Switch device

Abstract

This switch device is provided with: a glass layer comprising tempered glass; and a switch unit disposed on the back surface side of the glass layer. The thickness of the glass layer is 100 μm to 200 μm, inclusive. The switch unit is provided with a plurality of contacts including a contact that is movable in the vertical direction. When the glass layer is pressed, the glass layer elastically deforms so as to switch between conduction and non-conduction of the plurality of contacts.

Description

Switching device

[0001] The present invention relates to a switch device.

[0002] Switches that mechanically control electrical contact are widely used as an input method for electronic components. One example of such a switch is the tactile switch shown in Patent Document 1. This type of switch has a sliding button that can self-recognize on / off, and is therefore thought to have the advantage of being less prone to malfunction than touch-type switches.

[0003] Among these types of switches, switches with contacts that move up and down and slide up and down use flexible, break-resistant resin as their outermost surface. However, resin surfaces are prone to deterioration due to scratches, are difficult to clean with solvents, have a poor texture, and are not strong enough. Therefore, a switch device that solves these problems is needed.

[0004] Japanese Patent Application Publication No. 06-203679

[0005] The present invention has been made in consideration of the above points, and aims to provide a switch device with contacts that can move up and down, which has improved scratch resistance, solvent cleanability, and texture, as well as sufficient strength.

[0006] This switch device has a glass layer made of tempered glass and a switch unit arranged on the back side of the glass layer, the thickness of the glass layer being between 100 μm and 200 μm, the switch unit having a plurality of contacts including a contact that can move up and down, and when the glass layer is pressed, the glass layer elastically deforms, switching between conductive and non-conductive states of the plurality of contacts.

[0007] According to the disclosed technology, in a switch device having contacts that can move up and down, it is possible to improve scratch resistance, solvent cleanability, and texture, while also providing sufficient strength.

[0008] It is a cross-sectional view (part 1) illustrating the switch device according to the first embodiment. It is a plan view illustrating a frame of the switch device according to the first embodiment. It is a cross-sectional view (part 2) illustrating the switch device according to the first embodiment. It is a diagram showing the conditions and results of an example and a comparative example.

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following describes the preferred embodiments of the present invention with reference to the accompanying drawings. In the drawings, the same components are designated by the same reference numerals, and redundant explanations may be omitted.

[0010] 1 is a cross-sectional view (part 1) illustrating a switch device according to a first embodiment. As shown in FIG. 1 , the switch device 1 includes a support portion 10, a bonding layer 20, a frame 30, a bonding layer 40, a resin layer 50, a bonding layer 60, a glass layer 70, and a switch portion 80. Note that the support portion 10, the frame 30, the bonding layer 40, the resin layer 50, and the bonding layer 60 are not essential components of the switch device 1.

[0011] One surface 70a of the glass layer 70 is the outermost surface of the switch device 1. Other members such as the support portion 10 and other layers are disposed on the other surface 70b (back surface side) of the glass layer 70. The switch device 1 is mounted on, for example, a wiring board.

[0012] Here, the materials and the like of each part of the switch device 1 will be described.

[0013] [Supporting Section] The supporting section 10 is disposed on the other surface 70b (rear surface side) of the glass layer 70 and supports the glass layer 70 and the like. The supporting section 10 can be disposed, for example, outside the switch section 80 in a frame shape so as to surround the switch section 80. Alternatively, a plurality of supporting sections 10 may be disposed at intervals at any positions outside the switch section 80. The supporting section 10 is formed, for example, from a resin, a metal, or the like.

[0014] Note that a component constituting the switch section 80 may be used as the support section. Alternatively, the switch section 80 itself may be used as the support section. That is, the support section may be a part of the switch section 80, or the whole of the switch section 80. In these cases, the support section 10 shown in FIG. 1 does not need to be provided. Alternatively, a part or the whole of the switch section 80 may be used as the support section, and the support section 10 shown in FIG. 1 may be provided separately.

[0015] [Bonding Layer] Any pressure-sensitive adhesive or adhesive can be used for the bonding layers 20, 40, and 60. In this specification, a pressure-sensitive adhesive refers to a layer that has adhesive properties at room temperature and adheres to an adherend with light pressure. Therefore, even when an adherend attached to the pressure-sensitive adhesive is peeled off, the pressure-sensitive adhesive maintains practical adhesive strength. On the other hand, an adhesive refers to a layer that can bond substances by being interposed between them. Therefore, when an adherend attached to the adhesive is peeled off, the adhesive loses practical adhesive strength.

[0016] Examples of the adhesive include adhesives having a base polymer such as an acrylic polymer, a silicone polymer, a polyester, a polyurethane, a polyamide, a polyether, a fluorine-based polymer, or a rubber-based polymer.

[0017] Examples of adhesives include polyester adhesives, polyurethane adhesives, polyvinyl alcohol adhesives, and epoxy adhesives. If the adhesive is a thermosetting adhesive, it can exhibit peel resistance by being heated and cured (solidified). If the adhesive is a photocurable adhesive such as an ultraviolet curable adhesive, it can exhibit peel resistance by being cured by irradiating it with light such as ultraviolet light. If the adhesive is a moisture curable adhesive, it can be cured by reacting with moisture in the air, and can therefore exhibit peel resistance by being left to stand.

[0018] From the viewpoint of strength, it is preferable to use an adhesive or pressure-sensitive adhesive for bonding layer 20, a pressure-sensitive adhesive for bonding layer 40, and an adhesive for bonding layer 60. The thickness of bonding layer 20 is preferably within a range of 5 μm to 2 mm. Due to the manufacturing method of the pressure-sensitive adhesive layer, the thickness of bonding layer 40 is preferably 5 μm to 200 μm, more preferably 20 μm to 150 μm, and even more preferably 20 μm to 100 μm. The thickness of bonding layer 60 is preferably 0.5 μm to 25 μm, more preferably 0.5 μm to 5 μm, and even more preferably 0.5 μm to 3 μm.

[0019] [Frame] The frame 30 can be interposed between the glass layer 70 and the switch section 80. In the example of FIG. 1, the frame 30 is bonded onto the support section 10 via a bonding layer 20. FIG. 2 is a plan view illustrating the frame. As shown in FIG. 2, the frame 30 has a fixed section 31 and a movable section 32 supported by elastic support sections 33 relative to the fixed section 31. The fixed section 31 has an opening, and the movable section 32 is disposed within the opening. The fixed section 31 and the movable section 32 are movably supported by the multiple elastic support sections 33. Note that only the fixed section 31 is bonded to the support section 10; the movable section 32 and the elastic support sections 33 are not bonded to the support section 10.

[0020] In the example of FIG. 2, a circular opening is formed in the approximate center of a rectangular fixed portion 31, and a circular movable portion 32 is disposed within the opening. The diameter of the movable portion 32 can be, for example, approximately 10 mm to 30 mm. In addition, in the example of FIG. 2, three elastic support portions 33 are disposed at positions that divide the circumferential direction of the movable portion 32 into approximately three equal parts. However, the shapes of the fixed portion 31 and the movable portion 32, and the number and connection positions of the elastic support portions 33 are not limited to those in the example of FIG. 2. The elastic support portions 33 are, for example, springs. The springs may be leaf springs or coil springs. The elastic support portions 33 may also be made of materials other than springs, such as rubber.

[0021] The frame 30 can be integrally formed from, for example, resin or metal. When the frame 30 is made of resin, materials such as ABS resin, vinyl chloride resin, polypropylene resin, polycarbonate resin, and polystyrene resin can be used. When the frame 30 is made of metal, materials such as aluminum and SUS can be used. The thickness of the frame 30 can be, for example, 0.5 mm or more and 5 mm or less.

[0022] [Resin Layer] The resin layer 50 can be interposed between the glass layer 70 and the switch section 80. In the example of FIG. 1 , the resin layer 50 is bonded onto the fixing section 31 of the frame 30 via the bonding layer 40. The resin layer 50 is flexible. From the viewpoint of flexibility, the thickness of the resin layer 50 is preferably 50 μm or more and 150 μm or less. Examples of materials for the resin layer 50 include polyester resins such as polyethylene terephthalate resins and polyethylene naphthalate resins, cycloolefin resins such as norbornene resins, polyethersulfone resins, polycarbonate resins, acrylic resins, polyolefin resins, polyimide resins, polyamide resins, polyimideamide resins, polyarylate resins, polysulfone resins, polyetherimide resins, and urethane resins.

[0023] In this way, when the resin layer 50 is laminated below the glass layer 70, the resin layer 50 has the effect of suppressing excessive deformation of the glass layer 70 and suppressing cracking of the glass layer 70, and also realizes an appropriate amount of deformation, thereby improving durability against repeated elastic deformation of the glass layer 70. Note that the amount of deformation of the glass layer 70 can be controlled by changing the thickness of the resin layer 50.

[0024] A plurality of resin layers may be laminated via a bonding layer below the glass layer 70. Such a laminated structure can further suppress cracking of the glass layer 70 and can further improve the durability of the glass layer 70 against repeated elastic deformation.

[0025] [Glass Layer] The glass layer 70 is laminated on the resin layer 50 via the bonding layer 60. The glass layer 70 is made of tempered glass. The tempered glass may be chemically tempered glass or thermally tempered glass, but chemically tempered glass having a compressive stress layer is easier to manufacture than thermally tempered glass. The glass layer 70 preferably has a compressive stress of 600 MPa or more.

[0026] Chemical strengthening refers to the process of replacing ions near the surface of a glass sheet with ions with a larger ionic radius. This ion exchange creates a compressive stress layer on the surface of the glass sheet, resulting in chemically strengthened glass. The glass composition in the compressive stress layer is different from the glass composition inside the glass.

[0027] In chemically strengthened glass, the glass plate before strengthening can be, for example, soda-lime glass, aluminosilicate glass, borosilicate glass, aluminoborosilicate glass, etc. Soda-lime glass or soda-silicate glass is preferred, and soda-lime glass is more preferred, in that the depth of the compressive stress layer does not become too large more than necessary.

[0028] Ion exchange can be performed, for example, by substituting Li ions on the surface of the glass plate with Na ions and / or K ions. Alternatively, Na ions on the surface of the glass plate may be substituting K ions. By such ion exchange, a compressive stress layer is formed on the surface of the glass plate.

[0029] In the case of substituting Na ions with K ions, for example, a glass plate containing sodium may be brought into contact with an inorganic molten salt containing potassium nitrate. ２ CO ３ , Na ２ CO ３ , KHCO ３ , NaHCO ３ It is preferable that the solution contains at least one salt selected from the group consisting of KOH and NaOH.

[0030] Considering the strength and durability required for the glass layer of the switch device, the thickness of the glass layer 70 is preferably 100 μm or more. On the other hand, the glass layer used in the switch device needs to be elastically deformable, and considering sufficient elastic deformation, the thickness of the glass layer 70 is preferably 200 μm or less.

[0031] A functional layer such as an antifouling layer, an anti-reflection layer, a conductive layer, a reflective layer, or a decorative layer may be provided on the front and / or back surface of the glass layer 70. In the switch device according to this embodiment, the glass layer 70 is located on the outermost surface. Here, "the glass layer 70 is located on the outermost surface" means that the glass layer 70 is substantially located on the outermost surface, and even if an additional layer such as the above is provided, this embodiment expresses the glass layer 70 as being located on the outermost surface.

[0032] [Switch Unit] The switch unit 80 is disposed on the back surface side of the glass layer 70. In the example of Fig. 1, the switch unit 80 is disposed inside the support unit 10 and on the opposite side of the frame 30 from the glass layer 70 and the like.

[0033] The switch unit 80 also has a plurality of contacts, including a contact that can move up and down. In the example of Fig. 1, the switch unit 80 is a tactile switch, and has a housing 81, a film 82, a frame 83, a stem 84, a first contact 85, and a second contact 86. Of the first contact 85 and the second contact 86, the second contact 86 is a contact that can move up and down.

[0034] The housing 81 and the frame 83 are each square-shaped and are arranged opposite each other with an adhesive film 82 sandwiched between them. The film 82 is arranged, for example, so as to close the opening of the housing 81. The stem 84 is held by the frame 83 in a state in which it can slide freely up and down.

[0035] A first contact 85 and a second contact 86 are arranged on the bottom surface of the housing 81. The second contact 86 is arranged above the first contact 85 and spaced apart from the first contact 85. The film 82 and the second contact 86 are configured to be elastically deformable. The housing 81, the film 82, the frame 83, and the stem 84 are made of, for example, resin.

[0036] 1, external connection terminals electrically connected to the first contact 85 and the second contact 86 are not shown. There is a gap of approximately 0.1 mm to 0.2 mm between the upper surface of the stem 84 of the switch unit 80 and the lower surface of the movable part 32 of the frame 30. Note that the switch unit 80 is not limited to a tactile switch, and may be a membrane switch or the like.

[0037] FIG. 3 is a cross-sectional view (part 2) illustrating the switch device according to the first embodiment, showing a state in which one surface 70a of the glass layer 70 is pressed in the direction of the arrow.

[0038] As described above, the thickness of the glass layer 70 is preferably 100 μm or more and 200 μm or less. By making the glass layer 70 have such a thickness, the glass layer 70 can be elastically deformed and can be locally recessed. When one surface 70a of the glass layer 70 is pressed, the glass layer 70 elastically deforms together with the resin layer 50 and the bonding layer 60, moving the movable part 32 of the frame 30 and switching between contact (conduction) and non-contact (non-conduction) between the first contact 85 and the second contact 86 of the switch unit 80. The glass layer 70 can be elastically deformed so as to sink, for example, approximately 0.5 mm to 2 mm in the vertical direction.

[0039] In the example of Fig. 1 , when the glass layer 70 is not pressed, the first contact 85 and the second contact 86 of the switch unit 80 are not in contact (non-conductive state). Therefore, as shown in Fig. 3 , when the glass layer 70 is pressed and deformed, the stem 84 of the switch unit 80 is pressed accordingly, causing the film 82 and the second contact 86 to elastically deform, so that the second contact 86 approaches the first contact 85, and the first contact 85 and the second contact 86 come into contact and become conductive. When the force pressing the glass layer 70 is removed, the glass layer 70 returns to the state shown in Fig. 1 , and the first contact 85 and the second contact 86 are again not in contact.

[0040] In this way, by setting the thickness of the glass layer 70 to be 100 μm or more and 200 μm or less, the glass layer 70 becomes elastically deformable. As a result, when the glass layer 70 is pressed, the contacts of the switch unit 80 slide up and down in accordance with local deformation of the glass layer 70, and the multiple contacts of the switch unit 80 can be switched between conductive and non-conductive states.

[0041] Because the outermost surface of the switch device 1 is the glass layer 70, it is possible to improve scratch resistance, solvent cleanability, and texture compared to when the outermost surface is made of resin. Furthermore, because the glass layer 70 of the switch device 1 is tempered glass, it is possible to provide sufficient strength and durability compared to when the glass layer 70 is untempered glass. Furthermore, because the switch device 1 is a sliding switch, it is possible to obtain a tactile sensation when pressed and reduce the risk of malfunction.

[0042] Although capacitive switches are also considered as switches with glass on the top surface, it is difficult to create an up-and-down sliding action with ordinary plate glass. As a result, there is no tactile sensation when pressed, and there is a risk of malfunctioning even if touched unintentionally.

[0043] Example 1 In Example 1, a switch device having the structure shown in Fig. 1 was fabricated. Chemically strengthened glass with a compressive stress of 600 MPa was used as the glass layer 70, and the thickness was set to 200 µm. PET was used as the material for the resin layer 50, and the thickness was set to 100 µm. The bonding layer 60 was an adhesive, and epoxy resin was used as the material, and the thickness was set to 1 µm.

[0044] Example 2 In Example 2, a switch device was fabricated in the same manner as in Example 1 except that chemically strengthened glass with a compressive stress of 600 MPa and a thickness of 150 μm was used as the glass layer 70.

[0045] Example 3 In Example 2, a switch device was fabricated in the same manner as in Example 1 except that chemically strengthened glass with a compressive stress of 600 MPa and a thickness of 100 μm was used as the glass layer 70.

[0046] Comparative Example 1 In Comparative Example 1, a switch device was fabricated in the same manner as in Example 1 except that chemically strengthened glass having a compressive stress of 600 MPa and a thickness of 300 μm was used as the glass layer 70.

[0047] Comparative Example 2 In Comparative Example 2, a switch device was fabricated in the same manner as in Example 1 except that chemically strengthened glass having a compressive stress of 600 MPa and a thickness of 50 μm was used as the glass layer 70.

[0048] Comparative Example 3 In Comparative Example 3, a switch device was produced in the same manner as in Example 1 except that untempered glass was used as the glass layer 70 and the thickness was 200 μm.

[0049] Comparative Example 4 In Comparative Example 4, a switch device was fabricated in the same manner as in Example 1 except that untempered glass was used as the glass layer 70 and the thickness was 100 μm.

[0050] [Evaluation 1] For the switch devices produced in Examples 1 to 3 and Comparative Examples 1 to 4, it was confirmed whether pressing the glass layer 70 would cause the glass layer 70 to elastically deform and press the switch portion 80. Specifically, it was confirmed whether the switch portion 80 would switch from non-conductive to conductive when pressed with a load of 5 N from the glass layer 70 side in the direction of the arrow in Figure 3, and a mark of "O" was given if it switched, and a mark of "X" if it did not switch.

[0051] [Evaluation 2] A strength test was conducted on the switch devices produced in Examples 1 to 3 and Comparative Examples 1 to 4, and the presence or absence of cracks in the glass layer 70 was visually confirmed. A score of ◯ was given if no cracks were observed, and a score of × was given if cracks were observed. The strength test was conducted in accordance with the spring hammer test specified in JIS C4526-1:2021. The force applied to the switch device in the spring hammer test was 0.5 J.

[0052] [Evaluation Results] The evaluation results are shown in Fig. 4. From Examples 1 to 3 in Fig. 4, it was confirmed that by using chemically strengthened glass with a compressive stress of 600 MPa as glass layer 70 and setting the thickness to 100 µm to 200 µm, it was possible to switch the conduction and non-conduction of the switch portion and obtain sufficient strength.

[0053] In contrast, Comparative Example 1 confirmed that even if chemically strengthened glass having a compressive stress of 600 MPa was used as the glass layer 70, if the thickness was 300 μm, the strength was too high to elastically deform, and it was not possible to switch the switch unit between conductive and non-conductive. Furthermore, Comparative Example 2 confirmed that even if chemically strengthened glass having a compressive stress of 600 MPa was used as the glass layer 70, if the thickness was 50 μm, sufficient strength was not obtained. Furthermore, Comparative Examples 3 and 4 confirmed that when unstrengthened glass was used as the glass layer 70, sufficient strength was not obtained even at thicknesses of 100 μm and 200 μm.

[0054] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0055] This international application claims priority based on Japanese Patent Application No. 2022-029745, filed on February 28, 2022, the entire contents of which are incorporated herein by reference.

[0056] REFERENCE SIGNS LIST 1 Switch device 10 Support portion 20, 40, 60 Bonding layer 30 Frame 31 Fixed portion 32 Movable portion 33 Elastic support portion 50 Resin layer 70 Glass layer 70a One surface 70b Other surface 80 Switch portion 81 Housing 82 Film 83 Frame 84 Stem 85 First contact 86 Second contact

Claims

1. A glass layer made of tempered glass; A switch portion disposed on the rear surface side of the glass layer, The thickness of the glass layer is 100 μm or more and 200 μm or less, The switch unit includes a plurality of contacts including a contact that can move up and down, When the glass layer is pressed, the glass layer elastically deforms, switching between conductive and non-conductive states of the plurality of contacts.

2. The switch device according to claim 1 , wherein the glass layer is a chemically strengthened glass having a compressive stress layer.

3. The switch device according to claim 2 , wherein the glass layer has a compressive stress of 600 MPa or more.

4. a frame is interposed between the glass layer and the switch portion, The frame has a fixed portion and a movable portion supported by an elastic support portion relative to the fixed portion, 4. The switch device according to claim 1, wherein when the glass layer is pressed, the glass layer is elastically deformed to move the movable portion, and the plurality of contacts are switched between conductive and non-conductive states.

5. The switch device according to claim 1 , further comprising a support portion for supporting the glass layer on a rear surface side of the glass layer.

6. The switch device according to claim 5 , wherein the support portion is a part or the whole of the switch portion.

7. The switch device according to claim 5 , wherein the support portion is disposed outside the switch portion.

8. The switch device according to claim 1 , further comprising a bonding layer interposed between the glass layer and the switch portion.

9. The switch device according to claim 1 , further comprising a resin layer interposed between the glass layer and the switch portion.