Distance-measurement imaging element, package, module, and distance-measurement imaging device

Abstract

A distance-measurement imaging element (30) is provided with: a plurality of delay adjustment circuits (61, 62) that adjust the delay time of each of a plurality of control signals controlling a plurality of gate electrodes (6a, 6b) of a plurality of pixels (40), and that outputs a plurality of delay controlled signals in which the delay time is adjusted; and a plurality of drivers (51, 52) to which the plurality of delay controlled signals are input and that output a plurality of drive signals for driving the plurality of gate electrodes (6a, 6b) of the plurality of pixels (40).

Description

Distance measuring imaging element, package, module, and distance measuring imaging device

[0001] The present disclosure relates to a distance measuring image sensor, a package, a module, and a distance measuring image sensor for measuring distances.

[0002] 2. Description of the Related Art Distance measuring image sensors for performing distance measurement using an indirect TOF (Time Of Flight) method have been known (see, for example, Patent Documents 1, 2 and 3).

[0003] International Publication No. 2020 / 129954 Japanese Patent Application Laid-Open No. 2019-75826 Japanese Patent Application Laid-Open No. 2020-85464

[0004] In distance measurement, it is desirable to perform distance measurement with high accuracy.

[0005] Therefore, an object of the present disclosure is to provide a distance measuring image sensor, a package, a module, and a distance measuring image sensor that can perform distance measurement with high accuracy.

[0006] A ranging imaging element according to one aspect of the present disclosure is a ranging imaging element for performing ranging using an indirect TOF (Time Of Flight) method, and includes: a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into an electric charge and a plurality of gate electrodes for transferring the electric charges generated by the photoelectric conversion unit; a control signal output circuit that outputs a plurality of control signals to control the plurality of gate electrodes of the plurality of pixels; a plurality of delay adjustment circuits that adjust the delay times of each of the plurality of control signals and output a plurality of delay control signals with adjusted delay times; a plurality of drivers that receive the plurality of delay control signals and output a plurality of drive signals that drive the plurality of gate electrodes of the plurality of pixels; a plurality of power supply wirings that supply a power supply potential to the plurality of drivers; and a plurality of ground wirings that supply a ground potential to the plurality of drivers, the plurality of power supply wirings having common portions with each other, and the plurality of ground wirings having common portions with each other, and the plurality of delay adjustment circuits adjust the delay times of the plurality of control signals so that the phase differences between the plurality of control signals and the plurality of drive signals are constant.

[0007] A package according to one aspect of the present disclosure is a package including the above-described distance measuring image sensor, wherein the first driver is configured by a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal that supply a ground potential to the first driving element. a first power supply terminal and a second ground terminal, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the second ground terminal is disposed at a position facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor; the third ground terminal and the fourth ground terminal are disposed at a position facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor; the package comprises: a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to one two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; and a second external power supply terminal connected to the other two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; and an electrical path from the first external power supply terminal to one internal power supply terminal of the one two internal power supply terminals.The difference in length between each of the four electrical paths, namely, the electrical path from the first external power supply terminal to the other of the two internal power supply terminals, the electrical path from the second external power supply terminal to one of the other of the two internal power supply terminals, and the electrical path from the second external power supply terminal to the other of the other of the two internal power supply terminals, is 3 mm or less, or the difference in inductance between each of the four electrical paths is 2 nH or less.

[0008] A package according to one aspect of the present disclosure is a package including the above-described distance measuring image sensor, wherein the first driver is configured by a first drive element and a second drive element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first drive element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second drive element, a first ground terminal and a second ground terminal that supply a ground potential to the first drive element, and a third ground terminal and a fourth ground terminal that supply a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the second ground terminal are arranged at positions facing each other with the first driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions facing each other with the second driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, the package comprises a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to the first internal power supply terminal, a second external power supply terminal connected to the second internal power supply terminal, a third external power supply terminal connected to the third internal power supply terminal, and a fourth external power supply terminal connected to the fourth internal power supply terminal, an electrical path from the first external power supply terminal to the first internal power supply terminal, an electrical path from the second external power supply terminal to the second internal power supply terminal, and an electrical path from the third external power supply terminal to the third internal power supply terminal,The difference in length between the four electrical paths from the fourth external power supply terminal to the fourth internal power supply terminal is 3 mm or less, or the difference in inductance between the four electrical paths is 2 nH or less.

[0009] A module according to one aspect of the present disclosure is a module including the distance measuring image sensor and a mounting board on which the distance measuring image sensor is mounted, wherein the first driver is configured with a first driving element and a second driving element that are arranged in opposing positions sandwiching the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a ground potential to the first driving element. a first ground terminal and a second ground terminal for supplying a ground potential to the second drive element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, The second ground terminal is disposed at a position facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at a position facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor, and the mounting board has a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, and a fourth internal power supply terminal connected to the fourth power supply terminal. a first bypass capacitor having one terminal connected to one of the first, second, third, and fourth internal power supply terminals; and a second bypass capacitor having one terminal connected to the other of the first, second, third, and fourth internal power supply terminals, wherein an electrical path runs from the first bypass capacitor to one of the two internal power supply terminals.The difference in length among the four electrical paths, namely, the electrical path from the first bypass capacitor to the other of the two internal power supply terminals, the electrical path from the second bypass capacitor to the one of the two other internal power supply terminals, and the electrical path from the second bypass capacitor to the other of the two other internal power supply terminals, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0010] A module according to one aspect of the present disclosure is a module including the distance measuring image sensor and a mounting board on which the distance measuring image sensor is mounted, wherein the first driver is configured with a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has first and second power supply terminals that supply a power supply potential to the first driving element, third and fourth power supply terminals that supply a power supply potential to the second driving element, and a ground terminal that connects the first driving element to a ground. a first ground terminal and a second ground terminal for supplying a potential, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first driving element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor, the round terminal and the second ground terminal are arranged at positions opposing each other with the first driving element interposed therebetween in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element interposed therebetween in the second direction in a plan view of the distance measuring image sensor, the mounting board comprises a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor having one terminal connected to the first internal power supply terminal, a second bypass capacitor having one terminal connected to the second internal power supply terminal, a third bypass capacitor having one terminal connected to the third internal power supply terminal, and a fourth bypass capacitor having one terminal connected to the fourth internal power supply terminal, an electrical path from the first bypass capacitor to the first internal power supply terminal, and an electrical path from the second bypass capacitor to the second internal power supply terminal;The difference in length between the four electrical paths, namely the electrical path from the third bypass capacitor to the third internal power supply terminal and the electrical path from the fourth bypass capacitor to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance between the four electrical paths is 2 nH or less.

[0011] A package according to one aspect of the present disclosure is a package including a distance measuring image sensor for performing distance measurement using an indirect TOF method, wherein the distance measuring image sensor includes: a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into an electric charge, and a first gate electrode and a second gate electrode for transferring the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply wiring that supplies power to the first driver; a second power supply wiring that supplies power to the second driver; a first ground wiring that supplies a ground potential to the first driver; and a second ground wiring that supplies a ground potential to the second driver, the first driver is configured with a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal that supply a ground potential to the first driving element. a first power supply terminal and a second ground terminal, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the first ground terminal and the second ground terminal areIn a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the first driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the package includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to one two internal power supply terminals of the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, a second external power supply terminal connected to the other two of the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, the electrical path from the first external power supply terminal to one of the two internal power supply terminals, the electrical path from the first external power supply terminal to the other of the two internal power supply terminals, the electrical path from the second external power supply terminal to one of the other two internal power supply terminals, and the electrical path from the second external power supply terminal to the other of the two internal power supply terminals, is 3 mm or less, or the difference in inductance among four electrical paths is 2 nH or less.

[0012] A package according to one aspect of the present disclosure is a package including a distance measuring image sensor for performing distance measurement using an indirect TOF method, wherein the distance measuring image sensor includes: a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into an electric charge, and a first gate electrode and a second gate electrode for transferring the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply wiring that supplies power to the first driver; a second power supply wiring that supplies power to the second driver; a first ground wiring that supplies a ground potential to the first driver; and a second ground wiring that supplies a ground potential to the second driver, the first driver is configured with a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal that supply a ground potential to the first driving element. a first power supply terminal and a second ground terminal, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the first ground terminal and the second ground terminal areIn a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the first driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the package includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to the first internal power supply terminal, and a second external power supply terminal connected to the second internal power supply terminal, a third external power supply terminal connected to the third internal power supply terminal, and a fourth external power supply terminal connected to the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, the electrical path from the first external power supply terminal to the first internal power supply terminal, the electrical path from the second external power supply terminal to the second internal power supply terminal, the electrical path from the third external power supply terminal to the third internal power supply terminal, and the electrical path from the fourth external power supply terminal to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0013] A module according to one aspect of the present disclosure is a module including a ranging image sensor for performing ranging by an indirect TOF method, and a mounting board on which the ranging image sensor is mounted, wherein the ranging image sensor includes a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into electric charges and a first gate electrode and a second gate electrode for transferring the electric charges generated by the photoelectric conversion unit, a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels, a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal, a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal, a first power supply wiring that supplies power to the first driver, a second power supply wiring that supplies power to the second driver, a first ground wiring that supplies a ground potential to the first driver, and a second ground wiring that supplies a ground potential to the second driver. and a ground wiring, wherein the first power supply wiring and the second power supply wiring have a common portion, and the first ground wiring and the second ground wiring have a common portion, and the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal and a second ground terminal for supplying a ground potential to a drive element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor;the first ground terminal and the second ground terminal are arranged at positions opposing each other with the first driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, and the mounting board includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, and a first bypass capacitor having one terminal connected to one of two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; and a second bypass capacitor having one terminal connected to the other of the two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, the electrical path from the first bypass capacitor to one of the two internal power supply terminals, the electrical path from the first bypass capacitor to the other of the two internal power supply terminals, the electrical path from the second bypass capacitor to one of the other of the two internal power supply terminals, and the electrical path from the second bypass capacitor to the other of the two internal power supply terminals, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0014] A module according to one aspect of the present disclosure is a module including a ranging image sensor for performing ranging by an indirect TOF method, and a mounting board on which the ranging image sensor is mounted, wherein the ranging image sensor includes a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into electric charges and a first gate electrode and a second gate electrode for transferring the electric charges generated by the photoelectric conversion unit, a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels, a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal, a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal, a first power supply wiring that supplies power to the first driver, a second power supply wiring that supplies power to the second driver, a first ground wiring that supplies a ground potential to the first driver, and a second ground wiring that supplies a ground potential to the second driver. and a ground wiring, wherein the first power supply wiring and the second power supply wiring have a common portion, and the first ground wiring and the second ground wiring have a common portion, and the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal and a second ground terminal for supplying a ground potential to a drive element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor;The first ground terminal and the second ground terminal are arranged at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor, and the mounting board includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor one terminal of which is connected to the first internal power supply terminal, and a second bypass capacitor having one terminal connected to the first internal power supply terminal, a third bypass capacitor having one terminal connected to the third internal power supply terminal, and a fourth bypass capacitor having one terminal connected to the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, an electrical path from the first bypass capacitor to the first internal power supply terminal, an electrical path from the second bypass capacitor to the second internal power supply terminal, an electrical path from the third bypass capacitor to the third internal power supply terminal, and an electrical path from the fourth bypass capacitor to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0015] A distance measuring imaging device according to an aspect of the present disclosure includes the distance measuring imaging element, the package, or the module.

[0016] According to a distance measuring image sensor, a package, a module, and a distance measuring image sensor device according to an aspect of the present disclosure, distance measurement can be performed with high accuracy.

[0017] FIG. 1 is a functional block diagram showing a schematic configuration of a distance measuring imaging device according to a first embodiment. FIG. 2 is a circuit diagram showing a configuration of a distance measuring imaging element according to the first embodiment. FIG. 3 is a schematic plan view showing a configuration of a pixel according to the first embodiment. FIG. 4 is a timing chart showing the operation of a pixel during exposure according to the first embodiment. FIG. 5 is a schematic diagram showing a schematic configuration of a first driving element group and a second driving element group according to the first embodiment. FIG. 6 is a schematic plan view showing a package configuration according to the first embodiment. FIG. 7 is a circuit diagram showing a configuration of a distance measuring imaging element according to the first embodiment. FIG. 8 is a waveform diagram showing a simulation of the operation of the first driver, the second driver, and the third driver according to the first embodiment. FIG. 9 is a graph showing the relationship between the advance exposure setting period and the advance exposure period according to the first embodiment. FIG. 10 is a graph showing the relationship between the advance exposure setting period and the advance exposure period according to the first embodiment. FIG. 11 is a graph showing the distribution of ideal delay times of drive signals with respect to position in the column direction. FIG. 12 is a graph showing the simulation results of the distribution of delay times of drive signals with respect to position in the column direction under first simulation conditions. FIG. 13 is a graph showing the relationship between the first exposure period and the delay difference under the first simulation condition. FIG. 14 is a graph showing the relationship between the first exposure period and the delay difference under the second simulation condition. FIG. 15A is a perspective view of a distance measuring image sensor according to Embodiment 1. FIG. 15B is an exploded perspective view of a distance measuring image sensor according to Embodiment 1. FIG. 15C is a perspective view of a distance measuring image sensor according to Embodiment 1. FIG. 16 is a schematic plan view showing the configuration of a package according to Modification 1. FIG. 17 is a schematic plan view showing the configuration of a package according to Modification 2. FIG. 18 is a schematic plan view showing the configuration of a package according to Modification 3. FIG. 19 is a schematic plan view showing the configuration of a package according to Modification 4. FIG. 20 is a schematic plan view showing the configuration of a package according to Modification 5. FIG. 21 is a functional block diagram showing the schematic configuration of a distance measuring image sensor according to Embodiment 2. FIG. 22 is a schematic plan view showing the configuration of a module according to Embodiment 2. FIG. 23 is a schematic plan view showing the configuration of a module according to Modification 6. FIG. 24 is a schematic plan view showing the configuration of a module according to Modification 7.Fig. 25 is a schematic plan view showing the configuration of a module according to Modification 8. Fig. 26 is a schematic plan view showing the configuration of a module according to Modification 9. Fig. 27 is a schematic plan view showing the configuration of a module according to Modification 10. Fig. 28 is a timing chart showing another example of the operation of a pixel during exposure according to embodiment 1. Fig. 29 is a schematic plan view showing another example of the configuration of a package according to embodiment 1.

[0018] (How one aspect of the present disclosure was achieved) The inventors have conducted extensive experiments and studies to improve the accuracy of distance measurement in indirect TOF distance measurement using a distance measurement image sensor.

[0019] Through these experiments and studies, the inventors have discovered the cause of the deterioration in distance measurement accuracy.

[0020] In other words, the inventors discovered that if the power supply potential of the driver that drives the control signal that determines the operation timing of multiple pixels in a ranging image sensor, or the ground potential, fluctuates, the operation timing of each pixel will fluctuate, thereby deteriorating the ranging accuracy.

[0021] The inventors also discovered that when the timing at which a control signal reaches a pixel fluctuates, if the amount of fluctuation in the timing at which the control signal reaches a pixel differs between pixels in different physical positions, the operation timing between the pixels in different physical positions will fluctuate, thereby deteriorating the ranging accuracy.

[0022] Therefore, the inventors continued to conduct further experiments and studies in order to eliminate these factors that deteriorate distance measurement accuracy.

[0023] As a result, the inventors have come up with the following distance measuring image sensor and the like according to the present disclosure.

[0024] A ranging image sensor according to one aspect of the present disclosure is a ranging image sensor for performing ranging by an indirect TOF (Time Of Flight) method, and includes: a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into an electric charge, and a first gate electrode and a second gate electrode for transferring the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first delay adjustment circuit that adjusts a delay time of the first control signal to output a first delay control signal with the adjusted delay time; a second delay adjustment circuit that adjusts a delay time of the second control signal to output a second delay control signal with the adjusted delay time; a first driver that receives the first delay control signal and outputs a first drive signal that drives the first gate electrodes of the plurality of pixels; the first power supply wiring and the second power supply wiring have a common portion, and the first ground wiring and the second ground wiring have a common portion; the first delay adjustment circuit adjusts a delay time of the first control signal so that a phase difference between the first control signal and the first drive signal is constant; and the second delay adjustment circuit adjusts a delay time of the second control signal so that a phase difference between the second control signal and the second drive signal is constant.

[0025] In the range-finding image sensor having the above configuration, the phase difference between the first control signal and the first drive signal, and the phase difference between the second control signal and the second drive signal are kept constant, so that even if the power supply potential or the ground potential supplied to the first driver fluctuates and the delay time of the first driver fluctuates, or even if the power supply potential or the ground potential supplied to the second driver fluctuates and the delay time of the second driver fluctuates, the operation timing of the first gate electrode and the operation timing of the second gate electrode in each pixel do not fluctuate.

[0026] Therefore, the distance measuring image sensor having the above configuration can measure distances with high accuracy.

[0027] Furthermore, each of the plurality of pixels may further have a third gate electrode for discharging electric charges generated by the photoelectric conversion unit, and the control signal output circuit may further output a third control signal for controlling the third gate electrodes of the plurality of pixels, and the distance measuring image sensor may further include a third delay adjustment circuit for adjusting a delay time of the third control signal and outputting a third delay control signal with the adjusted delay time, and a third driver for receiving the third delay control signal and outputting a third drive signal for driving the third gate electrodes of the plurality of pixels, and the third delay adjustment circuit may adjust the delay time of the third control signal so that a phase difference between the third control signal and the third drive signal is constant.

[0028] The control signal output circuit may output the first control signal including a pulse having a pulse width of 10 ns or less, and the second control signal including a pulse having a pulse width of 10 ns or less.

[0029] In addition, the distance measuring image sensor may be configured by a single semiconductor chip on which the pixel array, the first driver, and the second driver are formed, or may be configured by stacking a first semiconductor chip on which the pixel array is formed and a second semiconductor chip on which the first driver and the second driver are formed.

[0030] A package according to one aspect of the present disclosure is a package including the above-described distance measuring image sensor, wherein the first driver is configured by a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal that supply a ground potential to the first driving element. a first power supply terminal and a second ground terminal, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the second ground terminal is disposed at a position facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor; the third ground terminal and the fourth ground terminal are disposed at a position facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor; the package comprises: a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to one two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; and a second external power supply terminal connected to the other two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; and an electrical path from the first external power supply terminal to one internal power supply terminal of the one two internal power supply terminals.The difference in length between each of the four electrical paths, namely, the electrical path from the first external power supply terminal to the other of the two internal power supply terminals, the electrical path from the second external power supply terminal to one of the other of the two internal power supply terminals, and the electrical path from the second external power supply terminal to the other of the other of the two internal power supply terminals, is 3 mm or less, or the difference in inductance between each of the four electrical paths is 2 nH or less.

[0031] With the package having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first or second external power supply terminal in the package to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0032] Therefore, the package having the above configuration can measure distances with high accuracy.

[0033] A package according to one aspect of the present disclosure is a package including the above-described distance measuring image sensor, wherein the first driver is configured by a first drive element and a second drive element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first drive element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second drive element, a first ground terminal and a second ground terminal that supply a ground potential to the first drive element, and a third ground terminal and a fourth ground terminal that supply a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the second ground terminal are arranged at positions facing each other with the first driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions facing each other with the second driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, the package comprises a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to the first internal power supply terminal, a second external power supply terminal connected to the second internal power supply terminal, a third external power supply terminal connected to the third internal power supply terminal, and a fourth external power supply terminal connected to the fourth internal power supply terminal, an electrical path from the first external power supply terminal to the first internal power supply terminal, an electrical path from the second external power supply terminal to the second internal power supply terminal, and an electrical path from the third external power supply terminal to the third internal power supply terminal,The difference in length between the four electrical paths from the fourth external power supply terminal to the fourth internal power supply terminal is 3 mm or less, or the difference in inductance between the four electrical paths is 2 nH or less.

[0034] With the package having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first, second, third, or fourth external power supply terminal in the package to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0035] Therefore, the package having the above configuration can measure distances with high accuracy.

[0036] A module according to one aspect of the present disclosure is a module including the distance measuring image sensor and a mounting board on which the distance measuring image sensor is mounted, wherein the first driver is configured with a first driving element and a second driving element that are arranged in opposing positions sandwiching the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a ground potential to the first driving element. a first ground terminal and a second ground terminal for supplying a ground potential to the second drive element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, The second ground terminal is disposed at a position facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at a position facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor, and the mounting board has a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, and a fourth internal power supply terminal connected to the fourth power supply terminal. a first bypass capacitor having one terminal connected to one of the first, second, third, and fourth internal power supply terminals; and a second bypass capacitor having one terminal connected to the other of the first, second, third, and fourth internal power supply terminals, wherein an electrical path runs from the first bypass capacitor to one of the two internal power supply terminals.The difference in length among the four electrical paths, namely, the electrical path from the first bypass capacitor to the other of the two internal power supply terminals, the electrical path from the second bypass capacitor to the one of the two other internal power supply terminals, and the electrical path from the second bypass capacitor to the other of the two other internal power supply terminals, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0037] With the module having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first or second bypass capacitor on the mounting substrate to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0038] Therefore, the module having the above configuration can perform distance measurement with high accuracy.

[0039] A module according to one aspect of the present disclosure is a module including the distance measuring image sensor and a mounting board on which the distance measuring image sensor is mounted, wherein the first driver is configured with a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has first and second power supply terminals that supply a power supply potential to the first driving element, third and fourth power supply terminals that supply a power supply potential to the second driving element, and a ground terminal that connects the first driving element to a ground. a first ground terminal and a second ground terminal for supplying a potential, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first driving element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor, the round terminal and the second ground terminal are arranged at positions opposing each other with the first driving element interposed therebetween in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element interposed therebetween in the second direction in a plan view of the distance measuring image sensor, the mounting board comprises a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor having one terminal connected to the first internal power supply terminal, a second bypass capacitor having one terminal connected to the second internal power supply terminal, a third bypass capacitor having one terminal connected to the third internal power supply terminal, and a fourth bypass capacitor having one terminal connected to the fourth internal power supply terminal, an electrical path from the first bypass capacitor to the first internal power supply terminal, and an electrical path from the second bypass capacitor to the second internal power supply terminal;The difference in length between the four electrical paths, namely the electrical path from the third bypass capacitor to the third internal power supply terminal and the electrical path from the fourth bypass capacitor to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance between the four electrical paths is 2 nH or less.

[0040] With the module having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first, second, third, or fourth bypass capacitor on the mounting substrate to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0041] Therefore, the module having the above configuration can perform distance measurement with high accuracy.

[0042] A package according to one aspect of the present disclosure is a package including a distance measuring image sensor for performing distance measurement using an indirect TOF method, wherein the distance measuring image sensor includes: a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into an electric charge, and a first gate electrode and a second gate electrode for transferring the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply wiring that supplies power to the first driver; a second power supply wiring that supplies power to the second driver; a first ground wiring that supplies a ground potential to the first driver; and a second ground wiring that supplies a ground potential to the second driver, the first driver is configured with a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal that supply a ground potential to the first driving element. a first power supply terminal and a second ground terminal, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the first ground terminal and the second ground terminal areIn a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the first driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the package includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to one two internal power supply terminals of the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, a second external power supply terminal connected to the other two of the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, the electrical path from the first external power supply terminal to one of the two internal power supply terminals, the electrical path from the first external power supply terminal to the other of the two internal power supply terminals, the electrical path from the second external power supply terminal to one of the other two internal power supply terminals, and the electrical path from the second external power supply terminal to the other of the two internal power supply terminals, is 3 mm or less, or the difference in inductance among four electrical paths is 2 nH or less.

[0043] With the package having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first or second external power supply terminal in the package to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0044] Therefore, the package having the above configuration can measure distances with high accuracy.

[0045] A package according to one aspect of the present disclosure is a package including a distance measuring image sensor for performing distance measurement using an indirect TOF method, wherein the distance measuring image sensor includes: a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into an electric charge, and a first gate electrode and a second gate electrode for transferring the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply wiring that supplies power to the first driver; a second power supply wiring that supplies power to the second driver; a first ground wiring that supplies a ground potential to the first driver; and a second ground wiring that supplies a ground potential to the second driver, the first driver is configured with a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor includes a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal that supply a ground potential to the first driving element. a first power supply terminal and a second ground terminal, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor, and the first ground terminal and the second ground terminal areIn a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the first driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element sandwiched in the second direction, in a plan view of the distance measuring image sensor, the package includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to the first internal power supply terminal, and a second external power supply terminal connected to the second internal power supply terminal, a third external power supply terminal connected to the third internal power supply terminal, and a fourth external power supply terminal connected to the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, the electrical path from the first external power supply terminal to the first internal power supply terminal, the electrical path from the second external power supply terminal to the second internal power supply terminal, the electrical path from the third external power supply terminal to the third internal power supply terminal, and the electrical path from the fourth external power supply terminal to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0046] With the package having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first, second, third, or fourth external power supply terminal in the package to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0047] Therefore, the package having the above configuration can measure distances with high accuracy.

[0048] A module according to one aspect of the present disclosure is a module including a ranging image sensor for performing ranging by an indirect TOF method, and a mounting board on which the ranging image sensor is mounted, wherein the ranging image sensor includes a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into electric charges and a first gate electrode and a second gate electrode for transferring the electric charges generated by the photoelectric conversion unit, a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels, a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal, a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal, a first power supply wiring that supplies power to the first driver, a second power supply wiring that supplies power to the second driver, a first ground wiring that supplies a ground potential to the first driver, and a second ground wiring that supplies a ground potential to the second driver. and a ground wiring, wherein the first power supply wiring and the second power supply wiring have a common portion, and the first ground wiring and the second ground wiring have a common portion, and the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal and a second ground terminal for supplying a ground potential to a drive element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor;the first ground terminal and the second ground terminal are arranged at positions opposing each other with the first driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions opposing each other with the second driving element sandwiched in the second direction in a plan view of the distance measuring image sensor, and the mounting board includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, and a first bypass capacitor having one terminal connected to one of two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; and a second bypass capacitor having one terminal connected to the other of the two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, the electrical path from the first bypass capacitor to one of the two internal power supply terminals, the electrical path from the first bypass capacitor to the other of the two internal power supply terminals, the electrical path from the second bypass capacitor to one of the other of the two internal power supply terminals, and the electrical path from the second bypass capacitor to the other of the two internal power supply terminals, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0049] With the module having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first or second bypass capacitor on the mounting substrate to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0050] Therefore, the module having the above configuration can perform distance measurement with high accuracy.

[0051] A module according to one aspect of the present disclosure is a module including a ranging image sensor for performing ranging by an indirect TOF method, and a mounting board on which the ranging image sensor is mounted, wherein the ranging image sensor includes a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into electric charges and a first gate electrode and a second gate electrode for transferring the electric charges generated by the photoelectric conversion unit, a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels, a first driver that outputs a first drive signal that drives the first gate electrodes of the plurality of pixels based on the first control signal, a second driver that outputs a second drive signal that drives the second gate electrodes of the plurality of pixels based on the second control signal, a first power supply wiring that supplies power to the first driver, a second power supply wiring that supplies power to the second driver, a first ground wiring that supplies a ground potential to the first driver, and a second ground wiring that supplies a ground potential to the second driver. and a ground wiring, wherein the first power supply wiring and the second power supply wiring have a common portion, and the first ground wiring and the second ground wiring have a common portion, and the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction in a plan view of the distance measuring image sensor, and the distance measuring image sensor has a first power supply terminal and a second power supply terminal that supply a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal that supply a power supply potential to the second driving element, and a first ground terminal and a second ground terminal for supplying a ground potential to a drive element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second drive element, wherein the first power supply terminal and the second power supply terminal are arranged at positions facing each other across the first drive element in a second direction orthogonal to the first direction in a plan view of the distance measuring image sensor, and the third power supply terminal and the fourth power supply terminal are arranged at positions facing each other across the second drive element in the second direction in a plan view of the distance measuring image sensor;The first ground terminal and the second ground terminal are arranged at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are arranged at positions facing each other across the second driving element in the second direction in a plan view of the distance measuring image sensor, and the mounting board includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor one terminal of which is connected to the first internal power supply terminal, and a second bypass capacitor having one terminal connected to the first internal power supply terminal, a third bypass capacitor having one terminal connected to the third internal power supply terminal, and a fourth bypass capacitor having one terminal connected to the fourth internal power supply terminal, wherein the difference in length among four electrical paths, namely, the electrical path from the first bypass capacitor to the first internal power supply terminal, the electrical path from the second bypass capacitor to the second internal power supply terminal, the electrical path from the third bypass capacitor to the third internal power supply terminal, and the electrical path from the fourth bypass capacitor to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance among the four electrical paths is 2 nH or less.

[0052] With the module having the above configuration, the symmetry of the electrical characteristics of the electrical path that supplies the power supply potential from the first, second, third, or fourth bypass capacitor on the mounting substrate to the first or second drive element in the semiconductor element is kept within a certain range, so that when the timing at which the control signal reaches the pixel varies, the difference in the amount of variation in the operation timing of the first gate electrode between pixels that are physically located different from each other can be kept within a certain range.

[0053] Therefore, the module having the above configuration can perform distance measurement with high accuracy.

[0054] A distance measuring imaging device according to an aspect of the present disclosure includes the distance measuring imaging element, the package, or the module.

[0055] According to the distance measuring imaging device having the above configuration, distance measurement is performed by using the distance measuring imaging element, the package, or the module.

[0056] Therefore, the distance measuring imaging device having the above configuration can measure distances with high accuracy.

[0057] Specific examples of a distance measuring image sensor and the like according to one aspect of the present disclosure will be described below with reference to the drawings. Each embodiment shown here illustrates one specific example of the present disclosure. Therefore, the numerical values, shapes, components, the arrangement and connection of the components, steps (processes), and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. In each figure, substantially identical components are assigned the same reference numerals, and redundant explanations are omitted or simplified.

[0058] First Embodiment [Configuration] FIG. 1 is a functional block diagram showing a schematic configuration of a distance measuring imaging device 200 according to a first embodiment.

[0059] As shown in FIG. 1, the distance measuring image capturing device 200 includes a package 100 including a distance measuring image capturing element 30 , a light source 110 , and a signal processing device 120 .

[0060] The light source 110 emits pulsed irradiation light toward the subject 130 .

[0061] The distance measuring image sensor 30 receives the reflected light of the irradiated light from the subject 130 and outputs a signal based on the received reflected light.

[0062] The signal processing device 120 performs distance measurement using the indirect TOF method based on the signal output from the distance measurement image sensor 30, converts the signal output from the distance measurement image sensor 30 into a distance image, and outputs the image.

[0063] The signal processing device 120 includes, for example, a processor (not shown) and a memory (not shown), and is realized by the processor executing a program stored in the memory.

[0064] FIG. 2 is a circuit diagram showing the configuration of the distance measuring image sensor 30. As shown in FIG.

[0065] As shown in FIG. 2 , the ranging image sensor 30 includes a pixel array 41, a first driver 51, a second driver 52, a third driver 53, a first delay adjustment circuit 61, a second delay adjustment circuit 62, a third delay adjustment circuit 63, a control signal output circuit 70, a first power supply terminal 71, a second power supply terminal 72, a third power supply terminal 73, a fourth power supply terminal 74, a first ground terminal 81, a second ground terminal 82, a third ground terminal 83, a fourth ground terminal 84, a power supply wiring 91, a power supply wiring 92, a ground wiring 96, and a ground wiring 97.

[0066] The pixel array 41 is configured by arranging a plurality of pixels 40 in an array (matrix).

[0067] The pixel array 41 may be configured, for example, by arranging a plurality of pixels 40 in a matrix of 720 rows and 1080 columns.

[0068] FIG. 3 is a schematic plan view showing the configuration of the pixel 40. As shown in FIG.

[0069] As shown in FIG. 3 , the pixel 40 includes a photoelectric conversion unit 1, a charge storage unit 2 (for example, a first charge storage unit 2 a and a second charge storage unit 2 b), a readout gate 6 (for example, a first readout gate 6 a (first gate electrode 6 a) and a second readout gate 6 b (second gate electrode 6 b)), an output control gate 13, a floating diffusion layer 14, a reset gate 15, a reset drain 16, a readout circuit 17, an exposure control gate 8 (third gate electrode 8) (for example, an exposure control gate 8 a and an exposure control gate 8 b), an overflow drain 9 (for example, an overflow drain 9 a and an overflow drain 9 b), and a charge retention unit 10.

[0070] The photoelectric conversion unit 1 converts received light into electric charges.

[0071] The read gate 6 reads out the signal charge from the photoelectric conversion unit 1 .

[0072] The charge accumulation unit 2 accumulates signal charges read out from the readout gate 6. The charge accumulation unit 2 is composed of a transfer channel (CCD channel) 4 for transferring signal charges under the gate insulating film, and a transfer electrode 5 (for example, any one of transfer electrode 5a, transfer electrode 5b, transfer electrode 5c, transfer electrode 5d, and transfer electrode 5e) on the gate insulating film. That is, as shown in FIG. 3 , the charge accumulation unit 2 includes a part of the transfer channel 4 and a part of the transfer electrode 5 that overlaps with a part of the transfer channel 4 in a plan view of the pixel array 41.

[0073] Here, the voltages applied to the transfer electrodes 5a, 5b, 5c, 5d, and 5e are designated as VG1, VG2, VG3, VG4, and VG5, respectively.

[0074] The first charge storage unit 2 a and the second charge storage unit 2 b are driven in five phases. As an example, the first charge storage unit 2 a and the second charge storage unit 2 b are formed adjacent to the first readout gate 6 a and the second readout gate 6 b, respectively, and below the transfer electrodes 5 (here, below the transfer electrodes 5 a and 5 c) to which VG1 and VG3, which become High voltages during exposure, are applied.

[0075] The overflow drain 9 drains at least a portion of the charge from the photoelectric conversion unit 1 .

[0076] An exposure control gate 8 controls the discharge to an overflow drain 9 .

[0077] The charge holding unit 10 receives and holds the signal charge transferred from one of the charge storage units 2 (here, the first charge storage unit 2 a or the second charge storage unit 2 b) and stored in that charge storage unit 2, and transfers the held signal charge to one of the charge storage units 2 (here, the first charge storage unit 2 a or the second charge storage unit 2 b). As shown in FIG. 3 , the charge holding unit 10 includes a charge holding gate 11 and a transfer control gate 12 that controls the transfer of the charge holding unit 10.

[0078] The floating diffusion layer 14 receives and holds the signal charge transferred from one of the charge storage sections 2 (here, the first charge storage section 2 a and the second charge storage section 2 b ) and stored in that charge storage section 2 .

[0079] The output control gate 13 controls transfer to the floating diffusion layer 14 .

[0080] The readout circuit 17 converts the signal charge held in the floating diffusion layer 14 into a current and reads it out to the outside of the pixel 40. For example, the readout circuit 17 includes a source follower transistor whose gate is connected to the floating diffusion layer 14, and a selection transistor connected in series to the source follower transistor. For example, when the readout circuit 17 is selected by the selection transistor, the signal charge held in the floating diffusion layer 14 is read out to the outside of the pixel 40 by the readout circuit 17.

[0081] FIG. 4 is a timing chart showing the operation of the pixel 40 during exposure.

[0082] The first read gate 6a is driven by a first drive signal (described later) output from a first driver 51, the second read gate 6b is driven by a second drive signal (described later) output from a second driver 52, and the exposure control gate 8 (here, exposure control gates 8a and 8b) is driven by a third drive signal (described later) output from a third driver 53.

[0083] Although not shown in FIG. 4, the transfer electrodes 5a to 5e are driven by drive signals VG1 to VG5, respectively. When the pixel 40 is exposed to light, a high voltage is applied to VG1 and VG3, and a low voltage is applied to the others. Charge can be stored below the transfer electrode 5 to which a high voltage is applied. That is, the transfer electrodes 5 to which a high voltage is applied (here, transfer electrodes 5a and 5c) and the transfer channels 4 overlapping therebelow form charge storage sections 2 (here, first charge storage section 2a and second charge storage section 2b).

[0084] In FIG. 4, a period Tp is a period during which the light source 110 emits pulsed irradiation light.

[0085] The light emitted by the light source 110 and reflected by the subject 130 reaches the pixel 40 with a delay Td depending on the distance to the subject 130 and is converted into an electric charge in the photoelectric conversion unit 1 .

[0086] In the initial state, the third drive signal is High, i.e., the exposure control gate 8 is in a High state, and the photoelectric conversion unit 1 is in a reset state. The first drive signal and the second drive signal are Low, i.e., the first readout gate 6a and the second readout gate 6b are in a Low state, and the first charge accumulation unit 2a and the second charge accumulation unit 2b, whose transfer electrodes 5a and 5c are held in a High state, are electrically isolated from the photoelectric conversion unit 1. In this state, charges generated in the photoelectric conversion unit 1 are discharged to the overflow drain 9 via the exposure control gate 8 and are not accumulated in the photoelectric conversion unit 1.

[0087] Next, in synchronization with time t1 when the light source 110 emits irradiation light, the third drive signal goes low, i.e., the exposure control gate 8 goes low, and discharge of charges from the photoelectric conversion unit 1 to the overflow drain 9 is stopped. This starts accumulation of charges generated in the photoelectric conversion unit 1.

[0088] At time t2, the first drive signal transitions from low to high, i.e., the first readout gate 6a transitions from low to high, and the charge converted by the photoelectric conversion unit 1 in response to the incident reflected light begins to be transferred to the first charge accumulation unit 2a via the first readout gate 6a. Then, at time t3, the first drive signal transitions from high to low, i.e., the first readout gate 6a transitions from high to low, and the transfer of the charge converted by the photoelectric conversion unit 1 in response to the incident reflected light to the first charge accumulation unit 2a via the first readout gate 6a is stopped. As a result, the charge (charge amount A0) due to the preceding component of the reflected light that arrived between time t1 and time t3 is held in the first charge accumulation unit 2a. That is, the charge amount A0 of the charge converted from the reflected light during the preceding exposure period from time t1 to time t3 is held in the first charge accumulation unit 2a.

[0089] At time t4, the second drive signal transitions from low to high, i.e., the second readout gate 6b transitions from low to high, and the charge converted by the photoelectric conversion unit 1 in response to the incident reflected light begins to be transferred to the second charge accumulation unit 2b via the second readout gate 6b. Then, at time t5, the second drive signal transitions from high to low, i.e., the second readout gate 6b transitions from high to low, and the transfer of the charge converted by the photoelectric conversion unit 1 in response to the incident reflected light to the second charge accumulation unit 2b via the second readout gate 6b is stopped. As a result, the charge (charge amount A1) due to the subsequent component of the reflected light that arrived between time t3 and time t5 is held in the second charge accumulation unit 2b. That is, the amount of charge A1 into which the reflected light is converted during the post-exposure period from time t3 to time t5 is held in the second charge storage section 2b.

[0090] If the distance from the distance measuring imaging device 200 to the subject 130 is d, d is calculated using the charge amount A0 of the charge due to the leading component of the reflected light, the charge amount A1 of the charge due to the trailing component of the reflected light, and the speed of light c using the following equation:

[0091] d=c×Tp / 2×A1 / (A0+A1)

[0092] Returning to FIG. 2, the description of the distance measuring image sensor 30 will be continued.

[0093] The control signal output circuit 70 outputs a first control signal that controls the first readout gates 6 a (first gate electrodes 6 a) of the plurality of pixels 40, a second control signal that controls the second readout gates 6 b (second gate electrodes 6 b) of the plurality of pixels 40, and a third control signal that controls the exposure control gates 8 (third gate electrodes 8) of the plurality of pixels 40. Furthermore, the control signal output circuit 70 outputs a light source control signal that controls the light source 110.

[0094] The first delay adjustment circuit 61 receives a first control signal and a first drive signal, adjusts the delay time of the first control signal so that the phase difference between the first control signal and the first drive signal is constant, and outputs a first delay control signal with the adjusted delay time.

[0095] The first delay adjustment circuit 61 is realized by, for example, a DLL (Delay Locked Loop) circuit.

[0096] The second delay adjustment circuit 62 receives a second control signal and a second drive signal, adjusts the delay time of the second control signal so that the phase difference between the second control signal and the second drive signal is constant, and outputs a second delay control signal with the adjusted delay time.

[0097] The second delay adjustment circuit 62 is realized by, for example, a DLL circuit.

[0098] The third delay adjustment circuit 63 receives the third control signal and the third drive signal, adjusts the delay time of the third control signal so that the phase difference between the third control signal and the third drive signal is constant, and outputs the third delay control signal with the adjusted delay time.

[0099] The third delay adjustment circuit 63 is realized by, for example, a DLL circuit.

[0100] The first driver 51 receives the first delay control signal and outputs a first drive signal that drives the first read gates 6 a (first gate electrodes 6 a ) of the plurality of pixels 40 .

[0101] The first driver 51 is composed of a first driving element 51a and a second driving element 51b that are arranged in opposing positions sandwiching the pixel array 41 in a first direction (the y-axis direction in FIG. 2) when viewed in a plan view of the distance measurement image sensor 30. That is, the first driver 51 is composed of the first driving element 51a included in the first driving element group 50a and the second driving element 51b included in the second driving element group 50b.

[0102] Here, as an example that is not necessarily limited to this, the description will be given assuming that the circuit of the final output stage of the first drive element 51a is composed of multiple inverters connected in parallel, and the circuit of the final output stage of the second drive element 51b is composed of multiple inverters connected in parallel. In this case, the length of the electrical path from the output of the control signal output circuit 70 to the input of each inverter of the final output stage of the first drive element 51a is equal to the length of the electrical path from the output of the control signal output circuit 70 to the input of each inverter of the final output stage of the second drive element 51b. This ensures that the output timing of the first drive signal from each inverter of the final output stage of the first drive element 51a and the output timing of the first drive signal from each inverter of the final output stage of the second drive element 51b are synchronized.

[0103] The second driver 52 receives the second delay control signal and outputs a second drive signal that drives the second readout gates 6 b (second gate electrodes 6 b ) of the plurality of pixels 40 .

[0104] The second driver 52 is composed of a third drive element 52a and a fourth drive element 52b that are arranged at positions facing each other across the pixel array 41 in the first direction when viewed in a plan view of the distance measurement image sensor 30. That is, the second driver 52 is composed of the third drive element 52a included in the first drive element group 50a and the fourth drive element 52b included in the second drive element group 50b.

[0105] Here, as an example that is not necessarily limited to this, the description will be given assuming that the circuit of the final output stage of the third drive element 52a is composed of multiple inverters connected in parallel, and the circuit of the final output stage of the fourth drive element 52b is composed of multiple inverters connected in parallel. In this case, the length of the electrical path from the output of the control signal output circuit 70 to the input of each inverter of the final output stage of the third drive element 52a is equal to the length of the electrical path from the output of the control signal output circuit 70 to the input of each inverter of the final output stage of the fourth drive element 52b. This ensures that the output timing of the second drive signal from each inverter of the final output stage of the third drive element 52a and the output timing of the second drive signal from each inverter of the final output stage of the fourth drive element 52b are synchronized.

[0106] The third driver 53 receives the third delay control signal and outputs a third drive signal that drives the exposure control gates 8 (third gate electrodes 8 ) of the plurality of pixels 40 .

[0107] The third driver 53 is composed of a fifth driving element 53a and a sixth driving element 53b that are arranged in opposing positions sandwiching the pixel array 41 in the first direction when viewed in a plan view of the distance measurement image sensor 30. That is, the third driver 53 is composed of the fifth driving element 53a included in the first driving element group 50a and the sixth driving element 53b included in the second driving element group 50b.

[0108] Here, as an example that is not necessarily limited to this, the description will be given assuming that the circuit of the final output stage of the fifth drive element 53a is composed of multiple inverters connected in parallel, and the circuit of the final output stage of the sixth drive element 53b is composed of multiple inverters connected in parallel. In this case, the length of the electrical path from the output of the control signal output circuit 70 to the input of each inverter of the final output stage of the fifth drive element 53a is equal to the length from the output of the control signal output circuit 70 to the input of each inverter of the final output stage of the sixth drive element 53b. This ensures that the output timing of the third drive signal from each inverter of the final output stage of the fifth drive element 53a and the output timing of the third drive signal from each inverter of the final output stage of the sixth drive element 53b are synchronized.

[0109] As shown in FIG. 2, the first drive element group 50a includes a first drive element 51a, a third drive element 52a, and a fifth drive element 53a, and the second drive element group 50b includes a second drive element 51b, a fourth drive element 52b, and a sixth drive element 53b.

[0110] FIG. 5 is a schematic diagram showing the general configuration of the first drive element group 50a and the second drive element group 50b.

[0111] In Figure 5, one of the final stage inverters of the first drive element 51a is illustrated as a representative of the circuit 51aa constituting the first drive element 51a, one of the final stage inverters of the third drive element 52a is illustrated as a representative of the circuit 52aa constituting the third drive element 52a, one of the final stage inverters of the fifth drive element 53a is illustrated as a representative of the circuit 53aa constituting the fifth drive element 53a, one of the final stage inverters of the second drive element 51b is illustrated as a representative of the circuit 51ba constituting the second drive element 51b, one of the final stage inverters of the fourth drive element 52b is illustrated as a representative of the circuit 52ba constituting the fourth drive element 52b, and one of the final stage inverters of the sixth drive element 53b is illustrated as a representative of the circuit 53ba constituting the sixth drive element 53b.

[0112] As shown in Figure 5, in the first driving element group 50a, a circuit 51aa constituting the first driving element 51a, a circuit 52aa constituting the third driving element 52a, and a circuit 53aa constituting the fifth driving element 53a are supplied with a power supply potential from a common power supply wiring 91 and with a ground potential from a common ground wiring 96.

[0113] In addition, in the second driving element group 50b, the circuit 51ba constituting the second driving element 51b, the circuit 52ba constituting the fourth driving element 52b, and the circuit 53ba constituting the sixth driving element 53b are supplied with power supply potential from a common power supply wiring 92 and with ground potential from a common ground wiring 97.

[0114] In other words, the first power supply wiring that supplies a power supply potential to the first driver 51, the second power supply wiring that supplies a power supply potential to the second driver 52, and the third power supply wiring that supplies a power supply potential to the third driver 53 have a common portion, and the first ground wiring that supplies a ground potential to the first driver 51, the second ground wiring that supplies a ground potential to the second driver 52, and the third ground wiring that supplies a ground potential to the third driver 53 have a common portion.

[0115] As shown in FIG. 5 , the first power supply terminal 71 and the second power supply terminal 72 are connected to a power supply wiring 91, the first ground terminal 81 and the second ground terminal 82 are connected to a ground wiring 96, the third power supply terminal 73 and the fourth power supply terminal 74 are connected to the power supply wiring 92, and the third ground terminal 83 and the fourth ground terminal 84 are connected to a ground wiring 97.

[0116] Here, the first power supply terminal 71 and the second power supply terminal 72 are arranged in positions facing each other across the first drive element group 50a (first drive element 51a) in a second direction (x-axis direction in FIG. 5 ) perpendicular to the first direction in a plan view of the distance measurement image sensor 30, and the third power supply terminal 73 and the fourth power supply terminal 74 are arranged in positions facing each other across the second drive element group 50b (second drive element 51b) in the second direction in a plan view of the distance measurement image sensor 30. The first ground terminal 81 and the second ground terminal 82 are arranged in positions facing each other across the first drive element group 50a (first drive element 51a) in the second direction when viewed in a plane of the distance measuring image sensor 30, and the third ground terminal 83 and the fourth ground terminal 84 are arranged in positions facing each other across the second drive element group 50b (second drive element 51b) in the second direction when viewed in a plane of the distance measuring image sensor 30. In this case, the length of the electrical path in the power supply wiring 91 from the first power supply terminal 71 to the first drive element group 50a, the length of the electrical path in the power supply wiring 91 from the second power supply terminal 72 to the first drive element group 50a, the length of the electrical path in the power supply wiring 91 from the third power supply terminal 73 to the second drive element group 50b, the length of the electrical path in the power supply wiring 92 from the fourth power supply terminal 74 to the second drive element group 50b, the length of the electrical path in the ground wiring 96 from the first ground terminal 81 to the first drive element group 50a, the length of the electrical path in the ground wiring 96 from the second ground terminal 82 to the first drive element group 50a, the length of the electrical path in the ground wiring 96 from the third ground terminal 83 to the second drive element group 50b, and the length of the electrical path in the ground wiring 97 from the fourth ground terminal 84 to the second drive element group 50b are all equal.

[0117] FIG. 6 is a schematic plan view showing the configuration of the package 100. As shown in FIG.

[0118] As shown in Figure 6, the package 100 includes a ranging image sensor 30, a first internal power supply terminal 101, a second internal power supply terminal 102, a third internal power supply terminal 103, a fourth internal power supply terminal 104, a first internal ground terminal 111, a second internal ground terminal 112, a third internal ground terminal 113, a fourth internal ground terminal 114, a first external power supply terminal 201, a second external power supply terminal 202, a first external ground terminal 211, and a second external ground terminal 212.

[0119] The first internal power supply terminal 101 is connected to the first power supply terminal 71. The second internal power supply terminal 102 is connected to the second power supply terminal 72. The third internal power supply terminal 103 is connected to the third power supply terminal 73. The fourth internal power supply terminal 104 is connected to the fourth power supply terminal 74.

[0120] The first internal ground terminal 111 is connected to the first ground terminal 81. The second internal ground terminal 112 is connected to the second ground terminal 82. The third internal ground terminal 113 is connected to the third ground terminal 83. The fourth internal ground terminal 114 is connected to the fourth ground terminal 84.

[0121] The first external power supply terminal 201 is connected to the first internal power supply terminal 101 and the third internal power supply terminal 103. The second external power supply terminal 202 is connected to the second internal power supply terminal 102 and the fourth internal power supply terminal 104.

[0122] The first external ground terminal 211 is connected to the first internal ground terminal 111 and the third internal ground terminal 113. The second external ground terminal 212 is connected to the second internal ground terminal 112 and the fourth internal ground terminal 114.

[0123] Here, the difference in length between each of the four electrical paths, (1) the electrical path from the first external power supply terminal 201 to the first internal power supply terminal 101, (2) the electrical path from the first external power supply terminal 201 to the third internal power supply terminal 103, (3) the electrical path from the second external power supply terminal 202 to the second internal power supply terminal 102, and (4) the electrical path from the second external power supply terminal 202 to the fourth internal power supply terminal 104, is 3 mm or less. In addition, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0124] [Discussion] FIG. 7 is a circuit diagram showing the configuration of a distance measuring image sensor 300 of a type that does not include the first delay adjustment circuit 61, the second delay adjustment circuit 62, and the third delay adjustment circuit 63.

[0125] As shown in Fig. 7, the distance measuring image sensor 300 is configured by removing the first delay adjustment circuit 61, the second delay adjustment circuit 62, and the third delay adjustment circuit 63 from the distance measuring image sensor 30 shown in Fig. 2. In the distance measuring image sensor 300, the first control signal, the second control signal, and the third control signal output from the control signal output circuit 70 are directly input to the first driver 51, the second driver 52, and the third driver 53, respectively.

[0126] As described above in the description of the ranging image sensor 30, in the ranging image sensor 300, the first driver 51, the second driver 52, and the third driver 53 are supplied with power supply potential from a common power supply wiring 91 and a common power supply wiring 92, and are supplied with ground potential from a common ground wiring 96 and a common ground wiring 97.

[0127] For this reason, when the first driver 51 outputs the first drive signal, that is, when the first driver 51 operates, a period occurs during which the power supply potential and ground potential supplied to the second driver 52 and the third driver 53 fluctuate. Therefore, when the second driver 52 and / or the third driver 53 operates during this period, the delay time of the second driver 52 and / or the third driver 53 fluctuates.

[0128] Similarly, when the second driver 52 outputs the second drive signal, that is, when the second driver 52 operates, a period occurs in which the power supply potential and ground potential supplied to the third driver 53 and the first driver 51 fluctuate. Therefore, when the third driver 53 and / or the first driver 51 operates during this period, the delay time of the third driver 53 and / or the first driver 51 fluctuates.

[0129] Similarly, when the third driver 53 outputs the third drive signal, that is, when the third driver 53 operates, a period occurs in which the power supply potential and ground potential supplied to the first driver 51 and the second driver 52 fluctuate. Therefore, when the first driver 51 and / or the second driver 52 operates during this period, the delay time of the first driver 51 and / or the second driver 52 fluctuates.

[0130] Therefore, depending on the operation timings of the first driver 51, the second driver 52, and the third driver 53, the operation timings of the first readout gate 6 a (first gate electrode 6 a), the second readout gate 6 b (second gate electrode 6 b), and the exposure control gate 8 (third gate electrode 8) in each pixel 40 may fluctuate.

[0131] If the operation timing of the first readout gate 6a (first gate electrode 6a), the operation timing of the second readout gate 6b (second gate electrode 6b), and the operation timing of the exposure control gate 8 (third gate electrode 8) in each pixel 40 fluctuates, the distance measurement accuracy decreases.

[0132] FIG. 8 is a waveform diagram showing a simulation of the operations of the first driver 51, the second driver 52, and the third driver 53 when the pixel 40 is exposed.

[0133] 8, the upper waveform shows the waveforms of the first control signal, the second control signal, and the third control signal input to the first driver 51, the second driver 52, and the third driver 53, respectively. The lower waveform shows the waveforms of the first drive signal, the second drive signal, and the third drive signal output from the first driver 51, the second driver 52, and the third driver 53, respectively.

[0134] As shown in Figure 8, when the third driver 53 drives the third drive signal from High to Low, the charge accumulated in the load capacitance of the third drive signal (e.g., the gate capacitance of the exposure control gate 8, the wiring capacitance of the wiring for the third drive signal, etc.) flows into the ground wiring 96 and the ground wiring 97, causing the potential of the ground wiring 96 and the ground wiring 97 to rise.

[0135] As described above, the ground wiring 96 and the ground wiring 97 are common ground wirings with the first driver 51. Therefore, as shown in FIG. 8 , when the first driver 51 drives the first drive signal from low to high during a period in which the potentials of the ground wiring 96 and the ground wiring 97 are floating, the operation timing of the first drive signal fluctuates. In this case, this simulation shows that the operation timing of the first drive signal fluctuates in a delayed direction. In other words, it shows that the delay time of the first driver 51 fluctuates in a delayed direction.

[0136] Therefore, as shown in Figure 8, in each pixel 40, the pre-exposure period defined by the third drive signal and the first drive signal fluctuates to be longer than the pre-exposure setting period set by the third control signal and the first control signal.

[0137] The same applies to the relationship between the first drive signal and the second drive signal, and the relationship between the second drive signal and the third drive signal.

[0138] For example, if the exposure period such as the preceding exposure period or the following exposure period varies by 20 ps, ​​a distance measurement error of 3 mm occurs.

[0139] In contrast, the range-finding image sensor 30 configured as described above maintains a constant phase difference between the first control signal and the first drive signal, and a constant phase difference between the second control signal and the second drive signal, by including the first delay adjustment circuit 61 and the second delay adjustment circuit 62. Therefore, even if the power supply potential or the ground potential supplied to the first driver 51 fluctuates and the delay time of the first driver 51 fluctuates, or even if the power supply potential or the ground potential supplied to the second driver 52 fluctuates and the delay time of the second driver 52 fluctuates, the operation timing of the first readout gate 6 a (first gate electrode 6 a) and the operation timing of the second readout gate 6 b (second gate electrode 6 b) in each pixel 40 do not fluctuate.

[0140] Therefore, the distance measuring image sensor 30 having the above configuration can measure distances with high accuracy.

[0141] Furthermore, the distance measuring image sensor 30 configured as described above maintains a constant phase difference between the third control signal and the third drive signal by including the third delay adjustment circuit 63. Therefore, even if the power supply potential or ground potential supplied to the third driver 53 fluctuates and the delay time of the third driver 53 fluctuates, the operation timing of the exposure control gate 8 (third gate electrode 8) in each pixel does not fluctuate.

[0142] Therefore, the distance measuring image sensor 30 having the above configuration can measure distances with even greater accuracy.

[0143] The above effect, i.e., the effect of being able to measure distances with high accuracy, becomes greater as the exposure period, i.e., the period for accumulating the electric charges converted by the photoelectric conversion unit 1, becomes shorter. In particular, the above effect becomes more pronounced when the exposure period is 10 ns or less, and becomes even more pronounced when the exposure period is 7 ns or less.

[0144] Therefore, in order to achieve the above-mentioned effect significantly, it is desirable that the control signal output circuit 70 be configured to output a first control signal including a pulse having a pulse width of 10 ns or less, and a second control signal including a pulse having a pulse width of 10 ns or less.

[0145] Figure 9 is a graph showing the relationship between the advance exposure setting period for the third control signal and the first control signal and the advance exposure period for the third drive signal and the first drive signal in a distance measurement image sensor 300 that is a type that does not have the first delay adjustment circuit 61, the second delay adjustment circuit 62, and the third delay adjustment circuit 63.

[0146] In FIG. 9, the horizontal axis represents the pre-exposure setting period [ns], and the vertical axis represents the pre-exposure period [ns].

[0147] Figure 10 is a graph showing the relationship between the advance exposure setting period for the third control signal and the first control signal and the advance exposure period for the third drive signal and the first drive signal in a distance measurement image sensor 30 that is a type that has a first delay adjustment circuit 61, a second delay adjustment circuit 62, and a third delay adjustment circuit 63.

[0148] In FIG. 10, the horizontal axis represents the pre-exposure setting period [ns], and the vertical axis represents the pre-exposure period [ns].

[0149] As shown in Figure 9, in a range-finding image sensor 300 that is a type that does not have the first delay adjustment circuit 61, the second delay adjustment circuit 62, and the third delay adjustment circuit 63, the shorter the advance exposure setting period, the greater the deviation between the advance exposure setting period and the advance exposure setting period. In contrast, as shown in Figure 10, in a range-finding image sensor 30 that is a type that is equipped with the first delay adjustment circuit 61, the second delay adjustment circuit 62, and the third delay adjustment circuit 63, even if the advance exposure setting period is shortened, there is no significant deviation between the advance exposure setting period and the advance exposure setting period.

[0150] Thus, with the distance measuring image sensor 30 configured as described above, accurate distance measurement can be performed even if the control signal output circuit 70 is configured to output a first control signal including a pulse having a pulse width of 10 ns or less and a second control signal including a pulse having a pulse width of 10 ns or less.

[0151] FIG. 11 is a graph showing the distribution of ideal delay times of drive signals relative to position in the column direction (the direction in which the first drive signal, the second drive signal, and the third drive signal (hereinafter, when there is no need to explicitly distinguish between these three, they will also be simply referred to as "drive signals")) in the pixel array 41.

[0152] In FIG. 11, the horizontal axis represents the position in the column direction, and the vertical axis represents the delay time.

[0153] As shown in Figure 11, the distribution of delay time with respect to position in the column direction has a "mountain shape" in which the delay time is larger in the central part far from the drivers than in the upper and lower parts close to the first driver 51, second driver 52, and third driver (hereinafter, when there is no need to explicitly distinguish between these three, they will simply be referred to as "drivers").

[0154] This arched shape is simply determined by the resistance and parasitic capacitance of the wiring in the column direction within the pixel array 41, so errors in distance measurement accuracy due to delay time differences can be corrected by signal processing or the like.

[0155] Furthermore, as shown in FIG. 11, when the temperature fluctuates, the absolute value of the delay time fluctuates.

[0156] Errors in distance measurement accuracy due to fluctuations in delay time caused by temperature fluctuations can also be corrected by signal processing or the like based on the temperature detected by a temperature sensor or the like.

[0157] On the other hand, the inventors realized by performing various simulations, etc., that if the symmetry of the electrical characteristics of the electrical path that supplies power supply potential from the power supply potential supply point in the package that packages the ranging image sensor 30 to the driver, and the electrical path that supplies ground potential from the ground supply point in the package to the driver, is not within a certain range, the above-mentioned arched shape will be distorted, that is, fluctuations in the operation timing will occur between pixels 40 that are physically located differently from each other, which will be difficult to correct by signal processing, etc.

[0158] Figure 12 is a graph showing the simulation results of the distribution of delay times of drive signals with respect to column position when a simulation was performed in which the difference in length between four electrical paths, namely (1) the electrical path from the first external power supply terminal 201 to the first internal power supply terminal 101, (2) the electrical path from the first external power supply terminal 201 to the third internal power supply terminal 103, (3) the electrical path from the second external power supply terminal 202 to the second internal power supply terminal 102, and (4) the electrical path from the second external power supply terminal 202 to the fourth internal power supply terminal 104, was set so that it was not less than 3 mm, i.e., not less than 2 nH (hereinafter also referred to as "a simulation under the first simulation conditions").

[0159] In FIG. 12, the horizontal axis represents the position in the column direction, and the vertical axis represents the delay time.

[0160] As shown in FIG. 12, if the difference in length between the four electrical paths is not equal to or less than 3 mm, the shorter the exposure period, the more pronounced the distortion of the arched shape becomes.

[0161] FIG. 13 is a graph showing the relationship between (1) the first exposure period and (2) the delay difference, which is the difference between the value in the central part and the upper and lower parts of the delay time of the first drive signal in the vertical direction of the pixel array 41, when simulated under the first simulation conditions.

[0162] In FIG. 13, the horizontal axis represents the first exposure period [ns], and the vertical axis represents the delay difference [ps].

[0163] FIG. 14 is a graph showing the relationship between (1) the first exposure period and (2) the delay difference, which is the difference between the value of the central part and the upper and lower parts of the delay time of the first drive signal in the vertical direction of the pixel array 41, when a simulation is performed by setting the above four electrical paths to reproduce the electrical paths in the actual package 100, that is, when a simulation is performed by setting the difference in length between each of the above four electrical paths to be 3 mm or less (hereinafter also referred to as a "simulation under the second simulation conditions").

[0164] In FIG. 14, the horizontal axis represents the first exposure period [ns], and the vertical axis represents the delay difference [ps].

[0165] From Figures 13 and 14, it can be seen that the distortion of the arched shape can be suppressed by making the difference in length between each of the four electrical paths 3 mm or less, that is, by making the difference in inductance between each of the four electrical paths 2 nH or less.

[0166] In this way, with the package 100 having the above configuration, when the timing at which the drive signal reaches the pixel 40 varies, the difference in the amount of variation in the operation timing of the drive signal between pixels 40 that are in different physical positions can be suppressed (kept within a certain range).

[0167] Therefore, the package 100 having the above configuration can perform distance measurement with high accuracy.

[0168] The distance measuring image sensor 30 may be configured, for example, by one semiconductor chip, or by stacking a plurality of semiconductor chips on top of each other.

[0169] FIG. 15A is a perspective view of an example of a distance measuring image sensor 30 configured by a single semiconductor chip 31. FIG.

[0170] FIG. 15B is an exploded perspective view of the distance measuring image sensor 30 in an example in which the distance measuring image sensor 30 is configured by stacking a first semiconductor chip 32 and a second semiconductor chip 33 on top of each other.

[0171] FIG. 15C is a perspective view of the distance measuring image sensor 30 in an example in which the distance measuring image sensor 30 is configured by stacking a first semiconductor chip 32 and a second semiconductor chip 33 on top of each other.

[0172] As shown in Figure 15A, the ranging image sensor 30 may be configured, for example, by a single semiconductor chip 31 on which a pixel array 41, a first driving element group 50a, and a second driving element group 50b are formed, i.e., on which a pixel array 41, a first driver 51, a second driver 52, and a third driver 53 are formed; or, as shown in Figures 15B and 15C, the ranging image sensor 30 may be configured by stacking, for example, a first semiconductor chip 32 on which a pixel array 41 is formed, and a second semiconductor chip 32 on which a first driving element group 50a and a second driving element group 50b are formed, i.e., on which a first driver 51, a second driver 52, and a third driver 53 are formed.

[0173] (Modification 1) A package according to Modification 1, which is configured by partially modifying package 100 according to embodiment 1, will be described below.

[0174] In the following, for the package according to variant 1, components that are similar to those in package 100 have already been explained, so they will be assigned the same reference numerals and their detailed explanations will be omitted, and the explanation will focus on the differences from package 100.

[0175] [Configuration] FIG. 16 is a schematic plan view showing the configuration of a package 100a according to the first modification.

[0176] As shown in FIG. 16, the package 100a differs from the package 100 according to the first embodiment in that the distance-measuring image sensor 30 is changed to a distance-measuring image sensor 30a, the first internal power supply terminal 101, the second internal power supply terminal 102, the third internal power supply terminal 103, and the fourth internal power supply terminal 104 are changed to a first internal power supply terminal 101a, a second internal power supply terminal 102a, a third internal power supply terminal 103a, and a fourth internal power supply terminal 104a, respectively, and the first internal ground terminal 111, the second internal ground terminal 112, the third internal ground terminal 113, and the fourth internal ground terminal 114 are changed to a first internal power supply terminal 101a, a second internal power supply terminal 102a, a third internal power supply terminal 103a, and a fourth internal power supply terminal 104a. The ground terminal 114 is changed to a first internal ground terminal 111a, a second internal ground terminal 112a, a third internal ground terminal 113a, and a fourth internal ground terminal 114a, respectively, the first external power supply terminal 201 and the second external power supply terminal 202 are changed to a first external power supply terminal 201a and a second external power supply terminal 202a, respectively, and the first external ground terminal 211 and the second external ground terminal 212 are changed to a first external ground terminal 211a and a second external ground terminal 212a, respectively.

[0177] The ranging image sensor 30a is configured by changing the first ground terminal 81 of the ranging image sensor 30 according to embodiment 1 to a first ground terminal 81a whose position has been changed, the second ground terminal 82 to a second ground terminal 82a whose position has been changed, the third ground terminal 83 to a third ground terminal 83a whose position has been changed, and the fourth ground terminal 84 to a fourth ground terminal 84a whose position has been changed.

[0178] The first internal power supply terminal 101a is connected to the first power supply terminal 71. The second internal power supply terminal 102a is connected to the second power supply terminal 72. The third internal power supply terminal 103a is connected to the third power supply terminal 73. The fourth internal power supply terminal 104a is connected to the fourth power supply terminal 74.

[0179] The first internal ground terminal 111a is connected to the first ground terminal 81a. The second internal ground terminal 112a is connected to the second ground terminal 82a. The third internal ground terminal 113a is connected to the third ground terminal 83a. The fourth internal ground terminal 114a is connected to the fourth ground terminal 84a.

[0180] The first external power supply terminal 201a is connected to the first internal power supply terminal 101a and the second internal power supply terminal 102a. The second external power supply terminal 202a is connected to the third internal power supply terminal 103a and the fourth internal power supply terminal 104a.

[0181] The first external ground terminal 211a is connected to the first internal ground terminal 111a and the second internal ground terminal 112a. The second external ground terminal 212a is connected to the third internal ground terminal 113a and the fourth internal ground terminal 114a.

[0182] Here, the difference in length among the four electrical paths, (1) the electrical path from the first external power supply terminal 201a to the first internal power supply terminal 101a, (2) the electrical path from the first external power supply terminal 201a to the second internal power supply terminal 102a, (3) the electrical path from the second external power supply terminal 202a to the third internal power supply terminal 103a, and (4) the electrical path from the second external power supply terminal 202a to the fourth internal power supply terminal 104a, is 3 mm or less, and the difference in inductance among these four electrical paths is 2 nH or less.

[0183] [Discussion] As described above, in the package 100a having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less, and the difference in inductance between each of the four electrical paths is 2 nH or less.

[0184] Therefore, the package 100a having the above configuration can perform distance measurement with high accuracy, similar to the package 100 according to the first embodiment.

[0185] (Modification 2) A package according to Modification 2, which is configured by partially modifying package 100 according to embodiment 1, will be described below.

[0186] In the following, for the package according to variant 2, components that are similar to those in package 100 have already been explained, so they will be assigned the same reference numerals and their detailed explanations will be omitted, and the explanation will focus on the differences from package 100.

[0187] [Configuration] FIG. 17 is a schematic plan view showing the configuration of a package 100b according to the second modification.

[0188] As shown in FIG. 17 , package 100b is configured by changing the first external power supply terminal 201 and the second external power supply terminal 202 of package 100 according to embodiment 1 to a first external power supply terminal 201b, a second external power supply terminal 202b, a third external power supply terminal 203b, and a fourth external power supply terminal 204b, and changing the first external ground terminal 211 and the second external ground terminal 212 to a first external ground terminal 211b, a second external ground terminal 212b, a third external ground terminal 213b, and a fourth external ground terminal 214b.

[0189] The first external power supply terminal 201b is connected to the first internal power supply terminal 101. The second external power supply terminal 202b is connected to the second internal power supply terminal 102. The third external power supply terminal 203b is connected to the third internal power supply terminal 103. The fourth external power supply terminal 204b is connected to the fourth internal power supply terminal 104.

[0190] The first external ground terminal 211b is connected to the first internal ground terminal 111. The second external ground terminal 212a is connected to the second internal ground terminal 112. The third external ground terminal 213b is connected to the third internal ground terminal 113. The fourth external ground terminal 214b is connected to the fourth internal ground terminal 114.

[0191] Here, the difference in length between each of the four electrical paths is 3 mm or less: (1) the electrical path from the first external power supply terminal 201 b to the first internal power supply terminal 101, (2) the electrical path from the second external power supply terminal 202 b to the second internal power supply terminal 102, (3) the electrical path from the third external power supply terminal 203 b to the third internal power supply terminal 103, and (4) the electrical path from the fourth external power supply terminal 204 b to the fourth internal power supply terminal 104. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0192] [Discussion] As described above, in the package 100b having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less, and the difference in inductance between each of the four electrical paths is 2 nH or less.

[0193] Therefore, the package 100b having the above configuration can perform distance measurement with high accuracy, similar to the package 100 according to the first embodiment.

[0194] (Modification 3) A package according to Modification 3, which is configured by partially modifying package 100 according to embodiment 1, will be described below.

[0195] In the following, for the package according to variant 3, components that are similar to those in package 100 have already been explained, so they will be assigned the same reference numerals and their detailed explanations will be omitted, and the explanation will focus on the differences from package 100.

[0196] [Configuration] FIG. 18 is a schematic plan view showing the configuration of a package 100c according to the third modification.

[0197] As shown in FIG. 18, the package 100c is configured by changing the distance measuring image sensor 30 in the package 100 according to the first embodiment to a distance measuring image sensor 300.

[0198] [Discussion] As with the package 100 according to the first embodiment, in the package 100c having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less: (1) the electrical path from the first external power supply terminal 201 to the first internal power supply terminal 101; (2) the electrical path from the first external power supply terminal 201 to the third internal power supply terminal 103; (3) the electrical path from the second external power supply terminal 202 to the second internal power supply terminal 102; and (4) the electrical path from the second external power supply terminal 202 to the fourth internal power supply terminal 104. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0199] Therefore, the package 100c having the above configuration can perform distance measurement with high accuracy, similar to the package 100 according to the first embodiment.

[0200] (Modification 4) A package according to Modification 4, which is configured by partially modifying the package 100a according to Modification 1, will be described below.

[0201] In the following, for the package according to variant 4, components that are similar to those of package 100a have already been explained, so they will be assigned the same reference numerals and detailed explanations thereof will be omitted, and the explanation will focus on the differences from package 100a.

[0202] [Configuration] FIG. 19 is a schematic plan view showing the configuration of a package 100d according to the fourth modification.

[0203] As shown in FIG. 19, the package 100d is configured by changing the distance measuring image sensor 30a of the package 100a according to the first modification to a distance measuring image sensor 300a.

[0204] The ranging image sensor 300a is configured by changing the first ground terminal 81 of the ranging image sensor 300 to a first ground terminal 81a whose position has been changed to the same position as that of the ranging image sensor 30a, the second ground terminal 82 to a second ground terminal 82a whose position has been changed to the same position as that of the ranging image sensor 30a, the third ground terminal 83 to a third ground terminal 83a whose position has been changed to the same position as that of the ranging image sensor 30a, and the fourth ground terminal 84 to a fourth ground terminal 84a whose position has been changed to the same position as that of the ranging image sensor 30a.

[0205] [Discussion] As with the package 100a according to the first modification, in the package 100d having the above configuration, the difference in length among the four electrical paths, namely (1) the electrical path from the first external power supply terminal 201a to the first internal power supply terminal 101a, (2) the electrical path from the first external power supply terminal 201a to the second internal power supply terminal 102a, (3) the electrical path from the second external power supply terminal 202a to the third internal power supply terminal 103a, and (4) the electrical path from the second external power supply terminal 202a to the fourth internal power supply terminal 104a, is 3 mm or less, and the difference in inductance among these four electrical paths is 2 nH or less.

[0206] Therefore, the package 100d having the above configuration can perform distance measurement with high accuracy, similar to the package 100a according to the first modification.

[0207] (Modification 5) A package according to Modification 5, which is configured by partially modifying the package 100b according to Modification 2, will be described below.

[0208] In the following, for the package according to variant 5, components similar to those of package 100b have already been explained, so they will be assigned the same reference numerals and detailed explanations thereof will be omitted, and the explanation will focus on the differences from package 100b.

[0209] [Configuration] FIG. 20 is a schematic plan view showing the configuration of a package 100e according to the fifth modification.

[0210] As shown in FIG. 20, the package 100e is configured by changing the distance measuring image sensor 30 in the package 100b according to the second modification to a distance measuring image sensor 300.

[0211] [Discussion] As with the package 100b according to the second modification, in the package 100e having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less: (1) the electrical path from the first external power supply terminal 201b to the first internal power supply terminal 101; (2) the electrical path from the second external power supply terminal 202b to the second internal power supply terminal 102; (3) the electrical path from the third external power supply terminal 203b to the third internal power supply terminal 103; and (4) the electrical path from the fourth external power supply terminal 204b to the fourth internal power supply terminal 104. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0212] Therefore, the package 100e having the above configuration can perform distance measurement with high accuracy, similar to the package 100b according to the second modification.

[0213] Second Embodiment [Configuration] FIG. 21 is a functional block diagram showing a schematic configuration of a distance measuring imaging device 200a according to a second embodiment.

[0214] As shown in FIG. 21, the distance measuring image capturing device 200 a is configured by replacing the package 100 of the distance measuring image capturing device 200 according to the first embodiment with a module 1000 .

[0215] FIG. 22 is a schematic plan view showing the configuration of the module 1000.

[0216] As shown in FIG. 22, the module 1000 includes a mounting substrate 500 and a distance measuring image sensor 30 .

[0217] The mounting board 500 mounts the ranging image sensor 30 and includes a first internal power supply terminal 501, a second internal power supply terminal 502, a third internal power supply terminal 503, a fourth internal power supply terminal 504, a first internal ground terminal 511, a second internal ground terminal 512, a third internal ground terminal 513, a fourth internal ground terminal 514, a first bypass capacitor 601, and a second bypass capacitor 602.

[0218] The first internal power supply terminal 501 is connected to the first power supply terminal 71. The second internal power supply terminal 502 is connected to the second power supply terminal 72. The third internal power supply terminal 503 is connected to the third power supply terminal 73. The fourth internal power supply terminal 504 is connected to the fourth power supply terminal 74.

[0219] The first internal ground terminal 511 is connected to the first ground terminal 81. The second internal ground terminal 512 is connected to the second ground terminal 82. The third internal ground terminal 513 is connected to the third ground terminal 83. The fourth internal ground terminal 514 is connected to the fourth ground terminal 84.

[0220] The first bypass capacitor 601 has one terminal connected to the first internal power supply terminal 501 and the third internal power supply terminal 503, and the other terminal connected to the first internal ground terminal 511 and the third internal ground terminal 513.

[0221] The second bypass capacitor 602 has one terminal connected to the second internal power supply terminal 502 and the fourth internal power supply terminal 504, and the other terminal connected to the second internal ground terminal 512 and the fourth internal ground terminal 514.

[0222] Here, the difference in length between each of the four electrical paths is 3 mm or less: (1) the electrical path from the first bypass capacitor 601 to the first internal power supply terminal 501, (2) the electrical path from the first bypass capacitor 601 to the third internal power supply terminal 503, (3) the electrical path from the second bypass capacitor 602 to the second internal power supply terminal 502, and (4) the electrical path from the second bypass capacitor 602 to the fourth internal power supply terminal 504. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0223] [Discussion] As described above, in the module 1000 having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less, and the difference in inductance between each of the four electrical paths is 2 nH or less.

[0224] Therefore, according to the module 1000 having the above configuration, distance measurement can be performed with high accuracy, similar to the package 100 according to the first embodiment.

[0225] (Modification 6) A module according to Modification 6, which is configured by partially modifying module 1000 according to embodiment 2, will be described below.

[0226] In the following, for the module according to variant 6, components that are similar to those of module 1000 have already been explained, so they will be assigned the same reference numerals and their detailed explanations will be omitted, and the explanation will focus on the differences from module 1000.

[0227] [Configuration] FIG. 23 is a schematic plan view showing the configuration of a module 1000a according to the sixth modification.

[0228] As shown in FIG. 23, the module 1000a is configured by changing the distance measuring image sensor 30 of the module 1000 according to the second embodiment to a distance measuring image sensor 30a, and changing the mounting board 500 to a mounting board 500a.

[0229] The mounting board 500a is configured such that the first internal power supply terminal 501, the second internal power supply terminal 502, the third internal power supply terminal 503, and the fourth internal power supply terminal 504 are changed to the first internal power supply terminal 501a, the second internal power supply terminal 502a, the third internal power supply terminal 503a, and the fourth internal power supply terminal 504a, respectively; the first internal ground terminal 511, the second internal ground terminal 512, the third internal ground terminal 513, and the fourth internal ground terminal 514a are changed to the first internal ground terminal 511a, the second internal ground terminal 512a, the third internal ground terminal 513a, and the fourth internal ground terminal 514a, respectively; and the first bypass capacitor 601 and the second bypass capacitor 602 are changed to the first bypass capacitor 601a and the second bypass capacitor 602a, respectively.

[0230] The first internal power supply terminal 501a is connected to the first power supply terminal 71. The second internal power supply terminal 502a is connected to the second power supply terminal 72. The third internal power supply terminal 503a is connected to the third power supply terminal 73. The fourth internal power supply terminal 504a is connected to the fourth power supply terminal 74.

[0231] The first internal ground terminal 511a is connected to the first ground terminal 81a. The second internal ground terminal 512a is connected to the second ground terminal 82a. The third internal ground terminal 513a is connected to the third ground terminal 83a. The fourth internal ground terminal 514a is connected to the fourth ground terminal 84a.

[0232] The first bypass capacitor 601a has one terminal connected to the first internal power supply terminal 501a and the second internal power supply terminal 502a, and the other terminal connected to the first internal ground terminal 511a and the second internal ground terminal 512a.

[0233] The second bypass capacitor 602a has one terminal connected to the third internal power supply terminal 503a and the fourth internal power supply terminal 504a, and the other terminal connected to the third internal ground terminal 513a and the fourth internal ground terminal 514a.

[0234] The difference in length among the four electrical paths (1) from the first bypass capacitor 601a to the first internal power supply terminal 501a, (2) from the first bypass capacitor 601a to the second internal power supply terminal 502a, (3) from the second bypass capacitor 602a to the third internal power supply terminal 503a, and (4) from the second bypass capacitor 602a to the fourth internal power supply terminal 504a) is 3 mm or less, and the difference in inductance among these four electrical paths is 2 nH or less.

[0235] [Discussion] As described above, in the module 1000a having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less, and the difference in inductance between each of the four electrical paths is 2 nH or less.

[0236] Therefore, the module 1000a having the above configuration can perform distance measurement with high accuracy, similar to the module 1000 according to the second embodiment.

[0237] (Seventh Modification) A module according to a seventh modification, which is configured by partially modifying the module 1000 according to the second embodiment, will be described below.

[0238] In the following, for the module according to variant 7, components similar to those of module 1000 have already been explained, so they will be assigned the same reference numerals and detailed explanations will be omitted, and the explanation will focus on the differences from module 1000.

[0239] [Configuration] FIG. 24 is a schematic plan view showing the configuration of a module 1000b according to the seventh modification.

[0240] As shown in FIG. 24, module 1000b is configured by changing the first bypass capacitor 601 and the second bypass capacitor 602 of module 1000 according to embodiment 2 to a first bypass capacitor 601b, a second bypass capacitor 602b, a third bypass capacitor 603b, and a fourth bypass capacitor 604b.

[0241] The first bypass capacitor 601 b has one terminal connected to the first internal power supply terminal 501 and the other terminal connected to the first internal ground terminal 511 .

[0242] The second bypass capacitor 602 b has one terminal connected to the second internal power supply terminal 502 and the other terminal connected to the second internal ground terminal 512 .

[0243] The third bypass capacitor 603 b has one terminal connected to the third internal power supply terminal 503 and the other terminal connected to the third internal ground terminal 513 .

[0244] The fourth bypass capacitor 604 b has one terminal connected to the fourth internal power supply terminal 504 and the other terminal connected to the fourth internal ground terminal 514 .

[0245] Here, the difference in length between each of the four electrical paths is 3 mm or less: (1) the electrical path from the first bypass capacitor 601 b to the first internal power supply terminal 501, (2) the electrical path from the second bypass capacitor 602 b to the second internal power supply terminal 502, (3) the electrical path from the third bypass capacitor 603 b to the third internal power supply terminal 503, and (4) the electrical path from the fourth bypass capacitor 604 b to the fourth internal power supply terminal 504. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0246] [Discussion] As described above, in the module 1000b having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less, and the difference in inductance between each of the four electrical paths is 2 nH or less.

[0247] Therefore, the module 1000b having the above configuration can perform distance measurement with high accuracy, similar to the module 1000 according to the second embodiment.

[0248] (Modification 8) A module according to Modification 8, which is configured by partially modifying module 1000 according to embodiment 2, will be described below.

[0249] In the following, for the module according to variant 8, components similar to those of module 1000 have already been explained, so they will be assigned the same reference numerals and detailed explanations will be omitted, and the explanation will focus on the differences from module 1000.

[0250] [Configuration] FIG. 25 is a schematic plan view showing the configuration of a module 1000c according to Modification 8. As shown in FIG.

[0251] As shown in FIG. 25, the module 1000c is configured by changing the distance measuring image sensor 30 in the module 1000 according to the second embodiment to a distance measuring image sensor 300.

[0252] [Consideration] As with the module 1000 according to the second embodiment, in the module 1000 having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less: (1) the electrical path from the first bypass capacitor 601 to the first internal power supply terminal 501, (2) the electrical path from the first bypass capacitor 601 to the third internal power supply terminal 503, (3) the electrical path from the second bypass capacitor 602 to the second internal power supply terminal 502, and (4) the electrical path from the second bypass capacitor 602 to the fourth internal power supply terminal 504. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0253] Therefore, the module 1000c having the above configuration can perform distance measurement with high accuracy, similar to the module 1000 according to the second embodiment.

[0254] (Modification 9) A module according to Modification 9, which is configured by partially modifying the module 1000a according to Modification 6, will be described below.

[0255] In the following, for the module according to variant 9, components similar to those of module 1000a have already been explained, so they will be assigned the same reference numerals and detailed explanations will be omitted, and the explanation will focus on the differences from module 1000a.

[0256] [Configuration] FIG. 26 is a schematic plan view showing the configuration of a module 1000d according to Modification 9. As shown in FIG.

[0257] As shown in FIG. 26, the module 1000d is configured by changing the distance measuring image sensor 30a of the module 1000a according to the sixth modification to a distance measuring image sensor 300a.

[0258] [Discussion] As with the module 1000a according to the sixth modification, in the module 1000d having the above configuration, the difference in length between each of the 84 electrical paths, namely (1) the electrical path from the first bypass capacitor 601a to the first internal power supply terminal 501a, (2) the electrical path from the first bypass capacitor 601a to the second internal power supply terminal 502a, (3) the electrical path from the second bypass capacitor 602a to the third internal power supply terminal 503a, and (4) the electrical path from the second bypass capacitor 602a to the fourth internal power supply terminal 504a, is 3 mm or less. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0259] Therefore, the module 1000d having the above configuration can perform distance measurement with high accuracy, similar to the module 1000a according to the sixth modification.

[0260] (Modification 10) A module according to Modification 10, which is configured by partially modifying the module 1000b according to Modification 7, will be described below.

[0261] In the following, for the module according to variant 10, components similar to those of module 1000b have already been explained, so they will be assigned the same reference numerals and detailed explanations will be omitted, and the explanation will focus on the differences from module 1000b.

[0262] [Configuration] FIG. 27 is a schematic plan view showing the configuration of a module 1000e according to a tenth modification.

[0263] As shown in FIG. 27, the module 1000e is configured by changing the distance measuring image sensor 30 in the module 1000b according to the seventh modification to a distance measuring image sensor 300.

[0264] [Discussion] As with the module 1000b according to the seventh modification, in the module 1000e having the above configuration, the difference in length between each of the four electrical paths is 3 mm or less: (1) the electrical path from the first bypass capacitor 601b to the first internal power supply terminal 501, (2) the electrical path from the second bypass capacitor 602b to the second internal power supply terminal 502, (3) the electrical path from the third bypass capacitor 603b to the third internal power supply terminal 503, and (4) the electrical path from the fourth bypass capacitor 604b to the fourth internal power supply terminal 504. Furthermore, the difference in inductance between each of these four electrical paths is 2 nH or less.

[0265] Therefore, the module 1000e having the above configuration can perform distance measurement with high accuracy, similar to the module 1000b according to the seventh modification.

[0266] (Supplementary Note) The distance measuring image sensor, package, module, and distance measuring image device according to one aspect of the present disclosure have been described above based on Embodiments 1 and 2 and Modifications 1 to 10, but the present disclosure is not limited to these embodiments and modifications. Various modifications that would occur to a person skilled in the art may be made to these embodiments and modifications, and configurations constructed by combining components in different embodiments and modifications may also be included within the scope of one or more aspects of the present disclosure, provided that they do not deviate from the spirit of the present disclosure.

[0267] (1) In the first embodiment, FIG. 4 is shown as an example of a timing chart illustrating the operation of the pixel 40 during exposure, but the present invention is not limited to this.

[0268] FIG. 28 is a timing chart showing another example of the operation of the pixel 40 during exposure.

[0269] 28, the delay amount of reflected light may be detected by complementary continuous operation of a first drive signal and a second drive signal that drive a first readout gate 6 a and a second readout gate 6 b provided in a pixel 40. In this case, distance measurement can be performed with higher accuracy according to the first embodiment.

[0270] (2) The packages disclosed in the first embodiment and the first to fifth modifications are not limited to specific packages such as ceramic packages, resin-sealed packages, and chip-size packages (CSPs).

[0271] (3) The modules disclosed in the second embodiment and the sixth to tenth modifications may further include a package such as a ceramic package, a resin-sealed package, a chip-size package (CSP), etc. Even in this case, accurate distance measurement is possible even in the form of a module by maintaining electrical symmetry from the internal terminals of the package to the bypass capacitor.

[0272] (4) In the first embodiment, the configuration of the package 100 is shown in FIG. 6 as an example, but the present invention is not limited to this.

[0273] FIG. 29 is a schematic plan view showing another example of the configuration of the package 100. As shown in FIG.

[0274] For example, as shown in FIG. 29, each power supply terminal and each ground terminal, as well as each internal power supply terminal and each internal ground terminal, may be divided into a plurality of terminals.

[0275] This method is generally used to increase the current that can be supplied, and in this case too, according to this embodiment, it is possible to perform distance measurement with higher accuracy.

[0276] The present disclosure is widely applicable to distance measuring image sensors, packages, modules, distance measuring image devices, and the like.

[0277] REFERENCE SIGNS LIST 1 Photoelectric conversion section 2 Charge storage section 2a First charge storage section 2b Second charge storage section 4 Transfer channel 5, 5a, 5b, 5c, 5d, 5e Transfer electrode 6 Readout gate 6a First readout gate (first gate electrode) 6b Second readout gate (second gate electrode) 8, 8a, 8b Exposure control gate (third gate electrode) 9, 9a, 9b Overflow drain 10 Charge holding section 11 Charge holding gate 12 Transfer control gate 13 Output control gate 14 Floating diffusion layer 15 Reset gate 16 Reset drain 17 Readout circuit 30, 30a, 300, 300a Range-finding image sensor 31, 32, 33 Semiconductor chip 40 Pixel 41 Pixel array 50a First drive element group 50b Second drive element group 51 First driver 51a First drive element 51b Second drive element 51aaa, 51ba, 52aa, 52ba, 53aa, 53ba Circuit 52 Second driver 52a Third drive element 52b Fourth drive element 53 Third driver 53a Fifth drive element 53b Sixth drive element 61 First delay adjustment circuit 62 Second delay adjustment circuit 63 Third delay adjustment circuit 70 Control signal output circuit 71 First power supply terminal 72 Second power supply terminal 73 Third power supply terminal 74 Fourth power supply terminal 81, 81a First ground terminal 82, 82a Second ground terminal 83, 83a Third ground terminal 84, 84a Fourth ground terminal 91, 92 Power supply wiring 96, 97 Ground wiring 100, 100a, 100b, 100c, 100d, 100e Package 101, 101a, 501, 501a First internal power supply terminal 102, 102a, 502, 502a Second internal power supply terminal 103, 103a, 503, 503a Third internal power supply terminal 104, 104a, 504, 504a Fourth internal power supply terminal 110 Light source 111, 111a, 511, 511a First internal ground terminal 112, 112a, 512, 512a Second internal ground terminal 113, 113a, 513, 513a Third internal ground terminal114, 114a, 514, 514a Fourth internal ground terminal 120 Signal processing device 130 Subject 200, 200a Distance measuring image pickup device 201, 201a, 201b First external power supply terminal 202, 202a, 202b Second external power supply terminal 203b Third external power supply terminal 204b Fourth external power supply terminal 211, 211a, 211b First external ground terminal 212, 212a, 212b Second external ground terminal 213b Third external ground terminal 214b Fourth external ground terminal 500, 500a, 500b, 500c, 500d, 500e Mounting board 601, 601a, 601b First bypass capacitor 602, 602a, 602b Second bypass capacitor 603b: Third bypass capacitor 604b: Fourth bypass capacitor 1000, 1000a, 1000b, 1000c, 1000d, 1000e: Module

Claims

1. A distance measuring image sensor for performing distance measurement by an indirect TOF (Time Of Flight) method, a pixel array in which a plurality of pixels are arranged in an array, each pixel having a photoelectric conversion unit that converts received light into an electric charge and a plurality of gate electrodes for transferring the electric charges generated by the photoelectric conversion unit; a control signal output circuit that outputs a plurality of control signals for controlling the plurality of gate electrodes of the plurality of pixels; a plurality of delay adjustment circuits that adjust the delay times of the respective control signals and output a plurality of delay control signals whose delay times have been adjusted; a plurality of drivers to which the plurality of delay control signals are input and which output a plurality of drive signals for driving the plurality of gate electrodes of the plurality of pixels; A plurality of power supply lines for supplying a power supply potential to the plurality of drivers; a plurality of ground wirings for supplying a ground potential to the plurality of drivers; the plurality of power supply wirings have common portions; the plurality of ground wirings have a common portion; The plurality of delay adjustment circuits adjust delay times of the plurality of control signals so that phase differences between the plurality of control signals and the plurality of drive signals are constant. Distance measuring image sensor.

2. the plurality of gate electrodes include a first gate electrode and a second gate electrode; the plurality of control signals include a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; the plurality of delay control signals include a first delay control signal and a second delay control signal; the plurality of delay adjustment circuits include a first delay adjustment circuit that adjusts a delay time of the first control signal and outputs the first delay control signal whose delay time has been adjusted, and a second delay adjustment circuit that adjusts a delay time of the second control signal and outputs the second delay control signal whose delay time has been adjusted; the plurality of drive signals include a first drive signal and a second drive signal; the plurality of drivers include a first driver which receives the first delay control signal and outputs the first drive signal for driving the first gate electrodes of the plurality of pixels, and a second driver which receives the second delay control signal and outputs the second drive signal for driving the second gate electrodes of the plurality of pixels; the plurality of power supply wirings include a first power supply wiring that supplies a power supply potential to the first driver and a second power supply wiring that supplies a power supply potential to the second driver; the plurality of ground wirings include a first ground wiring that supplies a ground potential to the first driver and a second ground wiring that supplies a ground potential to the second driver; the first power supply wiring and the second power supply wiring have a common portion; the first ground wiring and the second ground wiring have a common portion; the first delay adjustment circuit adjusts a delay time of the first control signal so that a phase difference between the first control signal and the first drive signal is constant; The second delay adjustment circuit adjusts a delay time of the second control signal so that a phase difference between the second control signal and the second drive signal is constant.

2. The distance measuring image sensor according to claim 1.

3. Each of the plurality of pixels further has a third gate electrode for discharging charges generated by the photoelectric conversion unit, the control signal output circuit further outputs a third control signal for controlling the third gate electrodes of the plurality of pixels; The distance measuring image sensor further includes: a third delay adjustment circuit that adjusts a delay time of the third control signal and outputs a third delay control signal whose delay time has been adjusted; a third driver that receives the third delay control signal and outputs a third drive signal that drives the third gate electrodes of the plurality of pixels; The third delay adjustment circuit adjusts a delay time of the third control signal so that a phase difference between the third control signal and the third drive signal is constant. The distance measuring image sensor according to claim 2 .

4. The control signal output circuit outputs the first control signal including a pulse having a pulse width of 10 ns or less, and the second control signal including a pulse having a pulse width of 10 ns or less.

4. The distance measuring image sensor according to claim 2 or 3.

5. The distance measuring image sensor is The pixel array, the first driver, and the second driver are formed on a single semiconductor chip. or A first semiconductor chip on which the pixel array is formed and a second semiconductor chip on which the first driver and the second driver are formed are stacked on top of each other.

4. The distance measuring image sensor according to claim 2 or 3.

6. A package including the distance measuring image sensor according to claim 2 or 3, the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the package includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to one two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, and a second external power supply terminal connected to the other two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; A difference in length between each of four electrical paths, namely, an electrical path from the first external power supply terminal to one of the first two internal power supply terminals, an electrical path from the first external power supply terminal to the other of the first two internal power supply terminals, an electrical path from the second external power supply terminal to one of the other two internal power supply terminals, and an electrical path from the second external power supply terminal to the other of the other two internal power supply terminals, is 3 mm or less, or a difference in inductance between each of the four electrical paths is 2 nH or less. package.

7. A package including the distance measuring image sensor according to claim 2 or 3, the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the package comprises: a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to the first internal power supply terminal, a second external power supply terminal connected to the second internal power supply terminal, a third external power supply terminal connected to the third internal power supply terminal, and a fourth external power supply terminal connected to the fourth internal power supply terminal; The difference in length between each of four electrical paths, namely, the electrical path from the first external power supply terminal to the first internal power supply terminal, the electrical path from the second external power supply terminal to the second internal power supply terminal, the electrical path from the third external power supply terminal to the third internal power supply terminal, and the electrical path from the fourth external power supply terminal to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance between each of the four electrical paths is 2 nH or less. package.

8. 4. A module comprising the distance measuring image sensor according to claim 2 or 3 and a mounting board on which the distance measuring image sensor is mounted, the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the mounting board comprises: a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor having one terminal connected to one of two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, and a second bypass capacitor having one terminal connected to the other of the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; A difference in length between each of four electrical paths, namely, an electrical path from the first bypass capacitor to one of the two internal power supply terminals of the one side, an electrical path from the first bypass capacitor to the other of the two internal power supply terminals of the one side, an electrical path from the second bypass capacitor to one of the other of the two internal power supply terminals, and an electrical path from the second bypass capacitor to the other of the other of the two internal power supply terminals, is 3 mm or less, or a difference in inductance between each of the four electrical paths is 2 nH or less. Module.

9. 4. A module comprising the distance measuring image sensor according to claim 2 or 3 and a mounting board on which the distance measuring image sensor is mounted, the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, The mounting board includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor having one terminal connected to the first internal power supply terminal, a second bypass capacitor having one terminal connected to the second internal power supply terminal, a third bypass capacitor having one terminal connected to the third internal power supply terminal, and a fourth bypass capacitor having one terminal connected to the fourth internal power supply terminal. A difference in length between four electrical paths, namely, an electrical path from the first bypass capacitor to the first internal power supply terminal, an electrical path from the second bypass capacitor to the second internal power supply terminal, an electrical path from the third bypass capacitor to the third internal power supply terminal, and an electrical path from the fourth bypass capacitor to the fourth internal power supply terminal, is 3 mm or less, or a difference in inductance between the four electrical paths is 2 nH or less. Module.

10. A package including a distance measuring image sensor for performing distance measurement by an indirect TOF method, The distance measuring image sensor is a pixel array in which a plurality of pixels are arranged in an array, the pixels each having a photoelectric conversion unit that converts received light into an electric charge and a first gate electrode and a second gate electrode that transfer the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal for driving the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal for driving the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply line for supplying a power supply potential to the first driver; a second power supply line for supplying a power supply potential to the second driver; a first ground wiring that supplies a ground potential to the first driver; a second ground wiring that supplies a ground potential to the second driver; the first power supply wiring and the second power supply wiring have a common portion; the first ground wiring and the second ground wiring have a common portion; the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the package includes a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to one two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, and a second external power supply terminal connected to the other two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; A difference in length between each of four electrical paths, namely, an electrical path from the first external power supply terminal to one of the first two internal power supply terminals, an electrical path from the first external power supply terminal to the other of the first two internal power supply terminals, an electrical path from the second external power supply terminal to one of the other two internal power supply terminals, and an electrical path from the second external power supply terminal to the other of the other two internal power supply terminals, is 3 mm or less, or a difference in inductance between each of the four electrical paths is 2 nH or less. package.

11. A package including a distance measuring image sensor for performing distance measurement by an indirect TOF method, The distance measuring image sensor is a pixel array in which a plurality of pixels are arranged in an array, the pixels each having a photoelectric conversion unit that converts received light into an electric charge and a first gate electrode and a second gate electrode that transfer the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal for driving the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal for driving the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply line for supplying a power supply potential to the first driver; a second power supply line for supplying a power supply potential to the second driver; a first ground wiring that supplies a ground potential to the first driver; a second ground wiring that supplies a ground potential to the second driver; the first power supply wiring and the second power supply wiring have a common portion; the first ground wiring and the second ground wiring have a common portion; the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the package comprises: a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first external power supply terminal connected to the first internal power supply terminal, a second external power supply terminal connected to the second internal power supply terminal, a third external power supply terminal connected to the third internal power supply terminal, and a fourth external power supply terminal connected to the fourth internal power supply terminal; The difference in length between each of four electrical paths, namely, the electrical path from the first external power supply terminal to the first internal power supply terminal, the electrical path from the second external power supply terminal to the second internal power supply terminal, the electrical path from the third external power supply terminal to the third internal power supply terminal, and the electrical path from the fourth external power supply terminal to the fourth internal power supply terminal, is 3 mm or less, or the difference in inductance between each of the four electrical paths is 2 nH or less. package.

12. A module including a distance measuring image sensor for performing distance measurement by an indirect TOF method, and a mounting board on which the distance measuring image sensor is mounted, The distance measuring image sensor is a pixel array in which a plurality of pixels are arranged in an array, the pixels each having a photoelectric conversion unit that converts received light into an electric charge and a first gate electrode and a second gate electrode that transfer the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal for driving the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal for driving the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply line for supplying a power supply potential to the first driver; a second power supply line for supplying a power supply potential to the second driver; a first ground wiring that supplies a ground potential to the first driver; a second ground wiring that supplies a ground potential to the second driver; the first power supply wiring and the second power supply wiring have a common portion; the first ground wiring and the second ground wiring have a common portion; the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the mounting board comprises: a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor having one terminal connected to one of two internal power supply terminals among the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal, and a second bypass capacitor having one terminal connected to the other of the first internal power supply terminal, the second internal power supply terminal, the third internal power supply terminal, and the fourth internal power supply terminal; A difference in length between each of four electrical paths, namely, an electrical path from the first bypass capacitor to one of the two internal power supply terminals of the one side, an electrical path from the first bypass capacitor to the other of the two internal power supply terminals of the one side, an electrical path from the second bypass capacitor to one of the other of the two internal power supply terminals, and an electrical path from the second bypass capacitor to the other of the other of the two internal power supply terminals, is 3 mm or less, or a difference in inductance between each of the four electrical paths is 2 nH or less. Module.

13. A module including a distance measuring image sensor for performing distance measurement by an indirect TOF method, and a mounting board on which the distance measuring image sensor is mounted, The distance measuring image sensor is a pixel array in which a plurality of pixels are arranged in an array, the pixels each having a photoelectric conversion unit that converts received light into an electric charge and a first gate electrode and a second gate electrode that transfer the electric charge generated by the photoelectric conversion unit; a control signal output circuit that outputs a first control signal that controls the first gate electrodes of the plurality of pixels and a second control signal that controls the second gate electrodes of the plurality of pixels; a first driver that outputs a first drive signal for driving the first gate electrodes of the plurality of pixels based on the first control signal; a second driver that outputs a second drive signal for driving the second gate electrodes of the plurality of pixels based on the second control signal; a first power supply line for supplying a power supply potential to the first driver; a second power supply line for supplying a power supply potential to the second driver; a first ground wiring that supplies a ground potential to the first driver; a second ground wiring that supplies a ground potential to the second driver; the first power supply wiring and the second power supply wiring have a common portion; the first ground wiring and the second ground wiring have a common portion; the first driver is composed of a first driving element and a second driving element that are arranged at positions facing each other across the pixel array in a first direction when viewed in a plan view of the distance measurement image sensor, the distance measuring image sensor includes a first power supply terminal and a second power supply terminal for supplying a power supply potential to the first driving element, a third power supply terminal and a fourth power supply terminal for supplying a power supply potential to the second driving element, a first ground terminal and a second ground terminal for supplying a ground potential to the first driving element, and a third ground terminal and a fourth ground terminal for supplying a ground potential to the second driving element; the first power supply terminal and the second power supply terminal are disposed at positions facing each other across the first driving element in a second direction perpendicular to the first direction in a plan view of the distance measuring image sensor, the third power supply terminal and the fourth power supply terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the first ground terminal and the second ground terminal are disposed at positions facing each other across the first driving element in the second direction in a plan view of the distance measuring image sensor, the third ground terminal and the fourth ground terminal are disposed at positions facing each other across the second driving element in the second direction in a plan view of the distance measurement image sensor, the mounting board comprises: a first internal power supply terminal connected to the first power supply terminal, a second internal power supply terminal connected to the second power supply terminal, a third internal power supply terminal connected to the third power supply terminal, a fourth internal power supply terminal connected to the fourth power supply terminal, a first bypass capacitor having one terminal connected to the first internal power supply terminal, a second bypass capacitor having one terminal connected to the second internal power supply terminal, a third bypass capacitor having one terminal connected to the third internal power supply terminal, and a fourth bypass capacitor having one terminal connected to the fourth internal power supply terminal; A difference in length between four electrical paths, namely, an electrical path from the first bypass capacitor to the first internal power supply terminal, an electrical path from the second bypass capacitor to the second internal power supply terminal, an electrical path from the third bypass capacitor to the third internal power supply terminal, and an electrical path from the fourth bypass capacitor to the fourth internal power supply terminal, is 3 mm or less, or a difference in inductance between the four electrical paths is 2 nH or less. Module.

14. 14. A distance measuring imaging device comprising: the distance measuring image sensor according to claim 2 or 3; the package according to claim 10 or 11; or the module according to claim 12 or 13.

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