Substrate production system and substrate production method
Patent Information
- Application Number
- JP2025541236
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Filing Date
- 2023-08-23
- Publication Date
- 2025-02-27
Abstract
Description
Substrate production system and substrate production method
[0001] The technology disclosed in this specification relates to a board production system and a board production method.
[0002] Conventionally, board production systems that include a screen printer, a component mounter, etc. are well known. In board production systems, a component-mounted board is typically produced by printing solder paste on a board using a screen printer and then mounting components on the board using a component mounter.
[0003] The gap that occurs between the mask (screen mask) and the substrate during paste printing is one of the factors that significantly affects print quality. For example, if the gap is larger than the paste particles, the pressure applied when filling the mask openings with solder paste can cause the solder paste to seep into the gap, resulting in bleed. This results in poor print quality. Gaps between the mask and the substrate are caused by substrate thickness errors, surface irregularities, warpage, and other factors. Therefore, a technique for checking such gaps has been proposed in the past. This technique involves elevating the substrate to a pre-set printing position before paste printing and measuring the size of the gap between the mask and the substrate. This technique controls the amount of substrate lift based on the gap measurement results, increasing the amount of pressure the substrate is pressed against the mask, thereby suppressing printing defects such as bleed. Related techniques are known, for example, from Patent Document 1 (WO 2019 / 049278).
[0004] However, in areas where the board is partially recessed or where the board is bulged due to printed matter (e.g., characters printed on the board), the board will not adhere to the mask even if the board lift amount is increased. In such cases, it is difficult to determine a single board lift amount (amount of pressure against the mask) that will reduce printing defects based on the results of multiple gap measurements. In other words, in conventional technology, the relationship between the degree of adhesion between the mask and the board and the quality of the solder paste printing is unclear.
[0005] Therefore, this specification provides a technique for clarifying the relationship between the degree of adhesion between the mask and the substrate and the quality of the printing state of the solder paste.
[0006] This specification discloses a system for producing component-mounted boards by mounting components on a board printed with solder paste. The board production system includes a mask holding device, a board pressing device, a squeegee device, an adhesion inspection device, a print inspection device, a storage device, and a control device. The mask holding device holds a mask having a mask opening. The board pressing device lifts the supported board and presses the board against the mask from below. The squeegee device spreads solder paste on the mask, transferring the solder paste to portions of the board corresponding to the mask openings. The adhesion inspection device measures the size of the gap between the mask and the board to inspect the adhesion between the mask and the board. The print inspection device performs three-dimensional measurement of the solder paste printed on the board to inspect the printing condition of the solder paste. The storage device stores association information that associates adhesion inspection results with printing condition inspection results. The control device determines whether the adhesion between the mask and the board is good or bad based on the association information stored in the storage device and the inspection results obtained by the adhesion inspection device. Therefore, with the above-described configuration, it is possible to clarify the relationship between the degree of adhesion between the mask and the substrate and the quality of the printed state of the solder paste.
[0007] This specification further discloses a method for producing component-mounted boards by mounting components on a board printed with solder paste. The board production method includes an adhesion inspection step, a printing inspection step, an information storage step, and a judgment step. In the adhesion inspection step, the size of the gap between a mask used for printing solder paste and the board is measured to inspect the adhesion between the mask and the board. In the printing inspection step, the solder paste printed on the board is measured in three dimensions to inspect the printing condition of the solder paste. In the information storage step, information correlating the adhesion inspection results with the printing condition inspection results is stored. In the judgment step, the quality of the adhesion between the mask and the board is judged based on the associated information and the inspection results obtained by the adhesion inspection device.
[0008] It is a schematic diagram showing a board production system of an embodiment. It is a perspective view showing a board and a metal mask. It is a block diagram showing the electrical configuration of the board production system. It is an image diagram showing a state where the size of the gap between the metal mask and the board is measured. It is an image diagram showing a state where solder paste is three-dimensionally measured.
[0009] (Mode 1) In the board production system disclosed herein, the association information may be information that associates the adhesion inspection results and the mask opening size with the printing condition inspection results. The control device may determine whether the adhesion between the mask and the board is good or bad based on the association information, the inspection results obtained by the adhesion inspection device, and the mask opening size. By associating the mask opening size, the adhesion between the mask and the board can be appropriately determined. (Mode 2) In the board production system disclosed herein, the association information may be information that associates the adhesion inspection results, the mask opening size, and at least one condition selected from printing conditions, environmental conditions, and clamping conditions related to the pressure for clamping the board when printing the solder paste with the printing condition inspection results. The control device may further derive optimal printing conditions, environmental conditions, or clamping conditions for the adhesion based on the association information and the result of the determination. With this configuration, by associating the printing conditions, the printing conditions can be derived based on the result of the determination of the adhesion between the mask and the board. (Mode 3) In the board production system disclosed herein, the control device may determine the amount of board lift based on the results of the pass / fail judgment, derive optimal printing conditions, environmental conditions, or clamping conditions for the determined amount of board lift, or control each device to automatically set the determined amount of board lift and the derived conditions and perform printing. With this configuration, the board lift amount determined based on the results of the pass / fail judgment and the derived conditions are automatically set, simplifying various adjustments before printing. (Mode 4) In the board production system disclosed herein, the control device may instruct printing of solder paste on the board if it determines that good print results will be obtained, but may eject the board without instructing printing of solder paste on the board or stop the operation due to an error if it determines that good print results will not be obtained. With this configuration, printing is not performed if it determines that good print results will not be obtained, thereby preventing the production of poorly printed boards.
[0010] (Example) A board production system and a board production method according to this example will be described below with reference to the drawings. As shown in FIG. 1 , a board production system 10 according to this example is a system that produces component-mounted boards by mounting components on a board 1 on which solder paste has been printed. The board production system 10 includes a screen printer 11 and a component mounter (not shown). The screen printer 11 is a device that prints solder paste on the board 1 and transports the board 1 after the solder paste printing to the component mounter. The component mounter is a device that mounts components on the board 1 and transports the board 1 after the components have been mounted outside the board production system 10. Examples of components include semiconductor packages such as QFPs (Quad Flat Packages) and BGAs (Ball Grid Arrays), and chip components such as chip resistors and chip capacitors.
[0011] The screen printing machine 11 includes a mask holding device 20, a substrate pressing device 50, and a squeegee device 60. The mask holding device 20 holds a metal mask 2 having a substantially square mask opening 3 (see FIG. 2). Specifically, the mask holding device 20 holds the metal mask 2 in a mask holder 22 via a rectangular frame 21. The metal mask 2 in this embodiment is a mask for printing solder paste.
[0012] Furthermore, a substrate transport device 23, a clamp device 24, and an elevator device 25 are provided below the mask holder 22. The substrate transport device 23 is a device that performs the operations of transporting the substrate 1 to a work position within the screen printing machine 11, positioning the substrate 1 at the work position before solder paste printing, and transporting the substrate 1 from the work position after solder paste printing. The substrate transport device 23 can be composed of a pair of belt conveyors 26, a support device (not shown) that is attached to the belt conveyors 26 and supports the substrate 1 from below, and a drive device (not shown) that drives the belt conveyors 26.
[0013] The clamping device 24 is a device for clamping the substrate 1. The clamping device 24 includes a pair of side frames 27 and a support base 28 that supports both side frames 27. One side frame 27 (the right side in FIG. 1 ) is provided with a ball screw mechanism 29, and the distance between the side frame 27 and the other side frame 27 (the left side in FIG. 1 ) can be adjusted by driving a clamping motor 30 (see FIG. 3 ). Clamping units 31 are attached to the upper end surfaces of both side frames 27, and the clamping units 31 can grip the substrate 1 by moving them closer to each other. A pair of belt conveyors 26 of the substrate transport device 23 are disposed inside both side frames 27. The support base 28 is supported via a ball screw mechanism (not shown) and is configured to be raised and lowered by an elevation motor 32.
[0014] The lifting device 25 includes a lifting platform 34 that moves up and down along a guide rail 33 extending in the vertical direction, and the lifting platform 34 is connected to a lifting motor 36 via a ball screw mechanism 35. The substrate transport device 23, the clamping device 24, and the like are mounted on the lifting platform 34 via a support platform 37. A pair of mask supports 38 are provided on the support platform 37, and a mask support plate 39 that supports the metal mask 2 is fixed to the upper end surfaces of both mask supports 38. One of the mask supports 38 (the right one in FIG. 1) is equipped with a ball screw mechanism 40, and the distance to the other mask support 38 (the left one in FIG. 1) can be adjusted by driving a mask support motor 41 (see FIG. 3).
[0015] 1 , the substrate pressing device 50 is a device that lifts the supported substrate 1 and presses the substrate 1 against the metal mask 2 from below. The substrate pressing device 50 is disposed between a pair of side frames 27 of the clamp device 24. In the substrate pressing device 50, a backup table 52 equipped with a plurality of backup pins 51 is supported via a ball screw mechanism 53, and the backup table 52 is configured to be raised and lowered by a backup motor 54.
[0016] A camera C1 that is movable in a planar direction is provided between the mask holder 22 and the clamp device 24. When the camera C1 captures an image of a mark (not shown) attached to the substrate 1, the amount of relative positional deviation in the planar direction between the substrate 1 and the metal mask 2 is calculated. Then, based on the calculated amount of positional deviation, a correction device (not shown) provided on the support base 37 corrects the positional deviation.
[0017] The squeegee device 60 is also installed above the mask holder 22. The squeegee device 60 spreads the solder paste onto the metal mask 2, thereby transferring the solder paste to the portions of the substrate 1 that correspond to the mask openings 3 (see FIG. 2). Specifically, the squeegee device 60 includes a running platform 61, on which a pair of squeegees 62 are mounted so as to be able to move up and down. The running platform 61 is slidably mounted on a guide rod 63, and is capable of linear movement by being driven by a squeegee motor 65 (see FIG. 3) via a ball screw mechanism consisting of a screw shaft 64 arranged parallel to the guide rod 63.
[0018] The screen printing machine 11 also includes an adhesion inspection device 70 (see FIGS. 2 and 3 ) and a print inspection device 80 (see FIG. 3 ). As shown in FIG. 2 , the adhesion inspection device 70 measures the size of the gap between the metal mask 2 and the substrate 1 to inspect (measure) the adhesion between the metal mask 2 and the substrate 1. Specifically, before printing the solder paste, the adhesion inspection device 70 raises the substrate 1 to a printing position where it contacts the metal mask 2 and measures the size of the gap between the metal mask 2 and the substrate 1. The adhesion inspection device 70 of this embodiment also includes a laser displacement sensor 71. In this embodiment, the laser displacement sensor 71 is mounted on the running platform 61 of the squeegee device 60. The laser displacement sensor 71 is a sensor that measures the top surface height of the substrate 1, the metal mask 2, etc. without contact.
[0019] The print inspection device 80 is a device that performs three-dimensional measurement of the solder paste printed on the substrate 1 to inspect the printing condition of the solder paste. In this embodiment, for example, a scanning laser probe type non-contact three-dimensional measuring machine is used as the print inspection device 80. The print inspection device 80 is mounted inside the screen printing machine 11, specifically, to the side of the camera C1. The print inspection device 80 inspects the solder transfer condition, such as the volume and area (bleed) of the solder paste after printing.
[0020] As shown in Figure 3, the board production system 10 includes a control device 90. The control device 90 is a computer that includes a CPU 91, a ROM 92, a RAM 93, a memory 94, an input / output interface 95, etc. The ROM 92 stores a basic program for supplying solder paste to the board 1. The memory 94 stores a print control program for the screen printer 11, etc.
[0021] A touch panel display device 96 is also connected to the control device 90, allowing the worker to input data and display the details of the work. The laser displacement sensor 71 of the adhesion inspection device 70, the print inspection device 80, and the camera C1 are also connected to the control device 90. The motors 30 and 32 of the clamp device 24, the motors 36 and 41 of the lifting device 25, the motor 54 of the substrate pressing device 50, and the motor 65 of the squeegee device 60 are also connected to the control device 90.
[0022] Next, a board production method using board production system 10 will be described.
[0023] First, in the screen printing machine 11, the belt conveyor 26 transports the substrate 1 between the pair of side frames 27. Then, the backup motor 54 is driven to raise the backup table 52, and the substrate 1 is lifted from the belt conveyor 26 by the multiple backup pins 51. Furthermore, the clamping motor 30 is driven to move both side frames 27 in directions approaching each other, whereby the substrate 1 is sandwiched and held between the pair of clamps 31.
[0024] Next, the lift motor 32 is driven to raise the clamp device 24 holding the substrate 1, so that the upper surfaces of the clamp unit 31 and the substrate 1 are aligned with the upper surface of the mask support plate 39. Furthermore, the lift motor 36 is driven to raise the lift platform 34 and push up the substrate 1, so that the substrate 1 is pressed against the metal mask 2 from below.
[0025] One factor that reduces the printing quality of the solder paste is a decrease in adhesion due to a large gap between the metal mask 2 and the substrate 1. To solve this problem, the CPU 91 of the control device 90 first measures the size of the gap between the metal mask 2 and the substrate 1 and performs a process (adhesion inspection step) to inspect the adhesion between the metal mask 2 and the substrate 1. The measurement of the gap size is performed by pressing the start button displayed on the display device 96. First, as shown in FIG. 4 , the lifting motors 32 and 36 and the backup motor 54 are driven to position the substrate 1 at a printing height (i.e., the position of the top surface of the substrate 1 (position indicated by H1) = the printing reference height (H0)) at which the position of the top surface of the substrate 1 (position indicated by H1) theoretically coincides with the position of the bottom surface of the metal mask 2 (position indicated by H0). Note that even if the position of the top surface of the substrate 1 (position H1) is positioned at the printing reference height (H0) as shown in FIG. 4 , the top surface of the substrate 1 and the bottom surface of the metal mask 2 do not necessarily come into close contact with each other due to bending of the substrate 1 or the like.
[0026] After the substrate 1 is positioned, the heights of the substrate 1 and the metal mask 2 are measured using a laser displacement sensor 71. In the height measurement, the laser displacement sensor 71 moves together with the running platform 61 of the squeegee device 60, and laser light is continuously irradiated onto the metal mask 2. As a result, the distance from the laser displacement sensor 71 to the top surface of the substrate 1 (land 4) (substrate top surface distance L1) and the distance from the laser displacement sensor 71 to the top surface of the metal mask 2 (mask top surface distance L2) are acquired as a set of measurement data (see FIG. 4).
[0027] Next, the size X of the gap between the metal mask 2 and the substrate 1 is calculated from the distances L1 and L2 and the thickness C of the metal mask 2 input from the display device 96. Specifically, first, the top surface distance B is calculated by calculating the difference between the substrate top surface distance L1 and the mask top surface distance L2. Then, the size X of the gap is calculated based on the formula (top surface distance B - thickness C). The calculation of size X is performed at multiple locations on the substrate 1.
[0028] Thereafter, the CPU 91 drives the squeegee device 60 to spread the solder paste over the metal mask 2 and force the solder paste into the mask openings 3 (see FIG. 2 ) of the metal mask 2. As a result, the solder paste is transferred onto the lands 4 formed on the substrate 1 in the areas corresponding to the mask openings 3.
[0029] In the subsequent print inspection step, the print inspection device 80 performs three-dimensional measurement of the solder paste printed on the substrate 1. In the three-dimensional measurement, the print inspection device 80 moves together with the camera C1, and laser light L3 is continuously irradiated onto the printed solder paste (see FIG. 5 ). As a result, the three-dimensional shape of the printed solder paste is acquired as three-dimensional shape data. The print inspection device 80 then inspects the printing condition of the three-dimensionally measured solder paste. Specifically, the print inspection device 80 inspects the solder transfer condition, such as the volume of the solder bumps 5 and the area (bleed) of the printed solder paste, based on the acquired three-dimensional shape data. As a result, the volume and area of the printed solder paste are acquired as inspection data.
[0030] After the print inspection step is completed, the lifting motors 32 and 36 are driven to lower the substrate 1 for plate separation. Then, the belt conveyor 26 is driven to transport the substrate 1 out of the screen printing machine 11. Furthermore, the printed substrate 1 is transported into a component mounter, where components are mounted on the substrate 1, thereby producing a component-mounted substrate.
[0031] When the print inspection step is executed, association information associating the adhesion inspection results (the size X of the gaps at multiple locations on the substrate 1) with the print condition inspection results (the volume and area of the printed solder paste) is stored in the RAM 93 (information storage step). That is, the RAM 93 functions as a storage device for storing association information. Furthermore, in addition to the adhesion inspection results and the print condition inspection results, the RAM 93 also stores printing conditions (printing speed, printing pressure, plate release conditions, etc.) and environmental conditions (remaining amount of solder, atmospheric temperature and humidity, cleaning timing, etc.) in association with each other.
[0032] Once the association information is stored in the RAM 93 using the above method, the CPU 91 further executes a determination step for the next board 1 to be produced. That is, in the same manner as described above, a new board 1 is loaded into the screen printing machine 11. When the newly loaded board 1 is pressed against the metal mask 2 from below (i.e., when the position (H1) of the top surface of the board 1 is positioned at the printing reference height (H0)), a process of inspecting the adhesion between the metal mask 2 and the board 1 (adhesion inspection step) is first executed. Next, the CPU 91 determines whether the adhesion between the metal mask 2 and the board 1 is good or bad based on the association information stored in the RAM 93 and the inspection results obtained by the adhesion inspection device 70. The CPU 91 then displays (presents) the result of the pass / fail determination on the display device 96. Furthermore, the CPU 91 further derives optimal printing conditions and environmental conditions for the adhesion based on the association information and the result of the pass / fail determination. Specifically, the CPU 91 determines the amount of substrate lift (amount of pressure applied to the metal mask 2) based on the pass / fail judgment results, and derives optimal printing conditions and environmental conditions for the determined amount of substrate lift. The determined amount of substrate lift and the derived conditions (printing conditions and environmental conditions) are displayed on the display device 96. After checking the displayed contents, the operator then newly sets the amount of substrate lift and the derived conditions (printing conditions and environmental conditions) displayed on the display device 96. Therefore, the amount of substrate lift, printing conditions, and environmental conditions are adjusted until good printing results are obtained.
[0033] For example, if association information indicating that defects (bleeding) will occur at the mask opening 3 when the gap is 0.1 mm or more is stored in RAM 93, and if the next board 1 to be produced has a gap of 0.1 mm or more (e.g., 0.15 mm) or more, CPU 91 displays (presents) on display device 96 a message indicating that the board lift amount should be increased by, for example, 0.15 mm so that the gap becomes less than 0.1 mm. Next, the operator sets a new board lift amount, and if it is determined that good printing results can be obtained, CPU 91 instructs printing of solder paste on board 1. Note that if it is determined that good printing results cannot be obtained, CPU 91 does not instruct printing of solder paste on board 1 and ejects board 1 from board production system 10.
[0034] When the amount of substrate lift is determined based on the pass / fail judgment results, the optimal printing and environmental conditions for the determined amount of substrate lift may be derived based on the three-dimensional measurement results obtained in the printing inspection step. Specifically, the RAM 93 stores association information that associates the results of the adhesion inspection (the size X of the gap at multiple locations on the substrate 1), the results of the print condition inspection (the volume and area of the printed solder paste), the printing conditions (printing speed, printing pressure, stencil release conditions, etc.), and the environmental conditions (the amount of remaining solder, ambient temperature and humidity, cleaning timing, etc.). Once the amount of substrate lift is determined, association information obtained when printing is performed with the same amount of substrate lift as the determined amount of substrate lift is extracted from the association information stored in the RAM 93. Then, the extracted association information that produces the optimal print result (i.e., the three-dimensional measurement results) is selected, and the printing and environmental conditions are derived from the selected association information. For example, once the amount of substrate lift is determined, the CPU 91 searches for association information stored in the RAM 93, extracts association information that matches the amount of substrate lift, and outputs a list of printing conditions and environmental conditions in descending order of print results.The CPU 91 (or the user) then determines the printing conditions and environmental conditions from the output list of printing conditions and environmental conditions.
[0035] If the association information indicates that increasing the substrate lift amount (substrate pressing amount) will not change the gap X between the substrate 1 and the metal mask, the printing conditions and environmental conditions may be changed without changing the substrate lift amount (substrate pressing amount). If it is possible to reduce the gap X by changing the printing conditions and environmental conditions, for example, printing inspection data obtained when the gap X is reduced by changing the printing conditions and environmental conditions without changing the substrate lift amount (substrate pressing amount) may be compared with printing inspection data obtained when the substrate lift amount (substrate pressing amount) is changed (but the gap X remains unchanged) and the printing conditions and environmental conditions are changed, and the conditions that result in better quality may be adopted. If a comparison of the two printing inspection data does not determine which is better, association information for substrates of different sizes may be added to the data used to determine the substrate lift amount, printing conditions, and environmental conditions. As described above, whether to change the substrate lift amount, the printing conditions, and environmental conditions, or both the substrate lift amount and the printing conditions and environmental conditions can be determined based on the association information stored in RAM 93 so as to obtain optimal printing results.
[0036] As described above, the board production system 10 of this embodiment stores association information that associates the adhesion inspection results obtained by the adhesion inspection device 70 with the print condition inspection results obtained by the print inspection device 80. This clarifies the relationship between the adhesion between the metal mask 2 and the board 1 and the quality of the solder paste printing condition (whether or not there are printing defects such as bleeding). When printing on a new board 1, the quality of the adhesion between the metal mask 2 and the board 1 is determined based on the stored association information and the inspection results obtained by the adhesion inspection device 70. Therefore, printing conditions (e.g., the amount of board lift (amount of pressure against the metal mask 2)) for reducing printing defects can be determined based on the results of the determination of the quality of the adhesion (the gap between the metal mask 2 and the board 1).
[0037] Although the above describes the exemplary embodiment, the specific configuration is not limited to the exemplary embodiment. In the exemplary embodiment, the association information is information that associates the adhesion inspection results with the print condition inspection results, and the CPU 91 determines whether the adhesion between the metal mask 2 and the substrate 1 is good or bad based on the association information and the inspection results obtained by the adhesion inspection device 70. However, the present invention is not limited to this configuration. For example, in another exemplary embodiment, the association information may be information that associates the adhesion inspection results, the size (or approximate size) of the mask opening 3, and the inspection results of the print condition, and the CPU 91 may determine whether the adhesion between the metal mask 2 and the substrate 1 is good or bad based on the association information, the inspection results obtained by the adhesion inspection device 70, and the size (or approximate size) of the mask opening 3. The CPU 91 may then determine the amount of substrate lift based on the result of the pass / fail determination and display (present) the determined amount of substrate lift on the display device 96.
[0038] For example, consider a case where association information indicating that a defect (bleed) will occur at a square mask opening 3 with a side length of 0.6 mm when the gap is 0.15 mm or more, and association information indicating that a transfer defect will occur at a circular mask opening with an inner diameter of 0.3 mm when the gap is 0.05 mm or more, are stored in the RAM 93. In this case, if the next substrate 1 to be produced has a gap near the square mask opening 3 of less than 0.15 mm (e.g., 0.1 mm) and a gap near the circular mask opening of 0.05 mm or more (e.g., 0.08 mm), the CPU 91 may display (present) on the display device 96 a message indicating that the substrate lift amount should be increased by, for example, 0.08 mm so that the gap near the circular mask opening becomes less than 0.05 mm.
[0039] In the above embodiment, the association information is information associating the adhesion inspection results with the print condition inspection results, and the CPU 91 determines whether the adhesion between the metal mask 2 and the substrate 1 is good or bad based on the association information and the inspection results obtained by the adhesion inspection device 70. However, this configuration is not limited to this. For example, in another embodiment, the association information may be information associating the print condition inspection results with the adhesion inspection results, the size of the mask opening 3, and at least one condition selected from the printing conditions, environmental conditions, and clamping conditions related to the pressure for clamping the substrate 1 when printing the solder paste. In this case, the CPU 91 may further derive optimal printing conditions, environmental conditions, or clamping conditions for the adhesion based on the association information and the result of the adhesion determination. The CPU 91 may then determine the amount of substrate lift from the result of the adhesion determination and derive optimal printing conditions, environmental conditions, or clamping conditions for the determined amount of substrate lift, or may control each device to automatically set the determined amount of substrate lift and the derived conditions and perform printing.
[0040] In the above embodiment, the CPU 91 displays (presents) the determined amount of substrate lift on the display device 96, and the worker sets the amount of substrate lift after checking the displayed content, but this configuration is not limited to this. For example, in another embodiment, the CPU 91 may automatically set the determined amount of substrate lift and perform printing.
[0041] In the above embodiment, the mask opening 3 is substantially square, but is not limited to this configuration. For example, in other embodiments, the mask opening 3 may have other shapes such as a rectangular shape, a circular shape, or an elliptical shape.
[0042] In the above embodiment, a scanning laser probe type non-contact three-dimensional measuring machine is used as the print inspection device 80, but the present invention is not limited to this configuration. For example, in other embodiments, an optical type non-contact three-dimensional measuring machine may be used as the print inspection device 80.
[0043] In the above embodiment, the adhesion inspection device 70 and the print inspection device 80 are installed inside the screen printing machine 11, but this configuration is not limited to this. For example, in another embodiment, the print inspection device 80 may be installed in a location separate from the screen printing machine 11, next to the screen printing machine 11 in the board production system 10.
[0044] In the above embodiment, even if various changes are made to the degree of adhesion between the metal mask 2 and the substrate 1, the solder paste printing state, the printing conditions, the environmental conditions, etc., if it is determined that a good print result cannot be obtained, the CPU 91 does not instruct printing of solder paste on the substrate 1 and ejects the substrate 1 from the substrate production system 10, but this configuration is not limited to this. For example, in another embodiment, if it is determined that a good print result cannot be obtained, the CPU 91 may stop the substrate 1 due to an error without instructing printing of solder paste on the substrate 1.
[0045] Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The claimed technology includes various modifications and variations of the specific examples exemplified above. The technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings can achieve multiple objectives simultaneously, and achieving one of these objectives alone is technically useful.
[0046] 1: Substrate 2: Metal mask as a mask 3: Mask opening 10: Substrate production system 20: Mask holding device 50: Substrate pressing device 60: Squeegee device 70: Adhesion inspection device 80: Print inspection device 90: Control device 93: RAM as a storage device
Claims
1. A system for producing component-mounted boards by mounting components on a board printed with solder paste, comprising: a mask holding device that holds a mask having a mask opening; a board pressing device that lifts the supported board and presses the board from below against the mask; a squeegee device that transfers the solder paste to a portion of the board that corresponds to the mask opening by spreading the solder paste on the mask; an adhesion inspection device that measures the size of the gap between the mask and the board and inspects the adhesion between the mask and the board; a print inspection device that performs three-dimensional measurement of the solder paste printed on the board and inspects the printing condition of the solder paste; a memory device that stores association information that associates the inspection results of the adhesion with the inspection results of the printing condition; and a control device that judges the quality of the adhesion between the mask and the board based on the inspection results obtained by the adhesion inspection device and the association information stored in the memory device.
2. The board production system of claim 1, wherein the association information associates the adhesion inspection results and the size of the mask opening with the printing condition inspection results, and the control device determines whether the adhesion between the mask and the board is good or bad based on the association information, the inspection results obtained by the adhesion inspection device, and the size of the mask opening.
3. The board production system of claim 1, wherein the association information is information that associates the inspection results of the printing condition with at least one condition selected from the inspection results of the adhesion, the size of the mask opening, and the printing conditions when printing the solder paste, the environmental conditions, and the clamping conditions related to the pressure for clamping the board, and the control device further derives the printing conditions, the environmental conditions, or the clamping conditions that are optimal for the adhesion based on the association information and the result of the pass / fail judgment.
4. A board production system as described in claim 3, wherein the control device determines the amount of substrate lift from the result of the pass / fail judgment, and controls each of the devices to derive the optimal printing conditions, environmental conditions or clamping conditions when the determined amount of substrate lift is used, or to automatically set the determined amount of substrate lift and the derived conditions and perform printing.
5. A board production system as claimed in any one of claims 1 to 4, wherein the control device, if it determines that a good print result can be obtained, instructs printing of the solder paste on the board, whereas, if it determines that a good print result cannot be obtained, ejects the board without instructing printing of the solder paste on the board, or performs an error stop.
6. A method for producing a component-mounted board by mounting components on a board printed with solder paste, comprising: an adhesion inspection step of measuring the size of a gap between a mask for printing solder paste and the board to inspect the adhesion between the mask and the board; a print inspection step of performing three-dimensional measurement of the solder paste printed on the board to inspect the printing condition of the solder paste; an information storage step of storing information correlating the adhesion inspection results with the inspection results of the printing condition; and a judgment step of judging the quality of the adhesion between the mask and the board based on the associated information and the inspection results obtained by the adhesion inspection device.