Liquid epoxy resin composition and semiconductor device

Abstract

Provided is a liquid epoxy resin composition with which it is possible to ensure an appropriate pot life and suppressing occurrence of cracks in a cured product. The liquid epoxy resin composition contains a lactone compound (A), an epoxy resin (B), an aromatic amine (C), and an inorganic filler (D).

Description

Liquid epoxy resin composition and semiconductor device

[0001] The present disclosure relates generally to liquid epoxy resin compositions and semiconductor devices. More particularly, the present disclosure provides liquid epoxy resin compositions and semiconductor devices made from the liquid epoxy resin compositions.

[0002] Patent Document 1 describes an amine-cured epoxy composition used in underfills that contains at least one six-membered lactone condensed to an aromatic or heteroaromatic moiety as a shrinkage inhibitor.

[0003] Special Publication No. 2008-530321

[0004] An object of the present disclosure is to provide a liquid epoxy resin composition that ensures an appropriate pot life and can suppress the occurrence of cracks in the cured product, and a semiconductor device produced from the liquid epoxy resin composition.

[0005] A liquid epoxy resin composition according to one embodiment of the present disclosure contains a lactone compound (A), an epoxy resin (B), an aromatic amine (C), and an inorganic filler (D).

[0006] A semiconductor device according to one aspect of the present disclosure includes a substrate, a semiconductor element, and a sealing portion filling a gap between the substrate and the semiconductor element, the sealing portion including a cured product of the liquid epoxy resin composition.

[0007] FIG. 1 shows an example of a semiconductor device manufactured using a liquid epoxy resin composition according to an embodiment of the present disclosure.

[0008] 1. Overview An embodiment of the present disclosure will be described. Note that the following embodiments are merely a portion of various embodiments of the present disclosure. Furthermore, the following embodiments can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. The drawings referred to below are schematic drawings, and the dimensional ratios of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0009] The liquid epoxy resin composition of the present disclosure (hereinafter also referred to as composition (X)) contains a lactone compound (A), an epoxy resin (B), an aromatic amine (C), and an inorganic filler (D), thereby ensuring an appropriate pot life and providing a cured product in which the occurrence of cracks in the cured product can be suppressed.

[0010] The composition (X) of the present disclosure is used to produce a semiconductor device. More specifically, the composition (X) is used to produce a sealing portion included in the semiconductor device. In particular, the composition (X) can be suitably used to produce a sealing portion included in a semiconductor device in which a semiconductor element and a substrate are bonded with solder bumps. In other words, the composition (X) can be suitably used for underfill that seals between the semiconductor element and the substrate.

[0011] In recent semiconductor devices, there has been a trend toward larger semiconductor elements, narrower gaps between the semiconductor elements and the substrate, and narrower pitches between bumps, but composition (X) can be applied as an underfill material to such semiconductor devices and can impart good sealing performance to the semiconductor devices. The semiconductor elements referred to here include, for example, active elements such as chips, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils.

[0012] Furthermore, as described above, the cured product of the composition (X) according to the present disclosure can be prevented from cracking. Therefore, the sealing part made from the composition (X) tends to be free from cracking. In particular, the number of cracks occurring at the portion of the sealing part contacting the corner of the semiconductor element or the portion of the sealing part contacting the periphery of the semiconductor element tends to be reduced.

[0013] The use of the composition (X) in the present disclosure is not limited to sealing a semiconductor device, that is, the composition (X) can be used for various purposes depending on the purpose of use.

[0014] 2. composition

[0015] 2.1 Properties The properties of composition (X) are described below.

[0016] The viscosity of composition (X) at 25°C is, for example, 100 Pa s or less. In this case, the fluidity of composition (X) can be ensured. This makes it easier to use composition (X) as a material for sealing semiconductor devices. Furthermore, the viscosity of composition (X) at 25°C is preferably 50.0 Pa s or less. In this case, handling of composition (X) becomes easier. This makes it easier to use composition (X) as a material for sealing semiconductor devices. The viscosity of composition (X) at 25°C is more preferably 45.0 Pa s or less, and even more preferably 40.0 Pa s or less. Furthermore, the viscosity of composition (X) at 25°C may be 1.0 Pa s or more, or may be 5.0 Pa s or more. The viscosity of composition (X) can be measured, for example, using a Brookfield viscometer (manufactured by Toki Sangyo Co., Ltd., model number: TVB-10) at a temperature of 25°C and a rotation speed of 20.0 rpm.

[0017] The properties of composition (X) can be achieved by appropriately selecting the components and adjusting the blending amounts within the ranges described below regarding the components.

[0018] 2.2 Components The components contained in the composition (X) according to this embodiment will be described.

[0019] (Lactone Compound) As described above, the composition (X) contains the lactone compound (A).

[0020] The lactone compound (A) has a lactone ring. The number of atoms constituting the lactone ring is not particularly limited. For example, the number of atoms can be appropriately selected depending on the mode of use, but the number is preferably 6. That is, the lactone ring of the lactone compound (A) is preferably a six-membered ring. In this case, the crack resistance of the cured product of the composition (X) tends to be enhanced. In this disclosure, "crack resistance" refers to the property of suppressing the occurrence of cracks in the cured product of the liquid epoxy resin composition.

[0021] The lactone ring of the lactone compound (A) may be condensed with, for example, an aromatic ring or a heterocyclic ring, but the lactone ring is preferably condensed with an aromatic ring. Furthermore, the aromatic ring is preferably a benzene ring. In other words, the lactone compound (A) preferably contains at least one compound selected from the group consisting of a compound having a chromanone skeleton in the molecule, a compound having a bischromanone skeleton in the molecule, a compound having a coumarin skeleton in the molecule, and a compound having a biscoumarin skeleton in the molecule.

[0022] The compound having a chromanone skeleton and a bischromanone skeleton in the molecule (hereinafter also referred to as a chromanone compound) preferably contains 6-methyl-4-phenyl-2-chromanone, which can suppress an increase in viscosity of composition (X) and can enhance the crack resistance of a cured product of composition (X).

[0023] Furthermore, compounds having a coumarin skeleton and a biscoumarin skeleton in the molecule (hereinafter also referred to as coumarin compounds) include, for example, 3-aminocoumarin, 4-hydroxycoumarin, 3,3'-carbonylbis(7-diethylaminocoumarin), 3-benzoyl-7-diethylaminecoumarin, 3,3'-carbonylbis(7-methoxycoumarin), 7-(diethylamino)-4-methylcoumarin, 3-(2-benzothiazole)-7-(diethylamine)coumarin, 3-benzoyl-7-methoxycoumarin, 2,3,6,7-tetrahydro-10-(3-pyridyl)-1H, The compound contains at least one selected from the group consisting of 5H,11H-[1]benzopyrano[6,7,8-ij]quinolizin-11-one (coumarin 510), 10-(2-benzothiazolyl)-2,3,6,7-tetrahydro-1H,5H,11H-[1]benzopyrano[6,7,8-ij]quinolizin-11-one (coumarin 545), and 10-(2-benzothiazolyl)-2,3,6,7-tetrahydro-1,1,7,7-tetramethyl-1H,5H,11H-[1]benzopyrano[6,7,8-ij]quinolizin-11-one (coumarin 545T). Among these, the coumarin compound preferably contains at least one of 3-aminocoumarin, 7-(diethylamino)-4-methylcoumarin, Coumarin 510, Coumarin 545, Coumarin 545T, and 3,3'-carbonylbis(7-diethylaminocoumarin). In this case, an increase in viscosity of composition (X) is suppressed, and the crack resistance of a cured product of composition (X) can be improved.

[0024] The lactone compound (A) has, for example, a functional group in the molecule. By appropriately changing the number or type of functional groups in the lactone compound (A), the solubility of the lactone compound (A) in the composition (X) can be increased. Increasing the solubility of the lactone compound (A) in the composition (X) can improve the fluidity of the composition (X) and also improve the crack resistance of the cured product of the composition (X). Examples of the functional group include an alkyl group having 1 to 4 carbon atoms, a phenyl group, an alkoxy group, an amino group, a primary or secondary alkylamino group having an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a pyridyl group, a benzothiazolyl group, an alkoxy group, or an acetyl group. The alkyl group may be linear or branched. The alkyl group of the alkylamino group may be linear or branched. It is preferable that a hydroxyl group is not bonded to the lactone ring in the lactone compound (A). In other words, the lactone compound (A) preferably contains a lactone compound (A1) that does not have a hydroxyl group bonded to the lactone ring, which can particularly reduce the viscosity of the composition (X).

[0025] The chemical structure of the lactone compound (A) will be described in more detail. When the lactone compound (A) contains a lactone compound having a specific structure, an appropriate pot life of the composition (X) can be ensured and the occurrence of cracks in a cured product of the composition (X) can be further suppressed.

[0026] The lactone compound (A) preferably contains a lactone compound (A2) having a structure represented by the following formula (1): In this case, an increase in the viscosity of the composition (X) is suppressed, and the crack resistance of a cured product of the composition (X) can be improved.

[0027]

[0028] In the above formula (1), R １ ~R ８ are independent and may be the same or different. １ ~R ８may be a hydrogen atom, or a functional group such as an alkyl group having 1 to 4 carbon atoms, a phenyl group, an amino group, a primary or secondary alkylamino group having an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a pyridyl group, a benzothiazolyl group, an alkoxy group, or an acetyl group. The alkyl group may be linear or branched. The alkyl group of the alkylamino group may be linear or branched.

[0029] R １ ~R ８ Each of R may be a monovalent group. １ ~R ８ may each be a divalent group. In this case, R １ ~R ８ Any two of the R １ ~R ８ Any two of the above are both divalent groups.

[0030] Furthermore, R １ ~R ８ When each of R is an alkylamino group, the alkyl group contained in the alkylamino group may be a monovalent group or a divalent group. When the alkyl group contained in the alkylamino group is a divalent group, R １ ~R ８ Any two of these may be combined.

[0031] When the lactone compound (A) contains the lactone compound (A2), R １ ~R ８ It is preferable that at least one of the groups is a phenyl group or a methyl group. In this case, the increase in viscosity of the composition (X) is further suppressed, and the crack resistance of the cured product of the composition (X) can be further improved. In addition, if the composition (X) is used to produce an encapsulating part of a semiconductor device, the occurrence of cracks in the encapsulating part at the part in contact with the corner of the semiconductor element or the part in contact with the periphery of the semiconductor element can be further suppressed. Furthermore, in the above formula (1), R ５ or R ６ is a phenyl group, and R ３is particularly preferably a methyl group. In this case, the crack resistance of the cured product of composition (X) can be particularly enhanced. Furthermore, when the sealing part of a semiconductor device is produced from such composition (X), the occurrence of cracks at the portion of the sealing part that contacts the corner of the semiconductor element can be particularly suppressed.

[0032] The lactone compound (A) preferably contains a lactone compound (A3) having a structure represented by the following formula (2): In this case, an increase in the viscosity of the composition (X) is suppressed, and the crack resistance of a cured product of the composition (X) can be improved.

[0033]

[0034] In the above formula (2), R ９ ~R ２２ are each independently of one another and may be the same or different. ９ ~R ２２ Each of the groups is a hydrogen atom or R １ ~R ８ It may be the same functional group as

[0035] In the above formula (2), Z １ is a linking group. １ Examples of the alkylene group include an alkylene group, a phenylene group, -O-alkylene-O-, -O-phenylene-O-, -O-(C=O)-alkylene-(C=O)-O-, -O-(C=O)-phenylene-(C=O)-O-, -O-(C=O)-NH-alkylene-NH-(C=O)-O-, and -O-(C=O)-NH-phenylene-NH-(C=O)-O-.

[0036] R ９ ~R ２２ Each of R may be a monovalent group. ９ ~R ２２ may each be a divalent group. In this case, R ９ ~R ２２ Any two of the R ９ ~R ２２ Any two of the above are both divalent groups.

[0037] In addition, when the lactone compound (A) contains the lactone compound (A3), R ９ ~R ２２ It is preferable that at least one of R is an alkylamino group. In this case, the crack resistance of the cured product of the composition (X) can be further improved. ９ ~R ２２ When at least one of the alkylamino groups is an alkylamino group, the alkyl group contained in the alkylamino group may be a monovalent group or a divalent group. When the alkyl group contained in the alkylamino group is a divalent group, R ９ ~R ２２ Any two of these may be combined.

[0038] The lactone compound (A) preferably contains a lactone compound (A4) having a structure represented by the following formula (3): In this case, an increase in the viscosity of the composition (X) is suppressed, and the crack resistance of a cured product of the composition (X) can be improved.

[0039]

[0040] In the above formula (3), R ２３ ~R ２８ are each independently of one another and may be the same or different. ２３ ~R ２８ Each of the groups is a hydrogen atom or R １ ~R ８ It may be the same functional group as

[0041] R ２３ ~R ２８ Each of R may be a monovalent group. ２３ ~R ２８ may each be a divalent group. In this case, R ２３ ~R ２８ Any two of the R ２３ ~R ２８ Any two of the above are both divalent groups.

[0042] When the lactone compound (A) contains the lactone compound (A4), R ２３ ~R ２８ Preferably, at least one of the groups is an alkylamino group, a methyl group, or an amino group. In this case, an increase in the viscosity of the composition (X) can be further suppressed, and the crack resistance of the cured product of the composition (X) can be further improved. Furthermore, if an encapsulating part of a semiconductor device is produced from such a composition (X), the occurrence of cracks in the encapsulating part at the portion contacting the corner of the semiconductor element or the portion contacting the periphery of the semiconductor element can be further suppressed.

[0043] Furthermore, in the above formula (3), R ２８ is particularly preferably an amino group. In this case, an increase in viscosity of the composition (X) can be particularly suppressed, and the crack resistance of a cured product of the composition (X) can be particularly enhanced. Furthermore, when an encapsulating part of a semiconductor device is produced from such a composition (X), the occurrence of cracks can be particularly suppressed both at the part of the encapsulating part that contacts the corner of the semiconductor element and at the part that contacts the periphery of the semiconductor element.

[0044] In addition, in the above formula (3), R ２４ is an alkylamino group, and R ２７ is also particularly preferably a methyl group. In this case, an increase in viscosity of the composition (X) can be particularly suppressed, and the crack resistance of a cured product of the composition (X) can be particularly enhanced. Furthermore, in this case, if the composition (X) is used to produce an encapsulating part of a semiconductor device, the occurrence of cracks can be particularly suppressed both at the part of the encapsulating part that contacts the corner of the semiconductor element and at the part that contacts the periphery of the semiconductor element.

[0045] Also, R ２３ ~R ２８ When at least one of the alkylamino groups is an alkylamino group, the alkyl group contained in the alkylamino group may be a divalent group. When the alkyl group contained in the alkylamino group is a divalent group, R ２３ ~R ２８Any two of the above may be bonded to each other. Specific examples include structures represented by the following formula (4). That is, the lactone compound (A4) may contain a lactone compound (A41) having a structure represented by the following formula (4).

[0046]

[0047] In the above formula (4), R in the above formula (3) ２４ is an alkylamino group having two alkyl groups, and each of the two alkyl groups of the alkylamino group is bonded to a carbon atom of an aromatic ring contained in the coumarin skeleton. ２３ and R ２５ In the above formula (4), R ２６ ~R ２８ are independent and may be the same or different. ２６ ~R ２８ is R in the above formula (3). ２６ ~R ２８ In the above formula (4), R ２９ ~R ３２ is an alkyl group having 1 to 4 carbon atoms. ２９ ~R ３２ It is particularly preferred that all of the groups are methyl groups.

[0048] When the lactone compound (A4) contains the lactone compound (A41), R ２８ is preferably a pyridyl group or a benzothiazolyl group. In this case, the crack resistance of the cured product of the composition (X) tends to be enhanced.

[0049] The lactone compound (A) preferably contains a lactone compound (A5) having a structure represented by the following formula (5): In this case, an increase in the viscosity of the composition (X) is suppressed, and the crack resistance of a cured product of the composition (X) can be improved.

[0050]

[0051] In the above formula (5), R ３３ ~R ４２are each independently of one another and may be the same or different. ３３ ~R ４２ Each of the groups is a hydrogen atom or R １ ~R ８ It may be the same functional group as

[0052] In the above formula (5), Z ２ is a linking group. ２ is Z in the above formula (2). １ may be the same as

[0053] R ３３ ~R ４２ Each of R may be a monovalent group. ３３ ~R ４２ may each be a divalent group. In this case, R ３３ ~R ４２ Any two of the R ３３ ~R ４２ Any two of the above are both divalent groups.

[0054] In addition, when the lactone compound (A) contains the lactone compound (A5), R ３３ ~R ４２ It is preferable that at least one of R is an alkylamino group. In this case, the crack resistance of the cured product of the composition (X) can be further improved. ３３ ~R ４２ When at least one of R is an alkylamino group, the alkyl group contained in the alkylamino group may be a monovalent group. ３３ ~R ４２ When at least one of the alkylamino groups is an alkylamino group, the alkyl group contained in the alkylamino group may be a divalent group. When the alkyl group contained in the alkylamino group is a divalent group, R ３３ ~R ４２ Any two of these may be combined.

[0055] The melting point of the lactone compound (A) is preferably 220°C or lower. In this case, the fluidity of the composition (X) is ensured, and the crack resistance of the composition (X) can be improved. The melting point of the lactone compound (A) is more preferably 170°C or lower, and even more preferably 140°C or lower. Furthermore, the melting point of the lactone compound (A) is, for example, 70°C or higher.

[0056] The proportion of the lactone compound (A) is 0.1% by mass or more and 5.0% by mass or less, based on the total of the epoxy resin (B) and the aromatic amine (C). When the proportion of the lactone compound (A) is 0.1% by mass or more, based on the total of the epoxy resin (B) and the aromatic amine (C), the crack resistance of the cured product of the composition (X) can be improved. When the proportion of the lactone compound (A) is 5.0% by mass or less, based on the total of the epoxy resin (B) and the aromatic amine (C), the usable life of the composition (X) can be easily extended. The proportion of the lactone compound (A) is more preferably 0.1% by mass or more, and even more preferably 0.3% by mass or more, based on the total of the epoxy resin (B) and the aromatic amine (C). The proportion of the lactone compound (A) is more preferably 1.5% by mass or less, and even more preferably 1.0% by mass or less, based on the total of the epoxy resin (B) and the aromatic amine (C).

[0057] In composition (X), the molar ratio of lactone compound (A) to epoxy resin (B) is preferably within the range of 0.1:99.9 to 10.0:90.0, which can easily extend the usable life of composition (X) and improve the crack resistance of a cured product of composition (X).

[0058] (Epoxy Resin) As described above, the composition (X) contains the epoxy resin (B).

[0059] The epoxy resin (B) may contain at least one selected from the group consisting of diglycidyl ether epoxy resins such as p-aminophenol epoxy resins, naphthalene epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol AD ​​epoxy resins, bisphenol S epoxy resins, and hydrogenated bisphenol A epoxy resins; epoxy resins obtained by epoxidizing novolac resins obtained by the reaction of phenols with aldehydes, such as orthocresol novolac epoxy resins; glycidyl ester epoxy resins obtained by the reaction of polybasic acids such as phthalic acid and dimer acid with epichlorohydrin; and glycidyl amine epoxy resins obtained by the reaction of amine compounds such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin. Among these, it is particularly preferred that the epoxy resin (B) contain at least one of bisphenol A epoxy resins, bisphenol F epoxy resins, p-aminophenol epoxy resins, and naphthalene epoxy resins. In this case, the curability of the composition (X) can be particularly enhanced.

[0060] As the epoxy resin (B), a commercially available product may be used. Examples of commercially available epoxy resin (B) include bisphenol F type epoxy resin (product name: YDF-8170C, epoxy equivalent: 155 to 165 g / eq.) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., bisphenol A type epoxy resin (product name: YD-128, epoxy equivalent: 184 to 194 g / eq.) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and multifunctional epoxy resin (product name: jER-630, epoxy equivalent: 90 to 105 g / eq.) manufactured by Mitsubishi Chemical Corporation. Furthermore, one type of epoxy resin (B) may be used alone, or two or more types may be used in combination.

[0061] The epoxy resin (B) is preferably liquid at 25°C. In this case, the viscosity of the composition (X) can be reduced. In this embodiment, an epoxy resin that is solid at 25°C can also be used in combination, as long as it does not affect the fluidity of the composition (X). In addition, the epoxy resin (B) being liquid at 25°C means that the viscosity at 25°C is 100 Pa s or less.

[0062] The viscosity of the epoxy resin (B) at 25° C. is preferably 0.01 Pa s or more, and more preferably 0.02 Pa s or more. The viscosity of the epoxy resin (B) at 25° C. is preferably 50.0 Pa s or less, and more preferably 20.0 Pa s or less. When the viscosity of the epoxy resin (B) satisfies the above numerical range, the fluidity of the composition (X) can be further increased, and the handling of the composition (X) can be facilitated.

[0063] The epoxy equivalent of the epoxy resin (B) is, for example, 40 g / eq. or more and 1,000 g / eq. or less. In this case, the reactivity between the epoxy resin (B) and the aromatic amine (C) can be enhanced. As a result, the heat resistance and crack resistance of the cured product of the composition (X) can be enhanced. The epoxy equivalent means the mass (g) of the epoxy resin (B) containing 1 mole of epoxy groups. The epoxy equivalent of the epoxy resin (B) is preferably 50 g / eq. or more. The epoxy equivalent of the epoxy resin (B) is preferably 300 g / eq. or less. Furthermore, the epoxy resin (B) preferably contains an epoxy resin (B1) having two or more epoxy groups per molecule. In this case, the reactivity between the epoxy resin (B) and the aromatic amine (C) can be further enhanced. As a result, the curability of the composition (X) can be enhanced, and the heat resistance and crack resistance of the cured product of the composition (X) can be enhanced. That is, the epoxy equivalent of the epoxy resin (B) is, for example, 50 g / eq. and 300 g / eq. or less, and the epoxy resin (B) contains an epoxy resin (B1) having two or more epoxy groups in one molecule. In this case, the heat resistance and crack resistance of the cured product of the composition (X) can be further improved.

[0064] (Aromatic Amine) As described above, the composition (X) contains the aromatic amine (C). By containing the aromatic amine (C) in the composition (X), the heat resistance of the cured product of the composition (X) can be improved. In particular, compared to when an aliphatic amine is used instead of the aromatic amine (C), the composition (X) can achieve high heat resistance, and the usable life of the composition (X) can be easily extended. In the present disclosure, the aromatic amine (C) refers to an aromatic compound having an amino group.

[0065] The aromatic amine (C) may be liquid or solid as long as it allows the composition (X) to exhibit fluidity at 25° C. when contained in the composition (X). The aromatic amine (C) is preferably liquid at 25° C., and in this case, the fluidity of the composition (X) can be improved.

[0066] Examples of the aromatic amine (C) include aliphatic aromatic amines such as m-xylylenediamine, aromatic amines having one aromatic ring such as metaphenylenediamine, 1,3-diaminotoluene, 1,4-diaminotoluene, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene, 3,5-diethyl-2,6-diaminotoluene, and 2,4-diaminoanisole, 2,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'-methylenebis(2-ethyl-2,4'-diaminodiphenylmethane), and the like. The aromatic amine (C) contains at least one selected from the group consisting of aromatic amines having two aromatic rings, such as diaminodiphenylmethane (diaminoaniline), 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetraethyl-4,4'-diaminodiphenylmethane, and polytetramethylene oxide diparaaminobenzoate, condensates of aromatic diamines and epichlorohydrin, and reaction products of aromatic diamines and styrene. Among these, it is particularly preferred that the aromatic amine (C) contains at least one of diaminodiphenylmethane, m-phenylenediamine, diaminodiphenylsulfone, and diethyltoluenediamine. In this case, the usable life of the composition (X) can be particularly easily extended.

[0067] The aromatic amine (C) may be, for example, a commercially available product, such as an amine curing agent manufactured by Nippon Kayaku Co., Ltd. (product name: Kayahard AA, amine active hydrogen equivalent: 64 g / eq.) or a modified aromatic amine curing agent manufactured by ADEKA Corporation (product name: EH-105L, amine active hydrogen equivalent: 61 g / eq.).

[0068] The amine active hydrogen equivalent of the aromatic amine (C) is, for example, 20 g / eq. or more and 500 g / eq. or less. In this case, the reactivity between the epoxy resin (B) and the aromatic amine (C) can be enhanced. As a result, the heat resistance and crack resistance of the cured product of the composition (X) can be enhanced. The amine active hydrogen equivalent means the mass (g) of the aromatic amine (C) containing 1 mole of amine active hydrogen. The amine active hydrogen equivalent of the aromatic amine (C) is preferably, for example, 30 g / eq. or more. The amine active hydrogen equivalent of the aromatic amine (C) is preferably, for example, 100 g / eq. or less. Furthermore, the aromatic amine (C) preferably contains an aromatic amine (C1) having two or more amino groups per molecule. In this case, the reactivity between the epoxy resin (B) and the aromatic amine (C) can be further enhanced. As a result, higher curability of the composition (X) and higher heat resistance of the cured product of the composition (X) can be achieved. In other words, the amine active hydrogen equivalent of the aromatic amine (C) is 30 g / eq. It is more preferable that the aromatic amine (C) contains an aromatic amine (C1) having two or more amino groups in one molecule, and the cured product of the composition (X) has improved heat resistance and crack resistance.

[0069] In this embodiment, the ratio of the functional group equivalent of the aromatic amine (C) to the functional group equivalent of the epoxy resin (B) in the composition (X) is preferably 0.6 or more and 1.4 or less. When the ratio of the functional group equivalent of the aromatic amine (C) to the functional group equivalent of the epoxy resin (B) is 0.6 or more, the proportion of the epoxy resin (B) is not excessively high, so that the epoxy resin (B) and the aromatic amine (C) can react efficiently. Therefore, the number of crosslinking points in the cured product of the composition (X) is not excessively low, so that the glass transition temperature of the cured product can be appropriately increased. This can improve the heat resistance of the cured product of the composition (X) and also improve the crack resistance of the cured product. When the ratio of the functional group equivalent of the aromatic amine (C) to the functional group equivalent of the epoxy resin (B) is 1.4 or less, the proportion of the aromatic amine (C) is not excessively high, so that the epoxy resin (B) and the aromatic amine (C) can react efficiently. Therefore, the number of crosslinking points in the cured product of composition (X) is not excessively large, and the glass transition temperature of the cured product can be appropriately lowered, thereby suppressing stress in the cured product of composition (X), and thereby improving the crack resistance of the cured product.

[0070] The functional group of the epoxy resin (B) refers to an epoxy group. The functional group of the aromatic amine (C) refers to an amino group. In other words, the ratio of the amine active hydrogen equivalent of the aromatic amine (C) to the epoxy equivalent of the epoxy resin (B) is preferably 0.6 or more and 1.4 or less. The ratio of the functional group equivalent of the aromatic amine (C) to the functional group equivalent of the epoxy resin (B) is more preferably 0.7 or more, and even more preferably 0.8 or more. The ratio of the functional group equivalent of the aromatic amine (C) to the functional group equivalent of the epoxy resin (B) is more preferably 1.3 or less.

[0071] (Inorganic Filler) As described above, the composition (X) contains the inorganic filler (D). In this case, the linear expansion coefficient of the cured product of the composition (X) may be included. Therefore, stress in the cured product may be reduced.

[0072] The inorganic filler (D) contains at least one component selected from the group consisting of, for example, silica, alumina, and silicon nitride. In particular, it is preferable that the inorganic filler (D) contains silica. Specific examples of the type of silica include fused silica and crystalline silica. Among these, it is preferable that the silica is fused silica. The silica contained in the composition (X) may be used alone or in combination of two or more types. Furthermore, it is preferable that the shape of the silica is spherical. That is, it is preferable that the inorganic filler (D) contains spherical silica. In this case, the fluidity of the composition (X) can be increased.

[0073] The inorganic filler (D) is preferably surface-treated with a surface treatment agent. In this case, the dispersibility of the inorganic filler (D) in the composition (X) can be increased. This ensures the fluidity of the composition (X) and increases the filling rate of the inorganic filler (D) in the composition (X). A silane coupling agent can be suitably used as the surface treatment agent. In other words, the inorganic filler (D) is preferably surface-treated with a silane coupling agent. In other words, more specifically, the inorganic filler (D) preferably contains silica surface-treated with a silane coupling agent.

[0074] The average particle size of the inorganic filler (D) is preferably 0.1 μm or more and 70.0 μm or less. In this case, the fluidity of the composition (X) can be improved. Furthermore, the average particle size of the inorganic filler (D) is more preferably 0.3 μm or more. The average particle size of the inorganic filler (D) is more preferably 20.0 μm or less.

[0075] The maximum particle size of the inorganic filler (D) is preferably 5.0 μm or less. In this case, the fluidity of the composition (X) can be improved. The maximum particle size of the inorganic filler (D) is more preferably 3.0 μm or less. The maximum particle size of the inorganic filler (D) is preferably 0.1 μm or more, more preferably 0.3 μm or more.

[0076] The average particle size is a volume-based median diameter calculated from particle size distribution measured by a laser diffraction / scattering method, and is obtained using a commercially available laser diffraction / scattering particle size distribution analyzer. Two or more inorganic fillers (D) having different average particle sizes may be used as the inorganic filler (D) in order to improve the viscosity of the composition (X) during molding or to adjust the physical properties of the plugging portion.

[0077] The proportion of the inorganic filler (D) is preferably 40.0 mass% or more and 80.0 mass% or less relative to the total amount of the composition (X). When the proportion of the inorganic filler (D) is 40.0 mass% or more, the linear expansion coefficient of the composition (X) can be sufficiently reduced. This can improve the crack resistance of the cured product of the composition (X). When the proportion of the inorganic filler (D) is 80.0 mass% or less, the fluidity of the composition (X) during molding can be ensured. The proportion of the inorganic filler (D) is more preferably 42.0 mass% or more, and even more preferably 45.0 mass% or more, relative to the total amount of the composition (X). Furthermore, the proportion of the inorganic filler (D) is more preferably 75.0 mass% or less, and even more preferably 70.0 mass% or less, relative to the total amount of the composition (X).

[0078] (Other Components) In the present embodiment, the composition (X) may contain, in addition to the lactone compound (A), the epoxy resin (B), the aromatic amine (C), and the inorganic filler (D), at least one selected from the group consisting of a resin modifier, an antioxidant, a curing aid, a coupling agent, a colorant, a thixotropic agent, an ion trapping agent, an antifoaming agent, a leveling agent, an antioxidant, and the like, within a range that does not impair the object of the present disclosure.

[0079] As described above, the composition (X) may contain a resin modifier. The inclusion of the resin modifier in the composition (X) can enhance the crack resistance of a cured product of the composition (X). The resin modifier contains, for example, a resin. The resin contained in the resin modifier contains, for example, at least one resin selected from the group consisting of silicone resins, butadiene resins, and the like.

[0080] As described above, the composition (X) may contain a curing aid. The curing aid can accelerate the curing reaction between the epoxy resin (B) and the aromatic amine (C). The curing aid may contain at least one compound selected from the group consisting of, for example, an aluminum-containing chelate compound, an imidazole-based compound such as 2-ethyl-4-methylimidazole, an organic phosphorus compound such as triphenylphosphine, a quaternary ammonium-based compound, and a phosphonium-based compound.

[0081] As described above, the composition (X) may contain a coupling agent. The coupling agent can improve compatibility between the inorganic filler (D) and the epoxy resin (B). The coupling agent may contain at least one selected from the group consisting of, for example, silane-based compounds, titanium-based compounds, aluminum chelates, and aluminum / zirconium-based compounds.

[0082] The silane-based compound contains at least one selected from the group consisting of, for example, a silane compound having an amino group, an epoxy silane, a mercapto silane, an alkyl silane, a ureido silane, and a vinyl silane.

[0083] Specifically, examples of the silane-based compound include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris(β-methoxyethoxy)silane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, and γ-aminopropylmethyldimethoxysilane. thoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltriethoxysilane, γ-(N,N-dimethyl)aminopropyltrimethoxysilane, γ-(N,N-diethyl)aminopropyltrimethoxysilane, γ-(N,N-dibutyl)aminopropyltrimethoxysilane, γ-(N-methyl)anilinopropyltrimethoxysilane, γ-(N-ethyl)anilinopropyltrimethoxysilane, γ-(N,N-di γ-(N,N-dimethyl)aminopropyltriethoxysilane, γ-(N,N-diethyl)aminopropyltriethoxysilane, γ-(N,N-dibutyl)aminopropyltriethoxysilane, γ-(N-methyl)anilinopropyltriethoxysilane, γ-(N-ethyl)anilinopropyltriethoxysilane, γ-(N,N-dimethyl)aminopropylmethyldimethoxysilane, γ-(N,N-diethyl)aminopropylmethyldimethoxysilane, γ-(N,N-dibutyl)aminopropylmethyldimethoxysilane, γ-(N-methyl) It contains at least one selected from the group consisting of anilinopropylmethyldimethoxysilane, γ-(N-ethyl)anilinopropylmethyldimethoxysilane, N-(trimethoxysilylpropyl)ethylenediamine, N-(dimethoxymethylsilylisopropyl)ethylenediamine, methyltrimethoxysilane, dimethyldimethoxysilane, methyltriethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, vinyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, etc. The inorganic filler (D) may be surface-treated using any of the silane compounds listed here.

[0084] As described above, the composition (X) may contain a colorant.

[0085] Specific examples of colorants include inorganic pigments and organic dyes.

[0086] The inorganic pigment contains at least one selected from the group consisting of, for example, carbon black, a composite metal oxide of copper, chromium, and manganese, a composite metal oxide of iron and manganese, a composite metal oxide of chromium and iron, a composite metal oxide of cobalt, iron, and chromium, a composite metal oxide of copper, iron, manganese, and aluminum, and titanium oxide. The organic dye contains at least one selected from the group consisting of, for example, alloy dyes such as azo compound chromium complexes, azo dyes, anthraquinone dyes, and nigrosine dyes. These colorants may be used alone or in combination of two or more.

[0087] 2.3 Production Method The production method of composition (X) is not particularly limited as long as it is a method that can uniformly disperse and mix the above components. Specific examples of such a dispersion and mixing method include dispersion and kneading using a three-roll mill, a planetary mixer, or the like.

[0088] 3. Application Examples Application examples of the composition (X) according to this embodiment will now be described in detail.

[0089] As described above, the composition (X) can be used to encapsulate a semiconductor device. In this case, the semiconductor device comprises a cured product of the composition (X).

[0090] Specific examples of semiconductor devices include FC-BGA (Flip Chip Ball Grid Array), EBGA (Enhanced BGA), ABGA (Advanced BGA), Stacked-BGA, SIP (System in Package), and WLP (Wafer Level Package), which are flip-chip mounted at the package level.

[0091] When used to seal a semiconductor device, composition (X) can also be used as an underfill material. For example, composition (X) can be applied from the periphery of a semiconductor element such as a chip using a syringe needle or the like, and the underfill material can be impregnated and penetrated into the space between the semiconductor element such as a chip and the substrate by capillary action. As mentioned above, there has been a recent trend toward larger semiconductor element sizes, narrower gaps between the semiconductor element and the substrate, and narrower pitches between bumps. However, composition (X) according to this embodiment can be applied even when the size of the semiconductor element is 20 × 20 mm or more, the gap between the semiconductor element and the substrate is 50 μm or less, and the pitch between bumps in the semiconductor device is 150 μm or less, making it possible to manufacture a semiconductor device with excellent sealing performance.

[0092] FIG. 1 shows an example of a semiconductor device 1 manufactured using the composition (X).

[0093] This semiconductor device 1 comprises a substrate 2, a semiconductor element 3 mounted opposite the substrate 2 via bumps 4, and a sealing portion 5 that seals the gap between the substrate 2 and the semiconductor element 3. The sealing portion 5 contains a cured product of a liquid sealing resin composition. The semiconductor element 3 has a plurality of bump electrodes 31 on the surface facing the substrate 2, and the substrate 2 has conductor wiring 21 on the surface facing the semiconductor element 3. The bump electrodes 31 and the conductor wiring 21 are aligned and connected via the bumps 4. The bumps 4, the bump electrodes 31, and the conductor wiring 21 are embedded in the sealing portion 5.

[0094] As described above, the sealing portion 5 includes a cured product of the composition (X). In other words, the sealing portion 5 is produced by filling the gap between the substrate 2 and the semiconductor element 3 of the semiconductor device 1 with the composition (X) and then heating and curing the composition (X).

[0095] The method for producing the sealing portion 5 will be described in more detail. First, the composition (X) is dropped onto one side of the side of the semiconductor element 3 using a syringe or the like. By doing so, the composition (X) fills the gaps between the semiconductor element 3 and the substrate 2 that are not occupied by the bumps 4 due to capillary action. If the substrate 2 is heated using a heating device such as a hot plate, the heat of the substrate 2 is transferred to the composition (X), allowing the composition (X) to be efficiently filled. Note that the temperature of the composition (X) when filling the gaps in the semiconductor device 1 is preferably 80°C or higher and 130°C or lower. Then, after the composition (X) has penetrated into the gaps and filled them completely, the sealing portion 5 is produced by heating the semiconductor device 1 in a constant temperature bath or the like.

[0096] As described above, the semiconductor device 1 according to this embodiment includes the sealing portion 5 produced by the method described above, the substrate 2, and the semiconductor element 3. Note that the method for producing the sealing portion 5 is not limited to the method described above. In other words, as long as the sealing portion 5 produced from the composition (X) can exhibit good sealing performance in the semiconductor device 1, any appropriate method can be used as the method for producing the sealing portion 5.

[0097] 4. Summary As is clear from the above embodiments, the present disclosure includes the following aspects. In the following, reference numerals are given in parentheses only to clarify the correspondence with the embodiments.

[0098] The composition (X) according to the first aspect of the present disclosure contains a lactone compound (A), an epoxy resin (B), an aromatic amine (C), and an inorganic filler (D).

[0099] According to the first aspect, it is possible to provide a composition (X) that ensures an appropriate pot life and can suppress the occurrence of cracks in the cured product.

[0100] In the composition (X) according to the second aspect of the present disclosure, in the first aspect, the proportion of the lactone compound (A) is 0.1 mass% or more and 5.0 mass% or less with respect to the total of the epoxy resin (B) and the aromatic amine (C).

[0101] According to the second aspect, the crack resistance of the cured product of the composition (X) is improved, and the usable life of the composition (X) can be easily extended.

[0102] In the composition (X) according to the third aspect of the present disclosure, in the first or second aspect, the viscosity at 25°C is 100 Pa·s or less.

[0103] In the composition (X) according to the fourth aspect of the present disclosure, in any one of the first to third aspects, the molar ratio of the lactone compound (A) to the epoxy resin (B) is within the range of 0.1:99.9 to 10.0:90.0.

[0104] According to the fourth aspect, in this case, the pot life of the composition (X) can be easily extended, and the crack resistance of the cured product of the composition (X) can be improved.

[0105] In any one of the first to fourth aspects of the composition (X) according to the fifth aspect of the present disclosure, the ratio of the functional group equivalent of the aromatic amine (C) to the functional group equivalent of the epoxy resin (B) is 0.6 or more and 1.4 or less.

[0106] According to the fifth aspect, the crack resistance of the composition (X) can be improved.

[0107] In the composition (X) according to the sixth aspect of the present disclosure, in any one of the first to fifth aspects, the lactone compound (A) contains a lactone compound (A1) that does not have a hydroxyl group bonded to a lactone ring.

[0108] According to the sixth embodiment, the viscosity of the composition (X) can be particularly reduced.

[0109] Composition (X) according to a seventh aspect of the present disclosure is any one of the first to sixth aspects, in which the epoxy equivalent of the epoxy resin (B) is 50 g / eq. or more and 300 g / eq. or less, and the epoxy resin (B) contains an epoxy resin (B1) having two or more epoxy groups in one molecule.

[0110] According to the seventh aspect, the reactivity of the epoxy resin (B) with the aromatic amine (C) can be further enhanced, and as a result, the heat resistance and crack resistance of the cured product of the composition (X) can be further enhanced.

[0111] Composition (X) according to an eighth aspect of the present disclosure is any one of the first to seventh aspects, in which the amine active hydrogen equivalent of the aromatic amine (C) is 30 g / eq. or more and 100 g / eq. or less, and the aromatic amine (C) contains an aromatic amine (C1) having two or more amino groups in one molecule.

[0112] According to the eighth aspect, the reactivity of the epoxy resin (B) with the aromatic amine (C) can be further enhanced, and as a result, the heat resistance and crack resistance of the cured product of the composition (X) can be further enhanced.

[0113] The composition (X) according to the ninth aspect of the present disclosure is any one of the first to eighth aspects, in which the inorganic filler (D) contains spherical silica.

[0114] According to the ninth aspect, the fluidity of the composition (X) can be increased.

[0115] The composition (X) according to the tenth aspect of the present disclosure is any one of the first to ninth aspects, in which the ratio of the inorganic filler (D) to the liquid epoxy resin composition is 40.0 mass% or more and 80.0 mass% or less.

[0116] According to the tenth aspect, the coefficient of linear expansion of the cured product of the composition (X) can be sufficiently reduced, and the fluidity of the composition (X) can be ensured.

[0117] The composition (X) according to an eleventh aspect of the present disclosure is for semiconductor encapsulation in any one of the first to tenth aspects.

[0118] The composition (X) according to a twelfth aspect of the present disclosure is for underfill in any one of the first to eleventh aspects.

[0119] A semiconductor device (1) according to a thirteenth aspect of the present disclosure includes a substrate (2), a semiconductor element (3), and a sealing portion (5) filling a gap between the substrate (2) and the semiconductor element (3). The sealing portion (5) contains a cured product of the composition (X) according to any one of the first to twelfth aspects.

[0120] The present disclosure will be described in more detail below with reference to examples, but the present disclosure is not limited to these examples.

[0121] [Preparation of Liquid Epoxy Resin Compositions] Liquid epoxy resin compositions of the examples and comparative examples were prepared by mixing the components shown in Tables 1 to 3. Details of the components are as follows:

[0122] <Lactone Compounds> Lactone compound 1: (Tokyo Chemical Industry Co., Ltd., product name: 7-diethylamino-4-methylcoumarin (melting point 72° C.)).

[0123] Lactone compound 2: (Tokyo Chemical Industry Co., Ltd., product name: 6-methyl-4-phenyl-2-chromanone (melting point 82°C)).

[0124] Lactone compound 3: (Tokyo Chemical Industry Co., Ltd., product name: 3-aminocoumarin (melting point 137°C)).

[0125] Lactone compound 4: (Tokyo Chemical Industry Co., Ltd., product name: Coumarin 510 (melting point 165°C)).

[0126] Lactone compound 5: (Tokyo Chemical Industry Co., Ltd., product name: 4-hydroxycoumarin (melting point 212°C)).

[0127] Lactone compound 6: (Tokyo Chemical Industry Co., Ltd., product name: 3,3'-carbonylbis(7-diethylaminocoumarin) (melting point 217°C)).

[0128] <Epoxy Resins> Epoxy resin 1: bisphenol F type epoxy resin (manufactured by Nippon Steel Chemical & Material Co., Ltd., product name: YDF-8170C, epoxy equivalent 160 g / eq.).

[0129] Epoxy resin 2: bisphenol A type epoxy resin (manufactured by Nippon Steel Chemical & Material Co., Ltd., product name: YDF-8125, epoxy equivalent 173 g / eq.).

[0130] Epoxy resin 3: glycidylamine type epoxy resin (manufactured by ADEKA Corporation, product name: EP-3950S, epoxy equivalent: 95 g / eq.).

[0131] <Aromatic Amines> Aromatic amine 1: 3,3'-diethyl-4,4'-diaminodiphenylmethane (manufactured by Nippon Kayaku Co., Ltd., product name: Kayahard-AA, amine active hydrogen equivalent: 64 g / eq.).

[0132] Aromatic amine 2: dimethylthiotoluenediamine (manufactured by ADEKA Corporation, product name: EH105L, amine active hydrogen equivalent: 61 g / eq.).

[0133] Aromatic amine 3: diethyltoluenediamine (manufactured by Mitsubishi Chemical Corporation, product name: WA, amine active hydrogen equivalent: 45 g / eq.).

[0134] <Inorganic Filler> Inorganic Filler 1: Silica (average particle size 0.7 μm, maximum particle size 1.0 μm) prepared by a sol-gel method and surface-treated with a silane coupling agent having a phenylamino group.

[0135] <Other Components> [Resin Modifiers] Resin Modifier 1: A liquid masterbatch in which core-shell rubber particles are dispersed as single particles at a high concentration in an epoxy resin (manufactured by Kaneka Corporation, product name: MX-965).

[0136] [Antioxidants] Antioxidant 1: Hindered phenol (manufactured by Lianglong Japan Co., Ltd., product name: RIANOX 1010).

[0137] [Evaluation of Liquid Epoxy Resin Compositions] Evaluation items of the liquid epoxy resin compositions of each Example and Comparative Example will be described below.

[0138] <Viscosity> First, the viscosity of each liquid epoxy resin composition was measured using a Brookfield viscometer (manufactured by Toki Sangyo Co., Ltd., model number: TVB-10) at a temperature of 25°C and a rotation speed of 20.0 rpm. The rotor used was No. 6. The viscosity values ​​obtained are shown in Tables 1 to 3.

[0139] <Crack Evaluation> First, a 10 mm square silicon die and a 20 mm square silicon die were prepared. Next, 0.1 mg of the liquid epoxy resin composition of each Example and Comparative Example was applied to the 20 mm square silicon die, and the die was placed on a hot plate set to 100°C. Next, 10 minutes after the 20 mm square silicon die was placed on the hot plate, the 10 mm square silicon die was placed on the surface of the 20 mm square silicon die that had been applied with the liquid epoxy resin composition, to prepare a sample.

[0140] The samples were then heated at 100°C for 2 hours, followed by heating at 165°C for 2 hours to cure the applied liquid epoxy resin composition. Samples in which the resin had reached 70% or more of the side surface of a 10 mm square silicon die were then examined using an optical microscope (200x magnification) to check for cracks around the silicon die. The results are shown in Tables 1 to 3 according to the following criteria:

[0141] A: In the cured liquid epoxy resin composition, the number of cracks observed at the corners of the silicon die is 0, and the number of cracks observed around the silicon die is 0. B: In the cured liquid epoxy resin composition, the number of cracks observed at the corners of the silicon die is 0, and the number of cracks observed around the silicon die is 1 or more but less than 4. C: In the cured liquid epoxy resin composition, the number of cracks observed at the corners of the silicon die is 1, and the number of cracks observed around the silicon die is 4 or more but less than 7. D: In the cured liquid epoxy resin composition, the number of cracks observed at the corners of the silicon die is 2, and the number of cracks observed around the silicon die is 7 or more but less than 10. E: In the cured liquid epoxy resin composition, the number of cracks observed at the corners of the silicon die is more than 2, and the number of cracks observed around the silicon die is more than 10.

[0142]

[0143]

[0144]

[0145] Comparative Example 1 did not contain a lactone compound compared to Examples 1 to 10, and therefore the crack evaluation was not good. Furthermore, Comparative Example 2 contained an antioxidant, but did not contain a lactone compound compared to Examples 1 to 10, and therefore the crack evaluation was not good. Furthermore, Comparative Example 3 contained a resin modifier, but did not contain a lactone compound compared to Examples 1 to 10, and therefore the crack evaluation was not good.

[0146] REFERENCE SIGNS LIST 1 semiconductor device 2 substrate 3 semiconductor element 5 sealing portion

Claims

1. A composition comprising a lactone compound (A), an epoxy resin (B), an aromatic amine (C), and an inorganic filler (D), A liquid epoxy resin composition.

2. the proportion of the lactone compound (A) is 0.1 mass% or more and 5.0 mass% or less with respect to the total of the epoxy resin (B) and the aromatic amine; The liquid epoxy resin composition according to claim 1.

3. The viscosity at 25°C is 100 Pa s or less. The liquid epoxy resin composition according to claim 1 or 2.

4. the molar ratio of the lactone compound (A) to the epoxy resin (B) is within the range of 0.1:99.9 to 10.0:90.0; The liquid epoxy resin composition according to claim 1 or 2.

5. a ratio of the functional group equivalent of the aromatic amine (C) to the functional group equivalent of the epoxy resin (B) is 0.6 or more and 1.4 or less; The liquid epoxy resin composition according to claim 1 or 2.

6. The lactone compound (A) contains a lactone compound (A1) that does not have a hydroxyl group bonded to a lactone ring. The liquid epoxy resin composition according to claim 1 or 2.

7. the epoxy equivalent of the epoxy resin (B) is 50 g / eq. or more and 300 g / eq. or less, and the epoxy resin (B) contains an epoxy resin (B1) having two or more epoxy groups in one molecule; The liquid epoxy resin composition according to claim 1 or 2.

8. the aromatic amine (C) has an amine active hydrogen equivalent of 30 g / eq. or more and 100 g / eq. or less, and the aromatic amine (C) contains an aromatic amine (C1) having two or more amino groups in one molecule; The liquid epoxy resin composition according to claim 1 or 2.

9. The inorganic filler (D) contains spherical silica. The liquid epoxy resin composition according to claim 1.

10. The ratio of the inorganic filler (D) to the liquid epoxy resin composition is 40.0 mass% or more and 80.0 mass% or less. The liquid epoxy resin composition according to claim 1 or 2.

11. For semiconductor encapsulation, The liquid epoxy resin composition according to claim 1.

12. For underfill, The liquid epoxy resin composition according to claim 10.

13. a substrate, a semiconductor element, and a sealing portion that fills a gap between the substrate and the semiconductor element; The sealing portion comprises a cured product of the liquid epoxy resin composition according to claim 1 or 2. Semiconductor device.