Surface-modifier resin composition

Abstract

A surface-modifier resin composition which is for use in a process comprising a step in which the surface-modifier resin composition is adhered to a surface of a structure including a first region, which is made of a cured epoxy resin composition, and a step in which the surface-modifier resin composition is thereafter removed from the surface to thereby modify the surface, the surface-modifier resin composition including a phenoxy resin.

Description

Resin composition for surface modification

[0001] The present invention relates to a resin composition for surface modifiers.

[0002] In recent years, there has been an increasing trend in the demand for smaller, lighter, and more functional electronic devices. Accordingly, semiconductor packages mounted on electronic devices are also required to be smaller and more dense. As a technology for realizing semiconductor packages that meet these demands, many proposals have been made in recent years regarding fan-out wafer-level packages (hereinafter referred to as "fan-out WLPs") that can provide a rewiring area larger than the chip size (see, for example, Patent Document 1).

[0003] Furthermore, in a typical conventional manufacturing process for fan-out WLP, a structure in which a plurality of semiconductor chips are embedded inside an encapsulant is produced, and then an insulating resin film is formed by applying a varnish-like resin composition to a surface area of ​​the structure on the side where connection terminals provided on the semiconductor chips are arranged (see Patent Document 1, etc.).

[0004] Furthermore, with regard to the above-mentioned encapsulating material, many proposals have been made regarding encapsulating compositions that can produce cured products that are less likely to warp during molding, with the aim of improving the handleability of intermediate products in the manufacturing process of fan-out type WLPs and thereby improving the manufacturing efficiency of fan-out type WLPs (Patent Document 2, etc.).

[0005] JP 2014-236095 A International Publication No. 2020 / 255749

[0006] A fan-out WLP obtained by a conventional manufacturing process is, for example, a structure in which a semiconductor chip is encapsulated with a resin composition such as an epoxy resin encapsulant, i.e., a structure including a cured epoxy resin, and an insulating resin film formed on the structure. The present inventors have studied the fan-out WLP obtained by the above conventional manufacturing process and found that the quality of the insulating resin film significantly affects the reliability of the fan-out WLP.

[0007] In conventional manufacturing processes, as described above, a resin varnish, which is the raw material for the insulating resin film, is applied to the surface of a structure, and then the solvent contained in the resin varnish is dried and the raw material is cured to form the insulating resin film. The inventors have confirmed that this process does not achieve an ideal state in which the structure surface is sufficiently wetted with the resin varnish, and in particularly extreme cases, the resin varnish is repelled by the structure surface, resulting in a state in which the resin varnish is not sufficiently applied to the structure surface. From the above, the inventors have discovered that improving the film quality of the insulating resin film formed on the sealing structure is important in order to improve the reliability of fan-out WLP.

[0008] In view of the above, an object of the present invention is to improve the reliability of treatment performed on the surface of a structure containing an epoxy resin cured body. More specifically, an object of the present invention is to improve the quality of an insulating resin film when a treatment for forming an insulating resin film is performed in contact with the surface.

[0009] The present inventors have completed the invention provided below and solved the above problems.

[0010] [1] The resin composition for a surface modifier used in a process comprising: a step of adhering a resin composition for a surface modifier to the surface of a structure including a first region formed from a cured product of an epoxy resin composition; and a step of subsequently modifying the surface by removing the resin composition for a surface modifier from the surface, wherein the resin composition for a surface modifier comprises a phenoxy resin. [2] The resin composition for a surface modifier according to [1] above, wherein the phenoxy resin comprises one or more selected from the group consisting of phenoxy resins having a bisphenol A skeleton, phenoxy resins having a bisphenol F skeleton, and phenoxy resins having a bisphenol A skeleton and a bisphenol F skeleton. [3] The resin composition for a surface modifier according to [1] or [2] above, wherein the phenoxy resin has a weight average molecular weight Mw of 2,500 or more and 120,000 or less. [4] The resin composition for surface modifiers according to any one of [1] to [3] above, further comprising an epoxy resin. [5] The resin composition for surface modifiers according to [4] above, wherein the epoxy resin comprises a tri- or higher functional epoxy resin. [6] The resin composition for surface modifiers according to [5] above, wherein the epoxy resin comprises one or more epoxy resins selected from the group consisting of phenol novolac epoxy resins and cresol novolac epoxy resins. [7] The resin composition for surface modifiers according to any one of [1] to [6] above, further comprising a surfactant. [8] The resin composition for surface modifiers according to any one of [1] to [7] above, further comprising a solvent. [9] The resin composition for surface modifiers according to any one of the above [1] to [8], wherein the cured product of the epoxy resin composition further contains an inorganic filler.

[10] The resin composition for surface modifiers according to any one of [1] to [9] above, wherein the process further comprises a step of adhering to the surface-modified surface a photosensitive resin composition containing one or more resins selected from the group consisting of a polybenzoxazole resin or its precursor, and a polyimide resin or its precursor.

[11] The resin composition for surface modifiers according to

[10] above, wherein the resin composition for surface modifiers has a contact angle θ1 of the first region with the photosensitive resin composition before the step of adhering the resin composition for surface modifiers, and a contact angle θ2 of the first region with the photosensitive resin composition after the step of removing the resin composition for surface modifiers, such that θ1 > θ2.

[12] The resin composition for surface modifiers according to any one of [1] to

[11] above, wherein the surface comprises a second region formed by metal wiring.

[13] The resin composition for a surface modifier according to

[12] above, wherein, when the contact angle of the second region with the photosensitive resin composition before the step of adhering the resin composition for a surface modifier is θ1 and the contact angle of the second region with the photosensitive resin composition after the step of removing the resin composition for a surface modifier is θ2, θ1 < θ2.

[14] The resin composition for a surface modifier according to any one of [1] to

[13] above, wherein the resin composition for a surface modifier is non-photosensitive.

[15] The resin composition for a surface modifier according to any one of [1] to

[14] above, wherein the resin composition for a surface modifier is substantially free of a photosensitizer.

[16] The resin composition for a surface modifier according to any one of [1] to

[15] above, wherein the resin composition for a surface modifier is substantially free of a curing agent.

[17] The resin composition for surface modifiers according to any one of the above [4] to [6], wherein (amount of the epoxy resin / amount of the phenoxy resin) is, by mass, 1 to 10.

[18] The resin composition for surface modifiers according to any one of the above [1] to

[17] , wherein the resin composition for surface modifiers is used in the manufacture of electronic devices.

[0011] According to the present invention, there is provided a resin composition for surface modifiers that can improve the wettability of the surface of a structure and improve the reliability of treatments performed on the surface of a structure that includes a cured product of an epoxy resin composition.

[0012] 1 is a vertical cross-sectional view showing an example of the configuration of an electronic device according to an embodiment of the present invention.

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, similar components are given similar reference numerals, and descriptions thereof will be omitted as appropriate. To avoid complexity, (i) when multiple identical components appear in the same drawing, only one of the components may be given a reference numeral, and not all of the components may be given a reference numeral. All drawings are for illustrative purposes only. The shapes and dimensional ratios of each component in the drawings do not necessarily correspond to actual objects.

[0014] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0015] In the description of groups (atomic groups) in this specification, when a notation does not specify whether the group is substituted or unsubstituted, it encompasses both those that have no substituents and those that have a substituent. For example, the term "alkyl group" encompasses not only alkyl groups that have no substituents (unsubstituted alkyl groups) but also alkyl groups that have a substituent (substituted alkyl groups). The term "(meth)acrylic" in this specification represents a concept that encompasses both acrylic and methacrylic. The same applies to similar notations such as "(meth)acrylate." In this specification, the term "organic group" refers to an atomic group obtained by removing one or more hydrogen atoms from an organic compound, unless otherwise specified. For example, a "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound.

[0016] <Resin composition for surface modifier> The resin composition for surface modifier of this embodiment is a resin composition for surface modifier used in a process including a step of adhering the resin composition for surface modifier to the surface of a structure including a first region formed by a cured product of an epoxy resin composition, and a step of subsequently modifying the surface by removing the resin composition for surface modifier from the surface, and the resin composition for surface modifier contains a phenoxy resin.

[0017] By using the resin composition for surface modifiers of this embodiment, the reliability of treatment performed on the surface of a structure containing a cured product of the epoxy resin composition can be improved. In particular, when a treatment for forming an insulating resin film is performed in contact with the surface, the quality of the insulating resin film can be improved. The reason for this is not necessarily clear, but is presumed to be as follows.

[0018] The resin composition for surface modifiers of this embodiment contains a phenoxy resin. Phenoxy resins have an epoxy resin skeleton and numerous hydroxyl groups (—OH) within the molecule. Therefore, when the resin composition for surface modifiers is removed from the surface of a structure containing a cured product of the epoxy resin composition, it is believed that a trace amount of the phenoxy resin remains tightly bound to the surface.

[0019] Although the resin composition for surface modifiers of this embodiment is thoroughly removed from the surface by washing with a solvent, it is believed that a trace amount of phenoxy resin, so small that it cannot be seen with the naked eye, remains in a strongly adsorbed state due to its interaction with the surface. This changes the properties of the surface, and it is believed that the reliability of subsequent treatments performed on the surface, such as the formation of an insulating resin film, is improved. By treating with the resin composition for surface modifiers of this embodiment, the insulating resin film formed on the surface is free of microvoids and adheres well to the interface with the surface, and its quality is thought to be significantly improved.

[0020] For the above reasons, the resin composition for surface modifiers of this embodiment is used in a process including a step of adhering the resin composition for surface modifiers to the surface of a structure including a first region formed from a cured product of an epoxy resin composition, and a step of subsequently modifying the surface by removing the resin composition for surface modifiers from the surface. As a result, coating unevenness when applied to the surface of the structure can be suppressed, and the quality of the insulating resin film can be improved when a process for forming an insulating resin film is performed in contact with the surface. The resin composition for surface modifiers of this embodiment is preferably applied to the manufacture of electronic devices such as semiconductor devices. In other words, the structure can be a component used in the manufacture of electronic devices such as semiconductor devices. Furthermore, each of the above processes can be part of a manufacturing process for electronic devices such as semiconductor devices.

[0021] Here, "adhere" means that the resin composition for surface modifier of this embodiment comes into contact with the surface, and any known method can be used as the means for this. Examples of known methods include table coating, spin coating, dip coating, die coating, spray coating, bar coating, roll coating, curtain flow coating, slit coating, inkjet coating, and dispensing. These are appropriately selected taking into consideration the shape and size of the structure, productivity, and the like.

[0022] The resin composition for surface modifiers according to this embodiment will be described in more detail below.

[0023] (Phenoxy Resin) The resin composition for surface modifiers of this embodiment contains a phenoxy resin. This improves the wettability of the structure surface when the surface of the structure is modified with the resin composition for surface modifiers, and improves the quality of the insulating resin film when a process for forming an insulating resin film in contact with the surface is performed. In a narrow sense, phenoxy resin is a polyhydroxy polyether synthesized from bisphenols and epichlorohydrin. In this specification, however, the term "phenoxy resin" also includes a polymer (phenoxy resin in a broad sense) obtained by polyaddition reaction of a multifunctional epoxy resin (e.g., a bisepoxy compound) with a multifunctional phenol.

[0024] Examples of phenoxy resins include phenoxy resins containing a bisphenol A skeleton, phenoxy resins containing a bisphenol F skeleton, phenoxy resins containing a bisphenol A skeleton and a bisphenol F skeleton, biphenyl-type phenoxy resins, phenoxy resins containing a bisphenol S skeleton, and phenoxy resins containing a biphenyl-type phenoxy resin and a bisphenol S skeleton. Among these, it is preferable to use one or more types selected from the group consisting of phenoxy resins containing a bisphenol A skeleton, phenoxy resins containing a bisphenol F skeleton, and phenoxy resins containing a bisphenol A skeleton and a bisphenol F skeleton. In this case, these may be used alone or in combination of two or more types.

[0025] Furthermore, the phenoxy resin preferably has reactive groups such as epoxy groups at both ends of the molecular chain or within the molecular chain. The reactive groups in the phenoxy resin are capable of crosslinking with the epoxy groups in the epoxy resin. The use of such a phenoxy resin improves the solubility in solvents, improves the wetting and spreading properties when the resin composition for surface modifiers of the present embodiment is applied to the surface of a structure, and more suitably improves the wettability of the surface of the structure after the surface modification treatment of the structure.

[0026] The weight average molecular weight Mw of the phenoxy resin is preferably 2,500 or more and 120,000 or less. Furthermore, the lower limit of the weight average molecular weight Mw of the phenoxy resin is preferably 2,500 or more, more preferably 2,750 or more, and particularly preferably 3,000 or more. By having the weight average molecular weight Mw of the phenoxy resin be equal to or greater than the above lower limit, the wettability of the structure surface after the surface modification treatment of the structure can be more suitably improved. Furthermore, the upper limit of the weight average molecular weight Mw of the phenoxy resin is preferably 120,000 or less, more preferably 80,000 or less, and particularly preferably 60,000 or less. By having the weight average molecular weight Mw of the phenoxy resin be equal to or less than the above upper limit, the wetting and spreading properties during the surface modification treatment are improved, and the workability of the surface modification treatment can be improved. Furthermore, since the content of the phenoxy resin in the resin composition for surface modifiers of this embodiment is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, it is possible to obtain a resin composition for surface modifiers that has an excellent balance between the wettability of the structure surface after the surface modification treatment and the workability of the surface modification treatment.

[0027] The weight average molecular weight Mw of the phenoxy resin is determined, for example, from a calibration curve of standard polystyrene (PS) obtained by GPC measurement, and is expressed in terms of polystyrene. The measurement conditions are, for example, as follows: Gel permeation chromatography apparatus HLC-8320GPC manufactured by Tosoh Corporation; Column: TSK-GEL Supermultipore HZ-M manufactured by Tosoh Corporation; Detector: RI detector for liquid chromatography; Measurement temperature: 40°C; Solvent: THF; Sample concentration: 2.0 mg / ml

[0028] The lower limit of the content of the phenoxy resin in the resin composition for surface modifiers of this embodiment is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and even more preferably 15 parts by mass or more, when the content of the total solids in the resin composition for surface modifiers of this embodiment is 100 parts by mass. By having the phenoxy resin content be equal to or greater than the above lower limit, the wettability of the structure surface after the surface modification treatment of the structure can be more suitably improved. Furthermore, the upper limit of the content of the phenoxy resin in the resin composition for surface modifiers of this embodiment is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, and even more preferably 40 parts by mass or less, when the content of the total solids in the resin composition for surface modifiers of this embodiment is 100 parts by mass. By having the phenoxy resin content be equal to or less than the above upper limit, the wetting and spreading properties during the surface modification treatment can be improved, thereby improving the workability of the surface modification treatment. Furthermore, since the content of the phenoxy resin in the resin composition for surface modifiers of this embodiment is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, it is possible to obtain a resin composition for surface modifiers that has an excellent balance between the wettability of the structure surface after the surface modification treatment and the workability of the surface modification treatment.

[0029] (Epoxy Resin) The resin composition for surface modifier of this embodiment preferably further contains an epoxy resin, which improves the solvent solubility of the phenoxy resin, improves the wettability and spreadability of the resin composition for surface modifier of this embodiment when it is applied to the surface of a structure, and more suitably improves the wettability of the surface of the structure after the surface modification treatment of the structure.

[0030] The epoxy resin in the resin composition for surface modifiers of this embodiment can be, for example, an epoxy resin having two or more epoxy groups per molecule. The epoxy resin can be a monomer, oligomer, or polymer, and its molecular weight and molecular structure are not particularly limited. Examples of the epoxy resin include phenol novolac epoxy resins, cresol novolac epoxy resins, cresol naphthol epoxy resins, biphenyl epoxy resins, biphenyl aralkyl epoxy resins, phenoxy resins, naphthalene skeleton epoxy resins, bisphenol A epoxy resins, bisphenol A diglycidyl ether epoxy resins, bisphenol F epoxy resins, bisphenol F diglycidyl ether epoxy resins, bisphenol S diglycidyl ether epoxy resins, glycidyl ether epoxy resins, cresol novolac epoxy resins, aromatic polyfunctional epoxy resins, aliphatic epoxy resins, aliphatic polyfunctional epoxy resins, alicyclic epoxy resins, and polyfunctional alicyclic epoxy resins. The epoxy resins can be used alone or in combination.

[0031] The epoxy resin in the resin composition for surface modifier of this embodiment preferably contains a polyfunctional epoxy resin having three or more functional groups in the molecule (i.e., a polyfunctional epoxy resin having three or more epoxy groups in one molecule), which improves compatibility with the phenoxy resin and more suitably improves the wettability of the surface of the structure after the surface modification treatment of the structure.

[0032] The tri- or higher functional polyfunctional epoxy resin preferably contains one or more epoxy resins selected from the group consisting of phenol novolac epoxy resins, cresol novolac epoxy resins, triphenylmethane epoxy resins, dicyclopentadiene epoxy resins, bisphenol A epoxy resins, and tetramethylbisphenol F epoxy resins, and more preferably contains one or more selected from the group consisting of phenol novolac epoxy resins and cresol novolac epoxy resins. This improves compatibility with the phenoxy resin and more suitably improves the wettability of the surface of the structure after the surface modification treatment of the structure.

[0033] The weight average molecular weight (Mw) of the epoxy resin is not particularly limited, but is, for example, preferably 300 to 3000, more preferably 300 to 2000, and even more preferably 300 to 1000. By using an epoxy resin with a relatively low molecular weight, compatibility with the phenoxy resin is improved, and the wettability of the surface of the structure can be more suitably improved after the surface modification treatment of the structure.

[0034] The resin composition for surface modifiers of this embodiment may contain other thermosetting resins besides the above-mentioned epoxy resin. Examples of other thermosetting resins include resins having a triazine ring, such as urea resins and melamine resins; unsaturated polyester resins; maleimide resins such as bismaleimide compounds; polyurethane resins; diallyl phthalate resins; silicone-based resins; benzoxazine resins; polyimide resins; polyamide-imide resins; cyanate ester resins such as benzocyclobutene resins, novolac cyanate resins, bisphenol A cyanate resins, bisphenol E cyanate resins, and tetramethylbisphenol F cyanate resins. These may be used alone or in combination of two or more.

[0035] (Surfactant) The resin composition for surface modifier of this embodiment preferably contains a surfactant. This improves the adhesion of the resin composition for surface modifier, and more effectively exhibits the surface modification effect of the structure. Examples of surfactants include fluorine-based surfactants, silicone-based surfactants, alkyl-based surfactants, and acrylic-based surfactants. From another perspective, the surfactant is preferably nonionic. The use of a nonionic surfactant is preferable, for example, in terms of suppressing unintentional reactions with other components in the composition and improving the storage stability of the composition.

[0036] The surfactant preferably contains a surfactant containing at least one of a fluorine atom and a silicon atom. This improves the coatability of the resin composition for surface modifiers and more effectively exhibits the surface modification effect of the structure. Such surfactants are preferably, for example, nonionic surfactants containing at least one of a fluorine atom and a silicon atom. Commercially available surfactants that can be used include, for example, the "Megafac" series manufactured by DIC Corporation, including F-251, F-253, F-281, F-430, F-477, F-551, F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F-565, F-568, F-569, and F-5 fluorine-containing oligomer surfactants such as F-70, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, R-94, and FC4430 and FC4432 manufactured by 3M; fluorine-containing nonionic surfactants such as Ftergent 250 and Ftergent 251 manufactured by Neos Corporation; and silicone surfactants such as the SILFOAM (registered trademark) series manufactured by Wacker Chemie (e.g., SD 100 TS, SD 670, SD 850, SD 860, SD 882) and BYK-333, BYK-349, BYK-313, and BYK-323 manufactured by BYK-Chemie. Other preferred surfactants include FC4430 and FC4432 manufactured by 3M, and BYK-333 manufactured by BYK-Chemie.

[0037] When the resin composition for surface modifiers of this embodiment contains a surfactant, it may contain one or more surfactants. When the resin composition for surface modifiers of this embodiment contains a surfactant, the lower limit of the content is preferably 0.001 parts by mass or more, more preferably 0.005 parts by mass or more, relative to 100 parts by mass of the phenoxy resin in the resin composition for surface modifiers of this embodiment. When the content of the surfactant is equal to or greater than the above lower limit, the adhesion of the resin composition for surface modifiers can be improved. Furthermore, the upper limit of the content of the surfactant in this embodiment is preferably 1 part by mass or less, more preferably 0.5 parts by mass or less. When the content of the surfactant is equal to or less than the above upper limit, the wettability of the structure surface can be more suitably improved after the surface modification treatment of the structure.

[0038] (Solvent / Properties of Composition) The resin composition for surface modifier of this embodiment preferably contains a solvent. This improves the adhesion of the resin composition for surface modifier to the surface of a structure, making it easy to modify the surface of the structure. The solvent usually contains an organic solvent. There are no particular restrictions on the organic solvent, as long as it can dissolve or disperse each of the above-mentioned components and does not substantially chemically react with each of the constituent components.

[0039] Examples of organic solvents include acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, benzyl alcohol, propylene carbonate, ethylene glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl-n-propyl ether, butyl acetate, γ-butyrolactone, methyl lactate, ethyl lactate, butyl lactate, etc. These may be used alone or in combination.

[0040] When the resin composition for surface modifier of this embodiment contains a solvent, the resin composition for surface modifier of this embodiment is usually in a varnish state. More specifically, the resin composition for surface modifier of this embodiment is preferably a varnish-like composition in which at least a phenoxy resin and an epoxy resin are dissolved in a solvent. Since the resin composition for surface modifier of this embodiment is in a varnish state, it can be easily attached to the surface of a structure.

[0041] When a solvent is used, the concentration of total solids (non-volatile components) in the resin composition for surface modifiers is preferably 10 to 50% by mass, more preferably 20 to 45% by mass. This range allows for sufficient dissolution or dispersion of each component. Furthermore, adjusting the content of non-volatile components allows for appropriate control of the viscosity of the resin composition for surface modifiers. From another perspective, the proportion of phenoxy resin and epoxy resin in the entire resin composition for surface modifiers is preferably 20 to 50% by mass. Using a relatively large amount of phenoxy resin and epoxy resin facilitates surface modification of structures. Furthermore, when the resin composition for surface modifiers contains an epoxy resin, the ratio (amount of epoxy resin / amount of phenoxy resin) is preferably 1 to 10, more preferably 1.5 to 8, and even more preferably 2 to 5, by mass. Using a phenoxy resin and an epoxy resin in combination in such a ratio maximizes the effects of each resin and further enhances the synergistic effect of using two types of resins in combination.

[0042] (Other Components) In addition to the above components, the resin composition for surface modifiers of this embodiment may contain components other than the above-listed components, as necessary. Examples of such components include fillers such as water and silica, sensitizers, and film-forming agents. Incidentally, in consideration of the intended use, the resin composition for surface modifiers of this embodiment is usually non-photosensitive. In other words, the resin composition for surface modifiers of this embodiment does not substantially contain a photosensitizer (for example, 1% by mass or less of the total non-volatile components). In addition, in consideration of the intended use, the resin composition for surface modifiers of this embodiment usually does not substantially contain a curing agent (for example, 1% by mass or less of the total non-volatile components).

[0043] <Structure> The structure to which the resin composition for surface modifier of this embodiment is attached includes a first region formed on the surface by a cured product of the epoxy resin composition. In other words, the resin composition for surface modifier of this embodiment is used for adhering to the surface of the structure including the first region formed by a cured product of the epoxy resin composition.

[0044] Hereinafter, each component contained in the epoxy resin composition that forms the first region will be described.

[0045] [First Region] (Epoxy Resin) Examples of epoxy resins that can be used in the epoxy resin composition of the present embodiment include known epoxy resins that are generally used in encapsulating epoxy resin compositions. Known epoxy resins include epoxidized novolac resins obtained by condensing or co-condensing phenols such as phenol novolac epoxy resins and orthocresol novolac epoxy resins, and phenols such as cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F, and / or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene with compounds having an aldehyde group such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde, under an acidic catalyst; diglycidyl ethers of bisphenol A, bisphenol F, bisphenol S, and bisphenol A / D; biphenyl epoxy resins, which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; phenol aralkyl resins synthesized from phenols and dimethoxyparaxylene or bis(methoxymethyl)biphenyl, and biphenyl aralkyl resins synthesized from phenols and dimethoxyparaxylene or bis(methoxymethyl)biphenyl. glycidyl ester type epoxy resins obtained by reacting epichlorohydrin with polybasic acids such as phthalic acid and dimer acid; glycidylamine type epoxy resins obtained by reacting epichlorohydrin with polyamines such as diaminodiphenylmethane and isocyanuric acid; dicyclopentadiene type epoxy resins which are epoxidized products of co-condensation resins of dicyclopentadiene and phenols; triphenolmethane type epoxy resins, trimethylolpropane type epoxy resins; terpene-modified epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; alicyclic epoxy resins; and epoxy resins obtained by modifying these epoxy resins with silicone, acrylonitrile, butadiene, isoprene-based rubber, polyamide-based resin, or the like.

[0046] The total epoxy resin content in the epoxy resin composition in this embodiment is preferably 5% by mass or more, more preferably 6% by mass or more, and even more preferably 7% by mass or more, based on the total epoxy resin composition. Furthermore, for a structure obtained using the epoxy resin composition, the total epoxy resin content in the epoxy resin composition is preferably 15% by mass or less, more preferably 14% by mass or less, and even more preferably 13% by mass or less, based on the total epoxy resin composition.

[0047] In the present embodiment, the epoxy equivalent of all epoxy resins in the epoxy resin composition is preferably 100 g / eq or more, more preferably 120 g / eq or more, and even more preferably 150 g / eq or more. Furthermore, from the viewpoint of improving the high-temperature reliability and reflow resistance of a structure obtained using the epoxy resin composition, the epoxy equivalent of all epoxy resins in the epoxy resin composition is preferably 500 g / eq or less, more preferably 480 g / eq or less, and even more preferably 450 g / eq or less.

[0048] (Curing Agent) Examples of curing agents that can be used in the epoxy resin composition of the present embodiment include known curing agents that are generally used in encapsulating epoxy resin compositions. Specific examples of known curing agents include phenol-based curing agents and amine-based curing agents (curing agents having an amino group).

[0049] Examples of phenolic curing agents include novolak-type phenolic resins obtained by condensing or co-condensing phenols such as phenol, cresol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and / or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with compounds having an aldehyde group such as formaldehyde, benzaldehyde, and salicylaldehyde, under an acidic catalyst; polyfunctional phenolic resins such as triphenylmethane-type phenolic resins and biphenylene skeleton-containing polyfunctional phenolic resins; phenol aralkyl-type phenolic resins such as biphenylene skeleton-containing polyfunctional phenolic resins synthesized from phenols and / or naphthols and dimethoxyparaxylene or bis(methoxymethyl)biphenyl; dicyclopentadiene-type phenolic resins; and terpene-modified phenolic resins.

[0050] Examples of the amine curing agent include linear aliphatic diamines having 2 to 20 carbon atoms, such as ethylenediamine, trimethylenediamine, tetramethylenediamine, and hexamethylenediamine, metaphenylenediamine, paraphenylenediamine, paraxylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, metaxylenediamine, paraxylenediamine, 1,1-bis(4-aminophenyl)cyclohexane, and dicyanodiamide.

[0051] Other curing agents include polyoxystyrenes such as polyparaoxystyrene; acid anhydrides including alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), and aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA); polymercaptan compounds such as polysulfide, thioester, and thioether; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; and organic acids such as carboxylic acid-containing polyester resins.

[0052] Among these, from the viewpoint of the adhesion and high-temperature reliability of the structure in this embodiment, it is preferable to include one or two of a polyfunctional phenolic resin and a phenol aralkyl phenolic resin, and it is more preferable to include a triphenylmethane phenolic resin or a biphenylene skeleton-containing polyfunctional phenolic resin. These may be used alone or in combination of two or more.

[0053] In the present embodiment, the content of the curing agent in the epoxy resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 3% by mass or more, based on the total epoxy resin composition, from the viewpoints of realizing excellent fluidity and improving filling property and adhesion during molding. Furthermore, from the viewpoints of improving high-temperature reliability and reflow resistance of a structure obtained using the epoxy resin composition, the content of the curing agent in the epoxy resin composition is preferably 25% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, based on the total epoxy resin composition.

[0054] (Inorganic Filler) The inorganic filler has the function of reducing the increase in moisture absorption and the decrease in strength that accompany the curing of the resin composition, and any inorganic filler that is generally used in the relevant field can be used.

[0055] Examples of inorganic fillers include fused silica, spherical silica, crystalline silica, alumina, silicon nitride, and aluminum nitride, and these inorganic fillers may be used alone or in combination.

[0056] Average particle size D of inorganic filler ５０ can be set to, for example, 0.01 μm or more and 150 μm or less.

[0057] The lower limit of the amount of inorganic filler in the epoxy resin composition is preferably 60% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more, based on the total mass of the epoxy resin composition. When the lower limit is within the above range, the increase in moisture absorption and the decrease in strength that accompany curing of the resulting epoxy resin composition can be more effectively reduced, and therefore the solder crack resistance of the cured product can be further improved.

[0058] The upper limit of the amount of inorganic filler in the epoxy resin composition is preferably 93% by mass or less, more preferably 91% by mass or less, and even more preferably 90% by mass or less, based on the total mass of the epoxy resin composition. When the upper limit is within the above range, the obtained epoxy resin composition has good fluidity and good moldability.

[0059] When inorganic flame retardants such as metal hydroxides such as aluminum hydroxide and magnesium hydroxide, zinc borate, zinc molybdate, and antimony trioxide are used, it is preferable that the total amount of these inorganic flame retardants and the inorganic filler be within the above range.

[0060] (Other Components) The epoxy resin composition of the present embodiment may contain the following components in addition to the curing agent, epoxy resin, and inorganic filler.

[0061] (Curing Accelerator) The curing accelerator has a function of accelerating the reaction between the epoxy group of the epoxy resin and the reactive group of the curing agent, and a curing accelerator generally used in this field can be used.

[0062] Specific examples of the curing accelerator include phosphorus atom-containing compounds such as organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, and adducts of phosphonium compounds and silane compounds; and nitrogen atom-containing compounds such as amidines and tertiary amines, exemplified by 1,8-diazabicyclo(5,4,0)undecene-7, benzyldimethylamine, and 2-methylimidazole, as well as quaternary salts of the above amidines and amines. One or more of these compounds can be used in combination. Of these, phosphorus atom-containing compounds are preferred from the viewpoint of curability, and phosphobetaine compounds and adducts of phosphine compounds and quinone compounds are particularly preferred from the viewpoint of fluidity when molding the structure. Furthermore, phosphorus atom-containing compounds such as tetra-substituted phosphonium compounds and adducts of phosphonium compounds and silane compounds are particularly preferred in terms of mild mold contamination during continuous molding when molding the structure.

[0063] Examples of organic phosphines that can be used in the epoxy resin composition include primary phosphines such as ethylphosphine and phenylphosphine; secondary phosphines such as dimethylphosphine and diphenylphosphine; tertiary phosphines such as trimethylphosphine, triethylphosphine, tributylphosphine and triphenylphosphine; and derivatives thereof.

[0064] (Coupling Agent) The coupling agent has the function of improving the adhesion between the epoxy resin and the inorganic filler when the inorganic filler is contained in the epoxy resin composition, and for example, a silane coupling agent or the like is used.

[0065] Although various silane coupling agents can be used, it is preferable to use aminosilane, which can improve the flowability and solder resistance of the epoxy resin composition.

[0066] The aminosilane is not particularly limited, but examples thereof include γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, N-phenylγ-aminopropyltriethoxysilane, N-phenylγ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, N-6-(aminohexyl)3-aminopropyltrimethoxysilane, and N-(3-(trimethoxysilylpropyl)-1,3-benzenedimethanamine.

[0067] The lower limit of the blending ratio of the coupling agent such as a silane coupling agent is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, and particularly preferably 0.1 mass% or more, based on the total epoxy resin composition. When the lower limit of the blending ratio of the coupling agent such as a silane coupling agent is within the above range, the interfacial strength between the epoxy resin and the inorganic filler is not reduced, and good solder crack resistance can be obtained in electronic devices using a cured product of the epoxy resin composition of this embodiment. Furthermore, the upper limit of the blending ratio of the coupling agent such as a silane coupling agent is preferably 1 mass% or less, more preferably 0.8 mass% or less, and particularly preferably 0.6 mass% or less, based on the total resin composition. When the upper limit of the blending ratio of the coupling agent such as a silane coupling agent is within the above range, the interfacial strength between the epoxy resin and the inorganic filler is not reduced, and good solder crack resistance can be obtained in electronic devices using a cured product of the epoxy resin composition of this embodiment. Furthermore, when the blending ratio of the coupling agent such as the silane coupling agent is within the above range, the water absorption of the cured product of the epoxy resin composition does not increase, and good solder crack resistance can be obtained in an electronic device using the cured product of the epoxy resin composition of the present embodiment.

[0068] (Inorganic Flame Retardant) In the epoxy resin composition of the present embodiment, the inorganic flame retardant has the function of improving the flame retardancy of the epoxy resin composition, and a commonly used inorganic flame retardant is used.

[0069] Specifically, metal hydroxides that inhibit the combustion reaction by dehydrating and absorbing heat during combustion, and composite metal hydroxides that can shorten the combustion time are preferably used.

[0070] Examples of metal hydroxides include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, barium hydroxide, and zirconia hydroxide.

[0071] The composite metal hydroxide is a hydrotalcite compound containing two or more metal elements, in which at least one metal element is magnesium and the other metal elements are selected from calcium, aluminum, tin, titanium, iron, cobalt, nickel, copper, and zinc. As such a composite metal hydroxide, a magnesium-zinc hydroxide solid solution is a commercially available product that is easily available.

[0072] Among these, aluminum hydroxide and magnesium-zinc hydroxide solid solution are preferred from the viewpoint of the balance between adhesion and high-temperature reliability.

[0073] The inorganic flame retardants may be used alone or in combination of two or more. In order to reduce the influence on adhesion, the inorganic flame retardants may be used after surface treatment with a silicon compound such as a silane coupling agent or an aliphatic compound such as wax.

[0074] In the epoxy resin composition of the present embodiment, the inorganic flame retardant may be used as described above, but it is preferable not to use a flame retardant whose weight loss after treatment relative to the initial weight is 0.1% by weight or more, when the inorganic flame retardant is dried at 125°C for 20 hours, cooled in a desiccator, and the weight thereof is defined as the initial weight, and then the inorganic flame retardant is placed in a high-temperature bath at 200°C and heated for 1000 hours, and the weight thereof after cooling in a desiccator is defined as the post-treatment weight. It is even more preferable not to use an inorganic flame retardant, and to compose the epoxy resin composition using only a flame-retardant resin.

[0075] In addition to the other components described above, colorants such as carbon black, red iron oxide, and titanium oxide; ion scavengers; natural waxes such as carnauba wax, synthetic waxes such as polyethylene wax, release agents such as higher fatty acids such as stearic acid and zinc stearate, and metal salts thereof, or paraffin; and low-stress additives such as silicone oil and silicone rubber may also be blended as appropriate.

[0076] The epoxy resin composition of the present embodiment can be obtained by mixing the above-mentioned curing agent and epoxy resin, and, if necessary, the above-mentioned other components, by a method commonly used in the relevant field.

[0077] [Second Region] In addition, the structure to which the resin composition for surface modifier of this embodiment is attached includes the first region on the surface, and preferably the surface includes a second region formed by metal wiring.

[0078] Here, the metal that can be used for the metal wiring that forms the second region can be any known metal that can be used for wiring in electronic devices, such as copper, aluminum, nickel, vanadium, titanium, chromium, cobalt, gold, tungsten, and alloys containing these metals, with copper and aluminum being more preferred, and copper being even more preferred.

[0079] The method for forming the metal wiring is not particularly limited, and existing methods can be applied. For example, the methods described in JP 2007-157879 A, ​​JP 2001-521288 A, JP 2004-214501 A, and JP 2004-101850 A can be used. For example, photolithography, lift-off, electrolytic plating, electroless plating, etching, printing, and combinations of these methods can be considered. More specific examples include a patterning method that combines sputtering, photolithography, and etching, and a patterning method that combines photolithography and electrolytic plating.

[0080] The thickness of the metal wiring is preferably 0.1 μm or more and 50 μm or less, and more preferably 1 μm or more and 10 μm or less, at the thickest part.

[0081] <Method for Manufacturing an Electronic Device> The method for manufacturing an electronic device using the resin composition for surface modifier of this embodiment is a process including the steps of preparing a structure including a first region formed from a cured product of an epoxy resin composition, adhering the resin composition for surface modifier to the surface of the structure, and removing the resin composition for surface modifier from the surface to modify the surface. In other words, the surface of the structure can be modified by applying a surface modification method to the structure, including the steps of preparing a structure including a region formed from a cured product of an epoxy resin composition using the resin composition for surface modifier of this embodiment, adhering the resin composition for surface modifier to the surface of the structure, and removing the resin composition for surface modifier from the surface to modify the surface. This improves the wettability of the structure surface, suppresses coating unevenness when coating the structure surface, and improves the quality of the insulating resin film when a process is performed to form an insulating resin film in contact with the surface.

[0082] Each step in the method for manufacturing an electronic device according to this embodiment will be described in detail below.

[0083] (Step of Preparing a Structure Including a First Region Formed by a Cured Product of an Epoxy Resin Composition) First, a structure including a first region formed by a cured product of an epoxy resin composition is prepared. The structure is not particularly limited, and is formed, for example, by molding an epoxy resin composition so as to encapsulate an electronic component and then curing it. In this embodiment, the epoxy resin composition may be formed, for example, to encapsulate a wiring board together with the electronic component. The cured product of the epoxy resin composition is provided so as to encapsulate one and the other sides of the wiring board and the electronic component mounted on the wiring board. The epoxy resin composition may also be formed, for example, to encapsulate a part or the entire wiring board. In this case, the portion of the surface of the structure where the cured product of the epoxy resin composition is exposed corresponds to the first region. Furthermore, an example is given in which the cured product of the epoxy resin composition is provided so as to encapsulate the entire remaining portion of the wiring board without encapsulating the connection terminals or wiring, so that the connection terminals or wiring are exposed. In this case, the portion of the surface of the structure where the cured product of the epoxy resin composition is exposed corresponds to the first region, and the portion where the connection terminals or wiring are exposed corresponds to the second region.

[0084] (Step of Adhering the Resin Composition for Surface Modifier to the Surface of the Structure) Next, the resin composition for surface modifier is adhered to the surface of the structure. Any known adhesion method can be used for this adhesion. Examples of known adhesion methods include table coating, spin coating, dip coating, die coating, spray coating, bar coating, roll coating, curtain flow coating, slit coating, inkjet coating, and dispensing. These are appropriately selected taking into consideration the shape and size of the structure, productivity, and the like.

[0085] (Step of Removing the Resin Composition for Surface Modifier from the Surface of a Structure to Modify the Surface) Thereafter, the resin composition for surface modifier is removed from the surface of the structure to modify the surface. At this time, any known cleaning method can be used as a method for removing the resin composition for surface modifier from the surface of the structure, and an example of such a method is a cleaning method in which a solvent is sprayed onto the structure. At this time, the solvent is not particularly limited as long as it dissolves the resin composition for surface modifier. Examples of the solvent include ketones such as cyclohexanone, cyclopentanone, and methyl-2-n-amyl ketone; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, and 1-ethoxy-2-propanol; propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, and propylene glycol monomethyl ether. Examples of the ester include ethers such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, propylene glycol-mono-tert-butyl ether acetate, and γ-butyrolactone, and these esters may be used alone or in combination.

[0086] At this time, it is preferable to completely remove the resin composition for surface modifiers from the surface. Here, "completely removed" means, for example, that when a cross-sectional image of the surface of the structure is observed, no layer made of the resin composition for surface modifiers is observed.

[0087] (Step of forming an insulating resin film) The process in the method for producing an electronic device of this embodiment preferably further includes a step of forming an insulating resin film in contact with the modified surface. The insulating resin film in this case may be a photosensitive resin film or a non-photosensitive resin film.

[0088] First Embodiment A first embodiment of the step of forming an insulating resin film in the above process preferably includes, for example, a step of applying a solution containing raw materials for a photosensitive resin film and a solvent, and then drying the solvent to obtain the photosensitive resin film.

[0089] The method for drying the solvent is not particularly limited as long as it can volatilize the solvent from the solution containing the raw materials of the photosensitive resin film and the solvent, and any known method can be used depending on the type of polymer. The drying step can be carried out, for example, under conditions of a temperature of 30° C. to 150° C. and a time of 1 minute to 1 hour.

[0090] In this case, the solution containing the raw materials for the photosensitive resin film and the solvent may be, for example, the following photosensitive resin composition.

[0091] [Photosensitive Resin Composition] The photosensitive resin composition of this embodiment preferably contains one or more selected from the group consisting of a polybenzoxazole resin or its precursor, and a polyimide resin or its precursor. This reduces shrinkage due to curing (heating). In other words, the process in the method for producing an electronic device of this embodiment further includes a step of adhering a photosensitive resin composition containing one or more selected from the group consisting of a polybenzoxazole resin or its precursor, and a polyimide resin or its precursor to the surface that has been modified. The resin composition for surface modifiers of this embodiment is used in applications that further include a step of adhering a photosensitive resin composition containing one or more selected from the group consisting of a polybenzoxazole resin or its precursor, and a polyimide resin or its precursor to the surface that has been modified.

[0092] The polybenzoxazole resin can be obtained by heat treating a precursor polyamide resin to dehydrate and ring-close it.

[0093] Polyimide resins can typically be obtained by (i) first synthesizing a polyamide by reacting (condensation polymerization) a diamine with an acid dianhydride, (ii) then imidizing the polyamide (ring-closing reaction), and (iii) introducing desired functional groups into the polymer terminals as needed.

[0094] Examples of the diamine raw material include 3,4'-diaminodiphenyl ether (3,4'-ODA), 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (TFMB), 3,3',5,5'-tetramethylbenzidine, 2,3,5,6-tetramethyl-1,4-phenylenediamine, 3,3'-diaminodiphenyl sulfone, 3,3'dimethylbenzidine, 3,3'-bis(trifluoromethyl)benzidine, and 2,2'-bis(p-aminophenyl)hexafluoro. Fluoropropane, bis(trifluoromethoxy)benzidine (TFMOB), 2,2'-bis(pentafluoroethoxy)benzidine (TFEOB), 2,2'-trifluoromethyl-4,4'-oxydianiline (OBABTF), 2-phenyl-2-trifluoromethyl-bis(p-aminophenyl)methane, 2-phenyl-2-trifluoromethyl-bis(m-aminophenyl)methane, 2,2'-bis(2-heptafluoroisopropoxy-tetrafluoroethoxy)benzidine Benzene (DFPOB), 2,2-bis(m-aminophenyl)hexafluoropropane (6-FmDA), 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane, 3,6-bis(trifluoromethyl)-1,4-diaminobenzene (2TFMPDA), 1-(3,5-diaminophenyl)-2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentane, 3,5-diaminobenzotrifluoride (3,5-DABTF), 3,5-diaminobenzotrifluoride Examples of suitable diamines include amino-5-(pentafluoroethyl)benzene, 3,5-diamino-5-(heptafluoropropyl)benzene, 2,2'-dimethylbenzidine (DMBZ), 2,2',6,6'-tetramethylbenzidine (TMBZ), 3,6-diamino-9,9-bis(trifluoromethyl)xanthene (6FCAM), 3,6-diamino-9-trifluoromethyl-9-phenylxanthene (3FCAM), and 3,6-diamino-9,9-diphenylxanthene. Of course, usable diamines are not limited to these. One or more types of diamines may be used.

[0095] Examples of the acid dianhydride raw material include pyromellitic anhydride (PMDA), diphenylether-3,3',4,4'-tetracarboxylic dianhydride (ODPA), benzophenone-3,3',4,4'-tetracarboxylic dianhydride (BTDA), biphenyl-3,3',4,4'-tetracarboxylic dianhydride (BPDA), diphenylsulfone-3,3',4,4'-tetracarboxylic dianhydride (DSDA), diphenylmethane-3,3',4,4'-tetracarboxylic dianhydride, 2,2-bis(3,4-phthalic anhydride)propane, and 2,2-bis(3,4-phthalic anhydride)-1,1,1,3,3,3-hexafluoropropane (6FDA). Of course, the acid dianhydrides that can be used are not limited to these. One or more types of acid dianhydrides can be used.

[0096] The molar ratio of diamine to acid dianhydride is basically 1:1. However, to obtain a desired terminal structure, one of them may be used in excess. Specifically, by using an excess of diamine, the terminals (both terminals) of the polyimide resin tend to become amino groups. On the other hand, by using an excess of acid dianhydride, the terminals (both terminals) of the polyimide resin tend to become acid anhydride groups.

[0097] In the photosensitive resin composition of the present embodiment, the amino group and / or acid anhydride group at the terminal of the polyimide resin or its precursor may be reacted with some kind of reagent so that the terminal of the polyimide resin has a desired functional group.

[0098] In this embodiment, the weight-average molecular weight of the polybenzoxazole resin or its precursor, and the polyimide resin or its precursor is, for example, 5,000 to 100,000, preferably 7,000 to 75,000, and more preferably 10,000 to 50,000. A relatively high weight-average molecular weight of the polybenzoxazole resin and polyimide resin can, for example, provide a resin film with sufficient heat resistance. Furthermore, a polyimide resin with a weight-average molecular weight that is not too high can facilitate dissolution of the polybenzoxazole resin or its precursor, and the polyimide resin or its precursor in an organic solvent. The weight-average molecular weight can typically be determined by gel permeation chromatography (GPC) using polystyrene as a standard.

[0099] (Photosensitizer) The photosensitive resin composition of the present embodiment preferably contains a photosensitizer. The photosensitizer is not particularly limited as long as it is capable of generating active species by light and curing the photosensitive resin composition.

[0100] The photosensitizer preferably contains a photoradical generator, which is particularly effective in polymerizing the polyimide resin.

[0101] The photoradical generator that can be used is not particularly limited, and known ones can be used appropriately. For example, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one, 2-methyl-1-(4-methylthiophene), alkylphenone compounds such as 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; benzophenone compounds such as benzophenone, 4,4'-bis(dimethylamino)benzophenone, and 2-carboxybenzophenone; benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl benzoin-based compounds such as benzoin ether and benzoin isobutyl ether; thioxanthone-based compounds such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone and 2,4-diethylthioxanthone; thioxanthone-based compounds such as 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxy ... halomethylated triazine compounds such as 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine; halomethylated oxadiazole compounds such as 2-trichloromethyl-5-(2'-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-benzofuryl)vinyl]-1,3,4-oxadiazole, 4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole;Biimidazole compounds such as 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, and 2,2'-bis(2,4,6-trichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole; 1,2-octanedione, 1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime), ethanone, 1-[9-ethyl-6-(2- Examples of suitable compounds include oxime ester compounds such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)-, 1-(O-acetyloxime); titanocene compounds such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium; acylphosphine compounds such as acylphosphine oxide; benzoate ester compounds such as p-dimethylaminobenzoic acid and p-diethylaminobenzoic acid; and acridine compounds such as 9-phenylacridine.

[0102] The photosensitive resin composition may contain only one type of photosensitizer or two or more types of photosensitizers. The content of the photosensitizer is, for example, 5 parts by mass or more and 30 parts by mass or less, and preferably 10 parts by mass or more and 25 parts by mass or less, per 100 parts by mass of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor.

[0103] (Crosslinking Agent) The photosensitive resin composition of the present embodiment preferably contains a crosslinking agent. By using the crosslinking agent, for example, the crosslinking agent reacts with other components contained in the photosensitive resin composition, or the crosslinking agents polymerize with each other, so that the crosslinking agent becomes closely entangled with the photosensitive resin composition, and it is thought that this improves the chemical resistance and elongation percentage of the resin film.

[0104] The content of the crosslinking agent is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and more preferably 1 part by mass or more, relative to 100 parts by mass of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor. By having the content of the crosslinking agent be 0.1 parts by mass or more, the resin film can have high chemical resistance. Furthermore, the content of the crosslinking agent is, for example, 30 parts by mass or less, preferably 20 parts by mass or less, and more preferably 10 parts by mass or less, relative to 100 parts by mass of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor. By having the content of the crosslinking agent be 30 parts by mass or less, the ratio of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor in the photosensitive resin composition is maintained, the elongation of the resin film is good, and the adhesion between the resin film and the structure is sufficiently improved.

[0105] The photosensitive resin composition of the present embodiment may contain only one type of crosslinking agent, or may contain two or more types of crosslinking agents.

[0106] (Coupling Agent) The photosensitive resin composition of the present embodiment preferably contains a coupling agent, more preferably a silane coupling agent. By using a silane coupling agent, for example, the adhesion between the resin film and the structure can be further improved.

[0107] Examples of the silane coupling agent that can be used include amino group-containing silane coupling agents, epoxy group-containing silane coupling agents, (meth)acryloyl group-containing silane coupling agents, mercapto group-containing silane coupling agents, vinyl group-containing silane coupling agents, ureido group-containing silane coupling agents, sulfide group-containing silane coupling agents, and silane coupling agents having a cyclic anhydride structure.

[0108] Examples of amino group-containing silane coupling agents include bis(2-hydroxyethyl)-3-aminopropyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, etc. Examples of epoxy group-containing silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidylpropyltrimethoxysilane, etc. Examples of (meth)acryloyl group-containing silane coupling agents include γ-((meth)acryloyloxypropyl)trimethoxysilane, γ-((meth)acryloyloxypropyl)methyldimethoxysilane, and γ-((meth)acryloyloxypropyl)methyldiethoxysilane. Examples of mercapto group-containing silane coupling agents include 3-mercaptopropyltrimethoxysilane. Examples of vinyl group-containing silane coupling agents include vinyltris(β-methoxyethoxy)silane, vinyltriethoxysilane, and vinyltrimethoxysilane. Examples of ureido group-containing silane coupling agents include 3-ureidopropyltriethoxysilane. Examples of sulfide group-containing silane coupling agents include bis(3-(triethoxysilyl)propyl)disulfide and bis(3-(triethoxysilyl)propyl)tetrasulfide. Examples of silane coupling agents having a cyclic anhydride structure include 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, and 3-dimethylmethoxysilylpropylsuccinic anhydride.

[0109] In this embodiment, a silane coupling agent having a cyclic anhydride structure is particularly preferably used. Although the details are unclear, it is presumed that the cyclic anhydride structure easily reacts with the main chain, side chain, and / or end of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor, and therefore a particularly good adhesion improving effect can be obtained.

[0110] When a silane coupling agent is used, it may be used alone or in combination of two or more adhesion aids. When a silane coupling agent is used, the amount used is, for example, 0.1 to 20 parts by mass, preferably 0.3 to 15 parts by mass, more preferably 0.4 to 12 parts by mass, and even more preferably 0.5 to 10 parts by mass, relative to 100 parts by mass of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor.

[0111] (Surfactant) The photosensitive resin composition of the present embodiment preferably contains a surfactant. This can further improve the coatability of the photosensitive resin composition. Examples of the surfactant include a fluorine-based surfactant, a silicone-based surfactant, an alkyl-based surfactant, and an acrylic-based surfactant. From another perspective, the surfactant is preferably nonionic. The use of a nonionic surfactant is preferable in that it suppresses unintentional reactions with other components in the composition and improves the storage stability of the composition, for example.

[0112] The surfactant preferably contains a surfactant containing at least one of a fluorine atom and a silicon atom. This contributes to obtaining a uniform resin film (improving coating properties), improving developability, and also improving adhesive strength. Such surfactants are preferably, for example, nonionic surfactants containing at least one of a fluorine atom and a silicon atom. Commercially available surfactants that can be used include, for example, the "Megafac" series manufactured by DIC Corporation, including F-251, F-253, F-281, F-430, F-477, F-551, F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F-565, F-568, F-569, and F-5 fluorine-containing oligomer surfactants such as F-70, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, R-94, and FC4430 and FC4432 manufactured by 3M; fluorine-containing nonionic surfactants such as Ftergent 250 and Ftergent 251 manufactured by Neos Corporation; and silicone surfactants such as the SILFOAM (registered trademark) series manufactured by Wacker Chemie (e.g., SD 100 TS, SD 670, SD 850, SD 860, SD 882) and BYK-333, BYK-349, BYK-313, and BYK-323 manufactured by BYK-Chemie. Other preferred surfactants include FC4430 and FC4432 manufactured by 3M, and BYK-333 manufactured by BYK-Chemie.

[0113] When the photosensitive resin composition of the present embodiment contains a surfactant, it may contain one or more surfactants. When the photosensitive resin composition of the present embodiment contains a surfactant, the amount of the surfactant is, for example, 0.001 to 1 part by mass, preferably 0.005 to 0.5 parts by mass, relative to 100 parts by mass of the content of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor.

[0114] (Solvent / Properties of Photosensitive Resin Composition) The photosensitive resin composition of the present embodiment preferably contains a solvent. This makes it possible to easily form a resin film on a structure by a coating method. The solvent usually contains an organic solvent. There are no particular limitations on the organic solvent, as long as it can dissolve or disperse the above-mentioned components and does not substantially chemically react with the components.

[0115] Examples of organic solvents include acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, benzyl alcohol, propylene carbonate, ethylene glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl-n-propyl ether, butyl acetate, γ-butyrolactone, methyl lactate, ethyl lactate, butyl lactate, etc. These may be used alone or in combination.

[0116] When the photosensitive resin composition of this embodiment contains a solvent, the photosensitive resin composition of this embodiment is usually in the form of a varnish. More specifically, the photosensitive resin composition of this embodiment is preferably a varnish-like composition in which at least a polybenzoxazole resin or its precursor and a polyimide resin or its precursor are dissolved in a solvent. Since the photosensitive resin composition of this embodiment is in the form of a varnish, a uniform film can be formed by coating. Furthermore, since the polybenzoxazole resin or its precursor and the polyimide resin or its precursor are "dissolved" in the solvent, a uniform cured film can be obtained.

[0117] When a solvent is used, it is used so that the concentration of the total solids (non-volatile components) in the photosensitive resin composition is preferably 10 to 50% by mass, more preferably 20 to 45% by mass. By using a solvent in this range, each component can be sufficiently dissolved or dispersed. Furthermore, good coating properties can be ensured, which in turn leads to improved flatness during spin coating. Furthermore, adjusting the content of non-volatile components allows the viscosity of the photosensitive resin composition to be appropriately controlled.

[0118] (Other Components) In addition to the above-described components, the photosensitive resin composition of the present embodiment may contain other components as needed, such as a resin other than the polybenzoxazole resin or its precursor and the polyimide resin or its precursor, water, a filler such as silica, a curing catalyst, a sensitizer, a film-forming agent, etc.

[0119] In this case, the resin composition for surface modifier preferably has a contact angle θ1>θ2, where θ1 is the contact angle of the first region with the photosensitive resin composition before the step of applying the resin composition for surface modifier and θ2 is the contact angle of the first region with the photosensitive resin composition after the step of removing the resin composition for surface modifier. By doing so, the wettability of the structure surface can be more suitably improved after the surface modification treatment of the structure.

[0120] Furthermore, the resin composition for surface modifier preferably has a contact angle θ1<θ2, where θ1 is the contact angle of the second region with the photosensitive resin composition before the step of applying the resin composition for surface modifier, and θ2 is the contact angle of the second region with the photosensitive resin composition after the step of removing the resin composition for surface modifier. This can more effectively improve the wettability of the structure surface after the surface modification treatment of the structure. The contact angles in the first and second regions can be measured at 25°C. The photosensitive resin composition used for contact angle measurement is usually in the form of a varnish containing an organic solvent. Photosensitive resin compositions actually used in the manufacturing method of electronic devices can be used as the photosensitive resin composition. An example of a photosensitive resin composition is the wafer coat resin from Sumitomo Bakelite Co., Ltd., which is used in the examples described below.

[0121] Second Embodiment In addition, in the process of the electronic device manufacturing method of the present embodiment, a second embodiment of the step of forming an insulating resin film preferably includes a step of applying a solution containing a polymerizable monomer and a solvent, drying the solvent, and polymerizing the polymerizable monomer.

[0122] The method for drying the solvent is not particularly limited as long as it can volatilize the solvent from the solution containing the polymerizable monomer and the solvent, and a known method can be used depending on the type of polymerizable monomer. Examples of the method for drying the solvent include conditions at a temperature of 30° C. or higher and 150° C. or lower for 1 minute or longer and 1 hour or shorter.

[0123] The step of polymerizing the polymerizable monomer is not particularly limited, and a known method can be used depending on the type of polymerizable monomer. Examples of the step of polymerizing the polymerizable monomer include heat treatment and irradiation with energy rays. Examples of the energy rays used in this step include radiation, ultraviolet rays, visible light, and electron beams.

[0124] In this case, the solution containing the polymerizable monomer and the solvent may be, for example, the following resin composition.

[0125] [Solution containing polymerizable monomer and solvent] (Polymerizable monomer) As the polymerizable monomer contained in the solution containing the polymerizable monomer and solvent of this embodiment, known polymerizable monomers used in photosensitive resin compositions can be used. Usable ones are not particularly limited, but examples thereof include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tertiary butyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, isoamyl (meth)acrylate, isostearyl (meth)acrylate, behenyl (meth)acrylate, and the like. Acrylates, other alkyl (meth)acrylates, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, tertiary butylcyclohexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, isobornyl (meth)acrylate, glycidyl (meth)acrylate, glycerol mono(meth)acrylate, glycerol di(meth)acrylate, trimethyl Cholesterolpropane tri(meth)acrylate, zinc mono(meth)acrylate, zinc di(meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, dimerylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, neopentyl glycol (meth)acrylate, trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate Acrylate, 2,2,3,3,4,4-hexafluorobutyl (meth)acrylate, perfluorooctyl (meth)acrylate, perfluorooctylethyl (meth)acrylate, ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, 1,4-bulanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,10-Decanediol di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol mono(meth)acrylate, polypropylene glycol di(meth)acrylate, tetramethylene glycol mono(meth)acrylate, tetramethylene glycol di(meth)acrylate, polytetramethylene glycol mono(meth)acrylate, polytetramethylene glycol di(meth)acrylate, methoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, ethoxydiethylene glycol (meth)acrylate, methoxypolyalkylene glycol mono(meth)acrylate, octoxypolyalkylene glycol mono(meth)acrylate, lauroxypolyalkylene glycol mono(meth)acrylate, stearoxypolyalkylene glycol mono(meth)acrylate, allyloxypolyalkylene glycol mono(meth)acrylate acrylate, nonylphenoxy polyalkylene glycol mono(meth)acrylate, polyalkylene oxide-modified bisphenol A di(meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, N,N'-methylenebis(meth)acrylamide, N,N'-ethylenebis(meth)acrylamide, 1,2-di(meth)acrylamidoethylene glycol, di(meth)acryloyloxymethyltricyclodecane, 2-(meth)acryloyloxyethyl succinic acid, Examples of known compounds include 2-(meth)acryloyloxyethyl hexahydrophthalic acid, 2-(meth)acryloyloxyethyl, 2-hydroxypropyl phthalate, 2-hydroxy-3-acryloyloxypropyl methacrylate, N-(meth)acryloyloxyethyl maleimide, N-(meth)acryloyloxyethyl hexahydrophthalimide, N-(meth)acryloyloxyethyl phthalimide, n-vinyl-2-pyrrolidone, styrene derivatives, and α-methylstyrene derivatives. Among these compounds, one may be used alone, or two or more may be used in combination.

[0126] (Solvent) The solution of the present embodiment contains a solvent. This makes it possible to easily form a resin film on the structure by a coating method. The solvent usually contains an organic solvent. There are no particular restrictions on the organic solvent, as long as it can dissolve or disperse the above-mentioned components and does not substantially chemically react with the components.

[0127] Examples of organic solvents include acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, benzyl alcohol, propylene carbonate, ethylene glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl-n-propyl ether, butyl acetate, γ-butyrolactone, methyl lactate, ethyl lactate, butyl lactate, etc. These may be used alone or in combination.

[0128] The solution of this embodiment is usually in the form of a varnish because it contains a solvent. More specifically, the solution of this embodiment containing a polymerizable monomer and a solvent is a varnish-like composition in which the polymerizable monomer is dissolved in the solvent. Since the solution of this embodiment containing the polymerizable monomer and a solvent is in the form of a varnish, a uniform film can be formed by coating. Furthermore, since the polymerizable monomer is "dissolved" in the solvent, a uniform cured film can be obtained.

[0129] When a solvent is used, the concentration of the total solids (non-volatile components) in the solution containing the polymerizable monomer and the solvent is preferably 10 to 50% by mass, more preferably 20 to 45% by mass. By adjusting the concentration within this range, each component can be sufficiently dissolved or dispersed. This also ensures good coating properties, which in turn leads to improved flatness during spin coating. Furthermore, by adjusting the content of non-volatile components, the viscosity of the solution containing the polymerizable monomer and the solvent can be appropriately controlled.

[0130] (Other Components) In addition to the above components, the solution containing the polymerizable monomer and the solvent of this embodiment may contain components other than the above-listed components, as necessary. Examples of such components include a photosensitizer, a crosslinking agent, a silane coupling agent, a surfactant, a resin other than the polymerizable monomer, water, a filler such as silica, a curing catalyst, a sensitizer, a film-forming agent, etc.

[0131] (Photosensitizer) The solution containing the polymerizable monomer and the solvent of the present embodiment preferably contains a photosensitizer. The photosensitizer is not particularly limited as long as it can generate active species by light and cure the solution containing the polymerizable monomer and the solvent.

[0132] The photosensitizer preferably contains a photoradical generator, which is particularly effective in polymerizing polymerizable monomers.

[0133] The photoradical generator that can be used is not particularly limited, and known ones can be used appropriately. For example, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one, 2-methyl-1-(4-methylthiophene), alkylphenone compounds such as 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; benzophenone compounds such as benzophenone, 4,4'-bis(dimethylamino)benzophenone, and 2-carboxybenzophenone; benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl benzoin-based compounds such as benzoin ether and benzoin isobutyl ether; thioxanthone-based compounds such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone and 2,4-diethylthioxanthone; thioxanthone-based compounds such as 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxy ... halomethylated triazine compounds such as 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine; halomethylated oxadiazole compounds such as 2-trichloromethyl-5-(2'-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-benzofuryl)vinyl]-1,3,4-oxadiazole, 4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole;Biimidazole compounds such as 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, and 2,2'-bis(2,4,6-trichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole; 1,2-octanedione, 1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime), ethanone, 1-[9-ethyl-6-(2- Examples of suitable compounds include oxime ester compounds such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)-, 1-(O-acetyloxime); titanocene compounds such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium; acylphosphine compounds such as acylphosphine oxide; benzoate ester compounds such as p-dimethylaminobenzoic acid and p-diethylaminobenzoic acid; and acridine compounds such as 9-phenylacridine.

[0134] The solution containing the polymerizable monomer and the solvent may contain only one type of photosensitizer or may contain two or more types of photosensitizer. The content of the photosensitizer is, for example, 5 parts by mass or more and 30 parts by mass or less, and preferably 10 parts by mass or more and 25 parts by mass or less, relative to 100 parts by mass of the polymerizable monomer.

[0135] (Crosslinking Agent) The solution containing the polymerizable monomer and the solvent of this embodiment preferably contains a crosslinking agent. By using the crosslinking agent, for example, the crosslinking agent reacts with other components contained in the solution containing the polymerizable monomer and the solvent, or the crosslinking agents polymerize with each other, and the crosslinking agent becomes closely entangled with the solution containing the polymerizable monomer and the solvent, which is thought to improve the chemical resistance and elongation of the resin film.

[0136] The content of the crosslinking agent is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and more preferably 1 part by mass or more, relative to 100 parts by mass of the polymerizable monomer. By having the content of the crosslinking agent be 0.1 parts by mass or more, the resin film can have high chemical resistance. Furthermore, the content of the crosslinking agent is, for example, 30 parts by mass or less, preferably 20 parts by mass or less, and more preferably 10 parts by mass or less, relative to 100 parts by mass of the polymerizable monomer. By having the content of the crosslinking agent be 30 parts by mass or less, the ratio of the polymerizable monomer in the solution containing the polymerizable monomer and the solvent is maintained, the elongation rate of the resin film is good, and the adhesion between the resin film and the structure is sufficiently improved.

[0137] The solution containing the polymerizable monomer and the solvent of the present embodiment may contain only one type of crosslinking agent, or may contain two or more types of crosslinking agents.

[0138] (Silane Coupling Agent) The solution containing the polymerizable monomer and the solvent of the present embodiment preferably contains a silane coupling agent. By using the silane coupling agent, for example, the adhesion between the resin film and the structure can be further improved.

[0139] Examples of the silane coupling agent that can be used include amino group-containing silane coupling agents, epoxy group-containing silane coupling agents, (meth)acryloyl group-containing silane coupling agents, mercapto group-containing silane coupling agents, vinyl group-containing silane coupling agents, ureido group-containing silane coupling agents, sulfide group-containing silane coupling agents, and silane coupling agents having a cyclic anhydride structure.

[0140] Examples of amino group-containing silane coupling agents include bis(2-hydroxyethyl)-3-aminopropyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, etc. Examples of epoxy group-containing silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidylpropyltrimethoxysilane, etc. Examples of (meth)acryloyl group-containing silane coupling agents include γ-((meth)acryloyloxypropyl)trimethoxysilane, γ-((meth)acryloyloxypropyl)methyldimethoxysilane, and γ-((meth)acryloyloxypropyl)methyldiethoxysilane. Examples of mercapto group-containing silane coupling agents include 3-mercaptopropyltrimethoxysilane. Examples of vinyl group-containing silane coupling agents include vinyltris(β-methoxyethoxy)silane, vinyltriethoxysilane, and vinyltrimethoxysilane. Examples of ureido group-containing silane coupling agents include 3-ureidopropyltriethoxysilane. Examples of sulfide group-containing silane coupling agents include bis(3-(triethoxysilyl)propyl)disulfide and bis(3-(triethoxysilyl)propyl)tetrasulfide. Examples of silane coupling agents having a cyclic anhydride structure include 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, and 3-dimethylmethoxysilylpropylsuccinic anhydride.

[0141] In this embodiment, a silane coupling agent having a cyclic anhydride structure is particularly preferably used. Although the details are unclear, it is presumed that the cyclic anhydride structure easily reacts with the main chain, side chain, and / or end of the polymerizable monomer, thereby providing a particularly good effect of improving adhesion.

[0142] When a silane coupling agent is used, it may be used alone or two or more kinds of adhesion aids may be used in combination. When a silane coupling agent is used, the amount used is, for example, 0.1 to 20 parts by mass, preferably 0.3 to 15 parts by mass, more preferably 0.4 to 12 parts by mass, and even more preferably 0.5 to 10 parts by mass, relative to 100 parts by mass of the amount of the polymerizable monomer used.

[0143] (Surfactant) The solution containing the polymerizable monomer and the solvent of this embodiment preferably contains a surfactant. This can further improve the coatability of the solution containing the polymerizable monomer and the solvent. Examples of the surfactant include fluorine-based surfactants, silicone-based surfactants, alkyl-based surfactants, and acrylic-based surfactants. From another perspective, the surfactant is preferably nonionic. The use of a nonionic surfactant is preferable, for example, in terms of suppressing unintentional reactions with other components in the composition and improving the storage stability of the composition.

[0144] The surfactant preferably contains a surfactant containing at least one of a fluorine atom and a silicon atom. This contributes to obtaining a uniform resin film (improving coating properties), improving developability, and also improving adhesive strength. Such surfactants are preferably, for example, nonionic surfactants containing at least one of a fluorine atom and a silicon atom. Commercially available surfactants that can be used include, for example, the "Megafac" series manufactured by DIC Corporation, including F-251, F-253, F-281, F-430, F-477, F-551, F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F-565, and F-566. Fluorine-containing oligomer surfactants such as F-8, F-569, F-570, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, and R-94, fluorine-containing nonionic surfactants such as Ftergent 250 and Ftergent 251 manufactured by Neos Corporation, and silicone surfactants such as the SILFOAM (registered trademark) series manufactured by Wacker Chemie (e.g., SD 100 TS, SD 670, SD 850, SD 860, and SD 882). FC4430 and FC4432 manufactured by 3M are also preferred.

[0145] When the solution containing the polymerizable monomer and the solvent of this embodiment contains a surfactant, it may contain one or more surfactants. When the solution containing the polymerizable monomer and the solvent of this embodiment contains a surfactant, the amount of the surfactant is, for example, 0.001 to 1 part by mass, preferably 0.005 to 0.5 parts by mass, relative to 100 parts by mass of the polymerizable monomer content.

[0146] In this case, the resin composition for surface modifier preferably has a contact angle θ1>θ2, where θ1 is the contact angle of the first region with respect to the insulating resin film before the step of applying the resin composition for surface modifier and θ2 is the contact angle of the first region with respect to the insulating resin film after the step of removing the resin composition for surface modifier. By doing so, the wettability of the structure surface can be more suitably improved after the surface modification treatment of the structure.

[0147] Furthermore, the resin composition for surface modifier preferably has a contact angle θ1<θ2, where θ1 is the contact angle of the second region with the insulating resin film before the step of applying the resin composition for surface modifier and θ2 is the contact angle of the second region with the insulating resin film after the step of removing the resin composition for surface modifier. By doing so, the wettability of the structure surface can be more suitably improved after the surface modification treatment of the structure.

[0148] <Electronic Device> As shown in FIG. 1 , the electronic device 1 manufactured by the above manufacturing method includes an epoxy resin composition cured body 10, a semiconductor chip 40 consisting of individualized dies 20 and electrode pads 30, and a passivation film 50, and on top of that, an insulating resin film 60 consisting of the above-mentioned photosensitive resin composition, and a conductive film 110 formed so as to cover the exposed electrode pads 30 and the insulating resin film 60.

[0149] In this case, the interface where the epoxy resin composition cured product 10 and the insulating resin film 60 contact each other is the first region, and the interface where the electrode pad 30 and the insulating resin film 60 or the conductive film 110 contact each other is the second region. In the electronic device 1 of this embodiment, the first region and the second region have been surface-modified with the resin composition for surface modifier of this embodiment.

[0150] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention.

[0151] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples.

[0152] [Undercoating Materials (E-1) to (E-5) for Obtaining a Structure Having a Base Layer (Corresponding to the First Region) Formed on the Surface] The epoxy resin cured materials (E-1) to (E-4), which are undercoating materials for obtaining a structure having a base layer (corresponding to the first region) formed on the surface, were prepared as follows. First, the components shown in Table 1 were mixed using a mixer. The resulting mixture was then melt-kneaded in a co-rotating twin-screw extruder with a cylinder inner diameter of 65 mm at a screw rotation speed of 30 rpm and a resin temperature of 110°C. Next, the melt-kneaded resin composition was fed from above a rotor with a diameter of 20 cm at a rate of 2 kg / hr, and passed through multiple small holes (hole diameter 0.9 mm) on the outer periphery of a cylinder heated to 115°C by the centrifugal force generated by rotating the rotor at 3,000 rpm. Granular undercoating materials (E-1) to (E-4) were then obtained by cooling. For (E-5), commercially available copper for sputtering was used as is.

[0153] Details of the raw materials for the undercoating materials (E-1) to (E-4) for obtaining a structure having an undercoating layer formed on the surface are shown in Table 1. Details of the raw materials for each component in Table 1 are as follows.

[0154] [Raw materials for each of the base materials (E-1) to (E-5)] (Inorganic fillers) Inorganic filler 1: spherical fused silica (manufactured by Tatsumori Co., Ltd., product number: MUF-4, particle size 3.8 μm) Inorganic filler 2: spherical fused silica (manufactured by Tatsumori Co., Ltd., product number: MSR-SC3-TS, particle size 3.8 μm) Inorganic filler 3: spherical fused silica (manufactured by Admatechs Co., Ltd., product number: SC-2500-SQ, particle size 0.5 μm) Inorganic filler 4: spherical fused silica (manufactured by Admatechs Co., Ltd., product number: SC-5500-SQ, particle size 1.5 μm) (Colorants) Colorant 1: carbon black (manufactured by Mitsubishi Chemical Corporation, product number: MA-600)

[0155] (Coupling Agents) Coupling Agent 1: N-phenyl-3-aminopropyltrimethoxysilane (manufactured by Toray Dow Corning Co., Ltd., product number: CF-4083) Coupling Agent 2: Hydrolyzed product of silane coupling agent (hydrolyzed product of γ-glycidoxypropylmethyldimethoxysilane) Coupling Agent 3: 3-mercaptopropyltrimethoxysilane (manufactured by Chisso Corporation, product number: S810)

[0156] (Epoxy resins) Epoxy resin 1: Biphenyl type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product number: YX-4000K) Epoxy resin 2: Trisphenylmethane / biphenyl mixed type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product number: YL6677) Epoxy resin 3: Biphenyl aralkyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., product number: NC3000L) Epoxy resin 4: Mixture of biphenyl aralkyl type epoxy resin and biphenol glycidyl ether (manufactured by Nippon Kayaku Co., Ltd., product number: CER-3000-L) (Curing agents) Curing agent 1: Trisphenylmethane mixed type phenolic resin (manufactured by Air Water Inc., product number: HE910-20) Curing agent 2: Phenol novolac type phenolic resin (manufactured by Sumitomo Bakelite Co., Ltd., product number: PR-55617) Curing agent 3: Biphenyl aralkyl type phenolic resin (manufactured by Nippon Kayaku Co., Ltd., product number: GPH-65) Curing agent 4: Biphenyl aralkyl phenolic resin (manufactured by Meiwa Kasei Co., Ltd., product number: MEH-7851SS)

[0157] (Curing accelerators) Curing accelerator 1: tetraphenylphosphonium 4,4'-sulfonyldiphenolate Curing accelerator 2: tetraphenylphosphonium bis(naphthalene-2,3-dioxy)phenylsilicate Curing accelerator 3: adduct of triphenylphosphine and p-benzoquinone (manufactured by K.I. Kasei Co., Ltd., product number: TPP-BQ) Curing accelerator 4: tetraphenylphosphonium-2,3-dihydroxynaphthalate

[0158] (Mold Release Agents) Mold Release Agent 1: Carnauba wax (manufactured by Toagosei Co., Ltd., product number: TOWAX-132) (Flame Retardants) Flame Retardant 1: Aluminum hydroxide powder, D50=2.1 μm, D90=7.1 μm, electrical conductivity=24 μS / cm (Ion Scavenger) Ion Scavenger 1: Hydroxytalcite (manufactured by Toagosei Co., Ltd., product number: SBM-8677) (Stress Reduction Agents) Stress Reduction Agent 1: Polyether-modified silicone oil (manufactured by Dow Corning Toray Co., Ltd., product number: FZ-3730)

[0159]

[0160] [Preparation of Resin Composition for Surface Modifier] The raw materials blended according to Tables 2 and 3 below were stirred at room temperature for 2.5 hours to obtain a mixed solution. The mixed solution was then filtered through a polypropylene filter with a pore size of 1.0 μm. In this way, a resin composition for surface modifier was obtained.

[0161] Details of the raw materials for each component in Tables 2 and 3 are as follows. Note that for Comparative Examples 1 to 5 and 7 to 10 in which the resin composition for surface modifiers was not applied to the structure in the [Surface Modification Treatment] described below, the composition of the resin composition for surface modifiers in Tables 2 and 3 is recorded as "-".

[0162] <(A) Phenoxy Resins> (A-1) Phenoxy resin containing a bisphenol A skeleton (manufactured by Mitsubishi Chemical Corporation, product number: jER1256, Mw: 51,000, epoxy equivalent: 7,800 g / eq) (A-2) Phenoxy resin containing a bisphenol A skeleton and a bisphenol F skeleton (manufactured by Mitsubishi Chemical Corporation, product number: jER4275, Mw: 60,000, epoxy equivalent: 9,000 g / eq) (A-3) Phenoxy resin containing a bisphenol F skeleton (manufactured by Mitsubishi Chemical Corporation, product number: jERYX7105, Mw: 3,000, epoxy equivalent: 487 g / eq)

[0163] <(B) Epoxy Resin> (B-1) Multifunctional epoxy resin (manufactured by Nippon Kayaku Co., Ltd., product number: EPPN201, phenol novolac epoxy resin, number of functional groups: 2 to 10)

[0164] <(C) Surfactant> (C-1) FC4432 (manufactured by 3M, fluorine-based)

[0165] <(D) Solvent> (D-1) Propylene glycol monomethyl ether acetate (PGMEA) (D-2) γ-butyrolactone (GBL)

[0166] [Preparation of Structure] A structure including a first region formed of a cured product of an epoxy resin composition was prepared by the method described below.

[0167] (E-1) to (E-4) Twelve 0.15 mm thick, 4 mm square semiconductor elements were bonded with silver paste onto a circuit board having a thickness of 0.1 mm, a width of 77.5 mm, and a length of 240 mm, made of a glass-based epoxy resin copper-clad laminate with a heat resistance grade of FR-4. The surface on which the semiconductor elements were mounted was fixed to the upper mold by a substrate fixing means, with the surface facing downward. Next, resin granules made of each of the base materials (E-1) to (E-4) were fed into the lower mold cavity, and then, while reducing the pressure inside the cavity, 12 semiconductor elements were molded into a panel using a compression molding machine (manufactured by TOWA Corporation), to obtain a structure with a base layer formed on the surface. The molding conditions at this time were a mold temperature of 175 ° C, a molding pressure of 2.0 MPa, and a curing time of 120 seconds.

[0168] (E-5) (E-5) was sputtered onto an 8-inch silicon wafer to a thickness of 3000 Å, thereby obtaining a structure having an underlayer formed on the surface.

[0169] [Surface Modification Treatment] In the coating process, the resin composition for surface modifiers was applied by spin coating onto the structure obtained in the above [Preparation of Structure]. Next, in the drying process, the structure coated with the resin composition for surface modifiers was dried at 110 ° C. for 3 minutes to form a surface modifier resin film with a film thickness of 5 μm on the structure. Then, in the cleaning process, cyclopentanone was sprayed onto the obtained surface modifier resin film for 30 seconds while rotating at a rotation speed of 2500 rpm, and then spin-dried at the same rotation speed for 20 seconds to remove the surface modifier resin film on the structure. At this time, in the examples, the coating process, the drying process, and the cleaning process were all performed, but in the comparative examples, only the cleaning process was performed, or none of the coating process, the drying process, and the cleaning process was performed.

[0170] [Fabrication of Photosensitive Resin Film] A photosensitive resin composition was applied by spin coating onto the structure after the [Surface Modification Treatment]. The structure coated with the photosensitive resin composition was then dried at 120°C for 5 minutes to form a photosensitive resin film with a thickness of 5 µm on the structure.

[0171] The details of the photosensitive resin compositions used in the preparation of the photosensitive resin films are as follows: These are photosensitive resin compositions containing a polybenzoxazole precursor.

[0172] <(F) Photosensitive Resin Composition> (F-1) Wafer Coat Resin (Sumitomo Bakelite Co., Ltd., Product Number: CRC-8903) (F-2) Wafer Coat Resin (Sumitomo Bakelite Co., Ltd., Product Number: CRC-8300S)

[0173] [Evaluation] (Coating property of photosensitive resin composition) For the structures on which the photosensitive resin film obtained in [Preparation of photosensitive resin film] was formed, the surface condition of the photosensitive resin film was visually observed, and the coating condition was evaluated according to the following three levels. The results are shown in Table 2. Good: No cissing occurred, and the surface was smooth and uniform with no irregularities. Poor: Some cissing occurred, but the surface had relatively minor irregularities. Very poor: Cessing occurred in part or over the entire surface, and the surface had significant irregularities.

[0174]

[0175] In Table 2, the base material used in each example is described as "used", the photosensitive resin composition used in each example is described as "used", and the surface modification treatment performed in each example is described as "performed". As shown in Table 2, in each example, by performing surface modification using the resin composition for surface modifier, the coatability of the photosensitive resin composition was improved and the occurrence of repelling on the surface of the structure was suppressed.

[0176] (Contact angle of photosensitive resin composition before and after surface modification treatment) First, 2 μL of photosensitive resin composition (F-1) was dropped onto the structure on which the underlayer was formed, obtained by the above [Preparation of structure]. Thereafter, the contact angle 10 seconds after the droplet landed was evaluated by the sessile drop method, and the contact angle at this time was defined as θ1. The measurement was performed using a contact angle meter (DROPMASTER-501, manufactured by Kyowa Interface Science Co., Ltd.). Next, the structure was subjected to surface modification treatment by the method described in the above [Surface modification treatment]. The contact angle of the structure after the surface modification treatment was evaluated by the same method, and the contact angle at this time was defined as θ2. Furthermore, the relationship between the evaluated contact angles θ1 and θ2 was also evaluated. The results are shown in Table 3. Note that in Comparative Examples 9 and 10, no surface modification treatment was performed, and therefore the contact angle θ2 after the surface modification treatment and the relationship between θ1 and θ2 were not evaluated. In Table 3, this is indicated as "-".

[0177]

[0178] In Table 3, the base material used in each example is described as "used", the photosensitive resin composition used in each example is described as "used", and the surface modification treatment performed in each example is described as "performed". As shown in Table 3, in each example, by performing surface modification using the resin composition for surface modifier, the contact angle in the resin region of the structure surface was reduced and the contact angle in the metal region was increased, thereby reducing the difference in contact angle between the resin region and the metal region. This is thought to have made the wettability on the structure surface uniform and suppressed the occurrence of repelling on the structure surface.

[0179] This application claims priority based on Japanese Patent Application No. 2022-055266, filed March 30, 2022, the disclosure of which is incorporated herein in its entirety.

[0180] REFERENCE SIGNS LIST 1 Electronic device 10 Epoxy resin composition cured body 110 Conductive film 20 Die 30 Electrode pad 40 Semiconductor chip 50 Passivation film 60 Insulating resin film

Claims

1. A step of adhering a resin composition for surface modifier to a surface of a structure including a first region formed of an epoxy resin composition cured body; Thereafter, modifying the surface by removing the resin composition for surface modifier from the surface; The resin composition for surface modifiers is used in a process comprising: The resin composition for surface modifiers comprises a phenoxy resin.

2. The resin composition for surface modifier according to claim 1, The phenoxy resin comprises one or more selected from the group consisting of phenoxy resins containing a bisphenol A skeleton, phenoxy resins containing a bisphenol F skeleton, and phenoxy resins containing a bisphenol A skeleton and a bisphenol F skeleton.

3. The resin composition for surface modifier according to claim 1 or 2, The resin composition for surface modifiers, wherein the phenoxy resin has a weight average molecular weight Mw of 2,500 or more and 120,000 or less.

4. The resin composition for surface modifier according to claim 1 or 2, The resin composition for surface modifier further comprises an epoxy resin.

5. The resin composition for surface modifier according to claim 4, The resin composition for surface modifiers, wherein the epoxy resin comprises a tri- or higher functional epoxy resin.

6. The resin composition for surface modifier according to claim 5, The epoxy resin comprises one or more selected from the group consisting of phenol novolac type epoxy resins and cresol novolac type epoxy resins.

7. The resin composition for surface modifier according to claim 1 or 2, The resin composition for surface modifier further comprises a surfactant.

8. The resin composition for surface modifier according to claim 1 or 2, The resin composition for surface modifier further comprises a solvent.

9. The resin composition for surface modifier according to claim 1 or 2, The resin composition for surface modifier, wherein the cured product of the epoxy resin composition further contains an inorganic filler.

10. The resin composition for surface modifier according to claim 1 or 2, The process further includes a step of adhering a photosensitive resin composition containing one or more resins selected from the group consisting of a polybenzoxazole resin or a precursor thereof, and a polyimide resin or a precursor thereof to the surface that has been modified.

11. The resin composition for surface modifier according to claim 10, The resin composition for surface modifiers, wherein when the contact angle of the first region with respect to the photosensitive resin composition before the step of adhering the resin composition for surface modifiers is θ1 and the contact angle of the first region with respect to the photosensitive resin composition after the step of removing the resin composition for surface modifiers is θ2, θ1 > θ2.

12. The resin composition for surface modifier according to claim 11, The resin composition for surface modifiers, wherein the surface includes a second region formed by metal wiring.

13. The resin composition for surface modifier according to claim 12, The resin composition for surface modifiers has a contact angle of θ1 with respect to the photosensitive resin composition of the second region before the step of adhering the resin composition for surface modifiers, and a contact angle of θ2 with respect to the photosensitive resin composition of the second region after the step of removing the resin composition for surface modifiers, such that θ1 < θ2.

14. The resin composition for surface modifier according to claim 1 or 2, A non-photosensitive resin composition for surface modifiers.

15. The resin composition for surface modifier according to claim 1 or 2, A resin composition for surface modifiers, which is substantially free of a photosensitizer.

16. The resin composition for surface modifier according to claim 1 or 2, A resin composition for surface modifiers, which is substantially free of a curing agent.

17. The resin composition for surface modifier according to claim 4, The resin composition for surface modifiers, wherein (the amount of the epoxy resin / the amount of the phenoxy resin) is 1 to 10 by mass.

18. The resin composition for surface modifier according to claim 1 or 2, A resin composition for surface modification used in the manufacture of electronic devices.