Pickup system and pickup method

Abstract

In the present invention, a pickup system (100) comprises a push-up unit (34) that pushes up a chip (6a) that is on an adhesive sheet (6b) with the adhesive sheet (6b) interposed therebetween; an article holder (15) that holds the chip (6a) using a pickup nozzle (14a); a negative pressure generator (153) that generates negative pressure around an opening (14b) of the pickup nozzle (14a); and a control unit (101). The control unit (101) causes the push-up unit (34) to start pushing up the chip (6a), causes the chip (6a) to be contactlessly held by the pickup nozzle (14a) using suction force that pulls the chip (6a) toward the opening (14b) and repulsive force that pushes the chip (6a) away from the opening (14b), and raises the pickup nozzle (14a). After the chip (6a) has been pushed up while being held, the control unit (101) causes the negative pressure generation unit (153) to generate negative pressure, whereby said suction force is generated.

Description

Pickup system and pickup method

[0001] The present disclosure relates to a system for picking up parts and the like.

[0002] To improve the functionality of semiconductor packages, hybrid bonding that does not use bumps or bonding materials is required. In hybrid bonding, the semiconductor chip is bonded to a substrate or other device using hydrogen bonding or other methods while the surface of the semiconductor chip is kept clean. Therefore, in hybrid bonding, the surface of the semiconductor chip must be kept highly clean from the time it is picked up from the adhesive sheet dicing tape until it is bonded.

[0003] Furthermore, a pickup device using a vacuum pickup nozzle has been proposed (see, for example, Patent Document 1). With this pickup device, when picking up a semiconductor chip, the metallic pickup nozzle comes into contact with the surface of the semiconductor chip. This contact can contaminate or damage the surface of the semiconductor chip. As a result, there is a problem that the semiconductor chip cannot be properly bonded to the substrate. Therefore, there is a need for a technology that allows the pickup nozzle to pick up the semiconductor chip without contact.

[0004] Japanese Patent Application Laid-Open No. 2018-63967

[0005] However, even when the pickup nozzle of the pickup device of Patent Document 1 holds the semiconductor chip in a non-contact manner, there is a problem in that it may be difficult to properly pick up the component, which is the semiconductor chip.

[0006] Therefore, the present disclosure provides a pickup system that can properly pick up parts.

[0007] A pickup system according to one aspect of the present disclosure includes a push-up unit that pushes a component attached to an adhesive sheet upward through the adhesive sheet, a component holding unit that holds the component attached to the adhesive sheet from above using a holding tool that has an opening and can be raised and lowered, a negative pressure generating unit that generates negative pressure around the opening of the holding tool, and a control unit that controls the push-up unit, the component holding unit, and the negative pressure generating unit, wherein the control unit starts pushing up the component by the push-up unit, causes the holding tool to hold the component in a non-contact manner using a suction force that draws the component toward the opening of the holding tool and a repulsive force that moves the component away from the opening, and raises the holding tool holding the component, and when the component is to be held by the holding tool, generates the suction force by generating negative pressure in the negative pressure generating unit after the component has been pushed up by the push-up unit.

[0008] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may also be a non-transitory recording medium.

[0009] The pickup system of the present disclosure can properly pick up parts.

[0010] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some of the embodiments and configurations described in the specification and drawings, but not all of the configurations are necessarily required.

[0011] FIG. 1 is a perspective view of a component mounting apparatus according to the first embodiment. FIG. 2 is a diagram illustrating the operation of the component mounting apparatus according to the first embodiment to mount a chip on a substrate. FIG. 3 is a diagram illustrating an example of the configuration of a pickup system according to the first embodiment. FIG. 4 is a diagram illustrating an example of the basic operation of the pickup nozzle picking up a chip according to the first embodiment as a basic pattern. FIG. 5 is a flowchart showing the processing operation of the basic pattern by the control unit according to the first embodiment. FIG. 6 is a diagram illustrating an example of a detailed operation of the pickup nozzle picking up a chip according to the first embodiment as a first pattern. FIG. 7 is a diagram illustrating an example of a detailed operation of the pickup nozzle picking up a chip according to the first embodiment as a second pattern. FIG. 8 is a diagram illustrating an example of a detailed operation of the pickup nozzle picking up a chip according to the first embodiment as a third pattern. FIG. 9 is a diagram illustrating an example of a detailed operation of the pickup nozzle picking up a chip according to the first embodiment as a fourth pattern. FIG. 10 is a diagram illustrating an example of a detailed operation of the pickup nozzle picking up a chip according to the first embodiment as a fifth pattern. FIG. 11 is a diagram illustrating an exceptional operation of the pickup nozzle picking up a chip according to the first embodiment as a first exceptional pattern. FIG. 12 is a diagram for explaining an exceptional operation of the pickup nozzle in embodiment 1 picking up a chip as a second exceptional pattern. FIG. 13 is a perspective view of a component mounting device in embodiment 2. FIG. 14 is a diagram showing an example of the configuration of a pickup system in embodiment 2. FIG. 15 is a diagram for explaining an example of a basic operation of the pickup nozzle in embodiment 2 picking up a chip. FIG. 16 is a diagram showing an example of negative pressure adjustment by the negative pressure generating unit in embodiment 2. FIG. 17 is a diagram showing another example of negative pressure adjustment by the negative pressure generating unit in embodiment 2. FIG. 18 is a flowchart showing the processing operation of the control unit in embodiment 2. FIG. 19 is a diagram for explaining an exceptional operation of the pickup nozzle in embodiment 2 picking up a chip as a third exceptional pattern.FIG. 20 is a diagram for explaining an exceptional operation of the pick-up nozzle picking up a chip in the second embodiment as a fourth exceptional pattern.

[0012] A pickup system according to one aspect of the present disclosure includes a push-up unit that pushes up a component attached to an adhesive sheet from below through the adhesive sheet, a component holding unit that holds the component attached to the adhesive sheet from above using a holding tool that is movable and has an opening, a negative pressure generator that generates negative pressure around the opening of the holding tool, and a control unit that controls the push-up unit, the component holding unit, and the negative pressure generator, wherein the control unit starts pushing up the component using the push-up unit, causes the holding tool to hold the component in a non-contact manner using a suction force that attracts the component toward the opening of the holding tool and a repulsion force that repels the component away from the opening, and raises the holding tool holding the component, and when the component is to be held by the holding tool, generates negative pressure in the negative pressure generator after the component is pushed up by the push-up unit, for example, the holding tool is a pickup nozzle.

[0013] When a component is pushed up through the adhesive sheet, the component is more likely to peel off from the adhesive sheet. In other words, the component's peeling from the adhesive sheet is promoted. If negative pressure is generated before the component is pushed up, a force is generated that pulls the component toward the holding tool while the component is firmly attached to the adhesive sheet. Furthermore, for the holding tool to hold the component without contact, a gap is required between the holding tool and the component. Therefore, as described above, if negative pressure is generated before the component is pushed up, a large negative pressure, i.e., a strong force that attracts the component, is required. Then, when the component is peeled off from the adhesive sheet, the large negative pressure causes the component to be forcefully sucked up into the holding tool, which is positioned with a gap between it and the component. As a result, the component may collide with the holding tool. Even if a repulsive force is acting between the component and the holding tool to hold the component without contact, a collision of the component is still possible. As a result, the component may be damaged, contaminated, or broken. Furthermore, if the negative pressure generated before the component is pushed up is small, the generation of the negative pressure may not contribute significantly to the pickup of the component, which is inefficient.

[0014] On the other hand, in one aspect of the present disclosure, after the component is pushed up, a negative pressure is generated so that the holding tool can hold the component without contact. Therefore, since the negative pressure is generated after the component is pushed up, promoting the release of the component from the adhesive sheet, the negative pressure can be reduced, and the collision between the component and the holding tool as described above can be suppressed. Therefore, the component can be prevented from being damaged, contaminated, or broken, and the component can be kept clean. Furthermore, the pickup efficiency can be improved. Therefore, in one aspect of the present disclosure, the component can be picked up appropriately.

[0015] In addition, the component holding unit may further include a first ultrasonic generating unit that generates ultrasonic waves from around the opening by vibrating the holding tool, and when the control unit causes the holding tool to hold the component, it may generate the repulsive force by causing the first ultrasonic generating unit to generate ultrasonic waves.

[0016] This allows the realization of a so-called ultrasonic non-contact chuck. Furthermore, since the repulsive force is generated by the squeeze effect caused by the ultrasonic waves, it is easy to obtain an appropriate repulsive force. As a result, the part can be held efficiently without contact.

[0017] The control unit may also cause the first ultrasonic generator to generate ultrasonic waves before the push-up unit starts to push up the component.

[0018] This allows ultrasonic waves to be generated continuously, eliminating the need to switch between generating and stopping ultrasonic waves, thereby simplifying the processing operation and shortening the time required for pickup.

[0019] The control unit may also cause the first ultrasonic generator to generate ultrasonic waves after the component has been pushed up by the push-up unit.

[0020] This allows the component to be pushed up, facilitating its removal from the adhesive sheet, and then ultrasonic vibrations can be applied to the component, further facilitating its removal. As a result, the negative pressure generated by the negative pressure generating unit can be kept low, further reducing the possibility of the component colliding with the holding tool.

[0021] The control unit may also cause the first ultrasonic generator to generate ultrasonic waves after a predetermined amount of the component is peeled off from the adhesive sheet due to the component being pushed up. For example, the predetermined amount may be a predetermined area or a predetermined percentage of the area. In a specific example, the control unit may identify the area of ​​the region that has been peeled off from the adhesive sheet of the entire bottom surface of the component that was attached to the adhesive sheet, for example, by image processing using a camera. Then, the control unit may cause the first ultrasonic generator to generate ultrasonic waves after the area of ​​that region reaches a predetermined amount, or after the percentage of the area of ​​that region of the entire bottom surface reaches a predetermined amount.

[0022] This allows ultrasonic waves to be generated after the component has been peeled off by a predetermined amount, thereby highly reliably reducing the possibility of the component colliding with the holding tool.

[0023] The pickup system may further include a second ultrasonic wave generating unit disposed below the adhesive sheet and configured to output ultrasonic waves toward the adhesive sheet.

[0024] This allows the ultrasonic waves output by the second ultrasonic generator to transmit the vibrations of the air caused by the ultrasonic waves to the component attached to the adhesive sheet via the adhesive sheet, further facilitating the peeling of the component, thereby further reducing the possibility of the component colliding with the holding tool.

[0025] In addition, the push-up portion and the second ultrasonic generating portion may be arranged to be freely movable so that one of the push-up portion and the second ultrasonic generating portion can be positioned below the component and the adhesive sheet in place of the other.

[0026] This allows the ultrasonic waves output from the second ultrasonic generator to alternately promote peeling of the component and the thrust to promote peeling of the component, thereby more appropriately promoting peeling of the component and further reducing the possibility of the component colliding with the holding tool.

[0027] The pickup system may further include a measuring unit that measures the flow rate of air flowing into the holding tool through the opening or the pressure of the air in order to generate negative pressure by the negative pressure generating unit, and the control unit may control at least one of the negative pressure generating unit and the first ultrasonic generating unit so that the flow rate or pressure measured by the measuring unit falls within a predetermined range.

[0028] This allows the measuring unit to measure the flow rate or pressure to determine the state of component holding by the holding tool and correct that holding state to an appropriate state. As a result, components can be prevented from falling off the holding tool and from coming into contact with the holding tool. This allows components to be picked up appropriately and, for example, to be transferred appropriately to another tool.

[0029] The comprehensive or specific aspects of the control unit described above may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of the system, the method, the integrated circuit, the computer program, or the recording medium. The recording medium may also be a non-transitory recording medium.

[0030] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0031] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concepts are described as optional components.

[0032] Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Furthermore, in each figure, the same components are assigned the same reference numerals. Furthermore, in the following embodiments, expressions such as "approximately simultaneously" are used. For example, "approximately simultaneously" does not only mean completely simultaneous, but also means substantially simultaneous, that is, including an error of, for example, about several percent. Furthermore, "approximately simultaneously" means simultaneous within the range in which the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately."

[0033] (Embodiment 1) FIG. 1 is a perspective view of a component mounting apparatus according to this embodiment.

[0034] The component mounting apparatus 1 in this embodiment picks up components and mounts the picked-up components on the substrate 7. Therefore, the component mounting apparatus 1 in this embodiment is equipped with a pickup system that picks up components. Mounting components on the substrate 7 is also referred to as bonding the components to the substrate 7. The substrate 7 in this embodiment is not limited to a specific type of substrate and may be a silicon substrate or a silicon chip, for example. In this disclosure, the vertical direction is referred to as the Z-axis direction or up-down direction, a direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction, left-right direction, or lateral direction, and a direction perpendicular to the Y-axis direction in that perpendicular plane is referred to as the X-axis direction or depth direction. In this disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. In this disclosure, the positive side of the X-axis direction is the back side or rear, and the negative side of the X-axis direction is the front side or front.

[0035] The component mounting device 1 includes a base 2, a component supply unit 3, a board holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. The base 2 is the base of the component mounting device 1 and supports each of the components included in the component mounting device 1.

[0036] The component supply unit 3 is placed on the base 2 and supplies components to the component holder 15. The component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a movable plate 32, and multiple support members 33. The holding table 3a holds the semiconductor wafer unit 6 aligned horizontally. The semiconductor wafer unit 6 includes an adhesive sheet 6b and multiple chips 6a. The multiple chips 6a are individual pieces or semiconductor chips obtained by dicing a semiconductor wafer, and are components supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is an adhesive sheet. The multiple chips 6a are affixed to the upper surface of the adhesive sheet 6b. Each of the multiple support members 33 is a columnar member placed on the movable plate 32 so as to stand upright from the movable plate 32. The multiple support members 33 support the holding table 3a while separating the semiconductor wafer unit 6 held by the holding table 3a above the movable plate 32. The movable plate 32 is a plate placed on the XY table mechanism 31. The XY table mechanism 31 moves the movable plate 32 in the X-axis direction and the Y-axis direction. As the movable plate 32 moves, the semiconductor wafer unit 6 moves in the X-axis direction and the Y-axis direction. In other words, the multiple chips 6a move along the XY plane.

[0037] The pickup camera 21 is disposed above the component supply section 3 and captures an image of the chip 6 a to be picked up from the semiconductor wafer unit 6 .

[0038] The substrate holder 5 holds the substrate 7 in a horizontally aligned state. Such a substrate holder 5 is provided with transport rails 5a. The substrate holder 5 positions and holds the substrate 7 transported by the transport rails 5a at a mounting position. The mounting position is a position where the chip 6a is mounted.

[0039] The component holder 15 includes an arm 15a, a PHDM mechanism 15b, and the PHDM 14. The arm 15a is a columnar member attached to the PHDM mechanism 15b along the X-axis. That is, one longitudinal end (i.e., the base end) of the arm 15a is attached to the PHDM mechanism 15b. The PHDM 14 is attached to the other end (i.e., the tip end) of the arm 15a.

[0040] The PHDM mechanism 15b is suspended from the Y-axis frame 11b of the frame 11 and moves the arm 15a in the X-axis, Y-axis, and Z-axis directions. Furthermore, the PHDM mechanism 15b rotates the arm 15a around a central axis along the longitudinal direction of the arm 15a. That is, the PHDM mechanism 15b rotates the arm 15a around the X-axis. The PHDM 14 is attached to the tip of the arm 15a as described above. The PHDM 14 also includes a metal PHDM nozzle 14a that holds the chip 6a by vacuum suction. Note that vacuum suction is an air-suction operation. Therefore, the PHDM nozzle 14a is driven by the PHDM mechanism 15b to move in the X-axis, Y-axis, and Z-axis directions and rotate around the X-axis. The PHDM mechanism 15b also moves the PHDM nozzle 14a based on the image captured by the pickup camera 21. This allows the pickup head moving mechanism 15b to lower the pickup nozzle 14a so that it can accurately approach the top surface of the chip 6a to be picked up. Note that the pickup nozzle 14a in this embodiment is an example of a holding tool having an opening for holding the chip 6a by vacuum suction.

[0041] As described above, the component holder 15 in this embodiment uses a holding tool, which is a pickup nozzle 14a having an opening and capable of moving up and down, to hold the chip 6a attached to the adhesive sheet 6b from above.

[0042] The frame 11 is disposed on the positive side of the X-axis direction on the base 2, and includes two support posts 11a and a long Y-axis frame 11b. The two support posts 11a support the Y-axis frame 11b while the Y-axis frame 11b is aligned along the Y-axis direction and spaced above the top surface of the base 2. In other words, the Y-axis frame 11b is suspended by the two support posts 11a. As described above, the pickup head moving mechanism 15b is suspended from this Y-axis frame 11b.

[0043] Y-axis drive mechanism 12 is attached to the surface of Y-axis frame 11b on the negative side in the X-axis direction, and moves component mounting section 13 in the Y-axis direction. Component mounting section 13 includes a mounting unit 20. Component mounting section 13 receives chip 6a held by pickup nozzle 14a using mounting unit 20, and mounts chip 6a on board 7 positioned at the mounting position.

[0044] FIG. 2 is a diagram for explaining the operation of component mounting apparatus 1 to mount chip 6 a on substrate 7 .

[0045] The component mounting device 1 picks up a chip 6a that is positioned at a predetermined pick-up work position P in the XY plane from among multiple chips 6a attached to an adhesive sheet 6b, and mounts the chip 6a on a substrate 7.

[0046] Specifically, the XY table mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction to place the chip 6 a to be picked up at the pick-up work position P. The chip 6 a to be picked up that has been placed at the pick-up work position P is pushed up by the push-up section 34.

[0047] 2, the component mounting apparatus 1 in this embodiment is provided with a push-up unit 34 arranged at the pick-up operation position P. The push-up unit 34 may also be provided in the component supply unit 3. The push-up unit 34 pushes up the chip 6a attached to the adhesive sheet 6b from below to above via the adhesive sheet 6b. Specifically, the push-up unit 34 pushes up the chip 6a to be picked up that is arranged at the pick-up operation position P.

[0048] The pickup camera 21 is disposed above the component supply unit 3 and at the pickup operation position P. The pickup camera 21 captures an image of the pickup operation position P and its surroundings among the multiple chips 6a attached to the adhesive sheet 6b from above the component supply unit 3. This captures an image of the chip 6a to be picked up, and the position of the chip 6a to be picked up is recognized based on the image capture result. In other words, the position of the chip 6a is recognized.

[0049] The pickup nozzle 14a of the pickup head 14 is lowered by the drive of the pickup head movement mechanism 15b, approaches from above the chip 6a whose position has been recognized based on the image capture results of the pickup camera 21, and holds the chip 6a. The pickup nozzle 14a then rises while holding the chip 6a, and further moves, for example, to the negative side in the Y-axis direction. Here, the pickup nozzle 14a faces upward with the lower surface (i.e., the bottom surface) of the held chip 6a as a result of the rotation of the arm 15a by the pickup head movement mechanism 15b. As a result, the chip 6a is held upside down by the pickup nozzle 14a.

[0050] 2, the component mounting section 13 includes not only the mounting unit 20 but also a movable plate 13a, an elevating mechanism 13b, and an elevating plate 13c. The movable plate 13a is attached to the Y-axis driving mechanism 12 so as to be movable in the Y-axis direction. In other words, the movable plate 13a moves in the Y-axis direction by being driven by the Y-axis driving mechanism 12.

[0051] The lifting mechanism 13b is attached to the front of the moving plate 13a and raises and lowers the lifting plate 13c. A mounting unit 20 is attached to the lower part of the lifting plate 13c. The mounting unit 20 has a component mounting nozzle 20a. The component mounting nozzle 20a receives the chip 6a from the pickup nozzle 14a, which holds the chip 6a in an upside-down state, for example. For example, the component mounting nozzle 20a is moved above the chip 6a by the driving of the Y-axis drive mechanism 12 and the lifting mechanism 13b, and holds the chip 6a by, for example, vacuum suction. Then, while holding the chip 6a, the component mounting nozzle 20a moves toward the substrate 7 along the Y-axis direction and mounts the chip 6a on the substrate 7.

[0052] FIG. 3 is a diagram showing an example of the configuration of a pickup system according to this embodiment.

[0053] The pickup system 100 in this embodiment is a system provided in the component mounting apparatus 1, and includes, for example, the component holding unit 15, the push-up unit 34, and the control unit 101 described above.

[0054] The component holder 15 includes a holder body 15c and a pickup nozzle 14a. The holder body 15c is composed of, for example, the arm 15a, the pickup head moving mechanism 15b, and the pickup head 14 except for the pickup nozzle 14a. The holder body 15c includes a first ultrasonic wave generator 152, a negative pressure generator 153, and a drive unit 154.

[0055] The first ultrasonic wave generator 152 vibrates the pick-up nozzle 14a (i.e., ultrasonically vibrates), thereby generating ultrasonic waves from around the opening 14b of the pick-up nozzle 14a. In other words, the pick-up nozzle 14a ultrasonically vibrates in the up-and-down direction, and the vibrations are transmitted to the air in contact with the underside of the pick-up nozzle 14a. For example, the first ultrasonic wave generator 152 ultrasonically vibrates the pick-up nozzle 14a with a maximum amplitude of approximately 10 to 20 μm.

[0056] Negative pressure generator 153 generates negative pressure around opening 14b of pick-up nozzle 14a. In this embodiment, negative pressure generator 153 is configured as, for example, a vacuum pump. Negative pressure generator 153 generates negative pressure around opening 14b by creating a negative pressure in air flow path 14c, which is a flow path formed in pick-up nozzle 14a and communicates with opening 14b. In other words, negative pressure generator 153 generates negative pressure around opening 14b by sucking air around opening 14b through flow path 14c.

[0057] The drive unit 154 includes, for example, a motor and moves the pickup nozzle 14a in the X-axis, Y-axis, and Z-axis directions. The drive unit 154 also rotates the arm 15a, thereby rotating the pickup nozzle 14a of the pickup head 14 attached to the tip of the arm 15a. Such a drive unit 154 may be incorporated into the pickup head moving mechanism 15b.

[0058] The push-up unit 34 has a plurality of push-up pins 34a, and raises and lowers the plurality of push-up pins 34a. The plurality of push-up pins 34a rise and push up the adhesive sheet 6b, thereby pushing up the chips 6a attached to the adhesive sheet 6b.

[0059] Control unit 101 controls push-up unit 34 and component holder 15. In the present embodiment, component holder 15 includes negative pressure generator 153, but negative pressure generator 153 does not have to be included in component holder 15. In this case, control unit 101 controls push-up unit 34, component holder 15, and negative pressure generator 153.

[0060] FIG. 4 is a diagram for explaining, as a basic pattern, an example of the basic operation of the pickup nozzle 14a in this embodiment to pick up the tip 6a.

[0061] First, the XY table mechanism 31 moves the movable plate 32, thereby moving the adhesive sheet 6b held on the holding table 3a in the X-axis direction and the Y-axis direction. This movement of the adhesive sheet 6b places the chip 6a to be picked up at the pick-up operation position P, as shown in Fig. 4(a). That is, the chip 6a to be picked up is placed on the multiple push-up pins 34a of the push-up unit 34.

[0062] Next, as shown in Figure 4(b), the push-up unit 34 raises the multiple push-up pins 34a, thereby pushing up the chip 6a through the adhesive sheet 6b. When the chip 6a is pushed up through the adhesive sheet 6b in this manner, the chip 6a becomes more likely to peel off from the adhesive sheet 6b. In other words, the peeling of the chip 6a from the adhesive sheet 6b is promoted.

[0063] Next, as shown in FIG. 4C, the pickup nozzle 14a holds the pushed-up tip 6a without contact. That is, the pickup nozzle 14a holds the tip 6a without contact by using a suction force that draws the tip 6a toward the opening 14b of the pickup nozzle 14a and a repulsive force that moves the tip 6a away from the opening 14b. The suction force is obtained by generating a negative pressure using the negative pressure generator 153. For example, the distance over which the tip 6a can be sucked up by the suction force, i.e., the distance from the pickup nozzle 14a to the tip 6a, is approximately 0.05 to 1.0 mm. The repulsive force is obtained by generating ultrasonic waves using the first ultrasonic generator 152.

[0064] Then, as shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0065] FIG. 5 is a flowchart showing the processing operation of the control unit 101 for the basic pattern.

[0066] First, the control unit 101 starts pushing up the tip 6a by the push-up unit 34 (step S1).

[0067] Next, the control unit 101 generates negative pressure in the negative pressure generator 153, causing the pickup nozzle 14a to hold the tip 6a in a non-contact manner (step S2). That is, when the control unit 101 causes the pickup nozzle 14a to hold the tip 6a, the control unit 101 generates negative pressure in the negative pressure generator 153 after the tip 6a is pushed up by the push-up unit 34, thereby generating the above-mentioned suction force. The control unit 101 then causes the pickup nozzle 14a to hold the tip 6a in a non-contact manner using a suction force that draws the tip 6a toward the opening 14b of the pickup nozzle 14a and a repulsive force that moves the tip 6a away from the opening 14b. Here, the control unit 101 generates ultrasonic waves in the first ultrasonic generator 152, thereby generating the above-mentioned repulsive force. The timing of the start of the generation of the ultrasonic waves may be arbitrary.

[0068] Then, control unit 101 controls drive unit 154 to raise pick-up nozzle 14a (step S3).

[0069] In this manner, in this embodiment, after the chip 6 a is pushed up, a negative pressure is generated by the pickup nozzle 14 a to hold the chip 6 a without contacting it. Therefore, since the negative pressure is generated after the chip 6 a is pushed up, which promotes the peeling of the chip 6 a from the adhesive sheet 6 b, the negative pressure can be reduced.

[0070] Here, if negative pressure is generated before the chip 6a is pushed up, a force is generated that pulls the chip 6a toward the pickup nozzle 14a while the chip 6a is firmly attached to the adhesive sheet 6b. Furthermore, in order for the pickup nozzle 14a to hold the chip 6a without contact, a gap is required between the pickup nozzle 14a and the chip 6a. Therefore, as described above, if negative pressure is generated before the chip 6a is pushed up, a large negative pressure, i.e., a strong force that pulls the chip 6a, is required. Furthermore, when the chip 6a is peeled off the adhesive sheet 6b, the large negative pressure causes the chip 6a to be forcefully sucked up by the pickup nozzle 14a, which is positioned with a gap between it and the chip 6a. As a result, the chip 6a may collide with the pickup nozzle 14a. Even if a repulsive force is acting between the chip 6a and the pickup nozzle 14a to hold the chip 6a without contact, a collision of the chip 6a is still possible. As a result, the chip 6a may be damaged, contaminated, or broken. Furthermore, if the negative pressure generated before the tip 6a is pushed up is small, the generation of the negative pressure may not contribute significantly to picking up the tip 6a, which is inefficient.

[0071] On the other hand, in this embodiment, as described above, the chip 6a is pushed up, which promotes the peeling of the chip 6a from the adhesive sheet 6b, and then a negative pressure is generated, so that the negative pressure can be reduced. As a result, the collision between the chip 6a and the pick-up nozzle 14a can be suppressed. Therefore, the chip 6a can be prevented from being scratched, contaminated, or damaged, and the chip 6a can be kept clean. Furthermore, the pick-up efficiency can be improved. Therefore, in this embodiment, the chip 6a can be properly picked up.

[0072] In this embodiment, the ultrasonic waves generated by the first ultrasonic generator 152 realize a so-called ultrasonic non-contact chuck. That is, a repulsive force is obtained by the squeeze effect caused by the ultrasonic waves generated, so that an appropriate repulsive force can be easily obtained. As a result, the tip 6a can be held efficiently in a non-contact manner.

[0073] FIG. 6 is a diagram for explaining, as a first pattern, an example of the detailed operation of the pickup nozzle 14a in this embodiment to pick up the tip 6a.

[0074] First, as in the example shown in Fig. 4, as shown in Fig. 6(a), the chip 6a to be picked up is placed on a plurality of push-up pins 34a of the push-up unit 34. Then, in the example shown in Fig. 6, the first ultrasonic wave generator 152 generates ultrasonic waves around the opening 14b of the pick-up nozzle 14a. In other words, the first ultrasonic wave generator 152 constantly generates ultrasonic waves.

[0075] Next, as shown in FIG. 6B, the push-up unit 34 raises the plurality of push-up pins 34a, thereby pushing up the chip 6a through the adhesive sheet 6b.

[0076] 6C, the driver 154 lowers the pickup nozzle 14a to approach the upper surface of the chip 6a. For example, the driver 154 moves the pickup nozzle 14a closer to the chip 6a so that the distance from the upper surface of the chip 6a to the lower surface of the pickup nozzle 14a is 100 to 200 μm.

[0077] 6(d), the negative pressure generator 153 begins generating negative pressure, i.e., sucking in air. In other words, the negative pressure generator 153 begins sucking in air around the opening 14b through the flow path 14c of the pickup nozzle 14a. This allows the pickup nozzle 14a to hold the tip 6a in a non-contact manner. In this non-contact holding, a gap of, for example, about 25 μm in width is created between the pickup nozzle 14a and the tip 6a.

[0078] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0079] In this way, in the first pattern, the control unit 101 causes the first ultrasonic generator 152 to generate ultrasonic waves before the push-up unit 34 starts pushing up the tip 6a. This allows ultrasonic waves to be generated continuously, eliminating the need to switch between generating and stopping ultrasonic waves. As a result, the processing operation can be simplified and the time required for pickup can be shortened.

[0080] 7 is a diagram illustrating an example of the detailed operation of the pickup nozzle 14a in this embodiment to pick up the tip 6a as a second pattern. In the second pattern, the timing of the generation of ultrasonic waves by the first ultrasonic generator 152 differs from that of the first pattern in FIG. 6. That is, in the second pattern, the timing of the generation of ultrasonic waves is approximately simultaneous with the timing of the generation of negative pressure.

[0081] Specifically, first, as in the example shown in FIG. 4, the chip 6a to be picked up is placed on a plurality of push-up pins 34a of the push-up section 34 as shown in FIG. 7(a).

[0082] Next, as shown in FIG. 7B, the push-up unit 34 raises the plurality of push-up pins 34a, thereby pushing up the chip 6a through the adhesive sheet 6b.

[0083] Next, as shown in FIG. 7C, the driving unit 154 lowers the pick-up nozzle 14a so that it approaches the upper surface of the chip 6a.

[0084] 7(d), first ultrasonic wave generator 152 generates ultrasonic waves around opening 14b of pickup nozzle 14a, and negative pressure generator 153 generates negative pressure around opening 14b of pickup nozzle 14a. In other words, negative pressure generator 153 begins to suck air around opening 14b through flow path 14c of pickup nozzle 14a. This allows pickup nozzle 14a to hold tip 6a without contact.

[0085] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0086] Thus, in the second pattern, the control unit 101 causes the first ultrasonic generator 152 to generate ultrasonic waves after the tip 6a is pushed up by the push-up unit 34. This allows the tip 6a to be further vibrated by ultrasonic waves after the tip 6a has been pushed up to promote its peeling from the adhesive sheet 6b, thereby further promoting the peeling of the tip 6a. As a result, the negative pressure generated by the negative pressure generator 153 can be kept small, further reducing the possibility of the tip 6a colliding with the pick-up nozzle 14a.

[0087] In the second pattern, the control unit 101 may cause the first ultrasonic generator 152 to generate ultrasonic waves after the tip 6a is pushed up and peels off a predetermined amount from the adhesive sheet 6b. For example, the predetermined amount may be a predetermined area or a predetermined percentage of the area. In a specific example, the control unit 101 may identify the area of ​​the region of the entire bottom surface of the tip 6a that has been peeled off from the adhesive sheet 6b, for example, by image processing using a camera. The control unit 101 may then cause the first ultrasonic generator 152 to generate ultrasonic waves after the area of ​​that region reaches a predetermined amount, or after the percentage of the area of ​​that region relative to the entire bottom surface area reaches a predetermined amount. This generates ultrasonic waves after the tip 6a peels off a predetermined amount, thereby highly reliably reducing the possibility of the tip 6a colliding with the pickup nozzle 14a.

[0088] 8 is a diagram illustrating an example of detailed operation of pickup nozzle 14a in this embodiment to pick up chip 6a as pattern 3. Pattern 3 differs from pattern 2 in FIG. 7 in that the chip 6a is thrust upward while being subjected to ultrasonic waves.

[0089] Specifically, first, as in the example shown in FIG. 4, the chip 6a to be picked up is placed on a plurality of push-up pins 34a of the push-up section 34 as shown in FIG. 8(a).

[0090] 8B, drive unit 154 lowers pickup nozzle 14a to approach the top surface of chip 6a. At this time, first ultrasonic wave generator 152 generates ultrasonic waves around opening 14b of pickup nozzle 14a.

[0091] 8(c), the push-up unit 34 raises the multiple push-up pins 34a, thereby pushing up the chip 6a through the adhesive sheet 6b. The drive unit 154 then raises the pickup nozzle 14a in synchronization with the pushing up of the chip 6a. In other words, the pickup nozzle 14a and the multiple push-up pins 34a are raised while maintaining a constant distance between the bottom surface of the pickup nozzle 14a and the tips of the multiple push-up pins 34a.

[0092] Therefore, in the third pattern, the chip 6a is pushed up while being subjected to ultrasonic waves, and therefore ultrasonic waves can be applied to the chip 6a more efficiently and for a longer period of time than in the first and second patterns. In other words, ultrasonic vibrations of the air can be applied to the chip 6a for a longer period of time, which can further promote the peeling of the chip 6a from the adhesive sheet 6b.

[0093] 8(d), negative pressure generator 153 generates negative pressure around opening 14b of pickup nozzle 14a. That is, negative pressure generator 153 begins to suck air around opening 14b through flow path 14c of pickup nozzle 14a. This allows pickup nozzle 14a to hold tip 6a without contacting it.

[0094] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0095] In this way, the third pattern can further promote the peeling of the chip 6 a from the adhesive sheet 6 b. Furthermore, compared to the second pattern, the generation of ultrasonic waves begins before the generation of negative pressure, that is, the repulsive force acts before the suction force, so the possibility of the chip 6 a colliding with the pick-up nozzle 14 a can be further reduced.

[0096] 9 is a diagram illustrating an example of the detailed operation of the pickup nozzle 14a in this embodiment to pick up the tip 6a as a fourth pattern. This fourth pattern can be considered a modification of the second pattern shown in FIG. 7. That is, in the fourth pattern, the timing of generating ultrasonic waves and negative pressure differs from that in the second pattern, but other operations are performed in the same way as in the second pattern.

[0097] Specifically, first, as shown in Fig. 9(a), the chip 6a to be picked up is placed on a plurality of push-up pins 34a of the push-up unit 34. Next, as shown in Fig. 9(b), the push-up unit 34 raises the plurality of push-up pins 34a to push up the chip 6a through the adhesive sheet 6b. Next, as shown in Fig. 9(c), the drive unit 154 lowers the pickup nozzle 14a to bring it close to the top surface of the chip 6a.

[0098] Then, as shown in Figure 9(d), first ultrasonic wave generator 152 generates ultrasonic waves around opening 14b of pick-up nozzle 14a. Thereafter, as shown in Figure 9(e), negative pressure generator 153 generates negative pressure around opening 14b of pick-up nozzle 14a. In other words, negative pressure generator 153 begins to suck air around opening 14b through flow path 14c of pick-up nozzle 14a.

[0099] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0100] Thus, in the fourth pattern, compared to the second pattern, the generation of ultrasonic waves begins before the generation of negative pressure, i.e., the repulsive force acts before the suction force, thereby further reducing the possibility of the tip 6a colliding with the pick-up nozzle 14a.

[0101] 10 is a diagram illustrating an example of detailed operation of the pickup nozzle 14a in this embodiment to pick up the chip 6a as a fifth pattern. This fifth pattern can be considered a modification of the second pattern shown in FIG. 7. In other words, the fifth pattern further includes an operation for facilitating the peeling of the chip 6a from the adhesive sheet 6b, in addition to the operation of the second pattern.

[0102] Specifically, the pickup system 100 performs the operations shown in (a) to (d) of Figure 10. The operations shown in (a) to (d) of Figure 10 are the same as the operations shown in (a) to (d) of Figure 7. Through these operations, the pickup nozzle 14a holds the tip 6a in a non-contact manner.

[0103] Next, as shown in (e) of Fig. 10, the negative pressure generating unit 153 stops generating the negative pressure. Then, as shown in (d) of Fig. 10, the negative pressure generating unit 153 starts generating the negative pressure again. By repeatedly starting and stopping the generation of the negative pressure in this way, the negative pressure generating unit 153 encourages the chip 6a to peel off from the adhesive sheet 6b.

[0104] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0105] In this way, in the fifth pattern, the repeated start and stop of the generation of negative pressure can promote the peeling of chip 6a from adhesive sheet 6b more than any of the above-mentioned patterns.

[0106] In the above embodiment, the generation of negative pressure begins after the tip 6 a is pushed up, but the generation of negative pressure may begin before the tip 6 a is pushed up as long as the tip 6 a is picked up appropriately. For example, the tip 6 a may be picked up as shown in the examples of FIGS. 11 and 12 .

[0107] FIG. 11 is a diagram for explaining an exceptional operation in which the pick-up nozzle 14a picks up the tip 6a in this embodiment as a first exceptional pattern.

[0108] 4, as shown in Fig. 11(a), the chip 6a to be picked up is placed on a plurality of push-up pins 34a of the push-up unit 34. Next, as shown in Fig. 11(b), the drive unit 154 lowers the pickup nozzle 14a to bring it close to the top surface of the chip 6a.

[0109] 11(c), first ultrasonic wave generator 152 generates ultrasonic waves around opening 14b of pickup nozzle 14a, and negative pressure generator 153 generates negative pressure around opening 14b of pickup nozzle 14a before pushing up tip 6a. In other words, negative pressure generator 153 sucks air around opening 14b through flow path 14c of pickup nozzle 14a. This allows pickup nozzle 14a to hold tip 6a without contact.

[0110] 11(d), the push-up unit 34 raises the multiple push-up pins 34a, thereby pushing up the chip 6a through the adhesive sheet 6b. The drive unit 154 then raises the pickup nozzle 14a in synchronization with the pushing up of the chip 6a. In other words, the pickup nozzle 14a and the multiple push-up pins 34a are raised while maintaining a constant distance between the bottom surface of the pickup nozzle 14a and the tips of the multiple push-up pins 34a.

[0111] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0112] 12 is a diagram illustrating an exceptional operation in which the pickup nozzle 14a picks up the tip 6a in this embodiment as a second exceptional pattern. This second exceptional pattern can be considered a modified example of the first exceptional pattern shown in FIG. 11. That is, in the second exceptional pattern, the timing of generating ultrasonic waves and negative pressure differs from that of the first exceptional pattern, but other operations are performed in the same way as in the first exceptional pattern.

[0113] Specifically, as shown in FIG. 12A, the chip 6a to be picked up is first placed on the multiple push-up pins 34a of the push-up unit 34. Then, in the second exceptional pattern, the first ultrasonic wave generator 152 generates ultrasonic waves from around the opening 14b of the pickup nozzle 14a. In other words, the first ultrasonic wave generator 152 generates ultrasonic waves constantly. Furthermore, in the second exceptional pattern, the negative pressure generator 153 also generates negative pressure around the opening 14b of the pickup nozzle 14a. In other words, the negative pressure generator 153 generates negative pressure constantly.

[0114] 12B, the drive unit 154 lowers the pickup nozzle 14a to approach the upper surface of the tip 6a, so that the pickup nozzle 14a holds the tip 6a without contacting it.

[0115] Next, as shown in Fig. 12(c), the push-up unit 34 and the driver 154 perform the same operations as those shown in Fig. 11(d) for the first exceptional pattern. That is, the push-up unit 34 raises the multiple push-up pins 34a to push up the chip 6a through the adhesive sheet 6b. Then, the driver 154 raises the pickup nozzle 14a in synchronization with the pushing up of the chip 6a.

[0116] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0117] In this second exceptional pattern, the time required for pickup can be reduced compared to the first exceptional pattern.

[0118] (Embodiment 2) The pickup system of this embodiment executes additional operations for properly picking up the chips 6a, which are not executed by the pickup system 100 of Embodiment 1. Furthermore, the pickup system of this embodiment may execute any of the operations of the first to fifth patterns, the first exception pattern, and the second exception pattern of Embodiment 1.

[0119] FIG. 13 is a perspective view of a component mounting apparatus 1a according to this embodiment.

[0120] As shown in FIG. 13 , the component mounting device 1a of the present embodiment includes the components included in the component mounting device 1 of the first embodiment and a second ultrasonic wave generating unit 35. The second ultrasonic wave generating unit 35 is disposed below the adhesive sheet 6b and outputs ultrasonic waves toward the adhesive sheet 6b. Such a second ultrasonic wave generating unit 35 is provided in the pickup system of the present embodiment. In addition, in the present embodiment, the push-up unit 34 and the second ultrasonic wave generating unit 35 are disposed below the adhesive sheet 6b so as to be movable along the XY plane. Specifically, the push-up unit 34 and the second ultrasonic wave generating unit 35 are disposed so as to be movable such that one of the push-up unit 34 and the second ultrasonic wave generating unit 35 can be disposed below the chip 6a and adhesive sheet 6b to be picked up, replacing the other.

[0121] FIG. 14 is a diagram showing an example of the configuration of a pickup system according to this embodiment.

[0122] The pickup system 100a in this embodiment is a system provided in the component mounting device 1a, and includes, for example, a component holding unit 15, a push-up unit 34, a control unit 101, a second ultrasonic generating unit 35, a light emitting unit 161, a camera 162, and a moving mechanism 36.

[0123] In this embodiment, component holder 15 includes holder body 15c and pickup nozzle 14a. Holder body 15c in this embodiment includes not only first ultrasonic wave generator 152, negative pressure generator 153, and driver 154 from the first embodiment, but also a measuring unit 155. Measuring unit 155 measures the flow rate of air flowing into pickup nozzle 14a through opening 14b to generate negative pressure using negative pressure generator 153. The air flowing into pickup nozzle 14a is specifically air flowing through flow path 14c.

[0124] Light emitting portion 161 emits light to illuminate the area around opening 14b of pick-up nozzle 14a.

[0125] The camera 162 captures an image of the area around the opening 14b of the pickup nozzle 14a illuminated by the light-emitting unit 161. For example, when the pickup nozzle 14a is holding the tip 6a in a non-contact manner, the light-emitting unit 161 emits light and the camera 162 captures the image. This results in a pickup image that shows the area around the opening 14b of the pickup nozzle 14a illuminated by the light-emitting unit 161 and the tip 6a. The pickup image can also be said to show the state in which the pickup nozzle 14a is holding the tip 6a in a non-contact manner (hereinafter also referred to as the holding state). The control unit 101 identifies the distance between the pickup nozzle 14a and the tip 6a that is shown in the pickup image. This allows the holding state of the tip 6a to be recognized.

[0126] The moving mechanism 36 includes, for example, a motor and moves the thrust-up unit 34 and the second ultrasonic wave generating unit 35 along the XY plane in accordance with control by the control unit 101. For example, the moving mechanism 36 places the thrust-up unit 34 at the pick-up operation position P shown in FIG. 2 and moves the second ultrasonic wave generating unit 35 to a position other than the pick-up operation position P. Alternatively, the moving mechanism 36 places the second ultrasonic wave generating unit 35 at the pick-up operation position P instead of the thrust-up unit 34 and moves the thrust-up unit 34 to a position other than the pick-up operation position P.

[0127] FIG. 15 is a diagram for explaining an example of a basic operation in which the pick-up nozzle 14a picks up the tip 6a in this embodiment.

[0128] First, the moving mechanism 36 moves the second ultrasonic generator 35 to its pick-up operation position P, as shown in FIG. 15A. Then, the second ultrasonic generator 35 outputs ultrasonic waves from below toward the chip 6a to be picked up via the adhesive sheet 6b. At this time, the second ultrasonic generator 35 outputs ultrasonic waves without contacting the adhesive sheet 6b. For example, if the second ultrasonic generator 35 is in contact with the adhesive sheet 6b, the vibration of the second ultrasonic generator 35 may be transmitted to the chip 6a via the adhesive sheet 6b, potentially damaging the chip 6a. However, in this embodiment, as described above, the second ultrasonic generator 35 outputs ultrasonic waves without contact, thereby reducing the possibility of damaging the chip 6a.

[0129] 15(b), the moving mechanism 36 retracts the second ultrasonic generator 35 from the pickup operation position P and moves the push-up unit 34 to the pickup operation position P. Thereafter, the pickup system 100a performs the same operation as the pickup system 100 of the first embodiment.

[0130] 15(c), the push-up unit 34 raises the multiple push-up pins 34a to push up the chip 6a through the adhesive sheet 6b. The pickup nozzle 14a then holds the pushed-up chip 6a without contact. That is, the pickup nozzle 14a holds the chip 6a without contact by using a suction force that draws the chip 6a toward the opening 14b of the pickup nozzle 14a and a repulsive force that moves the chip 6a away from the opening 14b. The suction force is obtained by generating a negative pressure using the negative pressure generator 153, and the repulsive force is obtained by generating ultrasonic waves using the first ultrasonic generator 152.

[0131] 15(b), the pickup system 100a may hold the chip 6a in a non-contact manner as shown in Fig. 15(c) by performing the operation of any one of the first to fifth patterns in embodiment 1. Alternatively, the pickup system 100a may perform the operation of the first exception pattern or the second exception pattern in embodiment 1.

[0132] In this embodiment, the ultrasonic waves output by the second ultrasonic generator 35 can transmit the vibrations of the air caused by the ultrasonic waves to the chip 6a attached to the adhesive sheet 6b via the adhesive sheet 6b. This can further promote the peeling of the chip 6a. As a result, the possibility of the chip 6a colliding with the pick-up nozzle 14a can be further reduced.

[0133] Furthermore, in this embodiment, the promotion of peeling of the chip 6 a by ultrasonic waves output from the second ultrasonic wave generating unit 35 and the promotion of peeling of the chip 6 a by thrusting can be alternately switched. As a result, the peeling of the chip 6 a can be more appropriately promoted. As a result, the possibility of the chip 6 a colliding with the pick-up nozzle 14 a can be further reduced.

[0134] In addition, in this embodiment, the adhesive sheet 6b is pushed up from below and ultrasonic waves are output, but if the ultrasonic wave output is sufficient to promote the peeling of the chip 6a, pushing up does not have to be performed.

[0135] FIG. 16 is a diagram showing an example of the adjustment of the negative pressure by the negative pressure generating unit 153.

[0136] 16, control unit 101 controls negative pressure generator 153 to adjust the negative pressure based on the air flow rate measured by measuring unit 155. The air flow rate is the flow rate of air flowing through flow path 14c of pickup nozzle 14a when pickup nozzle 14a holds tip 6a in a non-contact manner.

[0137] 16A, the air flow rate measured by measuring unit 155 is 0.5 L / min. In this case, because the air flow rate is small, the gap between tip 6a and pick-up nozzle 14a is narrow, and there is a risk that tip 6a will come into contact with pick-up nozzle 14a.

[0138] Therefore, the negative pressure generator 153 adjusts the negative pressure as shown in FIG. 16(b) based on the control of the controller 101. For example, the negative pressure generator 153 reduces the negative pressure. This increases the distance between the tip 6a and the pick-up nozzle 14a, and the air flow rate measured by the measuring unit 155 increases to 4.5 L / min. As a result, contact of the tip 6a can be suppressed. In other words, it is possible to suppress the tip 6a from being scratched, bent, or broken due to contact of the tip 6a with the pick-up nozzle 14a.

[0139] As described above, in this embodiment, the negative pressure generating unit 153 is controlled so that the flow rate measured by the measuring unit 155 falls within a predetermined range. In the example of Fig. 16, the predetermined range is, for example, 4.4 to 4.6 L / min. The example of Fig. 16 illustrates a case where the flow rate measured by the measuring unit 155 is lower than the predetermined range, but if the flow rate is higher than the predetermined range, the control unit 101 may control the negative pressure generating unit 153 to increase the negative pressure.

[0140] Thus, by measuring the flow rate using the measuring unit 155, it is possible to grasp the state in which the pickup nozzle 14a is holding the chip 6a, and to correct that holding state to an appropriate state. As a result, it is possible to prevent the chip 6a from falling from the pickup nozzle 14a, and further to prevent the chip 6a from coming into contact with the pickup nozzle 14a. This allows the chip 6a to be picked up appropriately, and for example, the chip 6a can be turned over and handed over to the component mounting nozzle 20a appropriately. In a specific example, it is possible to prevent the chip 6a from falling from the pickup nozzle 14a when the chip 6a is turned over.

[0141] FIG. 17 is a diagram showing another example of the adjustment of the negative pressure by the negative pressure generating unit 153. In FIG.

[0142] For example, as shown in FIG. 16, the control unit 101 controls the negative pressure generating unit 153 to adjust the negative pressure based on a pickup image obtained by the camera 162 .

[0143] 17A, the control unit 101 acquires the pickup image from the camera 162 and identifies the distance between the tip 6a and the pickup nozzle 14a shown in the pickup image. The distance is, for example, 10 μm. In this case, the distance between the tip 6a and the pickup nozzle 14a is so small that there is a risk that the tip 6a will come into contact with the pickup nozzle 14a.

[0144] Therefore, the negative pressure generator 153 adjusts the negative pressure as shown in FIG. 17B under the control of the controller 101. For example, the negative pressure generator 153 reduces the negative pressure. This increases the gap between the tip 6a and the pick-up nozzle 14a. This gap can be increased to, for example, 25 μm. This makes it possible to prevent the tip 6a from coming into contact with the pick-up nozzle 14a. In other words, it is possible to prevent the tip 6a from being scratched, bent, or broken due to contact between the tip 6a and the pick-up nozzle 14a.

[0145] Thus, in this embodiment, negative pressure generator 153 is controlled so that the distance between tip 6a and pick-up nozzle 14a falls within a predetermined range. In the example of Fig. 17, the predetermined range is, for example, 24 to 26 µm. Also, while the example of Fig. 17 shows a case where the distance between tip 6a and pick-up nozzle 14a is narrow, if the distance is wide, control unit 101 may control negative pressure generator 153 to increase the negative pressure.

[0146] FIG. 18 is a flowchart showing the processing operation of the control unit 101 in this embodiment.

[0147] First, the control unit 101 causes the second ultrasonic wave generating unit 35 to output ultrasonic waves (step S21). That is, the second ultrasonic wave generating unit 35 is placed at the pick-up operation position P, and outputs ultrasonic waves from below to the chip 6a to be picked up via the adhesive sheet 6b. Next, the control unit 101 interchanges the second ultrasonic wave generating unit 35 with the push-up unit 34 (step S22). That is, the second ultrasonic wave generating unit 35 retreats from the pick-up operation position P and moves to a location other than the pick-up operation position P. Then, the push-up unit 34 is placed at the pick-up operation position P.

[0148] Next, the control unit 101 starts pushing up the tip 6a by the push-up unit 34 (step S23). The control unit 101 may repeatedly execute the processes of steps S21 to S23. That is, after the tip 6a has been pushed up in step S23, the control unit 101 releases the pushing up of the tip 6a and places the second ultrasonic generator 35 at the pick-up operation position P instead of the push-up unit 34. Then, the control unit 101 repeatedly executes the processes from step S21.

[0149] Next, control unit 101 controls negative pressure generator 153 to generate a negative pressure, causing pickup nozzle 14a to hold tip 6a in a non-contact manner (step S24). Steps S23 and S24 are the same processes as steps S1 and S2 shown in FIG. 5 of the first embodiment.

[0150] Next, the control unit 101 acquires the air flow rate measured by the measuring unit 155 (step S25) and determines whether the flow rate is within an appropriate range (step S26). If the control unit 101 determines that the flow rate is within the appropriate range (Yes in step S26), it causes the camera 162 to capture an image of the state in which the tip 6a is held by the pickup nozzle 14a (step S27). This results in the above-mentioned pickup image.

[0151] Next, the control unit 101 determines whether the holding state shown in the pickup image is appropriate (step S28). That is, the control unit 101 determines whether the distance between the chip 6a and the pickup nozzle 14a shown in the pickup image is within an appropriate range. If the control unit 101 determines that the distance is within the appropriate range (Yes in step S28), it controls the drive unit 154 to raise the pickup nozzle 14a to a position where the chip 6a can be delivered to the component mounting nozzle 20a (step S30).

[0152] On the other hand, if the control unit 101 determines in step S26 that the flow rate is not within the appropriate range (No in step S26), it causes the negative pressure generator 153 to adjust the negative pressure (step S29) and repeats the processing from step S25. Similarly, if the control unit 101 determines in step S28 that the interval is not within the appropriate range (No in step S28), it causes the negative pressure generator 153 to adjust the negative pressure (step S29) and repeats the processing from step S25.

[0153] In this embodiment, measuring unit 155 is a flow meter that measures the flow rate of air, but it may also be a pressure meter that measures the pressure of air. This air pressure is the pressure of air flowing into pickup nozzle 14a through opening 14b in order to generate negative pressure with negative pressure generator 153. Specifically, the air flowing into pickup nozzle 14a is air flowing through flow path 14c. In this case, control unit 101 controls negative pressure generator 153 so that the pressure measured by measuring unit 155 falls within a predetermined range.

[0154] Furthermore, instead of controlling the negative pressure generating unit 153, the control unit 101 may control the first ultrasonic wave generating unit 152, or may control both the negative pressure generating unit 153 and the first ultrasonic wave generating unit 152. That is, the control unit 101 controls at least one of the negative pressure generating unit 153 and the first ultrasonic wave generating unit 152 so that the flow rate or pressure measured by the measuring unit 155 falls within a predetermined range. In other words, the control unit 101 controls at least one of the suction force caused by the negative pressure and the repulsive force caused by the ultrasonic waves. This makes it possible to correct the holding state to an appropriate state.

[0155] (Other Modifications) While pickup systems according to one or more aspects have been described above based on the respective embodiments, the present disclosure is not limited to these embodiments. As long as they do not deviate from the spirit of the present disclosure, various modifications conceivable by those skilled in the art to the above-described embodiments and configurations constructed by combining the components of the respective embodiments may also be included in the present disclosure.

[0156] For example, in the first and second embodiments, the pushed-up chip 6a is held in a non-contact state, but the non-pushed-up chip 6a may exceptionally be held in a non-contact state.

[0157] FIG. 19 is a diagram for explaining an exceptional operation in which the pick-up nozzle 14a picks up the tip 6a as a third exceptional pattern.

[0158] 19A, the second ultrasonic wave generating unit 35 is placed at the pick-up operation position P. Then, the second ultrasonic wave generating unit 35 outputs ultrasonic waves from below to the chip 6a to be picked up via the adhesive sheet 6b. At this time, the second ultrasonic wave generating unit 35 outputs ultrasonic waves without coming into contact with the adhesive sheet 6b.

[0159] Next, as shown in Figure 19(b), the drive unit 154 lowers the pickup nozzle 14a to approach the top surface of the tip 6a. Furthermore, the first ultrasonic wave generator 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a. Then, as shown in Figure 19(c), the negative pressure generator 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. In other words, the negative pressure generator 153 sucks air around the opening 14b through the flow path 14c of the pickup nozzle 14a. This allows the pickup nozzle 14a to hold the tip 6a without contacting it.

[0160] Next, as shown in Fig. 19(d), second ultrasonic wave generator 35 stops outputting ultrasonic waves. Thereafter, similar to the example shown in Fig. 4(d), pickup nozzle 14a is driven by driver 154 to rise while holding tip 6a in a non-contact state.

[0161] 19, the tip 6a is not pushed up, but after the push-up unit 34 pushes up the tip 6a and then releases the push-up, ultrasonic waves may be output by the second ultrasonic generator 35 shown in FIG. 19(a). Also, in the example shown in FIG. 19, the first ultrasonic generator 152 generates ultrasonic waves to hold the tip 6a in a non-contact manner, but the first ultrasonic generator 152 does not have to generate ultrasonic waves. In this case, the pickup nozzle 14a comes into contact with the tip 6a and picks up the tip 6a by suction.

[0162] Furthermore, in the first and second embodiments, chips 6a attached to adhesive sheets 6b are picked up, but chips 6a placed on a tray may also be picked up.

[0163] FIG. 20 is a diagram for explaining an exceptional operation in which the pick-up nozzle 14a picks up the tip 6a as a fourth exceptional pattern.

[0164] First, as shown in FIG. 20( a ), the pick-up nozzle 14 a is positioned above the chip 6 a placed on the tray 4 .

[0165] Next, as shown in FIG. 20(b), the driving unit 154 lowers the pick-up nozzle 14a so that it approaches the upper surface of the chip 6a.

[0166] As shown in FIG. 20C, the first ultrasonic wave generator 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a. Furthermore, the negative pressure generator 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. That is, the negative pressure generator 153 begins to suck air around the opening 14b through the flow path 14c of the pickup nozzle 14a. This allows the pickup nozzle 14a to hold the chip 6a without contact. For example, if the pickup nozzle 14a approaches the chip 6a while ultrasonic waves are being generated, the chip 6a, which is subjected to air vibrations caused by the ultrasonic waves, may slip off the tray 4 because it is not attached to the tray 4. However, in the case of the fourth exceptional pattern, ultrasonic waves are generated after the pickup nozzle 14a approaches the top surface of the chip 6a, preventing the chip 6a from slipping off.

[0167] Thereafter, similar to the example shown in FIG. 4D, pickup nozzle 14a is driven by drive unit 154 to rise while holding tip 6a in a non-contact state.

[0168] In the first and second embodiments, the tip 6 a is held using ultrasonic waves. That is, the tip 6 a is held by a so-called ultrasonic non-contact chuck. However, the present disclosure is not limited to ultrasonic non-contact chucks, and the tip 6 a may be held by a Bernoulli chuck. In a Bernoulli chuck, the negative pressure generator 153 generates negative pressure around the opening 14 b of the pickup nozzle 14 a by blowing a swirling flow of air from the periphery of the opening 14 b. In a Bernoulli chuck, the flow path 14 c of the pickup nozzle 14 a is maintained at positive pressure, and the air flows along the flow path 14 c toward the opening 14 b. Even with such a Bernoulli chuck, the effects of the first and second embodiments can be achieved by generating negative pressure after the tip 6 a is pushed up.

[0169] Furthermore, in the first and second embodiments, the pickup nozzle 14a holds the chip 6a in a non-contact manner, but the component mounting nozzle 20a may also hold the chip 6a in a non-contact manner, similar to the pickup nozzle 14a.

[0170] In each of the above embodiments, the control unit 101 and the like may be configured with dedicated hardware, or may be realized by executing a software program suitable for the control unit 101. The control unit 101 may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that realizes the control unit 101 and the like in the above embodiments causes a computer to execute, for example, each step of the flowchart shown in FIG. 5 or FIG. 18.

[0171] The following cases are also included in this disclosure:

[0172] (1) Specifically, the control unit 101 may be a computer system including a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The control unit 101 achieves its functions by the microprocessor operating in accordance with the computer program. Here, the computer program is composed of a combination of multiple instruction codes that indicate commands to the computer to achieve a predetermined function.

[0173] (2) The control unit 101 may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions by the microprocessor operating in accordance with the computer program.

[0174] (3) The control unit 101 may be configured as a removable IC card or a standalone module. The IC card or module is a computer system configured with a microprocessor, ROM, RAM, etc. The IC card or module may include the ultra-multifunctional LSI described above. The IC card or module achieves its functions when the microprocessor operates in accordance with a computer program. This IC card or module may be tamper-resistant.

[0175] (4) The present disclosure may be embodied as the methods described above, a computer program that implements these methods on a computer, or a digital signal that includes the computer program.

[0176] The present disclosure may also be a computer program or a digital signal recorded on a computer-readable recording medium, such as a flexible disk, a hard disk, a CD (Compact Disc)-ROM, a DVD, a DVD-ROM, a DVD-RAM, a BD (Blu-ray (registered trademark) Disc), a semiconductor memory, etc. Alternatively, the present disclosure may be a digital signal recorded on such a recording medium.

[0177] The present disclosure may also be applied to transmitting a computer program or digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0178] Furthermore, the program or digital signal may be recorded on a recording medium and transferred, or the program or digital signal may be transferred via a network or the like, so that the program or digital signal may be implemented by another independent computer system.

[0179] The present disclosure can be used, for example, in a system that picks up a part and performs a task using that part.

[0180] DESCRIPTION OF SYMBOLS 1, 1a Component mounting device 2 Base 3 Component supply section 3a Holding table 5 Substrate holding section 5a Transport rail 6 Semiconductor wafer unit 6a Chip 6b Adhesive sheet 7 Substrate 11 Frame 11a Support post 11b Y-axis frame 12 Y-axis drive mechanism 13 Component mounting section 13a Moving plate 13b Lifting mechanism 13c Lifting plate 14 Pickup head 14a Pickup nozzle (holding tool) 14b Opening 14c Flow path 15 Component holding section 15a Arm 15b Pickup head moving mechanism 15c Holding main body 20 Mounting unit 20a Component mounting nozzle 21 Pickup camera 31 XY table mechanism 32 Moving plate 33 Support member 34 Push-up section 34a Push-up pin 35 Second ultrasonic wave generating section 36 Moving mechanism 100, 100a Pickup system 101 Control unit 152 First ultrasonic wave generating unit 153 Negative pressure generating unit 154 Driving unit 155 Measuring unit 161 Light emitting unit 162 Camera

Claims

1. a push-up section that pushes up a component attached on an adhesive sheet from below through the adhesive sheet; a component holding section that holds the component attached to the adhesive sheet from above using a holding tool that has an opening and can be raised and lowered; a negative pressure generating unit that generates a negative pressure around the opening of the holding tool; a control unit that controls the push-up unit, the component holding unit, and the negative pressure generating unit, The control unit is The push-up portion starts to push up the component, The component is held by the holding tool in a non-contact manner using an attractive force that attracts the component toward the opening of the holding tool and a repulsive force that moves the component away from the opening; Raising the holding tool holding the part; When the part is held by the holding tool, After the component is pushed up by the push-up portion, negative pressure is generated by the negative pressure generating portion to generate the suction force. Pickup system.

2. The component holder further comprises: a first ultrasonic generating unit that generates ultrasonic waves from the periphery of the opening by vibrating the holding tool; The control unit is When the part is held by the holding tool, The repulsive force is generated by causing the first ultrasonic generating unit to generate ultrasonic waves. The pickup system of claim 1 .

3. The control unit is The first ultrasonic generating unit generates ultrasonic waves before the push-up unit starts to push up the component. The pickup system of claim 2 .

4. The control unit is After the component is pushed up by the push-up portion, ultrasonic waves are generated by the first ultrasonic generating portion. The pickup system of claim 2 .

5. The control unit is After the component is pushed up and peeled off from the adhesive sheet by a predetermined amount, ultrasonic waves are generated in the first ultrasonic generating unit. The pickup system of claim 4.

6. The pickup system further comprises: a second ultrasonic generating unit that is disposed below the adhesive sheet and outputs ultrasonic waves toward the adhesive sheet; The pickup system of claim 2 .

7. The thrusting portion and the second ultrasonic generating portion are one of the push-up unit and the second ultrasonic generating unit is movably disposed below the component and the adhesive sheet so as to be replaced with the other one; The pickup system of claim 6.

8. The pickup system further comprises: A measuring unit is provided that measures a flow rate of air flowing into the holding tool through the opening or a pressure of the air in order to generate a negative pressure by the negative pressure generating unit, The control unit is At least one of the negative pressure generating unit and the first ultrasonic generating unit is controlled so that the flow rate or the pressure measured by the measuring unit falls within a predetermined range. A pickup system according to any one of claims 2 to 7.

9. The control unit: The component is pushed up by the push-up unit while applying ultrasonic waves generated by the first ultrasonic generating unit to the component. The pickup system of claim 2 .

10. The control unit repeatedly starts and stops the generation of negative pressure by the negative pressure generating unit. The pickup system of claim 1 .

11. The control unit controls the negative pressure generating unit so that the distance between the component and the holding tool falls within a predetermined range. The pickup system of claim 1 .

12. The control unit controls the amount of negative pressure generated according to the interval. The pickup system of claim 11.

13. A push-up operation is started to push the component attached on the adhesive sheet upward through the adhesive sheet from below, a holding tool having an opening holds the component in a non-contact manner by using an attractive force that draws the component toward the opening and a repulsive force that moves the component away from the opening; The holding tool rises while holding the part, When the holding tool holds the part, After the component is pushed up by the pushing-up operation, a negative pressure is generated around the opening of the holding tool by a negative pressure generating unit, thereby generating the suction force. Pick-up method.