Electronic apparatus and heat dissipation device

Abstract

Provided are an electronic apparatus and a heat dissipation device that enable IC chip cooling performance to be improved. A heat dissipation device (100) wherein, a plurality of heat pipes (130) include a linkage section (131) in which the heat pipes (130), which are aligned in the left-right direction and adjacent to one another along a surface (10D) of an IC chip (10), are interlinked. Relative to a center position (L2) in the left-right direction of the surface 10D, a center position (L1) in the left-right direction of the linkage section (131) is shifted in the left-right direction to a first side.

Description

Electronic devices and heat dissipation devices

[0001] The present disclosure relates to electronic devices and heat dissipation devices.

[0002] In recent years, IC (integrated circuit) chips, such as SoCs (System on a Chip), which integrate functions such as a CPU (Central Processing Unit) and I / O (Input / Output), have come into use. To cool IC chips, heat dissipation devices including multiple heat pipes and heat sinks have also been used. Multiple heat pipes are sometimes connected to each other in the width direction to form a connecting portion, which is thermally connected to a single IC chip.

[0003] Japanese Patent Application Laid-Open No. 2018-148026

[0004] Due to demands for cost reduction and miniaturization of devices, there is a demand for more efficient cooling structures that are small in size and have a high cooling capacity, even in heat dissipation devices.

[0005] An object of the present disclosure is to provide an electronic device and a heat dissipation device that can improve the cooling capacity of an IC chip.

[0006] The electronic device according to the present disclosure includes an IC chip having a surface facing a first direction and a plurality of heat pipes. The plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction and include a connecting portion where adjacent heat pipes are connected to each other. The connecting portion is disposed in the first direction relative to the surface and thermally connected to the surface. The center position of the connecting portion in the second direction is shifted toward the first side in the second direction with respect to the center position of the surface in the second direction. This improves the cooling capacity of the IC chip.

[0007] The present disclosure also provides a heat dissipation device that covers a surface of an IC chip facing a first direction. The heat dissipation device includes a plurality of heat pipes. The plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction and include a connecting portion that connects adjacent heat pipes to each other. The connecting portion is disposed in the first direction relative to the surface and is thermally connected to the surface. The center position of the connecting portion in the second direction is shifted toward the first side in the second direction with respect to the center position of the surface in the second direction. This improves the cooling capacity of the IC chip.

[0008] The electronic device according to the present disclosure includes an IC chip having a surface facing a first direction and a plurality of heat pipes. The plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction and include connecting portions connecting adjacent heat pipes to each other. The connecting portions are disposed in the first direction relative to the surface and thermally connected to the surface. The heat absorption efficiency of the connecting portions for a region located on a first side of a central position of the surface in the second direction is higher than the heat absorption efficiency of the connecting portions for a region located on a second side of the central position. This improves the cooling capacity of the IC chip.

[0009] The present disclosure also provides a heat dissipation device that covers a surface of an IC chip facing a first direction. The heat dissipation device includes a plurality of heat pipes. The plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction and include connecting portions that connect adjacent heat pipes to each other. The connecting portions are arranged in the first direction relative to the surface and are thermally connected to the surface. The heat absorption efficiency of the connecting portions for a region located on a first side of a central position of the surface in the second direction is higher than the heat absorption efficiency of the connecting portions for a region located on a second side of the central position. This can improve the cooling capacity of the IC chip.

[0010] FIG. 4 is a plan view of a heat dissipation device built into an electronic device according to an embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing an IC chip built into the electronic device and components of the heat dissipation device. FIG. 6 is a plan view of a heat dissipation device. FIG. 7 is a cross-sectional view of an IC chip and a heat dissipation device taken along a cross section including line IV-IV in FIG. 3. FIG. 8 is a plan view schematically showing an example of regions of functions mounted on the surface of an IC chip and positions of connectors of heat pipes. FIG. 9 is a plan view schematically showing another example of regions of functions mounted on the surface of an IC chip and positions of connectors of heat pipes. FIG. 10 is a cross-sectional view of a heat dissipation device built into an electronic device according to another embodiment of the present disclosure. FIG. 11 is a cross-sectional view of a heat dissipation device built into an electronic device according to another embodiment of the present disclosure.

[0011] [1. Overview of IC Chip and Heat Dissipation Device] Fig. 1 is a plan view of a heat dissipation device 100 built into an electronic device. Fig. 2 is an exploded perspective view showing an IC chip 10 built into the electronic device and components of the heat dissipation device 100. Fig. 3 is a plan view of the heat dissipation device 100, and is an enlarged view of a portion of a base plate 120, which will be described later. Fig. 4 is a cross-sectional view of the IC chip 10 and the heat dissipation device 100 taken along line IV-IV in Fig. 3.

[0012] In the following description, the Z1 and Z2 directions of the Z axis shown in FIG. 2 and elsewhere will be referred to as "upward" and "downward," respectively. The X1 and X2 directions of the X axis, which are perpendicular to the Z axis, will be referred to as "leftward" and "rightward," respectively. The Y1 and Y2 directions of the Y axis, which are perpendicular to the Z and X axes, will be referred to as "forward" and "rearward," respectively. However, these directions are defined to explain the shapes of elements such as parts, components, and portions of the heat dissipation device 100 and the relative positional relationship between the IC chip 10 and the heat dissipation device 100, and do not limit the orientation of the IC chip 10 and the heat dissipation device 100 in an electronic device. For example, an electronic device incorporating an IC chip 10 and a heat dissipation device 100 may be placed upside down on a ground surface such as a floor, or may be placed with its side (the surface facing the X axis or Y axis) in contact with the ground surface.

[0013] The IC chip 10 is, for example, a chip such as an SoC that integrates functions of a graphics processing unit (GPU), a CPU, and I / O. The IC chip 10 may also include memory functions such as read-only memory (ROM) and random access memory (RAM). In this disclosure, the IC chip 10 is a flat semiconductor, such as silicon, referred to as a die. The IC chip 10 may incorporate circuits that realize functions such as a GPU. As shown in FIGS. 2 and 4 , the IC chip 10 is flat and has an upper surface 10U facing upward and a lower surface 10D (surface) facing downward (first direction). When the IC chip 10 is operated, heat is generated in at least a portion of the IC chip 10, including the lower surface 10D. Hereinafter, the lower surface 10D of the IC chip 10 will also be referred to as the heat-generating surface 10D.

[0014] As shown in FIG. 4 , the IC chip 10 is mounted on a circuit board 20. Note that the circuit board 20 is not shown in FIGS. 1 and 2 . The circuit board 20 may be covered with a circuit board shield 30 made of a conductive material such as iron or aluminum. In this case, an opening may be formed in the circuit board shield 30 at the position of the IC chip 10 to expose the heat-generating surface 10D of the IC chip 10. A heat dissipation device 100 for cooling the IC chip 10 may be attached to the opening of the circuit board shield 30. The heat dissipation device 100 is disposed below the IC chip 10 covered by the circuit board shield 30 (in the direction indicated by Z2 in FIG. 2 ).

[0015] As shown in FIGS. 1 and 2 , the heat dissipation device 100 includes a heat receiving plate 110 (heat receiving member), a base plate 120, a plurality of heat pipes 130 (six heat pipes 130 in this embodiment as shown in FIG. 4 ), and a heat sink 140a and a heat sink 140b. The heat receiving plate 110, the plurality of heat pipes 130, and the heat sinks 140a and 140b are made of metal and cool the IC chip 10. The heat receiving plate 110, the plurality of heat pipes 130, and the heat sinks 140a and 140b may be made of metals with high thermal conductivity such as aluminum or copper, or may be made of iron. The base plate 120 may be made of a conductive material such as iron or aluminum.

[0016] As shown in FIG. 2 , the base plate 120 has an opening 121 in its center. In a plan view of the circuit board unit, the opening in the base plate 120 is formed at the position of the IC chip 10. Also, as shown in FIG. 2 , the heat receiving plate 110 has a first contact portion 111, which is a convex portion that protrudes upward (in the Z1 direction in FIG. 2 ). The top of this first contact portion 111 forms a heat receiving surface 111U that contacts the heat generating surface 10D (see FIG. 4 ) of the IC chip 10. Grease, liquid metal, or the like may be applied to the heat generating surface 10D to transfer heat to the heat receiving surface 111U. As shown in FIGS. 1 and 2 , in the heat dissipation device 100, the heat receiving surface 111U of the heat receiving plate 110 is exposed upward.

[0017] 4, the heat pipes 130 are aligned in the left-right direction (a second direction intersecting the first direction) (the X-axis direction in FIG. 4) along the heat-generating surface 10D of the IC chip 10, and include a connecting portion 131 where adjacent heat pipes 130 are connected to each other. The connecting portion 131 may be a portion where all of the heat pipes 130 (five in this embodiment) included in the heat dissipation device 100 are connected. The connecting portion 131 may be a portion where the heat pipes 130 are welded together, or a portion where the heat pipes 130 are connected by a fixing means such as solder.

[0018] As shown in FIG. 4 , the connecting portion 131 of the heat pipe 130 is disposed below (in a first direction) the heat-generating surface 10D of the IC chip 10 and is thermally connected to the heat-generating surface 10D of the IC chip 10. Here, "thermally connected" means that the connecting portion 131 is in direct contact with the heat-generating surface 10D, or that the connecting portion 131 is in indirect contact with the heat-generating surface 10D. "Indirect contact" means, for example, that grease, liquid metal, a metal layer, or the like is disposed between the connecting portion 131 and the heat-generating surface 10D, and that the two are in contact with each other. In the example shown in FIG. 4 , a heat-receiving plate 110 is disposed between the connecting portion 131 and the heat-generating surface 10D. The heat-receiving plate 110 is in contact with both the heat-generating surface 10D of the IC chip 10 and the connecting portion 131 of the heat pipe 130 at the opening 121 of the base plate 120. The connecting portion 131 is in indirect contact with the heat-generating surface 10D via the heat-receiving plate 110, and is thermally connected to the heat-generating surface 10D.

[0019] 4, the heat receiving plate 110 is disposed between the heat generating surface 10D of the IC chip 10 and the connecting portion 131 of the heat pipe 130 in the vertical direction (Z-axis direction). The heat receiving plate 110 has a first connecting portion 111 that contacts the heat generating surface 10D and is thermally connected to the heat generating surface 10D. The heat receiving plate 110 also has a second connecting portion 112 that contacts the connecting portion 131 and is thermally connected to the connecting portion 131. More specifically, the lower surface 112D of the second connecting portion 112 contacts the connecting portion 131 of the heat pipe 130. The first connecting portion 111 protrudes upward from the upper surface 112U of the second connecting portion 112.

[0020] The heat pipe 130 transfers the heat of the IC chip 10 received through the heat receiving plate 110 to the heat sink 140a or 140b shown in Fig. 1. The heat sinks 140a and 140b dissipate the heat of the IC chip 10 transferred through the heat pipe 130. This allows the heat dissipation device 100 to cool the IC chip 10 in contact with the heat receiving surface 111U.

[0021] The heat receiving plate 110 is fixed to the base plate 120 by a fixing means such as solder. As shown in Fig. 4, the heat receiving plate 110 has a fixed portion 114L located on the left side (X1 side) of the first connection portion 111 and a fixed portion 114R located on the right side (X2 side) of the first connection portion 111. The fixed portions 114L and 114R are provided on the lower surface of the heat receiving plate 110 (the lower surface 112D of the second connection portion 112). The fixed portions 114L and 114R are fixed to the base plate 120 by a fixing means such as solder.

[0022] [2. Position of the Connectors Relative to the IC Chip] FIG. 5 is a plan view schematically showing an example of the regions of functions implemented on the IC chip 10 and the positions of the connectors 131 of the heat pipes 130 on the heat-generating surface 10D. FIG. 6 is a plan view schematically showing another example of the regions of functions implemented on the IC chip 10 and the positions of the connectors 131 on the heat-generating surface 10D. In both examples shown in FIGS. 5 and 6 , the center position L1 of the connectors 131 in the left-right direction (second direction) is shifted to the first side in the left-right direction (the left side (X1 side) in the examples shown in FIGS. 5 and 6 ) with respect to the center position L2 of the heat-generating surface 10D in the left-right direction. The center position L1 of the connectors 131 is the center position in the left-right direction of all the heat pipes 130 located below the IC chip 10. As a result, the heat absorption efficiency of the connecting portion 131 on the first side (e.g., the left side) of the center position L2 in the left-right direction of the heat-generating surface 10D is higher than the heat absorption efficiency of the connecting portion 131 on the second side (the right side (X2 side) in the examples shown in FIGS. 5 and 6) of the center position L2. Note that the "heat absorption efficiency" indicates the degree to which heat can be absorbed by the heat-generating surface 10D, and can be rephrased as, for example, "heat absorption amount" or "heat transfer coefficient."

[0023] 5 and 6, the center position L1 of the connecting portion 131 is shifted to the left (X1 side) with respect to the center position L2 in the left-right direction of the heat-generating surface 10D. This makes the heat absorption efficiency of the connecting portion 131 for an area located to the left of the center position L2 of the heat-generating surface 10D (for example, the CP area 10c described below) higher than the heat absorption efficiency of the connecting portion 131 for an area located to the right of the center position L2 of the heat-generating surface 10D (for example, the I / O area 10a described below). This allows for efficient absorption of heat generated on the heat-generating surface 10D.

[0024] As shown in FIGS. 5 and 6 , the IC chip 10 includes an I / O (Input / Output) area 10a (first area) in which circuits for data input / output processing functions are implemented, a GP (Graphics Processing) area 10b (second area) for performing a first arithmetic processing function, which is parallel arithmetic processing, and a CP (Central Processing) area 10c (third area) for performing a second arithmetic processing function. "Parallel arithmetic processing" refers to, for example, pipeline processing in which multiple processes (e.g., instruction fetching and decoding) are executed in parallel, or data parallel processing obtained by performing the same processing on different portions of data. Furthermore, the "first arithmetic processing function" refers to, for example, image processing (arithmetic processing required to render images) or machine learning processing such as deep learning. The "second arithmetic processing function" refers to general-purpose arithmetic processing different from image processing or machine learning processing. The GP area 10b is an area that primarily performs GPU functions, and the CP area 10c is an area that primarily performs CPU functions. The temperature of the surface (heat generating surface 10D) of the IC chip 10 varies depending on the processing content executed in each of the above-mentioned areas.

[0025] The GP area 10b (second area) is equipped with M cores that perform a first arithmetic processing function such as image processing or machine learning processing. The CP area 10c (third area) is equipped with N (N<M) cores that perform a second arithmetic processing function, which is general-purpose arithmetic processing. The number of cores implemented in the GP area 10b is greater than the number of cores implemented in the CP area 10c.

[0026] The number of cores implemented in the GP region 10b is, for example, 50 or more. The number of cores implemented in the GP region 10b may be 100 or more, or 200 or more. The number of cores implemented in the GP region 10b may be 500 or more, or 1000 or more. In contrast, the number of cores implemented in the CP region 10c is, for example, 30 or less. The number of cores implemented in the CP region 10c may be 20 or less, or 10 or less. The number of cores implemented in the CP region 10c may be 5 or less, or may be two, or one.

[0027] When the IC chip 10 is operating (for example, when the electronic device is running an application such as a game), the average temperature of the GP area 10b is the highest, followed by the average temperature of the CP area 10c, and the average temperature of the I / O area 10a is the lowest. The "average temperature" refers to the temperature per unit area (for example, 1 mm²) in each of the I / O area 10a, GP area 10b, and CP area 10c. ２ ) is the average temperature around

[0028] In the example shown in FIGS. 5 and 6 , the CP region 10c, GP region 10b, and I / O region 10a are arranged in this order from the first side to the second side of the heat-generating surface 10D (more specifically, from the left side (X1 side) to the right side (X2 side)). The GP region 10b is arranged so as to include the central portion of the IC chip 10, with the CP region 10c arranged on one side of the GP region 10b and the I / O region 10a arranged on the other side. As a result, the average temperature of the region on the heat-generating surface 10D that is located on the first side (e.g., the left side) of the center position L2 in the left-right direction (second direction) of the heat-generating surface 10D is higher than the average temperature of the region on the second side (e.g., the right side) of the center position L2 in the left-right direction of the heat-generating surface 10D. In contrast, the center position L1 of the connecting portion 131 is shifted toward the first side (e.g., the left side) of the center position L2 of the heat-generating surface 10D. In this way, it is possible to efficiently absorb the heat generated on the heat generating surface 10D.

[0029] 5 and 6, at least a portion of the I / O area 10a is disposed on the right side (second side, X2 side in FIGS. 5 and 6) of the center position L2 in the left-right direction of the heat-generating surface 10D. In the example shown in FIG. 5, the entire I / O area 10a is disposed on the right side of the center position L2 of the heat-generating surface 10D. In the example shown in FIG. 6, the I / O area 10a is disposed on both the left and right sides of the center position L2 of the heat-generating surface 10D. The portion of the I / O area 10a disposed on the right side (second side) of the center position L2 is larger than the other portion of the I / O area 10a disposed on the left side (first side) of the center position L2 of the heat-generating surface 10D. In contrast, the center position L1 of the connecting portion 131 is shifted to the opposite region (the region to the left of the center position L2 of the heat-generating surface 10D) from the right region (the region to the right of the center position L2 of the heat-generating surface 10D) which largely includes the I / O region 10 where the average temperature is lowest. This allows the heat generated on the heat-generating surface 10D to be efficiently absorbed.

[0030] 5 and 6, the CP region 10c is disposed to the left (first side, X1 side in FIGS. 5 and 6) of the center position L2 in the left-right direction of the heat-generating surface 10D. More specifically, the entire CP region 10c is disposed to the left of the center position L2 of the heat-generating surface 10D. In contrast, the center position L1 of the connecting portion 131 is shifted to the left of the center position L2 of the heat-generating surface 10D, including the CP region 10c. The center position L1 of the connecting portion 131 is shifted from the center position L2 of the heat-generating surface 10D toward the CP region 10c, which has a higher average temperature than the I / O region 10a. This allows the heat generated on the heat-generating surface 10D to be efficiently absorbed.

[0031] In the example shown in FIGS. 5 and 6 , the GP region 10b is disposed on the left side (first side, X1 side in FIGS. 5 and 6 ) and the right side (second side, X2 side in FIGS. 5 and 6 ) of the center position L2 of the heat-generating surface 10D. The center position L1 of the connecting portion 131 in the left-right direction is disposed so as to overlap with the GP region 10b, which has the highest average temperature when the IC chip 10 is operating (when an application is running). The connecting portion 131 covers the entire GP region 10b. The center position L1 of the connecting portion 131 is disposed between the center position L2 in the left-right direction of the heat-generating surface 10D and the CP region 10c. In this way, by disposing the center position L1 of the connecting portion 131 in the GP region 10b and shifting the center position L1 of the connecting portion 131 toward the CP region 10c, which has the second highest average temperature after the GP region 10b, it is possible to efficiently absorb heat generated on the heat-generating surface 10D.

[0032] 4, the heat receiving plate 110 has a first connection portion 111 that contacts the heat generating surface 10D and a second connection portion 112 that contacts the linking portion 131. The first connection portion 111 is a portion that protrudes upward from the upper surface 112U of the second connection portion 112. The width of the first connection portion 111 in the left-right direction is narrower than the width of the second connection portion 112 in the left-right direction.

[0033] As shown in FIG. 4 , the center position L3 of the first connecting portion 111 in the left-right direction is located at the center position L2 of the heat-generating surface 10D in the left-right direction. Furthermore, the center position L4 of the second connecting portion 112 in the left-right direction is shifted to the left (first side, X1 side in FIG. 4 ) with respect to the center position L2 of the heat-generating surface 10D. The center position L4 of the second connecting portion 112 is located at the center position L1 of the connecting portion 131 in the left-right direction. In the heat-receiving plate 110, the center position L3 of the first connecting portion 111 and the center position L4 of the second connecting portion 112 are shifted left-right in the same manner as the center position L2 of the heat-generating surface 10D and the center position L1 of the connecting portion 131. This allows the heat-receiving plate 110 to efficiently transfer heat from the heat-generating surface 10D received by the heat-receiving surface 111U of the first connecting portion 111 to the connecting portion 131 of the heat pipe 130.

[0034] As shown in Fig. 2, recesses 122L, 122R that are recessed downward relative to an upper surface 120U of the base plate 120 are formed on the left side (X1 side) and right side (X2 side) of the base plate 120. As shown in Fig. 4, the fixed portions 114L, 114R of the heat receiving plate 110 are fixed to the inside of the recesses 122L, 122R of the base plate 120. As shown in Fig. 4, the upper surface of the heat receiving plate 110 (the upper surface 112U of the second connection portion 112) and the upper surface 120U of the base plate 120 are positioned at the same position in the vertical direction.

[0035] 2 and 3, in the heat receiving plate 110, a notch 115L is formed at the front end (end on the Y1 side) of the left fixed portion 114L, and a width of the left notch 115L in the left-right direction (X-axis direction) is different from the width of the right notch 115R at the rear end (end on the Y2 side) of the right fixed portion 114R. The width of the left notch 115L in the left-right direction is the same as the width of the left recess 122L, and the width of the right notch 115R in the left-right direction is the same as the width of the right recess 122R.

[0036] The width in the left-right direction of the notch 115R on the right side of the heat receiving plate 110 (width W1 of the right recess 122R shown in FIG. 4) is narrower than the width in the left-right direction of the notch 115L on the left side (width W2 of the left recess 122L shown in FIG. 4). The width in the left-right direction of the notch 115L on the left side of the heat receiving plate 110 (width of the left recess 122L) W2 may be narrower than the width of the right notch 115R (width of the right recess 122R). By adopting these configurations, the heat receiving plate 110 cannot be fitted into the recesses 122L, 122R when the left-right and front-to-back directions of the heat receiving plate 110 are reversed. This prevents the heat receiving plate 110 from being attached to the base plate 120 with the left-right and front-to-back directions reversed, preventing the position of the heat receiving surface 111U of the base plate 120 from shifting from the pre-designed position. For example, when in the position shown in Figure 4, the heat receiving plate 110 can efficiently transfer heat from the heat generating surface 10D received by the heat receiving surface 111U of the first connection portion 111 to the connecting portion 131 of the heat pipe 130.

[0037] [3. Modifications] The present invention is not limited to the above-described embodiments.

[0038] (1) Fig. 7 is a cross-sectional view of a heat dissipation device 200 incorporated in an electronic device according to another embodiment. As shown in Fig. 7, the heat dissipation device 200 includes a heat receiving block 210 as a heat receiving member instead of the flat heat receiving plate 110. The heat receiving block 210 has a heat receiving surface 211U provided at its top (upper end) that contacts the heat generating surface 10D of the IC chip 10.

[0039] 7, a recess 212 recessed upward is formed in the center of the lower surface 210D of the heat receiving block 210. A plurality of heat pipes 130 are fitted inside this recess 212. The connecting portions 131 aligned in the left-right direction (X-axis direction, second direction) along the heat generating surface 10D of the IC chip 10 may be configured in this way by fitting the plurality of heat pipes 130 inside the recess 212 of the heat receiving block 210. Here, the width of the recess 212 in the left-right direction may match (or approximately match) the width of the connecting portions 131 in the left-right direction.

[0040] The number of heat pipes 130 constituting the connecting portion 131 may be five as shown in Fig. 4 or six as shown in Fig. 7. The central position L1 of the connecting portion 131 is the central position of all the heat pipes 130. Therefore, as shown in Fig. 7, if there are six heat pipes 130, the central position L1 is the central position of the six heat pipes 130. The number of heat pipes 130 constituting the connecting portion 131 may be a number other than five or six.

[0041] 7, the center position L1 of the connecting portion 131 is shifted to the left (X1 side) with respect to the center position L2 in the left-right direction of the heat-generating surface 10D. This makes it possible to increase the heat absorption efficiency for the CP region 10c (see FIGS. 5 and 6) located to the left of the center position L2 of the heat-generating surface 10D compared to the heat absorption efficiency for the I / O region 10a (see FIGS. 5 and 6) located to the right of the center position L2 of the heat-generating surface 10D (X2 side). This allows the heat generated on the heat-generating surface 10D to be efficiently absorbed.

[0042] (2) Fig. 8 is a cross-sectional view of a heat dissipation device 300 built into an electronic device according to another embodiment. In the example shown in Fig. 8, unlike the heat dissipation device 100 described above, the center position L1 in the left-right direction (second direction) of the connecting portion 131 is located at the center position L2 in the left-right direction of the heat-generating surface 10D. Furthermore, in the heat-receiving plate 110, the center position L3 in the left-right direction of the first connecting portion 111 that contacts the heat-generating surface 10D and the center position L4 in the left-right direction of the second connecting portion 112 that contacts the connecting portion 131 are also located at the center position L2 of the heat-generating surface 10D.

[0043] 8, the heat absorption efficiency of the connecting portion 131 for the region located on the left side (first side, X1 side in FIG. 8) of the center position L2 in the left-right direction of the heat-generating surface 10D is higher than the heat absorption efficiency of the connecting portion 131 for the region located on the right side (second side, X2 side in FIG. 8) of the center position L2. In the example shown in FIG. 8, of the five heat pipes that make up the connecting portion 131 lined up in the left-right direction (X-axis direction) along the heat-generating surface 10D of the IC chip 10, the thermal conductivity of the three heat pipes 130a located on the left side (X1 side) is higher than the thermal conductivity of the two heat pipes 130b located on the right side (X2 side).

[0044] For example, the cross-sectional structure of the heat pipes 130 (e.g., three heat pipes 130a) constituting the connecting portion 131 on the left side (X1 side) of the center position L2 in the left-right direction of the heat-generating surface 10D may be different from the cross-sectional structure of the heat pipes 130 (e.g., two heat pipes 130b) constituting the connecting portion 131 for the region located on the right side (X2 side) of the center position L2. "Different cross-sectional structures" means that the cross-sectional shapes, sizes, internal structures, etc. of the heat pipes 130 are different. For example, the internal structure of the heat pipe 130a located on the left side (X1 side) may be designed to have a higher thermal conductivity than the internal structure of the heat pipe 130b located on the right side (X2 side).

[0045] 8, the cross-sectional size (height H1 in the vertical direction (Z-axis direction)) of the three heat pipes 130a arranged on the left side is larger than the cross-sectional size (height H2) of the two heat pipes 130b arranged on the right side. This makes it possible to increase the heat absorption efficiency for the CP region 10c (see FIGS. 5 and 6) arranged on the left side of the center position L2 of the heat-generating surface 10D compared to the heat absorption efficiency for the I / O region 10a (see FIGS. 5 and 6) arranged on the right side of the center position L2 of the heat-generating surface 10D, thereby enabling efficient absorption of heat generated on the heat-generating surface 10D.

[0046] Furthermore, the connecting portion 131 is not limited to the example shown in Figure 8, and may be configured, for example, so that the thermal conductivity of the material of the heat pipe 130a arranged on the left side (X1 side) is higher than the thermal conductivity of the material of the heat pipe 130b arranged on the right side (X2 side).

[0047] In addition, the heat dissipation efficiency (e.g., the amount of heat released according to the size of the heat sink) of the heat sink connected to the heat pipe 130a located on the left side (X1 side) may be made higher than the heat dissipation efficiency of the heat sink connected to the heat pipe 130b located on the right side (X2 side).

[0048] Even with these structures, the heat absorption efficiency on the left side (X1 side) of the center position L2 of the heat-generating surface 10D can be made higher than the heat absorption efficiency in the region located on the right side (X2 side) of the center position L2 of the heat-generating surface 10D, thereby enabling the heat generated on the heat-generating surface 10D to be efficiently absorbed.

[0049] (3) In the embodiment, as shown in Figures 5 and 6, an example has been described in which the heat-generating surface 10D of the IC chip 10 includes the I / O region 10a, the GP region 10b, and the CP region 10c. However, the heat-generating surface 10D of the IC chip 10 may include, for example, the I / O region 10a and the GP region 10b without including the CP region 10c. In this case, the GP region 10b may be located on a first side (e.g., the left side (X1 side)) of the center position L2 of the heat-generating surface 10D, and the I / O region 10a may be located on a second side (e.g., the right side (X2 side)) of the center position L2 of the heat-generating surface 10D.

[0050] Furthermore, the heat-generating surface 10D may include the I / O region 10a and the CP region 10c without including the GP region 10b. In this case, the CP region 10c may be located to the left of the center position L2 in the left-right direction of the heat-generating surface 10D, and the I / O region 10a may be located to the right of the center position L2 of the heat-generating surface 10D.

[0051] Even in these structures, by shifting the center position L1 (see FIGS. 5 and 6) of the connecting portion 131 in the left-right direction with respect to the center position L2 of the heat-generating surface 10D, the heat absorption efficiency of the connecting portion 131 for the region located to the left (X1 side in FIGS. 5 and 6) of the center position L2 of the heat-generating surface 10D can be made higher than the heat absorption efficiency for the region located to the right (X2 side in FIGS. 5 and 6). In this way, it becomes possible to efficiently absorb heat generated on the heat-generating surface 10D, and the cooling capacity of the IC chip can be improved.

[0052] [4. Summary] (1) As described above, the electronic device described in this disclosure includes an IC chip having a heat-generating surface facing a first direction and a plurality of heat pipes. The heat pipes are aligned along the heat-generating surface in a second direction intersecting the first direction and include a connecting portion connecting adjacent heat pipes to each other. The connecting portion is disposed in the first direction relative to the heat-generating surface and is thermally connected to the heat-generating surface. The center position of the connecting portion in the second direction is shifted toward the first side in the second direction relative to the center position of the heat-generating surface in the second direction. This improves the cooling capacity of the IC chip.

[0053] (9) A heat dissipation device according to the present disclosure is a heat dissipation device that covers a heat-generating surface of an IC chip facing a first direction. The heat dissipation device has a plurality of heat pipes. The plurality of heat pipes are aligned along the heat-generating surface in a second direction intersecting the first direction, and include a connecting portion that connects adjacent heat pipes to each other. The connecting portion is disposed in the first direction relative to the heat-generating surface and is thermally connected to the heat-generating surface. The center position of the connecting portion in the second direction is shifted toward the first side in the second direction with respect to the center position of the heat-generating surface in the second direction. This can improve the cooling capacity of the IC chip.

[0054] (2) In the electronic device of (1) above, an average temperature of an area disposed on the first side of the surface may be higher than an average temperature of an area disposed on a second side of a central position of the surface in the second direction.

[0055] (3) In the electronic device of (1) or (2), the IC chip may include a first region in which a circuit for inputting and outputting data is formed, and at least a portion of the first region may be disposed on a second side of a center position of the surface in the second direction.

[0056] (4) In the electronic device of (3), the first region may be disposed on the first side and the second side, and a portion of the first region disposed on the second side may be larger than another portion of the first region disposed on the first side.

[0057] (5) In the electronic device of any one of (1) to (4) above, the IC chip may include a second area in which M cores for performing a first arithmetic processing function, which is parallel arithmetic processing, are implemented, and a third area in which N (N<M) cores for performing a second arithmetic processing function are implemented. The third area may be disposed on the first side.

[0058] (6) In the electronic device of (5) above, a center position of the connecting portion in the second direction may be disposed between a center position of the surface in the second direction and the third region.

[0059] (7) The electronic device of any of (1) to (6) above may include a heat-receiving member disposed between the surface and the connecting portion. The heat-receiving member may include a first connecting portion in contact with the surface and thermally connected to the surface, and a second connecting portion in contact with the connecting portion and thermally connected to the connecting portion. A center position of the first connecting portion in the second direction may be disposed at a center position of the surface in the second direction. A center position of the second connecting portion in the second direction may be shifted toward the first side with respect to a center position of the surface in the second direction.

[0060] (8) In the electronic device of (7) above, a center position of the second connection portion in the second direction may be disposed at a center position of the coupling portion in the second direction.

[0061] (10) An electronic device according to the present disclosure includes an IC chip having a heat-generating surface facing a first direction and a plurality of heat pipes. The heat pipes are aligned along the heat-generating surface in a second direction intersecting the first direction and include connecting portions connecting adjacent heat pipes to each other. The connecting portions are disposed in the first direction relative to the heat-generating surface and are thermally connected to the heat-generating surface. The heat absorption efficiency of the connecting portions on the first side of the center position of the heat-generating surface in the second direction is higher than the heat absorption efficiency of the connecting portions on the second side of the center position. This improves the cooling capacity of the IC chip.

[0062] (13) A heat dissipation device according to the present disclosure is a heat dissipation device that covers a heat-generating surface of an IC chip facing a first direction. The heat dissipation device includes a plurality of heat pipes. The plurality of heat pipes are aligned along the heat-generating surface in a second direction intersecting the first direction, and include connecting portions that connect adjacent heat pipes to each other. The connecting portions are arranged in the first direction relative to the heat-generating surface and are thermally connected to the heat-generating surface. The heat absorption efficiency of the connecting portions on the first side of the center position of the heat-generating surface in the second direction is higher than the heat absorption efficiency of the connecting portions on the second side of the center position. This can improve the cooling capacity of the IC chip.

[0063] (11) In the electronic device of (10) above, the cross-sectional structure of the heat pipe constituting the connecting portion on the first side relative to a central position in the second direction of the surface may be different from the cross-sectional structure of the heat pipe constituting the connecting portion on the second side relative to the central position.

[0064] (12) In the electronic device of (10) or (11) above, the heat dissipation efficiency of the heat sink connected to the heat pipe that constitutes the connecting portion on the first side with respect to the central position in the second direction of the surface may be higher than the heat dissipation efficiency of the heat sink connected to the heat pipe that constitutes the connecting portion on the second side with respect to the central position.

Claims

1. an IC chip having a surface facing in a first direction; a plurality of heat pipes; the plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction, and include connecting portions at which adjacent heat pipes are connected to each other; the coupling portion is disposed in the first direction relative to the surface and thermally coupled to the surface; an average temperature of a region of the surface disposed on a first side with respect to a central position in the second direction is higher than an average temperature of a region of the surface disposed on a second side with respect to the central position; A center position of the connecting portion in the second direction is shifted toward the first side with respect to the center position of the surface. electronic equipment.

2. the IC chip includes a first region in which a circuit for performing data input / output processing functions is formed; At least a portion of the first region is disposed on a second side relative to the central location of the surface. The electronic device according to claim 1 .

3. the first region is disposed on the first side and the second side; A portion of the first region disposed on the second side is larger than another portion of the first region disposed on the first side.

3. The electronic device according to claim 2.

4. the IC chip includes a second area in which M cores that perform a first arithmetic processing function, which is parallel arithmetic processing, are implemented, and a third area in which N (N<M) cores that perform a second arithmetic processing function are implemented, The third region is disposed on the first side. The electronic device according to claim 1 .

5. The central position of the connecting portion is disposed between the central position of the surface and the third region.

5. The electronic device according to claim 4.

6. a heat-receiving member disposed between the surface and the connecting portion; the heat-receiving member has a first connection portion that contacts the surface and is thermally connected to the surface, and a second connection portion that contacts the connecting portion and is thermally connected to the connecting portion, a center position of the first connection portion in the second direction is disposed at the center position of the surface; A center position of the second connection portion in the second direction is shifted toward the first side with respect to the center position of the surface. The electronic device according to claim 1 .

7. The center position of the second connection portion is disposed at the center position of the coupling portion.

7. The electronic device according to claim 6.

8. A heat dissipation device covering a surface of an IC chip facing a first direction, the heat dissipation device has a plurality of heat pipes; the plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction, and include connecting portions at which adjacent heat pipes are connected to each other; the coupling portion is disposed in the first direction relative to the surface and thermally coupled to the surface; an average temperature of a region of the surface disposed on a first side with respect to a central position in the second direction is higher than an average temperature of a region of the surface disposed on a second side with respect to the central position; A center position of the connecting portion in the second direction is shifted toward the first side with respect to the center position of the surface. Heat dissipation device.

9. an IC chip having a surface facing in a first direction; a plurality of heat pipes; the plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction and include connecting portions connecting adjacent heat pipes to each other; the coupling portion is disposed in the first direction relative to the surface and thermally coupled to the surface; an average temperature of a region of the surface disposed on a first side with respect to a central position in the second direction is higher than an average temperature of a region of the surface disposed on a second side with respect to the central position; a heat absorption efficiency by the coupling portion on the first side of the surface is greater than a heat absorption efficiency by the coupling portion on the second side of the surface; electronic equipment.

10. a cross-sectional structure of the heat pipe constituting the connecting portion on a first side with respect to a central position of the surface in the second direction is different from a cross-sectional structure of the heat pipe constituting the connecting portion on a second side with respect to the central position; 10. The electronic device according to claim 9.

11. a heat dissipation efficiency of a heat sink connected to a heat pipe constituting the connecting portion on a first side with respect to a central position of the surface in the second direction is higher than a heat dissipation efficiency of a heat sink connected to a heat pipe constituting the connecting portion on a second side with respect to the central position; 10. The electronic device according to claim 9.

12. A heat dissipation device covering a surface of an IC chip facing a first direction, the heat dissipation device has a plurality of heat pipes; the plurality of heat pipes are aligned along the surface in a second direction intersecting the first direction and include connecting portions connecting adjacent heat pipes to each other; the coupling portion is disposed in the first direction relative to the surface and thermally coupled to the surface; an average temperature of a region of the surface disposed on a first side with respect to a central position in the second direction is higher than an average temperature of a region of the surface disposed on a second side with respect to the central position; a heat absorption efficiency by the coupling portion on the first side of the surface is greater than a heat absorption efficiency by the coupling portion on the second side of the surface; Heat dissipation device.