Curable resin composition, curable film, and layered film

JPWO2025009565A1Pending Publication Date: 2025-01-09
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Patent Information

Application Number
JP2025531581
Authority / Receiving Office
JP · JP
Patent Type
Applications
Priority Date
2023-07-06
Filing Date
2024-07-03
Publication Date
2025-01-09
Patent Text Reader

Abstract

A curable resin composition according to one aspect of the present disclosure comprises (A) a rubber component, (B) a compound having an epoxy group, (C) a curing agent, (D) a curing accelerator, and (E) a filler, wherein the rubber component (A) comprises a modified styrene-based elastomer having a degree of modification with maleic anhydride of 1.8-10.0 mass%.
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