Inspection management system and method

Abstract

The present invention provides a technology with which it is possible to realize more efficient inspection processing when an inspection system has a plurality of devices. An inspection in the inspection system is realized as an inspection processing sequence by, for example, a first-type device, a second-type device, and a third-type device. Each of the first-type device, the second-type device, and the third-type device includes one or more devices. As the inspection processing sequence, the inspection system prepares a thin piece from a sample for each part of the inspection, transfers the thin piece to a carrier, and performs processing relating to the inspection for each thin piece on the carrier. This inspection management system: grasps, on the basis of communication with the devices, the device state of each of the devices; selects, on the basis of an inspection instruction and the device state and from among the plurality of devices, each type of devices for use in the inspection processing sequence and the time to be used for the devices; and creates a plan of the inspection processing sequence including the selected device and time.

Description

Inspection management system and method

[0001] The present disclosure relates to semiconductor manufacturing processes and semiconductor device inspection processing techniques.

[0002] As semiconductor devices become finer in structure, circuit patterns become denser, and wiring becomes more multi-layered, cross-sectional analysis of wafers using, for example, a transmission electron microscope (TEM) or a scanning transmission electron microscope (STEM) is becoming increasingly important in order to improve reliability.

[0003] In the imaging, observation, measurement, analysis, evaluation, inspection, etc. (sometimes collectively referred to as inspection for the sake of explanation) of a sample in a semiconductor manufacturing process, for example, a focused ion beam (FIB) device is used to thin a specified portion of a wafer to produce a lamella (also called a thin film sample) that exposes the cross-sectional structure of the device. The lamella is then transferred to a carrier, and the cross-sectional structure of the lamella is observed using, for example, a TEM device.

[0004] An example of prior art is Japanese Patent Application Laid-Open No. 2014-022296 (Patent Document 1). Patent Document 1 describes a charged particle beam device capable of performing processing using an FIB and observation using a scanning electron microscope (SEM). This charged particle beam device acquires a cross-section of a processed lamella (thin piece) as an SEM image, compares this SEM image with a pre-prepared reference image, and if the two images do not match, identifies the cross-section as a defective part. It also describes that the processed lamella is extracted using a mechanical probe and deposition function provided in this charged particle beam device.

[0005] JP 2014-022296 A

[0006] In the background art, there is a demand for efficient operation and management of a series of sequences (sometimes referred to as an inspection processing sequence) related to inspection processing of semiconductor devices. The inspection processing sequence is realized by sharing the load among various devices, such as an FIB-SEM device, a lift-out device, and a TEM device.

[0007] For example, inspections in IC manufacturing processes are performed using TEM image observation with a TEM device. In this case, the manufacturing management system of the semiconductor manufacturing factory's production line sets the inspection target area on the wafer, which is the sample, and provides the inspection target area information, inspection instructions, and the wafer, etc. to the inspection system. The inspection system uses, for example, an FIB-SEM device to thin the inspection target area on the wafer, forming and producing a lamella. The wafer on which the lamella has been formed is then removed, for example, by a lift-out device, and the lamella is transferred to a carrier. The lamella on the carrier is then subjected to cross-sectional observation using TEM images, for example, by a TEM device.

[0008] Furthermore, in an environment having an inspection system, multiple units of each device, such as an FIB-SEM device, may be installed. For example, multiple units of each device may be installed to increase the overall processing capacity for the inspection process. For example, multiple sets of an FIB-SEM device, a lift-out device, and a TEM device may be installed. In such cases, efficient operation and management of the multiple devices in the entire inspection system is required to reduce costs, etc. However, in the past, when an inspection system has multiple units of each device, there has been insufficient consideration of how to operate and manage the multiple devices to achieve efficient inspection processing.

[0009] The object of the present disclosure is to provide a technology for the inspection processing technology of the semiconductor manufacturing process and semiconductor devices, which can realize more efficient inspection processing by operating and managing multiple devices when there are multiple devices of each type in an inspection system.

[0010] A representative embodiment of the present disclosure has the following configuration: An inspection management system according to an embodiment is an inspection management system for managing the inspection of a sample by an inspection system that inspects the sample, wherein the inspection in the inspection system is realized as an inspection process sequence in which a first process, a second process, and a third process are sequentially processed in order by a first type device, a second type device, and a third type device that perform different processes, and the inspection system has one or more of each of the first type device, the second type device, and the third type device, and the inspection process sequence is realized by preparing thin sections from the sample for each target location of the inspection, transferring the thin sections to a carrier, and transferring the thin sections to a carrier. The inspection management system performs processing related to the inspection for each of the rear slices, and is connected to each of the multiple devices, namely the first type device, the second type device, and the third type device, via communication, and based on communication with each of the devices, grasps the device status, including the available time and usage time, for each of the devices, and selects from the multiple devices, the first type device, the second type device, and the third type device to be used in the inspection processing sequence and the time to be used by the device, based on inspection instructions related to the inspection and the device status, and creates a plan for the inspection processing sequence that includes the selected devices and times.

[0011] According to a representative embodiment of the present disclosure, in relation to the semiconductor manufacturing process and semiconductor device inspection processing technology, when an inspection system has multiple units of each device, more efficient inspection processing can be achieved by operating and managing the multiple units. Problems, configurations, effects, etc. other than those described above are described in the description of the invention.

[0012] 1 shows a system configuration including an inspection management system and an inspection system according to a first embodiment. An example configuration is shown in which a plurality of devices of the inspection system are communicatively connected to the inspection management system according to the first embodiment. An example configuration is shown of the inspection management system according to the first embodiment as a computer system. In the first embodiment, a general flow of inspection processing in the inspection system is shown. In the first embodiment, an overview of processing by each device in the inspection system is shown. In the first embodiment, an inspection processing sequence in a first type inspection system is shown. In the first embodiment, an inspection processing sequence in a second type inspection system is shown. In the first embodiment, an example configuration related to carriers, etc. in the first type inspection system is shown. In the first embodiment, an example configuration related to carriers, etc. in the second type inspection system is shown. In the first embodiment, an example configuration of an FIB-SEM device as a lamina production device is shown. In the first embodiment, an example configuration of a lift-out device as a lamina transfer device is shown. In the first embodiment, an example configuration of a TEM device as a lamina observation device is shown. In the first embodiment, an example configuration of a lamina structure, etc. is shown. In the first embodiment, a state in which the lamina has been removed by the lift-out device is shown. In the first embodiment, a state in which a lamina is imaged by a lift-out device is shown. In the first embodiment, an example of the structure of a carrier is shown. In the first embodiment, a state in which a lamina has been transferred to a carrier by the lift-out device is shown. In the first embodiment, an example of a configuration when a lamina is transferred to a carrier using a microsampling method is shown. In the first embodiment, another example of a configuration when a lamina is transferred to a carrier is shown. In the first embodiment, an example of a configuration when a carrier is held inside a TEM device is shown. In the first embodiment, an example of a functional block configuration of an inspection management system is shown. In the first embodiment, a processing flow of the inspection management system is shown. In the first embodiment, an example of a schedule table among the device status information is shown. In the first embodiment, an example of communication between the inspection management system and each device, and an example of plan creation is shown. In the first embodiment, an example of plan creation using a success rate and an index value is shown. In the first embodiment, an example of a screen for creating a plan with a priority on success rate is shown. In the first embodiment, an example of a screen for creating a plan with a priority on processing capacity is shown. In the first embodiment, an example of a screen for starting execution of an inspection processing sequence is shown. In the first embodiment, an explanatory diagram of a start instruction method is shown. In the first embodiment, an explanatory diagram of a plan determination method is shown.In embodiment 1, an explanatory diagram for the manual execution method is shown. In embodiment 1, an example screen of the inspection processing status is shown. In embodiment 1, an example screen of the inspection processing result is shown. In embodiment 1, an example warning notification is shown. In embodiment 1, an example error notification is shown. In embodiment 1, an example screen of the actual success rate is shown. In embodiment 1, an example screen of the index value is shown. In embodiment 1, an example screen of the maintenance status is shown. In embodiment 1, an example screen of the maintenance plan is shown. In embodiment 1, another example of plan creation is shown. In embodiment 1, an example of plan creation according to inspection priority is shown. In embodiment 1, an example plan for simultaneous parallel inspection processing is shown.

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, identical parts are generally designated by the same reference numerals, and repeated explanations will be omitted. In the drawings, the representation of components may not represent their actual positions, sizes, shapes, ranges, etc., in order to facilitate understanding of the invention.

[0014] For the purpose of explanation, when describing processing by a program, the program, functions, processing units, etc. may be described as the main components, but the main hardware components are the processor, or a controller, device, computer, system, etc. that is configured with the processor, etc. The computer executes processing according to the program read into memory using resources such as memory and communication interfaces as appropriate through the processor. This realizes predetermined functions, processing units, etc. The processor is configured, for example, with semiconductor devices such as a CPU / MPU or GPU. Processing is not limited to software program processing, and can also be implemented using dedicated circuits. Dedicated circuits such as FPGAs, ASICs, and CPLDs can be used.

[0015] The program may be pre-installed as data on the target computer, or may be distributed as data from a program source to the target computer. The program source may be a program distribution server on a communication network, or a non-transitory computer-readable storage medium, such as a memory card or disk. The program may be composed of multiple modules. The computer system may be composed of multiple devices. The computer system may be composed of a client-server system, a cloud computing system, an IoT system, etc. Various data and information may be composed of structures such as tables and lists, for example, but are not limited to these. Expressions such as identification information, identifiers, IDs, names, and numbers are interchangeable.

[0016] [Issues, etc.] Additional explanation regarding issues, etc., is provided. For example, flakes with a size of less than 150 nm are prepared as TEM samples for the observation and analysis of samples using a TEM device. The inspection system uses an FIB-SEM device, a lift-out device, or the like to form and prepare one or more flakes on a wafer, remove the flakes from the wafer, and transfer the flakes to a carrier. The flakes on the carrier are then observed as TEM images using the TEM device. The transfer method varies depending on the configuration of the inspection system. For example, in a first type of inspection system described below, a lift-out device, which is a flake transfer device, removes the flakes from the wafer and transfers them to a carrier. For example, in a second type of inspection system described below, a first type of FIB-SEM device cuts out the flakes from the wafer and transfers them to a carrier.

[0017] The inspection process sequence including the preparation and transfer of the thin section described above takes a relatively long time, and automation technology is required to efficiently perform the processing operations and tasks of such an inspection process sequence.

[0018] Conventionally, the lift-out method and the micro-sampling method are known as methods for producing lamellae. In the lift-out method, for example, a lamella portion formed on a wafer using an FIB-SEM device is removed using the lift-out device and transferred to a carrier. In the micro-sampling method, the production of the lamella and the transfer of the lamella to the carrier can be performed within the same device, for example, within a first-class FIB-SEM device. In either method, for example, the lift-out device or the first-class FIB-SEM device can perform processing operations while monitoring the sample, etc., using images captured by an optical microscope or SEM mechanism.

[0019] Here, the following problems are particularly encountered. Examples of devices that make up an inspection system include the above-mentioned FIB-SEM device and lift-out device. The FIB-SEM device has both the function of performing processing by irradiating an FIB and the function of capturing images using an SEM. The lift-out device has the function of lifting out a sample using a detacher and the function of capturing images using an optical microscope or SEM mechanism. These devices can perform processing operations to form or transfer a lamella using the lift-out method or micro-sampling method while using the captured images (see Figures 6 and 7, etc., described below, for details).

[0020] As an example of transfer, in a first type inspection system (FIG. 6), the FIB-SEM device in the first step transfers the wafer to a holder, and in a second step, the lift-out device removes the flake from the wafer and transfers it to a carrier. In a second type inspection system (FIG. 7), the first type FIB-SEM device in the first step removes the flake from the wafer and transfers it to a carrier.

[0021] In a process including the creation and transfer of a lamina as in the above example, when an apparatus performs a processing operation such as transfer, the processing operation may fail. For example, a lift-out apparatus may fail to grip a lamina portion with a detacher. For example, an FIB-SEM apparatus may fail to create a lamina portion by deposition or etching or to cut a lamina portion from a wafer.

[0022] Both FIB-SEM and lift-out devices equipped with the functionality to perform processing operations such as the above-mentioned relocation perform predetermined processing operations on samples on a stage. In particular, these devices perform processing operations such as relocation while using image recognition and monitoring using SEM images, optical microscope images, etc. Each of these devices has individual differences in terms of the stability of the charged particle beam, stage reproducibility, etc. These differences affect the success or failure of processing operations such as relocation, resulting in different success rates.

[0023] The success or failure of the transfer is also important from the perspective of the overall processing time and processing capacity (in other words, throughput) of the inspection process. If the transfer of the thin section fails, recovery processing for the preparation and transfer of the thin section is required. This increases the overall processing time of the inspection process, reduces throughput, and decreases overall efficiency.

[0024] [Solution, etc.] In the embodiments, an inspection management system (hereinafter sometimes simply referred to as a management system) is provided for efficient operation and management of an inspection process sequence of semiconductor devices by an inspection system. The inspection management system of the embodiments has a function of operating and managing each device that constitutes each step of the inspection process sequence in the inspection system, such as an FIB-SEM device, a lift-out device, and a TEM device. In other words, this inspection management system is a computer system for managing the inspection process sequence of the inspection system, an inspection process sequence management system.

[0025] This inspection management system is connected to each device in the inspection system via communication, and manages the processing operations of each device and grasps the status of the inspection processing sequence. This inspection management system has the function of creating plans and schedules (sometimes collectively referred to as plans) for the inspection processing sequence. This inspection management system also has the function of managing the execution of the inspection processing sequence by the inspection system in accordance with the plan, and the function of outputting the status and results of the inspection processing.

[0026] This inspection management system efficiently operates and manages multiple devices even when the inspection system has multiple devices for each step. This inspection management system has a function of creating a suitable plan using the multiple devices as candidates. The number of devices for each step in the inspection system may be the same or different. Some steps may have a single device. Typically, for example, when one set consists of one FIB-SEM device, one lift-out device, and one TEM device, expansion may be performed for each set.

[0027] This inspection management system has the function of managing the inspection process sequences of at least two types of inspection systems (see FIGS. 6 and 7, which will be described later). The two types of management can coexist. Two types of inspection systems may be installed side by side in the inspection environment. In this case, the management system creates plans tailored to each type of inspection system.

[0028] This inspection management system is connected to each device in the inspection system via communication, and appropriately communicates with each device regarding instructions and responses, etc., to grasp the device status, etc. The inspection management system sends start instructions, etc. to each device based on the created plan, and executes processing operations in each device while receiving responses, etc. from each device. Processing operations include, for example, thinning with an FIB-SEM device, lift-out with a lift-out device, and cross-sectional observation with a TEM device. The inspection management system monitors the status and results of processing operations for each device in each step of the inspection system and records them as actual results. The inspection management system creates a new plan based on the actual results information.

[0029] The inspection management system keeps track of the available time and usage time of each device in the inspection system as the device status. Usage time includes time when an inspection process is already being performed and time when future inspection processes are scheduled according to a created plan. Usage time also includes adjustment time when equipment adjustment work is scheduled and maintenance time when equipment maintenance is scheduled. Usage time also includes time when individual devices are reserved for specific purposes.

[0030] The inspection management system creates a new inspection process plan based on sample, inspection instructions, inspection location information, etc. from the manufacturing management system. When creating the plan, the inspection management system refers to and checks equipment status and past performance information, etc. Based on the equipment status, etc., the inspection management system selects and calculates the equipment to be used in each step to create a new plan and the time to allocate processing on that equipment (sometimes referred to as equipment usage time, etc.). The management system selects an equipment from multiple equipment for each step. The management system determines the scheduled start time and scheduled end time to allocate to the processing operation of each equipment. To do this, the management system calculates the equipment usage time required for processing on each equipment based on performance information. If the equipment usage time fits within the equipment's available time, the time on that equipment can be used as a candidate for processing allocation.

[0031] The inspection management system creates one or more plan proposals based on the set policy, combining candidate devices and time for each step of the inspection process sequence to ensure efficiency throughout the entire inspection process sequence. The inspection management system may create multiple plan proposals by prioritizing them.

[0032] Furthermore, when multiple inspection processes are required for multiple slices of multiple wafers, the inspection management system creates multiple plans for multiple inspection process sequences using an inspection system including multiple devices. The multiple inspection process sequences may be executed simultaneously in parallel if there is sufficient equipment and time, or may be executed sequentially on a time axis if there is not sufficient equipment and time.

[0033] When creating a plan, the inspection management system may select the equipment and time for each step by taking into account not only the equipment status but also the success rate and processing capacity of each equipment's processing operation based on past performance information. For example, if the policy prioritizes the success rate, the plan is created by giving priority to equipment with a high success rate. For example, if the policy prioritizes processing time or processing capacity (in other words, throughput, etc.), the plan is created by giving priority to equipment with a short processing time or high processing capacity.

[0034] Furthermore, in order to automate and streamline the inspection process of the inspection system, it is desirable to improve the efficiency and success rate of the thin section production and relocation process operations. To this end, the embodiment has a function for operating and managing multiple devices in the inspection system, taking into account the differences between each device and the success rate of relocation. As a specific example, the inspection management system grasps the success rate and processing capacity of each device in the inspection system for processing operations, including relocation, and creates an inspection process sequence plan based on this information.

[0035] In the embodiment, the inspection management system, regardless of the type of inspection system, grasps the processing time, success / failure, etc. of processing operations, including the creation and relocation of thin sections, performed by each device, and stores this as device status and performance information. The device detects and grasps the status, including success / failure, of processing operations, such as the creation and relocation of thin sections, using monitoring, for example, SEM images. The device sends a response to the inspection management system regarding the processing status and processing results, including information indicating the success / failure of the processing operation. Based on the response and information, the inspection management system grasps the processing status and results of each device and calculates the success rate, etc.

[0036] The inspection management system displays the progress of the inspection process sequence to the user while the inspection process sequence is being executed according to the plan. The inspection management system keeps track of the progress of the processing operations of each device, the success or failure of the operations, etc. The inspection management system also displays the execution results of the inspection process sequence according to the plan to the user. The user can check the progress and execution results on a screen, for example, and can also take action such as pausing the inspection process manually as necessary. The inspection management system also has a function to receive observation result data from the sample observation device in the third step and display the observation results on a screen to the user based on that data.

[0037] The inspection management system has the function of calculating the device-specific processing capacity, processing time, and success rate for each device in the inspection system, reflecting machine differences, based on the actual inspection processing information to date. In particular, the inspection management system calculates the success rate, processing time, and processing capacity for processing operations, including relocation, for devices in the inspection system that have the function of transferring wafers or lamellae (e.g., FIB-SEM devices and lift-out devices). The inspection management system calculates, for example, processing capacity index values ​​such as throughput and processing time index values. When creating a new plan, the inspection management system selects the device and time to be used using information on the device status, such as available time, as well as at least one of the success rate and index value. The inspection management system can predict the success rate of the device's processing operation based on the success rate. Even between multiple devices of the same type, the success rate can vary depending on machine differences, etc. The inspection management system selects the device to be used taking the predicted success rate into consideration. The inspection management system can create an optimal plan based on the success rate and index value. The inspection management system may display information such as the calculated success rate and index value for each device on a screen to the user.

[0038] In addition, the inspection management system of the embodiment has both a function for creating plans and managing execution corresponding to the fully automatic execution method of the inspection system and a function for creating plans and managing execution corresponding to the manual execution method of the inspection system. The inspection management system has a function for switching between fully automatic execution management by the inspection management system and manual execution management by manual operation by the user. For example, the user can select and set on a screen between a mode corresponding to automatic execution management and a mode corresponding to manual execution management.

[0039] The inspection management system according to the embodiment has a function of transmitting instructions according to a plan to each device in the inspection system. In addition, when an operator's work is involved in part of the inspection processing sequence, the inspection management system also has a function of transmitting work instructions to the operator associated with each device to make the operator aware of the work.

[0040] By having the above-described functions, the inspection management system of the embodiment optimizes inspection time and throughput while ensuring the accuracy required for inspection. According to the embodiment, it is possible to create an appropriate plan that takes into account the success rate of relocation, etc., and by managing the execution of the inspection processing sequence in accordance with the plan, it is possible to achieve efficient inspection processing that shortens the overall processing time of the inspection processing and increases throughput compared to conventional techniques.

[0041] 1 to 42 , an inspection management system and method according to a first embodiment will be described. The inspection management system according to the first embodiment is a system that is connected to an inspection system and manages inspection processing performed by the inspection system. The inspection management method according to the first embodiment is a method that is executed by the inspection management system according to the first embodiment.

[0042] [Overall System] Figure 1 shows the overall system configuration including the inspection management system of embodiment 1 and the inspection system. Management system 2, which is the inspection management system of embodiment 1, is connected to inspection system 1 via communication. Inspection system 1 is a system that performs inspection processing such as producing, transferring, observing, and analyzing a thin section 4 from a wafer 3. Management system 2 operates and manages the inspection processing sequence performed by inspection system 1. Note that Figure 1 shows an example of a first type inspection system 1 (Figure 6) described below, but is not limited to this.

[0043] The inspection system 1 includes a thin section production mechanism, a thin section transfer mechanism, a thin section observation mechanism, and a control mechanism. In FIG. 1, the thin section production mechanism includes a thin section production device 10, which is, for example, an FIB-SEM device. The thin section transfer mechanism includes a thin section transfer device 20, which is, for example, a lift-out device. The thin section observation mechanism includes a thin section observation device 30, which is, for example, a TEM device. The control mechanism includes, for example, controllers 10C, 20C, and 30C provided for each device. The controller of each device manages information about the device and controls the processing operation of the device.

[0044] In FIG. 1, for ease of understanding, the controllers of each device in the inspection system 1 are illustrated as blocks of controllers 10C, 20C, and 30C. These controllers may be built into each device or may be externally connected. The controllers of each device may communicate with each other as appropriate. When a controller is provided as a host control unit for each device such as the FIB-SEM device 10 and the lift-out device 20, a configuration in which one controller controls multiple devices may be adopted. A configuration in which the controllers for each device communicate with each other and control their corresponding devices may also be adopted.

[0045] The inspection system 1 receives the wafer 3 to be inspected from a semiconductor production line in a semiconductor manufacturing factory by transportation. The wafer 3 is set in the lamina production device 10. The wafer 3 is transported between the semiconductor production line and the lamina production device 10 of the inspection system 1 by a predetermined transport mechanism. For example, a FOUP, which is a container storing the wafer 3, is transported by an automatic transport system or by an operator.

[0046] The FIB-SEM device 10, which is a lamina production device, performs lamina processing on a specified location of the wafer 3, thereby forming and producing a lamina 4. The lift-out device 20, which is a lamina transfer device, removes the lamina 4 from the wafer 3 on which the lamina 4 has been formed, which was produced by the lamina production device 10, and transfers it to a carrier 5. The TEM device 30, which is a lamina observation device, then observes and analyzes the cross section of the lamina 4 on the carrier 5, and generates and outputs the resulting data 9, etc.

[0047] Various data and information may be appropriately communicated between the devices of the inspection system 1 to control the inspection process. Examples of the various data and information include data indicating the position of the inspection target on the wafer 3 surface, data indicating the position where the lamina 4 was successfully created, and data indicating the position of the lamina 4 mounted on the carrier 5. In addition, the inspection result data 9 includes detection signals related to secondary electrons and the like generated from the lamina 4 irradiated with the beam, images obtained from the detection signals, data obtained as a result of processing the images, and data related to X-rays generated from the lamina 4.

[0048] Inspection system 1 performs processing operations such as producing a lamina 4 at a specified position on a specified wafer 3 and transferring the lamina 4 to a specified position on a specified carrier 5, with each device performing the processing operations, and for control purposes, it keeps track of information such as the processing operations, status, position, etc. Then, inspection system 1 outputs the inspection results of the lamina 4 as data 9. Management system 2 communicates with each device in inspection system 1 to keep track of the processing operations, status, position, inspection results, etc., as described above, during the inspection process of inspection system 1.

[0049] A conveying mechanism 80 conveys the wafer 3 on which the lamina 4 is formed between the lamina manufacturing device 10 and the lamina conveying device 20. For example, a holder (details will be described later) storing the wafer 3 is conveyed by an automatic conveying system or by an operator.

[0050] The thin section 4 is transported between the thin section transport device 20 and the thin section observation device 30 by a transport mechanism 90. For example, the carrier 5 (details will be described later) to which the thin section 4 has been transferred is transported by an automatic transport system or an operator.

[0051] It is also possible to transport the wafer 3 from the thin piece transfer device 20 back to the semiconductor manufacturing line by a transport mechanism (not shown). For various transports, a FOUP, carrier 5, or the like is used. A FOUP is a container filled with an inert gas such as nitrogen, and wafers and the like can be put in and taken out of the container for storage.

[0052] The wafer 3 used in the first embodiment is composed of a semiconductor substrate in which a p-type or n-type impurity region is formed, semiconductor elements such as transistors formed on the semiconductor substrate, and wiring layers formed on the semiconductor elements. The lamina 4 is a portion formed on the wafer 3 and removed. Therefore, the lamina 4 similarly includes the semiconductor substrate, semiconductor elements, wiring layers, and other structures of the wafer 3. Furthermore, the first embodiment is primarily concerned with the inspection of the lamina 4 of the wafer 3 used in a semiconductor manufacturing line, but the present invention is not limited to this, and the sample may also be a structure used in fields other than semiconductor technology.

[0053] [Multiple Apparatuses and Communication Connections] Inspection processing in the semiconductor manufacturing process / semiconductor device inspection system 1 is shared among various apparatuses that perform different processes, and the processes are performed sequentially among these apparatuses. Such inspection processing is sometimes referred to as an inspection processing sequence. The management system 2 has the function of operating and managing the inspection processing sequence of such inspection system 1.

[0054] In the first embodiment, the inspection process sequence of the inspection system 1 is divided into a plurality of processes, such as a first process performed by the thin section manufacturing device 10, which is a first-type device, in a first step, a second process performed by the thin section transfer device 20, which is a second-type device, in a second step, and a third process performed by the thin section observation device 30, which is a third-type device, in a third step. The inspection process sequence may be composed of two or more types of devices in two or more steps.

[0055] The multiple devices that make up the inspection system 1 include, for example, one or more FIB-SEM devices 10 as the first type device, one or more lift-out devices 20 as the second type device, and one or more TEM devices 30 as the third type device in the first type inspection system 1, but are not limited to this. At least one of the steps has multiple devices.

[0056] The management system 2 is communicatively connected to each device of the inspection system 1. The communication may be, for example, communication via a LAN, but is not limited to this. The devices of the inspection system 1, for example, the FIB-SEM device 10, the lift-out device 20, and the TEM device 30, may be communicatively connected to each other, but this is not required. Since the first embodiment has the management system 2, communication between these devices may be replaced with communication via the management system 2. Each device of the inspection system 1 has a controller (for example, the controller 10C in FIG. 1) for controlling the device itself, but this is not required. The management system 2 may also serve as the controller for the device. In other words, the management system 2 may be implemented with a control function for some of the devices.

[0057] The devices in the inspection system 1 may differ in function, even if they are of the same type. For example, the specifications of the multiple FIB-SEM devices 10 in the first step may differ. The management system 2 manages such differences as information and takes them into consideration when creating the plan, which will be described later. The differences in function of each device, along with differences between devices, affect the success rate of processing operations in the device.

[0058] 2 shows a configuration example in which multiple devices constituting the inspection system 1 are connected to the management system 2 via communication (which may be wired or wireless) based on FIG. 1. In the first embodiment, multiple FIB-SEM devices 10 are used as the first-step lamina fabrication device 10, multiple lift-out devices 20 are used as the second-step lamina transfer device 20, and multiple TEM devices 30 are used as the third-step lamina observation device 30. The example in FIG. 2 shows a case in which one FIB-SEM device 10, one lift-out device 20, and one TEM device 30 are used in combination to provide three sets.

[0059] The thin section observation device 30 is not limited to a TEM device, and a STEM device may also be applied.

[0060] The management system 2 is operated and used by a user, for example, an inspection manager. The management system 2 provides a management screen to the user. This screen is a screen with a graphical user interface (GUI) for operation, management, assistance, support, visualization, etc. of the inspection process sequence. Furthermore, the inspection system 1 has traditionally had a control screen for each device. The devices in the inspection system 1 provide a control screen to the user who uses the device. Screen examples will be described later.

[0061] In the inspection process of the inspection system 1, some of the work may be performed by different operators. Fig. 2 shows an example in which a responsible operator is associated with each step of the inspection process sequence. For example, a first operator W1 is responsible for the FIB-SEM apparatus 10 in the first step, a second operator W2 is responsible for the lift-out apparatus 20 in the second step, and a third operator W3 is responsible for the TEM apparatus 30 in the third step. The association is not limited to this, and the same operator may be responsible for multiple steps or multiple apparatuses, for example.

[0062] Each user, such as an inspection manager or an operator, may carry a mobile terminal for work, and the management system 2 may transmit information to each user's mobile terminal and display it on the screen of the mobile terminal. Furthermore, information transmission and output from the management system 2 is not limited to screen display, and may also use audio output, lamp lighting control, etc.

[0063] [Management System] Fig. 3 shows an example of the configuration of the management system 2 as a computer system 2 and an example of the configuration of data and information. The computer system 2, which is the management system 2 in Fig. 3, is mainly composed of a computer 1000. In this example, the computer 1000 is connected to a LAN 1100 as a communication network. As an implementation example, the computer 1000 may be a PC or a server device. Each device of the inspection system 1 in Fig. 1 is connected to the LAN 1100. The computer 1000 can communicate with each device of the inspection system 1 via the communication interface device 1003 and the LAN 1100.

[0064] The computer 1000 includes a processor 1001, a memory 1002, a communication interface device 1003, an input / output interface device 1004, and the like, which are connected to a bus. The computer 1000 realizes a management function 1101 and the like as an execution module by executing processing according to a control program using the processor 1001. The management function 1101 is a part that realizes various functions described below. The processor 1001 is composed of, for example, a CPU. The memory 1002 is composed of, for example, a non-volatile storage device. The memory 1002 stores preset information, various information input by a user, and various information generated by the computer 1000. The communication interface device 1003 is equipped with a communication interface for communicating with external devices via the LAN 1100. An input device 1005 and an output device 1006 are externally connected to the input / output interface device 1004. The input device 1005 and the output device 1006 may be built into the computer 1000.

[0065] In this example, the memory 1002 stores inspection instruction information 51, apparatus status information 52 (including a schedule), plan information 53, inspection processing status information 54, inspection processing performance information 55, inspection setting information 56, etc. These data and information are generated as needed. The memory 1002 may be realized as a storage area of ​​an external storage device.

[0066] The inspection setting information 56 includes setting information regarding the inspection processing of the inspection system 1, such as the functional mode when the inspection processing is executed, configuration information of the inspection system 1 (e.g., type, number, etc.), operation manual information, information on the semiconductor manufacturing factory, sample design information, and other data and information necessary for operation and management in the management system 2.

[0067] Other devices may be connected to the LAN 1100 in FIG. 3 . Examples of such devices include a user's client terminal device, an external defect inspection device, and a manufacturing execution system (MES). The computer 1000 may communicate with these external devices to input and output necessary data and information. The computer 1000 may function as a server, forming a client-server system with the user's client terminal device. In this case, the server computer 1000 handles the main processing, and the user's client terminal device handles the GUI. The computer 1000 generates GUI information and data information, for example, in the form of a web page, and sends it to the user's client terminal device. The user can view the GUI and data information displayed on the screen of the client terminal device and input instructions and settings as needed. The client terminal device then sends the instructions and other information to the computer 1000. The computer 1000 performs processing according to the instructions and other information and sends GUI information including the processing results to the client terminal device. The client terminal device displays the information on its screen, allowing the user to view it on the screen.

[0068] [Inspection Processing Flow of the Inspection System] Figure 4 shows an overview of the inspection processing flow of the inspection system 1, including steps S101 to S106. Figure 4 illustrates the inspection processing sequence of a first type of inspection system (Figure 6). This flow is automatically executed and controlled by each device of the inspection system 1 (especially the controller 10C in Figure 1, etc.) based on instructions from the management system 2, but some parts may be manually operated by a user. For example, in the first and second transport steps, not only automatic transport by an automatic transport system but also transport work by an operator may be applied, and in each step such as the first step, the operator may press a start button when the device processing begins.

[0069] In step S101, a FOUP containing wafers 3 to be inspected is transported from the semiconductor manufacturing line via a transport mechanism to the location of the lamina production device 10 of the inspection system 1. The lamina production device 10 receives the FOUP and places the wafers 3 on the stage. At this time, the controller of the inspection system 1 or the management system 2 acquires data and information such as information on the inspection target locations of the wafers 3 and inspection instructions from the factory's manufacturing management system. In the first embodiment, the management system 2 receives data and information such as inspection instructions from the manufacturing management system, and the management system 2 instructs the inspection system 1 to perform the inspection process.

[0070] In step S102, the FIB-SEM device 10, which is the first-step lamina production device 10, performs a lamina processing operation as a first process, forming and producing one or more lamina 4 on the wafer 3. Based on information such as the inspection position received from the management system 2, the lamina production device 10 moves the stage to position the field of view at the inspection target position on the surface of the wafer 3. Then, the lamina production device 10 irradiates the inspection target position with a beam, which is an FIB, to form a lamina portion 4a corresponding to the lamina 4 (see FIG. 5, described below).

[0071] In step S103, a first transfer step is performed. In the first transfer step, the wafer 3 on which the lamina portion 4a is formed is transferred from the lamina production device 10 to the lamina transfer device 20 by an automatic transfer system as the transfer mechanism 80 or by an operator. The wafer 3 is transferred while stored in, for example, a holder (e.g., a FOUP) described below.

[0072] In step S104, the lift-out device 20, which is the lamina transfer device 20 in the second step, performs a lift-out process operation to remove the lamina 4 from the wafer 3 and transfer it onto the carrier 5 as the second process.

[0073] In step S105, a second transport step is performed. In the second transport step, the carrier 5 carrying the lamina 4 is transported from the lamina transfer device 20 to the lamina observation device 30 by an automatic transport system as the transport mechanism 90 or by an operator. The carrier 5 is transported, for example, stored in an LCC (Liquid Carrier Control Center) described below.

[0074] In step S106, the TEM device 30, which is the thin section observation device 30 of the third step, performs cross-sectional observation of the thin section 4 on the carrier 5 using TEM images as the third process, analyzes and inspects it, and stores and outputs the results as data 9.

[0075] [Overview of the Inspection Processing Devices and Steps] Figure 5 shows the schematic configuration of each device, the thin section preparation device 10, the thin section transfer device 20, and the thin section observation device 30, in the first type inspection system 1, and the corresponding first, second, and third steps. Figure 5(A) shows the thinning processing operation by the thin section preparation device 10, for example, the FIB-SEM device 10, in the first step. Figure 5(B) shows the lift-out processing operation by the lift-out device 20, which is the thin section transfer device 20, in the second step. Figure 5(C) shows the cross-sectional observation processing operation by the TEM device 30, which is the thin section observation device 30, in the third step. Note that the lower part of (A) shows an enlarged example of the thin section portion 4a, and the lower part of (B) shows an enlarged example of the thin section 4 (details will be described later).

[0076] The lamina production device 10 is, for example, an FIB-SEM device as shown in Fig. 10, which will be described later. The lamina transfer device 20 is, for example, a lift-out device as shown in Fig. 11, which will be described later. The lamina observation device 30 is, for example, a TEM device as shown in Fig. 12, which will be described later. These devices are, in other words, charged particle beam devices, microscope devices, etc.

[0077] 5A, the thin section manufacturing apparatus 10 has at least an FIB column 11, which is an ion beam column 11, and an SEM column 12, which is an electron beam column 12. The ion beam column 11 includes all the components necessary for an FIB apparatus, such as an ion source for generating a charged particle beam b11, which is an ion beam b11, a lens for focusing the ion beam b11, and a deflection system for scanning and shifting the ion beam b11. The electron beam column 12 includes all the components necessary for an SEM apparatus, such as an electron source for generating a charged particle beam b12, which is an electron beam b12, a lens for focusing the electron beam b12, and a deflection system for scanning and shifting the electron beam b12.

[0078] In the first step, the lamina production device 10 irradiates the wafer 3 with an ion beam b11 from the ion beam column 11 and etches a portion of the wafer 3, thereby creating the outline of the lamina 4. Furthermore, the lamina production device 10 uses the ion beam b11 to etch a portion of the lamina 4, thereby creating an analysis portion 4b near the top surface of the lamina 4. The analysis portion 4b is then subjected to a finishing process, etc., for later analysis by the TEM device 30. Furthermore, the etching by the ion beam column 11 is performed while the wafer 3 is irradiated with an electron beam b12 from the electron beam column 12, and the etched portion is observed, in other words, imaged and monitored. One or more lamina portions 4a corresponding to one or more lamina 4 are formed on the top surface of a single wafer 3.

[0079] In the first transport step, the wafer 3 on which the plurality of lamellae 4 are formed is transported from the lamella manufacturing device 10 to the lamella transfer device 20 via the transport mechanism 80 .

[0080] At this time, the management system 2 (or the controller of the inspection system 1) acquires data and information such as the manufacturing position of the lamina 4 on the wafer 3 from the lamina manufacturing device 10. Then, the management system 2 transmits the data and information such as the manufacturing position to the lamina transfer device 20.

[0081] In the second step, the lamina transfer device 20, based on the data and information received from the management system 2, uses the detacher 23 to remove the lamina 4 from the manufacturing position on the wafer 3 and transfer it onto the carrier 5. This transfer is repeated until it is completed for all the lamina 4 formed on the surface of the wafer 3.

[0082] In the second transport step, the carrier 5 to which the thin section 4 has been transferred is transported from the thin section transfer device 20 to the thin section observation device 30 via the transport mechanism 90 .

[0083] At this time, the management system 2 (or the controller of the inspection system 1) acquires data and information such as the position of the thin section 4 transferred and mounted on the carrier 5 from the thin section transfer device 20. The management system 2 then transmits the data and information to the thin section observation device 30.

[0084] In a third step, the thin section observation device 30 performs cross-sectional observation of the thin section 4 (particularly the analysis portion 4b) at the target position on the carrier 5 set inside the device based on the data and information received from the management system 2. The thin section observation device 30 has at least an electron beam column 31. The electron beam column 31 includes all the components necessary for a TEM device, such as an electron source for generating a charged particle beam b31, which is an electron beam b31, a lens for focusing the electron beam b31, and a deflection system for scanning and shifting the electron beam b31. The thin section observation device 30 also has a detector 32, such as a charged particle detector and an X-ray detector. A TEM image is obtained based on the detection signal from the detector 32.

[0085] Observation and analysis of analysis portion 4b of lamina 4 in lamina observation device 30 is performed inside the device with lamina 4 still mounted on carrier 5. Furthermore, carrier 5 on which lamina 4 is mounted is positioned so that the front of analysis portion 4b of lamina 4 (i.e., the surface on which the cross-sectional structure is exposed) faces electron beam column 31, in other words, so that electron beam b31 is irradiated onto the front of analysis portion 4b.

[0086] The thin section observation device 30 first irradiates the analysis portion 4b of the thin section 4 with an electron beam b31 from the electron beam column 31. Particles generated from the analysis portion 4b of the thin section 4 by the irradiation are detected as detection signals by the detector 32. The detection signals of the detected particles are processed by an arithmetic processing unit provided in the detector 32 and converted into an image. The thin section observation device 30 analyzes and inspects the structure of the analysis portion 4b of the thin section 4 from the acquired image. In addition, X-rays generated from the analysis portion 4b are detected by the X-ray detector, and similarly, the materials constituting the analysis portion can be analyzed based on the obtained image.

[0087] Data 9 (FIG. 1) generated as a result of observation and analysis by such thin section observation device 30 is stored in the memory of a controller (for example, controller 30C in FIG. 1) of inspection system 1. Furthermore, this data 9 is output and transmitted to management system 2 and stored in the memory of management system 2. Management system 2 stores data 9 in its own memory and can display inspection results on a screen to a user, such as an inspection manager, based on the data 9.

[0088] 6 shows an outline of the configuration of the inspection process sequence in the first type inspection system 1. The inspection system 1 receives a wafer 3, which is a sample to be inspected, from a semiconductor manufacturing line in a factory by transport in a FOUP or the like. Furthermore, the management system 2 receives information such as information on the location to be inspected and inspection instructions from the manufacturing management system of the factory.

[0089] The inspection process sequence of the first type inspection system 1 realizes cross-sectional observation of the lamina 4. The inspection process sequence of the first type inspection system 1 is broadly composed of first to third steps. The first type inspection system 1 is composed of three types of devices, for example, an FIB-SEM device 10, a lift-out device 20, and a TEM device 30, and the inspection process sequence is a sequence of continuous processing using these devices in this order. The first step is a thinning processing step, in which the FIB-SEM device 10, for example, is used as the first type device. The second step is a lift-out step, in which the lift-out device 20 is used as the second type device. The third step is a cross-sectional observation step, in which the TEM device 30 is used as the third type device.

[0090] In the first step, the FIB-SEM device 10 performs thinning processing according to a specified recipe as a first process during a time (start time to end time) specified in a plan (described below) of the management system 2. A specified FOUP storing a specified wafer 3 is set in the FIB-SEM device 10. The FIB-SEM device 10 then performs the specified first process, thinning, on the specified wafer 3 removed from the FOUP. This first process is a process of forming and producing a thin section 4a by thinning the area of ​​the wafer 3 to be inspected using a charged particle beam. The FIB-SEM device 10 forms the thin section 4a on the wafer 3 while monitoring using SEM images captured based on the beam. At this point, the thin section 4a is still connected to the wafer 3 via a portion. The FIB-SEM device 10 transfers and stores the wafer 3 on which the thin section 4a is formed into a holder 6 (for example, a FOUP).

[0091] Between the first step and the second step, there is a first transfer step. In the first transfer step, for example, an automatic transfer system transfers the holder 6 (FOUP) storing the wafers 3 to the lift-out device 20 in the second step via the transfer mechanism 80. Then, the holder 6 is set in the lift-out device 20. In the case of manual transfer, an operator transfers the holder 6 (FOUP) to the lift-out device 20 and sets it in the lift-out device 20.

[0092] In the second step, the lift-out device 20 performs a lift-out process operation according to a specified recipe as the second process during the time (start time to end time) specified in the plan. The lift-out device 20 removes the lamina 4a from the specified position of the wafer 3 removed from the set FOUP using the remover 23 (FIG. 5) and transfers it to the specified position of the specified carrier 5 (LC, described below).

[0093] Between the second step and the third step is the second transfer step. In the second transfer step, for example, an automatic transfer system transfers the carrier 5 (LCC 7, which will be described in detail later) to the TEM device 30 in the third step via the transfer mechanism 90. Then, the carrier 5 (LCC 7) is set in the TEM device 30. In the case of manual transfer, an operator transfers the carrier 5 (LCC 7) to the TEM device 30 and sets it in the TEM device 30.

[0094] In the third step, the TEM device 30 performs a processing operation for cross-sectional observation of the lamina 4 using a specified recipe as the third process during the time (start time to end time) specified in the plan. The TEM device 30 loads the set carrier 5 (a cartridge, described in detail later) into the interior and performs TEM image observation of the lamina 4 on the carrier 5. At this time, the TEM device 3 acquires a TEM image of the analysis portion 4b of the lamina 4 on the mesh, described later, of the carrier 5 under specified conditions such as position and magnification. At this time, a reference that can be searched at low magnification is specified to position the lamina 4 to the observation position, so searching to the final observation position can be automated. The TEM device 30 performs the above processing operation a specified number of times and for a specified number of pieces, and then loads the carrier 5 externally.

[0095] The TEM device 30 stores image data of the acquired TEM image and data on the results of processing such as measurement and analysis of the image as data 9 and transmits it to the management system 2. The management system 2 receives the data 9 from the TEM device 30 and stores it in memory. The management system 2 can display the cross-sectional observation results, which are part of the inspection processing results, on a screen based on the data 9. It should be noted that the data 9 is not limited to being transmitted from the TEM device 30 to the management system 2, and the cross-sectional observation results may also be output to the screen of an output device of the TEM device 30 at the location of the TEM device 30.

[0096] A specific example of cross-sectional observation of the flake 4 using the TEM device 30 is as follows. In this cross-sectional observation, the position, shape, and dimensions of laminated films and the like are measured, analyzed, and evaluated for the cross-sectional structure appearing on the front surface of the flake 4 (particularly the analysis portion 4b). For example, the width and depth of trenches, holes, etc. are measured. Then, for example, by comparing the measured values ​​with reference values, it is evaluated and determined whether the position, shape, and dimensions of the films and the like are appropriate.

[0097] The transfer steps include transferring the holder 6 (FOUP) from the manufacturing line to the FIB-SEM device 10, transferring the holder 6 (FOUP) from the FIB-SEM device 10 to the lift-out device 20 as a first transfer step, and transferring the carrier 5 (LCC 7) from the lift-out device 20 to the TEM device 30 as a second transfer step. These transfer steps may be performed using an automatic transfer method using an automatic transfer system, a manual transfer method by an operator, or a combination of these. When the automatic transfer method is used, fully automated inspection processing can be achieved. Such a transfer method is predefined for each environment of the inspection system 1. The management system 2 has the function of creating a plan corresponding to such a transfer method. When the manual transfer method is used, the management system 2 can also send and notify work instructions to the responsible operator, as will be described later.

[0098] [Second Type Inspection System and Inspection Processing Sequence] Figure 7 shows an overview of the configuration of the inspection processing sequence in the second type inspection system 1. Inspection instructions from the factory are the same as those for the first type. The second type inspection processing sequence differs mainly from the first type inspection processing sequence in that it uses a second type FIB-SEM device 20 (10B) without using a lift-out device 20. Additionally, the second type can achieve planar observation of the lamella 4 (in other words, plane view imaging) using the TEM device 30. This planar observation involves observing a TEM image in the planar direction of the wafer 3. As with the first type inspection processing sequence, the functions of the management system 2 can also be applied to the second type inspection processing sequence.

[0099] The inspection process sequence of the second type inspection system 1 is broadly divided into first to third steps. The second type inspection system 1 is composed of a set of three types of devices, for example, a first type FIB-SEM device 10 (10A), a second type FIB-SEM device 20 (10B), and a TEM device 30, and the inspection process sequence is a sequence of continuous processing using these devices in this order. The first step is a thinning step, in which, for example, the first type FIB-SEM device 10 (10A) is used as the first type device. The second step is a final finishing step, in which, for example, the second type FIB-SEM device 20 (10B) is used as the second type device. The third step is a cross-section observation step, in which the TEM device 30 is used as the third type device.

[0100] In the first step, the first type FIB-SEM device 10 performs FIB processing on the inspection target position of the wafer 3 according to a specified recipe as a first process, thinning the wafer 3 to a state immediately before final finishing, thereby forming a lamina 4a in that state. After this processing, the first type FIB-SEM device 10 cuts out the lamina 4a from the wafer 3 using FIB processing and transfers it onto the carrier 5 (see FIG. 9, which will be described later). The first type FIB-SEM device 10 loads the carrier 5 externally and stores it in the LCC 7. In the case of the second type, the first step includes the processing operation of transferring the lamina 4.

[0101] In the first transfer step, the carrier 5, to which the thin section 4a of the wafer 3 has been transferred, is transferred to the second type FIB-SEM device 20 in the second step by, for example, an automatic transfer system via the transfer mechanism 80, while being stored in the LCC 7. Then, the carrier 5 is set in the second type FIB-SEM device 20.

[0102] In the second step, as the second process, the second type FIB-SEM device 20 loads the LCC 7 and performs final FIB processing on the lamina portion 4a on the carrier 5 using a specified recipe. At this time, the second type FIB-SEM device 20 uses the SEM image to observe the final finishing position while moving the stage to that position, and irradiates the lamina portion 4a at that position with an FIB to perform final FIB processing. Note that this final finishing processing may take a relatively long time. Therefore, the management system 2 of embodiment 1 is effective in improving the efficiency of the entire inspection process.

[0103] The second type FIB-SEM device 20 performs the above processing operation a specified number of times for a specified number of slices 4, and then loads the LCC 7, which stores the carrier 5 (LC) on which the final finished slices 4 are mounted, to the outside.

[0104] In the second transport step, the LCC 7 storing the carrier 5 is transported to the TEM device 30 in the third step by, for example, an automatic transport system via the transport mechanism 90. Then, the carrier 5 stored in the cartridge 8 is set in the TEM device 30.

[0105] In the third step, the TEM device 30 performs cross-sectional observation (particularly planar observation) as a third process. The TEM device 30 loads the cartridge 8 storing the carrier 5 into the interior, and sets the lamina 4 on the carrier 5 in a state where the beam is irradiated. The TEM device 30 acquires a TEM image of the lamina 4 on the mesh of the carrier 5 under specified conditions such as a specified position and magnification. After performing the above processing operation a specified number of times and for a specified number of pieces, the TEM device 30 loads the cartridge 8 storing the carrier 5 into the exterior.

[0106] In the above-described first type inspection processing sequence, there are machine differences between the FIB-SEM device 10 in the first step and the lift-out device 20 in the second step. Similarly, in the above-described second type inspection processing sequence, there are machine differences between the first type FIB-SEM device 10 in the first step and the second type FIB-SEM device 20 in the second step. The machine differences between these devices affect the success / failure of processing operations such as transferring the wafer 3 or lamella 4.

[0107] [Configuration Example of Carrier, etc. in First Type] Figure 8 shows a configuration example of the carrier 5, etc. in the inspection process sequence of the first type inspection system 1 in Figure 6. In the first step, one or more flake portions 4a are formed on the surface of the wafer 3 by the FIB-SEM device 10. The wafer 3 on which the flake portions 4a have been formed is stored in a holder 6, such as a FOUP (Front Opening Unified Pod). For example, 20 to 30 wafers 3 can be stored in one FOUP. The FOUP is then transported to the lift-out device 20.

[0108] In the second step, the lift-out device 20 removes the lamella 4 from the wafer 3 using the remover 23 and transfers the removed lamella 4 onto the mesh 5m of the LC (Lamella Carrier), which is the carrier 5. At this time, the lamella 4 is inserted, for example, into a pillar on the mesh 5m (see FIG. 17 , etc., described later). The LC, which is the carrier 5, is further stored in an LCC (Lamella Carrier Container) 7. For example, one LCC 7 can store eight LCs. The LCC 7 is transported to the TEM device 30. In the TEM device 30, the LC, which is the carrier 5, is transferred from the LCC 7 to a TEM cartridge 8, which is then loaded and set inside the TEM device 30.

[0109] [Configuration Example of Carrier, etc. in Second Type] Figure 9 shows a configuration example of the carrier 5, etc. in the inspection process sequence of the second type inspection system 1 of Figure 7. In the first step, the first type FIB-SEM device 10 forms one or more thin sections 4a on the surface of the wafer 3 to a state immediately before final finishing. The first type FIB-SEM device 10 cuts out the thin sections 4a from the wafer 3 and transfers the cut out thin sections 4a onto the mesh 5m of the LC, which is the carrier 5. At this time, the thin sections 4a that remain to be finished are adhered to, for example, pillars on the mesh 5m (Figure 18 described below). The LC, which is the carrier 5, is stored in the LCC 7. The LCC 7 is transported to the second type FIB-SEM device 20.

[0110] In the second step, the second type FIB-SEM device 20 performs final finishing on the lamina 4 on the carrier 5. The LCC 7, which stores the carrier 5 (LC) on which the lamina 4 after final finishing is mounted, is transported to the TEM device 30. In the TEM device 30, the LC, which is the carrier 5, is similarly transferred from the LCC 7 to a cartridge 8 for the TEM, and the cartridge 8 is loaded and set inside the TEM device 30.

[0111] [Thin section fabrication device: FIB-SEM device] Figure 10 shows an example of the configuration of an FIB-SEM device 10 that can be used as the thin section fabrication device 10 in the first step in the first or second type inspection system 1. The FIB-SEM device 10 in Figure 10 is equipped with both an FIB mechanism and an SEM mechanism. This FIB-SEM device 10 can form a thin section 4 on a wafer 3 using the FIB mechanism, and can image and observe the wafer 3 and thin section 4 using the SEM mechanism.

[0112] 10 includes a sample chamber 107, an ion beam column 11, an ion beam column controller 131, an electron beam column 12, an electron beam column controller 132, a wafer stage 104, a wafer stage controller 134, a substage 106, a substage controller 136, a probe unit 112, and a probe unit controller 142. The FIB-SEM apparatus 10 also includes charged particle detectors 109 and 110, detector controllers 139 and 140, an X-ray detector 111, an X-ray detector controller 141, an integrated control unit 130, a computer system 100, and the like.

[0113] An ion beam column 11 and an electron beam column 12 are mounted in the sample chamber 107. The ion beam column 11 is disposed such that its optical axis (shown by a dashed-dotted line) is aligned along the vertical Z-axis direction. The electron beam column 12 is disposed such that its optical axis (shown by a dashed-dotted line) is tilted relative to the optical axis of the ion beam column 11. The ion beam column 11 irradiates an ion beam b11, which is an FIB, toward a cross point CP1, and the electron beam column 12 irradiates an electron beam b12 toward the cross point CP1. The ion beam b11 emitted from the ion beam column 11 and the electron beam b12 emitted from the electron beam column 12 are focused at the cross point CP1, which is the intersection of their respective optical axes. In this example, the optical axis of the electron beam column 12 is tilted relative to the optical axis of the ion beam column 11, but the present invention is not limited to such a configuration.

[0114] The ion beam column 11 includes components necessary for an FIB device, such as an ion source that generates the ion beam b11, a lens that focuses the ion beam b11, a deflection system for scanning the ion beam b11, and a blanking deflection system for blanking the ion beam b11.

[0115] The electron beam column 12 includes components necessary for an SEM device, such as an electron source that generates the electron beam b12, a lens that converges the electron beam b12, a deflection system for scanning the electron beam b12, and a blanking deflection system for blanking the electron beam b12.

[0116] The wafer stage 104 is a movable stage on which the wafer 3, which is a sample, can be placed. The substage 106 is a movable stage on which the flake 4 or the carrier 5 can be placed. The wafer stage 104 and other stages are capable of horizontal and rotational movement. The integrated control unit 130 controls the movement of the wafer stage 104 via a wafer stage controller 134, thereby positioning the target area on the surface of the wafer 3 (for example, the area where the flake 4 is to be formed) so that the beam can be irradiated.

[0117] The charged particle detector 109 detects, as a detection signal, charged particles generated when the ion beam b11 is irradiated onto the sample. The charged particle detector 110 detects, as a detection signal, charged particles generated when the electron beam b12 is irradiated onto the sample. The detector controller 139 performs arithmetic processing on the detection signal of the charged particle detector 109 to generate an image. The detector controller 140 performs arithmetic processing on the detection signal of the charged particle detector 110 to generate an image. The detector controllers 139 and 140 each include an arithmetic processing unit implemented by a circuit or program processing.

[0118] The probe unit 112 uses a probe to pick up the lamella portion 4a formed on the wafer 3 based on control via the probe unit controller 142. In the case of the second type, the probe unit 112 may be, for example, a mechanism that drives the needle 13 in FIG.

[0119] The sample chamber 107 may also include other components, such as a gas supply unit (not shown) that supplies gases used for etching and deposition processes, and may also include another type of detector, such as a backscattered electron detector that detects backscattered electrons generated from the sample.

[0120] The thin section manufacturing device 10 is not limited to the FIB-SEM device described above, but may also be an FIB device without an SEM mechanism, or an FIB device equipped with an optical microscope instead of an SEM mechanism.

[0121] The integrated control unit 130 controls the entire FIB-SEM apparatus 10 and each of its components. The integrated control unit 130 is electrically connected to the controllers of each component, such as the wafer stage controller 134, and can communicate with each other. The integrated control unit 130 controls the controllers of each component using control signals. Multiple controllers may be integrated into a single controller. Each controller may be implemented by a computer system, a dedicated circuit, or the like. The integrated control unit 130 is connected to the computer system 100. The integrated control unit 130 controls the operation of the entire FIB-SEM apparatus 10 and each of its components in accordance with instructions from the computer system 100, etc.

[0122] The computer system 100 provides a user interface including a GUI to a user who uses the FIB-SEM apparatus 10, and accepts input of various instructions, settings, etc. from the user. An input device 162, an output device 161, a storage device, etc. are built into the computer system 100 or are externally connected. Examples of the input device 162 include a keyboard, a mouse, a touch panel, a microphone, etc. Examples of the output device 161 include a display, a printer, a speaker, a lamp, etc. The display displays a screen with a GUI, etc. The screen displays images captured by the FIB-SEM apparatus 10, setting information, user instruction information, etc.

[0123] A user such as an operator can check various information, images, etc. on the screen displayed on the display. The user inputs various instructions, settings, etc. to the screen using a keyboard, etc. The computer system 100 transmits instructions, etc. to the integrated control unit 130 based on the input instructions, settings, etc.

[0124] The integrated control unit 130 and the computer system 100 may be integrated into one unit. The controller 10C in FIG. 1 may be the same as the integrated control unit 130 or the computer system 100, or may be a separate computer system connected to the integrated control unit 130 or the computer system 100.

[0125] The same FIB-SEM device as above can also be applied to the second type of FIB-SEM device 20 (10B) in the second type.

[0126] [Thin Section Transfer Device: Lift-Out Device] FIG. 11 shows an example of the configuration of a lift-out device 20 that can be applied as the thin section transport device 20 in the second step in the first type inspection system 1. As shown in FIG.

[0127] The lift-out device 20 includes a sample chamber 207, which is provided with an electron beam column 21 as a first column, an electron beam column 22 as a second column, a detacher 23, a movable stage 24, a rotary stage 25 for the wafer 3, a rotary stage 26 for the carrier 5, a charged particle detector 27, etc. Although details are omitted, a holder for holding the wafer 3 is provided on the rotary stage 25, and a holder for holding the carrier 5 is provided on the rotary stage 26.

[0128] The electron beam column 21, which is the first column, includes all of the components necessary for an SEM apparatus, such as an electron source 21a for generating a charged particle beam b21, which is an electron beam b21, condenser lenses 21b and 21c for focusing the electron beam b21, an objective lens 21d, and a deflector 21e for scanning the electron beam b21. The electron source 21a, the condenser lenses 21b and 21c, the objective lens 21d, and the deflector 21e are each electrically connected to a controller 206 via a drive control unit (not shown). The controller 206 sends control signals to the respective drive control units to control the operation of the electron beam column 21.

[0129] The second column, the electron beam column 22, includes all of the components necessary for an SEM apparatus, such as an electron source 22a for generating a charged particle beam, which is the electron beam b22, condenser lenses 22b and 22c for focusing the electron beam b22, an objective lens 22d, and a deflector 22e for scanning the electron beam b22. The electron source 22a, the condenser lenses 22b and 22c, the objective lens 22d, and the deflector 22e are each electrically connected to a controller 212 via a drive control unit (not shown). The controller 212 sends control signals to each drive control unit to control the operation of the electron beam column 22.

[0130] The electron beam column 22 is mounted in the sample chamber 207 at a different angle from the electron beam column 21. The electron beam column 21 is disposed in the Z-axis direction, which is the vertical direction in the figure, and the electron beam column 22 is disposed in a direction tilted with respect to the Z-axis direction. Therefore, the electron beam b22 is irradiated at a different angle from the electron beam b21. The electron beam b21 irradiated from the electron beam column 21 and the electron beam b22 irradiated from the electron beam column 22 are mainly focused at a cross point CP2, which is the intersection of the optical axis OA1 of the electron beam column 21 and the optical axis OA2 of the electron beam column 22.

[0131] A movable stage 24 is provided in the sample chamber 207. A rotation stage 25 and a rotation stage 26 are connected to the movable stage 24. The integrated control unit 230 controls the movement of the movable stage 24 and the like via a controller 213, thereby positioning the movable stage 24 so that the electron beams b21 and b22 are irradiated onto target positions on the surface of the wafer 3. The movable stage 24, including the rotation stage 25 and the rotation stage 26, is a moving stage that can move in a plane, vertically, rotationally, and tiltably based on drive control.

[0132] The detector 27 detects charged particles and the like generated when the electron beam b21 and the electron beam b22 are irradiated onto the wafer 3 or the lamella 4. The detector 27 is electrically connected to the controller 214. The detector 27 is driven and controlled by the controller 214. The controller 214 also includes an arithmetic processing unit that processes the detection signal from the detector 27 to generate an image. The arithmetic processing unit is realized by circuit or program processing. The sample chamber 207 may also be provided with an X-ray detector, a backscattered electron detector, or the like for detecting X-rays and backscattered electrons generated from the lamella 4.

[0133] The detacher 23 is provided in the sample chamber 207 as a mechanism that can reach the cross point CP2. The detacher 23 is electrically connected to the controller 215. The detacher 23 is driven and controlled by the controller 215. By driving the detacher 23, it is possible to remove the flakes 4 from the wafer 3 and transfer the flakes 4 to the carrier 5. Furthermore, the detacher 23 is capable of planar, vertical, and rotational movement based on the drive control. Therefore, when the detacher 23 holds the flakes 4, the orientation of the flakes 4 can be freely changed. For example, nanotweezers are used as the detacher 23.

[0134] The degree of vacuum inside the sample chamber 207 is controlled by a controller 216. The sample chamber 207 may be provided on a vibration isolation table 209 to prevent vibration. The sample chamber 207 may further be provided with a pressure reducing device for evacuating the sample chamber, a cold trap, an optical microscope, and the like.

[0135] The lift-out device 20 in FIG. 11 includes electron beam columns 21 and 22 that are installed with different optical axis directions, and thus can monitor and grasp the three-dimensional positional relationships of the wafer 3, lamella 4, carrier 5, detacher 23, etc., enabling accurate and efficient processing operations (see, for example, FIG. 13 described below).

[0136] The integrated control unit 230 controls the entire lift-out apparatus 20 and each of its components. The integrated control unit 230 is electrically connected to the controllers of each component, such as the controller 213, and can communicate with each other. The integrated control unit 230 controls the controllers of each component using control signals. Multiple controllers may be integrated into one controller. Each controller may be implemented by a computer system, a dedicated circuit, or the like. The integrated control unit 230 is connected to the computer system 200. The integrated control unit 230 controls the operation of the entire lift-out apparatus 20 and each of its components in accordance with instructions from the computer system 200, etc.

[0137] The computer system 200 provides a user interface including a GUI to a user who uses the lift-out device 20, and accepts input of various instructions, settings, etc. from the user. An input device 262 such as a keyboard, an output device 261 such as a display, a storage device, etc. are built into the computer system 200 or are externally connected. The display displays a screen with a GUI, etc. Images captured by the lift-out device 20, setting information, user instruction information, etc. are displayed on the screen.

[0138] A user such as an operator can check various information, images, etc. on the screen displayed on the display. The user inputs various instructions, settings, etc. to the screen using a keyboard, etc. The computer system 200 transmits instructions, etc. to the integrated control unit 230 based on the input instructions, settings, etc.

[0139] 1 may be the same as the integrated control unit 230 or the computer system 200, or may be a separate computer system connected to the integrated control unit 230 or the computer system 200.

[0140] The configuration of the lift-out apparatus 20 is not limited to the example shown in Fig. 11. For example, an optical microscope may be provided instead of the electron beam columns 21 and 22. Furthermore, while the example configuration of Fig. 11 allows processing operations to be performed in a sealed space within the sample chamber 207, the configuration is not limited to this, and the sample chamber 207 may be omitted, and processing operations may be performed in the atmosphere.

[0141] [Thin Section Observation Apparatus: TEM Apparatus] Figure 12 shows an example of the configuration of a TEM apparatus 30 that can be used as the thin section observation apparatus 30 of the third step in the first or second type inspection system 1. The TEM apparatus 30 of Figure 12 includes an electron beam column 31, an electron beam column controller 32, a sample holder 303 on which a carrier 5 can be placed, a sample holder stage 304, a sample holder stage controller 324, a secondary electron detector 305, a detector controller 325, an X-ray detector 308, and an X-ray detector controller 328. The secondary electron detector 305 and the like correspond to the detector 32 in Figure 5C.

[0142] The TEM device 30 also includes a fluorescent screen 306, a camera 307, and a camera controller 327, which are installed below the electron beam column 31. The TEM device 30 also includes an integrated control unit 330 connected to each controller, and a computer system 300 connected to the integrated control unit 330. The computer system 300 is connected to a keyboard 362 as an input device, a display 361 as an output device, and the like.

[0143] The fluorescent screen 306 is a fluorescent screen that projects a TEM image, which is a transmission electron microscope image. The camera 307 is a camera that captures an image of the fluorescent screen 306.

[0144] The secondary electron detector 305 detects, as a detection signal, particles such as secondary electrons emitted from the flake 4 on the carrier 5 as a sample. The X-ray detector 308 detects, as a detection signal, X-rays emitted from the flake 4 on the carrier 5 as a sample.

[0145] The integrated control unit 330 controls the entire TEM device 30 and each unit. The integrated control unit 330 is electrically connected to the controllers of each unit, such as the controller 321, and can communicate with each other. The integrated control unit 330 controls the controllers of each unit using control signals. Multiple controllers may be combined into one controller. Each controller may be implemented as a computer system, a dedicated circuit, or the like. The integrated control unit 330 is connected to the computer system 300. The integrated control unit 330 controls the operation of the entire TEM device 30 and each unit in accordance with instructions from the computer system 300, etc.

[0146] The computer system 300 provides a user interface including a GUI to a user who uses the TEM device 30, and accepts input of various instructions, settings, etc. from the user. An input device 362 such as a keyboard, an output device 361 such as a display, a storage device, etc. are built into the computer system 300 or are externally connected. The display displays a screen with a GUI, etc. Images captured by the TEM device 30, setting information, user instruction information, etc. are displayed on the screen.

[0147] A user such as an operator can check various information, images, etc. on the screen displayed on the display. The user inputs various instructions, settings, etc. to the screen using a keyboard, etc. The computer system 300 transmits instructions, etc. to the integrated control unit 330 based on the input instructions, settings, etc.

[0148] 1 may be the same as the integrated control unit 330 or the computer system 300, or may be a separate computer system connected to the integrated control unit 330 or the computer system 300.

[0149] The electron beam column 31 may be configured to support both the TEM mode and the STEM mode, for example. Examples of components of the electron beam column 31 that support the TEM mode include an electron source, an illumination lens group, an objective lens, and a projection lens group. An electron energy loss spectrometer (EELS), an EELS detector, and the like are provided below the electron beam column 31. In the TEM mode, the observation area is the aforementioned analysis portion 4b ( FIG. 5 ) on the front surface (the main surface on which the cross-sectional structure is formed) of the lamina 4 on the carrier 5 placed on the sample holder 303, and the electron beam b31 (only the optical axis is shown by a dashed line) from the electron beam column 31 is irradiated over the entire observation area. The TEM device 30 acquires a projection image, an interference image, a diffraction pattern, and the like generated by the irradiation of the electron beam b31 as a TEM image.

[0150] An example of a configuration of the electron beam column 31 for STEM mode is that, in addition to the components in TEM mode, a polarization system for scanning the electron beam and an aperture for controlling the aperture angle of the electron beam are added. Furthermore, in the STEM mode configuration, instead of the fluorescent screen 306, a circular detector for detecting transmitted electrons scattered over a wide angle and a transmitted electron detector for detecting electrons transmitted through the sample are provided. In STEM mode, the electron beam is focused on the thin section 4, and a TEM image is acquired by scanning the analysis portion 4b, which is the observation area.

[0151] In addition, a cold trap, a cooling mechanism, a heating mechanism, a gas supply mechanism, etc. may be provided near the sample (thin piece 4 on carrier 5) of sample holder 303 in FIG.

[0152] [Example of lamina structure] Figure 13 shows an example of the detailed structure of the lamina 4. Figure 13 shows the state of the lamina 4, etc., when the lamina 4 formed on the wafer 3 is removed while being observed, for example, in the second step lift-out device 20 (Figure 11, etc.) in the first type inspection system 1. Figure 13 also schematically illustrates an example of the arrangement of the electron beam column 21 and the electron beam column 22 relative to the lamina portion 4a of the wafer 3. In addition, in the drawings, (X, Y, Z), etc. may be used as a coordinate system for explanation. The X-axis and Y-axis are two orthogonal axes that form the horizontal plane direction. The Z-axis is a vertical direction perpendicular to the X-axis and Y-axis.

[0153] In the first step, the FIB-SEM device 10 forms a lamina portion 4a on the surface of the wafer 3 as shown. The lamina 4, which has not yet been separated from the wafer 3, may also be referred to as the lamina portion 4a. Figure 13 shows a schematic perspective view of a portion of the wafer 3 where the lamina portion 4a is formed. The width and thickness of the lamina 4 in the Y direction are smaller than those in the X and Z directions. An analysis portion 4b is provided at the top of the lamina 4 in the Z direction and at the center in the X direction. The analysis portion 4b is the region to be observed by the lamina observation device 30. As shown, the width and thickness of the analysis portion 4b in the Y direction are smaller than those of the surrounding lamina 4.

[0154] The analysis portion 4b is formed thinner than the main body of the flake 4, but is not limited to this, and may have any thickness that allows TEM image observation. The size of the wafer 3 is, for example, 100 mm to 300 mm, the size of the flake 4 is, for example, several μm to several tens of μm, the thickness of the flake 4 is, for example, several μm, and the thickness of the analysis portion 4b is, for example, several nm to several tens of nm.

[0155] In the first embodiment, the surfaces viewed from above in the Z direction may be referred to as the top surfaces of the lamina 4 and the analysis portion 4b, and the surfaces viewed from the front in the Y direction may be referred to as the front surfaces of the lamina 4 and the analysis portion 4b. The surfaces viewed from the X direction are the right and left sides of the lamina 4, the surfaces viewed from below in the Z direction are the bottom surfaces of the lamina 4, and the surfaces viewed from the rear in the Y direction are the back surfaces of the lamina 4 and the analysis portion 4b. The perspective view of Figure 13 mainly shows the front, right side, top, and tapered bottom surfaces of the lamina 4.

[0156] 13 , before being removed, the thin section 4 is connected to the wafer 3 by some of the connecting portions 4c in the state of the thin section portion 4a, and the thin section portion 4a, the connecting portions 4c, and the wafer 3 are integrated. This is not a limitation, and one thin section portion 4a may be connected by multiple connecting portions 4c. When the thin section 4 is transferred by the lift-out device 20, the thin section 4 is grasped by the detacher 23 and cut at the connecting portions 4c to be separated from the wafer 3.

[0157] The wafer 3 is placed on the rotation stage 25 in Fig. 11 so that the top surface of the lamella 4 faces the electron beam column 21 and the front surface of the lamella 4 faces the electron beam column 22. In this state, the electron beam column 21 irradiates the wafer with the electron beam b21 along the optical axis OA1 (downward along the Z axis), and the electron beam column 22 irradiates the wafer with the electron beam b22 along the optical axis OA2 (inclined relative to the Z axis). The cross point CP2 in Fig. 11 is located at the analysis portion 4b in Fig. 13.

[0158] In Figure 13, the electron beam b21 from the electron beam column 21 is irradiated perpendicularly onto the top surface of the flake 4. Because the electron beam column 22 is installed at a different angle from the electron beam column 21, the electron beam b22 is irradiated onto the flake 4 at a different angle from the electron beam b21, and in Figure 13, the electron beam b22 is irradiated from an oblique direction relative to the front of the flake 4. Based on these irradiations, charged particles generated from the flake 4 are detected as detection signals by the detector 27 in Figure 11, and the detection signals are converted into images by a processing device included in the control unit 214. In this way, a top-view SEM image and a side-view SEM image are acquired.

[0159] The top-view SEM image taken by the electron beam column 21 mainly enables inspection of the thickness of the analysis portion 4b and the entire thickness of the lamina 4. The side-view SEM image taken by the electron beam column 22 mainly enables inspection of whether or not there are any damaged areas or foreign matter attached to the lamina 4. At the same time, the side-view SEM image also enables observation of the general structure of the device formed in the analysis portion 4b. The SEM images obtained here are stored in the storage device of the computer system 200.

[0160] As described above, the lift-out device 20 uses two SEM images from two electron beam columns to enable simple inspection and quality assessment of the flakes 4. As a result of this inspection, the flakes 4 are separated into good and bad products. Bad products are flakes 4 that are unsuitable for observation with the TEM device 30, for example, because of the presence of damaged areas or foreign matter. Flakes 4 that are judged to be good are removed, while flakes that are judged to be bad are left as they are. Note that such inspection and quality assessment may be performed automatically by the lift-out device 20 or manually by the user.

[0161] Next, while checking the SEM image by the electron beam column 21 or the electron beam column 22, the lift-out device 20 uses the controller 215 to move the detacher 23 above the lamina 4 that has been determined to be a non-defective product. The lift-out device 20 lowers the detacher 23 and brings the tip of the detacher 23 into contact with the lamina 4. Here, the lift-out device 20 can confirm the height of the detacher 23 using the side-view SEM image by the electron beam column 22, and can confirm that the detacher 23 has come into contact with the lamina 4 using the top-view SEM image by the electron beam column 21. The lift-out device 20 also operates the detacher 23 so that the analysis portion 4b is not grabbed.

[0162] [Example (2) of Thin Section Transfer Processing Operation] Next, the lift-out device 20 removes the thin section 4 from a portion of the wafer 3. FIG. 14 shows the state in which the lift-out device 20 grasps and removes the thin section 4 from a portion of the wafer 3 with the tip of the detacher 23. At this time, the lift-out device 20 raises the detacher 23 while the detacher 23 holds the thin section 4 (a portion other than the analysis portion 4b), thereby separating the thin section 4 from the wafer 3 by cutting at the connecting portion 4c. Alternatively, the thin section transport device 20 may lower the movable stage 24 to separate the thin section 4 from the wafer 3 by cutting at the connecting portion 4c. As a result, the thin section 4 is lifted off from the wafer 3. The above-described method (a generic term including a method, a system, a mechanism, etc.) is called the lift-out method. In the first type inspection system 1, the thin section 4 is removed from the wafer 3 by the above-described lift-out method and transferred to the carrier 5.

[0163] Next, the lift-out device 20 acquires an SEM image of the flake 4 while the flake 4 is held by the detacher 23. Thereafter, the lift-out device 20 may perform a secondary pass / fail judgment on the flake 4 as a simple inspection based on the acquired SEM image.

[0164] [Example of Thin Section Relocation Processing Operation (3)] According to the characteristics of the SEM device, a higher resolution image can be obtained when the distance (WD: Working Distance) between the thin section 4 and the objective lens 22d is shortened. To utilize this characteristic, the lift-out device 20 may perform the following operation.

[0165] 15 shows an example of the operation of the lift-out device 20 when moving the lamina 4 using the detacher 23 to capture a suitable SEM image with the electron beam column 22. As shown in (A), the lift-out device 20 rotates the detacher 23 while holding the lamina 4, so that the front of the analysis portion 4b is perpendicular to the irradiation direction of the electron beam b22, as shown. PD is the axis of the detacher 23, and the lamina portion 4a is arranged along this axis. The optical axis OA2 of the electron beam b22 is perpendicular to this axis.

[0166] Next, as shown in (B), the lift-out device 20 translates the detachable device 23 in the direction of the optical axis OA2, bringing the front of the analysis portion 4b closer to the electron beam column 22. In this way, the working distance between the thin section 4 and the objective lens 22d is adjusted to an appropriate distance. This allows a high-resolution SEM image to be obtained by the electron beam column 22.

[0167] The lift-out device 20 may also perform a secondary pass / fail judgment of the flake 4 using an SEM image in the state shown in FIG. 15 . This secondary pass / fail judgment is performed with a higher resolution than the primary pass / fail judgment. The device structure formed in the analysis portion 4 b is observed as an SEM image with more detail than the primary pass / fail judgment. The SEM image obtained here is stored in the storage device of the computer system 200. The secondary pass / fail judgment may also be performed automatically by the lift-out device 20 or manually by the user.

[0168] As a result of the above-mentioned inspection and secondary quality assessment, flakes 4 that are judged to be good products are transferred to carriers 5, and flakes 4 that are judged to be defective are stored in a defective product storage area.

[0169] [Example of Carrier Structure] Figure 16 shows an example of the structure of a carrier 5 used when transferring a lamella 4 to a carrier 5 using a lift-out device 20 in a first type of inspection system 1. Figure 16 (A) shows a longitudinal cross-sectional view of the carrier 5, which is an LC. This LC carrier 5 is also called a lamellar grid, a TEM mesh, or the like. This carrier 5 includes a half-moon-shaped base 5a and multiple support portions 5b that protrude upward from the surface of the base 5a in the Z direction. The mesh 5m is composed of multiple support portions 5b. Each support portion 5b is a lamella support portion that has a structure that allows the lamella 4 to be mounted and held.

[0170] The base 5a including the plurality of support portions 5b may be made of a single material such as silicon, but the portions of the base 5a where the plurality of support portions 5b are provided and their surroundings may be made of a material different from the material that makes up the base 5a. For example, the majority of the base 5a may be made of copper, and the plurality of support portions 5b and their surroundings may be made of silicon.

[0171] Marks 5c consisting of holes penetrating the base 5a are provided at both ends of the base 5a where no support portions 5b are provided (circumferential portions when viewed in plan on the top surface of the carrier 5). The marks 5c are provided as marks of different shapes, and circular and triangular marks 5c are exemplified here. The marks 5c make it easy to distinguish between the front and rear of the carrier 5. Furthermore, when determining which support portion 5b the flake 4 should be relocated to, the desired support portion 5b can be found using the marks 5c as a reference, making it easy to identify the relocation position.

[0172] FIG. 16B shows an example of the structure of the support portion 5b. (B) shows a state in which no flakes 4 are mounted on the support portion 5b. In this example, one support portion 5b is composed of four pillars 5d {5d1, 5d2, 5d3, 5d4} as pillars (supports) 5d extending upward from the base 5a. The pillars 5d1 and 5d2 are spaced apart from each other in the Y direction, and the pillars 5d3 and 5d4 are spaced apart from each other in the Y direction. Furthermore, the pillars 5d1 and 5d2 are spaced apart from the pillars 5d3 and 5d4 in the X direction. These spacing distances are designed as distances for supporting the flakes 4.

[0173] A single carrier 5 has a plurality of such support portions 5b, for example, 4 to 20, arranged in a mesh 5m on the XY plane. While the pillars 5d are shown as having a rectangular prism shape, they may have any shape that can hold the flakes 4, such as a polygonal prism or a cylinder. The example of FIG. 16 is not limitative; only one end of the flakes 4 may be held by a pair of pillars. Furthermore, the pillars 5d may be configured higher in the Z direction, and multiple flakes 4 may be inserted and held in one support portion 5b in the Z direction.

[0174] [Example of Processing Operation for Transferring Thin Pieces (4)] In the lift-out device 20, the processing operation for transferring thin pieces 4 determined to be non-defective to the carrier 5 is performed as follows: During this transfer, the thin pieces 4 are inserted into and held by the detacher 23 as shown in FIG. 17 with respect to the support portion 5b as shown in FIG. 16.

[0175] The lift-out device 20 moves the movable stage 24 using the controller 213 so that the carrier 5 is positioned at the center of the top-view SEM image. At this time, the lift-out device 20 controls the rotation stage 26 and the movable stage 24 while checking the side-view SEM image using the obliquely arranged electron beam column 22. In this way, the position of the desired support portion 5b of the carrier 5 is determined.

[0176] The lift-out device 20 moves the detacher 23 holding the lamina 4 to a position above the desired support 5b while checking a top-view SEM image using a vertically arranged electron beam column 21.

[0177] FIG. 17 shows the state in which the lamina 4 is inserted into the desired support portion 5b of the carrier 5 by the detacher 23 in the lift-out device 20 and relocated. The lift-out device 20 lowers the detacher 23 holding the lamina 4 from a position above the desired support portion 5b until the bottom surface of the lamina 4 contacts or approaches the substrate 5a. During this process, the lift-out device 20 adjusts the height of the detacher 23 and also performs fine posture control of the lamina 4 while checking a side-view SEM image using the obliquely positioned electron beam column 22. In this way, the target lamina 4 is inserted into the target support portion 5b, as shown in FIG. 17. Specifically, one end of the lamina 4 in the X direction is inserted and held between pillars 5d1 and 5d2, and the other end is inserted and held between pillars 5d3 and 5d4.

[0178] Observation of the flakes 4 in the TEM device 30 is performed on each flake 4 while multiple flakes 4 are mounted on the carrier 5. Therefore, in order to prevent the analysis portion 4b of the flake 4 from being blocked by the support portion 5b, the analysis portion 4b is exposed without overlapping with the pillars 5d of the support portion 5b in a plan view seen from the Y direction.

[0179] After completing the insertion of the lamina 4 as described above, the lift-out device 20 releases the grip of the detacher 23 and retracts the detacher 23. The lift-out device 20 repeats the same processing operation for other lamina 4 to be removed from the wafer 3 and transferred to the carrier 5. The number of lamina 4 that can be loaded on one carrier 5 is determined in advance as an allowable range. When the number of lamina 4 loaded on one carrier 5 reaches the allowable range and there are other subsequent lamina 4, the lift-out device 20 transfers the subsequent lamina 4 to the support portion 5b of the other carrier 5. The carrier 5 on which multiple lamina 4 have been transferred and loaded through the above processing operation and the original wafer 3 are removed from the sample chamber 207.

[0180] The removed carrier 5 is then transported from the lift-out device 20 to the TEM device 30 in the second transport step. The removed wafer 3 may be returned to the manufacturing line if necessary, or discarded if unnecessary. In the TEM device 30 in the third step, the carrier 5 is set, and TEM image observation is performed on the analysis portion 4b of each thin section 4 on the carrier 5.

[0181] 18 is an explanatory diagram showing a detailed example of the processing operation of thinning and relocation by the micro-sampling method by the first type FIB-SEM device 10 in the first step of the inspection processing sequence of the second type inspection system 1. First, as shown in (A), the first type FIB-SEM device 10 forms a thin section 4a in a state just before final finishing (in other words, a state where finishing processing is left) at the inspection target portion of the wafer 3 by FIB processing. The front surface 4s shown in the figure indicates the cross section to be observed.

[0182] Next, the first type FIB-SEM device 10 brings the needle 13 close to the lamina portion 4a that remains to be finished. The needle 13 corresponds to the tip of the probe unit 112 in FIG. 12. Next, the first type FIB-SEM device 10 performs a deposition process to bond the needle 13 to a part of the lamina portion 4a that remains to be finished. Next, the first type FIB-SEM device 10 cuts the lamina portion 4a from the wafer 3 by irradiating the connection portion 4c on the edge opposite to the bonding position with an FIB to perform an etching process.

[0183] Next, as shown in (B), the first type FIB-SEM device 10 moves the cut flake portion 4a held by the needle 13 to the position of the pillar 5p to be mounted, which is a predetermined position on the mesh 5m of the carrier 5 (LC) placed in a position separate from the wafer 3. This movement can be achieved by moving the stage. Next, the first type FIB-SEM device 10 moves the needle 13 to bring the flake portion 4a closer to the position of the pillar 5p on the mesh 5m.

[0184] Next, as shown in (C), the first type FIB-SEM device 10 performs deposition processing at the location where the pillar 5p and the flake portion 4a are connected, thereby bonding the pillar 5p and the flake portion 4a together. Next, the first type FIB-SEM device 10 irradiates the bonding position between the flake portion 4a and the needle 13 with an FIB to perform etching processing, thereby cutting the needle 13 and the flake portion 4a and separating the needle 13 from the flake portion 4a.

[0185] Through the above-described processing operation, the lamina 4 is transferred and mounted so as to be supported by the pillars 5p on the mesh 5m of the carrier 5. After performing the above-described processing operation a designated number of times for a designated number of lamina 4a, the first type FIB-SEM device 10 unloads the LCC 7 storing the LC, which is the carrier 5. Note that, although one lamina 4 is fixed to one pillar 5p in the example of FIG. 18, the pillars 5p may be configured to be higher, and multiple lamina 4 may be fixed to one pillar 5p.

[0186] In the automatic micro-sampling method described above, the flakes 4 are fixed to the pillars 5p by deposition processing or the like. The FIB-SEM device 10 can be controlled while monitoring the above-described processing operation using SEM images. The success rate of the above-described transfer processing operation varies depending on the individual FIB-SEM devices 10.

[0187] [Other Transfer Methods] Figure 19 is an explanatory diagram of another example of a method for transferring flakes 4 to a carrier 5, in which flakes 4 are mounted within the mesh 5m of the carrier 5. In Figure 19, an enlarged portion of the X-Y plane of the LC mesh 5m, which is the carrier 5, viewed from above is shown on the right. The mesh 5m, or in other words, the lattice, has multiple rectangular frames or recesses 5f as its constituent parts. During transfer, flakes 4 are placed within the recesses 5f of such mesh 5m. In the example of Figure 19, one flake 4 is placed within one recess 5f with the aforementioned front surface 4s facing upward.

[0188] [Cartridge of TEM Apparatus] Figure 20 is an explanatory diagram of a configuration example in which a cartridge 8 carrying a carrier 5 is set in the sample holder 303 of the electron beam column 31 in the TEM apparatus 30 (Figure 12). The carrier 5 carrying the flake 4 is set in the cartridge 8 as shown. The cartridge 8 is provided with, for example, a convex portion 8a. The tip of the sample holder 303 is provided with, for example, a concave portion 303a. The convex portion 8a of the cartridge 8 is inserted into the concave portion 303a at the tip of the sample holder 303, thereby fixing the cartridge 8. In this way, the TEM apparatus 30 holds the carrier 5 of the cartridge 8 by the sample holder 303. In this state, TEM imaging of the flake 4 on the carrier 5 is performed.

[0189] [Detection of Success / Failure of Transfer] In either the method shown in Figure 13 or the method shown in Figure 18, the success rate of the processing operation related to the transfer of the flake 4 by the FIB-SEM device 10 or the lift-out device 20 varies depending on the device's mechanical differences. As described above, the FIB-SEM device 10 or the lift-out device 20 can monitor the processing operation using images obtained by an SEM mechanism or an optical microscope, and therefore can determine and detect whether the transfer of the flake 4 was successful or unsuccessful. Alternatively, the success / failure of the transfer of the flake 4 may be determined and detected by other technical means.

[0190] Based on the above-described technology, the management system 2 of the first embodiment also grasps the success / failure of the processing operation of transferring the lamella 4 in the FIB-SEM device 10 and the lift-out device 20, and calculates the success rate of the processing operation including the transfer in each device. Then, the management system 2 uses the success rate to create a suitable plan (described later).

[0191] The technical means for detecting and understanding the success / failure of the relocation process operation in the inspection system 1 are not particularly limited, but examples include the following. For example, the FIB-SEM device 10 in FIG. 10 is capable of monitoring using SEM images, so the FIB-SEM device 10 may determine and detect the success / failure of the relocation from the contents of the SEM images. Similarly, the lift-out device 20 in FIG. 11 is capable of monitoring using SEM images, so the lift-out device 20 may determine and detect the success / failure of the relocation from the contents of the SEM images. For example, the probe unit 112 in FIG. 10 or the detacher 23 in FIG. 11 can grasp the lamina 4, etc., but if the lamina 4 grasped by them falls and becomes invisible in the SEM image, it can be determined to be a failure. Another technical means may be a sensor device that detects the falling or breakage of the lamina 4.

[0192] [Functional Blocks of Management System] Fig. 21 shows an example of the functional block configuration of the management system 2 in embodiment 1. The management system 2 has, as functional blocks, an inspection instruction receiving unit 401, an apparatus status management unit 402, a plan creation unit 403, an inspection processing execution management unit 404, an inspection processing result management unit 405, a maintenance management unit 406, a user interface unit 407, etc. Furthermore, as more detailed functional blocks, the inspection processing result management unit 405 has a success rate calculation unit 405A and an index value calculation unit 405B. Each unit is realized by program processing by the processor 1001, for example, based on the configuration as shown in Fig. 3.

[0193] Figure 21 also shows examples of data and information handled by each processing unit, corresponding to Figure 3. The inspection instruction receiving unit 401 reads and writes inspection instruction information 51, etc. The device status management unit 402 reads and writes device status information 52. The plan creation unit 403 reads and writes plan information 53. The inspection processing execution management unit 404 reads and writes inspection processing status information 54. The inspection processing status information 54 includes instruction information 54A and response information 54B. The inspection processing result management unit 405 reads and writes inspection processing performance information 55 (in other words, inspection processing execution record data). The inspection processing performance information 55 includes success rate information 55A and index value information 55B.

[0194] The inspection instruction receiving unit 401 receives inspection instructions and information on inspection target locations from the factory's manufacturing management system, and stores and manages them as inspection instruction information 51. The equipment status management unit 402 stores and manages the status of each device in the inspection system 1 of Fig. 1 as equipment status information 52. The equipment status management unit 402 also stores and manages the configuration of the inspection system 1 including multiple devices as shown in Fig. 2 in the equipment status information 52 and inspection process setting information 56. The configuration of the inspection system 1 includes the type and method of the inspection system 1 and the inspection process sequence, the type, number and model of the devices, and the configuration of users such as associated workers.

[0195] The plan creation unit 403 creates an inspection processing plan corresponding to the inspection instruction based on the inspection instruction information 51, device status information 52, inspection processing performance information 55, etc., and stores and manages it as plan information 53. The inspection processing execution management unit 404 manages the execution of the inspection processing according to the plan by the inspection system 1 and manages the status of each device during the execution of the inspection processing, and stores and manages information related to this as inspection processing status information 54. The instruction information 54A is information such as an instruction to each device to start processing. The response information 54B is information such as a response on the processing status from each device.

[0196] The inspection processing result management unit 405 stores and manages the execution results of the inspection processing according to the plan as inspection processing performance information 55. The inspection processing result management unit 405 may store all information, including communication information (such as instructions and responses) during the execution of the inspection processing sequence, as a log in the inspection processing performance information 55. The inspection processing result management unit 405 also has a function for analyzing performance related to the inspection processing. In particular, the success rate calculation unit 405A calculates the success rate of the processing operation of each device based on the performance information, and stores and manages it as success rate information 55A. In particular, the index value calculation unit 405B calculates index values ​​related to the processing capacity and processing time of each device based on the performance information, and stores and manages it as index value information 55B.

[0197] The maintenance management unit 406 manages the maintenance of each device in the inspection system 1, and in cooperation with the device status management unit 402, stores and manages the maintenance status and schedule of each device as part of the device status information 52. In addition, the maintenance management unit 406 formulates a maintenance plan for each device based on the success rate information 55A, etc., and stores and manages it as part of the device status information 52.

[0198] The user interface unit 407 displays various data and information handled by each processing unit along with the GUI on a screen provided to a user such as an inspection manager or an operator. The screen is, for example, the display screen of the output device 1006 in Fig. 3. The screen may be provided in the form of a web page, for example.

[0199] In this example, the inspection processing result management unit 405 is configured to calculate the index values, etc. However, the present invention is not limited to this, and the plan creation unit 403 may be configured to calculate the index values, etc.

[0200] [Processing Flow of Management System] Fig. 22 shows the main processing flow of the management system 2 of Fig. 21, and includes steps S201 to S214. This flow shows an example of detailed processing related to the creation of a plan, etc.

[0201] In step S201, an inspection instruction, information on the inspection target area, etc., are issued from the factory's manufacturing management system. Wafers 3, which are samples to be inspected, are transported from the manufacturing line to the inspection system 1. The inspection instruction receiving unit 401 of the management system 2 receives the inspection instruction, information on the inspection target area, manufacturing process information, etc. from the manufacturing management system, recognizes that the inspection system 1 has received the wafers 3 by transport from the manufacturing line, and stores this information as inspection instruction information 51. From the inspection instruction, the management system 2 determines the number of target wafers 3 and lamellas 4, etc., and determines the scale of the required inspection process, such as the number of devices required for each step of the inspection system 1. The inspection instruction receiving unit 401 may also use the user interface unit 407 to display the contents of the inspection instruction, etc., on a screen for the user.

[0202] In step S202, the device status management unit 402 of the management system 2 checks the status of each device in the inspection system 1. The device status management unit 402 checks, for example, the schedule table (see FIG. 23 described below) of the device status information 52 to ascertain available time and usage time. The device status management unit 402 communicates with each device in the inspection system 1 to obtain the latest status of each device. The device status management unit 402 may also use the user interface unit 407 to display the device status on a screen for the user.

[0203] In step S203, the plan creation unit 403 of the management system 2 starts creating a plan for the inspection process corresponding to the new inspection instruction based on the inspection instruction information 51, the equipment status information 52, the inspection process performance information 55, etc. To this end, first, in step S203, the plan creation unit 403 selects a recipe for the processing operation of each equipment in each step of the inspection system 1 that is required to realize the requested inspection process. Candidate equipment is equipment that has the function to perform the requested processing. This recipe is selected, for example, from a predefined standard recipe. The recipe is information for controlling the processing operation of the equipment. For example, a recipe for the FIB-SEM equipment 10 includes information such as conditions for controlling the irradiation of a charged particle beam as a recipe according to the function. The plan creation unit 403 may adjust parameter values ​​of the recipe.

[0204] In step S204, the plan creation unit 403 of the management system 2 calculates the apparatus usage time for each apparatus required to perform the processing operations required for each apparatus in each step of the inspection system 1 based on the recipe, etc. This apparatus usage time is an estimated time. The plan creation unit 403 estimates the apparatus usage time corresponding to the assumption that the apparatus performs the processing operations according to the selected recipe. The plan creation unit 403 may estimate the apparatus usage time by referencing the inspection processing performance information 55 and the time required for past inspection processing at that apparatus. If the apparatus usage time falls within the available time of the apparatus, in other words, if there is continuous available time equal to or greater than the apparatus usage time, that apparatus becomes a candidate for processing allocation in the plan.

[0205] In step S205, the plan creation unit 403 of the management system 2 calculates a predicted success rate for the processing operation of each apparatus based on the inspection processing performance information 55. The plan creation unit 403 calculates the predicted success rate, particularly using the success rate information 55A. The predicted success rate is a predicted success rate for the processing operation of each apparatus, assuming that the apparatus executes the selected recipe. The plan creation unit 403 calculates the predicted success rate based on the already calculated success rate ("actual success rate") in the success rate information 55A. In a simpler processing example, the actual success rate may be used directly as the predicted success rate.

[0206] In step S206, the plan creation unit 403 of the management system 2 selects devices and times for each step as candidates for allocation to the inspection process sequence plan based on the information obtained up to step S205. At this time, among devices with available time in each step, if the device usage time falls within the available time, the device and its device usage time become candidates for allocation.

[0207] In step S207, the plan creation unit 403 of the management system 2 creates one or more proposed plans using the device and time candidates from step S206 in accordance with the set policy. The policy may, for example, prioritize a plan with a high success rate. For example, if there are multiple candidate devices for a certain step, the plan creation unit 403 preferentially selects a device with a high predicted success rate, taking into account the predicted success rate from step S205. If the plan creation unit 403 can create multiple proposed plans, it ranks the plans based on the policy.

[0208] In step S208, the plan creation unit 403 of the management system 2 uses the user interface unit 407 to display the contents of one or more proposed plans created in step S207 on a screen for the user. The user can check the contents of the plans on the screen and decide on one plan. If there are multiple proposed plans, the user can select one from them. However, this is not limited to this, and the management system 2 can also automatically decide on one plan based on a predetermined policy, in which case step S208 can be omitted. The plan creation unit 403 saves the decided plan in the plan information 53.

[0209] In step S209, when the date and time for executing a certain plan arrives and the user inputs an execution start instruction based on the plan information 53, the inspection process execution management unit 404 of the management system 2 causes the inspection system 1 to execute the inspection process sequence in accordance with the plan. To this end, the inspection process execution management unit 404 sequentially transmits a processing start instruction, etc. to each device of the inspection system 1 on the date and time according to the plan. Each device starts its own processing operation in accordance with the processing start instruction, etc.

[0210] In step S210, the inspection process execution management unit 404 of the management system 2 sequentially receives responses, such as processing status and processing results, from each device in the inspection system 1. Each device transmits its own processing status, processing results, and the like to the management system 2 as a response. This allows the inspection process execution management unit 404 to grasp the progress of the inspection process sequence. Furthermore, the inspection process execution management unit 404 uses the user interface unit 407 to display the progress of the inspection process sequence on the screen for the user. The user can check the progress of the inspection process sequence on the screen.

[0211] In step S211, the inspection processing result management unit 405 of the management system 2, in cooperation with the inspection processing execution management unit 404, grasps the execution results of the inspection processing in steps S209 and S210 and saves them as inspection processing performance information 55. The inspection processing performance information 55 includes information such as the number of items processed, the time required for processing, and the success or failure of the processing for each device in each step. Furthermore, the inspection processing result management unit 405 uses the user interface unit 407 to display the execution results of the inspection processing on the screen for the user. The user can check the execution results of the inspection processing on the screen.

[0212] In step S212, the inspection processing result management unit 405 of the management system 2 calculates the success rate for the processing operation of each device in each step regarding the results of the current inspection processing using the success rate calculation unit 405A based on the inspection processing performance information 55, and updates the success rate information 55A. In addition, the inspection processing result management unit 405 may use the user interface unit 407 to display the success rate of each device on a screen for the user. The user can check the success rate of each device on the screen.

[0213] In step S213, the inspection processing result management unit 405 of the management system 2 calculates, based on the inspection processing performance information 55, index values ​​for the processing time and processing capacity (e.g., throughput) for the processing operation of each device in each step regarding the results of the current inspection processing using the index value calculation unit 405B, and updates the index value information 55B. At least one of an index value for processing time and an index value for processing capacity is calculated as this index value. Furthermore, the inspection processing result management unit 405 may use the user interface unit 407 to display the index values ​​for each device on a screen for the user. The user can check the index values ​​for each device on the screen.

[0214] In step S213, the maintenance management unit 406 of the management system 2 may further develop a maintenance plan for the devices of the inspection system 1 based on the inspection processing performance information 55. For example, if there is a device with a declining success rate, a declining processing capacity, or an increasing processing time, that device becomes a candidate for maintenance. The maintenance management unit 406 sets a scheduled maintenance time within the available time of the device that is a candidate for maintenance based on the device status information 52. The maintenance management unit 406 also uses the user interface unit 407 to display the developed maintenance plan on the screen for the user. The user can check the candidate devices for maintenance and the developed maintenance plan on the screen, and can also manually set the maintenance plan.

[0215] Below, specific examples of each process and function will be described along with the overall process flow and order of the management system 2 and the inspection system 1.

[0216] [Inspection Instruction Information] In step S201, the inspection instruction receiving unit 401 determines the inspection target and the contents of the inspection process to be performed based on the inspection instruction information. The inspection instruction information transmitted from the factory's manufacturing management system to the management system 2 includes, for example, the following information. This inspection instruction information includes information such as Lot ID, FOUP ID, cassette slot position (or Wafer ID), inspection position, and inspection type. Lot ID is identification information for the lot of the wafer 3, which is the sample to be inspected. FOUP ID is identification information for the FOUP, which is the container in which the wafer 3 is stored. Cassette slot position is information representing the position of the slot in the FOUP in which the wafer 3 is stored. Wafer ID is identification information for the wafer 3, which is the sample to be inspected. The inspection position is the position to be inspected on the wafer 3, and is, for example, a two-dimensional coordinate. The inspection position corresponds to the position where the slice 4 is created. The inspection type includes information that specifies the type of observation, such as cross-sectional observation or planar observation, the size of the thin section 4, the direction in which the thin section 4 is made, and the like.

[0217] [ID Management] The ID and position of each object handled by this system, such as the wafer 3, lamina 4, carrier 5, and holder 6, are managed individually. The management system 2 keeps track of the ID and position of each individual object. The wafer 3 and lamina 4 may be assigned an ID as information, or the ID may be formed by processing. The ID may be read by image processing, a code reader, or the like. The management system 2 keeps track of and manages information including the ID, such as the position of the holder 6, carrier 5, etc., in which each wafer 3 or lamina 4 is mounted, and the device in which step it is currently located. The management system 2 also keeps track of and manages information such as which device will perform which process for each wafer 3 or lamina 4, as well as the recipe and conditions for that process. The above-mentioned ID and other information are also reflected in the plan information. For example, the plan determines information such as which FIB-SEM device 10 will form the flake 4 at which position on which wafer 3 in the first step, which position on which carrier 5 the formed flake 4 will be moved to, and which lift-out device 20 the carrier 5 will be transported to in the second step.

[0218] Each device in each step may perform a processing operation to read the ID of the target object transported to the device itself. For example, the FIB-SEM device 10 in the first step may read the ID of the transported FOUP and wafer 3 and transmit the information to the management system 2. The lift-out device 20 in the second step may read the ID of the transported carrier 5 and lamella 4 and transmit the information to the management system 2. Each device may determine a processing operation for the object indicated by the ID based on the read ID.

[0219] [Device Status Management] Based on inspection instructions and the like, the management system 2 grasps the device status, such as free time and usage time, from each device in each step of the inspection system 1 through communication. In step S202, the device status management unit 402 grasps the status of each device in the inspection system 1. The device status management unit 402 checks the schedule for all devices in the inspection system 1 (e.g., FIG. 2) under the management of the management system 2. In other words, this schedule is the device status including the current status and future plans. For example, the device status management unit 402 writes and manages the schedule for each of the multiple devices in the inspection system 1 connected via communication in a schedule table. The device status management unit 402 checks the schedule by referring to device status information 52, including the schedule table stored in memory. From the schedule, the device status management unit 402 grasps the free time and usage time of each device.

[0220] [Schedule] FIG. 23 shows an example of the configuration of a schedule 52A as part of the equipment status information 52. The data structure of this schedule 52A is not particularly limited. The schedule 52A in FIG. 23 represents a schedule with each device of the inspection system 1 listed on the vertical axis and the time axis on the horizontal axis. This example shows a case where there are three FIB-SEM devices 10, three lift-out devices 20, and three TEM devices 30 in the first type inspection system 1. For example, there are three FIB-SEM devices 10, designated FIB1, FIB2, and FIB3. "FIB1" and the like are examples of device identification information. For example, the time axis only shows the portion from 8:00 to 1:00 PM on May 15, 2022, but other dates and times are similarly included.

[0221] In this schedule table 52A, the status or state of each device and for each time period is recorded and managed as information. The state of each device and for each time period can be broadly categorized into an available state and a used state. White blocks in the drawing indicate available states. The used state can be further divided into various states, such as an "in use for inspection processing" state (shown by blocks with a dotted pattern), an "inspection processing scheduled" state (shown by blocks with a diagonal line pattern), an "adjustment" state (shown by blocks with a horizontal line pattern), a "maintenance" state (shown by blocks with a grid pattern), and an "individual device in use" state (shown by blocks with a vertical line pattern).

[0222] The "inspection process in use" state indicates that the inspection process according to a certain plan (for example, plan X) has already started. In this example, the inspection process of plan X uses three devices: FIB1, LIFTOUT1, and TEM1. The "inspection process in use" time is fixed and cannot basically be changed.

[0223] The "Inspection Processing Scheduled" status indicates that an inspection processing according to a certain plan (for example, Plan Y) is scheduled but has not yet started. In this example, the inspection processing of Plan Y uses three devices, namely, FIB2, LIFTOUT2, and TEM2. Since the "Inspection Processing Scheduled" time has not yet started, it is also possible to change the plan.

[0224] The "adjustment" state corresponds to, for example, the necessary settings and adjustments (e.g., optical adjustments) that are performed before the device's main processing load. Adjustments include pre-adjustment work, such as daily adjustments, and hardware and software adjustments, such as adjusting and setting optical conditions and imaging conditions. If the settings and adjustments are defined as processing by the device, the "adjustment" time may be integrated into the "scheduled inspection processing" time. If the settings and adjustments are defined as maintenance, the "adjustment" time may be integrated into the "maintenance" time. In this example, the "adjustment" time is scheduled before the processing operation time for Plan X (9:00 to 10:00) on the LIFTOUT1 device.

[0225] The "maintenance" state corresponds to maintenance work on the equipment. Maintenance corresponds to maintenance work such as periodic inspection, unexpected inspection, part replacement, and preventive maintenance. In this example, "maintenance" time is scheduled for the FIB3 equipment after 10:00.

[0226] Furthermore, the "individual device use" state indicates that the device is scheduled to be used individually for a specific purpose. Individual device use applies when an individual device is to be used on a specific date and time. This use also includes use for purposes other than inspection processing. In this example, the "individual device use" time is set for the TEM3 device after 11:00. Devices and times in the "individual device use" state are not considered when creating an inspection processing plan.

[0227] The device status management unit 402 manages a schedule table 52A such as that shown in Fig. 23 as a schedule management function, and constantly keeps track of the status and schedule of each device in the inspection system 1. This allows the plan creation unit 403 to create an appropriate plan depending on the available time and usage time of each device for multiple devices in the inspection system 1. The management system 2 may also provide the user with a screen that displays the schedule table 52A such as that shown in Fig. 23.

[0228] [Plan Creation (1)] Based on the device status information 52 and the like, the management system 2 selects a device and time to allocate each process from among the multiple devices in the inspection system 1 to plan a new inspection process, and creates a plan based on that selection. At this time, the management system 2 calculates the device usage time when the process is executed by the device based on the inspection process performance information 55 and the like, and if the device usage time falls within the device's available time, that device and device usage time become candidates for allocation. If there are multiple candidates, the candidates are selected by ranking them according to a predetermined policy. This plan is information that defines how the multiple devices in the inspection system 1 are used on a time axis, and is a concept that includes the schedule and workload of the inspection process sequence.

[0229] 24 shows an example of a plan created by the plan creation unit 403 of the management system 2 when the inspection system 1 includes multiple units of each device (e.g., three units of each device). The inspection system 1 includes, for example, three FIB-SEM devices 10, FIB1, FIB2, and FIB3, three lift-out devices 20, LIFTOUT1, LIFTOUT2, and LIFTOUT3, and three TEM devices 30, TEM1, TEM2, and TEM3. The management system 2 communicates appropriately with each device in the inspection system 1. For example, the management system 2 sends a request 2401 to each device to obtain the device status. In response to the request 2401, each device sends a response 2402 indicating the device status to the management system 2.

[0230] The example in Figure 24 shows the device status of the inspection system 1 at a certain date and time. The squares in the blocks of each device indicate the resources and status of that device. For example, a FIB-SEM device 10 called FIB1 is in the "in use for inspection processing" state for a certain plan X. In this example, three devices called FIB1, LIFTOUT1, and TEM1 (for example, the first set) are assigned to the inspection processing sequence of plan X and are in the "in use for inspection processing" state. In addition, three devices called FIB2, LIFTOUT2, and TEM2 (for example, the second set) and three devices called FIB3, LIFTOUT3, and TEM3 (for example, the third set) are in the "free" state.

[0231] For example, in the case of such an equipment situation, the management system 2, upon receiving a new inspection instruction, creates a plan (e.g., Plan Y) for a new inspection processing sequence. For example, since the devices in the second and third sets are in an "available" state, the plan creation unit 403 selects devices and times to be assigned to the inspection processing sequence of Plan Y, using the available times of these devices as candidates. In this example, it is assumed that both the devices in the second and third sets have similar processing capabilities. For example, if the device usage time of the device in the second set falls within the available time, the plan creation unit 403 selects the device and device usage time of the second set as a candidate. In this situation, if the second set is selected, for example, in Plan Y, the devices and times for FIB2, LIFTOUT2, and TEM2 are assigned their respective share of processing, and the state is set to "scheduled inspection processing," as shown in the lower part of FIG. 24 .

[0232] The above example shows the concept of allocating one inspection process sequence to three types of devices within a relatively short period of time (for example, one day or one hour), but similarly, there may be availability or availability over a relatively long period of time on the time axis, and it is possible to allocate one or more inspection process sequences using the available time. For example, if none of the devices have available time during a certain time period, allocation during that time period cannot be selected, but if there is available time during the next time period, allocation can be selected using the available time during that time period.

[0233] In addition, although the above example shows the case where three devices of three types within the same set are used in series, this is not limiting and any available device may be used regardless of the set. For example, if all the devices in Figure 24 are available, another plan would be to select three devices such as FIB1, LIFTOUT2, and TEM3.

[0234] [Plan Creation (2)] Fig. 25 shows an example in which the management system 2 creates a plan using the success rate and index value of each device. In Fig. 25, there are multiple devices, as in Fig. 24. When there are differences in success rate, processing time, or processing capacity between the devices in each step of the inspection system 1, the plan creation unit 403 of the management system 2 selects the devices and time to allocate to the plan based on the set policy, success rate, and index value.

[0235] For the sake of explanation, the success rate is defined as SR, the index value of the processing time is defined as PT, and the index value of the processing capacity (for example, throughput) is defined as PC. The success rate SR corresponds to the predicted success rate described above.

[0236] 25, the success rate SR and index values ​​PT and PC are illustrated for each device block. For example, an FIB-SEM device 10 called FIB1 has a success rate SR11 and a processing capacity index value PC11 based on past inspection processing results.

[0237] For example, if the policy for creating the plan prioritizes the success rate, the plan creation unit 403 prioritizes the device with the highest success rate SR from among multiple candidate devices for each step. For example, for the FIB-SEM device 10 in the first step, if three devices, FIB1, FIB2, and FIB3, are available during the same time period, the plan creation unit 403 selects the device with the highest success rate SR from among the three devices. For example, if the success rates SR are SR11 > SR12 > SR13, the first candidate c1 is selected as FIB1, the second candidate c2 is selected as FIB2, and the third candidate c3 is selected as FIB3. Similarly, based on the success rate SR, for example, if LIFTOUT2 has the highest success rate SR22, LIFTOUT2 is selected as the first candidate from the lift-out devices 20 in the second step. From the TEM devices 30 in the third step, for example, if the success rate SR33 of TEM3 is the highest, TEM3 is selected as the first candidate. The first candidate is indicated by a dashed frame.

[0238] As a result, as shown in the lower part of FIG. 25, a plan using three machines, FIB1, LIFTOUT2, and TEM3, is created as the first plan (Plan A1) with the highest priority on success rate.

[0239] Furthermore, if the policy for creating the plan is, for example, to prioritize processing capacity, the plan creation unit 403 prioritizes the device with the highest processing capacity index value PC from among multiple candidate devices for each step. For example, for the FIB-SEM device 10 in the first step, if three devices, FIB1, FIB2, and FIB3, are available during the same time period, the plan creation unit 403 selects the device with the highest index value PC from among them. For example, if the index values ​​PC are PC11 < PC12 < PC13, the first candidate c1 is selected as FIB3, the second candidate c2 is selected as FIB2, and the third candidate c3 is selected as FIB1. Similarly, based on the index value PC, for example, if LIFTOUT2 has the highest index value PC22, LIFTOUT2 is selected as the first candidate from the lift-out devices 20 in the second step. For example, if the index value PC33 of TEM1 is the highest among the TEM devices 30 in the third step, TEM1 is selected as the first candidate. The first candidate is indicated by a dotted line frame.

[0240] As a result, as shown in the lower part of FIG. 25, a plan using three machines, FIB3, LIFTOUT2, and TEM1, is created as the first plan (Plan B1) with the highest priority on processing capacity.

[0241] As described above, the management system 2 can create a plan according to a priority policy. The priority policy may be determined in advance in the system design, or may be specified by the user on the screen. Plans can also be created that select second and subsequent candidates in addition to the first candidate.

[0242] When the policy prioritizes success rate, the goal is to maximize the success rate of processing operations, including relocation of equipment, minimize failures, and minimize recovery processing in the event of a failure. Furthermore, fewer recovery processes may result in higher throughput of the inspection process. When the policy prioritizes processing capacity, the goal is to increase the throughput of the inspection process sequence. The same can be achieved by using a processing time index value PT instead of the processing capacity index value PC. When creating a plan with processing time priority, the goal is to shorten the processing time of the inspection process sequence.

[0243] Furthermore, in a modified example, it is possible to combine the above-mentioned policies and create a plan by selecting candidates according to different policies for each step of the inspection process sequence. For example, it is possible to select a candidate for the first step device by prioritizing the success rate, and to select a candidate for the second step device by prioritizing the processing capacity.

[0244] [Plan Creation (3)] The management system 2 may create and propose multiple plans as proposals for a given inspection process sequence, rather than just one plan. In this case, the management system 2 creates multiple plan proposals based on a policy specified in the settings. The management system 2 presents the multiple plan proposals on the screen, ranked according to the policy, and the user can review the multiple plan proposals on the screen and select and decide on one plan.

[0245] Furthermore, depending on the device status of the inspection system 1, there are cases where a plan cannot be created, cases where one plan can be created, and cases where multiple plan proposals can be created. For example, if there is a lot of free time or equipment, multiple plan proposals can be created. Furthermore, if there is no free time or equipment until a certain date and time, a plan using the equipment or time up to that date and time cannot be created, but a plan can be created after that date and time.

[0246] In addition, when multiple plan proposals can be created, the management system 2 may automatically select one proposal based on predetermined policies or rules and decide on one plan, rather than having the user decide on one plan.

[0247] FIG. 26 shows an example of a screen displayed by the management system 2 for a user regarding plan creation. The screen in FIG. 26 particularly shows an example of displaying multiple plan proposals created by the management system 2. The screen in FIG. 26 includes a column 2601 for setting and displaying a plan creation policy and a column 2602 for displaying the results of automatic plan creation. In column 2601, for example, a success rate priority policy is set as the plan creation policy. In column 2602, one or more plan proposals automatically created by the plan creation unit 403 based on the plan creation policy are displayed. In this example, three plans, namely, plans A1, A2, and A3, are presented as the results of automatic creation. In column 2602, the multiple plans are displayed in order of rank, with ranking numbers (e.g., 1, 2, and 3) assigned. In column 2602, information such as the device to be used and the time are also displayed for each plan. The time information includes, for example, the scheduled start time and scheduled end time for the processing operation of each device. In addition, column 2602 may display information on the predicted success rate for each device. For example, Plan A1 is also shown in Figure 25, and is a plan in which a device with the highest possible prediction success rate was selected at each step. Note that the success rates shown are values ​​for convenience of explanation to show that there are differences between devices.

[0248] In the default display, plan A1 selected by the management system 2 is displayed in the selected state (the button is on) as the highest-ranked recommended plan in column 2602. The user can review the proposed plans on this screen and select and decide on one to apply. For example, the user can select a proposed plan by operating the cursor on the screen and the button for each proposed plan. This screen also allows the user to display and check details for each proposed plan and for each device in accordance with a specified operation. For example, the user can select a device block and check the recipe, schedule, and other detailed information about the processing in that device.

[0249] The user may select the automatically created plan as is, or may change to another plan by manually editing the contents of the plan on this screen. The user may also change the policy settings in field 2601 and have the management system 2 automatically create a plan again.

[0250] In the example plan of FIG. 26, for the sake of simplicity, a case is shown in which the three FIB-SEM devices 10 have the same device usage time, but this is not limited to this. In reality, the free time and device usage time may differ depending on the individual device. Correspondingly, the overall processing time and end time of the inspection processing sequence in the plan may differ. When the processing time is prioritized, it is possible to create a plan that minimizes the overall processing time of the inspection processing sequence, or a plan that minimizes the overall end time. When the processing capacity is prioritized, it is possible to create a plan that maximizes the processing volume within the overall processing time of the inspection processing sequence.

[0251] The management system 2 determines one plan selected and determined from the multiple plan proposals on the above screen as the plan to be actually used, and saves the contents of that plan as plan information 53. The management system 2 prepares to start execution of the inspection process according to that plan. Note that, when the plan is created, the management system 2 may notify a user, such as an inspection manager, that the plan has been created by email or the like. The notified user can access the above screen to check the plan, etc.

[0252] [Plan Creation (4)] FIG. 27 is similar to FIG. 26 , but shows an example of a display of automatically created plans on the plan creation screen when the plan creation policy prioritizes processing capacity (e.g., throughput). Column 2601 displays a processing capacity priority policy. Column 2602 displays three plans, B1, B2, and B3, automatically created under that policy, ranked by priority. Column 2602 may also display information on the processing capacity (e.g., throughput) index value PC for each device. For example, plan B1 is the same as shown in FIG. 25 , and the device with the highest index value PC at each step was selected. Note that the index values ​​shown are numerical values ​​for convenience of explanation to indicate differences between devices.

[0253] The plan creation unit 402 of the management system 2 calculates allocation of processes to devices and time periods using at least one of the policies for creating a plan. The policy to be used may be predetermined as a design item of the management system 2, or may be variable by user setting as in the above example.

[0254] Even after the management system 2 creates and decides on a plan, the user can check the contents and schedule of the plan on the screen as needed.

[0255] [Start of execution of inspection process] After creating and deciding on the plan, the inspection process execution management unit 404 of the management system 2 causes the inspection system 1 to start executing the inspection process sequence in accordance with the plan, based on the scheduled date and time in the plan and the user's instruction to start execution of the inspection process. Based on the plan, the management system 2 transmits and outputs instructions, etc. to each device in the inspection system 1 via communication, and each device receives and inputs the instructions, etc. As a result, the inspection process sequence in accordance with the plan is executed in the inspection system 1. Each device transmits and outputs the status and results of its own processing to the management system 2 via communication, and the management system 2 receives and inputs the status and results from each device. As a result, the management system 2 grasps and manages the status and results of the execution of the inspection process sequence in the inspection system 1.

[0256] FIG. 28 shows an example of an inspection process sequence execution start screen provided to the user by the management system 2. This screen displays information about the determined plan (e.g., plan A1, indicated by a check mark). The inspection process sequence of plan A1 is composed of processes performed at each time by each of the devices, e.g., FIB1, LIFTOUT1, and TEM1. On this screen, the user can press the "Start Execution" button to start execution of the inspection process sequence according to the plan. After execution has started, the user can also press the "Stop" button, in which case the execution of the inspection process sequence according to the plan can be temporarily suspended. Furthermore, if there are multiple plans for multiple inspection process sequences, execution start instructions can be issued for each plan in a similar manner.

[0257] The screen is not limited to the example shown in Fig. 28, and the plan information may be displayed in the form of a schedule table 52A shown in Fig. 23, for example, and an instruction to start execution from the user may be accepted. In a modified example, the input of the start of execution on the above screen may be omitted, and the management system 2 may automatically start execution of the inspection process sequence when the scheduled date and time in the plan arrives.

[0258] [Instruction to Start Inspection Processing] Based on the input of the plan and execution start instruction, the inspection processing execution management unit 404 of the management system 2 starts execution of the inspection processing sequence according to the plan. To do this, the inspection processing execution management unit 404 transmits a start instruction or the like via communication to the relevant device of the inspection system 1, for example, the FIB-SEM device 10 of the first step, to start the processing operation in that device. The start instruction corresponds to a command or the like. Each device starts executing its own processing in accordance with the received start instruction or the like. Each device appropriately transmits the status of the processing operation, the results of the processing operation, and the like as a response to the management system 2. Based on the responses from each device, the management system 2 grasps the status and results of the processing operation of each device and stores them in the device status information 52.

[0259] In addition, each device in the inspection system 1 may be equipped with a controller for controlling the processing operation of the device itself, as well as a processing unit for performing management communications with the management system 2 and management processing.

[0260] The management system 2 may also transmit control information for the processing operation of each device in the inspection system 1. For example, the management system 2 may transmit recipe information for thinning processing to the FIB-SEM device 10 in the first step. Each device may control its own processing operation in accordance with the control information from the management system 2.

[0261] Furthermore, the following methods can be applied as control when the management system 2 causes each device of the inspection system 1 to execute an inspection process. The method (also referred to as a mode) to be applied may be selectable and set by the user on the screen. For example, as shown at the bottom of the example screen in FIG. 28 , a field 2801 may be provided in which the execution method can be set. The same method may be set regardless of the plan, or a method may be set for each plan. For example, when the user specifies this method on the screen, the management system 2 switches the control mode to the mode of the specified method.

[0262] [Start instruction method] Fig. 29 is an explanatory diagram of one method, the start instruction method. In this method, the management system 2 sends a start instruction for the processing operation of the inspection processing sequence according to the plan to each device in the inspection system 1. Each device starts its own processing operation in accordance with the start instruction. If each device is unable to start its own processing operation in response to the start instruction, it sends a response to that effect to the management system 2.

[0263] When the first control mode corresponding to this start instruction method is on, the management system 2 sends a start instruction 2901 to each device at the scheduled start time of the inspection process on the plan. The example of Figure 29 shows a case where the inspection process sequence of a certain plan X is executed by FIB1, LIFTOUT1, and TEM1 as the first set of devices. The flow of each process of each device in plan X is illustrated on the time axis at the bottom.

[0264] According to the schedule of Plan X, first, the first process using FIB1 in the first step starts at time t1 and ends at time t2. The time from time t2 to time t3 is the time for the first transfer step. Next, the second process using LIFTOUT1 in the second step starts at time t3 and ends at time t4. The time from time t4 to time t5 is the time for the second transfer step. Next, the third process using TEM1 in the third step starts at time t5 and ends at time t6.

[0265] At the start of the inspection process sequence according to the above-mentioned Plan X (time t1), the management system 2 first transmits a start instruction 2901 to the FIB1. Upon receiving the start instruction 2901, the FIB1 starts the first process. The FIB1 transmits a response indicating the status to the management system 2 as appropriate. Upon completion of the first process, the FIB1 transmits an end response 2902 indicating the end of the first process to the management system 2. The management system 2 recognizes the end of the first process based on the end response 2902.

[0266] Next, the management system 2 sends a start instruction 2901 to LIFTOUT1 at time t3, which corresponds to after the first transport step. LIFTOUT1, which has received the start instruction 2901, starts the second process. When the second process is completed, LIFTOUT1 sends an end response 2902 indicating the end of the second process to the management system 2. The management system 2 recognizes the end of the second process based on the end response 2902.

[0267] Next, at time t5, which corresponds to after the second transport step, management system 2 transmits a start instruction 2901 to TEM 1. TEM 1, which has received the start instruction 2901, initiates the third process. When the third process is completed, TEM 1 transmits an end response 2902 indicating the end of the third process to management system 2. Based on the end response 2902, management system 2 recognizes the end of the third process.

[0268] The above example is for a fully automated system, which will be described later. It is assumed that each transport step is completed normally within a standard time based on the automated transport system.

[0269] [Plan Determination Method] Figure 30 is an explanatory diagram of another method, the plan determination method. In this method, the management system 2 transmits plan information to each device in the inspection system 1 instead of a start instruction. Each device that receives the plan information determines whether to start its own processing operation and starts the processing operation based on the determination result. When the second control mode corresponding to this method is enabled, the management system 2 transmits plan information 3001 to each device at the scheduled start time of the inspection process in the plan. The transmitted plan information 3001 includes at least the scheduled start time and scheduled end time of the process scheduled for that device. The timing of transmitting the plan information 3001 is not limited to immediately before the start of the process, as in the first control mode, but may be any time before the scheduled start time, such as when the plan is finalized. On the time axis shown at the bottom of Figure 30, for example, each device makes a start determination at time points t1, t3, and t5, which are the scheduled start times of each process.

[0270] Each device (e.g., controller 10C in FIG. 1 ) that receives plan information 3001 determines the process specified by that device and the start time of that process based on the plan information 3001. Each device determines whether it can start the specified process at the specified start time, taking into account its own status. If it determines that it can start, it may send a response to the management system 2 indicating that it can start. If it determines that it can start, it starts executing the specified process at the specified start time. Thereafter, each device appropriately sends the status and results of its own process as a response 3002 to the management system 2. The management system determines the status and results of the processing operation of each device based on the response 3002 from each device.

[0271] Furthermore, if each device determines that it cannot start, it may send a response indicating that it cannot start to the management system 2. Examples of situations in which it cannot start include a hardware error in the device or a delay in transport from the device of the previous step. When the management system 2 receives a response 3002 indicating that it cannot start from the device, it may pause the inspection processing sequence to wait or extend the start of processing at that device. Depending on the delay in the start of processing at that device, the management system 2 may modify the plan to extend the processing of subsequent steps in the inspection processing sequence. The management system 2 may notify the user of the situation in which it cannot start processing at the device. When the management system 2 identifies the cause of the delay in the start of processing at the device (e.g., an error or transport delay), it may notify the user of the cause and information for dealing with the delay.

[0272] [Execution method of inspection process sequence] In the first embodiment, the inspection process sequence of the inspection system 1 can basically be executed in a fully automatic manner, and the management system 2 has a function of creating a plan corresponding to the fully automatic execution method and managing the execution. In the fully automatic execution method, the work by the operator can be minimized for the processing operation of each device in each step of the inspection system 1. Furthermore, when an automatic transfer system is available, the work by the operator can also be minimized for the transfer steps between devices.

[0273] In the first embodiment, the management system 2 automatically manages the execution of the inspection process sequence, and there is no need for the user to manually manage the execution. In other words, there is no need for the user to manually issue instructions to each device to start a processing operation. However, in some cases, it is conceivable that a user such as an inspection manager may wish to manually manage the execution of the inspection process sequence. Therefore, the management system 2 also provides functions and a user interface for the user to manually manage the execution of the inspection process sequence.

[0274] In the first embodiment, the management system 2 can execute and manage the inspection process sequence of the inspection system 1 based on a plan using a fully automatic execution method and a manual execution method. The fully automatic execution method automates the processing operations in the inspection process sequence, including the transport step described above, and can achieve complete labor savings.

[0275] After creating a plan based on the fully automatic execution method, the management system 2 displays the plan information on the screen and accepts manual operations so that the user can confirm the plan information and change part of the inspection process in the plan. For example, the management system 2 enables plan adjustments such as changing the size of the thinning process performed by the FIB-SEM device 10 in the first step from 10 microns to 12 microns. The management system 2 updates the contents of the plan information in response to the change.

[0276] On the other hand, the manual execution method involves a user, such as an inspection manager or an operator, manually performing some of the processing operations in the inspection processing sequence. For example, in the aforementioned transport step, an operator may transport a FOUP or carrier 5 or set the FOUP or carrier 5 in the equipment. For example, in the case of the first type of inspection system 1 shown in FIG. 6 , in the first transport step, the operator transports the FOUP, which is the holder 6, from the FIB-SEM equipment 10 to the lift-out equipment 20, sets the FOUP in the lift-out equipment 20, and presses a processing operation start button in the lift-out equipment 20. In the second transport step, the operator transports the LCC 7 containing the carrier 5 from the lift-out equipment 20 to the TEM equipment 30, transfers the carrier 5 to the cartridge 8, sets it in the TEM equipment 30, and presses a processing operation start button in the TEM equipment 30. After the processing operation start button is pressed in each equipment, the automatic processing operation in each equipment is performed and then enters a waiting state until it is completed.

[0277] In the case of a manual execution method, the management system 2 has the function of creating a plan corresponding to that method and managing the execution. In this case, for the part where work is performed by a worker, the management system 2 estimates the time required for the work and the processing capacity, assuming that the standard work is performed normally, and creates a plan that reflects the estimate.

[0278] In addition, for example, a user may want to manually start processing by an apparatus in a certain step, or to perform transport work in a transport step, at a timing determined by the user. The management system 2 accepts plan adjustments for such manual execution methods. In this case, a part of the process specified by the user on the screen, such as the start of processing by an apparatus in a certain step, is set as a target start time and is not an automatic start. After the worker is notified of the target start time, the worker starts the processing at the timing determined by the worker. After the processing actually starts, the management system 2 can grasp the start status based on responses from the apparatus and the worker and update the target start time for each subsequent step.

[0279] The management system 2 also provides the user with a screen with a GUI for manually managing the execution of an inspection process sequence. On this screen, the user can check the inspection process sequence plan and execution status, and can also manually issue start instructions to individual devices. For example, as shown as an example screen at the bottom of Fig. 28, a start button for device processing operation execution is provided for each device block.

[0280] [Work instruction method] Furthermore, when a worker's work is involved in part of the inspection processing sequence of the inspection system 1, the management system 2 also has a function of sending work instructions and the like to devices and users to support the work of the worker. This is referred to as a work instruction method here.

[0281] FIG. 31 is an explanatory diagram of the work instruction method. Here, an example of a first type of inspection processing sequence is shown. As shown in the figure, this inspection processing sequence includes, on a time axis, for example, a transfer from the production line, a first process of a first step (time t1 to t2), a first transfer (time t2 to t3), a second process of a second step (time t3 to t4), a second transfer (time t4 to t5), and a third process of a third step (time t5 to t6). At the start of processing for each step, a start instruction 2901 may be sent from the management system 2 to the device, as in FIG. 29 .

[0282] 31 also shows an example of the allocation of workers to the processing operations of each step. For example, a first worker W1 is in charge of the first process of the FIB-SEM device 10 in the first step and the work of the subsequent first transfer step. A second worker W2 is in charge of the second process of the lift-out device 20 in the second step and the work of the subsequent second transfer step. A third worker W3 is in charge of the third process of the TEM device 30 in the third step. However, this is not limiting, and for example, the work of the transfer step may be performed by a different worker.

[0283] The management system 2 transmits work instructions and the like to each worker in accordance with the start of the processing operation of each step (such as the scheduled time in the plan). These work instructions are information that allows the worker in charge to recognize the work and processing operation of that step or device. An example of the work instructions is shown at the bottom of FIG. 31 . For example, the management system 2 transmits a first processing start instruction 3101 to the worker W1 at the start of the first processing (time t1). The first processing start instruction 3101 includes information such as which holder 6 should be processed with which FIB-SEM device 10 and when. The destination of each instruction may be a predetermined destination, such as the screen of an output device of a device such as the FIB-SEM device 10, or the screen of the mobile terminal of the worker W1. The destination of the instruction may also be a common management device (e.g., a large display viewable by each worker) separate from each device within the environment in which the inspection system 1 is installed.

[0284] For example, operator W1 sets a designated FOUP in a designated FIB-SEM device 10 and presses the device's process start button in accordance with first process start instruction 3101. Accordingly, the FIB-SEM device 10 starts thinning processing of the wafer 3 removed from the FOUP. The FIB-SEM device 10 forms a lamella 4 by irradiating a beam onto a designated position on the surface of the wafer 3.

[0285] Furthermore, the management system 2 may transmit a first transport instruction 3102 regarding the work of the first transport step to the worker W1 in charge, for example, in response to the end of the first process (time t2). The first transport instruction 3102 includes information such as which holder 6 should be transported to which lift-out device 20 and by when.

[0286] Similarly, the management system 2 may transmit a second process start instruction 3103 to the operator W2 in charge of the lift-out apparatus 20, for example, at the start of the second process (time t3). The second process start instruction 3103 includes information such as which holder 6 should be processed in which lift-out apparatus 20 and when. In accordance with the second process start instruction 3103, the operator W2 sets the designated FOUP in the designated lift-out apparatus 20 and presses the process start button of that apparatus. Accordingly, the lift-out apparatus 20 removes the lamella 4 from the wafer 3 removed from the FOUP and transfers it to the carrier 5. The management system 2 may transmit a second transfer instruction 3104 regarding the work of the second transfer step to the operator W2 in charge, for example, at the end of the second process (time t4). The second transfer instruction 3104 includes information such as which carrier 5 (LCC 7) should be transported to which TEM apparatus 30 and by when.

[0287] In this method, information such as the worker in charge of each step of the inspection system 1 and the address of the notification recipient is registered in advance in the management system 2. The management system 2 sends work instructions, such as a processing start instruction or a transport instruction as shown in FIG. 31, to the address of the mobile device of the worker in charge in the form of an email or the like. For example, a message such as "Please start processing ____ on ____ device at this time" is displayed on the screen of the worker's mobile device. Such a notification is sent before the scheduled start time in the plan.

[0288] The management system 2 may display information such as the process scheduled for each device in the plan and the scheduled start time of that process on the screen of the output device (e.g., operation panel) of each device in the inspection system 1. This information is displayed before the scheduled start time. By looking at the screen, the worker in charge can check the scheduled start time of the process for that device.

[0289] Similarly, information regarding the work of the transfer step may be displayed on the screen of a related device. For example, when outputting work instructions regarding the work of the first transfer step, information regarding the work instructions for the transfer step is displayed on at least one of the screens of the FIB-SEM device 10, the lift-out device 20, the worker's mobile terminal, and the management device.

[0290] In the above work instruction method, the management system 2 supports the work of the workers by issuing work instructions in accordance with the inspection processing sequence plan. The management system 2 sends instructions and notifications to the corresponding workers so that the processing and work of each step can be started as close to the scheduled time as possible in the plan. Therefore, in this method, the workers can be made to perform their work according to the scheduled time in the plan with as little deviation as possible.

[0291] If a worker does not complete a task within the scheduled time in the plan, the processing of each step will be delayed, causing the entire inspection process sequence to be delayed. The inspection process execution management unit 404 of the management system 2 may detect such delays based on communication with the device and the worker. The worker may transmit the status of the work to the management system 2, for example, from a mobile terminal. In this case, the management system 2 may modify the plan, for example, by extending the scheduled time in the original plan. When the management system 2 modifies the plan, it may output the modified plan to the user, or may transmit instructions according to the modified plan to each device and user.

[0292] This work instruction method also has the following functions to provide support and support when a worker forgets to do a task. If the processing of a step or work does not start at the scheduled time in the plan, the management system 2 sends or outputs a notification such as an alert to the corresponding worker. Details of this method are as follows:

[0293] When the scheduled start time of a planned process or task approaches, the management system 2 may display, for example, a notification window warning of time-up to a predetermined notification destination. For example, for the second process in the lift-out device 20 of the second step, if the scheduled start time is 10:00 as time t3, a process start instruction 3103 is displayed on the screen of the lift-out device 20 and on the screen of the mobile terminal of the worker W2 in charge, for example, 5 minutes before the scheduled start time. The notification counts and displays the remaining time until the scheduled start time (t3). As the scheduled start time (t3) approaches, a time-up warning is displayed. The output of a warning or the like may be realized by switching the display state of a pilot lamp provided on the device, or the like. Furthermore, after the scheduled start time is reached, a warning or the like may be output, as described below.

[0294] [Display of Inspection Processing Status] The inspection processing execution management unit 404 of the management system 2 displays the progress of the currently executing inspection processing sequence to the user on a screen while the inspection processing sequence is being executed according to the plan. The user can check the progress of the currently executing inspection processing sequence by viewing the screen. Each process performed by each device in the inspection system 1 is composed of more detailed operation sequences and process groups related to multiple thin sections 4, etc. The management system 2 also grasps the progress of the operation sequences and process groups of each device based on responses from each device and displays the progress on the screen. Alternatively, each device in the inspection system 1, for example, the controller 10C, may manage the progress of its own processing operation and send information indicating that progress to the management system 2, which then grasps the progress of each device from that information. The management system 2 may output information on the inspection processing status to, for example, an operation panel for each device or a user's mobile terminal.

[0295] FIG. 32 shows an example of a screen displaying the inspection processing status. The inspection processing execution management unit 404 of the management system 2 generates this inspection processing status screen based on the plan information 53 and the inspection processing status information 54, and provides it to the user. The example screen of FIG. 32 displays information about the plan to be checked (e.g., plan X1) and information representing the inspection processing sequence. The configuration of the inspection system 1 is assumed to be the same as that shown in FIG. 2, for example. This screen displays the overall configuration of the inspection system 1, which consists of multiple devices, and indicates that the devices that execute the inspection processing sequence of plan X1 are FIB1, LIFTOUT1, and TEM1. In addition, the connection between the processes of each device is displayed, for example, with an arrow image.

[0296] This screen displays the status of processing for each device in the currently running inspection processing sequence of Plan X1. The processing status indicates, for example, whether processing has started or ended for each device. For example, the first processing for FIB1 has ended, which is displayed as "Ended." The third processing for TEM1 has not yet started, which is displayed as "Scheduled." When processing is in progress for a device, the status of the processing and the progress of the processing are displayed. In this example, processing is represented by a square bar for each device block, and the length of the bar (e.g., the diagonal line pattern) represents the progress of the processing. For example, in LIFTOUT1, the second processing, lift-out processing, is being performed, and the status is displayed as being 50% complete. 50% corresponds to, for example, the completion of five of the ten planned processing slices 4, or the completion of 30 minutes of a scheduled one-hour processing. This screen may also display the actual start and end times of processing for each device.

[0297] On this screen, it is also possible to check the available equipment in the inspection system 1 that is not being used for plan X1. Although not shown here, the status of scheduled equipment maintenance, etc. is also displayed, as will be described later, so that these can be checked as well. Also, on this screen, when the user selects the information for the plan, the detailed contents of the plan are displayed and can be checked. Also, when the user selects the block of an equipment, the detailed status of that equipment is displayed and can be checked.

[0298] In addition, although the screen example in Fig. 32 displays the degree of progress for each device, this is not limiting, and the degree of progress for the entire inspection process sequence may be calculated and displayed. An example of such a display is shown at the bottom of Fig. 32. In this example, the degree of progress for the entire inspection process sequence is represented by a long bar.

[0299] [Display of inspection process results] The inspection process execution management unit 404 of the management system 2 displays the execution results of the inspection process sequence according to the plan on the screen. The user can check the results of the inspection process by looking at the screen. Note that the inspection process results here are separate from the results (data 9) of observation, analysis, etc. by the TEM device 30, and are the execution results of the inspection process sequence.

[0300] Figure 33 shows an example of a screen displaying inspection processing results. When inspection processing in an inspection processing sequence according to a plan is completed, the inspection processing execution management unit 404 generates an inspection processing result screen like this and provides it to the user. In this example screen, information on the inspection processing sequence and the success rate of processing operations in each device are displayed above information on the plan, status, and information on the overall configuration of the inspection system 1. In this inspection processing sequence, for example, inspection processing is performed on multiple lamellae 4, and the success rate of processing operations is displayed for each device based on the success rate information 55A. For example, it is displayed that the success rate for thinning processing in FIB1 was 90%. This success rate is a value calculated based on the results of the current inspection processing sequence.

[0301] Furthermore, when a user selects a device block on this screen, detailed information regarding the success rate can be displayed and checked. For example, as shown in the lower part of FIG. 33, the management system 2 may display a graph of the progress of the success rate based on past performance as the success rate of processing by the FIB 1. Furthermore, the user may specify a period for calculating the success rate on the screen, and the success rate for the specified period may be calculated and displayed. Similarly, as will be described later, index values ​​can also be displayed for each device.

[0302] Furthermore, on this screen, detailed information about the device processing itself can be displayed and confirmed based on user operations, for example, in response to the selection of a device block. For example, as shown at the bottom of Figure 33, detailed information about cross-sectional observation can be displayed and confirmed as the third process in the TEM device 30. Based on the data 9 (Figure 1) obtained as a result of the inspection process, the management system 2 acquires images and information resulting from the cross-sectional observation of, for example, TEM 1 and displays them on the screen. For example, a TEM image of a certain slice 4 can be displayed and confirmed by the user.

[0303] As with the screen of FIG. 32, the screen of FIG. 33 may also display information such as the overall processing time as the result of the entire inspection processing sequence.

[0304] [Warning Display] The inspection process execution management unit 404 of the management system 2 determines whether the processing of each device in the inspection process sequence is being executed as scheduled in the plan, based on responses from each device, etc. If the inspection process execution management unit 404 determines that processing in a device has not started or has not ended as scheduled in the plan, it outputs a warning indicating this. For example, the inspection process execution management unit 404 displays a warning on a screen for a user associated with the processing. Alternatively, the management system 2 may notify the user of the warning by email or the like. The management system 2 may notify the warning on the operation panel of the corresponding device or on the mobile device of the worker in charge. The management system 2 may output a warning in the form of light or sound. Warnings may be provided in stages ranging from low to high severity.

[0305] FIG. 34 shows an example of a warning notification screen for users such as inspection managers and operators. On this screen, warning information 3401 is displayed above the plan information and information about each device in the inspection process sequence. The information about each device in the inspection process sequence includes the scheduled time and progress of the process for each device. For example, in the LIFTOUT1 block, the start and end times of the second process are displayed as scheduled between 10:00 and 11:00 in the plan. Progress status indicates that the process has not yet started, using an X or similar symbol. The warning information 3401 displays a message, such as "The scheduled start time is 11:00, but the process has not yet started," in a speech bubble. Possible reasons for the second step process not starting include, for example, when the operator W1 in charge of the transport work for the first transport step forgets to perform the work or has not yet completed the work, or when a hardware error occurs in LIFTOUT1.

[0306] When a user receives such a warning, the user can check the content of the warning and the status of the inspection process, and consider how to deal with the problem. For example, the operator may go to the location of the device that is the subject of the warning and check whether a hardware error or transport delay has occurred. The inspection manager may also send instructions to the operator in charge. After the user checks the warning and takes appropriate action, the user can resume the inspection process by inputting a start command again on the screen (e.g., FIG. 28).

[0307] Furthermore, for example, the management system 2 may display parameter values ​​and the like on the screen as recipe information for the processing operation of the equipment corresponding to the plan, and the user may check the recipe and manually correct some of the parameter values, etc., to take appropriate action. An example of a recipe display is shown at the bottom of Figure 34. For example, when the LIFTOUT1 block is selected on the screen, the recipe information for LIFTOUT1 is displayed. The user checks and corrects the parameter values ​​of the recipe and presses the OK button. The management system 2 corrects and updates the recipe on the plan. If the schedule, such as the processing time, is updated along with the recipe update, the management system 2 may display the updated schedule to the user.

[0308] With the inspection processing status and warning functions described above, the user can check whether the processing operations of each device in the inspection processing sequence are proceeding according to plan without any problems, and if any problems occur, they can be dealt with smoothly.

[0309] [Error Display] Furthermore, when a problem occurs during an inspection process sequence, such as a hardware error in an apparatus or a transport delay in a transport step, the inspection process execution management unit 404 of the management system 2 identifies such a problem based on communication with the inspection system 1. The inspection process execution management unit 404 identifies, for example, which error occurred in which apparatus's processing operation in which inspection process sequence, and what the progress status is (for example, a status such as interruption). The inspection process execution management unit 404 then outputs the status of such a problem or error to a user, such as an inspection manager. This allows the user to confirm the status and take prompt action to resolve it.

[0310] When an error such as a hardware error occurs in the processing operation of each device, the device sends an error notification as a type of response to the management system 2. The inspection processing status management unit 404 grasps the error status of the device based on the error notification received from the device. Then, the inspection processing status management unit 404 uses the user interface unit 407 to display an error notification screen to the user.

[0311] FIG. 35 shows an example of a screen that notifies a user of an error when an error occurs in an inspection process sequence. In this example screen, error notification information 3501 is displayed, for example, as a balloon image, above plan information and progress information for the inspection process sequence. The progress is, for example, the same as in FIG. 32 , with the second process in LIFTOUT1 having completed 50%. At this time, a hardware error occurred in LIFTOUT1, causing the second process in LIFTOUT1 to be interrupted. In response to this error, the error notification information 3501 displays a message such as "Processing has been interrupted due to an error," and also displays links to error information (e.g., an error code) and troubleshooting. The user can check the error notification information 3501 on this screen and smoothly perform troubleshooting and other troubleshooting operations.

[0312] [Display of Success Rate] Figure 36 shows an example of displaying statistical values ​​related to the success rate (achieved success rate) for each device in the inspection system 1 on a screen. The user can request and check such a screen at any time. The inspection processing result management unit 405 of the management system 2 uses the success rate calculation unit 405A to refer to the success rate information 55A in the inspection processing achievement information 55 and calculates the statistical value of the success rate for a predetermined period in the past, for example, a period specified by the user on the screen. This calculation may be performed in advance or when a request is received from the user.

[0313] In the example screen of Fig. 36, the period for which statistics are to be collected is specified as, for example, one year from the present to the past. Furthermore, the average value is specified as the type of statistical value. The success rate calculation unit 405A calculates the specified statistical value for the specified period based on the success rate information 55A, which stores the success rates of each past test. In addition to the average value, maximum values, minimum values, and amounts of change can also be displayed.

[0314] This screen also allows you to view a graph of the device's success rate over time, for example, in response to device block operations. As shown in the bottom of Figure 36, you can see trends such as an increase in the success rate for FIB1, but a decrease in the success rate for FIB3.

[0315] Furthermore, when there are multiple processes in a detailed operation sequence for each device, the success rate may be calculated and displayed for each detailed operation process, such as the success rate for the operation of storing the wafer 3 on which the flake portion 4a has been formed in the holder 6 in the FIB-SEM device 10, the success rate for the operation of extracting the flake 4 from the wafer 3 in the lift-out device 20, and the success rate for the operation of loading the extracted flake 4 onto the carrier 5.

[0316] The screen can also display devices in descending order of success rate, or highlight the device with the highest success rate among devices of the same type. It is also possible to extract points in the history of success rate trends where the success rate has changed significantly and display and confirm detailed information about those points. For example, when maintenance is performed on a device, the success rate may change due to the effects of that maintenance. This confirmation makes it possible to evaluate the effectiveness of the maintenance. Furthermore, as will be described later, it is also possible to create a maintenance plan based on the success rate trends.

[0317] [Display of Index Values] Figure 37 shows an example of displaying index values ​​for processing time and processing capacity for each device in the inspection system 1 on a screen. For example, when an inspection processing sequence for a certain plan is completed and the execution results are obtained, the inspection processing result management unit 405 of the management system 2 calculates index values ​​for each device related to that inspection processing sequence. The inspection processing result management unit 405 calculates at least one of an index value PT for processing time or an index value PC for processing capacity based on the processing results of each device in the inspection processing sequence using the inspection processing performance information 55, and stores the calculated values ​​as index value information 55B. The management system 2 uses the user interface unit 407 to generate a screen displaying the index values ​​and provides it to the user.

[0318] 37, the processing time index value PT and the processing capacity index value PC are displayed for each device above the configuration of the inspection system 1. For example, for the thinning process using FIB1, the processing time index value PT is 10 minutes and the processing capacity index value PC is 6. These example index values ​​are provided for convenience of explanation.

[0319] Furthermore, as described above (FIG. 27), the management system 2 may compare such index values ​​between devices in the inspection system 1 and select devices and times to allocate processing to when creating a new plan. Furthermore, the management system 2 is not limited to storing index value information 55B in a structure such as a table, and the inspection system 1 may store index value information related to its own device in each device (e.g., controller 10C, etc.).

[0320] [Regarding the Index Value] The index value PT of the processing time is the time required to process one flake. The index value PC of the processing capacity or throughput is the amount of flakes that can be processed per unit time, according to a general definition. These index values ​​can be converted into each other. The index value can also be referred to as an evaluation value or a correction coefficient. The processing is the process shared by each device, for example, the thinning process in the FIB-SEM device 10. For example, the index value PC of the processing capacity or throughput in the FIB-SEM device 10 can be the amount of flake portions 4a that can be formed per hour. The index value PT of the processing time in the FIB-SEM device 10 is the time required for the thinning process to form one flake portion 4a.

[0321] The index value can be calculated, for example, as follows: The processing time of each device in the inspection system 1 (in other words, the total processing time) can be defined as [device processing time], for example, by the following formula: [Device processing time] = [Transport time] + [Preprocessing time] + [Shared processing time]. This [Device processing time] is a value that also reflects differences in the devices specific to the device.

[0322] The "Transportation Time" is the time required for tasks such as transporting and setting from the equipment for the previous step to the equipment for the current step. The "Preprocessing Time" is the time required for processing such as adjustments performed before the main shared processing in the equipment. Examples of adjustment processing include alignment between the stage and optical system and setting optical conditions. The "Shared Processing Time" is the time required for the main shared processing performed in the equipment that is the shared part, and for example, in the case of the FIB-SEM equipment 10, it is the time required for thinning processing.

[0323] The "allocated processing time" can be defined, for example, by the following formula: "allocated processing time" = "number of slices to be processed" x "time required to process one slice".

[0324] The inspection processing time for the entire inspection processing sequence can be defined by, for example, the following formula: [equipment processing time for the first step] + [equipment processing time for the second step] + [equipment processing time for the third step].

[0325] The calculation formula in the above example is defined including the transport steps, but is not limited to this and may be defined excluding the transport steps.

[0326] When creating a plan, the plan creation unit 403 calculates the predicted device processing time (corresponding to the device usage time described above) as the predicted required time assuming that the candidate device performs the shared processing assigned to it. For example, let the number of slices 4 to be processed be n. Let the [transport time] be Tt. Let the [preprocessing time] be Tp. Let the [shared processing time] (time per slice) be Td. Let the predicted device processing time be Te. Each time is the time for each device, and the device ID is shown in parentheses below. The predicted device processing time Te can be calculated using the formula Te = Tt + Tp + Td * n.

[0327] For example, when calculating the predicted device processing time Te for each of three devices for thinning processing using the FIB-SEM device 10, the predicted device processing times Te(FIB1), Te(FIB2), and Te(FIB3) for each device are as follows: Te(FIB1) = Tt(FIB1) + Tp(FIB1) + Td(FIB1) * n, Te(FIB2) = Tt(FIB2) + Tp(FIB2) + Td(FIB2) * n, Te(FIB3) = Tt(FIB3) + Tp(FIB3) + Td(FIB3) * n.

[0328] In the calculation formulas in the above example, the transport time Tt and pre-processing time Tp are constant values ​​regardless of the number of flakes 4, but they may also be values ​​determined according to the number of flakes 4.

[0329] When creating a plan, the plan creation unit 403 calculates allocation so that the predicted apparatus processing time Te of each apparatus falls within the available time as the aforementioned apparatus usage time. In this case, there may be cases where multiple apparatuses of the same type (e.g., FIB-SEM apparatus 10) have available time in the same time period and are available for allocation. In such cases, the plan creation unit 403 prioritizes the multiple apparatuses in the same time period in order of availability and allocates processing to the selected apparatus and its corresponding time, based on a policy.

[0330] The processing capacity, processing time, and success rate improve with improvements and advancements such as improvements to the equipment's functions and the addition of new functions. Therefore, even for the same type of FIB-SEM equipment, the processing capacity and processing time may differ depending on whether it is a current model or a new model. Furthermore, even for equipment with the same model number, there may be differences between the individual equipment. Therefore, the management system 2 calculates index values ​​for the processing capacity and processing time specific to each equipment based on the inspection processing performance information 55 and uses these values ​​in creating plans.

[0331] In a specific example, the inspection processing result management unit 405 of the management system 2 calculates the index value PT of the processing time for the equipment at each step based on the above formula, and calculates the processing capacity index value PC by converting the index value PT, and stores the calculated index value as index value information 55B. The management system 2 may then display an index value screen such as that shown in FIG. 37. The example screen of FIG. 37 displays the results of inspection processing at equipment such as FIB1, LIFTOUT1, and TEM1 for a certain inspection processing sequence, as well as the index value PT of each equipment. The user can check the processing capacity of the current inspection processing by looking at the screen.

[0332] In addition, similar to the success rate screen of Figure 36, the management system 2 can also calculate statistical values ​​of index values ​​for a specified period in the past based on the inspection processing performance information 55 and display them on the screen.

[0333] The bottom of Figure 37 shows an example of displaying index values ​​calculated as statistical values. In this example, the index values ​​PT and PC for three FIB-SEM devices 10, FIB1, FIB2, and FIB3, in the first step, are displayed in parallel. These index values ​​are calculated as statistical values, such as average values, for the past year, for example. For example, the index values ​​PT for the processing times of the three devices are 10, 15, and 20 minutes, which translates into the index values ​​PC for the processing capabilities of 6, 4, and 3, respectively. By viewing this screen, the user can compare the index values ​​as statistical values ​​between devices. For example, among the three devices, it can be seen that FIB1 has the shortest processing time and the highest throughput.

[0334] Similarly, as shown in the example on the right, it is also possible to display a graph showing the progress of index values ​​for a device selected by the user.

[0335] The management system 2 can automatically select the devices to be used in the plan using the index values ​​as described above (FIG. 27). The user can also select or modify the devices to be used in the plan by referring to the index values ​​that can be confirmed on the screen as described above.

[0336] [Display of Maintenance Status and Maintenance Plan] Figure 38 shows an example of the maintenance status and maintenance plan screen displayed by the maintenance management unit 406 of the inspection system 2. The user can check this screen at any time. In the example screen of Figure 38, the user can select a date and time using a time axis bar 3801, etc., and the maintenance status and maintenance plan for the devices in the inspection system 1 for the time period of the selected date and time are displayed. Also, for example, in the list box 3802, "Maintenance Status" or "Plan" can be selected, and when "Maintenance Status" is selected, the maintenance status and maintenance plan for each device in the inspection system 1 are displayed. The maintenance management unit 406 generates this screen based on the schedule table 52A shown in Figure 23 and provides it to the user using the user interface unit 407.

[0337] In the example screen of Fig. 38, the status of each block of the equipment, such as "available" or "scheduled for maintenance," is displayed as the maintenance status and maintenance plan. In this example, FIB1 is displayed as scheduled for maintenance during a certain time period (9:00 to 10:00). When creating a plan using this time period, the plan creation unit 403 of the management system 2 excludes FIB1 scheduled for maintenance from the candidates so as not to use it.

[0338] The user can also input scheduled maintenance for the device on this screen. For example, when the device block for LIFTOUT3 is selected, a list box 3803 displays options such as "Available," "Adjustment," "Maintenance," and "Individual Use," from which the user can select and input. The "Maintenance" status may also be set to more detailed status, such as whether it is a regular inspection or an unexpected inspection.

[0339] Furthermore, on this screen, the user can select a specific device block in the inspection system 1 and schedule it for the aforementioned individual use. For example, TEM3 is set to the "individual use" state. When creating a plan using this time period, the plan creation unit 403 excludes TEM3 in the "individual use" state from the candidates so as not to use it.

[0340] The screen is not limited to the example shown in FIG. 38, and maintenance schedules may be displayed in a similar manner to the schedule table 52A shown in FIG. 23, for example.

[0341] [Maintenance Planning] The maintenance management unit 406 of the management system 2 may use the above-mentioned success rate information 55A and index value information 55B ( FIG. 21 ) in addition to the maintenance schedule management information (apparatus status information 52 in the implementation example) to plan preventive maintenance and maintenance plans. The maintenance management unit 406 plans a maintenance plan for the apparatuses of the inspection system 1 based on information such as the success rate and index value of each apparatus (e.g., FIGS. 36 and 37 ). For example, the maintenance management unit 406 creates a maintenance schedule and records it in the schedule table 52A so that apparatuses with lower success rates require earlier maintenance or more frequent maintenance. Furthermore, for example, the maintenance management unit 406 may compare the success rate of each apparatus with a threshold value to determine whether maintenance is necessary. For example, the maintenance management unit 406 may compare the amount of change in the success rate when the success rate decreases with a threshold value to determine whether maintenance is necessary. The management system 2 uses the user interface unit 407 to display the contents of the maintenance plan drawn up by the maintenance management unit 406 on a screen.

[0342] FIG. 39 shows an example of a screen displaying a planned maintenance plan. In the example screen of FIG. 39, information 3901 about the success rate of FIB3 is displayed at the top, and a maintenance recommendation message such as "The success rate is decreasing. We recommend maintenance of FIB3" is displayed to the user in a speech bubble image. For example, as in FIG. 36, if there is a record of a decrease in the success rate of FIB3 in the FIB-SEM device 10, the maintenance management unit 406 determines that early maintenance of FIB3 is required based on the decrease in success rate and displays such information. Then, the maintenance management unit 406 plans a maintenance plan for FIB3.

[0343] At the bottom of Figure 39, information 3902 of a maintenance plan drawn up by the maintenance management unit 406 for the maintenance of FIB3 is displayed. In this example, the maintenance plan information 3902 is displayed in the form of a schedule, as in Figure 23. In this example, FIB3 is already scheduled for inspection processing between 8:00 and 9:00, for example. The maintenance management unit 406 selects the earliest available time slot for FIB3, between 9:00 and 10:00, for example, and proposes this as the maintenance schedule.

[0344] On this screen, the user can confirm or modify the devices that are subject to maintenance recommended by the management system 2 and the contents of the automatically planned maintenance plan. The user looks at the maintenance plan information 3902 and presses the OK button if they approve of the planned maintenance schedule. This causes the maintenance management unit 406 to reflect the planned maintenance schedule in the device status information 52. Furthermore, if the user wants to modify the planned maintenance schedule, the user can perform an operation such as sliding the maintenance schedule area horizontally with the cursor to move it to the desired free time area, and then press the OK button.

[0345] The above-described functions enable efficient maintenance and preventive maintenance, thereby maintaining or increasing the success rate of the device. Each device in the inspection system 1 may have consumable maintenance parts as device components. An example of a consumable maintenance part is the tweezers that make up the detacher 23 of the lift-out device 20. In this case, the device requires maintenance and replacement work for the consumable maintenance parts. The maintenance schedule also includes a schedule for maintenance and replacement work for such consumable maintenance parts.

[0346] Furthermore, the maintenance schedule can be input manually by the user on the above screen example, but is not limited to this; it can also be input automatically by the management system 2. For example, each device in the inspection system 1 may manage its own maintenance schedule, and the user may input the maintenance schedule on the operation panel of each device. The management system 2 acquires information about the maintenance schedule (e.g., the scheduled maintenance time) from each device in the inspection system 1 via communication. Then, the maintenance management unit 406 sets the schedule table 52A of the device status information 52 to reflect the maintenance schedule for each device based on the acquired information.

[0347] Furthermore, the management system 2 may determine and analyze whether the success rate of the device's processing operations, processing time, or processing capacity has improved before and after device maintenance, and output information regarding the relationship between the maintenance and the success rate, etc. The management system 2 may analyze the correlation between the time elapsed since device maintenance was performed and the success rate, and output the results as a graph. This allows the user to confirm the effectiveness and necessity of maintenance, etc.

[0348] Furthermore, the management system 2 may determine and analyze the location of a failure or a location where a failure is likely to occur in the processing operation of the device based on the progress and success / failure information of the processing operation of the device. The management system 2 may output information such as the location of the failure, which can be used as a reference when the user decides on the details of maintenance.

[0349] The management system 2 may create a maintenance plan for the device based on analysis result information regarding the correlation between the maintenance and the success rate, etc., and the location of failures, etc. For example, if the success rate increases as a result of maintenance on a certain device, this indicates that the maintenance was effective, and if the success rate decreases, this indicates that the maintenance was ineffective. If the management system 2 determines that the maintenance in a certain maintenance plan was ineffective, it creates a maintenance plan with different content.

[0350] If there is a difference in the success rate or the like before and after maintenance on a device, this difference is reflected when creating a new plan. That is, a device whose success rate has increased after maintenance is more likely to be selected when creating a new plan if the above-mentioned success rate priority policy is used. Furthermore, the management system 2 may preferentially select a device whose success rate has increased after maintenance over a device whose success rate has remained unchanged or decreased after maintenance.

[0351] Furthermore, if a plan has already been created and maintenance is subsequently performed on an apparatus, the management system 2 may adjust the created plan taking into account the maintenance. For example, suppose that FIB1 is set as the apparatus for the first step in the created plan. Suppose that maintenance is subsequently performed on FIB2. The inspection process of the plan has not yet begun. In this case, the management system 2 changes the apparatus for the first step in the plan to FIB2, which has undergone maintenance. As a result, in the adjusted plan, it is expected that the success rate, etc. of FIB2 has increased due to the maintenance, and therefore more optimal inspection processes can be expected.

[0352] [Recovery Processing] If a failure occurs in a predetermined processing operation such as thinning, lift-out, or cross-section observation in each device of the inspection system 1, information indicating the failure may be transmitted from each device to the management system 2 as a type of response. The information indicating the failure may be, for example, information indicating that processing of a specific ID out of 10 planned thin slices 4 (e.g., IDs 1 to 10) failed, or information indicating how many of the 10 failed. Alternatively, the information indicating the failure may be in the form of an error code and used as the error notification described above.

[0353] Based on the failure information from each device as described above, the management system 2 can grasp the success / failure status of processing in each device and calculate the success rate. The management system 2 can also analyze the transition of the success rate over time, failure trends, error trends, and error causes. The management system 2 may display the information resulting from such analysis on a screen. The management system 2 may also create a plan using the information resulting from such analysis.

[0354] Furthermore, the management system 2 or each device may determine whether to interrupt or continue processing on that device when a processing failure occurs for each slice 4. For example, the management system 2 will not interrupt processing after a failure, except in fatal cases (e.g., when the device determines a serious error and it is difficult to continue processing), and will continue to execute subsequent processing, i.e., similar processing for other slices 4. As a result, the management system 2 will once complete all processing of the entire inspection processing sequence (processing excluding processing of the failed slice 4). After completion, the management system 2 will execute additional recovery processing depending on the location and cause of the identified failure. The recovery processing will continue processing the failed slice 4 until it is successful.

[0355] [Plan Creation (5)] Figure 40 shows another example of plan creation. Figure 40 shows an example of calculating the apparatus and time to which processing is assigned when there are three FIB-SEM apparatuses 10, FIB1 to FIB3, in the first step. (A) shows an example of a schedule for FIB1 to FIB3 from the current time t1 onward. Assume that the time available for allocation is from time t1 onward. FIB1 is being used for inspection processing from time t1 to t3. FIB2 is scheduled for maintenance from time t3 to t5 and from time t9 to t11. FIB3 is being used for inspection processing from time t1 to t5. Furthermore, assume that the success rates of each apparatus are 90%, 85%, and 80%. Furthermore, assume that the index values ​​PC of the processing capabilities (e.g., throughput) of each apparatus are relatively low, medium, and high. That is, in this example, FIB1 has a relatively high success rate but a relatively low throughput, while FIB3 has a relatively low success rate but a relatively high throughput.

[0356] The plan creation unit 403 estimates the predicted device processing time Te for each device as described above. As a result, as shown in (B), the predicted device processing times Te for each device are Te1, Te2, and Te3, as shown in the figure. Te1 > Te2 > Te3. In this example, Te1 is four unit times long, Te2 is three unit times long, and Te3 is two unit times long.

[0357] (C) shows an example of a proposed process allocation based on the predicted device processing time Te in (B) for the device status in (A). First, simply, among the possible cases in which time Te can be accommodated within the available time after time t1, a plan that allows processing to be scheduled at the earliest possible time is selected. In this case, for candidate FIB1, a block of time Te1 is allocated from time t3 to t7. For candidate FIB2, time Te2 cannot be allocated from time t1 to t2, so a block of time Te2 is allocated from time t5 to t8. For candidate FIB3, a block of time Te3 is allocated from time t4 to t7. The plan creation unit 403 selects from these three candidates, for example.

[0358] When the plan creation unit 403 makes a decision based solely on the success rate, it selects FIB1 based on the success rate value regardless of the allocation of time Te, and in this plan, it allocates processing to the time period from time t3 to time t7 of FIB1.

[0359] When the plan creation unit 403 makes a decision based solely on throughput priority, it selects FIB3 from the value of the index value PC regardless of the allocation of time Te, and in this plan, allocates processing to the time period from time t5 to t7 of FIB3.

[0360] Alternatively, when prioritizing throughput, the plan creation unit 403 may select the placement plan that will result in the earliest processing completion time, based on the placement plan such as (C). In this example, of the three placement plans, the processing completion times of FIB1 and FIB3 are time t7. Therefore, the plan creation unit 403 may select either FIB1 or FIB3.

[0361] In the above example, only the processing portion of the FIB-SEM apparatus 10 in the first step of the inspection processing sequence was considered, but similarly, plans can be made for the processing portions of the subsequent lift-out apparatus 20 and TEM apparatus 30. For example, if the time Te1 (times t3 to t7) of FIB1 is selected from the above layout plan, the allocation of processing for the lift-out apparatus 20 in the second step is calculated for the time from time t7 onwards.

[0362] In addition, the plan creation unit 403 may sequentially make a provisional selection of the processing allocation for the device at each step, create a provisional allocation for the entire inspection processing sequence, and then evaluate the overall inspection processing time, etc., to finally select and decide on a plan.

[0363] In addition, in the first embodiment, the calculation of the predicted device processing time Te does not reflect recovery processing in the event of a processing operation failure. As a modification, the predicted device processing time Te may be calculated by taking into account information on the success rate, i.e., the predicted time required for recovery processing in the event of a failure.

[0364] [Plan Creation (6)] The manufacturing control system of the manufacturing factory may assign information such as priorities for the inspections and samples in the inspection instructions. The control system 2 may receive information such as the inspection instructions and priorities from the manufacturing control system and assign priorities to the inspection process sequences and plans in accordance with the priorities. Alternatively, the control system 2 may assign priorities to the inspection instructions. In other words, the control system 2 may assign priorities to each target sample and each inspection process. The control system 2 then creates multiple plans for multiple inspection processes for multiple samples, taking into account the priorities among them.

[0365] Priority can be divided into multiple levels, such as normal, high, and highest. For example, at the normal level, a plan is created to simply process inspection orders in chronological order in the order in which they arrive. At the high and highest levels, plans are created to process inspection orders earlier in chronological order than at the normal level.

[0366] For example, suppose a plan for testing a normal-level sample (referred to as the first plan) is first created based on a first testing instruction. Next, suppose a request for testing a high-level sample is received as a second testing instruction. In this case, the plan creation unit 403 shifts the existing normal-level first plan as far back as possible and inserts the high-level plan (referred to as the second plan) before it, thereby reconstructing the entire set of multiple plans, including the first and second plans, so that the high-level testing process is completed as quickly as possible.

[0367] Furthermore, suppose that, for example, while the inspection process of the first plan or the second plan is being executed, a request for inspection process of the highest level sample is received as a third inspection instruction. In this case, the plan creation unit 403, for example, suspends the inspection process of the current plan, creates a highest level plan (hereinafter referred to as the third plan) so that the highest level inspection process is executed as quickly as possible with the highest priority, and controls the entire plurality of plans. After the inspection process of the third plan is completed, the suspended inspection process of the plan is resumed.

[0368] Figure 41 shows an example of plan creation using the above priorities. (A) shows a first plan for the inspection process of a normal-level sample, created initially based on the first inspection instruction. For simplicity, this example shows a case where only FIB1, LIFTOUT1, and TEM1 are used. The first plan consists of a process p11 using FIB1 from time t1, a process p12 using LIFTOUT1 from time t3, and a process p13 using TEM1 from time t5.

[0369] (B) shows a second plan for the inspection process of a high-level sample, created based on the second inspection instruction. The plan creation unit 403 shifts the time of the first plan back and inserts the time of the second plan so that the inspection process of the second plan is executed before the inspection process of the first plan. The second plan consists of a process p21 using FIB1 from time t1, a process p22 using LIFTOUT1 from time t3, and a process p23 using TEM1 from time t5. The updated first plan is configured to be shifted back by two unit times.

[0370] Assume now that the inspection process is executed according to the plan (B), and that the processes p21, p11, and p22 are completed up to time t5, for example.

[0371] (C) shows an example of the creation of a third plan for the inspection process of the highest-level sample when a third inspection instruction is received at time t5. The plan creation unit 403 suspends the processing of the first and second plans at time t5. At this time t5, processes p12, p23, and p13 remain. The plan creation unit 403 creates and enters the third plan, which has the highest priority, from time t5. The third plan consists of process p31 in FIB1 from time t5, process p32 in LIFTOUT1 from time t7, and process p23 in TEM1 from time t9. The plan creation unit 403 enters processes p12, p23, and p13 after the first plan after resumption. For example, process p12 is placed after process p32, and processes p23 and p13 are placed after process p33.

[0372] (D) shows another example of the placement of processes p12, p23, and p13 after resumption for the third plan. This example utilizes the available time before the time used in the third plan. The plan creation unit 403 places process p12 of LIFTOUT1 there by utilizing the available time in (C) (times t5 to t7). The plan creation unit 403 places processes p23 and p13 of TEM1 there by utilizing the available time in (C) (times t5 to t9).

[0373] [Simultaneous Parallel Processing] In the inspection system 1, if there are multiple devices of the same type, for example, multiple sets, it is possible to use those resources to simultaneously execute multiple inspection processes for multiple samples in parallel. The plan creation unit 403 can create multiple plans for simultaneously executing those multiple inspection processes in parallel.

[0374] FIG. 42 shows an example of the creation of multiple plans in this case. First, as an example of the advance equipment status, assume that there are maintenance schedules for each equipment (blocks in a grid pattern) as shown in the figure. Assume that the management system 2 receives inspection instructions for three inspection processes. The plan creation unit 403 creates three plans (Plans X, Y, and Z) for the three inspection processes using available time. In this example, the management system 2 creates Plan X using the first set of equipment {FIB1, LIFTOUT1, TEM1}, Plan Y using the second set of equipment {FIB2, LIFTOUT2, TEM2}, and Plan Z using the third set of equipment {FIB3, LIFTOUT3, TEM3}. Regarding the first process of the first step of each plan, for example, from 8:00 to 9:00, FIB1 is scheduled for maintenance, so the process is scheduled for 9:00 to 10:00. FIB2 and FIB3 are available, so the processes are scheduled simultaneously in parallel. Regarding the second process of the second step, the process is arranged immediately after the process of the previous step is completed for each of LIFTOUT1, LIFTOUT2, and LIFTOUT3. Regarding the third process of the third step, the process is arranged immediately after the process of the previous step is completed for TEM1 and TEM2, and the process is arranged between 11:00 and 12:00 for TEM3 due to scheduled maintenance, and the processes are arranged simultaneously in parallel for TEM1 and TEM3.

[0375] The present invention has been specifically described above based on the embodiments, but the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the spirit of the invention. In each embodiment, components can be added, deleted, or replaced, except for essential components. Unless otherwise specified, each component may be singular or plural. A combination of each embodiment is also possible.

[0376] 1...inspection system, 2...management system (inspection management system), 3...wafer, 4...thin section, 5...carrier, 10...thin section manufacturing device (FIB-SEM device), 20...thin section transfer device (lift-out device), 30...thin section observation device (TEM device).

Claims

1. An inspection management system for managing an inspection of a sample by an inspection system that inspects the sample, the inspection in the inspection system is realized as an inspection process sequence in which a first process, a second process, and a third process are sequentially performed in order by a first type device, a second type device, and a third type device, which are devices performing different processes; The first type device, the second type device, and the third type device each include one or more devices, the inspection system, as the inspection processing sequence, prepares thin sections from the sample for each target location of the inspection, transfers the thin sections to a carrier, and performs processing related to the inspection for each of the thin sections on the carrier; The inspection management system includes: a plurality of devices, each of which is connected via communication to the first type device, the second type device, and the third type device; Based on communication with each of the devices, grasp the device status including free time and usage time for each of the devices; selecting, from the plurality of devices based on the inspection instructions related to the inspection and the device status, the first type device, the second type device, and the third type device to be used in the inspection processing sequence and the times to be used by the devices, and creating a plan for the inspection processing sequence including the selected devices and times; the inspection management system causes the inspection system to execute the inspection process sequence of the inspection based on the plan; the first type device performs a processing operation to form the thin section on the sample; the first type device or the second type device performs a processing operation of removing the thin piece formed on the sample and transferring it to the carrier; the third type device performs a processing operation to observe the thin section mounted on the carrier; the inspection management system holds performance information of the results of the inspection process sequence executed based on the plan; creating the plan for a new inspection based on the performance information; the test management system calculates a success rate of a processing operation for each of the devices based on a result of the test processing sequence executed based on the plan; creating said plan for new testing based on said success rate; The first type device or the second type device monitors the status of the processing operation of transferring the flakes to the carrier; the inspection management system calculates a success rate of the processing operation of transferring the thin piece to the carrier by the first type device or the second type device based on the monitor; Inspection management system.

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15. 2. The inspection management system according to claim 1, The examination management system creates one or more proposed plans as the plan based on the set policy, displays the created proposed plans on a screen for the user, and determines the proposed plan selected on the screen based on an operation by the user as the plan; A policy of prioritizing success rate can be selected, and when the policy of prioritizing success rate is selected, a device having a high success rate is selected from the plurality of devices. Inspection management system.

16. 2. The inspection management system according to claim 1, the inspection management system formulates a maintenance plan for each of the devices based on a result of the inspection process sequence executed based on the plan; the device whose success rate has decreased is designated as a candidate for maintenance, and the maintenance plan is created by setting the idle time of the device as a maintenance time. Inspection management system.

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20. 1. A method performed by an inspection management system for managing inspection of a specimen by an inspection system that performs inspection of the specimen, the method comprising: the inspection in the inspection system is realized as an inspection process sequence in which a first process, a second process, and a third process are sequentially performed in order by a first type device, a second type device, and a third type device, which are devices performing different processes; The first type device, the second type device, and the third type device each include one or more devices, the inspection system, as the inspection processing sequence, prepares thin sections from the sample for each target location of the inspection, transfers the thin sections to a carrier, and performs processing related to the inspection for each of the thin sections on the carrier; the inspection management system is connected via communication to each of the first type device, the second type device, and the third type device as a plurality of devices; The inspection management system grasps the device status including the available time and the usage time of each of the devices based on communication with each of the devices; the inspection management system selects, from the plurality of devices, the first type device, the second type device, and the third type device to be used in the inspection processing sequence and the times to be used with the devices based on the inspection instructions related to the inspection and the device status, and creates a plan for the inspection processing sequence including the selected devices and times; and causing the inspection management system to execute the inspection processing sequence of the inspection by the inspection system based on the plan; the first type device performs a processing operation to form the thin section on the sample; the first type device or the second type device performs a processing operation of removing the thin piece formed on the sample and transferring it to the carrier; the third type device performs a processing operation to observe the thin section mounted on the carrier; the inspection management system holds performance information of the results of the inspection processing sequence executed based on the plan; creating the plan for a new inspection based on the performance information; the test management system calculates a success rate of a processing operation for each of the devices based on a result of the test processing sequence executed based on the plan; creating said plan for new testing based on said success rate; The first type device or the second type device monitors the status of the processing operation of transferring the flakes to the carrier; the inspection management system calculates a success rate of the processing operation of transferring the thin piece to the carrier by the first type device or the second type device based on the monitor; Inspection management methods.

21. An inspection management system for managing an inspection of a sample by an inspection system that inspects the sample, the inspection in the inspection system is realized as an inspection process sequence in which a first process, a second process, and a third process are sequentially performed in order by a first type device, a second type device, and a third type device, which are devices performing different processes; The first type device, the second type device, and the third type device each include one or more devices, the inspection system, as the inspection processing sequence, prepares thin sections from the sample for each target location of the inspection, transfers the thin sections to a carrier, and performs processing related to the inspection for each of the thin sections on the carrier; The inspection management system includes: a plurality of devices, each of which is connected via communication to the first type device, the second type device, and the third type device; Based on communication with each of the devices, grasp the device status including free time and usage time for each of the devices; selecting, from the plurality of devices based on the inspection instructions related to the inspection and the device status, the first type device, the second type device, and the third type device to be used in the inspection processing sequence and the times to be used by the devices, and creating a plan for the inspection processing sequence including the selected devices and times; the inspection management system causes the inspection system to execute the inspection process sequence of the inspection based on the plan; the first type device performs a processing operation to form the thin section on the sample; the first type device or the second type device performs a processing operation of removing the thin piece formed on the sample and transferring it to the carrier; the third type device performs a processing operation to observe the thin section mounted on the carrier; the inspection management system holds performance information of the results of the inspection process sequence executed based on the plan; creating the plan for a new inspection based on the performance information; the inspection management system calculates an index value of a processing time or a processing capacity for each of the devices based on a result of the inspection processing sequence executed based on the plan; creating said plan for a new examination based on said index value; The first type device or the second type device monitors the status of the processing operation of transferring the flakes to the carrier; The inspection management system calculates an index value of the processing time or processing capacity of the processing operation of transferring the thin piece to the carrier by the first type device or the second type device based on the monitor. Inspection management system.

22. 2. The inspection management system according to claim 1, The monitor captures an image of the slice during the processing operation using an imaging mechanism provided in the first type device or the second type device, and makes a judgment from the captured image. Inspection management system.

23. 23. The inspection management system according to claim 22, The determination based on the captured image includes determining that the processing operation has failed when the slice cannot be confirmed in the image. Inspection management system.

24. 2. The inspection management system according to claim 1, The monitor detects the falling or breakage of the flakes during the processing operation by a sensor device provided in the first type apparatus or the second type apparatus. Inspection management system.

25. 22. The inspection management system according to claim 21, The examination management system creates one or more proposed plans as the plan based on the set policy, displays the created proposed plans on a screen for the user, and determines the proposed plan selected on the screen based on an operation by the user as the plan; A policy for creating the plan can be selected to prioritize processing capacity, and when the priority is selected, a device having a high index value of the processing time or processing capacity is selected from the plurality of devices. Inspection management system.

26. 22. The inspection management system according to claim 21, the inspection management system formulates a maintenance plan for each of the devices based on a result of the inspection process sequence executed based on the plan; The device whose index value has decreased is designated as a candidate for maintenance, and the maintenance plan is created by setting the idle time of the device as the maintenance time. Inspection management system.

27. 2. The inspection management system according to claim 1, determining a change in the success rate for the processing operation of the device before and after the maintenance work on the device, and outputting information relating to a correlation between the maintenance work and the success rate; Inspection management system.

28. 22. The inspection management system according to claim 21, determining a change in the index value of the processing time or processing capacity for the processing operation of the device before and after the maintenance work on the device, and outputting information relating to the correlation between the maintenance work and the index value; Inspection management system.