all Si derived from organosilanes. ２９ The Si-NMR measurement conditions are as follows: Apparatus: Nuclear magnetic resonance apparatus (JNM-GX270; manufactured by JEOL Ltd.) Measurement method: Gated decoupling method Measurement nuclear frequency: 53.6693 MHz ( ２９ Si nucleus) Spectral width: 20,000 Hz Pulse width: 12 μs (45° pulse) Pulse repetition time: 30.0 seconds Solvent: acetone-d6 Reference substance: tetramethylsilane Measurement temperature: 23° C. Sample rotation speed: 0.0 Hz.

[0172] Synthesis Example 1 Polysiloxane (PSL-1) Solution A 1000 ml three-neck flask was charged with 117.76 g (0.525 mol) of styryltrimethoxysilane, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 78.89 g (0.656 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 1.180 g of BHT, and 251.60 g of PGMEA, and an aqueous phosphoric acid solution prepared by dissolving 3.353 g of phosphoric acid (1.0 wt % based on the charged monomers) in 80.33 g of water was added over 30 minutes with stirring at 40°C. The flask was then immersed in a 70°C oil bath and stirred for 60 minutes, after which the oil bath was heated to 115°C over 30 minutes. One hour after the start of the temperature increase, the solution temperature (internal temperature) reached 100°C, and the mixture was heated and stirred for 2 hours (internal temperature: 100-110°C), yielding a polysiloxane solution. During the temperature increase and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liters / minute. A total of 182.96 g of by-product methanol and water was distilled during the reaction. PGMEA was added to the resulting polysiloxane solution to a solids concentration of 40% by weight, yielding a polysiloxane (PSL-1) solution. The weight-average molecular weight of the resulting polysiloxane (PSL-1) was 12,000. In addition, the molar ratios of repeating units derived from styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-1) were 30 mol %, 17.5 mol %, 5 mol %, 37.5 mol %, and 10 mol %, respectively.

[0173] Synthesis Example 2 Polysiloxane (PSL-2) Solution A 1000 ml three-neck flask was charged with 198.29 g (0.831 mol) of phenyltrimethoxysilane, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 1.197 g of BHT, and 256.24 g of PGMEA, and an aqueous phosphoric acid solution prepared by dissolving 3.455 g of phosphoric acid (1.0 wt % based on the charged monomers) in 85.84 g of water was added over 30 minutes with stirring at 40°C. The flask was then immersed in a 70°C oil bath and stirred for 60 minutes, after which the oil bath was heated to 115°C over 30 minutes. One hour after the start of the temperature increase, the solution temperature (internal temperature) reached 100°C, and the mixture was heated and stirred for 2 hours (internal temperature: 100-110°C), yielding a polysiloxane solution. During the temperature increase and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liters / minute. A total of 195.52 g of by-product methanol and water was distilled during the reaction. PGMEA was added to the resulting polysiloxane solution to adjust the solids concentration to 40% by weight, yielding a polysiloxane (PSL-2) solution. The weight-average molecular weight of the resulting polysiloxane (PSL-2) was 5,500. In addition, the molar ratios of repeating units derived from phenyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-2) were 47.5 mol %, 17.5 mol %, 5 mol %, 20 mol %, and 10 mol %, respectively.

[0174] Synthesis Example 3 Polysiloxane (PSL-3) Solution A 1000 ml three-neck flask was charged with 203.13 g (0.831 mol) of diphenyldimethoxysilane, 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 1.475 g of BHT, and 308.45 g of PGMEA, and an aqueous phosphoric acid solution prepared by dissolving 3.887 g (1.0 wt % based on the charged monomers) in 76.39 g of water was added over 30 minutes with stirring at 40°C. The flask was then immersed in a 70°C oil bath and stirred for 60 minutes, after which the oil bath was heated to 115°C over 30 minutes. One hour after the start of the temperature increase, the solution temperature (internal temperature) reached 100°C, and the mixture was heated and stirred for 2 hours (internal temperature: 100-110°C), yielding a polysiloxane solution. During the temperature increase and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liters / minute. A total of 173.99 g of by-product methanol and water was distilled during the reaction. PGMEA was added to the resulting polysiloxane solution to adjust the solids concentration to 40% by weight, yielding a polysiloxane (PSL-3) solution. The weight-average molecular weight of the resulting polysiloxane (PSL-3) was 6,000. In addition, the molar ratios of repeating units derived from diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-3) were 47.5 mol %, 17.5 mol %, 5 mol %, 20 mol %, and 10 mol %, respectively.

[0175] Synthesis Example 4 Polysiloxane (PSL-4) Solution A 1000 ml three-necked flask was charged with 186.45 g (0.831 mol) of styryltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 78.89 g (0.656 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 1.132 g of BHT, and 243.65 g of PGMEA, and an aqueous phosphoric acid solution prepared by dissolving 3.328 g of phosphoric acid (1.0 wt% based on the charged monomers) in 85.84 g of water was added over 30 minutes with stirring at 40 ° C. Thereafter, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, after which the oil bath was heated to 115 ° C. over 30 minutes. One hour after the start of the temperature increase, the solution temperature (internal temperature) reached 100°C, and the mixture was then heated and stirred for two hours (internal temperature 100-110°C) to obtain a polysiloxane solution. During the temperature increase and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 L / min. A total of 195.52 g of by-products, methanol and water, was distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution to adjust the solids concentration to 40% by weight, yielding a polysiloxane (PSL-4) solution. The weight-average molecular weight of the obtained polysiloxane (PSL-4) was 15,000. In addition, the molar ratios of repeating units derived from styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-4) were 47.5 mol %, 5 mol %, 20 mol %, and 10 mol %, respectively.

[0176] Synthesis Example 5 Polysiloxane (PSL-5) Solution A 1000 ml three-neck flask was charged with 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 142.01 g (1.181 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 0.954 g of BHT, and 206.29 g of PGMEA, and an aqueous phosphoric acid solution prepared by dissolving 2.855 g (1.0 wt % based on the charged monomers) in 76.39 g of water was added over 30 minutes with stirring at 40°C. The flask was then immersed in a 70°C oil bath and stirred for 60 minutes, after which the oil bath was heated to 115°C over 30 minutes. One hour after the start of the temperature increase, the solution temperature (internal temperature) reached 100°C, and the mixture was heated and stirred for 2 hours (internal temperature: 100-110°C), yielding a polysiloxane solution. During the temperature increase and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liters / minute. A total of 173.99 g of by-products, methanol and water, was distilled during the reaction. PGMEA was added to the resulting polysiloxane solution to a solids concentration of 40% by weight, yielding a polysiloxane (PSL-5) solution. The weight-average molecular weight of the resulting polysiloxane (PSL-5) was 5,000. Furthermore, the molar ratios of repeating units derived from 3-methacryloxypropyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-5) were 17.5 mol %, 5 mol %, 67.5 mol %, and 10 mol %, respectively.

[0177] Synthesis Example 6 Polysiloxane (PSL-6) Solution A 1000 ml three-necked flask was charged with 203.13 g (0.831 mol) of diphenyldimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 78.89 g (0.656 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropylsuccinic anhydride, 1.312 g of BHT, and 275.12 g of PGMEA, and an aqueous phosphoric acid solution prepared by dissolving 3.495 g of phosphoric acid (1.0 wt% based on the charged monomers) in 70.88 g of water was added over 30 minutes with stirring at 40 ° C. Thereafter, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, after which the oil bath was heated to 115 ° C. over 30 minutes. One hour after the start of the temperature increase, the solution temperature (internal temperature) reached 100°C, and the mixture was then heated and stirred for two hours (internal temperature 100-110°C) to obtain a polysiloxane solution. During the temperature increase and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 L / min. A total of 161.44 g of by-products, methanol and water, was distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution to adjust the solids concentration to 40% by weight, yielding a polysiloxane (PSL-6) solution. The weight-average molecular weight of the obtained polysiloxane (PSL-6) was 6,000. In addition, the molar ratios of repeating units derived from diphenyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-6) were 47.5 mol %, 5 mol %, 37.5 mol %, and 10 mol %, respectively. The compositions of Synthesis Examples 1 to 6 are shown together in Table 1.

[0178]

[0179] Synthesis Example 7 Synthesis of (meth)acrylic polymer solution (PAL-1) A 500 mL flask was charged with 3.00 g of 2,2′-azobis(isobutyronitrile) and 50.0 g of PGMEA, and then 30.0 g (0.349 mol) of methacrylic acid, 22.48 g (0.216 mol) of styrene, and 35.0 g (0.149 mol) of tricyclo[5.2.1.02,6]decan-8-yl methacrylate were added and stirred at room temperature for a while. The atmosphere in the flask was replaced with nitrogen, and then the mixture was heated and stirred at 70° C. for 5 hours. Next, 15.00 g (0.106 mol) of glycidyl methacrylate, 1.00 g of triphenylphosphine, 0.200 g of p-methoxyphenol, and 100 g of PGMEA were added to the resulting solution, and the mixture was heated and stirred at 90°C for 4 hours to obtain a (meth)acrylic polymer solution. PGMEA was added to the resulting (meth)acrylic polymer solution so that the solids concentration was 40 wt%, to obtain a (meth)acrylic polymer solution (PAL-1). The weight-average molecular weight of the (meth)acrylic polymer was 16,000.

[0180] Synthesis Example 8 Synthesis of (meth)acrylic polymer solution (PAL-2) A 500 mL flask was charged with 3.00 g of 2,2'-azobis(isobutyronitrile) and 50.0 g of PGMEA, followed by 15.0 g (0.174 mol) of methacrylic acid, 38.06 g (0.216 mol) of benzyl methacrylate, and 32.80 g (0.149 mol) of tricyclodecanyl methacrylate. The mixture was stirred at room temperature for a while, and the atmosphere in the flask was replaced with nitrogen. The mixture was then heated and stirred for 5 hours at 70°C. Next, 15.0 g (0.106 mol) of glycidyl methacrylate, 1 g of triphenylphosphine, 0.200 g of p-methoxyphenol, and 100 g of PGMEA were added to the resulting solution, and the mixture was heated and stirred at 90°C for 4 hours to obtain a (meth)acrylic polymer solution. PGMEA was added to the obtained (meth)acrylic polymer solution so that the solid content concentration became 40% by weight, to obtain a (meth)acrylic polymer solution (PAL-2). The weight average molecular weight of the (meth)acrylic polymer was 25,000.

[0181] Synthesis Example 9 Synthesis of (meth)acrylic polymer solution (PAL-3) A 500 mL flask was charged with 3.00 g of 2,2'-azobis(isobutyronitrile) and 50.0 g of PGMEA, followed by 30.0 g (0.349 mol) of methacrylic acid and 116.98 g (0.498 mol) of tricyclo[5.2.1.02,6]decan-8-yl methacrylate, and the mixture was stirred at room temperature for a while. The atmosphere in the flask was replaced with nitrogen, and the mixture was heated and stirred for 5 hours at 70 ° C. Next, 15.00 g (0.106 mol) of glycidyl methacrylate, 1.00 g of triphenylphosphine, 0.200 g of p-methoxyphenol, and 100 g of PGMEA were added to the resulting solution, and the mixture was heated and stirred at 90 ° C. for 4 hours to obtain a (meth)acrylic polymer solution. PGMEA was added to the obtained (meth)acrylic polymer solution so that the solid concentration became 40% by weight, to obtain a (meth)acrylic polymer solution (PAL-3). The weight average molecular weight of the (meth)acrylic polymer was 16,000. The compositions of Synthesis Examples 7 to 9 are shown in Table 2.

[0182]

[0183] Synthesis Example 10 Green Organic Fluorescent Material 3,5-Dibromobenzaldehyde (3.0 g), 4-t-butylphenylboronic acid (5.3 g), tetrakis(triphenylphosphine)palladium(0) (0.4 g), and potassium carbonate (2.0 g) were placed in a flask and purged with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added and refluxed for 4 hours. The reaction solution was cooled to room temperature and separated, after which the organic layer was washed with saturated saline. This organic layer was dried over magnesium sulfate and filtered, and the solvent was distilled off. The resulting reaction product was purified by silica gel column chromatography to obtain a white solid, 3,5-bis(4-t-butylphenyl)benzaldehyde (3.5 g). Next, 3,5-bis(4-t-butylphenyl)benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were placed in a flask, and dehydrated dichloromethane (200 mL) and trifluoroacetic acid (1 drop) were added. The mixture was stirred for 4 hours under a nitrogen atmosphere. A solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) in dehydrated dichloromethane was added to the reaction mixture, and the mixture was stirred for an additional 1 hour. After the reaction was completed, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added and the mixture was stirred for 4 hours. Water (100 mL) was then added and stirred, and the organic layer was separated. The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The resulting reaction product was purified by silica gel column chromatography to obtain 0.4 g of a green powder (yield 17%). １ The results of H-NMR analysis are as follows, and it was confirmed that the green powder obtained above was [G-1] represented by the following structural formula. １ H-NMR (CDCl ３ (d=ppm)): 7.95 (s, 1H), 7.63-7.48 (m, 10H), 6.00 (s, 2H), 2.58 (s, 6H), 1.50 (s, 6H), 1.37 (s, 18H).

[0184]

[0185] Synthesis Example 11: Red Organic Fluorescent Phosphor: A mixed solution of 300 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoyl chloride, and 10 mL of toluene was heated at 120°C for 6 hours under a nitrogen stream. After cooling to room temperature, the solvent was evaporated. The resulting residue was washed with 20 mL of ethanol and dried under vacuum to obtain 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole. Next, a mixed solution of 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole, 180 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride, and 10 mL of degassed toluene was heated at 125°C for 7 hours under a nitrogen stream. After cooling the reaction mixture to room temperature, 20 ml of water was poured into the mixture, and the mixture was extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, evaporated, and dried under vacuum to obtain a pyrromethene derivative as a residue. Next, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to a mixed solution of the obtained pyrromethene derivative and 10 ml of toluene under a nitrogen stream, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was poured into the reaction mixture, and the mixture was extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and evaporated. After purification by silica gel column chromatography and vacuum drying, 0.27 g of a reddish-purple powder was obtained (yield 70%). １ The results of H-NMR analysis are as follows, and it was confirmed that the reddish purple powder obtained above was [R-1] represented by the following structural formula: １ H-NMR (CDCl ３ (d=ppm)): 1.19 (s, 18H), 3.42 (s, 3H), 3.85 (s, 6H), 5.72 (d, 1H), 6.20 (t, 1H), 6.42-6.97 (m, 16H), 7.89 (d, 4H).

[0186]

[0187] Synthesis Example 12 Silica Particle-Containing Polysiloxane Solution (LS-1) Into a 500 ml three-necked flask, 0.05 g (0.4 mmol) of methyltrimethoxysilane, 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane, 0.10 g (0.4 mmol) of trimethoxysilylpropylsuccinic anhydride, 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane, and 224.37 g of a 15.6 wt% silica particle isopropyl alcohol dispersion (IPA-ST-UP: manufactured by Nissan Chemical Industries, Ltd.) were placed, and 163.93 g of ethylene glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous phosphoric acid solution prepared by dissolving 0.088 g of phosphoric acid in 4.09 g of water was added over 3 minutes. Thereafter, the flask was immersed in a 40 ° C. oil bath and stirred for 60 minutes, and the oil bath was then heated to 115 ° C. over 30 minutes. One hour after the start of the temperature increase, the internal temperature of the solution reached 100°C, and the solution was heated and stirred for an additional two hours (internal temperature: 100-110°C), yielding a silica particle-containing polysiloxane solution (LS-1). During the temperature increase and heating and stirring, nitrogen was flowed in at a rate of 0.05 L / min. A total of 194.01 g of by-products, methanol and water, was distilled off during the reaction. The solids concentration of the resulting silica particle-containing polysiloxane solution (LS-1) was 24.3 wt%, and the contents of polysiloxane and silica particles in the solids were 15 wt% and 85 wt%, respectively. The molar ratios of repeating units derived from methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and γ-acryloxypropyltrimethoxysilane in the polysiloxane in the obtained silica particle-containing polysiloxane (LS-1) were 1.0 mol %, 8.0 mol %, 1.0 mol %, and 90.0 mol %, respectively.

[0188] Example 1 Resin composition for partition walls (P-1) 5.00 g of titanium dioxide pigment (R-960; manufactured by BASF Japan Ltd. (hereinafter referred to as "R-960")) as a white pigment, 5.00 g of the polysiloxane (PSL-1) solution obtained in Synthesis example 1 as a resin, and 0.0188 g of titanium nitride as a light-shielding pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads, to obtain a pigment dispersion (MW-1).

[0189] Next, 8.27 g of the pigment dispersion (MW-1), 2.83 g of the polysiloxane (PSL-1) solution, 4.48 g of the (meth)acrylic polymer (PAL-1) solution obtained in Synthesis Example 7, and 0.001 g of ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime) ("Irgacure" (registered trademark) OXE-02, manufactured by BASF Japan Ltd. (hereinafter referred to as "OXE-02")) as a photopolymerization initiator were mixed. 155 g, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("Irgacure" 819, manufactured by BASF Japan Ltd. (hereinafter referred to as "IC-819")) 0.258 g, 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene ("ADK STAB" (registered trademark) AO-330, manufactured by ADEKA Corporation (hereinafter referred to as "AO-330")) 0.001 g as a hindered phenol compound, 0.309 g, as a photopolymerizable compound, 2.063 g of dipentaerythritol hexaacrylate ("KAYARAD" (registered trademark) DPHA, manufactured by Shinnihon Pharmaceutical Co., Ltd. (hereinafter referred to as "DPHA")), as a liquid-repellent compound, 0.258 g of a photopolymerizable fluorine-containing compound ("MEGAFACE" (registered trademark) RS-72A, 20 wt % PGMEA diluted solution, manufactured by DIC Corporation (hereinafter referred to as "RS-72A")), 3',4'-epoxycyclohexylmethyl-3,4-epoxy 0.021 g of cyclohexanecarboxylate (Celloxide (registered trademark) 2021P, manufactured by Daicel Corporation (hereinafter referred to as "Celloxide (registered trademark) 2021P")) and 0.103 g of a 10 wt % diluted solution of an acrylic surfactant (BYK (registered trademark) 352, manufactured by BYK Japan K.K. (hereinafter referred to as "BYK-352")) in PGMEA (corresponding to a concentration of 500 ppm) were dissolved in 0.513 g of a solvent, PGMEA, and 1.65 g of DAA, and the mixture was stirred. The resulting mixture was filtered through a 5.0 μm filter, to obtain a partition wall resin composition (P-1).

[0190] Example 2 Partition wall resin composition (P-2) R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-1) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-2). Furthermore, 0.103 g of bis(acetylacetonato)palladium as an organometallic compound and 0.089 g (equimolar amount relative to the organometallic compound) of triphenylphosphine as a coordinating compound having a phosphorus atom were dissolved in 1.726 g of DAA to obtain an organometallic compound solution (OM-1).

[0191] A resin composition for partition walls (P-2) was obtained in the same manner as in Example 1, except that 8.25 g of the pigment dispersion (MW-2) was added instead of the pigment dispersion (MW-1), 1.92 g of the organometallic compound solution (OM-1), 2.61 g of the polysiloxane (PSL-1) solution, 4.26 g of the (meth)acrylic polymer (PAL-1) solution, and 0.701 g of PGMEA were added, and DAA was not added.

[0192] Example 3 Resin composition for partition walls (P-3) 0.103 g of silver neodecanoate as an organometallic compound was dissolved in 0.928 g of EDM to obtain an organometallic compound solution (OM-2). Resin composition for partition walls (P-3) was obtained in the same manner as in Example 2, except that 1.03 g of the organometallic compound solution (OM-2) was added instead of the organometallic compound solution (OM-1), 2.72 g of a polysiloxane (PSL-1) solution, 4.37 g of a (meth)acrylic polymer (PAL-1) solution, and 1.366 g of PGMEA.

[0193] Examples 4 to 6 Resin compositions for partition walls (P-4) to (P-6) Resin compositions for partition walls (P-4) to (P-6) were obtained in the same manner as in Example 1, except that the polysiloxane (PSL-1) solution was replaced with the polysiloxane (PSL-2), (PSL-3), or (PSL-4) solution, respectively.

[0194] Example 7 Resin composition for partition walls (P-7) A resin composition for partition walls (P-7) was obtained in the same manner as in Example 1, except that the (meth)acrylic polymer (PAL-2) solution was used instead of the (meth)acrylic polymer (PAL-1) solution.

[0195] Example 8 Resin composition for partition wall (P-8) A resin composition for partition wall (P-8) was obtained in the same manner as in Example 1, except that the cardo polymer V-259ME was used instead of the (meth)acrylic polymer (PAL-1) solution.

[0196] Example 9 Partition wall resin composition (P-9) A partition wall resin composition (P-9) was obtained in the same manner as in Example 1, except that the cardo polymer WR-301 was used instead of the (meth)acrylic polymer (PAL-1) solution.

[0197] Example 10 Resin composition for partition walls (P-10) A resin composition for partition walls (P-10) was obtained in the same manner as in Example 1, except that pentaerythritol tetrakis(3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate ("ADK STAB" (registered trademark) AO-60, manufactured by ADEKA Corporation (hereinafter referred to as "AO-60")) was used instead of the hindered phenol compound AO-330.

[0198] Example 11 Resin composition for partition walls (P-11) A resin composition for partition walls (P-11) was obtained in the same manner as in Example 1, except that 6,6'-di-t-butyl-4,4'-butylidenedi-m-cresol ("ADK STAB" (registered trademark) AO-40, manufactured by ADEKA Corporation (hereinafter referred to as "AO-40")) was used instead of the hindered phenol compound AO-330.

[0199] Example 12 Resin composition for partition walls (P-12) A resin composition for partition walls (P-12) was obtained in the same manner as in Example 1, except that octadecyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate ("ADK STAB" (registered trademark) AO-50, manufactured by ADEKA Corporation (hereinafter referred to as "AO-50")) was used instead of the hindered phenol compound AO-330.

[0200] Example 13 Resin composition for partition walls (P-13) A resin composition for partition walls (P-13) was obtained in the same manner as in Example 1, except that the amount of the hindered phenol compound AO-330 added was 0.0474 g, and 2.81 g of the polysiloxane (PSL-1) solution, 4.46 g of the (meth)acrylic polymer (PAL-1) solution, and 0.538 g of PGMEA were added.

[0201] Example 14 Resin composition for partition walls (P-14) A resin composition for partition walls (P-14) was obtained in the same manner as in Example 1, except that the amount of the hindered phenol compound AO-330 added was 0.330 g, and 2.46 g of the polysiloxane (PSL-1) solution, 4.10 g of the (meth)acrylic polymer (PAL-1) solution, and 0.962 g of PGMEA were added.

[0202] Example 15 Resin composition for partition walls (P-15) A resin composition for partition walls (P-15) was obtained in the same manner as in Example 1, except that the amount of the hindered phenol compound AO-330 added was 0.00516 g, and 2.86 g of the polysiloxane (PSL-1) solution, 4.51 g of the (meth)acrylic polymer (PAL-1) solution, and 0.474 g of PGMEA were added.

[0203] Example 16 Resin composition for partition walls (P-16) A resin composition for partition walls (P-16) was obtained in the same manner as in Example 1, except that the amount of the hindered phenol compound AO-330 added was changed to 0.00309 g, and 2.87 g of the polysiloxane (PSL-1) solution, 4.51 g of the (meth)acrylic polymer (PAL-1) solution, and 0.474 g of PGMEA were added.

[0204] Example 17 Resin composition for partition walls (P-17) A resin composition for partition walls (P-17) was obtained in the same manner as in Example 1, except that 0.103 g of 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate ("ADK STAB" (registered trademark) LA-82, manufactured by ADEKA Corporation (hereinafter referred to as "LA-82")) was added as the hindered amine compound, 2.70 g of polysiloxane (PSL-1) solution, 4.35 g of (meth)acrylic polymer (PAL-1) solution, and 0.668 g of PGMEA were added.

[0205] Example 18 Resin composition for partition walls (P-18) A resin composition for partition walls (P-18) was obtained in the same manner as in Example 17, except that 2,2,6,6-tetramethyl-4-piperidyl methacrylate ("ADK STAB" (registered trademark) LA-87, manufactured by ADEKA Corporation (hereinafter referred to as "LA-87")) was used instead of the hindered amine compound LA-82.

[0206] Example 19 Resin composition for partition walls (P-19) A resin composition for partition walls (P-19) was obtained in the same manner as in Example 17, except that the hindered phenol compound AO-330 was not added, and 2.74 g of the polysiloxane (PSL-1) solution, 4.39 g of the (meth)acrylic polymer (PAL-1) solution, and 0.621 g of PGMEA were added.

[0207] Example 20 Resin composition for partition walls (P-20) A resin composition for partition walls (P-20) was obtained in the same manner as in Example 19, except that bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate ("ADK STAB" (registered trademark) LA-72, manufactured by ADEKA Corporation (hereinafter referred to as "LA-72")) was used instead of the hindered amine compound LA-82.

[0208] Example 21 Resin composition for partition walls (P-21) A resin composition for partition walls (P-21) was obtained in the same manner as in Example 19, except that 1,2,2,5,5-pentamethylpiperidine was used instead of the hindered amine compound LA-82.

[0209] Example 22 Resin composition for partition walls (P-22) A resin composition for partition walls (P-22) was obtained in the same manner as in Example 19, except that the amount of the hindered amine compound LA-82 added was 0.248 g, and 2.56 g of the polysiloxane (PSL-1) solution, 4.71 g of the (meth)acrylic polymer (PAL-1) solution, and 0.838 g of PGMEA were added.

[0210] Example 23 Resin composition for partition walls (P-23) A resin composition for partition walls (P-23) was obtained in the same manner as in Example 19, except that the amount of the hindered amine compound LA-82 added was 0.371 g, and 2.40 g of the polysiloxane (PSL-1) solution, 4.05 g of the (meth)acrylic polymer (PAL-1) solution, and 1.024 g of PGMEA were added.

[0211] Example 24 Resin composition for partition walls (P-24) A resin composition for partition walls (P-24) was obtained in the same manner as in Example 19, except that the amount of the hindered amine compound LA-82 added was 0.0100 g, and 2.86 g of the polysiloxane (PSL-1) solution, 4.51 g of the (meth)acrylic polymer (PAL-1) solution, and 0.482 g of PGMEA were added.

[0212] Example 25 Resin composition for partition walls (P-25) A resin composition for partition walls (P-25) was obtained in the same manner as in Example 19, except that the amount of the hindered amine compound LA-82 added was changed to 0.0039, and 2.86 g of the polysiloxane (PSL-1) solution, 4.51 g of the (meth)acrylic polymer (PAL-1) solution, and 0.471 g of PGMEA were added.

[0213] Example 26 Resin composition for partition walls (P-26) A resin composition for partition walls (P-26) was obtained in the same manner as in Example 1, except that the amount of IC-819 added was 0.413 g and OXE-02 was not added.

[0214] Example 27 Resin composition for partition walls (P-27) A resin composition for partition walls (P-27) was obtained in the same manner as in Example 1, except that the amount of OXE-02 added was 0.413 g and IC-819 was not added.

[0215] Example 28 Resin composition for partition walls (P-28) A resin composition for partition walls (P-28) was obtained in the same manner as in Example 1, except that the amount of the polysiloxane (PSL-1) solution added was 1.33 g and the amount of the (meth)acrylic polymer (PAL-1) solution added was 5.98 g.

[0216] Example 29 Resin composition for partition walls (P-29) A resin composition for partition walls (P-29) was obtained in the same manner as in Example 1, except that the amount of the polysiloxane (PSL-1) solution added was 4.73 g and the amount of the (meth)acrylic polymer (PAL-1) solution added was 2.58 g.

[0217] Example 30 Partition Wall Resin Composition (P-30) 7.68 g of polysiloxane (PSL-1) solution, 7.68 g of (meth)acrylic polymer (PAL-1) solution, 0.123 g of OXE-02, 0.205 g of IC-819, 1.64 g of DPHA, 0.205 g of RS-72A, 0.016 g of Celloxide 2021P, 0.025 g of AO-330, and 0.103 g of a 10 wt % diluted solution of BYK-352 in PGMEA were dissolved in 0.619 g of PGMEA solvent and 2.214 g of DAA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain partition wall resin composition (P-30).

[0218] Example 31 Resin composition for partition walls (P-31) A resin composition for partition walls (P-31) was obtained in the same manner as in Example 2, except that the organometallic compound solution (OM-1) was not added, and the amounts of the polysiloxane (PSL-1) solution, the (meth)acrylic polymer (PAL-1) solution, the PGMEA, and the DAA were changed to 2.85 g, 4.50 g, 0.284 g, and 1.86 g, respectively.

[0219] Example 32 Resin composition for partition walls (P-32) 0.20 g of titanium nitride as a light-shielding pigment and 7.00 g of a polysiloxane (PSL-1) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads, thereby obtaining a pigment dispersion (MW-3). 5.90 g of the pigment dispersion (MW-3), 0.79 g of polysiloxane (PSL-1) solution, 6.54 g of (meth)acrylic polymer (PAL-1) solution, 0.108 g of OXE-02, 0.180 g of IC-819, 1.44 g of DPHA, 0.179 g of RS-72A, 0.014 g of Celloxide 2021P, 0.022 g of AO-330, and 0.103 g of a 10 wt % diluted solution of BYK-352 in PGMEA were dissolved in 1.804 g of PGMEA solvent and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a partition wall resin composition (P-32).

[0220] Example 33 Partition Wall Resin Composition (P-33) 4.00 g of the organometallic compound solution (OM-1), 6.21 g of the polysiloxane (PSL-1) solution, 6.21 g of the (meth)acrylic polymer (PAL-1) solution, 0.108 g of OXE-02, 0.180 g of IC-819, 1.44 g of DPHA, 0.179 g of RS-72A, 0.014 g of Celloxide 2021P, 0.022 g of AO-330, and 0.103 g of a 10 wt % PGMEA diluted solution of BYK-352 were dissolved in 2.03 g of PGMEA solvent and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain partition wall resin composition (P-33).

[0221] Example 34 Resin composition for partition walls (P-34) A resin composition for partition walls (P-34) was obtained in the same manner as in Example 2, except that the liquid-repellent compound RS-72A was not added, and the amounts of the polysiloxane (PSL-1) solution, the (meth)acrylic polymer (PAL-1) solution, and the PGMEA solution were changed to 2.67 g, 4.32 g, and 0.830 g, respectively.

[0222] Comparative Examples 1 and 2 Resin compositions for partition walls (P-35) to (P-36) Resin compositions for partition walls (P-35) to (P-36) were obtained in the same manner as in Example 1, except that the polysiloxane (PSL-1) solution was replaced with the polysiloxane (PSL-5) or (PSL-6) solution, respectively.

[0223] Comparative Example 3 Resin composition for partition walls (P-37) A resin composition for partition walls (P-37) was obtained in the same manner as in Example 1, except that the (meth)acrylic polymer (PAL-3) solution was used instead of the (meth)acrylic polymer (PAL-1) solution.

[0224] Comparative Example 4 Resin composition for partition walls (P-38) A resin composition for partition walls (P-38) was obtained in the same manner as in Example 1, except that the amount of the polysiloxane (PSL-1) solution added was 0.590 g and the amount of the (meth)acrylic polymer (PAL-1) solution added was 6.72 g.

[0225] Comparative Example 5 Resin composition for partition walls (P-39) A resin composition for partition walls (P-39) was obtained in the same manner as in Example 1, except that the amount of the polysiloxane (PSL-1) solution added was 5.07 g and the amount of the (meth)acrylic polymer (PAL-1) solution added was 2.24 g.

[0226] Comparative Example 6 Resin composition for partition walls (P-40) A resin composition for partition walls (P-40) was obtained in the same manner as in Example 1, except that the (meth)acrylic polymer (PAL-1) solution was not added and the amount of polysiloxane (PSL-1) solution added was changed to 7.31 g.

[0227] Comparative Example 7 Resin composition for partition walls (P-41) 5.00 g of R-960 as a white pigment, 5.00 g of a (meth)acrylic polymer (PAL-1) solution as a resin, and 0.0188 g of titanium nitride as a light-shielding pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads, to obtain a pigment dispersion (MW-4).

[0228] A resin composition for partition walls (P-41) was obtained in the same manner as in Example 1, except that 8.27 g of the pigment dispersion (MW-4) was added instead of the pigment dispersion (MW-1), and 7.31 g of the (meth)acrylic polymer (PAL-1) solution was added instead of the polysiloxane (PSL-1) solution.

[0229] Comparative Example 8 Resin composition for partition walls (P-42) A resin composition for partition walls (P-42) was obtained in the same manner as in Example 1, except that the hindered phenol compound AO-330 was not added, and 2.87 g of polysiloxane (PSL-1) solution, 4.52 g of (meth)acrylic polymer (PAL-1) solution, and 0.467 g of PGMEA were added. The compositions of Examples 1 to 34 and Comparative Examples 1 to 8 are shown together in Tables 3-1 to 3-4.

[0230]

[0231]

[0232]

[0233]

[0234] Preparation Example 1 Color-Converting Luminescent Material Composition (CL-1) 20 parts by weight of a 0.5 wt % toluene solution of a green quantum dot material (Lumidot 640 CdSe / ZnS, average particle size 6.3 nm: manufactured by Aldrich Chemical), 45 parts by weight of DPHA, 5 parts by weight of "Irgacure" (registered trademark) 907 (manufactured by BASF Japan Ltd.), 166 parts by weight of a 30 wt % PGMEA solution of an acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko K.K.), and 97 parts by weight of toluene were mixed and stirred to form a uniform solution. The resulting mixture was filtered through a 0.45 μm syringe filter to prepare a color-converting luminescent material composition (CL-1).

[0235] Preparation Example 2 Color-Converting Luminescent Material Composition (CL-2) A color-converting luminescent material composition (CL-2) was prepared in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 10 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight.

[0236] Preparation Example 3 Color-Converting Luminescent Material Composition (CL-3) A color-converting luminescent material composition (CL-3) was prepared in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 11 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight.

[0237] Preparation Example 4 Color Filter Forming Material (CF-1) 90 g of C.I. Pigment Green 59, 60 g of C.I. Pigment Yellow 150, 75 g of a polymer dispersant ("BYK" (registered trademark) -6919 (trade name) manufactured by BYK-Chemie Co., Ltd. (hereinafter referred to as "BYK-6919")), 100 g of a binder resin ("ADEKA ARCLES" (registered trademark) WR301 (trade name) manufactured by ADEKA Corporation), and 675 g of PGMEA were mixed to prepare a slurry. The beaker containing the slurry was connected to a Dyno Mill via a tube, and the mixture was subjected to a dispersion treatment at a peripheral speed of 14 m / s for 8 hours using zirconia beads having a diameter of 0.5 mm as a medium, to prepare a Pigment Green 59 dispersion (GD-1).

[0238] A color filter-forming material (CF-1) was prepared by mixing 56.54 g of Citrate Green 59 dispersion (GD-1), 3.14 g of an acrylic resin ("CYCLOMER" (registered trademark) P(ACA) Z250 (trade name) manufactured by Daicel-Allnex Corporation (hereinafter referred to as "P(ACA) Z250")), 2.64 g of DPHA, 0.330 g of a photopolymerization initiator ("OPTOMER" (registered trademark) NCI-831 (trade name) manufactured by ADEKA Corporation (hereinafter referred to as "NCI-831")), 0.04 g of a surfactant (BYK" (registered trademark) -333 (trade name) manufactured by BYK-Chemie KK (hereinafter referred to as "BYK-333")), 0.01 g of BHT as a polymerization inhibitor, and 37.30 g of PGMEA as a solvent.

[0239] Preparation Example 5 Resin composition for light-shielding partition walls A slurry was prepared by mixing 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Corporation), 75 g of polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA. The beaker containing the slurry was connected to a Dyno-Mill via a tube, and dispersion treatment was carried out for 8 hours at a peripheral speed of 14 m / s using zirconia beads with a diameter of 0.5 mm as media, to prepare a pigment dispersion (MB-1).

[0240] A resin composition for light-shielding partition walls was prepared by mixing 56.54 g of the pigment dispersion (MB-1), 3.14 g of P(ACA)Z250, 2.64 g of DPHA, 0.330 g of NCI-831, 0.04 g of BYK-333, 0.01 g of tert-butylcatechol as a polymerization inhibitor, and 37.30 g of PGMEA.

[0241] Preparation Example 6 Low Refractive Index Layer-Forming Material 5.350 g of the silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 12, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA were mixed and then filtered through a 0.45 μm syringe filter to prepare a low refractive index layer-forming material.

[0242] Preparation Example 7 Yellow Organic Protective Layer Forming Material (YL-1) C.I. Pigment Yellow 150 (150 g), polymer dispersant ("BYK" (registered trademark) -6919 (trade name) manufactured by BYK-Chemie Co., Ltd. (hereinafter referred to as "BYK-6919")) (75 g), binder resin ("ADEKA ARCLES" (registered trademark) WR301 (trade name) manufactured by ADEKA Corporation) (100 g), and PGMEA (675 g) were mixed to prepare a slurry. The beaker containing the slurry was connected to a Dyno Mill via a tube, and the mixture was subjected to a dispersion treatment at a peripheral speed of 14 m / s for 8 hours using zirconia beads with a diameter of 0.5 mm as a medium, to prepare a C.I. Pigment Yellow 150 dispersion (YD-1).

[0243] Pigment Yellow 150 dispersion (YD-1) 3.09 g, as a resin 23.54 g of polysiloxane (PSL-1) solution, as a photopolymerizable compound 6.02 g of DPHA, as an organometallic compound 6.02 g of an organometallic compound solution (OM-2) prepared using silver neodecanoate as an organometallic compound, as a photopolymerization initiator 0.20 g of OXE-02, 0.40 g of IC-819, 0.060 g of IRGANOX (registered trademark) 1010, and 0.050 g of a 10 wt% diluted solution of BYK-352 in PGMEA (corresponding to a concentration of 500 ppm) were dissolved in 61.15 g of PGMEA solvent and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a yellow organic protective layer-forming material (YL-1).

[0244] Examples 35 to 69, Comparative Examples 9 to 16 A 10 cm square alkali-free glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The partition wall resin compositions shown in Tables 4 to 5 were spin-coated thereon, and dried for 3 minutes at a temperature of 100°C using a hot plate (product name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to produce a dried film. The produced dried film was then irradiated with an ultra-high pressure mercury lamp as a light source through a photomask using a parallel light mask aligner (product name PLA-501F, manufactured by Canon Inc.) at an exposure dose of 100 mJ / cm. ２The film was exposed to light using an automatic developing apparatus ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.) for 100 seconds using a 0.045 wt % aqueous potassium hydroxide solution, followed by rinsing with water for 30 seconds. The film was then heated in air at 230°C for 30 minutes using an oven (trade name IHPS-222, manufactured by Espec Corporation) to form barrier ribs on the glass substrate, each 10 μm high and 20 μm wide, in a grid-like pattern with a short side of 80 μm and a long side of 280 μm at a pitch interval.

[0245] Each of the color-converting light-emitting material compositions shown in Tables 4 and 5 was applied to the regions separated by the partition walls of the obtained partition wall-equipped substrate by inkjet printing under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form pixels with a thickness of 5.0 μm, thereby obtaining a partition wall-equipped substrate having the configuration shown in FIG.

[0246] Example 70 A 10 cm square alkali-free glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as a base substrate. The light-shielding partition wall-forming material obtained in Preparation Example 5 was spin-coated thereon, and dried for 3 minutes at a temperature of 100°C using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to produce a dry film. The produced dry film was then irradiated with light at an exposure dose of 40 mJ / cm using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source through a photomask. ２ The film was exposed to light (g, h, i rays). Thereafter, using an automatic developing apparatus ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development was carried out for 50 seconds with a 0.3 wt % tetramethylammonium aqueous solution, followed by rinsing with water for 30 seconds. Furthermore, using an oven (trade name IHPS-222, manufactured by Espec Corporation), heating was carried out in air at a temperature of 230°C for 30 minutes, thereby obtaining a substrate with light-shielding partition walls on a glass substrate, in which partition walls having a height of 2.0 μm, a width of 20 μm, and an OD value of 2.0 per 1.0 μm thickness were formed in a grid-like pattern with a pitch of 40 μm on the short side and 280 μm on the long side.

[0247] Thereafter, a substrate with partition walls was obtained in which partition walls each having a height of 10 μm and a width of 20 μm were formed on the light-shielding partition walls in a lattice pattern similar to that of the light-shielding partition walls, with a pitch of 40 μm on the short side and 280 μm on the long side, by the same method as in Example 36. The color-changing light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied to the regions separated by the partition walls of the obtained substrate with partition walls using an inkjet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to form pixels with a thickness of 5.0 μm, thereby obtaining a substrate with partition walls having the configuration shown in FIG.

[0248] Example 71 The color filter-forming material (CF-1) obtained in Preparation Example 4 was applied to the regions separated by the partition walls of a partition-equipped substrate before pixel formation, which was obtained by the same method as in Example 36, so that the film thickness after curing would be 2.5 μm, and then dried under vacuum. The exposure dose was 40 mJ / cm through a photomask designed to expose the regions of the openings of the partition-equipped substrate. ２ The resulting film was exposed to light (g, h, i rays). Development was carried out for 50 seconds using a 0.3 wt % aqueous tetramethylammonium solution, followed by heat curing at 230°C for 30 minutes, to form a color filter layer having a height of 2.5 μm, a short side of 40 μm, and a long side of 280 μm in the region separated by the partition walls. The color-changing light-emitting material composition (CL-2) obtained in Preparation Example 2 was then applied onto the color filter using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form pixels with a thickness of 5.0 μm, thereby obtaining a substrate with partition walls having the configuration shown in FIG.

[0249] Example 72: The low refractive index layer-forming material obtained in Preparation Example 6 was spin-coated on a substrate with partition walls after pixels had been formed in the same manner as in Example 36, and the resulting film was dried at 100°C for 3 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to produce a dried film. The film was then heated in air at 90°C for 30 minutes using an oven (trade name IHPS-222, manufactured by Espec Corporation) to form a low refractive index layer having a height of 1.0 μm and a refractive index of 1.25, thereby obtaining a substrate with partition walls having the configuration shown in FIG.

[0250] Example 73 A silicon nitride film having a thickness of 300 nm, which corresponds to inorganic protective layer I having a height of 50 to 1,000 nm, was formed on the low refractive index layer of the partition wall-equipped substrate obtained in Example 72 using a plasma CVD apparatus (PD-220NL, manufactured by Samco Corporation), to obtain a partition wall-equipped substrate having the configuration shown in FIG.

[0251] Example 74 A 10 cm square alkali-free glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as a base substrate. The light-shielding partition wall-forming material obtained in Preparation Example 5 was spin-coated thereon, and dried for 3 minutes at a temperature of 100°C using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to produce a dry film. The produced dry film was then irradiated with light at an exposure dose of 40 mJ / cm using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source through a photomask. ２ The film was exposed to light (g, h, i rays). Thereafter, using an automatic developing apparatus ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development was carried out for 50 seconds with a 0.3 wt % tetramethylammonium aqueous solution, followed by rinsing with water for 30 seconds. Furthermore, using an oven (trade name IHPS-222, manufactured by Espec Corporation), heating was carried out in air at a temperature of 230°C for 30 minutes, thereby obtaining a substrate with light-shielding partition walls on a glass substrate, in which partition walls having a height of 2.0 μm, a width of 20 μm, and an OD value of 2.0 per 1.0 μm thickness were formed in a grid-like pattern with a pitch of 40 μm on the short side and 280 μm on the long side.

[0252] Thereafter, the color filter-forming material (CF-1) obtained in Preparation Example 4 was applied to the region separated by the light-shielding partition walls so that the film thickness after curing would be 2.5 μm, and then dried under vacuum. The exposure dose was 40 mJ / cm through a photomask designed to expose the region of the opening of the substrate with partition walls. ２ The resist was developed with a 0.3 wt % aqueous solution of tetramethylammonium for 50 seconds, and then heat-cured at 230° C. for 30 minutes to form a color filter layer having a height of 2.5 μm, a short side of 40 μm, and a long side of 280 μm in the region separated by the partition walls.

[0253] Thereafter, the low refractive index layer-forming material obtained in Preparation Example 6 was spin-coated and dried for 2 minutes at 90°C using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to prepare a dried film. Further, the film was heated in air at 90°C for 30 minutes using an oven (trade name IHPS-222, manufactured by Espec Corporation) to form a low refractive index layer having a height of 1.0 μm and a refractive index of 1.25.

[0254] Thereafter, a silicon nitride film having a thickness of 300 nm, which corresponds to an inorganic protective layer I having a height of 50 to 1,000 nm, was formed on the low refractive index layer using a plasma CVD apparatus (PD-220NL, manufactured by Samco).

[0255] A substrate with partition walls was obtained on top of these, in which partition walls each having a height of 10 μm and a width of 20 μm were formed in a lattice pattern similar to that of the light-shielding partition walls with a pitch of 40 μm on the short side and 280 μm on the long side, in the same manner as in Example 36. The color-changing light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied to the regions separated by the partition walls of the obtained substrate with partition walls using an inkjet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to form pixels with a thickness of 5.0 μm, thereby obtaining a substrate with partition walls having the configuration shown in FIG.

[0256] Example 75: A partition-attached substrate having a color filter layer with a thickness of 2.5 μm, a short side of 40 μm, and a long side of 280 μm formed thereon, obtained by the same method as in Example 71, and before pixel formation, was used to form a 300 nm-thick silicon nitride film, which corresponds to a 50 to 1,000 nm-thick inorganic protective layer III, using a plasma CVD apparatus (PD-220NL, manufactured by Samco). Furthermore, the color-changing light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the inorganic protective layer III using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form pixels with a thickness of 5.0 μm, thereby obtaining a partition-attached substrate having the configuration shown in FIG.

[0257] Example 76 A 10 cm square alkali-free glass substrate (AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as a base substrate. A 300 nm thick silicon nitride film, corresponding to an inorganic protective layer IV having a thickness of 50 to 1,000 nm, was formed thereon using a plasma CVD apparatus (PD-220NL, Samco). A substrate with partition walls having the configuration shown in FIG. 12 was obtained in the same manner as in Example 36, except that the above substrate was used instead of the 10 cm square alkali-free glass substrate.

[0258] Example 77 The yellow organic protective layer-forming material (YL-1) obtained in Preparation Example 7 was applied to the color filter of a substrate with partition walls before pixel formation, which had a color filter layer with a thickness of 2.5 μm, a short side of 40 μm, and a long side of 280 μm formed thereon, obtained by the same method as in Example 71, and then dried under vacuum. The exposure dose was 300 mJ / cm through a photomask designed to expose the opening regions of the substrate with partition walls. ２ The resulting film was exposed to ultraviolet (UV) radiation (g, h, i rays). After developing for 50 seconds with a 0.3 wt % aqueous tetramethylammonium solution, the film was heat-cured at 230°C for 30 minutes to form a yellow organic protective layer having a thickness of 1.0 μm, a short side of 40 μm, and a long side of 280 μm. Furthermore, the color-changing light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the yellow organic protective layer using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form pixels having a thickness of 5.0 μm, thereby obtaining a substrate with partition walls having the configuration shown in FIG.

[0259] Example 78 A 10 cm square alkali-free glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as a base substrate. The yellow organic protective layer-forming material (YL-1) obtained in Preparation Example 7 was coated thereon and dried under vacuum. The dried film was exposed to light at a dose of 300 mJ / cm without using a photomask. ２ After exposure to UV rays (g, h, i lines), the film was developed for 50 seconds in a 0.3 wt % tetramethylammonium aqueous solution and then heat-cured at 230°C for 30 minutes to form a yellow organic protective layer with a thickness of 1.0 μm. A substrate with partition walls having the structure shown in FIG. 8 was obtained in the same manner as in Example 36, except that the above substrate was used instead of a 10 cm square alkali-free glass substrate. The structures of each Example and Comparative Example are shown in Tables 4 and 5.

[0260]

[0261]

[0262] The evaluation methods used in each example and comparative example are described below. <Glass Transition Temperature of (Meth)acrylic Polymer and Cardo Polymer> The glass transition temperature of the (meth)acrylic polymer and / or cardo polymer in the resin composition of the present invention used in the examples and comparative examples was calculated from a thermogram obtained using a DSC device (Rigaku's "Thermo Plus DSC8230"). DSC measurements were performed under nitrogen at a heating rate of 20°C / min. The glass transition temperature was calculated as the temperature corresponding to the intersection of the baseline and the tangent at the inflection point on the DSC heating curve of the thermogram. The inflection point was the temperature corresponding to the peak in the DDSC (differential DSC) curve of the thermogram. The DDSC curve was also referenced as appropriate to confirm the DSC baseline. The glass transition temperature (Tg) was evaluated as "A" when it was 60°C or higher and "B" when it was lower than 60°C.

[0263] <Refractive Index of Low Refractive Index Layer> The low refractive index layer-forming material used in each example was applied to a silicon wafer using a spinner and dried at 90°C for 2 minutes using a hot plate (product name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). Thereafter, the film was heated in air at 90°C for 30 minutes using an oven (IHPS-222, manufactured by Espec Corporation) to produce a cured film. Using a prism coupler (PC-2000, manufactured by Metricon Corporation), light with a wavelength of 550 nm was irradiated from a direction perpendicular to the cured film surface under atmospheric pressure and at 20°C, and the refractive index was measured, and the value was rounded to two decimal places.

[0264] <Tacklessness of Dried Film> Using a spin coater (product name 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for partition walls used in each of the Examples and Comparative Examples was spin-coated onto a 10 cm square alkali-free glass substrate so that the film would have a dry thickness of 10 μm. The coating was then dried for 3 minutes at 100° C. using a hot plate (product name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to produce a dried film with a thickness of 10 μm. A 10 cm square alkali-free glass substrate acting as a mask was placed on top of the produced dried film for 1 minute, and the tacklessness of the dried film was evaluated according to the following criteria. The lower the adhesion of the glass substrate, the higher the tacklessness and the better the handleability. A: The dried film did not stick to the glass substrate when superimposed, and after the glass substrate was separated, no stains derived from the partition wall material were left on the glass substrate. B: The dried film adhered to the glass substrate when superimposed, but the glass substrate was easily separated. A small amount of stains derived from the partition wall material were left on the glass substrate. C: When the dried film was placed on the glass substrate, it stuck and adhered. The glass substrate could not be easily separated. After the glass substrate was separated, stains originating from the barrier rib material were found on the glass substrate.

[0265] <Crack Resistance> The partition wall-forming resin compositions used in each Example and Comparative Example were spin-coated to thicknesses of 10 μm, 15 μm, 20 μm, and 25 μm after heating. Subsequent processes were performed under the same conditions as in each Example and Comparative Example, except that the entire substrate was exposed without a photomask during exposure, to form a solid film on a glass substrate. The resulting solid film was used as a model for the partition walls of the partition-wall-equipped substrates obtained in each Example and Comparative Example. The glass substrates bearing the solid film were visually observed to evaluate the presence or absence of cracks in the solid film. If even one crack was observed, it was determined that the film had no crack resistance at that thickness. For example, if no cracks were observed at a film thickness of 15 μm but cracks were observed at a film thickness of 20 μm, the crack-resistant film thickness was determined to be "≧15 μm." Furthermore, the crack-resistant film thickness when no cracks were observed even at 25 μm was judged as "≧25 μm," and the crack-resistant film thickness when cracks were observed even at 10 μm was judged as "<10 μm," and these were taken as crack resistance.

[0266] <Wrinkle Resistance> The partition wall-forming resin compositions used in each Example and Comparative Example were spin-coated to film thicknesses of 10 μm, 15 μm, 20 μm, and 25 μm after heating. Subsequent processes were performed under the same conditions as in each Example and Comparative Example, except that the entire substrate was exposed without a photomask during exposure, to form solid films on glass substrates. The resulting solid films were used as models for the partition walls of the partition-wall-equipped substrates obtained in each Example and Comparative Example. The glass substrates bearing the solid films were visually observed to evaluate the presence or absence of wrinkles in the solid films. If wrinkles were observed, it was determined that the film thickness did not have wrinkle resistance. For example, if there were no wrinkles at a film thickness of 15 μm but wrinkles were present at a film thickness of 20 μm, the wrinkle resistance was determined to be "≧15 μm." Furthermore, if there were no wrinkles even at 25 μm, the wrinkle resistance was determined to be "≧25 μm," and if there were wrinkles even at 10 μm, the wrinkle resistance was determined to be "<10 μm."

[0267] <1% Weight Loss Temperature> The partition-forming resin composition used in each Example and Comparative Example was spin-coated onto a Si wafer to a film thickness of 10 μm after heating. Subsequent processes were performed under the same conditions as in each Example and Comparative Example, except that the entire surface was exposed without a photomask during exposure, to form a solid film on a glass substrate. Next, a portion of the solid film formed on the Si wafer was carefully scraped off to avoid contamination with impurities, and approximately 100 mg of the film was placed in an aluminum cell. Using a thermogravimetric analyzer (TGA-50, manufactured by Shimadzu Corporation), the sample was held at 150°C for 30 minutes in a nitrogen atmosphere, then heated to 400°C at a heating rate of 10°C / min, and the weight was measured. The temperature at which the weight lost 1% by weight from the initial weight was defined as the 1% weight loss temperature. A higher 1% weight loss temperature indicates higher heat resistance.

[0268] <Resolution> Using a spin coater (product name 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for partition walls used in each of the examples and comparative examples was spin-coated onto a 10 cm square alkali-free glass substrate so that the film thickness after heating would be 10 μm, and then using a hot plate (product name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.), the coating was dried at a temperature of 100° C. for 3 minutes to form a dried film having a film thickness of 10 μm.

[0269] The prepared dried film was exposed to light at a dose of 300 mJ / cm through a mask having line and space patterns with widths of 100 μm, 80 μm, 60 μm, 50 μm, 40 μm, 30 μm, and 20 μm using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) and an ultra-high pressure mercury lamp as a light source. ２ The resist was exposed to i-line light with a gap of 100 μm, and then shower-developed with a 0.045 wt % aqueous potassium hydroxide solution for 100 seconds using an automatic developing apparatus (Takizawa Sangyo Co., Ltd., "AD-2000 (trade name)"), followed by rinsing with water for 30 seconds.

[0270] The developed pattern was observed under magnification using a microscope adjusted to 100x magnification, and the narrowest line width among the patterns in which no residue was observed in the unexposed areas was taken as the resolution. However, if residue was also observed in the unexposed areas near the 100 μm wide pattern, it was recorded as ">100 μm."

[0271] <Reflectance> The partition wall-forming resin composition used in each Example and Comparative Example was processed under the same conditions as in each Example and Comparative Example, except that the entire surface was exposed without a photomask during exposure, to form a 10 μm-high solid film on a glass substrate. The resulting solid film was used as a model for the partition walls of the partition-wall-equipped substrate obtained in each Example and Comparative Example. The reflectance of the glass substrate with the solid film was measured from the solid film side in SCI mode at wavelengths of 350 to 750 nm using a spectrophotometer (product name CM-2600d, manufactured by Konica Minolta, Inc.), and the value at 550 nm was compared as a representative value. However, if cracks or wrinkles occurred in the solid film, reflectance measurement was not performed because accurate values ​​could not be obtained due to the cracks, etc.

[0272] <OD Value> As in the case of the evaluation of reflectance, a 10 μm-high solid film was formed on a glass substrate as a model of the partition walls of the partition-wall-equipped substrate obtained in each Example and Comparative Example. For the glass substrate with the solid film thus obtained, the intensities of incident light and transmitted light were measured using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science), and the OD values ​​at wavelengths of 300 to 800 nm were calculated using the above-mentioned formula (1). The value at 450 nm was used as a representative value for comparison.

[0273] Furthermore, a solid film was similarly formed on a glass substrate as a model of the light-shielding partition wall (A-2) for Example 70. The intensities of incident light and transmitted light were measured for the glass substrate with the solid film obtained using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science) and calculated using the above-mentioned formula (1).

[0274] <Taper Angle> In each of the Examples and Comparative Examples, an arbitrary cross section of the substrate with partition walls before pixel formation was observed using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) at an acceleration voltage of 3.0 kV to measure the taper angle.

[0275] <Line Width Increase> A 10 cm square alkali-free glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as a base substrate, and the partition wall resin composition used in each of the Examples and Comparative Examples was spin-coated thereon, and dried for 3 minutes at a temperature of 100°C using a hot plate (product name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to produce a dried film. The produced dried film was irradiated with an ultra-high pressure mercury lamp as a light source through a photomask (design: partition wall width 20 μm, opening short side 80 μm, opening long side 280 μm) using a parallel light mask aligner (product name PLA-501F, manufactured by Canon Inc.) at an exposure dose of 100 mJ / cm. ２ and 500 mJ / cm ２ The film was exposed to light using an automatic developing apparatus ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.) for 100 seconds using a 0.045 wt % aqueous potassium hydroxide solution, followed by rinsing with water for 30 seconds. Furthermore, the film was heated in air at a temperature of 230°C for 30 minutes using an oven (trade name IHPS-222, manufactured by Espec Corporation) to form 10 μm-high partition walls in a grid pattern on the glass substrate.

[0276] The barrier rib pattern was observed under magnification using a microscope adjusted to 100 times, the barrier rib line width was measured, and the exposure dose was 100 mJ / cm ２ and 500 mJ / cm ２The line widths at the exposure dose of 500 mJ / cm were compared. The line width increase was evaluated according to the following criteria. Note that no evaluation was made when the pattern peeled off during development or when residues were generated making measurement difficult. A: Exposure dose of 500 mJ / cm ２ The line width of the partition wall processed by the exposure dose of 100 mJ / cm ２ B: Exposure amount 500 mJ / cm ２ The line width of the partition wall processed by the exposure dose of 100 mJ / cm ２ C: Exposure amount 500 mJ / cm ２ The line width of the partition wall processed by the exposure dose of 100 mJ / cm ２ The line width is +10 μm or more compared to the line width of the partition wall processed in the step 1.

[0277] <Surface Contact Angle> As a model of the partition walls in the partition wall-equipped substrates obtained in each Example and Comparative Example, a 10 μm-high solid film was formed on a glass substrate, similar to the evaluation of reflectance. The surface of the solid film obtained was measured for its surface contact angle at 25°C in air using a DM-700 manufactured by Kyowa Interface Science Co., Ltd. and a microsyringe: a Teflon (registered trademark) coated needle 22G for contact angle meter manufactured by Kyowa Interface Science Co., Ltd., in accordance with the wettability test method for substrate glass surfaces specified in JIS R3257 (established on April 20, 1999). However, propylene glycol monomethyl ether acetate was used instead of water, and the contact angle between the solid film surface and propylene glycol monomethyl ether acetate was measured.

[0278] <Inkjet Coatability> In the partition-equipped substrates obtained in each Example and Comparative Example before pixel formation, PGMEA ink was inkjet coated onto pixel portions surrounded by grid-shaped partitions using an inkjet coater (InkjetLabo, manufactured by Cluster Technology Co., Ltd.). 160 pL of PGMEA was applied per grid pattern, and the presence or absence of breakthrough (a phenomenon in which ink overcomes the partitions and mixes into adjacent pixel portions) was observed, and inkjet coatability was evaluated according to the following criteria. Fewer breakthroughs indicate higher liquid repellency and superior inkjet coatability. A: The ink did not overflow from within the pixels. B: In some areas, the ink overflowed from within the pixels onto the top surface of the partitions. C: Over the entire surface, the ink overflowed from within the pixels onto the top surface of the partitions.

[0279] <Height> For the partition-wall-equipped substrates obtained in each Example and Comparative Example, the heights of the structures before and after pixel (B) formation were measured using a SURFCOM stylus film thickness measurement device, and the difference was calculated to measure the height of the pixel (B). For Examples 72 to 74, the film thickness of the low refractive index layer (C) was also measured. For Examples 71, 74 to 75, and 77, the film thickness of the color filter was also measured. For Examples 70 and 74, the thickness (height) of the light-shielding partition wall was also measured. For Examples 77 and 78, the thickness (height) of the yellow organic protective layer was also measured. Furthermore, for Examples 73 to 76, a polishing device such as a cross-section polisher was used to expose a cross section perpendicular to the base substrate, and the cross section was then magnified and observed with a scanning electron microscope or a transmission electron microscope to measure the height of the inorganic protective layer.

[0280] <Brightness> A surface light-emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as a light source, and the partition-equipped substrate obtained in each Example and Comparative Example was placed so that the pixel portion was on the light source side. A current of 30 mA was passed through this surface light-emitting device to light up the LED elements, and the brightness (unit: cd / m) based on the CIE 1931 standard was measured using a spectroradiometer (CS-1000, manufactured by Konica Minolta). ２) was measured and used as the initial luminance. The luminance was evaluated as a relative value, with the initial luminance of Example 67 set to a standard of 100. After the LED element was lit for 48 hours at room temperature (23°C), the luminance was measured in the same manner, and the change in luminance over time was evaluated. The luminance was evaluated as a relative value, with the initial luminance of Example 67 set to a standard of 100.

[0281] <Color Characteristics> The partition-equipped substrates obtained in each of the Examples and Comparative Examples were placed on a commercially available white reflector so that the pixels were located on the white reflector side. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, Inc., measurement diameter φ8 mm), light was irradiated from the base substrate side of the partition-equipped substrate, and the spectrum including specular reflection light was measured.

[0282] The color gamut defined by the color standard BT.2020, which can reproduce the colors of nature almost completely, is defined as the three primary colors of red, green, and blue on the spectral locus shown in a chromaticity diagram, with the wavelengths of red, green, and blue corresponding to 630 nm, 532 nm, and 467 nm, respectively. The luminescent color of the pixel was evaluated based on the reflectance (R) of the obtained reflection spectrum at three wavelengths of 470 nm, 530 nm, and 630 nm, according to the following criteria: A:R ５３０ / (R ６３０ +R ５３０ +R ４７０ ) ≧ 0.55 B:R ５３０ / (R ６３０ +R ５３０ +R ４７０ ) <0.55.

[0283] <Display characteristics> The display characteristics of the display devices fabricated by combining the partition-equipped substrates obtained in each Example and Comparative Example with the organic EL elements were evaluated based on the following criteria: A: The green display is very vivid and clear, and the display device has excellent contrast. B: The color is somewhat unnatural, but the display device is not problematic.

[0284] <Color Mixing> In the substrates with partition walls obtained in each Example and Comparative Example before pixel formation, color-converting light-emitting material composition (CL-2) was applied by inkjet printing to a part of the pixel portion surrounded by the lattice-shaped partition wall, and dried for 30 minutes at 100° C. to form pixels with a thickness of 5.0 μm. Thereafter, color-converting light-emitting material composition (CL-3) was applied by inkjet printing to a region of the pixel portion surrounded by the lattice-shaped partition wall adjacent to the region where color-converting light-converting material composition (CL-2) was applied, and dried for 30 minutes at 100° C. to form pixels with a thickness of 5.0 μm.

[0285] Separately, a blue organic EL cell having the same width as the pixel portion surrounded by the lattice-shaped partition walls was prepared, and the aforementioned substrate with partition walls and the blue organic EL cell were bonded together with a sealant, facing each other, to obtain a display device having the configuration shown in FIG. 15. Among the blue organic EL cells 11 in FIG. 15, only the blue organic EL cell bonded directly below pixel 3 (CL-2) formed with color-changing luminescent material composition (CL-2) was turned on, and the absorbance intensity A (630 nm) at a wavelength of 630 nm was measured for pixel 3 (CL-3) formed with color-changing luminescent material composition (CL-3) using a microspectrophotometer LVmicro-V (manufactured by Lambda Vision Corporation). The smaller the value of absorbance intensity A (630 nm), the less likely color mixing was to occur. Color mixing was evaluated according to the following criteria. A: A(630nm)<0.01 B: 0.01≦A(630nm)≦0.5 C: 0.5<A(630nm).

[0286] The evaluation results of each example and comparative example are shown in Tables 6 and 7.

[0287]

[0288]

[0289] DESCRIPTION OF SYMBOLS 1 Base substrate 2 Partition wall 3 Pixel 3 (CL-2) Pixel formed from color-converting luminescent material composition (CL-2) 3 (CL-3) Pixel formed from color-converting luminescent material composition (CL-3) 4 Light-shielding partition wall 5 Color filter 6 Low refractive index layer 7 Inorganic protective layer I 8 Inorganic protective layer II 9 Inorganic protective layer III and / or yellow organic protective layer 10 Inorganic protective layer IV and / or yellow organic protective layer 11 Light-emitting source selected from organic EL cell, mini LED cell, and micro LED cell 12 Blue organic EL cell H Thickness of partition wall L Width of partition wall θ Taper angle

Claims

1. (i) a photo radical generator; (ii) a hindered phenol compound and / or a hindered amine compound; (iii) a polysiloxane containing a structure having an aromatic ring represented by the following general formula (1) or (2) and a structure having a photo radical polymerizable group represented by the following general formula (3); (iv) a (meth)acrylic polymer containing a structure having an aromatic ring represented by the following general formula (4) and a structure having a photo radical polymerizable group represented by the following general formula (5) and / or a cardo polymer having a structure represented by the following general formula (6) or the following general formula (7) and a photo radical polymerizable group, a resin composition, wherein the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo polymer is 30 / 70 to 70 / 30. 【Chemical Formula 1】 (In general formulas (1) to (7), R １ and R ２ each independently represent hydrogen, a hydroxy group, a group having a siloxane bond, or a monovalent organic group having 1 to 30 carbon atoms. R ３ and R ４ each independently represent hydrogen, a hydroxy group, or a monovalent organic group having 1 to 30 carbon atoms. R ５ to R ７ each independently represent hydrogen, a monovalent organic group having 1 to 30 carbon atoms, an aryl group having 6 to 20 carbon atoms, or a group in which the ring formed by adjacent R ５ to R ７ is an aromatic ring. R ８ represents hydrogen, a monovalent organic group having 1 to 30 carbon atoms, or an aryl group having 6 to 20 carbon atoms. X １ , X ２ , X ３ and X ４ each independently represent an organic group having an aromatic ring. Y １ and Y ２ each independently represent an organic group having a photo radical polymerizable group. p, q, r are each independently an integer of 0 to 2, and s represents an integer of 1 to 2. a, b, c, d, e, f, and g each independently represent an integer of 1 or more.) When a to e are 2 or more, a plurality of Rs １ , R ２ , R ３ , R ４ , R ５ , R ６ , R ７ , R ８ , X １ , X ２ , X ３ , X ４ , Y １ and Y ２ may be the same or different from each other. )

2. The resin composition according to claim 1, wherein the hindered phenol compound is a hindered phenol compound having two or more hindered phenol groups in one molecule.

3. The resin composition according to claim 1 or 2, wherein the hindered amine compound is a piperidine compound.

4. The resin composition according to claim 1 or 2, wherein the hindered amine compound is a piperidine compound having a photo polymerizable group.

5. The resin composition according to claim 1 or 2, wherein the weight average molecular weight of the polysiloxane is 5,000 to 300,000, and in all repeating units of the polysiloxane, the repeating unit represented by the general formula (1) or (2) is contained in an amount of 30 to 70 mol%, and the repeating unit represented by the general formula (3) is contained in an amount of 15 to 70 mol%.

6. The resin composition according to claim 1 or 2, wherein the glass transition temperature of the (meth)acrylic polymer and / or the cardo polymer is 60°C or higher.

7. The resin composition according to claim 1 or 2, further containing at least one selected from the group consisting of a white pigment, a light-shielding pigment, and an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium.

8. The resin composition according to claim 1 or 2, containing an oxime ester compound and a phosphine oxide compound as the photo radical generator.

9. The resin composition according to claim 1 or 2, further containing a liquid-repellent compound having a photo polymerizable group.

10. A light-shielding film obtained by curing the resin composition according to claim 1 or 2.

11. A substrate with partition walls formed with a (A-1) pattern by the resin composition according to claim 1 or 2 on a lower substrate, wherein the reflectance per 10 μm thickness of the partition walls at a wavelength of 550 nm is 10% to 60%, and the OD value per 10 μm thickness of the partition walls at a wavelength of 450 nm is 1.0 to 3.

0.

12. The substrate with partition walls according to claim 11, wherein the (A-1) pattern-formed partition walls contain a resin, a white pigment, and a light-shielding pigment, and the light-shielding pigment is titanium nitride, zirconium nitride, carbon black, a mixed pigment having a weight ratio of red pigment to blue pigment of 20 / 80 to 80 / 20, and a pigment selected from particles composed of at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver.

13. The substrate with partition walls according to claim 11, wherein the (A-1) pattern-formed partition walls further contain a hindered amine compound.

14. The substrate with partition walls according to claim 11, further having a pattern-formed light-shielding partition wall (A-2) having an OD value of 0.5 or more per 1.0 μm thickness between the lower substrate and the (A-1) pattern-formed partition walls.

15. The substrate with partition walls according to claim 11, further having a pixel layer containing a (B) color conversion light-emitting material arranged and separated by the (A-1) pattern-formed partition walls.

16. A display device having the substrate with partition walls according to claim 11 and a light-emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.

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