Electronic component

Abstract

The present disclosure provides an electronic component with which it is possible to suppress the occurrence of defects such as migration. An electronic component (1) is provided with: an insulating body (3) in which a plurality of insulating substrates each comprising side surface electrodes (21)-(24) and internal electrodes (11)-(14) are stacked; and external electrodes (41)-(44) which are electrically connected to the side surface electrodes (21)-(24) and are provided on the side surface of the insulating body (3). Each of the plurality of insulating substrates additionally comprises dummy electrodes that are disposed on both sides of the side surface electrodes (21)-(24) when viewed from the stacking direction, with an insulating portion being interposed therebetween. The external electrodes (41)-(44) are connected to the dummy electrodes on the side surface of the insulating body (3).

Description

Electronic Components

[0001] The present disclosure relates to an electronic component in which an external electrode is provided on a side surface of an insulator.

[0002] In electronic components that have external electrodes on the side surfaces of an insulator, if a gap occurs between the insulator and the external electrode, moisture may penetrate into the insulator through the gap, causing problems such as migration. Japanese Patent Laid-Open Publication No. 2004-273917 (Patent Document 1) discloses a configuration for an electronic component that prevents moisture from penetrating.

[0003] Japanese Patent Application Laid-Open No. 2004-273917

[0004] In Japanese Patent Laid-Open No. 2004-273917 (Patent Document 1), a protruding convex portion is formed on the side edge of the lead portion of the internal electrode to prevent moisture from penetrating from the end face of the electronic component along the vicinity of the side edge of the lead portion. However, simply providing a convex portion on the internal electrode cannot prevent problems such as migration that occur between the internal electrode and the side electrode electrically connected to the external electrode.

[0005] Therefore, an object of the present disclosure is to provide an electronic component that can suppress the occurrence of defects such as migration.

[0006] An electronic component according to an embodiment of the present disclosure includes an insulator formed by stacking a plurality of insulating substrates, each of which includes a side electrode and an internal electrode, and external electrodes electrically connected to the side electrodes and provided on a side surface of the insulator. Each of the insulating substrates further includes dummy electrodes disposed on both sides of the side electrode with an insulating portion sandwiched therebetween when viewed from the stacking direction. The external electrodes are connected to the dummy electrodes on the side surfaces of the insulator.

[0007] According to one embodiment of the present disclosure, the multiple insulating substrates further include dummy electrodes arranged on both sides of the side electrode with insulating portions sandwiched therebetween when viewed from the stacking direction, thereby making it possible to suppress the occurrence of defects such as migration.

[0008] Fig. 1 is a perspective view of an electronic component according to an embodiment; Fig. 2 is a circuit diagram of the electronic component according to an embodiment; Fig. 3 is a plan view of the vicinity of one external electrode of the electronic component according to an embodiment; Fig. 4 is a cross-sectional view of the vicinity of one external electrode of the electronic component according to an embodiment; Fig. 5 is an exploded plan view showing the configuration of the electronic component according to an embodiment; Fig. 6 is an exploded plan view showing the configuration of an electronic component according to a first modified example; Fig. 7 is an exploded plan view showing the configuration of an electronic component according to a second modified example; Fig. 8 is a plan view of the vicinity of one external electrode of the electronic component according to a third modified example;

[0009] An electronic component according to an embodiment will be described below. In the electronic component described below, a filter circuit including a coil and a capacitor is configured with internal electrodes within a rectangular parallelepiped insulator. However, in the electronic component according to the present disclosure, as long as external electrodes are provided on the side surfaces of the insulator, the filter circuit does not necessarily have to be configured with internal electrodes, and other circuits may also be configured with internal electrodes.

[0010] First, an electronic component according to an embodiment will be described with reference to the drawings. Fig. 1 is a perspective view of an electronic component 1 according to an embodiment. Fig. 2 is a circuit diagram of the electronic component 1 according to an embodiment. In Fig. 1, the short side direction of the electronic component 1 is the X direction, the long side direction is the Y direction, and the height direction is the Z direction. The stacking direction of insulating substrates (hereinafter simply referred to as substrates) is the Z direction, and the arrow indicates the direction toward the upper layer.

[0011] The electronic component 1 is a filter circuit in which a first coil L1 and a second coil L2 constituting a transformer are arranged in the lamination direction, and a first capacitor C1 and a second capacitor C2 are arranged in the Y direction.

[0012] 2, the electronic component 1 has a first coil L1 and a second coil L2 that are magnetically coupled and connected in series between a first terminal P1 and a second terminal P2. Furthermore, the electronic component 1 has a first capacitor C1 connected in parallel to the first coil L1 and the second coil L2, and an intermediate terminal between the first coil L1 and the second coil L2 is connected to ground (GND) via a second capacitor C2.

[0013] As shown in Figures 1 and 2, the electronic component 1 is composed of an insulator 3 formed by stacking multiple substrates on which internal electrodes forming part of a coil and part of a capacitor are formed. Side electrodes forming a first terminal P1, a second terminal P2, a GND terminal, and a dead terminal (NC terminal) are formed at the four corners of the substrate. For example, the insulator 3 may be manufactured using a method of forming electrode patterns for the internal electrodes and side electrodes using a photomask that uses a photosensitive conductive paste and a photosensitive insulating paste. Alternatively, the insulator 3 may be manufactured using a method of stacking ceramic green sheets, which serve as insulating substrates, using a process of forming an electrode pattern by screen printing or a process of drilling holes in an insulating layer with a laser and filling them with via electrodes.

[0014] The insulator 3 has a pair of first and second principal surfaces facing each other, and a side surface connecting the first and second principal surfaces. As shown in Fig. 1, the insulator 3 is formed by stacking substrates in the Z direction on which are formed internal electrodes 11 of the first coil L1, internal electrodes 12 of the second coil L2, internal electrodes 13 of the first capacitor C1, and internal electrodes 14 of the second capacitor C2, which constitute a filter circuit.

[0015] A side electrode 21 constituting the first terminal P1, a side electrode 22 constituting the second terminal P2, a side electrode 23 constituting a GND terminal, and a side electrode 24 constituting a dead terminal (NC terminal) are formed at the four corners of the insulator 3 when viewed from the stacking direction. The shape of the external electrodes 41 to 44 when viewed from the stacking direction is quadrangular. Note that the side electrodes 21 to 24 do not need to be formed at the four corners of the insulator 3, as long as they are formed on the outer periphery of the insulator 3. The side electrodes 21 to 24 formed on the outer periphery of the insulator 3 are electrically connected to the external electrodes 41 to 44 formed on the side surfaces of the insulator 3, respectively.

[0016] The external electrodes 41 to 44 may be formed not only on the side surfaces of the insulator 3 but also on the bottom surface (second main surface) of the insulator 3 as shown in FIG. 1 . Of course, the external electrodes 41 to 44 may be formed not only on the bottom surface (second main surface) of the insulator 3 but also on the top surface (first main surface) of the insulator 3. The external electrodes 41 to 44 are thin film layers and plating layers formed on the side and bottom surfaces of the insulator 3. For example, if the side electrodes 21 to 24 are formed from silver (Ag) paste, the external electrodes 41 to 44 are formed from a gold (Au) plating layer to make it easier to solder the electronic component 1 to a mounting board.

[0017] However, forming a gold (Au) plating layer directly on side electrodes 21 to 24 formed from silver (Ag) paste results in poor adhesion, so two-layer external electrodes 41 to 44 are used, in which a nickel (Ni) plating layer is formed first and then a gold (Au) plating layer is formed on top of it. Figure 3 is a plan view of the vicinity of one external electrode 41 of electronic component 1 according to the embodiment. In Figure 3, external electrode 41 including a nickel (Ni) plating layer 41a (first external electrode layer) and a gold (Au) plating layer 41b (second external electrode layer) is provided on the side surface of insulator 3 on which side electrode 21 is formed.

[0018] In this way, when the external electrode 41 is provided on the side surface of the insulator 3 on which the side electrode 21 is formed, a gap may occur at the interface between the side surface of the insulator 3 and the external electrode 41. In particular, when the gold (Au) plating layer 41b is formed after the nickel (Ni) plating layer 41a is formed, the nickel (Ni) plating layer 41a may be eluted (Ni corrosion) when the gold (Au) plating layer 41b is formed, and therefore a gap occurs at the interface between the side surface of the insulator 3 and the external electrode 41. If a gap occurs at the interface between the side surface of the insulator 3 and the external electrode 41, moisture may penetrate into the insulator 3 through the gap, causing problems such as migration.

[0019] Therefore, in the electronic component 1 according to this embodiment, dummy electrodes 51 and 52 are provided on both sides of the side electrode 21, sandwiching an insulating portion, when viewed from the stacking direction (Z direction). Note that the dummy electrodes are not shown in the electronic component 1 shown in FIG. 1 . Also, in FIG. 3 , a gap occurring at the interface between the side surface of the insulator 3 and the external electrode 41 is indicated by a dashed triangle, and moisture penetrating through the gap is indicated by an arrow. By providing the dummy electrode 51, moisture penetrating through the gap cannot reach the side electrode 21 without bypassing the dummy electrode 51, thereby suppressing problems such as migration between the side electrode 21 and the internal electrode 13. In other words, providing the dummy electrodes 51 and 52 extends the path from the end of the external electrode 41 to the side electrode 21, thereby lengthening the path of moisture penetrating into the insulator 3.

[0020] Furthermore, external electrode 41 is provided from side electrode 21 to the position where dummy electrodes 51, 52 are arranged, and is connected to dummy electrodes 51, 52 on the side surface of insulator 3. That is, external electrode 41 is connected not only to side electrode 21 but also to dummy electrodes 51, 52. If insulator 3 is formed of, for example, a glass element, side electrode 21 and dummy electrodes 51, 52 have a higher degree of adhesion to external electrode 41, which is a plating layer, than does the glass element. Note that dummy electrodes 51, 52 are formed of the same material as side electrode 21, for example, a silver (Ag) paste, but may be made of a different material from side electrode 21 as long as the material has a higher degree of adhesion to external electrode 41 than does the glass element.

[0021] If the dummy electrodes 51, 52 are made of the same material as the side electrode 21, then even if the area of ​​the side electrode 21 is reduced by providing the dummy electrodes 51, 52, it is possible to suppress a decrease in the degree of adhesion between the external electrode 41 and the insulator 3. Furthermore, when the insulator 3 is fired, stress that causes the side electrode 21 to peel off from the insulator 3 is generated due to the difference in thermal contraction rate between the insulator 3 of the glass element and the metal side electrode 21. However, by providing the dummy electrodes 51, 52, the area of ​​the side electrode 21 is reduced, thereby alleviating the stress that causes peeling and suppressing delamination.

[0022] Furthermore, due to the difference in thermal shrinkage rate between the insulator 3 of the glass element and the metal side electrode 21 and dummy electrodes 51, 52, gaps form between the insulator 3 and the side electrode 21 and dummy electrodes 51, 52, but gaps are less likely to form between the external electrode 41 formed after firing the insulator 3 and the side electrode 21 and dummy electrodes 51, 52. Therefore, moisture does not penetrate between the dummy electrodes 51, 52 and the external electrode 41, but penetrates along the outer peripheries of the dummy electrodes 51, 52, thereby extending the penetration path.

[0023] 3, the shape of the dummy electrodes 51, 52 when viewed from the stacking direction (Z direction) is preferably rectangular in that the sides not in contact with the external electrodes 41 are longer than the sides in contact with the external electrodes 41. This ensures a sufficient perimeter length for the dummy electrodes 51, 52. The shape of the dummy electrodes 51, 52 is not limited to a rectangular shape, and may be a triangle, a circle, a polygon, or the like.

[0024] 3, the distance between the dummy electrodes 51, 52 and the internal electrode 13 is preferably longer than the distance between the side electrode 21 and the internal electrode 13. This prevents the formation of a path for moisture to penetrate from the dummy electrodes 51, 52 to the internal electrode 13. The distance here refers to the shortest distance connecting the side electrode 21 and the internal electrode 13.

[0025] While Fig. 3 describes moisture penetration in the planar direction (XY direction) of the insulator 3, moisture penetration can also be considered in the stacking direction (Z direction) of the insulator 3. Fig. 4 is a cross-sectional view of the vicinity of one external electrode 41 of the electronic component 1 according to the embodiment. The cross-sectional view shown in Fig. 4 is a cross-sectional view taken along the IV-IV plane in Fig. 3. Note that the electronic component 1 shown in Fig. 4 differs from the electronic component 1 shown in Fig. 1 in that an external electrode 41 is also provided on the top surface of the insulator 3.

[0026] 4 , if a gap occurs at the interface between the top surface of the insulator 3 and the external electrode 41, moisture may penetrate into the insulator 3 through the gap, potentially causing problems such as migration. Therefore, in the electronic component 1 according to this embodiment, the side electrode 21a (first side electrode) closest to the top surface of the insulator 3 and the side electrode 21b (second side electrode) one layer closer to the bottom surface of the insulator 3 than the side electrode 21a are not electrically connected by a via conductor. Note that the side electrode 21b is not limited to being provided one layer below the side electrode 21a; at least one layer of insulating substrate on which no side electrode or internal electrode is formed may be sandwiched between the side electrodes 21a and 21b. In other words, it is sufficient that the side electrode 21b is adjacent to the side electrode 21a at a position closer to the bottom surface of the insulator 3 than the side electrode 21a.

[0027] Therefore, even if moisture penetrates as indicated by the arrow through a gap (dashed triangle) formed at the interface between the top surface of the insulator 3 and the external electrode 41, the side electrode 21a is not connected to the side electrode 21b by a via conductor, and therefore the penetrated moisture cannot reach the side electrode 21b without bypassing the side electrode 21a, thereby suppressing problems such as migration between the side electrode 21b and the internal electrode. In other words, by not connecting the side electrode 21a to the side electrode 21b by a via conductor, the path from the end of the external electrode 41 to the side electrode 21b can be extended, thereby lengthening the path of moisture penetration into the insulator 3. Note that the dummy electrode 51a provided in the same layer as the side electrode 21a also contributes to lengthening the path of moisture penetration into the insulator 3.

[0028] To avoid the risk of a gap occurring at the interface between the bottom surface of the insulator 3 and the external electrode 41, in the electronic component 1 according to this embodiment, the side electrode 21k (third side electrode) closest to the bottom surface of the insulator 3 and the side electrode 21j (fourth side electrode) one layer closer to the top surface of the insulator 3 than the side electrode 21k are not electrically connected by a via conductor. Note that the configuration is not limited to a case where the side electrode 21j is provided one layer above the side electrode 21k; at least one layer of insulating substrate on which no side electrode or internal electrode is formed may be sandwiched between the side electrodes 21k and 21j. In other words, it is sufficient that the side electrode 21j is adjacent to the side electrode 21k at a position closer to the top surface of the insulator 3 than the side electrode 21k. This allows the path from the end of the external electrode 41 to the side electrode 21j to be extended, thereby lengthening the path for moisture to penetrate into the insulator 3. The dummy electrode 51k provided in the same layer as the side electrode 21k also contributes to lengthening the penetration path of moisture into the insulator 3.

[0029] In electronic component 1, the side electrodes of each layer are electrically connected to each other by via conductors, except between side electrode 21a and side electrode 21b and between side electrode 21k and side electrode 21j. Specifically, side electrode 21b and side electrode 21c are electrically connected to each other by via conductor 31, and side electrode 21c and side electrode 21d (not shown) are electrically connected to each other by via conductor 32. Note that the side electrodes of all layers, except between side electrode 21a and side electrode 21b and between side electrode 21k and side electrode 21j, are not necessarily electrically connected to each other by via conductors; it is sufficient that the side electrodes of some layers are electrically connected to each other by via conductors. Of course, the side electrodes of all layers do not necessarily have to be electrically connected to each other by via conductors.

[0030] It is preferable that the via conductors (e.g., via conductors 31, 32) that connect the side electrodes of each layer to each other are electrically connected directly to the external electrode 41. By electrically connecting the via conductors and the external electrode 41 directly, the electrical resistance between the external electrode 41 and the side electrode can be kept low. Of course, if the electrical resistance is low, it is not necessary to electrically connect the via conductors (e.g., via conductors 31, 32) that connect the side electrodes of each layer to each other to the external electrode 41 directly.

[0031] 3 and 4, the configuration near external electrode 41 has been described, but electronic component 1 also employs a similar configuration near other external electrodes 42 to 44, making it possible to suppress problems such as migration between the side electrodes and internal electrodes. Furthermore, electronic component 1 employs dummy electrodes 51 and 52 shown in FIG. 3, but does not necessarily have to employ the configuration shown in FIG.

[0032] Next, the configuration of each layer will be described using an exploded plan view. Fig. 5 is an exploded plan view showing the configuration of electronic component 1 according to an embodiment. First, for example, using a screen printing method, each of the electrode patterns for the internal electrodes and side electrodes of the coils and capacitors is formed with conductive paste (Ag paste) on insulating substrates 3a to 3l, which are the substrates, as shown in Fig. 5.

[0033] 5, side electrodes 21a to 24a and dummy electrodes 51a to 58a are formed on the insulating substrate 3a. Furthermore, the insulating substrate 3a is formed with an internal electrode 12a that forms part of the second coil L2, an internal electrode 13a that forms part of the first capacitor C1, and an internal electrode 14a that forms part of the second capacitor C2. The internal electrode 12a is electrically connected to the internal electrode 13a.

[0034] The insulating substrate 3b is formed with side electrodes 21b to 24b and dummy electrodes 51b to 58b. Furthermore, the insulating substrate 3b is formed with an internal electrode 12b that constitutes a part of the second coil L2, an internal electrode 13b that constitutes a part of the first capacitor C1, and an internal electrode 14b that constitutes a part of the second capacitor C2. The side electrode 21b is electrically connected to the internal electrode 13b, and the side electrode 24b is electrically connected to the internal electrode 14b. Furthermore, the connection point 34b of the side electrode 22b is electrically connected to the connection point 34a of the internal electrode 13a via a via conductor 34. The connection point 33b of the side electrode 23b is electrically connected to the connection point 33a of the internal electrode 14a via a via conductor 33.

[0035] The insulating substrate 3c is formed with side electrodes 21c to 24c and dummy electrodes 51c to 58c. Furthermore, the insulating substrate 3c is formed with an internal electrode 12c that forms part of the second coil L2, an internal electrode 13c that forms part of the first capacitor C1, and an internal electrode 14c that forms part of the second capacitor C2. The side electrode 22c is electrically connected to the internal electrode 13c, and the side electrode 23c is electrically connected to the internal electrode 14c.

[0036] The insulating substrate 3d is formed with side electrodes 21d to 24d and dummy electrodes 51d to 58d. Furthermore, the insulating substrate 3d is formed with an internal electrode 12d that constitutes a part of the second coil L2, an internal electrode 13d that constitutes a part of the first capacitor C1, and an internal electrode 14d that constitutes a part of the second capacitor C2. The side electrode 21d is electrically connected to the internal electrode 13d, and the side electrode 24d is electrically connected to the internal electrode 14d. Furthermore, the internal electrode 12d is electrically connected to the internal electrode 14d. The internal electrodes 12a to 12d are electrically connected by via conductors (not shown) to form the second coil L2.

[0037] The insulating substrate 3e has side electrodes 21e to 24e and dummy electrodes 51e to 58e formed thereon. Furthermore, the insulating substrate 3e has an internal electrode 13e that constitutes a part of the first capacitor C1 and an internal electrode 14e that constitutes a part of the second capacitor C2 formed thereon. The side electrode 22e is electrically connected to the internal electrode 13e, and the side electrode 23e is electrically connected to the internal electrode 14e.

[0038] The insulating substrate 3f is formed with side electrodes 21f to 24f and dummy electrodes 51f to 58f. Furthermore, the insulating substrate 3f is formed with an internal electrode 11f that constitutes a part of the first coil L1, an internal electrode 13f that constitutes a part of the first capacitor C1, and an internal electrode 14f that constitutes a part of the second capacitor C2. The side electrode 21f is electrically connected to the internal electrode 13f, and the side electrode 24f is electrically connected to the internal electrode 14f. Furthermore, the internal electrode 11f is electrically connected to the internal electrode 14f.

[0039] The insulating substrate 3g is provided with side electrodes 21g to 24g and dummy electrodes 51g to 58g. Furthermore, the insulating substrate 3g is provided with an internal electrode 11g that forms part of the first coil L1, an internal electrode 13g that forms part of the first capacitor C1, and an internal electrode 14g that forms part of the second capacitor C2. The side electrode 22g is electrically connected to the internal electrode 13g, and the side electrode 23g is electrically connected to the internal electrode 14g.

[0040] The insulating substrate 3h is provided with side electrodes 21h to 24h and dummy electrodes 51h to 58h. Furthermore, the insulating substrate 3h is provided with an internal electrode 11h that forms part of the first coil L1, an internal electrode 13h that forms part of the first capacitor C1, and an internal electrode 14h that forms part of the second capacitor C2. The side electrode 21h is electrically connected to the internal electrode 13h, and the side electrode 24h is electrically connected to the internal electrode 14h.

[0041] The insulating substrate 3i is provided with side electrodes 21i to 24i and dummy electrodes 51i to 58i. Furthermore, the insulating substrate 3i is provided with an internal electrode 11i that forms part of the first coil L1, an internal electrode 13i that forms part of the first capacitor C1, and an internal electrode 14i that forms part of the second capacitor C2. The side electrode 22i is electrically connected to the internal electrode 13i, and the side electrode 23i is electrically connected to the internal electrode 14i.

[0042] The insulating substrate 3j is formed with side electrodes 21j to 24j and dummy electrodes 51j to 58j. Furthermore, the insulating substrate 3j is formed with an internal electrode 11j that constitutes a part of the first coil L1, an internal electrode 13j that constitutes a part of the first capacitor C1, and an internal electrode 14j that constitutes a part of the second capacitor C2. The side electrode 21j is electrically connected to the internal electrode 13j, and the side electrode 24j is electrically connected to the internal electrode 14j. Furthermore, the internal electrode 11j is electrically connected to the internal electrode 13j. The internal electrodes 11f to 11j are electrically connected by via conductors (not shown) to form the first coil L1.

[0043] The insulating substrate 3k has side electrodes 21k to 24k and dummy electrodes 51k to 58k formed thereon. Furthermore, the insulating substrate 3k has an internal electrode 13k that forms a part of the first capacitor C1 and an internal electrode 14k that forms a part of the second capacitor C2 formed thereon. A connection point 36k of the internal electrode 13k is electrically connected to a connection point 36j of the side electrode 22j via a via conductor 36. A connection point 35k of the internal electrode 14k is electrically connected to a connection point 35j of the side electrode 23j via a via conductor 35.

[0044] All of the side electrodes, side electrodes 21b to 21j, side electrodes 22b to 22j, side electrodes 23b to 23j, and side electrodes 24b to 24j, are electrically connected to one another by via conductors as described in Fig. 4. Note that side electrodes 21l to 24l are formed on insulating substrate 3l in correspondence with external electrodes 41 to 44 formed on the bottom surface of insulator 3, respectively.

[0045] Here, the dummy electrodes 51a to 51k are collectively referred to as dummy electrodes 51, the dummy electrodes 52a to 52k are collectively referred to as dummy electrodes 52, the dummy electrodes 53a to 53k are collectively referred to as dummy electrodes 53, and the dummy electrodes 54a to 54k are collectively referred to as dummy electrodes 54. Furthermore, the dummy electrodes 55a to 55k are collectively referred to as dummy electrodes 55, the dummy electrodes 56a to 56k are collectively referred to as dummy electrodes 56, the dummy electrodes 57a to 57k are collectively referred to as dummy electrodes 57, and the dummy electrodes 58a to 58k are collectively referred to as dummy electrodes 58.

[0046] 5, at least one insulating substrate 3a to 3l is laminated on each side, and multiple insulating substrates (dummy layers) without printed electrode patterns are laminated on both the top and bottom sides. The multiple insulating substrates, including the dummy layers, are pressure-bonded together to form an unfired insulator 3 (glass element). The formed insulator 3 is fired, and the external electrodes 41 to 44 are formed on the outside of the fired insulator 3 by plating.

[0047] As described above, electronic component 1 according to the embodiment includes insulator 3 formed by stacking multiple insulating substrates, each including side electrodes 21-24 and internal electrodes 11-14, and external electrodes 41-44 electrically connected to side electrodes 21-24 and provided on the side surfaces of insulator 3. Each of multiple insulating substrates 3a-3k further includes dummy electrodes 51-58 disposed on both sides of side electrodes 21-24 with an insulating portion sandwiched between them when viewed from the stacking direction. External electrodes 41-44 are provided from side electrodes 21-24 to positions where dummy electrodes 51-58 are disposed, and are connected to dummy electrodes 51-58 on the side surfaces of insulator 3.

[0048] As a result, in the electronic component 1 according to the embodiment, the multiple insulating substrates further include dummy electrodes 51-58 arranged on both sides of the side electrodes 21-24, with insulating portions sandwiched between them, when viewed from the stacking direction, thereby suppressing the occurrence of defects such as migration. <Modifications> (1) In the electronic component 1 described so far, as shown in Figure 5, the internal electrodes 13a, 14a closest to the top surface of the insulator 3 and the internal electrodes 13k, 14k closest to the bottom surface of the insulator 3 are not electrically connected to the side electrodes. However, this is not limited to this, and the internal electrodes 13a, 14a and the internal electrodes 13k, 14k may be electrically connected to the side electrodes.

[0049] 6 is an exploded plan view showing the configuration of electronic component 1A according to Modification 1. In the configuration of electronic component 1A according to Modification 1, the same components as those of electronic component 1 according to the embodiment are denoted by the same reference numerals, and detailed description thereof will not be repeated.

[0050] As shown in FIG. 5, the insulating substrate 3a1 is formed with side electrodes 21a to 24a and dummy electrodes 51a to 58a. Furthermore, the insulating substrate 3a1 is formed with an internal electrode 12a constituting a part of the second coil L2, an internal electrode 13a constituting a part of the first capacitor C1, and an internal electrode 14a constituting a part of the second capacitor C2. The internal electrode 13a is electrically connected to the side electrode 22a, and the internal electrode 14a is electrically connected to the side electrode 23a. Therefore, even without providing a via conductor 33, the internal electrode 14a is electrically connected to the side electrode 23b because the side electrodes 23a and 23b are electrically connected via the external electrode 43 (see FIG. 1). Furthermore, even without providing a via conductor 34, the internal electrode 13a is electrically connected to the side electrode 22b because the side electrodes 22a and 22b are electrically connected via the external electrode 42 (see FIG. 1).

[0051] The insulating substrate 3k1 is formed with side electrodes 21k to 24k and dummy electrodes 51k to 58k. Furthermore, the insulating substrate 3k1 is formed with an internal electrode 13k that constitutes a part of the first capacitor C1 and an internal electrode 14k that constitutes a part of the second capacitor C2. The internal electrode 13k is electrically connected to the side electrode 22k, and the internal electrode 14k is electrically connected to the side electrode 23k. Therefore, even without providing a via conductor 35, the internal electrode 14k is electrically connected to the side electrode 23j because the side electrodes 23j and 23k are electrically connected via the external electrode 43 (see FIG. 1). Furthermore, even without providing a via conductor 36, the internal electrode 13k is electrically connected to the side electrode 22j because the side electrodes 22j and 22k are electrically connected via the external electrode 42 (see FIG. 1).

[0052] The electronic component 1A according to the first modification can ensure a degree of freedom in design by adopting the configuration shown in FIG.

[0053] (2) In the electronic component 1 described above, as shown in Fig. 5, dummy electrodes 51 to 58 are formed on all of the layers of side electrodes 21 to 24. However, the present invention is not limited to this, and the electronic component may have dummy electrodes 51 to 58 formed on necessary layers of the layers of side electrodes 21 to 24.

[0054] 7 is an exploded plan view showing the configuration of electronic component 1B according to Modification 2. In the configuration of electronic component 1B according to Modification 2, the same components as those of electronic component 1 according to the embodiment are denoted by the same reference numerals, and detailed description thereof will not be repeated.

[0055] Insulating substrates 3b2, 3d2, 3f2, 3h2, and 3j2, dummy electrodes 55 and 56 are formed only near side electrode 23. Furthermore, insulating substrates 3a2, 3c2, 3e2, 3g2, 3i2, and 3k2 have dummy electrodes 53 and 54 formed only near side electrode 24.

[0056] By adopting the configuration shown in FIG. 7 , electronic component 1B according to variant example 2 has dummy electrodes only on electrodes (e.g., side electrodes 23 and 24) where a voltage difference may occur and migration may occur. This eliminates the need to provide unnecessary dummy electrodes, and allows a larger area to be secured on the insulating substrate where internal electrodes can be formed.

[0057] (3) In the electronic component 1 described so far, as shown in Fig. 3, one dummy electrode 51, one dummy electrode 52 are formed on each side of the side electrode 21. However, this is not limited to this, and the electronic component may have multiple dummy electrodes formed on each side of the side electrode 21.

[0058] 8 is a plan view of the vicinity of one external electrode of an electronic component according to Modification 3. In the configuration of electronic component 1C according to Modification 3, the same components as those of electronic component 1 according to the embodiment are denoted by the same reference numerals, and detailed description thereof will not be repeated.

[0059] In electronic component 1C according to Variation 3, dummy electrodes 51A and 52A (first dummy electrodes) are provided on both sides of side electrode 21, sandwiching an insulating portion, when viewed from the stacking direction (Z direction). Furthermore, electronic component 1C also has dummy electrodes 51B and 52B (second dummy electrodes) located farther from side electrode 21 than dummy electrodes 51A and 52A. External electrode 41 extends from side electrode 21 to the locations where dummy electrodes 51B and 52B are located, and is connected to dummy electrodes 51A, 51B, 52A, and 52B on the side of insulator 3. By providing dummy electrode 51B in addition to dummy electrode 51A, moisture penetrating through gaps cannot reach side electrode 21 without bypassing dummy electrode 51A and dummy electrode 51B. This further reduces problems such as migration between side electrode 21 and internal electrode 13. In other words, by providing dummy electrodes 51B and 52B in addition to dummy electrodes 51A and 52A, the path from the end of external electrode 41 to side electrode 21 can be extended, and the penetration path for moisture into the interior of insulator 3 can be lengthened.

[0060] Although not shown, electronic component 1C may further include multiple dummy electrodes located farther from side electrode 21 than dummy electrodes 51B and 5Bb. While the configuration near external electrode 41 has been described in Fig. 8, electronic component 1C employs a similar configuration near other external electrodes 42 to 44. In other words, dummy electrodes 51 to 54 of electronic component 1C include dummy electrodes (first dummy electrodes) that are close to side electrodes 21 to 24 when viewed from the stacking direction, and dummy electrodes (second dummy electrodes) that are far from side electrodes 21 to 24, thereby further suppressing problems such as migration between the side electrodes and internal electrodes.

[0061] <Aspects> (1) An electronic component according to the present disclosure comprises an insulator formed by stacking a plurality of insulating substrates, each of which includes a side electrode and an internal electrode; and external electrodes electrically connected to the side electrodes and provided on the side surfaces of the insulator, wherein the plurality of insulating substrates further include dummy electrodes arranged on both sides of the side electrodes with insulating portions sandwiched therebetween when viewed from the stacking direction, and the external electrodes are connected to the dummy electrodes on the side surfaces of the insulator.

[0062] (2) In the electronic component described in (1), the insulator has a first main surface and a second main surface that face each other in the stacking direction, and there is no electrical connection by via conductors between the first side electrode closest to the first main surface and the second side electrode adjacent to the first side electrode at a position closer to the second main surface than the first side electrode, and between the third side electrode closest to the second main surface and the fourth side electrode adjacent to the first main surface at a position closer to the first main surface than the third side electrode.

[0063] (3) In the electronic component described in (2), the side electrodes of each layer are electrically connected to each other by via conductors, except between the first side electrode and the second side electrode, and between the third side electrode and the fourth side electrode.

[0064] (4) In the electronic component according to (3), the via conductor is electrically connected directly to the external electrode.

[0065] (5) In the electronic component according to any one of (1) to (4), the distance between the dummy electrode and the internal electrode is longer than the distance between the side electrode and the internal electrode.

[0066] (6) In the electronic component according to any one of (1) to (5), the shape of the dummy electrode when viewed from the stacking direction is a rectangle in which the side not in contact with the external electrodes is longer than the side in contact with the external electrodes.

[0067] (7) In the electronic component according to any one of (1) to (6), the dummy electrodes include a first dummy electrode that is close to the side electrode when viewed from the stacking direction, and a second dummy electrode that is far from the side electrode.

[0068] (8) In the electronic component described in any one of (1) to (7), the external electrodes include a first external electrode layer provided on a side surface of the insulator and a second external electrode layer covering the first external electrode layer, and the first external electrode layer is in contact with the side electrode and the dummy electrode.

[0069] (9) In the electronic component described in (8), the first external electrode layer is made of nickel and the second external electrode layer is made of gold.

[0070] (10) In the electronic component according to any one of (1) to (9), the side electrodes are provided at four corners of the insulator when viewed from the stacking direction, and each of the side electrodes has a rectangular shape.

[0071] (11) In the electronic component according to any one of (1) to (10), the internal electrodes include at least an electrode that constitutes a part of a coil and an electrode that constitutes a part of a capacitor, and form a filter circuit within the insulator.

[0072] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims.

[0073] 1, 1A to 1C: electronic components; 3: insulator; 3a to 3l: insulating substrate; 11 to 14: internal electrodes; 21 to 24: side electrodes; 31 to 36: via conductors; 41 to 51: external electrodes; 51 to 58: dummy electrodes.

Claims

1. An electronic component, an insulator formed by laminating a plurality of insulating substrates, each of which includes a side electrode and an internal electrode; an external electrode electrically connected to the side electrode and provided on a side surface of the insulator, each of the plurality of insulating substrates further includes dummy electrodes disposed on both sides of the side electrode with an insulating portion sandwiched therebetween when viewed from the stacking direction; the external electrode is connected to the dummy electrode on a side surface of the insulator, the insulator has a first main surface and a second main surface that face each other in a stacking direction, There is no electrical connection by a via conductor between a first side electrode closest to the first main surface and a second side electrode adjacent to the first side electrode at a position closer to the second main surface than the first side electrode, and between a third side electrode closest to the second main surface and a fourth side electrode adjacent to the first main surface at a position closer to the first main surface than the third side electrode. An electronic component, wherein the side electrodes of at least some of the layers between the second side electrode and the fourth side electrode are electrically connected to each other by the via conductors.

2. An electronic component as described in claim 1, wherein the side electrodes of all layers between the second side electrode and the fourth side electrode are electrically connected to each other by the via conductor.

3. The electronic component according to claim 2 , wherein the via conductor is directly electrically connected to the external electrode.

4. 4. The electronic component according to claim 1, wherein the distance between the dummy electrode and the internal electrode is longer than the distance between the side electrode and the internal electrode.

5. The electronic component according to any one of claims 1 to 3, wherein the shape of the dummy electrode when viewed from the stacking direction is a rectangle in which the side not in contact with the external electrode is longer than the side in contact with the external electrode.

6. The electronic component according to any one of claims 1 to 3, wherein the dummy electrodes include a first dummy electrode that is close to the side electrode when viewed from the stacking direction, and a second dummy electrode that is far from the side electrode.

7. The electronic component according to any one of claims 1 to 3, wherein the external electrodes include a first external electrode layer provided on a side surface of the insulator and a second external electrode layer covering the first external electrode layer, and the first external electrode layer is in contact with the side electrode and the dummy electrode.

8. 8. The electronic component according to claim 7, wherein the first external electrode layer is made of nickel and the second external electrode layer is made of gold.

9. 4. The electronic component according to claim 1, wherein the side electrodes are provided at four corners of the insulator when viewed from the stacking direction, and each of the side electrodes has a rectangular shape.

10. The electronic component according to any one of claims 1 to 3, wherein the internal electrodes include at least an electrode that constitutes a part of a coil and an electrode that constitutes a part of a capacitor, and form a filter circuit within the insulator.