Method for producing ceramic electronic component

Abstract

This method for producing a ceramic electronic component comprises: a step in which a shaped article 1A is formed by 3D printing a ceramic material, a metal material and an evaporative material by a material jetting method, the shaped article 1A comprising an electronic component main body 10 that contains the ceramic material and the metal material, a supporting body 20 that contains the ceramic material and is disposed at least partially around the electronic component main body 10, and an evaporative body 30 that contains the evaporative material and is disposed between the electronic component main body 10 and the supporting body 20; a step in which the shaped article 1A is fired at a temperature that is not less than the temperature at which the evaporative body 30 disappears; and a step in which the electronic component main body 10 is obtained in a state where the supporting body 20 is separated from the shaped article 1A after the firing.

Description

Manufacturing method for ceramic electronic components

[0001] The present invention relates to a method for manufacturing a ceramic electronic component.

[0002] Patent Document 1 discloses a method for manufacturing a multilayer electronic component, comprising the steps of: laminating a plurality of ceramic green sheets, each of which is patterned so that at least the insulator, the conductor for the internal electrodes, the conductor for the external electrodes, and the dissipative material have approximately spherical rounded shapes at portions that will become the corners of the multilayer electronic component after lamination; and laminating the ceramic green sheets so that the dissipative material is patterned outside the approximately spherical rounded portions and continuous with the approximately spherical rounded portions at positions that correspond to the cut margins for separating the ceramic green sheet laminate into the multilayer electronic components; and performing a specific process on the ceramic green sheet laminate to remove the regions made of the dissipative material and simultaneously separate the ceramic green sheet laminate into individual multilayer electronic components.

[0003] Patent Document 2 discloses a method for producing a ceramic shaped product for an electronic component, characterized in that a three-dimensional shape is formed by subjecting a laminate formed by stacking a plurality of sheet-like members each having at least an insulating material and an evaporating material to an evaporating treatment so that the ceramic shaped product for the electronic component can be obtained from the laminate.

[0004] Patent Document 3 discloses a method for manufacturing a ceramic product, comprising: a 3D printing process in which a first ink containing a ceramic material and a second ink containing a glaze are sprayed and deposited by an inkjet method to form a three-dimensional object having a ceramic body formed from the first ink and a glaze film formed from the second ink and covering at least a portion of the ceramic body; and a firing process in which the three-dimensional object formed by the 3D printing process is fired.

[0005] JP 2005-311225 A JP 2006-41204 A JP 2019-142069 A

[0006] When manufacturing ceramic electronic components, using a method of laminating ceramic green sheets as in the inventions described in Patent Documents 1 and 2 limits the degree of freedom in the shape of the resulting ceramic electronic components. In contrast, using a method of 3D printing a ceramic material as in the invention described in Patent Document 3 is thought to increase the degree of freedom in the shape of the resulting ceramic electronic components.

[0007] However, when the present inventors manufactured ceramic electronic components using a method for 3D printing a ceramic material as in the invention described in Patent Document 3, they found that it was difficult to obtain ceramic electronic components having the desired shape, particularly when manufacturing ceramic electronic components having complex shapes, due to deformation during firing in the manufacturing process.

[0008] The present invention has been made to solve the above problems, and aims to provide a method for manufacturing ceramic electronic components that can suppress deformation during firing even when the components have complex shapes.

[0009] A method for producing a ceramic electronic component of the present invention is characterized by comprising the steps of: 3D printing a ceramic material, a metal material, and a dissipative material by a material jetting method to form a shaped object having an electronic component main body that includes the ceramic material and the metal material; a support that includes the ceramic material and is provided around at least a portion of the periphery of the electronic component main body; and a dissipative body that includes the dissipative material and is provided between the electronic component main body and the support; firing the shaped object at a temperature equal to or higher than a temperature at which the dissipative body disappears; and obtaining the electronic component main body from which the support has been separated from the fired shaped object.

[0010] According to the present invention, a method for manufacturing a ceramic electronic component that can suppress deformation during firing even when the component has a complex shape can be provided.

[0011] FIG. 1 is a schematic perspective view showing a shaped object formed in the step of forming a shaped object in the method for producing a ceramic electronic component according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an example of a cross section of the shaped object taken along line a1-a2 shown in FIG. 1 . FIG. 3 is a schematic perspective view showing an electronic component main body obtained in the step of obtaining an electronic component main body in the method for producing a ceramic electronic component according to the first embodiment of the present invention. FIG. 4 is a schematic perspective view showing a shaped object formed on a printing base in the step of forming a shaped object in the method for producing a ceramic electronic component according to a modified example of the first embodiment of the present invention. FIG. 5 is a schematic perspective view showing a shaped object formed in the step of forming a shaped object in the method for producing a ceramic electronic component according to the second embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing an example of a cross section of the shaped object taken along line b1-b2 shown in FIG. 5 . FIG. 7 is a schematic perspective view showing an electronic component main body with connectors obtained during the step of obtaining an electronic component main body in the method for producing a ceramic electronic component according to the second embodiment of the present invention.

[0012] The method for manufacturing a ceramic electronic component of the present invention will be described below. Note that the present invention is not limited to the following configurations and may be modified as appropriate without departing from the spirit of the present invention. Furthermore, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0013] The following embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. From embodiment 2 onwards, descriptions of matters common to embodiment 1 will be omitted, and differences will be mainly described. In particular, similar effects resulting from similar configurations will not be mentioned one after the other for each embodiment.

[0014] In the following description, when there is no need to particularly distinguish between the embodiments, they will simply be referred to as "the method for manufacturing a ceramic electronic component of the present invention."

[0015] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, scale, etc. may differ from those of the actual product.

[0016] A method for producing a ceramic electronic component of the present invention is characterized by comprising the steps of: 3D printing a ceramic material, a metal material, and a dissipative material by a material jetting method to form a shaped object having an electronic component main body that includes the ceramic material and the metal material; a support that includes the ceramic material and is provided around at least a portion of the periphery of the electronic component main body; and a dissipative body that includes the dissipative material and is provided between the electronic component main body and the support; firing the shaped object at a temperature equal to or higher than a temperature at which the dissipative body disappears; and obtaining the electronic component main body from which the support has been separated from the fired shaped object.

[0017] First Embodiment An example of a method for manufacturing a ceramic electronic component according to the present invention will be described below as a method for manufacturing a ceramic electronic component according to a first embodiment of the present invention.

[0018] <Step of Forming a Shaped Object> Fig. 1 is a schematic perspective view showing a shaped object formed in the step of forming a shaped object in the method for manufacturing a ceramic electronic component according to Preferred Embodiment 1 of the present invention. Fig. 2 is a schematic cross-sectional view showing an example of a cross section of the shaped object taken along line a1-a2 shown in Fig. 1.

[0019] A ceramic material, a metal material, and a dissipative material are 3D printed by the material jetting method to form a shaped object 1A shown in FIGS. 1 and 2 .

[0020] The shaped object 1A has an electronic component body 10, a support 20, and an evanescent body 30.

[0021] The electronic component body 10 includes a ceramic material and a metal material.

[0022] The electronic component body 10 has a ceramic portion 11 containing a ceramic material, and an electrode portion 12 containing a metal material and in contact with the ceramic portion 11 .

[0023] The electrode section 12 may be composed of one electrode member or a plurality of electrode members.

[0024] In the example shown in Figures 1 and 2, the electrode portion 12 is composed of two electrode members: a first electrode member 13a that contacts one end of the ceramic portion 11, and a second electrode member 13b that contacts the other end of the ceramic portion 11.

[0025] There is no particular limitation on the positions of the electrode portions 12 relative to the ceramic portion 11. For example, the positions of the first electrode member 13a and the second electrode member 13b relative to the ceramic portion 11 are not limited to the positions shown in FIGS.

[0026] The support 20 comprises a ceramic material.

[0027] The ceramic material contained in the support 20 is preferably the same as the ceramic material contained in the electronic component body 10 (ceramic portion 11), but may be different from the ceramic material contained in the electronic component body 10 (ceramic portion 11).

[0028] The support 20 is provided around at least a portion of the periphery of the electronic component body 10. The support 20 may be provided around a portion of the periphery of the electronic component body 10 as shown in Fig. 1 , or may be provided around the entire periphery of the electronic component body 10. In other words, the support 20 may cover a portion of the electronic component body 10 as shown in Fig. 1 , or may cover the entire electronic component body 10.

[0029] The vanishing body 30 includes a vanishing material.

[0030] The vanishing body 30 is provided between the electronic component body 10 and the support 20. More specifically, the vanishing body 30 is provided so as to fill the gap between the electronic component body 10 and the support 20. In this way, the vanishing body 30 contacts both the electronic component body 10 and the support 20.

[0031] Examples of the ceramic material include alumina, aluminum nitride, low-temperature co-fired ceramic (LTCC) material, etc. Among these, the ceramic material is preferably a low-temperature co-fired ceramic material.

[0032] In this specification, the low-temperature sintering ceramic material means a ceramic material that can be sintered at a firing temperature of 1000° C. or less.

[0033] Examples of low-temperature sintered ceramic materials include glass composite low-temperature sintered ceramic materials containing ceramic materials such as quartz, alumina, and forsterite and borosilicate glass, and ZnO—MgO—Al ２ O ３ -SiO ２ low-temperature sintered ceramic material containing BaO-Al ２ O ３ -SiO ２ Ceramic materials, Al ２ O ３ -CaO-SiO ２ -MgO-B ２ O ３ Among them, non-glass-based low-temperature sintered ceramic materials including alumina-based ceramic materials and SiO ２ Low temperature co-fired ceramic materials doped with Cr are preferred.

[0034] The metal material is preferably a material that can be co-fired with the ceramic material, more preferably a material that can be co-fired with the low-temperature co-fired ceramic material. That is, the melting point of the metal material is preferably higher than the sintering temperature of the ceramic material, more preferably higher than the sintering temperature of the low-temperature co-fired ceramic material. Examples of such metal materials include copper, silver, and alloys containing at least one of these metals.

[0035] The vanishing material is preferably a material that vanishes at a temperature equal to or lower than the sintering temperature of the ceramic material, more preferably a material that vanishes at a temperature equal to or lower than the sintering temperature of the low-temperature sintering ceramic material, such as organic resins and carbon black.

[0036] Examples of methods for forming the shaped object 1A using 3D printing with the material jetting method include the following. First, a first ink containing a ceramic material, a second ink containing a metal material, and a third ink containing a disposable material are prepared. Each ink is then sprayed from an inkjet head to coat the desired pattern, and the resulting coating is then dried with hot air or the like. Subsequently, by repeatedly coating the inks and drying the coating, a ceramic layer containing a ceramic material, a metal layer containing a metal material, and a disposable layer containing a disposable material are laminated in the desired pattern. As a result, a shaped object 1A is formed, which includes an electronic component body 10 formed by laminating ceramic layers and metal layers, a support 20 formed by laminating ceramic layers, and a disposable body 30 formed by laminating disposable layers.

[0037] When forming a molded object 1A having a complex structure as described above, if a method of stacking ceramic green sheets is used, as in the inventions described in Patent Documents 1 and 2, for example, many masks (plates) are required, which results in a decrease in manufacturing efficiency.

[0038] In contrast, in this embodiment, a mask (plate) is not required because 3D printing using a material jetting method is used to form the object 1A. Thus, according to this embodiment, even when forming an object having a complex structure, and ultimately an electronic component body 10 having a complex shape, a decrease in manufacturing efficiency is suppressed.

[0039] The first ink may further contain a resin, a solvent, etc. in addition to the ceramic material.

[0040] Examples of resins include ethyl cellulose, acrylic, and polyvinyl butyral. When such a resin is contained in the first ink, the resin solidifies when the coating film described above dries and functions as a binder for the ceramic material. Such a resin is removed, for example, when the shaped object is fired, as described below.

[0041] Examples of the solvent include organic solvents such as methanol and ethanol, inorganic solvents such as water, mixtures of these, etc. Such solvents are removed, for example, when the coating film is dried as described above.

[0042] Similarly, the second ink and the third ink may also further contain the above-mentioned resin, solvent, and the like.

[0043] When forming the shaped object 1A, instead of the method of drying the coating film described above, for example, each ink may be sprayed from an inkjet head to coat the desired pattern, and the resulting coating film may be irradiated with radiation (preferably ultraviolet light) to cure the coating film. In this case, each ink may be a radiation-curable ink (preferably an ultraviolet-curable ink) that is cured by radiation (preferably ultraviolet light), and preferably contains a radiation-polymerizable compound (preferably an ultraviolet-polymerizable compound), and may further contain a polymerization initiator, a solvent, etc., as necessary.

[0044] <Step of Firing the Model> The model 1A is fired at a temperature equal to or higher than the temperature at which the vanishing body 30 disappears. This causes the vanishing body 30 to disappear from the model 1A, and also sinters the ceramic material contained in the model 1A, particularly the ceramic material contained in the electronic component body 10.

[0045] For example, if the shaped object 1A is composed only of the electronic component body 10, the entire electronic component body 10 will be fired while exposed. During this process, the ceramic material contained in the electronic component body 10 (ceramic portion 11) moves in a manner that reduces the surface area of ​​the electronic component body 10. Therefore, particularly when the electronic component body 10 has a complex shape, the large specific surface area of ​​the electronic component body 10 tends to generate large surface tension during firing. As a result, the electronic component body 10 is prone to deformation during firing.

[0046] In contrast to this, in the present embodiment, the support 20 is provided around at least a portion of the periphery of the electronic component body 10 when the electronic component body 10 is fired, and therefore deformation of the electronic component body 10 during firing is suppressed even if the electronic component body 10 has a complex shape. Furthermore, firing the shaped object 1A in this step eliminates the vanishing body 30 from the shaped object 1A and sinters the ceramic material contained in the shaped object 1A, particularly the ceramic material contained in the electronic component body 10, thereby improving manufacturing efficiency.

[0047] <Step of Obtaining Electronic Component Body> FIG. 3 is a schematic perspective view showing an electronic component body obtained in the step of obtaining an electronic component body in the method for manufacturing a ceramic electronic component according to the first preferred embodiment of the present invention.

[0048] As shown in FIG. 3, an electronic component body 10 in a state where the support 20 is separated from the shaped article 1A after firing is obtained as a ceramic electronic component.

[0049] In the process of obtaining the electronic component main body 10 in a state in which the support 20 is separated from the molded object 1A, the support 20 may be removed manually from the molded object 1A, or the support 20 may naturally come off from the molded object 1A as the disappearing body 30 disappears.

[0050] By using the above steps, ceramic electronic components can be manufactured without deformation during firing, even if they have complex shapes.

[0051] The ceramic electronic component manufactured by the above steps is not particularly limited, and examples thereof include multilayer ceramic capacitors.

[0052] Although the above describes an example in which one ceramic electronic component is obtained from one shaped object 1A, multiple ceramic electronic components may be obtained from one shaped object 1A. In other words, in the step of forming the shaped object 1A, multiple electronic component bodies 10 may be formed in the shaped object 1A.

[0053] 3, the electronic component body 10 may have an irregular shape in which a recess 15 is provided. That is, in the step of forming the shaped object 1A, the electronic component body 10 may be formed so as to have an irregular shape in which the recess 15 is provided.

[0054] In this specification, the term "irregular shape" refers to a shape in which recesses are partially provided in an assumed reference shape (e.g., a simple shape such as a rectangular parallelepiped). For example, the electronic component body 10 shown in Fig. 3 has an irregular shape in which four recesses 15 are provided in a rectangular parallelepiped shape assumed to be the reference shape.

[0055] When the electronic component body 10 has an irregular shape, the number of recesses 15 may be one or may be multiple as shown in FIG.

[0056] When the electronic component body 10 has a different shape, the shape is not limited to the shape shown in FIG.

[0057] In this embodiment, even if the electronic component body 10 has a complex shape such as an irregular shape, a support 20 is provided around at least a portion of the periphery of the electronic component body 10 in the shaped object 1A, thereby preventing deformation of the electronic component body 10 during firing.

[0058] In addition, when forming multiple electronic component bodies 10 in the process of forming the molded object 1A, all of the multiple electronic component bodies 10 may be irregularly shaped, or only some of the electronic component bodies 10 may be irregularly shaped.

[0059] The electronic component body 10 does not have to have a complex shape such as an irregular shape, and may have a simple shape such as a rectangular parallelepiped.

[0060] 1 and 3 , the support 20 preferably covers the recess 15 of the electronic component body 10. In other words, in the step of forming the shaped object 1A, the support 20 is preferably formed so as to cover the recess 15 of the electronic component body 10.

[0061] Even if the electronic component body 10 has an irregular shape with a recess 15 formed therein, the support 20 covers the recess 15 of the electronic component body 10, thereby sufficiently preventing the electronic component body 10 from deforming during firing.

[0062] When a plurality of recesses 15 are provided in the electronic component body 10 as shown in FIG. 3, the support 20 preferably covers all of the plurality of recesses 15 .

[0063] When a plurality of recesses 15 are provided in the electronic component body 10 as shown in FIG. 3, the support 20 may cover some of the recesses 15 .

[0064] The support 20 may cover the recess 15 and also cover the other parts of the electronic component body 10 , or may not cover the other parts of the electronic component body 10 .

[0065] In addition, when multiple electronic component bodies 10 are formed in the process of forming the molded object 1A, it is preferable that the support 20 covers the recesses 15 for all of the multiple electronic component bodies 10, as described above.

[0066] Furthermore, when multiple electronic component bodies 10 are formed in the process of forming the molded object 1A, the support 20 may cover the recesses 15 of some of the multiple electronic component bodies 10 as described above.

[0067] 1 and 3 , the volume of the support 20 is preferably larger than the volume of the electronic component body 10. In other words, in the step of forming the shaped object 1A, the support 20 is preferably formed so as to have a larger volume than the electronic component body 10.

[0068] Since the volume of the support 20 is larger than the volume of the electronic component body 10, the effect of the support 20 on the electronic component body 10 is sufficiently large, and deformation of the electronic component body 10 during firing is sufficiently suppressed.

[0069] When a plurality of electronic component bodies 10 are formed in the step of forming the shaped object 1A, the volume of the support 20 is preferably larger than the total volume of the electronic component bodies 10 .

[0070] 1, the support 20 is preferably made up of a plurality of support members. That is, in the step of forming the shaped object 1A, the support 20 is preferably formed so as to be made up of a plurality of support members.

[0071] In the example shown in FIG. 1, the support 20 is made up of four support members: a first support member 21a, a second support member 21b, a third support member 21c, and a fourth support member 21d.

[0072] When the support 20 is composed of multiple support members, it is easier to obtain the electronic component body 10 in a state where the support 20 is separated from the molded object 1A, compared to when the support 20 is composed of a single support member, for reasons such as making it easier to remove the electronic component body 10 from the molded object 1A (making it easier to remove the electronic component body 10) in the process of obtaining the electronic component body 10.

[0073] In the method for manufacturing a ceramic electronic component according to the first embodiment of the present invention, the shaped object may be formed on a printing base in the forming step, the shaped object may be fired on the printing base in the firing step, and the shaped object may be separated from the printing base during firing in the firing step. Such an example will be described below as a method for manufacturing a ceramic electronic component according to a modification of the first embodiment of the present invention.

[0074] FIG. 4 is a schematic perspective view showing a shaped object formed on a printing base in the step of forming a shaped object in a method for manufacturing a ceramic electronic component according to a modified example of the first preferred embodiment of the present invention.

[0075] 4, in the step of forming the object 1A, the object 1A may be formed on a printing base 100. Furthermore, in the step of firing the object 1A, the object 1A may be fired on the printing base 100. Furthermore, the object 1A may be separated from the printing base 100 during firing in the step of firing the object 1A.

[0076] In the above-described method, the object 1A is formed on the printing base 100 and then fired directly on the printing base 100, eliminating the need to transfer the object 1A from the printing base 100 to a firing base during firing. Furthermore, in the above-described method, the object 1A separates from the printing base 100 during firing, eliminating the need to separate the fired object 1A from the printing base 100. Therefore, in the above-described method, even if the object 1A is formed on the printing base 100, a decrease in manufacturing efficiency is suppressed.

[0077] Furthermore, in the above-described method, the model 1A separates from the printing base 100 during firing, and therefore the model 1A can freely shrink during firing without being affected by the printing base 100. Therefore, when the model 1A shrinks during firing, cracking or deformation due to the influence of the printing base 100 is suppressed.

[0078] 4, the printing base 100 preferably has a disappearing portion 110 on its surface that disappears during firing in the step of firing the model 1A. In other words, in the step of firing the model 1A, it is preferable that the disappearing portion 110 that the printing base 100 has on its surface disappears during firing.

[0079] The printing base 100 has on its surface a disappearing portion 110 that disappears during firing, which makes it easier for the shaped object 1A to separate from the printing base 100 during firing.

[0080] The temperature at which the disappearing portion 110 disappears is preferably lower than the temperature at which the disappearing body 30 disappears. In other words, in the step of firing the shaped object 1A, it is preferable that the disappearing portion 110 disappears before the disappearing body 30 disappears.

[0081] Because the temperature at which the disappearing portion 110 disappears is lower than the temperature at which the disappearing body 30 disappears, the disappearing portion 110 is more likely to disappear before the model 1A shrinks during firing, and as a result, the model 1A is more likely to separate from the printing base 100, and the model 1A is more likely to shrink freely during firing without being affected by the printing base 100. Therefore, when the model 1A shrinks during firing, cracking or deformation due to the influence of the printing base 100 is sufficiently suppressed.

[0082] The vanishing portion 110 preferably contains a plurality of resin particles at least part of whose surfaces are covered with polyvinyl alcohol. In this case, the vanishing portion 110 may contain a plurality of resin particles whose entire surfaces are covered with polyvinyl alcohol, a plurality of resin particles whose surfaces are partly covered with polyvinyl alcohol, or both resin particles whose entire surfaces are covered with polyvinyl alcohol and resin particles whose surfaces are partly covered with polyvinyl alcohol.

[0083] Because the disappearing portions 110 contain a plurality of resin particles at least partially covered with polyvinyl alcohol on their surfaces, the disappearing portions 110 are more likely to disappear during firing. Furthermore, the disappearing portions 110 are more likely to disappear before the model 1A shrinks during firing, and as a result, the model 1A is more likely to separate from the printing base 100, which makes it easier for the model 1A to shrink freely during firing without being affected by the printing base 100. Therefore, cracking or deformation of the model 1A due to the influence of the printing base 100 when the model 1A shrinks during firing is sufficiently suppressed.

[0084] The disappearing portion 110 may further include resin particles whose surfaces are not covered with polyvinyl alcohol, in addition to the plurality of resin particles whose surfaces are at least partially covered with polyvinyl alcohol.

[0085] The resin particles may contain, for example, an acrylic resin, a cellulose resin, or a polyvinyl butyral resin. Among these, the resin particles preferably contain an acrylic resin. When the resin particles contain an acrylic resin, the acrylic resin is preferably a methyl methacrylate-ethylene glycol dimethacrylate copolymer ({CH ２ C(CH ３ ) COOCH ３} ｍ ・{CH ２ C(CH ３ ) COOCH ２ CH ２ OOC (CH ３ ) CCH ２} ｎ ) is preferred.

[0086] The shape of the resin particles is not particularly limited, and examples thereof include a spherical shape, a spheroid shape (a shape obtained by rotating an ellipse around the long or short axis of the ellipse as the axis of rotation), a rectangular parallelepiped shape, a triangular pyramid shape, a square pyramid shape, a cylindrical shape, a conical shape, and other irregular shapes.

[0087] When the resin particles are spherical, the average particle size of the resin particles is preferably 1.8 μm or less.

[0088] The polyvinyl alcohol covering the surface of the resin particles may contain impurities such as methanol and methyl acetate.

[0089] In the disappearing portion 110, the plurality of resin particles at least partially covered on the surface with polyvinyl alcohol are preferably connected to one another via the polyvinyl alcohol.

[0090] The thickness of the vanishing portion 110 is preferably 5 μm or more.

[0091] As shown in FIG. 4, the printing base 100 preferably further includes a support portion 120 that is a porous structure and is provided so as to be in contact with the disappearing portion 110 .

[0092] The printing base 100 further includes the support portion 120, which is a porous structure and is provided so as to contact the vanishing portion 110. This, combined with the fact that the surface of the printing base 100 tends to be flat, makes it possible to bake the model 1A in a state where unnecessary external forces other than gravity are not easily applied to the model 1A. As a result, cracking or deformation of the model 1A due to the influence of the printing base 100 when the model 1A shrinks during baking is sufficiently suppressed.

[0093] The support portion 120 is made of Al ２ O ３ In this case, the support portion 120 may contain, for example, aluminum oxide (Al ２ O ３ ) as a main component may be included.

[0094] The support portion 120 is made of Al ２ O ３ and SiO ２ In this case, the support portion 120 may contain a compound of, for example, mullite (3Al ２ O ３ 2SiO ２ ) as a main component may be included.

[0095] The support portion 120 is made of Al ２ O ３ and SiO ２ In this case, the support portion 120 may contain, for example, a compound of cordierite (2MgO.2Al ２ O ３ 5SiO ２ ) as a main component may be included.

[0096] In addition to the main components described above, the support portion 120 may further contain minor components, impurities, etc. in amounts that do not change the characteristics.

[0097] In a method for producing a ceramic electronic component according to a second embodiment of the present invention, the shaped object contains a ceramic material and further includes a connector that connects the electronic component body and the support body. Except for this, the method for producing a ceramic electronic component according to the second embodiment of the present invention is the same as the method for producing a ceramic electronic component according to the first embodiment of the present invention.

[0098] <Step of Forming a Shaped Object> Fig. 5 is a schematic perspective view showing a shaped object formed in the step of forming a shaped object in the method for manufacturing a ceramic electronic component according to Preferred Embodiment 2. Fig. 6 is a schematic cross-sectional view showing an example of a cross section of the shaped object shown in Fig. 5 taken along line b1-b2.

[0099] The ceramic material, the metal material, and the dissipative material are 3D printed by the material jetting method to form the shaped object 1B shown in FIGS. 5 and 6 .

[0100] The object 1B has an electronic component body 10, a support 20, a disappearing body 30, and a connecting body 40. In other words, the object 1B has a configuration in which the connecting body 40 is provided on the object 1A (see FIGS. 1 and 2 ).

[0101] The connector 40 includes a ceramic material.

[0102] The ceramic material contained in the connector 40 is preferably the same as the ceramic material contained in the electronic component body 10 (ceramic portion 11), but may be different from the ceramic material contained in the electronic component body 10 (ceramic portion 11).

[0103] The ceramic material contained in the connector 40 is preferably the same as the ceramic material contained in the support 20 , but may be different from the ceramic material contained in the support 20 .

[0104] In other words, it is preferable that the ceramic material contained in the electronic component main body 10 (ceramic part 11), the ceramic material contained in the support body 20, and the ceramic material contained in the connecting body 40 are the same as each other, but they may be different from each other or may be partially different.

[0105] The connector 40 connects the electronic component body 10 and the support 20. In other words, the connector 40 contacts both the electronic component body 10 and the support 20.

[0106] The connector 40 preferably connects the ceramic part 11 and the support body 20. In other words, the connector 40 preferably contacts both the ceramic part 11 and the support body 20.

[0107] The connector 40 may connect the electrode portion 12 and the support 20. In other words, the connector 40 may be in contact with both the electrode portion 12 and the support 20.

[0108] The connector 40 may be made up of one connecting member or a plurality of connecting members.

[0109] In the example shown in Figures 5 and 6, the connecting body 40 is composed of two connecting members: a first connecting member 41a that connects the ceramic part 11 and the third support member 21c, and a second connecting member 41b that connects the ceramic part 11 and the fourth support member 21d.

[0110] The position of the connecting body 40 relative to the electronic component body 10 is not particularly limited. For example, the positions of the first connecting member 41a and the second connecting member 41b relative to the ceramic part 11 are not limited to the positions shown in FIGS.

[0111] The position of the connector 40 relative to the support member 20 is not particularly limited. For example, the position of the first connecting member 41a relative to the third supporting member 21c and the position of the second connecting member 41b relative to the fourth supporting member 21d are not limited to the positions shown in FIGS.

[0112] <Step of Firing the Shaped Object> The shaped object 1B is fired at a temperature equal to or higher than the temperature at which the vanishing body 30 disappears. This causes the vanishing body 30 to disappear from the shaped object 1B, and also sinters the ceramic material contained in the shaped object 1B, particularly the ceramic material contained in the electronic component body 10.

[0113] In this embodiment, the molded object 1B has a connector 40 that connects the electronic component main body 10 and the support 20, and the electronic component main body 10 is fixed to the support 20 that is provided around at least a portion of the electronic component main body 10 via the connector 40, thereby sufficiently preventing the electronic component main body 10 from deforming during firing.

[0114] <Step of Obtaining Electronic Component Body> FIG. 7 is a schematic perspective view showing an electronic component body with connectors obtained in the middle of the step of obtaining the electronic component body in the method for manufacturing a ceramic electronic component according to the second embodiment of the present invention.

[0115] As shown in FIG. 7, an electronic component body 10 with connectors 40 is obtained in a state in which the support 20 is separated from the shaped product 1B after firing.

[0116] Thereafter, the connectors 40 are removed from the electronic component body 10 with the connectors 40 attached, thereby obtaining the electronic component body 10 shown in FIG. 3 as a ceramic electronic component.

[0117] The method for removing the connector 40 is not particularly limited, and examples thereof include cutting, grinding (e.g., blasting), etc. Traces of the connector 40 removed by these methods will remain on the electronic component body 10 (here, the ceramic part 11).

[0118] In the method for manufacturing a ceramic electronic component according to the second embodiment of the present invention, the shaped object may be formed on a printing base in the forming step, the shaped object may be fired on the printing base in the firing step, and the shaped object may be separated from the printing base during firing in the firing step. This example of the method for manufacturing a ceramic electronic component according to the second embodiment of the present invention is similar to the method for manufacturing a ceramic electronic component according to the first embodiment of the present invention in that it uses a printing base.

[0119] The present specification discloses the following:

[0120] <1> A method for manufacturing a ceramic electronic component, comprising: a step of 3D printing a ceramic material, a metal material, and a dissipative material by a material jetting method to form a shaped object having an electronic component main body that includes the ceramic material and the metal material; a support that includes the ceramic material and is provided on at least a part of the periphery of the electronic component main body; and a dissipative body that includes the dissipative material and is provided between the electronic component main body and the support; a step of firing the shaped object at a temperature equal to or higher than a temperature at which the dissipative body disappears; and a step of obtaining the electronic component main body in a state where the support is separated from the shaped object after firing.

[0121] <2> The method for manufacturing a ceramic electronic component according to <1>, wherein the electronic component body has an irregular shape and is provided with a recess.

[0122] <3> The method for producing a ceramic electronic component according to <2>, wherein the support covers the recess of the electronic component body.

[0123] <4> The method for producing a ceramic electronic component according to any one of <1> to <3>, wherein the volume of the support is larger than the volume of the electronic component body.

[0124] <5> The method for producing a ceramic electronic component according to any one of <1> to <4>, wherein the support body is made up of a plurality of support members.

[0125] <6> The method for producing a ceramic electronic component according to any one of <1> to <5>, wherein the shaped object includes the ceramic material and further includes a connector that connects the electronic component body and the support.

[0126] <7> The method for producing a ceramic electronic component according to any one of <1> to <6>, wherein in the forming of the shaped object, the shaped object is formed on a printing base; in the firing of the shaped object, the shaped object is fired on the printing base; and during firing in the firing of the shaped object, the shaped object is separated from the printing base.

[0127] <8> The method for producing a ceramic electronic component according to <7>, wherein the printing base has a surface with a disappearance portion that disappears during firing in the step of firing the shaped object.

[0128] <9> The method for producing a ceramic electronic component according to <8>, wherein the temperature at which the disappearing portion disappears is lower than the temperature at which the disappearing body disappears.

[0129] <10> The method for producing a ceramic electronic component according to <8> or <9>, wherein the removed portion includes a plurality of resin particles at least partly covered with polyvinyl alcohol.

[0130] <11> The method for producing a ceramic electronic component according to any one of <8> to <10>, wherein the printing base further has a support portion having a porous structure and provided so as to be in contact with the disappearance portion.

[0131] 1A, 1B Modeled object 10 Electronic component body 11 Ceramic portion 12 Electrode portion 13a First electrode member 13b Second electrode member 15 Recessed portion 20 Support 21a First support member 21b Second support member 21c Third support member 21d Fourth support member 30 Evaporating body 40 Connecting body 41a First connecting member 41b Second connecting member 100 Printing base 110 Evaporating portion 120 Supporting portion

Claims

1. By 3D printing a ceramic material, a metal material, and a sacrificial material using a material jetting method, a recess that creates a step between two surfaces is partially provided, and an electronic component body including the ceramic material and the metal material, and the ceramic material, and a support that does not function as the electronic component body and is provided on at least a part of the periphery of the electronic component body, and a sacrificial body that includes the sacrificial material and is provided between the electronic component body and the support, forming a shaped object having; Firing the shaped object at a temperature equal to or higher than the temperature at which the sacrificial body disappears; Obtaining the electronic component body in a state where the support is separated from the fired shaped object, A method for manufacturing a ceramic electronic component, comprising:

2. The method for manufacturing a ceramic electronic component according to claim 1, wherein the support covers the recess of the electronic component body.

3. The method for manufacturing a ceramic electronic component according to claim 1 or 2, wherein the volume of the support is larger than the volume of the electronic component body.

4. The method for manufacturing a ceramic electronic component according to claim 1 or 2, wherein the support is composed of a plurality of support members.

5. The method for manufacturing a ceramic electronic component according to claim 1 or 2, wherein the shaped object further includes a connecting body that includes the ceramic material and connects the electronic component body and the support.

6. In the step of forming the shaped object, the shaped object is formed on a printing base; In the step of firing the shaped object, the shaped object is fired on the printing base; During firing in the step of firing the shaped object, the shaped object separates from the printing base. The method for manufacturing a ceramic electronic component according to claim 1 or 2.

7. The method for manufacturing a ceramic electronic component according to claim 6, wherein the printing base has a sacrificial portion on its surface that disappears during firing in the step of firing the shaped object.

8. The method for manufacturing a ceramic electronic component according to claim 7, wherein the temperature at which the sacrificial portion disappears is lower than the temperature at which the sacrificial body disappears.

9. The method for manufacturing a ceramic electronic component according to claim 7, wherein the sacrificial portion includes a plurality of resin particles at least a part of the surface of which is covered with polyvinyl alcohol.

10. The method for manufacturing a ceramic electronic component according to claim 7, wherein the printing base further has a support portion that is a porous structure provided so as to be in contact with the sacrificial portion.