Method and device for transferring electronic component

Abstract

This method is for transferring, from a first holding member (20A) to a second holding member (20B), an electronic component (1) that has one end and the other end, the method comprising: a first step (D1) for shortening the distance between the first holding member to which the other end of the electronic component has been bonded and the second holding member, and bonding the other end of the electronic component to the second holding member; and a second step (D2 and D3, or D2 and D4) for detaching the electronic component, which is bonded to the second holding member, from the first holding member by using a difference in bonding strength between the first holding member and the second holding member. The second step includes a distance extension movement (D3) for extending the distance between the first holding member and the second holding member, and a position changing movement (D2 or D4) for parallelly moving one of the first holding member and the second holding member relative to the other at least at the time of and / or before starting the distance extension movement.

Description

Electronic component transfer method and device

[0001] The present invention relates to a transfer method and device for transferring an electronic component held by a first holding member to a second holding member.

[0002] In a method for manufacturing an electronic component, for example, forming an external electrode on an electronic component such as a multilayer capacitor, one end of the electronic component is held on an adhesive plate and the other end is coated with a conductive paste (FIG. 8 of Patent Document 1).

[0003] JP 2012-244104 A

[0004] As shown in FIG. 1 of Patent Document 1, in order to form external electrodes at both ends of an electronic component, it is necessary to first form a first external electrode by applying and drying a conductive paste to one end of the electronic component, the other end of which is adhered to an adhesive plate, and then form a second external electrode at the other end of the electronic component while the first external electrode is still adhered to the adhesive plate.

[0005] However, after forming the first external electrode and before forming the second external electrode, it was necessary to peel off the end portion that had been adhered to the adhesive plate from the adhesive plate and then re-adhere the first external electrode of the electronic component to the adhesive plate, which was a cumbersome process.

[0006] An object of the present invention is to provide a method and device for transferring an electronic component that can transfer an electronic component from a first holding member directly and smoothly to a second holding member.

[0007] (1) One aspect of the present invention relates to a method for transferring an electronic component having one end and the other end from a first holding member to a second holding member, the method comprising: a first step of shortening the distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second holding member; and a second step of peeling the electronic component adhered to the second adhesive surface of the second holding member from the first holding member by utilizing an adhesive force difference between a first adhesive surface of the first holding member and a second adhesive surface of the second holding member, the second adhesive surface having an adhesive force per unit area greater than that of the first adhesive surface, the second step including a distance expansion movement that expands the distance between the first holding member and the second holding member, and a position change movement that moves one of the first holding member and the second holding member in parallel with respect to the other at least at the start of and / or before the start of the distance expansion movement.

[0008] According to one aspect of the present invention, the repositioning movement during the second step tilts the electronic component relative to a perpendicular line to the first holding member. This allows the other end of the electronic component to be locally peeled off from the first adhesive surface of the first holding member. This weakens the adhesive force of the electronic component held by the first adhesive surface of the first holding member. At this time, one end of the electronic component may also be locally peeled off from the second adhesive surface of the second holding member. However, because the adhesive force per unit area of ​​the second adhesive surface of the second holding member is greater than that of the first adhesive surface of the first holding member, the electronic component adheres more strongly to the second adhesive surface than to the first adhesive surface. Meanwhile, the distance expansion movement performed simultaneously with or after the repositioning movement completely peels the electronic component off from the first adhesive surface of the first holding member, and the electronic component is held only by the second holding member.

[0009] (2) In one aspect (1) of the present invention, the second step may include the position change movement performed before the start of the distance expansion movement and the distance expansion movement performed thereafter. By performing the position change movement before the start of the distance expansion movement, the other end of the electronic component is locally peeled off from the first adhesive surface of the first holding member during the distance expansion movement, making it easier to remove the electronic component from the first holding member. Note that the position change movement performed before the start of the distance expansion movement may be, for example, a linear movement, performed multiple times as one step. This is effective for reliably removing the electronic component from the first holding member.

[0010] (3) In the aspect (1) of the present invention, the second step can simultaneously perform the distance expansion movement and the position change movement. In this way, localized peeling in different regions is repeated and the electronic component is simultaneously separated from the first holding member, so that the electronic component can be reliably released from the first holding member.

[0011] (4) In one aspect (3) of the present invention, the position change movement can change the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member so that the direction of movement of the two-dimensional position within the plane of the first adhesive surface changes sequentially. In this way, the direction of movement of the electronic component's two-dimensional position within the projection plane changes sequentially, thereby sequentially changing the inclination of the central axis of the electronic component, which is inclined relative to the perpendicular to the first holding member. This also sequentially changes the local position at which the other end of the electronic component is peeled from the first adhesive surface of the first holding member. Therefore, local peeling in different regions is repeated, making it easier to detach the electronic component from the first holding member.

[0012] (5) In one aspect (1) of the present invention, the electronic component may have a first external electrode formed on the one end and a second external electrode not formed on the other end. In this case, the first external electrode is formed in advance on one end of the electronic component held by the first holding member before transfer. Thereafter, the second external electrode can be applied to the other end of the electronic component transferred from the first holding member to the second holding member.

[0013] (6) Another aspect of the present invention is a device comprising: a first holding member including a first adhesive surface and capable of holding an electronic component having one end and the other end by adhering the one end of the electronic component to the first adhesive surface; a second holding member including a second adhesive surface having a greater adhesive force per unit area than the first adhesive surface and capable of holding the electronic component by adhering the other end to the second adhesive surface; and a movement mechanism that moves the first holding member and the second holding member relatively, wherein the movement mechanism: adheres the other end of the electronic component to the second adhesive surface of the second holding member by a distance-reducing movement that reduces the distance between the first holding member and the second holding member to which the other end of the electronic component is adhered; and then peels the electronic component adhered to the second holding member from the first adhesive surface of the first holding member by a distance-expanding movement that expands the distance between the first holding member and the second holding member; The present invention relates to an electronic component transfer device, wherein the electronic component transfer device locally peels the other end of the electronic component from the first adhesive surface by a position change movement that translates one of the first holding member and the second holding member relative to the other at least at the start of and / or before the start of the distance expansion movement.

[0014] (7) The aspects (2) to (5) of the present invention can also be applied to the other aspect (6) of the present invention.

[0015] 1 is a diagram showing an example of an electronic component manufactured by an electronic component manufacturing method and apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the electronic component of FIG. 1. FIG. 3 is a diagram showing an electronic component manufacturing apparatus according to an embodiment of the present invention. FIG. 4 is a block diagram of the manufacturing apparatus of FIG. 3. FIG. 5 is a diagram showing a first step of a transfer method. FIG. 6 is a diagram showing a second step of a transfer method in embodiment 1. FIG. 7 is a diagram showing a state in which the electronic component has been transferred. FIG. 8 is a diagram showing a state in which the electronic component has been locally peeled off from the second holding member due to position change movement in the second step. FIG. 9 is a diagram showing a second step of a transfer method in embodiment 2. FIG. 10 is a diagram showing position change movement in the second step in embodiment 2.

[0016] The following invention provides many different embodiments and examples for implementing different features of the presented subject matter. Of course, these are merely examples and are not intended to be limiting. Furthermore, the present invention may repeat reference numerals and / or letters in various examples. Such repetition is for the sake of brevity and clarity and does not necessarily imply a relationship between the various embodiments and / or configurations being described. Furthermore, when a first element is described as being "connected" or "coupled" to a second element, such a description includes embodiments in which the first and second elements are directly connected or coupled to each other, as well as embodiments in which the first and second elements are indirectly connected or coupled to each other with one or more other intervening elements therebetween. Furthermore, when a first element is described as "moving" relative to a second element, such a description includes embodiments in which at least one of the first and second elements moves relative to the other.

[0017] 1. Electronic Component FIG. 1 shows an electronic component 1 manufactured by a manufacturing method according to an embodiment of the present invention, and FIG. 2 schematically shows a cross section of a paste material, e.g., first and second external electrodes 4A and 4B, formed on the electronic component 1. While there are no particular restrictions on the size of the electronic component 1 to which the present invention is applied, the present invention is suitable for electronic components 1 that have been miniaturized in line with downsizing. For example, in a miniature electronic component 1, where L1 is the maximum length of one side of a rectangular (square or oblong) cross section shown in FIG. 1 and L2 is the length perpendicular to the rectangular cross section, L1 = 500 μm or less and L2 = 1000 μm or less. Preferably, L1 = 300 μm or less and L2 = 600 μm or less, more preferably, L1 = 200 μm or less and L2 = 400 μm or less, and even more preferably, L1 = 125 μm or less and L2 = 250 μm or less. The term "rectangle" as used herein includes not only a rectangular shape where two sides meet at a corner that is strictly 90°, but also a substantially rectangular shape with curved or chamfered corners. It goes without saying that the present invention can also be applied to electronic components 1 with cross sections other than rectangular.

[0018] 2 , first and second external electrodes 4A, 4B made of conductive paste layers are formed on both end portions 2, 2 of the electronic component 1. Each end portion 2 of the electronic component 1 includes an end face 2A, a side face 2B, and a corner 2C connecting the end face 2A and the side face 2B. In this embodiment, the first external electrode 4A is first applied to one of the end portions 2 by coating and drying, and then the second external electrode 4B is applied to the other end portion 2.

[0019] 2. Electronic Component Manufacturing Apparatus FIG. 3 shows a manufacturing apparatus 10 used in carrying out this embodiment, and FIG. 4 shows a control system block diagram. This manufacturing apparatus 10 includes a carrier plate (jig) 20 serving as a holder for the electronic component 1, a movement mechanism 50, and a surface plate 100. In FIG. 3, three orthogonal axial directions are designated as X, Y, and Z. The surface plate 100 can be used for processes such as applying the first and second external electrodes 4A and 4B. The surface plate 100 may be used to transfer the electronic component 1 between two carrier plates 20A and 20B (see FIG. 5). Alternatively, a transfer table 200 shown in FIG. 5 may be used instead of the surface plate 100. In this case, the movement mechanism 50 can be moved above the transfer table 200 by a mechanism not shown.

[0020] The carrier plate 20 that holds the plurality of hanging electronic components 1 has an adhesive surface that holds at least one, for example, a plurality of electronic components 1. The carrier plate 20 is detachably supported on a jig fixing plate 30. A base 40 is fixed above the jig fixing plate 30, and a surface plate 100 or a transfer table 200 is disposed below the jig fixing plate 30.

[0021] A squeegee unit 110 including a squeegee 112 and a blade 114 is provided on the surface plate 100. The squeegee unit 110 moves over the surface plate 100. By moving the blade 114, the squeegee unit 110 can form a dip layer of conductive paste 120 having a height H on the surface 101 of the surface plate 100. By moving the squeegee 112, the squeegee unit 110 can scrape off the dip layer of conductive paste 120 from the surface 101 of the surface plate 100.

[0022] The base 40 is provided with a movement mechanism 50 that moves the jig fixture platen 30. Here, the movement mechanism 50 may include an X-axis drive unit 60, a Y-axis drive unit 70, and a Z-axis drive unit 80. The movement mechanism 50 may be configured to move the jig fixture platen 30 and the surface platen 100 relatively in the X, Y, and Z-axis directions. That is, the movement mechanism 50 may move the surface platen 100 (transfer table 200). Alternatively, a movement mechanism 50 that moves the jig fixture platen 30 and a movement mechanism 50 that moves the surface platen 100 (transfer table 200) may be provided. Alternatively, some of the X-axis drive unit 60, Y-axis drive unit 70, and Z-axis drive unit 80 included in the movement mechanism 50 may move the jig fixture platen 30, and the other parts may move the surface platen 100 (transfer table 200).

[0023] The X-axis drive unit 60 may be configured with an X-table that is movable in the X-axis direction relative to the base 40 along an X-axis guide 62. The Y-axis drive unit 70 may be configured with a Y-table that is movable in the Y-axis direction relative to the X-axis drive unit 60 along a Y-axis guide 72. The Z-axis drive unit 80 is fixed to the Y-axis drive unit 70, for example, and is capable of moving a Z-axis 82 in the Z-axis direction. The jig fixing plate 30 is fixed to the Z-axis 82. Note that FIG. 3 does not show drive sources for the X, Y, and Z axes, such as motors and their drive force transmission mechanisms.

[0024] In this way, the jig fixing plate 30, carrier plate 20 and multiple electronic components 1 can be moved in the Z-axis direction relative to the surface plate 100 (transfer table 200) by the moving mechanism 50, and can also be moved along the X-Y plane parallel to the surface of the surface plate 100.

[0025] As shown in FIG. 4 , the manufacturing apparatus 10 includes a control unit 90 that controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80. The control unit 90 is connected to an operation input unit 92, such as a keyboard. The control unit 90 includes a memory unit 91, which stores operation information input via the operation input unit 92 and pre-registered programs. The control unit 90 controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 according to the data and programs stored in the memory unit 91. The control unit 90 can shorten the distance between the jig fixing platen 30 and the surface plate 100 (transfer table 200) (distance shortening movement) using the Z-axis drive unit 80. Furthermore, the control unit 90 can move the jig fixing platen 30 along a movement trajectory, such as a linear or circular trajectory, in a plane parallel to the surface platen 100 (transfer table 200) using the X-axis drive unit 60 and / or the Y-axis drive unit 70 (position change movement). Furthermore, the control unit 90 can use the Z-axis drive unit 80 to expand the distance between the jig fixing plate 30 and the base plate 100 (transfer table 200) (distance expansion movement) simultaneously with or after the linear or circular movement by the X-axis drive unit 60 and the Y-axis drive unit 70.

[0026] 3. Electronic Component Manufacturing Method The manufacturing apparatus 10 of this embodiment performs a prepressing process, a coating process, and a subsequent blotting process on both end portions 2 of the electronic component 1. The prepressing process is a process of bringing the end faces 2A of each of the multiple electronic components 1 held on the carrier plate 20 into contact with the surface plate 100 before the coating process. The coating process is a process of bringing the end portions 2, including the end faces 2A of each of the multiple electronic components 1 held on the carrier plate 20, into contact with a dip layer of conductive paste formed on the surface 101 of the surface plate 100, thereby coating the end portions 2 of each of the multiple electronic components 1 with the conductive paste. The blotting process is a process of bringing the conductive paste applied to the end portions 2 of each of the multiple electronic components 1 held on the carrier plate 20 into contact with the surface 101 of the surface plate 100, and transferring excess conductive paste to the surface plate 100. The conductive paste is then dried to form first and second external electrodes 4A and 4B.

[0027] 5, an electronic component 1 having a first external electrode 4A formed on one end thereof is held by a first carrier plate 20A. That is, the electronic component 1 held by the first carrier plate 20A undergoes the above-described prepressing step, coating step, blotting step, and drying step to form the first external electrode 4A. In order to form a second external electrode 4B on the other end of the electronic component 1, it is necessary to transfer the electronic component 1 from the first carrier plate 20A to a second carrier plate 20B.

[0028] For this reason, in Fig. 5, the first carrier plate 20A, which has been removed from the jig fixing plate 30, is held on the transfer table 200. The first carrier plate 20A is fixed on the transfer table 200, for example, by vacuum suction or clamping. Next, the jig fixing plate 30 and the second carrier plate 20B shown in Fig. 3 are moved above the transfer table 200 on which the first carrier plate 20A is placed. However, the jig fixing plate 30 is omitted in Fig. 5, and only one electronic component 1 is shown on the first carrier plate 20A.

[0029] 5 , the first carrier plate 20A includes a first substrate 21A and a first adhesive sheet (first adhesive surface in a broad sense) 22A. An electronic component 1 having a first external electrode 4A formed on one end thereof is held upright with the other end thereof adhered to the adhesive sheet 22A. The second carrier plate 20B similarly includes a first substrate 21B and a second adhesive sheet 22B (second adhesive surface in a broad sense). The first and second carrier plates 20A and 20B are arranged so that the adhesive sheets 22A and 22B face each other.

[0030] 3.1. Electronic Component Transfer Method (First Embodiment) 3.1.1. First Step As shown in Fig. 5, the distance between the first carrier plate 20A and the second carrier plate 20B to which the other end of the electronic component 1 is adhered is reduced. In this embodiment, the Z-axis drive unit 80 shown in Fig. 3 lowers the second carrier plate 20B in the direction D1 in Fig. 5. In this way, as shown in Fig. 6, the first external electrode 4A at one end of the electronic component 1 can be adhered to the adhesive sheet 22B of the second carrier plate 20B while the other end of the electronic component 1 remains adhered to the adhesive sheet 22A of the first carrier plate 20A.

[0031] 3.1.2. Second Step As shown in FIGS. 6 and 7 , the difference in adhesive strength between the first and second adhesive sheets 22A, 22B is utilized to peel the electronic components 1 adhered to the second carrier plate 20B from the first carrier plate 20A. To achieve this, in FIG. 6 , the X-axis drive unit 60 shown in FIG. 3 slides the second carrier plate 20B in the D2 direction in FIG. 6 (hereinafter also referred to as the D2 movement), and then the Z-axis drive unit 80 shown in FIG. 3 lifts the second carrier plate 20B in the D3 direction in FIG. 6 (hereinafter also referred to as the D3 movement). Here, the D2 movement is a position change movement that translates one of the first carrier plate 20A and the second carrier plate 20B relative to the other. The D3 movement is a distance expansion movement that expands the distance between the first carrier plate 20A and the second carrier plate 20B. The D2 movement (slide movement) performed before the D3 movement may be performed multiple times in different directions. The D3 movement may be performed simultaneously with the D2 movement.

[0032] Here, due to the movement D2 shown in FIG. 6 , the central axis P of the electronic component 1 is tilted with respect to the perpendicular to the first carrier plate 20A, as shown in FIG. 8 . This allows the end surface 2A of the electronic component 1 to be locally peeled off from the adhesive sheet 22A of the first carrier plate 20A, as shown in FIG. 8 . This weakens the adhesive force of the adhesive sheet 22A on the electronic component 1, making it easier to peel the electronic component 1 from the adhesive sheet 22A. At this time, there is a possibility that the first external electrode 4A of the electronic component 1 may also be locally peeled off from the adhesive sheet 22B of the second carrier plate 20B. However, because the adhesive sheet 22B has a greater adhesive force per unit area than the adhesive sheet 22A, even in the state shown in FIG. 8 , the electronic component 1 adheres to the adhesive sheet 22B more strongly than the adhesive sheet 22A.

[0033] By the movement D3 after the movement D2 shown in FIG. 6 , the electronic component 1 is completely peeled off from the adhesive sheet 22A, and as shown in FIG. 7 , the electronic component 1 is held only by the second carrier plate 20B. Thereafter, the second external electrodes 4B can be formed on the electronic component 1 using the second carrier plate 20B in the same manner as the formation of the first external electrodes 4A on the electronic component 1. In particular, by using the above-described transfer method, multiple electronic components 1 can be simultaneously transferred from the first carrier plate 20A to the second carrier plate 20B while maintaining the positional relationship of the multiple electronic components 1 aligned on the first carrier plate 20A. Note that in the first embodiment, the distance expansion movement may be performed simultaneously with the position change movement. In this case, electronic components 1 that are locally peeled off by the position change movement can be separated from the first carrier plate 20A by the distance expansion movement performed simultaneously.

[0034] 3.2. Electronic Component Transfer Method (Embodiment 2) In Embodiment 2, the second step (D2 movement and D3 movement) shown in FIG. 6 of Embodiment 1 is replaced with the D3 movement and D4 movement shown in FIG. 9. In FIG. 9, the distance expansion movement (D3) between the first and second carrier plates 20A and 20B is performed simultaneously with the D4 movement shown in FIG. 10. The D4 movement in FIG. 10 is a movement that changes the two-dimensional position 1A on the projection plane (the plane of FIG. 10) of the electronic component 1 projected onto the adhesive sheet 22A of the first carrier plate 20A so that the movement direction of the two-dimensional position 1A within the projection plane changes sequentially. This D4 movement is also a position change movement that moves one of the first carrier plate 20A and the second carrier plate 20B parallel to the other. Specifically, in Fig. 10, the movement direction of the two-dimensional position 1A (the direction of the tangent 211 to the circle 210 shown in Fig. 10) is successively changed so that the two-dimensional position 1A becomes, for example, a part or all (loop) of a circular movement locus 210. In other words, the simultaneous movement of D3 and D4 shown in Fig. 9 causes the second carrier plate 20B to move in a spiral by the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 shown in Fig. 3. As a result, the second step of the second embodiment also causes the electronic component 1 to be locally peeled off from the adhesive sheet 22A of the first carrier plate 20A, as shown in Fig. 8. The loop locus is not limited to a circle and may be an ellipse, for example.

[0035] Furthermore, as the direction of movement (the direction of tangent 211 to circle 210 shown in FIG. 10 ) of electronic component 1 within the projection plane (the plane of FIG. 10 ) of two-dimensional position 1A changes sequentially, the inclination of central axis P of electronic component 1, which is inclined relative to the perpendicular to first carrier plate 20A, also changes sequentially. As a result, the local position where other end 2A of electronic component 1 is peeled from first adhesive sheet 22A of first carrier plate 20A also changes sequentially. Therefore, local peeling in different regions is repeated, making it easier to detach electronic component 1 from first carrier plate 20A.

[0036] In the second embodiment, the distance expansion movement and the position change movement are performed simultaneously in the second step. This allows repeated local peeling in different regions and simultaneously detaching the electronic component 1 from the first carrier plate 20A, thereby enabling the electronic component 1 to be smoothly and reliably detached from the first carrier plate 20A. As a result, the electronic component 1 can be held only by the second carrier plate 20B, as shown in FIG. 7, similar to the first embodiment.

[0037] The present invention is not limited to the above embodiment, and various modifications are possible within the scope of the present invention. This transfer method can also be used to transfer electronic components before external electrodes are formed on one end and the other end. For example, before being held by the first carrier plate 20A, multiple electronic components without external electrodes are aligned through a guide having multiple guide holes and held on a holding member. This holding member has an adhesive surface with a smaller adhesive force per unit area than the first carrier plate 20A. This transfer method can also be used when transferring electronic components from a holding member to the first carrier plate 20A.

[0038] DESCRIPTION OF SYMBOLS 1...electronic component, 2...end, 2A...end face, 2B...side face, 2C...corner, 4A, 4B...paste material, 10...manufacturing apparatus, 20, 20A, 20B...holding member (carrier plate), 21A, 21B...substrate, 22A...first adhesive surface, 22B...second adhesive surface, 30...jig fixing plate, 40...base, 50...movement mechanism, 60...X-axis drive unit, 70...Y-axis drive unit, 80...Z-axis drive unit, 90...control unit, 91...storage unit, 92...operation input unit, 100...surface plate, 200...transfer table, 210...circular movement trajectory, 211...circular tangent (movement direction that changes sequentially), P...central axis of electronic component

Claims

1. A method for transferring an electronic component, having one end and the other end, from a first holding member to a second holding member, comprising: a first step of shortening the distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, and adhering the one end of the electronic component to the second holding member; and a second step of peeling the electronic component adhered to the second adhesive surface of the second holding member from the first holding member by utilizing the difference in adhesive force between the first adhesive surface of the first holding member and the second adhesive surface of the second holding member, the second adhesive surface having a greater adhesive force per unit area than the first adhesive surface, wherein the second step includes a distance expansion movement that expands the distance between the first holding member and the second holding member, and a position change movement that moves one of the first holding member and the second holding member in parallel with the other at least at the start of and / or before the start of the distance expansion movement.

2. A method for transferring an electronic component according to claim 1, wherein the second step includes the position change movement being carried out before the start of the distance expansion movement, and the distance expansion movement being carried out thereafter.

3. A method for transferring and mounting an electronic component according to claim 1, wherein the second step simultaneously carries out the distance expansion movement and the position change movement.

4. A method for transferring electronic components according to claim 3, wherein the position change movement changes the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member so that the direction of movement of the two-dimensional position within the plane of the first adhesive surface changes sequentially.

5. A method for transferring an electronic component according to claim 1, wherein the electronic component has a first external electrode formed at one end and a second external electrode not formed at the other end.

6. A device comprising: a first holding member including a first adhesive surface and capable of holding an electronic component having one end and the other end by adhering the one end of the electronic component to the first adhesive surface; a second holding member including a second adhesive surface having a greater adhesive force per unit area than the first adhesive surface and capable of holding the electronic component by adhering the other end to the second adhesive surface; and a movement mechanism that moves the first holding member and the second holding member relatively, wherein the movement mechanism: adheres the other end of the electronic component to the second adhesive surface of the second holding member by a distance-reducing movement that reduces the distance between the first holding member to which the other end of the electronic component is adhered and the second holding member; and then peels the electronic component adhered to the second holding member from the first adhesive surface of the first holding member by a distance-expanding movement that expands the distance between the first holding member and the second holding member; An electronic component transfer device that locally peels the other end of the electronic component from the first adhesive surface by a position change movement that moves one of the first holding member and the second holding member parallel to the other at least at the start of and / or before the start of the distance expansion movement.

7. An electronic component transfer device according to claim 6, wherein the movement mechanism performs the position change movement before the start of the distance expansion movement, and then performs the distance expansion movement thereafter.

8. An electronic component transfer device according to claim 6, wherein the movement mechanism performs the distance expansion movement and the position change movement simultaneously.

9. An electronic component transfer device according to claim 8, wherein the position change movement changes the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member so that the direction of movement of the two-dimensional position within the plane of the first adhesive surface changes sequentially.