Curable resin composition, curable film, and layered film
JPWO2025009565A1Pending Publication Date: 2025-01-09
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Patent Information
- Application Number
- JP2025531581
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Priority Date
- 2023-07-06
- Filing Date
- 2024-07-03
- Publication Date
- 2025-01-09
Abstract
A curable resin composition according to one aspect of the present disclosure comprises (A) a rubber component, (B) a compound having an epoxy group, (C) a curing agent, (D) a curing accelerator, and (E) a filler, wherein the rubber component (A) comprises a modified styrene-based elastomer having a degree of modification with maleic anhydride of 1.8-10.0 mass%.
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