Probe for probe card

Abstract

This probe (1) for a probe card has, on a reference surface (1SB) perpendicular to a buckling direction (X), a plurality of deformed regions (8) which are arranged with intervals therebetween, the outer edge of which is circular, oval, or polygonal, and which has a recessed shape or a protruding shape, and a framework region (9), which is provided at the boundary of adjacent deformed regions (8). A plurality of the deformed regions (8) are arranged with intervals therebetween in rows in a prescribed direction relative to the lengthwise direction (Z) of the probe, and a plurality of the rows are arranged with intervals therebetween in the lengthwise direction (Z) of the probe (1).

Description

Probes for probe cards

[0001] The present application relates to a probe for a probe card.

[0002] A probe card is an electrical connection device used to supply power, input / output signals, and ground individual semiconductor devices formed on a wafer by contacting the probes with the electrode pads of the semiconductor devices to perform operational tests. The probes are attached to the surface of the probe card, and their tips are pressed against the electrode pads of the semiconductor devices with a predetermined pressure. In order to increase the number of semiconductor devices formed on a wafer, it is necessary to reduce the size of the semiconductor devices. To this end, the electrode pads of semiconductor devices are designed to be small, and the distance between the electrode pads (pitch) is also designed to be small. As semiconductor devices become smaller, probes must also be made smaller. However, miniaturizing probes poses the problem of weakening their mechanical strength.

[0003] Therefore, in order to ensure good electrical and mechanical contact with the electrode pads of the semiconductor device, for example, Patent Document 1 proposes a configuration in which a multi-layer metal sheet is used for the probe.

[0004] Special table 2018-501490 publication

[0005] The probe disclosed in Patent Document 1 is a contact probe having at least one multilayer structure including a superposition of a core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and is made of a material harder than the core and completely covers the multilayer structure. As shown in Patent Document 1, in order to achieve good electrical contact and mechanical contact, a configuration in which multiple layers made of different materials are superposed is preferable, but there is a limit to meeting the demand for a thinner cross-sectional thickness of the probe, and a further breakthrough was needed.

[0006] In an inspection process using a probe card, after the probes have contacted the electrode pads of a semiconductor device, the probe card is moved even closer to the semiconductor wafer (overdrive) to press the probes against the electrode pads of the semiconductor device. Therefore, the probes must be strong enough to withstand a contact pressure greater than a predetermined value. To prevent the probes from being broken, it is necessary to prevent localized stress concentrations on the probes. To prevent this stress concentration, probes with surfaces as smooth and free of scratches as possible are required.

[0007] However, there is a limit to how smooth a metal surface can be made, and there is a problem in that the thinner the cross-section of the probe, the more easily it is deformed by an external force, and the lower its mechanical strength.

[0008] The present application discloses a technology for solving the above-mentioned problems, and aims to provide a probe that can contact an electrode pad of a semiconductor device with an appropriate needle pressure even when the probe is miniaturized, and has the strength to not break even when a contact pressure of a predetermined value or more is applied. That is, the probe for a probe card of the present application aims to provide a probe for a probe card that can withstand large stress (having high mechanical strength) by having a structure that intentionally disperses the positions where stress concentration occurs, rather than preventing stress concentration.

[0009] The probe for a probe card disclosed in the present application has a plurality of deformation regions arranged at intervals on a reference plane perpendicular to the buckling direction, the outer edges of which are circular, elliptical or polygonal and have a recessed or protruding shape, and a framework region provided at the boundary between adjacent deformation regions, the plurality of deformation regions being arranged in rows spaced apart in a predetermined direction relative to the longitudinal direction of the probe, and the rows being arranged in multiple rows spaced apart in the longitudinal direction of the probe.

[0010] According to the probe for a probe card disclosed in the present application, it is possible to provide a probe for a probe card and a method for manufacturing a probe for a probe card that have high mechanical strength by dispersing the locations where stress concentration occurs even when the plate thickness is thin.

[0011] 1 is a perspective view showing a schematic configuration of a probe for a probe card according to a first embodiment; FIG. 2 is a diagram showing the relationship between the overdrive amount and needle pressure of the probe according to the first embodiment; FIG. 3 is a diagram showing the relationship between the overdrive amount and stress acting on the probe according to the first embodiment; FIG. 4 is a cross-sectional view showing a framework region when many recesses are provided according to the first embodiment; FIG. 5 is a diagram showing a manufacturing process of the probe by electroforming according to the first embodiment; FIG. 6 is a diagram showing a manufacturing process of the probe by electroforming according to the first embodiment; FIG. 7 is a diagram showing a manufacturing method of the probe by pressing according to the first embodiment; FIG. 8 is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to the second embodiment; FIG. 9 is a diagram showing a plane on which a deformation region is provided of the probe according to the second embodiment; FIG. 10 is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to the third embodiment; FIG. 11 is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to the fourth embodiment; FIG. 12 is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to the fifth embodiment; FIG. 13 is a diagram showing a modification of the fifth embodiment; FIG. 14 is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to the sixth embodiment; 15A is an enlarged view of a main part of a surface perpendicular to the buckling direction X of the probe according to embodiment 8. FIG. 15B is a cross-sectional view taken along line BB of FIG. 15A. FIG. 15C is a view showing a partial cross-sectional shape of the probe according to embodiment 9.

[0012] Embodiment 1. A probe for a probe card according to embodiment 1 will be described below with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals. FIG. 1 is a perspective view showing the structure of a probe 1 for a probe card. FIG. 2 is a diagram showing the relationship between the overdrive amount of the probe 1 and the needle pressure. FIG. 3 is a diagram showing the relationship between the overdrive amount of the probe and the stress acting on the probe. FIG. 4 is a partial cross-sectional view of a deformation region 8 and a framework region 9.

[0013] The probe 1 is a so-called vertical probe, and is held almost vertically by an upper first guide plate 2 and a lower second guide plate 3. A tip portion 4 of the probe 1 is guided by the second guide plate 3 so as to come into contact with an electrode pad 5 of a semiconductor device. A rear end portion 6 of the probe 1 (upper side of the paper in FIG. 1 ) is guided by the first guide plate 2 so as to be connected to an electrode (not shown) connected to a circuit board of a probe card.

[0014] The probe 1 is made of a thin metal plate of a conductive material, and a plurality of deformation regions 8 and a framework region 9 are formed on at least one surface 1S (front or back) of a central portion 7 of the probe 1 that is perpendicular to a buckling direction X. The buckling direction X is the direction in which the probe 1 bends when the probe card is overdriven. The deformation region 8 refers to a region in which the reference surface 1SB, which is the original plane of the probe card, is deformed to form a depression. The framework region 9 refers to a region connecting the plurality of deformation regions 8. The boundary between the deformation region 8 and the framework region 9 is represented by a ridge line 10.

[0015] FIG. 1 shows an example in which the deformation region 8 is a rectangular prism-shaped depression provided in the reference plane 1SB, which is the original plane. Therefore, when the deformation region 8 is viewed in the buckling direction X of the probe 1, its outer edge is rectangular. The framework region 9 corresponds to the flat portion between the deformation regions 8. The deformation regions 8 are arranged in a row in a predetermined direction D1 with a spacing P between them relative to the longitudinal direction Z of the probe 1, and these rows are arranged in multiple rows in the longitudinal direction of the probe 1. The spacing P is the width of the framework region 9. In this embodiment 1, the direction D1 is perpendicular to the longitudinal direction Z of the probe 1.

[0016] Here, when a probe with no deformation region 8 was compared with a probe with a deformation region 8 on both the front and back sides, the following results were obtained. That is, the measurement result of the probe with no deformation region 8 on the front side is represented as A, and the measurement result of the characteristics of the probe 1 with the deformation region 8 is represented as B. In the state where a load is further applied to press the probe 1 against the electrode pad 5 after the tip portion 4 of the probe 1 has contacted the electrode pad 5 (overdrive state), the relationship between the needle pressure and the amount of overdrive is as shown in Figure 2. Also, the relationship between the stress and the amount of overdrive is as shown in Figure 3.

[0017] As shown in Fig. 2, the needle pressure when the overdrive amount was 70 µm was 1.72 gf for the probe without the recessed deformation region 8, while it was 1.19 gf for probe 1 provided with the recessed deformation region 8. Also, as shown in Fig. 3, the maximum stress when the overdrive amount was 110 µm was 670 MPa for the probe without the recess, while it was 891 MPa for probe 1 provided with the recessed deformation region 8, confirming that the mechanical characteristics as a probe were satisfactory.

[0018] When we investigated the factors that increased the maximum stress, we found that the difference in the surface area of ​​the probe 1 was a possible structural peculiarity. That is, the surface area was increased by providing a deformation region 8 in the shape of a rectangular prism depression on the surface of the probe 1. In the case of a depression shape created by depressing a square plane (i.e., representing a rectangular prism depression), the surface area of ​​the top of the rectangular prism remains unchanged because the original surface has simply been pressed down. In contrast, the area of ​​the inner wall surface created by the depression has increased.

[0019] In Figure 1, the dimensions of the recesses provided on the front and back of the probe are squares with sides of 20 μm, with the recess depth on the front side being 3.5 μm and the recess depth on the back side being 2.5 μm. There are 429 recesses of this size provided on each of the front and back sides. As a result, the total depth on the front side is 120 μm and 120 μm. ２ The area of ​​the back side increases to 85800 μm ２The surface area increases by the area of ​​the inner wall of the depression caused by the depression. Since a large depression affects the thickness of the probe 1, it is desirable to increase the surface area by providing many small depressions. By designing the size and arrangement of the depression shape, the surface area can be changed as desired.

[0020] Furthermore, an analysis was conducted to determine what effects could be obtained by the deformation region 8. The needle pressure and maximum stress of the probes were determined based on the finite element method (FEM) for probe A with no depressions (smooth surface), probe B with square prism-shaped depressions arranged in a matrix, probe C with square prism-shaped depressions arranged in a staggered pattern, and probe D with circular depressions arranged in a staggered pattern. The results are shown in Table 1.

[0021]

[0022] As shown in Table 1, for probe A, the needle pressure was 1.72 gf when the overdrive was 70 μm, and the maximum stress was 670 MPa when the overdrive was 110 μm. In contrast, under the same conditions, for probe B, the needle pressure was 1.19 gf and the maximum stress was 891 MPa, for probe C, the needle pressure was 1.18 gf and the maximum stress was 899 MPa, and for probe D, the needle pressure was 1.18 gf and the maximum stress was 1164 MPa.

[0023] In addition, stress contour diagrams (contour diagrams are diagrams that display calculation results with contour lines) were created for probes A, B, C, and D. Probe A showed a nearly uniform distribution of maximum stress at 670 MPa. Probe B showed a maximum stress of 74 MPa at the flat portion of the bottom surface of deformation region 8 and 668 MPa at the framework region 9, for a total of 891 MPa. Probe C showed a maximum stress of 74 MPa at the flat portion of the bottom surface of deformation region 8 and 674 MPa at the framework region 9, for a total of 899 MPa. Probe D showed a maximum stress of 97 MPa at the spherical portion of the bottom surface of deformation region 8 and 873 MPa at the framework region 9, for a total of 1164 MPa.

[0024] From these results, it is estimated that when an external force is applied to probes A, B, C, and D, stress is concentrated on the ridge 10 at the boundary between the deformation region 8 and the framework region 9. Furthermore, by making the bottom surface of the deformation region 8 flat or spherical, stress is concentrated on the ridge 10 at the boundary between the deformation region 8 and the framework region 9. This means that when the deformation region 8 is formed as a polygonal prism depression, stress is concentrated at each vertex of the polygon, and therefore when an external force is applied, stress is dispersed to each vertex.

[0025] Therefore, if the deformation region 8 is formed as a conical or pyramidal depression, stress can be dispersed not only at each vertex of the periphery but also at the vertex of the cone or pyramid, which reduces stress concentration at the ridge 10 at the boundary between the deformation region 8 and the framework region 9.

[0026] If the ridge 10 is polygonal, stress will be concentrated at each vertex, but the greater the number of vertices, the smaller the stress concentration borne by each vertex. For this reason, if the periphery of the depression is circular, stress will be dispersed to the periphery, and it is presumed that a structure in which a spherical depression shape is provided as the deformation region 8, as explained for probe D, will be the structure that best disperses stress and result in a probe with high mechanical strength.

[0027] Next, a method for manufacturing the probe 1 shown in FIG. 1 will be described. There are three methods for manufacturing the probe 1. The first manufacturing method is a manufacturing method using electroforming. FIGS. 5A and 5B are diagrams showing the manufacturing process of the probe 1 using electroforming. A protrusion shape corresponding to the recess shape of the conductive layer 42 is formed on the surface of the substrate 41, and then a metal layer 43, which will become a component of the probe 1, is provided on the surface of the conductive layer 42, thereby forming the deformation region 8. This metal layer 43 can be formed by, for example, electroforming. The surface is then flattened, a mask is provided, and etching is performed to create the desired probe. The conductive layer 42 is then removed, and the probe 1 is detached from the substrate 41.

[0028] The second manufacturing method is a manufacturing method using a press. Figure 6 shows a manufacturing method of the probe 1 using a press. A metal plate 53 is pressed from both sides using a first mold 51 and a second mold 52, each having a surface corresponding to the recess shape, to form a recess-shaped deformation region 8 on the surface. This method has the advantage of being able to shorten the manufacturing time compared to forming a metal layer by electroforming.

[0029] In the first embodiment, the structure in which the deformation region 8 is recessed has been described, but the same effect can be obtained by changing this shape to a protruding shape. The manufacturing method simply involves reversing the recess and protrusion.

[0030] Embodiment 2. A probe for a probe card according to embodiment 2 will be described below, focusing on the differences from embodiment 1. Fig. 7 is an enlarged view of a main portion of a surface 1S perpendicular to the buckling direction X of the probe 1, and shows another example of the arrangement of the deformation region 8. Fig. 8 is a view showing a surface of the probe 1 on which the deformation region 8 is provided. As in embodiment 1, the deformation region 8 is provided on at least one side of the surface 1S perpendicular to the buckling direction X of the probe 1.

[0031] The deformation regions 8 are arranged in a row with a plurality of regions spaced apart by an interval P in a predetermined direction D2 with respect to the longitudinal direction Z of the probe 1. Here, the direction D2 is oblique to the longitudinal direction Z of the probe 1.

[0032] When viewed in the buckling direction X, each deformation region 8 has a rectangular ridge 10 (outer edge). Therefore, the actual shape is a depression or protrusion in the shape of a square prism, a square pyramid, a truncated square pyramid, or the like. The two opposing sides of the ridge 10 of the square of the deformation region 8 are parallel to the predetermined direction D2, and the other two sides are perpendicular to the direction D2. The spacing between adjacent deformation regions 8 aligned in a direction perpendicular to the direction D2 is also the same as the spacing P. In the second embodiment, the deformation regions 8 are also aligned straight and at equal intervals in the longitudinal direction Z of the probe 1. The shapes of the truncated circular cone, truncated elliptical cone, and truncated polygonal pyramid deformation regions 8 are such that the cross-sectional area gradually increases toward the reference plane 1SB.

[0033] According to the probe for a probe card of embodiment 2, as in embodiment 1, by regularly arranging deformation regions 8 of the same shape, regular distribution of stress is achieved, and a probe for a probe card with high mechanical strength can be provided.

[0034] Embodiment 3. A probe for a probe card according to embodiment 3 will be described below, focusing on the differences from embodiment 1. Fig. 9 is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of the probe 1, and shows another example of the arrangement of the deformation region 8.

[0035] The deformation regions 8 are arranged in a row with a plurality of regions spaced apart by an interval P in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1. Here, the direction D1 is perpendicular to the longitudinal direction Z of the probe 1.

[0036] When viewed in the buckling direction X, each deformation region 8 has a ridge 10 (outer edge) that is circular (a type of ellipse). Therefore, the actual shape is a depression or protrusion that is cylindrical, conical, truncated conical, spherical, or the like. The distance between adjacent deformation regions 8 in the longitudinal direction Z of the probe 1 is also the same as the distance P.

[0037] According to the probe for a probe card of embodiment 3, as in embodiments 1 and 2, by regularly arranging deformation regions 8 of the same shape, regular distribution of stress is achieved, and a probe for a probe card with high mechanical strength can be provided.

[0038] Embodiment 4. A probe for a probe card according to embodiment 4 will be described below, focusing on the differences from embodiment 2. Fig. 10 is an enlarged view of a main portion of the surface 1S of the probe 1 perpendicular to the buckling direction X, and shows another example of the arrangement of the deformation region 8. As in embodiment 2, the deformation region 8 is provided on at least one side of the surface 1S perpendicular to the buckling direction X.

[0039] The deformation regions 8 are arranged in a row with a plurality of regions spaced apart by an interval P in a predetermined direction D2 with respect to the longitudinal direction Z of the probe 1. Here, the direction D2 is oblique to the longitudinal direction Z of the probe 1.

[0040] When viewed in the buckling direction X, each deformation region 8 has a rectangular ridge 10 (outer edge). Therefore, the actual shape is a depression or protrusion in the shape of a rectangular prism, a rectangular pyramid, a truncated rectangular pyramid, or the like. The deformation region 8 is arranged such that two opposing sides of the ridge 10 (outer edge) are parallel to a predetermined direction D2, and the other two sides are perpendicular to the direction D2. The spacing between adjacent deformation regions 8 in a direction perpendicular to the direction D2 is also the same as the spacing P. The difference from the second embodiment is that, in the second embodiment, the deformation regions 8 are aligned straight and at equal intervals in the longitudinal direction Z of the probe 1, whereas in the fourth embodiment, the deformation regions 8 are not aligned straight in the longitudinal direction Z of the probe 1.

[0041] 10 , the first row L1, the second row L2, the third row L3, and the fourth row L4 each consist of four deformation regions (actually more), but the deformation regions 8 in the first row L1 and the deformation regions 8 in the second row L2 are arranged alternately along the direction D2. The same is true for the deformation regions in the second row L2 and the third row L3. The centers S of all the deformation regions 8 in the first row L1 are not aligned in a straight line with the centers S of any of the deformation regions 8 in the second row L2 in the longitudinal direction Z of the probe 1.

[0042] When the deformation regions 8 are arranged in this manner, one side of the ridge line 10 of the second deformation region 8 from the top of the Nth column and subsequent deformation regions 8, which is opposite to the ridge line 10 of the N+1th column deformation region 8, will be parallel to and opposite to each side of the ridge lines 10 of the two deformation regions 8 in the N+1th column. In other words, the corners K of the two deformation regions 8 will be close to each other and adjacent to each other. Note that the spacing between adjacent deformation regions 8 is the same, as in embodiment 2.

[0043] In the probe for a probe card according to the fourth embodiment, the corners K of the deformation region 8 where stress is concentrated are arranged close to each other. Compared to the four corners K arranged close to each other in the second embodiment, the number of places where stress is concentrated can be increased by approximately twice. This further distributes stress, making it possible to provide a probe for a probe card with high mechanical strength.

[0044] Fifth Embodiment A probe for a probe card according to a fifth embodiment will be described below, focusing on the differences from the third embodiment. Fig. 11 is an enlarged view of a main portion of the surface 1S of the probe 1 perpendicular to the buckling direction X, and shows another example of the arrangement of the deformation region 8. As in the third embodiment, the deformation region 8 is provided on at least one side of the surface 1S perpendicular to the buckling direction X.

[0045] The deformation regions 8 are arranged in a row with a plurality of regions spaced apart by an interval P in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1. Here, the direction D1 is perpendicular to the longitudinal direction Z of the probe 1.

[0046] When viewed in the buckling direction X, each deformation region 8 has a circular ridge 10 (outer edge). Therefore, the actual shape is a depression or protrusion in the shape of a cylinder, a cone, a truncated cone, or the like. The intervals between adjacent deformation regions 8 are all the same as the interval P. The difference from the third embodiment is that in the third embodiment, the centers of the deformation regions 8 are aligned straight and at equal intervals in the longitudinal direction Z of the probe 1, but in the fourth embodiment, the deformation regions 8 are not aligned straight in the longitudinal direction Z of the probe 1.

[0047] As shown in FIG. 11 , the first row L1 consists of two deformation regions 8 (actually, more), the second row L2 consists of three deformation regions 8, and the third row L3 consists of two deformation regions 8. In this way, the number of deformation regions 8 constituting adjacent rows is different. As shown in FIG. 11 , the deformation regions 8 in the first row L1 and the deformation regions 8 in the second row L2 are arranged alternately along the direction D1. The same is true for the deformation regions in the second row L2 and the third row L3. Note that, as in the third embodiment, the spacing between adjacent deformation regions 8 is all the same. However, as can be seen by comparing FIG. 9 and FIG. 11 , the fifth embodiment allows for a higher density of deformation regions 8 arranged for the same area.

[0048] 12 is a diagram showing a modification of embodiment 5. When viewed in the buckling direction X, the deformation region 8 may have an elliptical ridge 10 (outer edge).

[0049] According to the probe for a probe card of the fifth embodiment, the deformation regions 8 can be arranged at high density, so that stress can be further dispersed, and a probe for a probe card having high mechanical strength can be provided.

[0050] Sixth Embodiment A probe for a probe card according to a sixth embodiment will be described below, focusing on the differences from the first to fifth embodiments. Fig. 13 is an enlarged view of a main portion of a surface 1S perpendicular to the buckling direction X of the probe 1, and shows another example of the arrangement of the deformation region 8.

[0051] The deformation regions 8 are arranged in a row with a plurality of regions spaced apart by an interval P in a predetermined direction D2 with respect to the longitudinal direction Z of the probe 1, and these are arranged in a plurality of rows in the longitudinal direction Z of the probe 1. Here, the direction D2 is oblique to the longitudinal direction Z of the probe 1. In this example, the ridge lines 10 of the deformation regions 8 in each row are rectangular. The centers S of the deformation regions 8 in each row are also aligned in the longitudinal direction Z of the probe 1, but only a maximum of two corners K are adjacent to each other. This example achieves the same effect as the fourth embodiment.

[0052] Seventh Embodiment A probe for a probe card according to a seventh embodiment will be described below, focusing on the differences from the first to sixth embodiments. Fig. 14 is an enlarged view of a main part of a surface 1S perpendicular to the buckling direction X of a probe 1 provided with a recess in the shape of a triangular pyramid.

[0053] The deformation regions 8 are arranged in a row with a plurality of regions spaced apart by an interval P in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1. Here, the direction D1 is perpendicular to the longitudinal direction Z of the probe 1.

[0054] The deformation regions 8 constituting the first row L1 and the deformation regions 8 constituting the second row L2 are arranged inverted in the vertical direction of the paper surface of Fig. 14. Furthermore, the deformation regions 8 are recessed from the reference plane 1SB in the shape of a triangular pyramid truncated.

[0055] According to the probe for a probe card of the seventh embodiment, since the deformation regions 8 can be arranged at high density, stress can be further dispersed, and a probe for a probe card having high mechanical strength can be provided. In addition, the strength of the framework region 9 can be increased.

[0056] Embodiment 8. Figure 15A is an enlarged view of a main part of a probe having a truncated cone-shaped recess and a truncated cone-shaped protrusion. Figure 15B is a cross-sectional view taken along the line B-B of Figure 15A. As shown in Figures 15A and 15B, a reference surface 1SB of the probe 1 is provided with a first deformation region 91, which is a truncated cone-shaped recess with a first large diameter, and a second deformation region 92, which is a truncated cone-shaped protrusion with a second small diameter.

[0057] On the surface of this probe 1, first deformation regions 91 are arranged in a staggered pattern, and second deformation regions 92 are arranged in the spaces between the first deformation regions 91. The arrangement of the first deformation regions 91 and the second deformation regions 92 distributes stress evenly, resulting in a probe with a high mechanical strength structure. In this way, the deformation regions may have a shape that protrudes from the reference surface 1SB, or may be mixed with a recessed shape.

[0058] Ninth Embodiment Fig. 16 shows a partial cross-sectional shape of a probe 1 according to a tenth embodiment. As shown in Fig. 16, in this ninth embodiment, a coating layer 13 is provided on the surface of the metal plate of the probe 1 shown in any of the first to eighth embodiments to prevent foreign matter from adhering. Furthermore, even if foreign matter does adhere, the surface of the metal plate is smoothly covered so that it can be easily removed. This configuration can solve the problem of foreign matter adhering by providing a coating layer in the same way for any probe having a deformed region in the shape of a recess or protrusion on the surface of the metal plate.

[0059] The material for the coating layer 13 is preferably a resin layer that does not hinder deformation of the metal plate. In particular, in embodiments 1 to 5, since multiple recessed or protruding deformation regions 8 are provided on the surface, there is a concern about the adhesion of foreign matter, and therefore the coating layer 13, which smooths the surface, is effective in eliminating this concern. By providing the multiple recessed or protruding deformation regions 8 and the framework region 9 on the surface of the conductor and providing the coating layer 13 on that surface, it is possible to obtain a probe 1 that has high mechanical strength and is free from the adhesion of foreign matter. Note that the probe 1 may be covered with a material other than resin that is different from the material of the structure of the probe 1.

[0060] Although various exemplary embodiments and examples are described in this application, the various features, aspects, and functions described in one or more embodiments are not limited to the application of a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless modifications not illustrated are contemplated within the scope of the technology disclosed in this application. For example, this includes cases where at least one component is modified, added, or omitted, or where at least one component is extracted and combined with components of another embodiment.

[0061] 1 probe, 1SB reference surface, 10 ridge line, 101 area expansion pattern region, 102 stress concentration region, 13 coating layer, 2 first guide plate, 3 second guide plate, 4 tip portion, 41 substrate, 42 conductive layer, 43 metal layer, 5 electrode pad, 51 first mold, 52 second mold, 53 metal plate, 6 rear end portion, 7 central portion, 8 deformation region, 9 framework region, 91 first deformation region, 92 second deformation region, 1S surface, X buckling direction, L1 first row, L2 second row, L3 third row, L4 fourth row, K corner portion, P spacing, D1, D2 predetermined direction.

Claims

A vertical probe that buckles in a direction perpendicular to the longitudinal direction of a metal plate of a conductive member, the probe having, on a reference plane included in a plate surface perpendicular to the buckling direction of the metal plate, a plurality of deformation regions spaced apart from each other, the outer edges of which are circular, elliptical or polygonal and which are in a concave shape or a convex shape, and a framework region provided at a boundary between the plurality of adjacent deformation regions, wherein the plurality of deformation regions are arranged in a row with a plurality of them spaced apart from each other in a direction predetermined with respect to the longitudinal direction of the probe, and the rows are arranged in a plurality of rows with a space therebetween. A probe for a probe card, wherein the plurality of deformation regions in the N-th row and the plurality of deformation regions in the (N + 1)-th row are arranged alternately along the predetermined direction. Claim 2 The probe for a probe card according to claim 1, wherein the predetermined direction is an oblique direction with respect to the longitudinal direction of the probe. Claim 3 The probe for a probe card according to claim 1, wherein the predetermined direction is a direction perpendicular to the longitudinal direction of the probe. Claim 4 The probe for a probe card according to claim 1, wherein the deformation region is any one of a polygonal prism shape, a polygonal pyramid shape, a cylindrical shape, an elliptical cylinder shape, a conical shape or an elliptical cone shape, or a frustum of a polygonal pyramid shape, a frustum of a cone shape or a frustum of an elliptical cone shape whose cross-sectional area gradually increases toward the reference plane. Claim 5 The probe for a probe card according to any one of claims 1 to 4, wherein the deformation region is covered with a member made of a material different from the material of the structure of the probe.