Transfer method, substrate, and repair method

Abstract

The present invention is a transfer method for using laser to transfer a plurality of objects to a target substrate from a start substrate, the transfer method comprising a transfer step for transferring the plurality of objects by means of the laser via a first optical system to the destination substrate from the start substrate, wherein: in the transfer step, the transfer is performed so that a surplus object, which is not transferred but remains on the start substrate, can be obtained; after the transfer step, it is determined in advance whether an object-missing spot is included on the target substrate; and when the object-missing spot is included, a repair step is added for transferring the surplus object to the object-missing spot by irradiating the surplus object on the start substrate with laser via a second optical system. Accordingly, a transfer method capable of transferring objects at high yield can be provided.

Description

Transfer method, substrate, and repair method

[0001] The present invention relates to a transfer method, a substrate, and a repair method.

[0002] With the commercialization of high-brightness blue light-emitting diodes, the three primary colors of light are now available, and light-emitting diodes (hereinafter referred to as LEDs) are now used in a wide variety of fields.Their applications are countless, from television and computer displays and monitors to large displays such as street-corner digital signage and large screens at live music venues, and even small displays such as those used in smartwatches.

[0003] In the mass production process of displays, a technique is used in which LED chips formed on a starting substrate are transferred to a circuit board. Figures 11 to 13 show a part of an example of a manufacturing flow of an LED chip-mounted device, including the transfer process. However, the manufacturing flow to which the transfer device and transfer method of the present invention are applied is not limited to the manufacturing flow shown in Figures 11 to 13.

[0004] 11A, a starting substrate, for example, a sapphire substrate 110, is prepared. On the surface of the sapphire substrate 110, a plurality of LED chips 6, which are the objects to be transferred, are provided.

[0005] When the plurality of LED chips 6 includes a defective LED chip 6D, as shown in FIG. 11(b), a laser beam L transmitted through the sapphire substrate 110 is incident on the interface between the defective LED chip 6D and the sapphire substrate 110. T The laser light source 3 irradiates the rear surface of the sapphire substrate 110 (the rear surface opposite to the surface on which the LED chips 6 are provided) to peel off and remove the defective LED chips 6 from the sapphire substrate 110. This process can be called, for example, a trimming process. Note that if there are no defective LED chips 6D, this trimming process can be omitted.

[0006] Next, a first intermediate substrate 210, which is a target substrate shown in Fig. 11(c), is prepared. The first intermediate substrate 210 has an adhesive layer 211 on its surface. This first intermediate substrate 210 and the sapphire substrate 110, which has been subjected to a trimming process as necessary, are placed face to face with the LED chip 6 and adhesive layer 211. In this state, a laser beam L is emitted from the laser light source 3 to the rear surface of the sapphire substrate 110. Ｌ The laser irradiation is performed while the laser light source 3, the sapphire substrate 110, and the first intermediate substrate 210 are moved relative to each other. This allows the plurality of LED chips 6 to be sequentially irradiated. As a result, the plurality of LED chips 6 are irradiated with the laser L from the sapphire substrate 110 to the first intermediate substrate 210. Ｌ This process can be called, for example, a laser lift-off process.

[0007] Ga may remain on the surface of each of the LED chips 6 transferred to the first intermediate substrate 210. Therefore, Ga cleaning is performed in a cleaning layer 60, as shown in FIG.

[0008] Next, a second intermediate substrate (release substrate) 120 is prepared, as shown in the lower right of FIG. 12( e). The second intermediate substrate 120 has an adhesive layer 121 on its surface. The first intermediate substrate 210 and the second intermediate substrate 120 are bonded together so that the LED chips 6 contact the adhesive layer 121 of the second intermediate substrate 120 to form a composite 300. This composite 300 is then pressed vertically using a transfer device 20 shown in the upper left of FIG. 12( e). Next, as shown in the lower right of FIG. 12( e), the first intermediate substrate 210 is peeled off while the second intermediate substrate 120 is held down by a holding device 30. This completes the transfer of the LED chips 6 from the first intermediate substrate 210 to the second intermediate substrate 120. This process can be referred to as a chip transfer process.

[0009] If there is a defective LED chip 6D among the LED chips 6 transferred onto the second intermediate substrate 120, the defective LED chip 6D is removed as shown in FIG. 12( f). This step can be performed in the same manner as the trimming step shown in FIG. 11( b). Therefore, this step can also be called a trimming step. Of course, if there is no defective LED chip 6D on the second intermediate substrate 120, this trimming step can be omitted.

[0010] Next, as shown in FIG. 12( g ), the LED chip 6 on the second intermediate substrate 120 as the starting substrate is bonded to the finished substrate 220 (having an adhesive layer 221 on its surface) as the destination substrate by laser L. Ｍ This step can also be called a transfer step.

[0011] The completed substrate 220 may be in the form of a wafer as shown in the lower left of Fig. 12(g) or in the form of a rectangle as shown in the lower right. In this transfer process, the multiple LED chips 6 can be transferred at various pitches.

[0012] If the completed substrate 220 obtained after the transfer process has a missing LED chip 6 (for example, a portion where the defective LED chip 6D removed in the trimming process was to be transferred), as shown in Figure 13(h), the missing LED chip can be replenished with a replenisher chip 6R' from a repair substrate 130 having a normal replenisher chip 6R' as the starting substrate to the portion of the completed substrate 220 as the destination substrate. This process can also be called a repair process.

[0013] Next, as shown in FIG. 13( i ), a mounter 400 is used to transfer a plurality of LED chips 6 from the completed substrate 220 obtained as described above onto a circuit substrate 230 .

[0014] Then, as shown in FIG. 13( j ), the circuit board 230 is subjected to a reflow process in a reflow device 40 , whereby the electrodes of the circuit board 230 and the LED chips 6 can be bonded together.

[0015] In the trimming process, laser lift-off process, and repair process, a laser is irradiated onto a portion of the LED chip to ablate it, or a laser is irradiated onto the interface between the starting substrate and the LED chip to ablate the adhesive layer, thereby separating the starting substrate from the LED chip. For example, Patent Document 1 describes the use of a line beam when transferring multiple chips. Furthermore, Patent Document 2 discloses a technology in which a galvanometer scanner is used to irradiate a specific irradiation target with laser light in a retransfer method and a lift-off method.

[0016] JP 2021-61396 A Patent No. 7111916 Specification JP 2023-5499 A

[0017] Mass production involving the transfer of objects also requires an improvement in yield, just as in other mass production processes.

[0018] The present invention has been made to solve the above problems, and aims to provide a transfer method that can transfer objects with a high yield, a substrate that can be used in a repair process to transfer objects with a high yield, and a repair method that can complete the transfer of objects with a high yield.

[0019] In order to solve the above problem, the present invention provides a first aspect of a transfer method for transferring a plurality of objects from a starting substrate to a destination substrate using a laser, the transfer method including a transfer step of transferring the plurality of objects from the starting substrate to the destination substrate by a laser through a first optical system, the transfer step being performed so as to obtain surplus objects that have not been transferred and remain on the starting substrate, and a repair step of determining in advance after the transfer step whether or not the destination substrate includes a portion where the objects are missing, and if a portion where the objects are missing is included, irradiating the laser onto the surplus objects on the starting substrate through a second optical system to transfer the surplus objects to the portion where the objects are missing.

[0020] According to the transfer method of the first aspect of the present invention, the surplus objects remaining in the transfer process that were not transferred in the transfer process can be used in the repair process, thereby enabling the transfer of objects with a high yield. Moreover, according to the transfer method of the first aspect of the present invention, the objects transferred in the transfer process and the surplus objects replenished in the repair process can be from the same production lot, making it possible to construct an aligned chip consisting of objects and surplus objects that are uniform across the entire surface, thereby reducing in-plane variations in product quality. Furthermore, in the repair process, the surplus objects remaining in the first optical system can be used in the repair process in the second optical system without preparing a new starting substrate, thereby enabling the objects on the starting substrate to be effectively utilized.

[0021] It is preferable that the method further includes a trimming step of determining in advance, prior to the transfer step, whether or not the plurality of objects on the starting substrate include any defective objects, and, if any defective objects are included, selectively removing the defective objects using a laser through the second optical system.

[0022] In this preferred embodiment, defective objects can be removed in advance prior to the transfer step, so that only normal objects can be transferred to the destination substrate in the transfer step.

[0023] For example, the transfer process and the repair process can be performed using the same starting substrate without changing the setup, using the same device that has the first optical system and the second optical system and is configured to branch a laser from the same laser light source and irradiate the laser to each of the first optical system and the second optical system.

[0024] The apparatus for carrying out the transfer method of the first aspect of the present invention is not particularly limited, and may be, for example, an apparatus equipped with both the first and second optical systems as described above. Alternatively, an apparatus equipped with the first optical system and an apparatus equipped with a second optical system that is separate from the first optical system may be used.

[0025] In addition, the trimming process and the transporting process may be performed using the same starting substrate without changing the setup, using the same device that is equipped with the first optical system and the second optical system and is configured to branch a laser from the same laser light source and irradiate the laser to each of the first optical system and the second optical system.

[0026] A transfer method of this type allows objects to be transferred with minimal footprint and capital investment, and with high productivity.

[0027] For example, in the transferring step, the object formed in the rectangular region on the starting substrate can be transferred to the destination substrate, and the excess object can be left on the starting substrate.

[0028] The transfer in the transfer step is not particularly limited, but for example, an object formed in a rectangular area may be transferred to a destination substrate.

[0029] The present invention also provides a substrate having a plurality of objects to be used in a repair process, wherein the plurality of objects are present on a surface of the substrate, the surface of the substrate has a first region and a second region in which the plurality of objects have different densities, and the density of the first region is greater than the density of the second region.

[0030] Such a substrate of the present invention can be obtained, for example, by the transfer step of the transfer method of the first aspect of the present invention. By using this substrate of the present invention, for example, in the repair step of the transfer method of the first aspect, objects that are not transferred in the transfer step can be used in the repair step as surplus objects, thereby enabling the transfer of objects with a high yield throughout the transfer method. Alternatively, the substrate of the present invention can also be used in a repair step in which objects are replenished to non-object-mounted locations on a mounting board or circuit board that has multiple objects mounted thereon. Even in such cases, the substrate of the present invention manufactured using the transfer method of the first aspect of the present invention can be reused in the repair step of the mounting board or circuit board, allowing the transfer of objects with a high yield throughout the transfer method. In other words, using the substrate of the present invention in the repair step allows the transfer of objects with a high yield.

[0031] The plurality of objects may not be present in the second region.

[0032] The second region may contain an object, but typically does not contain an object.

[0033] The second region may be larger than the first region.

[0034] The second region may be larger than the first region in which the density of the plurality of objects is higher.

[0035] For example, the second region may have a rectangular planar shape.

[0036] The planar shape of the second region is not particularly limited, but may be, for example, rectangular.

[0037] In this case, for example, the substrate may have a circular planar shape, the first region may have an outer edge that is approximately circular, and the second region may be surrounded by the first region, and in this case, a corner of the rectangular planar shape of the second region may be approximately inscribed in the outer edge of the first region.

[0038] The planar shape of the substrate is not particularly limited, but may be circular. Alternatively, the outer edge of the first region may be substantially circular, and the second region may be surrounded by the first region. In this case, the corners of the rectangular planar shape of the second region may be substantially inscribed in the outer edge of the first region.

[0039] In this case, the distance between the intersection of the diagonals of the rectangular planar shape of the second region and the center of the approximate circle that is the outer edge of the first region may be greater than or equal to 0% and less than 5% of the diameter of the approximate circle.

[0040] The distance between the intersection of the diagonals in the rectangular planar shape of the second region and the center of the approximate circle that is the outer edge of the first region is not particularly limited, but may be, for example, between 0% and 5% of the diameter of the approximate circle.

[0041] The area of ​​the second region may be 60% or more of the total area of ​​the first region and the second region.

[0042] The area of ​​the second region may be 60% or more of the total area of ​​the first region and the second region, or may be less than 60%.

[0043] For example, the planar shape of the second area may be a quadrangle including a square, which allows the object to be transported efficiently and at high speed in the second area.

[0044] Alternatively, the planar shape of the second region may have a pair of long sides and a pair of short sides, and the ratio of the length of the short sides to the length of the long sides may be equal to or greater than 0.7 and less than 1.0.

[0045] The shape of the second region is not particularly limited.

[0046] For example, the plurality of objects may be present in the first area in a matrix form.

[0047] The arrangement of the multiple objects present in the first area is not particularly limited, but may be, for example, in a matrix.

[0048] Typically, the second region is provided at least in the inner portion of the substrate excluding the outer edge portion.

[0049] The second region is typically provided in the inner portion of the substrate excluding the outer edge portion.

[0050] The second region may have a plurality of portions, each of which does not include the plurality of objects.

[0051] In the substrate of the present invention, the second region may be a continuous region, but may also have a plurality of portions each of which does not include an object.

[0052] Typically, the second area is large enough to accommodate a plurality of other objects arranged in a matrix.

[0053] The second region is typically large enough to accommodate a matrix of a plurality of other objects, rather than the gaps between the plurality of objects arranged in a matrix.

[0054] The present invention also provides a repair method for transferring an object from a first substrate to a non-object-mounted location on a second substrate, in which a substrate of the present invention is used as the first substrate, and one or more objects of the plurality of objects in the first region are transferred to the non-object-mounted location on the second substrate using a laser.

[0055] In such a repair method, the substrate of the present invention is used, so that the transfer of the object can be completed with a high yield.

[0056] The second substrate has an object mounting area where a first group of multiple objects was present and an object non-mounting area where no objects are present, and it is preferable that the first group of multiple objects on the second substrate and the multiple objects in the first region of the first substrate originate from the same starting substrate.

[0057] This repair method can more reliably increase the transfer yield. Moreover, by using such a substrate, the objects transferred in the transfer process and the surplus objects replenished in the repair process can be from the same production lot, making it possible to construct an aligned chip consisting of objects and surplus objects that are uniform across the entire surface, thereby reducing in-plane variations in product quality.

[0058] The present invention also provides a second aspect of the transfer method, which is a transfer method for transferring an object to be transferred from a first substrate to a second substrate using a laser, wherein the first substrate has a plurality of objects including the object to be transferred, the plurality of objects being present on a surface of the first substrate, the surface of the first substrate having a first region and a second region in which the plurality of objects have different existence densities, the existence density in the first region being greater than the existence density in the second region, and the object to be transferred being present in the first region.

[0059] With the transfer method of the second aspect of the present invention, for example, objects that are not transferred during the transfer process can be used as surplus objects, so that the transfer method as a whole can achieve a high yield of object transfer.

[0060] For example, a substrate having a non-object mounting area can be used as the second substrate, and the object to be transferred can be replenished by transferring it from the first substrate to the non-object mounting area of ​​the second substrate.

[0061] In this way, for example, objects that remain untransferred in the transfer step can be used in the repair step as surplus objects, so that the transfer method as a whole can achieve transfer with a high yield.

[0062] The present invention also provides a third aspect of a transfer method, which is a transfer method for transferring a plurality of objects present on a first substrate to a second substrate, wherein the plurality of objects on the first substrate are the remains after defective objects have been removed in advance, and the plurality of objects are transferred from the first substrate to the second substrate such that the portions of the second substrate to which the removed defective objects were intended to be transferred become object-missing locations.

[0063] The transfer method of the third aspect of the present invention can prevent the transfer of defective objects, thereby achieving a high yield. Furthermore, instead of performing a repair process after each trimming, the transfer process is performed together with other objects, assuming that an object exists in the location where the defective object was removed. This allows the repair process to be performed at a subsequent, convenient timing in the process. In particular, when an object is transferred multiple times, it may be transferred after undergoing a trimming process and a repair process. This may result in a defect, and repeating the trimming and repair processes each time a defect occurs is inefficient. In such cases, the repair process is not performed immediately after the trimming process, but is instead performed so that the object becomes a defective location, and the trimming process is performed as needed. Furthermore, the efficiency of the repair process can be improved by performing a trimming process as needed for each subsequent transfer process, and then performing the repair process all at once near the final stage.

[0064] Furthermore, the present invention provides a fourth aspect of a transfer method, which comprises a trimming step of removing defective objects from a first substrate on which a plurality of objects exist, and a transfer step of transferring objects other than the removed defective objects to a second substrate, wherein in the transfer step, the objects other than the removed defective objects are transferred to the second substrate so that the portion to which the removed defective objects were intended to be transferred becomes an object missing portion.

[0065] The transfer method according to the fourth aspect of the present invention can prevent the transfer of defective objects, thereby achieving a high yield rate. Furthermore, instead of performing a repair process after each trimming, the transfer process is performed together with other objects, assuming that an object exists in the location where the defective object was removed. This allows the repair process to be performed at a convenient timing in the process. In particular, when an object is transferred multiple times, it may be transferred after undergoing a trimming process and a repair process. During this process, there is a possibility that some kind of defect may occur. Repeating the trimming and repair processes each time a defect occurs is inefficient. In such cases, the repair process is not performed immediately after the trimming process, but is instead performed so that the object becomes a defective location, and trimming is performed as needed. Furthermore, the efficiency of the repair process can be improved by performing a trimming process as needed during each subsequent transfer process, followed by a repair process performed all at once near the final stage.

[0066] The transfer method of the third or fourth aspect may further include, for example, a repair step of replenishing a replenishment object at the missing portion of the object.

[0067] In this case, the plurality of objects on the first substrate and the supplementary object may originate from the same starting substrate.

[0068] In a transfer method including such a repair process, the starting substrate used in creating the first substrate can also be used in the repair process, thereby achieving a higher transfer yield. Moreover, by using such a substrate, the objects transferred in the transfer process and the surplus objects replenished in the repair process can be from the same production lot, making it possible to construct an aligned chip consisting of objects and surplus objects that are uniform across the entire surface, thereby reducing in-plane variation in product quality.

[0069] The present invention also provides a fifth aspect of a transfer method for transferring a plurality of objects from a first substrate to a second substrate using a laser, the transfer method including a transfer step of transferring the plurality of objects from the first substrate to the second substrate by a laser through a first optical system, the transfer step being performed so as to obtain surplus objects that have not been transferred and remain on the first substrate, and a repair step of determining in advance after the transfer step whether or not the second substrate includes a portion where the objects are missing, and if a portion where the objects are missing is included, irradiating the laser onto the surplus objects on the first substrate through a second optical system to transfer the surplus objects to the portion where the objects are missing.

[0070] According to the transfer method of the fifth aspect of the present invention, the surplus objects remaining in the transfer process that were not transferred in the transfer process can be used in the repair process, thereby enabling the transfer of objects with a high yield. Moreover, according to the transfer method of the fifth aspect of the present invention, the objects transferred in the transfer process and the surplus objects replenished in the repair process can be from the same production lot, making it possible to construct an aligned chip consisting of uniform objects and surplus objects across the entire surface, thereby reducing in-plane variations in product quality. Furthermore, in the repair process, the surplus objects remaining in the first optical system can be used in the repair process in the second optical system without preparing a new starting substrate, thereby enabling the objects on the starting substrate to be effectively utilized.

[0071] As described above, the transfer method of the first aspect of the present invention allows for the transfer of objects with a high yield. Moreover, the transfer method of the first aspect of the present invention allows for the objects transferred in the transfer process and the surplus objects replenished in the repair process to be from the same production lot, making it possible to construct an aligned chip consisting of objects and surplus objects that are uniform across the entire surface, thereby reducing in-plane variations in product quality. Furthermore, in the repair process, the surplus objects remaining through the first optical system can be used to perform the repair process in the second optical system without preparing a new starting substrate, allowing for effective use of the objects on the starting substrate.

[0072] Furthermore, by using the substrate of the present invention in, for example, the repair step of the transfer method of the first aspect, objects that remain untransferred in the transfer step can be reused in the repair step as surplus objects, allowing objects to be transferred with a high overall yield. Alternatively, the substrate of the present invention can also be used in a repair step in which objects are replenished to non-object-mounted locations on a mounting board or circuit board that has multiple objects mounted thereon. Even in such cases, the substrate of the present invention manufactured using the transfer method of the first aspect of the present invention can be reused in the repair step of the mounting board or circuit board, allowing objects to be transferred with a high overall yield through the transfer method. In other words, using the substrate of the present invention in the repair step can increase the yield of the repair step, which allows objects to be transferred with a high yield.

[0073] Furthermore, the transfer method according to the second aspect of the present invention can achieve transfer with a high yield.

[0074] Furthermore, the transfer method according to the third aspect of the present invention can achieve transfer with a high yield.

[0075] Furthermore, the transfer method according to the fourth aspect of the present invention can achieve transfer with a high yield.

[0076] Furthermore, the transfer method according to the fifth aspect of the present invention can achieve transfer with a high yield.

[0077] FIG. 1 is a flow diagram showing an example of a transfer method according to the first aspect of the present invention. FIG. 1 is a block diagram of an example of a transfer system capable of implementing the transfer method according to the first aspect of the present invention. FIG. 2 is a schematic diagram for explaining a transfer step in the transfer method according to the first aspect of the present invention. FIG. 3 is another schematic diagram for explaining the transfer step in the transfer method according to the first aspect of the present invention. FIG. 4 is a still another schematic diagram for explaining the transfer step in the transfer method according to the first aspect of the present invention. FIG. 5 is a schematic perspective view of a starting substrate after a transfer step in the transfer method according to the first aspect of the present invention. FIG. 6 is a schematic diagram for explaining a repair step in the transfer method according to the first aspect of the present invention. FIG. 7 is another schematic diagram for explaining the repair step in the transfer method according to the first aspect of the present invention. FIG. 8 is a schematic diagram for explaining an example of a trimming step that can be performed in the transfer method according to the first aspect of the present invention. FIG. 9 is a block diagram of an example of a transfer apparatus capable of implementing the transfer method according to the first aspect of the present invention. FIG. 11 is a part of a manufacturing flow diagram of an example of an LED chip-mounted device, subsequent to FIG. 11 . FIG. 12 is a part of a manufacturing flow diagram of an example of an LED chip-mounted device, subsequent to FIG. 13 . FIG. 14 is a schematic diagram showing a first example of a substrate according to the present invention. 15 is a schematic enlarged view of a portion 101a of the substrate shown in Figure 14. 16 is a schematic enlarged view of a portion 102s of the substrate shown in Figure 14. 17 is a schematic view showing a second example of a substrate according to the present invention. 18 is a schematic view showing a third example of a substrate according to the present invention. 19 is a schematic view showing a fourth example of a substrate according to the present invention. 20 is a schematic view showing a fifth example of a substrate according to the present invention. 21 is a schematic view showing a sixth example of a substrate according to the present invention. 22 is a schematic view showing a seventh example of a substrate according to the present invention. 23 is a schematic view showing an eighth example of a substrate according to the present invention. 24 is a schematic view showing a ninth example of a substrate according to the present invention. 25 is a schematic view showing a tenth example of a substrate according to the present invention. 26 is a schematic view showing an eleventh example of a substrate according to the present invention. 27 is a schematic view showing a twelfth example of a substrate according to the present invention. 28 is a schematic view showing a thirteenth example of a substrate according to the present invention. 29 is a schematic view showing a fourteenth example of a substrate according to the present invention. 30 is a schematic view showing a fifteenth example of a substrate according to the present invention. 31 is a schematic view showing a sixteenth example of a substrate according to the present invention. 32 is a schematic view showing a seventeenth example of a substrate according to the present invention. 33 is a schematic view showing an eighteenth example of a substrate according to the present invention.It is a schematic diagram showing a 19th example of a substrate according to the present invention. It is a schematic diagram showing a 20th example of a substrate according to the present invention. It is a schematic diagram showing a 21st example of a substrate according to the present invention. It is an explanatory diagram of an example of a repair method of the present invention.

[0078] As described above, there has been a demand for the development of a transfer method that can transfer objects with a high yield.

[0079] As a result of extensive research into the above-mentioned problems, the inventors discovered that objects can be transferred with a high yield by transferring surplus objects that were not transferred in the transfer process to the location where the object is missing in the repair process, and thus completed the present invention.

[0080] The present inventors have also found that if a substrate obtained in the above-described transfer process is used in a repair process, the object can be transferred with a high yield, and have completed the present invention.

[0081] That is, a first aspect of the transfer method according to the present invention is a transfer method for transferring a plurality of objects from a starting substrate to a destination substrate using a laser, comprising: a transfer step of transferring the plurality of objects from the starting substrate to the destination substrate by a laser through a first optical system; in the transfer step, the transfer is performed so as to obtain surplus objects that remain on the starting substrate without being transferred; and after the transfer step, it is determined in advance whether or not the destination substrate includes a portion where the objects are missing, and if a portion where the objects are missing is included, the transfer method further comprises a repair step of irradiating the laser onto the surplus objects on the starting substrate through a second optical system, and transferring the surplus objects to the portion where the objects are missing.

[0082] The substrate of the present invention is also a substrate having a plurality of objects to be used in a repair process, wherein the plurality of objects are present on a surface of the substrate, the surface of the substrate has a first region and a second region in which the presence densities of the plurality of objects are different from each other, and the presence density of the first region is greater than the presence density of the second region.

[0083] The present invention will be described in detail below, but the present invention is not limited thereto.

[0084] In the present invention, the transfer yield is the quotient obtained by dividing the number of non-defective objects transferred to the destination substrate by the number of non-defective objects on the starting substrate.

[0085] [First Aspect] A transfer method according to a first aspect of the present invention is a transfer method for transferring a plurality of objects from a starting substrate to a destination substrate using a laser.

[0086] 1 shows a flow chart of an example of a transfer method according to a first aspect of the present invention. The transfer method includes a transfer step and a repair step after the transfer step. The transfer method according to the first aspect of the present invention may include a trimming step before the transfer step, but the trimming step is an optional step in the transfer method according to the first aspect of the present invention.

[0087] The apparatus and system capable of implementing the transfer method of the first aspect of the present invention are not particularly limited. The transfer method of the first aspect of the present invention can be implemented using, for example, the transfer system 10 shown in Fig. 2, but can also be implemented in other apparatuses or systems.

[0088] The transfer system 10 shown in FIG. 2 includes a first optical system 1, a second optical system 2, and a laser light source 3. １ and 3 ２ and a determination mechanism 5.

[0089] The first optical system 1 includes a laser light source 3 １ Laser L from １ The first optical system 1 is arranged to receive a laser L １ Along the optical path of the laser light source 3, a homogenizer, a mask, a projection lens, and a stage may be provided. １ Laser L emitted from １ The mask is configured to homogenize the intensity distribution of the laser L. １The first optical system 1 has a pattern for shaping the irradiation shape of the starting substrate into a desired shape. The stage is configured to hold the starting substrate and the target substrate. The projection lens is configured to focus the laser on an irradiation target on the starting substrate on the stage. Note that the configuration of the first optical system 1 is not limited to these.

[0090] The second optical system 2 includes a laser light source 3 ２ Laser L from ２ The second optical system 2 is arranged to receive a laser L ２ Along the optical path of the first optical system 1, a homogenizer, an aperture, a galvanometer scanner, a mask, a projection lens, and a stage are provided. The aperture is for forming a laser beam of a size that allows the galvanometer scanner to operate properly. The stage is configured to hold the starting substrate and / or the destination substrate. The other members are the same as those of the first optical system 1. However, the configuration of the second optical system 2 is not limited to these.

[0091] The first optical system 1, the determination mechanism 5, and the second optical system 2 are connected to each other by a transport mechanism T, which is configured to transport a starting substrate and / or a destination substrate (not shown in Figure 2) between them.

[0092] Hereinafter, each step in the transfer method according to the first aspect of the present invention will be described in more detail with reference to an example using the transfer system 10 of FIG.

[0093] (Transfer Step) As shown in FIG. 3, the transfer step is performed by transferring a plurality of objects 6 from a starting substrate 100 to a destination substrate 200 using a laser L １ This step corresponds to the laser lift-off step described above with reference to FIG.

[0094] In the transfer step, for example, as shown in FIG. １ Laser L from １ Alternatively, the light may be irradiated sequentially onto each of the plurality of objects from the rear surface side of the starting substrate 100 .

[0095] Alternatively, as shown in FIGS. 4 and 5, a laser L １ The laser beam L having a line-shaped irradiation shape may be irradiated onto the plurality of objects 6 from the rear side of the starting substrate 100, so that the plurality of objects 6 may be simultaneously transferred onto the surface of the destination substrate 200. １ 5 is an example in which a laser beam L having a rectangular irradiation shape is irradiated onto a plurality of objects 6 (1×m (m>2)) arranged in a line. １ In this example, the light is irradiated onto a plurality of objects 6 (n×m (n>2, m>2)) arranged in a plurality of columns and a plurality of rows. The irradiation shape can be appropriately changed by, for example, a mask (not shown) included in the first optical system 1.

[0096] In the transfer step of the transfer method of the first aspect of the present invention, the transfer is performed so as to obtain surplus objects 6R that remain on the starting substrate 100 without being transferred, as shown in Fig. 6. For example, the objects 6 formed in a rectangular region on the starting substrate 100 can be transferred to the destination substrate 200, leaving surplus objects 6R in the rectangular region on the starting substrate 100 as shown in Fig. 6, but the manner in which the surplus objects 6R are left is not particularly limited.

[0097] (Repair Process) In the repair process, after the transfer process, it is determined in advance whether or not there is a missing part of the object 6 on the destination substrate 200, and if there is a missing part of the object 6, a laser L is applied to the surplus object 6R on the starting substrate 100 through the second optical system 2. ２ This is a process of irradiating the object 6 with light and transferring the surplus object 6R to the location where the object 6 is missing.

[0098] 7 shows an example of determining whether or not a portion where the object 6 is missing is included on the target substrate 200. However, the means for making the determination in the repair process is not limited to the means shown in FIG.

[0099] In FIG. 7, in the determination mechanism 5 shown in FIG. 2, the detection laser L Ｄ 10 shows an example in which a missing portion 6S of an object 6 is optically detected using the above.

[0100] If it is determined that the object 6 includes a missing portion 6S, for example, as shown in FIG. 8, the laser light source 3２ irradiating the surplus object 6R of the starting substrate 100 with a laser beam L through the second optical system 2. ２ The laser beam is irradiated to transfer the surplus object 6R to the location 6S where the object 6 on the target substrate 200 is missing.

[0101] In this way, by replenishing the surplus objects 6R remaining after the transfer step in the location 6S, some of the surplus objects 6R remaining on the starting substrate 100 after the transfer step can be used without being wasted. This increases the utilization efficiency of non-defective objects 6 on the starting substrate. In other words, according to the transfer method of the first aspect of the present invention, the objects 6 can be transferred with a high yield.

[0102] Furthermore, the object 6 transferred in the transfer step and the surplus object 6R to be replenished in the repair step are derived from the same starting substrate 100, that is, they can be from the same production lot.

[0103] 11(a) and 13(h), the target 6 supplied in the laser lift-off process and the replenishment chips 6R' supplied in the repair process are supplied from different substrates. In such a case, the target 6 supplied in the transfer process and the replenishment chips 6R' supplied in the repair process are from different chip production lots, which can cause unevenness such as partial light emission.

[0104] On the other hand, in the transfer method of the first aspect of the present invention, the object 6 transferred in the transfer process and the surplus object 6R replenished in the repair process can be from the same production lot, making it possible to construct an aligned chip consisting of objects 6 and surplus objects 6R that are uniform across the entire surface.

[0105] The target substrate 200 to be subjected to the repair process is not particularly limited as long as it is a substrate after the transfer process. For example, the target substrate 200 may be the first intermediate substrate 210 immediately after the object 6 is transferred in the transfer process shown in FIG. 11(c), the second intermediate substrate (release substrate) 120 shown in the lower right of FIG. 12(e) and FIG. 12(f), or the finished substrate 220 shown in FIG. 12(g), FIG. 13(h), and FIG. 13(i). The transfer method of the first aspect of the present invention allows the target substrate 200 after the transfer process to be repaired as needed. Even when multiple transfer processes are performed, the trimming and repair processes can be omitted for each transfer process, thereby increasing productivity. This method is particularly suitable for processes having approximately two to five transfer processes.

[0106] As the starting substrate 100 used in the transfer step and the repair step, for example, a sapphire substrate 110 shown in FIG. 11(a) can be used.

[0107] (Trimming Step) In the optional trimming step shown in FIG. 1, prior to the transfer step, it is determined in advance whether or not any defective object is included among the plurality of objects 6 on the starting substrate 100, and if any defective object is included, the laser L ２ This step corresponds to the trimming step shown in FIG.

[0108] More specifically, whether or not any of the objects 6 on the starting substrate 100 are defective is determined using, for example, the determination mechanism 5. The determination may be made optically using the tester 51 as described above, or by other means.

[0109] Next, as shown in FIG. 9, for example, a defective object 6D is projected onto a laser light source 3 through a second optical system 2. ２ Laser L from ２ selectively removed by

[0110] In this way, it is possible to prevent defective objects 6D from being transferred to the destination substrate 200.

[0111] In the transfer process, the portion of the target substrate 200 facing the portion of the starting substrate 100 where the defective object 6D was located becomes a portion 6S where the object 6 is missing. In the repair process, a surplus object 6R can be transferred to this portion 6S.

[0112] Alternatively, the trimming step prior to the transfer step may not be performed, and in the transfer step, all of the objects 6 on the target substrate 100 that are to be transferred to the target substrate 200 may be transferred to the target substrate 200. In this case, a trimming step similar to the trimming step described above with reference to Figure 12(f) can be performed to remove defective objects 6D, and the portions where the removed defective objects 6D were located become portions 6S where the objects 6 are missing.

[0113] The above describes an example in which the transport system 10 shown in FIG. 2 is used, in which the first optical system 1 and the second optical system 2 are separate devices. However, the transport method of the first aspect according to the present invention can also be performed using a single device equipped with the first optical system 1 and the second optical system 2.

[0114] FIG. 10 shows a block diagram of an example of a transfer device capable of implementing the transfer method according to the first aspect of the present invention.

[0115] The transfer device 10′ shown in FIG. 10 includes a first optical system 1 and a second optical system 2, and splits a laser L from the same laser light source 3 to provide the laser L to the first optical system 1 and the second optical system 2, respectively. １ or L ２ The device is configured to irradiate the

[0116] The transfer device 10' shown in FIG. 10 will now be described in more detail.

[0117] The transfer device 10' shown in FIG. 10 includes a first optical system 1, a second optical system 2, a laser light source 3, a determination mechanism 5, a controller 4, a homogenizer 31, a plurality of mirrors M, and a transport mechanism T.

[0118] The first optical system 1 and the second optical system 2 are similar to the optical systems described with reference to FIG. 2, except that they do not include a homogenizer.

[0119] The homogenizer 31 is configured to homogenize the intensity distribution of the laser beam L emitted from the laser light source 3 .

[0120] One of the mirrors M, Mm, is movable, and the controller 4 can switch the optical path of the laser L from the laser light source 3 between the optical path to the first optical system 1 and the optical path to the second optical system 2. The other mirrors are １ and L ２ This forms the alignment for the optical path.

[0121] The transport mechanism T and the determination mechanism 5 are the same as those shown in FIG.

[0122] By using such an apparatus, the transfer process and repair process described above can be performed using the same starting substrate 100 without changing the setup. This allows the transfer process and repair process to be performed without changing the setup, which has traditionally been a cause of reduced productivity and variations between processes depending on the accuracy of alignment adjustment. Therefore, productivity can be increased and variations between processes can be suppressed. Furthermore, by using only one laser light source 3, capital investment, maintenance costs, and the system footprint can be reduced.

[0123] Furthermore, by using such an apparatus, when a trimming process is performed, the trimming process and the transfer process can be performed using the same starting substrate 100 without changing the setup. In this way, for the same reasons as above, productivity can be increased and variations between processes can be suppressed. Furthermore, by using only one laser light source 3, capital investment, maintenance costs, and the system footprint can be reduced.

[0124] As a variant, the transfer device 10′ may include a common projection lens and mask that are transported between the first optical system 1 and the second optical system 2 by the transport mechanism M, and a stage that is transported between the first optical system 1, the second optical system 2, and the determination mechanism 5 by the transport mechanism M. The projection lens, mask, and transport mechanism M may be similar to those described in FIG. 2 . Alternatively, the transfer device 10′ may include a mask that has both a pattern for the first optical system 1 and a pattern for the second optical system 2.

[0125] The object 6 to be transferred by the transfer device of the present invention is not particularly limited. The transfer device of the present invention can be used to transfer LED chips such as μ-LEDs, for example.

[0126] [Substrate] A first example of the substrate of the present invention is shown in Fig. 14. An enlarged view of a portion 101a of the substrate shown in Fig. 14 is shown in Fig. 15, and an enlarged view of a portion 102s is shown in Fig. 16.

[0127] The substrate 1000 shown in Fig. 14 has a plurality of objects 6R shown in Fig. 15 for use in a repair process. The plurality of objects 6R are present on the surface of the substrate 1000. The surface of the substrate 1000 has a first region 101 and a second region 102. The first region 101 and the second region 102 have different densities of the plurality of objects 6R. More specifically, the density of the objects 6R in the first region 101 is greater than the density of the objects 6R in the second region 102.

[0128] Although not limited thereto, such a substrate 1000 can be obtained by performing the transfer step in the transfer method of the first aspect of the present invention described above in such a way that surplus objects remaining on the starting substrate without being transferred are obtained. That is, the starting substrate 100 shown in FIG. 6 is an example of the substrate 1000 of the present invention. By using this substrate 1000 in the repair step of the transfer method of the first aspect of the present invention, the objects 6R remaining in the transfer step can be used as surplus objects in the repair step, thereby enabling the transfer of the objects 6 and 6R with a high yield throughout the transfer method. Alternatively, the substrate 1000 of the present invention can also be used in a repair step in which objects are replenished to non-object-mounted locations on a mounting board or circuit board that already has multiple objects 6R mounted thereon. Even in such cases, the substrate 1000 of the present invention manufactured using the transfer method of the first aspect of the present invention can be reused in the repair step of the mounting board or circuit board, thereby enabling the transfer of the objects 6 and 6R with a high yield throughout the transfer method. That is, if the substrate 1000 of the present invention is used in a repair process, the object can be transferred with a high yield.

[0129] 2 of Patent Document 3 shows an LED chip forming substrate in which one LED chip is formed on a small, individually divided, rectangular planar substrate. However, the substrate 1000 of the present invention differs from the LED chip forming substrate described in Patent Document 3 in that it has multiple objects 6.

[0130] 14 to 16 will be described in more detail below. However, the matters described below are matters relating to the substrate 1000 of the first example, and the substrate of the present invention is not limited to the matters described below.

[0131] The substrate 1000 has a circular surface shape, for example, as shown in Fig. 14. However, the planar shape of the substrate 1000 according to the present invention is not limited to a circular shape.

[0132] The substrate 1000 of the first example further has an outer edge portion 103. No object is present in the outer edge portion 103. In the substrate 1000 of the first example, the second region 102 is provided at least in the inner portion excluding the outer edge portion 103 of the substrate 1000. However, the substrate 1000 of the present invention does not need to have a portion of the outer edge where no object is present, as shown in FIG. 17 , for example. The width of the outer edge portion 103 is preferably 10% or less of the radius of the substrate 1000, and more preferably 5% or less.

[0133] The object 6R shown in FIG. 15, that is, the object to be transferred, is not particularly limited, but may be, for example, an LED chip such as a μ-LED, or may be any other microelectronic component.

[0134] As shown in Figure 14, the first region 101 has a circular outer edge 101c when viewed macroscopically. However, if the object 6R is a chip, for example, the outer edge 101c of the first region is not a perfect curve but has multiple corners, as shown in Figure 15. In the present invention, the concept of a shape formed by the outer edge 101c having multiple corners as shown in Figure 15, including circles and ellipses, is expressed as "approximately circular." That is, in the substrate 1000, the first region 101 has an outer edge 101c that is approximately circular.

[0135] In the first region 101, a plurality of objects 6R are present in a matrix pattern as shown in Fig. 15. In the example shown in Fig. 15, the plurality of objects 6R are arranged in a matrix pattern with gaps 6A between them.

[0136] In the substrate 1000 shown in Figures 14 to 16, the second region 102 does not contain multiple objects. Specifically, the second region 102 is the region after multiple objects 6 have been transferred from multiple locations 102s indicated by dotted lines in Figure 16 by the transfer step of the transfer method of the first aspect of the present invention described above. Therefore, the second region 102 is large enough to accommodate multiple other objects 6 in a matrix arrangement, as indicated by dotted lines in Figure 16. Although there are no particular limitations, the second region 102 may be large enough to accommodate a matrix arrangement of hundreds to tens of thousands of objects. Furthermore, the second region 102 is clearly different from the gaps 6A between multiple objects 6R present in a matrix arrangement, as shown in Figure 15.

[0137] In the substrate 1000, the second region 102 has a rectangular planar shape. More specifically, the second region 102 is square. In such a substrate 1000, as shown in FIG. 14 , the corners of the rectangular planar shape of the second region 102 can be approximately inscribed in the outer edge 101c of the first region 101. This can reduce the area of ​​the first region 101, for example, the number of surplus objects remaining in the transfer process. This also allows the objects to be transferred efficiently and at high speed in the second region.

[0138] However, as in the third example shown in FIG. 18 , the corners of the rectangular planar shape of the second region 102 do not have to be inscribed in the outer edge 101c of the first region 101. The planar shape of the second region 102 may also be rectangular, as in the fourth example shown in FIG. 19 . For example, the planar shape of the second region 102 may have a pair of long sides and a pair of short sides, and the ratio of the length of the short sides to the length of the long sides may be 0.7 or more and less than 1.0. Alternatively, as in the fifth and sixth examples shown in FIGS. 20 and 21 , the area of ​​the first region 101, e.g., the number of surplus objects remaining in the transfer process, may be reduced by using a planar shape that combines rectangles.

[0139] In the substrate 1000 of the first example, the second region 102 is larger than the first region 101. In the present invention, the area of ​​the second region 102 is preferably 60% or more of the total area of ​​the first region 101 and the second region 102. The maximum value of the ratio of the area of ​​the second region 102 to the total area of ​​the first region 101 and the second region 102 is approximately 64% (=2 / π) when the corners of the square planar shape of the second region 102 are inscribed in the outer edge 101c of the first region 101, as in the substrate 1000 of the first example.

[0140] The substrate 1000 of the present invention is, for example, a substrate used in a repair process, and therefore only needs to have the number of objects 6R required for repair. Since the number of objects 6R required for repair is typically not large, the first region 101 can be made smaller than the second region 102. The more objects 6 transferred in the transfer process, the higher the transfer yield, so having a small first region 101 remaining in the transfer process is advantageous in terms of transfer yield.

[0141] Furthermore, in the substrate 1000 of the first example, the distance between the intersection C2 of the diagonals of the rectangular planar shape of the second region 102 and the center C1 of the approximate circle that is the outer edge 101c of the first region 101 is 0% to 5% of the diameter of the approximate circle. More specifically, in the substrate 1000 of the first example, the distance between C1 and C2 is 0, and they are the same.

[0142] The planar shape of the first region 101 can be controlled, for example, by the arrangement of the multiple objects 6 when the starting substrate 100 is fabricated, and the planar shape of the second region 102. The planar shape of the second region 102 can be controlled, for example, by transferring some of the multiple objects 6 from the starting substrate 100 on which the multiple objects 6 are arranged. The transfer of some of the multiple objects 6 may be performed one object 6 at a time, or may be performed by mass transfer in which the multiple objects 6 are transferred simultaneously. The transfer of some of the multiple objects 6 may also be performed by multiple mass transfers.

[0143] In mass transfer, all of the objects 6 in the transfer target area can be transferred, but some of the objects 6R can also be left in the transfer target area, which becomes the second area 102. Therefore, the second area 102 may include the objects 6R as long as their density is lower than that of the first area 101.

[0144] As described above, the first region 101 and the second region 102 in the substrate 1000 of the present invention can be modified in various ways.

[0145] For example, as shown in Fig. 22 as a seventh example, the second region 102 may have a plurality of portions 102A and 102B, each of which does not include a plurality of objects 6R. Between the portions 102A and 102B, there is an intermediate portion 104 that includes the objects 6R.

[0146] Such a seventh example substrate 1000 can be obtained, for example, by transferring multiple objects 6R contained in the first region 101 of the first example substrate 1000 adjacent to each of the four sides of the second region 102.

[0147] Furthermore, for example, when forming the second region 102, the first region 101 may be intentionally increased to break the rectangular planar shape, as in the eighth and ninth examples shown in Figures 23 and 24. In particular, as shown in Figure 24, a portion 104 where the object 6R is present may be left in the center of the substrate 1000.

[0148] Furthermore, for example, when forming the second region 102, multiple portions (e.g., 102a, 102b, ... 102n) each not including multiple objects 6R may be formed, as in the tenth to twelfth examples shown in Figures 25, 26 and 27.

[0149] Furthermore, as in a thirteenth example shown in Fig. 28, the planar shape of the second region 102 may be approximately circular. Such a second region 102 can be formed, for example, by transferring the objects 6 one by one. The thirteenth example shown in Fig. 28 has the advantage that the first region 101 can be made smaller than in the first example.

[0150] Although the above examples show substrate 1000 having a circular planar shape, it may also have a rectangular planar shape, as in the fourteenth and fifteenth examples shown in Figures 29 and 30. Furthermore, for the purpose of fixation and alignment, an orientation flat or a notch may be provided on the circular substrate, and the corners of the rectangle may be chamfered.

[0151] For example, as shown in FIG. 29, by making the planar shape of the second region 102 similar to the planar shape of the substrate 1000, the size of the first region 101 can be reduced.

[0152] For example, if multiple objects 6 are transferred one by one, the planar shape of the second region 102 can be circular or rectangular as described above, or even a shape that is a variation of these, or it can be designed as appropriate, such as a polygon with pentagons or more sides, or a polygon with quadrangles or more sides with some or all of the sides changed to curves.

[0153] Although it is an extreme example, for example, as in the 16th to 21st examples shown in Figures 31 to 36, respectively, it is also possible to leave only a small portion of the first region 101 and use the rest as the second region 102. The substrate 1000 in these examples is also included in the substrate 1000 of the present invention.

[0154] [Another aspect of the substrate] In another aspect, the substrate of the present invention described above is a substrate having a plurality of objects to be used in a repair process, the plurality of objects being arranged in a matrix on the surface of the substrate, and the surface of the substrate having an area large enough to allow the plurality of objects to be arranged in a matrix, with no objects being arranged in the area.

[0155] 14 to 16 again, in the substrate 1000, a plurality of objects 6R are arranged on the surface of the substrate 1000 in a matrix of, for example, 2 x 2 or more as shown in FIG. 15. Although there are no particular limitations, the size may be large enough to arrange hundreds to tens of thousands of objects in a matrix. The surface of the substrate 1000 also has an area 102 large enough to arrange a plurality of objects 6 shown in FIG. 16 in a matrix. No objects 6 are arranged in the area 102.

[0156] The substrate 1000 of the present invention can be, for example, a substrate obtained by the transfer step of the transfer method of the first aspect of the present invention after transferring a plurality of objects 6 from the starting substrate 100. However, the substrate 1000 of the present invention is not limited to a substrate obtained by the transfer step of the transfer method of the first aspect of the present invention. For example, the substrate of the present invention also includes a substrate obtained by using a destination substrate having a plurality of transferred objects, obtained by the transfer method of the first aspect of the present invention, as a second starting substrate, and transferring a plurality of objects 6 from this second starting substrate by the transfer step of the transfer method of the first aspect. Similarly, the substrate of the present invention also includes a substrate obtained by the transfer step of the transfer method of the first aspect using an object-mounted substrate obtained by transferring a plurality of objects 6 from the second starting substrate as a third starting substrate, and a substrate obtained from a subsequent starting substrate.

[0157] [Repair method] The repair method of the present invention is a repair method for transferring an object from a first substrate to a non-object-mounted location on a second substrate, in which a substrate of the present invention is used as the first substrate, and one or more objects of the plurality of objects in the first region are transferred to the non-object-mounted location on the second substrate using a laser.

[0158] An example of the repair method of the present invention will be described below with reference to Fig. 37. However, the repair method of the present invention is not limited to the example shown in Fig. 37.

[0159] In the repair method of this example, the object 6R is transferred from the first substrate 1000 to the non-object mounting location 6S of the second substrate 200.

[0160] Here, the substrate 1000 of the present invention described above is used as the first substrate, and one or more of the plurality of objects 6R in the first region 101 are projected onto the laser light source 3. ２ Laser L from ２ , and the second substrate 200 is transferred to a non-object mounting location 6S using the

[0161] Such a repair method uses the substrate 1000 of the present invention, and therefore the transfer of the objects 6 and 6R can be completed with a high yield.

[0162] Furthermore, in this example, the second substrate 200 has an object mounting location 202 where the first group of objects 6 was present and an object non-mounting location 6S where no objects are present, and it is preferable that the first group of objects 6 on the second substrate 200 and the first region 101 of the first substrate 1000 originate from the same starting substrate. For example, the first group of objects 6 on the second substrate 200 can be transferred in the transfer step of the transfer method of the first aspect.

[0163] This repair method can more reliably increase the transfer yield. Furthermore, by using such a substrate, the objects transferred in the transfer process and the surplus objects replenished in the repair process can be from the same production lot, making it possible to construct an aligned chip consisting of objects and surplus objects that are uniform across the entire surface, thereby reducing in-plane variations in product quality.

[0164] [Various Aspects of the Transfer Method] The transfer method of the present invention includes various aspects. The second to fifth aspects will be described below in order.

[0165] [Second Aspect] A transfer method of the second aspect is a transfer method for transferring a transfer object from a first substrate to a second substrate using a laser, wherein the first substrate has a plurality of objects including the transfer object, the plurality of objects being present on a surface of the first substrate, the surface of the first substrate having a first region and a second region in which the plurality of objects have different existence densities, the existence density in the first region being greater than the existence density in the second region, and the transfer object being present in the first region.

[0166] For example, the substrate of the present invention can be used as a first substrate to transfer an object to a second substrate, which is a destination substrate. That is, the substrate of the present invention may also be used in a transfer method other than the repair process.

[0167] With the transfer method of the second aspect of the present invention, for example, objects that are not transferred during the transfer process can be used as surplus objects, so that the transfer method as a whole can achieve a high yield of object transfer.

[0168] In this aspect, for example, a substrate having an area where no object is mounted can be used as the second substrate, and the object to be transferred can be transferred from the first substrate to the area where no object is mounted on the second substrate to replenish the object.

[0169] In this way, for example, objects that remain untransferred in the transfer step can be used in the repair step as surplus objects, so that the transfer method as a whole can achieve transfer with a high yield.

[0170] [Third Aspect] A transfer method of the third aspect is a transfer method for transferring a plurality of objects present on a first substrate to a second substrate, wherein the plurality of objects on the first substrate are the remains after defective objects have been removed in advance, and the plurality of objects are transferred from the first substrate to the second substrate such that the portions of the second substrate to which the removed defective objects were intended to be transferred become object-missing locations.

[0171] According to the transfer method of the third aspect of the present invention, it is possible to prevent defective objects from being transferred, thereby realizing transfer with a high yield.

[0172] [Fourth Aspect] A transfer method of the fourth aspect is a transfer method comprising: a trimming step of removing defective objects from a first substrate on which a plurality of objects exist; and a transfer step of transferring objects other than the removed defective objects to a second substrate, wherein in the transfer step, the objects other than the removed defective objects are transferred to the second substrate so that the portions to which the removed defective objects were intended to be transferred become object missing portions.

[0173] The transfer method according to the fourth aspect of the present invention can prevent defective objects from being transferred, thereby achieving transfer with a high yield.

[0174] The transfer method of the third or fourth aspect described above may further include, for example, a repair step of replenishing a missing object with a replenishment object.

[0175] In this case, the plurality of objects on the first substrate and the supplementary objects may originate from the same starting substrate.

[0176] With such a transfer method that includes a repair process, the starting substrate used to create the first substrate can also be used in the repair process, thereby suppressing variations that may arise due to differences in the starting substrate, such as variations in brightness and color compared to other normal objects.

[0177] [Fifth Aspect] A transfer method of the fifth aspect is a transfer method for transferring a plurality of objects from a first substrate to a second substrate using a laser, and includes a transfer step of transferring the plurality of objects from the first substrate to the second substrate by a laser through a first optical system, wherein the transfer step is performed so as to obtain surplus objects that have not been transferred and remain on the first substrate, and further includes a repair step of determining in advance, after the transfer step, whether or not the second substrate includes a portion where the objects are missing, and if a portion where the objects are missing is included, irradiating the laser onto the surplus objects on the first substrate through a second optical system, and transferring the surplus objects to the portion where the objects are missing.

[0178] As explained above, the starting substrate used in the transfer method of the present invention is not limited to a starting substrate on which multiple objects are formed, and a target substrate obtained by a single transfer method can also be used as a second starting substrate. As such a second starting substrate, a substrate having a resin layer provided on a laser-transparent substrate such as synthetic quartz may be used.

[0179] Therefore, with the transfer method of the fifth aspect of the present invention, as with the first aspect, surplus objects remaining in the transfer process that were not transferred in the transfer process can be used in the repair process, allowing for high-yield transfer of objects. Furthermore, with the transfer method of the fifth aspect of the present invention, the objects transferred in the transfer process and the surplus objects replenished in the repair process can be from the same production lot, making it possible to construct an aligned chip consisting of uniform objects and surplus objects across the entire surface, thereby reducing in-plane variations in product quality. Furthermore, in the repair process, the surplus objects remaining in the first optical system can be used in the second optical system without preparing a new starting substrate, allowing for effective use of the objects on the starting substrate.

[0180] The present invention is not limited to the above-described embodiments, which are merely examples, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and that provides similar effects is included within the technical scope of the present invention.

Claims

1. 1. A method for transferring a plurality of objects from a starting substrate to a destination substrate using a laser, comprising: a transferring step of transferring the plurality of objects from the starting substrate to the destination substrate by a laser through a first optical system; In the transferring step, the transfer is performed so as to obtain surplus objects remaining on the starting substrate without being transferred; a repair step of determining in advance whether or not the destination substrate contains a portion where the object is missing after the transfer step, and, if a portion where the object is missing is contained, irradiating the laser onto the surplus object on the starting substrate through a second optical system to transfer the surplus object to the portion where the object is missing.

2. 2. The transfer method according to claim 1, further comprising a trimming step of determining in advance whether or not the plurality of objects on the starting substrate include any defective objects prior to the transfer step, and selectively removing the defective objects using a laser through the second optical system if any defective objects are included.

3. 2. The transfer method according to claim 1, wherein the transfer step and the repair step are performed using the same starting substrate without changing the setup, using the same device that includes the first optical system and the second optical system and is configured to branch a laser from the same laser light source and irradiate the laser to each of the first optical system and the second optical system.

4. 3. The transfer method according to claim 2, wherein the trimming step and the transfer step are performed using the same starting substrate without changeover, using the same device that includes the first optical system and the second optical system and is configured to split a laser from the same laser light source and irradiate the laser to each of the first optical system and the second optical system.

5. The transfer method according to any one of claims 1 to 4, wherein in the transfer step, the object formed in the rectangular region on the starting substrate is transferred to the destination substrate, and the excess object is left on the starting substrate.

6. A substrate having a plurality of objects to be used in a repair process, the plurality of objects are present on a surface of the substrate; A substrate, wherein the surface of the substrate has a first region and a second region in which the existence densities of the plurality of objects are different from each other, and the existence density of the first region is greater than the existence density of the second region.

7. The substrate of claim 6 , wherein the second region is free of the plurality of objects.

8. The substrate of claim 6 , wherein the second region is larger than the first region.

9. The substrate according to claim 6 , wherein the second region has a rectangular planar shape.

10. the substrate has a circular planar shape, the first region has a substantially circular outer edge; the second region is surrounded by the first region, The substrate according to claim 9 , wherein a corner of the rectangular planar shape of the second region is approximately inscribed in the outer edge of the first region.

11. 11. The substrate according to claim 10, wherein the distance between the intersection of diagonals in the rectangular planar shape of the second region and the center of the approximate circle that is the outer edge of the first region is 0% or more and 5% or less of the diameter of the approximate circle.

12. The substrate according to claim 8 , wherein the area of ​​the second region is 60% or more of the total area of ​​the first region and the second region.

13. The substrate according to claim 9 , wherein the planar shape of the second region is a square.

14. the planar shape of the second region has a pair of long sides and a pair of short sides, The substrate according to claim 9 , wherein the ratio of the length of the short side to the length of the long side is equal to or greater than 0.7 and less than 1.

0.

15. The substrate according to claim 6 , wherein the plurality of objects are present in the first region in a matrix pattern.

16. The substrate according to claim 6 , wherein the second region is provided at least in an inner portion of the substrate excluding an outer edge portion.

17. The substrate of claim 6 , wherein the second region has a plurality of portions each of which does not include the plurality of objects.

18. The substrate according to claim 6 , wherein the second region is large enough to accommodate a matrix arrangement of a plurality of other objects.

19. A repair method for transferring an object from a first substrate to a non-object-mounted location on a second substrate, comprising: A repair method using a substrate described in any one of claims 6 to 18 as the first substrate, and transferring one or more objects of the plurality of objects in the first area to a location on the second substrate where the object is not mounted using a laser.

20. the second substrate has object mounting locations where the first group of objects was present and the object non-mounting locations where no object is present; 20. The repair method of claim 19, wherein the first group of objects on the second substrate and the first region of the first substrate originate from the same starting substrate.

21. A transfer method for transferring an object from a first substrate to a second substrate using a laser, comprising: The first substrate: a plurality of objects including the object to be transferred; the plurality of objects are present on a surface of the first substrate; the surface of the first substrate has a first region and a second region in which the plurality of objects have different densities, the density of the objects in the first region being greater than the density of the objects in the second region; The object to be transferred is present in the first area. A transfer method using a substrate.

22. a substrate having a non-object mounting portion is used as the second substrate; The transfer method according to claim 21 , further comprising the step of transferring the object from the first substrate to the non-object-mounted portion of the second substrate to replenish the object.

23. A method for transferring a plurality of objects present on a first substrate to a second substrate, comprising: the plurality of objects on the first substrate are the remains after defective objects have been removed in advance, A transfer method for transferring the plurality of objects from the first substrate to the second substrate such that the portion of the second substrate onto which the removed defective object was intended to be transferred becomes an object missing portion.

24. A transfer method comprising: a trimming step of removing defective objects from a first substrate on which a plurality of objects exist; a transferring step of transferring objects other than the removed defective objects to a second substrate; and A transfer method in which, in the transfer step, the objects other than the removed defective object are transferred to a second substrate so that the portion to which the removed defective object was intended to be transferred becomes an object missing portion.

25. A repair process of replenishing a replacement object at the missing portion of the object.

25. The method of claim 23 or 24, further comprising:

26. 26. The method of claim 25, wherein the plurality of objects on the first substrate and the replenishment object originate from the same starting substrate.

27. 1. A method for transferring a plurality of objects from a first substrate to a second substrate using a laser, comprising: transferring the plurality of objects from the first substrate to the second substrate by a laser through a first optical system; In the transferring step, the transfer is performed so as to obtain surplus objects remaining on the first substrate without being transferred; The transfer method further includes a repair step of determining in advance whether or not the second substrate contains a portion where the object is missing after the transfer step, and if the second substrate contains a portion where the object is missing, irradiating the laser onto the surplus object on the first substrate through a second optical system, and transferring the surplus object to the portion where the object is missing.